Electronic device comprising expanded resonance space for audio signals

Abstract

This electronic device comprises: a printed circuit board; a shield can including a first portion disposed on a first surface of the printed circuit board, and a second portion protruding laterally from the printed circuit board; a bracket which is disposed below a second surface of the printed circuit board opposite to the first surface of the printed circuit board, and which includes one portion having an internal volume; and a speaker disposed in the one portion of the bracket. The one portion of the bracket defines a first space that surrounds the speaker. The bracket defines a through-hole that connects the first space to a second space defined by the printed circuit board and the shield can.

Description

An electronic device comprising an extended resonant space for audio signals

[0001] The present disclosure relates to an electronic device comprising an extended resonant space for audio signals.

[0002] An electronic device may include a speaker configured to output audio signals. The audio signals output from the speaker may be transmitted from inside the electronic device to outside the electronic device. The audio signals may induce a resonance phenomenon, which is a large amplitude vibration at a specific frequency. Audio signals with relatively low frequencies may require a relatively large space to induce the resonance phenomenon because they have a relatively long wavelength.

[0003] The above information may be provided as background information to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art in connection with the present disclosure.

[0004] An electronic device is disclosed. The electronic device may include a printed circuit board. The electronic device may include a shield can partially mounted on a first surface of the printed circuit board. The shield can may include a first portion disposed on the first surface of the printed circuit board and a second portion protruding laterally from the printed circuit board. The electronic device may include a bracket disposed below a second surface of the printed circuit board opposite the first surface of the printed circuit board, the bracket including a portion having an internal volume. The electronic device may include a speaker disposed within a portion of the bracket. The portion of the bracket may define a first space surrounding the speaker. The bracket may define a through hole connecting the first space to a second space defined by the printed circuit board and the shield can.

[0005] An electronic device is disclosed. The electronic device may include a foldable housing comprising a first housing part and a second housing part rotatably coupled to the first housing part. The electronic device may include a printed circuit board disposed within the second housing part. The electronic device may include a shield can partially mounted on a first surface of the printed circuit board. The shield can include a first portion disposed on the first surface of the printed circuit board and a second portion protruding laterally from the printed circuit board. The electronic device may include a bracket disposed below a second surface of the printed circuit board opposite the first surface of the printed circuit board, the bracket including a portion having an internal volume. The electronic device may include a speaker disposed within a portion of the bracket. The portion of the bracket may define a first space surrounding the speaker. The bracket may define a through hole connecting the first space to a second space defined by the printed circuit board and the shield can.

[0006] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment.

[0007] Figure 2 illustrates an electronic device according to one embodiment.

[0008] Figure 3 is an exploded perspective view of an electronic device according to one embodiment.

[0009] Figure 4 illustrates the interior of an electronic device according to one embodiment.

[0010] Figure 5 illustrates a second bracket of the electronic device.

[0011] Figure 6 is a plan view of a printed circuit board according to one embodiment.

[0012] Fig. 7 is a cross-sectional view of the printed circuit board of Fig. 6 taken along line A-A'.

[0013] Figures 8 and 9 are exploded perspective views of the second bracket and the printed circuit board.

[0014] Fig. 10 is a cross-sectional view of the electronic device of Fig. 4 taken along line BB'.

[0015] Figure 11 illustrates a second bracket according to one embodiment.

[0016] FIG. 12 is a cross-sectional view of an electronic device including the second bracket of FIG. 11.

[0017] Figures 13 and 14 illustrate an electronic device having a foldable structure.

[0018] FIG. 1 is a block diagram of an electronic device within a network environment, according to one embodiment.

[0019] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0020] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor)) that can operate independently or together therewith. For example, when the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof. The secondary processor (123) may control at least a part of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state.According to one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., a neural network processing device) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, in the electronic device (101) itself on which the artificial intelligence is performed, or may be performed through a separate server (e.g., the server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers. The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0021] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0022] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0023] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0024] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0025] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0026] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0027] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0028] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0029] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0030] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0031] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0032] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0033] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0034] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0035] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0036] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0037] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0038] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0039] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0040] Figure 2 illustrates an electronic device according to one embodiment.

[0041] Referring to FIG. 2, an electronic device (101) according to one embodiment may include a housing (210) that forms (or defines) the exterior of the electronic device (101). For example, the housing (210) may include a first side (or front side) (200A), a second side (or back side) (200B), and a third side (or side surface) (200C) that surrounds a space between the first side (200A) and the second side (200B).

[0042] An electronic device (101) according to one embodiment may include a display (201) (e.g., a display module (160) of FIG. 1). The display (201) may include a substantially transparent window (e.g., a window (302) of FIG. 3). The window (302) may form (or define) at least a portion of the first surface (200A). For example, the window (302) may include, but is not limited to, a glass plate or a polymer plate including various coating layers.

[0043] An electronic device (101) according to one embodiment may include a substantially opaque rear plate (211). According to one embodiment, the rear plate (211) may form (or define) at least a portion of the second surface (200B). According to one embodiment, the rear plate (211) may be formed of coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials.

[0044] An electronic device (101) according to one embodiment may include a peripheral part (218). The peripheral part (218) may be combined with the window (302) and / or the rear plate (211) to form (or define) at least a portion of a third side (200C) of the electronic device (101). For example, the peripheral part (218) may form the entire third side (200C) of the electronic device (101). For example, the peripheral part (218) may form the third side (200C) of the electronic device (101) together with the window (302) and / or the rear plate (211).

[0045] An electronic device (101) according to one embodiment may include at least one of a display (201), an audio module (203, 204, 207), a sensor module (not shown), a camera module (205, 212, 213), a key input device (217), a light-emitting element (not shown), and / or a connector hole (208). According to one embodiment, the electronic device (101) may omit at least one of the above components (e.g., the key input device (217) or the light-emitting element (not shown)) or may additionally include other components.

[0046] In one embodiment, at least a portion of the display (201) may be viewed through a window (302) forming (or defining) the first surface (200A). In one embodiment, the display (201) may include a display panel (e.g., display panel (301) of FIG. 3) disposed on a back surface of the window (302).

[0047] According to one embodiment, the display (201) may include a display area (201A). According to one embodiment, the display (201) may provide visual information to a user through the display area (201A).

[0048] In one embodiment, the display area (201A) may include a sensing area (201B) configured to acquire biometric information of the user. Here, the meaning of "the display area (201A) includes the sensing area (201B)" may be understood to mean that at least a portion of the sensing area (201B) may overlap the display area (201A). For example, the sensing area (201B) may be an area capable of displaying visual information by the display (201) like other areas of the display area (201A) and additionally capable of acquiring biometric information of the user (e.g., a fingerprint). In one embodiment, the sensing area (201B) may also be formed in the key input device (217).

