Mounting device and method for controlling mounting device

Abstract

The present invention suppresses occurrence of positional deviation between a component and a substrate due to elevation and lowering of a mounting head in a mounting device. A mounting head (5) comprises a nozzle (51) and a housing (52) including a first transparent part (54) that is transparent. A tip (106A) of an imaging device (106) is moved to an internal space (K1) of the housing (52) of the mounting head (5) by a second moving device (69). The imaging device (106) captures, through the first transparent part (54), a superposed image including first recognition marks (71A, B) on the component (11) and second recognition marks (72A, B) on the substrate (12).

Description

Mounting Device and Control Method of Mounting Device

[0001] The present disclosure relates to a mounting device and a control method thereof.

[0002] For example, Patent Document 1 discloses a mounting device including a stage for holding a substrate, a mounting head for holding a component, a driving unit for relatively moving the stage and the mounting head with respect to each other, and a recognition unit for recognizing the substrate and the component.

[0003] The mounting device of Patent Document 1 uses the driving unit to move the mounting head to align the component with respect to the substrate. Thereafter, the mounting device lowers the mounting head to bring the component held by the mounting head closer to the substrate.

[0004] Japanese Patent No. 6411823

[0005] However, when the mounting head is lowered after aligning the component and the substrate, there is a risk of positional deviation between the component and the substrate during the lowering. Therefore, there is still room for improvement in suppressing positional deviation due to the lifting and lowering of the mounting head.

[0006] The present disclosure aims to solve the above problems and provides a mounting device that suppresses positional deviation due to the lifting and lowering of the mounting head.

[0007] The mounting device according to the present disclosure includes a stage for supporting a substrate, a nozzle for holding a component, a mounting head having a housing that holds the nozzle and forms an internal space, a first moving device for relatively moving the mounting head with respect to the stage, an imaging device having an infrared camera for imaging a first image including a first recognition mark of the component and a second recognition mark of the substrate, a second moving device for moving the imaging device with respect to the mounting head, and a control unit for controlling the first moving device based on the first image. At least a part of the component has infrared transmissivity, the nozzle has a first transmissive part having infrared transmissivity at a position facing the first recognition mark of the held component. When the mounting head is positioned at a first height by the first moving device, the imaging device is movable by the second moving device to an imaging position where the tip of the imaging device is located in the internal space of the housing, and images the first image through the first transmissive part from the imaging position.

[0008] The control method for a mounting apparatus according to this disclosure includes: holding a component in a nozzle held in the housing of a mounting head; moving the mounting head above a stage supporting a substrate using a first moving device; moving the mounting head to a first height relative to the stage using the first moving device; when the mounting head is at the first height, moving an imaging device having an infrared camera to an imaging position where the tip of the imaging device is located in the internal space formed by the housing of the mounting head using a second moving device; causing the imaging device to capture a first image including a first recognition mark of the component and a second recognition mark of the substrate through a first transparent portion of the nozzle from the imaging position; and controlling the first moving device based on the first image, wherein at least a portion of the component is transparent to infrared light, and the first transparent portion is transparent to infrared light and faces the first recognition mark of the held component.

[0009] According to this disclosure, it is possible to provide a mounting device that can suppress positional misalignment caused by the raising and lowering of the mounting head.

[0010] Schematic diagram of the mounting device according to Embodiment 1 of the present disclosure Schematic diagram of a part of the mounting device Schematic diagram of a part of the mounting device Perspective view of the mounting head housing Cross-sectional view of the mounting head housing Cross-sectional view of the mounting head housing Schematic diagram of the imaging device Flowchart showing the mounting operation Schematic diagram of a part of the mounting device in component image Schematic diagram of a circuit board image Schematic diagram of a component image Schematic diagram of a circuit board image Schematic diagram of a superimposed image before alignment Schematic diagram of a superimposed image before alignment Schematic diagram of a superimposed image after alignment Schematic diagram of a part of the mounting device according to Modification 1 Schematic diagram of a part of the mounting device according to Modification 2 Schematic diagram of a part of the mounting device according to Modification 3 Schematic diagram of the imaging device according to Modification 3

[0011] The embodiments of this disclosure will be described below with reference to the drawings.

[0012] [Embodiment 1] (Overall Configuration) Figure 1 is a schematic diagram of a mounting device 1 according to Embodiment 1 of the present disclosure. Figures 2 and 3 are schematic diagrams of a part of the mounting device 1 (mounting head 5, imaging device 6, and stage 8). In the figures, the Z direction is the vertical direction, and the X and Y directions are orthogonal to each other and to the Z direction. In Embodiment 1, the Z direction is the vertical direction, and the XY plane is the horizontal plane, but is not limited thereto. In Figures 2, 3 and subsequent drawings, the internal structure of the mounting head 5 is shown by dotted lines.

[0013] As shown in Figure 1, the mounting apparatus 1 is an apparatus for mounting components 11 onto a substrate 12. The components 11 are thin, plate-shaped members, such as dies or IC chips. The substrate 12 is a plate-shaped member, and may be circular or rectangular in shape.

[0014] Component 11 is mainly composed of a material that is transparent to infrared light. Component 11 is mainly composed of, for example, silicon, silicon carbide (SiC), etc. Component 11 may have wiring patterns or recognition marks formed of materials different from its main component. In this specification, "infrared" mainly refers to the wavelength range of short-wave infrared (SWIR), for example, the wavelength range from 900 nm to 2500 nm. Since optical resolution is proportional to wavelength, "infrared" preferably refers to the lower wavelength range within the short-wave infrared region, for example, the wavelength range from 900 nm to 1200 nm. The wavelength range may be changed depending on the material of component 11. In this specification, "transparent" means having enough transparency to allow imaging of a recognition mark provided on the surface of component 11 through the inside of component 11. For example, "transparent" means having a transmittance of 10% or more, preferably 30% or more.

[0015] On the other hand, the substrate 12 may be mainly composed of a material that is transparent to infrared rays, or it may be mainly composed of a material that reflects or absorbs infrared rays. The substrate 12 may be formed from, for example, silicon, glass, or resin.

[0016] As shown in Figure 2, the surface of component 11 is provided with a wiring pattern (not shown) and recognition marks 71A and 71B for alignment. The surface of substrate 12 is provided with a wiring pattern (not shown) and recognition marks 72A and 72B for alignment. The two recognition marks 71A and 71B on component 11 are located diagonally opposite each other, and the two recognition marks 72A and 72B on substrate 12 are located at positions corresponding to the recognition marks 71A and 71B at the mounting position of component 11 on substrate 12. The recognition marks 71A, 71B, 72A, and 72B are located away from the wiring pattern. The wiring pattern and recognition marks 71A, 71B, 72A, and 72B are not transparent to infrared light and reflect infrared light. For example, the wiring pattern and recognition marks 71A, 71B, 72A, and 72B are made of metal.

