In-line leveling mechanism, apparatus and method for correcting thermal deformation of carrier plate

Abstract

The present application relates to an in-line leveling mechanism for correcting thermal deformation of a carrier plate, comprising: a fixing support; a carrier plate, wherein the carrier plate is in a horizontal state and placed on the bottom of the upper side of the fixing support; a fixed leveling assembly, wherein the fixed leveling assembly is provided on the lower side of the fixing support; a first driving assembly, wherein the first driving assembly is provided on the lower side of the fixing support; and a flexible leveling assembly, wherein the first driving assembly is drivingly connected to the flexible leveling assembly, so that the carrier plate is separately fixedly connected to the flexible leveling assembly and the fixed leveling assembly. In addition, the present invention further relates to a leveling apparatus comprising the leveling mechanism, and a corresponding leveling method. The present invention enables a device to perform in-line leveling of a carrier plate, improves the production efficiency, and significantly reduces the breakage rate of fragile thin sheets in loading and unloading processes.

Description

Online flatting mechanism for correcting heating deformation of carrier plate, flatting device and method

[0001] Cross-reference to related applications

[0002] This application claims priority to Chinese Invention Patent Application No. 202411355825.5, filed on September 26, 2024, the entire contents of which are incorporated herein by reference. TECHNICAL FIELD

[0003] The present application belongs to the technical field of metal plate flattening, and more particularly, relates to an online flatting mechanism for correcting heating deformation of a carrier plate, a flatting device comprising the flatting mechanism, and a method for flattening a carrier plate using the flatting mechanism and the flatting device. BACKGROUND

[0004] For large / large-area film-coated vacuum equipment, such as magnetron sputtering, hot wire CVD, etc., large-area metal carrier plates are often used. The metal carrier plate frequently undergoes high-low temperature cycles during film coating, causing thermal deformation of the carrier plate, which in turn adversely affects the success rate and fragment rate of wafer picking and placing on the carrier plate.

[0005] Currently, there are two common methods for addressing the thermal deformation problem of large-area metal carrier plates in the industry: one is to use metal materials with extremely low thermal expansion coefficients for the carrier plate. Although this method can solve the problem of thermal deformation of the carrier plate, the material and processing costs are extremely high, which is not conducive to energy conservation and environmental protection. The other is to increase the thickness of the metal carrier plate. Although this method can improve the thermal deformation of the carrier plate to some extent, it cannot completely solve the problem, and the increase in the thickness of the carrier plate increases the heat absorption of the carrier plate, resulting in proportional increase in energy consumption and high electrical energy consumption, which is not conducive to energy conservation and environmental protection.

[0006] Therefore, in view of the thermal deformation problem of large-area metal carrier plates in large / large-area film-coated vacuum equipment, there is an urgent need to design a simple and practical online flatting mechanism for correcting heating deformation of a metal carrier plate and a device comprising the flatting mechanism.

[0007] SUMMARY

[0008] In view of the deficiencies of the prior art, the purpose of the present application is to flatten large-area metal carrier plates with fragile wafers in film-coating equipment online. The present application does not require the carrier plate to have an extremely low thermal expansion coefficient, nor does it require the carrier plate to be thickened. The carrier plate is flattened during the loading and unloading of fragile wafers, improving production efficiency and greatly reducing the fragment rate of fragile wafers during loading and unloading. Based on this, the present application provides an online flatting mechanism for correcting heating deformation of a carrier plate and a device comprising the flatting mechanism, and a method for flattening a carrier plate using the flatting mechanism and the flatting device.

[0009] To solve the above technical problems or achieve the above purposes, the present application adopts the following technical solutions:

[0010] According to a first aspect of the present application, there is provided an online flatness correction mechanism for correcting the flatness of a heated carrier plate, comprising:

[0011] a fixed support;

[0012] a carrier plate in a horizontal state and placed on the bottom of the upper side of the fixed support;

[0013] a fixed flattening assembly arranged on the lower side of the fixed support;

[0014] a first driving assembly arranged on the lower side of the fixed support;

[0015] a flexible flattening assembly, the first driving assembly being drivingly connected to the flexible flattening assembly, so that the carrier plate is fixedly connected to the flexible flattening assembly and the fixed flattening assembly.

[0016] In an embodiment of the present application, the carrier plate is fixedly connected to the flexible flattening assembly by a short-distance spaced-attractive force, which includes any one of gravity, permanent magnetic force, electromagnetic force, electrostatic force, strong force and weak force, or the carrier plate is fixedly connected to the flexible flattening assembly by a contact element, which includes any one of a mechanical bolt, a nail, glue, an adhesive, a suction cup and a bayonet.

[0017] The carrier plate is fixedly connected to the fixed flattening assembly by a short-distance spaced-attractive force, which includes any one of gravity, permanent magnetic force, electromagnetic force, electrostatic force, strong force and weak force.

[0018] In an embodiment of the present application, the fixed flattening assembly flattens the carrier plate with a maximum height error of a plane less than 10 mm, and flattens the carrier plate to a maximum height error of a plane less than 1 mm; the flexible flattening assembly flattens the carrier plate with a maximum height error of a plane less than 30 mm.

[0019] In an embodiment of the present application, the first driving assembly includes any one of a pneumatic cylinder, an oil cylinder, an electric cylinder and a linear motor.

[0020] In an embodiment of the present application, the fixed flattening assembly is arranged in parallel with the first driving assembly; or the fixed flattening assembly is arranged in abutment with the first driving assembly.

[0021] According to a second aspect of the present application, there is provided an online flattening device for correcting the flatness of a heated carrier plate, comprising:

[0022] a correction mechanism, the correction mechanism comprising:

[0023] a movable support;

[0024] a carrier plate, which is in a vertical state and placed on the inner side of one side of the movable support, and the carrier plate moves from the vertical state to a horizontal state with the rotation of the movable support;

[0025] a fixed correction assembly, which is arranged on the other side of the movable support;

[0026] a second driving assembly, which is arranged on the other side of the movable support;

[0027] a flexible correction assembly, the second driving assembly is drivingly connected with the flexible correction assembly, so that the carrier plate is fixedly connected with the flexible correction assembly and the fixed correction assembly with the rotation of the movable support;

[0028] a carrier plate, which is in a vertical state and placed on the inner side of one side of the movable support, and the carrier plate moves from the vertical state to a horizontal state with the rotation of the movable support;

[0029] and

[0030] a leveling mechanism, which levels the carrier plate when the correction mechanism corrects and rotates the carrier plate to the horizontal state, and the leveling mechanism adopts the leveling mechanism for correcting the heating deformation of the carrier plate in line as described above.

