Electromagnetic wave heating control device, program, and electromagnetic wave heating control method

Abstract

An electromagnetic wave heating control device (100) comprises: a power information acquisition unit (120) that acquires information indicating the magnitude of reflected power from the inside of an electromagnetic wave heating device (50); and a power control unit (150) that controls input power of electromagnetic waves to be inputted to the electromagnetic wave heating device (50). When the reflected power from the inside of the electromagnetic wave heating device (50) reaches a preset threshold value, the power control unit (150) reduces the input power to below the threshold value, and increases the input power over time while maintaining a state in which the reflected power from the inside of the electromagnetic wave heating device (50) is below the threshold value.

Description

Electromagnetic Wave Heating Control Device, Program, and Electromagnetic Wave Heating Control Method

[0001] The present disclosure relates to an electromagnetic wave heating control device, a program, and an electromagnetic wave heating control method.

[0002] Conventionally, a microwave heating device having a variable function of the microwave frequency has been disclosed (see Patent Document 1). The microwave heating device described in Patent Document 1 controls the frequency of the microwave output to the heating chamber so that the reflection amount (reflected power) of the microwave from the heating chamber detected by the power detection unit is minimized, thereby maximizing the heating efficiency of the object to be heated.

[0003] Japanese Patent Application Laid-Open No. 2013-201096

[0004] Generally, in an electromagnetic wave heating device that heats an object to be heated by electromagnetic waves such as microwaves, the reflected power of the reflected wave may change during the heating of the object to be heated. However, the microwave heating device described in Patent Document 1 has a problem that when the reflected power increases, depending on the magnitude of the reflected power, it may be difficult to sufficiently reduce the burden on the device caused by the reflected power even if control is performed by frequency.

[0005] The present disclosure has been made based on the recognition of the above problems, and an object thereof is to provide an electromagnetic wave heating control device, a program, and an electromagnetic wave heating control method capable of suppressing an increase in reflected power.

[0006] The electromagnetic wave heating control device according to the present disclosure includes a power information acquisition unit that acquires information indicating the magnitude of the reflected power from within the electromagnetic wave heating device, and a power control unit that controls the input power of the electromagnetic wave input to the electromagnetic wave heating device. When the reflected power from within the electromagnetic wave heating device reaches a preset threshold value, the power control unit suppresses the input power so that it becomes less than the threshold value, and raises the input power over time while maintaining a state where the reflected power from within the electromagnetic wave heating device is less than the threshold value.

[0007] According to the present disclosure, an increase in reflected power can be suppressed.

[0008] This is a block diagram showing the schematic configuration of an electromagnetic wave heating system according to Embodiment 1. This is a block diagram showing an example of the hardware configuration of an electromagnetic wave heating control device according to Embodiment 1. This is a block diagram showing an example of the hardware configuration of an electromagnetic wave heating control device according to Embodiment 1. This is a flowchart showing an example of the processing performed by an electromagnetic wave heating control device according to Embodiment 1. This is a block diagram showing the schematic configuration of an electromagnetic wave heating system according to Embodiment 2. This is a block diagram showing the schematic configuration of an electromagnetic wave heating system according to Embodiment 3. This is a flowchart showing an example of the processing performed by an electromagnetic wave heating control device according to Embodiment 3. This is a block diagram showing the schematic configuration of an electromagnetic wave heating system according to Embodiment 4. This is a block diagram showing the schematic configuration of an electromagnetic wave heating system according to Embodiment 5. This is a flowchart showing an example of the processing performed by an electromagnetic wave heating control device according to Embodiment 5. This is a block diagram showing the schematic configuration of an electromagnetic wave heating system according to Embodiment 6.

[0009] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. Embodiment 1. First, the electromagnetic wave heating system 1 according to Embodiment 1 will be described with reference to Figure 1. The electromagnetic wave heating system 1 according to Embodiment 1 is a system for heating an object M1 by irradiating the object to be heated M1 in an electromagnetic wave heating device 50 with electromagnetic waves. Figure 1 is a block diagram showing the schematic configuration of the electromagnetic wave heating system 1 according to Embodiment 1. As shown in Figure 1, the electromagnetic wave heating system 1 according to Embodiment 1 comprises an electromagnetic wave generator 10, a power monitor 30, an electromagnetic wave heating device 50, and an electromagnetic wave heating control device 100, which are electrically connected to each other wirelessly or by wire.

[0010] The electromagnetic wave generator 10 generates electromagnetic waves when power is supplied. For example, the electromagnetic wave generator 10 is composed of a magnetron and generates microwaves as electromagnetic waves when power is supplied. Note that the electromagnetic wave generator 10 is not limited to a magnetron, but may also be composed of a signal source such as a digital signal processor (DSP) and an amplifier that amplifies the signal from the signal source. The electromagnetic wave generator 10 outputs the generated electromagnetic waves toward the power monitor 30.

[0011] The power monitor 30 monitors the input power of the traveling wave input from the electromagnetic wave generator 10 to the electromagnetic wave heating device 50, and the reflected power from within the electromagnetic wave heating device 50, and outputs signals corresponding to the input power and signals corresponding to the reflected power to the electromagnetic wave heating control device 100. For example, the power monitor 30 has a current sensor and a voltage sensor (not shown), and generates signals corresponding to the input power and signals corresponding to the reflected power using the current sensor and the voltage sensor.

[0012] The electromagnetic wave heating device 50 includes an antenna 51 and a housing (not shown) that forms a space inside in which the object to be heated M1 can be housed. The antenna 51 transmits electromagnetic waves input from the electromagnetic wave generator 10 via the power monitor 30 as traveling waves (transmitted waves) toward the inside of the housing, and receives reflected waves (received waves) input to the antenna 51 as the electromagnetic waves are reflected within the housing. With this configuration, the electromagnetic wave heating device 50 enables heating of the object to be heated M1 housed inside the electromagnetic wave heating device 50, or drying of the object to be heated M1 by heating it.

[0013] The electromagnetic wave heating control device 100 includes a power information acquisition unit 120, a power control unit 150, and a storage unit 160.

[0014] The power information acquisition unit 120 acquires reflected power information, which is information indicating the magnitude of reflected power from within the electromagnetic wave heating device 50. More specifically, the power information acquisition unit 120 acquires reflected power information, which indicates the magnitude of reflected power from within the electromagnetic wave heating device 50, based on information from a power monitor 30 located on the electromagnetic wave transmission path from the electromagnetic wave generator 10 to the electromagnetic wave heating device 50. In addition to the reflected power information, the power information acquisition unit 120 may also be configured to acquire input power information, which is information indicating the magnitude of the input power input to the electromagnetic wave heating device 50, based on information from the power monitor 30.

[0015] Based on the information acquired by the power information acquisition unit 120, the power control unit 150 controls the input power to the electromagnetic wave heating device 50 so that when the reflected power from within the electromagnetic wave heating device 50 reaches a preset threshold, the input power to the electromagnetic wave heating device 50 is suppressed to be less than the preset threshold. For example, based on the information acquired by the power information acquisition unit 120, the power control unit 150 controls the input power to the electromagnetic wave heating device 50 so that when the reflected power from within the electromagnetic wave heating device 50 reaches a preset threshold that is less than or equal to half of the maximum input power of the electromagnetic waves input to the electromagnetic wave heating device 50, the input power to the electromagnetic wave heating device 50 is suppressed to be less than the preset threshold. Specifically, the preset threshold is set to be between one-tenth and half of the maximum input power of the electromagnetic waves input to the electromagnetic wave heating device 50. The maximum input power of the electromagnetic waves input to the electromagnetic wave heating device 50 may be, for example, the catalog value of the electromagnetic wave generator 10, the measured value when the output of the electromagnetic wave generator 10 is set to maximum, or the theoretical value calculated based on the operating conditions of the electromagnetic wave generator 10.

