Positioning system to enable a soft landing for replaceable edge rings in a plasma processing system

Abstract

A positioning system for an edge ring of a plasma processing system includes an arm assembly including an arm support and M lower arms extending radially outwardly from the arm support, where M is an integer greater than two. M upper arms are attached to and extend upwardly from radially outer ends of the M lower arms. M orientation lock sleeves are connected to upper ends of the M upper arms. M lift pins are connected to the M orientation lock sleeves and configured to raise and lower the edge ring.

Description

Attorney Docket No. 11883-1 WOHDP Ref. No. 15545-001289-WO-POAPOSITIONING SYSTEM TO ENABLE A SOFT LANDING FOR REPLACEABLE EDGE RINGS IN A PLASMA PROCESSING SYSTEMCROSS REFERENCE TO RELATED APPLICATIONS

[0001] This application claims the benefit of U.S. Provisional Application No. 63 / 696,915, filed on September 20, 2024. The entire disclosure of the application referenced above is incorporated herein by reference.FIELD

[0002] The present disclosure relates to substrate processing systems, and more particularly to a positioning system to enable a soft landing for edge rings in a plasma processing system.BACKGROUND

[0003] The background description provided here is for the purpose of generally presenting the context of the disclosure. Work of the presently named inventors, to the extent it is described in this background section, as well as aspects of the description that may not otherwise qualify as prior art at the time of filing, are neither expressly nor impliedly admitted as prior art against the present disclosure.

[0004] Substrate processing systems may be used to treat substrates such as semiconductor wafers. The substrate treatments may include deposition, etching, cleaning, and / or other treatments. During processing, a substrate is arranged on a substrate support in a processing chamber of the substrate processing system. Gas mixtures are introduced into the processing chamber using a gas delivery device. In some processes, radio frequency (RF) plasma may be used to initiate chemical reactions.SUMMARY

[0005] A positioning system for an edge ring of a plasma processing system includes an arm assembly including an arm support and M lower arms extending radially outwardly from the arm support, where M is an integer greater than two. M upper arms are attached to and extend upwardly from radially outer ends of the M lower arms. M orientation lockAttorney Docket No. 11883-1 WOHDP Ref. No. 15545-001289-WO-POA sleeves are connected to upper ends of the M upper arms. M lift pins are connected to the M orientation lock sleeves and configured to raise and lower the edge ring.

[0006] In other features, the M orientation lock sleeves include an upper portion and a lower portion. One of the upper portion and the lower portion includes a notch and the other of the upper portion and the lower portion includes a projection received by the notch. M fasteners are configured to attach and fix M angular orientations of the M upper arms relative to the M lower arms, respectively. The M lift pins include a first “L”-shaped portion and a second “L”-shaped portion extending inwardly from a radially inner end of the first “L”-shaped portion.

[0007] In other features, the M lift pins include a first “L”-shaped portion including a vertical portion extending in an axial direction and a horizontal portion extending radially inwardly from the vertical portion. The horizontal portion of the first “L”-shaped portion has a trapezoidal cross section. The horizontal portion of the first “L”-shaped portion includes angled side walls arranged at an acute angle relative to an axial direction.

[0008] In other features, the arm support includes a cylindrical portion. The M lower arms extend radially outwardly from the cylindrical portion. An arm control system comprises a pressure control valve configured to receive gas from a gas supply and to provide a predetermined pressure at an outlet thereof, a pressure actuator configured for arrangement between the arm assembly and a substrate support, and a valve configured to selectively connect an output of the pressure control valve to the pressure actuator.

[0009] In other features, one or more restricted orifices are arranged between the pressure actuator and the valve. The one or more restricted orifices include a first restricted orifice fluidly connected to the valve, a second restricted orifice fluidly connected between the first restricted orifice and the pressure actuator, and a check valve in parallel with the second restricted orifice.

[0010] In other features, the pressure actuator is in a raised position when pressure from the valve is not supplied. The pressure actuator includes a bellows actuator.

[0011] A substrate processing system includes a substrate support, an edge ring system arranged around the substrate support, and the positioning system. The edge ring system includes a top edge ring and a middle edge ring arranged below the top edge ring. The M lift pins raise and lower the middle edge ring and the top edge ring at the same time.Attorney Docket No. 11883-1 WOHDP Ref. No. 15545-001289-WO-POA

[0012] In other features, the edge ring system includes an outer ring arranged radially outside of the middle edge ring and the top edge ring. The outer ring includes M horizontal slots configured to receive a horizontal portion of the M lift pins. The M horizontal slots include first angled side walls. The horizontal portion of the M lift pins includes second angled side walls, wherein the first angled side walls and the second angled side walls are configured to self-center the M lift pins.

