Light-emitting element package and display device using same
The light-emitting element package with a light-blocking layer and support structure addresses reflection issues in LED packages, enhancing contrast ratios and simplifying manufacturing processes by minimizing external light reflection and brightness loss.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2024-09-23
- Publication Date
- 2026-03-26
AI Technical Summary
Existing light-emitting diode (LED) packages in display devices suffer from high reflectivity due to metallic materials like connecting electrodes and terminal portions, leading to reduced contrast ratios and light loss, necessitating additional black side fill structures that complicate manufacturing processes.
A light-emitting element package design with a light-blocking layer and a support layer that minimizes reflection by metallic materials, maximizing light emission and eliminating the need for post-mounting black side fill processes, while allowing for a stable pick and place process.
The design achieves high contrast ratios and simplifies manufacturing by reducing external light reflection and brightness loss, enabling efficient and stable assembly of LED packages in display devices.
Smart Images

Figure KR2024014307_26032026_PF_FP_ABST
Abstract
Description
Light-emitting element package and display device using the same
[0001] The present disclosure is applicable to the field of technology related to display devices and, for example, relates to a light-emitting device package and a display device using an LED (Light Emitting Diode).
[0002] Recently, display devices with excellent characteristics such as thinness and flexibility are being developed in the field of display technology. Currently, the major commercially available displays are represented by LCD (Liquid Crystal Display) and OLED (Organic Light Emitting Diodes).
[0003] Meanwhile, light-emitting diodes (LEDs) are semiconductor light-emitting devices well known for converting electric current into light. Starting with the commercialization of red LEDs using GaAsP compound semiconductors in 1962, they have been used as light sources for display images in electronic devices, including information and communication equipment, along with green LEDs of the GaP:N series.
[0004] Recently, these light-emitting diodes (LEDs) have been gradually miniaturized and manufactured into micrometer-sized LEDs, which are being used as pixels in display devices.
[0005] Compared to other display devices / panels, such LED technology exhibits characteristics of low power consumption, high brightness, and high reliability, and can also be applied to flexible devices. Consequently, it has recently been actively researched by research institutions and companies.
[0006] These LEDs can be manufactured in a package form that can function as a unit pixel.
[0007] In the case of light-emitting device packages used in display devices with a size of approximately 0.4 mm, the area occupied by the light source within the total display area is large, making black treatment inside the package essential. Consequently, there is a tendency to adopt a black side fill structure, which fills the sides of the light source with a black layer capable of achieving the simplest yet lowest reflectivity. In this case, light loss may occur.
[0008] Meanwhile, since metal wiring, terminals, etc. are present inside the package, they may cause external light reflection, and such external light reflection can reduce the contrast ratio.
[0009] Therefore, measures to resolve these problems are required.
[0010] The technical problem of the present disclosure is to provide a light-emitting element package capable of achieving a high contrast ratio by minimizing reflection by metallic materials such as connecting electrodes and terminal portions and maximizing light emission of the light-emitting element, and a display device using the same.
[0011] In addition, we aim to provide a light-emitting element package that does not require an additional structure for improving contrast ratio after mounting the light-emitting element package on a wiring board, and a display device using the same.
[0012] In addition, we aim to provide a light-emitting device package capable of performing a stable PnP (pick and place) process by increasing the thickness of the support layer in the light-emitting device package, and a display device using the same.
[0013] Furthermore, according to other embodiments of the present invention, those skilled in the art will understand from the entire context of the specification and drawings that there may be additional technical problems not mentioned herein.
[0014] A light-emitting element package according to one embodiment of the present disclosure may include: a first layer having a terminal portion and a first width; a second layer having a light-emitting portion including light-emitting elements forming a unit subpixel, located adjacent to the first layer; a connecting electrode located between the first layer and the second layer, selectively connecting the light-emitting elements and the terminal portion and having a metal pattern shape; and a third layer located adjacent to the second layer, having a light-regulating layer on the edge side and a second width greater than the first width.
[0015] A display device according to one aspect of the present disclosure comprises: a substrate; a first electrode and a second electrode partitioned on the substrate; a black matrix layer defining a unit pixel area on the first electrode and the second electrode; and a light-emitting element package mounted on the first electrode and the second electrode within the unit pixel area, wherein the light-emitting element package comprises a light-blocking layer located on the edge side, and the light-blocking layer may overlap at least partially with the black matrix layer.
[0016] A display device according to one aspect of the present disclosure comprises: a substrate; a first electrode and a second electrode partitioned on the substrate; a black matrix layer defining a unit pixel area on the first electrode and the second electrode; and a light-emitting element package mounted on the first electrode and the second electrode within the unit pixel area, wherein the light-emitting element package comprises a color layer located on the edge side, and the color layer may overlap at least partially with the black matrix layer.
[0017] According to one embodiment of the present invention, the following effects are achieved.
[0018] First, according to an embodiment of the present disclosure, reflection by a metallic material such as a connecting electrode and a terminal portion is minimized and the light emission of the light-emitting element is maximized to achieve a high contrast ratio. Accordingly, a high-efficiency light-emitting element package and a display device can be realized.
[0019] In addition, according to an embodiment of the present disclosure, it is not necessary to perform a so-called black side fill (BSF) process, which involves covering the sides of a light-emitting element package with a black layer to improve contrast ratio after mounting the light-emitting element package on a wiring substrate. Accordingly, the post-processing step in the manufacturing process of a display device can be simplified.
