Display panel, preparation method therefor, and display device

Abstract

A display panel, a preparation method therefor, and a display device. The display panel comprises a display area, a transition area, and a hole edge area. The display panel is provided with a through-hole. The hole edge area surrounds the through-hole, the transition area surrounds the hole edge area, and the display area surrounds the transition area. The display panel comprises a substrate, an isolation structure, and an encapsulation structure. The isolation structure is disposed on one side of the substrate, and is located in the transition area. The encapsulation structure is disposed on the side of the isolation structure away from the substrate. The encapsulation structure comprises a first encapsulation pattern and a second encapsulation pattern. The first encapsulation pattern is at least partially located within the transition area, and the first encapsulation pattern covers a portion of the isolation structure. The second encapsulation pattern is located in the display area and a portion of the transition area, and the portion of the second encapsulation pattern located in the transition area covers at least the remaining portion of the isolation structure. The first encapsulation pattern and the second encapsulation pattern are connected to each other in the transition area, and the water-oxygen barrier performance of the first encapsulation pattern is higher than the water-oxygen barrier performance of the second encapsulation pattern.

Description

Display panel, preparation method thereof and display device TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of display, and in particular to a display panel, a preparation method thereof and a display device. BACKGROUND

[0002] An organic light emitting diode (OLED) display panel has the advantages of self-illumination, low driving voltage, high luminous efficiency, thin thickness, wide viewing angle, fast response speed, and flexible display, and has gradually become one of the mainstream products in the display field.

[0003] At present, a black spot phenomenon is prone to occur at the edge of a display area of a display panel, and therefore, how to improve the display quality of the display panel is a technical problem to be solved in the display panel.

[0004] SUMMARY

[0005] In one aspect, a display panel is provided. The display panel includes a display area, a transition area and a hole edge area, and the display panel is provided with a through hole, wherein the hole edge area surrounds the through hole, the transition area surrounds the hole edge area, and the display area surrounds the transition area. The display panel includes a substrate, an isolation structure and an encapsulation structure, the isolation structure is arranged on one side of the substrate, and the isolation structure is located in the transition area. The encapsulation structure is arranged on the side of the isolation structure away from the substrate; the encapsulation structure includes a first encapsulation pattern and a second encapsulation pattern, the first encapsulation pattern is at least partially located in the transition area, and the first encapsulation pattern covers part of the isolation structure; the second encapsulation pattern is located in the display area and part of the transition area, and part of the transition area where the second encapsulation pattern is located covers at least the rest of the isolation structure. Wherein the first encapsulation pattern and the second encapsulation pattern are connected in the transition area, and the water and oxygen blocking performance of the first encapsulation pattern is higher than that of the second encapsulation pattern.

[0006] In some embodiments, the isolation structure includes a plurality of isolation columns and at least one blocking dam, the plurality of isolation columns include a first isolation column and a second isolation column, wherein the first isolation column is located on the side of the blocking dam close to the display area, the second isolation column is located on the side of the blocking dam away from the display area, and the first encapsulation pattern covers at least the second isolation column.

[0007] In some embodiments, the display panel further comprises a light-emitting continuous layer, the light-emitting continuous layer comprises a light-emitting functional layer and a first electrode layer arranged in a stack in a direction away from the substrate, the light-emitting continuous layer extends at least to the transition region, and the light-emitting continuous layer in the transition region is located between the isolation structure and the first encapsulation pattern, the second encapsulation pattern, and the light-emitting continuous layer in the transition region is broken at the side of the isolation column.

[0008] In some embodiments, a boundary of the first encapsulation pattern close to the display region is located between the second isolation column and the blocking dam, and the first encapsulation pattern covers a portion of the light-emitting continuous layer between the second isolation column and the blocking dam.

[0009] In some embodiments, the first encapsulation pattern covers the second isolation column and the blocking dam.

[0010] In some embodiments, in the case where the display panel further comprises a light-emitting continuous layer, a boundary of the first encapsulation pattern close to the display region is located between the first isolation column and the blocking dam, and the first encapsulation pattern covers the light-emitting continuous layer between the first isolation column and the blocking dam.

[0011] In some embodiments, the number of the first isolation columns is a plurality, and the first encapsulation pattern further covers at least one of the first isolation columns close to the blocking dam in the plurality of the first isolation columns.

[0012] In some embodiments, in the case where the display panel further comprises a light-emitting continuous layer, a boundary of the first encapsulation pattern close to the display region is located between two adjacent first isolation columns, and the first encapsulation pattern covers the light-emitting continuous layer between the two adjacent first isolation columns.

[0013] In some embodiments, the second encapsulation pattern overlaps the first encapsulation pattern.

[0014] In some embodiments, at the overlapping position of the second encapsulation pattern and the first encapsulation pattern, the second encapsulation pattern is located above the first encapsulation pattern.

[0015] In some embodiments, the overlapping part of the second encapsulation pattern and the first encapsulation pattern has a size range of 3-50 μm in a first direction, and the first direction is a direction in which the center of the through hole points to the display region.

[0016] In some embodiments, the first encapsulation pattern is located in the transition region, and on a side of the transition region away from the display region, the light-emitting continuous layer is closer to the side of the via hole than the first encapsulation pattern is closer to the side of the via hole, and the first encapsulation pattern is closer to the side of the via hole than the isolation structure is closer to the side of the via hole.

[0017] In some embodiments, the first encapsulation pattern is also located in the hole edge region, and in the hole edge region, the light-emitting continuous layer is flush with the side wall of the via hole and the first encapsulation pattern is closer to the side of the via hole than the light-emitting continuous layer is closer to the side of the via hole.

[0018] In some embodiments, the first encapsulation pattern includes at least four layers of sub-encapsulation patterns arranged in a stack, and the at least four layers of sub-encapsulation patterns include first sub-encapsulation patterns and second sub-encapsulation patterns arranged alternately, wherein the thickness of the first sub-encapsulation pattern is less than the thickness of the second sub-encapsulation pattern.

[0019] In some embodiments, the ratio of the thickness of the second sub-encapsulation pattern to the thickness of the first sub-encapsulation pattern ranges from 6:1 to 12:1.

[0020] In some embodiments, the material of the first sub-encapsulation pattern is silicon oxynitride, silicon oxide, or aluminum oxide, and the material of the second sub-encapsulation pattern is silicon nitride.

[0021] In some embodiments, the sub-encapsulation pattern farthest away from the substrate among the at least four layers of sub-encapsulation patterns is the second sub-encapsulation pattern.

[0022] In some embodiments, the isolation column has an inverted trapezoidal structure, and the material of the isolation column is an organic material.

[0023] In some embodiments, the display panel further includes: a touch layer arranged on a side of the encapsulation structure away from the substrate; an optical film layer arranged on a side of the touch layer away from the substrate; and a cover plate arranged on a side of the optical film layer away from the substrate; wherein the via hole penetrates through the substrate, the light-emitting continuous layer, the encapsulation structure, the touch layer, and the optical film layer.

[0024] In another aspect, a display device is provided. The display device includes: a display panel as described in any of the above embodiments, and a driving chip and a back component arranged on the display panel; the display panel includes a display side and a non-display side; the driving chip is electrically connected to the display panel; the back component is arranged on the non-display side of the display panel; the back component includes a camera, and the camera is arranged at the position of the via hole.

[0025] In another aspect, a method for manufacturing a display panel is provided. The method includes: providing a substrate including a via region, a display region, a transition region, and a hole edge region, wherein the hole edge region surrounds the via region, the transition region surrounds the hole edge region, and the display region surrounds the transition region; forming an isolation structure on one side of the substrate, the isolation structure being located in the transition region; forming a first encapsulation pattern on a side of the isolation structure away from the substrate, the first encapsulation pattern being at least partially located in the transition region, and the first encapsulation pattern covering part of the isolation structure; and forming a second encapsulation pattern on a side of the isolation structure away from the substrate, the second encapsulation pattern being located in the display region and part of the transition region, and part of the second encapsulation pattern located in the transition region covering at least part of the remaining isolation structure; wherein the first encapsulation pattern and the second encapsulation pattern are connected in the transition region, and the water and oxygen barrier property of the first encapsulation pattern is higher than that of the second encapsulation pattern.

[0026] In some embodiments, the steps of forming the first encapsulation pattern and the second encapsulation pattern include: disposing a mask plate to form the first encapsulation pattern on a side of the isolation structure away from the substrate; the mask plate being located above the display region and part of the transition region; forming an initial second encapsulation pattern on a side of the first encapsulation pattern away from the substrate, the initial second encapsulation pattern covering the display region, the transition region, and the hole edge region; and removing part of the initial second encapsulation pattern located in part of the transition region and the hole edge region to form the second encapsulation pattern. BRIEF DESCRIPTION OF DRAWINGS

[0027] In order to more clearly illustrate the technical solutions in the present disclosure, the following will briefly introduce the drawings needed to be used in some embodiments of the present disclosure. Obviously, the drawings in the following description are only some drawings of the embodiments of the present disclosure, and other drawings can also be obtained by those skilled in the art according to these drawings. In addition, the drawings in the following description can be regarded as schematic diagrams, and are not limited to the actual size, actual process, actual timing of signals, etc. of the products involved in the embodiments of the present disclosure.

