Circuit board, display module, and display device

Abstract

A circuit board, a display module, and a display device, relating to the technical field of display. In the circuit board, the distance between first touch gold fingers and a touch chip is relatively long, and first-type touch traces among touch traces are routed from a second board portion and bypass the side of display gold fingers distant from the first touch gold fingers and then extend into a first board portion, thereby reducing a routing length of the first-type touch traces on the first board portion. The distance between second touch gold fingers and the touch chip is relatively short, so that a routing length of second-type touch traces among the touch traces on the first board portion is not too long. That is, the routing length of the touch traces on the first board portion is relatively short, which facilitates the routing design of display traces to prevent the orthographic projections of the touch traces and the display traces from overlapping, and prevent display signals transmitted by the display traces and touch signals transmitted by the touch traces from interfering with each other, thereby improving the yield rate of the display module.

Description

Circuit board, display module and display device

[0001] The present disclosure claims priority to the Chinese patent application No. 202411340371.4, filed on September 24, 2024, and entitled "Circuit board, display module and display device", the entire contents of which are incorporated herein by reference. TECHNICAL FIELD

[0002] The present application relates to the technical field of display, in particular to a circuit board, a display module and a display device. BACKGROUND

[0003] With the increasing demand of users for display products, a display module with a flexible multi-layer on cell (FMLOC) structure is widely used. SUMMARY

[0004] The present application provides a circuit board, a display module and a display device, and the technical solutions are as follows:

[0005] In one aspect, a circuit board is provided, comprising:

[0006] a first board body portion;

[0007] a gold finger portion, the gold finger portion being located on one side of a first side edge of the first board body portion, the gold finger portion comprising a plurality of first touch gold fingers, a plurality of display gold fingers and a plurality of second touch gold fingers, the plurality of display gold fingers being located between the plurality of first touch gold fingers and the plurality of second touch gold fingers;

[0008] a second board body portion, the second board body portion being located on a side of the gold finger portion away from the first side edge;

[0009] a touch chip, the touch chip being located on the first board body portion, and a distance between the touch chip and the plurality of second touch gold fingers being less than a distance between the touch chip and the plurality of first touch gold fingers;

[0010] Touch wires, the touch wires include a plurality of first type touch wires corresponding to the plurality of first touch fingers, and a plurality of second type touch wires corresponding to the plurality of second touch fingers; one end of the first type touch wire is connected with the first touch finger, the other end of the first type touch wire is inserted into the first plate body part from some of the plurality of display fingers away from the plurality of first touch fingers and connected with the touch chip, the part between the two ends of the first type touch wire is located on the second plate body part; one end of the second type touch wire is connected with the second touch finger, and the other end is connected with the touch chip, the second type touch wire is located on the first plate body part;

[0011] And display wires, the display wires are located on the first plate body part, and the display wires are connected with the display fingers;

[0012] Wherein, the orthographic projection of the display wires on the first plate body part and the orthographic projection of the touch wires on the first plate body part do not overlap.

[0013] Optionally, one end of the second plate body part is connected with the first area of the finger part, the other end of the second plate body part is connected with the second area of the finger part, and the part between the two ends of the second plate body part has a first hollow area between the finger part;

[0014] The first area is an area where at least part of the first touch finger is located, and the second area is an area where at least part of the second touch finger is located.

[0015] Optionally, the second plate body part further has a second hollow area;

[0016] The part between the two ends of a part of the first type touch wires is located on the first part of the second hollow area close to the first plate body part in the second plate body part;

[0017] The part between the two ends of another part of the first type touch wires is located on the second part of the second hollow area away from the first plate body part in the second plate body part.

[0018] Optionally, the circuit board further comprises:

[0019] A connecting plate body part, the connecting plate body part is connected with the first plate body part, and the display wires are also located on the connecting plate body part;

[0020] and a connector located on a side of the connecting plate body part away from the first plate body part, and the connector is connected with the display wire, and the connector is also used for connecting a power supply component of the display module.

[0021] Optionally, the connecting plate body part is connected with a second side of the first plate body part, and the second side and the first side are different sides of the first plate body part.

[0022] The first plate body part has a third hollow region, and the connecting plate body part and the connector are located in the third hollow region, and the connecting plate body part is connected with a side of the third hollow region.

[0023] Optionally, a shape of an orthographic projection of the connecting plate body part on a reference plane is a rectangle, an L shape, or a curved shape.

[0024] The reference plane is parallel to a surface of the connecting plate body part on which the display wire is arranged.

[0025] Optionally, the first plate body part comprises a first shielding layer, a first insulating layer, a first conductive layer, a second insulating layer, a second conductive layer, a third insulating layer, and a second shielding layer which are sequentially stacked.

[0026] The touch wire is located on the first conductive layer, and the display wire is located on the second conductive layer.

[0027] The circuit board further comprises a grounding part located in the first conductive layer and the second conductive layer, the grounding part located in the first conductive layer is arranged in a spaced manner with the touch wire, and the grounding part located in the second conductive layer is arranged in a spaced manner with the display wire.

[0028] Optionally, the grounding part located in the first conductive layer is connected with the first shielding layer through a via hole of the first insulating layer, and the grounding part located in the second conductive layer is connected with the second shielding layer through a via hole of the third insulating layer.

[0029] Optionally, the second plate body part comprises a third shielding layer, a fourth insulating layer, a third conductive layer, a fifth insulating layer, and a fourth shielding layer, and the gold finger part comprises a fourth conductive layer and a sixth insulating layer.

[0030] The first type of touch wire is also located on the third conductive layer, the first touch gold finger, the plurality of display gold fingers, and the plurality of second touch gold fingers are all located on the fourth conductive layer.

[0031] The third conductive layer and the fourth conductive layer are both located in the same layer as the first conductive layer.

[0032] Optionally, the second plate body part further comprises a fifth conductive layer and a seventh insulating layer between the fifth insulating layer and the fourth shielding layer.

[0033] The grounding part is further located on the fifth conductive layer, and the fifth conductive layer and the second conductive layer are in the same layer.

[0034] In another aspect, a display module is provided, comprising a display panel, a driving chip and a circuit board as described in the above aspect.

[0035] The display panel has a display area and a peripheral area surrounding the display area, the peripheral area comprises a bending area and a binding area, and the bending area is closer to the display area than the binding area.

[0036] The driving chip is located between the bending area and the binding area and connected with the display panel.

[0037] The gold finger part of the circuit board is connected with the binding area of the display panel, and the first plate body part of the circuit board is farther away from the bending area than the second plate body part.

[0038] Optionally, the driving chip is located on a side of the second plate body part of the circuit board away from the gold finger part.

[0039] Optionally, the display module further comprises a first buffer part.

[0040] The first buffer part is located on a side of the second plate body part close to the driving chip and between the second plate body part and the display panel.

[0041] Optionally, the orthographic projection of the driving chip on the display panel is located in the orthographic projection on the display panel of a first hollow area between the second plate body part and the first plate body part of the circuit board.

[0042] Optionally, the display module further comprises a second buffer part.

[0043] The first buffer part is located on a side of the first hollow area of the second plate body part and between the second plate body part and the display panel.

[0044] Optionally, the orthographic projection of the driving chip on the display panel is located in the orthographic projection on the display panel of a second hollow area of the second plate body part of the circuit board.

[0045] Optionally, the display module further comprises a third buffer part.

[0046] The third buffering portion is located at a side of the second hollowed region of the second plate body portion and between the second plate body portion and the display panel.

[0047] In another aspect, a display device is provided, which includes a power supply assembly and a display module as described in the above aspects.