[0031] In an embodiment of the present application, the carrier plate and the flexible correction assembly are fixedly connected through short-distance space attraction force, the short-distance space attraction force includes any one of gravity, permanent magnetic force, electromagnetic force, electrostatic force, strong force and weak force, or the carrier plate and the flexible correction assembly are fixedly connected through a contact element, the contact element includes any one of mechanical bolts, nails, glue, adhesives, suction cups and bayonets.

[0032] The carrier plate and the fixed correction assembly are fixedly connected through short-distance space attraction force, the short-distance space attraction force includes any one of gravity, permanent magnetic force, electromagnetic force, electrostatic force, strong force and weak force.

[0033] In an embodiment of the present application, the fixed correction assembly corrects the carrier plate with a maximum height error of a plane less than 20 mm and corrects the carrier plate to a maximum height error of a plane less than 5 mm; the flexible correction assembly corrects the carrier plate with a maximum height error of a plane less than 50 mm.

[0034] In an embodiment of the present application, the second driving assembly is the same as or different from the first driving assembly, and the second driving assembly includes any one of a pneumatic cylinder, an oil cylinder, an electric cylinder and a linear motor.

[0035] In an embodiment of the present application, the fixed correction assembly and the second driving assembly are arranged in parallel or abutted.

[0036] According to a third aspect of the present application, there is provided a method for correcting the deformation of an online carrier plate, the method being performed by the online carrier plate deformation correcting mechanism as described above, the method comprising the steps of:

[0037] placing the carrier plate in a horizontal state on a fixed support of the correcting mechanism;

[0038] controlling a first driving assembly of the correcting mechanism to push a flexible correcting assembly towards the carrier plate, and to fix the carrier plate to the flexible correcting assembly after the carrier plate is stressed;

[0039] controlling the first driving assembly to retract the flexible correcting assembly, so that the distance between the carrier plate and the fixed correcting assembly is reduced, and the carrier plate is fixed to the fixed correcting assembly after the carrier plate is stressed.

[0040] In an embodiment of the present application, the distance between the carrier plate and the fixed correcting assembly is reduced to within 10 mm.

[0041] According to a fourth aspect of the present application, there is provided a method for correcting the deformation of an online carrier plate, the method being performed by the online carrier plate deformation correcting device as described above, the method comprising the steps of:

[0042] placing the carrier plate in a vertical state on a movable support of the correcting mechanism;

[0043] controlling a second driving assembly of the correcting mechanism to push a flexible correcting assembly towards the carrier plate, and to fix the carrier plate to the flexible correcting assembly after the carrier plate is stressed;

[0044] controlling the second driving assembly to retract the flexible correcting assembly, so that the distance between the carrier plate and the fixed correcting assembly is reduced, and the carrier plate is fixed to the fixed correcting assembly after the carrier plate is stressed.

[0045] controlling the movable support to rotate, so that the carrier plate moves from the vertical state to the horizontal state;

[0046] placing the carrier plate in a horizontal state on a fixed support of the correcting mechanism;

[0047] controlling a first driving assembly of the correcting mechanism to push a flexible correcting assembly towards the carrier plate, and to fix the carrier plate to the flexible correcting assembly after the carrier plate is stressed;

[0048] controlling the first driving assembly to retract the flexible correcting assembly, so that the distance between the carrier plate and the fixed correcting assembly is reduced, and the carrier plate is fixed to the fixed correcting assembly after the carrier plate is stressed.

[0049] In an embodiment of the present application, the distance between the carrier plate and the fixed correcting assembly is reduced to within 20 mm, and the distance between the carrier plate and the fixed correcting assembly is reduced to within 10 mm.

[0050] The technical scheme provided by the present application has the following advantages compared with the prior art.

[0051] The present application can realize online flattening of the carrier plate, greatly reduces the breakage rate of the fragile sheet during feeding and discharging, realizes the stability and success rate of the fragile sheet feeding and discharging on the carrier plate, the fragile sheet correction time is short, the feeding and discharging speed is fast, the present application has good compatibility, can flatten the carrier plate deformation within 50mm and ensure the normal feeding and discharging of the fragile sheet, the present application has low cost and low debugging difficulty. BRIEF DESCRIPTION OF DRAWINGS

[0052] The accompanying drawings, which are incorporated into and form part of the specification, illustrate embodiments consistent with the present disclosure and, together with the specification, serve to explain the principles of the present disclosure.

[0053] In order to more clearly illustrate the technical scheme in the embodiments of the present disclosure or the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced as follows, and obviously, other drawings can also be obtained by those skilled in the art without creative effort on the basis of these drawings.

[0054] Fig. 1 shows a structure schematic diagram of an online flattening mechanism for correcting heating deformation of a carrier plate according to an embodiment of the present application;

[0055] Fig. 2 shows a structure schematic diagram of a correction mechanism in an online flattening device for correcting heating deformation of a carrier plate according to an embodiment of the present application;

[0056] Fig. 3 shows a structure schematic diagram of an online flattening mechanism for correcting heating deformation of a carrier plate according to another embodiment of the present application;

[0057] Fig. 4 shows a structure schematic diagram of a correction mechanism in an online flattening device for correcting heating deformation of a carrier plate according to another embodiment of the present application;

[0058] Fig. 5 shows a structure schematic diagram of an online flattening mechanism for correcting heating deformation of a carrier plate according to another embodiment of the present application;

[0059] Fig. 6 shows a structure schematic diagram of an online flattening mechanism for correcting heating deformation of a carrier plate according to another embodiment of the present application;

[0060] Fig. 7 shows a structure schematic diagram of an online flattening mechanism for correcting heating deformation of a carrier plate according to another embodiment of the present application;

[0061] Fig. 8 shows a structure schematic diagram of an online flattening mechanism for correcting heating deformation of a carrier plate according to another embodiment of the present application;

