Display device and temperature measurement method

Abstract

A display device and a temperature measurement method. The display device comprises: a display substrate having a plurality of temperature measurement components; a control circuit coupled to the plurality of temperature measurement components; and a measurement circuit electrically coupled to the plurality of temperature measurement components and the control circuit, wherein the measurement circuit is configured to, when it is determined that the display substrate is in a data refresh stage, control the control circuit to load common voltage to the temperature measurement components, and is configured to, when it is determined that the display substrate is in an inter-frame blank stage, control the control circuit to load temperature measurement signals to the temperature measurement components, and on the basis of temperature feedback signals fed back by the temperature measurement components, determine the temperatures at the positions of the temperature measurement components.

Description

Display device and temperature detection method TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of display, and in particular to a display device and a temperature detection method. BACKGROUND

[0002] In the performance requirements of detecting display devices, the detection of temperature changes is often considered as an important content to avoid adverse effects caused by excessively high or low temperatures.

[0003] With the development of vehicle-mounted technology trends, intelligent and high-end demands are continuously increasing, and there are higher requirements for temperature monitoring, as well as local temperature monitoring requirements. Some vehicle-mounted display applications, such as head-up displays (HUD), have great demand for vehicle-mounted temperature monitoring.

[0004] SUMMARY

[0005] Embodiments of the present disclosure provide a display device and a temperature detection method. The display device comprises:

[0006] a display substrate having a plurality of temperature detection components;

[0007] a control circuit coupled to the plurality of temperature detection components;

[0008] a detection circuit electrically coupled to the plurality of temperature detection components and the control circuit; the detection circuit is configured to control the control circuit to load a common voltage to the temperature detection components when determining that the display substrate is in a data refresh stage, and is configured to control the control circuit to load a temperature detection signal to the temperature detection components when determining that the display substrate is in an interframe blanking stage, and determine the temperature at the position of the temperature detection component according to a temperature feedback signal fed back by the temperature detection component.

[0009] In a possible implementation, the control circuit comprises a switch switcher.

[0010] A first input end of the switch switcher is coupled to the detection circuit, a second input end of the switch switcher is coupled to a common voltage end, a third input end of the switch switcher is coupled to a temperature detection signal end, and an output end of the switch switcher is coupled to an input end of the temperature detection component.

[0011] An output end of the temperature detection component is coupled to the detection circuit.

[0012] In a possible implementation, the detection circuit comprises at least one multiplexer and a processing circuit; the multiplexer is coupled to the temperature detection component and the processing circuit.

[0013] Part of the input end of the multiplexer is coupled with the output end of the plurality of temperature detection components, part of the input end is coupled with the processing circuit, and the output end of the multiplexer is coupled with the processing circuit; the multiplexer is configured to sequentially send the temperature feedback signals fed back by the plurality of temperature detection components to the processing circuit according to the control signal of the processing circuit received.

[0014] In a possible implementation, the processing circuit comprises a first resistor, a first amplifier, a first analog-to-digital converter, and a processor.

[0015] One end of the first resistor is coupled with the output end of the temperature detection component, and the other end of the first resistor is coupled with the ground end.

[0016] The first input end of the first amplifier is coupled with the output end of the multiplexer, the second input end of the first amplifier is coupled with the reference voltage end, and the output end of the first amplifier is coupled with the input end of the first analog-to-digital converter.

[0017] The output end of the first analog-to-digital converter is coupled with the first input end of the processor.

[0018] The second input end of the processor is coupled with the display substrate, and the first output end of the processor is coupled with the control circuit.

[0019] In a possible implementation, the display substrate has a display area, a binding area located on one side of the display area, and a binding opposite area located on the other side of the display area and opposite to the binding area; the binding area has a plurality of binding terminal groups.

[0020] The temperature detection component comprises a plurality of first temperature detection components and at least one second temperature detection component; the plurality of first temperature detection components are arranged in an array in the display area; the second temperature detection component is located in an area between at least some adjacent binding groups in the binding area; the display substrate further comprises a temperature detection lead electrically connected with the first temperature detection component.

[0021] The detection circuit is specifically configured to remove the temperature signal amount of the temperature detection lead along the direction from the binding area to the binding opposite area according to the temperature feedback signals fed back by the first temperature detection components and the second temperature detection component, and determine the temperature at the position of each first detection component in each first detection component row row by row.

[0022] In a possible implementation, the detection circuit is specifically configured to determine the temperature at the position of the second temperature detection component according to the temperature feedback signal fed back by the second temperature detection component, and take the temperature at the position of the second temperature detection component as the temperature of the temperature detection lead corresponding to the first temperature detection component row.

[0023] and configured to determine the temperature at the position of the first temperature detection component of the first temperature detection component row according to the temperature feedback signal fed back by the first temperature detection component of the first temperature detection component row and the temperature of the temperature detection lead corresponding to the first temperature detection component row.

[0024] In a possible implementation, the detection circuit is specifically configured to determine the temperature of the temperature detection lead of the M+1th temperature detection component row at the first to Mth temperature detection component rows according to the temperature at the position of the first temperature detection component of the first to Mth temperature detection component rows; wherein the M+1th temperature detection component row is located on the side of the Mth temperature detection component row away from the binding area, and M represents a positive integer greater than or equal to 1.

[0025] and configured to determine the temperature at the position of the first temperature detection component of the M+1th temperature detection component row according to the temperature feedback signal fed back by the first temperature detection component of the M+1th temperature detection component row and the temperature of the temperature detection lead of the M+1th temperature detection component row at the first to Mth temperature detection component rows and the binding area.

[0026] In a possible implementation, the display substrate has a display area; and the plurality of temperature detection components are arranged in an array in the display area.

[0027] The display substrate further includes a temperature detection lead electrically connected to the temperature detection component, and a lead detection line located on the side of and adjacent to the temperature detection lead; wherein the temperature detection lead of the temperature detection component in the ith row and jth column is located on the side of the temperature detection component in the jth column, and the lead detection line corresponding to the temperature detection component in the ith row and jth column is located on the side of the temperature detection lead away from the temperature detection component in the jth column.

[0028] The detection circuit is specifically configured to determine the temperature of the temperature detection lead according to the temperature feedback signal fed back by the lead detection line, and configured to determine the temperature at the position of the temperature detection component according to the temperature feedback signal fed back by the temperature detection component and the temperature of the temperature detection lead.

[0029] In a possible implementation, the detection circuit is further configured to:

[0030] determine the target temperature detection component and the temperature at the position of the target temperature detection component according to the temperatures at the positions of the plurality of temperature detection components;

[0031] determine the temperature of the target region in the target temperature detection component according to the temperature at the position of the target temperature detection component and the temperature at the position of the temperature detection component adjacent to the target temperature detection component.

[0032] In a possible implementation, the detection circuit is specifically configured to:

[0033] determine the average temperature of the plurality of temperature detection components according to the temperatures at the positions of the plurality of temperature detection components;

[0034] determine the target temperature detection component as the temperature detection component whose temperature is higher than the average temperature set value among the plurality of temperature detection components.

[0035] In a possible implementation, the detection circuit is specifically configured to:

[0036] determine the target temperature detection component as the temperature detection component with the highest temperature among the plurality of temperature detection components according to the temperatures at the positions of the plurality of temperature detection components.

[0037] In a possible implementation, the detection circuit is specifically configured to:

[0038] obtain the temperature of each temperature detection component in the temperature detection component matrix and the temperature of an adjacent temperature detection component of the temperature detection component matrix according to the determined target temperature detection component;

[0039] determine the temperature of the target region in the target temperature detection component by the following relationship: T1*Ms1+T2*Ms2+T3*Ms3+T4*Ms4=Tg*Mg+Ts*(Ms1+Ms2+Ms3+Ms4-Mg);

[0040] The temperature detection component matrix comprises a first sub-temperature detection component, a second sub-temperature detection component, a third sub-temperature detection component, and a fourth sub-temperature detection component; the first sub-temperature detection component is located at the mth row and the nth column, the second sub-temperature detection component is located at the mth row and the (n+1)th column, the third sub-temperature detection component is located at the (m+1)th row and the nth column, and the fourth sub-temperature detection component is located at the (m+1)th row and the (n+1)th column; the target detection component comprises at least one of the first sub-temperature detection component, the second sub-temperature detection component, the third sub-temperature detection component, and the fourth sub-temperature detection component; T1 represents the temperature at the position of the first sub-temperature detection component, T2 represents the temperature at the position of the second sub-temperature detection component, T3 represents the temperature at the position of the third sub-temperature detection component, T4 represents the temperature at the position of the fourth sub-temperature detection component, Tg represents the temperature at the position of the target region, Ts represents the temperature at the position of the temperature detection component adjacent to the temperature detection component matrix, Ms1 represents the area at the position of the first sub-temperature detection component, Ms2 represents the area at the position of the second sub-temperature detection component, Ms3 represents the area at the position of the third sub-temperature detection component, Ms4 represents the area at the position of the fourth sub-temperature detection component, Ms represents the area of the first sub-temperature detection component, the second sub-temperature detection component, the third sub-temperature detection component, the fourth sub-temperature detection component, or the temperature detection component adjacent to the temperature detection component matrix, and Mg represents the area of the target region.

[0041] In a possible implementation, the detection circuit is further configured to send an alarm signal to the display substrate when the temperature of the target region is higher than a second temperature.

[0042] In a possible implementation, the detection circuit is specifically configured to obtain the resistance value change of the temperature detection component according to the temperature feedback signal fed back by the temperature detection component, and determine the temperature at the position of the temperature detection component by calling a pre-calibrated and pre-stored temperature-resistance value relationship.

[0043] In a possible implementation, the display substrate comprises a substrate, a pixel electrode layer located on one side of the substrate, and a common electrode layer located on the side of the pixel electrode layer away from the substrate; and the temperature detection component is located between the common electrode layer and the layer where the pixel electrode is located.

[0044] In a possible implementation, the temperature detection component comprises a plurality of wiring units arranged in sequence along a first direction, and a first connecting portion connecting adjacent wiring units; wherein the wiring unit comprises two first wires extending along a second direction, and a second connecting portion connecting the two first wires.

[0045] In a possible implementation, the temperature detection component further includes a plurality of second traces extending along the first direction, and the second traces are electrically connected with the first traces.

[0046] In a possible implementation, the plurality of temperature detection components include a plurality of first detection components arranged along the first direction and along the second direction in sequence, and a plurality of second detection components arranged along the second direction and along one side of the first direction in sequence.

[0047] The first detection component includes a plurality of first electrode blocks arranged along the first direction in sequence and electrically connected; and the second detection component includes a plurality of second electrode blocks arranged along the second direction on one side and electrically connected.

[0048] The display device provided by the embodiments of the present disclosure further provides a temperature detection method, which is applied to the display device provided by the embodiments of the present disclosure, and the temperature detection method includes the following steps.

[0049] When it is determined that the display substrate is in a data refresh stage, the control circuit is controlled to load a common voltage to the temperature detection component.

[0050] When it is determined that the display substrate is in an interframe blanking stage, the control circuit is controlled to load a temperature detection signal to the temperature detection component, and a temperature at a position of the temperature detection component is determined according to a temperature feedback signal fed back by the temperature detection component.

[0051] In a possible implementation, the temperature at the position of the temperature detection component is determined according to the temperature feedback signal fed back by the temperature detection component, and includes the following steps.

[0052] According to the temperature feedback signals fed back by the first temperature detection component and the second temperature detection component, a temperature signal amount of the temperature detection lead is removed in a direction from the binding area to the opposite area of the binding area, and a temperature at a position of each first detection component in each first detection component row is determined.

