Light-emitting device and manufacturing method therefor

Abstract

Provided in the present application is a manufacturing method for a light-emitting device, comprising the following steps: S1: stamping a conductive blank plate to form a continuous substrate provided with a frame portion, a plurality of pairs of conductive substrates, and a plurality of connecting portions, wherein each pair of conductive substrates includes two conductive substrates arranged opposite and spaced apart from each other, each conductive substrate comprises a conductive portion and a protruding portion, and each pair of conductive substrates is connected to the frame portion via the connecting portions; S2: providing a carrier bracket bonded to each pair of conductive substrates, wherein the part of each conductive substrate exposed outside the carrier bracket is the protruding portion; S3: cutting off part of the protruding portions to form first cutting surfaces, and retaining at least one connecting portion to maintain the connection between the frame portion and each conductive substrate; S4: providing light-emitting elements within accommodating spaces and electrically connecting same to the conductive substrates; filling the accommodating spaces with adhesive; and S5: cutting off the connecting portions to form second cutting surfaces, so as to separate the conductive substrates from the frame portion. Further provided in the present application is a light-emitting device. The manufacturing of the light-emitting device provided in the present application has the advantage of high yield.

Description

Light emitting device and manufacturing method thereof TECHNICAL FIELD

[0001] The present application relates to the field of light emitting diode packaging, in particular to a manufacturing method of light emitting device and light emitting device. BACKGROUND

[0002] In the field of light emitting diode packaging, referring to Fig. 1, in order to make a light emitting device 7', the conventional manufacturing process is as follows: manufacturing a metal frame 3', the metal frame 3' is integrally formed with a plurality of arrayed pad units (Fig. 1 exemplarily shows a metal frame structure with only one pad unit), each pad unit is usually composed of two separate and oppositely arranged metal plates 2', the pad unit is connected with the metal frame 3', and the metal frame 3' is further formed with a clamping point 1' for supporting the bearing support; then forming a bearing support 5' on the pad unit, the bearing support 5' is usually made of resin material, after the bearing support 5' is formed, the connecting part 4' of the pad unit and the metal frame 3' is separated, only the clamping point 1' for supporting the bearing support 5' is reserved, then the die bonding and packaging of the light emitting diode chip 6' is completed in the bearing support 5', and then the clamping point 1' is separated from the bearing support 5' through stamping, so as to obtain the light emitting device 7'. However, in the stamping process, when the bearing support 3' is separated from the metal frame 3', the bearing support 3' is easily damaged by the force of the clamping point during stamping, resulting in a decrease in the yield of the product. SUMMARY

[0003] The technical problem solved by the present application is how to improve the yield of the light emitting device in the manufacturing process.

[0004] To solve the above technical problem, the present application provides a manufacturing method of light emitting device, comprising the following steps:

[0005] S1: performing stamping treatment on a conductive blank plate to form a continuous sheet substrate with a frame part, a plurality of pairs of conductive substrates and a plurality of connecting parts, each pair of the conductive substrates comprises two conductive substrates oppositely spaced apart, and each pair of the conductive substrates is connected to the frame part through the connecting part;

[0006] S2: providing a bearing support combined with each pair of conductive substrates; the bearing support is fixed on each of the conductive substrates and forms an accommodation space together with each of the conductive substrates, and the part of the conductive substrate exposed outside the bearing support is a protruding part;

[0007] S3: cutting part of the protruding part to remove part of the protruding part to form a first cutting surface, and reserving at least one connecting part to keep the frame part connected with each conductive substrate;

[0008] S4: disposing the light emitting piece into the accommodating space, and electrically connecting the light emitting piece with the conductive substrate; and filling glue into the accommodating space to encapsulate the light emitting piece in the bearing support;

[0009] S5: cutting the connection part to form a second cutting surface, and separating the conductive substrate from the frame.

[0010] As a further improvement of the technical solution of the present application, the manufacturing method of the light emitting device further comprises a step S23: electroplating the reflective layer on the continuous substrate before or after the step S2.

[0011] As a further improvement of the technical solution of the present application, the side wall of the bearing support is made of a light-transmitting material; the first cutting surface is closer to the bearing support than the second cutting surface; each of the connection parts has two first cutting surfaces; the remaining part of the protruding part after being partially cut includes an edge area and a buffer area; the edge area is close to the edge of the bearing support; and the buffer area is connected with the connection part and close to the middle position of the conductive substrate.

[0012] In an embodiment, each of the conductive substrates formed in the step S1 has at least two connection parts connected with the frame part.

[0013] In the step S3, part of the protruding part and part of the connection part are cut away, and only one connection part of each of the conductive substrates is left to be connected with the frame part; each of the bearing supports has only one connection part on each of the two opposite sides connected with the frame part, and the connection parts on the two opposite sides of each of the bearing supports are staggered in the first direction and rotationally symmetric with respect to the center point of the bearing support.

[0014] In an embodiment, when part of the protruding part is cut away in the step S3, part of the protruding part on both sides of at least one connection part is cut away, and the first cutting surfaces formed on both sides of the remaining connection part each include a plane and a curved surface, wherein the planes are located on the same plane.

[0015] The present application further provides a light emitting device, characterized by comprising a bearing support, a light emitting piece, at least one pair of conductive substrates, and a connection residual part.

[0016] The pair of conductive substrates comprises two oppositely spaced conductive substrates, each of the conductive substrates comprises a conductive part and a protruding residual part which are connected in the first direction; the bearing bracket is fixed on each of the conductive parts and encloses each of the conductive parts to form a containing space; the protruding residual part is exposed on two opposite sides of the bearing bracket, and the connecting residual part protrudes from one side of each of the protruding residual parts away from the conductive part; the protruding residual part is provided with a first cutting surface formed by partial cutting, the first cutting surface is formed on both sides of the connecting residual part, and the connecting residual part has a second cutting surface formed after being cut off; the light emitting element is mounted in the containing space, and the light emitting element is electrically connected with the conductive part; the containing space is filled with sealing glue covering the light emitting element.

[0017] In an embodiment, among the two opposite sides of the light emitting device provided with the connecting residual part, the connecting residual part of each side is only one and deviates from the middle position of one side of the light emitting device, and the connecting residual parts of the two opposite sides of the light emitting device are staggered in the first direction and rotationally symmetric about the center point of the bearing bracket.

[0018] In an embodiment, the protruding residual part comprises an edge region and a buffer region; the edge region is closer to the edge of the bearing bracket than the buffer region, and the buffer region is away from the edge of the bearing bracket and connected with the connecting residual part and located in the middle position of the connecting residual part close to the conductive substrate.