[0028] FIG. 1 is a structural diagram of a display device according to some embodiments of the present disclosure;

[0029] FIG. 2 is a partially enlarged structural diagram of the display device at F1 according to some embodiments of FIG. 1 of the present disclosure;

[0030] FIG. 3A is a structural diagram of a display panel according to some embodiments of the present disclosure;

[0031] FIG. 3B is a partially enlarged structural diagram of the display panel of FIG. 3A according to some embodiments of the present disclosure;

[0032] FIG. 4A is another structural diagram of a display panel according to some embodiments of the present disclosure;

[0033] FIG. 4B is a partial enlarged structural diagram of the display panel of FIG. 4A according to some embodiments of the present disclosure;

[0034] FIG. 5A is another connection structural diagram of a display panel according to some embodiments of the present disclosure;

[0035] FIG. 5B is a partial enlarged structural diagram of the display panel of FIG. 5A according to some embodiments of the present disclosure;

[0036] FIG. 6A is another structural diagram of a display panel according to some embodiments of the present disclosure;

[0037] FIG. 6B is a partial enlarged structural diagram of the display panel of FIG. 6A according to some embodiments of the present disclosure;

[0038] FIG. 7A is another structural diagram of a display panel according to some embodiments of the present disclosure;

[0039] FIG. 7B is another structural diagram of a display panel according to some embodiments of the present disclosure;

[0040] FIG. 8A is a stacking structural diagram of a first packaging pattern of a display panel according to some embodiments of the present disclosure;

[0041] FIG. 8B is another stacking structural diagram of a first packaging pattern of a display panel according to some embodiments of the present disclosure;

[0042] FIG. 8C is another stacking structural diagram of a first packaging pattern of a display panel according to some embodiments of the present disclosure;

[0043] FIG. 9 is another structural diagram of a display panel according to some embodiments of the present disclosure;

[0044] FIG. 10 is a structural diagram of a display device according to some embodiments of the present disclosure;

[0045] FIG. 11 is a preparation flowchart of a display panel according to some embodiments of the present disclosure;

[0046] FIG. 12A is a preparation process structural diagram in a display panel according to some embodiments of the present disclosure;

[0047] FIG. 12B is a preparation process structural diagram in a display panel according to some embodiments of the present disclosure;

[0048] FIG. 12C is a preparation process structural diagram in a display panel according to some embodiments of the present disclosure;

[0049] FIG. 12D is a preparation process structural diagram in a display panel according to some embodiments of the present disclosure;

[0050] FIG. 12E is a structure diagram of a preparation process in a display panel according to some embodiments of the present disclosure. DETAILED DESCRIPTION

[0051] The technical solutions in some embodiments of the present disclosure will be clearly and completely described below with reference to the drawings. Obviously, the described embodiments are only some of the embodiments of the present disclosure, but not all the embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by those of ordinary skill in the art are within the scope of protection of the present disclosure.

[0052] Unless otherwise required by context, the term "comprise" and other forms of the term "comprise", such as "comprises" and "comprising", are used in the sense of "including, but not limited to", and permit the inclusion of additional elements without departing from the scope of the concept disclosed. In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" are intended to mean that a particular feature, structure, material or characteristic included in at least one embodiment or example of the present disclosure. The illustrative representation of the above terms does not necessarily mean the same embodiment or example. In addition, the specific features, structures, materials or characteristics described can be included in any one or more embodiments or examples in any appropriate manner.

[0053] Hereinafter, the terms "first", "second" are only used for description purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more features. In the description of the embodiments of the present disclosure, unless otherwise stated, the meaning of "a plurality of" is two or more.

[0054] In describing some embodiments, "coupled" and "connected," along with their derivatives, can be used. It should be understood that these terms are not intended as synonyms for each other. Rather, "connected" can be used to indicate that two or more elements are in direct physical or electrical contact with each other. "Coupled" can be used to indicate that two or more elements are in either physical or electrical contact with each other, even at a remote location from each other. The term "coupled" as used herein encompasses the case where one or more intervening elements can exist. The embodiments disclosed herein are not necessarily limited to the details of the embodiments described.

[0055] "at least one of A, B, and C" has the same meaning as "at least one of A, B, or C" and includes the following combinations: only A, only B, only C, a combination of A and B, a combination of A and C, a combination of B and C, and a combination of A, B, and C.

[0056] "A and / or B" includes the following combinations: A alone, B alone, and a combination of A and B.

[0057] As used herein, the term "if' can be interpreted to mean "when" or "while" or "in response to determining" or "in response to detecting," depending on the context. Similarly, the phrase "if it is determined" or "if [a stated condition or event] is detected" can be interpreted to mean "upon determining" or "in response to determining" or "upon detecting [the stated condition or event]" or "in response to detecting [the stated condition or event]," depending on the context.

[0058] Use of "adapted to" or "configured to," as used herein, means open and inclusive language that does not exclude additional devices or steps that are adapted to or configured to perform the recited tasks or steps.

[0059] Additionally, use of "based on" means open and inclusive, as the process, step, calculation, or other action that is based on one or more recited conditions or values can in practice be based on additional conditions or values beyond those recited.

[0060] As used herein, "about," "approximately," or "around" includes the recited value and the average value within an acceptable range of deviation from the recited value, as determined by one of ordinary skill in the art considering the measurement in question and the error in measuring the particular quantity (i.e., the limitations of the measurement system).

[0061] As used herein, "parallel," "perpendicular," "equal" include the recited condition and conditions approximating the recited condition within an acceptable deviation range, as determined by one of ordinary skill in the art taking into account the measurements at issue and the error associated with the measurement of the particular quantity (i.e., limitations of the measurement system). For example, "parallel" includes absolute parallel and near parallel, where near parallel can have an acceptable deviation range of, for example, 5° or less; "perpendicular" includes absolute perpendicular and near perpendicular, where near perpendicular can also have an acceptable deviation range of, for example, 5° or less. "Equal" includes absolute equality and near equality, where near equality can have an acceptable deviation range of, for example, less than or equal to 5% of the difference between the two.

[0062] It will be understood that when a layer or element is referred to as being "on" another layer or substrate, it can be directly on the other layer or substrate, or intervening layers can also be present.

[0063] Exemplary embodiments are described herein with reference to cross-sectional and / or plan view illustrations that are idealized examples. In the interest of clarity, not all of the circular features can be shown in the drawings. It will be appreciated that in the development of any such actual implementation, numerous implementation-specific decisions can be made. These implementation-specific decisions can include, for example, manufacturing or processing tolerances, variations from the teaching, and / or the skill(s) of those in the art. Such implementation-specific decisions can be unique, depending on the specific implementation, and many alternatives have been discussed herein. It is intended that each of such alternatives be considered as possible implementations of the present technology even though such alternatives can not be explicitly shown. Thus, the exemplary embodiments should not be construed as limited to the examples shown, but rather interpreted as including all possible implementations falling within the spirit and scope of the exemplary embodiments.

[0064] In recent years, the overall display area of organic light emitting diode (OLED) display devices and terminal products is increasing, for example, a display screen is provided with an opening to increase the display area. Exemplarily, the opening position of the display screen can be used to place external components such as sensors and cameras, which can reduce the space occupation of the external components at the frame position of the display screen, thereby narrowing the frame and improving the display area. However, due to the complex display screen opening process, water vapor or foreign matter often enters along the opening edge to cause the display device to fail, affecting the service life and reliability of the display device.

[0065] Based on this, some embodiments of the present disclosure provide a display panel and a preparation method thereof, and a display device, to avoid the problem that the opening area of the display device is invaded by water vapor, causing the display device to fail, while improving the service life and reliability of the display device.

[0066] It should be noted that the labels appearing in the drawings of the present disclosure, such as A / B~C, mean that A and B can both refer to the structure indicated by the label, and A / B both belong to C. Similar labels appearing in the drawings also follow the above description.

[0067] As shown in FIG. 1, some embodiments of the present disclosure provide a display panel 100, which includes a display area AA, a transition area B1 and a hole edge area B2, wherein the display panel 100 is provided with a through hole T, the hole edge area B2 surrounds the through hole T, the transition area B1 surrounds the hole edge area B2, and the display area AA surrounds the transition area B1.

[0068] It should be noted that, with reference to FIG. 1, the display panel 100 includes a display area AA and a non-display area BB disposed adjacent to the display area AA, wherein the non-display area BB includes a frame area B3 of the display panel 100; in some application scenarios of the display panel 100, with reference to FIGS. 1 and 2, a through hole T can be provided in the display panel 100 to accommodate devices such as cameras and sensors; in the case where the through hole T is provided in the display panel 100, the non-display area BB further includes the transition area B1 and the hole edge area B2, i.e., the display panel 100 does not display a picture in the transition area B1 and the hole edge area B2, wherein the hole edge area B2 is an area around the through hole T, in this case, the hole edge area B2 is disposed around the through hole T, the transition area B1 is disposed around the hole edge area B2, and the display area AA surrounds the transition area B1.