[0053] In a possible implementation, the temperature at the position of the temperature detection component is determined according to the temperature feedback signal fed back by the temperature detection component, and includes the following steps.

[0054] determining the temperature at the position of the second temperature detection component according to the temperature feedback signal fed back by the second temperature detection component, and taking the temperature at the position of the second temperature detection component as the temperature of the temperature detection lead wire corresponding to the first temperature detection component row;

[0055] determining the temperature at the position of the first temperature detection component of the first temperature detection component row according to the temperature feedback signal fed back by the first temperature detection component of the first temperature detection component row and the temperature of the temperature detection lead wire corresponding to the first temperature detection component row.

[0056] In a possible implementation, the temperature at the position of each first detection component row is determined row by row according to the temperature feedback signal fed back by the first temperature detection component and the second temperature detection component, and the temperature signal amount of the temperature detection lead wire is removed in the direction from the binding area to the opposite side of the binding area.

[0057] determining the temperature of the temperature detection lead wire at the first temperature detection component row to the Mth temperature detection component row according to the temperature at the position of the first temperature detection component of the first temperature detection component row to the Mth temperature detection component row; wherein the M+1th temperature detection component row is located on the side of the Mth temperature detection component row away from the binding area, and M represents a positive integer greater than or equal to 1;

[0058] determining the temperature at the position of the first temperature detection component of the M+1th temperature detection component row according to the temperature feedback signal fed back by the first temperature detection component of the M+1th temperature detection component row and the temperature of the temperature detection lead wire at the first temperature detection component row to the Mth temperature detection component row and the binding area.

[0059] In a possible implementation, the temperature at the position of the temperature detection component is determined according to the temperature feedback signal fed back by the temperature detection component, and the temperature at the position of the temperature detection component is determined according to the temperature feedback signal fed back by the temperature detection component and the temperature of the temperature detection lead wire.

[0060] determining the temperature of the temperature detection lead wire according to the temperature feedback signal fed back by the lead detection line, and being configured to determine the temperature at the position of the temperature detection component according to the temperature feedback signal fed back by the temperature detection component and the temperature of the temperature detection lead wire.

[0061] In a possible implementation, after the temperature at the position of the temperature detection component is determined, the temperature detection method further comprises:

[0062] determining a target temperature detection component and the temperature at the position of the target temperature detection component according to the temperature at the positions of a plurality of temperature detection components.

[0063] determining the temperature of the target region in the target temperature detection component according to the temperature at the position of the target temperature detection component and the temperature at the position of the temperature detection component adjacent to the target temperature detection component.

[0064] In a possible implementation, the determining the target temperature detection component according to the temperatures at the positions of the temperature detection components comprises:

[0065] determining an average temperature of the temperature detection components according to the temperatures at the positions of the temperature detection components;

[0066] taking the temperature detection component with a temperature higher than the average temperature as the target temperature detection component.

[0067] In a possible implementation, the determining the target temperature detection component according to the temperatures at the positions of the temperature detection components comprises:

[0068] determining the temperature detection component with the highest temperature among the temperature detection components according to the temperatures at the positions of the temperature detection components, and taking the temperature detection component with the highest temperature as the target temperature detection component.

[0069] In a possible implementation, the determining the temperature of the target region in the target temperature detection component according to the temperature at the position of the target temperature detection component and the temperature at the position of the temperature detection component adjacent to the target temperature detection component comprises:

[0070] acquiring the temperature of each temperature detection component in the temperature detection component matrix according to the determined target temperature detection component, and acquiring the temperature of a temperature detection component adjacent to the temperature detection component matrix;

[0071] determining the temperature of the target region in the target temperature detection component according to the following relationship: T1*Ms1+T2*Ms2+T3*Ms3+T4*Ms4=Tg*Mg+Ts*(Ms1+Ms2+Ms3+Ms4-Mg);

[0072] The temperature detection component matrix comprises a first sub-temperature detection component, a second sub-temperature detection component, a third sub-temperature detection component, and a fourth sub-temperature detection component; the first sub-temperature detection component is located at the mth row and the nth column, the second sub-temperature detection component is located at the mth row and the n+1th column, the third sub-temperature detection component is located at the m+1th row and the nth column, and the fourth sub-temperature detection component is located at the m+1th row and the n+1th column; the target detection component comprises at least one of the first sub-temperature detection component, the second sub-temperature detection component, the third sub-temperature detection component, and the fourth sub-temperature detection component; T1 represents the temperature at the position of the first sub-temperature detection component, T2 represents the temperature at the position of the second sub-temperature detection component, T3 represents the temperature at the position of the third sub-temperature detection component, T4 represents the temperature at the position of the fourth sub-temperature detection component, Tg represents the temperature at the position of the target region, Ts represents the temperature at the position of the temperature detection component adjacent to the temperature detection component matrix, Ms1 represents the area at the position of the first sub-temperature detection component, Ms2 represents the area at the position of the second sub-temperature detection component, Ms3 represents the area at the position of the third sub-temperature detection component, Ms4 represents the area at the position of the fourth sub-temperature detection component, Ms represents the area of the first sub-temperature detection component, the second sub-temperature detection component, the third sub-temperature detection component, the fourth sub-temperature detection component, or the temperature detection component adjacent to the temperature detection component matrix, and Mg represents the area of the target region.

[0073] In a possible implementation, after determining the temperature of the target region in the target temperature detection component, the temperature detection method further comprises:

[0074] When it is determined that the temperature of the target region is higher than the second temperature, an alarm signal is sent to the display substrate.

[0075] In a possible implementation, when it is determined that the display substrate is in a data refreshing stage, before the control circuit is controlled to load the common voltage to the temperature detection component, the temperature detection method further comprises:

[0076] An initial temperature-resistance value change relationship is obtained.

[0077] The display device is placed in an environment with a set temperature, and when the display device reaches the set temperature, the resistance value and the temperature of each temperature detection component are obtained.

[0078] According to the resistance value and the temperature of each temperature detection component, a temperature-resistance value change relationship corresponding to each temperature detection component is obtained. BRIEF DESCRIPTION OF DRAWINGS

[0079] FIG. 1 is a schematic diagram of a display device according to an embodiment of the present disclosure;

[0080] FIG. 2 is a schematic diagram of a temperature detection component loading different signals at different time periods according to an embodiment of the present disclosure;

[0081] FIG. 3 is a schematic diagram of a display device according to an embodiment of the present disclosure;

[0082] FIG. 4 is a schematic diagram of a display device according to an embodiment of the present disclosure;

[0083] FIG. 5A is a schematic diagram of a display substrate according to an embodiment of the present disclosure;

[0084] FIG. 5B is a schematic diagram of a partial enlarged view of FIG. 5A;

[0085] FIG. 5C is a schematic diagram of a partial enlarged view of FIG. 5A;

[0086] FIG. 6 is a schematic diagram of a display substrate provided with a lead detection line according to an embodiment of the present disclosure;

[0087] FIG. 7A is a schematic diagram of a light spot position and a temperature detection component position according to an embodiment of the present disclosure;

[0088] FIG. 7B is a schematic diagram of a light spot position and a temperature detection component position according to an embodiment of the present disclosure;

[0089] FIG. 7C is a schematic diagram of a light spot position and a temperature detection component position according to an embodiment of the present disclosure;

[0090] FIG. 7D is a schematic diagram of a light spot position and a temperature detection component position according to an embodiment of the present disclosure;

[0091] FIG. 8 is a schematic diagram of a light spot position and a temperature detection component matrix according to an embodiment of the present disclosure;

[0092] FIG. 9 is a schematic diagram of a temperature detection component according to an embodiment of the present disclosure;

[0093] FIG. 10 is a schematic diagram of a temperature detection component according to an embodiment of the present disclosure;

[0094] FIG. 11 is a schematic diagram of a display substrate according to an embodiment of the present disclosure;

[0095] FIG. 12 is a schematic diagram of a display substrate according to an embodiment of the present disclosure;

[0096] FIG. 13 is a schematic diagram of a temperature detection process according to an embodiment of the present disclosure;

[0097] FIG. 14 is a schematic diagram of a temperature detection process according to an embodiment of the present disclosure;

[0098] FIG. 15 is a schematic diagram of a temperature detection process according to an embodiment of the present disclosure;

[0099] FIG. 16 is a fourth temperature detection flowchart according to an embodiment of the present disclosure;

[0100] FIG. 17 is a fifth temperature detection flowchart according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0101] In order to make the objects, technical solutions and advantages of the embodiments of the present disclosure clearer, the technical solutions of the embodiments of the present disclosure will be described clearly and completely below with reference to the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, rather than all the embodiments. Moreover, the embodiments in the present disclosure and the features in the embodiments can be combined with each other without conflict. Based on the described embodiments of the present disclosure, all other embodiments obtained by a person of ordinary skill in the art without creative effort fall within the scope of protection of the present disclosure.

[0102] Unless otherwise defined, technical terms or scientific terms used in the present disclosure should be understood as having the same meaning as commonly understood by a person of ordinary skill in the art to which the present disclosure belongs. The terms "first", "second", and similar terms used in the present disclosure do not denote any order, quantity, or importance, but are used to distinguish different components. The terms "include", "contain", and similar terms mean that the elements or objects before the terms encompass the elements or objects listed after the terms and their equivalents, without excluding other elements or objects. The terms "connect" or "connected" and similar terms do not mean only physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms "inner", "outer", "upper", "lower", and the like only represent relative positional relationships, which can change accordingly when the absolute positions of the described objects change.

[0103] It should be noted that the sizes and shapes of the figures in the drawings do not reflect the true proportions, but only serve to illustrate the present disclosure. And the same or similar reference numbers represent the same or similar elements or elements with the same or similar functions throughout.

[0104] In the related art, a temperature sensor made of an NTC thermistor is often used for temperature detection. For example, a lookup table (i.e., a resistance-temperature table) can be used to obtain the corresponding temperature value by detecting the derived resistance value. Since the temperature sensor used in each product model is relatively far away from the display product (e.g., the temperature sensor is arranged on a circuit board), accurate detection of the temperature at the corresponding position cannot be achieved. Moreover, the existing temperature detection can be interfered by the signal lines in the display substrate, resulting in a decrease in detection accuracy, and the display substrate can be affected by the signal interference of the temperature detection component, resulting in light leakage.

[0105] Therefore, referring to FIG. 1 and FIG. 2, the display device provided by the embodiment of the present disclosure includes:

[0106] The display substrate 100 has a plurality of temperature detection components 10.

[0107] The control circuit 300 is coupled with the plurality of temperature detection components 10.

[0108] The detection circuit 200 is electrically coupled with the plurality of temperature detection components 10 and the control circuit 300. The detection circuit 200 is configured to control the control circuit 300 to load a common voltage to the temperature detection components 10 when the display substrate 100 is in a data refresh stage t1, and is configured to control the control circuit 300 to load a temperature detection signal to the temperature detection components 10 when the display substrate 100 is in an interframe blanking stage t2, and determine the temperature at the position of the temperature detection components 10 according to a temperature feedback signal fed back by the temperature detection components 10.

[0109] In the embodiment of the present disclosure, the display device includes the control circuit 300 and the detection circuit 200. The detection circuit 200 can control the control circuit 300 to load a temperature detection signal Vs to the temperature detection components 10 in the interframe blanking stage t2, thereby achieving temperature detection of each position of the display substrate 100. Compared with placing the temperature detection components 10 on the periphery of the display substrate (such as on a circuit board), the embodiment of the present disclosure can more accurately achieve temperature detection of each position of the display substrate. Moreover, in the interframe blanking stage t2, the temperature detection components 10 load the temperature detection signal Vs for temperature detection, which can avoid the interference of voltage change of the display substrate gate line on temperature detection (when the data line is driven, an entire row of data signal is loaded at the same time, and positive and negative data voltages are distributed in a row of pixels, which affect mutual offset, so the data voltage change loaded by the data line has less influence on temperature detection of the temperature detection components).

