Charging circuit, and data cable

Abstract

Provided in the embodiments of the present application are a charging circuit, and a data cable. The charging circuit comprises: a control module and a voltage adjustment module, wherein the control module is connected to the voltage adjustment module; the voltage adjustment module is configured to be connected to a load; and the control module is configured to acquire charging protocol information of at least two loads when having detected that at least two interfaces among at least two interfaces of a data cable are respectively connected to a load, and control, on the basis of the charging protocol information, the voltage adjustment module to output a voltage having the same magnitude as that of a charging protocol voltage of each of the at least two loads, so as to charge the at least two loads by means of the interfaces; and the data cable contains at least two lines, wherein each line is provided with an interface, which can be connected to a load.

Description

Charging circuit and data line

[0001] Cross-reference to related applications

[0002] This application is based on the Chinese patent application No. 202422241267.1, filed on September 11, 2024, and claims priority to the Chinese patent application No. 202422241267.1, and the entire contents of the Chinese patent application No. 202422241267.1 are hereby incorporated by reference into this application. TECHNICAL FIELD

[0003] The present application relates to the technical field of charging, in particular to a charging circuit and a data line. BACKGROUND

[0004] At present, when a multi-branch data line accesses multiple loads for charging, the data line cannot accurately identify the charging requirements of each load, and cannot achieve simultaneous fast charging of multiple loads. Only slow charging can be used to charge multiple loads at the same time, which is low in charging efficiency and affects user experience. SUMMARY

[0005] The present application provides a charging circuit and a data line.

[0006] The technical scheme of the present application embodiment is implemented as follows:

[0007] In a first aspect, the present application provides a charging circuit, which comprises a control module and a voltage adjustment module; wherein the control module is connected with the voltage adjustment module; the voltage adjustment module is configured to be connected with a load;

[0008] The control module is configured to, when detecting that at least two interfaces of a data line are respectively connected with one load, acquire charging protocol information of the at least two loads, control the voltage adjustment module to output a voltage with the same size as the charging protocol voltage of the at least two loads according to the charging protocol information, and charge the at least two loads through the interfaces. The data line comprises at least two lines, and each line is provided with an interface capable of connecting a load.

[0009] In a second aspect, the present application provides a data line comprising the charging circuit provided in any of the embodiments of the present application.

[0010] Through the charging circuit provided in the embodiments of the present application, the control module can detect the charging protocol information of the data line connected with the load, control the output voltage of each line of each data line according to the charging protocol information, so that each line charges the load with a voltage with the same size as the charging protocol voltage of the load, and protocol fast charging of each load can be realized, the charging efficiency is improved, and the user experience is improved. BRIEF DESCRIPTION OF DRAWINGS

[0011] The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiments of the application and together with the description serve to explain the application. In the drawings:

[0012] Fig. 1 is a structural schematic diagram of a charging circuit according to an embodiment of the present application;

[0013] Fig. 2 is a structural schematic diagram of a charging circuit according to an embodiment of the present application;

[0014] Fig. 3 is a structural schematic diagram of a voltage adjustment module according to an embodiment of the present application;

[0015] Fig. 4 is a structural schematic diagram of a voltage adjustment submodule according to an embodiment of the present application;

[0016] Fig. 5 is a structural schematic diagram of a charging circuit according to an embodiment of the present application;

[0017] Fig. 6 is a schematic diagram of a first power management chip and its peripheral circuit according to an embodiment of the present application;

[0018] Fig. 7 is a circuit schematic diagram of a second power management chip and its peripheral circuit, a power interface module according to an embodiment of the present application;

[0019] Fig. 8 is a circuit schematic diagram of a third power management chip and its peripheral circuit, a voltage adjustment submodule three, an interface three according to an embodiment of the present application;

[0020] Fig. 9 is a circuit schematic diagram of a voltage adjustment submodule one and an interface one according to an embodiment of the present application;

[0021] Fig. 10 is a circuit schematic diagram of a voltage adjustment submodule two and an interface two according to an embodiment of the present application;

[0022] Fig. 11 is a layout schematic diagram of a charging circuit according to an embodiment of the present application;

[0023] Fig. 12 is a schematic diagram of a PCB stack structure according to an embodiment of the present application. DETAILED DESCRIPTION

[0024] The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all of the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of the present application.

[0025] It should be noted that in the embodiments of the present application, the term "and / or" is only used to describe the relationship between the associated objects, which means that there can be three relationships, for example, A and / or B, which means that there are three cases of A alone, A and B together, and B alone. In addition, in the embodiments of the present application, the character " / " generally represents an "or" relationship between the front and rear associated objects.

[0026] In the description of the embodiments of the present application, the term "corresponding" can represent a direct or indirect corresponding relationship between the two, can also represent an associated relationship between the two, or can indicate a relationship with the indicated, configured and configured.

[0027] In order to facilitate the understanding of the technical solutions of the embodiments of the present application, the related technologies of the embodiments of the present application are described below, and the following related technologies can be combined with the technical solutions of the embodiments of the present application as optional schemes, which all belong to the protection scope of the embodiments of the present application.

[0028] In the related art, the portable vehicle data line product only has one power supply control mode for operation design. When the product is in use, the user cannot charge when the battery suddenly runs out of power, which seriously affects the experience in use.

[0029] Fig. 1 is a schematic diagram of a charging circuit according to an embodiment of the present application. As shown in Fig. 1, the charging circuit according to the embodiment of the present application comprises a control module and a voltage adjustment module. The control module is connected with the voltage adjustment module. The voltage adjustment module is configured to be connected with a load.