[0016] Furthermore, the power control unit 150 controls the input power to the electromagnetic wave heating device 50 so as time progresses, while maintaining a state in which the reflected power from within the electromagnetic wave heating device 50 is below the threshold value, when the input power to the electromagnetic wave heating device 50 is suppressed.

[0017] For example, the power control unit 150 controls the input power to the electromagnetic heating device 50 by outputting a signal toward the electromagnetic wave generator 10 to increase or decrease the power supplied to the electromagnetic wave generator 10. Alternatively, for example, the power control unit 150 controls the input power to the electromagnetic heating device 50 by pulse-modulating the electromagnetic waves generated by the electromagnetic wave generator 10. Specifically, the power control unit 150 controls the input power to the electromagnetic heating device 50 by outputting a signal toward the electromagnetic wave generator 10 to pulse-modulate the power supplied to the electromagnetic wave generator 10, which is composed of a magnetron. Alternatively, for example, the power control unit 150 controls the input power to the electromagnetic heating device 50 by reducing the amplitude of the signal from the signal source in the electromagnetic wave generator 10, which has a signal source and an amplifier.

[0018] For example, the power control unit 150 sets an input power coefficient that indicates the degree to which the input power to the electromagnetic wave heating device 50 is suppressed. For example, the input power coefficient is set to 1 in the unsuppressed state where the input power to the electromagnetic wave heating device 50 is not suppressed, and is set to a value less than 1 in the suppressed state where the input power to the electromagnetic wave heating device 50 is suppressed. For example, in the suppressed state, the power control unit 150 controls the input power to the electromagnetic wave heating device 50 so that the input power to the electromagnetic wave heating device 50 is the input power to the electromagnetic wave heating device 50 in the unsuppressed state multiplied by the input power coefficient. The power control unit 150 stores the set input power coefficient in the storage unit 160. Alternatively, the power control unit 150 may be configured to set an input reflection coefficient, which is the ratio of the forward wave to the reflected wave, instead of the input power coefficient, and control the input power to the electromagnetic wave heating device 50 based on the input reflection coefficient.

[0019] The storage unit 160 stores information used in processing performed by the electromagnetic wave heating control device 100, information indicating the results of processing performed by the electromagnetic wave heating control device 100, and information acquired by the electromagnetic wave heating control device 100 from external devices. For example, the storage unit 160 stores various thresholds, various setting values, various parameters, data, and programs as information used when the electromagnetic wave heating control device 100 performs processing. The information stored in the storage unit 160 is referenced and used when the electromagnetic wave heating control device 100 performs processing.

[0020] Next, the hardware configuration of the electromagnetic wave heating control device 100 will be described with reference to Figures 2 and 3. Figure 2 is a diagram showing an example of the hardware configuration of the electromagnetic wave heating control device 100, and Figure 3 is a diagram showing an example of the hardware configuration of the electromagnetic wave heating control device 100 that is different from Figure 2. For example, as shown in Figure 2, the electromagnetic wave heating control device 100 is configured as a computer having a processor 100a, a memory 100b, and an I / O port 100c, and is configured so that the processor 100a reads and executes a program stored in the memory 100b.

[0021] Furthermore, as shown in Figure 3, for example, the electromagnetic wave heating control device 100 is configured as a computer that executes programs, having a processing circuit 100d which is dedicated hardware and an I / O port 100c. The processing circuit 100d is configured to have, for example, a single circuit, a composite circuit, a programmed processor, a parallel programmed processor, an ASIC (Application Specific Integrated Circuit), and an FPGA (Field Programmable Gate Array), or a combination of these. Each function of the electromagnetic wave heating control device 100 is realized by these processors 100a or the processing circuit 100d which is dedicated hardware executing programs. Note that the electromagnetic wave heating control device 100 may also have hardware other than those described above, such as a hardware timer, to achieve the functions of the electromagnetic wave heating control device 100.

[0022] Next, with reference to Figures 1 and 4, the details of the processing performed by the electromagnetic wave heating control device 100 will be described. Figure 4 is a flowchart showing an example of the processing performed by the electromagnetic wave heating control device 100 according to Embodiment 1. As shown in Figure 4, when the electromagnetic wave heating control device 100 starts processing, it first acquires the input power coefficient (step ST05). In this process, the electromagnetic wave heating control device 100 refers to the set value of the input power coefficient stored in the storage unit 160 and acquires the set value of the input power coefficient.

[0023] After performing the processing in step ST05, the electromagnetic wave heating control device 100 controls the input power (step ST06). In this process, the electromagnetic wave heating control device 100 controls the input power to the electromagnetic wave heating device 50 based on the input power coefficient obtained in the processing in step ST05. For example, in this process, if the input power coefficient obtained in the processing in step ST05 is less than 1, the electromagnetic wave heating control device 100 controls the input power to the electromagnetic wave heating device 50 to reduce the input power to the electromagnetic wave heating device 50.

[0024] After performing the process in step ST06, the electromagnetic wave heating control device 100 acquires reflected power information (step ST07). In this process, the electromagnetic wave heating control device 100 acquires reflected power information indicating the magnitude of reflected power from within the electromagnetic wave heating device 50, based on information from the power monitor 30.

[0025] When the electromagnetic wave heating control device 100 performs the processing in step ST07, it determines whether the reflected power is above a threshold value (step ST08). In this process, the electromagnetic wave heating control device 100 refers to the threshold value of the reflected power stored in the storage unit 160 and determines whether the reflected power indicated by the reflected power information obtained in the processing of step ST07 is above the threshold value.

[0026] In step ST08, if the reflected power is above a threshold (YES in step ST08), the electromagnetic wave heating control device 100 sets the input power coefficient to half (step ST09). In other words, in step ST08, if the reflected power is above a threshold, the electromagnetic wave heating control device 100 sets the input power coefficient to 0.5. In this process, the electromagnetic wave heating control device 100 reduces the input power to the electromagnetic wave heating device 50 so that the input power to the electromagnetic wave heating device 50 is below the threshold, based on the fact that the reflected power from inside the electromagnetic wave heating device 50 has reached a threshold. Also in this process, the electromagnetic wave heating control device 100 stores the new input power coefficient set to 0.5 in the storage unit 160.

[0027] In step ST08, if the reflected power is not equal to or greater than the threshold value (NO in step ST08), the electromagnetic wave heating control device 100 determines whether or not the input power coefficient is less than 1 (step ST10). In this process, the electromagnetic wave heating control device 100 refers to the value of the input power coefficient stored in the memory unit 160 and determines whether or not the electromagnetic waves input to the electromagnetic wave heating device 50 by the electromagnetic wave heating control device 100 are in a suppressed state.