[0062] Figure 9 shows a schematic diagram of a leveling mechanism for correcting the deformation of a heated carrier plate in an online process according to another embodiment of the present application;

[0063] Figure 10 shows a schematic diagram of a leveling mechanism for correcting the deformation of a heated carrier plate in an online process according to another embodiment of the present application;

[0064] Figure 11 shows a schematic diagram of a leveling mechanism for correcting the deformation of a heated carrier plate in an online process according to another embodiment of the present application;

[0065] Figure 12 shows a schematic diagram of a correction mechanism in a leveling device for correcting the deformation of a heated carrier plate in an online process according to another embodiment of the present application;

[0066] Figure 13 shows a schematic diagram of a correction mechanism in a leveling device for correcting the deformation of a heated carrier plate in an online process according to another embodiment of the present application;

[0067] Figure 14 shows a schematic diagram of a correction mechanism in a leveling device for correcting the deformation of a heated carrier plate in an online process according to another embodiment of the present application;

[0068] Figure 15 shows a schematic diagram of a correction mechanism in a leveling device for correcting the deformation of a heated carrier plate in an online process according to another embodiment of the present application;

[0069] Figure 16 shows a schematic diagram of a correction mechanism in a leveling device for correcting the deformation of a heated carrier plate in an online process according to another embodiment of the present application;

[0070] Figure 17 shows a schematic diagram of a correction mechanism in a leveling device for correcting the deformation of a heated carrier plate in an online process according to another embodiment of the present application;

[0071] Figure 18 shows a schematic diagram of a correction mechanism in a leveling device for correcting the deformation of a heated carrier plate in an online process according to another embodiment of the present application;

[0072] Figure 19 shows a flowchart of a leveling method for correcting the deformation of a heated carrier plate in an online process according to an embodiment of the present application;

[0073] Figure 20 shows a flowchart of a leveling method for correcting the deformation of a heated carrier plate in an online process according to another embodiment of the present application.

[0074] wherein 1, carrier plate; 2, fixed support; 3, fixed leveling assembly; 4, first driving assembly; 5, flexible leveling assembly; 6, movable support; 7, fixed correction assembly; 8, second driving assembly; 9, flexible correction assembly. DETAILED DESCRIPTION

[0075] In order to enable a more clear understanding of the above-mentioned objects, features and advantages of the present disclosure, the embodiments of the present disclosure will be further described below. It should be noted that the embodiments of the present disclosure and the features in the embodiments can be combined with each other without conflict.

[0076] In the following description, a large number of specific details are set forth in order to facilitate a thorough understanding of the present disclosure, but the present disclosure can also be implemented in other ways different from those described herein; obviously, the embodiments in the specification are only part of the embodiments of the present disclosure, not all the embodiments.

[0077] Fig. 1 and Fig. 2 show the overall structure of an online flatness device for correcting the heating deformation of a carrier plate according to an embodiment of the present application, wherein Fig. 1 shows the structure of the flatness device when the carrier plate 1 is in a horizontal state, and Fig. 2 shows the structure of the flatness device when the carrier plate 1 is in a vertical state.

[0078] As shown in Fig. 1, an online flatness device for correcting the heating deformation of a carrier plate, comprising a carrier plate 1, a fixed support 2, a fixed flatness assembly 3, a first driving assembly 4 and a flexible flatness assembly 5, wherein the carrier plate 1 is placed on the bottom of the upper side of the fixed support 2 in a horizontal state, the fixed flatness assembly 3 is arranged on the lower side of the fixed support 2, the first driving assembly 4 is arranged on the lower side of the fixed support 2, the flexible flatness assembly 5 is arranged on the first driving assembly 4, the first driving assembly 4 is drivingly connected with the flexible flatness assembly 5, and the first driving assembly 4 is arranged in parallel with the fixed flatness assembly 3.

[0079] When the above-mentioned flatness device is in operation, the first driving assembly 4 drives upward to push the flexible flatness assembly 5 to approach the carrier plate 1, the carrier plate 1 is fixedly connected with the flexible flatness assembly 5 after being stressed, the first driving assembly 4 drives downward to retract the flexible flatness assembly 5, the flexible flatness assembly 5 drives the connected carrier plate 1 to approach the fixed flatness assembly 3 downward, the carrier plate 1 is stressed and fixedly connected with the fixed flatness assembly 3 after reaching the appropriate position, the horizontal plane of the carrier plate 1 is leveled, the maximum height error of the plane is less than 1mm, and the stability and success rate of the upper sheet taking and placing of the fragile sheet on the carrier plate 1 are ensured.

[0080] In the embodiment, as shown in FIG. 1, the uneven carrier plate 1 has a maximum height error of less than 30 mm in the horizontal state, for example, the maximum height error of the plane is 25 mm. First, the first driving assembly 4 drives the flexible leveling assembly 5 to approach the carrier plate 1, and the carrier plate 1 is fixedly connected to the flexible leveling assembly 5 after being stressed, so as to realize the preliminary leveling of the carrier plate 1. Then, the first driving assembly 4 drives the flexible leveling assembly 5 to retract, and the flexible leveling assembly 5 drives the connected carrier plate 1 to approach the fixed leveling assembly 3. The distance between the carrier plate 1 and the fixed leveling assembly 3 is controlled to be less than 10 mm. Finally, the fixed leveling assembly 3 levels the carrier plate 1 in line, so that the uneven carrier plate 1 with a maximum height error of less than 10 mm is leveled to a maximum height error of less than 1 mm, thereby ensuring the flatness of the carrier plate 1 in the horizontal state, and reducing the fragment rate of the fragile sheet in the feeding and discharging process.

[0081] In the embodiment, as shown in FIG. 1, the carrier plate 1 and the flexible leveling assembly 5 are fixedly connected through short-distance space attraction force, which includes any one of gravity, permanent magnetic force, electromagnetic force, electrostatic force, strong force and weak force. Preferably, the carrier plate 1 and the flexible leveling assembly 5 are fixedly connected through electromagnetic force, for example, the lower surface of the carrier plate 1 is provided with an iron block, and the flexible leveling assembly 5 is provided with an electromagnet, so as to be fixedly connected through the electromagnet attracting the iron block to realize leveling. Alternatively, the carrier plate 1 and the flexible leveling assembly 5 can be fixedly connected through a contact element, which includes any one of mechanical bolt, nail, glue, adhesive, suction cup and bayonet. Preferably, the carrier plate 1 and the flexible leveling assembly 5 are fixedly connected through the suction cup, that is, the suction cup is arranged on the flexible leveling assembly 5, and the arranged suction cup is stressed to adsorb the carrier plate 1 when the flexible leveling assembly 5 moves upward to approach the carrier plate 1, so as to complete the leveling of the carrier plate 1.

