Unit for a power converter

Abstract

The invention relates to a unit for a power converter, wherein the unit comprises an at least substantially cuboidal heat sink having end faces, longitudinal sides and top and bottom sides, a plurality of power semiconductor modules which are arranged on the top side of the heat sink and are each designed as a half bridge, wherein module housings of the power semiconductor modules are mechanically and thermally connected to the heat sink, and wherein the module housings each have DC voltage terminals and AC voltage terminals on their top side, and first busbars which connect the DC voltage terminals of the power semiconductor modules to one another and form DC voltage terminals of the unit for connecting the unit to a DC voltage intermediate circuit of the power converter, wherein the DC voltage terminals of the unit are arranged in a region of at least one of the longitudinal sides of the heat sink, and wherein a plane for the connection thereof to the DC voltage intermediate circuit is oriented perpendicularly to the plane of the top side and the longitudinal side of the heat sink, or perpendicularly to the plane of the top side and parallel to the plane of the longitudinal sides of the heat sink, or parallel to the plane of the top side and perpendicularly to the plane of the longitudinal sides of the heat sink.

Description

[0001] 202417578 Late registration version

[0002] 1

[0003] Description

[0004] Component for a power converter

[0005] The invention relates to a component for a power converter, a power converter comprising at least one component according to the invention, and a vehicle, in particular a rail vehicle, comprising at least one power converter according to the invention.

[0006] German patent application DE 102021 203 996 A1 discloses a circuit arrangement for a power converter in which half-bridge modules, each with a capacitor, are connected via busbars, with a resistor being arranged in at least one of the busbars. At least three circuit arrangements can be mounted on a common heat sink, and the DC terminals of the half-bridge modules can be connected to a DC link of the power converter. The capacitors connected to the half-bridge modules are each part of a distributed DC link capacitor of the power converter.

[0007] The object of the invention is to provide an integration of such a circuit arrangement into a component of a power converter. This object is achieved by the respective features of the independent claims. Further developments are specified in the respective dependent claims.

[0008] A component according to the invention for a power converter comprises a heat sink that is at least substantially cuboid in shape, having end faces, longitudinal sides, and top and bottom surfaces; a plurality of power semiconductor modules arranged on the top surface of the heat sink, each configured as a half-bridge, wherein the module housings of the power semiconductor modules are mechanically and thermally connected to the heat sink, and wherein the module housings each have DC and AC terminals on their top surface; and first busbars that connect the DC terminals of the power semiconductor modules to each other and form DC terminals of the component for connecting the component to a DC link of the power converter, wherein the DC terminals of the component are arranged in a region of at least one of the longitudinal sides of the heat sink.and wherein a plane for their connection with the DC intermediate circuit is perpendicular to the plane of the top and the longitudinal side of the heat sink, or perpendicular to the plane of the top and parallel to the 202417578 subsequent application version,

[0009] 2

[0010] The plane of the longitudinal side of the heat sink is aligned, or parallel to the plane of the top and perpendicular to the plane of the longitudinal sides of the heat sink.

[0011] A substantially cuboid shape of the heat sink is particularly present if, for example, it has a smaller width in one or more specific areas of the longitudinal sides, whereby the basic width of the heat sink is limited by the two longitudinal sides.

[0012] According to a first further development of the component according to the invention, this comprises a plurality of capacitors arranged in the region of a first end face of the heat sink, wherein the capacitors each have terminals which are arranged in a plane perpendicular to the plane of the DC terminals of the power semiconductor modules, wherein the terminals of the capacitors are connected to the DC terminals of the power semiconductor modules, and wherein the capacitors each form part of a distributedly arranged intermediate circuit capacitor of a DC intermediate circuit of the power converter.

[0013] Following a further development of the inventive component based on the first further development, the first busbars additionally connect the DC voltage connections of the power semiconductor modules to the connections of the capacitors.

[0014] This results in both the respective DC voltage connections of the power semiconductor modules and the connections of the capacitors being electrically connected in parallel.

[0015] According to an alternative further development of the inventive component based on the first further development, this component comprises a second busbar, each of which connects at least one of the terminals of one of the capacitors to one of the DC terminals of one of the power semiconductor modules.

[0016] According to this further development, individual second busbars are arranged between the DC voltage terminals of the respective power semiconductor module and the terminals of the capacitor, which is exclusively assigned to this power semiconductor module. 202417578 Subsequent registration version

[0017] 3

[0018] According to a further development based on the above further development, at least one resistor electrically connected in series with the capacitor is arranged in each of the second busbars, or the second busbars are each connected with at least one resistor which is electrically connected in series with the capacitor.

[0019] Such a resistor, electrically connected in series with the respective capacitor, can be designed in particular according to a resistor described in the aforementioned German patent application DE 10 2021 203 996 A1. Such a resistor is not part of a snubber circuit consisting of a series connection of a snubber capacitor and a resistor. Accordingly, the capacitors of the component are also not snubber capacitors, but rather part of the intermediate circuit capacitor distributed across one or more components.

[0020] According to a further development of the component according to the invention, it comprises a holding device for the mechanical fastening of the capacitors, wherein the holding device is arranged in particular in the area of ​​a first end face of the heat sink, is mechanically and in particular thermally connected to the heat sink, and in particular has the same width as the heat sink in the plane of the heat sink.

