Ultrasonic fingerprint recognition apparatus and electronic device

Abstract

Embodiments of the present application provide an ultrasonic fingerprint recognition apparatus and an electronic device. The ultrasonic fingerprint recognition apparatus is disposed on an inner surface of a middle frame of an electronic device, and comprises: a plurality of ultrasonic detection chips, an electrical connection member, and a plurality of flexible circuit boards. The plurality of ultrasonic detection chips are disposed on the inner surface of the middle frame along a first direction. The plurality of ultrasonic detection chips respectively send ultrasonic signals to the middle frame above the plurality of ultrasonic detection chips and receive ultrasonic fingerprint signals fed back from a finger on the middle frame, the ultrasonic fingerprint signals of the plurality of ultrasonic detection chips being used to detect a sliding operation of the finger on the middle frame, and the first direction being the length direction of the middle frame. The plurality of ultrasonic detection chips are each electrically connected to a respective corresponding flexible circuit board via the electrical connection member, so as to be electrically connected to a main board of the electronic device via traces on the flexible circuit boards. The present solution can improve the mechanical reliability and waterproof performance of the ultrasonic fingerprint recognition apparatus and achieve detection of a sliding operation of a finger on the middle frame, thereby enabling additional derived functions based on sliding operations, such as volume adjustment and camera focusing.

Description

Ultrasonic fingerprint identification device and electronic device TECHNICAL FIELD

[0001] Embodiments of the present application relate to the technical field of fingerprint identification, and in particular to an ultrasonic fingerprint identification device and an electronic device. BACKGROUND

[0002] With the development of the consumer electronics industry, electronic devices with fingerprint identification function on the side are becoming more and more popular. A capacitive fingerprint identification device is usually installed in the button of the side frame of the electronic device to realize the fingerprint identification function. Since the capacitive fingerprint identification chip in the capacitive fingerprint identification device has poor penetration, the mechanical reliability of the capacitive fingerprint identification device is lacking, which affects the design of the button of the side frame of the electronic device and the provision of additional functions derived from the button. Moreover, the capacitive fingerprint identification chip also causes the button cover plate of the side of the electronic device to be unable to be designed as an arc surface, which has certain limitations.

[0003] SUMMARY

[0004] Therefore, embodiments of the present application provide an ultrasonic fingerprint identification device and an electronic device to at least partially solve the above problems.

[0005] According to a first aspect of embodiments of the present application, an ultrasonic fingerprint identification device is provided, which is arranged on an inner surface of a frame of an electronic device. The ultrasonic fingerprint identification device comprises a plurality of ultrasonic detection chips, an electrical connection member, and a plurality of flexible circuit boards.

[0006] The plurality of ultrasonic detection chips are arranged on the inner surface of the frame along a first direction. The plurality of ultrasonic detection chips respectively emit ultrasonic signals to the frame above them and receive ultrasonic fingerprint signals fed back from a finger of the frame. The ultrasonic fingerprint signals of the plurality of ultrasonic detection chips are used to detect a sliding operation of the finger on the frame. The first direction is the length direction of the frame.

[0007] The ultrasonic detection chips are respectively electrically connected to the flexible circuit boards through the electrical connection member, so as to be electrically connected to a mainboard of the electronic device through the wirings of the flexible circuit boards.

[0008] According to a second aspect of embodiments of the present application, an electronic device is provided, which comprises a frame and an ultrasonic fingerprint identification device according to the first aspect, and the ultrasonic fingerprint identification device is arranged on the frame.

[0009] In the scheme of the embodiments of the present application, since the ultrasonic detection chip of the ultrasonic fingerprint identification device has strong penetration, the ultrasonic fingerprint identification device can be directly arranged on the inner surface of the middle frame of the electronic device, and the middle frame provides protection, thereby improving the mechanical reliability and waterproof performance of the ultrasonic fingerprint identification device. At the same time, since the ultrasonic detection chip has strong penetration, it can support various middle frame materials and processes, for example, the part where the preset identification area of the middle frame is designed as a curved surface, etc., improving the form beauty of the process design of the electronic device. In addition, the plurality of ultrasonic detection chips are arranged on the inner surface of the middle frame along the first direction, respectively emitting ultrasonic signals to the middle frame, and receiving ultrasonic fingerprint signals fed back from the fingers above the middle frame. Since the signal amount of the ultrasonic fingerprint signals received by the plurality of ultrasonic detection chips is different when the fingers are at different positions of the middle frame, when the fingers move along the first direction on the middle frame, the signal amount of the ultrasonic fingerprint signals received by the plurality of ultrasonic detection chips will change, and according to the change of the signal amount of the ultrasonic fingerprint signals of the plurality of ultrasonic detection chips, the detection of the sliding operation of the fingers on the middle frame can be realized, thereby realizing the additional derived functions such as volume adjustment, camera focusing based on sliding operation. And, the plurality of ultrasonic detection chips are arranged along the first direction as the length direction of the middle frame, which expands the effective area of the sliding operation, thereby more accurate sliding operation can be realized, so that various additional derived functions based on sliding operation can be better realized. BRIEF DESCRIPTION OF DRAWINGS

[0010] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments or prior art description will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments described in the embodiments of the present application, and other drawings can also be obtained by those skilled in the art based on these drawings.

[0011] FIG. 1 is a top view of a capacitive fingerprint identification device mounted to a middle frame of an electronic device;

[0012] FIG. 2 is a packaging schematic diagram of a capacitive fingerprint identification device mounted to a middle frame of an electronic device;

[0013] FIG. 3 is an assembly schematic diagram of a capacitive fingerprint identification device mounted to a middle frame of an electronic device;

[0014] FIG. 4 is a top view of an ultrasonic fingerprint identification device provided by the embodiments of the present application;

[0015] FIG. 5 is a cross-sectional view of the ultrasonic fingerprint identification device shown in FIG. 4 along the X axis;

[0016] FIG. 6 is a top view of an ultrasonic fingerprint identification device provided by another embodiment of the present application;

[0017] Fig. 7 is a cross-sectional view of the ultrasonic fingerprint identification device shown in Fig. 6 along the X axis;

[0018] Fig. 8 is a top view of an ultrasonic fingerprint identification device according to another embodiment of the present application;

[0019] Fig. 9A is a cross-sectional view of the ultrasonic fingerprint identification device shown in Fig. 8 along the X axis;

[0020] Fig. 9B shows a structural schematic diagram of a middle frame applicable to the ultrasonic fingerprint identification device shown in Fig. 8;

[0021] Fig. 9C shows a structural schematic diagram of an auxiliary mounting member of the ultrasonic fingerprint identification device shown in Fig. 8;

[0022] Fig. 10 is a top view of an ultrasonic fingerprint identification device according to another embodiment of the present application;

[0023] Fig. 11 is a cross-sectional view of the ultrasonic fingerprint identification device shown in Fig. 10 along the X axis;

[0024] Fig. 12 is a top view of an ultrasonic fingerprint identification device according to another embodiment of the present application;

[0025] Fig. 13 is a cross-sectional view of the ultrasonic fingerprint identification device shown in Fig. 12 along the X axis;

[0026] Fig. 14 is a top view of an ultrasonic fingerprint identification device according to another embodiment of the present application;

[0027] Fig. 15 is a cross-sectional view of the ultrasonic fingerprint identification device shown in Fig. 14 along the X axis;

[0028] Fig. 16 is a top view of an ultrasonic fingerprint identification device according to another embodiment of the present application;

[0029] Fig. 17 is a cross-sectional view of the ultrasonic fingerprint identification device shown in Fig. 16 along the X axis;

[0030] Fig. 18 is a structural schematic diagram of an electronic device according to an embodiment of the present application. DETAILED DESCRIPTION

[0031] In order to make personnel in the art better understand the technical solutions in the embodiments of the present application, the technical solutions in the embodiments of the present application will be described clearly and completely below in combination with the drawings of the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application shall fall within the scope of protection of the present application.

[0032] The specific implementation of the embodiments of the present application will be further described below in combination with the drawings of the embodiments of the present application.

[0033] FIG. 1 is a top view of a capacitive fingerprint recognition device mounted to a middle frame of an electronic device. FIG. 2 is a packaging schematic view of a capacitive fingerprint recognition device mounted to a middle frame of an electronic device. FIG. 3 is an assembly schematic view of a capacitive fingerprint recognition device mounted to a middle frame of an electronic device.