[0028] If the input power coefficient is less than 1 during the process in step ST10 (YES in step ST10), the electromagnetic wave heating control device 100 increases the input power coefficient by a predetermined amount (step ST11). In this process, the electromagnetic wave heating control device 100 increases the input power coefficient by a predetermined amount in order to mitigate the suppression of electromagnetic waves input to the electromagnetic wave heating device 50, based on the fact that the reflected power is not above a threshold and the input power coefficient is less than 1 at the time the process in step ST08 is performed. For example, in this process, the electromagnetic wave heating control device 100 increases the input power coefficient by 0.1.

[0029] When the electromagnetic wave heating control device 100 has performed the processing in step ST09 or step ST10, and when the input power coefficient is not less than 1 in the processing of step ST10 (NO in step ST10), it determines whether or not the termination condition, which is the condition for ending the processing, has been met (step ST16). In this processing, the electromagnetic wave heating control device 100 determines, for example, when a signal indicating the end of processing is input from an input device (not shown) that accepts input operations from an operator, when the temperature of the object to be heated M1 reaches a preset temperature, when a preset heating time for heating the object to be heated M1 has elapsed, or when other conditions for ending the heating of the object to be heated M1 have been met, based on information from a temperature sensor (not shown) for detecting the temperature of the object to be heated M1.

[0030] If the termination condition is not met in step ST16 (NO in step ST16), the electromagnetic wave heating control device 100 returns to step ST05. For example, the electromagnetic wave heating control device 100 repeats the process from step ST05 to step ST16 shown in Figure 4 at predetermined specific intervals. In this way, for example, if the reflected power is not above a threshold and the input power coefficient is less than 1, the electromagnetic wave heating control device 100 gradually increases the input power coefficient each time the process from step ST05 to step ST16 is repeated, thereby increasing the input power to the electromagnetic wave heating device 50 over time while maintaining the state in which the reflected power from inside the electromagnetic wave heating device is below a threshold.

[0031] If the termination condition is met in step ST16 (YES in step ST16), the electromagnetic wave heating control device 100 terminates the process.

[0032] As described above, the electromagnetic wave heating control device 100 according to Embodiment 1 includes a power information acquisition unit that acquires information indicating the magnitude of reflected power from within the electromagnetic wave heating device, and a power control unit that controls the input power of electromagnetic waves input to the electromagnetic wave heating device. The power control unit is configured to suppress the input power to be below a preset threshold when the reflected power from within the electromagnetic wave heating device reaches a preset threshold, and to increase the input power over time while maintaining the state in which the reflected power from within the electromagnetic wave heating device is below the threshold. For example, the power control unit is configured to suppress the input power to be below a preset threshold when the reflected power from within the electromagnetic wave heating device reaches a value that is less than or equal to half of the maximum input power of electromagnetic waves input to the electromagnetic wave heating device, and to increase the input power over time while maintaining the state in which the reflected power from within the electromagnetic wave heating device is below the threshold. With this configuration, the electromagnetic wave heating control device 100 can suppress the rise in reflected power, so that even if there is a rise in reflected power while the object to be heated M1 is being heated by the electromagnetic wave heating device 50, the burden that the reflected power places on the device can be reduced.

[0033] Embodiment 2. Next, with reference to Figure 5, the electromagnetic wave heating system 2 according to Embodiment 2 will be described. The electromagnetic wave heating system 2 according to Embodiment 2 differs from the electromagnetic wave heating system 1 according to Embodiment 1 in its configuration for controlling the tuner 40 located between the electromagnetic wave generator 10 and the electromagnetic wave heating device 50. However, other configurations are the same, and for configurations similar to those in Embodiment 1, the same names and reference numerals as in Embodiment 1 will be used, and their descriptions will be omitted.

[0034] Figure 5 is a block diagram showing the schematic configuration of the electromagnetic wave heating system 2 according to Embodiment 2. As shown in Figure 5, the electromagnetic wave heating system 2 according to Embodiment 2 comprises an electromagnetic wave generator 10, a power monitor 30, a tuner 40, an electromagnetic wave heating device 50, and an electromagnetic wave heating control device 200, which are electrically connected to each other wirelessly or by wire.

[0035] The tuner 40 matches the impedance of the electromagnetic wave generator 10 with the impedance from the electromagnetic wave generator 10 to the object M1 to be heated. By matching the impedances, the tuner 40 suppresses reflected power from within the electromagnetic wave heating device 50.

[0036] The electromagnetic wave heating control device 200 includes a power information acquisition unit 120, a power control unit 250, and a storage unit 160.

[0037] Based on the information acquired by the power information acquisition unit 120, the power control unit 250 suppresses the input power to the electromagnetic wave heating device 50 to less than half the maximum input power of the electromagnetic waves input to the electromagnetic wave heating device 50 when the reflected power from within the electromagnetic wave heating device 50 reaches a preset threshold value of less than or equal to half the maximum input power of the electromagnetic waves input to the electromagnetic wave heating device 50. At the same time, it outputs a control signal to the tuner 40 to control the tuner 40 and suppress the reflected power. Furthermore, while the input power to the electromagnetic wave heating device 50 is suppressed, the power control unit 250 controls the input power to the electromagnetic wave heating device 50 so as time progresses while maintaining the state in which the reflected power from within the electromagnetic wave heating device 50 is less than the threshold value. With this configuration, the electromagnetic wave heating control device 200 can suppress reflected power and reduce the burden that reflected power places on the device more effectively than when only the input voltage to the electromagnetic wave heating device 50 is controlled.

[0038] The hardware configuration of the electromagnetic wave heating control device 200 according to Embodiment 2 is the same as that of the electromagnetic wave heating control device 100 according to Embodiment 1, so its description will be omitted.

[0039] Embodiment 3. Next, referring to FIGS. 6 and 7, the electromagnetic wave heating system 3 according to Embodiment 3 will be described. The electromagnetic wave heating system 3 according to Embodiment 3 is different from the electromagnetic wave heating system 2 according to Embodiment 2 in some of the configurations of the electromagnetic wave generating device, the electromagnetic wave heating device, and the configuration for suppressing the input power to the electromagnetic wave heating device by the electromagnetic wave heating control device, but the other configurations are the same. For the same configurations as those in Embodiment 2, the same names and reference numerals as those in Embodiment 2 are used and the description thereof is omitted.

[0040] FIG. 6 is a block diagram showing a schematic configuration of the electromagnetic wave heating system 3 according to Embodiment 3. As shown in FIG. 6, the electromagnetic wave heating system 3 according to Embodiment 3 includes an electromagnetic wave generating device 10A, an isolator 20, a power monitor 30, a tuner 40, an electromagnetic wave heating device 50A, and an electromagnetic wave heating control device 300, which are electrically connected to each other wirelessly or by wire.

[0041] The electromagnetic wave generating device 10A includes a signal source 11, a phase shifter 12, a variable attenuator 13, and a SSPA (Solid State Power Amplifier) 15.

[0042] The signal source 11 generates a signal. For example, the signal source 11 is constituted by a digital signal processor and generates a digital signal which is a continuous wave having a preset amplitude, phase and frequency. The signal source 11 outputs the generated signal toward the phase shifter 12.

[0043] The phase shifter 12 controls the phase of the electromagnetic wave input to the electromagnetic wave heating device 50A by changing the phase of the signal from the signal source 11.

[0044] The variable attenuator 13 controls the amplitude of the electromagnetic wave input to the electromagnetic wave heating device 50A by changing the amplitude of the signal from the signal source 11.