[0021] Such a mounting device specifically for attaching capacitors can, for example, be manufactured as an extruded profile from the same material, such as aluminum, as the heat sink. The shape of the mounting device is preferably adapted to the shape of the capacitors. If the capacitors have a cylindrical shape, for example, the mounting device can encompass at least part of the capacitor's casing. Alternatively, the capacitors can also have a cuboid shape, to which the mounting device can be adapted in the same way.

[0022] According to a further development of the component according to the invention, the DC voltage connections of the component project in a direction perpendicular to the plane of the longitudinal side of the heat sink beyond the capacitor and / or the holding device arranged in the area of ​​the longitudinal side.

[0023] According to a further development of the component according to the invention, AC voltage connections of the power semiconductor modules are each arranged in the area of ​​the second end face of the heat sink, wherein the AC voltage connections each have a 202417578 Subsequent application version

[0024] 4

[0025] form an AC voltage connection of the module or can be connected to third busbars, each of which forms an AC voltage connection of the module.

[0026] According to a further development of the component according to the invention, it further comprises a control device which is arranged above the power semiconductor modules and in a plane parallel to the top of the heat sink, wherein the control device is designed to control the power semiconductor modules.

[0027] In a further development of the component according to the invention, this component further comprises: a plurality of further power semiconductor modules arranged on the underside of the heat sink, each of which is designed as a half-bridge, wherein the module housings of the further power semiconductor modules are mechanically and thermally connected to the heat sink, and wherein the module housings each have DC voltage connections and AC voltage connections on their upper side, and further first busbars which connect the DC voltage connections of the further

[0028] Connect power semiconductor modules together and form additional DC connections of the component for connecting the component to the

[0029] DC link of the converter, wherein the further DC connections of the component are arranged in a region of at least one of the longitudinal sides of the heat sink, wherein a plane for their connection to the DC link is oriented perpendicular to the plane of the top and the longitudinal side of the heat sink, or perpendicular to the plane of the top and parallel to the plane of the longitudinal side of the heat sink, or parallel to the plane of the top and perpendicular to the plane of the longitudinal sides of the heat sink, and wherein the further DC connections and the DC connections of the component are arranged in particular in the region of the same longitudinal side of the heat sink.

[0030] According to a further embodiment of the component according to the invention based on the foregoing embodiment, the component further comprises a plurality of further capacitors arranged in the region of a first end face of the heat sink, wherein the further capacitors each have terminals which are arranged in a plane perpendicular to the plane of the DC terminals of the further power semiconductor modules, wherein the terminals of the further capacitors are connected to the DC terminals of the further power semiconductor modules, and wherein the further capacitors each form part of the distributedly arranged DC link capacitor of the DC link of the converter, and / or connect the further 202417578 Subsequent application version

[0031] 5. The first busbars additionally connect the DC terminals of the further power semiconductor modules to the terminals of the further capacitors, and / or the component further comprises further second busbars, each of which connects the terminals of one of the further capacitors to the DC terminals of one of the further power semiconductor modules, and / or at least one resistor connected in series with the further capacitor is arranged in each of the further second busbars, or the further second busbars are each connected to at least one resistor which is connected in series with the further capacitor, and / or the further capacitors are arranged on the holding device, and / or the further DC terminals of the component project in a direction perpendicular to the plane of the longitudinal side of the heat sink.beyond the additional capacitor arranged in the area of ​​the longitudinal side and / or the holding device, wherein the additional DC voltage connections are arranged in particular in the area of ​​the same longitudinal side of the heat sink as the DC voltage connections, and / or AC voltage connections of the additional power semiconductor modules are each arranged in the area of ​​the second end face of the heat sink, wherein the AC voltage connections each form a further AC voltage connection of the component or can be connected to further third busbars, which each form a further AC voltage connection of the component, and / or the component includes a further control device which is arranged above the additional power semiconductor modules and in a plane parallel to the underside of the heat sink, wherein the further control device is configured to control the additional power semiconductor modules.

[0032] As an alternative to the design of the last feature of this further training, the control device can be additionally designed to also control the other power semiconductor modules.

[0033] According to a further development of the component according to the invention, the heat sink has at least one cooling channel, wherein connections for a connection with the at least one cooling channel are arranged in the area of ​​the second and / or the first end face of the heat sink.

[0034] The cooling channel can be designed as part of a cooling circuit for the power converter. The connections can be located, for example, directly on the respective end face, or alternatively, on the top or bottom of the heat sink. Furthermore, the heat sink can have a greater height in the area of ​​the connections, for example, as shown in the subsequent filing.

[0035] 6. The basic height of the heat sink is limited by the top and bottom surfaces of the heat sink.

[0036] A power converter according to the invention, which is designed in particular for an electric drive system of a vehicle, comprises at least one component according to the invention.

[0037] According to a further development of the power converter according to the invention, it further comprises a cuboid housing with end faces, longitudinal sides, and top and bottom surfaces, wherein the at least one component can be arranged in an interior space of the housing, and fourth busbars arranged in the area of ​​the top and / or bottom surface of the interior space, wherein the fourth busbars form a DC link of the power converter, and wherein the fourth busbars each form connections or are connected to connections which can be connected to the DC connections and in particular to the further DC connections of the at least one component.

[0038] The fourth busbars primarily serve as a central DC link busbar, to which modules and other components of the power converter can be connected. A mechanical, and therefore electrical, connection between the module's DC terminals and the DC link terminals is achieved, for example, by means of screw and / or clamp connections.

[0039] If the converter is designed as a traction converter for a rail vehicle, a nominal voltage of between 1,500 V and 3,600 V inclusive is present on the third conductor rails during operation of the converter.