[0049] In one embodiment, the display (201) may include an area where a first camera module (205) (e.g., the camera module (180) of FIG. 1) is positioned. In one embodiment, an opening is formed (or defined) in the area of ​​the display (201), and the first camera module (205) (e.g., a punch hole camera) may be at least partially positioned within the opening so as to face the first surface (200A). For example, the display area (201A) may surround at least a portion of an edge of the opening. In one embodiment, the first camera module (205) (e.g., an under display camera (UDC)) may be positioned under the display (201) so as to overlap the area of ​​the display (201). For example, the display (201) can provide visual information to the user through the above area, and additionally, the first camera module (205) can obtain an image corresponding to a direction toward the first surface (200A) through the above area of ​​the display (201).

[0050] According to one embodiment, the display (201) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer capable of detecting a magnetic field-type stylus pen.

[0051] According to one embodiment, the audio module (203, 204, 207) (e.g., the audio module (170) of FIG. 1) may include a microphone hole (203, 204) and / or a speaker hole (207).

[0052] According to one embodiment, the microphone holes (203, 204) may include a first microphone hole (203) formed (or defined) in a portion of the third surface (200C) and / or a second microphone hole (204) formed (or defined) in a portion of the second surface (200B). A microphone (not shown) for acquiring external sound may be arranged inside the microphone holes (203, 204). The microphone may include a plurality of microphones so as to detect the direction of the sound.

[0053] According to one embodiment, a second microphone hole (204) formed (or defined) in a portion of the second surface (200B) may be positioned adjacent to a camera module (205, 212, 213). For example, the second microphone hole (204) may acquire sound according to the operation of the camera module (205, 212, 213). However, the present invention is not limited thereto.

[0054] In one embodiment, the speaker hole (207) may include an external speaker hole (207) and a call receiver hole (not shown). The external speaker hole (207) may be formed (or defined) in a portion of the third surface (200C) of the electronic device (101). In one embodiment, the external speaker hole (207) may be implemented as a single hole with the microphone hole (203). Although not shown, the call receiver hole (not shown) may be formed in another portion of the third surface (200C). For example, the call receiver hole may be formed on the opposite side of the external speaker hole (207) on the third surface (200C). For example, based on the city of FIG. 2, the external speaker hole (207) may be formed on the third surface (200C) corresponding to the lower part of the electronic device (101), and the call receiver hole may be formed on the third surface (200C) corresponding to the upper part of the electronic device (101). However, this is not limited thereto, and according to one embodiment, the call receiver hole may be formed at a location other than the third surface (200C). For example, the call receiver hole may be formed by a spaced space between the display (201) and the edge part (218).

[0055] According to one embodiment, the electronic device (101) may include at least one speaker (not shown) configured to output sound to the outside of the housing (210) through an external speaker hole (207) and / or a call receiver hole (not shown).

[0056] According to one embodiment, a sensor module (not shown) (e.g., sensor module (176) of FIG. 1) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (101) or an external environmental state. For example, the sensor module may include at least one of a proximity sensor, an HRM sensor, a fingerprint sensor, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0057] According to one embodiment, a camera module (205, 212, 213) (e.g., camera module (180) of FIG. 1) may include a first camera module (205) arranged to face a first side (200A) of an electronic device (101), a second camera module (212) arranged to face a second side (200B), and a flash (213).

[0058] According to one embodiment, the second camera module (212) may include multiple cameras (e.g., dual cameras, triple cameras, or quad cameras). However, the second camera module (212) is not necessarily limited to including multiple cameras and may include a single camera.

[0059] According to one embodiment, the first camera module (205) and the second camera module (212) may include one or more lenses, image sensors, and / or image signal processors.

[0060] In one embodiment, the flash (213) may include, for example, a light-emitting diode or a xenon lamp. In one embodiment, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be arranged on one side of the electronic device (101).

[0061] According to one embodiment, a key input device (217) (e.g., input module (150) of FIG. 1) may be disposed on a third side (200C) of the electronic device (101). According to one embodiment, the electronic device (101) may not include some or all of the key input devices (217), and the key input devices (217) that are not included may be implemented in another form, such as a soft key, on the display (201).

[0062] According to one embodiment, a connector hole (208) may be formed on the third surface (200C) of the electronic device (101) so that a connector of an external device can be accommodated. A connection terminal (e.g., a connection terminal (178) of FIG. 1) electrically connected to the connector of the external device may be arranged within the connector hole (208). The electronic device (101) according to one embodiment may include an interface module (e.g., an interface (177) of FIG. 1) for processing an electrical signal transmitted and received through the connection terminal.

[0063] According to one embodiment, the edge part (218) may include a vent hole (206). For example, air outside the housing (210) may be introduced into the housing (210) through the vent hole (206). For example, air inside the housing (210) may be discharged out of the housing (210) through the vent hole (206). The location of the vent hole (206) is not limited to the location illustrated in FIG. 2.

[0064] According to one embodiment, the electronic device (101) may include a light-emitting element (not shown). For example, the light-emitting element (not shown) may be disposed on a first surface (200A) of the housing (210). The light-emitting element (not shown) may provide status information of the electronic device (101) in the form of light. According to one embodiment, the light-emitting element (not shown) may provide a light source that is linked to the operation of the first camera module (205). For example, the light-emitting element (not shown) may include an LED, an IR LED, and / or a xenon lamp.

[0065] Figure 3 is an exploded perspective view of an electronic device according to one embodiment.

[0066] In the following, redundant descriptions of configurations having the same reference numerals as the configurations described above are omitted.

[0067] Referring to FIG. 3, an electronic device (101) according to one embodiment may include an edge part (218), a first bracket (243), a printed circuit board (250), a second bracket (260), and / or a battery (270). The printed circuit board (250) may include a first printed circuit board (251), which is a main board, and a second printed circuit board (252), which is a sub board.

[0068] An electronic device (101) according to one embodiment may include an edge part (218) forming (or defining) an exterior of the electronic device (101) (e.g., a third surface (200C) of FIG. 2) and a first bracket (243) coupled to an inner side of the edge part (218). According to one embodiment, the edge part (218) and the first bracket (243) may be disposed between a display (201) and a rear plate (211). For example, the edge part (218) may surround a space between the rear plate (211) and the display (201). A window (302) may be attached to the edge part (218).

[0069] In one embodiment, the first bracket (243) may support or accommodate other components included in the electronic device (101). For example, a display (201) may be disposed on one side of the first bracket (243) facing one direction (e.g., +z direction), and a portion of the display (201) may be supported by the first bracket (243). For example, a first printed circuit board (251), a second printed circuit board (252), a battery (270), and a second camera module (212) may be disposed on the other side of the first bracket (243) facing the opposite direction (e.g., -z direction). For example, the first printed circuit board (251), the second printed circuit board (252), the battery (270), and the second camera module (212) may each be mounted in a recess defined by the edge part (218) and / or the first bracket (243).

[0070] An electronic device according to one embodiment may include a shield can (410) that covers at least a portion of a printed circuit board (e.g., a first printed circuit board (251)). For example, the shield can (410) may cover one or more electronic components arranged on the printed circuit board (250). The one or more electronic components arranged on the printed circuit board (250) may be accommodated within a space defined by the shield can (410) and the printed circuit board (250).

