Antenna module and communication device

Abstract

An antenna module (100) comprises: a first substrate (131) having a first main surface (11) and a second main surface (12) facing each other; a second substrate (132) disposed on the second main surface (12) side; a third substrate (133) disposed between the first substrate (131) and the second substrate (132); a patch antenna (141) disposed on the first substrate (131) along the first main surface (11); a first dipole antenna (151) disposed so as to intersect the first main surface (11); and a second dipole antenna disposed on the third substrate (133) along the surface of the third substrate (133) facing the second main surface (12). The first dipole antenna (151) has a first element (1511) and a second element (1512). The first element (1511) is disposed across the first substrate (131) and the third substrate (133), and the second element (1512) is disposed across the second substrate (132) and the third substrate (133).

Description

Antenna module and communication device

[0001] The present disclosure relates to an antenna module and a communication device.

[0002] U.S. Patent Application Publication No. 2022 / 0336967 (Patent Document 1) describes an antenna module including a plurality of substrates, a patch antenna, a dipole antenna, and a monopole antenna. According to the description of U.S. Patent Application Publication No. 2022 / 0336967, the patch antenna, the dipole antenna, and the monopole antenna are housed in any of the plurality of substrates. The patch antenna is attached to the substrate so as to radiate radio waves upward from the antenna module. The dipole antenna and the monopole antenna are provided on the side of the antenna module so as to radiate radio waves in the lateral direction of the antenna module.

[0003] U.S. Patent Application Publication No. 2022 / 0336967

[0004] In the antenna module described in Patent Document 1, since the size of the dipole antenna is limited by the thickness of the substrate, it is not possible to sufficiently ensure the height of the polarization wave in the thickness direction of the substrate radiated from the dipole antenna. For this reason, the antenna module described in Patent Document 1 has a problem of low gain.

[0005] The present disclosure has been made to solve the above problems, and an object thereof is to provide an antenna module capable of radiating radio waves in two directions by a patch antenna and a dipole antenna, and capable of sufficiently ensuring the height of the polarization wave in the thickness direction of the substrate radiated from the dipole antenna.

[0006] The antenna module relating to this disclosure comprises a first substrate having opposing first main surfaces and second main surfaces, a second substrate disposed on the second main surface side, a third substrate disposed between the first substrate and the second substrate, a patch antenna disposed on the first substrate along the first main surface, a first dipole antenna disposed so as to intersect the first main surface, and a second dipole antenna disposed on the third substrate along the surface of the third substrate facing the second main surface, wherein the first dipole antenna has a first element and a second element, the first element is disposed across the first substrate and the third substrate, and the second element is disposed across the second substrate and the third substrate.

[0007] According to this disclosure, an antenna module is provided that enables radio wave radiation in two directions using a patch antenna and a dipole antenna, and moreover, can sufficiently secure the polarization height in the thickness direction of the substrate radiated from the dipole antenna.

[0008] This is a block diagram of a communication device to which the antenna module according to Embodiment 1 is applied. This is a plan view of the antenna module according to Embodiment 1. This is a side perspective view of the antenna module according to Embodiment 1. This is a plan perspective view of the antenna module in Figure 3 as seen from the direction of arrow AR1. This is a diagram for comparing and explaining the relative permittivity of each dielectric substrate. This is a side perspective view of the antenna module according to Embodiment 2. This is a side perspective view of the antenna module according to Embodiment 3. This is a diagram schematically showing the configuration of a dipole antenna applied to the antenna module according to Embodiment 3. This is a side perspective view of the antenna module according to Embodiment 4. This is a diagram schematically showing the configuration of a dipole antenna applied to the antenna module according to Embodiment 4. This is a side perspective view of the antenna module according to Embodiment 5.

[0009] Hereinafter, each embodiment of this disclosure will be described in detail with reference to the drawings. Note that the same or corresponding parts in the drawings are denoted by the same reference numerals, and their descriptions will not be repeated.

[0010] [Embodiment 1] (Basic Configuration of Communication Device) Figure 1 is a block diagram of a communication device 10 to which the antenna module 100 according to Embodiment 1 is applied. The communication device 10 is, for example, a mobile terminal such as a mobile phone, smartphone or tablet, or a personal computer equipped with communication functions. An example of the frequency band of radio waves used in the antenna module 100 according to Embodiment 1 is, for example, millimeter-wave radio waves with center frequencies of 28 GHz, 39 GHz, and 60 GHz. Radio waves in frequency bands other than those mentioned above can also be applied to the antenna module 100 according to Embodiment 1.