[0030] The control module is configured to obtain charging protocol information of at least two loads when it is detected that at least two interfaces of the data line are respectively connected with one load. The control module controls the voltage adjustment module to output a voltage with the same size as the charging protocol voltage of the at least two loads according to the charging protocol information, so as to charge the at least two loads through the interfaces. The data line comprises at least two lines, and each line is provided with an interface capable of connecting a load.

[0031] In the embodiments of the present application, the at least two lines included in the data line are at least two output lines, and the data line further comprises an input line configured to be connected with an adapter.

[0032] Fig. 2 is a schematic diagram of a charging circuit according to an embodiment of the present application. As shown in Fig. 2, in this embodiment, the charging circuit comprises a control module, a voltage adjustment module and a power interface module. The power interface module is connected with the voltage adjustment module and is configured to receive a voltage from an adapter and output the received voltage to the voltage adjustment module.

[0033] The control module is connected to at least two lines of the data line. When the interface is connected to a load, the load can perform protocol handshake with the control module through the interface. The control module detects the charging protocol information of each load connected to the data line. The charging protocol information includes charging protocol current, charging protocol voltage, charging protocol power and the like. The control module controls the voltage adjustment module to output the charging protocol voltage required by each load according to the charging protocol information of each load.

[0034] In the embodiment of the application, the voltage adjustment module includes at least two voltage adjustment sub-modules, and the at least two voltage adjustment sub-modules correspond to the at least two lines one by one. One voltage adjustment sub-module is arranged on each line. The control module controls the voltage adjustment sub-module on the line connected to the load according to the charging protocol voltage required by the load on the line connected to the load, so that each line connected to the load outputs a voltage with the same size as the charging protocol voltage of the load.

[0035] FIG. 3 is a structural schematic diagram of the voltage adjustment module provided by the embodiment of the application. As shown in FIG. 3, the voltage adjustment module includes n voltage adjustment sub-modules, and the data line includes n output interfaces. One voltage adjustment sub-module is arranged on each output line of the data line. The n voltage adjustment sub-modules correspond to the n output interfaces one by one.

[0036] Based on this, in an optional embodiment of the application, the voltage adjustment module includes at least two voltage adjustment sub-modules. One voltage adjustment sub-module is arranged on each line.

[0037] The control module is configured to control the voltage adjustment sub-module on the line connected to the load to output a voltage with the same size as the charging protocol voltage of the load.

[0038] In actual application, the power interface module can transmit the voltage received from the adapter to each voltage adjustment sub-module in the at least two voltage adjustment sub-modules.

[0039] In the embodiment of the application, each line of the at least two lines can be connected to a load using different charging protocols. The charging protocol information corresponding to each line is different. In actual application, the at least two lines can also be connected to a plurality of loads with the same or different charging protocols. The actual demand can be set, and the embodiment of the application does not limit this.

[0040] The interface of the line can be a Mini USB interface, a Micro USB interface, a USB Type-C interface, a Lightning interface and the like. In actual application, it can also be set as other charging interfaces, and the embodiment of the application does not limit this.

[0041] In the embodiment of the present application, the data line is a one-to-many data line, which can be a one-to-two data line, a one-to-three data line, or other data lines with multiple output interfaces. The multiple interfaces of the data line can be set as the same type of interface, such as USB Type-C interface, or different types of interfaces. The present application does not limit this.

[0042] In the embodiment of the present application, the voltage adjustment sub-module includes one or more of the following circuits:

[0043] The boost sub-circuit is configured to boost the input voltage to obtain a voltage with the same size as the charging protocol voltage of the load.

[0044] The boost sub-circuit is configured to boost the input voltage to obtain a voltage with the same size as the charging protocol voltage of the load.

[0045] The pass-through circuit is configured to input the voltage as a voltage with the same size as the charging protocol voltage of the load.

[0046] The voltage adjustment sub-module uses the boost sub-circuit, which can use a small input voltage to enhance the application scenarios of the charging circuit. The voltage adjustment sub-circuit uses the boost sub-circuit, which can improve the charging efficiency and reduce power loss. The pass-through circuit can reduce power loss and reduce circuit heating. In actual application, the voltage adjustment sub-circuit can be designed according to the requirements, and the present application does not limit this.

[0047] The voltage input to the power interface module of the adapter can be directly transmitted to each voltage adjustment sub-module. The output voltage of the voltage adjustment sub-module is connected to the interface, and the control module controls the voltage adjustment sub-module to output a voltage with the same size as the charging protocol voltage of the load.

[0048] Referring to FIG. 4, FIG. 4 is a structural schematic diagram of a voltage adjustment sub-module provided by an embodiment of the present application. As shown in FIG. 4, in this embodiment, the voltage adjustment sub-module includes a boost sub-circuit, a buck sub-circuit, a pass-through circuit, and a switch circuit. If the voltage input to the voltage adjustment sub-module is greater than the charging protocol voltage of the load, the switch circuit connects the buck sub-circuit and the load. If the voltage input to the voltage adjustment sub-module is less than the charging protocol voltage of the load, the switch circuit connects the boost sub-circuit and the load. If the voltage input to the voltage adjustment sub-module is equal to the charging protocol voltage of the load, the switch circuit connects the pass-through circuit and the load. The switch circuit can be controlled by the control module.

[0049] Based on this, in an optional embodiment of the present application, in the case where the voltage adjustment sub-module includes at least two of a boost sub-circuit, a buck sub-circuit, and a pass-through circuit, the voltage adjustment sub-module further includes a switch circuit, and the control module is configured to:

[0050] if the input voltage is greater than the charging protocol voltage of the load, the control module controls the switch circuit to connect the step-down sub-circuit and the load;

[0051] if the input voltage is less than the charging protocol voltage of the load, the control module controls the switch circuit to connect the step-up sub-circuit and the load;

[0052] if the input voltage is equal to the charging protocol voltage of the load, the control module controls the switch circuit to connect the pass-through circuit and the load.