[0048] The power supply assembly is connected with the display module and configured to supply power to the display module. BRIEF DESCRIPTION OF DRAWINGS

[0049] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative effort.

[0050] FIG. 1 is a schematic diagram of a circuit board in the related art;

[0051] FIG. 2 is a schematic diagram of another circuit board in the related art;

[0052] FIG. 3 is a schematic diagram of a circuit board provided by an embodiment of the present application;

[0053] FIG. 4 is a partial schematic diagram of a display module provided by an embodiment of the present application;

[0054] FIG. 5 is a partial schematic diagram of another display module provided by an embodiment of the present application;

[0055] FIG. 6 is a schematic diagram of another circuit board provided by an embodiment of the present application;

[0056] FIG. 7 is a partial schematic diagram of another display module provided by an embodiment of the present application;

[0057] FIG. 8 is a schematic diagram of another circuit board provided by an embodiment of the present application;

[0058] FIG. 9 is a partial schematic diagram of another display module provided by an embodiment of the present application;

[0059] FIG. 10 is a partial schematic diagram of another display module provided by an embodiment of the present application;

[0060] FIG. 11 is a schematic diagram of another circuit board provided by an embodiment of the present application;

[0061] FIG. 12 is a partial schematic diagram of another display module provided by an embodiment of the present application;

[0062] FIG. 13 is a schematic diagram of another circuit board provided by an embodiment of the present application;

[0063] FIG. 14 is a partial schematic view of still another display module according to an embodiment of the present application;

[0064] FIG. 15 is a partial schematic view of still another display module according to an embodiment of the present application;

[0065] FIG. 16 is a schematic view of still another circuit board according to an embodiment of the present application;

[0066] FIG. 17 is a partial schematic view of still another display module according to an embodiment of the present application;

[0067] FIG. 18 is a schematic view of still another circuit board according to an embodiment of the present application;

[0068] FIG. 19 is a partial schematic view of still another display module according to an embodiment of the present application;

[0069] FIG. 20 is a partial schematic view of still another display module according to an embodiment of the present application;

[0070] FIG. 21 is a schematic view of still another circuit board according to an embodiment of the present application;

[0071] FIG. 22 is a partial schematic view of still another display module according to an embodiment of the present application;

[0072] FIG. 23 is a schematic view of still another circuit board according to an embodiment of the present application;

[0073] FIG. 24 is a partial schematic view of still another display module according to an embodiment of the present application;

[0074] FIG. 25 is a partial schematic view of still another display module according to an embodiment of the present application;

[0075] FIG. 26 is a schematic view of still another circuit board according to an embodiment of the present application;

[0076] FIG. 27 is a partial schematic view of still another display module according to an embodiment of the present application;

[0077] FIG. 28 is a schematic view of still another circuit board according to an embodiment of the present application;

[0078] FIG. 29 is a partial schematic view of still another display module according to an embodiment of the present application;

[0079] FIG. 30 is a partial schematic view of still another display module according to an embodiment of the present application;

[0080] FIG. 31 is a schematic view of still another circuit board according to an embodiment of the present application;

[0081] FIG. 32 is a partial schematic view of still another display module according to an embodiment of the present application;

[0082] FIG. 33 is a schematic view of a circuit board according to an embodiment of the present application;

[0083] FIG. 34 is a schematic view of a display module according to an embodiment of the present application;

[0084] FIG. 35 is a schematic view of a display module according to an embodiment of the present application;

[0085] FIG. 36 is a schematic view of a circuit board according to an embodiment of the present application;

[0086] FIG. 37 is a schematic view of a display module according to an embodiment of the present application;

[0087] FIG. 38 is a schematic view of a circuit board according to an embodiment of the present application;

[0088] FIG. 39 is a schematic view of a circuit board according to an embodiment of the present application;

[0089] FIG. 40 is a schematic view of a display module according to an embodiment of the present application;

[0090] FIG. 41 is a schematic view of a display panel according to an embodiment of the present application;

[0091] FIG. 42 is a schematic view of a display module according to an embodiment of the present application;

[0092] FIG. 43 is a schematic view of a display module according to an embodiment of the present application;

[0093] FIG. 44 is a schematic view of a display device according to an embodiment of the present application. DETAILED DESCRIPTION

[0094] In order to make the objects, technical solutions and advantages of the present application clearer, the embodiments of the present application will be further described in detail below with reference to the drawings.

[0095] In some embodiments, a display module includes a display panel and a circuit board which is bonded to the display panel. In order to realize the display and touch functions of the display module, the circuit board can include display driving lines and touch driving lines. The display driving lines can provide display signals to the display panel to drive the display panel to realize display. The touch driving lines can provide touch signals to the display panel to enable the display panel to realize touch. Generally, in order to avoid the display signal lines and the touch signal lines from directly contacting each other, the display driving lines and the touch driving lines are arranged on different conductive layers of the circuit board. Further, in order to thin the circuit board, the circuit board generally includes two conductive layers and an insulating layer between the two conductive layers.

[0096] However, the display driving lines and the touch driving lines may interfere with each other at the projection overlapping position, and thus the yield of the display module is low.

[0097] The organic light-emitting diode (OLED) display technology has been widely applied in small and medium-sized products such as mobile phones and wearable devices. With the increasing demand for display products, the display module with the FMLOC structure is widely used.

[0098] In the lighting process of a display panel in a display module, two important materials are a driver integrated circuit (DIC) and a flexible printed circuit (FPC). The DIC can be directly purchased, and the FPC needs to be designed according to different product requirements. The current FPC needs to be adapted to the display module with the FMLOC structure. In simple terms, the display module needs to realize both display and touch functions, and the corresponding FPC includes both display signals and touch signals. Since the display signals and the touch signals are high-frequency signals, interference may occur.

[0099] Therefore, in order to reduce the interference between the display signals and the touch signals when the display module realizes both touch and display functions, the FPC included in the display module can be a multi-layer conductive layer. In a traditional design, the display traces and the touch traces in the FPC are distributed in different conductive layers, and a conductive layer is used for grounding to separate the display traces and the touch traces, so as to reduce the interference between the display traces and the touch traces. However, this design increases the number of conductive layers of the FPC, and the manufacturing difficulty and cost are also increased. That is, the existing multi-layer conductive FPC has the technical problems of high manufacturing difficulty and high cost.

[0100] Currently, in order to reduce the manufacturing difficulty and cost of the FPC, the FPC can include two conductive layers. However, as shown in FIG. 1, the orthographic projection of the display traces and the touch traces intersects in the A area, and in the two-layer conductive layer scheme, the display traces and the touch traces cannot be grounded through the conductive layer, which may cause interference between the display traces and the touch traces.

[0101] Specifically, referring to FIG. 1, the flexible circuit board 00 includes a main plate body 01, a plurality of bonding pins 02 arranged on one side of the main plate body 01, a touch IC (TIC) 03 arranged on the main plate body 01, a connecting plate body 04 connected to the main plate body 01, and a connector 05 connected to the connecting plate body 04. The connector 05 extends from the side of the main plate body 01 relative to the main plate body 01, and is used to connect to a power supply component or a terminal whole machine from the outside, so that the flexible circuit board can obtain signals from the outside to make the display panel of the display module light up.

[0102] The connector can transmit display signals and touch signals, and the flexible circuit board includes display traces and touch traces connected to the connector (the touch traces connected to the connector will not interfere with the touch traces connected to the bonding pins, and thus will not be described in detail below). In addition, the display traces connected to the connector need to be connected to the bonding pins located at the middle position, and the bonding pins at the middle position can be connected to the display panel and then connected to the driving chip for driving the display. In addition, the flexible circuit board further includes touch traces connected to the bonding pins located at the two ends, and the touch traces connected to the bonding pins at the two ends need to be connected to the touch IC.