[0011] Referring to Figure 1, the communication device 10 includes an antenna module 100 and a BBIC (Base Band Integrated Circuit) 200 that constitutes a baseband signal processing circuit. The antenna module 100 includes an RFIC (Radio Frequency Integrated Circuit) 110 and an antenna device 120.

[0012] The communication device 10 upconverts the signal transmitted from the BBIC 200 to the antenna module 100 into a high-frequency signal and radiates it from the antenna device 120, and also downconverts the high-frequency signal received by the antenna device 120 and processes the signal with the BBIC 200.

[0013] The antenna device 120 includes dielectric substrates 131 to 134. Dielectric substrates 131 to 134 are collectively referred to as "dielectric substrate 130". An antenna group 170, including a patch antenna 141 and dipole antennas 151 and 152, is arranged on the dielectric substrate 130. One antenna group 170 may be arranged on the dielectric substrate 130, or multiple antenna groups 170 may be arranged on the dielectric substrate 130. When multiple antenna groups 170 are arranged two-dimensionally on the dielectric substrate 130, an array-configured antenna module 100 is realized. Figure 1 shows an example in which four antenna groups 170 are arranged on the dielectric substrate 130.

[0014] The patch antenna 141 has two feed points offset in different directions from the center of the antenna, and a high-frequency signal is supplied to each feed point from the RFIC 110. The patch antenna 141 is configured to radiate radio waves in two mutually orthogonal polarization directions (first polarization direction and second polarization direction).

[0015] Furthermore, a patch antenna of a different size from the patch antenna 141 may be placed on the dielectric substrate 130. In this case, a so-called dual-band antenna module capable of radiating radio waves in two different frequency bands can be realized. When realizing a dual-band antenna module, the frequency band of the radio waves of one patch antenna may be set to the 39 GHz band (37.0 GHz to 43.5 GHz), and the frequency band of the radio waves of the other patch antenna may be set to the 28 GHz band (24.25 GHz to 29.5 GHz).

[0016] The RFIC 110 includes four feed circuits 110A to 110D. Feed circuit 110A is for supplying the high-frequency signal (first polarization direction) to the patch antenna 141. Feed circuit 110B is for supplying the high-frequency signal (second polarization direction) to the patch antenna 141. Feed circuit 110C is for supplying the high-frequency signal to the dipole antenna 151. Feed circuit 110D is for supplying the high-frequency signal to the dipole antenna 152. The internal configuration of feed circuits 110A to 110D is the same. Therefore, in Figure 1, for the sake of simplicity, only the detailed configuration of feed circuit 110A is shown, and the configurations of feed circuits 110B to 110D are omitted. Below, the function of feed circuit 110A will be described as a representative example.

[0017] The power supply circuit 110A includes switches 111A to 111D, 113A to 113D, and 117, power amplifiers 112AT to 112DT, low-noise amplifiers 112AR to 112DR, attenuators 114A to 114D, phase shifters 115A to 115D, signal combiner / distributor 116, mixer 118, and amplification circuit 119.

[0018] When transmitting a high-frequency signal, switches 111A to 111D and 113A to 113D are switched to the power amplifier 112AT to 112DT side, and switch 117 is connected to the transmitting amplifier of the amplification circuit 119. When receiving a high-frequency signal, switches 111A to 111D and 113A to 113D are switched to the low-noise amplifier 112AR to 112DR side, and switch 117 is connected to the receiving amplifier of the amplification circuit 119.

[0019] The intermediate frequency signal transmitted from the BBIC200 is amplified by the amplification circuit 119 and upconverted by the mixer 118. The upconverted high-frequency signal, which is the transmit signal, is split into four parts by the signal combiner / distributor 116 and passes through the corresponding signal paths to supply power to different radiating elements 121. The directivity of the radio waves output from the patch antenna 141 can be adjusted by individually adjusting the phase shift of the phase shifters 115A to 115D located in each signal path. The attenuators 114A to 114D adjust the strength of the transmit signal.

[0020] The received signals, which are high-frequency signals received by each patch antenna 141, are transmitted to the feed circuit 110A of the RFIC 110 and combined in the signal combiner / distributor 116 via four different signal paths. The combined received signals are down-converted to an intermediate frequency signal by the mixer 118, further amplified by the amplification circuit 119, and transmitted to the BBIC 200.

[0021] The RFIC 110 may be formed, for example, as a single-chip integrated circuit component including the above circuit configuration. Alternatively, it may be formed as separate integrated circuit components for each power supply circuit. Furthermore, for each device corresponding to a radiating element (switch, power amplifier, low-noise amplifier, attenuator, phase shifter), each corresponding antenna may be formed as a single-chip integrated circuit component.