[0034] Referring to FIGS. 1 to 3, the capacitive fingerprint recognition device 2 includes a substrate 20, a capacitive fingerprint recognition chip 21 disposed on the substrate, a plastic encapsulation layer 22 encapsulating the capacitive fingerprint recognition chip, a coating layer 23 coated on an outer surface of the plastic encapsulation layer, and a flexible circuit board 24 electrically connecting the substrate 20 to a main board of an electronic device. Since the capacitive fingerprint recognition chip 21 has poor penetration performance, the thickness of the plastic encapsulation layer 22 on the front surface of the capacitive fingerprint recognition chip 21 cannot be too thick and needs to be controlled within 150 um. This greatly affects the mechanical reliability, waterproof performance, and the like of the capacitive fingerprint recognition device 2. In order to improve the mechanical reliability of the electronic device having the capacitive fingerprint recognition device 2, a groove is usually dug in the key area of the middle frame 1 of the electronic device where the capacitive fingerprint recognition device 2 is located, so that the height of the capacitive fingerprint recognition key is lower than the plane where the middle frame 1 is located, thereby protecting the capacitive fingerprint recognition device 2 with poor mechanical reliability by the middle frame.

[0035] In addition, since the mechanical reliability of the capacitive fingerprint recognition device 2 is deficient, additional derivative functions such as volume adjustment, camera focusing, and the like based on a sliding operation cannot be provided by the capacitive fingerprint recognition key. Also, due to the limitation of the capacitive fingerprint recognition chip, the pressing surface of the area where the capacitive fingerprint recognition key is located can only be a plane, so when the middle frame is an arc design, the plane design of the area where the capacitive fingerprint recognition key is located results in a deficiency in the form aesthetics of the process design of the electronic device. The surface process of the area where the capacitive fingerprint recognition key is located is mostly matte, and the coating process also has certain limitations on the process design of the key.

[0036] To overcome the above technical defects, the embodiment of the present application provides an ultrasonic fingerprint identification device. The ultrasonic fingerprint identification device adopts an ultrasonic detection chip. Since the ultrasonic detection chip has strong penetration, the ultrasonic fingerprint identification device can be directly arranged on the inner surface of the middle frame of the electronic device, and the relatively thick middle frame provides protection, thereby improving the mechanical reliability and waterproof performance of the ultrasonic fingerprint identification device. At the same time, since the ultrasonic detection chip has strong penetration, it can support various middle frame materials and processes, which can improve the form beauty of the process design of the electronic device. In addition, the ultrasonic fingerprint identification device has a plurality of ultrasonic detection chips arranged on the inner surface of the middle frame of the electronic device along the first direction. According to the signal amount change of the ultrasonic fingerprint signal generated by the plurality of ultrasonic detection chips, the detection of the sliding operation of the finger on the middle frame can be realized, thereby realizing the additional derived functions such as volume adjustment, camera focusing based on the sliding operation. And, the plurality of ultrasonic detection chips are arranged along the first direction as the length direction of the middle frame, which expands the effective area of the sliding operation, thereby better realizing various additional derived functions based on the sliding operation.

[0037] The embodiment of the present application can be applied to any electronic device that can install a fingerprint identification device on the middle frame, such as a mobile phone, a tablet, a laptop, a wearable device, etc. The ultrasonic fingerprint identification device provided by the embodiment of the present application is arranged on the middle frame of the electronic device to realize the ultrasonic fingerprint identification function and other derived functions based on the sliding operation. The middle frame of the electronic device refers to the frame structure arranged along the circumference of the electronic device. Generally, the electronic device includes a front shell, a rear shell and a middle frame, and the middle frame is located between the front shell and the rear shell. In the embodiment of the present application, the middle frame can be an integrated frame structure composed of a plurality of side edges connected end to end. The middle frame can also be a split frame structure composed of a frame body and a frame cover plate. In the split frame structure, the frame body includes a plurality of side edges connected end to end and an opening is formed on a side edge of the plurality of side edges. The frame cover plate covers the opening to form a complete frame structure together with the frame cover plate.

[0038] In the embodiment of the present application, the middle frame has a preset identification area, which refers to the area on the middle frame where the ultrasonic fingerprint identification device is located. During the use of the electronic device, when the finger is pressed on the preset identification area of the middle frame or slides within the preset identification area, the electronic device can perform fingerprint detection and / or various function controls based on the sliding operation. The various function controls include but are not limited to volume adjustment, camera focusing, etc. In the embodiment of the present application, for the middle frame with an integrated frame structure, the preset identification area can be located on a specific side edge of the middle frame. For the middle frame with a split frame structure, the preset identification area can be located on the frame cover plate of the middle frame.

[0039] First embodiment

[0040] FIG. 4 is a top view of the ultrasonic fingerprint identification device 4 according to an embodiment of the present application, and FIG. 5 is a cross-sectional view of the ultrasonic fingerprint identification device 4 along the X-axis shown in FIG. 4. FIGS. 4 and 5 are described by taking an example in which the ultrasonic fingerprint identification device is applied to a middle frame 3 having an integrated frame structure. The middle frame 3 (only a part is shown) shown in FIGS. 4 and 5 has a preset identification area 30. It should be understood that, in order to facilitate understanding, the relative arrangement positions of the components in the ultrasonic fingerprint identification device 4 on the middle frame 3 of the electronic device are shown by a dashed box in FIG. 4.

[0041] Referring to FIGS. 4 and 5, the ultrasonic fingerprint identification device 4 includes a plurality of ultrasonic detection chips 40a, 40b, a plurality of electrical connection members 41a, 41b, and a plurality of flexible circuit boards 42a, 42b. The plurality of ultrasonic detection chips 40a, 40b correspond to the plurality of flexible circuit boards 42a, 42b one by one. Each ultrasonic detection chip 40a or 40b is electrically connected to the corresponding flexible circuit board 42a or 42b. The plurality of ultrasonic detection chips 40a, 40b are arranged on the inner surface of the middle frame 3 along the first direction X, specifically, on the inner surface of the middle frame 3 at the position of the preset identification area 30. The plurality of ultrasonic detection chips 40a, 40b respectively emit ultrasonic signals to the middle frame above. Specifically, ultrasonic signals are respectively emitted to the respective corresponding sub-areas in the preset identification area 30 of the middle frame 3, and ultrasonic fingerprint signals fed back from the fingers above the sub-areas are received. The ultrasonic fingerprint signals of the plurality of ultrasonic detection chips 40a, 40b are used to detect the sliding operation of the fingers on the preset identification area 30. The plurality of ultrasonic detection chips 40a, 40b are respectively electrically connected to the respective corresponding flexible circuit boards 42a, 42b through the electrical connection members 41a, 41b, so as to be electrically connected to the main board (not shown) of the electronic device through the wirings of the flexible circuit boards 42a, 42b.

[0042] In the embodiment of the present application, the first direction X is the length direction of the preset identification area 30. The first direction X is also the length direction of the middle frame part where the ultrasonic fingerprint identification device 4 is located. The plurality of ultrasonic detection chips 40a, 40b are arranged on the inner surface of the middle frame part at the position of the preset identification area 30 along the first direction X, thereby expanding the effective area of the fingerprint identification of the electronic device, and performing the fingerprint identification based on the ultrasonic fingerprint signals provided by the plurality of ultrasonic detection chips 40a, 40b, thereby improving the accuracy of the fingerprint identification.

[0043] In the embodiment, the sub-region corresponding to each ultrasonic detection chip in the preset recognition region includes a middle frame region directly above the ultrasonic detection chip and other middle frame regions to which the ultrasonic signal can be transmitted due to the diffraction of the ultrasonic wave, the other middle frame regions being adjacent to the middle frame region directly above the ultrasonic detection chip. The sub-regions corresponding to the ultrasonic detection chips overlap in the first direction. Since the signal amount of the ultrasonic fingerprint signal generated by the multiple ultrasonic detection chips 40a and 40b is different when the finger is at different positions on the preset recognition region 30, when the finger continuously moves along the first direction X on the preset recognition region 30, the signal amount of the ultrasonic fingerprint signal received by the multiple ultrasonic detection chips 40a and 40b changes, and the change in the signal amount of the ultrasonic fingerprint signal received by the multiple ultrasonic detection chips 40a and 40b can be used to detect the sliding operation of the finger on the preset recognition region 30, thereby achieving the functions of volume adjustment, camera focusing, and the like based on the sliding operation.

[0044] FIG. 4 shows an example in which the ultrasonic fingerprint recognition device provided in the embodiment can achieve volume adjustment. As shown in FIG. 4, the preset recognition region 30 of the middle frame 2 is provided with volume identifiers represented by symbols "+" and "-". When a sliding operation from the symbol "+" to the symbol "-" is detected based on the ultrasonic fingerprint signal received by the multiple ultrasonic detection chips 40a and 40b, it indicates that the user reduces the volume, and when a sliding operation from the symbol "+" to the symbol "-" is detected based on the ultrasonic fingerprint signal received by the multiple ultrasonic detection chips 40a and 40b, it indicates that the user increases the volume, thereby achieving the function of volume adjustment.

