System and method for correcting mounting position of component mounting device

Abstract

A system for correcting a mounting position of a component mounting device according to an embodiment of the present invention comprises: a mounter which mounts a component on a substrate; an inspection unit which checks a mounting position of the component mounted by the mounter; and a management unit which calculates a mounting position correction value of the component on the basis of the mounting position of the component checked by the inspection unit, wherein the management unit calculates the mounting position correction value for each mounting path of the component and transmits the correction value to the mounter.

Description

Mounting position correction system and method for component mounting device

[0001] Embodiments of the present invention relate to a mounting position correction system for a component mounting device and a method thereof.

[0002] With the advancement of information and communication technology, there is a trend of mounting an increasing number and variety of components on circuit boards that constitute electronic products. A device that mounts components onto a circuit board in this manner is called a component mounting device. In this case, the component mounting device must accurately mount each component onto the circuit board; specifically, the component mounting device must mount the components within a range that satisfies the mounting positional precision for each component. The component mounting device may be equipped with at least one mounter for mounting components onto the circuit board.

[0003] Conventionally, there is a method in which the position of a component mounted on a printed electronic circuit board is inspected using a tester, and the mounting position of the same component on the next board is corrected using a mounter based on the difference from the planned mounting position on the board—that is, the position on the drawing. In this process, the correction is applied not only to the mounting position but also to the angle of the mounted component.

[0004] The method of inspecting the position of a component after mounting it on a circuit board and correcting the mounting position of the same component on the next board is called feedback processing or feedback correction. This feedback processing or feedback correction method includes inspecting the position of the solder paste placed on the board using an inspector before mounting the component, and correcting the component mounting position based on the position of the solder paste.

[0005] Japanese Patent Publication No. 2016-058603 discloses a component mounting method characterized by a component mounting machine that repeatedly performs a component mounting process of transferring and mounting a component extracted from a component supply unit onto a substrate, an inspection process that inspects the mounting state of a component mounted on the component mounting machine and detects a positional misalignment state from the correct mounting position, and a process that calculates a correction value to be used in the component mounting process to improve the mounting position precision based on the information on the positional misalignment state of the component, thereby correcting the mounting position by adding a feedback correction value.

[0006] However, in order to correct the mounting position by adding a feedback correction value, the condition must be satisfied that the process of the component mounting machine transferring components from the component supply unit and mounting them on the board must be maintained repeatedly. If the components mounted on the board are mounted through multiple paths, it may be difficult to correct the mounting position of the components with a single correction value that needs to be fed back.

[0007] According to one aspect of the present invention, the main objective is to provide a mounting position correction system and a method for a component mounting device that enables the correction of the mounting position of a component even when the component has multiple mounting paths, in order to increase the productivity of the component mounting device.

[0008] However, these problems are exemplary, and the problems to be solved by the present invention are not limited thereto.

[0009] A mounting position correction system for a component mounting device according to one embodiment of the present invention comprises: a mounter for mounting a component on a substrate; an inspection unit for verifying the mounting position of the component mounted by the mounter; and a management unit for calculating a mounting position correction value of the component based on the mounting position of the component verified by the inspection unit, wherein the management unit calculates a mounting position correction value for each mounting path of the component and transmits the correction value to the mounter.

[0010] The above management unit may include a component mounting path acquisition unit that acquires the mounting path of a component through a mounting path verification unit of the above mounter.

[0011] The above mounting path verification unit may include a multi-program path verification unit that verifies which path was used when the part to be mounted is programmed with one or more mounting paths; and a re-mounting path verification unit that verifies whether a different path was obtained by bringing the part back and mounting it after it was determined to be a part that was written as a single program but cannot be mounted.

[0012] The above management unit may include an inspection result receiving unit that receives mounting location information of inspected parts from the inspection unit; and a part-specific inspection result classification unit that classifies the mounting location information of the parts received from the inspection result receiving unit for each part.

[0013] The above management unit may include a mounting position correction value calculation unit that obtains previous correction information for parts calculated up to now, and calculates a mounting position correction value for the parts based on the obtained previous correction information and the current mounting position information of the parts.

[0014] The above-mentioned mounting position correction value calculation unit may include a previous correction information acquisition unit; a component-specific mounting position correction value calculation unit; and a mounting path-specific mounting position correction value calculation unit.