[0013] A positioning system for an edge ring of a plasma processing system includes an arm assembly including M lift pins that are spaced 360Q / M and configured to lift one or more edge rings, where M is an integer greater than two. An arm control system comprises a pressure control valve configured to receive gas from a gas supply and to provide a predetermined pressure at an outlet thereof, a pressure actuator configured for arrangement between the arm assembly and a substrate support, and a valve configured to selectively connect an output of the pressure control valve to the pressure actuator to lift the arm assembly.

[0014] In other features, one or more restricted orifices are arranged between the pressure actuator and the valve. The one or more restricted orifices include a first restricted orifice fluidly connected to the valve, a second restricted orifice fluidly connected between the first restricted orifice and the pressure actuator, and a check valve in parallel with the second restricted orifice.

[0015] In other features, the pressure actuator is in a raised position when pressure from the valve is not supplied. The pressure actuator includes a bellows actuator. The arm assembly includes an arm support, M lower arms extending radially outwardly from the arm support, where M is an integer greater than two, and M upper arms attached to and extending upwardly from radially outer ends of the M lower arms.

[0016] In other features, the arm assembly includes M orientation lock sleeves connected to upper ends of the M upper arms. The M lift pins are connected to the M orientation lock sleeves and configured to raise and lower the edge ring.

[0017] In other features, the M orientation lock sleeves include an upper portion and a lower portion. One of the upper portion and the lower portion includes a notch and the other of the upper portion and the lower portion includes a projection received by the notch. M fasteners are configured to attach and fix M angular orientations of the M upper arms relative to the M lower arms, respectively. The M lift pins include a first “L”-shaped portion and a second “L”-shaped portion extending inwardly from a radially inner end ofAttorney Docket No. 11883-1 WOHDP Ref. No. 15545-001289-WO-POA the first “L”-shaped portion. The M lift pins include a first “L”-shaped portion including a vertical portion extending in an axial direction and a horizontal portion extending radially inwardly from the vertical portion.

[0018] In other features, the horizontal portion of the first “L”-shaped portion has a trapezoidal cross section. The horizontal portion of the first “L”-shaped portion includes angled side walls arranged at an acute angle relative to an axial direction. The arm support includes a cylindrical portion. The M lower arms extend radially outwardly from the cylindrical portion.

[0019] A substrate processing system includes a substrate support, an edge ring system arranged around the substrate support, and the positioning system. The edge ring system includes a top edge ring and a middle edge ring arranged below the top edge ring. The M lift pins raise and lower the middle edge ring and the top edge ring at the same time.

[0020] In other features, the edge ring system includes an outer ring arranged radially outside of the middle edge ring and the top edge ring. The outer ring includes M horizontal slots configured to receive a horizontal portion of the M lift pins. The M horizontal slots include first angled side walls. The horizontal portion of the M lift pins includes second angled side walls. The first angled side walls and the second angled side walls are configured to self-center the M lift pins.

[0021] Further areas of applicability of the present disclosure will become apparent from the detailed description, the claims, and the drawings. The detailed description and specific examples are intended for purposes of illustration only and are not intended to limit the scope of the disclosure.BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The present disclosure will become more fully understood from the detailed description and the accompanying drawings, wherein:

[0023] FIG. 1 is a functional block diagram of an example of a plasma processing system including a substrate support and a positioning system for enabling a soft landing of one or more edge rings according to the present disclosure;

[0024] FIG. 2A is a perspective view of an example of a substrate support surrounded by one or more edge rings and an arm assembly for actuating M lift pins at the same time to raise and / or lower the one or more edge rings according to the present disclosure;Attorney Docket No. 11883-1 WOHDP Ref. No. 15545-001289-WO-POA

[0025] FIG. 2B is a perspective view of an example of one of the M lift pins according to the present disclosure;

[0026] FIG. 3A is a perspective side cross section of an example of a substrate support, one or more edge rings, and one of the M lift pins for raising and / or lowering the one or more edge rings according to the present disclosure;

[0027] FIG. 3B is a cross section of an example of one of the M lift pins and a lower edge ring along line 3B-3B in FIG. 3A according to the present disclosure; and

[0028] FIG. 4 is a functional block diagram and schematic of an example of a positioning system according to the present disclosure.