[0045] In an implementation of the present application, as shown in FIG. 4 and FIG. 5, the plurality of ultrasonic detection chips 40a, 40b are arranged at preset intervals along the first direction on the inner surface of the preset identification area 30, and the preset intervals are set such that the respective sub-areas of the plurality of ultrasonic detection chips 40a, 40b in the preset identification area are different and have overlaps. Specifically, as mentioned above, due to the diffraction of ultrasonic waves, the ultrasonic signal emitted by each ultrasonic detection chip can be transmitted not only to the middle frame area directly above the ultrasonic detection chip, but also to other middle frame areas adjacent to the middle frame area. Therefore, such other middle frame areas can be used as detection areas. In the present embodiment, by having preset intervals between the plurality of ultrasonic detection chips 40a, 40b, the overall detection area of the ultrasonic detection chips 40a, 40b can be increased, and thus the effective area of the sliding detection can be expanded, thereby better realizing various functions based on sliding operations. In a specific implementation, the preset intervals are less than or equal to 6 mm and greater than or equal to 0.26 mm. In the present solution, the preset intervals between the ultrasonic detection chips specifically refer to the preset intervals between the AA (Active Area, sensing area) regions of one ultrasonic detection chip and the AA regions of another ultrasonic detection chip. Specifically, the AA region can refer to the area where the receiving electrode array of the ultrasonic detection chip is located. Setting the preset intervals to be greater than or equal to 0.26 mm can increase the overall detection area of the two ultrasonic detection chips, thereby expanding the effective area of the sliding detection. In addition, setting the preset intervals to be less than or equal to 6 mm can avoid too many undetectable areas between the two ultrasonic detection chips, thereby affecting the effect of the sliding detection. When the preset distance is set to 0.46, the effective area of the sliding detection can be expanded, and the sliding detection can also have better effects.

[0046] In an implementation of the present application, as shown in FIG. 5, the ultrasonic fingerprint identification device 4 further comprises a chip carrier plate arranged below the ultrasonic detection chips and the flexible circuit boards, for supporting the ultrasonic detection chips and the flexible circuit boards. Specifically, the plurality of ultrasonic detection chips 40a, 40b share one chip carrier plate 43. The edge regions of the sides of the plurality of ultrasonic detection chips 40a, 40b facing the middle frame 3 (specifically, the sides facing the middle frame part where the preset identification area 30 is located) are respectively provided with first pads 401a, 401b, the first pads 401a, 401b of the plurality of ultrasonic detection chips 40a, 40b are respectively connected to the second pads 421a, 421b of the respective corresponding flexible circuit boards 42a, 42b through the electrical connection members 41a, 41b, the other regions of the sides of the plurality of ultrasonic detection chips 40a, 40b facing the middle frame are attached to the inner surface of the middle frame part where the preset identification area 30 is located, and the sides of the plurality of ultrasonic detection chips 40a, 40b away from the middle frame (specifically, the sides away from the middle frame part where the preset identification area 30 is located) are attached to the chip carrier plate 43.

[0047] Specifically, the ultrasonic detection chips 40a, 40b are bare chips without packaging materials. The ultrasonic detection chips 40a, 40b include a silicon wafer layer and an acoustic layer disposed on the silicon wafer layer. The ultrasonic detection chips 40a, 40b emit ultrasonic signals from the acoustic layer. Generally, the pads of the ultrasonic detection chips electrically connected to external circuits are disposed on the side of the silicon wafer layer of the ultrasonic detection chips on which the acoustic layer is located. Hereinafter, for the convenience of description, the side of the silicon wafer layer of the ultrasonic detection chips on which the acoustic layer is located is referred to as the front side of the ultrasonic detection chips. In some application scenarios, the pads disposed on the front side of the ultrasonic detection chips can be led to the side of the silicon wafer layer of the ultrasonic detection chips away from the acoustic layer by using a through silicon via (TSV) packaging method, so as to provide pads on the back of the ultrasonic detection chips. Hereinafter, for the convenience of description, the side of the silicon wafer layer of the ultrasonic detection chips away from the acoustic layer is referred to as the front side of the ultrasonic detection chips. The present solution is described by taking front sticking as an example, that is, the acoustic layer is stuck to the inner surface of the middle frame, and back sticking refers to the silicon wafer layer being stuck to the inner surface of the middle frame. When the front sticking mode is used, the sensing distance is smaller, and the sensing accuracy is higher.

[0048] In the present implementation, the pads (i.e., the first pads herein) of the ultrasonic detection chips 40a, 40b are disposed at the edge region (i.e., the first chip region) of the front side of the ultrasonic detection chips 40a, 40b. The other regions (i.e., the second chip region) of the front side of the ultrasonic detection chips 40a, 40b are stuck to the inner surface of the middle frame portion where the preset recognition area 30 is located, and the back of the ultrasonic detection chips 40a, 40b is stuck to the chip carrier plate 43 to be supported by the chip carrier plate 43. At the same time, since the plurality of ultrasonic detection chips 40a, 40b share one chip carrier plate 43, when the ultrasonic fingerprint recognition device is assembled in the electronic device, the plurality of ultrasonic detection chips 40a, 40b can be fixed on the chip carrier plate 43 first, and then the plurality of ultrasonic detection chips 40a, 40b are installed together on the inner surface of the middle frame portion where the preset recognition area 30 is located through the chip carrier plate 43, thereby improving the efficiency of assembly.

[0049] In an implementation of the present application, the plurality of flexible circuit boards 42a, 42b respectively include first end portions 422a, 422b electrically connected to the corresponding ultrasonic detection chips 40a, 40b, and the second pads 421a, 421b of each flexible circuit board 42a, 42b are disposed on the first surface of the first end portion 422a, 422b of the flexible circuit board facing the preset recognition area 30, and the second surface of the first end portion 422a, 422b of the flexible circuit board away from the preset recognition area 30 is stuck to the chip carrier plate 30.

[0050] Specifically, referring to FIG. 4 and FIG. 5, each flexible circuit board 42a, 42b includes a first end portion 422a, 422b and a second end portion 423a, 423b. The first end portion 422a, 422b is the end portion of the flexible circuit board for connecting with the ultrasonic detection chip, and the second end portion 423a, 423b is the end portion of the flexible circuit board for connecting with the mainboard (not shown) of the electronic device. Each flexible circuit board 42a, 42b is folded to form a U-shaped structure. The two parallel sides of the U-shaped structure are the first end portion 422a, 422b and the second end portion 423a, 423b of the flexible circuit board, respectively. The first end portion 422a, 422b is located above the chip carrier board 43, and the second end portion 423a, 423b is located below the chip carrier board 43. The pads 421a, 421b (i.e., the second pads) on the flexible circuit board 42a, 42b for connecting with the ultrasonic detection chip are arranged at the first end portion 422a, 422b of the flexible circuit board 42a, 42b. The first end portion 422a, 422b is attached to the chip carrier board 43 and is supported by the chip carrier board 43, thereby facilitating the welding of the second pads 421a, 421b on the flexible circuit board 42a, 42b to the electrical connection member 41a, 41b.

[0051] In the embodiments of the present application, the electrical connection member 41a, 41b is a bonding wire.

[0052] In an implementation manner of the present application, the electrical connection member 41a, 41b is covered with a protective glue 45 to protect the electrical connection member 41a, 41b and the first pads 401a, 401b and the second pads 421a, 421b connected by the electrical connection member 41a, 41b.

[0053] In an implementation manner of the present application, in order to ensure the attachment effect, other regions on the front surface of the plurality of ultrasonic detection chips 40a, 40b are respectively attached to the inner surface of the middle frame portion where the preset identification area 30 is located by the first adhesive 44. The thickness of the first adhesive 44 arranged between the front surface of the plurality of ultrasonic detection chips 40a, 40b and the inner surface of the middle frame is set to be such that there is a preset gap between the protective glue and the inner surface of the middle frame, so as to avoid the collision between the electrical connection member and the protective glue and the middle frame.

[0054] In an implementation manner of the present application, the back surface of the ultrasonic detection chip 40a, 40b and the second surface of the first end portion 422a, 422b of the flexible circuit board 42a, 42b are attached to the chip carrier board 43 by the third adhesive 47 to ensure the attachment effect.

[0055] In the embodiments of the present application, the first adhesive 44 and the third adhesive 47 include glue or adhesive film to further improve the attachment effect and save the process cost.

[0056] In the embodiments of the present application, the material of the chip carrier plate 43 can include, but is not limited to, glass, sapphire, etc. In order to provide sufficient rigidity, in an implementation of the present application, the thickness of the chip carrier plate 43 is greater than or equal to 0.4 mm.

[0057] In the embodiments of the present application, the material of the middle frame 3 can be plastic or metal.

[0058] In the embodiments of the present application, the thickness of the middle frame above the ultrasonic fingerprint identification device, i.e., the thickness of the middle frame 3 at the preset identification area 30, is less than or equal to 1.5 mm, i.e., the thickness of the middle frame above the ultrasonic fingerprint identification device is less than or equal to 1.5 mm. Preferably, the thickness of the middle frame above the ultrasonic fingerprint identification device is 0.8 mm, 1.0 mm or 1.3 mm, so as to improve the mechanical reliability of the ultrasonic fingerprint identification device 4 while maintaining the fingerprint identification performance of the ultrasonic fingerprint identification device 4.