[0045] The SSPA15 as an amplifier has a plurality of semiconductor elements arranged in parallel (not shown) and amplifies the input power of a signal from a signal source whose phase and amplitude are controlled by the phase shifter 12 and the variable attenuator 13. The SSPA15 outputs the amplified signal from the signal source toward the isolator 20.

[0046] The isolator 20 is disposed between the electromagnetic wave generating device 10A and the electromagnetic wave heating device 50A and suppresses the reflected power from within the electromagnetic wave heating device 50A from being input into the electromagnetic wave generating device 10A. For example, the isolator 20 is disposed between the electromagnetic wave generating device 10A and the power monitor 30 disposed in the propagation path of the electromagnetic wave from the electromagnetic wave generating device 10A to the electromagnetic wave heating device 50A.

[0047] The electromagnetic wave heating device 50A includes an antenna 51, a temperature sensor 53, and a housing (not shown) that forms a space capable of accommodating the object to be heated M1 therein. The temperature sensor 53 acquires information indicating the temperature of the object to be heated M1. For example, the temperature sensor 53 is constituted by one or a plurality of radiation temperature sensors for measuring the temperature of the object to be heated M1 non - contact and acquires information indicating the temperature of the object to be heated M1. Also, for example, the temperature sensor 53 is constituted by one or a plurality of infrared cameras and acquires image information indicating the temperature distribution of the object to be heated M1.

[0048] For example, the temperature sensor 53 acquires information indicating the temperature of the object to be heated M1 at every preset specific period. Specifically, the temperature sensor 53 acquires information indicating the temperature of the object to be heated M1 at every preset specific period of 100 picoseconds or more and 100 seconds or less. Also, specifically, the temperature sensor 53 acquires information indicating the temperature of the object to be heated M1 at every preset specific period of 1 / 100 second or more and 1 / 10 second or less. Also, specifically, the temperature sensor 53 acquires information indicating the temperature of the object to be heated M1 every 1 / 30 second or every 1 / 60 second. The temperature sensor 53 outputs the acquired information toward the electromagnetic wave heating control device 300.

[0049] The electromagnetic wave heating control device 300 includes a temperature information acquisition unit 310, a power information acquisition unit 120, an amplitude phase information acquisition unit 330, a power control unit 350, and a storage unit 160.

[0050] The temperature information acquisition unit 310 acquires temperature detection information indicating the temperature detection result (measurement result) of the object M1 being heated by the electromagnetic wave heating device 50A. For example, the temperature information acquisition unit 310 acquires temperature detection information indicating the temperature detection result of the object M1 being heated by the electromagnetic wave heating device 50A based on information from the temperature sensor 53. Specifically, the temperature information acquisition unit 310 acquires temperature detection information indicating the temperature distribution detection result of the object M1 being heated by the electromagnetic wave heating device 50A, and temperature detection information indicating the maximum temperature, average temperature, and surface temperature detection results of the object M1 being heated by the electromagnetic wave heating device 50A, for the entire object M1 or for each part of the object M1 being heated.

[0051] Furthermore, for example, the temperature information acquisition unit 310 acquires temperature detection information at predetermined specific intervals. Specifically, the temperature information acquisition unit 310 acquires temperature detection information from the temperature sensor 53 at predetermined specific intervals of 100 picoseconds or more and 100 seconds or less. Furthermore, specifically, the temperature information acquisition unit 310 acquires temperature detection information from the temperature sensor 53 at predetermined specific intervals of 1 / 100th of a second or more and 1 / 10th of a second or less. Furthermore, specifically, the temperature information acquisition unit 310 acquires temperature detection information from the temperature sensor 53 every 1 / 30th of a second or every 1 / 60th of a second.

[0052] Furthermore, the temperature information acquisition unit 310 acquires temperature target information indicating the target temperature when heating the object to be heated M1, which is heated by the electromagnetic wave heating device 50A. For example, the temperature information acquisition unit 310 acquires temperature target information indicating the target maximum temperature, average temperature, and surface temperature of the object to be heated M1 at a specific time, as temperature target information indicating the target temperature when heating the object to be heated M1. For example, the temperature information acquisition unit 310 acquires the temperature target information by referring to information stored in the storage unit 160. Alternatively, for example, the temperature information acquisition unit 310 acquires the temperature target information based on information from an input device (not shown) that accepts input operations from an operator. The temperature information acquisition unit 310 may acquire temperature target information at predetermined specific intervals, or it may be configured to acquire information showing the time change of the target temperature of the object to be heated M1 from the start of heating to the end of heating all at once, or it may be configured to acquire information showing the time change of the target temperature of the object to be heated M1 all at once, and then update the information showing the time change of the target temperature of the object to be heated M1 with new information when the target temperature changes, or at predetermined specific intervals.

[0053] The temperature information acquisition unit 310 may be configured to acquire only information indicating the final temperature of the object to be heated M1 at the end of heating, based on information stored in the storage unit 160 or information from the input device, and to acquire temperature target information indicating a target temperature of the object to be heated M1 at a specific time by calculating information indicating the time change of the temperature of the object to be heated M1 during heating based on the final temperature and the initial temperature of the object to be heated M1 at the start of heating. Specifically, the temperature information acquisition unit 310 calculates information indicating the time change of temperature based on a regression model based on one or more of the following: characteristic information of the object to be heated M1, the time change of temperature when the object to be heated M1 was heated in the past, the time change of the amplitude, phase, and frequency of the electromagnetic waves input to the electromagnetic wave heating device 50A, the tuner setting value, and information indicating humidity and atmospheric pressure during heating; a data table in which multiple pieces of information are linked to each other; or a trained model generated based on the input of training data containing multiple pieces of this information. Note that the information indicating humidity and atmospheric pressure during heating may be configured to be acquired based on information from a hygrometer and a barometer (not shown) located inside the electromagnetic wave heating device, or it may be configured to be acquired based on information from an input device.

[0054] The amplitude-phase information acquisition unit 330 acquires amplitude and phase information by setting the amplitude and phase of the signal to be generated by the electromagnetic wave generator 10A based on the temperature detection information acquired by the temperature information acquisition unit 310. For example, if the temperature of the object to be heated M1, as indicated by the temperature detection information acquired by the temperature information acquisition unit 310, reaches a preset upper limit temperature, the amplitude-phase information acquisition unit 330 sets a new amplitude for the signal to be generated by the electromagnetic wave generator 10A so as to reduce the amplitude of the signal to be generated.

[0055] Furthermore, the amplitude-phase information acquisition unit 330 sets a new amplitude and phase for the signal to be generated by the electromagnetic wave generator 10A each time temperature detection information is acquired by the temperature information acquisition unit 310. For example, if temperature detection information is acquired by the temperature information acquisition unit 310 at specific intervals, the amplitude-phase information acquisition unit 330 sets a new amplitude and phase for the signal to be generated by the electromagnetic wave generator 10A at each specific interval.