[0020] Such a BSF process is a process for covering the side of a support layer, which occupies a large portion of the thickness of a light-emitting device package. However, according to the present disclosure, since such a BSF process is not required, the factors causing brightness reduction can be reduced even if the thickness of the support layer increases. Therefore, a stable PnP (pick and place) process can be performed by increasing the thickness of the support layer. Accordingly, damage to the light-emitting device package can be prevented.
[0021] Meanwhile, according to an embodiment of the present disclosure, the light blocking layer can be applied as a pattern mask for patterning the scattering layer, thereby reducing the number of processes and process costs.
[0022] Furthermore, according to another embodiment of the present invention, there are additional technical effects not mentioned herein. Those skilled in the art will understand this from the full context of the specification and drawings.
[0023] FIG. 1 is a plan view showing a light-emitting element package according to a first embodiment of the present disclosure.
[0024] Figure 2 is a cross-sectional view along line a-a' of Figure 1, showing the state of being mounted on a wiring board.
[0025] Figure 3 is a cross-sectional view along line b-b' of Figure 1, showing the state of being mounted on a wiring board.
[0026] FIG. 4 is a cross-sectional view of a display device according to a first embodiment of the present disclosure.
[0027] FIGS. 5 to 8 are plan views showing light-emitting element packages according to variations of the first embodiment of the present disclosure.
[0028] Figure 9 is a schematic diagram illustrating the light blocking effect according to the gap between the light blocking layer and the electrode.
[0029] FIG. 10 is a cross-sectional view showing a light-emitting element package according to a second embodiment of the present disclosure.
[0030] FIGS. 11 to 16 are plan views showing light-emitting element packages according to variations of the second embodiment of the present disclosure.
[0031] FIG. 17 is a graph showing the transmittance when a blue color layer is used in the second embodiment of the present disclosure.
[0032] FIG. 18 is a graph showing the reflectance when a blue color layer is used in the second embodiment of the present disclosure.
[0033] FIG. 19 is a graph showing transmittance in the first embodiment of the present disclosure.
[0034] FIG. 20 is a graph showing the reflectance in the first embodiment of the present disclosure.
[0035] FIG. 21 is a schematic diagram showing the fabrication process of a light-emitting device package according to embodiments of the present disclosure.
[0036] Hereinafter, embodiments disclosed in this specification will be described in detail with reference to the attached drawings. Identical or similar components, regardless of drawing symbols, are assigned the same reference number, and redundant descriptions thereof will be omitted. The suffixes "module" and "part" used for components in the following description are assigned or used interchangeably solely for the ease of drafting the specification and do not inherently possess distinct meanings or roles. Furthermore, when describing the embodiments disclosed in this specification, detailed descriptions of related prior art are omitted if it is determined that such detailed descriptions could obscure the essence of the embodiments disclosed in this specification. Additionally, it should be noted that the attached drawings are intended only to facilitate understanding of the embodiments disclosed in this specification and should not be interpreted as limiting the technical concept disclosed in this specification.
[0037] Furthermore, for the convenience of explanation, each drawing is described, but it is also within the scope of the present invention that a person skilled in the art combines at least two drawings to implement other embodiments.
[0038] Furthermore, when elements such as layers, regions, or substrates are referred to as existing "on" other components, it can be understood that this means they exist directly on the other elements or that there may be an intermediate element between them.
[0039] The semiconductor light-emitting device mentioned in this specification is a concept that includes LEDs, micro LEDs, etc., and may be used interchangeably.
[0040]
[0041] FIG. 1 is a plan view showing a light-emitting element package according to a first embodiment of the present disclosure. FIG. 2 is a cross-sectional view taken along line a-a' of FIG. 1 showing a state mounted on a wiring board. FIG. 3 is a cross-sectional view taken along line b-b' of FIG. 1 showing a state mounted on a wiring board.
[0042] Referring to FIGS. 1 to 3, a light-emitting element package (200) according to the first embodiment may include a first layer (210; terminal layer) having terminal portions (211, 212, 213, 214), a second layer (220; light-emitting layer) located adjacent to the first layer (210) and including light-emitting elements (261, 262, 263; 260) forming a unit subpixel, and a third layer (230; support layer).
[0043] The first layer (210) and the second layer (220) may have a first width (W1), and the third layer (230) may have a second width (W2) that is larger than the first width (W1). This third layer (230) can support the entire structure during the fabrication process of the light-emitting device package (200). Therefore, the third layer (230) can be called a support layer. The third layer (230) may be located adjacent to the second layer (220) and may be provided with a light control layer (240).
[0044] Between the first layer (210) and the second layer (220), light-emitting elements (261, 262, 263) and terminal portions (211, 212, 213, 214) may be selectively connected, and a connecting electrode (271, 272, 273, 274) having a metal pattern shape may be provided.
[0045] The light control layer (240) may include a light-transmitting layer (241; hereinafter, the first light-transmitting layer) located on a first region (A1) where the light-emitting part (260) is located, and a light-blocking layer (250, 251) located in a part other than the first region (A1).
[0046] As an exemplary embodiment, the light blocking layer may include a first portion (250) located within a first width (W1) and a second portion (251) located across the first width (W1) and the second width (W2). For example, the second portion (251) may be located in an area that overlaps with terminal portions (211, 212, 213, 214).
[0047] For example, the light blocking layer may include a first portion (250) partially located within a first width (W1). For example, the first portion (250) may be located in a portion excluding the first region (A1) where the light-emitting part (260) is located within the first width (W1). That is to say, the first portion (250) may be located in a portion of the first width (W1) excluding the width corresponding to the first region (A1).