[0082] In the embodiment, as shown in FIG. 1, the carrier plate 1 and the fixed leveling assembly 3 are fixedly connected through short-distance space attraction force, which includes any one of gravity, permanent magnetic force, electromagnetic force, electrostatic force, strong force and weak force. Preferably, the carrier plate 1 and the fixed leveling assembly 3 are fixedly connected through electromagnetic force, for example, the lower surface of the carrier plate 1 is provided with an iron block, and the fixed leveling assembly 3 is provided with an electromagnet, so as to be fixedly connected through the electromagnet attracting the iron block to realize leveling.

[0083] In the embodiment, as shown in FIG. 1, the first driving assembly 4 includes any one of air cylinder, oil cylinder, electric cylinder and linear motor. Preferably, the first driving assembly 4 is an air cylinder.

[0084] Therefore, in the above optimal or preferred embodiment described in FIG. 1, when the carrier plate 1 in the horizontal state is leveled, the air cylinder (the first driving assembly 4) moves upward to push the flexible leveling assembly 5 to approach the carrier plate 1, the electromagnet on the flexible leveling assembly 5 attracts the iron block arranged on the lower side of the carrier plate 1, the carrier plate 1 is fixedly connected with the flexible leveling assembly 5 after being stressed, the air cylinder moves downward to retract, the flexible leveling assembly 5 drives the connected carrier plate 1 to move downward, gradually approaches the fixed leveling assembly 3, and reaches the appropriate position (the distance between the carrier plate 1 and the fixed leveling assembly 3 is reduced to within 10 mm), the electromagnet on the fixed leveling assembly 3 attracts the corresponding iron block arranged on the lower side of the carrier plate 1, so that the carrier plate 1 is stressed and fixedly connected with the fixed leveling assembly 3, the horizontal plane leveling of the carrier plate 1 is realized, the maximum height error of the plane is ensured to be less than 1 mm, and the stability and success rate of the upper taking and placing of the fragile thin sheet on the carrier plate are realized.

[0085] As shown in FIG. 2, an online type leveling device for correcting the deformation of the carrier plate includes the leveling mechanism shown in FIG. 1 and a correction mechanism in which the carrier plate 1 is in a vertical state and is placed on the inner side of one side (for example, the left side shown in FIG. 2) of the movable support 6, the fixed correction assembly 7 is arranged on the other side (for example, the right side shown in FIG. 2) of the movable support 6, the second driving assembly 8 is arranged on the other side (for example, the right side shown in FIG. 2) of the movable support 6, the flexible correction assembly 9 is arranged on the second driving assembly 8, the second driving assembly 8 is drivingly connected with the flexible correction assembly 9, and the second driving assembly 8 is arranged in parallel with the fixed correction assembly 7.

[0086] Similarly, when the above correction mechanism operates, the second driving assembly 8 drives upward to push the flexible correction assembly 9 to approach the carrier plate 1, the carrier plate 1 is fixedly connected with the flexible correction assembly 9 after being stressed, the second driving assembly 8 drives downward to retract the flexible correction assembly 9, the flexible correction assembly 9 drives the connected carrier plate 1 to move downward to approach the fixed correction assembly 7, the carrier plate 1 is stressed and fixedly connected with the fixed correction assembly 7 after reaching the appropriate position, and the carrier plate 1, the second driving assembly 8 and the fixed correction assembly 7 are fixed on the movable support 6 as a whole and can rotate or move with the rotation of the movable support 6, so that the carrier plate 1 can stably move from the vertical state to the horizontal state, the positional deviation of the carrier plate 1 in the movement process and the unevenness of the carrier plate 1 are reduced, and the best carrier plate correction effect is realized.

[0087] In the embodiment, as shown in Fig. 2, the uneven carrier plate 1 has a maximum height error of less than 50 mm in the vertical state, for example, the maximum height error is 48 mm. First, the second driving assembly 8 drives the flexible correction assembly 9 to approach the carrier plate 1, and the carrier plate 1 is fixedly connected to the flexible correction assembly 9 after being stressed, so as to realize the preliminary correction of the carrier plate 1. Then, the second driving assembly 8 drives the flexible correction assembly 9 to retract, the flexible correction assembly 9 drives the connected carrier plate 1 to approach the fixed correction assembly 7, and the distance between the carrier plate 1 and the fixed correction assembly 7 is controlled to be less than 20 mm. Finally, the fixed correction assembly 7 corrects the carrier plate 1 in line, so that the uneven carrier plate 1 with a maximum height error of less than 20 mm is leveled to a maximum height error of less than 5 mm. Meanwhile, the carrier plate 1, the second driving assembly 8 and the fixed correction assembly 7 are fixed on the movable support 6 as a whole, so that the carrier plate 1 can be stably moved from the vertical state to the horizontal state along with the rotation of the movable support 6. After the carrier plate 1 is stably moved to the horizontal state, the carrier plate 1 is transported to the leveling mechanism shown in Fig. 1 for leveling operation.

[0088] In the embodiment, as shown in Fig. 2, the carrier plate 1 and the flexible correction assembly 9 are fixedly connected through short-distance space attraction force, which includes any one of gravity, permanent magnetic force, electromagnetic force, electrostatic force, strong force and weak force. Preferably, the carrier plate 1 and the flexible correction assembly 9 are fixedly connected through electromagnetic force, for example, the lower surface of the carrier plate 1 is provided with an iron block, and the flexible correction assembly 9 is provided with an electromagnet, so as to be fixedly connected through the electromagnet attracting the iron block to realize correction. Alternatively, the carrier plate 1 and the flexible correction assembly 9 are fixedly connected through a contact element, which includes any one of mechanical bolt, nail, glue, adhesive, suction cup and bayonet. Preferably, the carrier plate 1 and the flexible correction assembly 9 are fixedly connected through the suction cup, that is, the suction cup is arranged on the flexible correction assembly 9, and the arranged suction cup is stressed to adsorb the carrier plate 1 when the flexible correction assembly 9 moves upward to approach the carrier plate 1, so as to complete the correction of the carrier plate 1.