[0022] (Outline of Antenna Module Configuration) Figure 2 is a plan view of the antenna module according to Embodiment 1. Figure 3 is a side perspective view of the antenna module according to Embodiment 1. Figure 4 is a plan perspective view of the antenna module of Figure 3 as seen from the direction of arrow AR1.

[0023] In the following, the normal direction of the dielectric substrate 131 is defined as the Z-axis direction, the direction along one of the two adjacent sides of the patch antenna 141 is defined as the X-axis, and the direction along the other side is defined as the Y-axis. In each figure, the positive Z-axis direction may be referred to as the upward side, and the negative Z-axis direction as the downward side.

[0024] As shown in Figure 3, the antenna module 100 includes dielectric substrates 131 to 134. When viewed from the Z-axis direction, the dielectric substrates 131 to 134 have a substantially rectangular shape. The dielectric substrates 131 to 134 are, for example, low-temperature co-fired ceramics (LTCC) multilayer substrates.

[0025] The dielectric substrate 131 has opposing first main surface 11 and second main surface 12. Dielectric substrates 132 and 134 are arranged on the second main surface 12 side. Dielectric substrate 133 is arranged between dielectric substrate 131 and dielectric substrates 132 and 134. Dielectric substrate 131 and dielectric substrate 133 are joined by a plurality of solder bumps 160. Dielectric substrate 132 and dielectric substrate 133 are joined by a plurality of solder bumps 160. Dielectric substrate 133 and dielectric substrate 134 are joined by a plurality of solder bumps 160.

[0026] The patch antenna 141 is positioned on the dielectric substrate 130 along the first main surface 11. The patch antenna 141 radiates radio waves generally in the Z-axis direction (upward from the antenna module 100). The patch antenna 141 may be positioned on the first main surface 11. Part or all of the patch antenna 141 may be embedded in the dielectric substrate 131.

[0027] The patch antenna 141 is fed at feed points SP1 and SP2. Feed point SP1 is offset in the Y-axis direction from the center of the patch antenna 141 when viewed from a plan view from the normal direction of the dielectric substrate 130. Feed point SP2 of the patch antenna 141 is offset in the X-axis direction from the center of the patch antenna 141 when viewed from a plan view from the normal direction of the dielectric substrate 130.

[0028] Therefore, the patch antenna 141 radiates radio waves with polarization in the X-axis direction and radio waves with polarization in the Y-axis direction. In this way, the patch antenna 141 is capable of radiating radio waves with polarization in a first direction and radio waves with polarization in a second direction different from the first direction.

[0029] As shown in Figure 3, the dipole antenna 151 is positioned along the side of the antenna module 100. As shown in Figure 2, the dipole antenna 152 is positioned along the side of the antenna module 100. Therefore, the dipole antennas 151 and 152 radiate radio waves generally in the Y-axis direction (lateral direction of the antenna module 100).

[0030] As shown in Figure 3, the dipole antenna 151 is positioned perpendicular to the first main surface 11. As shown in Figure 4, the dipole antenna 152 is positioned on the dielectric substrate 133 along the surface of the dielectric substrate 133 facing the second main surface 12. When the side of the antenna module 100 is viewed from the Y-axis direction, the dipole antenna 151 and the dipole antenna 152 are positioned on the antenna module 100 so that they are perpendicular to each other (see Figure 4).

[0031] Therefore, the dipole antenna 151 emits radio waves with polarization in the Z-axis direction (vertically polarized radio waves), and the dipole antenna 152 emits radio waves with polarization in the Y-axis direction (horizontally polarized radio waves). On the other hand, the patch antenna 141 emits radio waves with polarization in the X-axis direction and radio waves with polarization in the Y-axis direction, roughly in the Z-axis direction. Thus, the antenna module 100 realizes dual polarization in the upward and lateral directions. In other words, the antenna module 100 is capable of radiating radio waves with two different polarization directions in the upward and lateral directions.

[0032] Furthermore, when viewing the side of the antenna module 100 from the Y-axis direction, it is sufficient that the dipole antenna 151 and the dipole antenna 152 intersect, and they do not necessarily have to be orthogonal. The dipole antenna 151 is sufficient that it intersects the first main surface 11, and the first main surface 11 and the dipole antenna 151 do not necessarily have to be orthogonal.

[0033] The dipole antenna 151 has elements 1511 and 1512. Element 1511 is fed at feed point SP11. Element 1512 is fed at feed point SP12.

[0034] Element 1511 is arranged across dielectric substrate 131 and dielectric substrate 133. The portion of element 1511 that is placed on dielectric substrate 131 and the portion of element 1511 that is placed on dielectric substrate 133 are joined together by solder bumps 160.