[0059] In the embodiments of the present application, the outer surface of the middle frame 3 at the preset identification area 30 can be designed as a curved surface to improve the appearance of the middle frame.

[0060] It is worth noting that FIGS. 4 and 5 take two ultrasonic detection chips 40a and 40b as examples for illustration, and it should be understood that in other embodiments, the ultrasonic detection chip can be three or more ultrasonic detection chips, which are not limited by the present application.

[0061] Second Example

[0062] FIG. 6 is a top view of an ultrasonic fingerprint identification device provided by another embodiment of the present application. FIG. 7 is a cross-sectional view of the ultrasonic fingerprint identification device shown in FIG. 6 along the X axis. FIGS. 6 and 7 take an example of the ultrasonic fingerprint identification device applied to a middle frame with an integrated frame structure. The ultrasonic fingerprint identification device 5 shown in FIGS. 6 and 7 is similar to the ultrasonic fingerprint identification device 4 shown in FIGS. 4 and 5, and the main difference is that each ultrasonic detection chip is provided with a chip carrier plate, and each ultrasonic detection chip and the corresponding flexible circuit board are arranged on the corresponding chip carrier plate.

[0063] Specifically, as shown in FIG. 6 and FIG. 7, the ultrasonic fingerprint identification device 5 comprises a plurality of ultrasonic detection chips 40a, 40b, a plurality of electric connection members 41a, 41b, and a plurality of flexible circuit boards 42a and 42b corresponding to the plurality of ultrasonic detection chips 40a, 40b. The ultrasonic detection chip 40a is provided with a chip carrier plate 43a in correspondence, and the ultrasonic detection chip 40b is provided with a chip carrier plate 43b in correspondence. The ultrasonic detection chip 40a and the corresponding flexible circuit board 42a are arranged on the chip carrier plate 43a, and the ultrasonic detection chip 40b and the corresponding flexible circuit board 42b are arranged on the chip carrier plate 43b. In the present application, the connection mode of the ultrasonic detection chip 40a and the corresponding flexible circuit board 42a with the chip carrier plate 43a and the connection mode of the ultrasonic detection chip 40b and the corresponding flexible circuit board 42b with the chip carrier plate 43b are the same as the connection mode of each fingerprint detection chip with the chip carrier plate 43 in the embodiment shown in FIG. 4 and FIG. 5, which will not be described here.

[0064] In the present application, the ultrasonic detection chip and the flexible circuit board are usually fixed on the chip carrier plate in advance, and then fixed to the inner surface of the middle frame through the chip carrier plate. Since each ultrasonic detection chip is provided with a chip carrier plate, when a certain ultrasonic detection chip fails, replacing the ultrasonic detection chip will not affect the ultrasonic detection chip arranged on another chip carrier plate, the replacement process is easier and the replacement cost is lower.

[0065] In addition, it is worth noting that FIG. 6 and FIG. 7 take two ultrasonic detection chips 40a and 40b as an example for description, and it should be understood that in other embodiments, the ultrasonic detection chip can be three or more ultrasonic detection chips, which are not limited by the present application.

[0066] Third embodiment

[0067] FIG. 8 is a top view of an ultrasonic fingerprint identification device provided by another embodiment of the present application. FIG. 9A is a sectional view of the ultrasonic fingerprint identification device shown in FIG. 8 along the X axis. FIG. 8 and FIG. 9A take the ultrasonic fingerprint identification device applied to a middle frame with an integrated frame structure as an example for description. The ultrasonic fingerprint identification device 6 shown in FIG. 8 and FIG. 9A is similar to the ultrasonic fingerprint identification device 4 shown in FIG. 4 and FIG. 5, and the main difference is that the ultrasonic fingerprint identification device further comprises an auxiliary mounting member 60, and the ultrasonic detection chips 40a, 40b of the ultrasonic fingerprint identification device 6 are arranged on the inner surface of the middle frame part 3 of the preset identification area 30 through the auxiliary mounting member 60. The middle frame 3 applicable to the ultrasonic fingerprint identification device shown in FIG. 8 and FIG. 9A is provided with a base groove 301 for accommodating the auxiliary mounting member 60 as shown in FIG. 9B.

[0068] As shown in FIGS. 8 and 9A, the ultrasonic fingerprint identification device 6 comprises a plurality of ultrasonic detection chips 40a, 40b, a plurality of electrical connection members 41a, 41b, a plurality of flexible circuit boards 42a, 42b, and an auxiliary mounting member 60. The plurality of flexible circuit boards 42a, 42b correspond to the plurality of ultrasonic detection chips 40a, 40b one-to-one. A first surface of the auxiliary mounting member 60 facing the preset identification area 30 of the middle frame is attached to the bottom wall of the base groove 301. The plurality of ultrasonic detection chips 40a, 40b are attached to a second surface of the auxiliary mounting member 60 facing away from the preset identification area 30 along the first direction X.

[0069] Specifically, the edge regions of the front surfaces of the plurality of ultrasonic detection chips 40a, 40b are respectively provided with first pads 401a, 401b, and the first pads 401a, 401b of the plurality of ultrasonic detection chips 40a, 40b are respectively connected to the second pads 421a and 421b of the corresponding flexible circuit boards 42a, 42b through the electrical connection members 41a, 41b. The other regions of the front surfaces of the plurality of ultrasonic detection chips 40a, 40b are attached to the second surface of the auxiliary mounting member 60, and thus are finally arranged on the inner surface of the preset identification area 30 of the middle frame 3. As shown in FIG. 9C, the second surface of the auxiliary mounting member 60 is provided with a plurality of avoiding grooves 601 corresponding to the electrical connection members 41a, 41b, for accommodating the electrical connection members 41a, 41b to prevent the electrical connection members 41a, 41b from colliding with the auxiliary mounting member 60.

[0070] Similar to FIGS. 4 and 5, the ultrasonic detection chips 40a, 40b are bare chips without encapsulation by encapsulation materials. The front surface of the ultrasonic detection chip 40a, 40b refers to the surface where the acoustic layer of the ultrasonic detection chip is located, and the ultrasonic detection chip 40a, 40b emits ultrasonic signals from the acoustic layer. The back surface of the ultrasonic detection chip 40a, 40b refers to the surface where the silicon wafer layer of the ultrasonic detection chip is located.

[0071] Similar to the embodiment shown in FIGS. 4 and 5, the first direction X is the length direction of the preset identification area 30. The first direction X is also the length direction of the middle frame portion where the ultrasonic fingerprint identification device 4 is located. The plurality of ultrasonic detection chips 40a, 40b are attached to the second surface of the auxiliary mounting member 60 facing away from the preset identification area 30 along the first direction X, and thus are arranged on the inner surface of the preset identification area 30 through the auxiliary mounting member 60. The plurality of ultrasonic detection chips 40a, 40b respectively emit ultrasonic signals to the respective corresponding sub-areas in the preset identification area 30, receive ultrasonic fingerprint signals fed back from the fingers above the sub-areas, and thus realize fingerprint identification and sliding operation of the fingers in the preset identification area 30 based on the ultrasonic fingerprint signals of the plurality of ultrasonic detection chips 40a, 40b.

[0072] In the embodiments of the present application, other regions of the front surface of the plurality of ultrasonic detection chips 40a, 40b are attached to the second surface of the auxiliary mounting member 60 by the first adhesive 44 to ensure the attachment effect. The first adhesive 44 includes but is not limited to a film or glue.

[0073] In the embodiments of the present application, the auxiliary mounting member 60 is added, and the avoiding groove 601 is formed on the second surface of the auxiliary mounting member 60 facing the ultrasonic detection chips 40a, 40b, for accommodating the electrical connection members 41a, 41b, so that the first adhesive 44 between the ultrasonic detection chips 40a, 40b and the second surface of the auxiliary mounting member 60 does not need to have a sufficient thickness to avoid the collision between the electrical connection members 41a, 41b and the auxiliary mounting member 60. That is, the relatively thin first adhesive 44 can be used to attach the ultrasonic detection chips 40a, 40b to the auxiliary mounting member 60, which can effectively reduce the interference of the first adhesive 44 to the ultrasonic signals emitted by the ultrasonic detection chips 40a, 40b, and improve the accuracy of the fingerprint recognition and the sliding operation detection.

[0074] Similar to the first and second embodiments, the ultrasonic fingerprint recognition device 6 further includes the chip carrier plate 43, and the plurality of flexible circuit boards 42a, 42b respectively include the first end portion 422a, 422b electrically connected to the corresponding ultrasonic detection chip 40a, 40b. The second pad 421a, 421b of each flexible circuit board 42a, 42b is arranged on the first surface of the first end portion 422a, 422b of the flexible circuit board 42a, 42b facing the first surface of the auxiliary mounting member 60, and the first end portion 422a, 422b of the flexible circuit board 42a, 42b is attached to the chip carrier plate 43 away from the second surface of the auxiliary mounting member and the back surface of the plurality of ultrasonic detection chips 40a, 40b, so that the chip carrier plate 43 supports the plurality of ultrasonic detection chips 40a, 40b and the corresponding flexible circuit boards 42a, 42b.