[0089] In the embodiment, as shown in Fig. 2, the carrier plate 1 and the fixed correction assembly 7 are fixedly connected through short-distance space attraction force, which includes any one of gravity, permanent magnetic force, electromagnetic force, electrostatic force, strong force and weak force. Preferably, the carrier plate 1 and the fixed correction assembly 7 are fixedly connected through electromagnetic force, for example, the lower surface of the carrier plate 1 is provided with an iron block, and the fixed correction assembly 7 is provided with an electromagnet, so as to be fixedly connected through the electromagnet attracting the iron block to realize correction.

[0090] In the embodiment, the second driving assembly 8 includes any one of air cylinder, oil cylinder, electric cylinder and linear motor. Preferably, the second driving assembly 8 is the same as the first driving assembly 4, and the second driving assembly 8 is also an air cylinder.

[0091] Therefore, in the above optimal or preferred embodiment shown in Fig. 2, when the carrier plate 1 is corrected, the cylinder (the second driving assembly 8) moves upward to push the flexible correction assembly 9 to approach the carrier plate 1, the electromagnet on the flexible correction assembly 9 attracts the iron block arranged below the carrier plate 1, the carrier plate 1 is fixedly connected with the flexible correction assembly 9 after being forced, the cylinder moves downward to retract, the flexible correction assembly 9 drives the connected carrier plate 1 to move downward and gradually approach the fixed correction assembly 7, and after reaching the appropriate position (the distance between the carrier plate 1 and the fixed correction assembly 7 is reduced to within 20 mm), the electromagnet on the fixed correction assembly 7 attracts the iron block arranged below the carrier plate 1, so that the carrier plate 1 is forced to be fixedly connected with the fixed correction assembly 7, the correction of the carrier plate 1 is realized, and at the same time, the carrier plate 1, the cylinder and the fixed correction assembly 7 are fixed on the movable support 6 as a whole, so that the carrier plate 1 can be moved from the vertical state to the horizontal state along with the rotation of the movable support 6, thereby ensuring the stability of the carrier plate 1 when moving from the vertical state to the horizontal state.

[0092] Generally, the carrier plate 1 is usually in the horizontal state, so that when leveling is performed, only the leveling mechanism shown in Fig. 1 is used for leveling operation, so as to ensure that the maximum height error of the plane of the carrier plate 1 is less than 1 mm, the stability and success rate of the fragile sheet on the carrier plate are realized, the production efficiency is improved, and the breakage rate of the fragile sheet during the feeding and discharging process is greatly reduced.

[0093] However, when the carrier plate 1 is in the vertical state, the carrier plate 1 needs to be leveled first by using the correction mechanism shown in Fig. 2 to stably move from the vertical state to the horizontal state, and then leveled by using the leveling mechanism shown in Fig. 1.

[0094] Specifically, as shown in Figs. 1 and 2, when the carrier plate 1 needs to be leveled, the second driving assembly 8 is controlled to push the flexible correction assembly 9 to approach the carrier plate 1, the carrier plate 1 is fixedly connected with the flexible correction assembly 9 after being forced to follow the movement of the flexible correction assembly 9, the second driving assembly 8 is controlled to retract the flexible correction assembly 9, so that the flexible correction assembly 9 drives the connected carrier plate 1 to approach the fixed correction assembly 7, the distance between the carrier plate 1 and the fixed correction assembly 7 is reduced, the carrier plate 1 is fixedly connected with the fixed correction assembly 7 after being forced, the correction of the carrier plate 1 is realized, and the stability of the carrier plate 1 when moving from the vertical state to the horizontal state is ensured.

[0095] By controlling the rotating of the movable support 6, the carrier plate 1 is moved from the vertical state to the horizontal state, at this time, the corrected carrier plate 1 enters into the leveling mechanism, the first driving assembly 4 is controlled to push the flexible leveling assembly 5 to approach the carrier plate 1, the carrier plate 1 is fixedly connected with the flexible leveling assembly 5 after being forced, and then follows the movement of the flexible leveling assembly 5, the first driving assembly 4 is controlled to retract the flexible leveling assembly 5, so that the flexible leveling assembly 5 drives the connected carrier plate 1 to approach the fixed leveling assembly 3, the distance between the carrier plate 1 and the fixed leveling assembly 3 is reduced, the carrier plate 1 is fixedly connected with the fixed leveling assembly 3 after being forced, the leveling of the carrier plate 1 is realized, the flatness of the carrier plate 1 in the horizontal state is ensured, and the fragment rate of the fragile sheet in the loading and unloading process is reduced.

[0096] FIGS. 3 and 4 show the overall structure of an online leveling device for correcting the deformation of the carrier plate according to another embodiment of the present application, wherein FIG. 3 shows the structure of the leveling mechanism when the carrier plate 1 is in the horizontal state, and FIG. 4 shows the structure of the correction mechanism when the carrier plate 1 is in the vertical state.

[0097] In this embodiment, the structure for correcting and leveling two carrier plates 1 is shown, as shown in FIG. 3, for the two carrier plates 1 in the horizontal state, the leveling mechanism is provided with the fixed support 2, and for each carrier plate 1, the fixed leveling assembly 3, the first driving assembly 4 and the flexible leveling assembly 5 are arranged below the corresponding carrier plate 1, for example, the structure shown on the left and right sides in FIG. 3. The working principle is similar to that of FIG. 1, for each carrier plate 1, the corresponding first driving assembly 4 drives the corresponding flexible leveling assembly 5 to move upward, the corresponding flexible leveling assembly 5 approaches the corresponding carrier plate 1, the corresponding carrier plate 1 is fixedly connected with the corresponding flexible leveling assembly 5 after being forced, then the corresponding first driving assembly 4 moves downward to retract, drives the corresponding flexible leveling assembly 5 and the connected carrier plate 1 to approach the corresponding fixed leveling assembly 3 downward, the corresponding carrier plate 1 is fixedly connected with the corresponding fixed leveling assembly 3 after being forced, so as to realize the leveling of the corresponding carrier plate 1. Of course, the leveling of the carrier plates 1 on the left and right sides in FIG. 3 can be performed simultaneously or not simultaneously.

