Optical system, arrangement and lithography apparatus

Abstract

An optical system (100) for a lithography apparatus (1), comprising at least one optical element (202), at least one actuator / sensor device (202) assigned to the at least one optical element (202), an interface device (206) that is optically connected (208) to the at least one actuator / sensor device (202) for data transmission purposes and is electrically and / or optically connectable to a controller (300), wherein the interface device (206) comprises a first micro-component (212) having a first processor element (214) and a first optical interface element (216) integrated therewith and the at least one actuator / sensor device (204) comprises a second micro-component (218) having a second processor element (220) and a second optical interface element (222) integrated therewith, the latter being optically connected to the first optical interface element (216).

Description

[0001] Carl Zeiss SMT GmbH

[0002] 1

[0003] OPTICAL SYSTEM, ARRANGEMENT AND LITHOGRAPHY APPARATUS

[0004] The present invention relates to an optical system for a lithography apparatus and to an arrangement and a lithography apparatus having such an optical system.

[0005] The content of the priority application DE 10 2024 209 176.6 is incorporated by reference in its entirety.

[0006] Microlithography is used to produce microstructured structural elements, for example integrated circuits. The microlithography process is performed using a lithography apparatus that comprises an illumination system and a projection system. The image of a mask (reticle) illuminated by means of the illumination system is projected by means of the projection system onto a substrate, for example a silicon wafer, which is coated with a light-sensitive layer (photoresist) and is arranged in the image plane of the projection system, in order to transfer the mask structure to the light-sensitive coating of the substrate.

[0007] Driven by the need for ever smaller structures in the production of integrated circuits, EUV lithography apparatuses that use light at a wavelength in the range from 0.1 nm to 30 nm, in particular 13.5 nm, are currently under development. Since most materials absorb light at this wavelength, such EUV lithography apparatuses require the use of reflective optical units, i.e. mirrors, instead of refractive optical units, i.e. lens elements, as used previously.

[0008] A multiplicity of actuator / sensor devices having sensors and / or actuators are installed in an optical system of a lithography apparatus. For example, an actuator / sensor device is suitable for displacing an optical element, for example a mirror, assigned to the actuator / sensor device and / or for detecting a parameter (e.g. a position, a temperature) of the assigned optical element.

[0009] In order to control the actuator / sensor devices and evaluate the data acquired by the actuator / sensor devices, the actuator / sensor devices of the optical system are connected to an external controller.

[0010] Against this background, the present invention addresses the problem of providing an improved optical system for a lithography apparatus.

[0011] According to a first aspect, an optical system for a lithography apparatus is proposed. The optical system comprises: Carl Zeiss SMT GmbH

[0012] 2 at least one optical element, at least one actuator / sensor device assigned to the at least one optical element, an interface device that is optically connected to the at least one actuator / sensor device for data transmission purposes and is electrically and / or optically connectable to a controller, wherein the interface device comprises a first micro-component having a first processor element and a first optical interface element integrated therewith and the at least one actuator / sensor device comprises a second micro-component having a second processor element and a second optical interface element integrated therewith, the latter being optically connected to the first optical interface element.

[0013] As a result of transmitting data between the at least one actuator / sensor device and the interface device by way of an optical transmission path (e.g. optical waveguide) and by means of optical interfaces, it is possible to transmit greater amounts of data than in the case of an electrical transmission. In particular, it is possible to provide a higher data transmission rate (e.g. bit rate, i.e. bits per second). Moreover, the bandwidth for the data interchange can be increased significantly.

[0014] Moreover, installation space is saved by the use of the first and second micro-components, in which the corresponding processor element with the corresponding optical interface element is integrated. In particular, lithography apparatuses are subject to very stringent optical and physical demands, which inter alia define and constrict the installation spaces. For example, the interface device and the at least one actuator / sensor device, which accordingly comprise the first and second microcomponents, are arranged in a confined region of the optical system. For example, the interface device and the at least one actuator / sensor device are arranged behind the assigned optical element, where there is only limited space available for the actuator / sensor device(s) and their data transmission links. For example, the interface device and the at least one actuator / sensor device may also be arranged in a vacuum atmosphere and / or a protective atmosphere with a limited amount of space. Saving installation space is particularly relevant if a plurality / multiplicity of actuator / sensor devices are used for an optical element (e.g. a micromirror arrangement having a multiplicity of individual mirrors).

[0015] A susceptibility to errors (e.g. dielectrically caused losses or reflections, crosstalk) known from electrical transmission paths between processor and electrical transceiver (e.g. by way of differential conductor pairs on a printed circuit board) may also be avoided as a result of the corresponding optical interface element Carl Zeiss SMT GmbH

[0016] 3 integrated with the corresponding processor element. This is because the corresponding processor element and the corresponding optical interface element are integrated in such a way with each other in the first and second micro-components that the electrical transmission path between the corresponding processor element and the corresponding optical interface element is very short. For example, a distance between the corresponding processor element and the corresponding optical interface element in the first and second micro-components is 100 pm or less. This high integration density not only increases the data transmission rate but also reduces waste heat of the first and second micro-components. As a result of reducing waste heat, less cooling is required for the interface device with the first microcomponent and the at least one actuator / sensor device with the second micro-component.

[0017] The lithography apparatus (projection exposure apparatus) may be an EUV lithography apparatus. EUV stands for "extreme ultraviolet" and denotes a wavelength of the operating light of between 0.1 nm and 30 nm, in particular 13.5 nm. The lithography apparatus may also be a DUV lithography apparatus. DUV stands for "deep ultraviolet" and denotes a wavelength of the operating light of between 30 nm and 250 nm. The lithography apparatus comprises an illumination system and a projection system. In particular, using the lithography apparatus, the image of a mask (reticle) illuminated by means of the illumination system is projected by means of the projection system onto a substrate, for example a silicon wafer, which is coated with a light-sensitive layer (photoresist) and arranged in the image plane of the projection system, in order to transfer the mask structure to the light-sensitive coating of the substrate.

[0018] The optical system is preferably an illumination system of the lithography apparatus. However, the optical system might also be a projection system of the lithography apparatus.

[0019] The at least one optical element is in particular configured to guide radiation in the optical system. For example, the at least one optical element is a mirror (e.g. an adaptive mirror) or a lens element in the lithography apparatus. Purely by way of example, the at least one optical element optionally comprises a micromirror arrangement having a multiplicity of micromirrors units (e.g. 100 or more, 500 or more and / or 900 or more) with in each case a multiplicity (e.g. 100 or more, 300 or more and / or 600 or more) of micromirrors.

[0020] For example, the at least one actuator / sensor device comprises an actuator (actuation device) for actuating an assigned optical element, a sensor for acquiring data Carl Zeiss SMT GmbH

[0021] 4

[0022] (e.g. a position, a temperature) of an assigned optical element and / or of surroundings of the assigned optical element and / or an actuator and sensor device for actuating the assigned optical element and acquiring data therefrom. For example, the sensor is a position sensor. By preference, the actuator is an actuator using the electrostrictive effect or an actuator using the piezoelectric effect, for example a PMN actuator (PMN; lead magnesium niobate) or a PZT actuator (PZT; lead zirconate titanate). In particular, the actuator is configured to actuate an optical element of the optical system.

[0023] The interface device is optically connected to the at least one actuator / sensor device for data transmission purposes, e.g. by means of one or more optical waveguides. An optical waveguide may also be referred to as an optical fibre (e.g. glass fibre) and is provided for example as a light-guiding cable (e.g. as a fibre-optic cable).