[0069] Exemplarily, the shape of the through hole T can be square, circular, oval, etc., which is not specifically limited here. With reference to FIGS. 1 and 2, the through hole T shown in FIGS. 1 and 2 of the present disclosure is taken as an example to be circular, at this time, the shapes of the transition area B1 and the hole edge area B2 are both circular annular.

[0070] In some embodiments, as shown in FIGS. 3A, 3B, 4A and 4B, the display panel 100 includes a substrate 1, an isolation structure 2 and an encapsulation structure 3. The isolation structure 2 is disposed on one side of the substrate 1, and the isolation structure 2 is located in the transition area B1. The encapsulation structure 3 is disposed on the side of the isolation structure 2 away from the substrate 1; the encapsulation structure 3 includes a first encapsulation pattern 31 and a second encapsulation pattern 32, the first encapsulation pattern 31 is at least partially located in the transition area B1, and the first encapsulation pattern 31 covers part of the isolation structure 2; the second encapsulation pattern 32 is located in the display area AA and part of the transition area B1, and the part of the transition area B1 where the second encapsulation pattern 32 is located covers at least the rest of the isolation structure 2; wherein the first encapsulation pattern 31 and the second encapsulation pattern 32 are connected in the transition area B1, and the water and oxygen barrier property of the first encapsulation pattern 31 is higher than that of the second encapsulation pattern 32.

[0071] Exemplarily, the material of the substrate 1 is a transparent material. For example, the substrate 1 can adopt a transparent flexible substrate, or can also adopt a transparent rigid substrate such as glass or ultra-thin glass.

[0072] It should be noted that the first encapsulation pattern 31 is at least partially located in the transition area B1. In some examples, referring to FIGS. 3A and 3B, the first encapsulation pattern 31 can be located in the transition area B1, that is, the orthographic projection of the first encapsulation pattern 31 on the substrate 1 is located in the transition area B1; in some examples, referring to FIGS. 4A and 4B, the first encapsulation pattern 31 can be located in the transition area B1 and the hole edge area B2, that is, a part of the first encapsulation pattern 31 is located in the transition area B1 and the other part is located in the hole edge area B2. Therefore, in the case that the first encapsulation pattern 31 is located in the transition area B1, the first encapsulation pattern 31 only has a water-oxygen barrier effect in the transition area B1, and in the case that the first encapsulation pattern 31 is located in the transition area B1 and the hole edge area B2, the first encapsulation pattern 31 can simultaneously have a water-oxygen barrier effect in the transition area B1 and the hole edge area B2.

[0073] It should be noted that the first encapsulation pattern 31 and the second encapsulation pattern 32 are connected in the transition area B1, that is, the first encapsulation pattern 31 and the second encapsulation pattern 32 are in contact with each other on the side surfaces adjacent to each other, or the first encapsulation pattern 31 and the second encapsulation pattern 32 are overlapped at the edge position close to each other, and the connection position is located in the transition area B1. Since the first encapsulation pattern 31 and the second encapsulation pattern 32 both have water-oxygen barrier capability, such a setting is to ensure that the encapsulation structure 3 can realize continuous coverage from the transition area B1 to the display area AA, and ensure the continuity of the encapsulation structure 3, that is, the water vapor or foreign matter can be continuously blocked.

[0074] It can be understood that the water-oxygen barrier performance of the first encapsulation pattern 31 is higher than that of the second encapsulation pattern 32, and the first encapsulation pattern 31 is closer to the through hole T than the second encapsulation pattern 32, that is, the setting of the first encapsulation pattern 31 can improve the water-oxygen corrosion resistance of the edge position of the through hole T, that is, the encapsulation capability of the edge of the through hole T can be improved, and thus the invasion of water vapor or foreign matter along the hole edge area B2 and the transition area B1 of the edge of the through hole T into the display area AA can be solved, and the phenomenon that the display device is damaged and the normal display of the display picture is affected can be avoided.

[0075] In some embodiments, continuing to refer to FIGS. 3A, 3B, 4A, 4B, 5A, 5B, 6A and 6B, the isolation structure 2 includes a plurality of isolation columns 21 and at least one blocking dam 22, the plurality of isolation columns 21 include a first isolation column 201 and a second isolation column 202, wherein the first isolation column 201 is located on a side of the blocking dam 22 close to the display area AA, the second isolation column 202 is located on a side of the blocking dam 22 away from the display area AA, and the first encapsulation pattern 31 covers at least the second isolation column 202.

[0076] For example, referring to FIGS. 3A, 3B, 4A, 4B, 5A, 5B, 6A and 6B, the first encapsulation pattern 31 covers at least the second isolation column 202, that is, in some examples, referring to FIGS. 5A and 5B, the first encapsulation pattern 31 can only cover the second isolation column 202, and at this time, the second encapsulation pattern 32 can cover the first isolation column 201 and the blocking dam 22, and the connection position of the first encapsulation pattern 31 and the second encapsulation pattern 32 is located between the second isolation column 202 closest to the display area AA and the blocking dam 22 farthest from the display area AA, so as to ensure the continuity of the water and oxygen blocking performance of the encapsulation structure 3, and thus reduce the phenomenon of water vapor intrusion.

[0077] In other examples, referring to FIGS. 3A, 3B, 4A, 4B, 6A and 6B, the first encapsulation pattern 31 can cover other parts of the isolation structure 2 in addition to covering the second isolation column 202.

[0078] In some embodiments, continuing to refer to FIGS. 3A, 3B, 4A, 4B, 5A, 5B, 6A and 6B, the display panel 100 further includes a light-emitting continuous layer 4, the light-emitting continuous layer 4 includes a light-emitting functional layer 41 and a first electrode layer 42 stacked in a direction away from the substrate 1, the light-emitting continuous layer 4 at least extends to the transition area B1, and the light-emitting continuous layer 4 located in the transition area B1 is located between the isolation structure 2 and the first encapsulation pattern 31 and the second encapsulation pattern 32, and the light-emitting continuous layer 4 located in the transition area B1 is disconnected at the side of the isolation column 21.

[0079] For example, referring to FIGS. 3A, 3B, 4A, 4B, 5A, 5B, 6A and 6B, the light-emitting continuous layer 4 at least extends to the transition area B1, that is, in some examples, referring to FIGS. 3A and 3B, the light-emitting continuous layer 4 can extend from the display area AA to the transition area B1, or, referring to FIGS. 4A, 4B, 5A, 5B, 6A and 6B, the light-emitting continuous layer 4 can also extend from the display area AA to the hole edge area B2.

[0080] It should be noted that, continuing to refer to FIGS. 3A, 3B, 4A, 4B, 5A, 5B, 6A and 6B, since the light-emitting continuous layer 4 located in the transition region B1 is located between the isolation structure 2 and the first encapsulation pattern 31 and the second encapsulation pattern 32, the light-emitting continuous layer 4 located in the transition region B1 is broken at the side surface of each isolation column 21, that is, the light-emitting continuous layer 4 can cover the side surface of the isolation column 21 away from the substrate 1, while exposing part of the side surface of the isolation column 21, and the light-emitting continuous layer 4 can be in contact with the position of the side surface of the isolation column 21 close to the substrate 1. Since the cross-sectional shape of the blocking dam 22 is a right trapezoidal shape with the top smaller and the bottom larger, the light-emitting continuous layer 4 can cover the surface and the side surface of the blocking dam 22 away from the substrate 1, and the light-emitting continuous layer 4 located in the transition region B1 includes the part located on the surface of the isolation column 21 away from the substrate, the part located on the surface and the side surface of the blocking dam 22 away from the substrate 1, the part located between adjacent isolation columns 21, and the part located between adjacent blocking dams 22 and isolation columns 21. The light-emitting continuous layer 4 includes a plurality of broken boundaries K, at which the light-emitting continuous layer 4 is separated into a part located on the surface of the isolation column 21 and a part located on the side surface of the isolation column 21 close to or away from the display region AA.

[0081] It should be explained that the light-emitting continuous layer 4 located in the transition region B1 is broken at the side surface of each isolation column 21 because the structure of the isolation column 21 is a structure with the top larger and the bottom smaller, and in the process of preparing the light-emitting continuous layer 4, the light-emitting continuous layer 4 deposited on the side surface of the isolation column 21 will be naturally broken, that is, the broken position of the light-emitting continuous layer 4 is naturally formed.

[0082] It can be understood that the light-emitting continuous layer 4 located in the transition region B1 is broken at the side surface of each isolation column 21 in order to prevent water and oxygen in the external environment from eroding into the display region AA through the light-emitting continuous layer 4, thereby avoiding damage to the display components located in the display region AA. That is, at each broken position, it can play a role in blocking water and oxygen. Compared with the continuously arranged light-emitting continuous layer 4, the above structure can better protect the display region AA from the influence of water and oxygen, and ensure that the display screen can normally display.