[0017] In Embodiment 1, component 11 is transparent to infrared light in all parts except for the wiring pattern and recognition marks 71A and 71B. It is sufficient that component 11 is transparent to infrared light in at least a portion of the area including the vicinity of the recognition marks 71A and 71B. With this configuration, the recognition marks 72A and 72B on the substrate 12 can be imaged through component 11.

[0018] As shown in Figures 1 and 2, the mounting device 1 comprises a component supply unit 2, a pickup head 3, an inversion unit 4, a mounting head 5, a first moving device 59 (Figure 2), an imaging device 6 (Figure 2), a second moving device 69 (Figure 2), a stage 8, and a control unit C.

[0019] The component supply unit 2 is configured to supply components 11 to the mounting head 5 via the pickup head 3. The component supply unit 2, for example, supports a wafer and supplies components 11 from the wafer.

[0020] The pickup head 3 is configured to hold the component 11 supplied from the component supply unit 2 and hand it over to the mounting head 5. Specifically, the pickup head 3 holds one side of the component 11 and hands it over to the mounting head 5 so that the mounting head 5 holds the other side.

[0021] The reversal unit 4 is configured to reverse the front and back sides of the component 11. The reversal unit 4 changes the pickup head 3, which is holding one side of the component 11, from a downward position to an upward position (indicated by the dotted line). As a result, the component 11 is also changed from a downward position to an upward position and is held by the mounting head 5 in the upward position.

[0022] The mounting head 5 is configured to hold the component 11 received from the pickup head 3 and mount it onto the circuit board 12. The mounting head 5 attracts and holds the component 11.

[0023] As shown in Figures 1 to 3, the mounting head 5 is movable relative to the pickup head 3 and the stage 8 by the first moving device 59. In Embodiment 1, the first moving device 59 moves the mounting head 5 relative to the stage 8 in the X, Y, and Z directions and rotates it around the Z axis. Furthermore, the first moving device 59 moves the stage 8 relative to the mounting head 5 in the X and Y directions. This operation allows for alignment of the component 11 and the substrate 12. The first moving device 59 includes, for example, a motor that drives the mounting head 5 and a motor that drives the stage 8.

[0024] The imaging device 6 is configured to capture images for the purpose of aligning the component 11 and the substrate 12. Specifically, the imaging device 6 captures the recognition marks 71A and 71B on the component 11 and the recognition marks 72A and 72B on the substrate 12. As will be described later, the imaging device 6 has an infrared camera.

[0025] The imaging device 6 is movable relative to the stage 8 by a second moving device 69. In the first embodiment, the imaging device 6 is movable in the X and Y directions. The second moving device 69 is, for example, a motor that drives the imaging device 6.

[0026] Stage 8 is configured to support the substrate 12. Stage 8 may have a heater for heating the substrate 12 and the components 11 that are close to the substrate 12. Providing a heater may facilitate the bonding of the components 11 and the substrate 12.

[0027] Returning to Figure 1, the control unit C is configured to control the mounting device 1. Specifically, the control unit C controls the moving devices 59, 69 and the imaging device 6. The control unit C includes, for example, a general-purpose processor such as a CPU, MPU, FPGA, DSP, or ASIC that realizes a predetermined function by executing a program. The control unit C realizes its function by executing a program stored in memory (not shown). The control unit C is not limited to one that realizes a predetermined function through the cooperation of hardware and software, but may also be a hardware circuit specifically designed to realize a predetermined function.

[0028] The control unit C includes an arithmetic unit C1 and a storage unit C2. The arithmetic unit C1 determines the relative position of the component 11 with respect to the substrate 12 based on the image captured by the imaging device 6. The storage unit C2 stores information such as the image captured by the imaging device 6. The storage unit C2 may be, for example, RAM, ROM, EEPROM, flash memory or other memory technology, CD-ROM, DVD or other optical disc storage, magnetic cassette, magnetic tape, magnetic disk storage or other magnetic storage device.

[0029] The structure of the mounting head 5 and the imaging device 6 will be described in more detail with reference to Figures 2 and 3.

[0030] As shown in Figures 2 and 3, the mounting head 5 has a suction nozzle 51 and a housing 52. The suction nozzle 51 attracts and holds the component 11, and the housing 52 attracts and holds the suction nozzle 51. Specifically, the housing 52 attracts the suction nozzle 51 on its lower surface. The housing 52 may also mechanically hold the suction nozzle 51.

[0031] The adsorption nozzle 51 is mainly composed of a material that is transparent to infrared rays. In Embodiment 1, the entire adsorption nozzle 51 is mainly composed of a material that is transparent to infrared rays. The adsorption nozzle 51 is formed of, for example, glass (synthetic quartz).

[0032] The housing 52 forms an internal space K1 on its inside. In Figures 2 and 3, a portion of the wall of the housing 52 is omitted so that the internal space K1 is visible. The internal space K1 communicates with the space outside the housing 52 through through holes 53 provided at least on the side of the housing 52. As shown in Figure 3, when the mounting head 5 is positioned at a predetermined height, the tip 6A of the imaging device 6 is inserted into the internal space K1 through the through holes 53. In other words, the internal space K1 is a space for receiving the tip portion of the imaging device 6 that enters through the through holes 53.

[0033] Two through-holes 54 are further provided on the lower surface of the housing 52. The through-holes 54 are located opposite the recognition marks 71A and 72A in the Z direction, and opposite the recognition marks 71B and 72B in the Z direction. With this configuration, the imaging device 6 can image the recognition marks 71A, 72A, 71B, and 72B from within the internal space K1 through the through-holes 54 and the suction nozzle 51.

[0034] The first moving device 59 raises and lowers the mounting head 5 above the stage 8 between a first height H1, a second height H2, and a third height H3, which are aligned in the Z direction. In the following description, heights H1 to H3 are the heights of the lower surface of the component 11 held by the mounting head 5.

[0035] As shown in Figure 2, the first height H1 is the height of the mounting head 5 when it moves from above the component supply unit 2 to above the stage 8 with the component 11 received and held from the pickup head 3. The first height H1 is such that the mounting head 5 can avoid interference with other components when moving from the component supply unit 2. The second height H2 is the height of the mounting head 5 when it is positioned below the first height H1 and mounting the held component 11. The second height H2 is the height at which the component 11 held by the mounting head 5 contacts the substrate 12.