[0019] In an embodiment, the first cutting surface on both sides of the connecting residual part comprises a plane located in the edge region of the protruding residual part and a curved surface located in the buffer region of the protruding residual part, wherein the planes located in the edge regions of the same side of the light emitting device are located on the same plane, and the curved surface is connected with the plane and extends away from the bearing bracket. Specifically, referring to FIG. 5a, when the partial protruding part 22 is cut, the partial protruding parts 22 on the same side of the longitudinally arranged adjacent bearing brackets can be cut at the same time, so that the planes located in the edge regions of the same side of the light emitting device are located on the same plane. At the same time, one of the connecting parts on one side of the two adjacent bearing brackets in the longitudinal direction can also be cut together.

[0020] In an embodiment, the bearing bracket is made of light-transmitting material; the surface of the conductive substrate is provided with a reflective layer; the first cutting surface and the second cutting surface are not covered by the reflective layer, and the reflective layer covers at least the joint surface of the bearing bracket and the conductive substrate.

[0021] The application provides a manufacturing method of a light-emitting device and the light-emitting device, wherein the supporting frame is connected with the metal frame through the connecting part of the conductive part, so that the support of the metal frame is obtained, the connecting part is cut off when the light-emitting device needs to be separated from the metal frame at last, the clamping point for supporting the supporting frame is not needed on the metal frame, so that the damage of the supporting frame caused by the clamping point on the metal frame is avoided, the damage rate of the supporting frame is reduced, and the product yield is improved.

[0022] In addition, a mold is needed when the supporting frame is formed on the conductive substrate, a part of the conductive substrate protrudes from the mold cavity (namely, the part outside the supporting frame and clamped by the mold, namely, the protruding part in the application), so that the mold can clamp the pad unit, the glue overflow in the process of forming the supporting unit by glue injection is reduced, and after the supporting unit is formed, the protruding part with such a large area is no longer needed, so that only the connecting part capable of being connected with the metal frame needs to be reserved. The part of the protruding part on both sides of the connecting part can be cut off, so that the light absorption phenomenon of the metal material is reduced. BRIEF DESCRIPTION OF DRAWINGS

[0023] Fig. 1 is a structure schematic view of a light-emitting device in the prior art in cooperation with a metal frame in a manufacturing process;

[0024] Figs. 2a, 2b and 2c are a brief flow chart of a manufacturing method of a light-emitting device provided by an embodiment of the application;

[0025] Fig. 3a is a structure schematic view of a metal blank in step S1 of a manufacturing method of a light-emitting device provided by an embodiment of the application;

[0026] Fig. 3b is a structure schematic view of a continuous sheet substrate in step S1 of a manufacturing method of a light-emitting device provided by an embodiment of the application;

[0027] Fig. 3c is an enlarged view of part A in Fig. 3b;

[0028] Fig. 4a is a structure schematic view of setting a supporting frame in step S2 of a manufacturing method of a light-emitting device provided by an embodiment of the application;

[0029] Fig. 4b is an enlarged view of part B in Fig. 4a;

[0030] Figs. 4c and 4d are A-A cross-sectional views based on Fig. 4b after setting a reflecting layer in step S23 of a manufacturing method of a light-emitting device provided by an embodiment of the application;

[0031] Fig. 5a is a schematic view of cutting part of the protruding part in step S3 of a manufacturing method of a light-emitting device provided by an embodiment of the application;

[0032] Fig. 5b is a schematic view after cutting part of the protruding part in step S3 of a manufacturing method of a light-emitting device provided by an embodiment of the application;

[0033] Fig. 6 is a schematic view of the light emitting device after the light emitting element is arranged in step S4 of the manufacturing method of the light emitting device according to an embodiment of the present application;

[0034] Fig. 7 is a schematic view of the light emitting device after the connecting portion is cut in step S5 of the manufacturing method of the light emitting device according to an embodiment of the present application;

[0035] Fig. 8a is a schematic view of the light emitting device after the part of the protruding portion is cut in step S3 of the manufacturing method of the light emitting device according to another embodiment of the present application;

[0036] Fig. 8b is a schematic view of the light emitting device after the light emitting element is arranged in step S4 of the manufacturing method of the light emitting device according to another embodiment of the present application;

[0037] Fig. 8c is a schematic view of the light emitting device after the connecting portion is cut in step S5 of the manufacturing method of the light emitting device according to another embodiment of the present application;

[0038] Fig. 9a is a schematic view of the light emitting device after the part of the protruding portion is cut in step S3 of the manufacturing method of the light emitting device according to another embodiment of the present application;

[0039] Fig. 9b is a schematic view of the light emitting device after the light emitting element is arranged in step S4 of the manufacturing method of the light emitting device according to another embodiment of the present application;

[0040] Fig. 9c is a schematic view of the light emitting device after the connecting portion is cut in step S5 of the manufacturing method of the light emitting device according to another embodiment of the present application;

[0041] Fig. 10a and Fig. 10b are schematic views of the front side and the back side of the light emitting device according to another embodiment of the present application;

[0042] Fig. 11a and Fig. 11b are schematic views of the front side and the back side of the light emitting device according to another embodiment of the present application;

[0043] Fig. 12a and Fig. 12b are schematic views of the front side and the back side of the light emitting device according to another embodiment of the present application;

[0044] Fig. 13a is a schematic view of the front side of the light emitting device according to another embodiment of the present application;

[0045] Fig. 13b is a schematic view of the A-A cross section of Fig. 13a;

[0046] Fig. 13c is a schematic view of the front side of the light emitting device according to another embodiment of the present application;

[0047] Fig. 13d is a schematic view of the A-A cross section of Fig. 13c. DETAILED DESCRIPTION

[0048] The application will be described in further detail below with specific reference being made to the drawings. Like elements are referred to with like reference numerals throughout the specification. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the application. However, those skilled in the art will readily recognize that the basic principles of the application can be practiced without the specific details given. In other instances, well-known methods have not been described in detail in order not to unnecessarily obscure aspects of the application.

[0049] In addition, features, operations, or steps described in the specification can be combined in any suitable manner without departing from the scope of the present application. Similarly, steps in the methods described herein can be performed in an order different from the order described, and that various steps can be modified, eliminated, or added.

[0050] The serial numbers of components in the specification, such as "first", "second", etc., are only used to distinguish the described objects, and do not have any sequential or technical meaning. Unless otherwise specified, "connected" or "coupled" in the present application includes direct and indirect connections (couplings).