[0110] Optionally, the resistance change amount of the temperature detection components can be obtained according to the temperature feedback signal fed back by the temperature detection components, and a pre-calibrated and pre-stored temperature-resistance change relationship can be called to determine the temperature at the position of the temperature detection components. The temperature-resistance change relationship can be obtained by calibration test before the display device is shipped and stored in the display device.

[0111] Optionally, the data refresh stage t1 can be a stage in which the gate lines are opened row by row and the data lines load voltages to the pixel electrodes; and the frame blanking stage t2 can be a time period between adjacent two frames.

[0112] Optionally, the common voltage and the temperature detection signal can have different voltages. For example, the common voltage can be -0.05V to 0.2V, for example, -0.5V; and the temperature detection signal can be a temperature detection voltage, for example, the temperature detection voltage can be 3V to 5V.

[0113] In a possible implementation, in combination with FIG. 1, the control circuit 300 includes a switch switcher 301; a first input end of the switch switcher 301 is coupled with the detection circuit 200, a second input end of the switch switcher 301 is coupled with the common voltage end Vc, a third input end of the switch switcher 301 is coupled with the temperature detection signal end Vs, and an output end of the switch switcher is coupled with an input end of the temperature detection component 10; and an output end of the temperature detection component 10 is coupled with the detection circuit 200. In this way, the switch switcher 301 can provide the common voltage of the common voltage end Vc or the temperature detection signal of the temperature detection signal end Vs to the input end of the temperature detection component 10 according to the control of the detection circuit 200.

[0114] Optionally, the switch switcher 301 can be an analog switch, which can be a single component or a circuit composed of multiple components; and can be implemented by using a component or a circuit that can realize switching in a conventional technology.

[0115] In a possible implementation, the input end and the output end of the temperature detection component 10 can be coupled with the output end of the switch switcher 301 or the detection circuit 200 through a switching structure, for example, the display substrate can include a plurality of binding terminal groups 400, the input end and the output end of the temperature detection component 10 can be respectively bound with binding terminals in the binding terminal groups 400 first, and then coupled with the output end of the switch switcher 301 or the detection circuit 200 through the binding terminals.

[0116] In a possible implementation, in combination with FIG. 1, the temperature detection component 10 can include an input end and an output end; the input end can be electrically connected with the control circuit 300, for inputting the common voltage or the temperature detection signal; and the output end can be electrically connected with the detection circuit 200, for sending a temperature feedback signal detected by the temperature detection component 10 to the detection circuit 200, to realize temperature detection.

[0117] In a possible implementation, as shown in FIG. 3, the detection circuit 200 includes at least one multiplexer 21 and a processing circuit 22; the multiplexer 21 is coupled to the temperature detection component 10 and the processing circuit 22; part of the input end of the multiplexer 21 is coupled to the output end of the plurality of temperature detection components 10, part of the input end of the multiplexer 21 is coupled to the processing circuit 22, and the output end of the multiplexer 21 is coupled to the processing circuit 22; the multiplexer 22 is configured to sequentially send the temperature feedback signals fed back by the plurality of temperature detection components 10 to the processing circuit 22 according to the control signal of the processing circuit 22 received. In the embodiment of the present disclosure, the detection circuit 200 includes at least one multiplexer 21, one multiplexer 21 is connected with a plurality of temperature detection components 10, and the temperature feedback signals detected by the temperature detection components 10 can be sequentially sent to the detection circuit 200, so that the number of connection wires between the temperature detection components 10 and the processing circuit 22 can be reduced, the wiring complexity of the display device can be reduced, and the manufacturing cost of the display device can be reduced.

[0118] In a possible implementation, as shown in FIG. 3, the display device includes a plurality of control signal lines 5 connected between the part of the input end of the multiplexer 21 and the processing circuit 22, and the processing circuit 22 can control the multiplexer 21 to open different paths at different time periods through the plurality of control signal lines 5, so that the temperature feedback signals fed back by different temperature detection components 10 can be sequentially sent to the processing circuit 22.

[0119] In a possible implementation, the structure of the multiplexer 22 can be the same as that of a conventional multiplexer, and details are not described herein again.

[0120] In a possible implementation, as shown in FIG. 4, the processing circuit 22 includes a first resistor 221, a first amplifier 222, a first analog-to-digital converter 223, and a processor 224.

[0121] One end of the first resistor 221 is coupled to the output end of the temperature detection component 10, and the other end of the first resistor 221 is coupled to the ground end.

[0122] The first input end of the first amplifier 222 is coupled to the output end of the multiplexer 21, the second input end of the first amplifier 222 is coupled to the reference voltage end Vref, and the output end of the first amplifier 222 is coupled to the input end of the first analog-to-digital converter 223.

[0123] The output end of the first analog-to-digital converter 223 is coupled to the first input end of the processor 224.

[0124] The second input end of the processor 224 is coupled to the display substrate 100, and the first output end of the processor 224 is coupled to the control circuit 300.

[0125] The direction indicated by the arrow in FIG. 4 can be the flow direction of the signal. The first amplifier 222 is configured to amplify the difference between the potential output by the multiplexer 21 and the potential of the reference voltage terminal Vref, to obtain an amplified voltage value. The first analog-to-digital converter 223 is configured to convert the amplified voltage value into a corresponding digital signal. The processor 224 is configured to obtain a corresponding resistance value according to the digital signal corresponding to the amplified voltage value and store the resistance value. In this exemplary embodiment, the amplified acquisition of the temperature detection component 10 can be realized.

[0126] In actual applications, the resistance value of the first resistor 221 can be selected according to the situation, so that the initial value (i.e., the voltage difference between the corresponding two ports) of the first amplifier 222 is close to 0V, thereby ensuring the sensitivity of the amplified acquisition of the temperature detection component 10. For example, the resistance value of the first resistor 221 can be selected to be equal to the initial resistance value (resistance when no temperature detection is performed) of the temperature detection component 10. For example, the potential loaded to the power terminal V1 is 5V, and the potential loaded to the reference voltage terminal Vref is 2.5V. When the resistance value of the first resistor 221 is equal to the initial resistance value of the temperature detection component 10, the initial value of the first amplifier 222 is 0V. In this way, the high sensitivity of the amplified acquisition of the temperature detection component 10 is ensured.

[0127] In a possible implementation, in combination with FIG. 4, each temperature detection component 10 can correspond to a first resistor; a plurality of temperature detection components 10 can share the same first amplifier 222 and a first analog-to-digital converter 223; and all temperature detection components 10 can share the same processor 224. In this way, the precise temperature test of each position of the display substrate can be realized, while the number of component settings of the display device is saved, and the cost of the display device is reduced.

[0128] In actual applications, the processor 224 can obtain a related display signal (for example, a frame signal (VS)) of the display substrate, and determine whether the display substrate is in a data refresh stage or an interframe blanking stage through the related display signal.

[0129] In a possible implementation, the processor 224 can be a micro control unit (MCU).

[0130] It should be noted that the display device provided by the embodiments of the present disclosure can be a liquid crystal display device, can also be an organic light emitting diode display device (Organic Light Emitting Diode, OLED), and can also be a micro light emitting diode (Micro Light-Emitting Diode, Micro LED) display device. Of course, the display substrate provided by the embodiments of the present disclosure can also be applied to the required display device according to the actual application needs, which will not be described in detail here.

[0131] In a possible implementation, referring to FIG. 5A, the display substrate 100 has a display area AA, a binding area BB located at one side of the display area AA, and a binding opposite area CC located at the other side of the display area AA and opposite to the binding area BB; the binding area BB has a plurality of binding terminal groups 400;

[0132] The temperature detection component 10 includes a plurality of first temperature detection components 11 and at least one second temperature detection component 12; the plurality of first temperature detection components 11 are arranged in an array in the display area AA; the second temperature detection component 12 is located in an area between at least some adjacent binding groups 400 in the binding area BB; the display substrate 100 further includes a temperature detection lead 13 electrically connected to the first temperature detection component 11;

[0133] The detection circuit 200 is specifically configured to remove the temperature signal amount of the temperature detection lead 13 according to the temperature feedback signals fed back by the first temperature detection component 11 and the second temperature detection component 12, and determine the temperature at the position of the first temperature detection component 11 in each first detection component row 101 in turn along the direction from the binding area BB to the binding opposite area CC (as indicated by the arrow e in FIG. 5A).

[0134] In the embodiments of the present disclosure, the influence of the temperature detection lead 13 on the detection result of the temperature detection component 10 can be removed by row-by-row reduction, so as to avoid the temperature variation amount caused by the change of the resistance of the temperature detection lead 13 itself with temperature, and thus the temperature detection component 10 can accurately detect the temperature at the position of the display substrate.

[0135] In a possible implementation, the first temperature detection component 11 can be formed by a bent metal wire, and the second temperature detection component 12 can be similar to the first temperature detection component 11 and also be formed by a bent metal wire. Different from the first temperature detection component 11, the second temperature detection component 12 can have a smaller number of bent turns and be used only for detecting the temperature of the bonding area BB. Alternatively, the second temperature detection component 12 can be connected to the bonding terminal group 400 through a lead wire. Alternatively, the second temperature detection component 12 can be arranged near the bonding terminal group 400 to reduce the influence of the lead wire connecting the second temperature detection component 12 to the bonding terminal group on the temperature detection of the bonding area BB.

[0136] In a possible implementation, as shown in FIG. 5A, the detection circuit 200 is specifically configured to determine the temperature at the position of the second temperature detection component 12 according to the temperature feedback signal fed back by the second temperature detection component 12, and take the temperature at the position of the second temperature detection component 12 as the temperature of the temperature detection lead wire 13 corresponding to the first temperature detection component row H.

[0137] In a possible implementation, as shown in FIG. 5A, the detection circuit 200 is specifically configured to determine the temperature at the position of the second temperature detection component 12 according to the temperature feedback signal fed back by the second temperature detection component 12, and take the temperature at the position of the second temperature detection component 12 as the temperature of the temperature detection lead wire 13 corresponding to the first temperature detection component row H.

[0138] In a possible implementation, as shown in FIG. 5A, the detection circuit 200 is specifically configured to determine the temperature of the temperature detection lead wire of the M+1th temperature detection component row H at the first to Mth temperature detection component rows H according to the temperatures at the positions of the first temperature detection components 11 of the first to Mth temperature detection component rows H; wherein the M+1th temperature detection component row H is located on the side of the Mth temperature detection component row H away from the bonding area BB, and M represents a positive integer greater than or equal to 1.

[0139] In a possible implementation, as shown in FIG. 5A, the detection circuit 200 is specifically configured to determine the temperature at the position of the second temperature detection component 12 according to the temperature feedback signal fed back by the second temperature detection component 12, and take the temperature at the position of the second temperature detection component 12 as the temperature of the temperature detection lead wire 13 corresponding to the first temperature detection component row H.