[0024] The interface device is electrically and / or optically connectable to the controller. For example, an electrical cable that is electrically connected to the interface device and electrically connectable to the controller is provided. For example, an optical waveguide that is optically connected to the interface device and optically connectable to the controller might also be provided. In particular, the controller is configured to provide control signals for the at least one actuator / sensor device and evaluate data received from the at least one actuator / sensor device.

[0025] In particular, the controller is an external controller that is arranged external to the optical system (e.g. also external to a vacuum atmosphere and / or protective atmosphere of the optical system). For example, the external controller is arranged in a greyroom or a cleanroom for the lithography apparatus.

[0026] Between the at least one actuator / sensor device and the external controller, the data are consequently transmitted on an optical transmission path (between the at least one actuator / sensor device and the interface device) and an electrical and / or optical transmission path (between the interface device and the external controller). Consequently, the interface device represents an interface between an optical transmission path and an electrical and / or optical transmission path.

[0027] The interface device comprises the first micro-component having the first optical interface element. Furthermore, the at least one actuator / sensor device comprises the second micro-component having the second optical interface element. The first and the second optical interface element of the first and the second micro-component, respectively, are each configured to convert incoming electrical signals into outgoing optical signals, and vice versa. The first and second optical interface Carl Zeiss SMT GmbH

[0028] 5 elements each comprise e.g. an optical input and output and an electrical input and output. For example, each of the first and second optical interface elements is a bidirectional optical interface element. For example, each of the first and second optical interface elements comprises one or more photonic integrated circuits (PICs). Moreover, the first and the second processor element of the first and the second micro-component, respectively, each comprise a microprocessor, an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA) or the like.

[0029] The first and the second micro-component may also be referred to as first and second electronic unit (more precisely, optoelectronic unit), respectively. In particular, each of the first and second micro-components is in the form of hardware. In particular, each of the first and second micro-components is a single component. In other words, the first processor element and the first optical interface element are integrated with each other in the first micro-component, in such a way that the first micro-component as a whole can be mechanically and electrically connected to another unit (e.g. a printed circuit board). The first processor element and the first optical interface element may also be referred to as two first chiplets that are integrated with each other (e.g. horizontally or vertically stacked). The features described in this paragraph also apply to the second processor element and the second optical interface element of the second micro-component.

[0030] The interface device may also comprise multiple first micro-components. Likewise, the at least one actuator / sensor device may also comprise multiple second microcomponents.

[0031] The optical system may also comprise multiple actuator / sensor devices. In this case, the interface device is directly or indirectly optically connected to each of the plurality of actuator / sensor devices with the aid of one or more optical waveguides.

[0032] Should purely by way of example the optical element comprise a micromirror arrangement having multiple micromirror units with multiple micromirrors each, then a dedicated actuator / sensor device may for example be provided for each micromirror unit (or else for each individual mirror).

[0033] According to an embodiment, the at least one optical element is at least partially arranged in a vacuum atmosphere, and the first and second micro-components are arranged in a region under atmospheric pressure. Carl Zeiss SMT GmbH

[0034] 6

[0035] The region under atmospheric pressure is separated vacuum-tightly from the vacuum atmosphere in particular. For example, an air mixture or else a nitrogen atmosphere is situated in the region under atmospheric pressure.

[0036] Consequently, the first and second micro-components are not arranged in the vacuum atmosphere but in the region under atmospheric pressure. This can prevent outgassing from the first and second micro-components from impairing the vacuum atmosphere and / or the optical element at least partially arranged in the vacuum atmosphere.

[0037] The at least one optical element being at least partially arranged in a vacuum atmosphere means for example that at least an optically active surface of the optical element is arranged in the vacuum atmosphere. The at least one optical element may also be arranged completely in the vacuum atmosphere.

[0038] Moreover, for example, not only are the first and second micro-components arranged in the region under atmospheric pressure but each of the interface device (including the first micro-component) and the at least one actuator / sensor device (including the second micro-component) as a whole may also be arranged in the region under atmospheric pressure.

[0039] For example, the first and second micro-components are arranged together in a joint region under atmospheric pressure. In an alternative, the first and second micro-components may each be arranged in a dedicated region under atmospheric pressure.

[0040] According to a further embodiment, the optical system comprises a vacuum housing under vacuum atmosphere and at least one protective housing that is at least partially arranged within the vacuum housing and under atmospheric pressure. Moreover, the at least one optical element is at least partially arranged within the vacuum atmosphere in the vacuum housing, and the first and second micro-components are arranged within the at least one protective housing.

[0041] For example, the vacuum housing and / or a vacuum pump for evacuating the vacuum housing are / is designed such that there is a pressure of 1 hPa to 103hPa, 103to 10’8hPa or 10’8to 1011hPa (vacuum atmosphere) in the interior of the vacuum housing.

[0042] In particular, the protective housing is a vacuum-tight housing. The protective housing serves to protect the vacuum atmosphere and / or the at least one optical Carl Zeiss SMT GmbH

[0043] 7 element from outgassing from the micro-components. The protective housing is designed for atmospheric pressure in its interior and for it to be sealed vis-a-vis the vacuum atmosphere in the vacuum housing. Atmospheric pressure may also be referred to as pressure of the atmosphere. Atmospheric pressure is the pressure in the ambient air at the Earth's surface or in the vicinity of the latter. For example, atmospheric pressure has a value of 1013.25 hPa.

[0044] Furthermore, for example, not only are the first and second micro-components arranged within the protective housing but each of the interface device and the at least one actuator / sensor device as a whole may also be arranged within the protective housing.

[0045] According to a further embodiment, the optical system comprises an electrical and / or optical vacuum feedthrough that connects the protective housing to an external space of the vacuum housing through the vacuum housing and serves to feed-through at least one electrical and / or optical connection that is connected to the interface device.

[0046] As a result, it is possible to establish an electrical or optical connection between the interface device arranged in the protective housing and the controller arranged outside of the vacuum housing.

[0047] For example, an electrical vacuum feedthrough is known from documents US 4982 055 Al, US 6 305 975 Bl and WO 14076 303 Al.

[0048] According to a further embodiment, the optical system comprises a first printed circuit board on which the first micro-component is arranged and / or a second printed circuit board on which the second micro-component is arranged.

[0049] According to a further embodiment, the optical system comprises a first printed circuit board on which the first micro-component is arranged and / or a second printed circuit board on which the second micro-component is arranged. Furthermore, the first and / or second printed circuit boards are each formed from a composite material that has an inner cavity. Moreover, the cavity in the first and / or second printed circuit boards accordingly forms a first or second vacuum-tight protective housing, wherein the first and / or second micro-components are / is arranged accordingly in the first or the second vacuum-tight protective housing.

[0050] Forming the first / second vacuum-tight protective housing in the interior of the first / second printed circuit board also allows the first or second micro-component Carl Zeiss SMT GmbH

[0051] 8 to be housed in the vacuum housing of the optical system without influencing the adjacent / surrounding vacuum. In this case, the composite material of the first / sec- ond printed circuit board forms the vacuum-tight first / second protective housing, which surrounds the first or second micro-component, in particular completely.

[0052] That is to say, the first or second micro-component is completely shielded from the vacuum in this embodiment by way of the integration of the first or second microcomponent in the corresponding printed circuit board. Since the corresponding vacuum-tight protective housing is formed by the composite material of the corresponding printed circuit board, there advantageously is no need for an additional dedicated housing for the first and second micro-components. Moreover, installation space is saved because the corresponding protective housing is formed in the composite material of the corresponding printed circuit board. In particular, an ultracompact unit suitable for confined installation spaces is obtained therewith.

[0053] The inner cavity is a sealed-off cavity in particular, which is completely surrounded by the composite material.

[0054] According to a further embodiment, the first processor element and the first optical interface element are arranged on a joint first substrate of the first micro-component, and / or the second processor element and the second optical interface element are arranged on a joint second substrate of the second micro-component.