[0029] In the drawings, reference numbers may be reused to identify similar and / or identical elements.DETAILED DESCRIPTION

[0030] During plasma processing, an edge ring system including one or more edge rings are arranged around the substrate and the substrate support to adjust a shape of a plasma sheath at outer edges of the substrate. During substrate processing, the plasma erodes one or more edge rings of the edge ring system. Some edge ring systems allow one or more of the edge rings to be replaced through a substrate port without breaking vacuum. In other words, a robot that is used to deliver substrates to the processing chamber is also used to replace the edge rings that are to be replaced without breaking vacuum. For example, the one or more of the edge rings are raised and lowered by N lift pins and N actuators, where N is an integer greater than two.

[0031] However, hard landing of the one or more edge rings during replacement can cause damage to the edge ring(s) and / or nearby chamber components. Synchronizing issues may occur when using individual actuators during edge ring replacement. Improper synchronization can cause misalignment. Misalignment can cause shifts in the impedance of the edge ring stack. Variations in impedance cause substrate nonuniformity. Nonuniform gaps between the edge rings and other chamber components can cause arcing issues, which may damage the substrate or chamber components. The use of individual actuators may require a complex actuator calibration process and longer system down time.

[0032] Referring now to FIG. 1 , a substrate processing system 100 includes a processing chamber 102 including a gas distribution device 104 and a substrate supportAttorney Docket No. 11883-1 WOHDP Ref. No. 15545-001289-WO-POA106 such as an electrostatic chuck (ESC). During operation, a substrate 108 is arranged on the substrate support 106.

[0033] In some examples, the substrate support 106 includes a heated pedestal or an electrostatic chuck. The substrate support 106 includes a baseplate 110. In some examples, the baseplate 110 is made of a conducting material such as aluminum. The baseplate 110 supports a top plate 1 12. A bond layer 1 14 bonds the top plate 1 12 to the baseplate 110. The baseplate 1 10 may include one or more coolant channels 116 for flowing coolant through the baseplate 1 10. One or more edge rings 1 18 are arranged around the substrate support 106 to shape the plasma sheath at a radially outer edge thereof as will be described further below. In some examples, the one or more edge rings 1 18 include a top edge ring arranged on a middle edge ring. The top edge ring can be raised and lowered using another lift pin actuator (not shown) during operation to adjust the plasma sheath. The top edge ring and the middle edge ring can be raised and lowered during replacement by the positioning system described herein without breaking vacuum. In other examples, the edge ring(s) may include a shadow ring configured to cover an exclusion zone of the substrate and / or to protect other chamber components.

[0034] A gas delivery system 130 includes one or more gas sources 132-1 , 132-2, ..., and 132-N, where N is an integer. The gas sources 132 supply one or more process gas mixtures. For an etching process, the process gas mixture may include carrier gas, inert gases, etching gas, etc. For a deposition process, the process gas mixture may include including carrier gas, inert gases, deposition precursor gases, etc.

[0035] The gas sources 132 are connected by flow metering devices 134-1 , 134-2, ..., and 134-N (e.g., mass flow controllers and valves) to a manifold 140. An output of the manifold 140 is fed to the gas distribution device 104. In some examples, a vapor delivery system 170 includes one or more vapor delivery sources that supply vapor to the manifold 140 or connect to the gas distribution device 104 downstream from the manifold 140. In some examples, the vapor delivery system 170 includes one or more ampoules 174, vaporizers 176, and flow metering devices 178 to controllably supply the vapor to the processing chamber.

[0036] In some examples, a temperature controller 142 is connected to heating elements 144 (e.g., thermal control elements (TCEs) or resistive heaters) arranged in the top plate 1 12. The temperature controller 142 may be used to supply power to the heating elements 144 to control a temperature of the substrate support 106 and the substrateAttorney Docket No. 11883-1 WOHDP Ref. No. 15545-001289-WO-POA108 during processing. The temperature controller 142 also operates a coolant assembly 146 that controls coolant flow through the coolant channels 116. For example, the coolant assembly 146 may include a coolant pump and coolant reservoir (not shown). The temperature controller 142 operates the coolant assembly 146 to selectively flow the coolant through the coolant channels 1 16 to cool the substrate support 106.

[0037] A valve 150 and a pump 152 are used to control pressure within the processing chamber 102 and / or to evacuate reactants from the processing chamber 102. A plasma generator 154 includes a radio frequency (RF) source 156 to output RF voltage / power to a matching network 158. The matching network 158 matches the impedance of the RF source 156 to the impedance of the load including the processing chamber and plasma. In some examples, the plasma generator 154 drives one of an electrode in a gas delivery device or a baseplate in the substrate support (and the other is floating or connected to a reference potential such as ground).