[0053] In the embodiments of the present application, when the step-up sub-circuit or the step-down sub-circuit is connected to the load, the control module can control the step-up sub-circuit or the step-down sub-circuit to adjust the input voltage by a feedback regulation (FB) regulation mode, so that the step-up sub-circuit or the step-down sub-circuit charges the load after adjusting the input voltage to a voltage of the same size as the charging protocol voltage of the load.

[0054] Based on this, in an optional embodiment of the present application, if the control module controls the switch circuit to connect the step-down sub-circuit and the load, or the control module controls the switch circuit to connect the step-up sub-circuit and the load; the control module is further configured to:

[0055] control the step-down sub-circuit to reduce the input voltage to a voltage of the same size as the charging protocol voltage of the load by the FB regulation mode; or,

[0056] control the step-up sub-circuit to increase the input voltage to a voltage of the same size as the charging protocol voltage of the load by the FB regulation mode.

[0057] In the embodiments of the present application, the control module can also determine the voltage size received from the adapter according to the charging protocol information of each load connected by the data line, thereby improving the flexibility of the charging circuit design and making the application scope wider. After determining the voltage size received from the adapter, the control module interacts with the power interface module and sends first information to the power interface module, wherein the first information includes the determined voltage size information. After receiving the first information, the power interface module interacts with the adapter and sends the first information to the adapter, so that the voltage output by the adapter is the voltage size determined by the control module.

[0058] Based on this, in an optional embodiment of the present application, the control module is further configured to determine the voltage size received from the adapter according to the charging protocol information of each load in the at least two loads, and generate first information, wherein the first information contains information related to the determined voltage size; and send the first information to the power interface module.

[0059] The power interface module is configured to receive the first information sent by the control module, send the first information to the adapter, and receive the voltage of the determined voltage size from the adapter.

[0060] For example, the control module determines the voltage of the charging protocol with the highest voltage among the multiple loads connected to the data line as the voltage output by the adapter. In this example, the voltage adjustment submodule can not be designed with a boost subcircuit because the voltage output by the adapter is the highest charging protocol voltage required by the multiple loads. The voltage adjustment submodule can be a buck subcircuit and a pass-through circuit. When the voltage output by the adapter is the same as the charging protocol voltage required by the load, the pass-through circuit is used, and the voltage output by the adapter is directly used as the output voltage of the voltage adjustment submodule to charge the load. When the voltage output by the adapter is greater than the charging protocol voltage required by the load, the buck subcircuit is used to reduce the voltage input to the voltage adjustment submodule by the adapter to the size of the charging protocol voltage to charge the load.

[0061] Based on this, in an optional embodiment of the present application, the control module is configured to determine the voltage of the charging protocol with the highest voltage among the at least two loads as the determined voltage size.

[0062] Referring to FIG. 5, FIG. 5 is a structural schematic diagram of a charging circuit provided by an embodiment of the present application. In this embodiment, the charging circuit comprises a power interface module, a control module, a voltage adjustment submodule one, a voltage adjustment submodule two and a voltage adjustment submodule three. The control module comprises a first power management chip, a second power management chip and a third power management chip. The power interface module is connected with the second power management chip, the voltage adjustment submodule one, the voltage adjustment submodule two and the voltage adjustment submodule three. The voltage adjustment submodule one is connected with the third power management chip and an interface one. The first power management chip is connected with the second power management chip, the third power management chip, an interface two, an interface three, the voltage adjustment submodule one, the voltage adjustment submodule two and the voltage adjustment submodule three. The voltage adjustment submodule one, the voltage adjustment submodule two and the voltage adjustment submodule three are connected with the interface one, the interface two and the interface three of the data line correspondingly. Each voltage adjustment submodule comprises a step-down subcircuit and a pass-through circuit. The interface one, the interface two and the interface three are USB Type-C interfaces. When the interface one, the interface two and the interface three are connected with loads, the first power management chip performs protocol handshake with the loads connected with the interface one and the interface two through a CC line or a DP line / DM line. The second power management chip performs protocol handshake with the interface three through a CC line or a DP line / DM line. The second power management chip sends charging protocol information to the first power management chip. The first power management chip detects the charging protocol information of each load and determines a first voltage as the size of the voltage output by the adapter according to the charging protocol voltage of each load. The first voltage is the maximum charging protocol voltage in the loads. The first power management chip generates first information containing information related to the size of the voltage output by the adapter and sends the first information to the second power management chip. The second power management chip sends the first information to the power interface module. The power interface module interacts with the adapter. The power interface module sends the first information to the adapter. The power interface module receives the voltage output by the adapter, which has the same size as the first voltage. The power interface module transmits the voltage output by the adapter to each voltage adjustment submodule. For the voltage adjustment submodule one and the voltage adjustment submodule two, the first power chip controls the step-down subcircuit or the pass-through circuit to be turned on according to the first voltage and the charging protocol voltage of the load. If the step-down subcircuit is turned on, the first power management chip controls the step-down subcircuit to adjust the first voltage to the charging protocol voltage corresponding to the load through FB voltage regulation function. For the voltage adjustment submodule three, the first power management chip sends the first voltage to the third power management chip. The third power management chip determines whether the pass-through circuit or the step-down subcircuit to be turned on according to the first voltage and the charging protocol voltage of the load connected with the interface three. When the step-down subcircuit is turned on, the second power management chip controls the step-down subcircuit to adjust the first voltage to the charging protocol voltage corresponding to the load through FB voltage regulation function. When three loads are connected simultaneously, the three voltage adjustment subcircuits are controlled independently, so that multiple loads can be charged simultaneously.