[0048] The first light-transmitting layer (241) located on the first region (A1) may contain first filler particles. These first filler particles may be dispersed and located within the first light-transmitting layer (241). These first filler particles may help extract light emitted from the light-emitting part (260) in the first region (A1).
[0049] Referring to FIG. 2, a light blocking layer may not be located in a portion (C) located outside the first width (W1) within the light control layer (240). This is because this portion (C) may not cause reflection of external light. For example, a second light-transmitting layer (242) may be included in this portion (C) located outside the first width (W1). The second light-transmitting layer (242) may correspond to the same location as portion C. This second light-transmitting layer (242) may be located at least partially in the portion of the second width (W2) excluding the first width (W1).
[0050] First filler particles may also be included in this second light-transmitting layer (242). These first filler particles may be dispersed and located within the second light-transmitting layer (242). These first filler particles may help extract light emitted from the light-emitting part (260) in an area that does not overlap with the terminal parts (211, 212, 213, 214).
[0051] As described above, the light blocking layer may include a first portion (250) located within a first width (W1) and a second portion (251) located across the first width (W1) and the second width (W2).
[0052] As an exemplary embodiment, referring to FIG. 2, the first portion (250) of the light blocking layer may be formed in a portion other than the first area corresponding to the light-emitting portion. For example, the second portion (251) of the light blocking layer may be located in an area that overlaps with the terminal portions (211, 212, 213, 214). This second portion (251) of the light blocking layer can prevent external light from being reflected by the terminal portions (211, 212, 213, 214). Meanwhile, the second portion (251) may have an opening (C) that does not overlap with the terminal portions (211, 212, 213, 214).
[0053] These light blocking layers (250, 251) can reduce external light reflection. Additionally, the light blocking layers (250, 251) can improve the contrast ratio of the light-emitting element package (200) by minimizing the required area. Furthermore, the efficiency of the display device (10) in which these light-emitting element packages (200) are used can be improved.
[0054] Referring to FIG. 2, the third layer (230; support layer) has a second width (W2) and may include a transparent layer (231) and a scattering layer (232) located adjacent to the transparent layer (231).
[0055] FIGS. 2 and 3 illustrate an example in which a light-emitting element package (200) is mounted on a wiring substrate (100) to form a display device (10). For example, the light-emitting element package (200) may be installed with terminal portions (211, 212, 213, 214) electrically connected to wiring electrodes (121, 122) arranged on a substrate (110). Here, the wiring electrodes (121, 122) are briefly shown. A black matrix layer (130) may be provided on the substrate (110) to reduce external light reflection and improve contrast ratio. At this time, at least a portion of the light blocking layer (250, 251) may overlap perpendicularly with the black matrix layer (130). A description of such a display device (10) will be given later with reference to FIG. 4.
[0056] For example, the light control layer (240) may be located within the transparent layer (231). For example, the transparent layer (231) may be located above and below the light control layer (240). Meanwhile, the scattering layer (232) may include a second filler particle.
[0057] Here, the refractive index of at least one of the first filler particle and the second filler particle may be 1.3 or higher. Hereinafter, as an exemplary embodiment, the first filler particle and the second filler particle are described as having the same characteristics.
[0058] For example, these filler particles may include multiple particles having a size in the nanometer (nm) or micrometer (㎛) range.
[0059] For example, the filler particles may include at least one of TiO2, ZnO2, ZrO2, MgF2, SnO2, ITO, SiNx, Silica, and PMMA.
[0060] The filler particles may be used for at least one of the purposes of improving the viewing angle to prevent color temperature deviation according to the light emission angle of the light-emitting part (260) in the scattering layer (232) and the light-transmitting layer (241, 242) and improving the reflectance.
[0061] The scattering layer (232) and the light-transmitting layer (241, 242) may include a transparent insulating layer. For example, at least one of the first layer (210) to the third layer (230) may be formed by at least one material selected from acrylic, epoxy, silicone, Teflon, silicone acrylic, and silicone epoxy composite.
[0062] For example, the scattering layer (232) and the light-transmitting layer (241, 242) may be provided with filler particles dispersed using such a material as a binder.
[0063] For example, the refractive index of the transparent insulating layer forming at least one of the first layer (210) to the third layer (230) may be 1.5 or less. Additionally, the refractive index of any one of the filler particles may be 1.6 or more. For example, the filler particles may include at least one of TiO2, ZnO2, and ZrO2.
[0064] As an exemplary embodiment, the first region (A1) may correspond to the location of at least one of the light-emitting elements (261, 262, 263). In this embodiment, the first region (A1) may correspond to a region that includes all of the light-emitting elements (261, 262, 263).
[0065] Meanwhile, the scattering layer (232) and the light-transmitting layer (241, 242) may not contain filler particles. In this case, the scattering layer (232) and the light-transmitting layer (241, 242) may have a scattering pattern.
[0066] Between the first layer (210) and the second layer (220), a connecting electrode (271, 272, 273, 274) that selectively connects light-emitting elements (261, 262, 263; 260) and terminal portions (211, 212, 213, 214) may be provided. A terminal portion (211, 212, 213, 214) may be located on the upper side of the first layer (210).
[0067] The first electrode (e.g., P-electrode; 264) and the second electrode (e.g., N-electrode; 265) of the light-emitting element (261, 262, 263; 260) can be electrically joined to the first connecting electrode (272) and the second connecting electrode (274) by solder, respectively.
[0068] At least one of these connection electrodes (271, 272, 273, 274) can be fabricated using a redistribution layer (RDL) process used in semiconductor packaging processes. Using such a redistribution layer (RDL) process, light-emitting elements (260) can be connected to the connection electrodes (271, 272, 273, 274).