[0036] As shown in Figure 3, the third height H3 is the height between the first height H1 and the second height H2. In other words, the third height H3 is lower than the first height H1 and higher than the second height H2. In Embodiment 1, the third height H3 is closer to the second height H2 than to the first height H1, and is located below the midpoint between heights H1 and H2.

[0037] A gap G1 is provided between the component 11 held by the mounting head 5 at the third height H3 and the substrate 12. The gap G1 is smaller than the Z-direction dimension of the tip 6A of the imaging device 6. Specifically, the gap G1 is smaller than the Z-direction dimension G2 of the portion of the cylindrical member 63 that houses the reflective optical system 64, which will be described later. Furthermore, the gap G1 is smaller than the depth of field of the infrared camera of the imaging device 6 so that it is possible to focus on both recognition marks 71A and 72A, or both recognition marks 71B and 72B. In Embodiment 1, the gap G1 is 0.5 mm or less, preferably 0.2 mm or less, and more preferably 0.1 mm.

[0038] As shown in Figures 2 and 3, the imaging device 6 includes a camera 62, a cylindrical member 63, and a reflective optical system 64. The imaging device 6 further includes an infrared illumination source (not shown) that emits infrared light. In Embodiment 1, the camera 62 is an infrared camera that receives infrared light that can penetrate the component 11 and the suction nozzle 51.

[0039] The cylindrical member 63 houses one or more lenses that focus the camera 62 onto the recognition mark and extends in the X direction, forming the tip 6A of the imaging device 6. A reflective optical system 64 is provided at the tip of the cylindrical member 63. The reflective optical system 64 has a first reflective surface 64A and a second reflective surface 64B (Figure 7) that are inclined at 45°, and reflects the light rays from the camera 62 so as to split them upwards and downwards. Therefore, the camera 62 has an upward field of view and a downward field of view so as to image the area above and below the imaging device 6 using the reflective optical system 64. In other words, the imaging device 6 has two fields of view, one above and one below.

[0040] In Embodiment 1, the cylindrical member 63 is arranged to extend in the X direction (for example, horizontally).

[0041] The second moving device 69 moves the imaging device 6 forward and backward in the X direction to bring it closer to and further away from the mounting head 5, and also moves it in the Y direction. Specifically, the second moving device 69 moves the imaging device 6 between imaging positions P10 and P11 and a retracted position P12, which are aligned in the X direction. Imaging position P10 is the position where the tip 6A of the imaging device 6 is positioned above the stage 8, and the imaging device 6 takes images of the recognition marks 71A and 72A. Imaging position P11 is the position where the tip 6A of the imaging device 6 is positioned above the stage 8, and the imaging device 6 takes images of the recognition marks 71B and 72B. Since the recognition marks 71A and 71B are aligned diagonally across the part 11, imaging position P10 and imaging position P11 are also offset in the Y direction. Retracted position P12 is a position away in the X direction from the space between the mounting head 5 and the stage 8.

[0042] On the other hand, the second moving device 69 maintains a constant height (imaging height H4) of the imaging device 6. Therefore, the distance from the recognition marks 72A and 72B on the substrate 12 to the reflective optical system 64 is constant between the arrangement shown in Figure 2 and the arrangement shown in Figure 3. As a result, whether the imaging device 6 is positioned outside the housing 52 or inside the housing 52 in the internal space K1, the camera 62's focus is aligned with the recognition marks 72A and 72B.

[0043] As shown in Figure 2, the imaging height H4 is lower than the first height H1. Therefore, when the mounting head 5 is at the first height H1, the imaging device 6 is positioned below the suction nozzle 51 and the component 11. When the imaging device 6 is at imaging positions P10 and P11, the tip 6A of the imaging device 6 is sandwiched between the mounting head 5 and the substrate 12, and the component 11, the reflective optical system 64, and the substrate 12 are aligned in the Z direction. The camera 62 then images the recognition marks 71A and 71B on the upper component 11 and the recognition marks 72A and 72B on the lower substrate 12, respectively.

[0044] On the other hand, as shown in FIG. 3, the imaging height H4 is higher than the second height H2 and the third height H3. Therefore, when the mounting head 5 is positioned at the third height H3, the imaging device 6 is positioned above the suction nozzle 51 and the component 11. When the imaging device 6 is positioned at the imaging positions P10 and P11, the tip 6A of the imaging device 6 is positioned within the internal space K1 of the housing 52, and the reflection optical system 64 is positioned above the suction nozzle 51. Thus, the camera 62 images the recognition marks 71A and 71B of the lower component 11 and the recognition marks 72A and 72B of the substrate 12 from the inside of the internal space K1 through the through-hole 54, the suction nozzle 51, and the component 11. The camera 62 can image the recognition mark 71A of the component 11 and the recognition mark 72A of the substrate 12 in one image simultaneously, and can image the recognition mark 71B of the component 11 and the recognition mark 72B of the substrate 12 in one image simultaneously.

[0045] In addition, the second moving device 69 may also move the imaging device 6 in the Z direction.

[0046] Next, the housing 52 of the mounting head 5 will be described in more detail with reference to FIGS. 4 to 6. FIG. 4 is a perspective view of the housing 52. FIG. 5 is a cross-sectional view of the housing 52 in the XY plane. FIG. 6 is a cross-sectional view of the housing 52 in the XZ plane.

[0047] As shown in FIG. 4, the housing 52 is a box-shaped member. Specifically, the housing 52 has an upper wall portion 55, a side wall portion 56, and a lower wall portion 57. The through-hole 53 is formed in one surface of the side wall portion 56. An additional through-hole may be formed in the surface of the side wall portion 56 facing the surface in which the through-hole 53 is formed.

[0048] The housing 52 is formed of, for example, metal and does not have permeability to infrared rays. Therefore, two through-holes 54 are formed in the lower wall portion 57 of the housing 52 so as to allow infrared rays to pass through.

[0049] As shown in Figures 5 and 6, the housing 52 forms channels 74A, 74B and channel 75 within the thickness of the lower wall 57. Channels 74A and 74B are channels for adsorbing the suction nozzle 51, and channel 75 is a channel for adsorbing the component 11 onto the suction nozzle 51. Channels 74A and 74B extend from an opening 77 provided on the lower surface of the lower wall 57 and are connected to a vacuum pump (not shown). Channel 75 extends from an opening 78 provided on the lower surface of the lower wall 57 and communicates with the through hole 51A (Figure 6) of the suction nozzle 51 and is connected to a vacuum pump (not shown).