[0098] As shown in Fig. 4, for two carrier plates 1 in vertical state, the correction mechanism is provided with a fixed correction assembly 7, a second driving assembly 8 and a flexible correction assembly 9 under the corresponding carrier plate 1 on the premise of sharing one movable support 6, such as the structure design shown on the upper and lower sides in Fig. 4. The working principle is similar to that of Fig. 2. For each carrier plate 1, the corresponding second driving assembly 8 drives the corresponding flexible correction assembly 9 to move upward, the corresponding flexible correction assembly 9 approaches the corresponding carrier plate 1, and then the corresponding carrier plate 1 is fixedly connected with the corresponding flexible correction assembly 9 after being stressed, then the corresponding second driving assembly 8 moves downward to retract, driving the corresponding carrier plate 1 and the connected flexible correction assembly 9 to approach the corresponding fixed correction assembly 7, and then the corresponding carrier plate 1 is fixedly connected with the corresponding fixed correction assembly 7 after being stressed, so as to realize the correction of the corresponding carrier plate 1. Of course, the correction of the carrier plates 1 on the upper and lower sides in Fig. 4 can be carried out simultaneously or not simultaneously.

[0099] Fig. 5 shows a structure schematic diagram of an online flatting mechanism for correcting the heating deformation of a carrier plate according to another embodiment of the present application. In this embodiment, the structure is similar to that of Fig. 3, and the difference is that for each corresponding carrier plate 1, the fixed flatting assembly 3 arranged below the carrier plate 1 is not spaced apart from the first driving assembly 4 but is abutted with the first driving assembly 4.

[0100] Fig. 6 shows a structure schematic diagram of an online flatting mechanism for correcting the heating deformation of a carrier plate according to another embodiment of the present application. In this embodiment, for the carrier plate 1 in horizontal state, the number of the first driving assembly 4, the flexible flatting assembly 5 and the fixed flatting assembly 3 designed for each carrier plate 1 can be selected according to actual needs, for example, for one corresponding carrier plate 1, the number of the fixed flatting assembly 3 can be multiple, such as 2, 3, 4 or the like, and the number of the whole of the first driving assembly 4 and the flexible flatting assembly 5 can also be multiple, such as 2, 3, 4 or the like. In this embodiment, all the fixed flatting assemblies 3 are arranged together, and all the whole of the first driving assembly 4 and the flexible flatting assembly 5 are arranged together, and these components are all arranged or arranged in parallel with equal intervals.

[0101] Fig. 7 shows a structure schematic diagram of an online flatting mechanism for correcting the heating deformation of a carrier plate according to another embodiment of the present application. In this embodiment, the structure is similar to that of Fig. 6, and the difference is that all the fixed flatting assemblies 3 are arranged together, and all the whole of the first driving assembly 4 and the flexible flatting assembly 5 are arranged together, and these components are all arranged or arranged in abutment with each other.

[0102] Figure 8 shows a schematic diagram of the structure of a leveling mechanism for correcting the deformation of a heated carrier plate in an online manner according to another embodiment of the present application. In this embodiment, the structure is similar to that of Figure 6, except that the fixed leveling assemblies 3 and the whole of the first driving assemblies 4 and the flexible leveling assemblies 5 are arranged or arranged in parallel in an alternating and equidistant manner.

[0103] Figure 9 shows a schematic diagram of the structure of a leveling mechanism for correcting the deformation of a heated carrier plate in an online manner according to another embodiment of the present application. In this embodiment, the structure is similar to that of Figure 8, except that the fixed leveling assemblies 3 and the whole of the first driving assemblies 4 and the flexible leveling assemblies 5 are arranged or arranged in an alternating and abutting manner.

[0104] Figure 10 shows a schematic diagram of the structure of a leveling mechanism for correcting the deformation of a heated carrier plate in an online manner according to another embodiment of the present application. In this embodiment, the structure is similar to that of Figure 6, except that all the fixed leveling assemblies 3 are arranged together, and the whole of the first driving assemblies 4 and the flexible leveling assemblies 5 are arranged together, wherein all the fixed leveling assemblies 3 are arranged or arranged in parallel in an equidistant manner, and the whole of the first driving assemblies 4 and the flexible leveling assemblies 5 are arranged or arranged in an abutting manner. Of course, all the fixed leveling assemblies 3 can also be arranged or arranged in an abutting manner, and the whole of the first driving assemblies 4 and the flexible leveling assemblies 5 can be arranged or arranged in parallel in an equidistant manner.

[0105] Figure 11 shows a schematic diagram of the structure of a leveling mechanism for correcting the deformation of a heated carrier plate in an online manner according to another embodiment of the present application. In this embodiment, the structure is similar to that of Figure 8, except that the fixed leveling assemblies 3 and the whole of the first driving assemblies 4 and the flexible leveling assemblies 5 are arranged in an alternating manner, wherein each two are a group, the fixed leveling assemblies 3 in the group and the whole of the first driving assemblies 4 and the flexible leveling assemblies 5 are arranged or arranged in an abutting manner, and each group is arranged or arranged in an equidistant manner.

[0106] Figure 12 shows a schematic diagram of the structure of a correction mechanism in a leveling device for correcting the deformation of a heated carrier plate in an online manner according to another embodiment of the present application. In this embodiment, the structure is similar to that of Figure 4, except that for each corresponding carrier plate 1, the fixed correction assemblies 7 arranged below the carrier plate 1 and the second driving assemblies 8 are not arranged in a spaced manner but in an abutting manner.

[0107] Figure 13 shows a schematic diagram of the structure of the correction mechanism in the flattening device for correcting the deformation of the heated carrier plate in an online manner according to another embodiment of the present application. In this embodiment, for the carrier plate 1 in a horizontal state, the number of the second driving assemblies 8, the flexible correction assemblies 9 and the fixed correction assemblies 7 designed for each carrier plate 1 can be selected according to actual needs. For example, for a corresponding carrier plate 1, the number of the fixed correction assemblies 7 can be multiple, such as 2, 3, 4, etc., and the number of the overall second driving assemblies 8 and the flexible correction assemblies 9 can also be multiple, such as 2, 3, 4, etc. In this embodiment, all the fixed correction assemblies 7 are arranged together, and all the overall second driving assemblies 8 and the flexible correction assemblies 9 are arranged together, and these components are arranged or arranged in parallel with equal intervals.