[0035] The first main surface 11 of the dielectric substrate 131 and the tip of the element 1511 may be flush. The tip of the element 1511 may protrude from the first main surface 11 of the dielectric substrate 131. The tip of the element 1511 may be located inside the dielectric substrate 131. A part of the element 1511 may protrude from the side surface of the dielectric substrate 131.

[0036] Element 1512 is arranged across dielectric substrate 132 and dielectric substrate 133. The portion of element 1512 that is placed on dielectric substrate 132 and the portion of element 1512 that is placed on dielectric substrate 133 are joined by solder bumps 160. The portion of element 1512 that is placed on dielectric substrate 132 may be formed as vias (through holes).

[0037] The lower surface of the dielectric substrate 132 and the tip of the element 1512 may be flush. The tip of the element 1512 may protrude from the lower surface of the dielectric substrate 132. The tip of the element 1512 may be located inside the dielectric substrate 132. A part of the element 1512 may protrude from the side surface of the dielectric substrate 132.

[0038] As explained above, the dipole antenna 151 is arranged across the dielectric substrates 131 to 133. In other words, the size of the dipole antenna 151 is not limited to the thickness of a single dielectric substrate. The dipole antenna 151 has elements 1511 and 1512 that are constructed using the respective thicknesses of the dielectric substrates 131 to 133. According to Embodiment 1, it is possible to sufficiently secure the polarization height in the thickness direction of the dielectric substrates 131 to 133 radiated from the dipole antenna 151. This makes it possible to increase the antenna gain of the dipole antenna 151.

[0039] Moreover, the dielectric substrates 131 to 133 used to construct the dipole antenna 151 are all general, approximately rectangular substrates. Therefore, according to Embodiment 1, the dipole antenna 151 can be realized using a less expensive manufacturing method compared to, for example, the case where a specially shaped substrate is used to increase the antenna length.

[0040] The dipole antenna 152 has elements 1521 and 1522. Element 1521 is fed at feed point SP21. Element 1522 is fed at feed point SP22. Elements 1521 and 1522 may be arranged so as to be in contact with the upper or lower surface of the dielectric substrate 133. Parts or all of elements 1521 and 1522 may be embedded in the dielectric substrate 133.

[0041] The side surface of the dielectric substrate 133 parallel to the Y-axis direction and the tips of the elements 1521 and 1522 may be flush. The tips of the elements 1521 and 1522 may protrude from the side surface of the dielectric substrate 133 parallel to the Y-axis direction. The tips of the elements 1521 and 1522 may be located inside the dielectric substrate 133.

[0042] As shown in FIG. 3, the dielectric substrate 131 has a ground electrode GND1 disposed between the element 1511 and the patch antenna 141. The dielectric substrate 133 has ground electrodes GND2 and GND3 disposed along the substrate layer. The ground electrode GND1 is connected to the ground electrode GND2 via a solder bump 160.

[0043] As shown in FIG. 2, a plurality of ground electrodes GND1 are provided so as to form a wall for shielding between the element 1511 and the patch antenna 141. Thereby, it is possible to reduce the interference between the radio waves radiated from the patch antenna 141 and the radio waves radiated from the element 1511. Further, the radio waves radiated from the element 1511 in the negative direction of the Y-axis can be reflected in the positive direction of the Y-axis by the ground electrode GND1. As a result, the radiation characteristics of the element 1511 with respect to the positive direction of the Y-axis can be improved.

[0044] An SiP (System in Package) 90 is disposed on the lower surface side of the dielectric substrate 134. The RFIC 110 is sealed in the SiP 90. The RFIC 110 and the dielectric substrate 134 are joined by a plurality of solder bumps 160. The SiP 90 may further be sealed with a PMIC (Power Management Integrated Circuit) for managing the power supply system of the RFIC 110. Each of the RFIC 110 and the PMIC is an example of an electric circuit.

[0045] The SiP 90 has an electromagnetic shield 80 that covers electric circuits such as the RFIC 110 sealed in the SiP 90. The gap between the electromagnetic shield 80 and the RFIC 110 is filled without a gap by a resin body 60. Therefore, the RFIC 110 is covered with the resin body 60.

[0046] The power supply point SP1 is connected to the RFIC 110 by a power supply line 41a. The power supply point SP2 is connected to the RFIC 110 by a power supply line 41b. The power supply lines 41a and 41b are wired from the power supply points SP1 and SP2 through the dielectric substrates 131, 133, and 134 toward the RFIC 110.