[0050] The thickness of the side walls 56 and bottom wall 57 of the housing 52 is greater than the thickness of the suction nozzle 51. With this configuration, the rigidity of the housing 52 can be maintained even when an internal space K1 is provided in the housing 52.

[0051] Next, the optical system of the imaging device 6 will be described with reference to Figure 7. Figure 7 is a schematic diagram of the imaging device.

[0052] As shown in Figure 7, the camera 62 has an image sensor 62a, such as a CMOS camera.

[0053] The camera 62 is located to the side (+X side) of the reflective optical system 64. In Embodiment 1, the reflective optical system 64 is a branching prism that splits light rays.

[0054] The light rays L1 and L2 incident on the camera 62 will now be described. Light ray L1 extends from above the imaging device 6 in the -Z direction, is bent by 90° by the first reflective surface 64A of the reflective optical system 64 and deflected in the +X direction before incident on the camera 62. Light ray L2 extends from below the imaging device 6 in the +Z direction, is bent by 90° by the second reflective surface 64B of the reflective optical system 64 and deflected in the +X direction before incident on the camera 62.

[0055] (Operation) With the above configuration, an example of the mounting operation of the mounting device 1 will be described with reference to Figures 8 to 17B. Figure 8 is a flowchart of the mounting operation of the mounting device 1. Figures 9 to 13 are schematic diagrams of the mounting device 1 showing the mounting operation. Figures 14A to 17B are images D1 to D3 and D11 to D13 captured by the imaging device 6.

[0056] First, as shown in Figure 8, the control unit C causes the pickup head 3 to hold the parts 11 in the parts supply unit 2, and the inversion unit 4 inverts the pickup head 3 from downward to upward. The control unit C may select the parts 11 to be held based on information such as a production program.

[0057] Next, the control unit C drives the first moving device 59 to move the mounting head 5 near the pickup head 3 and lower it so that the mounting head 5 can receive the component 11 held by the pickup head 3 (S10).

[0058] Next, as shown in Figure 9, the control unit C drives the first moving device 59 to move the mounting head 5, which holds the component 11, to a first height H1 above the substrate 12 (S11). The imaging device 6 is located in the retracted position P12.

[0059] Next, as shown in Figure 10, the control unit C drives the second moving device 69 to move the imaging device 6 from the retracted position P12 to the imaging position P10 (S12). As a result, the tip of the cylindrical member 63 of the imaging device 6 is positioned between the component 11 and the substrate 12. That is, the component 11 is located above the reflective optical system 64, and the substrate 12 is located below the reflective optical system 64.

[0060] Therefore, the control unit C causes the camera 62 to capture a component image D1 (Figure 14A) relating to the upper component 11 and a substrate image D2 (Figure 14B) relating to the lower substrate 12 via the reflective optical system 64 (S13). Specifically, the camera 62 captures a component image D1 including the recognition mark 71A of the component 11 and a substrate image D2 including the recognition mark 72A of the substrate 12. Although images D1 and D2 are shown separately in Figures 14A and 14B, the camera 62 captures a single image having the component image D1 at the top and the substrate image D2 at the bottom. The control unit C stores images D1 and D2 in the storage unit C2.

[0061] Next, the control unit C drives the second moving device 69 to move the imaging device 6 from imaging position P10 to imaging position P11 in the XY direction, causing the camera 62 to capture a component image D11 (Figure 15A) including the recognition mark 71B and a substrate image D12 (Figure 15B) including the recognition mark 72B (S13). Although images D11 and D12 are shown separately in Figures 15A and 15B, the camera 62 captures a single image with the component image D11 at the top and the substrate image D12 at the bottom. The control unit C stores images D11 and D12 in the storage unit C2.

[0062] Next, the control unit C drives the second moving device 69 to move the imaging device 6 from the imaging position P11 to the retracted position P12 (S14). By positioning the imaging device 6 at the retracted position P12, interference between the imaging device 6 and the mounting head 5 can be suppressed when the mounting head 5 moves up and down.

[0063] Next, the control unit C calculates the amount of misalignment of the component 11 relative to the substrate 12 based on images D1, D2, D11, and D12, and drives the first moving device 59 to align the component 11 with the substrate 12 (S15). Specifically, the control unit C rotates the mounting head 5 around the Z axis and moves the stage 8 in the XY direction.

[0064] Next, as shown in Figure 11, the control unit C drives the first moving device 59 to lower the aligned mounting head 5 to the third height H3 (S16).

[0065] Next, as shown in Figure 12, the control unit C drives the second moving device 69 to move the imaging device 6 from the retracted position P12 to the imaging position P10 (S17). As a result, the reflective optical system 64 at the tip of the cylindrical member 63 of the imaging device 6 is located within the internal space K1 of the housing 52 of the mounting head 5. That is, the components 11 and the substrate 12 are located below the reflective optical system 64.

[0066] Therefore, the control unit C instructs the camera 62 to capture an overlaid image D3 relating to the component 11 and the substrate 12 (S18). Specifically, the camera 62 captures an overlaid image D3 (Figure 16A) that includes the recognition mark 71A of the component 11 and the recognition mark 72A of the substrate 12. The control unit C stores the overlaid image D3 in the storage unit C2.

[0067] The control unit C drives the second moving device 69 to move the imaging device 6 from imaging position P10 to imaging position P11 in the XY direction, causing the camera 62 to capture a superimposed image D13 (Figure 16B) including the recognition mark 71B of the component 11 and the recognition mark 72B of the substrate 12 (S18). At imaging position P11, the reflective optical system 64 is located within the internal space K1 of the housing 52 of the mounting head 5. The control unit C stores the superimposed image D13 in the storage unit C2.

[0068] By performing alignment based on images D1, D2, D11, and D12 before capturing images D3 and D13, the recognition marks 71A, 72A and recognition marks 71B, 72B can be brought closer to each other, allowing both recognition marks to be placed within the field of view of the camera 62.

[0069] Next, the control unit C drives the second moving device 69 to move the imaging device 6 from the imaging position P11 to the retracted position P12 (S19).

[0070] Next, the control unit C calculates the amount of misalignment of the component 11 relative to the substrate 12 based on the superimposed images D3 and D13, and drives the first moving device 59 to align the component 11 with the substrate 12 (S20). Specifically, the control unit C rotates the mounting head 5 around the Z axis to move the stage 8 in the XY direction.

