Peeling device

Abstract

In a peeling device, a chamber mechanism can change a relative position of a second chamber formation part with respect to a first chamber formation part between a first position and a second position while maintaining the combined state of the first and second chamber formation parts by using elasticity of a seal part. The peeling mechanism is capable of peeling two workpieces in a bonded state in the chamber by enlarging a cleavage between bonding surfaces thereof. The internal pressure of the chamber is used to create a pressure difference on either the front or back surface of one of the workpieces, such that the bonding surface of that workpiece experiences positive pressure, and the region where this pressure difference is generated is expanded to enlarge the cleavage. The control device detects the peeled state between the two workpieces on the basis of the output of a displacement sensor that detects the relative position of the second chamber formation part.

Description

Peeling device

[0001] The present invention relates to a technique for detecting the peeling state between two workpieces.

[0002] Patent Document 1 discloses a peeling device that peels a support substrate from a wafer in a chamber. In this peeling device, after creating a crack that serves as a starting point for growing a cleavage between the wafer and a part of the outer peripheral edge of the support substrate, the support substrate is moderately pressed with a pad provided with a plurality of suction holes, and then the internal pressure of the chamber is increased in that state. After that, starting from the crack, a pressure difference is generated between the front and back of the support substrate by suction using the holes of the pad in sequence. Thereby, the support substrate is lifted while compressing and deforming the pad, and a cleavage is grown between the support substrate and the wafer.

[0003] Japanese Patent No. 6377956

[0004] On the other hand, in the peeling device as described above, in the process of peeling, the growth of the cleavage may stop halfway due to some reason. In this case, the peeling state between the wafer and the support substrate becomes a state where the support substrate remains partially unpeeled from the wafer (a state where peeling failure has occurred). However, conventionally, until the chamber is opened, it has been impossible to confirm what state the peeling state between the wafer and the support substrate is in. For this reason, after the occurrence of peeling failure is detected, if the peeling of the defective part is to be redone using the same peeling device, it has to be redone from the formation of the chamber, and thus there has been a problem that the running cost deteriorates significantly.

[0005] Therefore, an object of the present invention is to enable the detection of the peeling state between two workpieces without opening the chamber when peeling the two workpieces in the chamber.

[0006] The peeling device according to the present invention has the following configuration (Aspect 1). The peeling device comprises a chamber mechanism, a peeling mechanism, a displacement sensor, and a control device. The chamber mechanism includes a first chamber forming section and a second chamber forming section. Here, these chamber forming sections are capable of changing their relative positional relationship with each other in a first direction and form a chamber by joining together via an elastic sealing section. The chamber mechanism can change the relative position of the second chamber forming section with respect to the first chamber forming section between a first position and a second position further away, while maintaining the joined state of the chamber forming sections by utilizing the elasticity of the sealing section. The peeling mechanism is a mechanism that enables the peeling of two workpieces in a bonded state within the chamber by growing a crack between their bonded surfaces. It generates a pressure difference on the front and back of either workpiece, using the internal pressure of the chamber, so that the bonded surface side of the workpiece becomes positive pressure, and grows the crack by expanding the area where this pressure difference is generated. The displacement sensor detects the relative position of the second chamber forming section with respect to the first chamber forming section. The control device detects the separation state between the two workpieces based on the output of the displacement sensor.

[0007] In the above embodiment 1, even if the internal pressure of the chamber remains constant, as the delamination area increases due to the growth of the crack, the pressure-receiving area of ​​the first and second chamber forming parts increases, and consequently, the force attempting to separate the two chamber forming parts also increases. According to the above embodiment 1, it is possible to express this change in force as a change in the relative position of the second chamber forming part with respect to the first chamber forming part. Therefore, by detecting this change in relative position with a displacement sensor, it becomes possible to indirectly detect how much the delamination area has increased due to the growth of the crack (in other words, the state of delamination between the two workpieces).

[0008] The peeling apparatus according to Embodiment 1 described above may have the following configuration (Embodiment 2). The control device may raise the internal pressure of the chamber to a predetermined pressure before instructing the peeling mechanism to start peeling the two workpieces, and set the output of the displacement sensor at that time as the initial value before starting the peeling (Process (S1)). Thereafter, the control device may instruct the peeling mechanism to perform the peeling of the two workpieces, and detect the peeling state between the two workpieces based on the change from the initial value that occurs in the output of the displacement sensor during that process (Process (S2)).