[0069] The light-emitting element (260) may include a first light-emitting element (261), a second light-emitting element (262), and a third light-emitting element (263). For example, the first light-emitting element (261) may be a red light-emitting element (R), the second light-emitting element (262) may be a green light-emitting element (G), and the third light-emitting element (263) may be a blue light-emitting element (B). In some cases, at least one of the first light-emitting element (261), the second light-emitting element (262), and the third light-emitting element (263) may include two or more light-emitting elements.
[0070] When the light-emitting element package (200) is used in a display device (10), each of the first light-emitting element (261), the second light-emitting element (262), and the third light-emitting element (263) may correspond to an individual subpixel. The first light-emitting element (261), the second light-emitting element (262), and the third light-emitting element (263) may together form a unit pixel.
[0071] The light-emitting element (260) may be a mini LED with a size in millimeters or a micro LED with a size in micrometers.
[0072] Although not illustrated, the light-emitting element package (200) may further be provided with a driving element for driving light-emitting elements (261, 262, 263; 260). The driving element may be a micro-driver integrated circuit chip (Driver IC) capable of selectively driving the light-emitting elements (260). In this case, the driving element may be connected to at least one of the light-emitting elements (261, 262, 263) and the connecting electrodes (271, 272, 273, 274). A detailed description thereof is omitted.
[0073] As the overall size of the light-emitting element (261, 262, 263), such as a micro LED, decreases, the side light-emitting amount has a proportion that cannot be ignored compared to the front light-emitting amount. The angle of incidence of light can be adjusted by changing the shape and side angle of the micro LED chip for the purpose of changing the light path of the side light-emitting element (261, 262, 263) to the front.
[0074] Meanwhile, at least a portion of the metal pattern shape of the connecting electrodes (271, 272, 273, 274) may be provided with a connecting portion (280) that connects at least a portion between the first layer (210) and the second layer (220) and between the first layer (210) and the third layer (230).
[0075] FIG. 1 illustrates an example in which a coupling portion (280) is provided on the metal pattern shape of a single connecting electrode (274), but a coupling portion (280) may be provided on all or part of the metal pattern shapes of four connecting electrodes (271, 272, 273, 274) (see FIG. 6 and FIG. 7). Alternatively, the number of coupling portions (280) may differ from each connecting electrode (271, 272, 273, 274). For example, a larger number of coupling portions (280) may be provided on the connecting electrode (274) acting as a common electrode.
[0076] The connecting portion (280) may include an opening (280) formed in the metal pattern shape forming the connecting electrodes (271, 272, 273, 274) and opened so that the first layer (210) and the second layer (220) come into contact. Hereinafter, the connecting portion and the opening are described using the same reference numerals. Here, for example, the opening (280) may have a hole shape.
[0077] Referring to FIG. 1, the first layer (210) can penetrate the second layer (220) and come into contact with the second layer (220) through such an opening (280). Such a bonding part (280) or an opening (280) can increase the bonding strength of at least some of the first layer (210) to the third layer (230). For example, it can increase the adhesive strength between the first layer (210) and the second layer (220).
[0078] In this way, the first layer (210) can penetrate at least a portion of the second layer (220) through the opening (280). For example, the first layer (210) can penetrate the entire second layer (220) through the opening (280) and come into contact with the third layer (230).
[0079]
[0080] FIG. 4 is a cross-sectional view of a display device according to a first embodiment of the present disclosure.
[0081] Referring to FIG. 4, an example is illustrated in which a light-emitting element package (200) is mounted on a wiring substrate (100) to form a display device (10), similar to FIG. 2 and FIG. 3. FIG. 4 shows a cross-section of another part of the light-emitting element package (200). FIG. 4 also mainly shows the relative positions of the light-emitting element package (200) and the wiring substrate (100).
[0082] Referring to FIG. 4, the connecting electrodes (271, 272, 273, 274) of the light-emitting element package (200) may include a through-connecting portion (270) connected to the terminal portions (211, 212, 213, 214). For example, each connecting electrode (271, 272, 273, 274) may be connected to the terminal portions (211, 212, 213, 214) through the through-connecting portion (270). This through-connecting portion (270) may be positioned through the first layer (210). This through-connecting portion (270) may have a slanted electrode shape.
[0083] As mentioned above, for example, a light-emitting element package (200) may be installed with terminal portions (211, 212, 213, 214) electrically connected to wiring electrodes (121, 122) arranged on a substrate (110). Here, the wiring electrodes (121, 122) are briefly shown. A black matrix layer (130) may be provided on the substrate (110) to reduce external light reflection and improve contrast ratio. At this time, at least a portion of the light blocking layer (250, 251) may overlap perpendicularly with the black matrix layer (130).
[0084] For example, a display device (10) may be configured such that light-emitting element packages (200) forming unit pixels are arranged on a wiring board (100).
[0085] A wiring substrate (100) may include a substrate (110), a first electrode (121) and a second electrode (122) partitioned on the substrate (110), and a black matrix layer (130) defining a unit pixel area on the first electrode (121) and the second electrode (122).
[0086] Here, the first electrode (121) and the second electrode (122) are briefly described, but may each include a pad electrically connected to each terminal part (211, 212, 213, 214).
[0087] The first electrode (121) and the second electrode (122) can be electrically connected by the terminal portions (211, 212, 213, 214) and solder (140).