[0103] In FIG. 1, the connector 05 extends from the left side, and the touch IC 03 is closer to the right end, so the touch traces connected to the bonding pins at the left end will necessarily intersect the orthographic projection of the display traces connected to the connector 05 in the vertical direction (region A in FIG. 1). In FIG. 2, the connector 05 extends from the lower side, and the touch IC 03 is closer to the right end, so the touch traces connected to the bonding pins at the left end will necessarily intersect the orthographic projection of the display traces connected to the connector 05 in the horizontal direction (region B in FIG. 2).

[0104] That is, in the schemes of FIG. 1 and FIG. 2, if the flexible circuit board is arranged to include two conductive layers, the display traces and the touch traces will not be able to be arranged to be grounded through the conductive layers. Therefore, in order to reduce the interference between the display traces and the touch traces, the orthographic projection of the display traces and the touch traces can only be arranged to be perpendicular to each other, so as to minimize the intersection area of the orthographic projection of the display traces and the touch traces. However, this design still cannot avoid the interference between the display traces and the touch traces.

[0105] FIG. 3 is a structural schematic diagram of a circuit board according to an embodiment of the present application. Referring to FIG. 3, the circuit board 001 includes a first plate body portion 101, a bonding pin portion 102, a second plate body portion 103, a touch IC 104, touch traces 105, and display traces 106.

[0106] Referring to FIG. 3, the gold finger portion 102 is located on one side of the first side edge 101a of the first plate body portion 101, and the gold finger portion 102 includes a plurality of first touch gold fingers 1021, a plurality of display gold fingers 1022, and a plurality of second touch gold fingers 1023 which are arranged at intervals along the extension direction of the first side edge 101a. The plurality of display gold fingers 1022 are located between the plurality of first touch gold fingers 1021 and the plurality of second touch gold fingers 1023. Among them, the display gold fingers 1022 in the circuit board 001 are used for binding connection with the binding area of the display panel in the display module, and the display gold fingers can be gold fingers for transmitting display signals. The first touch gold fingers 1021 and the second touch gold fingers 1023 can be collectively referred to as touch gold fingers. The touch gold fingers can be gold fingers for transmitting touch signals. The touch gold fingers in the circuit board 001 are used for binding connection with the binding area of the display panel in the display module.

[0107] The second plate body portion 103 is located on the side of the gold finger portion 102 away from the first side edge 101a. Alternatively, it can be understood that the first plate body portion 101 and the second plate body portion 103 are respectively located on both sides of the gold finger portion 102.

[0108] The touch chip 104 is located on the first plate body portion 101, and the distance between the touch chip 104 and the plurality of second touch gold fingers 1023 is less than the distance between the touch chip 104 and the plurality of first touch gold fingers 1021. For example, in FIG. 3, the touch chip 104 can be arranged on the lower side of the plurality of second touch gold fingers 1023. Among them, the touch chip 104 is an electronic component for sensing human-computer interaction behavior, which realizes functions such as touch screen, gesture operation, and handwriting input by sensing various signals such as human muscle, capacitive magnetic field, and pressure.

[0109] The touch wire 105 is used for transmitting touch signals, and the touch wire 105 includes a plurality of first type touch wires 1051 and a plurality of second type touch wires 1052.

[0110] The plurality of first type touch wires 1051 and the plurality of first touch gold fingers 1021 are correspondingly arranged. One end of the first type touch wire 1051 is connected with the first touch gold finger 1021, and the other end of the first type touch wire 1051 extends into the first plate body portion 101 from the side of the plurality of display gold fingers 1022 away from the plurality of first touch gold fingers 1021 and is connected with the touch chip 104. The part between the two ends of the first type touch wire 1051 is located on the second plate body portion 103. That is, the part between the two ends of the first type touch wire 1051 can be located on the side of the gold finger portion 102 away from the touch chip 104. The first type touch wire 1051 can be routed on the second plate body portion 103, and only a small section of the wire is arranged on the first plate body portion 101 to be connected with the touch chip 104.

[0111] The plurality of second type touch wires 1052 and the plurality of second touch fingers 1023 are correspondingly arranged. One end of the second type touch wires 1052 is connected with the second touch fingers 1023, and the other end is connected with the touch chip 104. The second type touch wires 1052 are located on the first plate body part 101.

[0112] The display wires 106 are located on the first plate body part 101, and the display wires 106 are connected with the display fingers 1022. The display wires 106 are used for transmitting display signals. The display signals usually mainly include communication signals (high frequency signals), power signals, digital signals, analog signals and other signals.

[0113] In the embodiments of the present application, since the distance between the touch chip 104 and the second touch fingers 1023 is relatively short, even if the second type touch wires 1052 are arranged on the first plate body part 101, the length of the second type touch wires 1052 arranged on the first plate body part 101 will not be too long, and the display wires 106 will not be affected. Therefore, by designing the arrangement of the display wires 106, the orthographic projection of the second type touch wires 1052 on the first plate body part 101 can not overlap with the orthographic projection of the display wires 106 on the first plate body part 101.

[0114] In addition, since the distance between the touch chip 104 and the first touch fingers 1021 is relatively far, if the first type touch wires 1051 are directly arranged on the first plate body part 101, the length of the first type touch wires 1051 arranged on the first plate body part 101 will be too long, and the possibility of the orthographic projection of the first type touch wires 1051 overlapping with the display wires 106 will increase. Therefore, in the embodiments of the present application, the first type touch wires 1051 are arranged from the second plate body part 103 to the side of the plurality of display fingers 1022 away from the plurality of first touch fingers 1023, and then extend into the first plate body part 101, so as to reduce the length of the first type touch wires 1051 arranged on the first plate body part 101, and then the orthographic projection of the first type touch wires 1051 can be avoided from overlapping with the display wires 106 by designing the arrangement of the display wires 106.

[0115] The embodiment of the present application can reduce the wiring length of the first type of touch control wires 1051 on the first board body part 101 by additionally arranging the second board body part 103 to realize the wiring design of the first type of touch control wires 1051. Moreover, the wiring length of the second type of touch control wires 1052 on the first board body part 101 is short in itself. Thus, the wiring length of the touch control wires 105 on the first board body part 101 can be reduced, and the orthographic projection of the display wires 106 and the orthographic projection of the touch control wires 105 can be avoided from overlapping by the wiring design of the display wires 106. That is, the orthographic projection of the display wires 106 on the first board body part 101 and the orthographic projection of the touch control wires 105 on the first board body part 101 do not overlap. The wiring length of the touch control wires 105 on the first board body part 101 can refer to the path length of the wiring part of the touch control wires 105 on the first board body part 101.

[0116] Optionally, since the orthographic projection of the display wires 106 on the first board body part 101 and the orthographic projection of the touch control wires 105 on the first board body part 101 do not overlap, even if the circuit board includes two conductive layers, the display signals transmitted in the display wires 106 and the touch control signals transmitted in the touch control wires 105 can be prevented from interfering with each other, and the yield of the display module can be improved. Moreover, the circuit board includes two conductive layers, which can make the number of conductive layers included in the circuit board less and the cost lower.