[0071] The control unit C maintains the height position of the mounting head 5 at a third height H3 between the acquisition of superimposed images D3 and D13 and the alignment of the mounting head 5.

[0072] As shown in Figures 17A and 17B, the control unit C may, after aligning the component 11, have the imaging device 6 capture superimposed images D3 and D13 again to confirm that the alignment was successful.

[0073] Next, as shown in Figure 13, the control unit C drives the first moving device 59 to lower the aligned mounting head 5 to the second height H2 and mount the component 11 onto the substrate 12 (S21). After mounting the component 11 onto the substrate 12, the control unit C may have the imaging device 6 capture another superimposed image D3, or perform a post-mounting positional misalignment inspection.

[0074] (Effects) The mounting device 1 according to Embodiment 1 can achieve the following effects.

[0075] As described above, the mounting apparatus 1 of Embodiment 1 includes a stage 8 that supports a substrate 12, and a mounting head 5 having a suction nozzle 51 (nozzle) for holding components 11 and a housing 52 that holds the suction nozzle 51 and forms an internal space K1. The mounting apparatus 1 further includes a first moving device 59 for moving the mounting head 5 relative to the stage 8, and a control unit C for controlling the first moving device 59 based on superimposed images D3, D13 (first images). The mounting apparatus 1 further includes an imaging device 6 having a camera 62 (infrared camera) for capturing superimposed images D3, D13 including recognition marks 71A, 71B (first recognition marks) of components 11 and recognition marks 72A, 72B (second recognition marks) of the substrate 12. The mounting apparatus 1 further includes a second moving device 69 for moving the imaging device 6 relative to the mounting head 5. At least a portion of the components 11 is transparent to infrared light. The suction nozzle 51 is transparent to infrared light (has a first transparent portion) at a position facing the recognition marks 71A and 71B of the held component 11. When the mounting head 5 is positioned at a third height H3 (first height) by the first moving device 59, the imaging device 6 is moved by the second moving device 69 so that the tip 6A of the imaging device 6 is located in the internal space K1 of the housing 52, and superimposed images D3 and D13 are captured from imaging positions P10 and P11 through the first transparent portion.

[0076] With this configuration, the component 11 and the substrate 12 can be imaged from inside the housing 52, that is, from above the suction nozzle 51, so that superimposed images D3 and D13 can be imaged with the mounting head 5 close to the substrate 12. As a result, the vertical distance from the third height H3 where the superimposed images D3 and D13 are imaged to the substrate 12 can be reduced, and the occurrence of positional displacement due to the descent of the mounting head 5 from the third height H3 to the substrate 12 can be suppressed. In addition, if the component 11 and the substrate 12 are imaged with separate cameras, if each camera shows different deformation due to heat, it will cause positional displacement between the component 11 and the substrate 12. However, by imaged with a single camera 62, positional displacement can be suppressed. Therefore, the mounting accuracy is improved by the mounting device 1.

[0077] In the mounting apparatus 1 of Embodiment 1, the third height H3 is higher than the second height H2 of the mounting head 5 when mounting the component 11.

[0078] With this configuration, contact between the component 11 and the substrate 12 can be avoided at the third height H3, making it easier to align the component 11 and the substrate 12.

[0079] The mounting apparatus 1 of Embodiment 1 further includes a component supply unit 2 that supplies components 11 to the mounting head 5. The third height H3 is closer to the second height H2 than the first height H1 (third height) of the mounting head when it reaches the top of the stage from the component supply unit while holding the components.

[0080] This configuration allows the third height H3 to be brought closer to the second height H2, i.e., the substrate 12. Therefore, the occurrence of positional misalignment due to the descent of the mounting head 5 from the third height H3 to the second height H2 can be suppressed.

[0081] In the mounting apparatus 1 of Embodiment 1, the distance G1 between the component 11 held by the mounting head 5 and the substrate 12 at the third height H3 is smaller than the dimension G2 in the Z direction (height direction) of the tip 6A of the imaging apparatus 6.

[0082] This configuration allows the third height H3 to be brought even closer to the substrate 12. Furthermore, even when the imaging device 6 cannot be placed below the component 11, the recognition marks 71A and 71B of the component 11 can be imaged.

[0083] In the mounting apparatus 1 of Embodiment 1, the distance G1 between the component 11 held by the mounting head 5 and the substrate 12 at the third height H3 is smaller than the depth of field of the camera 62.

[0084] With this configuration, at the third height H3, the camera 62 can focus on both the component 11 and the substrate 12.

[0085] In the mounting apparatus 1 of Embodiment 1, the distance G1 between the component 11 held by the mounting head 5 and the substrate 12 at the third height H3 is 0.5 mm or less.

[0086] This configuration allows the third height H3 to be brought even closer to the substrate 12.

[0087] In the mounting apparatus 1 of Embodiment 1, the control unit C controls the first moving device 59 based on the superimposed image D3, maintaining the third height H3, and moves the mounting head 5 relative to the stage 8 in the XY direction which is perpendicular to the Z direction (height direction).

[0088] With this configuration, by performing imaging and alignment at the same height, it is possible to suppress the occurrence of positional misalignment caused by the raising and lowering of the mounting head 5 between imaging and alignment.

[0089] In the mounting device 1 of Embodiment 1, the housing 52 has a through hole 54 (second transparent portion) that is transparent to infrared rays at a position facing the recognition marks 71A and 71B of the held component 11.

[0090] With this configuration, infrared rays can pass through even if the housing 52 is not made of a material that is transparent to infrared rays. In addition, forming the housing 52 from metal makes it easier to manufacture the housing 52.

[0091] In the mounting apparatus 1 of Embodiment 1, when the mounting head 5 is positioned at a first height H1 (fourth height) higher than the third height H3, the imaging device 6 is movable between the mounting head 5 and the substrate 12 by the second moving device 69. The imaging device 6 includes a reflective optical system 64 having a first reflective surface 64A that reflects light from above the imaging device 6 and causes it to enter the camera 62, and a second reflective surface 64B that reflects light from below the imaging device 6 and causes it to enter the camera 62. The imaging device 6 captures component images D1, D11 (second images) including recognition marks 71A, 71B of the component 11, and substrate images D2, D12 (third images) including recognition marks 72A, 72B of the substrate 12. The control unit C controls the first moving device 59 based on the superimposed images D3, D13, component images D1, D11, and substrate images D2, D12.