[0047] The power supply point SP11 is connected to the RFIC 110 by the power supply line 51a. The power supply point SP12 is connected to the RFIC 110 by the power supply line 51b. Similarly, the power supply point SP21 is connected to the RFIC 110 by the power supply line 52a, and the power supply point SP22 is connected to the RFIC 110 by the power supply line 52b (see Fig. 2). The power supply lines 51a and 51b are wired from the power supply points SP11 and SP12 through the dielectric substrates 133 and 134 toward the RFIC 110. The power supply lines 52a and 52b are wired from the power supply points SP21 and SP22 through the dielectric substrates 133 and 134 toward the RFIC 110. In Fig. 2, the illustration of the connection portions of the RFIC 110 to the power supply lines 52a and 52b is omitted.

[0048] As described above, the RFIC 110 is electrically connected to each of the patch antenna 141, the dipole antenna 151, and the dipole antenna 152.

[0049] As shown in Fig. 3, the element 1512 and the electromagnetic shield 80 face each other in the Y-axis direction. Therefore, the radio waves radiated from the element 1512 in the negative direction of the Y-axis can be reflected by the electromagnetic shield 80 in the positive direction of the Y-axis. As a result, the radiation characteristics of the element 1512 with respect to the positive direction of the Y-axis can be improved.

[0050] The facing distance between the element 1511 and the ground electrode GND1 and the facing distance between the element 1512 and the electromagnetic shield 80 may be the same. Thereby, the radiation characteristics of the element 1511 with respect to the positive direction of the Y-axis and the radiation characteristics of the element 1512 with respect to the positive direction of the Y-axis can be made closer. As a result, the directivity patterns of the elements 1511 and 1512 can be made uniform.

[0051] As described above, the antenna module 100 can radiate radio waves in two directions (upward and lateral) by the patch antenna 141 and the dipole antennas 151 and 152. Moreover, according to the antenna module 100, it is possible to sufficiently secure the height of the polarization wave (for example, vertical polarization wave) in the thickness direction of the substrate radiated from the dipole antenna 151.

[0052] Alternatively, dielectric substrates 131 to 134 may be constructed using a multilayer resin substrate formed by laminating multiple resin layers made of resins such as epoxy and polyimide.

[0053] Dielectric substrates 131 to 134 may be constructed using a multilayer resin substrate formed by laminating multiple resin layers made of liquid crystal polymer (LCP) having a lower dielectric constant. Dielectric substrate 130 may be constructed using a multilayer resin substrate formed by laminating multiple resin layers made of fluororesin, a multilayer resin substrate formed by laminating multiple resin layers made of PET (Polyethylene Terephthalate) material, or a ceramic multilayer substrate other than LTCC.

[0054] The dielectric substrates 131 to 134 do not necessarily have to be multilayer structures; they may be single-layer substrates. The structures corresponding to the dielectric substrates 131 to 134 may be molded using a 3D printer.

[0055] (Dielectric ratio of each dielectric substrate) Figure 5 is a diagram for comparing and explaining the relative permittivity (Dk) of each dielectric substrate 131 to 133. Note that in Figure 5, the details of the various configurations provided on the dielectric substrates 131 to 133 are omitted. Those details are shown in Figure 3, etc.

[0056] As explained using Figure 3, a number of feed lines are provided on the dielectric substrate 133. Generally, when providing feed lines for an antenna, it is necessary to match the input impedance of the antenna with the impedance of the feed line. In this case, the thinner the dielectric substrate on which the feed lines are placed, and the higher the relative permittivity of the dielectric substrate, the greater the impedance fluctuation with respect to the degree of adjustment for impedance matching.

[0057] Therefore, in order to facilitate impedance matching, it is preferable to increase the thickness of the dielectric substrate and lower the relative permittivity of the dielectric substrate. However, from the viewpoint of miniaturizing the antenna module, it is desirable to reduce the thickness of the dielectric substrate. Therefore, in order to miniaturize the antenna module while facilitating impedance matching, it is necessary to reduce the thickness of the dielectric substrate on which the feed line is provided and to lower the relative permittivity of the dielectric substrate.

[0058] On the other hand, to improve the radiation characteristics of a dipole antenna, it is effective to either increase the element length or increase the relative permittivity of the dielectric substrate on which the elements are placed. Increasing the element length requires increasing the size of the dielectric substrate. However, increasing the size of the dielectric substrate leads to a larger antenna module.