[0140] In the embodiments of the present disclosure, since the second temperature detection component 12 is located near the bonding area BB and the bonding terminal group 400, it can be considered that the second temperature detection component 12 is not affected by the temperature detection lead 13, and the temperature change amount determined according to the temperature feedback signal fed back by the second temperature detection component 12 is the temperature change amount of the bonding area BB; and the temperature change amount determined according to the temperature feedback signal fed back by each first temperature detection component 11 in the first temperature detection component row H adjacent to the bonding area BB includes the temperature change amount caused by the wiring at the position of the first temperature detection component 11 (such as the position of the dashed box S in FIG. 5A), the temperature change amount caused by the temperature detection lead 13 electrically connected to the first temperature detection component 11, and the temperature change amount caused by the temperature detection lead 13 located only in the bonding area BB, which is the same as the temperature change amount measured by the second temperature detection component 12, that is, the temperature change amount at the position of the first temperature detection component 11 (such as the position of the dashed box S in FIG. 5A) can be obtained by removing the temperature change amount determined by the second temperature detection component 12 from the temperature change amount determined by each first temperature detection component 11 in the first temperature detection component row H.

[0141] Similarly, the temperature change amount determined according to the temperature feedback signal fed back by each first temperature detection component 11 in the M+1th temperature detection component row H includes the temperature change amount caused by the wiring at the position of each first temperature detection component 11 in the M+1th temperature detection component row H, and the temperature change amount caused by the temperature detection lead 13 electrically connected to the first temperature detection component 11 at each different row and the bonding area BB, and the temperature change amount caused by the temperature detection lead 13 of the M+1th temperature detection component row H at each different row and the bonding area BB can be the same as the temperature change amount of the corresponding first temperature detection component 11 at each row and the temperature change amount at the corresponding second temperature detection component 12, that is, the temperature change amount at the position of the M+1th temperature detection component 11 can be obtained by removing the temperature change amount of the temperature detection lead 13 of the M+1th temperature detection component row at the first to Mth temperature detection component rows and the bonding area BB from the temperature change amount determined by each first temperature detection component 11 in the M+1th temperature detection component row H.

[0142] In specific implementation, for each first temperature detection component 11 and the temperature detection lead 13 electrically connected thereto, the resistance value of the wiring at the position of the temperature detection lead 13 and the first temperature detection component 11 (such as the position of the dashed box S in FIG. 5A) can be adjusted, for example, to be in a proportion of 1:5;

[0143] For the first temperature detection component row H, the temperature detection lead 13 of each first temperature detection component 11 is only in the binding area BB, if the temperature of each first temperature detection component 11 in the first temperature detection component row H is T0, then the temperature is the temperature T0 of the position (such as the position of the dashed box S in FIG. 5A) of the first temperature detection component 11, which is obtained by the temperature detection lead 13 and the wire of the position (such as the position of the dashed box S in FIG. 5A) of the first temperature detection component 11, because the temperature detection lead 13 is only in the binding area BB, and the temperature change amount thereof is the same as that detected by the second temperature detection component 12, and since the temperature detection lead 13 and the wire of the position (such as the position of the dashed box S in FIG. 5A) of the first temperature detection component 11 are of the same material, the temperature resistance coefficient thereof is the same, and it can be obtained that ΔT01*6=ΔTs1*5+ΔTf*1;

[0144] wherein ΔT01 represents the temperature change amount of the first temperature detection component 11 in the first temperature detection component row H, ΔTf represents the temperature change amount of the temperature detection lead 13 of the first temperature detection component row H (i.e. the temperature change amount of the temperature detection lead 13 of the first temperature detection component row H), and ΔTs1 represents the temperature change amount of the position (i.e. the position of the dashed box S in FIG. 5A) of the first temperature detection component 11 in the first temperature detection component row H, and it can be obtained that ΔT01*6=ΔTs1*5+ΔTf*1;

[0145] For the determination of the position of the temperature detection component 10 in the second temperature detection component row H to the Nth temperature detection component row H, the determination manner is similar to that of the first temperature detection component 11 in the first temperature detection component row H, and specifically, taking the first column first temperature detection component 11 in the display substrate with five temperature detection component rows H as an example, the following is specifically described:

[0146] In the temperature detection lead wire 13, the resistance value of the wire design in the temperature detection component row H of the display area AA accounts for A% of the total resistance of the temperature detection lead wire 13, and the resistance value of the wire design in each temperature detection component row H is equal. For example, as shown in FIG. 5B, the wire of the temperature detection lead wire 13 in the second temperature detection component row H is divided into a wire portion S11 in the first temperature detection component row H and a portion S10 in the fanout (i.e., the binding area BB), wherein the resistance of the wire portion S11 in the first temperature detection component row H accounts for A% of the total resistance of the temperature detection lead wire 13; as shown in FIG. 5C, for the wire of the temperature detection lead wire 13 in the third temperature detection component row H, the wire is divided into a wire portion S21 in the first temperature detection component row H, a wire portion S22 in the second temperature detection component row H, and a portion S20 in the fanout (i.e., the binding area BB), wherein the resistance of the wire portion S21 in the first temperature detection component row H accounts for A% of the total resistance of the temperature detection lead wire 13, and the resistance of the wire portion S22 in the second temperature detection component row H also accounts for A% of the total resistance of the temperature detection lead wire 13.

[0147] That is, in the second temperature detection component row H, the resistance of the wire of the temperature detection lead wire 13 in the display area AA accounts for A% of the total resistance of the temperature detection lead wire 13; in the third temperature detection component row H, the resistance of the wire of the temperature detection lead wire 13 in the display area AA accounts for 2A% of the total resistance of the temperature detection lead wire 13; in the fourth temperature detection component row H, the resistance of the wire of the temperature detection lead wire 13 in the display area AA accounts for 3A% of the total resistance of the temperature detection lead wire 13; in the fifth temperature detection component row H, the resistance of the wire of the temperature detection lead wire 13 in the display area AA accounts for 4A% of the total resistance of the temperature detection lead wire 13; then, the temperature ΔTsn at the first temperature detection component 11 in the nth temperature detection component row H is ΔTsn={ΔT0n*6-ΔTsn-1*A%-…-ΔTs 1*A%-Δ-…*[1-(n-1)*A%]} / 5; ΔT0n represents the temperature change detected by the first temperature detection component 11 in the nth temperature detection component row H; and ΔTf represents the temperature change detected by the second temperature detection component 12.

[0148] Optionally, A can range from 2 to 10, for example, can be 8; taking A as 8 for example, that is, in the second temperature detection component row H, the wiring resistance of the temperature detection lead 13 in the display area AA accounts for 8% of the total resistance of the temperature detection lead 13; in the third temperature detection component row H, the wiring resistance of the temperature detection lead 13 in the display area AA accounts for 16% of the total resistance of the temperature detection lead 13; in the fourth temperature detection component row H, the wiring resistance of the temperature detection lead 13 in the display area AA accounts for 24% of the total resistance of the temperature detection lead 13; in the fifth temperature detection component row H, the wiring resistance of the temperature detection lead 13 in the display area AA accounts for 32% of the total resistance of the temperature detection lead 13; the temperature determination process of the first temperature detection component 11 in each temperature detection component row H is described as follows:

[0149] In the first temperature detection component row H, the temperature of the first temperature detection component 11 is calculated according to the above description of the second temperature detection component 12, that is, ΔT01=(ΔTs1*5+ΔTf*1) / 6, and the ΔTs1 of the first row is (ΔT01*6-ΔTf*1) / 5; ΔT01 represents the temperature change amount detected by the first temperature detection component 11 in the first temperature detection component row H, ΔTf represents the temperature change amount detected by the second temperature detection component 12 (that is, the temperature change amount of the temperature detection lead 13 corresponding to the first temperature detection component row H), and ΔTs1 represents the temperature change amount at the position of the first temperature detection component 11 in the first temperature detection component row H (that is, at the position of the dashed box S in FIG. 5A) calculated;

[0150] In the second temperature detection component row H, ΔT02=(ΔTs2*5+ΔTs1*0.08+ΔTf*0.92) / 6, and the ΔTs2 of the second row is (ΔT02*6-ΔTs1*0.08-ΔTf*0.92) / 5; ΔT02 represents the temperature change amount detected by the first temperature detection component 11 in the second temperature detection component row H, and ΔTs2 represents the temperature change amount at the position of the first temperature detection component 11 in the second temperature detection component row H calculated;

[0151] In the third temperature detection component row H, ΔT03=(ΔTs3*5+ΔTs2*0.08+ΔTs1*0.08+ΔTf*0.84) / 6, and the ΔTs3 of the third row is (ΔT03*6-ΔTs2*0.08-ΔTs1*0.08-ΔTf*0.84) / 5; ΔT03 represents the temperature change amount detected by the first temperature detection component 11 in the third temperature detection component row H, and ΔTs3 represents the temperature change amount at the position of the first temperature detection component 11 in the third temperature detection component row H calculated;

[0152] The fourth temperature detection component row H: ΔT04=(ΔTs4*5+ΔTs3*0.08+ΔTs2*0.08+ΔTs1*0.08+ΔTf*0.76) / 6; the fourth row ΔTs4=(ΔT04*6-ΔTs3*0.08-ΔTs2*0.08-ΔTs1*0.08-ΔTf*0.76) / 5 is obtained; wherein, ΔT04 represents the temperature change detected by the first temperature detection component 11 in the fourth temperature detection component row H, and ΔTs4 represents the temperature change at the position of the first temperature detection component 11 in the fourth temperature detection component row H calculated;

[0153] The fifth temperature detection component row H: ΔT05=(ΔTs5*5+ΔTs4*0.08+ΔTs3*0.08+ΔTs2*0.08+ΔTs1*0.08+ΔTf*0.68) / 6; the fifth row ΔTs5=(ΔT05*6-ΔTs4*0.08-ΔTs3*0.08-ΔTs2*0.08-ΔTs1*0.08-ΔTf*0.68) / 5 is obtained; wherein, ΔT05 represents the temperature change detected by the first temperature detection component 11 in the fifth temperature detection component row H, and ΔTs5 represents the temperature change at the position of the first temperature detection component 11 in the fifth temperature detection component row H calculated;

[0154] In the embodiment of the present disclosure, by removing the influence of the temperature detection lead 13 on the detection result of the temperature detection component 10 row by row, the temperature detection component 10 can accurately detect the temperature at the position of the display substrate.

[0155] Of course, in specific implementation, if the accuracy of the temperature at the position of the temperature detection component is not high, the temperature change caused by the temperature detection lead can also be removed, so that the calculation amount of the display device and the cost of the display device can be reduced.

[0156] In another possible implementation, the display substrate has a display area AA; the plurality of temperature detection components 10 are arranged in an array in the display area AA; as shown in FIG. 6, the display substrate further comprises: a temperature detection lead 13 electrically connected to the temperature detection component 10, and a lead detection line 14 located on one side of the temperature detection lead 13 and adjacent to the temperature detection lead 13; wherein, the temperature detection lead 13 of the temperature detection component 10 in the ith row and the jth column is located on one side of the temperature detection component 10 in the jth column, and the lead detection line 14 corresponding to the temperature detection component 10 in the ith row and the jth column is located on the side of the temperature detection lead 13 away from the temperature detection component 10 in the jth column;

[0157] The detection circuit 200 is specifically configured to determine the temperature of the temperature detection lead 13 according to the temperature feedback signal fed back by the lead detection line 14, and is configured to determine the temperature at the position of the temperature detection component 10 according to the temperature feedback signal fed back by the temperature detection component 10 and the temperature of the temperature detection lead 13.

[0158] In the embodiments of the present disclosure, the temperature determined according to the temperature feedback signal fed back by the temperature detection component 10 includes the temperature at the position of the temperature detection component 10 (as shown in the dashed box in FIG. 6) and the temperature of the temperature detection lead 13. By eliminating the temperature of the temperature detection lead 13, the temperature at the position of the temperature detection component 10 can be obtained. The temperature detected by the lead detection line 14 can be used as the temperature of the temperature detection lead 13, and the temperature at the position of the temperature detection component 10 can be finally determined. Moreover, compared with the algorithm compensation of removing each section of the temperature detection lead 13 row by row as described above, the method of setting the lead detection line 14 can be more accurate and reduce the calculation amount.