[0055] Hence, the first micro-component is an individual component that comprises the first substrate. For example, the first processor element and / or the first optical interface element are each connected electrically (and mechanically) to the joint first substrate. Hence, the first micro-component as a whole may be mechanically and electrically connected to another unit (e.g. a further substrate or a printed circuit board). In particular, the first substrate is configured to be mechanically and electrically connected to another unit (e.g. a further substrate or a printed circuit board). For example, the first substrate comprises electrical contacts, e.g. vias, for an electrical connection to another unit (e.g. a further substrate or a printed circuit board). The features described in this paragraph also apply to the second micro-component, the second processor element, the second optical interface element and the joint second substrate.

[0056] Optionally, the first and / or second micro-components may each comprise an electronics housing, in which the corresponding processor element and the corresponding optical interface element are arranged / accommodated at least in part. Carl Zeiss SMT GmbH

[0057] 9

[0058] In a first variant, the joint first / second substrate may be arranged on a printed circuit board and electrically connected to the latter. In a second variant, the joint first / second substrate may also be an intermediate unit (interposer unit) that is arranged on a further substrate (component substrate / package substrate) and electrically connected to the latter, with the further substrate (component substrate / package substrate) being arranged on a printed circuit board and electrically connected to the latter.

[0059] According to a further embodiment, the first processor element and the first optical interface element are arranged on a first intermediate unit of the first micro-component and electrically connected to each other within the first intermediate unit, and / or the second processor element and the second optical interface element are arranged on a second intermediate unit of the second micro-component and electrically connected to each other within the second intermediate unit.

[0060] The first / second processor element and the first / second optical interface element consequently represent two chiplets that are each arranged on the intermediate unit (interposer unit), electrically connected to the intermediate unit and electrically connected to each other within the intermediate unit. Hence, the electrical signals provided by the first / second optical interface element may be transmitted to the first / second processor element, or vice versa, over very short transmission paths.

[0061] That is to say, the first processor element and the first optical interface element together form a first interposer-based stack of multiple microchip s / chiplets. Likewise, the second processor element and the second optical interface element together form a second interposer-based stack of multiple microchip s / chiplets.

[0062] In the present case, "arranged on an intermediate unit" comprises the case that the first / second processor element and the first / second optical interface element are arranged next to each other (horizontal stacking) or on top of each other (vertical stacking) on the corresponding intermediate unit. In the case of an arrangement next to each other, the first / second processor element and the first / second optical interface element are arranged on the same surface / side of the corresponding intermediate unit. In the case of an arrangement on top of each other, the first / second processor element and the first / second optical interface element are arranged on opposite surfaces / sides of the corresponding intermediate unit such Carl Zeiss SMT GmbH

[0063] 10 that the intermediate unit is arranged between the first / second processor element and the first / second optical interface element.

[0064] According to a further embodiment, the first and second optical interface elements are optically connected to each other by means of one or more optical waveguides.

[0065] According to a further embodiment, the one or more optical waveguides comprise a polymer-based optical waveguide.

[0066] A polymer-based optical waveguide (polymer waveguide, PWG) has greater pliability than e.g. an optical fibre. For example, the polymer-based optical waveguide may comprise a film. For example, a polymer-based optical waveguide does not have a round / circular cross section but a rectangular cross section, the rectangle of which has a first side that is many times larger (e.g. by a factor of 10 or more and / or a factor of 100 or more) than a second side of the rectangle.

[0067] A material of the polymer-based optical waveguide comprises e.g. polynorbornene and / or polynorbornene rubber (PNR).

[0068] According to a further embodiment, the optical system comprises a plurality of the actuator / sensor devices, wherein the interface device is optically connected to each of the plurality of actuator / sensor devices with the aid of a respective optical waveguide.

[0069] In this context, the plurality of actuator / sensor devices are optically connected to the interface device in a hierarchic structure. For example, there is an optical transmission path (e.g. a single optical transmission path) between the interface device and each of the plurality of actuator / sensor devices.

[0070] For example, the interface device is directly optically connected to each of the plurality of actuator / sensor devices with the aid of a respective optical waveguide.

[0071] A high bandwidth for data interchange can be provided as a result of the optical data transmission being implemented between the first and second micro-components, each of which is in the form of an individual component (e.g. interposerbased stacked chiplet). As a result, it is possible to realize varied network topologies in the optical data transmission, for example like in the embodiments set forth below. Carl Zeiss SMT GmbH

[0072] 11

[0073] According to a further embodiment, the optical system comprises a plurality of the actuator / sensor devices and a forwarding device. The forwarding device comprises a third micro-component having a third processor element and a third optical interface element integrated therewith. Moreover, the interface device is optically connected to the forwarding device with the aid of an optical waveguide, and the forwarding device is optically connected to each of the plurality of actuator / sensor devices with the aid of a respective optical waveguide.

[0074] In this context, too, the plurality of actuator / sensor devices are optically connected to the interface device by way of the forwarding device in a hierarchic network topology.

[0075] For example, the interface device is directly optically connected to the forwarding device with the aid of an optical waveguide. Furthermore, the forwarding device is directly optically connected to each of the plurality of actuator / sensor devices with the aid of a respective optical waveguide.

[0076] The third micro-component having the third processor element and the third optical interface element integrated therewith may comprise the same features as described above for the first and second micro-components.

[0077] According to a further embodiment, the optical system comprises a plurality of the actuator / sensor devices and at least one forwarding device having a third microcomponent that comprises a third processor element and a third optical interface element integrated therewith. Moreover, the interface device, the at least one forwarding device and the plurality of actuator / sensor devices are optically connected to one another with the aid of multiple optical waveguides, in such a way that there are at least two mutually independent optical transmission paths between the interface device and each of the plurality of actuator / sensor devices.

[0078] In this embodiment, the plurality of actuator / sensor devices are optically connected to the interface device via the at least one forwarding device in a redundant network topology (e.g. a mesh-like and / or ring-like network topology). This can avoid an outage of the overall system due to the failure of a single component (single point of failure, SPOF), e.g. of individual optical waveguides.

[0079] An arrangement for a lithography apparatus is proposed according to a second aspect. The arrangement comprises an optical system as described above and a controller arranged in a greyroom or in a cleanroom. Furthermore, the interface device Carl Zeiss SMT GmbH

[0080] 12 of the optical system and the controller are connected for data transmission purposes by means of an electrical and / or optical line.

[0081] A lithography apparatus having an optical system as described above and / or an arrangement as described above is proposed according to a third aspect.

[0082] "A" or "an" in this instance should not necessarily be regarded as a restriction to exactly one element. Instead, there may also be provision for multiple elements, for example two, three or more. Any other numeral used here should also not be understood as a restriction to exactly the stated number of elements. Rather, unless indicated otherwise, numerical variances upwards and downwards are possible.

[0083] Further possible implementations of the invention also comprise combinations not explicitly mentioned of features or embodiments which were described above or will be described in the following text in relation to the exemplary embodiments. A person skilled in the art will also add individual aspects as improvements or supplementations to the respective basic form of the invention.

[0084] Further advantageous configurations and aspects of the invention are the subject of the dependent claims and of the exemplary embodiments of the invention that are described hereinafter. The invention is elucidated in greater detail hereinafter on the basis of preferred embodiments with reference to the appended figures.