[0059] Therefore, from the viewpoint of miniaturizing the antenna module, it is desirable to increase the relative permittivity of the dielectric substrate on which the elements are arranged. In Embodiment 1, although the dipole antenna 151 is arranged across dielectric substrates 131 to 133, most of the elements 1511 and 1512 reside on dielectric substrates 131 and 132. Therefore, in order to avoid increasing the size of the antenna module, it is desirable to increase the relative permittivity of dielectric substrates 131 and 132.

[0060] As described above, when considering the size of the antenna module 100, the radiation characteristics of the dipole antenna 151, and impedance matching, it is desirable that the relative permittivity of the dielectric substrate 133 be lower than that of the dielectric substrate 131 and the dielectric substrate 132.

[0061] Therefore, as shown in Figure 5, it is conceivable to set the relative permittivity of dielectric substrate 133 to approximately 2 to 3, and the relative permittivity of dielectric substrates 131 and 132 to approximately 3 to 7. Of course, the values ​​of relative permittivity are merely examples. It is sufficient that the relative permittivity of dielectric substrate 133 is lower than that of dielectric substrate 131 and dielectric substrate 132.

[0062] In this way, by making the relative permittivity of the dielectric substrate 133 lower than that of the dielectric substrate 131 and the dielectric substrate 132, it is possible to miniaturize the antenna module, improve the radiation characteristics of the dipole antenna 151, and facilitate impedance matching.

[0063] [Embodiment 2] Embodiment 2 will be described with reference to Figure 6. Figure 6 is a side perspective view of the antenna module 100A according to Embodiment 2. In the antenna module 100A according to Embodiment 2, a dielectric substrate 132A is used instead of the dielectric substrates 132 and 134 of the antenna module 100 according to Embodiment 1. Embodiment 2 is the same as Embodiment 1 except that a dielectric substrate 132A is used instead of the dielectric substrates 132 and 134.

[0064] As shown in Figure 6, the dielectric substrate 132A has a third main surface 13 and a fourth main surface 14 that face the second main surface 12 of the dielectric substrate 131. The third main surface 13 is the upper surface of the dielectric substrate 132A, and the fourth main surface 14 is the lower surface of the dielectric substrate 132A. Therefore, the distance between the fourth main surface 14 and the second main surface 12 is longer than the distance between the third main surface 13 and the second main surface 12.

[0065] A resin body 60 is provided on the fourth main surface 14 of the dielectric substrate 132A. A part of the element 1512 and the RFIC 110 are embedded in the resin body 60. The RFIC 110 and the resin body 60 around the RFIC 110 are covered by an electromagnetic shield 80. The SiP 90 is composed of the electromagnetic shield 80, the resin body 60 covered by the electromagnetic shield 80, and the RFIC 110.

[0066] Element 1512 is arranged across dielectric substrate 133, dielectric substrate 132A, and resin body 60. The portion of element 1512 that is arranged on dielectric substrate 133 and the portion that is arranged on dielectric substrate 132A are joined by solder bumps 160. The portion of element 1512 that is arranged on dielectric substrate 132A and the portion that is arranged on resin body 60 are joined by solder bumps 160.

[0067] Therefore, in the antenna module 100A, the resin body 60 is arranged on the dielectric substrate 132A so as to cover the fourth main surface 14, and the RFIC 110 and a part of the element 1512 are integrally provided by the resin body 60. According to Embodiment 2, the number of dielectric substrates can be reduced compared to Embodiment 1.

[0068] [Embodiment 3] Embodiment 3 will be described with reference to Figures 7 and 8. Figure 7 is a side perspective view of the antenna module 100B according to Embodiment 3. Figure 8 is a schematic diagram showing the configuration of the dipole antenna 152A applied to the antenna module 100B according to Embodiment 3.

[0069] In the antenna module 100B according to Embodiment 3, a dipole antenna 151A with a balun 70 is used instead of the dipole antenna 151, and a dipole antenna 152A with a balun 70 is used instead of the dipole antenna 152. A "balun" is also called a "balanced-to-unbalanced converter" or "balanced-to-unbalanced converter." Embodiment 3 is the same as Embodiment 1 except for the configuration of the dipole antennas 151A and 152A.

[0070] Figure 7 shows a configuration in which a balun 70 is connected to the feed line 51a of the dipole antenna 151A. Figure 8 shows a configuration in which a balun 70 is connected to the feed line 52b of the dipole antenna 152A. According to Embodiment 3, even if the feed lines 51a and 52b are unbalanced lines such as microstrip lines, power can be efficiently supplied to the dipole antennas 151A and 152A.

[0071] [Embodiment 4] Embodiment 4 will be described with reference to Figures 9 and 10. Figure 9 is a side perspective view of the antenna module 100C according to Embodiment 4. Figure 10 is a schematic diagram showing the configuration of the dipole antenna 152B applied to the antenna module 100C according to Embodiment 4.