[0159] In a possible implementation, referring to FIG. 6, the length of the lead detection line 14 is substantially equal to the length of the temperature detection lead 13, and the line width is equal. In this way, the resistances of the two are substantially equal, and the change amounts of the resistances generated when the temperature changes are also substantially equal.

[0160] In the related art, when the display device is applied to the HUD, the sunlight may flow back, causing the local temperature to rise and the display screen to be burned out. Specifically, when the external sunlight is consistent with the light-out angle of the HUD, the sunlight may flow back along the reverse direction of the forward projection light path of the HUD, and converge on the light engine display screen to form a light spot with a certain size and extremely high energy, which may cause the temperature of the display screen to rise until the display screen is burned out, resulting in the entire light engine system being scrapped. In particular, the Augmented Reality-Head Up Display (AR-HUD) has a longer virtual image distance and a larger virtual image magnification, resulting in a larger amount of backflowing sunlight and a more serious sunlight backflow problem. In the current temperature detection scheme for the display device, the temperature detection position is not accurate enough to determine the accurate temperature at the position of the light spot.

[0161] Therefore, in the embodiments of the present disclosure, referring to FIGS. 7A-7D and FIG. 8, the detection circuit 200 is further configured to determine the target temperature detection component T and the temperature at the position of the target temperature detection component T according to the temperatures at the positions of the plurality of temperature detection components 10, and determine the temperature of the target region Q in the target temperature detection component T according to the temperature at the position of the target temperature detection component T and the temperatures at the positions of the temperature detection components 10 adjacent to the target temperature detection component T. In the embodiments of the present disclosure, the temperature detection component 10 with a higher temperature can be selected as the target temperature detection component T through screening, and then the temperature of the target region Q (i.e., the position of the light spot) is determined according to the target temperature detection component T and the surrounding temperature detection components 10, so that when the temperature at a local position is higher than a set value, the display device can send a prompt signal to the user, so that the user can perform corresponding operations (for example, adjusting the position of the display screen), to avoid the problem that the local temperature keeps rising and the display screen may be burned out.

[0162] In a specific implementation, for how to determine the target temperature detection component 10, in a possible implementation, the detection circuit 200 is specifically configured to determine the average temperature of the plurality of temperature detection components 10 according to the temperatures at the positions of the plurality of temperature detection components 10, and determine the temperature detection component 10 with a temperature higher than the average temperature set value in the plurality of temperature detection components 10 as the target temperature detection component T. That is, the temperature detection component 10 with a temperature higher than the average temperature set value can be determined as the target temperature detection component T, for example, to determine that the temperature is 50°C higher than the average temperature, if the average temperature is 50°C, and it is found that the temperatures of two temperature detection components 10 are 60°C, which is abnormal, and the two temperature detection components 10 can be determined as the target temperature detection component T.

[0163] Optionally, the target temperature detection component T can be one temperature detection component 10 (i.e., the light spot is located at only one temperature detection component 10), as shown in FIG. 7A, or a plurality of (for example, two, three, or four) temperature detection components 10 (i.e., the light spot occupies a plurality of temperature detection components 10), as shown in FIGS. 7B-7D.

[0164] In a specific implementation, for how to determine the target temperature detection component 10, in a possible implementation, the detection circuit 200 is specifically configured to determine the temperature detection component 10 with the highest temperature in the plurality of temperature detection components 10 according to the temperatures at the positions of the plurality of temperature detection components 10, and determine the temperature detection component 10 with the highest temperature as the target temperature detection component. That is, the temperature detection component 10 with the highest temperature in the temperature detection components 10 can be screened out, and the temperature detection component 10 with the highest temperature and the temperature at the position of the temperature detection component 10 are determined as the target temperature detection component T and the temperature at the position of the target temperature detection component T.

[0165] For how to determine the temperature of the target region in the target temperature detection component T according to the temperature detected at the position of the component T and the temperature detected at the position of the temperature detection component 10 adjacent to the target temperature detection component T, in one possible implementation, 2 rows and 2 columns of temperature detection components 10 at the position of the target temperature detection component T can be selected as a temperature detection component matrix T00, and the temperature at the positions of the 2 rows and 2 columns of temperature detection components 10 is used to perform integration determination calculation. In combination with FIG. 8, the specific process is as follows:

[0166] According to the determined target temperature detection component T, the temperature of each temperature detection component 10 in the temperature detection component matrix T00 is obtained, and the temperature of a temperature detection component 10 adjacent to the temperature detection component matrix T00 is obtained; wherein the temperature detection component matrix T00 includes: a first sub-temperature detection component 101, a second sub-temperature detection component 102, a third sub-temperature detection component 103, and a fourth sub-temperature detection component 104; a temperature detection component 10 adjacent to the temperature detection component matrix T00 can be used as a fifth sub-temperature detection component 105; wherein the first sub-temperature detection component 101 is located at the mth row and the nth column, the second sub-temperature detection component 102 is located at the mth row and the n+1th column, the third sub-temperature detection component 103 is located at the m+1th row and the nth column, the fourth sub-temperature detection component 104 is located at the m+1th row and the n+1th column, and the fifth sub-temperature detection component 105 is adjacent to one of the first sub-temperature detection component 101, the second sub-temperature detection component 102, the third sub-temperature detection component 103, and the fourth sub-temperature detection component 104; the target detection component T includes at least one of the first sub-temperature detection component 101, the second sub-temperature detection component 102, the third sub-temperature detection component 103, and the fourth sub-temperature detection component 104;

[0167] The temperature of the target region Q in the target temperature detection component T is determined by the following relationship: T1*Ms1+T2*Ms2+T3*Ms3+T4*Ms4=Tg*Mg+Ts*(Ms1+Ms2+Ms3+Ms4-Mg);

[0168] Wherein, T1 represents the temperature at the position of the first sub-temperature detection component 101, T2 represents the temperature at the position of the second sub-temperature detection component 102, T3 represents the temperature at the position of the third sub-temperature detection component 103, T4 represents the temperature at the position of the fourth sub-temperature detection component 104, Tg represents the temperature at the position of the target region Q, Ts represents the temperature at the position of a temperature detection component 10 adjacent to the temperature detection component matrix T00 (which can be any one of the temperature detection components 10 in the adjacent one circle, and can be the fifth sub-temperature detection component 105), (the Ts temperature can be the average value of the plurality of temperature detection components 10 in the adjacent one circle on the periphery of the temperature detection component matrix T00, or can be the temperature of one temperature detection component 10 on the periphery of the temperature detection component matrix T00), Ms1 represents the area at the position of the first sub-temperature detection component 101, Ms2 represents the area at the position of the second sub-temperature detection component 102, Ms3 represents the area at the position of the third sub-temperature detection component 103, Ms4 represents the area at the position of the fourth sub-temperature detection component 104, and Mg represents the area of the target region Q (i.e. the light spot). Wherein, the area of the target region Q (i.e. the light spot) is fixed and determined by the components in the HUD imaging structure, and the light spot area is uniform in energy, and the temperature rise of the target detection component T is mainly caused by the temperature rise of the light spot.

[0169] Optionally, in some possible embodiments, Ms1, Ms2, Ms3 and Ms4 can be equal (since the first sub-temperature detection component 101, the second sub-temperature detection component 102, the third sub-temperature detection component 103 and the fourth sub-temperature detection component 104 are adjacent temperature detection components, they are located in approximately the same area in the display substrate, and the areas are relatively small, so they can be considered to be approximately equal), for example, when the display substrate as a whole is rectangular, Ms1, Ms2, Ms3 and Ms4 can be equal, and when Ms1, Ms2, Ms3 and Ms4 are equal, the above formula can be: T1*Ms+T2*Ms+T3*Ms+T4*Ms=Tg*Mg+Ts*(4Ms-Mg); in other possible embodiments, Ms1, Ms2, Ms3 and Ms4 can also be unequal, for example, when the outer edge of the display substrate is arc-shaped, Ms1, Ms2, Ms3 and Ms4 at the edge positions can also be set to be unequal.

[0170] Optionally, the area at the position of the first sub-temperature detection component 101 can be the area of the outer contour surrounded by the outermost peripheral traces of the first sub-temperature detection component 101 (e.g., the area at the position of the dashed-line frame S01 in FIG. 5B), the area at the position of the second sub-temperature detection component 102 can be the area of the outer contour surrounded by the outermost peripheral traces of the second sub-temperature detection component 102, the area at the position of the third sub-temperature detection component 103 can be the area of the outer contour surrounded by the outermost peripheral traces of the third sub-temperature detection component 103, and the area at the position of the fourth sub-temperature detection component 104 can be the area of the outer contour surrounded by the outermost peripheral traces of the fourth sub-temperature detection component 104.

[0171] Optionally, the area at the position of the first sub-temperature detection component 101 can also be the area of the outer contour surrounded by the outermost peripheral traces of the first sub-temperature detection component 101 and the adjacent partial temperature detection leads 13 (e.g., the area at the position of the dashed-line frame S02 in FIG. 5B), the area at the position of the second sub-temperature detection component 102 can be the area of the outer contour surrounded by the outermost peripheral traces of the second sub-temperature detection component 102 and the adjacent partial temperature detection leads 13, the area at the position of the third sub-temperature detection component 103 can be the area of the outer contour surrounded by the outermost peripheral traces of the third sub-temperature detection component 103 and the adjacent partial temperature detection leads 13, and the area at the position of the fourth sub-temperature detection component 104 can be the area of the outer contour surrounded by the outermost peripheral traces of the fourth sub-temperature detection component 104 and the adjacent partial temperature detection leads 13.

[0172] Specifically, taking the target area Q (i.e., the light spot) shown in FIG. 8 located at the second row and the third column as an example, the integrated determination manner of the temperature at the light spot area provided by the embodiment of the present disclosure is illustrated as follows:

[0173] For example, when the temperature detection component 10 at the second row and the third column is determined as the target temperature detection component T, 2 rows and 2 columns of temperature detection components 10 at the position of the target temperature detection component T are selected, for example, the temperature detection component 10 at the second row and the second column is selected as the first sub-temperature detection component 101, the target temperature detection component T at the second row and the third column is selected as the second sub-temperature detection component 102, the temperature detection component 10 at the third row and the second column is selected as the third sub-temperature detection component 103, and the temperature detection component 10 at the third row and the third column is selected as the fourth sub-temperature detection component 104, to form a temperature detection component matrix, and any one of the adjacent temperature detection components 10 of the temperature detection component matrix is selected as the fifth sub-temperature detection component 105, for example, the temperature detection component 10 at the second row and the first column is selected as the fifth sub-temperature detection component 105.

[0174] acquiring temperatures of the first sub temperature detecting component 101, the second sub temperature detecting component 102, the third sub temperature detecting component 103, the fourth sub temperature detecting component 104, and the fifth sub temperature detecting component 105;

[0175] The temperature of the target region Q in the target temperature detecting component T is determined by the following relation: T1*Ms1+T2*Ms2+T3*Ms3+T4*Ms4=Tg*Mg+Ts*(Ms1+Ms2+Ms3+Ms4-Mg).