[0071] According to one embodiment, the first printed circuit board (251), the second printed circuit board (252), and the battery (270) may be respectively coupled to the first bracket (243). For example, the first printed circuit board (251) and the second printed circuit board (252) may be fixedly arranged to the first bracket (243) through a coupling member such as a screw. For example, the battery (270) may be fixedly arranged to the first bracket (243) through an adhesive member (e.g., double-sided tape). However, the present invention is not limited to the above-described examples.

[0072] According to one embodiment, the second bracket (260) may be disposed between the first printed circuit board (251) and the rear plate (211). According to one embodiment, the second bracket (260) may be disposed on the first printed circuit board (251). For example, the second bracket (260) may be disposed on a surface of the first printed circuit board (251) facing the -z direction.

[0073] According to one embodiment, the second bracket (260) may at least partially overlap the first printed circuit board (251) with respect to the z-axis. According to one embodiment, the second bracket (260) may cover at least a portion of the first printed circuit board (251). The second bracket (260) may protect the first printed circuit board (251) from physical impact or prevent detachment of a connector coupled to the first printed circuit board (251).

[0074] According to one embodiment, the second bracket (260) may be fixedly positioned on the first printed circuit board (251) via a joining member (e.g., a screw), or may be joined to the first bracket (243) together with the first printed circuit board (251) via the joining member.

[0075] In one embodiment, the display (201) may include a display panel (301) and a window (302). In one embodiment, the display panel (301) may be disposed between a first bracket (243) and a window (302). For example, the window (302) may be disposed on one side (e.g., in the +z direction) of the display panel (301), and the first bracket (243) may be disposed on the other side (e.g., in the -z direction).

[0076] According to one embodiment, the window (302) may be coupled with the display panel (301). For example, the window (302) and the display panel (301) may be bonded to each other via an optical adhesive member (e.g., optically clear adhesive (OCA) or optically clear resin (OCR)) interposed therebetween.

[0077] According to one embodiment, the window (302) may be coupled with the edge part (218). For example, the window (302) may include an outer portion extending outside the display (201) when viewed in the z-axis direction, and may be coupled to the edge part (218) through an adhesive member (e.g., waterproof tape) disposed between the outer portion of the window (302) and the edge part (218). However, the present invention is not limited to the above-described example.

[0078] According to one embodiment, a processor (e.g., processor (120) of FIG. 1), a memory (e.g., memory (130) of FIG. 1), and / or an interface (e.g., interface (177) of FIG. 1) may be disposed on the first printed circuit board (251) and / or the second printed circuit board (252). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. The memory may include, for example, volatile memory or non-volatile memory. The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (101) to an external electronic device, and may include a USB connector, an SD card / MMC connector, or an audio connector. According to one embodiment, the first printed circuit board (251) and the second printed circuit board (252) may be operatively or electrically connected to each other via a connecting member (e.g., a flexible printed circuit board).

[0079] In one embodiment, a battery (270) (e.g., battery (189) of FIG. 1 ) may power at least one component of the electronic device (101). For example, the battery (270) may include a rechargeable secondary battery or a fuel cell. At least a portion of the battery (270) may be disposed substantially coplanar with the first printed circuit board (251) and / or the second printed circuit board (252).

[0080] An electronic device (101) according to one embodiment may include an antenna module (not shown) (e.g., antenna module (197) of FIG. 1). According to one embodiment, the antenna module may be disposed between a rear plate (211) and a battery (270). The antenna module may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna module may, for example, perform short-range communication with an external device or wirelessly transmit and receive power with an external device.

[0081] According to one embodiment, a first camera module (205) (e.g., a front camera) may be positioned on at least a portion of the first bracket (243) such that the lens can receive external light through a portion (e.g., the camera area (237)) of the window (302) (e.g., the front (200A) of FIG. 2).

[0082] In one embodiment, a second camera module (212) (e.g., a rear camera) may be disposed between the first bracket (243) and the rear plate (211). In one embodiment, the second camera module (212) may be electrically connected to the first printed circuit board (251) via a connecting member (e.g., a connector). In one embodiment, the second camera module (212) may be disposed such that a lens can receive external light through the camera area (284) of the rear plate (211) of the electronic device (101).

[0083] According to one embodiment, the camera area (284) may be formed (or defined) on a surface of the rear plate (211) (e.g., the rear surface (200B) of FIG. 2). According to one embodiment, the camera area (284) may be formed to be at least partially transparent so that external light may be incident on the lens of the second camera module (212). According to one embodiment, at least a portion of the camera area (284) may protrude from the surface of the rear plate (211) by a predetermined height. However, the present invention is not limited thereto, and according to one embodiment, the camera area (284) may form a substantially same plane as the surface of the rear plate (211).

[0084] According to one embodiment, the housing (210) of the electronic device (101) may refer to a configuration or structure that forms (or defines) at least a portion of the exterior of the electronic device (101). In this respect, at least a portion of the window (302), the edge part (218), the first bracket (243), and / or the rear plate (211) that form the exterior of the electronic device (101) may be referred to as the housing (210) of the electronic device (101).

[0085] An electronic device (101) according to one embodiment may include a rear plate (211). The rear plate (211) may define at least a portion of a rear surface (e.g., a second surface (200B) of FIG. 2) of the electronic device (101). The rear plate (211) may be referred to as a cover plate, a rear cover, a back cover, or a back glass in terms of defining at least a portion of the rear surface of the electronic device (101). For example, the rear plate (211) may be opposite a display (or a window (302) of the display) that forms at least a portion of a front surface (e.g., a first surface (200A) of FIG. 2) of the electronic device (101). The window (302) of the display (201) may form at least a portion of the front surface of the electronic device (101), and the rear plate (211) may form at least a portion of the rear surface of the electronic device (101). The display can be oriented substantially in the +z direction, and the rear plate (211) can be oriented substantially in the -z direction.

[0086] Within this disclosure, terms such as "above" and "below" are used not as terms indicating absolute positional relationships, but as terms indicating relative positional relationships. They should be understood as specific terms used for convenience of explanation. For example, if an electronic device depicted in a drawing is flipped over, "above" and "below" may be interchanged.

[0087] Fig. 4 illustrates the interior of an electronic device according to one embodiment. Fig. 5 illustrates a second bracket of the electronic device.

[0088] Referring to FIG. 4, an electronic device (101) according to one embodiment may include a first bracket (243) and a second bracket (260).

[0089] Referring to FIG. 4, the first bracket (243) can support components arranged inside the electronic device (101). For example, a printed circuit board (250) and a battery (270) can be arranged on the first bracket (243) and supported by the first bracket (243). For example, the second bracket (260) can be configured to protect the printed circuit board (250) and secure a connector arranged on the printed circuit board (250). The second bracket (260) can be arranged between the first bracket (243) and a rear plate defining the rear surface of the electronic device (101) (e.g., the rear plate (211) of FIG. 3).