[0072] In the antenna module 100C according to Embodiment 4, a dipole antenna 151B is used instead of a dipole antenna 151, and a dipole antenna 152B is used instead of a dipole antenna 152. Dipole antennas 151B and 152B differ from dipole antennas 151 and 152 in that they employ a "single-sided grounding" configuration. Embodiment 4 is the same as Embodiment 1 except for the configuration of dipole antennas 151B and 152B.

[0073] As shown in Figure 9, element 1512 of the dipole antenna 151B is connected to the feed line 51b extending to the RFIC 110. In contrast, element 1511 of the dipole antenna 151B is connected to the ground electrode GND2.

[0074] As shown in Figure 10, element 1521 of the dipole antenna 152B is connected to the feed line 52a extending to the RFIC 110, while element 1522 of the dipole antenna 152B is connected to the ground electrode GND2.

[0075] According to Embodiment 4, even when the feed lines 51b and 52a are unbalanced lines such as microstrip lines, power can be efficiently supplied to the dipole antennas 151B and 152B.

[0076] [Embodiment 5] Embodiment 5 will be described with reference to Figure 11. Figure 11 is a side perspective view of the antenna module 100D related to Embodiment 5.

[0077] The antenna module 100D according to Embodiment 5 has multiple antenna groups 170 arranged in an array. The antenna groups 170 include a patch antenna 141, a dipole antenna 151, and a dipole antenna 152, which are configured as shown in Figures 2 to 4.

[0078] Therefore, multiple patch antennas 141 are arranged on the dielectric substrate 131 along the first main surface 11. Multiple dipole antennas 151 are arranged so as to intersect the first main surface 11. Multiple dipole antennas 152 are arranged on the dielectric substrate 133 along the surface of the dielectric substrate 133 facing the second main surface 12. According to Embodiment 5, a higher gain can be achieved compared to Embodiment 1.

[0079] In this disclosure, it is intended that any two or three or more of the embodiments described above may be arbitrarily combined.

[0080] [Embodiments] Those skilled in the art will understand that each of the embodiments described above is a specific example of the following embodiments.

[0081] (Section 1) An antenna module relating to one embodiment comprises a first substrate having opposing first main surfaces and second main surfaces, a second substrate disposed on the second main surface side, a third substrate disposed between the first substrate and the second substrate, a patch antenna disposed on the first substrate along the first main surface, a first dipole antenna disposed so as to intersect the first main surface, and a second dipole antenna disposed on the third substrate along the surface of the third substrate facing the second main surface, wherein the first dipole antenna has a first element and a second element, the first element is disposed across the first substrate and the third substrate, and the second element is disposed across the second substrate and the third substrate.

[0082] (Paragraph 2) The antenna module of Paragraph 1, wherein the relative permittivity of the third substrate is lower than the relative permittivity of the first substrate and the relative permittivity of the second substrate.

[0083] (3) The antenna module of paragraph 1 or 2 further comprises an electronic component electrically connected to each of the patch antenna, the first dipole antenna, and the second dipole antenna, wherein the feed lines of the patch antenna, the feed line of the first dipole antenna, and the feed line of the second dipole antenna are connected to the electronic component through the third substrate.

[0084] (Clause 4) The antenna module of paragraph 3, wherein the second substrate has a third main surface and a fourth main surface facing the second main surface, the distance between the fourth main surface and the second main surface is longer than the distance between the third main surface and the second main surface, the electronic components are arranged on the fourth main surface, and the second element is further provided on the fourth main surface of the second substrate with a resin body, the electronic components are covered with the resin body, and the second element is arranged across the second substrate and the resin body.

[0085] (Paragraph 5) An antenna module according to paragraph 3 or 4, wherein one of the first and second elements is connected to the feed line of a first dipole antenna, and the other of the first and second elements is connected to a ground electrode, and the second dipole antenna has a third and a fourth element, the third element is connected to the feed line of the second dipole antenna, and the fourth element is connected to a ground electrode.

[0086] (Article 6) An antenna module according to any one of paragraphs 1 to 4, wherein one of the first dipole antenna and the second dipole antenna has a balun.

[0087] (Article 7) An antenna module according to any one of Articles 1 to 6, wherein the patch antenna is capable of radiating radio waves having a polarization direction in a first direction and radio waves having a polarization direction in a second direction different from the first direction.