[0088] As described above, the light-emitting device package (200) may include a light-blocking layer (250, 251) located on the edge side. This light-blocking layer (250, 251) may overlap at least partially with the black matrix layer (130). For example, the light-blocking layer (250, 251) may overlap with the black matrix layer (130) by a third width (D1). For example, the second portion (251) of the light-blocking layer located across the first width (W1) and the second width (W2) may have a fourth width (D2). In this case, the width or area corresponding to the third width (D1) located within the fourth width (D2) may overlap with the black matrix layer (130).
[0089] As described above, the light-emitting element package (200) may be provided with a light-emitting portion (260) comprising light-emitting elements (261, 262, 263) forming a unit subpixel, and a light-emitting layer (220) having a first width (W1). A terminal layer (210) having terminal portions (211, 212, 213, 214) may also have a first width (W1). For example, the terminal layer (210) and the light-emitting layer (220) may have a first width (W1).
[0090] Meanwhile, the light-emitting element package (200) may include a support layer (230) that is located adjacent to the light-emitting layer (220) and has a second width (W2) larger than the first width (W1) and is equipped with a light-blocking layer (250, 251).
[0091] Referring to FIG. 4, the terminal layer (210) and the light-emitting layer (220) having a first width (W1) may be located within a unit pixel area defined by the black matrix layer (130). Meanwhile, the support layer (230) having a second width (W2) may be located outside the unit pixel area defined by the black matrix layer (130).
[0092] According to an embodiment of the present disclosure, after mounting the light-emitting element package (200) on the wiring substrate (100), it is not necessary to perform a so-called black side fill (BSF) process, which covers the side of the light-emitting element package (200) with a black layer to improve the contrast ratio. Accordingly, the post-processing step in the manufacturing process of the display device (10) can be simplified.
[0093] Such a BSF process is a process for covering the side of the support layer (230), which occupies a large portion of the thickness of the light-emitting device package (200). However, according to the present disclosure, since such a BSF process is not required, the factor causing brightness reduction can be reduced even if the thickness of the support layer (230) increases. Therefore, a stable PnP (pick and place) process can be performed by making the thickness of the support layer (230) thicker. Accordingly, damage to the light-emitting device package (200) can be prevented.
[0094] Meanwhile, the light blocking layer (250, 251) can be applied as a pattern mask for patterning the scattering layer (241, 242), so that the number of processes and process costs can be reduced.
[0095] According to the embodiments of the present disclosure, reflection by metal materials such as connecting electrodes and terminal portions is minimized and light emission by the light-emitting element is maximized to achieve a high contrast ratio, thereby enabling the realization of a high-efficiency light-emitting element package and display device.
[0096]
[0097] FIGS. 5 to 8 are plan views showing light-emitting element packages according to variations of the first embodiment of the present disclosure.
[0098] Figures 5 to 8 briefly illustrate various variations of a light-emitting device package, focusing on the arrangement of the light-blocking layer and the light-emitting part.
[0099] Referring to FIG. 5, according to the embodiment, a light blocking layer (252) may also be located in a portion (C) located in a part other than the first width (W1) within the light control layer (240). That is, unlike the embodiment described above, a light blocking layer (252) may also be located in a portion (C) located in a part other than the first width (W1) within the light control layer (240).
[0100] In other words, in the embodiment described above, a light blocking layer (252) may be located in the portion where the second light-transmitting layer (242) is located. In the embodiment described above, the second light-transmitting layer (242) may be located in the portion that does not overlap with the terminal portions (211, 212, 213, 214) without the light blocking layer (250). However, in some cases, for the simplification of the process, a light blocking layer (252) may be located in the portion that does not overlap with the terminal portions (211, 212, 213, 214).
[0101] Referring to FIG. 6, the light-emitting element package may include light-emitting elements (264, 265, 266; 260) forming unit subpixels located adjacent to each other.
[0102] The light-emitting part including these light-emitting elements (264, 265, 266) can have a relatively small area compared to the first embodiment described above.
[0103] Referring to FIG. 6, a state is illustrated in which a light blocking layer (253, 254) covering an area excluding the light-emitting part is provided. In this way, the light-emitting element package illustrated in FIG. 6 may have a first part (253) located in a portion excluding the first region (A1) where the light-emitting part (260) is located.
[0104] At this time, similar to the case of FIG. 5, a light blocking layer (254) may also be located in a portion that does not overlap with the terminal portions (211, 212, 213, 214).
[0105] For example, in the light-emitting device package illustrated in FIG. 7, the light-blocking layer may have a first part (253) located in a portion excluding the first region (A1) where the light-emitting part (260) is located.
[0106] Meanwhile, referring to FIG. 7, unlike the embodiment described in FIG. 6, the portion (C) that does not overlap with the terminal portions (211, 212, 213, 214) may be provided with an open light blocking layer (255).
[0107] In this way, a scattering layer may be located in the portion (C) that does not overlap with the terminal portions (211, 212, 213, 214). Light emitted from the light-emitting portion (260) can be extracted through this scattering layer, thereby improving the light extraction efficiency.
[0108] Referring to FIG. 8, the light blocking layer is similar to the case of the first embodiment described above, but the first part (256) may be located in a part excluding the first region (A1) where the light-emitting part (260) is located, and the first part (256) may be partially provided with a hole (267) pattern.
[0109]
[0110] Figure 9 is a schematic diagram illustrating the light blocking effect according to the gap between the light blocking layer and the electrode.