[0038] A controller 160 may be used to monitor system parameters and to control components of the substrate processing system 100 based on a recipe. One or more robots 161 may be used to deliver substrates onto, and remove substrates from, the substrate support 106. The gas distribution device 104 includes a gas plenum 191 that distributes gas from the gas delivery system 130 or vapor from the vapor delivery system 170 to gas through holes passing through an electrode 193 that is grounded.

[0039] An arm assembly 180 includes a pressure actuator 182 connected to an arm support 184 including M lower arms 185 extending radially outward and M upper arms 186 extending upwardly therefrom. M orientation lock sleeves 188 arranged at upper ends of the M upper arms 186 maintain the respective radially inward orientations of M lift pins 187. A valve control system 189 controls a valve in the pressure actuator 182 as will be described further below. The controller 160 may be used to cause the valve control system 189 to raise and lower the edge rings.

[0040] Referring now to FIG. 2A, the arm assembly 180 includes the arm support 184. The arm support 184 includes a cylindrical inner portion 212 defining a cylindrical cavity 214. The M lower arms 185 extend radially outwardly from the cylindrical inner portion 212 at an angle equal to 360Q / M. The M upper arms 186 are attached by fasteners 216 to radially outer ends of the M lower arms 185 at a predetermined angle to correctly align the M lift pins 187. In some examples, the pressure actuator 182 may be mounted to theAttorney Docket No. 11883-1 WOHDP Ref. No. 15545-001289-WO-POA arm support 184 (e.g., in the cylindrical cavity 214). Fasteners may be used to connect the pressure actuator 182 to bores 218 in the cylindrical inner portion 212.

[0041] A substrate support 210 is surrounded by a top edge ring 224 arranged on a middle edge ring 228. In some examples, an outer ring 220 surrounds and / or is arranged at least partially below the top edge ring 224 and / or the middle edge ring 228. One or more additional edge rings (e.g., FIG. 3A) may be arranged below the top edge ring 224, the middle edge ring 228, and / or the outer ring 220. In some examples, the outer ring 220 includes M slots 230 extending horizontally in a radial direction (and / or downwardly at a radial inner edge of the outer ring 220) for receiving the M lift pins 187 to self-center the M lift pins 187.

[0042] In some examples, the M lift pins 187 include a first “L”-shaped portion 240 (e.g., including a horizontal portion 241 and a vertical portion 242) and a second “L”-shaped portion (at 260 in FIGS. 2B and 3A (also including a vertical portion 261 and a horizontal portion 262)). In other examples, the M lift pins 187 are straight lift pins that extend through one or more rings to lift the one or more rings from below.

[0043] In some examples, the horizontal portion 241 has angled or sloped circumferentially-facing walls (e.g., defining a trapezoidal cross section) configured to self-center the M lift pins 187 in the M slots 230 as shown in FIG. 3B below. In some examples, the vertical portion 242 includes an upper portion 242-U including a rectangular cross section and a lower portion 242-L including a circular cross section as shown in FIG. 2B.

[0044] The M orientation lock sleeves 188 include an upper portion 244 that is connected by a fastener 250 to a lower portion 246. The upper portion 244 includes an opening on an upper surface thereof that has a cross section that matches / engages the shape of the upper portion 242-U of the M lift pins 187 to lock the orientation of the M lift pins 187. The lower portion 246 receives the lower portion 242-L of the M lift pins 187. The M orientation lock sleeves 188 engage the M lift pins 187 to fix the angular position of the corresponding one of the M lift pins 187 and to prevent rotation relative to the upper portion 244. One of the upper portion 244 and the lower portion 246 includes a projection 248 and the other of the upper portion 244 and the lower portion 246 includes a notch 249. The projection 248 and the notch 249 fix the angular position of the upper portion 244 relative to the lower portion 246 and one of the M upper arms 186.Attorney Docket No. 11883-1 WOHDP Ref. No. 15545-001289-WO-POA

[0045] Referring now to FIG. 3A, the substrate support 106 is shown to include the baseplate 1 10 and the top plate 112 bonded to the baseplate 1 10 by the bond layer 1 14. The top plate 112 includes a cylindrical upper portion and a stepped portion extending radially outwardly from a lower and radially outer side of the cylindrical upper portion. A seal 280 is arranged below a radially outer edge of the top plate 1 12 in an annular step formed by the baseplate 1 10. The seal 280 prevents plasma from reaching the bond layer 1 14. One or more additional edge rings 284, 286, and 288 may be arranged below the outer ring 220, the top edge ring 224, and / or the middle edge ring 228.