[0090] According to one embodiment, the electronic device (101) may include a speaker (420). The speaker (420) may be positioned within a portion of the second bracket (260).

[0091] Referring to FIG. 5, the speaker (420) may be positioned within the second bracket (260). For example, the second bracket (260) may include a portion having an internal volume. The speaker (420) may be accommodated within a portion of the second bracket (260).

[0092] According to one embodiment, the second bracket (260) may be disposed below the printed circuit board (250) (e.g., in the -z direction). The speaker (420) may be electrically connected to the printed circuit board (250). For example, a processor (e.g., the processor (120) of FIG. 1) disposed on the printed circuit board (250) may be electrically connected to the speaker (420) via the printed circuit board (250). The speaker (420) may be configured to output audio signals by being controlled by the processor. For example, the speaker (420) may include, but is not limited to, a diaphragm configured to output audio signals by vibrating based on an electrical signal, at least one voice coil for causing the diaphragm to vibrate, and a permanent magnet configured to form a magnetic field.

[0093] According to one embodiment, audio signals output from the speaker (420) may cause a resonance phenomenon in which the audio signals output from the speaker (420) vibrate with a large amplitude at a specific frequency. In order for the audio signals output from the speaker (420) to have high quality, sufficient resonance space may be required. For example, audio signals having relatively low frequencies may require a relatively large space for resonance because they have a relatively long wavelength. In order for the speaker (420) to provide audio signals having a resonance frequency within a specified frequency range, a sufficient volume of the resonance space may be required. The larger the resonance space, the better the quality of audio signals having low frequencies.

[0094] According to one embodiment, the second bracket (260) accommodating the speaker (420) may provide at least a portion (e.g., the first space (S1) of FIG. 10) of the resonant space for audio signals output from the speaker (420). The audio signals output from the speaker (420) may be configured to resonate within the first space (S1) defined by a portion of the second bracket (260). The size of the second bracket (260) may be based on the size of the electronic device (e.g., the electronic device (101) of FIG. 4). For example, when the size of the electronic device (101) is relatively small, the size of the second bracket (260) disposed within the electronic device (101) may be reduced. As the size of the second bracket (260) decreases, the volume of the resonance space for audio signals output from the speaker (420) may decrease. If the volume of the resonance space is small, the quality and volume of the audio signals may deteriorate.

[0095] An electronic device (101) according to one embodiment may have a structure for connecting a resonance space (e.g., a first space (S1) of FIG. 10) defined by a portion of a second bracket (260) to an additional space (e.g., a second space (S2) of FIG. 10) defined by a printed circuit board (250) and a shield can (410) to provide a resonance space for audio signals output from a speaker (420). The first space (S1) and the second space (S2) may be connected by a through hole (440) of the second bracket (260). As the resonance space for resonance of audio signals is expanded, the quality of audio signals output from the speaker (420) may be improved.

[0096] Hereinafter, with reference to the drawings, a structure for expanding a resonant space is described. In the following description, the interconnected spaces may be referred to as distinct spaces being in fluid communication with each other. The fluidly connected spaces can provide a space for vibrations that form audio signals by allowing airflow from one space to another. The interconnected spaces may be referred to as a single space that provides air vibrations that form audio signals.

[0097] Fig. 6 is a plan view of a printed circuit board according to one embodiment. Fig. 7 is a cross-sectional view of the printed circuit board of Fig. 6 taken along line A-A'.

[0098] Referring to FIG. 6, an electronic device (e.g., the electronic device (101) of FIG. 2) may include a printed circuit board (250). The printed circuit board (250) may include a plurality of conductive layers and a plurality of non-conductive layers alternately laminated with the plurality of conductive layers. The printed circuit board (250) may provide electrical connections of electronic components using wiring and conductive vias formed by the conductive layers.

[0099] An electronic device (101) according to one embodiment may include a shield can (410) that covers at least a portion of a printed circuit board (250). For example, the shield can (410) may be partially disposed on a first surface (250a) of the printed circuit board (250). For example, the shield can (410) may cover one or more electronic components (610) disposed on the first surface (250a) of the printed circuit board (250). One or more electronic components (610) disposed on a first surface (250a) of a printed circuit board (250) may be configured to block electromagnetic interference between the printed circuit board (250) and a shield can (410). According to an embodiment, the shield can (410) may be configured to block electromagnetic interference between one or more electronic components (610) covered by the shield can (410) and other electronic components outside the shield can (410). For example, the shield can (410) may be configured to shield electromagnetic waves emitted from one or more electronic components (610) accommodated in the shield can (410) from reaching other electronic components outside the shield can (410) and to shield electromagnetic waves emitted from the other electronic components from entering the inside of the shield can (410). For example, the other electronic components may include, but are not limited to, an antenna module (e.g., an antenna module (197) of FIG. 1). For example, the shield can (410) may be electrically connected to a ground portion of a printed circuit board (250). For example, the shield can (410) may include metal to shield electromagnetic waves. The shield can (410) may protect one or more electronic components (610) housed within the shield can (410) from external impact.

[0100] According to one embodiment, the printed circuit board (250) may include a corner cut-out portion (620). The corner cut-out portion (620) of the printed circuit board (250) may be formed by cutting a corner portion of the printed circuit board (250) that overlaps a first space (e.g., the first space (S1) of FIG. 10) defined by a portion of the second bracket (260) among the corner portions of the printed circuit board (250) and the shield can (410). As the corner portion of the printed circuit board (250) is cut, a portion of the shield can (410) may protrude laterally from the printed circuit board (250). As the shield can (410) protrudes laterally from the printed circuit board (250) by the corner cut-out portion (620) of the printed circuit board (250), the space defined by the printed circuit board (250) and the shield can (410) (e.g., the second space (S2)) can be exposed to the outside.

[0101] As described below, the corner portion of the printed circuit board (250) cut to form the corner cut-out portion (620) of the printed circuit board (250) is a portion that overlaps a waterproof tape (e.g., the waterproof tape (1010) of FIG. 10), and may be a portion where it is difficult to mount electronic components. By cutting the portion where it is difficult to mount electronic components, the corner cut-out portion (620) can be formed without reducing the area of ​​the printed circuit board (250) for mounting electronic components. The corner cut-out portion (620) may be referred to as a chamfer portion, a fillet portion, or a recessed portion.

[0102] According to one embodiment, the shield can (410) may include a first portion (411) and a second portion (412). For example, the first portion (411) may be referred to as a portion of the shield can (410) that is disposed on a first surface (250a) of a printed circuit board (250). The first portion (411) of the shield can (410) may overlap the printed circuit board (250). For example, the second portion (412) may be referred to as a portion of the shield can (410) that protrudes laterally from the printed circuit board (250). The second portion (412) of the shield can (410) may protrude laterally from the corner cut-out portion (620) and may not overlap the printed circuit board (250). By the second part (412) of the shield can (410) protruding from the corner cut-out portion (620), the space defined by the printed circuit board (250) and the shield can (410) can be exposed to the outside.