[0040] According to a further embodiment of the power converter according to the invention based on the above embodiment, it further comprises guide rails arranged in the area of ​​the top and / or the bottom of the interior, wherein the heat sink and / or the holding device of the at least one component, in particular from an end face of the housing, can be inserted into the guide rails.

[0041] The guide rails are arranged, for example, below and above the fourth busbars, respectively, and are electrically insulated from them. Preferably, the guide rails are made of a plastic material. 202417578 Subsequent application version

[0042] 7

[0043] For mounting the component inside the converter housing, the housing has, for example, one or more maintenance hatches on one of the end faces or one of the long sides. Preferably, the height and width of the opening in the housing closed by the maintenance hatch are sufficient to allow complete removal of the component from the converter housing. Side maintenance hatches are particularly advantageous if the converter housing is located, for example, in an underfloor area of ​​a rail vehicle's car body.

[0044] A vehicle according to the invention comprises at least one power converter according to the invention, wherein the vehicle is in particular designed as a rail vehicle.

[0045] The power converter is preferably designed as a traction power converter for a multiple unit train for local, regional or long-distance transport or a locomotive.

[0046] The invention is explained in more detail below using exemplary embodiments. These include:

[0047] FIG 1 shows a rail vehicle with an electric drive system whose converter comprises components according to the invention,

[0048] FIG 2 shows a module with single-sided components in various views, FIG 3 shows the module of FIG 2 with a control device,

[0049] FIG 4 shows a component with a series resistor in a second busbar,

[0050] FIG 5 shows a component with a discrete series resistor in a second

[0051] busbar

[0052] FIG 6 shows a module with double-sided components in different views, FIG 7 shows the module of FIG 7 with an additional control device, FIG 8 shows a circuit diagram of the double-sided module,

[0053] FIG 9 possible parallel connections of the AC voltage terminals of single-sided and double-sided components,

[0054] FIG 10 a drive system with two building blocks,

[0055] FIG 11 shows a power converter housing with two components arranged inside it,

[0056] FIG 12 shows a detailed view of the building blocks FIG 11, and

[0057] FIG 13 Building blocks corresponding to FIG 12 with alternatively configured DC connections. 202417578 Subsequent filing version

[0058] 8

[0059] FIG 1 schematically shows an exemplary side view of a rail vehicle TZ configured as a multiple unit for passenger transport. The rail vehicle TZ comprises several coupled cars, of which only one end car EW and a first intermediate car MW coupled to it are shown. The cars EW and MW each have a passenger compartment (not shown) in their respective car bodies WK, which is accessible to passengers both via doors in the side walls of the respective car and via a gangway between adjacent cars. The car bodies WK are supported, by way of example, by two bogies each on the track of a rail network (not shown), with the bogies of the end car EW each being designed as powered bogies TDG with drive motors AM of the drive system AS arranged within them, each driving one wheelset.The bogies of the intermediate car MW, however, are designed as unpowered running bogies LDG.

[0060] The AS drive system of the rail vehicle TZ comprises, in addition to the AM drive motors in the TDG bogies, further components which are shown schematically in the end car EW, but are preferably arranged in respective containers in the roof and underfloor areas of the end car EW in order to provide a passenger compartment in this car as well. The AS drive system is supplied with electrical energy by an overhead line (not shown) of an electrical supply network, to which a supply voltage, for example a single-phase AC voltage of 25 kV at 50 Hz or 15 kV at 16.7 Hz, is applied. A pantograph PAN is arranged in the roof area of ​​the end car EW for an electrical connection between the AS drive system and the overhead line.

[0061] The electrical energy from the supply network is fed to a transformer TF of the drive system AS, which transforms the single-phase AC voltage on the primary side of the supply network into a single-phase AC voltage with a lower voltage level on the secondary side. A power converter SR is connected to the secondary side of the transformer TF, which converts the single-phase AC voltage into a DC voltage of a DC link using a rectifier GR, for example, a four-quadrant converter. Two inverters WR, for example, pulse inverters, of the power converter SR are connected to the DC link, each converting the DC voltage into a three-phase AC voltage of variable voltage level and frequency, which supplies the drive motors AM in the traction bogies TDG. (202417578 Subsequent Registration Version)

[0062] 9

[0063] Drive motors AM, for example, are designed as three-phase asynchronous motors. Both the rectifier GR and the inverters WR are designed as individual modules of the power converter SR. The function of these modules is controlled, in particular, by a central control unit ST connected to the power converter SR, for example, a drive control unit, of the rail vehicle TZ. In addition to the drive system AS shown as an example, the rail vehicle TZ can, depending on the required drive power, include other corresponding drive systems, the components of which are arranged in or on other cars of the rail vehicle TZ.

[0064] Alternatively or additionally, the DC link can also be connected to a supply network carrying a DC voltage via a line choke and / or an input filter.