[0085] Fig. 1 shows a schematic meridional section of a projection exposure apparatus for EUV projection lithography according to one embodiment;

[0086] Fig. 2 shows an optical system of the projection exposure apparatus from Fig. 1 according to a first embodiment;

[0087] Fig. 3 shows one embodiment of a micro-component of the optical system from Fig. 2 arranged on a printed circuit board;

[0088] Fig. 4 shows a further embodiment of a micro-component of the optical system from Fig. 2 arranged on a printed circuit board;

[0089] Fig. 5 shows an optical system of the projection exposure apparatus from Fig. 1 according to a second embodiment; Carl Zeiss SMT GmbH

[0090] 13

[0091] Fig. 6 shows an optical system of the projection exposure apparatus from Fig. 1 according to a third embodiment; and

[0092] Fig. 7 shows an optical system of the projection exposure apparatus from Fig. 1 according to a fourth embodiment.

[0093] In the figures, identical or functionally identical elements have been provided with the same reference signs, unless indicated otherwise. Further, it should be noted that the representations in the figures are not necessarily true to scale.

[0094] Fig. 1 shows one embodiment of a projection exposure apparatus 1 (lithography apparatus), in particular an EUV lithography apparatus. One embodiment of an illumination system 2 of the projection exposure apparatus 1 has, in addition to a light or radiation source 3, an illumination optics unit 4 for illuminating an object field 5 in an object plane 6. In an alternative embodiment, the light source 3 may also be provided as a module separate from the rest of the illumination system 2. In this case, the illumination system 2 does not comprise the light source 3.

[0095] A reticle 7 arranged in the object field 5 is exposed. The reticle 7 is held by a reticle holder 8. The reticle holder 8 is displaceable by way of a reticle displacement drive 9, in particular in a scanning direction.

[0096] Fig. 1 depicts, by way of elucidation, a Cartesian coordinate system with an x-di- rection x, a ydirection y and a z-direction z. The x-direction x runs perpendicularly into the plane of the drawing. The ydirection y runs horizontally, and the z- direction z runs vertically. The scanning direction runs in the ydirection y in Fig. 1. The z-direction z runs perpendicularly to the object plane 6.

[0097] The projection exposure apparatus 1 comprises a projection optics unit 10. The projection optics unit 10 serves to image the object field 5 into an image field 11 in an image plane 12. The image plane 12 runs parallel to the object plane 6. In an alternative, an angle that differs from 0° is also possible between the object plane 6 and the image plane 12.

[0098] A structure on the reticle 7 is imaged onto a light-sensitive layer of a wafer 13 arranged in the region of the image field 11 in the image plane 12. The wafer 13 is held by a wafer holder 14. The wafer holder 14 is displaceable by way of a wafer displacement drive 15, in particular in the ydirection y. The displacement, firstly, of the reticle 7 by way of the reticle displacement drive 9 and, secondly, of Carl Zeiss SMT GmbH

[0099] 14 the wafer 13 by way of the wafer displacement drive 15 can be implemented so as to be in sync with one another.

[0100] The light source 3 is an EUV radiation source. The light source 3 emits in particular EUV radiation 16, which is also referred to below as used radiation, illumination radiation or illumination light. The used radiation 16 has in particular a wavelength in the range between 5 nm and 30 nm. The light source 3 may be a plasma source, for example an LPP (laser produced plasma) source or a GDPP (gas discharge produced plasma) source. It may also be a synchrotron-based radiation source. The light source 3 may be a free electron laser (FEL).

[0101] The illumination radiation 16 emanating from the light source 3 is focused by a collector 17. The collector 17 may be a collector having one or more ellipsoidal and / or hyperboloidal reflection surfaces. The illumination radiation 16 may be incident on the at least one reflection surface of the collector 17 with grazing incidence (Gl), i.e. at angles of incidence of greater than 45°, or with normal incidence (Nl), i.e. at angles of incidence of less than 45°. The collector 17 may be structured and / or coated, firstly to optimize its reflectivity for the used radiation and secondly to suppress extraneous light.

[0102] Downstream of the collector 17, the illumination radiation 16 propagates through an intermediate focus in an intermediate focal plane 18. The intermediate focal plane 18 may represent a separation between a radiation source module, comprising the light source 3 and the collector 17, and the illumination optics unit 4.

[0103] The illumination optics unit 4 comprises a deflection mirror 19 and, arranged downstream thereof in the beam path, a first facet mirror 20. The deflection mirror 19 may be a planar deflection mirror or, alternatively, a mirror with a beaminfluencing effect that goes beyond the pure deflection effect. In an alternative to that or in addition, the deflection mirror 19 may take the form of a spectral filter that separates a used light wavelength of the illumination radiation 16 from extraneous light of a wavelength differing therefrom. Should the first facet mirror 20 be arranged in a plane of the illumination optics unit 4 that is optically conjugate to the object plane 6 as a field plane, it is also referred to as a field facet mirror. The first facet mirror 20 comprises a multiplicity of individual first facets 21, which may also be referred to as field facets. Only some of these first facets 21 are shown in Fig. 1 by way of example.

[0104] The first facets 21 may take the form of macroscopic facets, in particular the form of rectangular facets or the form of facets with an arcuate or partly circular Carl Zeiss SMT GmbH

[0105] 15 peripheral contour. The first facets 21 may take the form of planar facets or, alternatively, convexly or concavely curved facets.

[0106] As is known from DE 10 2008 009 600 Al, for example, the first facets 21 themselves may each also be composed of a multiplicity of individual mirrors, in particular a multiplicity of micromirrors. The first facet mirror 20 may take the form of a microelectromechanical system (MEMS system) in particular. For details, reference is made to DE 10 2008 009 600 Al.

[0107] The illumination radiation 16 travels horizontally, i.e. in the ydirection y, between the collector 17 and the deflection mirror 19.

[0108] In the beam path of the illumination optics unit 4, a second facet mirror 22 is disposed downstream of the first facet mirror 20. Should the second facet mirror 22 be arranged in a pupil plane of the illumination optics unit 4, it is also referred to as a pupil facet mirror. The second facet mirror 22 may also be arranged at a distance from a pupil plane of the illumination optics unit 4. In this case, the combination of the first facet mirror 20 and the second facet mirror 22 is also referred to as a specular reflector. Specular reflectors are known from US 2006 / 0132747 Al, EP 1 614 008 Bl and US 6,573,978.

[0109] The second facet mirror 22 comprises a plurality of second facets 23. In the case of a pupil facet mirror, the second facets 23 are also referred to as pupil facets.

[0110] The second facets 23 may also be macroscopic facets, which may for example have a round, rectangular or hexagonal boundary, or may alternatively be facets composed of micromirrors. In this regard, reference is also made to DE 10 2008 009 600 Al.

[0111] The second facets 23 may have planar or, alternatively, convexly or concavely curved reflection surfaces.

[0112] The illumination optics unit 4 thus forms a doubly faceted system. This fundamental principle is also referred to as a fly's eye integrator.

[0113] It might be advantageous to arrange the second facet mirror 22 not exactly in a plane that is optically conjugate to a pupil plane of the projection optics unit 10. In particular, the second facet mirror 22 may be arranged so as to be tilted in relation to a pupil plane of the projection optics unit 10, as described for example in DE 10 2017 220 586 Al. Carl Zeiss SMT GmbH

[0114] 16

[0115] The second facet mirror 22 is used to image the individual first facets 21 into the object field 5. The second facet mirror 22 is the last beam-shaping mirror or else actually the last mirror for the illumination radiation 16 in the beam path upstream of the object field 5.

[0116] In another embodiment (not shown) of the illumination optics unit 4, a transfer optics unit contributing in particular to the imaging of the first facets 21 into the object field 5 may be arranged in the beam path between the second facet mirror 22 and the object field 5. The transfer optics unit may comprise exactly one mirror, or alternatively two or more mirrors, which are arranged one behind the other in the beam path of the illumination optics unit 4. The transfer optics unit can in particular comprise one or two normal-incidence mirrors (NI mirrors) and / or one or two grazing-incidence mirrors (GI mirrors).