[0009] According to the above embodiment 2, the internal pressure of the chamber is increased to the atmospheric pressure (predetermined pressure) necessary for separation in the separation mechanism, thereby generating a force in the first and second chamber forming sections that attempts to separate them. This force increases as the separation area increases due to the growth of the crack. Therefore, by utilizing this change in force, it becomes possible to generate a change in the output of the displacement sensor corresponding to the growth of the crack (a change from the initial value).

[0010] The peeling device according to the above embodiment 2 may have the following configuration (embodiment 3). The peeling device may further include a position adjustment mechanism. Here, the position adjustment mechanism is a mechanism that enables adjustment of the relative position of the second chamber forming part with respect to the first chamber forming part between the first position and the second position. Then, in process (S1), when the internal pressure of the chamber is raised to a predetermined pressure, the control device may adjust the relative position of the second chamber forming part to coincide with a predetermined position set between the first position and the second position by controlling the position adjustment mechanism based on the output of the displacement sensor. In process (S2), the control device may detect the peeling state between the two workpieces based on the change from the initial value that occurs in the output of the displacement sensor without further adjustment of the relative position of the second chamber forming part.

[0011] According to embodiment 3 described above, when the internal pressure of the chamber is increased to the atmospheric pressure (predetermined pressure) necessary for peeling in the peeling mechanism, even if the relative position of the second chamber forming portion changes in a direction away from the first chamber forming portion, it becomes possible to return that relative position to a position (predetermined position) suitable for peeling the two wafers in the peeling mechanism.

[0012] The peeling device according to embodiment 3 described above may have the following configuration (embodiment 4). The position adjustment mechanism may include a movable part and a cam structure. The movable part may be installed in the first chamber forming part and configured to allow translational movement in a second direction perpendicular to the first direction. The cam structure may be provided in the movable part and the second chamber forming part and configured to convert the translational movement of the movable part in the second direction into translational movement of the second chamber forming part directed toward the first position.

[0013] According to embodiment 4 described above, a position adjustment mechanism can be configured as a separate mechanism from the mechanism (lifting mechanism) that enables the relative proximity and separation of the second chamber forming section to the first chamber forming section. Using such a position adjustment mechanism, it becomes possible to adjust the position of the second chamber forming section specifically when the chamber is being formed (including immediately before the chamber is formed). Therefore, it becomes unnecessary to have a function in the lifting mechanism to adjust the relative position of the second chamber forming section with high precision, and the lifting mechanism can be configured with a simpler mechanism such as an air cylinder or hydraulic cylinder instead of a ball screw. As a result, the peeling device can be simplified and miniaturized, and safety can be improved by using an air cylinder or hydraulic cylinder in the lifting mechanism.

[0014] A peeling device according to any of the above embodiments 2 to 4 may have the following configuration (embodiment 5). In process (S2), the control device may determine that the peeling state between the two workpieces has reached a state in which the crack has grown across the entire bonding surface and peeling is complete when the output of the displacement sensor changes from an initial value to a predetermined value.

[0015] According to embodiment 5 described above, it becomes possible to indirectly detect, based on the output of the displacement sensor, that the separation of the two workpieces has been completed (that the crack has grown across the entire bonding surface).

[0016] The peeling apparatus according to the above embodiment 5 may have the following configuration (embodiment 6). In the process (S2), if the output of the displacement sensor does not reach a predetermined value and the output stops changing midway, the control device may cause the peeling mechanism to restart the peeling process on the two workpieces from the beginning or midway.

[0017] According to embodiment 6 described above, it becomes possible to indirectly detect the occurrence of a delamination defect between two workpieces (i.e., the crack growth stopping midway) based on the output of the displacement sensor. Furthermore, if a delamination defect occurs, it becomes possible to repeat the delamination process until the defect is eliminated.

[0018] According to the present invention, when separating two workpieces within a chamber, the separation state between the two workpieces can be detected without opening the chamber.