[0015] The above management unit includes a correction value application unit that transmits the correction value to the mounter, and the mounter can separately apply a correction value for each component's mounting path when mounting each component based on the mounting position correction value for each mounting path received from the correction value application unit.

[0016] A method for correcting the mounting position of a component mounting device according to an embodiment of the present invention comprises: a step in which a management unit obtains the mounting path of components through a mounting path verification unit of a mounter; a step in which an inspection unit verifies the mounting position of components mounted by the mounter and transmits the mounting position information of the components to the management unit; a step in which the management unit calculates a component-specific mounting position correction value based on the mounting position information of the components transmitted by the inspection unit; a step in which the management unit calculates a component-specific mounting position correction value if there is a component among the components that has one or more mounting paths; and a step in which the management unit transmits the calculated component-specific and mounting path-specific mounting position correction values ​​to the mounter.

[0017] Other aspects, features, and advantages other than those described above will become clear from the following specific details, claims, and drawings for implementing the invention.

[0018] A mounting position correction system and method for a component mounting device according to one embodiment of the present invention can effectively correct the mounting position even when a single component mounted on a substrate has multiple mounting paths.

[0019] The effects of the present invention are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art from the description in the claims.

[0020] FIG. 1 is a block diagram showing a mounting position correction system for a component mounting device according to one embodiment of the present invention.

[0021] FIG. 2(a) is a conceptual diagram showing the detailed configuration of a mounter of a mounting position correction system for a component mounting device according to one embodiment of the present invention.

[0022] FIG. 2(b) is a drawing showing a gantry configured to mount parts a, b, and c on a substrate as an example.

[0023] Figure 2(c) is a diagram showing the path through which parts are mounted in a normal state via the gantry of Figure 2(b).

[0024] FIG. 2(d) is a diagram showing the path along which parts are mounted when part b is in a recognition error state through the gantry of FIG. 2(b).

[0025] FIG. 3 is a block diagram showing the detailed configuration of a mounting position correction system for a component mounting device according to one embodiment of the present invention.

[0026] FIG. 4 is a block diagram showing a mounting path verification unit according to an embodiment of the present invention.

[0027] FIG. 5 is a block diagram showing a mounting position correction value calculation unit according to an embodiment of the present invention.

[0028] FIG. 6 is a block diagram showing a configuration for calculating mounting position correction values ​​by path according to an embodiment of the present invention.

[0029] FIG. 7(a) is a graph showing the results of inspecting the mounting points of components on a PCB through an inspection unit according to an embodiment of the present invention. FIG. 7(b) is a graph showing the results of inspecting the mounting points of components on a PCB through an inspection unit after applying a correction value according to an embodiment of the present invention.

[0030] FIG. 8(a) is a graph showing all results of inspecting the mounting point offsets for each component on multiple PCBs through an inspection unit according to one embodiment of the present invention. FIG. 8(b) is a graph showing all results of inspecting the mounting point offsets for each component on multiple PCBs through an inspection unit after applying a correction value according to one embodiment of the present invention.

[0031] FIG. 9(a) is a conceptual diagram showing a component being mounted through a first path according to an embodiment of the present invention. FIG. 9(b) is a conceptual diagram showing a component being mounted through a second path according to an embodiment of the present invention. FIG. 9(c) is a conceptual diagram showing a component being mounted through a third path according to an embodiment of the present invention. FIG. 9(d) is a conceptual diagram showing a component being mounted through a fourth path according to an embodiment of the present invention. When a component is mounted through the first to fourth paths according to the embodiment, the feeder / nozzle / gantry may be the same or different.

[0032] FIG. 10(a) is a conceptual diagram showing a component being mounted through a first path according to an embodiment of the present invention. FIG. 10(b) is a diagram showing the center value of the mounting point offset distribution of a component confirmed through an inspection unit when the component is mounted through FIG. 10(a).

[0033] FIG. 11(a) is a conceptual diagram showing a component being mounted through a second path according to an embodiment of the present invention. FIG. 11(b) is a diagram showing the center value of the mounting point offset distribution of a component confirmed through an inspection unit when the component is mounted through FIG. 11(a).