[0092] With this configuration, objects located above the imaging device 6, such as the component 11 held by the mounting head 5 at a first height H1, can also be imaged, and alignment can be performed using the component images D1, D11 and the substrate images D2, D12.

[0093] The control method for the mounting apparatus 1 of Embodiment 1 includes holding a component 11 with a suction nozzle 51 held in the housing 52 of the mounting head 5, and moving the mounting head 5 above the stage 8 supporting the substrate 12 using a first moving device 59. The control method also includes moving the mounting head 5 to a third height H3 relative to the stage 8 using the first moving device 59. When the mounting head 5 is at the third height H3, the control method includes moving the imaging device 6 having a camera 62 to an imaging position above the suction nozzle 51 where the tip 6A of the imaging device 6 is located in the internal space K1 formed by the housing 52 of the mounting head 5 using a second moving device 69. The control method includes causing the imaging device 6 to capture superimposed images D3 and D13, which include the recognition marks 71A and 71B of the component 11 and the recognition marks 72A and 72B of the substrate 12, through the first transparent portion of the suction nozzle 51 from imaging positions P10 and P11, and controlling the first moving device 59 based on the superimposed images D3 and D13. At least a portion of the component 11 is transparent to infrared light. The suction nozzle 51 (first transparent portion) is transparent to infrared light and faces the recognition marks 71A and 71B of the held component 11.

[0094] With this configuration, by imaging the recognition marks 71A, 71B, 72A, and 72B closer to the second height H2 where the mounting takes place than to the first height H1, it is possible to suppress the recurrence of positional displacement due to the raising and lowering of the mounting head 5.

[0095] This disclosure is not limited to Embodiment 1, and can be implemented in various other forms.

[0096] In Embodiment 1, an example was described in which the component 11 is aligned with respect to the substrate 12, but the invention is not limited to this. For example, the component 11 may be aligned with other components already mounted on the substrate 12 or with other surfaces.

[0097] In Embodiment 1, an example was described in which the mounting head 5 rotates around the Z axis and the stage 8 moves in the X and Y directions, but the invention is not limited to this. The mounting head 5 only needs to be movable relative to the stage 8.

[0098] In Embodiment 1, an example was described in which the entire suction nozzle 51 is mainly composed of a material that is transparent to infrared rays, but the invention is not limited to this. The suction nozzle 51 only needs to have a transparent portion that is transparent to infrared rays at a position facing the recognition marks 71A and 71B of the held part 11 in the Z direction. The transparent portion may be a through hole. Also, an example was described in which the housing 52 has a through hole 54, but the invention is not limited to this. The housing 52 only needs to have a transparent portion that is transparent to infrared rays at a position facing the recognition marks 71A and 71B of the part 11 held by the suction nozzle 51 in the Z direction. That is, the through hole 54 may be filled with a transparent material. Furthermore, the housing 52 may not have a lower wall portion 57, and may hold the suction nozzle 51 at the lower end of the side wall portion 56.

[0099] In Embodiment 1, an example was described in which the camera 62 captures images D1, D2, D11, and D12 in addition to the superimposed images D3 and D13, but the invention is not limited to this. If the component holding accuracy of the mounting head 5 is high and the positional misalignment between the component 11 and the substrate 12 after step S11 is small, the camera 62 may capture only the superimposed images D3 and D13.

[0100] Furthermore, while an example has been described in which the imaging device 6 captures images D1 and D2 when the mounting head 5 is located at a first height H1, the imaging device 6 is not limited to this. The imaging device 6 only needs to capture images D1 and D2 when the mounting head 5 is located at a height higher than the third height H3.

[0101] In Embodiment 1, an example was described in which the reflective optical system 64 is provided at the tip of the cylindrical member 63, but the invention is not limited to this. The reflective optical system 64 may also be provided inside the housing 52 of the mounting head 5.

[0102] In Embodiment 1, an example was described in which the cylindrical member 63 extends in the X direction, but the invention is not limited to this. For example, the imaging device 6 may be installed at an angle with respect to the X direction, as shown in Modification 1 described later.

[0103] In Embodiment 1, an example was described in which the mounting head 5 has a housing 52, but the invention is not limited to this. The mounting head 5 may also have a shaft above the suction nozzle 51 that holds the suction nozzle 51, as shown in Modification 2 described later.

[0104] In Embodiment 1, an example was described in which the imaging device 6 has only a camera 62, but it is not limited to this. The imaging device 6 may have other cameras in addition to the camera 62. The other cameras may be visible light cameras or infrared cameras. If the other cameras are visible light cameras, the mounting device 1 can be manufactured at a low cost. Even if the imaging device 6 has two cameras, the imaging device 6 may only capture the superimposed image D3.

[0105] In Embodiment 1, an example was described in which the recognition marks captured in component images D1 and D11 and the recognition marks captured in the superimposed image D3 are the same recognition marks, but the invention is not limited to this. Similarly, an example was described in which the recognition marks captured in substrate images D2 and D12 and the recognition marks captured in the superimposed image D3 are the same recognition marks, but the invention is not limited to this. The recognition marks captured in component images D1 and D11 and substrate images D2 and D12 may be different from the recognition marks captured in the superimposed image D3.

[0106] [Modified Examples] Modified examples are described below. In the modified examples, components that are the same as or equivalent to those in Embodiment 1 are denoted by the same reference numerals and described accordingly, and descriptions that are redundant with Embodiment 1 are omitted.

[0107] (Modification 1) Figure 18 is a schematic diagram of a part of the mounting device 101 according to Modification 1. As shown in Figure 18, the mounting device 101 has an imaging device 106 instead of an imaging device 6. The imaging device 106 is positioned at an upward inclination with respect to the X direction (horizontal), from the tip 106A to the base 106B. Specifically, the imaging device 106 is positioned at an upward inclination from the reflective optical system 64 toward the cameras 61 and 62. The inclination angle of the imaging device 106 may be 3° or more and 10° or less, and is preferably 6°.

[0108] The reflective surfaces 64A and 64B of the reflective optical system 64 are tilted at an angle deviating from 45° so as to reflect the light rays incident from the cameras 61 and 62 upward or downward along the Z direction.

[0109] The second moving device 69 moves the imaging device 106 while it is tilted. That is, the tilt angle of the imaging device 106 is fixed.

[0110] The stage 108 has a heater 118. By tilting the imaging device 106, the heat from the heater 118 reaching the cameras 61 and 62 can be suppressed. In addition, interference between the imaging device 106 and other components of the mounting device 101 can be suppressed.