[0083] Referring to FIG. 2, the transition region B1 and the hole edge region B2 are annular, and the orthographic projection of the first encapsulation pattern 31 on the substrate is annular, for example, circular ring-shaped. The first encapsulation pattern 31 has two boundaries, which are the boundary close to the display region AA and the boundary away from the display region AA.

[0084] The position of the boundary of the first encapsulation pattern 31 close to the display region AA in each embodiment is introduced below.

[0085] In some embodiments, referring to FIGS. 5A and 5B, the first encapsulation pattern 31 covers the second isolation column 202, and a boundary P1 of the first encapsulation pattern 31 close to the display area AA is located between the second isolation column 202 and the blocking dam 22, and the first encapsulation pattern 31 covers a part of the light-emitting continuous layer 4 located between the second isolation column 202 and the blocking dam 22.

[0086] For example, as shown in FIGS. 5A and 5B, the boundary P1 of the first encapsulation pattern 31 close to the display area AA is located between the second isolation column 202 and the blocking dam 22, that is, the first encapsulation pattern 31 is connected with the second encapsulation pattern 32 between the second isolation column 202 and the blocking dam 22, and in this case, the first encapsulation pattern 31 covers a part of the light-emitting continuous layer 4 located between the second isolation column 202 and the blocking dam 22, that is, the first encapsulation pattern 31 can cover the part of the light-emitting continuous layer 4 close to the second isolation column 202 between the second isolation column 202 and the blocking dam 22. It can be understood that the boundary of the light-emitting continuous layer 4 close to the second isolation column 202 between the second isolation column 202 and the blocking dam 22 is the first disconnected boundary K1 of the light-emitting continuous layer 4. In the case that the first encapsulation pattern 31 covers the part of the light-emitting continuous layer 4 close to the second isolation column 202 between the second isolation column 202 and the blocking dam 22, the first disconnected boundary K1 of the light-emitting continuous layer 4 is also covered. In this way, the water vapor can be prevented from invading along the first disconnected boundary K1 and reacting with the light-emitting continuous layer 4, so as to avoid the problem of failure of the light-emitting continuous layer 4 and improve the service life and reliability of the display device.

[0087] In some embodiments, referring to FIGS. 3A, 3B, 4A and 4B, the first encapsulation pattern 31 covers the second isolation column 202 and the blocking dam 22.

[0088] For example, referring to FIGS. 3A, 3B, 4A and 4B, the first encapsulation pattern 31 covers the second isolation column 202 and the blocking dam 22, and in this case, the second encapsulation pattern 32 can cover the first isolation column 201, and the connection position of the first encapsulation pattern 31 and the second encapsulation pattern 32 is located between the blocking dam 22 close to the display area AA and the first isolation column 201 away from the display area AA, so as to ensure the continuity of the water-oxygen blocking performance of the encapsulation structure 3 and further reduce the risk of water vapor invasion.

[0089] In some embodiments, referring to FIGS. 3A, 3B, 4A and 4B, in the case that the display panel 100 further includes the light-emitting continuous layer 4, a boundary P2 of the first encapsulation pattern 31 close to the display area AA is located between the first isolation column 201 and the blocking dam 22, and the first encapsulation pattern 31 covers the light-emitting continuous layer 4 located between the first isolation column 201 and the blocking dam 22.

[0090] Exemplarily, referring to FIGS. 3A, 3B, 4A and 4B, the number of the first isolation columns 201 is one, the boundary P2 of the first encapsulation pattern 31 close to the display area AA is located between the first isolation column 201 and the blocking dam 22, that is, the first encapsulation pattern 31 is connected with the second encapsulation pattern 32 between the first isolation column 201 and the blocking dam 22, at this time, the first encapsulation pattern 31 covers the light-emitting continuous layer 4 located between the first isolation column 201 and the blocking dam 22, and it can be understood that the boundary of the light-emitting continuous layer 4 close to the first isolation column 201 side is the second disconnected boundary K2 of the light-emitting continuous layer 4, in the case that the first encapsulation pattern 31 covers the light-emitting continuous layer 4 between the first isolation column 201 and the blocking dam 22, the second disconnected boundary K2 of the light-emitting continuous layer 4 is also covered, and such arrangement can avoid the water vapor from invading along the second disconnected boundary K2 and reacting with the light-emitting continuous layer 4, thereby avoiding the problem of failure of the light-emitting continuous layer 4 and improving the service life and reliability of the display device.

[0091] In some embodiments, referring to FIGS. 6A and 6B, the number of the first isolation columns 201 is multiple, and the first encapsulation pattern 31 further covers at least one first isolation column 201 close to the blocking dam 22 in the multiple first isolation columns 201.

[0092] Exemplarily, referring to FIGS. 6A and 6B, the number of the first isolation columns 201 is two, the first encapsulation pattern 31 covers the first isolation column 201 away from the display area AA side, at this time, the second encapsulation pattern 32 covers the first isolation column 201 close to the display area AA side, and the connection position of the first encapsulation pattern 31 and the second encapsulation pattern 32 is located between the two first isolation columns 201, so as to ensure the continuity of the water-oxygen blocking performance of the encapsulation structure 3 and further reduce the phenomenon of water vapor invasion.

[0093] In some embodiments, referring to FIGS. 6A and 6B, in the case that the display panel 100 further comprises the light-emitting continuous layer 4, the boundary P3 of the first encapsulation pattern 31 close to the display area AA is located between the adjacent two first isolation columns 201, and the first encapsulation pattern 31 covers the light-emitting continuous layer 4 located between the adjacent two first isolation columns 201.

[0094] Referring to FIGS. 6A and 6B, the boundary P3 of the first encapsulation pattern 31 near the display area AA is located between two adjacent first isolation columns 201, that is, the first encapsulation pattern 31 is connected with the second encapsulation pattern 32 between the two adjacent first isolation columns 201. At this time, the first encapsulation pattern 31 covers the light-emitting continuous layer 4 between the two adjacent first isolation columns 201, and the light-emitting continuous layer 4 between the two adjacent first isolation columns 201 has a third disconnection boundary K3 near the display area AA and a fourth disconnection boundary K4 away from the display area AA. It can be understood that, in the case that the first encapsulation pattern 31 covers the light-emitting continuous layer 4 between the two adjacent first isolation columns 201, the third disconnection boundary K3 and the fourth disconnection boundary K4 of the light-emitting continuous layer 4 are also covered. This arrangement can avoid the invasion of water vapor along the third disconnection boundary K3 and the fourth disconnection boundary K4, and the reaction with the light-emitting continuous layer 4, thereby preventing the light-emitting continuous layer 4 from failing and improving the service life and reliability of the display device.

[0095] In some embodiments, continuing to refer to FIGS. 3A and 3B in combination with FIG. 2, the first encapsulation pattern 31 is located in the transition area B1, and on the side of the transition area B1 away from the display area AA, the boundary K5 of the light-emitting continuous layer 4 near the through hole T is close to the boundary P4 of the first encapsulation pattern 31 near the through hole T and close to the display area AA, and the boundary P4 of the first encapsulation pattern 31 near the through hole T is located on the side of the isolation structure 2 near the through hole T.

[0096] For example, as shown in FIGS. 3A and 3B, the first encapsulation pattern 31 is located only in the transition area B1. In the case that the first encapsulation pattern 31 is located in the transition area B1, the light-emitting continuous layer 4 is also located in the transition area B1, that is, the light-emitting continuous layer 4 and the first encapsulation pattern 31 are not arranged in the hole edge area B2. This arrangement can avoid the invasion of water vapor and oxygen in the environment along the position of the through hole T to corrode the light-emitting continuous layer 4 in the hole edge area B2, thereby preventing the peeling between the light-emitting continuous layer 4 and the first encapsulation pattern 31, and improving the encapsulation effect of the first encapsulation pattern 31.

[0097] It should be noted that, as shown in FIGS. 3A and 3B, the boundary K5 of the light-emitting continuous layer 4 close to the through hole T is a fifth cut-off boundary K5 of the light-emitting continuous layer 4 located on the side of the second isolation column 202 away from the substrate 1, and the light-emitting continuous layer 4 is located on the surface of the second isolation column 202 farthest from the substrate 1 and is not arranged on the side of the second isolation column 202 close to the through hole T. The boundary P4 of the first encapsulation pattern 31 close to the through hole T is the side of the second isolation column 202 close to the through hole T, and the first encapsulation pattern 31 also covers the side of the second isolation column 202 closest to the through hole T. That is, the first encapsulation pattern 31 can cover the fifth cut-off boundary K5 of the light-emitting continuous layer 4 and the side of the second isolation column 202, so that the boundary K5 of the light-emitting continuous layer 4 close to the through hole T is close to the boundary P4 of the first encapsulation pattern 31 close to the through hole T. It can be understood that the arrangement of the first encapsulation pattern 31 can prevent water vapor and oxygen in the environment from invading and corroding the second isolation column 202 and the light-emitting continuous layer 4 along the position of the through hole T, thereby playing a good barrier role and improving the service life and quality of the display panel.