[0117] In the embodiment shown in Fig. 1, the illumination optics unit 4 has exactly three mirrors downstream of the collector 17, specifically the deflection mirror 19, the first facet mirror 20 and the second facet mirror 22.

[0118] In another embodiment of the illumination optics unit 4, the deflection mirror 19 may also be omitted, and so the illumination optics unit 4 may then have exactly two mirrors downstream of the collector 17, specifically the first facet mirror 20 and the second facet mirror 22.

[0119] The imaging of the first facets 21 into the object plane 6 by means of the second facets 23 or using the second facets 23 and a transfer optics unit is often only approximate imaging.

[0120] The projection optics unit 10 comprises a plurality of mirrors Mi, which are consecutively numbered in accordance with their arrangement in the beam path of the projection exposure apparatus 1.

[0121] In the example illustrated in Fig. 1, the projection optics unit 10 comprises six mirrors Ml to M6. Alternatives with four, eight, ten, twelve or any other number of mirrors Mi are also possible. The projection optics unit 10 is a doubly obscured optical unit. The penultimate mirror M5 and the last mirror M6 each have a passage opening for the illumination radiation 16. The projection optics unit 10 has an image-side numerical aperture that is greater than 0.5 and may also be greater than 0.6 and may be, for example, 0.7 or 0.75. Carl Zeiss SMT GmbH

[0122] 17

[0123] Reflection surfaces of the mirrors Mi may take the form of free-form surfaces without an axis of rotational symmetry. Alternatively, the reflection surfaces of the mirrors Mi may be designed as aspherical surfaces with exactly one axis of rotational symmetry of the reflection surface shape. Just like the mirrors of the illumination optics unit 4, the mirrors Mi may have highly reflective coatings for the illumination radiation 16. These coatings may be designed as multi-layer coatings, in particular with alternating layers of molybdenum and silicon.

[0124] The projection optics unit 10 has a large object-image shift in the ydirection y between a ycoordinate of a centre of the object field 5 and a ycoordinate of the centre of the image field 11. This object-image shift in the ydirection y may be of approximately the same magnitude as a z-distance between the object plane 6 and the image plane 12.

[0125] The projection optics unit 10 may in particular have an anamorphic form. In particular, it has different imaging scales Bx, By in the x- and ydirections x, y. The two imaging scales Bx, By of the projection optics unit 10 are preferably (Bx, By) = (+ / -0.25, + / -0.125). A positive imaging scale B means imaging without image inversion. A negative sign for the imaging scale B means imaging with image inversion.

[0126] The projection optics unit 10 consequently leads to a reduction in size with a ratio of 4'1 in the x-direction x, i.e. in a direction perpendicular to the scanning direction.

[0127] The projection optics unit 10 leads to a reduction in size of 8H in the ydirection y, i.e. in the scanning direction.

[0128] Other imaging scales are also possible. Imaging scales with the same sign and the same absolute value in the x-direction x and ydirection y are also possible, for example with absolute values of 0.125 or of 0.25.

[0129] The number of intermediate image planes in the x-direction x and in the ydirection y in the beam path between the object field 5 and the image field 11 may be the same or may differ, depending on the embodiment of the projection optics unit 10. Examples of projection optics units with different numbers of such intermediate images in the x-direction x and the ydirection y are known from US 2018 / 0074303 Al. Carl Zeiss SMT GmbH

[0130] 18

[0131] In each case one of the second facets 23 is assigned to exactly one of the first facets 21 in order to form a respective illumination channel for illuminating the object field 5. This may in particular produce illumination according to the Kohler principle. The far field is decomposed into a multiplicity of object fields 5 using the first facets 21. The first facets 21 generate a plurality of images of the intermediate focus on the second facets 23 respectively assigned to them.

[0132] By way of an assigned second facet 23, the first facets 21 are each imaged onto the reticle 7 and overlaid on one another for the purpose of illuminating the object field 5. The illumination of the object field 5 is in particular of maximum homogeneity. It preferably has a uniformity error of less than 2%. Field uniformity can be achieved by overlaying different illumination channels.

[0133] An arrangement of the second facets 23 can be used to geometrically define the illumination of the entrance pupil of the projection optics unit 10. The intensity distribution in the entrance pupil of the projection optics unit 10 can be set by selecting the illumination channels, in particular the subset of the second facets 23 that guide light. This intensity distribution is also referred to as an illumination setting or illumination pupil filling.

[0134] A likewise preferred pupil uniformity in the region of portions of an illumination pupil of the illumination optics unit 4 which are illuminated in a defined manner can be achieved by redistributing the illumination channels.

[0135] Further aspects and details of the illumination of the object field 5 and, in particular, of the entrance pupil of the projection optics unit 10 are described below.

[0136] The projection optics unit 10 may have a homocentric entrance pupil, in particular. The latter may be accessible. It may also be inaccessible.

[0137] The entrance pupil of the projection optics unit 10 regularly cannot be exactly illuminated using the second facet mirror 22. In the case of imaging by the projection optics unit 10 which telecentrically images the centre of the second facet mirror 22 onto the wafer 13, the aperture rays often do not intersect at a single point. However, it is possible to find an area in which the spacing of the aperture rays that is determined in pairs becomes minimal. This area is the entrance pupil or an area conjugate thereto in real space. In particular, this area exhibits a finite curvature. Carl Zeiss SMT GmbH

[0138] 19

[0139] It may be the case that the projection optics unit 10 has different positions of the entrance pupil for the tangential beam path and for the sagittal beam path. In this case, an imaging element, in particular an optical structural element of the transfer optics unit, should be provided between the second facet mirror 22 and the reticle 7. This optical element can be used to take into account the different position of the tangential entrance pupil and the sagittal entrance pupil.

[0140] In the arrangement of the components of the illumination optics unit 4 shown in Fig. 1, the second facet mirror 22 is arranged in an area conjugate to the entrance pupil of the projection optics unit 10. The first facet mirror 20 is arranged so as to be tilted with respect to the object plane 6. The first facet mirror 20 is arranged so as to be tilted with respect to an arrangement plane defined by the deflection mirror 19. The first facet mirror 20 is arranged so as to be tilted with respect to an arrangement plane defined by the second facet mirror 22.

[0141] Fig. 2 shows an arrangement 100 of the projection exposure apparatus 1 from Fig. 1 according to one embodiment. The arrangement 100 comprises an optical system 200 of the projection exposure apparatus 1 according to a first embodiment. The arrangement 100 also comprises a controller 300 of the projection exposure apparatus 1.

[0142] The optical system 200 comprises at least one optical element 202. The optical system 200 also comprises at least one actuator / sensor device 204 that is assigned to the at least one optical element 202. The assignment of the at least one actuator / sensor device 204 to the at least one optical element 202 is labelled using the reference sign Z. With the aid of the at least one actuator / sensor device 204, it is possible to actuate the at least one optical element 202 and / or acquire data in conjunction with the at least one optical element 202.

[0143] The optical system 200 also comprises an interface device 206 that is optically connected (e.g. by way of optical waveguide 208) to the at least one actuator / sensor device 204 for data transmission purposes. The interface device 206 is electrically and / or optically connectable to the controller 300. In Fig. 2, the interface device 206 of the optical system 200 is shown as electrically connected (electrical connection 210) to the controller 300. Even though the connection 210 is described as electrical connection herein, it may also take the form of an optical connection in other examples.