[0019] Figure 1(A) is a conceptual front view of a peeling device according to an embodiment, and Figure 1(B) is a conceptual block diagram showing the configuration of the peeling device. Figure 2 is a conceptual top view of the peeling device according to an embodiment. Figure 3 is a cross-sectional view taken along the line I-I shown in Figure 2. Figure 4(A) is a bottom view of the second chamber forming section, and Figure 4(B) is a bottom view of the second chamber forming section excluding the pad. Figures 5(A) and 5(B) are a front view and a cross-sectional view showing the operation of the peeling device. Figure 6 is a front view showing the operation of the peeling device. Figures 7(A) and 7(B) are a front view and a cross-sectional view showing the operation of the peeling device. Figure 8 is an enlarged view of the J1B region in Figure 7(B). Figures 9(A) and 9(B) are enlarged views of the J1A region in Figure 7(A), where Figure 9(A) shows the case where the relative position of the second chamber forming section is in the first position, and Figure 9(B) shows the case where its relative position is in the second position. Figure 10(A) is a cross-sectional view showing the operation of the peeling device, and Figure 10(B) is an enlarged view of the J2 region within that cross-sectional view. Figure 11(A) is a cross-sectional view showing the operation of the peeling device, and Figure 11(B) is an enlarged view of the J3 region within that cross-sectional view. Figure 12 is a cross-sectional view showing the operation of the peeling device. Figure 13 is a flowchart showing the peeling state detection process performed in the embodiment. Figures 14(A) and 14(B) are conceptual diagrams illustrating the relationship between the piston position and the amount of change from the initial value of the displacement sensor output. Figures 15(A) to 15(D) are conceptual diagrams showing four different modifications of the cam structure. Figure 16 is a cross-sectional view of the peeling device according to the fifth modification. Figure 17 is a conceptual diagram showing the peeling device according to the sixth modification.

[0020] [1] Configuration of the peeling apparatus Figures 1(A) and 2 are a conceptual front view and a top view of the peeling apparatus according to the embodiment. Figure 1(B) is a conceptual block diagram showing the configuration of the peeling apparatus. Figure 3 is a cross-sectional view taken along the line I-I shown in Figure 2. The peeling apparatus of this embodiment is a device for peeling a laminate Ws (see Figure 3) formed by bonding two workpieces W1 and W2 together at the bonding surface, and comprises a chamber mechanism 1, a peeling mechanism 2, a position adjustment mechanism 3, a detection sensor 4, and a control device 5. As an example, workpiece W1 is a semiconductor wafer, and workpiece W2 is a substrate used for supporting semiconductor wafers in semiconductor processes or for applications such as nanoimprinting. The laminate Ws may also be attached to a dicing tape and fixed to a dicing frame via the tape. The configuration of each part will be described in detail below.

[0021] Furthermore, the laminate Ws to be peeled off may be one to which workpieces W1 and W2 are directly bonded, or it may be one to which workpieces W1 and W2 are indirectly bonded via an adhesive layer (such as resin), as long as the workpieces W1 and W2 can be peeled off at the bonding surface.

[0022] [1-1] Chamber mechanism The chamber mechanism 1 is a mechanism that forms a sealed chamber 10 and comprises a first chamber forming section 11, a second chamber forming section 12, a drive section 13, and an internal pressure adjustment section 14 (see Figures 1(A) and 1(B)). In this embodiment, this chamber 10 (sealed space) is used to achieve delamination of the bonding surfaces of two workpieces W1 and W2.

[0023] The first chamber forming section 11 and the second chamber forming section 12 are the parts that, when joined together, form the chamber 10. Furthermore, these chamber forming sections are configured so that their relative positional relationship in the first direction D1 (in other words, the relative position Pr of the second chamber forming section 12 with respect to the first chamber forming section 11 (see Figure 3)) can be changed by the action of the drive section 13. As a result, the chamber mechanism 1 can form the chamber 10 by joining the two chamber forming sections (see Figure 7(B)), and conversely, the chamber 10 can be opened by separating them (see Figure 3).

[0024] In the example shown in Figure 1(A), the second chamber forming section 12 is positioned above the first chamber forming section 11 such that the vertically upward direction is the first direction D1. Furthermore, while the first chamber forming section 11 is fixed at a specific position in the first direction D1, the second chamber forming section 12 is configured to move in the first direction D1 by the action of the drive unit 13. More specifically, the drive unit 13 is composed of an air cylinder or a hydraulic cylinder and supports the second chamber forming section 12 from below. This makes it possible to raise the second chamber forming section 12 against gravity by increasing the internal pressure of the cylinder, and conversely, to lower the second chamber forming section 12 using gravity by decreasing the internal pressure of the cylinder. In other words, the drive unit 13 functions as a lifting mechanism for the second chamber forming section 12.