[0117] In summary, the embodiment of the present application provides a circuit board including a first board body part, a gold finger part, a second board body part, a touch control chip, touch control wires and display wires. Since the distance between the first touch control gold finger and the touch control chip is far, the first type of touch control wires in the touch control wires are routed from the second board body part to the side of the display gold finger far from the first touch control gold finger and then extended into the first board body part, which can reduce the wiring length of the first type of touch control wires on the first board body part. Moreover, since the distance between the second touch control gold finger and the touch control chip is far, the wiring length of the second type of touch control wires on the first board body part is not too long. That is, the wiring length of the touch control wires on the first board body part is relatively short, and the orthographic projection of the touch control wires and the orthographic projection of the display wires can be prevented from overlapping by the wiring design of the display wires, which can prevent the display signals transmitted in the display wires and the touch control signals transmitted in the touch control wires from interfering with each other and improve the yield of the display module.

[0118] In the embodiments of the present application, the touch control signal can include a transmission (TX) signal and a reception (RX) signal. Correspondingly, the touch control line 105 that transmits the TX signal can be referred to as a TX line, and the touch control line 105 that transmits the RX signal can be referred to as an RX line. The TX line can be a sending end, used for sending information or data, and the RX line is used for receiving information and data from the sending end.

[0119] Optionally, each of the first type of touch control lines 1051 and the second type of touch control lines 1052 can include TX lines and RX lines. For example, a part of the first type of touch control lines 1051 in the plurality of first type of touch control lines 1051 are TX lines, and another part of the first type of touch control lines 1051 are RX lines. A part of the second type of touch control lines 1052 in the plurality of second type of touch control lines 1052 are TX lines, and another part of the second type of touch control lines 1052 are RX lines.

[0120] Optionally, each of the first type of touch control lines 1051 can directly extend from the gap between the adjacent second touch control fingers 1023 in the area where the second touch control fingers 1023 are located to the first plate portion 101. Alternatively, each of the first type of touch control lines 1051 can directly extend from the side of the second touch control fingers 1023 away from the display finger to the first plate portion 101. Alternatively, the finger portion 102 can further include a plurality of third touch control fingers (not shown in the figure), each of which is located between adjacent second touch control fingers 1023 (for example, the plurality of third touch control fingers and the plurality of second touch control fingers 1023 can be staggered) or located on the side of the second touch control fingers 1023 away from the display finger 1022. In this case, each of the first type of touch control lines 1051 can be connected to a third touch control finger and then extend to the first plate portion 101.

[0121] In the embodiments of the present application, referring to FIG. 3, one end of the second plate portion 103 is connected to the first area Q1 of the finger portion 102, and the other end of the second plate portion 103 is connected to the second area Q2 of the finger portion 102. The part between the two ends of the second plate portion 103 and the finger portion 102 has a first hollow area L1. Among them, the first area Q1 is the area where at least part of the plurality of first touch control fingers 1021 is located, and the second area Q2 is the area where at least part of the plurality of second touch control fingers 1023 is located. The part between the two ends of the second plate portion 103 of the circuit board and the finger portion 102 has a first hollow area L1, which can include the following two cases.

[0122] As a possible case, referring to FIG. 4, after the circuit board 001 is bound to the display panel 002 to form the display module 1000, the driving chip 003 connected with the display panel 002 can be located on the side of the second plate body part 103 away from the first plate body part 101. In this case, the existence of the first hollow area L1 between the part between the two ends of the second plate body part 103 and the gold finger part 102 can avoid the first type of touch wires 1051 located on the second plate body part 103 from affecting the gold fingers on the gold finger part 102.

[0123] As another possible case, referring to FIG. 5, after the circuit board 001 is bound to the display panel 002 to form the display module 1000, the driving chip 003 connected with the display panel 002 can be located in the first hollow area L1. Alternatively, it can be understood that the first hollow area L1 is a hollow area for avoiding the driving chip 003. In this case, the second plate body part 103 is located on the side of the driving chip 003 away from the first plate body part 101.

[0124] In the embodiments of the present application, referring to FIG. 6, the second plate body part 103 also has a second hollow area L2. Because the second plate body part 103 is provided with the second hollow area L2, the plurality of first type of touch wires 1051 need to avoid the second hollow area L2 when wiring on the second plate body part 103. Optionally, the part between the two ends of a part of the plurality of first type of touch wires 1051 is located on the first part 1031 of the second plate body part 103 close to the first plate body part 101 in the second hollow area L2. The part between the two ends of another part of the plurality of first type of touch wires 1051 is located on the second part 1032 of the second plate body part 103 away from the first plate body part 101 in the second hollow area L2.

[0125] Referring to FIG. 7, after the circuit board 001 is bound to the display panel 002 to form the display module 1000, the driving chip 003 connected with the display panel 002 can be located in the second hollow area L2. In this case, the part between the two ends of the second plate body part 103 and the gold finger part 102 can also have the first hollow area L1. The existence of the first hollow area L1 can avoid the first type of touch wires 1051 located on the second plate body part 103 from affecting the gold fingers on the gold finger part 102.

[0126] Optionally, the second hollow area L2 in the second plate body part 103 is farther away from the first plate body part 101 than the first hollow area L1, and the hollow area of the second hollow area L2 in the second plate body part 103 is larger than that of the first hollow area L1.

[0127] In the embodiments of the present application, referring to FIG. 3 to FIG. 7, the circuit board 001 further comprises a connecting plate body part 107 and a connector 108. The connecting plate body part 107 is connected to the first plate body part 101, and the display wire 106 is also located on the connecting plate body part 107. The connector 108 is located on the side of the connecting plate body part 107 away from the first plate body part 101, and the connector 108 is connected to the display wire 106. The connector 108 is also used to connect the power supply component of the display device.

[0128] Optionally, the connecting plate body part 107 can be connected to the second side edge 101b of the first plate body part 101. The second side edge 101b and the first side edge 101a can be two different side edges of the first plate body part 101. For example, referring to FIG. 3 to FIG. 7, the second side edge 101b and the first side edge 101a can be two adjacent side edges, or the second side edge 101b can be a side edge of the first plate body part 101 corresponding to the first side edge 101a.

[0129] Optionally, referring to FIG. 3 to FIG. 7 and FIG. 8 to FIG. 12, the first plate body part 101 has four side edges, which approximately form a rectangular shape. In FIG. 3 to FIG. 7, the first side edge 101a can be the upper side edge of the first plate body part 101, and the second side edge 101b can be the left side edge of the first plate body part 101. Alternatively, referring to FIG. 8 to FIG. 12, the first side edge 101a can be the upper side edge of the first plate body part 101, and the second side edge 101b can be the lower side edge of the first plate body part 101. Alternatively, the first side edge 101a can be the upper side edge of the first plate body part 101, and the second side edge 101b can be the right side edge of the first plate body part 101. Of course, the first plate body part 101 can also have other shapes, and the embodiments of the present application do not specifically limit the shape of the first plate body part 101.

[0130] Alternatively, referring to FIG. 13 to FIG. 17, the first plate body part 101 has a third hollow area L3, and the connecting plate body part 107 and the connector 108 are both located in the third hollow area L3, and the connecting plate body part 107 is connected to the side edge of the third hollow area L3. Optionally, the third hollow area L3 has four side edges, and in FIG. 13 to FIG. 17, the connecting plate body part 107 can be connected to the upper side edge of the third hollow area L3.

[0131] Optionally, the shape of the third hollow area L3 is approximately rectangular. Alternatively, the third hollow area L3 can be any shape under the condition of meeting the wire layout, and the embodiments of the present application do not specifically limit the shape of the third hollow area L3.

[0132] In the embodiments of the present application, the first board body part 101 of the circuit board can include other functional hollowed-out regions, and each hollowed-out region can have a square, circular, rectangular or irregular shape, etc. For example, the first board body part 101 of the circuit board 001 in FIGS. 3-7 can include two hollowed-out regions (L4 and L5).