[0176] In a specific implementation, when the 2*2 temperature detecting component matrix is formed by selecting the 2*2 temperature detecting components 10 at the position of the target temperature detecting component T, the selection manner is not limited to the above description, and various selection manners can be used. For example, the target temperature detecting component T in the second row and the third column can be selected as the first sub temperature detecting component 101, the target temperature detecting component 10 in the second row and the second column can be selected as the second sub temperature detecting component 102, the target temperature detecting component 10 in the third row and the second column can be selected as the third sub temperature detecting component 103, and the target temperature detecting component 10 in the third row and the third column can be selected as the fourth sub temperature detecting component 104 to form a temperature detecting component matrix. For another example, the target temperature detecting component 10 in the third row and the third column can be selected as the first sub temperature detecting component 101, the target temperature detecting component 10 in the third row and the second column can be selected as the second sub temperature detecting component 102, the target temperature detecting component 10 in the second row and the second column can be selected as the third sub temperature detecting component 103, and the target temperature detecting component 10 in the second row and the third column can be selected as the fourth sub temperature detecting component 104 to form a temperature detecting component matrix. As long as the target temperature detecting component T is included in the temperature detecting component matrix, the selection manner is not limited.

[0177] The above description is based on the example that the target region Q (i.e., the light spot) is located in one temperature detecting component 10. If the determined target temperature detecting component T is two temperature detecting components 10, i.e., the target region Q (i.e., the light spot) is distributed in the regions of the two temperature detecting components 10, a 2*2 temperature detecting component matrix T00 including the two temperature detecting components 10 is selected for integrated determination. If the determined target temperature detecting component T is three temperature detecting components 10, i.e., the target region Q (i.e., the light spot) is distributed in the regions of the three temperature detecting components 10, a 2*2 temperature detecting component matrix T00 including the three temperature detecting components 10 is selected for integrated determination. If the determined target temperature detecting component T is four temperature detecting components 10, i.e., the target region Q (i.e., the light spot) is distributed in the regions of the four temperature detecting components 10, a 2*2 temperature detecting component matrix T00 including the four temperature detecting components 10 is selected for integrated determination.

[0178] In the embodiments of the present disclosure, the 2*2 matrix T00 of temperature detection components including the target temperature detection component T is selected to perform the integration determination operation, which is convenient for algorithm comparison; moreover, the light spot is generally circular (the size is slightly smaller than that of the temperature detection component 10), and at most four temperature detection components 10 are irradiated, the calculation amount is small, and the operation speed and the temperature detection efficiency can be improved.

[0179] In a possible implementation, the detection circuit 200 is further configured to send an alarm signal to the display substrate 100 when the temperature of the target region Q is higher than the second temperature. In this way, the user can take corresponding operation to avoid the display substrate 100 from being burned by high temperature.

[0180] In specific implementation, because of the process deviation of the wiring of the temperature detection component 10, the uniformity is poor, and the deviation is large if directly detected. The calibration can be performed once before the user uses (for example, before the product is shipped). In a possible implementation, the detection circuit 200 is specifically configured to determine the temperature at the position of the temperature detection component by calling the pre-calibrated and pre-stored temperature resistance value relationship.

[0181] In specific implementation, the display device can first obtain an initial temperature resistance value change relationship; then, the display device is placed in an environment with a set temperature, and when the display device reaches the set temperature, the resistance value and the temperature of each temperature detection component are obtained; and then, the temperature resistance value change relationship corresponding to each temperature component is obtained according to the resistance value and the temperature of each temperature detection component.

[0182] The initial temperature resistance value change relationship can be obtained by testing a test product with a temperature detection component. For the temperature detection component in the manufactured display device, because of the process deviation of the wiring of different temperature detection components, the uniformity is poor, and the deviation is large if directly detected. Therefore, calibration is needed, that is, the initial parameters in the initial temperature resistance value change relationship in different temperature detection components can be different. By placing the display device in an environment with a set temperature, the resistance value and the temperature of each temperature detection component at the set temperature are tested, the initial parameters in the initial temperature resistance value change relationship corresponding to each temperature detection component in the display device are determined, the temperature resistance value change relationship corresponding to each temperature detection component is obtained, and the subsequent temperature detection can be more accurate.

[0183] In the temperature detection of the display device in the later period, the resistance value change of the temperature detection component 10 is obtained according to the temperature feedback signal fed back by the temperature detection component 10, the pre-calibrated and pre-stored temperature resistance value relationship is called, and then the temperature at the position of the temperature detection component is determined.

[0184] It should be noted that the temperature feedback signal fed back by the temperature detection component 10 can be an electrical signal related to the temperature change, for example, can be a voltage signal, or can be a current signal, that is, the resistance change amount is determined by the change amount of the fed back voltage or current signal, and the temperature change amount is determined according to the resistance change amount and the stored temperature-resistance relationship.

[0185] In a possible implementation, the display substrate comprises: a substrate, a pixel electrode layer on one side of the substrate, and a common electrode layer on the side of the pixel electrode layer away from the substrate; the temperature detection component is located between the common electrode layer and the layer where the pixel electrode is located.

[0186] In a possible implementation, the display substrate can further comprise a gate line layer between the substrate and the pixel electrode layer, a gate insulating layer between the gate line layer and the pixel electrode layer, and an active layer between the gate insulating layer and the pixel electrode layer; a data line layer can be further arranged between the pixel electrode layer and the layer where the temperature detection component is located, and a first passivation layer can be further arranged between the data line layer and the layer where the temperature detection component is located; a second passivation layer can be further arranged between the temperature detection component and the common electrode layer.

[0187] In a possible implementation, the material of the temperature detection component 10 can be metal, for example, can comprise Mo / Al / Mo arranged in a stack.

[0188] In a possible implementation, referring to FIG. 9, the temperature detection component 10 comprises: a plurality of trace units MA arranged in sequence along a first direction X, and a first connecting part MB connecting adjacent trace units MA; wherein the trace unit MA comprises: two first traces MA1 extending along a second direction Y, and a second connecting part MA2 connecting the two first traces MA1.

[0189] In a possible implementation, referring to FIG. 10, the temperature detection component 10 further comprises: a plurality of second traces MC extending along the first direction X, and the second traces MC are cross-connected with the first traces MA1.

[0190] In a possible implementation, referring to FIG. 11, the plurality of temperature detection components 10 comprises: a plurality of first detection components 18 arranged in sequence along the first direction X and along the second direction Y, and a plurality of second detection components 19 extending along the second direction Y and arranged on one side along the first direction X; the first detection component 18 comprises: a plurality of first electrode blocks 180 arranged in sequence along the first direction X and electrically connected; the second detection component 19 comprises: a plurality of second electrode blocks 190 arranged on one side along the second direction Y and electrically connected.

[0191] In the embodiments of the present disclosure, the temperature detection of different positions can also be realized by arranging a plurality of first electrode blocks 180 and a plurality of second electrode blocks 190. The first electrode blocks 180 and the plurality of second electrode blocks 190 at different positions can be determined by using the correlation signal detection method of the correlation mutual-capacitance touch, and the resistance change when the temperature changes, so as to realize temperature detection. Moreover, the integrated structure extending in the first direction X as the first detection component 18 and the integrated structure extending in the second direction Y as the second detection component 19 can greatly reduce the number of temperature detection leads and the complexity of temperature calculation.

[0192] In a possible implementation, as shown in FIG. 12, the binding terminal group 400 electrically connected with the temperature detection lead 13 can also be placed in the binding opposite side area CC of the display substrate, or the binding connection area DD between the connection binding area BB and the binding opposite side area CC of the display substrate. In this way, the wiring space of the temperature detection lead can be simplified, and the influence of the temperature detection lead 13 on the temperature detection accuracy of the temperature detection component 10 can be reduced.

[0193] Based on the same inventive concept, the embodiments of the present disclosure also provide a temperature detection method applied to the display device provided by the embodiments of the present disclosure. As shown in FIG. 13, the temperature detection method comprises the following steps:

[0194] In step S100, when it is determined that the display substrate is in the data refresh stage, a control circuit is controlled to load a common voltage to the temperature detection component.

[0195] In step S200, when it is determined that the display substrate is in the interframe blanking stage, the control circuit is controlled to load a temperature detection signal to the temperature detection component.

[0196] In step S300, the temperature at the position of the temperature detection component is determined according to the temperature feedback signal fed back by the temperature detection component. Optionally, the resistance change of the temperature detection component can be obtained according to the temperature feedback signal fed back by the temperature detection component, and the pre-calibrated and pre-stored temperature-resistance change relationship is called to determine the temperature at the position of the temperature detection component. The temperature-resistance change relationship can be obtained by calibration test before the display device is shipped and stored in the display device.

[0197] In the embodiment of the present disclosure, the control circuit 300 loads the temperature detection signal Vs to the temperature detection component 10 at the interframe blanking stage t2, so as to realize temperature detection of each position of the display substrate 100. Compared with placing the temperature detection component 10 on the periphery of the display substrate (such as on the circuit board), the embodiment of the present disclosure can more accurately realize temperature detection of each position of the display substrate. In addition, at the interframe blanking stage t2, the temperature detection component 10 loads the temperature detection signal Vs to perform temperature detection, which can avoid the interference of voltage change of the display substrate gate line on temperature detection (when the data line is driven, an entire row of data signal is loaded at the same time, and the positive and negative data voltages in a row of pixels are distributed alternately, which affects mutual offset, so the data voltage change loaded by the data line has little effect on temperature detection of the temperature detection component); in addition, the detection circuit 200 can also control the control circuit 300 to load a common voltage to the temperature detection component 10 at the data refresh stage t1, and the common voltage can be the same as the common voltage loaded by the common electrode of the display substrate 100 during display, so as to improve the problem that if the temperature detection component 10 loads other signals, the electric field formed by the pixel electrode and the common electrode in the display substrate will be disturbed, causing light leakage of the display substrate and affecting normal display.

[0198] In a possible implementation, for step S300, determining the temperature at the position of the temperature detection component according to the temperature feedback signal fed back by the temperature detection component can specifically include:

[0199] Step S310: removing the temperature signal amount of the temperature detection lead wire in the direction from the binding area to the opposite area of the binding area according to the temperature feedback signals fed back by the first temperature detection component and the second temperature detection component, and determining the temperature at the position of each first detection component row by row.

[0200] In the embodiment of the present disclosure, when determining the temperature at the position of the temperature detection component, the temperature signal amount caused by the temperature detection lead wire can be removed, so that the measured temperature at the position of the temperature detection component is more accurate.

[0201] Of course, in specific implementation, if the accuracy requirement of the temperature at the position of the temperature detection component is not high, the temperature change caused by the temperature detection lead wire can also not be removed, so that the calculation amount of the display device and the cost of the display device can also be reduced.

[0202] In a possible implementation, with reference to FIG. 14, for step S310, removing the temperature signal amount of the temperature detection lead wire in the direction from the binding area to the opposite area of the binding area according to the temperature feedback signals fed back by the first temperature detection component and the second temperature detection component, and determining the temperature at the position of each first detection component row by row, can include:

[0203] In step S311, the temperature at the position of the second temperature detecting component is determined according to the temperature feedback signal fed back by the second temperature detecting component, and the temperature at the position of the second temperature detecting component is taken as the temperature of the temperature detecting lead corresponding to the first temperature detecting component row.

[0204] In step S312, the temperature at the position of the first temperature detecting component of the first temperature detecting component row is determined according to the temperature feedback signal fed back by the first temperature detecting component of the first temperature detecting component row and the temperature of the temperature detecting lead corresponding to the first temperature detecting component row.

[0205] In a possible implementation, referring to FIG. 14, in step S310, the temperature at the position of the first temperature detecting component of each first temperature detecting component row is determined row by row along the direction from the binding area to the opposite area of the binding area according to the temperature feedback signal fed back by the first temperature detecting component and the second temperature detecting component, and the temperature of the temperature detecting lead is removed, and the step further includes:

[0206] In step S313, the temperature of the temperature detecting lead of the M+1th temperature detecting component row at the first temperature detecting component row to the Mth temperature detecting component row is determined according to the temperature at the position of the first temperature detecting component of the first temperature detecting component row to the Mth temperature detecting component row; wherein the M+1th temperature detecting component row is located on the side of the Mth temperature detecting component row away from the binding area, and M represents a positive integer greater than or equal to 1.