[0098] In some embodiments, continuing to refer to FIGS. 4A, 4B, 5A, 5B, 6A and 6B, the first encapsulation pattern 31 is also located in the hole edge area B2, and in the hole edge area B2, the boundary K6 of the light-emitting continuous layer 4 close to the through hole T and the boundary P5 of the first encapsulation pattern 31 close to the through hole T are flush with the side wall of the through hole T. The boundary P5 of the first encapsulation pattern 31 close to the through hole T is the boundary of the first encapsulation pattern 31 away from the display area AA.

[0099] It should be noted that the boundary K6 of the light-emitting continuous layer 4 close to the through hole T and the boundary P5 of the first encapsulation pattern 31 close to the through hole T are flush with the side wall of the through hole T because, in the preparation process, the initial display panel is first formed, and then the through hole T is formed by punching the through hole area T1 of the initial display panel. During the punching process, the portions of the light-emitting continuous layer 4 and the first encapsulation pattern 31 located in the through hole area T1 are synchronously removed, so that the boundary K6 of the light-emitting continuous layer 4 close to the through hole T and the boundary P5 of the first encapsulation pattern 31 close to the through hole T are flush with the side wall of the through hole T. The side wall of the through hole T of the prepared display panel is the boundary K6 of the light-emitting continuous layer 4 close to the through hole T and the boundary P5 of the first encapsulation pattern 31 close to the through hole T.

[0100] In some embodiments, referring to FIGS. 3A and 3B, the display panel further comprises a light emitting device layer 10, the light emitting device layer 10 comprises a light emitting continuous layer 4 and a second electrode layer 43 which are arranged in a stacked manner along a direction close to the substrate 1, wherein the light emitting continuous layer 4 comprises a first electrode layer 42 and a light emitting functional layer 41 which are arranged in a stacked manner along a direction close to the substrate 1. The light emitting device layer 10 comprises a plurality of light emitting devices, which can be light emitting devices of different colors, for example, red light emitting devices, green light emitting devices or blue light emitting devices, so that the display panel 100 can realize the display of a color picture. The plurality of light emitting devices can also be a single white light emitting device or a single blue light emitting device, in which case the single color light is converted into a target color by arranging a color conversion structure above the light emitting device layer 10. The first electrode layers 42 of the plurality of light emitting devices are connected to each other to form a continuous whole layer structure.

[0101] In some embodiments, the first electrode layer 42 is configured as a cathode layer of the light emitting device layer 10, and the second electrode layer 43 is configured as an anode layer of the light emitting device layer 10; in other embodiments, the first electrode layer 42 is configured as an anode layer of the light emitting device layer 10, and the second electrode layer 43 is configured as a cathode layer of the light emitting device layer 10.

[0102] In some embodiments, the second electrode layer 43 is a continuous film layer laid in the display area and extending to the transition area, and the first electrode layer comprises a plurality of first electrodes arranged at intervals.

[0103] The electrodes in the first electrode layer 42 are semi-transparent and semi-reflective electrodes, and the electrodes in the second electrode layer 43 are reflective electrodes, at this time, the display panel 100 is a top emission display panel; in other embodiments, the electrodes in the first electrode layer 42 are reflective electrodes, and the electrodes in the second electrode layer 43 are semi-transparent and semi-reflective electrodes, at this time, the display panel 100 is a bottom emission display panel, and the embodiments of the present disclosure do not make specific limitations thereon.

[0104] The light emitting functional layer 41 comprises an organic light emitting layer EML. The organic light emitting layer EML comprises a plurality of organic light emitting parts, which are arranged independently of each other in the case of a plurality of light emitting devices of different colors. In the case of a plurality of light emitting devices of the same color, for example, white light emitting devices or blue light emitting devices, the organic light emitting parts of the plurality of light emitting devices can be connected to form a whole surface structure, or can be arranged independently of each other.

[0105] The light-emitting functional layer 41 can further include at least one common layer including a hole injection layer, a hole transport layer, an electron blocking layer, a hole blocking layer, an electron transport layer, and an electron injection layer. The hole injection layer and / or the hole transport layer can be disposed between the anode and the organic light-emitting layer EML, and the electron injection layer and / or the electron transport layer can be disposed between the cathode and the organic light-emitting layer EML. The structure of the organic light-emitting diode display panel in the related art can be referred to for understanding. When the light-emitting functional layer 41 includes one or more of the hole injection layer, the hole transport layer, the electron blocking layer, the hole blocking layer, the electron transport layer, and the electron injection layer, these film layers can be in a full-area structure or can be independently disposed.

[0106] In some embodiments, with continued reference to FIGS. 3A, 3B, 4A, 4B, 5A, 5B, 6A, and 6B, the second encapsulation pattern 32 overlaps the first encapsulation pattern 31.

[0107] It can be understood that the second encapsulation pattern 32 overlaps the first encapsulation pattern 31, that is, the orthographic projection of the second encapsulation pattern 32 on the substrate 1 partially overlaps the orthographic projection of the first encapsulation pattern 31 on the substrate 1. As described in the foregoing, since the second encapsulation pattern 32 is connected to the first encapsulation pattern 31, that is, the second encapsulation pattern 32 overlaps the first encapsulation pattern 31 at the connection position, this arrangement can prevent moisture from entering the gap between the second encapsulation pattern 32 and the first encapsulation pattern 31 and damaging the display device, thereby improving the encapsulation effect and ensuring normal display of the display area AA.

[0108] In some embodiments, with continued reference to FIGS. 3A, 3B, 4A, 4B, 5A, 5B, 6A, and 6B, the second encapsulation pattern 32 is located above the first encapsulation pattern 31 at the overlapping position of the second encapsulation pattern 32 and the first encapsulation pattern 31.

[0109] It can be understood that the second encapsulation pattern 32 is located above the first encapsulation pattern 31, which is equivalent to that the second encapsulation pattern 32 and the first encapsulation pattern 31 have a height difference at the overlapping position. The height difference can play a role in blocking moisture. Meanwhile, the thickness is increased at the overlapping position, which can slow down the penetration rate of moisture when the moisture invades at this position, prolong the moisture invasion time, and improve the reliability.

[0110] In some embodiments, with reference to FIGS. 3A, 3B, and 4A, 4B, and in combination with FIG. 2, the overlapping part of the second encapsulation pattern 32 and the first encapsulation pattern 31 has a size D in the first direction X ranging from 3 μm to 50 μm. The first direction X is the direction in which the center of the through hole T points to the display area AA.

[0111] Exemplarily, referring to FIG. 3A, FIG. 3B, and FIG. 4A, FIG. 4B, the size D of the overlapping part of the second encapsulation pattern 32 and the first encapsulation pattern 31 in the first direction X can include but is not limited to 3 μm, 5 μm, 10 μm, 15 μm, 20 μm, 30 μm, 40 μm, or 50 μm.

[0112] In some embodiments, referring to FIG. 7A and FIG. 7B, the encapsulation structure 3 further comprises an organic encapsulation layer 33 and an inorganic encapsulation layer 34, the organic encapsulation layer 33 is disposed on the side of the second encapsulation pattern 32 away from the substrate 1; the inorganic encapsulation layer 34 is disposed on the side of the organic encapsulation layer 33 and the first encapsulation pattern 31 away from the substrate 1, and the inorganic encapsulation layer 34 is located in the display area AA, the transition area B1, and the hole edge area B2.

[0113] Exemplarily, the material of the organic encapsulation layer 33 comprises a polymer combination of one or more of an acrylic-based polymer, a silicon-based polymer, and an epoxy-based polymer, and the above-mentioned material is made on the second encapsulation pattern 32 by using an Ink Jet Printing (IJP) method and is subjected to ultraviolet (UV) curing to form the organic encapsulation layer 33.

[0114] Exemplarily, the material of the inorganic encapsulation layer 34 comprises a combination of one or more of silicon nitride (SiNx), silicon dioxide (SiOx), and silicon oxynitride (SiON). The inorganic encapsulation layer 34 is formed by using a Chemical Vapor Deposition (CVD) process.

[0115] It should be noted that the inorganic encapsulation layer 34 is located in the display area AA, the transition area B1, and the hole edge area B2, and the inorganic encapsulation layer 34 is disposed on the side of the organic encapsulation layer 33 and the first encapsulation pattern 31 away from the substrate 1, and the inorganic encapsulation layer 34 is configured to reduce the risk of water vapor and oxygen in the external environment entering the light-emitting continuous layer 4, thereby improving the service life of the display panel 100.

[0116] In some examples, referring to FIG. 7A and FIG. 7B, the organic encapsulation layer 33 covers the first isolation column 201, that is, the side of the organic encapsulation layer 33 away from the display area AA is farther away from the display area AA than the side of the first isolation column 201 away from the display area AA, according to FIG. 7A and FIG. 7B, the side of the organic encapsulation layer 33 away from the display area AA can cover the side of the blocking dam 22 close to the display area AA.