[0025] Furthermore, the opposing surfaces 11s and 12s of the first chamber forming section 11 and the second chamber forming section 12 (see Figure 3; in the example in Figure 3, the upper surface of the first chamber forming section 11 and the lower surface of the second chamber forming section 12) have a first recess 101 and a second recess 102 formed thereon, which become the chamber 10 when they are joined together. Also, an elastic annular sealing section 103 (see Figures 1(A) and 3) is installed on the opposing surface 11s on the first chamber forming section 11 side, surrounding the opening area of ​​the first recess 101. Here, the sealing section 103 can be an O-ring or a tubular seal (which allows adjustment of the internal pressure of the tube, and whose sealing force can be increased by expanding the tube with that internal pressure). The annular sealing section 103 may also be installed on the opposing surface 12s on the second chamber forming section 12 side, surrounding the opening area of ​​the second recess 102.

[0026] Due to the presence of this sealing portion 103, when the two chamber-forming portions are joined together, the sealing portion 103 is interposed between them (see Figure 7(B)). When these chamber-forming portions are joined together via the sealing portion 103, the internal spaces of the first recess 101 and the second recess 102 are sealed, thereby forming the chamber 10 (sealed space).

[0027] Furthermore, by utilizing the elasticity of the seal portion 103, while maintaining the state in which the two chamber forming portions are joined together (the state in which the chamber 10 is formed), the relative position Pr of the second chamber forming portion 12 with respect to the first chamber forming portion 11 can be changed between a first position P1 (see Figure 9(A)) in which the seal portion 103 is elastically deformed significantly to bring the two chamber forming portions closer together, and a second position P2 (see Figure 9(B)) in which the two chamber forming portions are moved further apart than in the first position to reduce the amount of elastic deformation of the seal portion 103. In other words, the chamber mechanism 1 is configured to change the relative position Pr of the second chamber forming portion 12 between the first position P1 and the second position P2, which is further away, while maintaining the state in which the chamber 10 is formed.

[0028] Furthermore, the drive unit 13 described above can move the relative position Pr of the second chamber forming section 12 with respect to the first chamber forming section 11 to a third position P3 (see Figure 3) where the chamber forming sections are separated and the chamber 10 is opened. In other words, the chamber mechanism 1 is configured to open the chamber 10 by relatively moving the second chamber forming section 12 to a third position P3, which is even further away than the second position P2.

[0029] The internal pressure adjustment section 14 (see Figure 1(B)) is a part that enables adjustment of the internal pressure of the chamber 10 and includes a pressure boosting section, such as a compression pump, which increases the internal pressure of the chamber 10 by supplying air into the chamber 10. The internal pressure adjustment section 14 may also include a pressure reducing section, such as a vacuum pump, which decreases the internal pressure of the chamber 10 by exhausting air from inside the chamber 10.

[0030] [1-2] Delamination Mechanism The delamination mechanism 2 is a mechanism that enables the separation of two bonded workpieces W1 and W2 within the chamber 10 by growing a crack Kw between their bonded surfaces. Specifically, the delamination mechanism 2 is a mechanism that enables the growth of a crack Kw across the entire bonded surface, triggered by a crack (see Figure 8) created along the bonded surface between the two workpieces W1 and W2 at a part of the outer edge of the laminate Ws, and has the following configuration (see Figure 3). In the following, the two axial directions perpendicular to each other in a virtual plane perpendicular to the first direction D1 are referred to as the X-axis direction and the Y-axis direction.

[0031] A stage portion 20 for holding the laminate Ws is installed on the bottom surface of the first recess 101 formed in the first chamber forming portion 11 (see Figure 3). This stage portion 20 is equipped with a chuck function (such as vacuum suction or electrostatic chuck) for fixing the laminate Ws placed thereon. In this embodiment, the laminate Ws is placed on the stage portion 20 with the back surface of the workpiece W2 (the surface opposite to the bonding surface) facing the first direction D1 (vertically upward in the example of Figure 3).

[0032] On the other hand, a platform-shaped raised portion 121 is provided on the bottom surface of the second recess 102 formed in the second chamber forming portion 12, and an annular groove 21A and a plurality of slit grooves 21B are formed on the surface 121a of the raised portion 121 (in the example of Figure 3, the bottom surface of the raised portion 121), and the pad 22 is attached so as to cover only the slit grooves 21B. Furthermore, the raised portion 121 is formed so that when the chamber 10 is formed, the pad 22 is pressed against the back surface of the workpiece W2, and the amount of compression of the pad 22 itself at that time is within an acceptable range. Specifically, it is as follows.