[0046] In FIGS. 3A and 3B, the second “L”-shaped portion 260 of the M lift pins 187 includes the vertical portion 261 extending downwardly to the horizontal portion 262 extending radially inwardly below the middle edge ring 228. In some examples, the horizontal portion 241 of the first “L”-shaped portion 240 is received in one of the M slots 230 in the outer ring 220.

[0047] In FIG. 3B, opposing walls 310 (e.g., circumferentially-facing walls) in the M slots 230 of the outer ring 220 are sloped or angled at an acute angle relative to vertical. In some examples, the angle is in a range from 20Qto 60Q. Opposing walls 312 of the horizontal portion 241 of the M lift pins 187 are sloped at the acute angle relative to vertical. In some examples, the opposing walls 312 of the horizontal portion 241 of the M lift pins 187 and the opposing walls 310 in the M slots 230 of the outer ring 220 use the same mirrored angle. In some examples, the opposing walls 312 of the horizontal portion 241 of the M lift pins 187 and the opposing walls 310 in the M slots 230 of the outer ring 220 cause the M lift pins 187 to self-center and to bias the top edge ring 224 and the middle edge ring 228 into the correct orientation and position.

[0048] Referring now to FIG. 4, a gas supply 410 supplies gas such as clean dry air (CDA), an inert gas, or another suitable gas to a pressure control valve 416. A pressure sensor 418 senses pressure between the gas supply 410 and the pressure control valve 416. If the pressure sensed by the pressure sensor 418 falls below a predetermined pressure, the controller 160 prevents operation of the system.

[0049] The pressure control valve 416 controls output gas pressure supplied at an outlet thereof to a predetermined pressure. The outlet of the pressure control valve 416 is fluidly coupled to a first port of a valve 420. In some examples, the valve 420 includes three ports and has two positions. The valve 420 includes a second port connected to the pressure actuator 182 and a third port acting as a gas return. In some examples, one orAttorney Docket No. 11883-1 WOHDP Ref. No. 15545-001289-WO-POA more restricted orifices 430 are arranged between the second port of the valve 420 and the pressure actuator 182.

[0050] In some examples, one or more restricted orifices 430 are arranged between the valve 420 and the pressure actuator 182. In some examples, one or more restricted orifices 430 include a first restricted orifice 434 and / or a second restricted orifice 436. In some examples, the first restricted orifice 434 has an opening in a range from 0.2mm to 0.9mm. In some examples, the first restricted orifice 434 has an opening in a range from 0.4mm to 0.6mm. In some examples, the second restricted orifice 436 has an opening in a range from 0.2mm to 0.8mm. In some examples, the first restricted orifice 436 has an opening in a range from 0.3mm to 0.6mm.

[0051] In some examples, a check valve 438 is arranged in parallel with the second restricted orifice 436 to bypass the second restricted orifice 436 in response to positive pressure from the pressure actuator 182 (e.g., when the pressure control valve 416 and / or the valve 420 stop supplying gas).

[0052] A position of the valve 420 is controlled by a pneumatic controller 424. When the pneumatic controller 424 sets the valve 420 in a first position, the pressure actuator 182 is connected through the one or more restricted orifices 430 to a gas return line 450. In some examples, the M lift pins 187 are in a raised position in this state. When the pneumatic controller 424 sets the valve 420 in a second position, the output of the pressure control valve 416 is coupled through the one or more restricted orifices 430 to the pressure actuator 182. In some examples, the M lift pins 187 are in a lowered position in this state.

[0053] In some examples, the pressure actuator 182 includes a bellows actuator, although other types of pressure actuators can be used. In some examples, the bellows actuator is configured to lift the arm assembly 180 when pressure is not applied to the pressure actuator 182. In other words, a failure mode of the pressure control system defaults to a raised position of the arm assembly 180 to prevent damage to the top edge ring 224, the middle edge ring 228, or other chamber components in the event that the pressure control system fails.

[0054] The pressure control system is configured to provide a soft landing of the top edge ring and the middle edge ring. The wedge shape of the horizontal portion 241 of the M lift pins 187 helps to self-align the top edge ring 224 and the middle edge ring 228 relative to the substrate support 106. Misalignment due to synchronization issues isAttorney Docket No. 11883-1 WOHDP Ref. No. 15545-001289-WO-POA eliminated by using a single actuator controlling all of the M lift pins at the same time. The single actuator with the M orientation lock sleeves 188 helps to reduce calibration time and system down time.