[0117] In some embodiments, referring to FIGS. 8A-8C, the first encapsulation pattern 31 includes at least four layers of sub-encapsulation patterns 311 arranged in a stack, the at least four layers of sub-encapsulation patterns 311 including first sub-encapsulation patterns 311a and second sub-encapsulation patterns 311b arranged alternately, wherein a thickness d1 of the first sub-encapsulation patterns 311a is less than a thickness d2 of the second sub-encapsulation patterns 311b.

[0118] Illustratively, referring to FIG. 8A, the first encapsulation pattern 31 in FIG. 8A includes four layers of sub-encapsulation patterns 311 arranged in a stack, wherein the four layers of sub-encapsulation patterns 311 include first sub-encapsulation patterns 311a and second sub-encapsulation patterns 311b arranged alternately in a sequence of thin-thick-thin-thick in a direction away from the substrate 1, that is, the sub-encapsulation patterns 311 arranged alternately in the sequence of thin-thick-thin-thick in the direction away from the substrate 1 form a plurality of interfaces.

[0119] Illustratively, referring to FIG. 8B, the first encapsulation pattern 31 in FIG. 8B includes four layers of sub-encapsulation patterns 311 arranged in a stack, wherein the four layers of sub-encapsulation patterns 311 include second sub-encapsulation patterns 311b and first sub-encapsulation patterns 311a arranged alternately in a sequence of thick-thin-thick-thin in a direction away from the substrate 1, that is, the sub-encapsulation patterns 311 arranged alternately in the sequence of thick-thin-thick-thin in the direction away from the substrate 1 form a plurality of interfaces.

[0120] Illustratively, referring to FIG. 8C, the first encapsulation pattern 31 in FIG. 8C includes five layers of sub-encapsulation patterns 311 arranged in a stack, wherein the five layers of sub-encapsulation patterns 311 include second sub-encapsulation patterns 311b and first sub-encapsulation patterns 311a arranged alternately in a sequence of thick-thin-thick-thin-thick in a direction away from the substrate 1, that is, the sub-encapsulation patterns 311 arranged alternately in the sequence of thick-thin-thick-thin-thick in the direction away from the substrate 1 form a plurality of interfaces.

[0121] It should be noted that in combination with the above embodiments of the sub-encapsulation patterns 311 arranged in a stack, on the one hand, the thickness of the film layer and the encapsulation performance are positively correlated within a certain range, and the thickness of the single-layer sub-encapsulation pattern 311 has an upper limit, that is, when the film thickness of the single-layer sub-encapsulation pattern 311 reaches a certain degree, the improvement of the encapsulation performance is limited, and by stacking the multi-layer sub-encapsulation patterns, the first encapsulation pattern can reach a certain thickness to improve the encapsulation effect; on the other hand, by stacking the first sub-encapsulation patterns 311a and the second sub-encapsulation patterns 311b, the interface can be increased, and when the water vapor invades the interface, the penetration rate is slowed down due to the effect of the interface phase or the interface barrier, the water vapor invasion time is prolonged, and the reliability of the display panel is improved.

[0122] The materials of the four sub-packaging patterns 311 constituting the first packaging pattern 31 are all inorganic materials, and can be formed by a plasma enhanced chemical vapor deposition (PECVD) or atomic layer deposition (ALD) process.

[0123] In some embodiments, referring to FIGS. 8A-8C, the ratio of the thickness d2 of the second sub-packaging pattern 311b to the thickness d1 of the first sub-packaging pattern 311a ranges from 6:1 to 12:1.

[0124] Exemplarily, the thickness d2 of the second sub-packaging pattern 311b can range from 100 nm to 200 nm. The thickness d1 of the first sub-packaging pattern 311a can range from 100 nm to 200 nm. The thickness d1 of the first sub-packaging pattern 311a is, for example, 100 nm. The thickness d2 of the second sub-packaging pattern 311b is, for example, 200 nm. At this time, the ratio of the thickness d2 of the second sub-packaging pattern 311b to the thickness d1 of the first sub-packaging pattern 311a is 9:1.

[0125] Exemplarily, the thickness d1 of the first sub-packaging pattern 311a is, for example, 200 nm. The thickness d2 of the second sub-packaging pattern 311b is, for example, 100 nm. At this time, the ratio of the thickness d2 of the second sub-packaging pattern 311b to the thickness d1 of the first sub-packaging pattern 311a is 6:1.

[0126] Exemplarily, the thickness d1 of the first sub-packaging pattern 311a is, for example, 150 nm. The thickness d2 of the second sub-packaging pattern 311b is, for example, 120 nm. At this time, the ratio of the thickness d2 of the second sub-packaging pattern 311b to the thickness d1 of the first sub-packaging pattern 311a is 12:1.

[0127] It should be noted that the thickness d2 of the second sub-packaging pattern 311b and the thickness d1 of the first sub-packaging pattern 311a are only some examples, and specifically, only the above thickness ratio range needs to be met.

[0128] In some embodiments, referring to FIGS. 8A-8C, the material of the first sub-packaging pattern 311a is silicon oxynitride, silicon oxide or aluminum oxide, and the material of the second sub-packaging pattern 311b is silicon nitride.

[0129] Exemplarily, the material of the second sub-packaging pattern 311b is silicon nitride, which can be prepared by a PECVD process, and the first sub-packaging pattern 311a can be prepared by a PECVD and ALD process. The barrier property of the second sub-packaging pattern 311b is higher than that of the first sub-packaging pattern 311, for example, the second sub-packaging pattern 311b can make the water vapor transmission rate decrease to 10 -3 g / m 2 / d, and the content of hydrogen atoms is less than 25%.

[0130] In some embodiments, referring to FIGS. 8A and 8C, among the at least four layers of sub-packaging patterns 311, the sub-packaging pattern 311 farthest from the substrate 1 is the second sub-packaging pattern 311b.

[0131] It should be noted that, since the thickness of the second sub-packaging pattern 311b is thicker than that of the first sub-packaging pattern 311a, when water vapor invades, the first sub-packaging pattern 311a is thinner and thus the water vapor penetrates faster, and there may be a problem of water absorption and chemical reaction, leading to failure. Therefore, by making the sub-packaging pattern 311 farthest from the substrate 1 be the second sub-packaging pattern 311b, the failure of the first sub-packaging pattern 311a can be avoided.

[0132] In some embodiments, referring to FIG. 9, the isolation column 21 has an inverted trapezoidal structure, and the material of the isolation column 21 is an organic material.

[0133] Exemplarily, as shown in FIG. 9, the preparation process of the isolation column 21 can be a photolithography process, for example, after exposure, development and etching of a negative photoresist, the isolation column 21 with an inverted trapezoidal structure is obtained.

[0134] Exemplarily, in the case where the isolation column 21 has an inverted trapezoidal structure, the isolation column 21 can be prepared synchronously with the planarization layer PLN located in the display area AA, wherein the planarization layer PLN is located on the side of the second electrode layer 43 close to the substrate 1.

[0135] In other embodiments, referring to FIGS. 3A, 3B, 4A, 4B, 5A, 5B, and 6A, 6B, the isolation column 21 is prepared by three layers of materials, for example, the material of the isolation column 21 can include a first titanium metal layer, an aluminum metal layer and a second titanium metal layer stacked away from the substrate 1.

[0136] In some embodiments, referring to FIG. 10 and in combination with FIG. 3A and FIG. 3B, the display panel 100 further comprises a touch layer 5 disposed on the encapsulation structure 3 away from the substrate 1; an optical film layer 6 disposed on the touch layer 5 away from the substrate 1; and a cover plate 7 disposed on the optical film layer 6 away from the substrate 1; wherein the through hole T penetrates the substrate 1, the light-emitting continuous layer 4, the encapsulation structure 3, the touch layer 5 and the optical film layer 6.

[0137] For example, the touch layer 5 comprises a first conductive layer, a second conductive layer and a touch insulating layer between the first conductive layer and the second conductive layer. The first conductive layer and the second conductive layer are connected through a via on the touch insulating layer. In some embodiments, the first conductive layer and the second conductive layer each can comprise a first titanium metal layer, an aluminum metal layer and a second titanium metal layer stacked in sequence away from the substrate 1.

[0138] For example, the optical film layer 6 comprises a polarizer, which is used to reduce the reflection of the internal film layer of the display panel 100 to the external environment light, and prevent the light in the environment from interfering with the display screen of the display panel 100.

[0139] In some embodiments, referring to FIG. 3A and FIG. 3B, the display panel 100 further comprises a pixel circuit layer 8 between the substrate and the light-emitting continuous layer 4, the pixel circuit layer 8 comprises a plurality of pixel circuits configured to drive the light-emitting continuous layer 4 to emit light. The pixel circuit layer 8 can comprise a plurality of conductive layers, such as a semiconductor layer ACT, a gate conductive layer GT and a source-drain conductive layer SD disposed in sequence away from the substrate 1 in a direction perpendicular to the substrate 1. Of course, the display panel 100 can also comprise other conductive layers, such as a second source-drain conductive layer, which is not limited here.