[0034] FIG. 12(a) is a conceptual diagram showing how a component is mounted through a first path and a second path according to an embodiment of the present invention. FIG. 12(b) is a diagram showing the center value (OS3) of the mounting point offset distribution of a component confirmed by an inspection unit for both the component mounted through the first path and the component mounted through the second path when the component is mounted through FIG. 12(a).

[0035] FIG. 12(c) is a diagram showing the center values ​​(OS1, OS2) of the mounting point offset distribution of a part confirmed through an inspection unit for each part mounted through the first path and the second path when the part is mounted through FIG. 12(a).

[0036] FIG. 13 is a flowchart illustrating a method for correcting the mounting position of a component mounting device according to an embodiment of the present invention.

[0037] FIG. 14 is a flowchart showing more specifically the case where the management unit obtains the mounting path of the parts through the mounting path verification unit of the mounter in the mounting position correction method of a component mounting device according to one embodiment of the present invention.

[0038] The present invention is capable of various modifications and may have various embodiments; specific embodiments are illustrated in the drawings and described in detail in the description of the invention. However, this is not intended to limit the present invention to specific embodiments, and it should be understood that the invention includes all modifications, equivalents, and substitutions that fall within the spirit and scope of the invention. In describing the present invention, the same identification numerals are used for identical components, even if they are illustrated in different embodiments.

[0039] Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings. When describing with reference to the drawings, identical or corresponding components are given the same reference numerals, and redundant descriptions thereof will be omitted.

[0040] In the following embodiments, terms such as first, second, etc. are used not in a limiting sense, but for the purpose of distinguishing one component from another component.

[0041] In the following examples, singular expressions include plural expressions unless the context clearly indicates otherwise.

[0042] In the following embodiments, terms such as "include" or "have" mean that the features or components described in the specification are present, and do not preclude the possibility that one or more other features or components may be added.

[0043] In the drawings, the size of components may be exaggerated or reduced for convenience of explanation. For example, the size and thickness of each component shown in the drawings are depicted arbitrarily for convenience of explanation, so the present invention is not necessarily limited to what is illustrated.

[0044] Where an embodiment can be implemented differently, a specific process sequence may be performed differently from the order described. For example, two processes described consecutively may be performed substantially simultaneously or proceed in the reverse order of the description.

[0045] The terms used in this application are used merely to describe specific embodiments and are not intended to limit the invention. In this application, terms such as “comprising” or “having” are intended to indicate the presence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

[0046] Hereinafter, with reference to FIGS. 1 to 6, a mounting position correction system for a component mounting device according to an embodiment of the present invention will be described.

[0047] FIG. 1 is a block diagram showing a mounting position correction system for a component mounting device according to an embodiment of the present invention. FIG. 2 is a conceptual diagram showing the detailed configuration of a mounter for a mounting position correction system for a component mounting device according to an embodiment of the present invention. FIG. 3 is a block diagram showing the detailed configuration of a mounting position correction system for a component mounting device according to an embodiment of the present invention. FIG. 4 is a block diagram showing a mounting path verification unit according to an embodiment of the present invention. FIG. 5 is a block diagram showing a mounting position correction value calculation unit according to an embodiment of the present invention. FIG. 6 is a block diagram showing a configuration for calculating a mounting position correction value for each path according to an embodiment of the present invention.

[0048] Referring to FIGS. 1 to 6, a mounting position correction system for a component mounting device according to one embodiment of the present invention includes a mounter (100) for mounting a component on a substrate, an inspection unit (200) for verifying the mounting position of a component mounted by the mounter, and a management unit (300) for calculating a mounting position correction value of a component based on the mounting position of a component verified by the inspection unit. The management unit calculates a mounting position correction value for each mounting path of a component and transmits the correction value to the mounter (100).

[0049] That is, the management unit (300) can calculate a correction value for the position to be mounted on the next substrate based on the difference between the target mounting position and the actual mounting position, i.e., the mounting position, for each component on the substrate according to the inspection results received from the inspection unit (200). In addition, regarding the correction value calculated for each component, the mounting position correction operation for the mounter according to the time-series change situation can be performed on the statistical value calculated for the correction value of all components mounted on the substrate.