[0051] The embodiment of the present application provides a light emitting device, and aims to solve the problem of high damage rate and low yield in the manufacturing process of the light emitting device in the prior art.

[0052] Embodiment one

[0053] The embodiment provides a manufacturing method of a light emitting device, and aims to solve the problem of low yield caused by breakage in the manufacturing process of the light emitting device in the prior art.

[0054] Please refer to FIG. 2a, the manufacturing method of the light emitting device specifically includes the following steps:

[0055] Step S1: making the continuous substrate 1. Please refer to FIG. 3a, FIG. 3b and FIG. 3c; providing a conductive blank plate 10 and punching the conductive blank plate 10 to form the continuous substrate 1 with the frame part 3, multiple pairs of conductive substrates 2 and multiple connecting parts 4, each pair of conductive substrates 2 is connected to the frame part 3 through the connecting part 4. In this embodiment, the conductive blank plate 10 is a whole piece of metal plate, in this embodiment, the conductive blank plate 10 shown in FIG. 3a is a square copper plate; after punching, please refer to FIG. 3b, the dark gray part is punched through the copper plate and removed, the light gray part is not punched through and is thinned. Each pair of conductive substrates 2 and the connecting part 4 are integrally formed with the frame part 3, the frame part 3 provides connection and support for each pair of conductive substrates 2, and each pair of conductive substrates 2 will not be separated from the frame part 3. Please refer to FIG. 3c, in this embodiment, each pair of conductive substrates 2 includes two conductive substrates arranged opposite to each other in the first direction, each conductive substrate 2 includes a conductive part 21 and a protruding part 22 connected to each other, so that there are two conductive parts 21 arranged opposite to each other in the first direction, which are respectively used as the positive and negative conductive areas of the light emitting device 7 (please refer to FIG. 10a and FIG. 10b) for connecting with the light emitting device; each conductive part 21 is connected to a protruding part 22 respectively, one conductive substrate 2 can be connected to the frame part 3 through one connecting part 4, or can be connected to the frame part 3 through multiple connecting parts 4. In this embodiment, it is preferred that each protruding part 22 and the frame part 3 are connected through two connecting parts 4, which can maintain the stability of the conductive part 21 when the bearing support 5 is arranged. In other embodiments, each protruding part 22 and the frame part 3 are also connected to the frame part 3 through three or four connecting parts 4. The punching holes 11 formed after the conductive blank plate 10 is punched are arranged between each connecting part 4, the punching holes 11 can distinguish each connecting part, and can also distinguish the connecting part 4 from the protruding part 21. FIG. 3b exemplarily shows that there are 12 pairs of arrayed conductive substrates 2 arranged in 3 rows and 4 columns on a continuous substrate, each pair of conductive substrates is connected to the frame part 3 through the connecting part 4 in the first direction, and each pair of conductive substrates 2 has the same structure. The purpose of arranging the continuous substrate 1 is to integrate each pair of conductive substrates 2 on the same part, which can be processed in batches to improve the processing convenience.

[0056] Step S2: setting the carrier supports 5. Please refer to FIG. 4a, FIG. 4b and FIG. 4c; set the carrier supports 5 on the continuous substrate 1, so that each carrier support 5 is combined with each pair of conductive substrates 2. After setting the carrier supports 5, according to the positional relationship between the conductive substrates 2 themselves and the carrier supports 5, the conductive substrates 2 can be divided into the conductive parts 21 and the protruding parts 22. The carrier supports 5 are stacked and fixed on the conductive parts 21 and enclosed with the conductive parts 21 to form the accommodation spaces 51, and the protruding parts 22 are exposed outside the carrier supports 5. The protruding parts 22 have a preset size, which can provide sufficient support area for the injection mold when the carrier supports 5 are set on the conductive substrates 2 through the injection mold. Referring to FIG. 4a, in this embodiment, the continuous substrate 1 is clamped by the injection mold (not shown), and then the resin material is injected into the mold cavity of the injection mold. The hatched area covered by the diagonal line in FIG. 4a is the range of the resin material when the carrier supports 5 are formed by injection molding. The flow channel (its position corresponds to 52 in FIG. 4a) and the overflow channel (its position corresponds to 53 in FIG. 4a) between each carrier support 5 are connected, so that the mold cavities for forming each carrier support 5 are connected with each other, facilitating the flow of resin material to fully fill the mold cavities, so as to form multiple carrier supports 5 at one time. FIG. 4a exemplarily shows that 12 carrier supports 5 arranged in 3 rows and 4 columns are formed on the continuous substrate, and adjacent carrier supports in each column are connected by the support communication part 52 and the support overflow part 53 formed by the flow channel in the second direction.

[0057] Step S3: cutting part of the protruding part. Referring to FIG. 5a, part of the protruding part 22 is cut off using a punching and cutting device. The shape of the gray part in FIG. 5a is the outer contour shape of the cutting knife of the punching and cutting device. In this embodiment, part of the protruding part 22 is cut off at the same time as part of the connecting part 4 and the support communication part 52 and the support overflow part 53, so that each protruding part 22 has only one connecting part 4 connected with the frame part 3. The first cutting surface P1 is formed on the protruding part. Cutting part of the protruding part reduces the area of the protruding part 22 exposed outside the carrier support 5, which can also reduce the adverse effects on the light efficiency of the product caused by the exposure of metal outside the carrier support 5. The upper and lower edges of the protruding part 22 are arranged in parallel along the first direction, and when part of the protruding part is cut off, part of the material on the upper and lower sides of the protruding part can be removed, but at least a certain amount of material is left at the edges of the carrier support 5 to avoid cutting stress damage to the carrier support 5 caused by being too close to the carrier support 5. Referring to FIG. 10a and FIG. 10b, the remaining part after cutting off part of the protruding part 22 is the protruding residual part 220.

[0058] Step S4: disposing the light emitting component 6, please refer to Fig. 6; disposing the light emitting component 6 in the accommodating space 51, and electrically connecting the light emitting component 6 with the pair of conductive substrates 2; in order to further seal the light emitting device, it is necessary to further fill the glue in the accommodating space 51 formed by the bearing bracket 5 and the conductive part 21, and fill the encapsulation glue in the accommodating space 51, so as to encapsulate the light emitting component 6 in the bearing bracket 5. The light emitting component 6 can be a positive structure or a flip-chip structure or a vertical structure LED light emitting chip or other light emitting component, etc. In the embodiment, the light emitting component 6 is preferably a flip-chip LED chip. When the flip-chip light emitting chip is disposed in the accommodating space 51, the two electrodes of the flip-chip light emitting chip are respectively fixed to the conductive part 21 of the two conductive substrates 2 and form electrical connection with the two conductive parts 21. Using the flip-chip light emitting chip does not need to provide an extra wire space in the accommodating space 51, so that the size of the light emitting device 7 can be miniaturized and lightened, and the load of the connecting part 4 can be reduced.