[0033] Figure 4(A) is a bottom view of the second chamber forming section 12, and Figure 4(B) is a bottom view of the second chamber forming section 12 excluding the pad 22. As shown in Figure 4(B), the annular groove 21A is formed in the peripheral region of the surface 121a, along the outer edge of the surface 121a. The multiple slit grooves 21B are formed in the region of the surface 121a that is inside the annular groove 21A, and each has a shape that extends elongated in the Y-axis direction. In other words, each of these slit grooves 21B is formed parallel to one another, with its formation position changing in the X-axis direction. Furthermore, the annular groove 21A and the slit grooves 21B, as well as the slit grooves 21B to each other, are formed so that they do not connect to one another.

[0034] Furthermore, the second chamber forming section 12 (see Figure 3) has a ventilation opening 23A that penetrates in the first direction D1 from the bottom surface of the annular groove 21A to the back surface 12t of the second chamber forming section 12 (the surface opposite to the opposing surface 12s; the top surface in the example of Figure 3), and ventilation openings 23B that penetrate in the first direction D1 from the bottom surface of each slit groove 21B to the back surface 12t. Specifically, it is as follows.

[0035] As shown in Figure 4(B), when the imaginary line Lx extending in the X-axis direction is set to intersect all the slit grooves 21B when viewed from the direction opposite to the first direction D1, the vents 23B are formed one by one in the slit grooves 21B so that they are aligned in a line along the imaginary line Lx. Similarly, the annular groove 21A is formed in the annular groove 21A so that it is aligned in a line along the imaginary line Lx together with the vents 23B. In the example in Figure 4(B), the case where the imaginary line Lx is set to pass through the center of each slit groove 21B is shown.

[0036] A cylinder chamber 24 is installed on the back surface 12t of the second chamber forming section 12 (see Figure 1(A)). Specifically, the cylinder chamber 24 is positioned such that the cylinder axis coincides with the dashed line Lx when viewed from the first direction D1 (see Figure 2), and all the vents 23A and 23B lead into the cylinder chamber 24 (see Figure 3). In this embodiment, the back surface 12t of the second chamber forming section 12 is exposed into the cylinder chamber 24, and as a result, all the vents 23A and 23B directly lead into the cylinder chamber 24 (see Figures 2 and 3). Note that Figure 2 is a top view showing a portion of the top wall of the cylinder chamber 24 broken off. Therefore, Figure 2 also shows the state in which the vents 23A and 23B are exposed on the back surface 12t of the second chamber forming section 12.

[0037] A piston 241 is provided inside the cylinder chamber 24, which reciprocates in the direction of the cylinder axis (in this case, the X-axis direction). The reciprocating motion of this piston 241 is performed through a shaft 242. In this embodiment, when the crack Kw is grown along the bonding surface, the piston 241 is moved from a starting position Ps (see Figure 10(A)) between a vent 23A and the adjacent vent 23B to an ending position Pt (see Figure 12) after passing through all the vents 23B.

[0038] Furthermore, of the two spaces within the cylinder chamber 24 separated by the piston 241 (see Figure 3), a pressure reducing unit 25A (such as a vacuum pump; see Figure 1(B)) is connected to the first space S1, which leads to the vent 23A when the piston 241 is in the starting position Ps, in order to reduce the internal pressure of the first space S1. The other space, the second space S2, is connected to a pressure increasing unit 25B (such as a compression pump; see Figure 1(B)) in order to increase the internal pressure of the second space S2.

[0039] This allows the pressure inside the annular groove 21A to be reduced or increased through the vent 23A, and the pressure inside the slit groove 21B to be reduced or increased through the vent 23B, depending on the position of the piston 241 within the cylinder chamber 24. Furthermore, by moving the piston 241 toward the end position Pt, the number of depressurized slit grooves 21B can be increased.

[0040] Furthermore, a pad 22 is attached to the surface 121a of the raised portion 121, covering only the slit groove 21B of the grooves formed therein (annular groove 21A and slit groove 21B) (see Figure 4(A)). The pad 22 is made of a material that is airtight and elastic (such as a non-porous sponge).