[0133] Alternatively, the connecting board body part 107 can be referred to as a long neck part of the circuit board, which can extend from any position of the first board body part 101 and be connected to the first board body part 101. For example, the connecting board body part 107 in FIGS. 8-12 can extend from the middle of the lower side of the first board body part 101. Alternatively, the connecting board body part 107 in FIGS. 18-22 can extend from the left end of the lower side of the first board body part 101. The connecting position of the connecting board body part 107 to the first board body part 101 and the length of the connecting board body part 107 in the extending direction can be determined according to specific product projects.

[0134] In the embodiments of the present application, referring to FIGS. 3-22, the shape of the connecting board body part 107 in the reference plane is a rectangle. Alternatively, referring to FIGS. 23-32, the shape of the connecting board body part 107 in the reference plane is an L shape. Alternatively, referring to FIGS. 33-37, the shape of the connecting board body part 107 in the reference plane is a curved shape. The embodiments of the present application do not specifically limit the shape of the connecting board body part 107, as long as the display traces 106 connected to the connector 108 can be arranged on the connecting board body part 107. The reference plane is parallel to the surface of the connecting board body part 107 on which the display traces 106 are arranged.

[0135] Alternatively, when the shape of the connecting board body part 107 in the reference plane is an L shape, the L shape can be a left-bent L shape (for example, FIGS. 23-27) or a right-bent L shape (for example, FIGS. 28-32).

[0136] In the embodiments of the present application, the connector 108 has a power interface that can provide a power signal for the circuit board 100 and a mobile industry processor interface (MIPI) interface that can provide a MIPI signal. Accordingly, some of the display traces connected to the connector 108 can be used to transmit the power signal, and some of the display traces can be used to transmit the MIPI signal.

[0137] The power supply component in the display device can transmit a power supply signal to the circuit board 100 through the power supply interface. The purpose of MIPI is to standardize the interfaces of cameras, display screens, radio frequency interfaces, and the like inside electronic devices such as display devices, so as to reduce the complexity of the design of electronic devices and increase the design flexibility. The benefit of standardization is that electronic device manufacturers can flexibly select different chips and modules on the market according to needs, and change the design and function more quickly and conveniently. The MIPI signal belongs to a high-frequency signal.

[0138] FIG. 38 is a schematic cross-sectional view of a circuit board according to an embodiment of the present application. Referring to FIG. 38, the first board body portion 101 includes a first shielding layer m1, a first insulating layer m2, a first conductive layer m3, a second insulating layer m4, a second conductive layer m5, a third insulating layer m6, and a second shielding layer m7, which are sequentially stacked.

[0139] The first shielding layer m1 and the second shielding layer m7 can be electromagnetic interference (EMI) layers for shielding electromagnetic signals. The first insulating layer m2 is configured to protect the first conductive layer m3, the second insulating layer m4 is configured to insulate the first conductive layer m3 and the second conductive layer m5, and the third insulating layer m6 is configured to protect the second conductive layer m5.

[0140] As shown in FIG. 38, the first board body portion 101 can be a board body portion designed with double-layer conductive layers, or it can be understood that the circuit board 001 is designed with double-layer conductive layers. Optionally, the touch trace 105 can be located in the first conductive layer m3, and the display trace 106 can be located in the second conductive layer m5. That is, the touch trace 105 and the display trace 106 can be located in different conductive layers in the first board body portion 101.

[0141] Optionally, the circuit board 001 further includes a grounding portion located in the first conductive layer m3 and the second conductive layer m5, and the grounding portion can be configured to receive a ground (GND) signal. In the first conductive layer m3 and the second conductive layer m5, the grounding portion can be arranged in other regions except the regions where the traces are arranged. For example, the grounding portion located in the first conductive layer m3 is arranged apart from the touch trace 105, and the grounding portion located in the second conductive layer m5 is arranged apart from the display trace 106.

[0142] In the embodiments of the present application, in order to make the circuit board 001 achieve better grounding effect, the following two ways can be used. Scheme one, the grounding part located in the first conductive layer m3 is connected through the via hole of the first insulating layer m2 and the first shielding layer m1, and the grounding part located in the second conductive layer m5 is connected through the via hole of the third insulating layer m6 and the second shielding layer m7. Scheme two, the first insulating layer m2 and the first shielding layer m1 above the grounding part located in the first conductive layer m3 are hollowed out, so that the grounding part located in the first conductive layer m3 is exposed; the second insulating layer m4 and the second shielding layer m7 above the grounding part located in the second conductive layer m5 are hollowed out, so that the grounding part located in the second conductive layer m5 is exposed. After the module process, the circuit board 001 can be attached with a cover film (cover type), which can be in contact with the grounding part.

[0143] In the embodiments of the present application, after the first type of touch control wire 1051 is led out from the first touch control gold finger 1021, the first type of touch control wire 1051 and the second type of touch control wire 1052 are collected to the same side of the display gold finger 1022 through the second board body part 103. In this way, the first type of touch control wire 1051 and the second type of touch control wire 1052 can be introduced together from the side of the display gold finger 1022 away from the first touch control gold finger 1021 and connected to the touch control chip 104. As compared with the related art of FIG. 1, in the scheme of FIGS. 3-37, the position where the touch control wire needs to be originally arranged in FIG. 1 does not need to be arranged with the touch control wire 105 (C area in the figure). Therefore, the area can be arranged with a grounding part, which can be connected with the shielding layer, thereby improving the electromagnetic shielding effect of the shielding layer in the circuit board.

[0144] In the schemes shown in FIGS. 3-12 and 18-37, since the first type of touch control wire 1051 is routed on the second board body part 103, the size of the first board body part 101 can be reduced (where the lower dashed line in FIGS. 3-12 and 18-37 represents the size of the circuit board according to the conventional design), that is, the area of the main board body of the circuit board is reduced, which is beneficial to the design of the module and the whole machine.

[0145] Referring to FIG. 38, the second board body part 103 can include a third shielding layer m8, a fourth insulating layer m9, a third conductive layer m10, a fifth insulating layer m11, and a fourth shielding layer m12. That is, the second board body part 103 can include one layer of conductive layer. The gold finger part 102 can include a fourth conductive layer m13 and a sixth insulating layer m14.

[0146] The first type of touch wire 1051 is also located on the third conductive layer m10. That is, the TX wire and the RX wire included in the first type of touch wire 1051 are both located on the third conductive layer m10. The first touch gold finger 1021, the plurality of display gold fingers 1022, and the plurality of second touch gold fingers 1023 are all located on the fourth conductive layer m13.

[0147] Optionally, the first shielding layer m1 and the third shielding layer m8 are located on the same layer. The first insulating layer m2 and the fourth insulating layer m9 are located on the same layer. The first conductive layer m3, the fourth conductive layer m13, and the third conductive layer m10 are located on the same layer. The first insulating layer m2, the sixth insulating layer m14, and the fifth insulating layer m11 are located on the same layer. The second shielding layer m7 and the fourth shielding layer m12 are located on the same layer. Here, being located on the same layer can mean being made of the same material by one process.

[0148] Optionally, the first shielding layer m1 and the third shielding layer m8 are located on the same layer. The first insulating layer m2 and the fourth insulating layer m9 are located on the same layer. The first conductive layer m3, the fourth conductive layer m13, and the third conductive layer m10 are located on the same layer. The first insulating layer m2, the sixth insulating layer m14, and the fifth insulating layer m11 are located on the same layer. The second shielding layer m7 and the fourth shielding layer m12 are located on the same layer. Here, being located on the same layer can mean being made of the same material by one process.