[0059] Step S5: cutting the connecting part 4. Please continue to refer to Fig. 6 and Fig. 7; after disposing the light emitting component 6, in order to obtain the light emitting device 7 (refer to Fig. 10a and Fig. 10b), the connecting part 4 can be cut along the cutting line L1 to separate the conductive substrate 2 from the frame part 3, and obtain the light emitting device 7 shown in Fig. 10a and Fig. 10b. The connecting part 4 forms a second cutting surface P2 through the cutting line L1, and after cutting, the connecting part 4 has a part remaining on one side of the protruding part 22, which can be called a connecting residual part 41; in the embodiment, referring to Fig. 7, the connecting part 4 extends along the first direction, and the cutting line L1 extends along the second direction, the second direction intersects the first direction, and the cutting line L1 has a predetermined distance from the bearing bracket 5, which reduces the stress transmission and reduces the possibility of cracking of the bearing bracket 5. Wherein, the second direction can be perpendicular to the first direction. The position of the cutting line L1 is preferably located at the narrowest part of the connecting part 4 in the second direction, which makes it easier to cut off the connecting part 4.

[0060] As a further improvement of the embodiment, a step S23 of electroplating the reflective layer 23 on the continuous substrate is added before or after the step S2. In one example, referring to Figs. 2b and 4c, the reflective layer 23 is electroplated on the continuous substrate 1 before the step S2, so that the reflective layer 23 is provided on the surface of the continuous substrate 1, and the whole conductive substrate 2 is covered with the reflective layer 23 before the first cutting surface P1 is cut, even after the carrier support 5 is provided, the conductive part 21 (i.e. the surface of the combination of the conductive part 21 and the carrier support 5) under the carrier support 5 is also covered with the reflective layer 23. In another example, referring to Figs. 2c and 4d, the reflective layer 23 is electroplated on the continuous substrate 1 after the step S2. Since the carrier support 5 has been provided at this time, the surface of the combination of the carrier support 5 and the conductive part 21 is blocked and cannot be electroplated, but other exposed surfaces of the conductive substrate can be electroplated. The upper surface of the reflective layer 23 can be a silver plating layer. Since the reflectivity of silver is higher than that of copper, silver plating can improve the reflectivity of the components including the conductive substrate 2, the conductive part 21 and the protruding part 22, and improve the brightness of the light emitting device 7. The reflective layer 23 can also include at least two electroplated layers, for example, a nickel layer can be pre-plated on the copper substrate (i.e. the conductive substrate), and then a silver layer is electroplated on the nickel layer, which can improve the surface smoothness of the reflective layer and the tightness of the electroplated structure. An intermediate plating layer can be further included between the nickel plating layer and the silver plating layer to further improve the mechanical properties or conductive properties of the conductive substrate.

[0061] In the above method, the conductive substrate 2 has at least two functions, one is to provide electrical connection for the provided light emitting part 6, and the other is to provide support for the carrier support 5. The punching hole 11 can also provide a positioning point for the mold during the step of providing the carrier support 5, which facilitates the installation of the mold and also reduces the weight of the continuous substrate 1.

[0062] In the above method, the carrier support 5 is provided before cutting the protruding part 22, so as to make full use of the area of the protruding part 22, so that the mold provides a clamping position when the carrier support 5 is provided by the mold. After the carrier support 5 is formed, the mold is not needed in the subsequent process, and the protruding part 22 does not need to provide a clamping position for the mold and maintain the area. In order to reduce the weight of the continuous substrate 1 and recycle the material, and also because the residual support communication part 52 and the support overflow part 53 need to be removed, part of the protruding part 22 can be cut off to reduce the material of the continuous substrate 1, recycle part of the metal material, and also remove the residual support communication part 52 and the support overflow part 53, which facilitates the subsequent provision of the light emitting part 6. Therefore, the embodiment cuts part of the protruding part 22 after the step of providing the carrier support 5 and before the step of providing the light emitting part 6.

[0063] In the above method, if the continuous substrate 1 is electroplated before and after step S2, then in step S5, the connecting portion 4 is cut along the cutting line L1 to separate the conductive substrate 2 from the frame portion 3; the connecting portion 4 connected with the protruding portion 22 after separation is cut to form a second cutting surface P2, which does not cover the reflective layer but is the original material of the continuous substrate 1 exposed by cutting. If the continuous substrate is electroplated before step S3, then the first cutting surface P1 formed after cutting part of the protruding portion 22 in step S3 also does not cover the reflective layer but is the original material of the continuous substrate 1 exposed.

[0064] In an embodiment, the step of arranging the reflective layer is placed before arranging the bearing support 5, so that the entire continuous substrate 1 is electroplated to form the reflective layer, and if the bearing support 5 is made of a light-transmitting material, the light emitted by the light-emitting element 6 can be refracted outward through the light-transmitting side wall of the bearing support 5, which can increase the light-emitting angle of the light-emitting device 7; and since the conductive portion 21 arranged below the bearing support 5 is also covered with the reflective layer, it has the function of reflecting light, thereby reducing the absorption of light by the part of the conductive substrate 2 covered by the light-transmitting material and improving the light efficiency of the light-emitting device 7. The light-transmitting material can be transparent or translucent resin material.

[0065] In the embodiment, the second cutting surface P2 is farther away from the side of the bearing support 5 than the first cutting surface P1. The first cutting surface P1 includes the surface formed by cutting the corner region of the protruding portion 22, which can more fully remove the support overflow portion 53, and the protruding portion closer to the middle region can retain a part connected with the connecting portion 4 when cut, thereby maintaining the stability of the connection between the conductive portion 21 and the frame portion 3.