[0111] (Modification 2) Figure 19 is a schematic diagram of a part of the mounting device 201 according to Modification 2. As shown in Figure 19, the mounting device 201 has a mounting head 205 instead of a mounting head 5. The mounting head 205 has a shaft 252 extending in the Z direction instead of a housing 52. When viewed from the Z direction, the shaft 252 is formed at a position away from the recognition marks 71A and 71B of the held part 11. In Modification 2, the shaft 252 holds the suction nozzle 51 in the center by suction.

[0112] At imaging positions P10 and P11, the tip 6A of the imaging device 6 is away from the shaft 252 (in the Y direction in Figure 19). Therefore, the imaging device 6 can image the recognition marks 71A, 71B, 72A, and 72B.

[0113] (Modification 3) Figure 20 is a schematic diagram of a part of the mounting device 301 according to Modification 3. Figure 21 is a schematic diagram of the imaging device 306. As shown in Figure 20, the mounting device 301 has an imaging device 306 instead of an imaging device 6. The imaging device 306 has a first camera 361 in addition to a second camera 362 corresponding to camera 62.

[0114] The imaging device 306 includes a first camera 361, a second camera 362, a cylindrical member 63, and a reflective optical system 364. The first camera 361 is a visible light camera, and the second camera 362 is an infrared camera. The reflective optical system 364 has reflective surfaces 364A and 364B that are inclined at 45°. The first reflective surface 364A reflects light rays from above the imaging device 306 toward the first camera 361, and the second reflective surface 364B reflects light rays from below the imaging device 306 toward the second camera 362. Therefore, the first camera 361 images the area above the imaging device 306, and the second camera 362 images the area below the imaging device 306.

[0115] As shown in Figure 21, the two cameras 361 and 362 each have image sensors 361a and 362a, such as CMOS cameras. The reflective optical system 364 has a configuration in which two triangular prisms, each having a reflective surface on an inclined surface, are bonded together so that the inclined surfaces are in contact with each other. Therefore, the first reflective surface 364A that reflects the light ray L1 to the first camera 361 and the second reflective surface 364B that reflects the light ray L2 to the second camera 362 are on opposite sides of the same plane.

[0116] The imaging device 306 has a reflective optical system 365 and a reflective optical system 366 in addition to the reflective optical system 364. The reflective optical systems 365 and 366 are housed in a cylindrical member 63. The reflective optical systems 365 and 366 are reflective prisms having reflective surfaces, but they may also be reflective mirrors. The reflective surfaces of the reflective optical systems 365 and 366 are tilted at 45° around the Z axis so as to face the reflective optical system 364. By providing the reflective optical systems 365 and 366, the cameras 361 and 362 can be positioned so that their optical axes are parallel to each other.

[0117] Light ray L1 is bent 90° from above the imaging device 306 by the reflective optical system 364, then bent 90° by the reflective optical system 365 and deflected in the +X direction before entering the first camera 361. Light ray L2 is bent 90° from below the imaging device 306 by the reflective optical system 364, then bent 90° by the reflective optical system 366 and deflected in the +X direction before entering the second camera 362.

[0118] In the operation of the mounting device 301, when the mounting head 5 is positioned at a first height H1, the control unit C causes the first camera 361 to capture part images D1 and D11 of the upper part 11, and the second camera 362 to capture substrate images D2 and D12 of the lower substrate 12 (S13).

[0119] On the other hand, when the mounting head 5 is located at the third height H3 and the imaging device 306 is located in the internal space K1, the first camera 361 does not perform imaging.

[0120] The mounting apparatus in the first embodiment comprises a stage for supporting a substrate, a mounting head having a nozzle for holding a component and a housing for holding the nozzle and forming an internal space, a first moving device for moving the mounting head relative to the stage, an imaging device having an infrared camera for capturing a first image including a first recognition mark on a component and a second recognition mark on a substrate, a second moving device for moving the imaging device relative to the mounting head, and a control unit for controlling the first moving device based on the first image, wherein at least a portion of the component is transparent to infrared light, the nozzle has a first transparent portion that is transparent to infrared light at a position facing the first recognition mark on the held component, and when the mounting head is positioned at a first height by the first moving device, the imaging device is movable by the second moving device to an imaging position where the tip of the imaging device is located in the internal space of the housing, and captures the first image from the imaging position through the first transparent portion.

[0121] In the second embodiment, the mounting apparatus is such that, in the first embodiment, the first height is higher than the second height of the mounting head when mounting components.

[0122] In the third embodiment, the mounting apparatus further comprises a component supply unit for supplying components to the mounting head, wherein the first height is closer to the second height than the third height of the mounting head when it reaches the top of the stage from the component supply unit while holding the components.

[0123] In the fourth embodiment, the mounting apparatus is such that, in any of the first to third embodiments, the distance between the component held by the mounting head and the substrate at a first height is smaller than the height dimension of the tip of the imaging device.

[0124] In the fifth embodiment, as a mounting apparatus, in any of the first to fourth embodiments, the distance between the component held by the mounting head and the substrate at a first height is smaller than the depth of focus of the infrared camera.

[0125] In the sixth embodiment, as a mounting apparatus, in any of the first to fifth embodiments, the distance between the component held by the mounting head and the substrate at a first height is 0.5 mm or less.

[0126] As a mounting apparatus in the seventh embodiment, in a mounting apparatus in any of the first to sixth embodiments, the control unit controls the first moving device based on the first image while maintaining a first height, and moves the mounting head relative to the stage in a direction perpendicular to the height direction.

[0127] In the eighth embodiment, as a mounting device, in any of the first to seventh embodiments, the housing has a second transparent portion that is transparent to infrared rays at a position opposite to the first recognition mark of the held component.

[0128] In the ninth embodiment, as a mounting device, the second transparent portion of the housing is a through hole in the mounting device of the eighth embodiment.

[0129] As a mounting apparatus in the tenth embodiment, in a mounting apparatus in any of the first to ninth embodiments, when the mounting head is positioned at a fourth height higher than the first height, the imaging device is movable between the mounting head and the substrate by a second moving device, and the imaging device includes a reflective optical system having a first reflective surface that reflects light from above the imaging device and causes it to enter an infrared camera, and a second reflective surface that reflects light from below the imaging device and causes it to enter an infrared camera, and captures a second image including a first recognition mark of a component and a third image including a second recognition mark of the substrate, and the control unit controls the first moving device based on the first image, the second image and the third image.