[0111] As described above, for example, a light-emitting element package (200) may be installed with terminal portions (211, 212, 213, 214) electrically connected to wiring electrodes (121, 122) arranged on a substrate (110). A black matrix layer (130) may be provided on the substrate (110) to reduce external light reflection and improve contrast ratio. At this time, at least a portion of the light blocking layer (250, 251) may be superimposed in a vertical direction with respect to the black matrix layer (130).
[0112] A light-emitting element package (200) may be provided with a light-emitting portion (260) comprising light-emitting elements (261, 262, 263) forming a unit subpixel, and a light-emitting layer (220) having a first width (W1). A terminal layer (210) having terminal portions (211, 212, 213, 214) may also have a first width (W1). For example, the terminal layer (210) and the light-emitting layer (220) may have a first width (W1).
[0113] Meanwhile, the light-emitting element package (200) may include a support layer (230) that is located adjacent to the light-emitting layer (220) and has a second width (W2) larger than the first width (W1) and is equipped with a light-blocking layer (250, 251).
[0114] According to the embodiments described above, the terminal layer (210) and the light-emitting layer (220) having a first width (W1) may be located within a unit pixel area defined by the black matrix layer (130). Meanwhile, the support layer (230) having a second width (W2) may be located outside the unit pixel area defined by the black matrix layer (130).
[0115] However, in some cases, the width (second width; W2) of the support layer (230) may not be larger than the unit pixel area defined by the black matrix layer (130).
[0116] Even in such cases, if the gap between the light control layer (240) and the black matrix layer (130) is sufficient, reflection by metal materials such as connecting electrodes and terminals can be reduced. For example, if the distance between the light blocking layer (251) and the first electrode (121) or the second electrode (122) is large, a significant portion of the light reflected from the first electrode (121) or the second electrode (122) can be blocked by the light blocking layer (251).
[0117] For example, as in (a) of FIG. 9, if the electrode (12) and the light blocking layer (25) are adjacent to each other, light is reflected at the opening of the light blocking layer (25), and the effect of improving the contrast ratio may be limited.
[0118] However, as in the case of FIG. 9 (b), if the distance between the light blocking layer (251) and the first electrode (121) or the second electrode (122) is large, the opening acts substantially narrowly depending on the angle of incidence of light, so that a significant portion of the reflected light can be blocked by the light blocking layer (251).
[0119] For example, referring to FIG. 4, if the vertical gap (G) between the light control layer (240) and the black matrix layer (130) is greater than the thickness of the light control layer (240), a sufficient contrast ratio improvement effect can be achieved.
[0120]
[0121] FIG. 10 is a cross-sectional view showing a light-emitting element package according to a second embodiment of the present disclosure.
[0122] Referring to FIG. 10, a light-emitting element package (201) according to a second embodiment may include a first layer (210; terminal layer) having terminal portions (211, 212, 213, 214), a second layer (220; light-emitting layer) located adjacent to the first layer (210) and including light-emitting elements (261, 262, 263; 260) forming a unit subpixel, and a third layer (230; support layer).
[0123] As with the first embodiment, the first layer (210) and the second layer (220) may have a first width (W1), and the third layer (230) may have a second width (W2) greater than the first width (W1). This third layer (230) can support the entire structure during the fabrication process of the light-emitting device package (200). Therefore, the third layer (230) may be called a support layer. The third layer (230) may be located adjacent to the second layer (220) and may be provided with a light control layer (240).
[0124] The light control layer (240) may include a light-transmitting layer (241; hereinafter, the first light-transmitting layer) located on a first region (A1) where the light-emitting part (260) is located, and a color layer (290) located in a part other than the first region (A1).
[0125] The first light-transmitting layer (241) located on the first region (A1) may contain first filler particles. These first filler particles may be dispersed and located within the first light-transmitting layer (241). These first filler particles may help extract light emitted from the light-emitting part (260) in the first region (A1).
[0126] For example, the color layer (290) may have a color corresponding to at least one of the colors of light emitted from the light-emitting elements (261, 262, 263). For example, the color layer (290) may have a color corresponding to the blue light-emitting element (263). That is, for example, the color layer (290) may have a blue color.
[0127] In an exemplary embodiment, the color layer (290) may be implemented using a color filter (CF). Such a color filter may be a pigment-based or dye-based photoresist typically used for displays. However, the present disclosure is not limited thereto and may be implemented in various ways, such as using color dyes, color films, etc.
[0128] In this way, the color layer (290) may be located in a portion of the area of the light-emitting element package (200), for example, the area (area) of the second layer (220; light-emitting layer). For example, the color layer (290) may be located in an area where one or two light-emitting elements (261, 262, 263) are located. For example, the color layer (290) may have an area corresponding to 1 / 4 to 3 / 4 of the area of the second layer (220).
[0129] As an exemplary embodiment, at least a portion of the color layer (290) may be positioned overlapping with the light-emitting elements (261, 262, 263). As another example, the color layer (290) may be positioned adjacent to the light-emitting elements (261, 262, 263).
[0130] For example, the color layer (290) may be used together with the light blocking layer (250, 251). For example, the color layer (290) may be provided overlapping the light blocking layer (250, 251). As another example, the color layer (290) may be provided adjacent to the light blocking layer (250, 251).
[0131] As described above, the light-emitting element (261, 262, 263) may be a mini LED having a size in millimeters or a micro LED having a size in micrometers.
[0132] Due to the small size of the LED light source, the light-emitting element package (200) can be used in high-resolution signage displays with a pitch of 1 mm or less. At pitches greater than this, a large-area mini LED light source capable of handling high current density may have an advantage.