[0103] Referring to FIG. 7, one or more electronic components (610) disposed on a first surface (250a) of a printed circuit board (250) may be covered by a shield can (410). The shield can (410) may be partially disposed on the first surface (250a) of the printed circuit board (250) so as to cover the one or more electronic components (610) disposed on the first surface (250a) of the printed circuit board (250). For example, the one or more electronic components (610) may be covered by a first portion (411) of the shield can (410) disposed on the first surface (250a).

[0104] According to one embodiment, a space defined by a printed circuit board (250) and a shield can (410) may be occupied by one or more electronic components (610). The space defined by the printed circuit board (250) and the shield can (410) may be referred to as a second space (S2). A portion of the second space (S2) may be occupied by one or more electronic components (610). A volume of an empty area of ​​the second space (S2) may be referred to as a first volume of the second space (S2). The first volume of the second space (S2) may correspond to a volume of a third volume surrounded by a first surface (250a) of the printed circuit board (250) and the shield can (410), excluding the second volume of the one or more electronic components (610). For example, the first volume may be, but is not limited to, about 0.1 cc to about 0.3 cc. Since the second space (S2) defined by the shield can (410) and the printed circuit board (250) is not entirely filled with one or more electronic components (610), the first volume of the empty second space (S2) may be used as a space in which air may vibrate. In one embodiment, the second space (S2) may be exposed to the external space of the shield can (410) and the printed circuit board (250) by the corner cut-out portion (620). As described below, as the second space (S2) is connected to the first space (e.g., the first space (S1) of FIG. 10) defined by a portion of the second bracket (e.g., the second bracket (260) of FIG. 5), the resonant space for audio signals can be expanded by the first volume of the second space (S2).

[0105] Figures 8 and 9 are exploded perspective views of the second bracket and the printed circuit board.

[0106] Referring to FIG. 8, the second bracket (260) may be positioned below (e.g., in the -z direction) the second side (250b) of the printed circuit board (250) opposite the first side (250a) of the printed circuit board (250) on which the shield can (410) is positioned. For example, the second bracket (260) may cover the second side (250b) of the printed circuit board (250).

[0107] In one embodiment, the speaker (420) may be positioned within a portion of the second bracket (260). As described above, the portion of the second bracket (260) may have an internal volume. The portion of the second bracket (260) may define (or form) a first space surrounding the speaker (420) (e.g., the first space (S1) of FIG. 10). For example, in the internal volume of the portion of the second bracket (260), the remaining space excluding the volume occupied by the speaker (420) may be used as a resonance space for audio signals output from the speaker (420).

[0108] In one embodiment, the second bracket (260) may define a through hole (440). The through hole (440) may connect a first space (S1) surrounding the speaker (420) to a second space (e.g., the second space (S2) of FIG. 10) defined by the printed circuit board (250) and the shield can (410). For example, when the second bracket (260) is positioned below the second surface (250b) of the printed circuit board (250), the through hole (440) of the second bracket (260) may overlap the second portion (412) of the shield can (410). Since the second part (412) of the shield can (410) protrudes from the printed circuit board (250), the second space (S2) defined by the printed circuit board (250) and the shield can (410) can be exposed through the second part (412). The first space (S1) surrounding the speaker (420) and the second space (S2) can be connected through the through hole (440) overlapping the second part (412).

[0109] Referring to FIGS. 8 and 9, the electronic device (e.g., the electronic device (101) of FIG. 2) may further include a support part (910). For example, the support part (910) may at least partially wrap an edge part (930) of the second part (412) of the shield can (410) protruding laterally from the printed circuit board (250) so as to support the edge part (930) of the second part (412) of the shield can (410). As described above, by cutting the corner part of the printed circuit board (250), a corner cut-out part (620) of the printed circuit board (250) may be formed. As the corner part of the printed circuit board (250) is cut, the second part (412) of the shield can (410) protruding from the corner cut-out part (620) may not be supported by the printed circuit board (250). The support part (910) may be arranged to at least partially surround the edge part (930) of the second part (412) so as to support the edge part (930) of the second part (412) that is not supported by the printed circuit board (250). According to one embodiment, the support part (910) may have a thickness corresponding to the thickness of the printed circuit board (250) so as to compensate for the thickness (e.g., length in the z-axis direction) of the cut corner part of the printed circuit board (250). For example, the thickness of the support part (910) may substantially correspond to the thickness of the printed circuit board (250).

[0110] An electronic device (101) according to one embodiment may include a sealing member (920). For example, a first space (e.g., the first space (S1) of FIG. 10) and a second space (e.g., the second space (S2) of FIG. 10) connected through a through hole (440) may be sealed by the sealing member (920). For example, when a second bracket (260) is disposed below a second surface (250b) of a printed circuit board (250), the sealing member (920) may be in contact with a surface of the bracket (e.g., the second bracket (260)) facing the printed circuit board (250). The sealing member (920) may be disposed so as to surround the through hole (440) on the surface of the bracket (e.g., the second bracket (260)) facing the printed circuit board (250).

[0111] Fig. 10 is a cross-sectional view of the electronic device of Fig. 4 taken along line B-B'.

[0112] Referring to FIG. 10, the electronic device (101) may include a display (201) and a rear plate (211). For example, the display (201) may define a front side (e.g., a side facing the +z direction) of the electronic device (101). For example, the rear plate (211) may define a rear side (e.g., a side facing the -z direction) of the electronic device (101). The rear plate (211) may be opposite to the display (201). For example, a first side (250a) of the printed circuit board (250) may face the display (201), and a second side (250b) of the printed circuit board (250) may face the rear plate (211).

[0113] According to one embodiment, the first bracket (243) and the second bracket (260) may be positioned between the display (201) and the rear plate (211). For example, the first bracket (243) may be positioned below the display (201) to support the display (201). For example, the second bracket (260) and the printed circuit board (250) may be positioned between the first bracket (243) and the rear plate (211).

[0114] An electronic device (101) according to one embodiment may include a waterproof tape (1010). The waterproof tape (1010) may be disposed between the display (201) and the first bracket (243). The waterproof tape (1010) may have a closed loop shape. The waterproof tape (1010) may reduce the inflow of moisture into a space covered by the waterproof tape (1010). Depending on the thickness of the waterproof tape (1010), the first bracket (243) may have a stepped shape. For example, a portion (1020) of the first bracket (243) corresponding to the waterproof tape (1010) may protrude in a direction (e.g., -z direction) toward the printed circuit board (250) so that the waterproof tape (1010) having a thickness may be disposed between the display (201) and the first bracket (243).