[0041] As a result, the portion of the pad 22 covering the depressurized groove of the slit groove 21B is elastically deformed in a direction toward the surface 121a of the raised portion 121 (here, the first direction D1; upward in the example of Figure 3) by the suction force generated by the depressurization within the slit groove 21B (see Figure 10(B)), while the portion of the pad 22 covering the pressurized groove of the slit groove 21B is elastically deformed in a direction toward away from the surface 121a of the raised portion 121 (here, the opposite direction to the first direction D1; downward in the example of Figure 3) by the pressure generated by the pressurization within the slit groove 21B (see Figure 11(B)).

[0042] Therefore, by moving the piston 241 toward the end position Pt and increasing the number of the slit grooves 21B that are thereby depressurized, the portion elastically deformed by the suction force in the pad 22 can be expanded (see FIGS. 11(A) and 11(B)).

[0043] An annular seal portion 26 surrounding the raised portion 121 is fitted therein (see FIGS. 3 and 4(A)). Further, when the pad 22 is pressed against the back surface of the workpiece W2 (the surface opposite to the bonding surface) (see FIGS. 7(B) and 8), the seal portion 26 is pressed against the peripheral edge region of the back surface of the workpiece W2 around the pad 22, whereby the space in the chamber 10 is divided into two regions, an inner region and an outer region (hereinafter, the inner region is referred to as "seal inner region Rg" and the outer space is referred to as "seal outer region Rh") by the seal portion 26, and they are configured to be sealed between the regions.

[0044] Therefore, when sealing between the two regions by the seal portion 26, when the pressure in the chamber 10 is increased by the internal pressure adjusting portion 14, only the seal outer region Rh is increased in pressure. On the other hand, the annular groove 21A is exposed without being covered by the pad 22 on the surface 121a of the raised portion 121 (see FIG. 4(A)). Therefore, at the time of the above sealing, the inside of the seal inner region Rg can be depressurized by the depressurizing portion 25A through the first space S1 of the cylinder chamber 24, the vent hole 23A, and the annular groove 21A. Thereby, a pressure difference is generated between the seal inner region Rg and the seal outer region Rh such that the seal outer region Rh side becomes a positive pressure, and the back surface of the workpiece W2 can be always adhered to the surface of the pad 22 by utilizing the pressure difference.

[0045] Therefore, by moving the piston 241 toward the end position Pt, the suction force generated gradually causes the pad 22 to elastically deform, allowing the workpiece W2, which is in close contact with the pad 22, to move together with the pad 22 in a direction toward the surface 121a of the raised portion 121 (here, the first direction D1; upward in the example of Figure 3) (see Figures 11(A) and 11(B)). As a result, a pressure difference is generated on both sides of the workpiece W2 by utilizing the internal pressure of the chamber 10, causing the bonding surface side of the workpiece W2 to be under positive pressure, while expanding the area where this pressure difference is generated. This allows a crack Kw to grow along the bonding surface between the two workpieces W1 and W2.

[0046] With this peeling mechanism 2, a crack (see Figure 8) created along the bonding surface between the two workpieces W1 and W2 at a part of the outer edge of the laminate Ws triggers the growth of a crack Kw across the entire bonding surface within the chamber 10, and as a result, the two workpieces W1 and W2 can be peeled off at the bonding surface (see Figure 12).

[0047] [1-3] Position Adjustment Mechanism The position adjustment mechanism 3 is a separate mechanism from the lifting mechanism (drive unit 13) of the chamber mechanism 1, and makes it possible to adjust the relative position Pr of the second chamber forming part 12 with respect to the first chamber forming part 11 between the first position P1 and the transition position Ph when the chamber forming parts are joined together (when forming the chamber 10), and between the first position P1 and the second position P2 after they have been joined together (after the chamber 10 has been formed). Details of the transition position Ph will be described later.

[0048] In this embodiment, the position adjustment mechanism 3 includes a biasing portion 301 and a main adjustment portion 302 (see FIGS. 1(A) and 2), and the main adjustment portion 302 is installed one by one on both side surfaces of the chamber mechanism 1 (specifically, both side surfaces in the Y-axis direction; see FIG. 2). Then, these two main adjustment portions 302 are configured to be able to change the relative position Pr of the second chamber forming portion 12 while maintaining an appropriate posture (here, a horizontal posture) of the second chamber forming portion 12 (in other words, without causing inclination in the second chamber forming portion 12) by interlocking with each other to perform position adjustment. Hereinafter, focusing on the biasing portion 301 and one main adjustment portion 302, their specific configurations will be described.