[0066] In the embodiment, referring to FIG. 5a and FIG. 5b, the partial connecting portion 4 is also removed in step S3 when cutting the partial protruding portion 22, and only one connecting portion 4 is left on each side to connect the conductive substrate 2 and the frame portion 3, the connecting portions 4 on the two opposite sides of the carrier bracket 5 are staggered in the first direction, and are rotationally symmetrical about the center point of the carrier bracket 5. When the light emitting element 6 and the encapsulation glue are arranged, the two connecting portions 4 can maintain the stability of the conductive portion 21 and the carrier bracket 5. At the same time, this is also to make it easier to cut the connecting portion 4 to separate the carrier bracket 5 from the frame portion 3 in step S5. If the number of connecting portions 4 is large, it will increase the difficulty of cutting the connecting portion 4 in step S5. In the embodiment, a part of the connecting portion 4 is also reserved when cutting the partial protruding portion 22. Referring to FIG. 10a and FIG. 10b, the remaining protruding portion 22 is a protruding residual portion 220. The protruding residual portion 220 includes an edge area 221 and a buffer area 222. The edge area 221 is closer to the edge of the carrier bracket 5 than the buffer area 222. The buffer area 222 is located between the edge area 221 and the cutting line L1. In this way, when cutting along the cutting line L1 to form the first cutting surface, the buffer area 222 will not be cut, which facilitates cutting the connecting portion 4. The buffer area 222 is away from the edge of the carrier bracket 5 and connects with the connecting portion 4 and is located at the middle position of the connecting portion 4 close to the conductive substrate 2. The buffer area 222 can provide stress buffering in step S5 of cutting the connecting portion 4. The stress generated when cutting the connecting portion 4 can be received and dispersed by the buffer area 222, avoiding the situation that the carrier bracket 5 is cracked when the cutting position is close to the carrier bracket 5. The buffer area 222 can also strengthen the structural strength of the connecting portion 4, so that the connecting portion 4 can sufficiently maintain the stability of the conductive portion 21 and the carrier bracket 5. In the embodiment, the light emitting element 6 is preferably a flip chip, so that the size of the light emitting device 7 can be miniaturized and lightened, the load of the connecting portion 4 can be reduced, and the structure is more suitable for the conductive portion 21 to be connected to the frame portion 3 through the two connecting portions 4 arranged along the two opposite sides of the carrier bracket 5.

[0067] In another embodiment, referring to FIG. 8a, FIG. 8b and FIG. 8c, in step S3, part of the protruding portion 22 is cut off while none of the connecting portions 4 is cut off, and there are still two connecting portions 4 on each side to connect the conductive substrate 2 and the frame portion 3. The two connecting portions 4 on opposite sides of the carrier support 5 are symmetrical about the longitudinal axis of the carrier support 5. The two connecting portions 4 on each side of the carrier support 5 can maintain the stability of the conductive portion 21 and the carrier support 5, and the remaining protruding residual portion 220 can only retain the edge area and does not need a buffer area, so as to reduce the volume of the protruding residual portion 220 and save costs, so that the light emitting device can be miniaturized and lightened. Of course, part of the connecting portion 4 can also be cut off while part of the protruding portion 22 is cut off, so that the width of the connecting portion 4 in the second direction is narrowed, which is to make it easier to cut off the connecting portion 4 in step S5. The light emitting device obtained after cutting off the connecting portion 4 is shown in FIG. 11a and FIG. 11b. The width of the connecting portion 4 is not necessarily smaller, and it also needs to be able to maintain the connection state between the conductive substrate 2 and the frame portion 3. If the width of the connecting portion 4 in the second direction is already small when the continuous sheet substrate 1 is formed in step S1, and part of the material is removed, it will not be able to support the carrier support 5, so the connecting portion 4 cannot be removed.

[0068] In another embodiment, referring to FIG. 9a, FIG. 9b and FIG. 9c, since the carrier support 5 is set before part of the protruding portion is cut off, the carrier support 5 is connected to two conductive substrates 2, so that in step S3, part of the protruding portion 22 is cut off, and only the protruding portion on one side of the carrier support 5 is cut off, while all the connecting portions on the same side can be cut off, and only the other side still has two connecting portions to connect the conductive substrate 2 and the frame portion 3. The two connecting portions 4 on one side of the carrier support 5 are symmetrical about the transverse axis of the carrier support 5. The width of the two connecting portions 4 on one side of the carrier support 5 in the second direction is wide enough to maintain the stability of the conductive portion 21 and the carrier support 5. Referring to the light emitting device 7 shown in FIG. 11a and FIG. 11b, the remaining protruding residual portion 220 can only retain the edge area 221 and does not need a buffer area, so as to reduce the volume of the protruding residual portion 220 and save costs. The light emitting device 7 obtained after cutting off the connecting portion 4 is shown in FIG. 12a and FIG. 12b.

[0069] According to the manufacturing method of the light emitting device 7 provided in the embodiments of the present application, the carrier support 5 is only supported by the conductive portion 21, and there is no need to set a metal clamping point to provide support for the carrier support 5, thereby avoiding damage to the carrier support 5 caused by the metal clamping point, reducing the damage rate of the carrier support, and improving the product yield.

[0070] Embodiment Two

[0071] Referring to FIG. 10a and FIG. 10b, the present embodiment provides a light emitting device 7, which can be manufactured by the manufacturing method of the light emitting device described in embodiment one, or can be manufactured by other manufacturing methods, which are not limited herein.

[0072] The light emitting device 7 provided by the present embodiment includes a bearing support 5, a light emitting component 6, a pair of conductive substrates 2, and a connecting residual portion 41; the pair of conductive substrates 2 includes two conductive substrates 2 oppositely arranged in a first direction, and each conductive substrate 2 includes a conductive portion 21 and a protruding residual portion 220; the bearing support 5 is fixedly stacked on the conductive portion 21 and forms an accommodation space 51 together with the conductive portion 21; the protruding residual portion 220 is exposed to two opposite sides of the bearing support 5, and the connecting residual portion 41 protrudes from each protruding residual portion 220 away from the conductive portion 21; the protruding residual portion 220 is provided with a first cutting surface P1 formed by partial cutting, and the first cutting surface P1 is formed on both sides of the connecting residual portion 41; the connecting residual portion 41 has a second cutting surface P2 formed by cutting; the light emitting component 6 is installed in the accommodation space 51, and the light emitting component 6 is electrically connected to the conductive portion 21.

[0073] In the present embodiment, the first direction is consistent with the connecting line of the center points of the two conductive substrates 2.

[0074] The light emitting device 7 of the present embodiment can be manufactured by the manufacturing method of the light emitting device provided in embodiment one, but is not limited thereto.

[0075] Referring to FIG. 4b, FIG. 5a and FIG. 5b, the protruding residual portion 220 is the part left after the protruding portion 22 exposed to the outside of the bearing support 5 is partially cut during the manufacturing process of the light emitting device 7. The purpose of cutting the protruding portion 22 is to reduce the area of the protruding portion 22 exposed to the bearing support 5, so as to reduce the influence of the light absorption of the protruding portion on the light efficiency of the light emitting device 7. In order to avoid excessive stress being transmitted to the bearing support 5 during the cutting process, causing the bearing support 5 to crack, the first cutting surface P1 is kept a certain distance from the bearing support 5, reducing the stress transmission and effectively reducing the possibility of the bearing support 5 cracking due to cutting the protruding residual portion 220.