[0050] In order to mount components on a substrate (10), at least one mounter (100) may be arranged, and in this embodiment, n mounters may be arranged. A component mounting process may be performed at each of the n mounters. According to this embodiment, an inspection unit (200) for inspecting the position of components on the substrate may be included. The inspection unit (200) may include an inspection device (AOI) for inspecting the position of components. The mounting position information of the components inspected by the inspection unit (200) may be transmitted to a management unit (300). The management unit (300) may include a line management PC (PC) that manages the production of substrates on a line composed of inspection devices and performs calculations regarding corrections, etc. The line management PC may manage production on the line and determine the maintenance timing for the mounters.

[0051] The inspection unit (200) and / or management unit (300) may be provided inside the component mounting device according to embodiments of the present invention, or may be provided separately outside. The inspection unit (200) and / or management unit (300) provided separately outside may be connected to the management unit (300), inspection unit (200), and / or mounter (100) via communication to perform data transmission and reception, information provision, and command transmission.

[0052] Each mounter (100) can assign mounting to some of the components (C) to be mounted on the substrate (10). That is, all components can be mounted using n mounters. When components to be mounted are assigned to each mounter (100), information regarding the order of mounting components, i.e., step information, can also be transmitted to the mounter (100). At this time, information regarding component assignment and mounting order for the mounter (100) is defined as job information, and the job information is input into the mounter (100) or the line management PC.

[0053] In the line management PC, based on the inspection results received from the inspection unit (200), a correction value for the position to be mounted on the next substrate can be calculated regarding the difference between the target mounting position and the actual mounting position for each component on the substrate. The correction value may be a statistically calculated value regarding the previously mounted substrate. For example, the statistically calculated value may be an average.

[0054] The management unit (300) can calculate a correction value for each component on the substrate based on the inspection results received from the inspection unit (200). The calculated correction value can transmit a mounting position correction value for the difference in mounting position regarding the component mounted on each mounter (100). In this case, the difference in mounting position may refer to the difference between the position where the component is supposed to be mounted and the position where the component is actually mounted.

[0055] Referring to FIG. 2, each mounter (100) may include a rail section (160) on which a substrate (10) moves, a feeder (150) for preparing parts, a gantry (120) for mounting parts, and a control section (110) connected to a management section (300) to control the gantry (120).

[0056] The gantry (120) can be moved from the upper part relative to the mounting position to mount a part (C). The gantry (120) may be equipped with a plurality of heads (130) to mount a plurality of parts simultaneously in a single operation. Each head (130) may be equipped with a nozzle (140) according to the size of the part, etc., to adsorb the part.

[0057] The difference (error) between the planned mounting position of a component on the substrate (10) and the actual mounting position of the component may be affected by the position, angle, etc., where the component is mounted, or the condition of the nozzle (140), as a result of controlling the gantry (120) or the head (130). All of the above components are components that constitute the mounter (100) and may be components corresponding to the movable part of the mounter (100).

[0058] After a component is mounted on a substrate (10) in a mounter (100), the mounting position is verified by an inspection unit (200), and the management unit (300) can calculate a component mounting position correction value based on the component mounting position verified by the inspection unit (200). The management unit (300) can transmit the calculated mounting position correction value information to the mounter (100) as feedback information.

[0059] At this time, the mounter (100) can mount the component on the substrate (10) by reflecting the mounting position correction value of the component according to the transmitted feedback information.

[0060] According to the present embodiment, the management unit (300) may include a component mounting path acquisition unit (310) that acquires a component mounting path through a mounting path verification unit (101) of a mounter (100).

[0061] The mounting path verification unit (101) can be mounted on the mounter (100). The mounting path verification unit (101) can verify the mounting path of a component (C) that is mounted through the mounter (100). The mounting path verification unit (101) may be formed, for example, as a sensor or camera device, to verify the mounting path for each component (C), prepare mounting path data, and transmit it to the component mounting path acquisition unit (310) of the management unit (300).

[0062] The mounting path verification unit (101) may include a multi-program path verification unit (101a) that checks which path was used when the part (C) to be mounted is programmed with one or more mounting paths; and a re-mounting path verification unit (101b) that checks whether a different path was obtained by bringing the part back and mounting it after it was determined to be a part that was written as a single program but cannot be mounted.

[0063] The multi-program path verification unit (101a) can verify which path among the multiple paths scheduled by the program the mounted part (C) has used. At this time, the multi-program path verification unit (101a) can verify the specific number of mounting paths and directions, such as how many mounting paths the part (C) has and which direction the mounting paths face.