[0065] FIG 2 shows a component BS according to the invention in a schematic side view (top), a top view (below), and a front view (left). The component BS comprises a largely cuboid-shaped heat sink KK, which has a specific length in the direction of the Y-axis of the specified coordinate system, a specific width in the direction of the X-axis, and a specific height in the direction of the Z-axis. The heat sink KK thus has dimensions in a length limited by the two end faces STS1 and STS2, a width limited by the two longitudinal sides LS, and a height limited by the top and bottom surfaces OS and US. The heat sink KK has essentially planar top and bottom surfaces OS and US, and at least one cooling channel inside it, through which a coolant from a cooling circuit, for example, of a cooling system of the power converter SR, flows.The heat sink KK has connections AKK on its left end face STS for connection to the cooling system. These connections are designed as inlets and outlets, through which the coolant is supplied and discharged, as indicated by the directional arrows. In the area of ​​these connections AKK, or inlets and outlets, the heat sink KK may, for example, have a greater height (not shown in detail). Alternatively, the connections AKK may also be located on the top surface OS or the bottom surface US of the heat sink KK. Furthermore, in addition to or as an alternative to the connections AKK on the second (left) end face STS2, additional connections of the cooling channel or a further cooling channel may be provided on the first (right) end face STS1. Therefore, these are shown only as dashed lines in FIG. 2 and other figures.

[0066] The LHM power semiconductor modules are each configured as a half-bridge with either an IGBT (Insulated-Gate Bipolar Transistor) based on silicon (Si) or a MOSFET (Metal Oxide Semiconductor Field-Effect Transistor), particularly based on silicon carbide (SiC) 202417578 Subsequent application version

[0067] The device is designed with 10 implemented power semiconductor switches. Three power semiconductor modules LHM are arranged side by side on the top surface OS of the heat sink KK, with the undersides of the housings of the power semiconductor modules LHM being thermally connected to the heat sink KK, so that heat generated during operation of the component BS can be dissipated into the heat sink and from there into the coolant.

[0068] The upper surfaces of the LHM power semiconductor module housings feature AC voltage connections AAC 1 to 3 tildes, DC voltage connections ADO 1+, 1- to 3+, 3-, and control connections (not shown) via which the function of the LHM power semiconductor modules is controlled by the ST control unit. The AC voltage connections AAC are connected to a third busbar SS3, which is configured as AC voltage connections AC1, AC2, AC3 of the BS module in the area of ​​the second left end face STS2 of the heat sink KK. In the area of ​​the second left end face STS2 of the heat sink KK, the third busbars SS3 can be additionally supported or mechanically fastened to a support device SV made of an electrically insulating material, such as plastic.

[0069] The DC terminals of the three power semiconductor modules LHM are connected to the respective DC terminals C1-, C1+, O2-, C2+, C3-, C3+ of three capacitors KON via first bus bars SS1, which electrically connect the respective voltage potentials of the power semiconductor modules LHM and the capacitors KON in parallel. The capacitors KON are designed as cylindrical capacitors, arranged above or in the plane of the heat sink, with their terminals O1-, C1+, O2-, C2+, C3-, C3+ facing the power semiconductor modules LHM. In order to achieve the lowest possible inductive connection between the terminals ACC of the power semiconductor modules LHM and the DC terminals 01-, C1+, 02-, C2+, 03-, 03+ of the capacitors KON, the first busbars SS1 for the two DC potentials are preferably routed parallel to each other over a large area and at a small distance.Since a connection plane, drawn from the X and Z axes, of the DC voltage terminals 01-, C1+, 02-, C2+, 03-, 03+ of the capacitors KON is thus perpendicular to a connection plane, drawn from the X and Y axes, of the DC voltage terminals ADO 1 tilde to 3 tilde of the power semiconductor modules LHM, the first busbars SS1 have an angle, in particular a right angle, as illustrated by the upper side view of FIG. 2. The first busbars SS1 thus have a first region which lies in a plane parallel to the surface of the 202417578 subsequent application version.

[0070] 11

[0071] The heat sink (KK) is guided, as well as a second area which is guided perpendicular to this plane.

[0072] In the vertical second section, the first busbars SS1 have a greater width along the X-axis than the heat sink KK, meaning they extend beyond the longitudinal side LS of the heat sink KK by a specific length. In these overhanging sections, the first busbars SS1 form DC terminals Zko+ and Zko- of the module BS, through which it is electrically connected to corresponding terminals of the DC link of the converter SR.

[0073] As an alternative to the representation in FIG 2, in which the DC voltage connections of the component BS are arranged in the area of ​​both longitudinal sides LS of the heat sink KK, the DC voltage connections can also be arranged only in the area of ​​one of the two longitudinal sides LS of the heat sink KK.

[0074] As shown in FIG. 2, the capacitors KON are arranged on the top surface OS of the heat sink KK. As an alternative to the illustrated configuration, in which the length of the heat sink KK, viewed along the Y-axis, also completely encompasses the capacitors KON, a separate holding device for the capacitors KON can be provided, which is mechanically and preferably additionally thermally connected to the heat sink KK. In this case, the first right end face STS1 of the heat sink KK, again viewed along the Y-axis, can be located, for example, in the area of ​​the DC voltage terminals C1-, C1+, C2-, C2+, C3-, C3+ of the capacitors KON. Since the capacitors KON are exposed to the elements during the operation of the module BS, respectively, the capacitors KON can be held in place by a separate holding device for the capacitors KON.Since the power converter SR exhibits significantly less heat generation than the power semiconductor modules LHM, direct heat dissipation from the capacitor housing to the heat sink KK may not be strictly necessary. Instead, indirect heat dissipation from the mounting device to the thermally connected heat sink KK may suffice. Such a mounting device, not shown in detail, could, for example, be manufactured as an extruded profile, allowing its shape to be easily adapted to the housing shape of the capacitors KON. The exemplary cylindrical housings of the capacitors KON could, for example, be at least partially enclosed by the mounting device. Both the heat sink KK and such a mounting device are, for example, made of aluminum. 202417578 Subsequent filing version.