[0144] As shown in Fig. 2, the interface device 206 comprises a first micro-component 212. The first micro-component 212 comprises a first processor element 214 and a first Carl Zeiss SMT GmbH

[0145] 20 optical interface element 216 integrated with the first processor element 214 (Fig. 3). The first optical interface element 216 is configured to receive optical signals from the at least one actuator / sensor device 204. The first optical interface element 216 converts the received optical signals into electrical signals and transmits the electrical signals to the first processor element 214. From the first processor element 214, the electrical signals are transmitted onward via the electrical connection 210 to the controller 300 for evaluation purposes. The first optical interface element 216 is also configured to receive electrical signals from the first processor element 214 (transmitted from the controller 300), to convert the received electrical signals into optical signals and to send the optical signals to the at least one actuator / sensor device 204.

[0146] Fig. 2 shows that the at least one actuator / sensor device 204 also comprises a second micro-component 218. The second micro-component 218 comprises a second processor element 220 and a second optical interface element 222 integrated with the second processor element 220 (Fig. 3). The second optical interface element 222 is configured to receive optical signals from the interface device 206 (in particular from the first optical interface element 216). The second optical interface element 222 converts the received optical signals into electrical signals and transmits the electrical signals to the second processor element 220. The second optical interface element 222 is also configured to receive electrical signals from the second processor element 220, to convert the received electrical signals into optical signals and to send the optical signals to the interface device 206 (in particular to the first optical interface element 216).

[0147] Fig. 3 shows details of the first and second micro-components 212, 218 according to one embodiment. In particular, the first and second micro-components 212, 218 may have a similar and / or identical configuration. For this reason, Fig. 3 shows only one micro-component 212, 218, wherein the features shown may be applied to each of the first and second micro-components 212, 218.

[0148] For example, the optical system 200 comprises a first printed circuit board 224 and a second printed circuit board 226. The first micro-component 212 is arranged on the first printed circuit board 224. Furthermore, the second micro-component 218 is arranged on the second printed circuit board 226.

[0149] The first micro-component 212 optionally comprises a first substrate 228 (first component substrate), which is secured to the first printed circuit board 224 and electrically contacted therewith. Moreover, the second micro-component 218 optionally comprises a second substrate 230 (second component substrate), which is Carl Zeiss SMT GmbH

[0150] 21 secured to the second printed circuit board 226 and electrically contacted therewith. For example, each of the first and second substrates 228, 230 comprises multiple vias 232, each of which is electrically connected to conductor tracks (not shown) of the first or second printed circuit board 224, 226 by means of electrical contacts 234 (e.g. solder joints). Fig. 3 only shows a few of the vias 232 and only one has been provided with a reference sign. Fig. 3 also only shows a few of the electrical contacts 234 and only one has been provided with a reference sign.

[0151] As shown in Fig. 3, the first micro-component 212 also comprises a first intermediate unit 236 (first interposer unit), on which the first processor element 214 and the first optical interface element 216 are arranged. Furthermore, the second micro-component 218 comprises a second intermediate unit 238 (first interposer unit), on which the second processor element 220 and the second optical interface element 222 are arranged. For example, a distance D between the corresponding processor element 214, 216 and the corresponding optical interface element 220, 222 in the first and second micro-components 212, 218 is 100 pm or less.

[0152] Each of the first processor element 214 and the first optical interface element 216 is electrically connected to the first intermediate unit 236 (electrical contacts 240, e.g. micro-solder joints, e.g. with a 40 pm diameter). The same applies correspondingly to the second processor element 220, the second optical interface element 222 and the second intermediate unit 238. For example, the first / second intermediate unit 236, 238 comprises multiple further vias 242, which are electrically connected to the electrical contacts 240. Fig. 3 only shows a few of the further vias 242 and only one has been provided with a reference sign. Fig. 3 also only shows a few of the electrical contacts 240 and only one has been provided with a reference sign.

[0153] Moreover, the first processor element 214 and the first optical interface element 216 are electrically connected to each other within the first intermediate unit 236 (see electrical connection / vias 244 in Fig. 3). The same applies correspondingly to the second processor element 220, the second optical interface element 222 and the second intermediate unit 238.

[0154] If a component substrate 228, 230 (as shown in Fig. 3 using dashed lines) is provided in addition to the first / second intermediate unit 236, 238, then the first / second intermediate unit 236, 238 is arranged on the component substrate 228, 230 and electrically connected to the latter (electrical contacts 246 in Fig. 3). However, if no component substrate 228, 230 is provided (not shown here), then the first / second intermediate unit 236, 238 is arranged directly on the first / second printed circuit board 224, 226 and electrically connected to the latter. Carl Zeiss SMT GmbH

[0155] 22

[0156] By configuring the first and second components 212, 218 as interposer-based chiplet technology, the first and second optical interface elements 216, 222 may be provided in particularly space-saving fashion and with a large data transmission rate and bandwidth.

[0157] In the example of Fig. 2, the optical system 200 comprises a vacuum housing 248, in which there is a vacuum atmosphere V. Furthermore, the at least one optical element 202 is at least partially arranged within the vacuum atmosphere V in the vacuum housing 248 in the example of Fig. 2. In the example of Fig. 2, an optically active surface 250 of the at least one optical element 202 is arranged in the vacuum atmosphere V of the vacuum housing 248 in particular.

[0158] The interface device 206 and the at least one actuator / sensor device 204 may also be arranged within the vacuum atmosphere V in the vacuum housing 248 (not shown here). However, the optical system 200 may optionally also comprise at least one protective housing 252 that is at least partially arranged within the vacuum housing 248, as shown in Fig. 2 using dashed lines. The protective housing 252 is vacuum-tight in particular. In particular, there is atmospheric pressure A within the protective housing 252 (region 254).

[0159] For example, the first and second micro-components 212, 218 are arranged in the region 254 under atmospheric pressure A. In the example shown in Fig. 2, the interface device as a whole (including the first micro -component 212) and the at least one actuator / sensor device 204 as a whole (including the second micro-component 218) are arranged in the region 254 under atmospheric pressure A.

[0160] If the protective housing 252 under atmospheric pressure A is provided - as shown in Fig. 2 - then an electrical and / or optical vacuum feedthrough 256 may also be used. In the following, the vacuum feedthrough 256 is described as an electrical vacuum feedthrough 256 by way of example, even though it might also be an optical vacuum feedthrough 256 in other examples. In particular, the electrical vacuum feedthrough 256 feeds through the vacuum housing 248 and connects an external space R of the vacuum housing 248 (e.g. a cleanroom R) to the interior 254 of the protective housing 252. The electrical vacuum feedthrough 256 is configured to feed-through at least one electrical connection 210, which is electrically connected to the interface device 206 and electrically connectable to the controller 300.

[0161] The electronics, in particular the first and second micro-components 212, 218, may be separated from the vacuum atmosphere V with the aid of the protective housing Carl Zeiss SMT GmbH

[0162] 23

[0163] 252 that is under atmospheric pressure A. As a result, outgassing of the electronics cannot adversely affect the vacuum atmosphere V.

[0164] Instead of the optional protective housing 252 shown in Fig. 2, a cavity 258 (Fig. 4) formed within a printed circuit board 224', 226' may also separate the first and second micro-components 212, 218 from the vacuum atmosphere V, as described in DE 10 2022 207 555 Al.

[0165] As shown in Fig. 4, the first and / or second printed circuit boards 224', 226' may each be formed from a composite material 260. The composite material 260 comprises an inner cavity 258, which is completely surrounded by the composite material 260. The cavity 258 in the first and / or second printed circuit boards 224', 226' forms a first or second vacuum-tight protective housing 262. The first micro-component 212 is arranged in the vacuum-tight protective housing 262 of the first printed circuit board 224'. Moreover, the second micro-component 218 is arranged in the vacuum-tight protective housing 262 of the second printed circuit board 226'.