[0075] Specifically, referring to FIG. 8 and FIG. 9A, each flexible circuit board 42a, 42b includes a first end portion 422a, 422b and a second end portion 423a, 423b. The first end portion 422a, 422b is the end portion of the flexible circuit board for connecting with the ultrasonic detection chip, and the second end portion 423a, 423b is the end portion of the flexible circuit board for connecting with the mainboard (not shown) of the electronic device. Each flexible circuit board 42a, 42b is respectively bent to include a first portion extending along a first direction X, a second portion extending along a second direction perpendicular to the first direction Y and parallel to the chip carrier plate 43, and a third portion extending along a third direction perpendicular to the chip carrier plate 43, the first portion of each flexible circuit board 42a, 42b being the first end portion 422a, 422b of the flexible circuit board, and the second portion of each flexible circuit board 42a, 42b being the second end portion 423a, 423b of the flexible circuit board for connecting with the mainboard of the electronic device. As shown in FIG. 8 and FIG. 9A, the second end portion 423a, 423b of the flexible circuit board 42a, 42b extends from the second direction Y for connecting with the mainboard of the electronic device. The second pads 421a, 421b of the flexible circuit board 42a, 42b are arranged at the first end portion 422a, 422b of the flexible circuit board 42a, 42b, which is attached to and supported by the chip carrier plate 43, thereby facilitating the welding of the second pads 421a, 421b on the flexible circuit board 42a, 42b to the electrical connection member 41a, 41b.

[0076] In addition, when installing the ultrasonic fingerprint identification device 6, the plurality of ultrasonic detection chips 40a, 40b and the corresponding flexible circuit boards 42a, 42b can be fixed to the chip carrier plate 43, and then the plurality of ultrasonic detection chips 40a, 40b and the corresponding flexible circuit boards 41a and 41b are installed to the auxiliary mounting member 60 through the chip carrier plate 43, so as to be installed to the middle frame as a whole, thereby reducing the assembly difficulty.

[0077] In order to ensure the effect of adhesion, as shown in FIG. 8 and FIG. 9A, in an implementation manner of the present application, the back surface of the ultrasonic detection chip 40a, 40b and the second surface of the first end portion 422a, 422b of the flexible circuit board 42a, 42b are also attached to the chip carrier plate 43 through the third adhesive 47, so as to ensure the effect of adhesion.

[0078] In the embodiment, the first adhesive 44 and the third adhesive 47 include glue or adhesive film, so as to further improve the effect of adhesion and save the process cost.

[0079] In an implementation of the present application, the second pad 421a, 421b of each flexible circuit board 42a, 42b is arranged at the edge region of the first surface of the first end portion 422a, 422b of the flexible circuit board 42a, 42b, and the other region of the first surface of the first end portion 422a, 422b of the flexible circuit board 42a, 42b is attached to the second surface of the auxiliary mounting member 60 by the fourth adhesive 48, thereby achieving the additional reinforcement of the first end portion 422a, 422b of the flexible circuit board 42a, 42b by the auxiliary mounting member 60.

[0080] In an implementation of the present application, the first surface of the auxiliary mounting member 60 is attached to the bottom wall of the base groove 301 by the second adhesive 46, which is glue. Since the glue has fluidity, when the first surface of the auxiliary mounting member 60 is attached to the bottom wall of the base groove 301 by the glue, the glue can overflow to fill the gap between the auxiliary mounting member 60 and the side wall of the base groove, thereby strengthening the strength of the middle frame.

[0081] As shown in FIG. 9A, in an implementation of the present application, the ultrasonic fingerprint identification device 6 further includes a bracket fixed to the middle frame 3, the bracket including a first support portion 611 parallel to the chip carrier plate 43, and a second support portion 612 and a third support portion 613 located at both ends of the first support portion 611 and extending in a direction perpendicular to the chip carrier plate 43, the ends of the second support portion 612 and the third support portion 613 being attached to the lower surface of the connecting position of the auxiliary mounting member 60 and the side wall of the base groove 301.

[0082] Referring to FIG. 9A, the second surface of the auxiliary mounting member 60 away from the middle frame is flush with the inner surface of the middle frame portion surrounding the base groove 301 facing the bracket. Part of the ends of the second support portion 612 and the third support portion 613 of the bracket is attached to the second surface of the auxiliary mounting member, and the other part is attached to the inner surface of the middle frame portion surrounding the base groove 301 facing the bracket, so that the bracket is supported on the lower surface of the connecting position of the auxiliary mounting member 60 and the side wall of the base groove 301, for strengthening the strength of the auxiliary mounting member 60 and the middle frame portion.

[0083] In an implementation of the present application, as shown in FIG. 9A, the ends of the second support portion 612 and the third support portion 613 are attached to the lower surface of the connecting position of the auxiliary mounting member and the side wall of the base groove by the second adhesive 46, which is glue. Since the glue has fluidity, when the ends of the second support portion 612 and the third support portion 613 are attached to the lower surface of the connecting position of the auxiliary mounting member and the side wall of the base groove by the glue, the glue can overflow to fill the gap between the auxiliary mounting member 60 and the side wall of the base groove 301, thereby strengthening the strength of the middle frame.

[0084] In an implementation manner of the present application, the first support part 611 is provided with a fixing hole 614 at both ends, which is used to fix the support to the middle frame through the fixing hole. Specifically, as mentioned above, the middle frame of the electronic device can be a frame structure composed of multiple side edges connected end to end, and the setting of the ultrasonic fingerprint identification device on the inner surface of the middle frame actually refers to the setting of the ultrasonic fingerprint identification device on the inner surface of one side edge of the frame structure. In the present implementation manner, the ultrasonic fingerprint identification device includes a support for supporting the connecting position of the auxiliary mounting member 60 and the side wall of the base groove 301. By providing a fixing hole on the third support part 613 of the support, a fastener can be used to fix the third support part 613 to the other side edge of the frame structure through the fixing hole, thereby fixing the support to the middle frame. This enables the support to be stably supported on the lower surface of the connecting position of the auxiliary mounting member 60 and the side wall of the base groove 301.

[0085] In an implementation manner of the present application, one side of the chip carrier plate 43 facing the second support part 611 of the support is adhered to the second support part 611 of the support by 49 point gluing, so as to improve the mechanical reliability of the fingerprint identification module.

[0086] In an implementation manner of the present application, the thickness of the middle frame above the base groove 301, i.e., the thickness of the middle frame at the preset identification area 30, is less than or equal to 1 mm.

[0087] In an implementation manner of the present application, the thickness of the auxiliary mounting member is greater than or equal to 0.3 mm, so as to facilitate the opening of the auxiliary mounting member for the installation of the avoiding groove for the electrical connection member.

[0088] In the embodiment of the present application, the electrical connection members 41a and 41b are bonding wires.

[0089] In an implementation manner of the present application, the electrical connection members 41a and 41b are covered with a protective glue 45, so as to protect the electrical connection members 41a and 41b and the first pads 401a and 401b and the second pads 421a and 421b connected by the electrical connection members 41a and 41b. Accordingly, the depth of the avoiding groove on the auxiliary mounting member 60 is set such that there is a preset gap between the bottom wall of the avoiding groove and the electrical connection members, so as to avoid the collision between the electrical connection members and the protective glue and the auxiliary mounting member 60.

[0090] Similarly to the foregoing embodiment, in the embodiment of the present application, the material of the chip carrier plate 43 can include but is not limited to glass, sapphire, etc. In order to provide sufficient rigidity, in an implementation manner of the present application, the thickness of the chip carrier plate 43 is greater than or equal to 0.4 mm.

[0091] In the embodiment of the present application, the material of the middle frame 3 can be plastic or metal.

[0092] In the embodiments of the present application, the outer surface of the preset identification area 30 of the middle frame 3 can be designed as a curved surface to improve the appearance of the middle frame.

[0093] It should be noted that FIGS. 8 and 9A illustrate two ultrasonic detection chips 40a and 40b as an example, and it should be understood that in other embodiments, the ultrasonic detection chips can be three or more ultrasonic detection chips, which are not limited in the present application.

[0094] Fourth embodiment

[0095] FIG. 10 is a top view of an ultrasonic fingerprint identification device provided by another embodiment of the present application. FIG. 11 is a cross-sectional view of the ultrasonic fingerprint identification device along the X axis shown in FIG. 10. FIGS. 10 and 11 illustrate an ultrasonic fingerprint identification device applied to a middle frame with an integrated frame structure as an example. The ultrasonic fingerprint identification device 7 provided by the embodiment of the present application is different from the ultrasonic fingerprint identification device provided by the foregoing embodiments in that the pads of the ultrasonic detection chips are provided to the silicon surface of the ultrasonic detection chips by a TSV packaging method in the embodiment of the present application, and a chip carrier plate is provided between the middle frame and the ultrasonic detection chips.