[0075] 12

[0076] FIG. 3 shows the component BS of FIG. 2 in an upper schematic side view with a control unit SE additionally arranged above the power semiconductor modules LHM, which controls the function or switching of the power semiconductor switches of the half-bridges of the power semiconductor modules LHM. The control unit SE is connected to control terminals of the power semiconductor modules LHM via electrical or optical control lines (not shown).

[0077] FIG. 4 shows a component BS according to the invention, again in a schematic side view. In this component BS, the DC terminals ADC of the respective power semiconductor module LHM are connected via second busbars SS2 to DC terminals C of the respective associated capacitor KON, while first busbars SS1, corresponding to the first busbars SS1 of the component BS in FIG. 2, connect the DC terminals ADC of all power semiconductor modules LHM and form the DC terminals DC of the component BS. In at least one of the second busbars SS2, a resistor R or damping resistor is arranged in series with the capacitor KON, wherein the resistor R can, for example, be designed as an integral part of the busbar SS2, which has a smaller cross-section and / or is made of a different material than the busbar.In order to dissipate heat generated in the resistor R during the operation of the component BS, it is thermally connected to the heat sink KK, as schematically indicated in FIG 4.

[0078] FIG 5 shows an alternative embodiment of the component BS of FIG 4, wherein instead of at least one resistor R in one of the two second current rails SS2 for the two voltage potentials, where the two second current rails SS2 connect the DC terminals ADC of one of the power semiconductor modules LHM to DC terminals C of the respective associated capacitor KON, only the second current rail SS2 of one of the two voltage potentials is connected to a discrete resistor R. This one second current rail SS2 is, by way of example, connected to one of the first current rails SS1 of the same voltage potential and to one DC terminal C of the capacitor KON. The other DC terminal C of the capacitor KON, however, is connected to the other of the first current rails SS1.One underside of the resistor R, designed as an example discrete component, is thermally connected to the heat sink KK and has terminals on one top side to which connection areas of the second bus bar SS2 are connected. Such a resistor R can, for example, be designed according to the 202417578 supplementary application.

[0079] 13

[0080] The configuration shown in FIG. 4 can be assigned to a respective capacitor KON, or alternatively to all three capacitors KON of the component BS.

[0081] FIG 6 shows a further embodiment of the component BS according to the invention in a schematic side view (right) and a front view (left). In addition to the component BS of FIG. 2, this component comprises three further power semiconductor modules LMH, three further capacitors KOM, and further first and third busbars SS1, SS3, which are arranged on the underside US of the heat sink KK. The further first busbars SS1 also have a greater width in the X-direction than the heat sink KK in the vertical second region and thus also project beyond the longitudinal side LS by a certain length. In these projecting regions, the lower first busbars SS1 form lower DC terminals DC Zku+, Zku- of the component BS, via which it is electrically connected to corresponding terminals of the DC link of the converter SR.

[0082] According to the design of FIG. 2, as an alternative to the representation of FIG. 4, the respective upper and lower DC voltage connections DC Zko+, Zko- or Zku+, Zku- can also be arranged only in the area of ​​one of the two longitudinal sides LS of the heat sink KK.

[0083] FIG 7 shows the component BS of FIG 6 with a control unit SE and another control unit SE, wherein the other control unit SE controls the function or switching of the further power semiconductor switches of the half-bridges of the further power semiconductor modules LHM arranged on the underside US of the heat sink KK via control lines not specifically shown.

[0084] As an alternative to the configuration shown in FIG 7, both the power semiconductor modules LHM on the top OS and the power semiconductor modules LMH on the bottom US of the heat sink KK can be controlled by a common control unit SE.

[0085] FIG. 8 shows the electrical circuit of component BS of FIG. 6, wherein, corresponding to component BS of FIG. 4, a resistor R1-R6 is arranged between a DC voltage terminal of a respective power semiconductor module LHM and a DC voltage terminal of the respective associated capacitor C1-C6. The power semiconductor modules LHM are each configured as a half-bridge with two power semiconductor switches HL1-HL12. 202417578 Subsequent filing version

[0086] 14

[0087] FIG. 9 shows the various possibilities for parallel connection of the three AC voltage terminals AC1-AC3 of the component BS of FIG. 2 with single-sided mounting of the heatsink KK, and the six AC voltage terminals AC1-AC6 of the component BS of FIG. 6 with double-sided mounting. The AC voltage terminals AC1-AC3 marked "top" are assigned to the power semiconductor modules LHM located on the top OS of the heatsink KK, and the AC voltage terminals AC4-AC6 marked "bottom" are assigned to the power semiconductor modules LHM located on the bottom US of the heatsink KK. In particular, the specific parallel connection can be selected depending on the desired power output of the component and its function in the power converter. The parallel connection can be implemented, for example, by means of an additional busbar that connects the AC voltage terminals to be connected in parallel.