[0166] The first / second printed circuit board 224', 226' has a plurality of N strata 264, 266, 268 (with N > 5 in particular) that form the composite material 260 and comprise two outer strata 264 and N-2 inner strata 266, 268 arranged between the two outer strata 264.

[0167] Without loss of generality, N = 13 in Fig. 4. The N-2 inner strata 266, 268, accordingly the 11 inner strata in Fig. 4, are formed by an alternating sequence of metal layers 266 and insulator layers 268. In this case, an inner layer without hatching is a metal layer 266 in Fig. 4, and an inner layer with hatching is an insulator layer 268. For reasons of clarity, only one respective metal layer 266 and one respective insulator layer 268 have been provided with a reference sign.

[0168] For example, the metal layers 266 are formed from copper. For example, the insulator layers 268 are formed from a fibreglass substrate and / or from an epoxy resin. The two outer layers 264 (the uppermost layer and the lowermost layer in Fig. 4) for example take the form of an insulator layer and preferably take the form of an outgassing-resistant plastic film.

[0169] The outer layers 264 may also be formed as a lacquer or as a metal layer suitable for spreading heat. For the latter example in particular, the side flanges of the first / second printed circuit board 224', 226' might also be provided with a metal layer suitable for spreading heat (not shown in Fig. 4). Carl Zeiss SMT GmbH

[0170] 24

[0171] As shown in Figs 5 to 7, the optical system 400, 500, 600 might also comprise multiple actuator / sensor devices 404, 504, 604, with different topologies being possible for the configuration of the optical transmission paths.

[0172] Fig. 5 shows an optical system 400 according to a second embodiment with multiple actuator / sensor devices 404 (without loss of generality, three have been shown in exemplary fashion), which are each assigned to an optical element 202 (assignment Z). Each of the actuator / sensor devices 404 comprises a second micro-component 418 having a second processor element 420 and a second optical interface element 422 - like the second micro-component 418 in Figs 2, 3. Moreover, the interface device 206 is optically connected to each of the plurality of actuator / sensor devices 404 with the aid of a respective optical waveguide 408a, 408b, 408c.

[0173] Fig. 6 shows an optical system 500 according to a third embodiment with multiple actuator / sensor devices 504 (without loss of generality, three have been shown in exemplary fashion), which are each assigned to an optical element 202 (assignment as in Fig. 5). Each of the actuator / sensor devices 504 comprises a second microcomponent 518 having a second processor element 520 and a second optical interface element 522 - like the second micro -component 218 in Figs 2, 3. Moreover, the optical system 500 comprises a forwarding device 524. The forwarding device 524 comprises a third micro-component 526 having a third processor element 528 and a third optical interface element 530 integrated therewith - like the first and / or second micro-component 212, 218 in Figs 2, 3.

[0174] The interface device 206 is optically connected to the forwarding device 524 with the aid of an optical waveguide 508a. Moreover, each of the plurality of actuator / sensor devices 504 is optically connected to the forwarding device 524 with the aid of a respective optical waveguide 508b, 508c, 508d.

[0175] Fig. 7 shows an optical system 600 according to a fourth embodiment with multiple actuator / sensor devices 604 (without loss of generality, three have been shown in exemplary fashion), which are each assigned to an optical element 202 (assignment as in Fig. 5).

[0176] Each of the actuator / sensor devices 604 comprises a second micro-component 618 having a second processor element 620 and a second optical interface element 622 - like the second micro-component 218 in Figs 2, 3. Moreover, the optical system 600 comprises at least one forwarding device 624, 624'. By way of example, two forwarding devices 624, 624' are provided in the example of Fig. 7. The forwarding device 624 comprises a third micro-component 626 having a third processor Carl Zeiss SMT GmbH

[0177] 25 element 628 and a third optical interface element 630 integrated therewith - like the first and / or second micro-component 212, 218 in Figs 2, 3. Moreover, the forwarding device 624' comprises a fourth micro-component 626' having a fourth processor element 628' and a fourth optical interface element 630' integrated therewith - like the first and / or second micro-components 212, 218 in Figs 2, 3.

[0178] In the embodiment of Fig. 7, the interface device 206, the at least one forwarding device 624, 624' (e.g. the two forwarding devices 624, 624') and the plurality of actuator / sensor devices 604 are optically connected to one another with the aid of multiple optical waveguides 608a to 608h, in such a way that there are at least two mutually independent optical transmission paths Wl, W2 between the interface device 206 and each of the plurality of actuator / sensor devices 604.

[0179] In the example of Fig. 7, the interface device 206 in particular is optically connected to the forwarding device 624 with the aid of an optical waveguide 608a. The interface device 206 is moreover optically connected to the forwarding device 624' with the aid of an optical waveguide 608e. Moreover, each of the plurality of actuator / sensor devices 604 is optically connected to the forwarding device 624 with the aid of a respective optical waveguide 608b, 608c, 608d-like in Fig. 6. Additionally, one of the actuator / sensor devices 604 for example is optically connected to the forwarding device 624' with the aid of an optical waveguide 608f. Although not shown here, more than one of the actuator / sensor devices 604 may however also be optically connected to the forwarding device 624' with the aid of a respective optical waveguide. Furthermore, one of the actuator / sensor devices 604 for example is optically connected to a further actuator / sensor device 604 with the aid of an optical waveguide 608g. The further actuator / sensor device 604 is then optically connected to an even further actuator / sensor device 604, for example with the aid of an optical waveguide 608h. Although not shown in Fig. 7, it is however also possible for all of the actuator / sensor devices 604 to be optically connected to multiple further and / or all further actuator / sensor devices 604 with the aid of a respective optical waveguide.

[0180] That is to say that, for example, the uppermost actuator / sensor device 604 in Fig. 7 is connected via a first optical transmission path W 1 (6O8e+6O80, a second optical transmission path W2 (608a+608d), a third optical transmission path (without reference sign, 608a+608c+608g) and a fourth optical transmission path (without reference sign, 608a+608b+608h+608g). Of these, the first optical transmission path Wl is independent of the second to fourth optical transmission paths (e.g. the second optical transmission path W2) since the first optical transmission path W 1 has no joint light guide 608a to 608h with the second to fourth optical transmission Carl Zeiss SMT GmbH

[0181] 26 paths (e.g. the second optical transmission path W2). The other actuator / sensor devices 604 in Fig. 7 are also each connected via at least two mutually independent optical transmission paths, as shown in Fig. 7. The advantage of this mesh-like and partially ring-like topology of the optical transmission paths lies in the provision of redundant optical transmission paths Wl, W2 for the case that one of the transmission paths, e.g. one of the optical waveguides 608a to 608h, fails. This can avoid an outage of the overall system 600 due to the failure of a single component (single point of failure).

[0182] For example, the optical system 200, 400, 500, 600 may also be used in a DUV lithography apparatus.

[0183] Although the present invention has been described with reference to exemplary embodiments, it is modifiable in a variety of ways.