[0063] For example, the first power management chip and the second power management chip can interact through an IIC bus, and the voltage power management chip and the third power management chip can interact through a Uart interface. In actual applications, the power management chips can also interact in other manners, which are not limited in the embodiments of the present application.

[0064] Referring to FIGS. 6, 7, 8, 9 and 10, FIG. 6 is a schematic diagram of a first power management chip and its peripheral circuit provided by the embodiments of the present application; FIG. 7 is a schematic diagram of a second power management chip and its peripheral circuit, a power interface module provided by the embodiments of the present application; FIG. 8 is a schematic diagram of a third power management chip and its peripheral circuit, a voltage adjustment submodule three and an interface three provided by the embodiments of the present application; FIG. 9 is a schematic diagram of a voltage adjustment submodule one and an interface one provided by the embodiments of the present application; and FIG. 10 is a schematic diagram of a voltage adjustment submodule two and an interface two provided by the embodiments of the present application.

[0065] The voltage adjustment submodule one comprises a step-down chip U1 and its peripheral circuit, and a first pass-through circuit. The first pass-through circuit comprises an NMOS tube Q1. The 12 port of U1 is connected with the source of Q1 and then connected with the power interface module. The 15 port of U1 is connected with the drain of Q1 and then connected with the interface one. The 16 port of U1 is connected with the first power management chip. The gate of Q1 is connected with the first power management chip.

[0066] The voltage adjustment submodule two comprises a step-down chip U4 and its peripheral circuit, and a second pass-through circuit. The second pass-through circuit comprises a PMOS tube Q10, a resistor R47, a resistor R51 and an NMOS tube Q12. The 1 port of U4 is connected with the source of Q10 and then connected with the power interface module. The 8 port of U4 is connected with the drain of Q10 and then connected with the interface two. The 6 port of U4 is connected with the first power management chip. The gate of Q12 is connected with the first power management chip.

[0067] The voltage adjustment submodule three comprises a step-down chip U5 and its peripheral circuit, and a third pass-through circuit. The third pass-through circuit comprises a PMOS tube Q4, a resistor R36, a resistor R37 and an NMOS tube Q5. The 1 port of U5 is connected with the source of Q4 and then connected with the power interface module. The 8 port of U5 is connected with the drain of Q4 and then connected with the interface three. The 6 port of U5 is connected with the third power management chip. The gate of Q5 is connected with the third power management chip.

[0068] The control module comprises the first power management chip U3 and its peripheral circuit, the second power management chip U2 and its peripheral circuit, and the third power management chip U6 and its peripheral circuit. Wherein,

[0069] The 16th and 17th ports of U3 are connected with the 13th and 12th ports of U6 respectively, the 4th and 10th ports of U3 are connected with the 3rd and 4th ports of U2 respectively, the 5th port of U3 is connected with the 16th port of U1, the 30th port of U3 is connected with the gate of Q12, the 20th, 21st and 22nd ports of U3 are connected with the interface one, the 18th port of U3 is connected with the interface two, the 28th port of U3 is connected with the gate of Q12, and the 8th port of U3 is connected with the 6th port of U4;

[0070] The 8th port of U2 is connected with the power interface module;

[0071] The 5th port of U6 is connected with the 6th port of U5, the 23rd port of U6 is connected with the gate of Q5, and the 15th, 16th and 17th ports of U16 are connected with the interface three.

[0072] The power interface module comprises J14, J15, J11 and J12 ports, wherein the J11 port is connected with voltage adjustment sub-module one, voltage adjustment sub-module two and voltage adjustment sub-module three respectively, and the J12 port is connected with U2.

[0073] The interface one comprises J1, J2, J3, J4 and J5 ports, wherein the J1 port is connected with voltage adjustment sub-module one, and the J2, J3 and J4 ports are connected with U3.

[0074] The interface two comprises J9, J10 and J13 ports, wherein the J9 port is connected with voltage adjustment sub-module two, and the J10 port is connected with U3.

[0075] The interface three comprises J16, J17, J18, J19 and J20 ports, wherein the J16 port is connected with voltage adjustment sub-module three, and the J17, J18 and J19 ports are connected with the 17th, 16th and 15th ports of U6 respectively.

[0076] The control logic is as follows: U6 performs a handshake with the load through interface three and sends the charging protocol information to U3; U3 performs a handshake with the loads connected through interface one and interface two respectively, obtains the charging protocol information of the loads connected through interface one and interface two, obtains a first voltage according to the charging protocol information corresponding to the three loads, the first voltage being the maximum charging protocol voltage, generates first information, and sends the first information to U2; U2 sends the first information to the power interface module; the power interface module interacts with the adapter according to the first information, receives the first voltage output by the adapter, and transmits the first voltage to the voltage adjustment submodule one, the voltage adjustment submodule two, and the voltage adjustment submodule three; for the voltage adjustment submodule one, if the first voltage is equal to the charging protocol voltage of the load, U3 sends a high-level signal to the first pass-through circuit to trigger the first pass-through circuit to conduct, U1 is short-circuited, and the voltage adjustment submodule one supplies power to the load through the pass-through circuit; if the first voltage is greater than the charging protocol voltage of the load, U3 sends a low-level signal to the first pass-through circuit to trigger the first pass-through circuit to disconnect, and U3 sends an FB voltage regulation signal to U1 to make U1 step down the first voltage to the voltage required by the load and then charge the load; for the voltage adjustment submodule two, if the first voltage is equal to the charging protocol voltage of the load, U3 sends a high-level signal to the second pass-through circuit to trigger the second pass-through circuit to conduct, U4 is short-circuited, and the voltage adjustment submodule two supplies power to the load through the pass-through circuit; if the first voltage is greater than the charging protocol voltage of the load, U3 sends a low-level signal to the second pass-through circuit to trigger the second pass-through circuit to disconnect, and U3 sends an FB voltage regulation signal to U4 to make U4 step down the first voltage to the voltage required by the load and then charge the load; for the voltage adjustment submodule three, if the first voltage is equal to the charging protocol voltage of the load, U6 sends a high-level signal to the third pass-through circuit to trigger the third pass-through circuit to conduct, U5 is short-circuited, and the voltage adjustment submodule three supplies power to the load through the pass-through circuit; if the first voltage is greater than the charging protocol voltage of the load, U6 sends a low-level signal to the third pass-through circuit to trigger the third pass-through circuit to disconnect, and U6 sends an FB voltage regulation signal to U5 to make U5 step down the first voltage to the voltage required by the load and then charge the load.