[0108] Figure 14 shows a schematic diagram of the structure of the correction mechanism in the flattening device for correcting the deformation of the heated carrier plate in an online manner according to another embodiment of the present application. In this embodiment, the structure is similar to that of Figure 13, and the difference is that all the fixed correction assemblies 7 are arranged together, and all the overall second driving assemblies 8 and the flexible correction assemblies 9 are arranged together, and these components are arranged or arranged in abutment with each other.

[0109] Figure 15 shows a schematic diagram of the structure of the correction mechanism in the flattening device for correcting the deformation of the heated carrier plate in an online manner according to another embodiment of the present application. In this embodiment, the structure is similar to that of Figure 13, and the difference is that the fixed correction assemblies 7 and the overall second driving assemblies 8 and the flexible correction assemblies 9 can be arranged or arranged in parallel with equal intervals and intersected with each other.

[0110] Figure 16 shows a schematic diagram of the structure of the correction mechanism in the flattening device for correcting the deformation of the heated carrier plate in an online manner according to another embodiment of the present application. In this embodiment, the structure is similar to that of Figure 15, and the difference is that the fixed correction assemblies 7 and the overall second driving assemblies 8 and the flexible correction assemblies 9 can be arranged or arranged in abutment with each other and intersected with each other.

[0111] Figure 17 shows a schematic diagram of the structure of the correction mechanism in the online flatting device for correcting the deformation of the heated carrier plate according to another embodiment of the present application. In this embodiment, the structure is similar to that of Figure 15, except that all the fixed correction assemblies 7 are arranged together, and all the second driving assemblies 8 and flexible correction assemblies 9 are arranged together, wherein all the fixed correction assemblies 7 are arranged or arranged in parallel at equal intervals, and all the second driving assemblies 8 and flexible correction assemblies 9 are arranged or arranged in abutment with each other. Of course, all the fixed correction assemblies 7 can also be arranged or arranged in abutment with each other, and all the second driving assemblies 8 and flexible correction assemblies 9 can be arranged or arranged in parallel at equal intervals.

[0112] Figure 18 shows a schematic diagram of the structure of the correction mechanism in the online flatting device for correcting the deformation of the heated carrier plate according to another embodiment of the present application. In this embodiment, the structure is similar to that of Figure 15, except that the arrangement of the fixed correction assemblies 7 and the overall second driving assemblies 8 and flexible correction assemblies 9 can be arranged in cross, wherein each two are a group, the fixed correction assemblies 7 in the group and the overall second driving assemblies 8 and flexible correction assemblies 9 are arranged in abutment with each other, and each group is arranged or arranged at equal intervals.

[0113] The above embodiments of the present application can be used in photovoltaic industry equipment, but the present application is not limited to use in photovoltaic industry equipment, nor is it limited to use in new energy industry, nor is it limited to use in the semiconductor industry.

[0114] In addition, Figure 19 shows a schematic diagram of the flow of an online flatting method for correcting the deformation of a heated carrier plate according to an embodiment of the present application. As shown in Figure 19, the online flatting method for correcting the deformation of a heated carrier plate according to this embodiment is implemented by the online flatting mechanism for correcting the deformation of a heated carrier plate described above, and the flatting method comprises the following steps:

[0115] S1: placing the carrier plate 1 in a horizontal state on the fixed support 2 of the flatting mechanism;

[0116] S2: controlling the first driving assembly 4 of the flatting mechanism to push the flexible flatting assembly 5 to approach the carrier plate 1, and making the carrier plate 1 fixedly connected with the flexible flatting assembly 5 after being stressed;

[0117] S3: controlling the first driving assembly 4 to retract the flexible flatting assembly 5, so that the distance between the carrier plate 1 and the fixed flatting assembly 3 is reduced, and the carrier plate 1 is fixedly connected with the fixed flatting assembly 3 after being stressed.

[0118] Figure 20 shows a flow chart of an online flatness correction method for correcting the deformation of a carrier plate according to another embodiment of the present application. As shown in Figure 20, the online flatness correction method for correcting the deformation of a carrier plate according to this embodiment is implemented by the online flatness correction device described above. The online flatness correction method comprises the following steps:

[0119] S10: placing the carrier plate 1 in a vertical state on the movable support 6 of the correction mechanism;

[0120] S20: controlling the second driving assembly 8 of the correction mechanism to push the flexible correction assembly 9 to approach the carrier plate 1, and to make the carrier plate 1 fixedly connected with the flexible correction assembly 9 after being stressed;

[0121] S30: controlling the second driving assembly 8 to retract the flexible correction assembly 9, so that the distance between the carrier plate 1 and the fixed correction assembly 7 is reduced, and the carrier plate 1 is fixedly connected with the fixed correction assembly 7 after being stressed;

[0122] S40: controlling the movable support 6 to rotate, so that the carrier plate 1 moves from the vertical state to the horizontal state;

[0123] S50: placing the carrier plate 1 in a horizontal state on the fixed support 2 of the flattening mechanism;

[0124] S60: controlling the first driving assembly 4 of the flattening mechanism to push the flexible flattening assembly 5 to approach the carrier plate 1, and to make the carrier plate 1 fixedly connected with the flexible flattening assembly 5 after being stressed;

[0125] S70: controlling the first driving assembly 4 to retract the flexible flattening assembly 5, so that the distance between the carrier plate 1 and the fixed flattening assembly 3 is reduced, and the carrier plate 1 is fixedly connected with the fixed flattening assembly 3 after being stressed.

[0126] In summary, the present application can correct the deformation of a large-area carrier plate with fragile sheets in an online manner. The present application does not require the carrier plate to have an extremely low thermal expansion coefficient, nor does it require the carrier plate to be thickened. The carrier plate is flattened during the loading and unloading of the fragile sheets, which improves the production efficiency and greatly reduces the breakage rate of the fragile sheets during the loading and unloading process. The present application can flatten the carrier plate online, greatly reducing the breakage rate of the fragile sheets during the loading and unloading process, and achieving the stability and success rate of loading and unloading the fragile sheets on the carrier plate.