[0207] In step S314, the temperature at the position of the first temperature detecting component of the M+1th temperature detecting component row is determined according to the temperature feedback signal fed back by the first temperature detecting component of the M+1th temperature detecting component row and the temperature of the temperature detecting lead of the M+1th temperature detecting component row at the first temperature detecting component row to the Mth temperature detecting component row and the binding area.

[0208] In the embodiments of the present disclosure, the temperature of the temperature detecting component at the position can be obtained more accurately by calculating the temperature influence of the temperature detecting lead at different rows row by row, and the temperature detection of the display device is more accurate.

[0209] In another possible implementation, for the display substrate shown in FIG. 6, the display substrate is further provided with the lead detecting line 14, and in step S300, the temperature at the position of the temperature detecting component is determined according to the temperature feedback signal fed back by the temperature detecting component, and the step further includes:

[0210] The temperature of the temperature detecting lead is determined according to the temperature feedback signal fed back by the lead detecting line, and the temperature at the position of the temperature detecting component is determined according to the temperature feedback signal fed back by the temperature detecting component and the temperature of the temperature detecting lead.

[0211] In a possible implementation, as shown in FIG. 15, after step S300, i.e., after determining the temperature at the position of the temperature detection component, the temperature detection method further includes:

[0212] Step S400, determining the target temperature detection component and the temperature at the position of the target temperature detection component according to the temperatures at the positions of the plurality of temperature detection components;

[0213] Step S500, determining the temperature of the target region in the target temperature detection component according to the temperature at the position of the target temperature detection component and the temperature at the position of the temperature detection component adjacent to the target temperature detection component.

[0214] In a possible implementation, as shown in FIG. 16, for step S400, determining the target temperature detection component according to the temperatures at the positions of the plurality of temperature detection components includes:

[0215] Step S410, determining the average temperature of the plurality of temperature detection components according to the temperatures at the positions of the plurality of temperature detection components;

[0216] Step S420, taking the temperature detection component with a temperature higher than the average temperature set value in the plurality of temperature detection components as the target temperature detection component.

[0217] In a possible implementation, for step S400, determining the target temperature detection component according to the temperatures at the positions of the plurality of temperature detection components includes:

[0218] Step S430, determining the temperature detection component with the highest temperature in the plurality of temperature detection components according to the temperatures at the positions of the plurality of temperature detection components, and taking the temperature detection component with the highest temperature as the target temperature detection component.

[0219] In a possible implementation, as shown in FIG. 16, for step S500, determining the temperature of the target region in the target temperature detection component according to the temperature at the position of the target temperature detection component and the temperature at the position of the temperature detection component adjacent to the target temperature detection component includes:

[0220] Step S510, according to the determined target temperature detection component, obtaining the temperature of each temperature detection component in the temperature detection component matrix and the temperature of the temperature detection component adjacent to the temperature detection component matrix;

[0221] Step S520, determining the temperature of the target region in the target temperature detection component by the following relationship: T1*Ms1+T2*Ms2+T3*Ms3+T4*Ms4=Tg*Mg+Ts*(Ms1+Ms2+Ms3+Ms4-Mg);

[0222] The temperature detection component matrix comprises a first sub-temperature detection component, a second sub-temperature detection component, a third sub-temperature detection component, and a fourth sub-temperature detection component; the first sub-temperature detection component is located at the mth row and the nth column, the second sub-temperature detection component is located at the mth row and the n+1th column, the third sub-temperature detection component is located at the m+1th row and the nth column, and the fourth sub-temperature detection component is located at the m+1th row and the n+1th column; the first sub-temperature detection component, the second sub-temperature detection component, the third sub-temperature detection component, and the fourth sub-temperature detection component have equal areas; the target detection component comprises at least one of the first sub-temperature detection component, the second sub-temperature detection component, the third sub-temperature detection component, and the fourth sub-temperature detection component; T1 represents the temperature at the position of the first sub-temperature detection component, T2 represents the temperature at the position of the second sub-temperature detection component, T3 represents the temperature at the position of the third sub-temperature detection component, T4 represents the temperature at the position of the fourth sub-temperature detection component, Tg represents the temperature at the position of the target region, Ts represents the temperature at the position of a temperature detection component adjacent to the temperature detection component matrix, Ms11 represents the area at the position of the first sub-temperature detection component, Ms2 represents the area at the position of the second sub-temperature detection component, Ms3 represents the area at the position of the third sub-temperature detection component, Ms4 represents the area at the position of the fourth sub-temperature detection component, and Mg represents the area of the target region.

[0223] In a possible implementation, after step S500, after determining the temperature of the target region in the target temperature detection component, the temperature detection method further comprises:

[0224] When it is determined that the temperature of the target region is higher than the second temperature in step S600, an alarm signal is sent to the display substrate.

[0225] In a possible implementation, referring to FIG. 17, before step S100, that is, before determining that the display substrate is in the data refreshing stage, before the control control circuit loads the common voltage to the temperature detection component, the temperature detection method further comprises:

[0226] In step S001, an initial temperature-resistance value change relationship is obtained.

[0227] In step S002, the display device is placed in an environment with a set temperature, and when the display device reaches the set temperature, the resistance value and the temperature of each temperature detection component are obtained.

[0228] In step S003, according to the resistance value and the temperature of each temperature detection component, a temperature-resistance value change relationship corresponding to each temperature component is obtained.

[0229] The initial temperature-resistance value change relationship can be obtained by testing a test product with the temperature detection component; and for the temperature detection component in the manufactured display device, due to the trace process deviation of different temperature detection components, the uniformity is not good, if directly detected, the deviation is large, and a calibration is required, that is, the initial parameters in the initial temperature-resistance value change relationship of different temperature detection components can be different, by placing the display device in an environment with a set temperature, testing the resistance value and the temperature of each temperature detection component at the set temperature, the initial parameters of each temperature detection component in the initial temperature-resistance value change relationship can be determined, the temperature-resistance value change relationship corresponding to each temperature detection component is obtained, and the subsequent temperature detection can be more accurate.

[0230] In the specific implementation, only one calibration before leaving the factory can be performed, that is, one step S001-step S003 is performed, and in the temperature detection in the subsequent use process of the display device, the temperature-resistance value change relationship can be directly called.

[0231] Although the preferred embodiments of the present disclosure have been described, those skilled in the art can make additional changes and modifications to the embodiments once they know the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications falling within the scope of the present disclosure.

[0232] Obviously, those skilled in the art can make various modifications and variations to the present disclosure without departing from the spirit and scope of the present disclosure. Thus, if these modifications and variations of the present disclosure fall within the scope of the claims of the present disclosure and their equivalent technologies, the present disclosure also intends to include these modifications and variations.

Claims

1. A display device, wherein, The display substrate has a plurality of temperature detection components; A control circuit is coupled to the plurality of temperature detection components; A detection circuit is electrically coupled to the plurality of temperature detection components and the control circuit; The detection circuit is configured to control the control circuit to load a common voltage to the temperature detection components when determining that the display substrate is in a data refresh stage, and is configured to control the control circuit to load a temperature detection signal to the temperature detection components when determining that the display substrate is in an interframe blanking stage, and determine the temperature at the position of the temperature detection components according to a temperature feedback signal fed back by the temperature detection components. The control circuit includes a switch switcher; 2. The display device of claim 1, wherein, A first input end of the switch switcher is coupled to the detection circuit, a second input end of the switch switcher is coupled to a common voltage end, a third input end of the switch switcher is coupled to a temperature detection signal end, and an output end of the switch switcher is coupled to an input end of the temperature detection component; An output end of the temperature detection component is coupled to the detection circuit. The detection circuit includes at least one multiplexer and a processing circuit; the multiplexer is coupled to the temperature detection component and the processing circuit; 3. The display device according to claim 1 or 2, wherein Part of the input end of the multiplexer is coupled to the output end of the plurality of temperature detection components, part of the input end is coupled to the processing circuit, and the output end of the multiplexer is coupled to the processing circuit; the multiplexer is configured to sequentially send the temperature feedback signal fed back by the plurality of temperature detection components to the processing circuit according to the control signal received by the processing circuit. The processing circuit includes a first resistor, a first amplifier, a first analog-to-digital converter, and a processor; 4. The display device of claim 3, wherein, One end of the first resistor is coupled to the output end of the temperature detection component, and the other end of the first resistor is coupled to a ground end; The first input end of the first amplifier is coupled to the output end of the multiplexer, the second input end of the first amplifier is coupled to a reference voltage end, and the output end of the first amplifier is coupled to the input end of the first analog-to-digital converter; The output end of the first analog-to-digital converter is coupled to the first input end of the processor; The second input end of the processor is coupled to the display substrate, and the first output end of the processor is coupled to the control circuit. The display substrate has a display area, a binding area located on one side of the display area, and a binding opposite area located on the other side of the display area and opposite to the binding area; The binding area has a plurality of binding terminal groups; 5. A display device as claimed in any one of claims 1-4, wherein The temperature detection component includes a plurality of first temperature detection components and at least one second temperature detection component; the plurality of first temperature detection components are arranged in an array in the display area; the second temperature detection component is located in the area between at least some adjacent binding groups in the binding area; and the display substrate further includes a temperature detection lead electrically connected to the first temperature detection component. ​ ​ The detection circuit is specifically configured to remove the temperature signal amount of the temperature detection lead in the direction from the binding area to the opposite area of the binding area according to the temperature feedback signal fed back by the first temperature detection component and the second temperature detection component, and determine the temperature at the position of the first detection component of each first detection component row.

6. The display device of claim 5, wherein, The detection circuit is specifically configured to determine the temperature at the position of the second temperature detection component according to the temperature feedback signal fed back by the second temperature detection component, and take the temperature at the position of the second temperature detection component as the temperature of the temperature detection lead corresponding to the first detection component row. And configured to determine the temperature at the position of the first detection component of the first detection component row according to the temperature feedback signal fed back by the first detection component of the first detection component row and the temperature of the temperature detection lead corresponding to the first detection component row.

7. A display device as claimed in claim 5 or 6, wherein, The detection circuit is specifically configured to determine the temperature of the temperature detection lead at the first to Mth detection component rows according to the temperature at the position of the first detection component of the first to Mth detection component rows; wherein the M+1th detection component row is located on the side of the Mth detection component row away from the binding area, and M represents a positive integer greater than or equal to 1. And configured to determine the temperature at the position of the first detection component of the M+1th detection component row according to the temperature feedback signal fed back by the first detection component of the M+1th detection component row and the temperature of the temperature detection lead of the M+1th detection component row at the first to Mth detection component rows and the binding area.

8. The display device of any of claims 1-4, wherein, The display substrate has a display area; a plurality of temperature detection components are arranged in an array in the display area; The display substrate further comprises a temperature detection lead electrically connected to the temperature detection component, and a lead detection line located on one side of the temperature detection lead and adjacent to the temperature detection lead; wherein the temperature detection lead of the temperature detection component in the ith row and jth column is located on one side of the temperature detection component in the jth column, and the lead detection line corresponding to the temperature detection component in the ith row and jth column is located on the side of the temperature detection lead away from the temperature detection component in the jth column. The detection circuit is specifically configured to determine the temperature of the temperature detection lead according to the temperature feedback signal fed back by the lead detection line, and to determine the temperature at the position of the temperature detection component according to the temperature feedback signal fed back by the temperature detection component and the temperature of the temperature detection lead.