[0077] The charging circuit provided in the embodiment of the application enables the data line to be used as an independent device to realize two-level highway distribution on the basis of the adapter, the data line is used as an independent charging link, the step-up and step-down circuit charging can be realized, the pass-through circuit is added, the charging efficiency is improved, the heat and power loss are reduced, the high-power fast charging can be realized when multiple electrical terminals are simultaneously charged, the charging convenience and timeliness are provided for users, and the user experience is improved.

[0078] Referring to FIG. 11 and FIG. 12, FIG. 11 is a schematic diagram of an arrangement of a charging circuit according to an embodiment of the present application, and FIG. 12 is a schematic diagram of a PCB stack structure according to an embodiment of the present application. In the embodiment of the present application, the charging circuit can be arranged on two PCBs, and a row of pins is arranged at each end of the two PCBs. The two PCBs are fixed by being stacked through the pins arranged at the two ends, and the element faces of the PCBs are arranged opposite to each other. In this way, the two PCBs are arranged in a stacked manner through the pins arranged at the two ends, so that the space volume is compressed to the limit, and space is saved. In addition, due to the existence of the pins arranged at the two ends, a gap exists between the two element faces of the two PCBs, which is beneficial to heat dissipation of the charging circuit, and the charging circuit has high practicability and is small and beautiful.

[0079] The embodiment of the present application further provides a data line, which comprises the charging circuit according to any one of the embodiments of the present application.

[0080] In the embodiment of the present application, the data line comprises at least two lines, and each line is provided with an interface capable of connecting a load. The voltage adjustment module in the charging circuit is connected with at least two interfaces arranged on the at least two lines, and is configured to charge the load connected with the interface.

[0081] The embodiment of the present application further provides a middle card of a one-to-many data line, which comprises:

[0082] A first circuit board and a second circuit board, wherein the first circuit board and the second circuit board are electrically connected.

[0083] An upper plane of the first circuit board faces a lower plane of the second circuit board, and a containing space is formed between the upper plane and the lower plane. The upper plane and the lower plane are provided with electronic components, and the electronic components are located in the containing space.

[0084] Referring to FIG. 12, in the embodiment of the present application, the first circuit board and the second circuit board are two independent PCBs, and the first circuit board and the second circuit board respectively carry different electronic components.

[0085] In the embodiment of the present application, the first circuit board and the second circuit board are vertically stacked through a pin assembly, so that the upper plane of the first circuit board and the lower plane of the second circuit board face each other, and a containing space is formed between the upper plane of the first circuit board and the lower plane of the second circuit board. The containing space is used to arrange electronic components, so as to realize compact layout and improve heat dissipation performance.

[0086] In the embodiment of the present application, the electrical connection can be achieved by using a pin or other conductive means to realize the electrical connection between the first circuit board and the second circuit board, ensuring the stability of signal and power transmission.

[0087] The stacking design between the first circuit board and the second circuit board not only saves the overall space, but also improves the integration of the system. Moreover, there is a gap between the first circuit board and the second circuit board, which can enhance air circulation and improve the heat dissipation capacity of the system.

[0088] In the embodiment of the present application, the upper plane of the first circuit board refers to the surface of the first circuit board facing the second circuit board, which is used for electrical connection or signal transmission with the second circuit board or other elements. The lower plane of the second circuit board refers to the surface of the second circuit board facing the first circuit board, which is used for electrical connection or signal transmission with the first circuit board or other elements.

[0089] In the embodiment of the present application, the upper plane of the first circuit board and the lower plane of the second circuit board can be arranged in parallel, i.e., the two planes are in the same direction and not inclined to each other.

[0090] Based on this, in an optional embodiment of the present application, the upper plane and the lower plane are arranged in parallel.

[0091] In the embodiment of the present application, the parallel arrangement of the upper plane of the first circuit board and the lower plane of the second circuit board can ensure that a uniform gap is formed between the upper plane of the first circuit board and the lower plane of the second circuit board, which is convenient for arranging other electronic elements or cables between the upper plane of the first circuit board and the lower plane of the second circuit board. Parallel arrangement can also reduce problems such as poor contact or short circuit caused by the inclination of the circuit board. By arranging the upper plane of the first circuit board and the lower plane of the second circuit board in parallel, the gap between the upper plane of the first circuit board and the lower plane of the second circuit board can be uniform, which is conducive to improving the assembly precision and stability.

[0092] In the embodiment of the present application, the multi-in-one data line includes a plurality of current output interfaces, and the middle card of the multi-in-one data line is a shunt control hub connecting the input power supply (such as an adapter, a power supply interface, etc.) and the plurality of current output interfaces.

[0093] In the embodiment of the present application, the middle card is provided with the charging circuit provided in any embodiment of the present application.