[0056] Furthermore, the amplitude-phase information acquisition unit 330 acquires amplitude information and phase information by setting the amplitude and phase of the signal to be generated by the electromagnetic wave generator 10A based on the temperature target information acquired by the temperature information acquisition unit 310. For example, the amplitude-phase information acquisition unit 330 compares the temperature of the object to be heated M1, indicated by the temperature detection information acquired by the temperature information acquisition unit 310 at a specific time, with the target value of the temperature of the object to be heated M1 at that specific time, indicated by the temperature target information acquired by the temperature information acquisition unit 310, and sets a new amplitude of the signal to be generated by the electromagnetic wave generator 10A according to these temperature differences. Specifically, if the temperature of the object to be heated M1, indicated by the temperature detection information acquired by the temperature information acquisition unit 310 at a specific time, is lower than the temperature of the object to be heated M1 at that specific time, indicated by the temperature target information acquired by the temperature information acquisition unit 310, the amplitude-phase information acquisition unit 330 sets a new amplitude so that the amplitude of the signal to be generated by the electromagnetic wave generator 10A increases according to these temperature differences.

[0057] Furthermore, the amplitude-phase information acquisition unit 330 acquires amplitude information and phase information by setting the amplitude and phase of the signal to be generated by the electromagnetic wave generator 10A based on the information acquired by the power information acquisition unit 120. For example, if the reflected power indicated by the information acquired by the power information acquisition unit 120 reaches a preset threshold, the amplitude-phase information acquisition unit 330 sets a new amplitude and phase of the signal to be generated by the electromagnetic wave generator 10A to reduce the reflected power. Also, for example, if the reflection coefficient indicated by the information acquired by the power information acquisition unit 120 reaches a preset threshold, the amplitude-phase information acquisition unit 330 sets a new amplitude and phase of the signal to be generated by the electromagnetic wave generator 10A to reduce the reflection coefficient.

[0058] Furthermore, for example, the amplitude-phase information acquisition unit 330 acquires amplitude information and phase information by setting the amplitude and phase of the signal to be generated by the electromagnetic wave generator 10A based on the temperature detection information acquired by the temperature information acquisition unit 310, the temperature target information acquired by the temperature information acquisition unit 310, and the information acquired by the power information acquisition unit 120. Specifically, the amplitude-phase information acquisition unit 330 uses one or more of the following information to determine the target temperature of the object to be heated M1 at a specific time indicated by the temperature target information acquired by the temperature information acquisition unit 310, the temperature of the object to be heated M1 at a specific time indicated by the temperature detection information acquired by the temperature information acquisition unit 310, the reflected power indicated by the information acquired by the power information acquisition unit 120, the reflection coefficient calculated from the information acquired by the power information acquisition unit 120, the elapsed time from the start of heating of the object to be heated M1, the time change of the amplitude, phase, and frequency of the signal generated by the electromagnetic wave generator 10A from the start of heating of the object to be heated M1 to a specific time, the tuner setting value, the previously acquired characteristic information of the object to be heated M1, and information indicating humidity and atmospheric pressure during heating, as well as a regression model based on the temperature target information acquired by the temperature information acquisition unit 310. The new amplitude and phase of the signal to be generated by the electromagnetic wave generator 10A at a specific time are set based on a data table in which multiple pieces of information are related to each other, or on a trained model generated based on the input of training data containing multiple pieces of this information, among the target value of the temperature of the object to be heated M1 at a specific time indicated by the temperature detection information obtained by the temperature information acquisition unit 310, the reflected power indicated by the information obtained by the power information acquisition unit 120, the reflection coefficient calculated from the information obtained by the power information acquisition unit 120, the elapsed time since the start of heating, the time change of the amplitude, phase and frequency of the signal generated by the electromagnetic wave generator 10A from the start of heating to a specific time, the tuner setting value, the characteristic information of the object to be heated M1 obtained in advance, and information indicating humidity and atmospheric pressure during heating.

[0059] The power control unit 350 includes a phase shifter control unit 351, a variable attenuator control unit 352, and a tuner control unit 353.

[0060] The phase shifter control unit 351 outputs a signal to the phase shifter 12 to control the phase shifter 12 based on the phase information acquired by the amplitude phase information acquisition unit 330, and changes the phase of the signal from the signal source 11 according to the output signal.

[0061] The variable attenuator control unit 352 sets an input power coefficient based on the amplitude information acquired by the amplitude phase information acquisition unit 330, outputs a signal to the variable attenuator 13 to control the variable attenuator 13 based on the set input power coefficient, and controls the input power to the electromagnetic wave heating device 50A by changing the amplitude of the signal from the signal source 11 according to the output signal.

[0062] The tuner control unit 353 outputs a signal to the tuner 40 for controlling the tuner 40, and performs impedance matching by the tuner 40 according to the output signal.

[0063] The hardware configuration of the electromagnetic wave heating control device 300 according to Embodiment 3 is the same as that of the electromagnetic wave heating control device 100 according to Embodiment 1, so its description will be omitted.

[0064] Next, with reference to Figures 6 and 7, the details of the processing performed by the electromagnetic wave heating control device 300 will be described. Figure 7 is a flowchart showing an example of the processing performed by the electromagnetic wave heating control device 300 according to Embodiment 3. Note that some of the processing performed by the electromagnetic wave heating control device 300 according to Embodiment 3 is the same as the processing performed by the electromagnetic wave heating control device 100 according to Embodiment 1, so the same processing as in Embodiment 1 is denoted by the same reference numerals as in Embodiment 1 and its description is omitted.

[0065] As shown in Figure 7, when the electromagnetic wave heating control device 300 starts processing, it first acquires temperature detection information (step ST01). In this process, the electromagnetic wave heating control device 300 acquires temperature detection information indicating the temperature of the object to be heated M1 at a specific time, based on the information from the temperature sensor 53.

[0066] After performing the process in step ST01, the electromagnetic wave heating control device 300 acquires temperature target information (step ST03). In this process, the electromagnetic wave heating control device 300 acquires temperature target information that indicates the target temperature of the object to be heated M1 at a specific time when heating the object to be heated M1.

[0067] When the electromagnetic wave heating control device 300 performs the processing in step ST03, it acquires amplitude information and phase information (step ST04). In this process, the electromagnetic wave heating control device 300 acquires new amplitude information and phase information by setting the amplitude and phase of a new signal to be generated by the electromagnetic wave generator 10A based on the temperature detection information acquired in step ST01 and the temperature target information acquired in the processing of step ST03.

[0068] For example, in step ST04, the electromagnetic wave heating control device 300 compares the temperature of the object to be heated M1 at a specific time indicated by the temperature detection information acquired in step ST01 with the target temperature of the object to be heated M1 at the same specific time indicated by the temperature target information acquired in step ST03, and sets a new amplitude of the signal to be generated by the electromagnetic wave generator 10A according to these temperature differences. Also, for example, in step ST04, if the temperature of the object to be heated M1 indicated by the temperature detection information acquired in step ST01 has reached a preset upper limit temperature, the electromagnetic wave heating control device 300 sets a new amplitude of the signal to be generated by the electromagnetic wave generator 10A to reduce its amplitude.

[0069] When the electromagnetic wave heating control device 300 performs the processing in step ST04, it acquires the input power coefficient (step ST05). When the electromagnetic wave heating control device 300 performs the processing in step ST05, it controls the input power (step ST06). When the electromagnetic wave heating control device 300 performs the processing in step ST06, it acquires reflected power information (step ST07). When the electromagnetic wave heating control device 300 performs the processing in step ST07, it determines whether the reflected power is above a threshold (step ST08). If the reflected power is above a threshold in the processing of step ST08 (YES in step ST08), the electromagnetic wave heating control device 300 sets the input power coefficient to half (step ST09). If the reflected power is not above a threshold in the processing of step ST08 (NO in step ST08), the electromagnetic wave heating control device 300 determines whether the input power coefficient is less than 1 (step ST10).