[0115] According to one embodiment, as the part (1020) of the first bracket (243) protrudes in a direction toward the rear plate (211), a first gap (G1) between the part (1020) of the first bracket (243) and the first surface (250a) of the printed circuit board (250) may be shorter than a second gap (G2) between another part of the first bracket (243) and the first surface (250a) of the printed circuit board (250). Since the first gap (G1) is shorter than the second gap (G2), it may be difficult to place an electronic component on a part of the first surface (250a) corresponding to the part (1020) of the first bracket (243) among the entire area of ​​the first surface (250a). For example, in the case of an electronic component having a thickness thicker than the first gap (G1), the electronic component cannot be placed on a part of the first surface (250a) corresponding to the part (1020) of the first bracket (243), and thus the part of the first surface (250a) may correspond to an area where it is difficult to place the electronic component. Since the first gap (G1) is shorter than the second gap (G2), the height of the shield can (410) corresponding to the part (1020) may be relatively low.

[0116] According to one embodiment, the corner cut-out portion (620) may be formed by cutting a corner portion of a portion of the first surface (250a) of the printed circuit board (250) corresponding to the portion (1020) of the first bracket (243) protruding toward the printed circuit board (250) by the waterproof tape (1010). As the corner cut-out portion (620) is formed by cutting the portion of the printed circuit board (250), the corner cut-out portion (620) of the printed circuit board (250) and the second portion (412) of the shield can (410) protruding from the printed circuit board (250) may at least partially overlap the portion (1020) of the first bracket (243) protruding in the direction toward the printed circuit board (250) by the waterproof tape (1010). For example, when viewing the electronic device (101) from above (e.g., when viewing in the -z direction), the waterproof tape (1010), the second portion (412) of the shield can (410), and the corner cut-out portion (620) of the printed circuit board (250) may at least partially overlap each other.

[0117] As described above, since it is difficult to place electronic components between the part (1020) of the first bracket (243) protruding toward the printed circuit board (250) by the waterproof tape (1010) and a part of the first surface (250a) of the printed circuit board (250), when the corner part of the part of the part is cut, the electronic component mounting area of ​​the printed circuit board (250) may not be reduced. The second part (412) of the shield can (410) may face the through hole (440) connected to the first space (S1) by extending to cover the part of the printed circuit board (250). As the second portion (412) extends to face the through hole (440), the first space (S1) of the second bracket (260) can be connected to the second space (S2) defined by the printed circuit board (250) and the shield can (410) through the through hole (440).

[0118] According to one embodiment, the first space (S1) and the second space (S2) connected to the first space (S1) through the through hole (440) can be configured to provide a resonance space for audio signals output from the speaker (420). The audio signals output from the speaker (420) can be configured to resonate within the first space (S1) and the second space (S2). As the resonance space for the audio signals expands to the first space (S1) and the second space (S2), the quality of the audio signals can be improved.

[0119] According to one embodiment, the sealing member (920) may be arranged to surround the through hole (440) on the surface (261) of the second bracket (260) facing the printed circuit board (250) so as to seal the resonance space at the portion where the first space (S1) and the second space (S2) are connected. If the first space (S1) and the second space (S2) are not sealed, the quality of audio signals output from the speaker (420) may deteriorate. For example, if the resonance space is connected to an external space, the audio signals may not vibrate at a constant resonance frequency, and uneven audio signals may be provided. One surface of the sealing member (920) may be in contact with the surface (261) of the second bracket (260) facing the printed circuit board (250). A portion (921) of the sealing member (920) may be disposed between the second bracket (260) and the printed circuit board (250). For example, one surface of the portion (921) may be in contact with the surface (261) of the second bracket (260), and the other surface of the portion (921) may be in contact with the corner cut-out portion (620). Another portion (922) of the sealing member (920) may be disposed between the second bracket (260) and the support part (910). For example, the other portion (922) may be in contact with the support part (910) that at least partially surrounds the printed circuit board (250) and the edge portion (930) of the second portion (412) of the shield can (410). The sealing member (920) may include a flexible material. For example, the sealing member (920) may include, but is not limited to, at least one of sponge, rubber, tape, silicone, or urethane. By sealing the first space (S1) and the second space (S2) by the sealing member (920), a resonance space for audio signals can be stably provided.

[0120] If a through hole is formed (or defined) in a portion of a printed circuit board overlapping a shield can and a first space of a portion of a second bracket surrounding a speaker is connected to a second space defined by the shield can and the printed circuit board through the through hole, the mounting area of ​​electronic components of the printed circuit board may be reduced. Since electronic components cannot be mounted in the area surrounding the through hole, the number of electronic components that can be electrically connected through the printed circuit board may be reduced. Since the through hole has a relatively narrow area, it may be difficult to stably connect the first space and the second space. For example, when vibrations caused by a speaker placed in the first space are transmitted to the second space through the through hole of the printed circuit board, the quality of audio signals generated from the vibrations may be deteriorated because the vibrations must pass through the relatively narrow through hole.

[0121] According to one embodiment, the connection between the first space (S1) and the second space (S2) may be made through a corner cut-out portion (620) cut from a corner portion of the printed circuit board (250) and a through hole (440). As described above, the corner cut-out portion (620) may be formed in an area where electronic components are difficult to mount. The second portion (412) of the shield can (410) may protrude laterally from the corner cut-out portion (620), and the through hole (440) of the second bracket (260) may be aligned with the second portion (412) of the shield can (410), thereby connecting the first space (S1) and the second space (S2) to each other. The corner cut-out portion (620), as a portion where the first space (S1) and the second space (S2) are connected, may have a relatively large area. As the first space (S1) and the second space (S2) are connected through the corner cut-out portion (620) of the printed circuit board (250), audio signals output from the speaker (420) can be configured to resonate stably within the first space (S1) and the second space (S2) that are connected to each other.

[0122] Fig. 11 illustrates a second bracket according to one embodiment. Fig. 12 is a cross-sectional view of an electronic device including the second bracket of Fig. 11.

[0123] Referring to FIG. 11, the aforementioned support part (e.g., the support part (910) of FIG. 9) may be formed as a part of the structure of the second bracket (260). Referring to FIG. 12, the second bracket (260) may include a support part (1110) into which an edge part (930) may be inserted so as to support an edge part (930) of a second part (412) of the shield can (410). For example, the support part (1110) may protrude from a surface (261) of the second bracket (260) facing the printed circuit board (250) toward the printed circuit board (250). For example, the support part (1110) may include a groove (1111) into which an edge part of the second part (412) of the shield can (410) may be inserted. The shape of the groove (1111) may correspond to the shape of the edge portion (930) of the second portion (412). For example, when the shape of the edge portion (930) of the second portion (412) is bent, the shape of the support portion (1110) and the shape of the groove (1111) of the support portion (1110) may be bent to correspond to the shape of the edge portion (930) of the second portion (412).

[0124] In one embodiment, the sealing member (920) may be formed as a part of the structure of the second bracket (260). For example, the sealing member (920) may be positioned so as to surround at least a portion of the through hole (440) on a surface of the second bracket (260) facing the printed circuit board (250). When the second bracket (260) is positioned below the printed circuit board (250), the sealing member (920) may seal a first space (e.g., a first space (S1) of FIG. 10) and a second space (e.g., a second space (S2) of FIG. 10).