[0094] In the embodiment of the present application, the distance h between the upper plane and the lower plane ranges from 3.5 mm to 4 mm. In the embodiment of the present application, by setting the distance between the upper plane and the lower plane in the range of 3.5 mm to 4 mm, the product volume can be reduced, the integration and portability can be improved, and the smooth insertion of the pin bank and sufficient space for the heat dissipation path can be ensured, thereby avoiding the performance degradation of the circuit caused by overheating due to the stacked structure.

[0095] Based on this, in an optional embodiment of the present application, the distance between the upper plane and the lower plane ranges from 3.5 mm to 4 mm.

[0096] In the embodiment of the present application, the first circuit board and the second circuit board can be electrically connected through the pin bank assembly. The pin bank assembly is a plug-in electronic component for realizing the electrical connection between two circuit boards. The pin bank assembly is composed of a plurality of metal pins, which can ensure the stable transmission of signals and power. In the embodiment of the present application, the pin bank assembly can reliably electrically connect the first circuit board and the second circuit board, realizing the extreme compression of the space volume. The design of the pin bank assembly not only facilitates heat dissipation, but also improves the aesthetics and practicality while ensuring performance.

[0097] Based on this, in an optional embodiment of the present application, the middle card includes a pin bank assembly, and the first circuit board and the second circuit board are electrically connected through the pin bank assembly.

[0098] In the embodiment of the present application, the pin bank assembly can include two groups, and the two groups of pin bank assemblies are symmetrically arranged.

[0099] In the embodiment of the present application, the pin bank assembly can be arranged on the long side of the circuit board, or can be arranged on the short side of the circuit board, which is not limited in the embodiment of the present application.

[0100] In the embodiment of the present application, the pin bank assembly can be arranged on the long side of the circuit board, one end of the pin bank assembly is connected to the long side of the first circuit board, the other end of the pin bank assembly is connected to the long side of the second circuit board, and the pin bank assembly is perpendicular to the first circuit board and the second circuit board; or the pin bank assembly can be arranged on the short side of the circuit board, one end of the pin bank assembly is connected to the short side of the first circuit board, the other end of the pin bank assembly is connected to the short side of the second circuit board, and the pin bank assembly is perpendicular to the first circuit board and the second circuit board.

[0101] In the embodiments of the present application, the arrangement position of the pin bank assembly can be determined according to the spatial layout of the first circuit board and the second circuit board, the heat dissipation requirement, and the optimization of the overall stacking structure. The vertical connection refers to a mounting mode in which the included angle between the pin bank assembly and the first circuit board and the second circuit board is 90 degrees. The mounting mode of vertical connection helps to save space, and is convenient for maintenance and replacement. The vertical connection can effectively reduce electromagnetic interference and improve the stability of signal transmission.

[0102] Based on this, in an optional embodiment of the present application, one end of the pin bank assembly is connected with the long side of the first circuit board, the other end of the pin bank assembly is connected with the long side of the second circuit board, and the pin bank assembly is perpendicular to the first circuit board and the second circuit board; or, one end of the pin bank assembly is connected with the short side of the first circuit board, the other end of the pin bank assembly is connected with the short side of the second circuit board, and the pin bank assembly is perpendicular to the first circuit board and the second circuit board.

[0103] In the embodiments of the present application, part of the electronic components on the upper plane and part of the electronic components on the lower plane are staggered. The staggered arrangement refers to staggered layout of the positions of part of the electronic components when the electronic components are arranged on the upper plane and the lower plane, so that the electronic components on the upper plane and the lower plane do not coincide in the vertical direction. The staggered arrangement can effectively avoid electromagnetic interference and thermal interference problems, and improve the overall stability and heat dissipation performance of the circuit. The staggered arrangement can be flexibly adjusted according to actual circuit design requirements, for example, staggered arrangement, regional staggered arrangement, or symmetrical staggered arrangement, etc. By staggering part of the electronic components, the height of the electronic components (such as capacitors or inductors) can be reduced.

[0104] Based on this, in an optional embodiment of the present application, part of the electronic components on the upper plane and part of the electronic components on the lower plane are staggered.

[0105] In the embodiments of the present application, the size of the first circuit board and the second circuit board can be the same. The same size of the two circuit boards helps to reduce the volume occupation, improve the space utilization, and improve the aesthetics of the middle card.

[0106] In the embodiments of the present application, the length of the first circuit board ranges from 32 mm to 42 mm, for example, 35 mm, and the width of the first circuit board ranges from 8 mm to 20 mm, for example, 17 mm. By controlling the length of the first circuit board in the range of 32 mm to 42 mm, it can be ensured that the first circuit board is adapted to the overall structure and is convenient for stacking and installing with other components; at the same time, limiting the width of the first circuit board in the range of 8 mm to 20 mm can help to reduce the volume occupation and improve the space utilization, thereby meeting the miniaturization design requirement. The size range of the first circuit board takes into account the compact internal structure of the multi-port fast charging data line, avoiding affecting the heat dissipation efficiency or increasing the product thickness due to the too large circuit board. In addition, the reasonable size can also ensure sufficient wiring space to support the operation of three independent protocol management and switching power supply topology circuit.

[0107] In the embodiments of the present application, the length of the second circuit board ranges from 32 mm to 42 mm, for example, 35 mm, and the width of the second circuit board ranges from 8 mm to 20 mm, for example, 17 mm. By controlling the length of the second circuit board in the range of 32 mm to 42 mm, it can be ensured that the second circuit board is adapted to the overall structure and is convenient for stacking and installing with other components; at the same time, limiting the width of the second circuit board in the range of 8 mm to 20 mm can help to reduce the volume occupation and improve the space utilization, thereby meeting the miniaturization design requirement. The size range of the second circuit board takes into account the compact internal structure of the multi-port fast charging data line, avoiding affecting the heat dissipation efficiency or increasing the product thickness due to the too large circuit board. In addition, the reasonable size can also ensure sufficient wiring space to support the operation of three independent protocol management and switching power supply topology circuit.