[0140] The plurality of conductive layers form a plurality of thin film transistors TFT, which can comprise a semiconductor pattern 101 in the semiconductor layer ACT, a gate in the gate conductive layer GT and a source and a drain in the source-drain conductive layer SD.

[0141] The pixel circuit layer 8 can further comprise an insulating layer between adjacent conductive layers, such as a gate insulating layer GI between the semiconductor layer ACT and the gate conductive layer GT, an interlayer dielectric layer ILD between the gate conductive layer GT and the source-drain conductive layer SD, and a first planar layer PLN between the source-drain conductive layer SD and the light-emitting continuous layer 4. Of course, the pixel circuit layer 8 can also comprise other insulating film layers, which are not repeated here.

[0142] For example, continuing to refer to FIG. 3A and FIG. 3B, the display panel 100 can further comprise a buffer layer 9 between the substrate 1 and the pixel circuit layer 8, and the material of the buffer layer 9 can be silicon nitride.

[0143] The present disclosure also provides a method for manufacturing the display panel 100, as shown in FIG. 11, which specifically comprises the following steps S1-S4:

[0144] Step S1: providing a substrate 1, as shown in FIG. 12A, the substrate 1 comprises a through-hole region T1, a display region AA, a transition region B1 and a hole edge region B2, wherein the hole edge region B2 surrounds the through-hole region T1, the transition region B1 surrounds the hole edge region B2, and the display region AA surrounds the transition region B1.

[0145] Step S2: referring to FIG. 12A, forming an isolation structure 2 on one side of the substrate 1, and the isolation structure 2 is located in the transition region B1.

[0146] Step S3: referring to FIG. 12B, forming a first encapsulation pattern 31 on the side of the isolation structure 2 away from the substrate 1, and the first encapsulation pattern 31 is at least partially located in the transition region B1, and the first encapsulation pattern 31 covers part of the isolation structure 2.

[0147] Step S4: referring to FIG. 12D, forming a second encapsulation pattern 32 on the side of the isolation structure 2 away from the substrate 1, and the second encapsulation pattern 32 is located in the display region AA and part of the transition region B1, and the second encapsulation pattern 32 is located in the transition region B1. Part of the second encapsulation pattern 32 at least covers the remaining part of the isolation structure 2.

[0148] Wherein, the first encapsulation pattern 31 and the second encapsulation pattern 32 are connected in the transition region B1, and the water and oxygen blocking performance of the first encapsulation pattern 31 is higher than that of the second encapsulation pattern 32.

[0149] Referring to FIGS. 12B, 12C and 12D, the above steps S3 and S4 (forming the first encapsulation pattern 31 and the second encapsulation pattern 32) specifically comprise:

[0150] Step S31: as shown in FIG. 12B, a mask plate Q is provided to form the first encapsulation pattern 31 on the side of the isolation structure 2 away from the substrate 1; the mask plate Q is located above the display panel to be formed, and the orthographic projection of the mask plate Q on the substrate is located in the display region AA and part of the transition region B1. That is, the mask plate Q comprises an opening, and the opening exposes the through-hole T, the hole edge region B2 and the remaining part of the transition region B1.

[0151] Exemplarily, the mask plate Q corresponds to cover the display region and the first isolation column 201 located in the transition region B1.

[0152] It should be noted that the first encapsulation pattern 31 is formed by depositing in the opening region of the mask by using a plasma enhanced chemical vapor deposition (Plasma Enhanced Chemical Vapor Deposition, referred to as: PECVD) or atomic layer deposition (Atomic Layer Deposition, referred to as: ALD) process.

[0153] Exemplarily, referring to FIGS. 8A, 8B and 8C, the first encapsulation pattern 31 includes a plurality of layers of sub-encapsulation patterns 311, and the sub-encapsulation patterns 311 include a first sub-encapsulation pattern 311a and a second sub-encapsulation pattern 311b, that is, in the process of forming the first encapsulation pattern 31, the corresponding sub-encapsulation patterns 311 need to be deposited in sequence in the direction away from the substrate 1.

[0154] Step S32: As shown in FIG. 12C, an initial second encapsulation pattern 32' is formed on the side of the first encapsulation pattern 31 away from the substrate 1, and the initial second encapsulation pattern 32' covers the display area AA, the transition area B1 and the hole edge area B2.

[0155] Exemplarily, referring to FIG. 12C, the initial second encapsulation pattern 32' covers the display area AA, the transition area B1 and the hole edge area B2, that is, the initial second encapsulation pattern 32' is an integral film layer, which can be formed by a plasma enhanced chemical vapor deposition (Plasma Enhanced Chemical Vapor Deposition, referred to as: PECVD) or atomic layer deposition (Atomic Layer Deposition, referred to as: ALD) process.

[0156] Step S33: As shown in FIGS. 12C, 12D and 12E, part of the initial second encapsulation pattern 32' located in part of the transition area B1 and the hole edge area B2 is removed to form the second encapsulation pattern 32.

[0157] Exemplarily, as shown in FIG. 12D, a photoresist 35 is arranged above the initial second encapsulation pattern 32' located in the display area AA and the first isolation column 201, and part of the initial second encapsulation pattern 32' located in part of the transition area B1 and the hole edge area B2 is removed, wherein the photoresist 35 can be formed by an etching process, specifically, can be formed by a dry etching process. It should be noted that the gas used in the dry etching process includes one or more of sulfur hexafluoride (SF6), nitrogen tetrafluoride (NF4) and chlorine (Cl2).

[0158] It should be noted that the above preparation method is described by taking the overlapping position of the first packaging pattern 31 and the second packaging pattern 32 as an example, which is located between the first isolation column 201 and the blocking dam 22. When the overlapping position of the first packaging pattern 31 and the second packaging pattern 32 is located between two adjacent first isolation columns 201, or the overlapping position of the first packaging pattern 31 and the second packaging pattern 32 is located between the blocking dam 22 and the second isolation column 202, the preparation can also be performed by referring to the above preparation method.

[0159] In some examples, in combination with FIGS. 5A and 5B, when the first packaging pattern 31 only covers the second isolation column 202, the boundary of the photoresist away from the display area AA is located between the blocking dam 22 and the second isolation column 202, and the boundary of the photoresist away from the display area AA is away from the display area AA relative to the boundary P1 of the first packaging pattern 31 close to the display area AA.

[0160] In some other examples, in combination with FIGS. 3A, 3B, 4A and 4B, when the first packaging pattern 31 covers the blocking dam 22 and the second isolation column 202, the boundary of the photoresist away from the display area AA is located between the blocking dam 22 and the first isolation column 201, and the boundary of the photoresist away from the display area AA is away from the display area AA relative to the boundary P2 of the first packaging pattern 31 close to the display area AA.

[0161] In some other examples, in combination with FIGS. 6A and 6B, when the first packaging pattern 31 covers the blocking dam 22, the second isolation column 202 and part of the first isolation column 201, i.e., the connection position of the first packaging pattern 31 and the second packaging pattern 32 is located between two adjacent first isolation columns 201. At this time, the boundary of the photoresist away from the display area AA is located between the two adjacent first isolation columns 201, and the boundary of the photoresist away from the display area AA is away from the display area AA relative to the boundary P3 of the first packaging pattern 31 close to the display area AA.

[0162] Step S34: referring to FIG. 12E, the photoresist 35 is removed to expose the second packaging pattern 32 located above the display area AA and the first isolation column 201.

[0163] As shown in FIGS. 1 and 10, the embodiments of the present disclosure provide a display device 1000, and the specific form of the display device 1000 is not specially limited. The display device 1000 adopts the display panel 100 provided by the above embodiments, and therefore the display device 1000 provided by the present disclosure has all the beneficial effects of the display panel 100 provided by any of the above embodiments, which will not be described here.

[0164] In some embodiments, referring to FIG. 10 in combination with FIG. 1, the display device 1000 includes a display panel 100, a driving chip 200, and a back assembly 300, the display panel 100 includes a display side 100a and a non-display side 100b, the driving chip 200 is electrically connected with the display panel 100, and the back assembly 300 is arranged at the non-display side 100b of the display panel 100; the back assembly 300 includes a camera 301 arranged at a position of a through hole T.

[0165] Exemplarily, the driving chip 200 is electrically connected with the display panel 100, and is configured to drive the display panel 100 to display a picture.

[0166] Exemplarily, a sensor can also be arranged at the position of the through hole T, and the sensor can be a fingerprint sensor configured to perform fingerprint identification. In addition, the camera is arranged at the position of the through hole T, and can perform light collection from the display side of the display panel.