[0070] If the input power coefficient is less than 1 during the process in step ST10 (YES in step ST10), the electromagnetic wave heating control device 300 increases the input power coefficient by a predetermined amount (step ST11). If the input power coefficient is not less than 1 during the process in step ST10 (NO in step ST10), and if the process in step ST09 or step ST10 has been performed, the electromagnetic wave heating control device 300 determines whether the termination condition, which is the condition for ending the process, has been met (step ST16). If the termination condition has not been met during the process in step ST16 (NO in step ST16), the electromagnetic wave heating control device 300 returns the process to step ST01. For example, the electromagnetic wave heating control device 300 repeats the processes from step ST01 to step ST16 shown in Figure 7 at predetermined specific intervals.

[0071] With this configuration, the electromagnetic wave heating system 3 according to Embodiment 3 can suppress reflected power from the electromagnetic wave heating device 50A and reduce the burden that reflected power places on the isolator 20.

[0072] Embodiment 4. Next, with reference to Figure 8, the electromagnetic wave heating system 4 according to Embodiment 4 will be described. The electromagnetic wave heating system 4 according to Embodiment 4 differs from the electromagnetic wave heating system 3 according to Embodiment 3 in that it is equipped with a plurality of electromagnetic wave generating devices, and the electromagnetic waves generated using these plurality of electromagnetic wave generating devices are input to a plurality of antennas of the electromagnetic wave heating device to heat the object to be heated M1. However, other configurations are the same, and the same names and reference numerals as in Embodiment 3 will be used and the description will be omitted.

[0073] Figure 8 is a block diagram showing the schematic configuration of the electromagnetic wave heating system 4 according to Embodiment 4. As shown in Figure 8, the electromagnetic wave heating system 4 according to Embodiment 4 comprises a first electromagnetic wave generator 10B, a second electromagnetic wave generator 10C, isolators 20, 20, power monitors 30, 30, tuners 40, 40, an electromagnetic wave heating device 50B, and an electromagnetic wave heating control device 400, which are electrically connected to each other wirelessly or by wire.

[0074] The first electromagnetic wave generator 10B and the second electromagnetic wave generator 10C each include a signal source 11, a phase shifter 12, a variable attenuator 13, and an SSPA 15. The first electromagnetic wave generator 10B is electrically connected to the electromagnetic wave heating device 50 via an isolator 20, a power monitor 30, and a tuner 40, while the second electromagnetic wave generator 10C is electrically connected to the electromagnetic wave heating device 50 via a different isolator 20, a power monitor 30, and a tuner 40 than the first electromagnetic wave generator 10B, and via a different path than the first electromagnetic wave generator 10B. In other words, the first electromagnetic wave generator 10B and the second electromagnetic wave generator 10C are electrically connected to the electromagnetic wave heating device 50B via electromagnetic wave transmission paths that are formed independently of each other, and the isolator 20, power monitor 30, and tuner 40 are arranged on each electromagnetic wave transmission path. The configurations of the first electromagnetic wave generator 10B and the second electromagnetic wave generator 10C are the same as those of the electromagnetic wave generator 10A according to Embodiment 3, so their descriptions will be omitted.

[0075] The electromagnetic wave heating device 50B includes a first antenna 51B, a second antenna 52B, a temperature sensor 53, and a housing (not shown) that forms a space inside capable of housing the object to be heated M1. The first antenna 51B transmits electromagnetic waves input from the first electromagnetic wave generator 10B via an isolator 20, a power monitor 30, and a tuner 40 as traveling waves toward the housing, and receives the reflected waves input to the first antenna 51B as the electromagnetic waves are reflected within the housing. The second antenna 52B transmits electromagnetic waves input from the second electromagnetic wave generator 10C via a different isolator 20, a power monitor 30, and a tuner 40 than the first antenna 51B as traveling waves toward the housing, and receives the reflected waves input to the second antenna 52B as the electromagnetic waves are reflected within the housing.

[0076] The electromagnetic wave heating control device 400 includes a temperature information acquisition unit 310, a power information acquisition unit 120, an amplitude phase information acquisition unit 430, a power control unit 450, and a storage unit 160.

[0077] The amplitude-phase information acquisition unit 430 acquires amplitude and phase information corresponding to the first electromagnetic wave generator 10B and the second electromagnetic wave generator 10C, respectively, by setting the amplitude and phase of the signals to be generated by the first electromagnetic wave generator 10B and the second electromagnetic wave generator 10C, respectively, based on the temperature detection information acquired by the temperature information acquisition unit 310. The details of the function of the amplitude-phase information acquisition unit 430 in acquiring amplitude and phase information are the same as those of the amplitude-phase information acquisition unit 330 in Embodiment 3, so the explanation is omitted.

[0078] The power control unit 450 includes a phase shifter control unit 451, a variable attenuator control unit 452, and a tuner control unit 453.

[0079] The phase shifter control unit 451 outputs a signal to control the phase shifters 12 of the first electromagnetic wave generator 10B and the second electromagnetic wave generator 10C based on the phase information acquired by the amplitude phase information acquisition unit 430, and changes the phase of the signals from the signal sources 11 of the first electromagnetic wave generator 10B and the second electromagnetic wave generator 10C according to the output signal.

[0080] The variable attenuator control unit 452 outputs signals to control the variable attenuators 13 of the first electromagnetic wave generator 10B and the second electromagnetic wave generator 10C based on the amplitude information acquired by the amplitude phase information acquisition unit 430, and changes the amplitude of the signals from the respective signal sources 11 of the first electromagnetic wave generator 10B and the second electromagnetic wave generator 10C according to the output signals.

[0081] The tuner control unit 453 outputs a signal to control the tuner 40 located between the first electromagnetic wave generator 10B and the electromagnetic wave heating device 50B, and the tuner 40 located between the second electromagnetic wave generator 10C and the electromagnetic wave heating device 50B, and performs impedance matching by each tuner 40 according to the output signal.

[0082] With this configuration, the electromagnetic wave heating system 4 according to Embodiment 4 can reduce the burden on the electromagnetic wave heating device 50B from reflected power, even when electromagnetic waves from multiple signal sources are input to the device.

[0083] The hardware configuration of the electromagnetic wave heating control device 400 according to Embodiment 4 is the same as that of the electromagnetic wave heating control device 100 according to Embodiment 1, so its description will be omitted.

[0084] Embodiment 5. Next, the electromagnetic wave heating system 5 according to Embodiment 5 will be described with reference to Figures 9 and 10. The electromagnetic wave heating system 5 according to Embodiment 5 differs from the electromagnetic wave heating system 1 according to Embodiment 1 in that the electromagnetic wave heating control device has a different configuration for performing control based on information acquired from the SSPA, but other configurations are the same, and the same names and reference numerals as in Embodiment 1 will be used and their descriptions will be omitted.

[0085] Figure 9 is a block diagram showing the schematic configuration of the electromagnetic wave heating system 5 according to Embodiment 5. As shown in Figure 9, the electromagnetic wave heating system 5 according to Embodiment 5 comprises an electromagnetic wave generator 10D, a power monitor 30, an electromagnetic wave heating device 50, and an electromagnetic wave heating control device 500, which are electrically connected to each other wirelessly or by wire.

[0086] The electromagnetic wave generator 10D includes a signal source 11, a phase shifter 12, a variable attenuator 13, a power supply controller 14, and an SSPA 15.