[0064] If there is only one mounting path for the component (C), the management unit (300) can calculate the mounting position correction value of the component (C) mounted through the path and transmit it to the mounter (100).

[0065] However, if there are two or more mounting paths for the part (C), the management unit (300) can calculate the mounting position correction value for each mounting path of the part and transmit the correction value to the mounter (100).

[0066] In the component mounting process, a component (C) scheduled for mounting may be removed due to defects or other reasons, and the corresponding component may be brought from the same feeder or a different feeder for mounting. In this case, the mounting path of the component may change.

[0067] In addition, if a part runs out of the feeder, it may be necessary to retrieve and mount the part from a feeder at another location where part supply is available. In this case, the mounting path of the part may also change.

[0068] According to the present embodiment, the re-mounting path verification unit (101b) can verify the changed part mounting path when the mounting path is changed due to reasons such as part removal and / or the use of a different feeder, and transmit the information to the part mounting path acquisition unit (310) of the management unit (300).

[0069] Referring exemplarily to FIG. 2(a), when all parts (C) supplied from the first feeder (150a) are exhausted and supplied from the second feeder (150b), the re-mounting path verification unit (101b) can transmit the changed supply path information of the parts (C) to the parts mounting path acquisition unit (310). The mounting position correction value calculation unit (340) can calculate the mounting position correction value based on the changed supply path information of the parts.

[0070] In FIGS. 2(b), FIG. 2(c), and FIG. 2(d), an inspection camera is located

[0071] The gantry is shown moving from the starting reference point (S) and supplying parts a, b, and c.

[0072] Referring to FIG. 2(c), when there is no abnormality, the gantry moves in the order of Pa, Pb, and Pc paths as indicated by the arrows, and parts a, b, and c can be mounted on the substrate (10) in order.

[0073] However, referring to FIG. 2(d), for example, if part b is discarded due to a recognition error, the gantry moves in the order of Pa and Pc paths, and after mounting parts a and c on the substrate (10) in order, moves again from the starting reference point (S) to the Pb path and mounts part b on the substrate (10).

[0074] The management unit (300) may include an inspection result receiving unit (320) that receives mounting location information of inspected parts from the inspection unit (200), and a part-specific inspection result classification unit (330) that classifies the mounting location information of parts (C) received from the inspection result receiving unit (320) for each part.

[0075] The inspection unit (200) can verify the position, angle, etc. of each mounted component on the substrate (10) on which the component (C) is mounted. This mounting position information can be received by the inspection result receiving unit (320). The component inspection result classification unit (330) can prepare classification data that classifies the mounting path and mounting position information of components by type of component, based on the mounting path data of the component mounting path acquisition unit (310) and the mounting position and angle data of the mounted component of the inspection result receiving unit (320).

[0076] The management unit (300) may include a mounting position correction value calculation unit (340) that obtains previous correction information for parts calculated up to now, and calculates a mounting position correction value for the parts based on the obtained previous correction information and the current mounting position information of the parts.

[0077] At this time, the mounting position correction value calculation unit (340) includes a previous correction information acquisition unit (341) that receives and acquires correction information when mounting a component from a previously produced substrate that recognizes the mounting path and mounting position, a component-specific mounting position correction value calculation unit (342) that calculates a mounting position correction value for each component, and a mounting path-specific mounting position correction value calculation unit (343) that calculates a mounting position correction value for each component mounting path when there are two or more mounting paths of the component.

[0078] FIG. 6 discloses a block diagram showing a configuration for calculating mounting position correction values ​​for each path. As illustrated in FIG. 6, when a first component is mounted via two or more paths, the mounting position correction value calculation unit (340) can calculate mounting position correction values ​​for each path. Through this, the management unit (300) transmits the mounting position correction values ​​of the component calculated for each mounting path to the mounter, and the mounter (100) can apply the mounting position correction values ​​of the component calculated for each mounting path differently to components mounted via different paths.

[0079] According to the present embodiment, the management unit (300) may include a correction value application unit (350) that transmits the correction value to the mounter (100). At this time, the mounter may apply a correction value separately for each component's mounting path based on the mounting position correction value for each mounting path received from the correction value application unit (350). The correction value application unit (350) transmits the feedback correction value for each component's mounting path, calculated through the mounting position correction value calculation unit (340), to the mounter (100), and the mounter (100) may proceed with the component (C) mounting process by applying the feedback correction value for each component's mounting path.