[0184] Carl Zeiss SMT GmbH

[0185] 27

[0186] LIST OF REFERENCE SIGNS

[0187] 1 Projection exposure apparatus

[0188] 2 Illumination system

[0189] 3 Light source

[0190] 4 Illumination optics unit

[0191] 5 Object field

[0192] 6 Object plane

[0193] 7 Reticle

[0194] 8 Reticle holder

[0195] 9 Reticle displacement drive

[0196] 10 Projection optics unit

[0197] 11 Image field

[0198] 12 Image plane

[0199] 13 Wafer

[0200] 14 Wafer holder

[0201] 15 Wafer displacement drive

[0202] 16 Illumination radiation

[0203] 17 Collector

[0204] 18 Intermediate focal plane

[0205] 19 Deflection mirror

[0206] 20 First facet mirror

[0207] 21 First facet

[0208] 22 Second facet mirror

[0209] 23 Second facet

[0210] 100 Arrangement

[0211] 200 System

[0212] 202 Element

[0213] 204 Actuator / sensor device

[0214] 206 Interface device

[0215] 208 Optical waveguide

[0216] 210 Connection

[0217] 212 Micro-component

[0218] 214 Processor element

[0219] 216 Interface element

[0220] 218 Micro-component

[0221] 220 Processor element

[0222] 222 Interface element

[0223] 224, 224’ Printed circuit board

[0224] 226, 226’ Printed circuit board Carl Zeiss SMT GmbH

[0225] 228 Substrate

[0226] 230 Substrate

[0227] 232 Via

[0228] 234 Contact

[0229] 236 Intermediate unit

[0230] 238 Intermediate unit

[0231] 240 Contact

[0232] 242 Via

[0233] 244 Connection

[0234] 246 Contact

[0235] 248 Vacuum housing

[0236] 250 Surface

[0237] 252 Protective housing

[0238] 254 Region

[0239] 256 Vacuum feedthrough

[0240] 258 Cavity

[0241] 260 Composite material

[0242] 262 Protective housing

[0243] 264 Layer

[0244] 266 Metal layer

[0245] 268 Insulator layer

[0246] 300 Controller

[0247] 400 System

[0248] 404 Actuator / sensor device

[0249] 408a-408c Optical waveguide

[0250] 418 Micro-component

[0251] 420 Processor element

[0252] 422 Interface element

[0253] 500 System

[0254] 504 Actuator / sensor device

[0255] 508a-508d Optical waveguide

[0256] 518 Micro-component

[0257] 520 Processor element

[0258] 522 Interface element

[0259] 524 Forwarding device

[0260] 526 Micro-component

[0261] 528 Processor element

[0262] 530 Interface element

[0263] 600 System

[0264] 604 Actuator / sensor device Carl Zeiss SMT GmbH

[0265] 608a-608h Optical waveguide

[0266] 618 Micro-component

[0267] 620 Processor element

[0268] 622 Interface element 624, 624’ Forwarding device

[0269] 626, 626’ Micro ■ comp onent

[0270] 628, 628’ Processor element

[0271] 630, 630’ Interface element A Pressure

[0272] D Distance

[0273] M1-M6 Mirrors

[0274] R External space

[0275] V Vacuum atmosphere W1 Transmission path

[0276] W2 Transmission path

[0277] Z Assignment

Claims

Carl Zeiss SMT GmbH30CLAIMS1. Optical system (200) for a lithography apparatus (1), comprising at least one optical element (202), at least one actuator / sensor device (204) assigned to the at least one optical element (202), an interface device (206) that is optically connected to the at least one actuator / sensor device (204) for data transmission purposes and is electrically and / or optically connectable to a controller (300), wherein the interface device (206) comprises a first micro-component (212) having a first processor element (214) and a first optical interface element (216) integrated therewith and the at least one actuator / sensor device (204) comprises a second micro-component (218) having a second processor element (220) and a second optical interface element (222) integrated therewith, the latter being optically connected to the first optical interface element (216).

2. Optical system according to Claim 1, wherein the at least one optical element (202) is at least partially arranged in a vacuum atmosphere (V), and the first and second micro-components (212, 218) are arranged in a region (254) under atmospheric pressure (A).

3. Optical system according to Claim 1 or 2, comprising a vacuum housing (248) under vacuum atmosphere (V) and at least one protective housing (252) that is at least partially arranged within the vacuum housing (248) and under atmospheric pressure (A), wherein the at least one optical element (202) is at least partially arranged within the vacuum atmosphere (V) in the vacuum housing (248), and the first and second micro-components (212, 218) are arranged within the at least one protective housing (252).

4. Optical system according to Claim 3, comprising an electrical and / or optical vacuum feedthrough (256) that connects the protective housing (252) to an external space (R) of the vacuum housing (248) through the vacuum housing (248) and serves to feed-through at least one electrical and / or optical connection (210) that is connected to the interface device (206).

5. Optical system according to any of Claims 1 to 4, comprising a first printed circuit board (224) on which the first micro-component (212) is arranged and / or aCarl Zeiss SMT GmbH31 second printed circuit board (226) on which the second micro-component (218) is arranged.

6. Optical system according to Claim 3, comprising a first printed circuit board (224') on which the first micro-component (212) is arranged and / or a second printed circuit board (226') on which the second micro-component (218) is arranged, wherein the first and / or second printed circuit boards (224', 226') are each formed from a composite material (260) that has an inner cavity (258), the cavity (258) in the first and / or second printed circuit boards (224', 226') accordingly forms a first or second vacuum-tight protective housing (262), and the first and / or second micro-components (212, 218) are / is arranged accordingly in the first or the second vacuum-tight protective housing (262).

7. Optical system according to any of Claims 1 to 6, wherein the first processor element (214) and the first optical interface element (216) are arranged on a joint first substrate (236) of the first micro-component (212), and / or the second processor element (220) and the second optical interface element (222) are arranged on a joint second substrate (238) of the second micro-component (218).

8. Optical system according to any of Claims 1 to 7, wherein the first processor element (214) and the first optical interface element (216) are arranged on a first intermediate unit (236) of the first micro-component (212) and electrically connected (244) to each other within the first intermediate unit (236), and / or the second processor element (220) and the second optical interface element (222) are arranged on a second intermediate unit (238) of the second micro-component (218) and electrically connected to each other within the second intermediate unit (238).

9. Optical system according to any of Claims 1 to 8, wherein the first and second optical interface elements (216, 222) are optically connected to each other by means of one or more optical waveguides (208).

10. Optical system according to Claim 9, wherein the one or more optical waveguides (208) comprise a polymer-based optical waveguide.Carl Zeiss SMT GmbH3211. Optical system according to any of Claims 1 to 10, comprising a plurality of the actuator / sensor devices (404), wherein the interface device (206) is optically connected to each of the plurality of actuator / sensor devices (404) with the aid of a respective optical waveguide (408a-408c).

12. Optical system according to any of Claims 1 to 10, comprising a plurality of the actuator / sensor devices (504) and a forwarding device (524), wherein the forwarding device (524) comprises a third micro-component (526) having a third processor element (528) and a third optical interface element (530) integrated therewith, the interface device (206) is optically connected to the forwarding device (524) with the aid of an optical waveguide (508a), and the forwarding device (524) is optically connected to each of the plurality of actuator / sensor devices (504) with the aid of a respective optical waveguide (508b-508d).

13. Optical system according to any of Claims 1 to 10, comprising a plurality of the actuator / sensor devices (604) and at least one forwarding device (624, 624') having a third micro-component (626, 626') that comprises a third processor element (628, 628') and a third optical interface element (630, 630') integrated therewith, wherein the interface device (206), the at least one forwarding device (624, 624') and the plurality of actuator / sensor devices (604) are optically connected to one another with the aid of multiple optical waveguides (608a-608h), in such a way that there are at least two mutually independent optical transmission paths (W 1, W2) between the interface device (206) and each of the plurality of actuator / sensor devices (604).

14. Arrangement (100) for a lithography apparatus (1), comprising an optical system (200) according to any of Claims 1 to 13 and a controller (300) arranged in a greyroom or in a cleanroom (R), wherein the interface device (206) of the optical system (200) and the controller (300) are connected for data transmission purposes by means of an electrical and / or optical line (210).

15. Lithography apparatus (1) having an optical system (200) according to any of Claims 1 to 13 and / or an arrangement (100) according to Claim 14.

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