[0096] Referring to FIG. 11, the ultrasonic fingerprint identification device 7 includes a plurality of ultrasonic detection chips 40a, 40b, electrical connection members 41a, 41b, a plurality of flexible circuit boards 42a, 42b, and a chip carrier plate 43. The plurality of flexible circuit boards 42a, 42b correspond one-to-one to the plurality of ultrasonic detection chips 40a, 40b. The first surface of the chip carrier plate 43 facing the middle frame is attached to the inner surface of the portion where the preset identification area 30 of the middle frame is located. The front surface of the plurality of ultrasonic detection chips 40a, 40b is attached to the second surface of the chip carrier plate in the first direction X, and the second surface of the chip carrier plate 43 away from the middle frame is opposite to the first surface of the chip carrier plate 43; the back surface of the plurality of ultrasonic detection chips 40a, 40b is respectively provided with the first pads 401a, 401b provided by the TSV packaging method, and the first pads 401a, 401b of each ultrasonic detection chip 40a, 40b are electrically connected to the second pads 421a, 421b of the corresponding flexible circuit board 42a, 42b through the electrical connection members 41a, 41b.

[0097] In the embodiments of the present application, the ultrasonic detection chips 40a, 40b are provided with the first pads 401a, 401b on the back surface of the ultrasonic detection chips by adopting a Through Silicon Via (TSV) packaging method to lead the pads provided on the front surface of the ultrasonic detection chips to the side of the silicon wafer layer of the ultrasonic detection chips away from the acoustic layer (i.e., the back surface of the ultrasonic detection chips).

[0098] Similar to the foregoing embodiments, the first direction X is the length direction of the preset recognition area. The first direction X is also the length direction of the side of the middle frame where the ultrasonic fingerprint recognition device 4 is located. The plurality of ultrasonic detection chips 40a, 40b are attached to the second surface of the chip carrier plate 43 along the first direction X, and the first surface of the chip carrier plate 43 is attached to the inner surface of the middle frame portion where the preset recognition area is located, so that the plurality of ultrasonic detection chips 40a, 40b are arranged on the inner surface of the middle frame portion 3 where the preset recognition area 30 is located along the first direction X. The plurality of ultrasonic detection chips 40a, 40b respectively emit ultrasonic signals to the respective corresponding sub-areas in the preset recognition area 30, receive ultrasonic fingerprint signals fed back from the fingers above the sub-areas, and thus realize fingerprint recognition and sliding operation of the fingers in the preset recognition area 30 based on the ultrasonic fingerprint signals of the plurality of ultrasonic detection chips 40a, 40b.

[0099] In order to ensure the attachment effect, as shown in FIG. 11, in an implementation manner of the present application, the first surface of the chip carrier plate 43 is attached to the inner surface of the middle frame portion where the preset recognition area 30 is located by the first adhesive 44, and / or the plurality of ultrasonic detection chips 40a, 40b are attached to the second surface of the chip carrier plate 43 by the first adhesive 44. The first adhesive can be glue or adhesive film, so as to further improve the attachment effect and save process cost.

[0100] In an implementation manner of the present application, the plurality of flexible circuit boards 42a, 42b respectively comprise first end portions 422a, 422b, the first surface of the first end portions 422a, 422b facing the chip carrier plate 43 is attached to the second surface of the chip carrier plate 43, the second surface of the first end portions 422a, 422b opposite to the first surface of the first end portions 422a, 422b is provided with second pads 421a, 421b, and the second surface of the first end portions 422a, 422b is opposite to the first surface of the first end portions 422a, 422b.

[0101] As shown in FIG. 11, each of the flexible circuit boards 42a, 42b includes a first end portion 422a, 422b and a second end portion 423a, 423b. The first end portion 422a, 422b is an end portion of the flexible circuit board for connecting with the ultrasonic detection chip, and the second end portion 423a, 423b is an end portion of the flexible circuit board for connecting with the mainboard (not shown) of the electronic device. Each of the flexible circuit boards 42a, 42b is folded in half to form a U-shaped structure. The two parallel sides of the U-shaped structure are the first end portion 422a, 422b and the second end portion 423a, 423b of the flexible circuit board, respectively. The pads 421a, 421b (i.e., the second pads) on the flexible circuit boards 42a, 42b for connecting with the ultrasonic detection chip are arranged at the first end portion 422a, 422b of the flexible circuit boards 42a, 42b. The first end portion 422a, 422b is attached to the chip carrier board 43 and is supported by the chip carrier board 43, thereby facilitating the welding of the second pads 421a, 421b on the flexible circuit boards 42a, 42b to the electrical connection members 41a, 41b.

[0102] Similarly, in order to ensure the attachment effect, as shown in FIG. 11, in an implementation manner of the present application, the first surface of the first end portion 422a, 422b is attached to the second surface of the chip carrier board 43 through the first adhesive 44.

[0103] In an implementation manner of the present application, a reinforcing plate 70 is arranged between the chip carrier board 43 and the flexible circuit boards 42a, 42b to further reinforce the flexible circuit boards, thereby facilitating the welding of the second pads 421a, 421b on the flexible circuit boards 42a, 42b to the electrical connection members 41a, 41b. The reinforcing plate 70 can be a steel sheet.

[0104] In an implementation manner of the present application, the thickness of the chip carrier board 43 is greater than or equal to 0.2 mm to provide sufficient rigidity. The material of the chip carrier board 43 can include, but is not limited to, glass, sapphire, etc.

[0105] In the embodiments of the present application, the electrical connection members 41a, 41b are bonding wires.

[0106] In an implementation manner of the present application, the electrical connection members 41a, 41b are covered with a protective glue 45 to protect the electrical connection members 41a, 41b and the first pads 401a, 401b and the second pads 421a, 421b connected by the electrical connection members 41a, 41b.

[0107] In the embodiments of the present application, the material, thickness and process design of the middle frame 3 are similar to those of the first and second embodiments described above, which will not be described here again.

[0108] It should be understood that the ultrasonic fingerprint identification device 7 provided by the embodiments of the present application has similar working principles and similar effects to the ultrasonic fingerprint identification device provided by the foregoing embodiments, and thus will not be described here.

[0109] It should be noted that FIGS. 10 and 11 are described by taking two ultrasonic detection chips 40a and 40b as an example, and it should be understood that in other embodiments, the ultrasonic detection chip can be three or more ultrasonic detection chips, which are not limited by the present application.

[0110] Fifth Embodiment

[0111] FIG. 12 is a top view of an ultrasonic fingerprint identification device provided by another embodiment of the present application. FIG. 13 is a sectional view of the ultrasonic fingerprint identification device shown in FIG. 12 along the X axis. FIGS. 12 and 13 are described by taking an application of the ultrasonic fingerprint identification device to a middle frame with an integrated frame structure as an example. The ultrasonic fingerprint identification device 8 provided by the embodiments of the present application is different from the ultrasonic fingerprint identification device provided by the first to third embodiments in that the pads of the ultrasonic detection chip are provided on the back surface of the ultrasonic detection chip by a TSV packaging method, and the electrical connection members 41a and 41b are soldering materials.

[0112] Specifically, as shown in FIG. 13, the ultrasonic fingerprint identification device 8 includes a plurality of ultrasonic detection chips 40a and 40b, electrical connection members 41a and 41b, a plurality of flexible circuit boards 42a and 42b, and a chip carrier plate 43. The plurality of flexible circuit boards 42a and 42b correspond one-to-one to the plurality of ultrasonic detection chips 40a and 40b. The front surface of each ultrasonic detection chip 40a and 40b is attached to the inner surface of the middle frame portion where the preset identification area 30 is located, the back surface of each ultrasonic detection chip 40a and 40b is provided with a first pad 401a and 401b, the corresponding flexible circuit board 42a and 42b of each ultrasonic detection chip 42a and 42b is provided with a second pad 421a and 421b, and the chip carrier plate 43 is provided with a third pad 431a and 431b corresponding to the first pad 401a and 401b, a fourth pad 432a and 432b corresponding to the second pad 421a and 421b, and a first wire (not shown) connecting the third pad 431a and 431b and the fourth pad 432a and 432b. The electrical connection member 41a includes a pair of first electrical connection members 411a and 412a. The electrical connection member 41b includes a pair of first electrical connection members 411b and 412b. The first pad 401a and 401b is connected to the corresponding third pad 431a and 431b through the first electrical connection member 411a and 411b, and the fourth pad 432a and 432b is connected to the corresponding second pad 421a and 421b through the electrical connection member 412a and 412b.

[0113] In the embodiments of the present application, the ultrasonic detection chips 40a and 40b are packaged by a through silicon via (TSV) packaging method to lead the pads arranged on the acoustic surface of the ultrasonic detection chips to the back surface of the ultrasonic detection chips, so as to provide the first pads 401a and 401b on the back surface of the ultrasonic detection chips.