[0088] (Clause 8) An antenna module relating to another embodiment comprises a first substrate having opposing first main surfaces and second main surfaces, a second substrate disposed on the second main surface side, a third substrate disposed between the first substrate and the second substrate, a plurality of patch antennas disposed on the first substrate along the first main surface, a first dipole antenna disposed so as to intersect the first main surface and corresponding to each of the plurality of patch antennas, and a second dipole antenna disposed on the third substrate along the surface of the third substrate facing the second main surface and corresponding to each of the plurality of patch antennas, wherein the first dipole antenna has a first element and a second element, the first element is disposed across the first substrate and the third substrate, and the second element is disposed across the second substrate and the third substrate.

[0089] (Item 9) A communication device equipped with an antenna module specified in any one of items 1 through 8.

[0090] The embodiments disclosed herein should be considered in all respects to be illustrative and not restrictive. The scope of the present invention is indicated by the claims rather than by the description of the embodiments above, and all modifications within the meaning and scope of the claims are intended to be included.

[0091] 10 Communication device, 11 First main surface, 12 Second main surface, 13 Third main surface, 14 Fourth main surface, 41a, 41b, 51a, 51b, 52a, 52b Feed line, 51c Grounding line, 60 Resin body, 80 Electromagnetic shield, 90 SiP, 100, 100A-100D Antenna module, 110 RFIC, 110A-110D Feed circuit, 111A-111D, 113A-113D, 117 Switch, 112AR-112DR Low-noise amplifier, 112AT-112DT Power amplifier, 114A-114D Attenuator, 115A-115D Phase shifter, 116 Signal combiner / distributor, 118 Mixer, 119 Amplifier circuit, 120 Antenna equipment, 130-134, 132A Dielectric substrate, 141 Patch antenna, 151, 151A, 151B, 152, 152A, 152B Dipole antenna, 160 Solder bump, 170 Antenna group, 200 BBIC, 1511, 1512, 1521, 1522 Elements, GND1-GND3 Ground electrode.

Claims

1. An antenna module comprising: a first substrate having opposing first main surfaces and second main surfaces; a second substrate disposed on the side of the second main surface; a third substrate disposed between the first substrate and the second substrate; a patch antenna disposed on the first substrate along the first main surface; a first dipole antenna disposed so as to intersect the first main surface; and a second dipole antenna disposed on the third substrate along the surface of the third substrate facing the second main surface, wherein the first dipole antenna has a first element and a second element, the first element is disposed across the first substrate and the third substrate, and the second element is disposed across the second substrate and the third substrate.

2. The antenna module according to claim 1, wherein the relative permittivity of the third substrate is lower than that of the first substrate and the relative permittivity of the second substrate.

3. The antenna module according to claim 1 or 2, further comprising an electronic component electrically connected to each of the patch antenna, the first dipole antenna, and the second dipole antenna, wherein the feed line of the patch antenna, the feed line of the first dipole antenna, and the feed line of the second dipole antenna are connected to the electronic component through the third substrate.

4. The antenna module according to claim 3, wherein the second substrate has a third main surface and a fourth main surface facing the second main surface, the distance between the fourth main surface and the second main surface is longer than the distance between the third main surface and the second main surface, the electronic components are arranged on the fourth main surface, and the second substrate further comprises a resin body provided on the fourth main surface, the electronic components are covered by the resin body, and the second element is arranged across the second substrate and the resin body.

5. The antenna module according to claim 3 or 4, wherein one of the first element and the second element is connected to the feed line of the first dipole antenna, the other of the first element and the second element is connected to a ground electrode, and the second dipole antenna has a third element and a fourth element, the third element is connected to the feed line of the second dipole antenna, and the fourth element is connected to the ground electrode.

6. The antenna module according to any one of claims 1 to 4, wherein one of the first dipole antenna and the second dipole antenna has a balun.

7. The antenna module according to any one of claims 1 to 6, wherein the patch antenna is capable of radiating radio waves having a polarization direction in a first direction and radio waves having a polarization direction in a second direction different from the first direction.

8. An antenna module comprising: a first substrate having opposing first main surfaces and second main surfaces; a second substrate disposed on the side of the second main surface; a third substrate disposed between the first substrate and the second substrate; a plurality of patch antennas disposed on the first substrate along the first main surface; a first dipole antenna disposed so as to intersect the first main surface and corresponding to each of the plurality of patch antennas; and a second dipole antenna disposed on the third substrate along the surface of the third substrate facing the second main surface and corresponding to each of the plurality of patch antennas, wherein the first dipole antenna has a first element and a second element, the first element is disposed across the first substrate and the third substrate, and the second element is disposed across the second substrate and the third substrate.

9. A communication device equipped with an antenna module according to any one of claims 1 to 8.

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