[0088] FIG. 10 schematically shows the drive system AS of the rail vehicle TZ of FIG. 1, with only two modules BS depicted. The modules BS are part of the converter SR, indicated by a dashed line, and are each configured as a double-sided module BS according to FIG. 6 or 7, respectively, and may, in particular, include damping resistors R according to FIG. 4, 5, or 8. The left module BS is connected to a secondary winding of the transformer TF, with the AC voltage terminals AC1-AC6 of the module BS being connected in parallel such that one voltage potential of the secondary winding is connected to the terminals AC1, AC2, and AC3 on the top OS of the heat sink KK, while the other voltage potential of the secondary winding is connected to the terminals AC4, AC5, and AC6 on the bottom US of the heat sink KK.This parallel connection of the AC voltage terminals is not specifically shown in FIG. 9, but corresponds on both sides to the triple parallel connection of a single-sided component BS. The left-hand component performs the function of a rectifier GR, for example a four-quadrant converter, which converts the input single-phase AC voltage into a DC voltage. The DC voltage terminals DC ZKo+, ZKo-, ZKu+, ZKu- on the top and bottom sides of the component BS are connected to the two DC voltage potentials +, - of a DC link rail ZKSC of the DC link of the converter SR.

[0089] The right-hand component BS of the power converter SR, on the other hand, performs the function of an inverter WR, for example a pulse inverter, which converts the DC voltage of the intermediate circuit rail ZKSC at the DC voltage connections DC ZKo+, ZKo-, ZKu+, ZKu- of the component BS into a three-phase AC voltage of variable voltage level and 202417578 Subsequent registration version

[0090] 15

[0091] Frequency conversion, with which an exemplary drive motor AM in one of the traction bogies TDG of the rail vehicle TZ is supplied. Motor cables for the three phases of the three-phase machine are each connected to two AC voltage connections AC AC1 and AC2, AC3 and AC4, and AC5 and AC6, respectively. A parallel connection of the AC voltage connections of the right-hand module BS is thus made according to the third parallel connection in FIG. 9 in the case of double-sided assembly.

[0092] As indicated by the dotted DC potentials of the intermediate circuit rail ZKSC, the converter SR of the drive system AS includes further components BS not specifically shown, for example another inverter WR, which is also supplied via the DC intermediate circuit of the converter SR from the left component BS or from the rectifier GR.

[0093] FIG 11 schematically shows a converter housing SRG, or converter container, in a perspective view. The converter housing SRG is designed as an example for installation in the underfloor area of ​​a vehicle, for example, the end car ES of the rail vehicle TZ. The interior of the converter housing SRG is accessible from one end, for example, via a maintenance hatch (not shown), and thus from one side of the vehicle. In the upper area, or ceiling area, of the interior of the converter housing SRG, the fourth busbar, or the DC link rail ZKSC of the DC link of the converter SR, is arranged along the Z-axis. After the respective module BS is inserted into the converter housing SRG, the DC terminals DC, located on one longitudinal side LS of the heat sink KK of the module BS, are connected to the two DC potentials of the DC link rail ZKSC.For this purpose, the fourth busbars form respective DC voltage connections which are compatible with the DC voltage connections DC ZKo+ / -, ZKu+ / - of the BS modules. Corresponding fourth busbars, or an additional DC link busbar of the converter SR (not specifically shown), can also be arranged in the lower area or bottom area of ​​the interior of the converter housing SR, to which further DC voltage connections of the BS modules located on the other longitudinal side LS of the heat sink KK can be connected.

[0094] Below the upper intermediate circuit rail ZKSC and above a lower intermediate circuit rail or in the floor area of ​​the interior of the converter housing SRG 202417578 Subsequent registration version

[0095] Sixteen guide rails (FS) are arranged to guide the modules (BS) within the converter housing (SRG). The guide rails (FS) are electrically insulated from the intermediate circuit rails (ZKSC) and are made of a plastic material, for example. They generally lack sufficient mechanical strength for permanently securing the modules (FS) within the converter housing (SRG). Such securing can be achieved, for example, by means of centering pins located on the first end face (STS1) of the cooling plate (KK) or by means of a holder for the capacitors (KON) of the module (BS) located in this area. When the module (BS) is inserted into the converter housing (SRG), the centering pins engage with corresponding receptacles on the rear side of the interior of the converter housing (SRG), creating a stable mechanical connection.The guide rails FS are arranged, for example, parallel to each other and at a specific distance in the Z-direction, in order to achieve a compact design of the power converter SR on the one hand, and on the other hand to ensure sufficient space between adjacent modules BS, particularly for air circulation. The modules BS each have a housing, which may be multi-part and may include openings.

[0096] The BS modules are inserted into the interior of the converter housing SRG through the open end face and along the Y-axis using the guide rails FS, as illustrated by the arrow indicating the insertion direction ESR. The BS modules are oriented as shown on the left in FIG. 6, so that sections of the longitudinal sides LS of the heat sink KK of the respective BS module, as well as any capacitor retaining device KON connected to the heat sink KK, are guided in the upper and lower guide rails FS.

[0097] The AC terminals of the respective module BS are located in the area of ​​the opening of the converter housing STG or the second end face STS2 of the heat sink KK. As shown in FIG. 10, the AC terminals of the left module BS, shown in FIG. 11, are connected to a secondary winding of the transformer TS of the drive system AS, while the AC terminals of the right module BS are connected to motor cables for a drive motor AM.

[0098] FIG. 12, supplementing FIG. 11, shows a detailed view of the connection of the DC voltage terminals of the upper and lower sides of the component BS with corresponding DC voltage terminals of the intermediate circuit rail ZKSC of the DC link of the drive system AS. This illustration clarifies 202417578 Subsequent filing version

[0099] Figure 17 again states that the DC voltage connections of the respective module BS extend laterally or in the X-direction beyond the heat sink KK. The mechanical and electrical connection of the DC voltage connections is made, for example, by means of screw connections (not shown in detail), with the screw axis aligned in the direction of the Y-axis. Alternatively, clamp connections, for example using plug-in terminals, can also be provided, as shown by way of example in FIG. 13. The connection areas of the DC voltage connections of the modules are aligned in the direction of the Y-axis and each contact appropriately designed spring clamps of the DC link bus for the two voltage potentials of the DC link of the drive system AS.