[0125] Referring to FIG. 12, the support portion (1110) may include a first support portion (1211) disposed on the inside of the second portion (412) of the shield can (410) and a second support portion (1212) disposed on the outside of the second portion (412) of the shield can (410). For example, as illustrated in FIG. 12, the first support portion (1211) and the second support portion (1212) may form a groove (1111) into which an edge portion (930) of the second portion (412) of the shield can (410) is inserted. Either the first support portion (1211) or the second support portion (1212) may be omitted. For example, the support portion (1110) may include only the first support portion (1211) or only the second support portion (1212). For example, when the support portion (1110) includes only the first support portion (1211), the support portion (1110) can support the edge portion (930) of the second portion (412) of the shield can (410) on the inside of the shield can (410). For example, when the support portion (1110) includes only the second support portion (1212), the support portion (1110) can support the edge portion (930) of the second portion (412) of the shield can (410) on the outside of the shield can (410).

[0126] Although the electronic device (101) described above has been described as having a bar-type structure, the structure of the electronic device (101) according to the present disclosure is not limited to the bar type. As described below, the electronic device (101) may include a foldable electronic device having a foldable structure. In the case of the electronic device (101) having a foldable structure, since the width of the housing parts is relatively narrow, the structures described above may be substantially identically applied to expand the resonance space.

[0127] Figures 13 and 14 illustrate an electronic device having a foldable structure.

[0128] Referring to FIG. 13, an electronic device (101) according to one embodiment may have a foldable structure. For example, the electronic device (101) may include a first housing part (1310) and a second housing part (1320). The first housing part (1310) and the second housing part (1320) may be rotatably coupled to each other so that they may be folded or unfolded. For example, a hinge assembly may be disposed between the first housing part (1310) and the second housing part (1320). The hinge assembly may rotatably couple the first housing part (1310) and the second housing part (1320).

[0129] Referring to FIG. 13, the aforementioned structure may be substantially identically applied to at least one of the first housing part (1310) or the second housing part (1320) of the electronic device (101). For example, the second housing part (1320) may include a first bracket (243) and a second bracket (260). The speaker (420) may be included within the second bracket (260). The second housing part (1320) may include a printed circuit board (250). For example, the printed circuit board (250) may be placed on the second bracket (260) (e.g., in the +z direction).

[0130] In the case of an electronic device (101) having a foldable structure, since the width of the first housing part (1310) and the width of the second housing part (1320) are relatively narrow, the resonance space for audio signals may be relatively narrow. According to one embodiment, in order to expand the resonance space for audio signals output from the speaker (420), the first space (e.g., the first space (S1) of FIG. 10) of the second bracket (260) surrounding the speaker (420) may be connected to a second space (e.g., the second space (S2) of FIG. 10) defined by the printed circuit board (250) and the shield can (e.g., the shield can (410) of FIG. 10). According to one embodiment, the first space (S1) and the second space (S2) may be configured to provide a resonance space for audio signals. As the resonance space expands, the quality of the audio signals may be improved.

[0131] Referring to FIG. 14, the electronic device (101) may include three housing parts. For example, the electronic device (101) may include a first housing part (1310), a second housing part (1320), and a third housing part (1330). The first housing part (1310) may be rotatably coupled to one side of the second housing part (1320), and the third housing part (1330) may be rotatably coupled to the other side of the second housing part (1320).

[0132] Referring to FIG. 14, the aforementioned structure may be substantially identically applied to at least one of the first housing part (1310), the second housing part (1320), or the third housing part (1330) of the electronic device (101). For example, the second housing part (1320) may include a first bracket (243) and a second bracket (260). The speaker (420) may be included within the second bracket (260). The second housing part (1320) may include a printed circuit board (250). For example, the printed circuit board (250) may be disposed on (e.g., in the +z direction) the second bracket (260).

[0133] According to one embodiment, in order to expand the resonance space for audio signals output from the speaker (420), a first space (e.g., the first space (S1) of FIG. 10) of a second bracket (260) surrounding the speaker (420) may be connected to a second space (e.g., the second space (S2) of FIG. 10) defined by a printed circuit board (250) and a shield can (e.g., the shield can (410) of FIG. 10). According to one embodiment, the first space (S1) and the second space (S2) may be configured to provide a resonance space for audio signals. As the resonance space expands, the quality of the audio signals may be improved.

[0134] The technical problems to be achieved in the present disclosure are not limited to the technical problems mentioned above, and other technical problems not mentioned will be clearly understood by a person having ordinary knowledge in the technical field to which the present disclosure pertains.

[0135] An electronic device (101) is disclosed. The electronic device (101) may include a printed circuit board (250). The electronic device (101) may include a shield can (410) partially mounted on a first surface (250a) of the printed circuit board (250). The shield can (410) may include a first portion (411) disposed on the first surface (250a) of the printed circuit board (250) and a second portion (412) protruding laterally from the printed circuit board (250). The electronic device (101) may include a bracket (e.g., a second bracket (260) of FIG. 10) disposed below a second surface (250b) of the printed circuit board (250) opposite to the first surface (250a) of the printed circuit board (250) and including a portion having an internal volume. The electronic device (101) may include a speaker (420) disposed within a portion of the bracket (260). The portion of the bracket (260) may define a first space (S1) surrounding the speaker (420). The bracket (260) may include a through hole (440) connecting the first space (S1) to a second space (S2) defined by the printed circuit board (250) and the shield can (410). As the first space (S1) and the second space (S2) are connected through the through hole (440), a resonance space for audio signals output from the speaker (420) may be expanded. As the resonance space is expanded, the quality of the audio signals may be improved. For example, in the case of an electronic device (101) having a relatively narrow width, the resonance space can be expanded by using the empty second space (S2) as the resonance space without a separate structure.

[0136] According to one embodiment, the printed circuit board (250) may include a corner cut-out portion (620). The second portion (412) of the shield can (410) may protrude from the corner cut-out portion (620) of the printed circuit board (250).

[0137] According to one embodiment, the corner cut-out portion (620) of the printed circuit board (250) can be formed by cutting a corner portion of the printed circuit board (250) that overlaps the first space (S1).

[0138] According to one embodiment, the first space (S1) and the second space (S2) connected to the first space (S1) may be configured to provide a resonant space for audio signals output from the speaker (420).

[0139] According to one embodiment, the electronic device (101) may further include a support part (910) that at least partially surrounds an edge portion of the second portion (412) of the shield can (410) to support the edge portion of the second portion (412) of the shield can (410).

[0140] According to one embodiment, the thickness of the support part (910) may correspond to the thickness of the printed circuit board (250).

[0141] According to one embodiment, the electronic device (101) may further include a sealing member (920) disposed on a surface of the bracket (260) facing the printed circuit board (250) to surround the through hole (440) for sealing between the second portion (412) of the shield can (410) and the bracket (260).