[0087] The power supply controller 14 switches between an energized state that allows input power and an interrupted state that interrupts input power for each of the multiple semiconductor elements of the SSPA 15. For example, the power supply controller 14 has multiple switching circuits corresponding to each of the multiple semiconductor elements of the SSPA 15, and switches between the energized state and the interrupted state of each semiconductor element by operating each switching circuit individually.

[0088] The electromagnetic wave heating control device 500 includes a power information acquisition unit 120, a semiconductor element information acquisition unit 540, a power control unit 550, and a storage unit 160.

[0089] The semiconductor element information acquisition unit 540 acquires semiconductor element information for each of the multiple semiconductor elements in the SSPA 15, indicating whether or not it has a predetermined specific function. For example, based on information notified by the SSPA 15, the semiconductor element information acquisition unit 540 acquires semiconductor element information for each of the multiple semiconductor elements in the SSPA 15, indicating whether or not it has a function to amplify the input power within a predetermined normal range.

[0090] The power control unit 550 includes a phase shifter control unit 551, a variable attenuator control unit 552, and a semiconductor element control unit 554.

[0091] The phase shifter control unit 551 outputs a signal to the phase shifter 12 to control it based on the information acquired by the semiconductor element information acquisition unit 540 and the amplitude information acquired by the amplitude phase information acquisition unit 330, and changes the phase of the signal from the signal source 11 according to the output signal.

[0092] The variable attenuator control unit 552 sets an input power coefficient based on the information acquired by the semiconductor element information acquisition unit 540 and the amplitude information acquired by the amplitude phase information acquisition unit 330. Based on the set input power coefficient, it outputs a signal to the variable attenuator 13 to control the variable attenuator 13, and controls the input power to the electromagnetic wave heating device 50 by changing the amplitude of the signal from the signal source 11 according to the output signal. For example, the variable attenuator control unit 552 sets the input power coefficient to a value of 1 or more based on the information acquired by the semiconductor element information acquisition unit 540, thereby increasing the input power to the electromagnetic wave heating device 50.

[0093] The semiconductor element control unit 554 controls the input power to each of the multiple semiconductor elements of the SSPA 15 so as to cut off the input power to semiconductor elements of the SSPA 15 that do not have a specific function, based on the semiconductor element information acquired by the semiconductor element information acquisition unit 540. For example, the semiconductor element control unit 554 outputs a control signal to activate the power supply controller 14 so as to cut off the input power to semiconductor elements of the SSPA 15 that do not have a specific function, based on the semiconductor element information acquired by the semiconductor element information acquisition unit 540. For example, if the reflected power input to the SSPA 15 exceeds an acceptable range, the function of one of the multiple semiconductor elements of the SSPA 15 may deteriorate due to the burden on them from the reflected power. In such a case, the semiconductor element control unit 554 is configured to cut off the input power to semiconductor elements that do not have sufficient function.

[0094] The hardware configuration of the electromagnetic wave heating control device 500 according to Embodiment 5 is the same as that of the electromagnetic wave heating control device 100 according to Embodiment 1, so its description will be omitted.

[0095] Next, with reference to Figures 9 and 10, the details of the processing performed by the electromagnetic wave heating control device 500 will be described. Figure 10 is a flowchart showing an example of the processing performed by the electromagnetic wave heating control device 500 according to Embodiment 5. Note that some of the processing performed by the electromagnetic wave heating control device 500 according to Embodiment 5 is the same as the processing performed by the electromagnetic wave heating control device 100 according to Embodiment 1, so the same processing as in Embodiment 1 is denoted by the same reference numerals as in Embodiment 1 and its description is omitted.

[0096] As shown in Figure 10, when the electromagnetic wave heating control device 500 starts processing, it first acquires the input power coefficient (step ST05). After performing the processing in step ST05, the electromagnetic wave heating control device 500 controls the input power (step ST06). After performing the processing in step ST06, the electromagnetic wave heating control device 500 acquires reflected power information (step ST07). After performing the processing in step ST07, the electromagnetic wave heating control device 500 determines whether the reflected power is above a threshold (step ST08). If the reflected power is above a threshold in the processing of step ST08 (YES in step ST08), the electromagnetic wave heating control device 500 sets the input power coefficient to half (step ST09). If the reflected power is not above a threshold in the processing of step ST08 (NO in step ST08), the electromagnetic wave heating control device 500 determines whether the input power coefficient is less than 1 (step ST10). If the input power coefficient is less than 1 during the process in step ST10 (YES in step ST10), the electromagnetic wave heating control device 500 increases the input power coefficient by a predetermined amount (step ST11).

[0097] After performing the processing in step ST11, the electromagnetic wave heating control device 500 acquires semiconductor element information (step ST12). In this process, based on the information notified by the SSPA 15, the electromagnetic wave heating control device 500 acquires semiconductor element information for each of the multiple semiconductor elements possessed by the SSPA 15, indicating whether or not it has the function of amplifying the input power within a preset normal range.

[0098] When the electromagnetic wave heating control device 500 performs the processing in step ST12, it determines whether or not there are semiconductor elements that do not have a specific function (step ST13). In this process, the electromagnetic wave heating control device 500 determines, based on the semiconductor element information obtained in the processing of step ST12, whether or not there are semiconductor elements among the multiple semiconductor elements of the SSPA 15 that do not have a specific function.

[0099] If there are semiconductor elements that do not have a specific function during the process in step ST13 (YES in step ST13), the electromagnetic wave heating control device 500 cuts off the power supply to the semiconductor elements that do not have a specific function (step ST14). In this process, the electromagnetic wave heating control device 500 outputs a control signal to the power supply controller 14, cutting off the power supply to the semiconductor elements that do not have a specific function, and maintaining the power supply to the semiconductor elements that do have a specific function.

[0100] When the electromagnetic wave heating control device 500 performs the processing in step ST14, it increases the input power coefficient in accordance with the number of semiconductor elements that do not have a specific function (step ST15). For example, in this process, the electromagnetic wave heating control device 500 suppresses a decrease in the input power to the electromagnetic wave heating device 50 by setting the input power coefficient to the reciprocal of the number of semiconductor elements whose input power has been cut off relative to the total number of semiconductor elements in the SSPA 15. Specifically, in this process, if the total number of semiconductor elements in the SSPA 15 is 16 and the number of semiconductor elements whose input power has been cut off is 1, the electromagnetic wave heating control device 500 sets the input power coefficient to 16 / 15. As a method for increasing the input power to the electromagnetic wave heating device 50 by an input power coefficient of 1 or more, for example, it is possible to reduce the amount of amplitude reduction by the variable attenuator 13 or increase the amplitude of the signal generated by the signal source 11.

[0101] The electromagnetic wave heating control device 500 determines whether the termination condition, which is the condition for ending the process, has been met (step ST16) if there are no semiconductor elements without a specific function in the process of step ST13 (NO in step ST13), or if the process of step ST15 has been performed. If the termination condition has not been met in the process of step ST16 (NO in step ST16), the electromagnetic wave heating control device 500 returns the process to step ST05. For example, the electromagnetic wave heating control device 500 repeats the process from step ST05 to step ST16 shown in Figure 10 at predetermined specific intervals.