[0108] Based on this, in an optional embodiment of the present application, the length of the first circuit board ranges from 32 mm to 42 mm, and the width of the first circuit board ranges from 8 mm to 20 mm; and / or, the length of the second circuit board ranges from 32 mm to 42 mm, and the width of the second circuit board ranges from 8 mm to 20 mm.

[0109] The embodiments of the present application also provide a one-to-three data line, characterized in that the one-to-three data line comprises the middle card provided by any of the embodiments of the present application.

[0110] In the embodiments of the present application, the one-to-three data line includes three current output interfaces and one current input interface. One end of the current input interface is connected to one end of the middle card, and the other end of the current input interface is used to connect a power supply end. One end of the three current output interfaces is connected to the other end of the middle card, and the other end of the three current output interfaces is used to connect a load. In the case that the three current output interfaces simultaneously connect the load, the sum of the powers output by the three current output interfaces is less than or equal to 140W. The current output interface refers to a charging interface on the data line, such as a TYPE-C interface or other output interface supporting fast charging protocol, which is used to supply power to external equipment. When the three current output interfaces simultaneously connect the load (i.e., three devices simultaneously charge), the charging circuit arranged on the middle card is used to uniformly manage the three-way output power, so as to ensure that the total power does not exceed 140W. Overload can be prevented, and the stability of the charging system is ensured. The sum of the powers refers to the result of adding the powers output by the three current output interfaces. The load state of each way can be monitored in real time, and the output power of each current output interface is dynamically adjusted, so as to ensure that the overall power does not exceed the set upper limit. By setting the power upper limit, power resources can be reasonably allocated in the case of simultaneous charging of multiple devices, and problems such as overheating and circuit failure caused by excessive power can be avoided, and safety and use efficiency are improved. In the case that any two current output interfaces of the three current output interfaces simultaneously connect the load, the sum of the powers output by the any two current output interfaces is less than or equal to 140W. When only two current output interfaces connect the load, the sum of the two-way output powers is also controlled to be less than or equal to 140W. In the case that part of the devices are not connected, the remaining capacity can be fully utilized, and the charging flexibility is improved. In the case that any one current output interface of the three current output interfaces connects the load, the power output by the current output interface connecting the load is less than or equal to 140W. When only one current output interface connects the load, the maximum output power of the current output interface is limited to 140W. In the case that the maximum output power of the current output interface is limited to 140W, a single device can obtain the highest power under the best conditions, and fast charging can be realized. The safety boundary based on product design is set to ensure that in extreme cases, a single-way power does not exceed the safety boundary, and a safety hazard is not caused. By setting the single-way maximum power, the demand of users for high-power fast charging can be met, and the problems of cost increase and size increase caused by excessive design can be avoided, so that the best balance between performance and cost is realized. In the embodiments of the present application, by classifying and limiting the three-way output power under different load conditions, overload can be effectively prevented, and the system stability is improved. In this way, the three-way output power is classified and limited under different load conditions, reliable and efficient charging services can be provided in various use scenarios, the user experience is improved, and the popularization and application of the one-to-three data line in the market are promoted.

[0111] Based on this, in an optional embodiment of the present application, the one-to-three data line comprises three current output interfaces and one current input interface, one end of the current input interface is connected with one end of the middle card, the other end of the current input interface is used for connecting a power supply end, one end of the three current output interfaces is connected with the other end of the middle card, and the other end of the three current output interfaces is used for connecting a load;

[0112] In the case that the three current output interfaces simultaneously connect loads, the sum of the powers output by the three current output interfaces is less than or equal to 140w;

[0113] In the case that any two current output interfaces of the three current output interfaces simultaneously connect loads, the sum of the powers output by the any two current output interfaces is less than or equal to 140w;

[0114] In the case that any one current output interface of the three current output interfaces connects a load, the power output by the current output interface connecting the load is less than or equal to 140w.

[0115] It can be understood that the output power of the current output interface is related to the power requested by the load, if the simultaneously connected loads all have the fast charging function, the sum of the powers output by the three current output interfaces will reach 140w, if the sum of the total powers required by the simultaneously connected loads output by the three current output interfaces is 120, then the sum of the powers output by the three current output interfaces is 120w.

[0116] It should be noted that the "module" mentioned in the embodiments of the present application can be replaced by "circuit", or other descriptions, and the embodiments of the present application do not limit this.

[0117] In the several embodiments provided by the present application, it should be understood that the disclosed system and device can be implemented in other ways. For example, the device embodiments described above are only schematic. The division of the modules is only a logical function division. There can be another division manner for actual implementation, for example, a plurality of units or components can be combined or integrated into another system, or some features can be ignored or not executed. In addition, the displayed or discussed mutual couplings or direct couplings or communication connections between the units can be indirect couplings or communication connections through some interfaces, devices or units, and can be electrical, mechanical or in other forms.

[0118] The units described as separate components can or can not be physically separate, and the components displayed as units can or can not be physical units, that is, they can be located in one place, or can be distributed on a plurality of network units. According to actual needs, part or all of the units can be selected to achieve the purpose of the embodiments of the present application.