[0130] As a mounting apparatus in the eleventh embodiment, in a mounting apparatus in any of the first to ninth embodiments, when the mounting head is positioned at a fourth height higher than the first height, the imaging device is movable between the mounting head and the substrate by a second moving device, and the imaging device further comprises a camera separate from the infrared camera, a reflective optical system having a first reflective surface that reflects light from above the imaging device and causes it to enter the other camera, and a second reflective surface that reflects light from below the imaging device and causes it to enter the infrared camera, the other camera captures a second image including a first recognition mark of a component, the infrared camera captures a third image including a second recognition mark of the substrate, and the control unit controls the first moving device based on the first image, the second image and the third image.

[0131] In the twelfth embodiment, as an implementation device, the other camera in the implementation device of the eleventh embodiment is a visible light camera.

[0132] In the 13th embodiment, the mounting device is arranged in any of the first to 12 embodiments, with the imaging device inclined upward from the front end to the base end with respect to the horizontal.

[0133] A control method for a mounting apparatus in a 14th embodiment includes: holding a component in a nozzle held in the housing of a mounting head; moving the mounting head above a stage supporting a substrate using a first moving device; moving the mounting head to a first height relative to the stage using the first moving device; when the mounting head is at the first height, moving an imaging device having an infrared camera to an imaging position where the tip of the imaging device is located in the internal space formed by the housing of the mounting head using a second moving device; causing the imaging device to capture a first image including a first recognition mark on the component and a second recognition mark on the substrate through a first transparent portion of the nozzle from the imaging position; and controlling the first moving device based on the first image, wherein at least a portion of the component is transparent to infrared light, and the first transparent portion is transparent to infrared light and faces the first recognition mark on the held component.

[0134] While this disclosure is adequately described in relation to preferred embodiments with reference to the accompanying drawings, various modifications and alterations will be obvious to those skilled in the art. Such modifications and alterations should be understood to be included within the scope of the invention as defined by the appended claims.

[0135] The mounting apparatus of this disclosure has the effect of aligning components to predetermined positions on a substrate and is particularly useful in mounting apparatuses for components such as high-speed, high-capacity memory, application processors, and CPUs.

[0136] 1 Mounting device 2 Component supply unit 5 Mounting head 6 Imaging device 8 Stage 11 Component 12 Substrate 51 Suction nozzle 52 Housing 53 Through hole 54 Through hole 59 First moving device 62 Camera (infrared camera) 63 Cylindrical member 64 Reflective optical system 69 Second moving device 71A, 71B Recognition mark 72A, 72B Recognition mark

Claims

1. A mounting device comprising: a stage for supporting a substrate; a mounting head having a nozzle for holding a component and a housing that holds the nozzle and forms an internal space; a first moving device for moving the mounting head relative to the stage; an imaging device having an infrared camera for capturing a first image including a first recognition mark on the component and a second recognition mark on the substrate; a second moving device for moving the imaging device relative to the mounting head; and a control unit for controlling the first moving device based on the first image, wherein at least a portion of the component is transparent to infrared light; the nozzle has a first transparent portion that is transparent to infrared light at a position facing the first recognition mark on the held component; and when the mounting head is positioned at a first height by the first moving device, the imaging device is movable by the second moving device to an imaging position where the tip of the imaging device is located in the internal space of the housing, and captures the first image from the imaging position through the first transparent portion.

2. The mounting apparatus according to claim 1, wherein the first height is higher than the second height of the mounting head when mounting the component.

3. The mounting apparatus according to claim 2, further comprising a component supply unit for supplying the component to the mounting head, wherein the first height is closer to the second height than the third height of the mounting head when it reaches the top of the stage from the component supply unit while holding the component.

4. The mounting apparatus according to claim 1, wherein the distance between the component held by the mounting head and the substrate at the first height is smaller than the height dimension of the tip of the imaging apparatus.

5. The mounting apparatus according to claim 1, wherein the distance between the component held by the mounting head and the substrate at the first height is smaller than the depth of focus of the infrared camera.

6. The mounting apparatus according to claim 1, wherein the distance between the component held by the mounting head and the substrate at the first height is 0.5 mm or less.

7. The mounting apparatus according to claim 1, wherein the control unit controls the first moving device while maintaining the first height based on the first image, and moves the mounting head relative to the stage in a direction perpendicular to the height direction.

8. The mounting apparatus according to claim 1, wherein the housing has a second transparent portion that is transparent to infrared rays at a position opposite to the first recognition mark of the held component.

9. The mounting apparatus according to claim 8, wherein the second transparent portion of the housing is a through hole.

10. When the mounting head is positioned at a fourth height higher than the first height, the imaging device is movable between the mounting head and the substrate by the second moving device, and the imaging device includes a reflective optical system having a first reflective surface that reflects light from above the imaging device and causes it to enter the infrared camera, and a second reflective surface that reflects light from below the imaging device and causes it to enter the infrared camera, and captures a second image including the first recognition mark of the component and a third image including the second recognition mark of the substrate, and the control unit controls the first moving device based on the first image, the second image and the third image, the mounting device according to claim 1.

11. When the mounting head is positioned at a fourth height higher than the first height, the imaging device is movable between the mounting head and the substrate by the second moving device, the imaging device further comprises: a camera other than the infrared camera; a reflective optical system having a first reflective surface that reflects light from above the imaging device and causes it to enter the other camera; and a second reflective surface that reflects light from below the imaging device and causes it to enter the infrared camera, the other camera captures a second image including the first recognition mark of the component; the infrared camera captures a third image including the second recognition mark of the substrate; and the control unit controls the first moving device based on the first image, the second image, and the third image, the mounting device according to claim 1.

12. The mounting apparatus according to claim 11, wherein the other camera is a visible light camera.

13. The mounting apparatus according to any one of claims 1 to 12, wherein the imaging device is arranged to be inclined upward from the tip to the base with respect to the horizontal.

14. A method for controlling a mounting device, comprising: holding a component in a nozzle held in the housing of a mounting head; moving the mounting head above a stage supporting a substrate using a first moving device; moving the mounting head to a first height relative to the stage using the first moving device; when the mounting head is at the first height, moving an imaging device having an infrared camera to an imaging position where the tip of the imaging device is located in the internal space formed by the housing of the mounting head using a second moving device; causing the imaging device to capture a first image from the imaging position through a first transparent portion of the nozzle, including a first recognition mark on the component and a second recognition mark on the substrate; and controlling the first moving device based on the first image, wherein at least a portion of the component is transparent to infrared light, and the first transparent portion is transparent to infrared light and faces the first recognition mark on the held component.

Images