[0133] In the case of light-emitting element packages used in display devices with a size of approximately 0.4 mm, the area occupied by the light source within the total display area is large, making black treatment inside the package essential. In a black side fill (BSF) structure that fills the sides of the light source with a black layer capable of achieving the simplest yet lowest reflectivity, a decrease in the efficiency of the light source is inevitable.
[0134] However, in the present disclosure, a color layer (290) is implemented within the light-emitting element package (200) to optimize the relationship between the efficiency and reflectance of the light-emitting element package (200).
[0135] In this second embodiment, parts other than the color layer (290) may be the same as those described above in the first embodiment. Therefore, redundant descriptions are omitted.
[0136]
[0137] FIGS. 11 to 16 are plan views showing light-emitting element packages according to variations of the second embodiment of the present disclosure.
[0138] Figures 11 to 16 briefly illustrate various variations of the light-emitting element package, focusing on the arrangement of the color layer and the light-emitting part.
[0139] First, referring to FIG. 11, a first color layer (291) provided in overlap with the area where the blue light-emitting element (263) is located, and a second color layer (290) provided in a portion other than the area occupied by the light-emitting part (260) may be used. In some cases, the second color layer (290) may have a darker color than the first color layer (291). For example, the second color layer (290) may act as a light-blocking layer.
[0140] Referring to FIG. 12, a third color layer (293) may be provided that overlaps with the area where the blue light-emitting element (263) is located. This third color layer (293) may have an area that is more expanded than the first color layer (291) within the area occupied by the light-emitting part (260). For example, the third color layer (293) may be located in an area other than the surrounding area of the red light-emitting element (261) and the blue light-emitting element (262).
[0141] Meanwhile, a fourth color layer (292) provided in a portion other than the area occupied by the light-emitting portion (260) may be used. This fourth color layer (292) may be implemented in blue. For example, the fourth color layer (292) may have a lighter color than the third color layer (293).
[0142] Referring to FIG. 13, a first color layer (291) provided in overlap with the area where the blue light-emitting element (263) is located, a fifth color layer (295) provided in overlap with the area where the red light-emitting element (261) is located, and a sixth color layer (294) provided in a portion other than the area occupied by the light-emitting part (260) may be used.
[0143] Here, the sixth color layer (294) may have a color that is a mixture of blue and red. For example, the sixth color layer (294) may be implemented by overlapping the first color layer (291) and the fifth color layer (295).
[0144] FIGS. 14 to 16 show examples of color layers (296, 297, 298) located adjacent to and not overlapping with the light-emitting element.
[0145] First, referring to FIG. 14, a sixth color layer (296) provided adjacent to the area where the blue light-emitting element (263) is located, without overlapping with it, and a second color layer (290) provided in a portion other than the area occupied by the light-emitting part (260) may be used. In some cases, the second color layer (290) may have a darker color than the first color layer (291). For example, the second color layer (290) may act as a light-blocking layer.
[0146] Referring to FIG. 15, a seventh color layer (297) may be provided adjacent to the area where the blue light-emitting element (263) is located. This seventh color layer (297) may have an area that is more expanded than the sixth color layer (296) within the area occupied by the light-emitting part (260). For example, the seventh color layer (297) may be located in an area other than the surrounding area of the red light-emitting element (261) and the blue light-emitting element (262).
[0147] Meanwhile, a fourth color layer (292) provided in a portion other than the area occupied by the light-emitting portion (260) may be used. This fourth color layer (292) may be implemented in blue. For example, the fourth color layer (292) may have a lighter color than the third color layer (293).
[0148] Referring to FIG. 16, a seventh color layer (297) provided adjacent to the area where the blue light-emitting element (263) is located, an eighth color layer (298) provided adjacent to the area where the red light-emitting element (261) is located, and a sixth color layer (294) provided in a portion other than the area occupied by the light-emitting part (260) may be used.
[0149] Here, the sixth color layer (294) may have a color that is a mixture of blue and red. For example, the sixth color layer (294) may be implemented by overlapping the first color layer (291) and the fifth color layer (295).
[0150]
[0151] FIG. 17 is a graph showing transmittance when a blue color layer is used in the second embodiment of the present disclosure. FIG. 18 is a graph showing reflectance when a blue color layer is used in the second embodiment of the present disclosure. FIG. 19 is a graph showing transmittance in the first embodiment of the present disclosure. FIG. 20 is a graph showing reflectance in the first embodiment of the present disclosure.
[0152] FIG. 17 shows the transmittance when the blue color layer (B CF) is used alone in the second embodiment of the present disclosure. FIG. 17 also shows the transmittance when at least one of the blue color layer (B CF), the scattering layer (232), and the light-transmitting layer (241, 242) is used (B CF + scattering).
[0153] Referring to FIG. 17, it can be seen that the transmittance increases when at least one of the blue color layer (B CF), scattering layer (232), and light-transmitting layer (241, 242) is used together in the blue wavelength band (peak wavelength approximately 450 nm).
[0154] Referring to FIG. 18, the reflectance is shown when a blue color layer (B CF) and filler particles (Ti) are used in the second embodiment of the present disclosure. FIG. 18 also shows the reflectance when at least one of the blue color layer (B CF), scattering layer (232), and light-transmitting layer (241, 242) is used together with filler particles (Ti) (B CF + scattering).
[0155] Referring to Fig. 18, it can be seen that the reflectance increases significantly when the color layer is used in the blue wavelength band (peak wavelength approximately 450 nm).