[0167] Exemplarily, the display device 1000 can be any device displaying images whether in motion (e.g., video) or fixed (e.g., a still image) and whether textual or pictorial. More particularly, it is contemplated that the embodiments can be implemented in or in association with a variety of electronic devices such as, but not limited to, mobile telephones, wireless devices, personal data assistants (PDAs), handheld or portable computers, GPS receivers / navigators, cameras, MP4 players, camcorders, game consoles, watches, clocks, calculators, television monitors, flat panel displays, computer monitors, auto displays (e.g., odometer display, etc.), cockpit controls and / or displays, camera view displays (e.g., display of a rear view camera in a vehicle), electronic photographs, electronic billboards or signs, projectors, architectural structures, packaging, and aesthetic structures (e.g., display of images on a piece of jewelry) and any other products or components thereof that have displays. For example, as shown in FIG. 1, the display device 1000 can be a mobile phone.

[0168] From the light-emitting type of the display device 1000, the display device 1000 can be an OLED display device or a quantum dot light emitting diode (QLED) display device. From the form of the display device 1000, the display device 1000 can be a flat display device, a curved display device, or a foldable display device, etc. From the shape of the display device 1000, the display device 1000 can be rectangular or rounded rectangular, etc. From the light-emitting direction of the display device 1000, the display device 1000 can be a top emission display device or a bottom emission display device. The embodiments of the present disclosure do not make specific limitations on this.

[0169] Exemplarily, the display device can be a flexible OLED display device, which can realize a bendable display with a smaller bending radius.

[0170] The display device 1000 is exemplarily taken as an OLED display device with a top emission type, a rectangular shape, and a flat plane. However, the embodiments of the present disclosure are not limited thereto, and any other display device can also be considered as long as the same technical idea is applied.

[0171] Exemplarily, the display device 1000 is an OLED display device, and the display panel 100 is an OLED display panel. The display panel 100 in the present disclosure is exemplarily taken as an OLED display panel to describe the structure of the display panel 100 in detail.

[0172] The above is only a specific embodiment of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any person skilled in the art can think of changes or replacements within the technical range disclosed in the present disclosure, which should be covered in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be subject to the protection scope of the claims.

Claims

1. A display panel, comprising a display area, a transition area and a hole border area, the display panel being provided with a through hole, wherein, The hole edge region surrounds the through hole, the transition region surrounds the hole edge region, and the display region surrounds the transition region; The display panel comprises: a substrate; an isolation structure disposed on one side of the substrate, the isolation structure being located in the transition region; an encapsulation structure disposed on a side of the isolation structure away from the substrate; the encapsulation structure comprises a first encapsulation pattern and a second encapsulation pattern, the first encapsulation pattern being at least partially located in the transition region, and the first encapsulation pattern covering part of the isolation structure; the second encapsulation pattern being located in the display region and part of the transition region, and the part of the second encapsulation pattern located in the transition region covering at least the remaining part of the isolation structure; wherein the first encapsulation pattern and the second encapsulation pattern are connected in the transition region, and the water and oxygen barrier property of the first encapsulation pattern is higher than that of the second encapsulation pattern.

2. The display panel of claim 1, wherein, The isolation structure comprises a plurality of isolation columns and at least one blocking dam, the plurality of isolation columns comprising a first isolation column and a second isolation column, wherein the first isolation column is located on a side of the blocking dam close to the display region, and the second isolation column is located on a side of the blocking dam away from the display region, and the first encapsulation pattern covers at least the second isolation column.

3. The display panel of claim 2, wherein, The display panel further comprises a light-emitting continuous layer, the light-emitting continuous layer comprising a light-emitting functional layer and a first electrode layer stacked in a direction away from the substrate, the light-emitting continuous layer extending at least to the transition region, and the light-emitting continuous layer located in the transition region being located between the isolation structure and the first encapsulation pattern and the second encapsulation pattern, and the light-emitting continuous layer located in the transition region being disconnected at the side of the isolation column.

4. The display panel of claim 3, wherein, The boundary of the first encapsulation pattern close to the display region is located between the second isolation column and the blocking dam, and the first encapsulation pattern covers part of the light-emitting continuous layer between the second isolation column and the blocking dam.

5. The display panel of claim 2 or 3, wherein, The first encapsulation pattern covers the second isolation column and the blocking dam.

6. The display panel of claim 5, wherein, In the case where the display panel further comprises a light-emitting continuous layer, The boundary of the first encapsulation pattern close to the display region is located between the first isolation column and the blocking dam, and the first encapsulation pattern covers the light-emitting continuous layer between the first isolation column and the blocking dam.

7. The display panel of claim 5, wherein, The number of the first isolation columns is a plurality, and the first encapsulation pattern further covers at least one first isolation column close to the blocking dam among the plurality of first isolation columns.

8. The display panel of claim 7, wherein, In the case where the display panel further comprises a light-emitting continuous layer, The boundary of the first encapsulation pattern close to the display region is located between two adjacent first isolation columns, and the first encapsulation pattern covers the light-emitting continuous layer between the two adjacent first isolation columns.

9. The display panel according to any one of claims 1 to 8, wherein The second encapsulation pattern overlaps the first encapsulation pattern.

10. The display panel of claim 9, wherein, The second encapsulation pattern is located above the first encapsulation pattern at the overlapping position of the second encapsulation pattern and the first encapsulation pattern.

11. The display panel of claim 9, wherein, An overlapping part of the second encapsulation pattern and the first encapsulation pattern has a size ranging from 3 μm to 50 μm in a first direction, the first direction being a direction in which a center of the through hole points to the display area.

12. The display panel of any one of claims 3-11, wherein, The first encapsulation pattern is located in the transition area, and on a side of the transition area away from the display area, a boundary of the light-emitting continuous layer close to the through hole is closer to the display area than a boundary of the first encapsulation pattern close to the through hole, and the boundary of the first encapsulation pattern close to the through hole is located on a side of the isolation structure close to the through hole.

13. The display panel according to any one of claims 3 to 11, wherein The first encapsulation pattern is also located in the hole edge area, and in the hole edge area, the boundary of the light-emitting continuous layer close to the through hole and the boundary of the first encapsulation pattern close to the through hole are flush with a side wall of the through hole.

14. The display panel according to any one of claims 1 to 13, wherein, The first encapsulation pattern comprises at least four layers of sub-encapsulation patterns arranged in a stack, and the at least four layers of sub-encapsulation patterns comprise first sub-encapsulation patterns and second sub-encapsulation patterns arranged alternately, wherein a thickness of the first sub-encapsulation pattern is less than a thickness of the second sub-encapsulation pattern.

15. The display panel of claim 14, wherein, A ratio of the thickness of the second sub-encapsulation pattern to the thickness of the first sub-encapsulation pattern ranges from 6:1 to 12:

1.

16. The display panel of claim 14, wherein, A material of the first sub-encapsulation pattern is silicon oxynitride, silicon oxide or aluminum oxide, and a material of the second sub-encapsulation pattern is silicon nitride.

17. The display panel of claim 14, wherein, In the at least four layers of sub-encapsulation patterns, a sub-encapsulation pattern farthest away from a side of the substrate is the second sub-encapsulation pattern.

18. The display panel according to any one of claims 1 to 17, wherein, The isolation column has an inverted trapezoidal structure, and a material of the isolation column is an organic material.

19. The display panel according to any one of claims 3 to 18, wherein, The display panel further comprises: a touch layer arranged on a side of the encapsulation structure away from the substrate; an optical film layer arranged on a side of the touch layer away from the substrate; a cover plate arranged on a side of the optical film layer away from the substrate; wherein the through hole penetrates the substrate, the light-emitting continuous layer, the encapsulation structure, the touch layer and the optical film layer.

20. A display device comprising: comprising: the display panel of any one of claims 1-19, the display panel comprising a display side and a non-display side; a driving chip, the driving chip being electrically connected with the display panel; a back assembly, the back assembly being arranged on the non-display side of the display panel, the back assembly comprising a camera, the camera being arranged at a position of the through hole.

21. A method of manufacturing a display panel, wherein, comprising: providing a substrate, the substrate comprising a through hole area, a display area, a transition area and a hole edge area, wherein the hole edge area surrounds the through hole area, the transition area surrounds the hole edge area, and the display area surrounds the transition area; forming an isolation structure on a side of the substrate, the isolation structure being located in the transition area; forming a first encapsulation pattern on a side of the isolation structure away from the substrate, the first encapsulation pattern being at least partially located in the transition area, and the first encapsulation pattern covering part of the isolation structure; forming a second encapsulation pattern on a side of the isolation structure away from the substrate, the second encapsulation pattern being located in the display area and part of the transition area, and the second encapsulation pattern being located in the part of the transition area covering at least part of the remaining isolation structure; The first encapsulation pattern and the second encapsulation pattern are connected at the transition area, and the water-oxygen barrier property of the first encapsulation pattern is higher than that of the second encapsulation pattern.

22. The method of producing a display panel according to claim 21, wherein The step of forming the first encapsulation pattern and the second encapsulation pattern comprises: A mask plate is arranged to form a first encapsulation pattern on a side of the isolation structure away from the substrate; the mask plate is located above the display area and part of the transition area; An initial second encapsulation pattern is formed on a side of the first encapsulation pattern away from the substrate, covering the display area, the transition area and the hole edge area; Part of the initial second encapsulation pattern located in part of the transition area and the hole edge area is removed to form the second encapsulation pattern.

Images