[0149] Optionally, in the case where the second board body part 103 includes two conductive layers, the first shielding layer m1 and the third shielding layer m8 are located on the same layer. The first insulating layer m2 and the fourth insulating layer m9 are located on the same layer. The first conductive layer m3, the fourth conductive layer m13, and the third conductive layer m10 are located on the same layer. The first insulating layer m2, the sixth insulating layer m14, and the fifth insulating layer m11 are located on the same layer. The second conductive layer m5 and the fifth conductive layer m15 are located on the same layer. The third insulating layer m6 and the seventh insulating layer m16 are located on the same layer. The second shielding layer m7 and the fourth shielding layer m12 are located on the same layer. Here, being located on the same layer can mean being made of the same material by one process.

[0150] Optionally, in the case where the second board body part 103 includes two conductive layers, the TX wire and the RX wire included in the first type of touch wire 1051 can be located on the same conductive layer of the second board body part 103, or can be located on different conductive layers.

[0151] For example, the TX trace and the RX trace included in the first type of touch control trace 1051 can be arranged on the third conductive layer m10, and the fifth conductive layer m15 can be used to arrange the ground part. Alternatively, the TX trace and the RX trace included in the first type of touch control trace 1051 can be arranged on different conductive layers, and the projections of the TX trace and the RX trace can not overlap. For example, the TX trace is arranged on the third conductive layer m10, and the RX trace is arranged on the fifth conductive layer m15. In this case, the position of the fifth conductive layer m15 overlapping with the TX trace is the ground part, and the position of the third conductive layer m10 overlapping with the RX trace is the ground part.

[0152] In the embodiments of the present application, the second board body part 103 of the circuit board shown in FIG. 38 has one conductive layer, and the second board body part 103 of the circuit board shown in FIG. 39 has two conductive layers. In fact, when designing the second board body part 103, both one conductive layer and two conductive layers can be designed, and the actual situation of different products can be selected.

[0153] For the circuit boards shown in FIG. 38 and FIG. 39, the lower side of the fourth conductive layer m13 in the circuit board 001 has no insulating layer, so the lower side of the gold fingers (the first touch control gold finger 1021, the plurality of display gold fingers 1022, and the plurality of second touch control gold fingers 1023) in the circuit board 001 can be bound and connected with the display panel binding area 002b2 included in the display module.

[0154] In the embodiments of the present application, each shielding layer included in the circuit board 001 can be an electromagnetic shielding film (a kind of electronic material film), which can block or attenuate the electromagnetic energy propagation between the shielded area and the outside world through the shielding body made of special material, so as to limit the electromagnetic wave in a certain range, inhibit or attenuate the electromagnetic radiation, and effectively block the electromagnetic interference.

[0155] Optionally, the material of each conductive layer included in the circuit board 001 can include copper (Cu). Correspondingly, the material of each trace arranged on the conductive layer can include copper.

[0156] Optionally, the material of the second insulating layer m4 arranged between the first conductive layer m3 and the second conductive layer m5 can include polyimide (PI). Since PI is a kind of high-temperature-resistant organic polymer material, it has good softness, so PI is usually arranged between the conductive layers to realize the insulation of the conductive layers. For the film layer arranged in the same layer as the second insulating layer m4 in the circuit board, the material thereof can also be PI.

[0157] Optionally, the first insulating layer m2 located on the side of the first conductive layer m3 away from the second conductive layer m5 and the third insulating layer m6 located on the side of the second conductive layer m5 away from the first conductive layer m3 can be a cover lay. The material of the cover lay can be a material combined by an insulating material and glue, mainly to protect the lines in the circuit board from short circuit, and can play a role of solder mask. The film layer in which the first insulating layer m2 and the third insulating layer m6 are located in the same layer in the circuit board 001 can also be a cover lay.

[0158] In the embodiment of the present application, by arranging the second board body part 103 (the second board body part 103 and the driving chip are located on the same side of the gold finger part 102) in the circuit board 001, the area of the circuit board 001 is increased to lead out the first type of touch control lines 1051 (i.e., the first type of touch control lines 1051 are led out separately through the second board body part 103), so as to avoid the mutual intersection of the touch control lines 105 and the display lines 106. Thus, in the case of the circuit board 001 being a double-layer conductive layer circuit board, the mutual interference between the touch control signals transmitted in the touch control lines 105 and the display signals transmitted in the display lines 106 can be avoided, i.e., the interference problem of the circuit board 001 is reduced, and the signal quality of the circuit board 001 is improved.

[0159] In the embodiment of the present application, the circuit board 001 can be a flexible circuit board (FPC). The first board body part 101 of the circuit board 001 can further be provided with other functional devices, such as the other devices represented by small rectangles in FIGS. 3 to 37. These other devices can include at least one of a resistor, a capacitor, and a diode.

[0160] In summary, the embodiment of the present application provides a circuit board including a first board body part, a gold finger part, a second board body part, a touch control chip, touch control lines, and display lines. Since the distance between the first touch control gold finger and the touch control chip is far, the first type of touch control lines in the touch control lines are wound from the second board body part to the side of the display gold finger away from the first touch control gold finger and then extended into the first board body part, so as to reduce the wiring length of the first type of touch control lines on the first board body part. Moreover, since the distance between the second touch control gold finger and the touch control chip is far, the wiring length of the second type of touch control lines in the touch control lines on the first board body part is not too long. That is, the wiring length of the touch control lines on the first board body part is relatively short, and thus the display lines can be designed to avoid the intersection of the orthographic projection of the touch control lines and the display lines, so as to avoid the mutual interference between the display signals transmitted in the display lines and the touch control signals transmitted in the touch control lines, and the yield of the display module can be improved.

[0161] FIG. 40 is a partial cross-sectional view of a display module according to an embodiment of the present application. Referring to FIG. 40, the display module 1000 includes a display panel 002, a driving chip 003, and a circuit board 001 as described in the above embodiments. FIG. 41 is a top view of a display panel according to an embodiment of the present application. Referring to FIG. 41, the display panel 002 has a display area 200a and a peripheral area 200b surrounding the display area 200a. The peripheral area 200b includes a bending area 002b1 and a bonding area 002b2. The bending area 002b1 is closer to the display area 200a than the bonding area 002b2.

[0162] In combination with FIG. 40 and FIG. 41, the driving chip 003 is located between the bending area 002b1 and the bonding area 002b2 and is connected to the display panel 002. The driving chip 003 can be used to drive the display panel 002 to display.

[0163] The gold finger portion 102 of the circuit board 001 is connected to the bonding area 002b2 of the display panel 002. The first board portion 101 of the circuit board 001 is farther away from the bending area 002b1 than the second board portion 103. That is, after the gold finger portion 102 of the circuit board 001 is connected to the bonding area 002b2 of the display panel 002, the second board portion 103 of the circuit board 001 and the display panel 002 can overlap in projection, and the first board portion 101 of the circuit board 001 and the display panel 002 can not overlap in projection.

[0164] In summary, the display module according to the embodiments of the present application includes a circuit board including a first board portion, a gold finger portion, a second board portion, a touch chip, touch wires, and display wires. Because the first touch gold finger is far away from the touch chip, the first type of touch wire in the touch wires extends from the second board portion to the side of the display gold finger away from the first touch gold finger and then extends into the first board portion, which can reduce the length of the first type of touch wire in the first board portion. Moreover, because the second touch gold finger is far away from the touch chip, the length of the second type of touch wire in the first board portion is not too long. That is, the length of the touch wire in the first board portion is relatively short, and thus the display wires can be designed to avoid the orthographic projection of the touch wires and the display wires, which can avoid the mutual interference between the display signals transmitted by the display wires and the touch signals transmitted by the touch wires, and can improve the yield of the display module.