[0114] As shown in FIG. 13, the plurality of ultrasonic detection chips 40a and 40b are attached to the inner surface of the middle frame portion where the preset identification area 30 is located along the first direction, respectively emit ultrasonic signals to the respective corresponding sub-areas in the preset identification area 30, receive the ultrasonic fingerprint signals fed back from the fingers above the sub-areas, so as to realize the fingerprint identification and the sliding operation of the finger in the preset identification area 30 based on the ultrasonic fingerprint signals of the plurality of ultrasonic detection chips 40a and 40b.

[0115] In an implementation manner of the present application, the plurality of flexible circuit boards 42a and 42b respectively include first end portions 422a and 422b electrically connected with the ultrasonic detection chips, the first surfaces of the first end portions 422a and 422b facing the preset identification area 30 of the middle frame are provided with the reinforcing plates 80, and the second surfaces of the first end portions 422a and 422b away from the preset identification area 30 are provided with the second pads 421a and 421b.

[0116] As shown in FIG. 13, each of the flexible circuit boards 42a and 42b includes the first end portions 422a and 422b and the second end portions 423a and 423b. The first end portions 422a and 422b are the end portions of the flexible circuit boards for connecting with the ultrasonic detection chips, and the second end portions 423a and 423b are the end portions of the flexible circuit boards for connecting with the main board (not shown) of the electronic device. Each of the flexible circuit boards 42a and 42b is folded to form a U-shaped structure. The two parallel sides in the U-shaped structure are the first end portions 422a and 422b and the second end portions 423a and 423b of the flexible circuit boards respectively. The pads 421a and 421b (i.e., the second pads) of the flexible circuit boards 42a and 42b for connecting with the ultrasonic detection chips are arranged on the first end portions 422a and 422b of the flexible circuit boards 42a and 42b. The first end portions 422a and 422b are attached to the reinforcing plates 80 and are supported by the reinforcing plates 80, thereby facilitating the welding of the second pads 421a and 421b on the flexible circuit boards 42a and 42b with the electrical connection members 41a and 41b. In the embodiments of the present application, the reinforcing plates 80 can be attached to the inner surface of the preset identification area by the first adhesive.

[0117] In an implementation form of the present application, the first and second electric connection members 411a, 411b and 412a, 412b are soldering material or conductive silver paste. For example, the first and second electric connection members 411a, 411b and 412a, 412b can be low-temperature tin paste, low-temperature silver paste (also known as conductive silver paste).

[0118] In an implementation form of the present application, the first electric connection members 411a, 411b are connected to the first pads 401a, 401b and the corresponding third pads 431a, 431b by laser welding, and the electric connection members 41a, 41b are connected to the second pads 421a, 421b and the corresponding fourth pads 432a, 433b by laser welding.

[0119] In an implementation form of the present application, the front surface of each ultrasonic detection chip is attached to the inner surface of the preset identification area 30 by the first adhesive 44 to ensure the attachment effect. The first adhesive can include glue or adhesive film.

[0120] In the embodiments of the present application, the materials, thicknesses, and process designs of the middle frame 3 and the chip carrier plate 43 and other components are similar to those of the first and second embodiments described above, and thus will not be described again here.

[0121] It should be understood that the ultrasonic fingerprint identification device 8 provided in the embodiments of the present application has similar working principles and effects to the ultrasonic fingerprint identification devices provided in the above-described embodiments, and thus will not be described again here.

[0122] It should be noted that FIGS. 12 and 13 take two ultrasonic detection chips 40a and 40b as examples for description, and it should be understood that in other embodiments, the ultrasonic detection chips can be three or more ultrasonic detection chips, which are not limited in the present application.

[0123] The first to fifth embodiments described above all take the middle frame with an integrated frame structure as an example. It should be understood that the ultrasonic fingerprint identification device provided in the embodiments of the present application is also suitable for the middle frame with a split structure described above. Specifically, the middle frame can include a frame body and a frame cover plate, the frame body is arranged along the circumference of the electronic device, and the frame body is provided with an opening, and the frame cover plate covers the opening, and the preset identification area of the middle frame is arranged on the frame cover plate. The sixth and seventh embodiments will be described below by way of example.

[0124] Sixth Embodiment

[0125] Fig. 14 is a top view of an ultrasonic fingerprint identification device according to another embodiment of the present application. Fig. 15 is a cross-sectional view of the ultrasonic fingerprint identification device shown in Fig. 14 along the X axis. Figs. 14 and 15 take the case of the ultrasonic fingerprint identification device being applied to a middle frame with a split structure as an example for illustration. The ultrasonic fingerprint identification device 9 provided in the present embodiment is similar to the ultrasonic fingerprint identification device 7 provided in the fourth embodiment, with the difference being that, in the present embodiment, the middle frame 3 comprises a frame body 31 and a frame cover plate 32, the frame body 31 is arranged along the circumference of the electronic device, and the frame body 31 is provided with an opening, the frame cover plate 32 covers the opening, the preset identification area 30 of the middle frame 3 is located on the frame cover plate 31, and the ultrasonic fingerprint identification device 10 is arranged on the inner surface of the frame cover plate 32 at the preset identification area 30. The arrangement positions and connection relationships between the components of the ultrasonic fingerprint identification device 10 shown in the sixth embodiment can be referred to the fourth embodiment, which will not be repeated here.

[0126] Seventh Embodiment

[0127] Fig. 16 is a top view of an ultrasonic fingerprint identification device according to another embodiment of the present application. Fig. 17 is a cross-sectional view of the ultrasonic fingerprint identification device shown in Fig. 16 along the X axis. Figs. 16 and 17 take the case of the ultrasonic fingerprint identification device being applied to a middle frame with a split structure as an example for illustration. The ultrasonic fingerprint identification device 10 provided in the present embodiment is similar to the ultrasonic fingerprint identification device 4 provided in the first embodiment, with the difference being that, in the present embodiment, the middle frame 3 comprises a frame body 31 and a frame cover plate 32, the frame body 31 is arranged along the circumference of the electronic device, and the frame body 31 is provided with an opening, the frame cover plate 32 covers the opening, the preset identification area 30 of the middle frame 3 is located on the frame cover plate 31, and the ultrasonic fingerprint identification device 10 is arranged on the inner surface of the frame cover plate 32 at the preset identification area 30.

[0128] The arrangement positions and connection relationships between the components of the ultrasonic fingerprint identification device 10 shown in the seventh embodiment can be referred to the first embodiment, which will not be repeated here.

[0129] It should be understood that the ultrasonic fingerprint identification devices provided in the second, third and fifth embodiments can also be arranged on the frame cover plate 32 mentioned in the sixth and seventh embodiments, with similar connection relationships and working principles, which will not be repeated here.

[0130] As shown in Fig. 18, the present application further provides an electronic device 180, which comprises a middle frame and an ultrasonic fingerprint identification device 1801, and the ultrasonic fingerprint identification device 1801 is arranged on the middle frame. The ultrasonic fingerprint identification device 1801 in the present embodiment is any of the ultrasonic fingerprint identification devices provided in the foregoing embodiments.

[0131] The middle frame of the electronic device refers to a frame structure arranged along the circumference of the electronic device. Generally, the electronic device includes a front shell, a rear shell, and a middle frame, and the middle frame is located between the front shell and the rear shell.

[0132] In the embodiments of the present application, the middle frame can be an integrated frame structure composed of a plurality of side edges connected end to end. In the integrated frame structure, the ultrasonic fingerprint identification device is arranged on the inner surface of one of the plurality of side edges constituting the frame structure.

[0133] The middle frame can also be a split frame structure composed of a frame body and a frame cover plate. In the split frame structure, the frame body includes a plurality of side edges connected end to end and has an opening matching the frame cover plate on one of the plurality of side edges. The frame cover plate is covered on the opening to constitute a complete frame structure together with the frame cover plate. In the split frame structure, the ultrasonic fingerprint identification device is arranged on the inner surface of the frame cover plate.

[0134] The electronic device of the embodiments of the present application includes but is not limited to:

[0135] (1) Mobile communication device: This type of device is characterized by having mobile communication function and providing voice and data communication as the main target. This type of terminal includes: smart phone (such as iPhone), multimedia phone, functional phone, and low-end phone, etc.

[0136] (2) Ultra-mobile personal computer device: This type of device belongs to the category of personal computers and has computing and processing functions, and generally also has the feature of mobile Internet. This type of terminal includes: PDA, MID and UMPC devices, such as iPad.

[0137] (3) Portable entertainment device: This type of device can display and play multimedia content. This type of device includes: audio and video player (such as iPod), handheld game console, electronic book, and smart toy and portable car navigation device.

[0138] (4) Other electronic devices with data interaction function.

[0139] The above embodiments are only used to illustrate the embodiments of the present application, and not to limit the embodiments of the present application. Those skilled in the related art can make various changes and modifications without departing from the spirit and scope of the embodiments of the present application, therefore all equivalent technical solutions also belong to the scope of the embodiments of the present application, and the patent protection scope of the embodiments of the present application should be defined by the claims.