[0049] The biasing portion 301 is installed in the first chamber forming portion 11, and when the second chamber forming portion 12 descends due to the action of the driving portion 13 for forming the chamber 10, the biasing portion 301 takes over from the driving portion 13 and supports the second chamber forming portion 12 from below immediately before the second chamber forming portion 12 is combined with the first chamber forming portion 11 (see FIG. 5(A)). In this embodiment, the biasing portion 301 is a structure that spring-biases the support portion 301Q in the first direction D1. Also, the relative position Pr of the second chamber forming portion 12 when the biasing portion 301 takes over the support from below from the driving portion 13 is defined as the takeover position Ph.

[0050] The main adjustment portion 302 includes a set of movable portions 31A and 31B and a set of cam structures 32A and 32B (see FIG. 1(A)).

[0051] Both the movable parts 31A and 31B are installed on the side surface of the first chamber forming part 11. The movable part 31A is configured to be able to perform translational motion in a second direction D2 (in this embodiment, coinciding with the X-axis direction) perpendicular to the first direction D1, and the movable part 31B is configured to move in the opposite direction in conjunction with the movable part 31A when the movable part 31A moves in the second direction D2. More specifically, a ball screw 310 is installed on the side surface of the first chamber forming part 11 with its axial direction coinciding with the second direction D2, and its screw shaft 311 has a right-hand thread portion and a left-hand thread portion. The movable part 31A is fixed to a nut 312A that moves one of the thread portions, and the movable part 31B is fixed to a nut 312B that moves the other thread portion. Furthermore, both the movable parts 31A and 31B are slidably supported on a guide rail 313 so that their proper orientation is maintained even when they are moving.

[0052] The cam structure 32A is provided on the movable part 31A and the side surface of the second chamber forming part 12, and is configured to convert the translational motion of the movable part 31A in the second direction D2 into the translational motion of the second chamber forming part 12 directed toward the first position P1 (in this case, in the opposite direction to the first direction D1).

[0053] Specifically, as a cam (driving link) constituting the cam structure 32A, a sloped surface 321A is formed on the movable part 31A, which faces diagonally downward to the right in Figure 1(A). Also, as a follower constituting the cam structure 32A, a roller 322A is installed on the side surface of the second chamber forming part 12. These sloped surface 321A and roller 322A are configured such that when the second chamber forming part 12 is supported from below by the biasing part 301, the sloped surface 321A can be brought into contact with the circumferential surface of the roller 322A by moving the movable part 31A in the second direction D2 (see Figure 6).

[0054] With this cam structure 32A, by moving the movable part 31A further in the second direction D2 after the inclined surface 321A contacts the circumferential surface of the roller 322A, the roller 322A can be moved relatively along the inclined surface 321A (see Figure 7(A)). As a result, the roller 322A can be moved in the opposite direction to the first direction D1 against the biasing force of the biasing part 301. By moving the roller 322A in this way, the second chamber forming part 12, which is the driven part of the cam structure 32A, can be displaced toward the first position P1 by the same amount as the displacement of the roller 322A.

[0055] Therefore, by controlling the amount of movement of the movable part 31A, it becomes possible to control the amount of displacement of the second chamber forming part 12, and as a result, it becomes possible to adjust the relative position Pr of the second chamber forming part 12 with respect to the first chamber forming part 11. In this embodiment, such adjustment of the relative position Pr of the second chamber forming part 12 (position adjustment process) is performed when the second chamber forming part 12 is joined to the first chamber forming part 11 (when the chamber 10 is formed) and when correcting any positional misalignment that occurs after they have been joined (i.e., after the chamber 10 has been formed) as needed.

[0056] The cam structure 32B is provided on the movable part 31B and the side surface of the second chamber forming part 12, and is configured to convert the translational motion of the movable part 31B in the opposite direction to the second direction D2 into translational motion of the second chamber forming part 12 directed toward the first position P1 (in this case, in the opposite direction to the first direction D1), and to displace the second chamber forming part 12 in the same direction and by the same amount as the displacement of the second chamber forming part 12 obtained by the cam structure 32A at that time.