[0165] Referring to FIG. 4, FIG. 9, FIG. 14, FIG. 19, FIG. 24, FIG. 29, FIG. 34, and referring to FIG. 40, the driving chip 003 can be located on the side of the second board body part 103 of the circuit board 001 away from the gold finger part 102. In this case, the second board body part 103 of the circuit board 001 and the first board body part 101 can have a first hollow area L1 therebetween, or can not have the first hollow area L1, which is not limited in the embodiments of the present application.

[0166] In the embodiments of the present application, since the second board body part 103 of the circuit board 001 and the display panel 002 overlap in projection, the second board body part 103 of the circuit board 001 and the display panel 002 can collide with each other. Further, since the driving chip 003 is located on the side of the second board body part 103 away from the gold finger part 102, the driving chip 003 and the side of the second board body part 103 away from the gold finger part 102 can also collide with each other, so that a certain safety distance is required between the driving chip 003 and the second board body part 103.

[0167] Optionally, in order to further improve the collision between the second board body part 103, the display panel 002 and the driving chip 100, referring to FIG. 40, the display module 1000 further comprises a first buffer part 004 (also referred to as a type film). The first buffer part 004 is located on the side of the second board body part 103 close to the driving chip, and between the second board body part 103 and the display panel. The first buffer part 004 can buffer the mutual collision between the second board body part 103 and the display panel 002, and the mutual collision between the second board body part 103 and the driving chip 003, avoid the design of the second board body part 103 affecting the driving chip 003 and the display panel 002, and ensure the yield of the second board body part 103, the driving chip 003 and the display panel 002.

[0168] FIG. 42 is a partial cross-sectional schematic view of another display module provided in the embodiments of the present application. Referring to FIG. 5, FIG. 10, FIG. 15, FIG. 20, FIG. 25, FIG. 30, FIG. 35 and FIG. 42, the orthographic projection of the driving chip 003 on the display panel 002 is located within the orthographic projection of the first hollow area L1 between the second board body part 103 and the first board body part 101 of the circuit board 001 on the display panel. Or it can be understood that the driving chip 003 is located within the first hollow area L1. In this case, the driving chip 003 can be located on the side of the second board body part 103 close to the gold finger part 102.

[0169] In the embodiment of the present application, since the second board body part 103 of the circuit board 001 and the display panel 002 overlap in projection, mutual collision between the second board body part 103 of the circuit board 001 and the display panel 002 can occur. Further, since the driving chip 003 is located in the first hollow area L1, mutual collision between the driving chip 003 and the side of the first hollow area L1 can also occur, thus a certain safety distance between the driving chip 003 and the second board body part 103 is required.

[0170] Optionally, in order to further improve the collision between the second board body part 103, the display panel 002 and the driving chip 003, referring to FIG. 42, the display module 1000 further comprises a second buffer part 005 (also referred to as a type film). The second buffer part 005 is located at the side of the first hollow area L1 and between the second board body part 103 and the display panel 002. The second buffer part 005 can buffer the mutual collision between the second board body part 103 and the display panel 002 and the mutual collision between the second board body part 103 and the driving chip 003, avoid the design of the second board body part 103 affecting the driving chip 003 and the display panel 002, and ensure the yield of the second board body part 103, the driving chip 003 and the display panel 002.

[0171] FIG. 43 is a partial cross-sectional schematic view of another display module provided by an embodiment of the present application. Referring to FIG. 7, FIG. 12, FIG. 17, FIG. 22, FIG. 27, FIG. 32, FIG. 37 and FIG. 43, the orthographic projection of the driving chip 003 on the display panel 002 is located within the orthographic projection of the second hollow area L2 of the second board body part 103 of the circuit board 001 on the display panel 002. Alternatively, it can be understood that the driving chip 003 is located in the second hollow area L2. In this case, a part of the second board body part 103 is located at the side of the driving chip 003 close to the gold finger part 102, and another part is located at the side of the driving chip 003 away from the gold finger part 102.

[0172] In the embodiment of the present application, since the second board body part 103 of the circuit board 001 and the display panel 002 overlap in projection, mutual collision between the second board body part 103 of the circuit board 001 and the display panel 002 can occur. Further, since the driving chip 003 is located in the second hollow area L2, mutual collision between the driving chip 003 and the side of the second hollow area L2 can also occur, thus a certain safety distance between the driving chip 003 and the second board body part 103 is required.

[0173] Optionally, in order to further improve the collision between the second plate body part 103, the display panel 002 and the driving chip 003, referring to FIG. 43, the display module 1000 further comprises a third buffer part 006 (also referred to as a type film). The third buffer part 006 is located at the side of the first hollow area L1 and between the second plate body part 103 and the display panel 002. The third buffer part 006 can buffer the mutual collision between the second plate body part 103 and the display panel 002 and the mutual collision between the second plate body part 103 and the driving chip 003, avoid the design of the second plate body part 103 affecting the driving chip 003 and the display panel 002, and ensure the yield of the second plate body part 103, the driving chip 003 and the display panel 002.

[0174] Referring to FIG. 40, FIG. 42 and FIG. 43, it can be seen that the display module 1000 further comprises a cover plate 007, an adhesive layer 008, a polarizer (POL) 009, a panel bottom film (U-film) 010, a heat dissipation film 011, a spacer 012 and a bending protection layer 013.

[0175] Optionally, the cover plate 007 can be a cover glass (CG) 007, the material of the adhesive layer 008 can be optical clear adhesive (OC), the panel bottom film 010 (also referred to as a panel back film) is used to protect the back side of the display panel 002, and the panel bottom film 010 is attached to the back side of the display panel 002 in a cutting process (EAC). The main function of the heat dissipation film 011 (surface conductive film, SCF) is to dissipate heat. The spacer 012 can be coated between the panel bottom film 010 on the binding area of the display panel 002 and the heat dissipation film 011 of the display area of the display panel 002, used to protect the display panel and also to adjust the bending stress of the bending area 002b1 of the display panel 002. The bending protection layer 013 can be located at the bending area 002b1 of the display panel 002, used to protect the bending area 002b1 and ensure the bending reliability of the bending area 022b.

[0176] Optionally, referring to FIG. 40, FIG. 42 and FIG. 43, it can be seen that the gold finger part 102 of the circuit board 001 can be connected by anisotropic conductive film (ACF) 014 and the binding area 002b2 of the display panel 002.

[0177] In summary, the display module provided by the embodiment of the present application includes a circuit board, which includes a first board body part, a gold finger part, a second board body part, a touch control chip, touch control wires and display wires. Since the first touch control gold finger and the touch control chip are far apart, the first type of touch control wire in the touch control wires is routed from the second board body part to the side of the display gold finger far from the first touch control gold finger and then extends into the first board body part, which can reduce the wiring length of the first type of touch control wire on the first board body part. Moreover, since the second touch control gold finger and the touch control chip are far apart, the wiring length of the second type of touch control wire in the touch control wires on the first board body part will not be too long. That is, the wiring length of the touch control wires on the first board body part is relatively short, and thus the design of the display wires can avoid the overlap of the orthographic projection of the touch control wires and the display wires, thereby avoiding the mutual interference between the display signals transmitted by the display wires and the touch control signals transmitted by the touch control wires, and improving the yield of the display module.

[0178] FIG. 44 is a structural schematic diagram of a display device provided by an embodiment of the present application. Referring to FIG. 44, the display device includes a power supply assembly 2000 and the display module 1000 provided by the above-described embodiment. The power supply assembly 2000 and the display module 1000 are connected, and used for supplying power to the display module 1000.

[0179] Optionally, the display device can be an organic light-emitting diode (OLED) display device. The display device can be any appropriate display device, including but not limited to a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a vehicle navigation device, an electronic book or any product or component having a display function.