[0119] The above description is only specific embodiments of the present application, but the protection scope of the present application is not limited thereto, any person skilled in the art can easily think of changes or replacements within the technical scope disclosed by the present application, which should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

A charging circuit, the charging circuit comprising: The control module is connected with the voltage adjustment module; and the voltage adjustment module is used to be connected with the load. The control module is used to acquire charging protocol information of the at least two loads when detecting that at least two interfaces of the data line are respectively connected with one load, control the voltage adjustment module to output a voltage with the same size as the charging protocol voltage of the at least two loads, and charge the at least two loads through the interfaces. The charging circuit according to claim 1, wherein The voltage adjustment module comprises at least two voltage adjustment sub-modules, and one voltage adjustment sub-module is arranged on each line. The control module is used to control the voltage adjustment sub-module on the line connected with the load to output a voltage with the same size as the charging protocol voltage of the load. The charging circuit according to claim 2, wherein The voltage adjustment sub-module comprises one or more of the following circuits: The boost sub-circuit is used to boost the input voltage to obtain a voltage with the same size as the charging protocol voltage of the load. The buck sub-circuit is used to buck the input voltage to obtain a voltage with the same size as the charging protocol voltage of the load. The pass-through circuit is used to take the input voltage as a voltage with the same size as the charging protocol voltage of the load. The charging circuit according to claim 2, wherein In the case where the voltage adjustment sub-module comprises at least two of the boost sub-circuit, the buck sub-circuit and the pass-through circuit, the voltage adjustment sub-module further comprises a switch circuit, and the control module is used to: If the input voltage is greater than the charging protocol voltage of the load, control the switch circuit to connect the buck sub-circuit and the load; If the input voltage is less than the charging protocol voltage of the load, control the switch circuit to connect the boost sub-circuit and the load; If the input voltage is equal to the charging protocol voltage of the load, control the switch circuit to connect the pass-through circuit and the load. The charging circuit according to claim 4, wherein If the control module controls the switch circuit to connect the buck sub-circuit and the load, or the control module controls the switch circuit to connect the boost sub-circuit and the load, the control module is further used to: control the buck sub-circuit to reduce the input voltage to a voltage with the same size as the charging protocol voltage of the load through an FB voltage regulation mode; or control the boost sub-circuit to increase the input voltage to a voltage with the same size as the charging protocol voltage of the load through an FB voltage regulation mode. The charging circuit according to any one of claims 1 to 5, wherein The charging circuit further comprises a power interface module used to receive a voltage from an adapter and output the received voltage to the voltage adjustment module. According to claim 6, wherein The control module is further used to determine the size of the voltage received from the adapter according to the charging protocol information of each load of the at least two loads, generate first information containing the determined voltage size related information, and send the first information to the power interface module. The power interface module is used to receive the first information sent by the control module, send the first information to the adapter, and receive the voltage with the determined size from the adapter. According to claim 7, wherein The control module is configured to determine the voltage size as the voltage with the highest charging protocol voltage among the at least two loads. The charging circuit according to any one of claims 1 to 5, wherein, The charging circuit is arranged on two PCBs; wherein the two PCBs are arranged in a stacked manner through two-end pin arrangement, and element surfaces of the two PCBs are arranged opposite to each other. A data line comprising the charging circuit according to any one of claims 1 to 9. A middle card of a multi-split data line, comprising: a first circuit board and a second circuit board, the first circuit board and the second circuit board being electrically connected; an upper plane of the first circuit board is opposite to a lower plane of the second circuit board, a containing space is formed between the upper plane and the lower plane, and the upper plane and the lower plane are provided with electronic components, and the electronic components are located in the containing space. The middle card according to claim 11, wherein, The upper plane and the lower plane are arranged in parallel. The middle card according to claim 11, wherein, The distance between the upper plane and the lower plane ranges from 3.5 mm to 4 mm. The middle card according to claim 11, wherein, The middle card comprises a pin assembly, and the first circuit board and the second circuit board are electrically connected through the pin assembly. The middle card according to claim 14, wherein, One end of the pin assembly is connected to a long side of the first circuit board, the other end of the pin assembly is connected to a long side of the second circuit board, and the pin assembly is perpendicular to the first circuit board and the second circuit board; or one end of the pin assembly is connected to a short side of the first circuit board, the other end of the pin assembly is connected to a short side of the second circuit board, and the pin assembly is perpendicular to the first circuit board and the second circuit board. The middle card according to claim 11, wherein, Part of the electronic components on the upper plane and part of the electronic components on the lower plane are arranged staggered. The middle card according to claim 11, wherein, The first circuit board and the second circuit board have the same size. The middle card according to claim 11, wherein, The length of the first circuit board ranges from 32 mm to 42 mm, and the width of the first circuit board ranges from 8 mm to 20 mm; and / or the length of the second circuit board ranges from 32 mm to 42 mm, and the width of the second circuit board ranges from 8 mm to 20 mm. A one-to-three data line comprising the middle card according to any one of claims 11 to 18. The one-to-three data line according to claim 19, wherein, The one-to-three data line comprises three current output interfaces and one current input interface, one end of the current input interface is connected to one end of the middle card, the other end of the current input interface is used to connect a power supply end, one end of the three current output interfaces is connected to the other end of the middle card, and the other end of the three current output interfaces is used to connect a load; In the case that the other end of the current input interface is connected to the power supply end and the three current output interfaces are simultaneously connected to the load, the sum of the powers output by the three current output interfaces is less than or equal to 140 W; In the case that the other end of the current input interface is connected to the power supply end and any two of the three current output interfaces are simultaneously connected to the load, the sum of the powers output by the any two current output interfaces is less than or equal to 140 W; and In the case that the other end of the current input interface is connected to the power supply end and any two of the three current output interfaces are simultaneously connected to the load, the sum of the powers output by the any two current output interfaces is less than or equal to 140 W. The power supply end is connected to the other end of the current input interface, and the power outputted by any one of the three current output interfaces connected to the load is less than or equal to 140w.

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