[0076] Referring to FIG. 7, the connecting residual portion 4 is the part left after the connecting portion 4 connecting the light emitting device 7 and other components is cut along the cutting line L1 during the manufacturing process of the light emitting device 7. The second cutting surface P2 is a cutting surface formed by cutting the connecting portion 4 along the second direction. In the present embodiment, the first direction is perpendicular to the second direction.

[0077] In the present embodiment, the first cutting surface P1 is closer to the bearing support than the second cutting surface P2, and the first cutting surface P2 is at least partially formed by cutting the corner area of the protruding portion 22.

[0078] In the embodiment, the two opposite sides of the light emitting device 7 are provided with one connection residual part 41 respectively, and the connection residual part 41 is arranged away from the middle position of the side of the light emitting device 7, and the connection residual parts 41 of the two opposite sides of the light emitting device 7 are staggered in the first direction and rotationally symmetrical about the center point of the bearing support 5. Referring to FIGS. 6 and 7, in the process of manufacturing the light emitting device 7, after the bearing support 5 and the light emitting device 6 are arranged, before the connection part 22 is cut off, each conductive substrate 2 is connected to the frame part 3 through one connection part 4. In the embodiment, the light emitting device 7 has only one connection residual part 41 on each of the two opposite sides in the first direction, so that in the process of manufacturing the light emitting device 7, the connection residual part 41 can be connected to the frame 3, which can not only maintain the connection state between the conductive substrate 2 and the frame part 3, but also easily cut off the connection part 4, thereby making the light emitting device 7.

[0079] In the embodiment, the protruding residual part 41 includes an edge area 221 and a buffer area 222; the edge area 221 is closer to the edge of the bearing support 5 than the buffer area 222, and the buffer area 222 is away from the edge of the bearing support 5 and is connected to the connection residual part 41 and located at the middle position of the connection residual part 41 close to the conductive substrate 2. Referring to FIG. 7, the buffer area 222 can provide stress buffering in the process of cutting the connection part 4 in the process of manufacturing the light emitting device 7. The edge of the buffer area 222 away from the conductive part 21 is located between the edge of the conductive part 21 and the cutting line L1 of the second cutting surface P2, so that the buffer area 222 will not be cut when the second cutting surface P2 is cut along the cutting line L1, and because the buffer area 222 is away from the bearing support 5, the buffer area 222 can play a stress buffering role and can reduce the influence on the bearing support 5 when the second cutting surface P2 is cut. The buffer area 222 can also play a role in strengthening the mechanical strength of the connection part 4.

[0080] The width of the buffer area 222 in the second direction is smaller than the width of the conductive part 21.

[0081] In the embodiment, the first cutting surface P1 of the two sides of the connection residual part 41 includes a plane P11 located at the side of the edge area 221 of the protruding residual part 41 and a curved surface P12 located at the side of the buffer area of the protruding residual part 41, wherein the planes P11 of the two sides of the connection residual part 41 are located on the same plane in the second direction, and the curved surface P12 is connected to the plane P11 and extends away from the bearing support. In the embodiment, the curved surface P12 smoothly transitions from the first direction to the second direction, and the second direction is perpendicular to the first direction. The curved surface P12 has the effect of avoiding stress concentration between the buffer area 222 and the edge area 221 when cutting the connection part.

[0082] In the second direction, the area of the first cutting surface P1 is smaller than the area of the second cutting surface P2.

[0083] In the embodiment, referring to FIG. 4c and FIG. 4d, the conductive substrate 2 is provided with a reflective layer 23, which covers at least the surface of the conductive substrate 2 facing the carrier support 5. The reflective layer 23 can reflect the light emitted by the light emitting element 6, reduce the light absorption of the conductive substrate 2, and reduce the impact on the light efficiency of the light emitting device 7. The reflective layer 23 can be formed by electroplating to form a metal reflective layer. Specifically, the conductive substrate 2 is generally made of copper, and the reflective layer 23 can be formed by silver plating. Since the reflectivity of silver is higher than that of copper, silver plating can improve the reflectivity of the conductive substrate 2, the protruding part 22, and other components, and improve the brightness of the light emitting device 7. In the embodiment, referring to FIG. 4c, the side wall of the carrier support 5 is made of a light-transmitting material (for example, transparent or translucent resin material), and the reflective layer 23 can cover the entire surface of the conductive substrate 2, including the surface of the conductive substrate 2 combined with the carrier support 5. The light emitted by the light emitting element 6 can be refracted outward through the light-transmitting side wall of the carrier support 5, which can increase the light emitting angle of the light emitting device 7. Since the conductive part 21 arranged below the carrier support 5 is also covered by the reflective layer 23, the light can also be reflected, thereby further improving the light intensity reflected from the carrier support 5. In the embodiment, the first cutting surface P1 and the second cutting surface P2 are not covered by the reflective layer, but are the original material of the continuous substrate 1 exposed after cutting. Referring to FIG. 4d, if the carrier support is made of a non-light-transmitting material, the reflective layer can only cover the surface of the conductive substrate 2 that is not covered by the carrier support 5, excluding the surface of the conductive substrate combined with the carrier support 5, which can reduce the manufacturing cost of the light emitting device 7.

[0084] In some optional embodiments, the light emitting element 6 includes a flip chip, and two electrodes of the flip chip are respectively fixed to the two conductive substrates 2 and form electrical connections with the conductive substrates 2. The use of flip chips does not require additional wire bonding space in the accommodation space 51 enclosed by the carrier support 5 and the conductive part 21, which can miniaturize and lighten the light emitting device 7.

[0085] According to the light emitting device 7 provided by the embodiment of the present application, the carrier support 5 is only supported by the conductive part 21, and does not need to be supported by metal clamping points, thereby avoiding damage to the carrier support 5 caused by the metal clamping points, reducing the damage rate of the carrier support 5, and improving the product yield.

[0086] Embodiment three

[0087] Referring to FIG. 11a and FIG. 11b, the present embodiment provides a light emitting device 7, which can be manufactured by the manufacturing method of the light emitting device described in embodiment one, or by other manufacturing methods, which are not limited in the present embodiment.