[0180] Since the display device can have substantially the same technical effects as the circuit board described in the above embodiment, for the purpose of brevity, the technical effects of the circuit board will not be described again here.

[0181] The terms used in the embodiment part of the present application are only used for explaining the embodiments of the present application, and are not intended to limit the present application. Unless otherwise defined, the technical terms or scientific terms used in the embodiment part of the present application should be understood as the general meaning understood by a person having ordinary skills in the art to which the present application belongs.

[0182] The terms used in the description of the embodiments of the present application are only used to explain the embodiments of the present application and are not intended to limit the present application. Unless otherwise defined, the technical terms or scientific terms used in the embodiments of the present application should be understood as the common meanings to those having ordinary skills in the art to which the present application pertains. The terms "first", "second", "third" and the like used in the description of the present patent application and the claims are not intended to denote any sequence, quantity, or importance, but are only used to distinguish different components. Similarly, the terms "one" or "a" and the like do not denote a quantity limitation, but denote the presence of at least one. The terms "include" or "contain" and the like mean that the elements or objects appearing before the "include" or "contain" cover the elements or objects listed after the "include" or "contain" and their equivalents, and do not exclude other elements or objects. The terms "connected" or "connected" and the like are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to represent relative positional relationships, and when the absolute positions of the described objects are changed, the relative positional relationships may also be changed accordingly.

[0183] The above is only an optional embodiment of the present application and is not intended to limit the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims

1. A circuit board, characterized by, The circuit board comprises: a first board body part; a gold finger part located on one side of a first side edge of the first board body part, the gold finger part comprising a plurality of first touch gold fingers, a plurality of display gold fingers and a plurality of second touch gold fingers arranged at intervals along the extension direction of the first side edge, the plurality of display gold fingers being located between the plurality of first touch gold fingers and the plurality of second touch gold fingers; a second board body part located on a side of the gold finger part away from the first side edge; a touch chip located on the first board body part, and the distance between the touch chip and the plurality of second touch gold fingers being less than the distance between the touch chip and the plurality of first touch gold fingers; touch wires comprising a plurality of first type touch wires corresponding to the plurality of first touch gold fingers and a plurality of second type touch wires corresponding to the plurality of second touch gold fingers; one end of the first type touch wires being connected to the first touch gold fingers, the other end of the first type touch wires extending into the first board body part from a side of the plurality of display gold fingers away from the plurality of first touch gold fingers and being connected to the touch chip, the part of the first type touch wires between the two ends being located on the second board body part; one end of the second type touch wires being connected to the second touch gold fingers, the other end being connected to the touch chip, the second type touch wires being located on the first board body part; and display wires located on the first board body part and connected to the display gold fingers; wherein the orthographic projection of the display wires on the first board body part and the orthographic projection of the touch wires on the first board body part do not overlap.

2. The circuit board of claim 1, wherein One end of the second board body part is connected to a first area of the gold finger part, the other end of the second board body part is connected to a second area of the gold finger part, and the part between the two ends of the second board body part has a first hollow area with the gold finger part; The first area is an area where at least part of the first touch gold fingers are located, and the second area is an area where at least part of the second touch gold fingers are located.

3. The circuit board of claim 1, wherein The second board body part further has a second hollow area; The part of the plurality of first type touch wires between the two ends of a part of the first type touch wires is located on a first part of the second hollow area close to the first board body part in the second board body part; The part of the plurality of first type touch wires between the two ends of another part of the first type touch wires is located on a second part of the second hollow area away from the first board body part in the second board body part.

4. The circuit board according to any one of claims 1 to 3, characterized by The circuit board further comprises: a connecting board body part connected to the first board body part, the display wires also being located on the connecting board body part; and a connector located on a side of the connecting board body part away from the first board body part, the connector being connected to the display wires, and the connector also being used to connect a power supply component of a display module.

5. The circuit board of claim 4, wherein, The second side edge of the first plate body part and the connecting plate body part are connected, and the second side edge and the first side edge are different side edges of the first plate body part. The first plate body part has a third hollow region, and the connecting plate body part and the connector are located in the third hollow region.

6. The circuit board of claim 4, wherein The shape of the connecting plate body part in the normal projection on the reference plane is a rectangle, an L shape, or a curved shape. The reference plane is parallel to the surface of the connecting plate body part provided with the display trace.

7. The circuit board according to any one of claims 1 to 3, characterized by The first plate body part comprises a first shielding layer, a first insulating layer, a first conductive layer, a second insulating layer, a second conductive layer, a third insulating layer, and a second shielding layer which are sequentially stacked. The touch trace is located in the first conductive layer, and the display trace is located in the second conductive layer. The circuit board further comprises a grounding part located in the first conductive layer and the second conductive layer, the grounding part located in the first conductive layer is spaced apart from the touch trace, and the grounding part located in the second conductive layer is spaced apart from the display trace.

8. The circuit board of claim 7, wherein, The grounding part located in the first conductive layer is connected to the first shielding layer through a via hole of the first insulating layer, and the grounding part located in the second conductive layer is connected to the second shielding layer through a via hole of the third insulating layer.

9. The circuit board of claim 7, wherein, The second plate body part comprises a third shielding layer, a fourth insulating layer, a third conductive layer, a fifth insulating layer, and a fourth shielding layer; and the gold finger part comprises a fourth conductive layer and a sixth insulating layer. The first type of touch trace is also located in the third conductive layer, the first touch gold finger, the plurality of display gold fingers, and the plurality of second touch gold fingers are all located in the fourth conductive layer. The third conductive layer and the fourth conductive layer are located in the same layer as the first conductive layer.

10. The circuit board of claim 9, wherein, The second plate body part further comprises a fifth conductive layer and a seventh insulating layer located between the fifth insulating layer and the fourth shielding layer. The grounding part is also located in the fifth conductive layer, and the fifth conductive layer is located in the same layer as the second conductive layer.

11. A display module, characterized by The display module comprises a display panel, a driving chip, and a circuit board as claimed in any one of claims 1 to 10. The display panel has a display area and a peripheral area surrounding the display area, the peripheral area comprises a bending area and a binding area, and the bending area is closer to the display area than the binding area. The driving chip is located between the bending area and the binding area and is connected to the display panel. The gold finger part of the circuit board is connected to the binding area of the display panel, and the first plate body part of the circuit board is farther away from the bending area than the second plate body part.

12. The display module of claim 11, wherein, The driving chip is located on the side of the second plate body part of the circuit board that is farther away from the gold finger part.

13. The display module of claim 12, wherein, The display module further comprises a first buffer part. The first buffer part is located on the side of the second plate body part that is closer to the driving chip and is located between the second plate body part and the display panel.

14. The display module of claim 11, wherein, The orthographic projection of the driving chip on the display panel is located in the orthographic projection on the display panel of the first hollow area between the second plate body part and the first plate body part of the circuit board.

15. The display module of claim 14, wherein, The display module further comprises a second buffer part. The first buffer part is located at the side of the first hollow area of the second plate body part and between the second plate body part and the display panel.

16. The display module of claim 11, wherein, The orthographic projection of the driving chip on the display panel is located in the orthographic projection on the display panel of the second hollow area of the second plate body part of the circuit board.

17. The display module of claim 16, wherein, The display module further comprises a third buffer part. The third buffer part is located at the side of the second hollow area of the second plate body part and between the second plate body part and the display panel.

18. A display device comprising: The display device comprises a power supply assembly and the display module as claimed in any one of claims 11 to 17. The power supply assembly and the display module are connected to supply power to the display module.

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