9. A display device as claimed in any one of claims 1-8, wherein, The detection circuit is further configured to: determine the target temperature detection component and the temperature at the position of the target temperature detection component according to the temperature at the position of a plurality of temperature detection components; Determine the temperature of the target region in the target temperature detection component according to the temperature at the position of the target temperature detection component and the temperature at the position of the temperature detection component adjacent to the target temperature detection component.

10. The display device of claim 9, wherein, The detection circuit is specifically configured to: Determine the average temperature of the plurality of temperature detection components according to the temperature at the position of the plurality of temperature detection components; The temperature detection component with a temperature higher than the average temperature setting value in the plurality of temperature detection components is taken as the target temperature detection component.

11. The display device of claim 9, wherein, The detection circuit is specifically configured to: Determine the temperature detection component with the highest temperature in the plurality of temperature detection components according to the temperature at the position of the plurality of temperature detection components, and take the temperature detection component with the highest temperature as the target temperature detection component.

12. A display device as claimed in any one of claims 9-11, wherein, The detection circuit is specifically configured to: According to the determined target temperature detection component, obtain the temperature of each temperature detection component in the temperature detection component matrix, and obtain the temperature of a temperature detection component adjacent to the temperature detection component matrix; Determine the temperature of the target region in the target temperature detection component according to the following relationship: T1*Ms1+T2*Ms2+T3*Ms3+T4*Ms4=Tg*Mg+Ts* (Ms1+Ms2+Ms3+Ms4-Mg); Wherein, the temperature detection component matrix includes: a first sub-temperature detection component, a second sub-temperature detection component, a third sub-temperature detection component, and a fourth sub-temperature detection component; wherein the first sub-temperature detection component is located in the mth row and the nth column, the second sub-temperature detection component is located in the mth row and the n+1th column, the third sub-temperature detection component is located in the m+1th row and the nth column, and the fourth sub-temperature detection component is located in the m+1th row and the n+1th column; the target detection component includes at least one of the first sub-temperature detection component, the second sub-temperature detection component, the third sub-temperature detection component, and the fourth sub-temperature detection component; T1 represents the temperature at the position of the first sub-temperature detection component, T2 represents the temperature at the position of the second sub-temperature detection component, T3 represents the temperature at the position of the third sub-temperature detection component, T4 represents the temperature at the position of the fourth sub-temperature detection component, Tg represents the temperature at the position of the target region, Ts represents the temperature at the position of the temperature detection component adjacent to the temperature detection component matrix, Ms1 represents the area at the position of the first sub-temperature detection component, Ms2 represents the area at the position of the second sub-temperature detection component, Ms3 represents the area at the position of the third sub-temperature detection component, Ms4 represents the area at the position of the fourth sub-temperature detection component, Ms represents the area of the first sub-temperature detection component, the second sub-temperature detection component, the third sub-temperature detection component, the fourth sub-temperature detection component, or the temperature detection component adjacent to the temperature detection component matrix, and Mg represents the area of the target region. ​ 13. A display device as claimed in any one of claims 9-12, wherein, The detection circuit is further configured to send an alarm signal to the display substrate when the temperature of the target area is higher than a second temperature.

14. The display device of any of claims 1-13, wherein, The detection circuit is specifically configured to obtain a resistance value change of the temperature detection component according to the temperature feedback signal fed back by the temperature detection component, and determine the temperature at the position of the temperature detection component by calling a pre-calibrated and pre-stored temperature-resistance value relationship.

15. A display device as claimed in any one of claims 1 to 14, wherein, The display substrate comprises a substrate, a pixel electrode layer on one side of the substrate, and a common electrode layer on the side of the pixel electrode layer away from the substrate; and the temperature detection component is located between the common electrode layer and the layer where the pixel electrode is located.

16. A display device as claimed in any one of claims 1 to 15, wherein, The temperature detection component comprises a plurality of wiring units arranged in sequence along a first direction, and a first connecting portion connecting adjacent wiring units; wherein each wiring unit comprises two first wires extending along a second direction, and a second connecting portion connecting the two first wires.

17. The display device of claim 16, wherein, The temperature detection component further comprises a plurality of second wires extending along the first direction, and the second wires are cross-connected with the first wires.

18. The display device of claim 1, wherein, The plurality of temperature detection components comprise a plurality of first detection components arranged in sequence along a first direction and a second direction, and a plurality of second detection components arranged on one side along the second direction and extending along the first direction; The first detection component comprises a plurality of first electrode blocks arranged in sequence along the first direction and electrically connected; and the second detection component comprises a plurality of second electrode blocks arranged on one side along the second direction and electrically connected.

19. A temperature detecting method applied to the display device according to any one of claims 1 to 18, wherein The temperature detection method comprises: When it is determined that the display substrate is in a data refreshing stage, the control circuit is controlled to load a common voltage to the temperature detection component; When it is determined that the display substrate is in an interframe blanking stage, the control circuit is controlled to load a temperature detection signal to the temperature detection component, and the temperature at the position of the temperature detection component is determined according to the temperature feedback signal fed back by the temperature detection component.

20. The temperature detecting method according to claim 19, wherein The determination of the temperature at the position of the temperature detection component according to the temperature feedback signal fed back by the temperature detection component comprises: According to the temperature feedback signals fed back by the first temperature detection component and the second temperature detection component, the temperature signal amount of the temperature detection lead is removed in the direction from the binding area to the opposite side area of the binding area, and the temperature at the position of each first detection component in each first detection component row is determined row by row.

21. The temperature detecting method according to claim 20, wherein According to the temperature feedback signals fed back by the first temperature detection component and the second temperature detection component, the temperature signal amount of the temperature detection lead is removed in the direction from the binding area to the opposite side area of the binding area, and the temperature at the position of each first detection component in each first detection component row is determined row by row. According to the temperature feedback signal fed back by the second temperature detection component, the temperature at the position of the second temperature detection component is determined, and the temperature at the position of the second temperature detection component is taken as the temperature of the temperature detection lead corresponding to the first detection component row. According to the temperature feedback signal fed back by the first temperature detection component in the first temperature detection component row and the temperature of the temperature detection lead wire corresponding to the first temperature detection component row, the temperature at the position of the first temperature detection component in the first temperature detection component row is determined. According to the temperature feedback signal fed back by the first temperature detection component in the first temperature detection component row and the temperature of the temperature detection lead wire corresponding to the first temperature detection component row, the temperature at the position of the first temperature detection component in the first temperature detection component row is determined.

22. The temperature detecting method according to claim 21, wherein The temperature at the position of the first temperature detection component in each first temperature detection component row is determined row by row according to the temperature feedback signal fed back by the first temperature detection component and the second temperature detection component, and the temperature signal amount of the temperature detection lead wire is removed in the direction from the binding area to the opposite area of the binding area. According to the temperature at the position of the first temperature detection component in the first to Mth temperature detection component rows, the temperature of the temperature detection lead wire at the first to Mth temperature detection component rows of the M+1th temperature detection component row is determined; wherein the M+1th temperature detection component row is located on the side of the Mth temperature detection component row away from the binding area, and M represents a positive integer greater than or equal to 1. According to the temperature feedback signal fed back by the first temperature detection component in the first temperature detection component row and the temperature of the temperature detection lead wire corresponding to the first temperature detection component row, the temperature at the position of the first temperature detection component in the first temperature detection component row is determined.

23. The temperature detecting method according to claim 19, wherein The temperature at the position of the temperature detection component is determined according to the temperature feedback signal fed back by the temperature detection component, and the temperature of the temperature detection lead wire is determined according to the temperature feedback signal fed back by the temperature detection component and the temperature of the temperature detection lead wire. After determining the temperature at the position of the temperature detection component, the temperature detection method further comprises:

24. The temperature detection method of any one of claims 19-23, wherein, According to the temperature at the position of the target temperature detection component and the temperature at the position of the temperature detection component adjacent to the target temperature detection component, the temperature of the target region in the target temperature detection component is determined. According to the temperature at the position of the target temperature detection component and the temperature at the position of the temperature detection component adjacent to the target temperature detection component, the temperature of the target region in the target temperature detection component is determined. According to the temperature at the position of the target temperature detection component and the temperature at the position of the temperature detection component adjacent to the target temperature detection component, the temperature of the target region in the target temperature detection component is determined.

25. The temperature detecting method according to claim 24, wherein According to the temperature at the position of the target temperature detection component and the temperature at the position of the temperature detection component adjacent to the target temperature detection component, the temperature of the target region in the target temperature detection component is determined. According to the temperature at the position of the target temperature detection component and the temperature at the position of the temperature detection component adjacent to the target temperature detection component, the temperature of the target region in the target temperature detection component is determined. According to the temperature at the position of the target temperature detection component and the temperature at the position of the temperature detection component adjacent to the target temperature detection component, the temperature of the target region in the target temperature detection component is determined.

26. The temperature detecting method according to claim 24, wherein ​ ​ 27. The temperature detection method of any one of claims 24-26, wherein, Determining the temperature of the target region within the target temperature detection component based on the temperature at the location of the target temperature detection component and the temperatures at the locations of adjacent temperature detection components includes: Based on the determined target temperature detection component, the temperature of each temperature detection component in the temperature detection component matrix is ​​obtained, as well as the temperature of a temperature detection component adjacent to the temperature detection component matrix is ​​obtained; The temperature of the target region in the target temperature detection component is determined by the following relationship: T1*Ms1+T2*Ms2+T3*Ms3+T4*Ms4=Tg*Mg+Ts* (Ms1+Ms2+Ms3+Ms4-Mg); The temperature detection component matrix includes: a first sub-temperature detection component, a second sub-temperature detection component, a third sub-temperature detection component, and a fourth sub-temperature detection component; wherein the first sub-temperature detection component is located in row m and column n, the second sub-temperature detection component is located in row m and column n+1, the third sub-temperature detection component is located in row m+1 and column n, and the fourth sub-temperature detection component is located in row m+1 and column n+1; the target detection component includes: the first sub-temperature detection component. The temperature is defined as follows: T1 represents the temperature at the location of the first sub-temperature detection component, T2 represents the temperature at the location of the second sub-temperature detection component, T3 represents the temperature at the location of the third sub-temperature detection component, T4 represents the temperature at the location of the fourth sub-temperature detection component, Tg represents the temperature at the location of the target area, Ts represents the temperature at the location of the temperature detection component adjacent to the temperature detection component matrix, Ms1 represents the area at the location of the first sub-temperature detection component, Ms2 represents the area at the location of the second sub-temperature detection component, Ms3 represents the area at the location of the third sub-temperature detection component, Ms4 represents the area at the location of the fourth sub-temperature detection component, Ms represents the area of ​​the first sub-temperature detection component, the second sub-temperature detection component, the third sub-temperature detection component, the fourth sub-temperature detection component, or the temperature detection component adjacent to the temperature detection component matrix, and Mg represents the area of ​​the target area.

28. The temperature detection method of any one of claims 24-27, wherein, After determining the temperature of the target region in the target temperature detection component, the temperature detection method further includes: When the temperature of the target area is determined to be higher than the second temperature, an alarm signal is sent to the display substrate.

29. The temperature detection method of any one of claims 19-28, wherein, Before controlling the control circuit to apply a common voltage to the temperature detection component when determining that the display substrate is in the data refresh stage, the temperature detection method further includes: Obtain the relationship between the resistance change at the initial temperature; The display device is placed in an environment with a set temperature. When the display device reaches the set temperature, the resistance and temperature of each temperature detection component are obtained. According to the resistance value and the temperature of each temperature detection component, a temperature-resistance value change relationship corresponding to each temperature component is obtained.

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