[0080] Hereinafter, with reference to FIGS. 7(a) to FIGS. 12(c), a mounting position correction system for a component mounting device according to an embodiment of the present invention will be described in more detail.

[0081] FIG. 7(a) is a graph showing the results of inspecting the mounting points of a component through an inspection unit according to an embodiment of the present invention. FIG. 7(b) is a graph showing the results of inspecting the mounting points of a component through an inspection unit after applying a correction value according to an embodiment of the present invention.

[0082] FIG. 8(a) is a graph showing the results of inspecting the mounting point offsets of a part through an inspection unit according to an embodiment of the present invention. FIG. 8(b) is a graph showing the results of inspecting the mounting point offsets of a part through an inspection unit after applying a correction value according to an embodiment of the present invention.

[0083] FIG. 9(a) is a conceptual diagram showing a component being mounted through a first path according to an embodiment of the present invention. FIG. 9(b) is a conceptual diagram showing a component being mounted through a second path according to an embodiment of the present invention. FIG. 9(c) is a conceptual diagram showing a component being mounted through a third path according to an embodiment of the present invention. FIG. 9(d) is a conceptual diagram showing a component being mounted through a fourth path according to an embodiment of the present invention.

[0084] FIG. 10(a) is a conceptual diagram showing a component being mounted through a first path according to an embodiment of the present invention. FIG. 10(b) is a diagram showing the center value of the mounting point offset distribution of a component confirmed through an inspection unit when the component is mounted through FIG. 10(a).

[0085] FIG. 11(a) is a conceptual diagram showing a component being mounted through a second path according to an embodiment of the present invention. FIG. 11(b) is a diagram showing the center value of the mounting point offset distribution of a component confirmed through an inspection unit when the component is mounted through FIG. 11(a).

[0086] FIG. 12(a) is a conceptual diagram showing a component being mounted through a first path and a second path according to an embodiment of the present invention. FIG. 12(b) is a diagram showing the center values ​​(OS1, OS2) of the mounting point offset distribution of a component confirmed by an inspection unit for each component mounted through the first path and the second path when the component is mounted through FIG. 12(a). FIG. 12(c) is a diagram showing the center value (OS3) of the mounting point offset distribution of a component confirmed by an inspection unit when the offsets corresponding to the first path and the second path are reflected together when the component is mounted as in FIG. 12(a).

[0087] As illustrated in FIG. 7(a), when the component mounting process is repeated, slight errors may occur in the position of the component mounted through the component mounting device. To resolve these errors, the mounting error of the component is reduced by reflecting a feedback correction value. Referring to FIG. 7(b), it can be seen that the mounting positions of the components are more densely concentrated at the mounting point (MP). In other words, the mounting position error of the component can be minimized by reflecting a feedback correction value. FIG. 7(a) and FIG. 7(b) are examples of mounting points.

[0088] At this time, as shown in FIG. 8(a) and FIG. 8(b), the position of the mounting point of the part can be represented by an offset circle that takes into account the displacement difference of each mounting point.

[0089] As illustrated in FIGS. 9(a), 9(b), 9(c), and 9(d), when a component (C) is mounted on a substrate (10) for each path (P1, P2, P3, P4), even if the component (C) is mounted at the same mounting position, if the component transport conditions of the mounter (100) moving for mounting change, the size and direction of the mounting point offset may change. That is, when mounting for each path (P1, P2, P3, P4), the size, position, and direction of the mounting point offset may change. For example, the component transport conditions of the mounter (100) may be elements such as the path direction of the mounter (100) transporting and mounting the component (C), the speed of the mounter (100), and acceleration.

[0090] Referring to FIG. 10(a) and FIG. 10(b), when a component (C) is moved along a first path (P1) and mounted on a substrate (10), the mounting point offset (OS1) of the component (C) that is moved along the first path (P1) and mounted may be +0.05. At this time, the mounting position correction value may be +0.05 in the Y-axis direction.

[0091] Also, referring to FIG. 11(a) and FIG. 11(b), when a component (C) is moved to a second path (P2) and mounted on a substrate (10), the mounting point offset (OS2) of the component (C) that is moved to the second path (P2) and mounted may be -0.05mm. At this time, the mounting position correction value may be -0.05mm in the Y-axis direction.