[0100] 202417578 Late registration version

[0101] 18

[0102] Reference symbol list

[0103] AAC - AC terminals (power semiconductor module)

[0104] AC, AC1, AC2, AC3 - AC voltage connection (component) ADC - DC voltage connections (power semiconductor module) AKK - Connections cooling channel

[0105] AM - Drive motor

[0106] AS - Drive system

[0107] BS - Building block

[0108] C, C1, C2, C3 - DC terminals of capacitor

[0109] DC - Direct current connection (module)

[0110] ESR - insertion direction

[0111] EW - Endwagen

[0112] FS - Guide rail

[0113] GR - Rectifier

[0114] HL1-HL12 - Power semiconductor switches

[0115] KK - Heat sink

[0116] KON - Capacitor

[0117] LDG - Running bogie

[0118] LHM - Power Semiconductor Module

[0119] LS - Long side

[0120] MW - Center car

[0121] OS - Top

[0122] PAN - current collector

[0123] R - Resistance

[0124] SE - Control unit (module)

[0125] SR - Power converter

[0126] SRG - Power converter housing

[0127] SS1, SS2, SS3 - busbar (first, second, third)

[0128] ST - Control unit (drive system)

[0129] STS1 , STS2 - Front side (first, second)

[0130] SV - Support device

[0131] TDG - Drive bogie

[0132] TF - Transformer

[0133] TZ - Rail vehicle

[0134] US - Subpage 202417578 Post-registration version

[0135] WK - Car body

[0136] WR - Inverter

[0137] X, Y, Z - axes of a coordinate system

[0138] ZKSC - fourth rail, intermediate circuit rail

Claims

202417578 Late registration version 20 Patent claims 1. Component (PC) for a power converter (PC), comprising: - a heat sink (CC) that is at least essentially cuboid in shape, with end faces (STS1, STS2), long sides (LS), and top and bottom faces (OS, US), - a plurality of power semiconductor modules (LHM) arranged on the top side (OS) of the heat sink (KK), each configured as a half-bridge, wherein the module housings of the power semiconductor modules (LHM) are mechanically and thermally connected to the heat sink (KK), and wherein the module housings each have DC terminals (ADO) and AC terminals (AAC) on their top side, and - first busbars (SS1), which connect the DC terminals (ADO) of the power semiconductor modules (LHM) to each other and form DC terminals (DC) of the component (BS) for connecting the component (BS) to a DC link of the converter (SR), wherein the DC terminals (DC) of the component (BS) are arranged in a region of at least one of the longitudinal sides (LS) of the heat sink (KK), and wherein a plane is provided for their connection to the DC link - each perpendicular to the plane of the top (OS) and the long side (LS) of the heat sink (KK), or - perpendicular to the plane of the top (OS) and parallel to the plane of the long side (LS) of the heat sink (KK), or - is aligned parallel to the plane of the top (OS) and perpendicular to the plane of the long sides (LS) of the heat sink (KK).

2. Component (BS) according to claim 1, further comprising: a plurality of capacitors (KON) arranged in the region of a first end face (STS1) of the heat sink (KK), wherein the capacitors (KON) each have terminals (C) which are arranged in a plane perpendicular to the plane of the DC terminals (ADC) of the power semiconductor modules (LHM), wherein the terminals (C) of the capacitors (KON) are connected to the DC terminals (ADC) of the power semiconductor modules (LHM), and wherein the capacitors (KON) each form part of a distributedly arranged DC link capacitor of a DC link of the power converter (SR).

3. Building block (BS) according to claim 2, wherein 202417578 Late registration version 21. Connect the first busbars (SS1) to the DC connections (ADC) of the power semiconductor modules (LHM) and the connections (C) of the capacitors (KON).

4. Component (BS) according to claim 2, further comprising: second busbars (SS2) which each connect the terminals (C) of one of the capacitors (KON) to the DC terminals (ADC) of one of the power semiconductor modules (LHM).

5. Component (BS) according to claim 4, wherein at least one resistor (R) is arranged in each of the second busbars (SS2) which is electrically connected in series with the capacitor (KON), or the second busbars (SS2) are connected with at least one resistor (R) which is electrically connected in series with the capacitor (KON).

6. Component (BS) according to one of claims 2 to 5, further comprising: a holding device for mechanically fastening the capacitors (KON), wherein the holding device - is located in particular in the area of ​​a first end face (STS1) of the heat sink (KK), - is mechanically and especially thermally connected to the heat sink (HS), and - in particular, in the plane of the heat sink (CC) it has the same width as the heat sink (CC).

7. Component (BS) according to one of claims 2 to 6, wherein the DC voltage terminals (DC) of the component (BS) extend in a direction perpendicular to the plane of the longitudinal side (LS) of the heat sink (KK) beyond the capacitor (KON) arranged in the region of the longitudinal side (LS) and / or the holding device.

8. Component (BS) according to one of the preceding claims, wherein AC voltage connections (AAC) of the power semiconductor modules (LHM) are each arranged in the region of the second end face (STS2) of the heat sink (KK), wherein the AC voltage connections (AAC) each form an AC voltage connection (AC) of the component (BS) or can be connected to third busbars (SS3), each of which forms an AC voltage connection (AC) of the component (BS).