[0055] In some examples, the M lift pins 187 are made of a plasma resistant material such as zirconia, although other plasma resistant materials can be used. In some examples, the M orientation lock sleeves 188 are made of a plasma resistant material such as polytetrafluoroethylene (PTFE), although other materials can be used. In some examples, the arm support 184, the M lower arms 185, and the M upper arms 186 are made of anodized aluminum, although other materials can be used.

[0056] The foregoing description is merely illustrative in nature and is in no way intended to limit the disclosure, its application, or uses. The broad teachings of the disclosure can be implemented in a variety of forms. Therefore, while this disclosure includes particular examples, the true scope of the disclosure should not be so limited since other modifications will become apparent upon a study of the drawings, the specification, and the following claims. It should be understood that one or more steps within a method may be executed in different order (or concurrently) without altering the principles of the present disclosure. Further, although each of the embodiments is described above as having certain features, any one or more of those features described with respect to any embodiment of the disclosure can be implemented in and / or combined with features of any of the other embodiments, even if that combination is not explicitly described. In other words, the described embodiments are not mutually exclusive, and permutations of one or more embodiments with one another remain within the scope of this disclosure.

[0057] Spatial and functional relationships between elements (for example, between modules, circuit elements, semiconductor layers, etc.) are described using various terms, including “connected,” “engaged,” “coupled,” “adjacent,” “next to,” “on top of,” “above,” “below,” and “disposed.” Unless explicitly described as being “direct,” when a relationship between first and second elements is described in the above disclosure, that relationship can be a direct relationship where no other intervening elements are present between the first and second elements, but can also be an indirect relationship where one or more intervening elements are present (either spatially or functionally) between the first and second elements. As used herein, the phrase at least one of A, B, and C should be construed to mean a logical (A OR B OR C), using a non-exclusive logical OR, and should not be construed to mean “at least one of A, at least one of B, and at least one of C.”Attorney Docket No. 11883-1 WOHDP Ref. No. 15545-001289-WO-POA

[0058] In some implementations, a controller is part of a system, which may be part of the above-described examples. Such systems can comprise semiconductor processing equipment, including a processing tool or tools, chamber or chambers, a platform, or platforms for processing, and / or specific processing components (a wafer pedestal, a gas flow system, etc.). These systems may be integrated with electronics for controlling their operation before, during, and after processing of a semiconductor wafer or substrate. The electronics may be referred to as the “controller,” which may control various components or subparts of the system or systems. The controller, depending on the processing requirements and / or the type of system, may be programmed to control any of the processes disclosed herein, including the delivery of processing gases, temperature settings (e.g., heating and / or cooling), pressure settings, vacuum settings, power settings, radio frequency (RF) generator settings, RF matching circuit settings, frequency settings, flow rate settings, fluid delivery settings, positional and operation settings, wafer transfers into and out of a tool and other transfer tools and / or load locks connected to or interfaced with a specific system.

[0059] Broadly speaking, the controller may be defined as electronics having various integrated circuits, logic, non-transitory memory, and / or software that receive instructions, issue instructions, control operation, enable cleaning operations, enable endpoint measurements, and the like. The integrated circuits may include chips in the form of firmware that store program instructions, digital signal processors (DSPs), chips defined as application specific integrated circuits (ASICs), and / or one or more microprocessors, or microcontrollers that execute program instructions (e.g., software). Program instructions may be instructions communicated to the controller in the form of various individual settings (or program files), defining operational parameters for carrying out a particular process on or for a semiconductor wafer or to a system. The operational parameters may, in some embodiments, be part of a recipe defined by process engineers to accomplish one or more processing steps during the fabrication of one or more layers, materials, metals, oxides, silicon, silicon dioxide, surfaces, circuits, and / or dies of a wafer.

[0060] The controller, in some implementations, may be a part of or coupled to a computer that is integrated with the system, coupled to the system, otherwise networked to the system, or a combination thereof. For example, the controller may be in the “cloud” or all or a part of a fab host computer system, which can allow for remote access of the wafer processing. The computer may enable remote access to the system to monitor current progress of fabrication operations, examine a history of past fabricationAttorney Docket No. 11883-1 WOHDP Ref. No. 15545-001289-WO-POA operations, examine trends or performance metrics from a plurality of fabrication operations, to change parameters of current processing, to set processing steps to follow a current processing, or to start a new process. In some examples, a remote computer (e.g., a server) can provide process recipes to a system over a network, which may include a local network or the Internet. The remote computer may include a user interface that enables entry or programming of parameters and / or settings, which are then communicated to the system from the remote computer. In some examples, the controller receives instructions in the form of data, which specify parameters for each of the processing steps to be performed during one or more operations. It should be understood that the parameters may be specific to the type of process to be performed and the type of tool that the controller is configured to interface with or control. Thus, as described above, the controller may be distributed, such as by comprising one or more discrete controllers that are networked together and working towards a common purpose, such as the processes and controls described herein. An example of a distributed controller for such purposes would be one or more integrated circuits on a chamber in communication with one or more integrated circuits located remotely (such as at the platform level or as part of a remote computer) that combine to control a process on the chamber.