[0156] Meanwhile, referring to FIG. 19, the transmittance is shown when the light blocking layer (BM) is used alone in the first embodiment of the present disclosure. Also, FIG. 20 shows the transmittance when at least one of the light blocking layer (BM), the scattering layer (232), and the light transmitting layer (241, 242) is used (BM + scattering).
[0157] Referring to FIG. 20, the reflectance is shown when a light blocking layer (BM) and filler particles (Ti) are used in the first embodiment of the present disclosure. FIG. 20 also shows the reflectance when at least one of the light blocking layer (BM), scattering layer (232), and light-transmitting layer (241, 242) is used together with filler particles (Ti) (B CF + scattering).
[0158] Referring to Figure 20, it can be seen that when a light blocking layer is used, the reflectance remains low in most wavelength bands and increases at long wavelengths above red.
[0159] Considering this data, it is desirable for the scattering layer to have a structure that overlaps at least behind the light-emitting surface compared to the color layer, or does not overlap at all.
[0160] In particular, it can be seen that scattering reflection increases when the scattering layer is superimposed on the color layer. Meanwhile, it can be seen that using a pigment for the color layer does not significantly change external light reflection even when overlapping with the scattering layer, thus contributing to improved efficiency.
[0161]
[0162] FIG. 21 is a schematic diagram showing the fabrication process of a light-emitting device package according to embodiments of the present disclosure.
[0163] FIG. 21 shows a process of separating into individual packages during the manufacturing process of a light-emitting device package (200).
[0164] As described above, according to embodiments of the present disclosure, the first layer (210) and the second layer (220) may have a first width (W1), and the third layer (230) may have a second width (W2) greater than the first width (W1). This third layer (230) may support the entire structure during the fabrication process of the light-emitting device package (200). The third layer (230) may be located adjacent to the second layer (220) and may be provided with a light control layer (240).
[0165] When having such a structure, the blade (300; or laser) that separates individual packages from the wide third layer (230) comes into contact, so there is an advantage in securing a process margin.
[0166] For example, a certain width (W3) exists at the part where individual packages (200) are connected, and since a light blocking layer (250, 251) exists at this part, high precision may not be required in the separation process. Accordingly, a process margin can be secured in the separation process of individual packages.
[0167]
[0168] The above description is merely an illustrative explanation of the technical concept of the present invention, and those skilled in the art to which the present invention pertains will be able to make various modifications and variations within the scope of the essential characteristics of the present invention.
[0169] Accordingly, the embodiments disclosed in this invention are intended to explain, not limit, the technical concept of the invention, and the scope of the technical concept of the invention is not limited by these embodiments.
[0170] The scope of protection of the present invention shall be interpreted by the claims below, and all technical ideas within an equivalent scope shall be interpreted as being included within the scope of rights of the present invention.
[0171] According to the present disclosure, a light-emitting element package using a light-emitting element and a display device using the same can be provided.
Claims
1. A first layer having a terminal portion and a first width; A second layer having a light-emitting portion located adjacent to the first layer and including light-emitting elements forming a unit subpixel; A connecting electrode positioned between the first layer and the second layer, selectively connecting the light-emitting elements and the terminal portion, and having a metal pattern shape; and A third layer located adjacent to the second layer and having a light control layer on the edge side and having a second width greater than the first width. Light-emitting element package.
2. In claim 1, the light-regulating layer A light-transmitting layer located on a first region where the light-emitting part is located; and A light-blocking layer located in a portion other than the first region above. Light-emitting element package.
3. In paragraph 2, the light-transmitting layer comprises a first filler particle. Light-emitting element package.
4. In paragraph 2, the light-blocking layer A first portion located within the first width; and including a second portion located across the first width and the second width. Light-emitting element package.
5. In paragraph 4, the second part overlaps with the terminal part Light-emitting element package.
6. In paragraph 4, the second part has an open portion that does not overlap with the terminal portion. Light-emitting element package.
7. In paragraph 1, the third layer Transparent layer; and A scattering layer located adjacent to the above transparent layer Light-emitting element package.
8. In claim 7, the light-regulating layer is located within the transparent layer. Light-emitting element package.
9. In claim 1, the light-regulating layer A light-transmitting layer located on a first region where the light-emitting part is located; and A color layer located in an area other than the first region mentioned above. Light-emitting element package.
10. In claim 9, the color layer has a color corresponding to at least one of the colors of light emitted from the light-emitting element. Light-emitting element package.
11. Substrate; A first electrode and a second electrode partitioned on the substrate; A black matrix layer defining a unit pixel area on the first electrode and the second electrode; and It includes a light-emitting element package mounted on the first electrode and the second electrode within the unit pixel area, and The light-emitting device package includes a light-blocking layer located on the edge side, and the light-blocking layer overlaps at least partially with the black matrix layer. Display device.
12. In claim 11, the light-emitting element package is A light-emitting layer having a first width and a light-emitting portion comprising light-emitting elements forming a unit subpixel; and A support layer having a light-blocking layer located adjacent to the second layer and having a second width greater than the first width, comprising Display device.
13. In claim 11, the vertical gap between the light-blocking layer and the black matrix layer is greater than the thickness of the light-blocking layer. Display device.
14. In Clause 12, the light-blocking layer A first part located within the above first width; including a second portion located across the first width and the second width. Display device.
15. Substrate; A first electrode and a second electrode partitioned on the substrate; A black matrix layer defining a unit pixel area on the first electrode and the second electrode; and It includes a light-emitting element package mounted on the first electrode and the second electrode within the unit pixel area, and The light-emitting element package includes a color layer located on the edge side, and the color layer overlaps at least partially with the black matrix layer. Display device.
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