[0092] Referring to FIG. 12(a), if a component (C) is mounted through a first path (P1) and also through a second path (P2), and the correction value is calculated by combining the case of mounting through the first path (P1) and the case of mounting through the second path (P2), a mounting point offset is formed at the mounting point (MP), and a situation may occur where the correction value becomes 0. Although the correction value is 0, the actual mounting position is formed at a position of +0.05mm and -0.05mm from the mounting point, so a correction value corresponding to the actual component mounting position error is not calculated.

[0093] However, as in one embodiment of the present invention, when the mounting position error of the first path (P1) and the second path (P2) is calculated separately and a separate correction value is calculated as shown in FIG. 12(b) and FIG. 12(c), the mounting point offset (OS1) of the component (C) through the first path (P1) is calculated as +0.05mm, the mounting point offset (OS2) of the component (C) through the second path (P2) is calculated as -0.05mm, and the final mounting point offset (OS3) is formed at a position of 0 corresponding to the position of the mounting point (MP), so that a more accurate mounting position correction value of the component can be calculated for each mounting path of the component.

[0094] Hereinafter, with reference to FIGS. 13 and 14, a method for correcting the mounting position of a component mounting device according to an embodiment of the present invention will be described. For details not shown in FIGS. 13 and 14, reference may be made to the details shown in FIGS. 1 to 12 and the descriptions thereof.

[0095] FIG. 13 is a flowchart illustrating a method for correcting the mounting position of a component mounting device according to an embodiment of the present invention. FIG. 14 is a flowchart illustrating more specifically the case in which, in the method for correcting the mounting position of a component mounting device according to an embodiment of the present invention, the management unit obtains the mounting path of the components through the mounting path verification unit of the mounter.

[0096] Referring to FIGS. 13 and 14, a mounting position correction method for a component mounting device according to an embodiment of the present invention comprises the steps of: a management unit (300) obtaining a mounting path of components (C) through a mounting path verification unit (101) of a mounter (100) (S100); an inspection unit (200) verifying the mounting position of components mounted by the mounter (100) and transmitting mounting position information of the components to the management unit (300) (S200); the management unit (300) calculating a mounting position correction value for each component (C) based on the mounting position information of the components transmitted by the inspection unit (200) (S300); the management unit (300) calculating a mounting position correction value for each component (C) by mounting path if there is a component among the components that has one or more mounting paths (S400); and the management unit (300) transmitting the calculated mounting position correction values ​​for each component and mounting path to the mounter (100) (S500). Includes.

[0097] In this way, the management unit (300) checks not only the mounting position of the component mounted through the mounter (100) but also the mounting path data of the component, and if there are two or more mounting paths of the component, calculates a correction value separately for each mounting path of the component and provides feedback to the mounter (100), thereby allowing the mounter (100) to apply different correction values ​​for each mounting path of the component and mount the component on the substrate, thereby further improving the accuracy of the component mounting error correction.

[0098] The step (S100) in which the management unit (300) obtains the mounting path of the parts through the mounting path verification unit of the mounter (100) may include the step (S110) of verifying one or more mounting paths of the parts (C) supplied through the feeder (150) and the step (S120) of verifying the mounting path of the parts supplied by changing the feeder (150).

[0099] In the step (S110) of verifying one or more mounting paths of a component (C) supplied through a feeder (150), the mounting paths of the component (C) supplied through the feeder (150) can be verified. At this time, the management unit (300) can verify the specific number and direction of mounting paths, such as how many mounting paths the component (C) has and which direction the mounting paths face.

[0100] Additionally, the step (S120) of checking the mounting path of a supplied part when the feeder (150) is changed can check the changed part mounting path when the supplied feeder is changed for reasons such as part removal and / or use of a different part, and transmit the information to the part mounting path acquisition unit (310) of the management unit (300).

[0101] Although the present invention has been described with reference to the embodiments illustrated in the drawings, this is merely illustrative. Those skilled in the art will fully understand that various modifications and equivalent alternative embodiments are possible from the embodiments. Accordingly, the true technical scope of protection of the present invention should be determined based on the appended claims.