[0142] According to one embodiment, the electronic device (101) may further include a display (201) defining at least a portion of a front surface of the electronic device (101). The electronic device (101) may further include a rear plate (211) defining at least a portion of a rear surface of the electronic device (101). The electronic device (101) may further include another bracket (e.g., the first bracket (243) of FIG. 10) disposed between the display (201) and the rear plate (211). The electronic device (101) may further include a waterproof tape (1010) disposed between the display (201) and the other bracket (243). The second portion (412) of the shield can (410) may at least partially overlap the waterproof tape (1010).

[0143] According to one embodiment, a portion (1020) of the other bracket (243) corresponding to the waterproof tape (1010) may protrude toward the printed circuit board (250).

[0144] According to one embodiment, the first side (250a) of the printed circuit board (250) may face the display (201), and the second side (250b) of the printed circuit board (250) may face the rear plate (211).

[0145] According to one embodiment, the printed circuit board (250) and the bracket (260) may be positioned between the rear plate (211) and the other bracket (243).

[0146] According to one embodiment, the bracket (260) may include a support portion (1110) into which the edge portion of the second portion (412) of the shield can (410) is inserted to support the edge portion of the second portion (412) of the shield can (410).

[0147] According to one embodiment, the electronic device (101) may further include one or more electronic components (610) disposed on the first surface (250a) of the printed circuit board (250) and covered by the first portion (411) of the shield can (410).

[0148] According to one embodiment, the first volume of the second space (S2) may include a volume excluding the second volume of the one or more electronic components (610) from the third volume surrounded by the first surface (250a) of the printed circuit board (250) and the shield can (410).

[0149] In one embodiment, the first volume may be from 0.1 cc to 0.3 cc.

[0150] An electronic device (101) is disclosed. The electronic device (101) may include a foldable housing including a first housing part (1310) and a second housing part (1320) rotatably coupled to the first housing part (1310). The electronic device (101) may include a printed circuit board (250) disposed within the second housing part (1320). The electronic device (101) may include a shield can (410) partially mounted on a first surface (250a) of the printed circuit board (250). The shield can (410) may include a first portion (411) disposed on the first surface (250a) of the printed circuit board (250) and a second portion (412) protruding laterally from the printed circuit board (250). The electronic device (101) may include a bracket (260) disposed below a second surface (250b) of the printed circuit board (250) opposite to the first surface (250a) of the printed circuit board (250) and including a portion having an internal volume. The electronic device (101) may include a speaker (420) disposed within a portion of the bracket (260). The portion of the bracket (260) may include a first space (S1) surrounding the speaker (420). The bracket (260) may include a through hole (440) connecting the first space (S1) to a second space (S2) defined by the printed circuit board (250) and the shield can (410).

[0151] According to one embodiment, the printed circuit board (250) may include a corner cut-out portion (620). The second portion (412) of the shield can (410) may protrude from the corner cut-out portion (620) of the printed circuit board (250).

[0152] According to one embodiment, the first space (S1) and the second space (S2) connected to the first space (S1) may be configured to provide a resonant space for audio signals output from the speaker (420).

[0153] According to one embodiment, the electronic device (101) may further include a support part (910) that at least partially surrounds an edge portion of the second portion (412) of the shield can (410) to support the edge portion of the second portion (412) of the shield can (410).

[0154] According to one embodiment, the electronic device (101) may further include a sealing member (920) disposed on a surface of the bracket (260) facing the printed circuit board (250) to surround the through hole (440) for sealing between the second portion (412) of the shield can (410) and the bracket (260).

[0155] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned will be clearly understood by a person having ordinary skill in the art to which the present disclosure pertains.

[0156] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, electronic devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0157] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0158] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0159] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (120) (e.g., the processor (120)) of a machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0160] According to one embodiment, the method according to various embodiments disclosed in the present document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as a memory (130) of a manufacturer's server, an application store's server, or a relay server.

[0161] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In electronic devices, printed circuit board; A shield can partially mounted on a first surface of the printed circuit board, the shield can including a first portion disposed on the first surface of the printed circuit board and a second portion protruding laterally from the printed circuit board; A bracket disposed under a second surface of the printed circuit board opposite to the first surface of the printed circuit board, the bracket including a portion having an internal volume; and comprising a speaker arranged within a portion of the above bracket; The above part of the above bracket, Define a first space surrounding the above speaker, The above brackets are, defining a through hole connecting the first space to the second space defined by the printed circuit board and the shield can; Electronic devices.

2. In paragraph 1, The above printed circuit board, Includes corner cut-out portions, The second part of the above shield can, protruding from the corner cut-out portion of the printed circuit board, Electronic devices.

3. In paragraph 2, The corner cut-out portion of the above printed circuit board, Formed by cutting a corner portion of the printed circuit board overlapping the first space, Electronic devices.

4. In any one of paragraphs 1 to 3, The first space and the second space connected to the first space are, configured to provide a resonant space for audio signals output from the above speaker, Electronic devices.

5. In any one of paragraphs 1 to 4, Further comprising a support part that at least partially surrounds the edge portion of the second portion of the shield can to support the edge portion of the second portion of the shield can. Electronic devices.

6. In paragraph 5, The thickness of the above support part is Corresponding to the thickness of the above printed circuit board, Electronic devices.

7. In any one of paragraphs 1 to 6, For sealing between the second part of the shield can and the bracket, a sealing member is further included, which is arranged to surround the through hole on the side of the bracket facing the printed circuit board. Electronic devices.

8. In any one of paragraphs 1 to 7, A display defining at least a portion of the front surface of the electronic device; A rear plate defining at least a portion of the rear surface of the electronic device; another bracket disposed between the display and the rear plate; and Further comprising a waterproof tape placed between the display and the other bracket, The second part of the above shield can, At least partially overlapping with the above waterproof tape, Electronic devices.

9. In paragraph 8, A portion of the other bracket corresponding to the above waterproof tape, Protruding toward the printed circuit board, Electronic devices.

10. In paragraph 8 or 9, The first side of the printed circuit board, Facing the above display, The second side of the printed circuit board, Facing the above rear plate, Electronic devices.

11. In any one of paragraphs 8 to 10, The above printed circuit board and the above bracket, Positioned between the rear plate and the other bracket, Electronic devices.

12. In any one of paragraphs 1 to 11, The above brackets are, Including a support portion into which the edge portion of the second portion of the shield can is inserted to support the edge portion of the second portion of the shield can. Electronic devices.

13. In any one of paragraphs 1 to 12, One or more electronic components disposed on the first surface of the printed circuit board and covered by the first portion of the shield can, Electronic devices.

14. In paragraph 13, The first volume of the above second space is, A volume including a volume excluding a second volume of the one or more electronic components in a third volume surrounded by the first surface of the printed circuit board and the shield can, Electronic devices.

15. In paragraph 14, The above first volume is, Equivalent to 0.1cc to 0.3cc, Electronic devices.

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