[0088] The difference between this embodiment and embodiment one is that, in this embodiment, the light emitting device 7 is provided with two connection residual portions 41 on each of the two opposite sides, and the two connection residual portions 41 on the two sides are symmetrically arranged with respect to the longitudinal axis of the light emitting device 7, and the two connection residual portions 41 on the same side are symmetrically arranged with respect to the transverse axis of the light emitting device 7. In this embodiment, the width of the connection residual portion 41 in the second direction is smaller than that of the connection residual portion 41 in embodiment two. In this embodiment, the protruding residual portion 220 has no buffer zone, but only has an edge zone 221, compared with the protruding residual portion in embodiment two. The edge zone 221 is close to the edge of the bearing bracket 5 and maintains a predetermined distance from the edge of the bearing bracket 5. The edge zone 221 is connected to the protruding residual portion 41 through the curved surface P12, and the side surface of the edge zone 221 on the same side of the light emitting device 4 is a plane P11, and the planes are on the same plane. The curved surfaces P11 and P12 are both components of the first cutting surface P1.

[0089] In this embodiment, the light emitting device 7 has two connection portions on each of the two opposite sides during the manufacturing process, which forms stable support for the light emitting device 7 and uniform stress, so that part of the protruding portion can be cut off, and the buffer zone is not needed, the volume of the protruding residual portion 220 can be reduced, the weight of the light emitting device 7 can be reduced, and the production cost can be reduced. In addition, due to the narrow width of the connection portion, it is also convenient to be cut off. The other parts of this embodiment not mentioned are the same as those of embodiment two.

[0090] Embodiment four

[0091] Referring to FIGS. 12a and 12b, this embodiment provides a light emitting device 7, which can be manufactured by the manufacturing method of the light emitting device described in embodiment one, or can be manufactured by other manufacturing methods, which are not limited in this embodiment.

[0092] The difference between this embodiment and embodiment one is that, in this embodiment, referring to FIGS. 9a, 9b and 9c, during the manufacturing process of the light emitting device 7, the connection portion 4 on one side of the light emitting device 7 is cut off together during the cutting of the protruding portion 22, and the light emitting device 7 is provided with a connection residual portion 41 on the other side. In this embodiment, the protruding portion on the side provided with the connection residual portion 41 does not need to be partially cut off, so the protruding portion 22 on this side is a complete protruding portion and has not been cut off in any way, and there is no protruding residual portion. Since there is only one connection portion, the mechanical strength requirement of the connection portion is higher, so the width of the connection portion in the second direction is larger than that of the connection portion in embodiments two and three. The other parts of this embodiment not mentioned are the same as those of embodiment two.

[0093] In the present embodiment, the pair of conductive substrates includes two first conductive substrates 2a and two second conductive substrates 2b, which are oppositely arranged in the first direction. The first conductive substrate 2a includes a conductive portion 21 and a protruding residual portion 220. The second conductive substrate 2b includes a conductive portion 21, a protruding portion 22, and a connecting residual portion 41. The connecting residual portion 41 protrudes from the conductive portion 21 to the side of the protruding portion 22. The bearing bracket 5 is fixed to the conductive portions 21 of the first and second conductive substrates 2a and 2b and encloses the conductive portions 21 to form a receiving space 51. The protruding portion 22 and the protruding residual portion 220 are exposed on the two opposite sides of the bearing bracket 5. The protruding residual portion 220 is provided with a first cutting surface P1 formed by cutting. The first cutting surface P1 is formed on the side of the first conductive substrate 2a. The connecting residual portion 41 has a second cutting surface P2 formed by cutting. The light emitting element 6 is mounted in the receiving space 51 and electrically connected to the conductive portion 21.

[0094] In the present embodiment, the light emitting device 7 is separated from the frame portion in the last step of the manufacturing process. Since only one side of the connecting portion 4 is provided, the connecting portion on this side can be cut, which is convenient for manufacturing. In the manufacturing process, after the light emitting element is arranged in the receiving space 51 of the bearing bracket 5, when the reflow soldering equipment is used, the deformation of the connecting portion 4 and the bearing bracket 5 caused by heat can be released to a certain extent through the other side without the connecting portion, which reduces the stress concentration and prevents the bearing bracket and the conductive substrate from being damaged due to excessive deformation.

[0095] Based on the present embodiment, in other embodiments, if the strength of the connecting portion 4 is sufficient to support the bearing bracket 5 during the manufacturing process of the light emitting device 7, and cutting part of the protruding portion 22 does not affect the support of the bearing bracket 5 by the connecting portion 4, then part of the protruding portion adjacent to the connecting portion on the other side can also be cut, or part of the connecting portion on this side can also be cut, so that the width of the remaining connecting portion is smaller, thereby facilitating the cutting of the connecting portion in the subsequent process.

[0096] Embodiment Five

[0097] Referring to FIGS. 13a and 13b, the present embodiment provides a light emitting device 100. The present embodiment integrates an optical component 8 based on the light emitting device 7 of the above embodiments two to four. The optical component 8 covers the bearing bracket 5 and the protruding residual portion 220. The optical component 8 functions to redistribute the light emitted by the light emitting device 7 and improves the integration of the light emitting device and the compactness of the structure, without the need for an additional independent optical component.

[0098] The light emitting device 7 in this embodiment is schematically illustrated by taking the light emitting device shown in Figs. 10a and 10b as a representative. It can be understood that the light emitting device 7 in this embodiment can also be replaced by the light emitting device shown in Figs. 11a and 11b, or the light emitting device shown in Figs. 12a and 12b, which will not be repeated here.

[0099] The optical component 8 in this embodiment is an optical lens, which includes a square base 82 and a lens body 81 protruding from the square base. The lens body 81 has a convex curved surface, which can refract the light emitted by the light emitting element 6 to expand the light emitting angle of the light emitting device 100. The position directly above the lens body 81 is recessed downward to form a concave portion 84, so as to weaken the light intensity from the portion directly above the light emitting element 6, and make the light emitting of the light emitting device more uniform. The optical component 8 can be molded on the light emitting device 7 by a mold. The optical component 8 is preferably made of transparent resin material.

[0100] There is no gap between the optical component 8 and the light emitting device 7, and since the optical component 8 is in contact with both the bearing bracket 5 and the protruding residual portion 220, in addition to improving the optical performance of the light emitting device 7, the air tightness of the light emitting device 7 can also be enhanced, so that the light emitting element is not easily invaded by water vapor.

[0101] Since the protruding residual portion 220 is very thin in thickness and is made of metal material, it is easy to be warped and deformed by external force, and the optical component 8 is a solid lens formed by curing the gel, and the combination of the optical component 8 and the protruding residual portion 220 can provide structural support to the protruding residual portion 220, so as to protect the protruding residual portion 220 from being warped and deformed by external force.