Claims

1. An ultrasonic fingerprint identification device, characterized by, An ultrasonic fingerprint identification device arranged on an inner surface of a middle frame of an electronic device, the ultrasonic fingerprint identification device comprising: a plurality of ultrasonic detection chips, an electrical connection member, and a plurality of flexible circuit boards; The plurality of ultrasonic detection chips are arranged on the inner surface of the middle frame along a first direction, the plurality of ultrasonic detection chips respectively emit ultrasonic signals to the middle frame above the plurality of ultrasonic detection chips, and receive ultrasonic fingerprint signals reflected from a finger pressed on the middle frame, the ultrasonic fingerprint signals of the plurality of ultrasonic detection chips are used to detect a sliding operation of the finger on the middle frame, and the first direction is a length direction of the middle frame; The ultrasonic detection chips are electrically connected to the flexible circuit boards through the electrical connection member, so as to be electrically connected to a mainboard of the electronic device through wirings of the flexible circuit boards.

2. The apparatus of claim 1, wherein, The plurality of ultrasonic detection chips are arranged on the inner surface of the middle frame along the first direction at a preset interval, the preset interval is less than or equal to 6 mm and greater than or equal to 0.26 mm.

3. The apparatus of claim 1 or 2, wherein, The ultrasonic fingerprint identification device further comprises a chip carrier plate arranged below the ultrasonic detection chips and a first end portion of the flexible circuit boards, and used for supporting the ultrasonic detection chips and the first end portion of the flexible circuit boards; the first end portion of the flexible circuit boards is an end portion of the flexible circuit boards connected to the corresponding ultrasonic detection chips; The thickness of the chip carrier plate is greater than or equal to 0.4 mm.

4. The apparatus of claim 3, wherein, The ultrasonic detection chips comprise a silicon wafer layer and an acoustic layer arranged on the silicon wafer layer, the acoustic layer of the ultrasonic detection chips is attached to the inner surface of the middle frame, a first surface of the silicon wafer layer of the ultrasonic detection chips facing the acoustic layer is provided with a first pad; a first surface of the first end portion of the flexible circuit boards facing the middle frame is provided with a second pad, the first pad of the ultrasonic detection chips is respectively connected to the second pad of the corresponding flexible circuit board through the electrical connection member; a second surface of the silicon wafer layer of the ultrasonic detection chips away from the acoustic layer and a second surface of the first end portion of the flexible circuit boards away from the middle frame are attached on the chip carrier plate.

5. The apparatus of claim 4, wherein, The acoustic layer of the ultrasonic detection chips is attached to the inner surface of the middle frame through a first adhesive, the first adhesive comprises glue or adhesive film; the electrical connection member is covered with a protective glue, and the thickness of the first adhesive is arranged to be such that a preset gap exists between the protective glue and the inner surface of the middle frame.

6. The apparatus of any one of claims 3 to 5, wherein, The chip carrier plate is arranged as one, and the plurality of ultrasonic detection chips share the one chip carrier plate; or The chip carrier plate is arranged as a plurality, and each ultrasonic detection chip is respectively attached on a different chip carrier plate.

7. The apparatus of claim 3, wherein, The ultrasonic fingerprint identification device further comprises an auxiliary mounting member, the inner surface of the middle frame is provided with a base groove, the base groove is used for accommodating the auxiliary mounting member, a first surface of the auxiliary mounting member facing the middle frame is attached to a bottom wall of the base groove, and the ultrasonic detection chips and the first end portion of the flexible circuit boards are attached to a second surface of the auxiliary mounting member away from the middle frame, so as to be arranged on the inner surface of the middle frame.

8. The apparatus of claim 7, wherein, The ultrasonic detection chip comprises a silicon wafer layer and an acoustic layer arranged on the silicon wafer layer, the acoustic layer of the ultrasonic detection chip is attached to the second surface of the auxiliary mounting member away from the middle frame, and the first surface of the silicon wafer layer of the ultrasonic detection chip facing the acoustic layer is provided with a first pad; the first surface of the first end of the flexible circuit board facing the middle frame is provided with a second pad, and the first pad of the ultrasonic detection chip is connected to the corresponding second pad of the flexible circuit board through the electric connection member; the second surface of the auxiliary mounting member away from the middle frame is provided with a avoiding slot for accommodating the electric connection member; and the second surface of the silicon wafer layer of the ultrasonic detection chip away from the acoustic layer and the second surface of the first end of the flexible circuit board away from the middle frame are attached on the chip carrier plate.

9. The apparatus of claim 8, wherein, The ultrasonic fingerprint identification device further comprises a bracket fixed to the middle frame, the bracket comprises a first support part parallel to the chip carrier plate, and a second support part and a third support part located at both ends of the first support part and extending in a direction perpendicular to the chip carrier plate, and the ends of the second support part and the third support part are attached to the lower surface of the connection position of the auxiliary mounting member and the sidewall of the base groove through a second adhesive; the second adhesive is glue. The first support part is provided with a fixing hole at both ends, and the bracket is fixed to the middle frame through the fixing hole.

10. The apparatus of any one of claims 7 to 9, wherein, The first surface of the auxiliary mounting member is attached to the bottom wall of the base groove through a second adhesive, the second adhesive is glue, the thickness of the middle frame above the base groove is less than or equal to 1mm, and the thickness of the auxiliary mounting member is greater than or equal to 0.3mm.

11. The apparatus of claim 1, wherein, The ultrasonic fingerprint identification device further comprises a chip carrier plate, the first surface of the chip carrier plate facing the middle frame is attached to the inner surface of the middle frame; the ultrasonic detection chip and the first end of the flexible circuit board are attached to the second surface of the chip carrier plate away from the middle frame, and the first end of the flexible circuit board is the end of the flexible circuit board connected with the corresponding ultrasonic detection chip; and the thickness of the chip carrier plate is greater than or equal to 0.2mm.

12. The apparatus of claim 11, wherein, The ultrasonic detection chip comprises a silicon wafer layer and an acoustic layer arranged on the silicon wafer layer, the acoustic layer of the ultrasonic detection chip is attached to the second surface of the chip carrier plate, so that the acoustic layer is arranged between the chip carrier plate and the silicon wafer layer of the ultrasonic detection chip; and one side of the silicon wafer layer of the ultrasonic detection chip away from the acoustic layer is provided with a first pad; The first surface of the first end of the flexible circuit board facing the middle frame is attached to the second surface of the chip carrier plate, and the second surface of the first end away from the middle frame is provided with a second pad; The first pad of the ultrasonic detection chip is electrically connected to the second pad of the corresponding flexible circuit board through the electric connection member.

13. The apparatus of any one of claims 1-12, wherein, The electric connection member is a bonding wire.

14. The apparatus of claim 3, wherein, The ultrasonic detection chip comprises a silicon wafer layer and an acoustic layer arranged on the silicon wafer layer, the acoustic layer of the ultrasonic detection chip is attached to the inner surface of the middle frame, so that the acoustic layer is arranged between the middle frame and the silicon wafer layer of the ultrasonic detection chip; the side of the silicon wafer layer of the ultrasonic detection chip away from the acoustic layer is provided with a first pad; The side of the first end of the flexible circuit board away from the middle frame is provided with a second pad; The chip carrier plate is provided with a third pad corresponding to the first pad, a fourth pad corresponding to the second pad, and a first trace connecting the third pad and the fourth pad, the first pad is electrically connected to the corresponding third pad through the electric connection member, and the fourth pad is electrically connected to the corresponding second pad through the electric connection member.

15. The apparatus of claim 14, wherein, The side of the first end of the flexible circuit board facing the middle frame is provided with a reinforcing plate to reinforce the first end of the flexible circuit board; The electric connection member comprises a first electric connection member connected to the first pad and the corresponding third pad by laser welding, and a second electric connection member connected to the second pad and the corresponding fourth pad by laser welding, the first electric connection member and the second electric connection member are welding material or conductive silver paste.

16. The apparatus of any one of claims 1 to 15, wherein, The thickness of the middle frame above the ultrasonic fingerprint identification device is less than or equal to 1.5 mm; The chip carrier plate is glass or sapphire.

17. The apparatus of claim 16, wherein, The thickness of the middle frame above the ultrasonic fingerprint identification device is: 0.8 mm, 1.0 mm or 1.3 mm.

18. An electronic device, comprising: Comprise: The middle frame and the ultrasonic fingerprint identification device according to any one of claims 1-17, the ultrasonic fingerprint identification device is arranged on the inner surface of the middle frame; wherein, the middle frame comprises a frame body arranged along the circumference of the electronic device, the fingerprint identification device is arranged on the inner surface of the frame body; or, the middle frame comprises a frame body and a frame cover plate, the frame body is arranged along the circumference of the electronic device, the frame body is provided with an opening, the frame cover plate is covered on the opening, and the fingerprint identification device is arranged on the inner surface of the frame cover plate.

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