[0127] It has to be noted that, in the present document, relational terms are intended only to convey a possible relationship between elements or

[0128] The foregoing description of the exemplary embodiment ( s ) of this application has been presented for the purposes of illustration and description. It is not intended to be exhaustive or to limit the application to the precise form disclosed. Many modifications and variations are possible in light of the above teaching. It is intended that the scope of the application be limited not with this detailed description, but rather by the claims appended hereto.

Claims

1. An online flatness mechanism for correcting the deformation of a carrier plate, characterized by, The application relates to a leveling device for a plate, which comprises the following parts: a fixed support; a plate placed on the bottom of the upper side of the fixed support in a horizontal state; a fixed leveling assembly arranged on the lower side of the fixed support; a first driving assembly arranged on the lower side of the fixed support; a flexible leveling assembly drivingly connected with the first driving assembly, so that the plate is fixedly connected with the flexible leveling assembly and the fixed leveling assembly respectively.

2. The in-line straightening flat bar heating and straightening mechanism according to claim 1, characterized in that, The plate and the flexible leveling assembly are fixedly connected through short-distance space attraction, which comprises any one of gravity, permanent magnetism, electromagnetism, electrostatic force, strong force and weak force, or the plate and the flexible leveling assembly are fixedly connected through a contact element, which comprises any one of a mechanical bolt, a nail, glue, an adhesive, a suction cup and a bayonet. The plate and the fixed leveling assembly are fixedly connected through short-distance space attraction, which comprises any one of gravity, permanent magnetism, electromagnetism, electrostatic force, strong force and weak force.

3. The in-line straightening mechanism for correcting the deformation of a carrier plate according to claim 1, wherein The fixed leveling assembly levels the plate with a maximum height error of a plane less than 10 mm and levels the plate to a maximum height error of a plane less than 1 mm; and the flexible leveling assembly levels the plate with a maximum height error of a plane less than 30 mm.

4. An online flattening device for correcting the deformation of a carrier plate, characterized by The application relates to a leveling device for a plate, which comprises the following parts: a correction mechanism, which comprises: a movable support; a plate placed on the inner side of one side of the movable support in a vertical state, and the plate moves from the vertical state to a horizontal state with the rotation of the movable support; a fixed correction assembly arranged on the other side of the movable support; a second driving assembly arranged on the other side of the movable support; a flexible correction assembly drivingly connected with the second driving assembly, so that the plate is fixedly connected with the flexible correction assembly and the fixed correction assembly respectively; and a leveling mechanism for leveling the plate when the plate is corrected and rotated to a horizontal state by the correction mechanism, wherein the leveling mechanism is the leveling mechanism for correcting the heating deformation of the plate in line as claimed in any one of claims 1-3. The plate and the flexible correction assembly are fixedly connected through short-distance space attraction, which comprises any one of gravity, permanent magnetism, electromagnetism, electrostatic force, strong force and weak force, or the plate and the flexible correction assembly are fixedly connected through a contact element, which comprises any one of a mechanical bolt, a nail, glue, an adhesive, a suction cup and a bayonet.

5. The online flatness device for correcting the deformation of a carrier plate according to claim 4, wherein The plate and the fixed correction assembly are fixedly connected through short-distance space attraction, which comprises any one of gravity, permanent magnetism, electromagnetism, electrostatic force, strong force and weak force. ​ 6. The online flatness device for correcting the deformation of a carrier plate according to claim 4, wherein The fixed correction assembly corrects the carrier plate with a maximum height error of the plane less than 20 mm and corrects the carrier plate to a maximum height error of the plane less than 5 mm; the flexible correction assembly corrects the carrier plate with a maximum height error of the plane less than 50 mm.

7. An online flattening method of correcting the deformation of a carrier plate, characterized by, The flattening method is implemented by the online correction carrier plate heating deformation flattening mechanism of any one of the preceding claims 1-3, and the flattening method comprises the following steps: Place the carrier plate in a horizontal state on the fixed support of the flattening mechanism; Control the first drive assembly of the flattening mechanism to push the flexible flattening assembly close to the carrier plate, and make the carrier plate fixedly connected with the flexible flattening assembly after being stressed; Control the first drive assembly to retract the flexible flattening assembly, so that the distance between the carrier plate and the fixed flattening assembly is reduced, and the carrier plate is fixedly connected with the fixed flattening assembly after being stressed.

8. The online leveling method for correcting heating deformation of a carrier plate according to claim 7, characterized in that, The distance between the carrier plate and the fixed flattening assembly is reduced to within 10 mm.

9. An online flattening method of correcting a deformation of a carrier plate by heating, characterized by, The flattening method is implemented by the online correction carrier plate heating deformation flattening device of any one of the preceding claims 4-6, and the flattening method comprises the following steps: Place the carrier plate in a vertical state on the movable support of the correction mechanism; Control the second drive assembly of the correction mechanism to push the flexible correction assembly close to the carrier plate, and make the carrier plate fixedly connected with the flexible correction assembly after being stressed; Control the second drive assembly to retract the flexible correction assembly, so that the distance between the carrier plate and the fixed correction assembly is reduced, and the carrier plate is fixedly connected with the fixed correction assembly after being stressed. Control the movable support to rotate, so that the carrier plate moves from the vertical state to the horizontal state; Place the carrier plate in a horizontal state on the fixed support of the flattening mechanism; Control the first drive assembly of the flattening mechanism to push the flexible flattening assembly close to the carrier plate, and make the carrier plate fixedly connected with the flexible flattening assembly after being stressed; Control the first drive assembly to retract the flexible flattening assembly, so that the distance between the carrier plate and the fixed flattening assembly is reduced, and the carrier plate is fixedly connected with the fixed flattening assembly after being stressed.

10. The on-line corrective flatness pad heating deformation flattening method according to claim 9, wherein The distance between the carrier plate and the fixed correction assembly is reduced to within 20 mm, and the distance between the carrier plate and the fixed flattening assembly is reduced to within 10 mm.

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