[0061] Without limitation, example systems may include a plasma etch chamber or module, a deposition chamber or module, a spin-rinse chamber or module, a metal plating chamber or module, a clean chamber or module, a bevel edge etch chamber or module, a physical vapor deposition (PVD) chamber or module, a chemical vapor deposition (CVD) chamber or module, an atomic layer deposition (ALD) chamber or module, an atomic layer etch (ALE) chamber or module, an ion implantation chamber or module, a track chamber or module, and any other semiconductor processing systems that may be associated or used in the fabrication and / or manufacturing of semiconductor wafers.

[0062] As noted above, depending on the process step or steps to be performed by the tool, the controller might communicate with one or more of other tool circuits or modules, other tool components, cluster tools, other tool interfaces, adjacent tools, neighboring tools, tools located throughout a factory, a main computer, another controller, or tools used in material transport that bring containers of wafers to and from tool locations and / or load ports in a semiconductor manufacturing factory.

Claims

Attorney Docket No. 11883-1 WOHDP Ref. No. 15545-001289-WO-POACLAIMSWhat is claimed is:1 . A positioning system for an edge ring of a plasma processing system, comprising: an arm assembly including: an arm support;M lower arms extending radially outwardly from the arm support, where M is an integer greater than two;M upper arms attached to and extending upwardly from radially outer ends of the M lower arms;M orientation lock sleeves connected to upper ends of the M upper arms; andM lift pins connected to the M orientation lock sleeves and configured to raise and lower the edge ring.

2. The positioning system of claim 1 , wherein: the M orientation lock sleeves include an upper portion and a lower portion, and one of the upper portion and the lower portion includes a notch and the other of the upper portion and the lower portion includes a projection received by the notch.

3. The positioning system of claim 1 , further comprising M fasteners configured to attach and fix M angular orientations of the M upper arms relative to the M lower arms, respectively.

4. The positioning system of claim 1 , wherein the M lift pins include a first “L”-shaped portion and a second “L”-shaped portion extending inwardly from a radially inner end of the first “L”-shaped portion.

5. The positioning system of claim 1 , wherein the M lift pins include a first “L”-shaped portion including a vertical portion extending in an axial direction and a horizontal portion extending radially inwardly from the vertical portion.

6. The positioning system of claim 5, wherein the horizontal portion of the first “L”- shaped portion has a trapezoidal cross section.Attorney Docket No. 11883-1 WOHDP Ref. No. 15545-001289-WO-POA7. The positioning system of claim 5, wherein the horizontal portion of the first “L”- shaped portion includes angled side walls arranged at an acute angle relative to an axial direction.

8. The positioning system of claim 5, wherein the arm support includes a cylindrical portion and wherein the M lower arms extend radially outwardly from the cylindrical portion.

9. The positioning system of claim 1 , further comprising an arm control system comprising: a pressure control valve configured to receive gas from a gas supply and to provide a predetermined pressure at an outlet thereof; a pressure actuator configured for arrangement between the arm assembly and a substrate support; and a valve configured to selectively connect an output of the pressure control valve to the pressure actuator.

10. The positioning system of claim 9, further comprising one or more restricted orifices arranged between the pressure actuator and the valve.1 1. The positioning system of claim 10, wherein the one or more restricted orifices include: a first restricted orifice fluidly connected to the valve; a second restricted orifice fluidly connected between the first restricted orifice and the pressure actuator; and a check valve in parallel with the second restricted orifice.

12. The positioning system of claim 10, wherein the pressure actuator is in a raised position when pressure from the valve is not supplied.

13. The positioning system of claim 10, wherein the pressure actuator includes a bellows actuator.Attorney Docket No. 11883-1 WOHDP Ref. No. 15545-001289-WO-POA14. A substrate processing system comprising: a substrate support; an edge ring system arranged around the substrate support; and the positioning system of claim 1 .