9. Building block (BS) according to any of the preceding claims, further comprising: 202417578 Late registration version 22 a control device (SE) which is arranged above the power semiconductor modules (LHM) and in a plane parallel to the top surface (OS) of the heat sink (KK), wherein the control device (SE) is configured to control the power semiconductor modules (LHM).

10. Building block (BS) according to any of the preceding claims, further comprising: - a plurality of further power semiconductor modules (LHM) arranged on the underside (US) of the heat sink (KK), each configured as a half-bridge, wherein the module housings of the further power semiconductor modules (LHM) are mechanically and thermally connected to the heat sink (KK), and wherein the module housings each have DC terminals (ADO) and AC terminals (AAC) on their upper side, and - further first busbars (SS1) which connect the DC terminals (ADO) of the further power semiconductor modules (LHM) to each other and form further DC terminals (AC) of the component (BS) for a connection of the component (BS) to the DC link of the converter (SR), wherein the further DC terminals (AC) of the component (BS) are arranged in a region of at least one of the longitudinal sides (LS) of the heat sink (KK), wherein a plane for their connection to the DC link - each perpendicular to the plane of the top (OS) and the long side (LS) of the heat sink (KK), or - perpendicular to the plane of the top (OS) and parallel to the plane of the long side (LS) of the heat sink (KK), or - is aligned parallel to the plane of the top (OS) and perpendicular to the plane of the longitudinal sides (LS) of the heat sink (KK), and wherein the further DC voltage connections (DC) and the DC voltage connections (DC) of the component (BS) are arranged particularly in the area of ​​the same longitudinal side (LS) of the heat sink (KK).

11. Building block (BS) according to claim 10, wherein additionally or alternatively - the component (BS) further comprises a plurality of additional capacitors (KON) arranged in the area of ​​a first end face (STS) of the heat sink (KK), wherein the additional capacitors (KON) each have terminals (C) which are arranged in a plane perpendicular to the plane of the DC terminals (ADC) of the additional power semiconductor modules (LMC), wherein the terminals (C) of the additional capacitors (KON) are connected to the DC terminals (ADC) of the additional power semiconductor modules (LHM) 202417578 Late registration version 23 are, and wherein the further capacitors (CON) are each part of the distributed intermediate circuit capacitor of the DC intermediate circuit of the converter (CRC), - connect the additional first busbars (SS1) to the DC connections (ADC) of the additional power semiconductor modules (LHM) and to the connections (C) of the additional capacitors (KON), - the component (BS) further comprises additional second busbars (SS2), each of which connects the terminals (C) of one of the additional capacitors (KON) to the DC terminals (ADC) of one of the additional power semiconductor modules (LHM), - in each of the further second busbars (SS2) at least one resistor (R) is arranged which is electrically connected in series with the further capacitor (KON), or the further second busbars (SS2) are each connected with at least one resistor (R) which is electrically connected in series with the further capacitor (KON), - the other capacitors (CON) are arranged on the holding device, - the additional DC terminals of the component (BS) extend in a direction perpendicular to the plane of the longitudinal side (LS) of the heat sink (KK) beyond the additional capacitor (KON) arranged in the area of ​​the longitudinal side (LS) and / or the holding device, wherein the additional DC terminals are arranged in particular in the area of ​​the same longitudinal side (LS) of the heat sink (KK) as the DC terminals, - AC voltage connections (AAC) of the further power semiconductor modules (LHM) are each arranged in the area of ​​the second end face (STS2) of the heat sink (KK), wherein the AC voltage connections (AAC) each form a further AC voltage connection (AC) of the component (BS) or can be connected to further third busbars (SS3), which each form a further AC voltage connection (AC) of the component (BS), and / or - the component (BS) comprises a further control unit (SE) which is arranged above the further power semiconductor modules (LHM) and in a plane parallel to the underside (US) of the heat sink (KK), wherein the further control unit (SE) is designed to control the further power semiconductor modules (LHM).

12. Component (BS) according to one of the preceding claims, wherein the heat sink (KK) has at least one cooling channel, wherein connections (AKK) for a connection with the at least one cooling channel are arranged in the area of ​​the second (STS2) and / or the first end face (STS1) of the heat sink (KK). 202417578 Late registration version 24 13. Power converter (SR), in particular for an electric drive system (AS) of a vehicle, comprising at least one component (BS) according to one of claims 1 to 12.

14. Power converter (SR) according to claim 13, further comprising: a cuboid housing (SRG) with end faces, longitudinal sides and top and bottom faces, wherein the at least one component (BS) can be arranged in an interior space of the housing (SRG), and fourth busbars (ZKSC) arranged in the area of ​​the top and / or bottom of the interior space, wherein the fourth busbars (ZKSC) form a DC link of the power converter (SR), and wherein the fourth busbars (ZKSC) each form or are connected to terminals which can be connected to the DC terminals and in particular to the further DC terminals (DC) of the at least one component (BS).

15. Power converter (SR) according to claim 14, further comprising: guide rails (FS) arranged in the area of ​​the top and / or the bottom of the interior, wherein the heat sink (KK) and / or the holding device of the at least one component (BS), in particular from an end face of the housing (SRG), can be inserted into the guide rails (FS).

16. Vehicle comprising at least one power converter (SR) according to claim 14 or 15, wherein the vehicle is in particular designed as a rail vehicle (TZ).

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