[0102] As described above, the electromagnetic wave heating control device 500 according to Embodiment 5 includes a semiconductor element information acquisition unit 540 that acquires semiconductor element information indicating whether or not each of the multiple semiconductor elements of the SSPA 15, which is an amplifier having multiple semiconductor elements arranged in parallel to amplify input power from a signal source, has a preset specific function, and a semiconductor element control unit 554 that controls the input power to each of the multiple semiconductor elements so as to cut off the input power to semiconductor elements that do not have the specific function based on the semiconductor element information acquired by the semiconductor element information acquisition unit 540, and the power control unit 550 is configured to control the input power of the electromagnetic waves input to the electromagnetic wave heating device 50 based on the semiconductor element information acquired by the semiconductor element information acquisition unit 540.

[0103] For example, the electromagnetic wave heating control device 500 is configured to control the input power of the electromagnetic waves input to the electromagnetic wave heating device 50 in accordance with the number of semiconductor elements among the multiple semiconductor elements that do not have a specific function.

[0104] With this configuration, the electromagnetic wave heating control device 500 can suppress a decrease in the input power of the electromagnetic waves input to the electromagnetic wave heating device 50, even if there are semiconductor elements among the multiple semiconductor elements of the amplification device that do not have sufficient functionality.

[0105] Embodiment 6. Next, with reference to Figure 11, the electromagnetic wave heating system 6 according to Embodiment 6 will be described. The electromagnetic wave heating system 6 according to Embodiment 6 differs from the electromagnetic wave heating system 5 according to Embodiment 5 in that it is equipped with a tuner and the electromagnetic wave heating control device has a configuration for controlling the tuner, but other configurations are the same, and the same names and reference numerals as in Embodiment 5 will be used and their descriptions will be omitted.

[0106] Figure 11 is a block diagram showing the schematic configuration of the electromagnetic wave heating system 6 according to Embodiment 6. As shown in Figure 11, the electromagnetic wave heating system 6 according to Embodiment 6 comprises an electromagnetic wave generator 10D, a power monitor 30, a tuner 40, an electromagnetic wave heating device 50, and an electromagnetic wave heating control device 600, which are electrically connected to each other wirelessly or by wire.

[0107] The electromagnetic wave heating control device 600 includes a power information acquisition unit 120, a semiconductor element information acquisition unit 540, a power control unit 650, and a storage unit 160.

[0108] The power control unit 650 includes a phase shifter control unit 551, a variable attenuator control unit 552, a tuner control unit 653, and a semiconductor element control unit 554.

[0109] The tuner control unit 653 outputs a signal to the tuner 40 for controlling the tuner 40, and performs impedance matching by the tuner 40 according to the output signal.

[0110] Furthermore, this disclosure allows for free combination of each embodiment, modification of any component of each embodiment, or omission of any component in each embodiment.

[0111] The electromagnetic wave heating control device described herein can be used, for example, to control electromagnetic waves in order to suppress the increase in reflected power when heating an object to be heated in an electromagnetic wave heating device by irradiating it with electromagnetic waves.

[0112] 1 Electromagnetic wave heating system, 2 Electromagnetic wave heating system, 3 Electromagnetic wave heating system, 4 Electromagnetic wave heating system, 5 Electromagnetic wave heating system, 6 Electromagnetic wave heating system, 10 Electromagnetic wave generator, 10A Electromagnetic wave generator, 10B First electromagnetic wave generator, 10C Second electromagnetic wave generator, 10D Electromagnetic wave generator, 11 Signal source, 12 Phase shifter, 13 Variable attenuator, 14 Power supply controller, 20 Isolator, 30 Power monitor, 40 Tuner, 50 Electromagnetic wave heating device, 50A Electromagnetic wave heating device, 50B Electromagnetic wave heating device, 51 Antenna, 51B First antenna, 52B Second antenna, 53 Temperature sensor, 100 Electromagnetic wave heating control device, 100a Processor, 100b Memory, 100c I / O port, 100d Processing circuit, 120 Power information acquisition unit, 150 Power control unit, 160 Memory unit, 200 Electromagnetic wave heating control device, 250 Power control unit, 300 Electromagnetic wave heating control device, 310 Temperature information acquisition unit, 330 Amplitude phase information acquisition unit, 350 Power control unit, 351 Phase shifter control unit, 352 Variable attenuator control unit, 353 Tuner control unit, 400 Electromagnetic wave heating control device, 430 Amplitude phase information acquisition unit, 450 Power control unit, 451 Phase shifter control unit, 452 Variable attenuator control unit, 453 Tuner control unit, 500 Electromagnetic wave heating control device, 540 Semiconductor element information acquisition unit, 550 Power control unit, 551 Phase shifter control unit, 552 Variable attenuator control unit, 554 Semiconductor element control unit, 600 Electromagnetic wave heating control device, 650 Power control unit, 653 Tuner control unit, M1 Object to be heated.

Claims

1. An electromagnetic wave heating control device comprising: a power information acquisition unit that acquires information indicating the magnitude of reflected power from within an electromagnetic wave heating device; and a power control unit that controls the input power of electromagnetic waves input to the electromagnetic wave heating device, wherein the power control unit suppresses the input power to be less than a preset threshold when the reflected power from within the electromagnetic wave heating device reaches a preset threshold, and increases the input power over time while maintaining the state in which the reflected power from within the electromagnetic wave heating device is less than the threshold.

2. The electromagnetic wave heating control device according to claim 1, characterized in that the threshold value is set in advance as a value of one-tenth or more and one-half or less of the maximum input power of the electromagnetic waves input to the electromagnetic wave heating device.

3. An electromagnetic wave heating control device according to claim 1 or 2, comprising: a semiconductor element information acquisition unit that acquires semiconductor element information indicating whether or not each of the plurality of semiconductor elements of an amplification device having a plurality of semiconductor elements arranged in parallel to amplify input power from a signal source; and a semiconductor element control unit that controls the input power to each of the plurality of semiconductor elements so as to cut off the input power to the semiconductor elements that do not have the specified function, based on the semiconductor element information acquired by the semiconductor element information acquisition unit, wherein the power control unit controls the input power of the electromagnetic waves input to the electromagnetic wave heating device to increase according to the number of semiconductor elements among the plurality of semiconductor elements that do not have the specified function.

4. A program for causing a computer to function as a power information acquisition unit that acquires information indicating the magnitude of reflected power from within an electromagnetic wave heating device, and a power control unit that controls the input power of electromagnetic waves input to the electromagnetic wave heating device, wherein the power control unit suppresses the input power to be less than half the maximum input power of electromagnetic waves input to the electromagnetic wave heating device when the reflected power from within the electromagnetic wave heating device reaches a preset threshold value, and increases the input power over time while maintaining the state in which the reflected power from within the electromagnetic wave heating device is less than the threshold.

5. An electromagnetic wave heating control method performed by a device comprising a power information acquisition unit and a power control unit, comprising the steps of: the power information acquisition unit acquiring information indicating the magnitude of reflected power from within the electromagnetic wave heating device; and the power control unit controlling the input power of electromagnetic waves input to the electromagnetic wave heating device, wherein the power control unit suppresses the input power to be less than the threshold when the reflected power from within the electromagnetic wave heating device reaches a threshold value set in advance as less than or equal to half of the maximum input power of electromagnetic waves input to the electromagnetic wave heating device, and increases the input power over time while maintaining the state in which the reflected power from within the electromagnetic wave heating device is less than the threshold.

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