15. The substrate processing system of claim 14, wherein the edge ring system includes: a top edge ring; and a middle edge ring arranged below the top edge ring, wherein the M lift pins raise and lower the middle edge ring and the top edge ring at the same time.

16. The substrate processing system of claim 15, wherein the edge ring system includes an outer ring arranged radially outside of the middle edge ring and the top edge ring.

17. The substrate processing system of claim 16, wherein the outer ring includes M horizontal slots configured to receive a horizontal portion of the M lift pins.

18. The substrate processing system of claim 17, wherein the M horizontal slots include first angled side walls and wherein the horizontal portion of the M lift pins includes second angled side walls, wherein the first angled side walls and the second angled side walls are configured to self-center the M lift pins.

19. A positioning system for an edge ring of a plasma processing system, comprising: an arm assembly including M lift pins that are spaced 360Q / M and configured to lift one or more edge rings, where M is an integer greater than two; and an arm control system comprising: a pressure control valve configured to receive gas from a gas supply and to provide a predetermined pressure at an outlet thereof; a pressure actuator configured for arrangement between the arm assembly and a substrate support; and a valve configured to selectively connect an output of the pressure control valve to the pressure actuator to lift the arm assembly.Attorney Docket No. 11883-1 WOHDP Ref. No. 15545-001289-WO-POA20. The positioning system of claim 19, further comprising one or more restricted orifices arranged between the pressure actuator and the valve.21 . The positioning system of claim 20, wherein the one or more restricted orifices include: a first restricted orifice fluidly connected to the valve; a second restricted orifice fluidly connected between the first restricted orifice and the pressure actuator; and a check valve in parallel with the second restricted orifice.

22. The positioning system of claim 20, wherein the pressure actuator is in a raised position when pressure from the valve is not supplied.

23. The positioning system of claim 20, wherein the pressure actuator includes a bellows actuator.

24. The positioning system of claim 19, wherein the arm assembly includes: an arm support;M lower arms extending radially outwardly from the arm support, where M is an integer greater than two; andM upper arms attached to and extending upwardly from radially outer ends of the M lower arms.

25. The positioning system of claim 24, wherein the arm assembly includes:M orientation lock sleeves connected to upper ends of the M upper arms, wherein the M lift pins are connected to the M orientation lock sleeves and configured to raise and lower the edge ring.

26. The positioning system of claim 25, wherein: the M orientation lock sleeves include an upper portion and a lower portion, and one of the upper portion and the lower portion includes a notch and the other of the upper portion and the lower portion includes a projection received by the notch.Attorney Docket No. 11883-1 WOHDP Ref. No. 15545-001289-WO-POA27. The positioning system of claim 25, further comprising M fasteners configured to attach and fix M angular orientations of the M upper arms relative to the M lower arms, respectively.

28. The positioning system of claim 25, wherein the M lift pins include a first “L”- shaped portion and a second “L”-shaped portion extending inwardly from a radially inner end of the first “L”-shaped portion.

29. The positioning system of claim 25, wherein the M lift pins include a first “L”- shaped portion including a vertical portion extending in an axial direction and a horizontal portion extending radially inwardly from the vertical portion.

30. The positioning system of claim 29, wherein the horizontal portion of the first “L”- shaped portion has a trapezoidal cross section.31 . The positioning system of claim 29, wherein the horizontal portion of the first “L”- shaped portion includes angled side walls arranged at an acute angle relative to an axial direction.

32. The positioning system of claim 29, wherein the arm support includes a cylindrical portion and wherein the M lower arms extend radially outwardly from the cylindrical portion.

33. A substrate processing system comprising: a substrate support; an edge ring system arranged around the substrate support; and the positioning system of claim 19.Attorney Docket No. 11883-1 WOHDP Ref. No. 15545-001289-WO-POA34. The substrate processing system of claim 33, wherein the edge ring system includes: a top edge ring; and a middle edge ring arranged below the top edge ring, wherein the M lift pins raise and lower the middle edge ring and the top edge ring at the same time.

35. The substrate processing system of claim 34, wherein the edge ring system includes an outer ring arranged radially outside of the middle edge ring and the top edge ring.

36. The substrate processing system of claim 35, wherein the outer ring includes M horizontal slots configured to receive a horizontal portion of the M lift pins.

37. The substrate processing system of claim 36, wherein the M horizontal slots include first angled side walls and wherein the horizontal portion of the M lift pins includes second angled side walls, wherein the first angled side walls and the second angled side walls are configured to self-center the M lift pins.

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