[0102] The specific technical details described in the embodiments are merely examples and do not limit the technical scope of the embodiments. To make the description of the invention concise and clear, descriptions of general prior art and configurations may be omitted. Furthermore, the connections of lines or connecting members between components depicted in the drawings are illustrative of functional connections and / or physical or circuit connections, and may be replaced or represented by various additional functional, physical, or circuit connections in actual devices. Additionally, unless specifically stated with terms such as "essential" or "importantly," a component may not be strictly necessary for the application of the present invention.

[0103] The term "the above" or similar designations in the description of the invention and claims may refer to both singular and plural forms unless specifically limited otherwise. Furthermore, where a range is described in the embodiments, it is considered to include the invention with respect to individual values ​​within said range (unless otherwise stated), and is equivalent to describing each individual value constituting said range in the description of the invention. Additionally, regarding the steps constituting the method according to the embodiments, the steps may be performed in a suitable order unless explicitly stated or otherwise stated. The embodiments are not necessarily limited by the order in which the steps are described. The use of all examples or exemplary terms (e.g., etc.) in the embodiments is merely for the purpose of describing the embodiments in detail, and the scope of the embodiments is not limited by said examples or exemplary terms unless otherwise limited by the claims. Furthermore, a person skilled in the art will understand that various modifications, combinations, and changes may be made according to design conditions and factors within the scope of the claims or equivalents to which they are added.

Claims

1. A mounter for mounting components onto a circuit board; An inspection unit for verifying the mounting position of a component mounted by the above-mentioned mounter; and It includes a management unit that calculates a mounting position correction value for the part based on the mounting position of the part confirmed by the inspection unit, and The above-mentioned management unit calculates a mounting position correction value for each mounting path of the above-mentioned component and transmits the correction value to the mounter, a mounting position correction system for a component mounting device.

2. In Paragraph 1, The above management department, A mounting position correction system for a component mounting device, comprising a component mounting path acquisition unit that acquires a component mounting path through a mounting path verification unit of the above-mentioned mounter.

3. In Paragraph 2, The above mounting path verification unit is, A multi-program path verification unit that checks which path was used when a component to be mounted is programmed with one or more mounting paths; and A mounting position correction system for a component mounting device including a remounting path verification unit that checks whether a different path has been obtained by bringing the component back and mounting it after it was determined to be a component that was written as a single program but cannot be mounted.

4. In Paragraph 1, The above management department, An inspection result receiving unit that receives mounting location information of the inspected part from the inspection unit; and A mounting position correction system for a component mounting device, comprising a component-specific inspection result classification unit that classifies mounting position information of the components received from the inspection result receiving unit for each component.

5. In Paragraph 1, The above management department, A mounting position correction system for a component mounting device, comprising a mounting position correction value calculation unit that acquires previous correction information for components calculated up to now, and calculates a mounting position correction value for the components based on the acquired previous correction information and current mounting position information of the components.

6. In Paragraph 5, The above mounting position correction value calculation unit is, Previous correction information acquisition unit; Calculation unit for mounting position correction values ​​per part; and A mounting position correction system for a component mounting device, comprising a unit for calculating mounting position correction values ​​for each mounting path.

7. In Paragraph 1, The above management department, It includes a correction value application unit that transmits the above correction value to the mounter, The above-described mounter is a mounting position correction system for a component mounting device that applies a correction value separately to each component's mounting path when mounting each component, based on the mounting position correction value for each mounting path received from the correction value application unit.

8. A step in which the management department obtains the mounting paths of the parts through the mounting path verification unit of the mounter; A step in which an inspection unit verifies the mounting positions of the parts mounted by the mounter and transmits the mounting position information of the parts to the management unit; The above management unit calculates a component-specific mounting position correction value based on the mounting position information of the components transmitted by the above inspection unit; The above management unit calculates a mounting position correction value for each mounting path of a component when there is a component among the above components that has one or more mounting paths; and A method for correcting the mounting position of a component mounting device, wherein the above-mentioned management unit includes the step of transmitting a calculated mounting position correction value for each component and mounting path to a mounter.

9. In Paragraph 8, The step in which the above-mentioned management unit obtains the mounting paths of the parts through the mounting path verification unit of the mounter is, A step of identifying one or more mounting paths of a part supplied through a feeder; and A method for correcting the mounting position of a component mounting device, comprising the step of verifying the mounting path of a component supplied by changing the feeder.

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