[0102] The peripheral size of the lens body 81 of the optical component 8 is smaller than the peripheral size of the base 82, so that a step surface 82 is formed between the lens body 81 and the base 82. The base 82 has an outer vertical surface 83. The outer vertical surface 83 is coplanar with the second cutting surface P2, and in the manufacturing process, the outer vertical surface 83 and the second cutting surface P2 can be formed by cutting process. The advantage is that the shape of the lens body 81 can be freely designed within the range of the base, and the lens body 81 will not be cut when cutting. The outer vertical surface 83 can be a vertical surface perpendicular to the upper surface of the conductive substrate.

[0103] In another embodiment, referring to Figs. 13c and 13d, the peripheral size of the lens body 81 of the optical component 8 is equal to the peripheral size of the base 82. The upper surface of the base 82 is square, and the bottom shape of the lens body 81 is the inscribed circle of the upper surface of the base 82. In this case, the volume of the lens body can be maximized.

[0104] The above describes the present application by using specific examples, which is only used to help understand the present application and does not limit the present application. According to the idea of the present application, a person skilled in the art of the present application can make several simple deductions, deformations or substitutions.

Claims

1. A method for manufacturing a light emitting device, characterized by, The method comprises the following steps: S1: providing a conductive blank plate and performing stamping processing on the conductive blank plate to form a continuous substrate having a frame part, a plurality of pairs of conductive substrates, and a plurality of connecting parts, each pair of the conductive substrates comprising two conductive substrates arranged opposite to each other; and each pair of the conductive substrates being connected to the frame part through the connecting parts; S2: arranging a bearing support combined with each pair of the conductive substrates; the bearing support being fixedly stacked on each of the conductive substrates and enclosing a containing space with each of the conductive substrates, and a part of each of the conductive substrates exposed outside the bearing support being a protruding part; S3: cutting part of the protruding parts to remove part of the protruding parts to form a first cutting surface, and reserving at least one connecting part to keep the frame part connected to each of the conductive substrates; S4: arranging a light emitting element in the containing space, electrically connecting the light emitting element to each of the conductive substrates, and filling glue in the containing space to encapsulate the light emitting element in the bearing support; S5: cutting the connecting parts to form a second cutting surface, and separating each of the conductive substrates from the frame part.

2. The method of claim 1, wherein the first cutting surface is closer to the bearing support than the second cutting surface, each of the connecting parts has the first cutting surface on both sides thereof; and the part of the protruding part remaining after being partially cut comprises an edge region and a buffer region, the edge region is close to an edge of the bearing support, and the buffer region is adjacent to the connecting part and close to a middle position of each of the conductive substrates. wherein Before or after step S2, the method further comprises a step S23 of electroplating a reflective layer on the continuous substrate.

3. The method for manufacturing a light emitting device according to claim 1, wherein The side wall of the bearing support is made of a transparent material.

4. The method for manufacturing a light emitting device according to claim 1 or 2, wherein Each of the conductive substrates formed in step S1 has at least two connecting parts connected to the frame part; 5. The method for manufacturing a light emitting device according to claim 1, wherein In step S3, part of the protruding parts and part of the connecting parts are cut away, and only one connecting part is left on each of the conductive substrates to be connected to the frame part; so that each of the bearing supports has only one connecting part on each of the two opposite sides connected to the frame part, and the connecting parts on the two opposite sides of each of the bearing supports are staggered in a first direction and rotationally symmetric with respect to a center point of the bearing support. In step S3, when part of the protruding parts is cut away, part of the protruding parts on both sides of at least one connecting part is cut away, and the first cutting surfaces formed on both sides of the remaining connecting part each comprise a flat surface and a curved surface, wherein the flat surfaces are located on the same plane.

6. The method for manufacturing a light emitting device according to claim 1, wherein The light emitting device comprises a bearing support, a light emitting element, at least one pair of conductive substrates, and a connecting residual part.

7. A light-emitting device, characterized in that, ​ The pair of conductive substrates includes two conductive substrates oppositely arranged in a first direction, each of the conductive substrates including a conductive part and a protruding residual part; the bearing bracket is fixed on each of the conductive parts and encloses a containing space with each of the conductive parts; the protruding residual part is exposed on two opposite sides of the bearing bracket, and the connecting residual part protrudes from one side of each of the protruding residual parts away from the conductive part; the protruding residual part is provided with a first cutting surface formed by partial cutting, the first cutting surface is formed on both sides of the connecting residual part, and the connecting residual part has a second cutting surface formed after being cut off; the light emitting element is mounted in the containing space, and the light emitting element is electrically connected with the conductive part; the containing space is filled with sealing glue covering the light emitting element.

8. The light emitting device of claim 7, wherein the first and second light emitting layers are formed of a material having a band gap of 2.5 eV or more. Among the two opposite sides of the light emitting device provided with the connecting residual part, the connecting residual part of each side is only one and deviates from the middle position of one side of the light emitting device, and the connecting residual parts of the two opposite sides of the light emitting device are staggered in the first direction and rotationally symmetric about the center point of the bearing bracket.

9. The light emitting device of claim 7, wherein the first and second light emitting layers are formed of a material having a band gap of 2.5 eV or more. The protruding residual part includes an edge region and a buffer region; the edge region is closer to the edge of the bearing bracket than the buffer region, and the buffer region is away from the edge of the bearing bracket and connected with the connecting residual part and located at the middle position of the connecting residual part close to the conductive substrate.

10. The light emitting device of claim 9, wherein the first and second light emitting layers are formed of a material having a band gap of 2.5 eV or more. The first cutting surface on both sides of the connecting residual part includes a plane located in the edge region of the protruding residual part and a curved surface located in the buffer region of the protruding residual part, wherein the planes located in the edge regions of the same side of the light emitting device are located on the same plane, and the curved surface is connected with the plane and extends away from the bearing bracket.

11. The light emitting device of claim 7, wherein the first and second light emitting layers are formed of a material having a band gap of 2.5 eV or more. The bearing bracket is made of light-transmitting material; the surface of the conductive substrate is provided with a reflective layer; the first cutting surface and the second cutting surface do not cover the reflective layer, and the reflective layer covers at least the joint surface of the bearing bracket and the conductive substrate.

12. The light emitting device of claim 7, wherein the first and second light emitting layers are formed of a material having a band gap of 2.5 eV or more. Further comprising an optical component integrated on the light emitting device, the optical component covering the bearing bracket and the protruding residual part.

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