[0057] Specifically, as a cam (driving link) constituting the cam structure 32B, a sloped surface 321B is formed on the movable part 31B, facing diagonally downward to the left in Figure 1(A), so as to be symmetrical with the sloped surface 321A. Furthermore, as a follower constituting the cam structure 32B, a roller 322B separate from roller 322A is installed on the side surface of the second chamber forming part 12. More specifically, this roller 322B has the same diameter as roller 322A and is installed so as to be in the same position (at the same height in this embodiment) as roller 322A in the first direction D1. Furthermore, these inclined surfaces 321B and roller 322B are configured such that, when the second chamber forming section 12 is supported from below by the biasing section 301, the movable section 31B is moved in the opposite direction to the second direction D2 in conjunction with the movable section 31A, so that the inclined surface 321B can be brought into contact with the circumferential surface of roller 322B at the same time that the inclined surface 321A comes into contact with the circumferential surface of roller 322A by the cam structure 32A (see Figure 6).

[0058] With this cam structure 32B, after the inclined surface 321B contacts the circumferential surface of the roller 322B, the movable part 31B is moved further in the opposite direction to the second direction D2 in conjunction with the movable part 31A, thereby allowing the roller 322B to move relatively along the inclined surface 321B (see Figure 7(A)). As a result, the roller 322B can be moved in the same direction and by the same amount of displacement as the roller 322A. Therefore, in the cam structure 32B as well, the second chamber forming part 12, which is its driven link (a driven link common to the cam structure 32A), can be moved toward the first position P1 by the same amount of displacement as the second chamber forming part 12 obtained by the cam structure 32A at that time.

[0059] Therefore, with this configuration of the position adjustment mechanism 3, it becomes possible to adjust the position of the second chamber forming section 12 at multiple locations in the same direction with the same amount of displacement. As a result, it becomes possible to adjust the position while maintaining the appropriate orientation of the second chamber forming section 12 (in this embodiment, a horizontal orientation) (in other words, without causing tilting of the second chamber forming section 12).

[0060] Furthermore, according to the position adjustment mechanism 3 described above, the position adjustment mechanism 3 can be configured as a separate mechanism from the mechanism (lifting mechanism; in this embodiment, the drive unit 13 (air cylinder or hydraulic cylinder)) that enables the relative proximity and separation of the second chamber forming section 12 to the first chamber forming section 11. Using such a position adjustment mechanism 3, it becomes possible to adjust the position of the second chamber forming section 12 specifically when the chamber 10 is being formed (including immediately before the formation of the chamber 10). Therefore, it becomes unnecessary to have the lifting mechanism (drive unit 13) have a function to adjust the relative position Pr of the second chamber forming section 12 with high precision, and the lifting mechanism (drive unit 13) can be configured with a simpler mechanism such as an air cylinder or hydraulic cylinder instead of a ball screw. As a result, the peeling device can be simplified and miniaturized, and safety can be improved by using an air cylinder or hydraulic cylinder in the lifting mechanism (drive unit 13). Moreover, the position adjustment mechanism 3 itself can be made thin along the side surface of the chamber mechanism 1.

[0061] Furthermore, in this embodiment, the movable part 31A is configured to move to a retracted position that avoids collision with the cam component (roller 322A) on the second chamber forming part 12 side of the cam structure 32A when the second chamber forming part 12 moves relative to the second position P2 and the third position P3 (see Figures 1(A) and 5(A)). Also, the movable part 31B is configured to move in conjunction with the movement of the movable part 31A to a retracted position that avoids collision with the cam component (roller 322B) on the second chamber forming part 12 side of the cam structure 32B when the movable part 31A moves to the retracted position.

[0062] With this configuration, it becomes possible to perform the function of the position adjustment mechanism 3 without interfering with the function of the lifting mechanism (drive unit 13).

[0063] [1-4] Detection Sensor The detection sensor 4 (see Figures 1(A) and 1(B)) includes a displacement sensor 41 that detects the relative position Pr of the second chamber forming section 12 with respect to the first chamber forming section 11. In this embodiment, the displacement sensor 41 is a contact type sensor installed in the first chamber forming section 11 and detects the position of the opposing surface 12s on the second chamber forming section 12 side as the relative position Pr of the second chamber forming section 12 by contacting the opposing surface 12s from below (see Figures 9(A) and 9(B)) in the first direction D1. A non-contact type displacement sensor 41 may also be used.

[0064] [1-5] Control Device The control device 5 (see Figure 1(B)) consists of a processing device (such as a CPU) and a storage device (such as RAM or ROM), and controls each part of the peeling device (chamber mechanism 1, peeling mechanism 2, position adjustment mechanism 3, detection sensor 4, etc.) according to a control program installed in the peeling device. In this embodiment, the position adjustment process, the peeling process, and the peeling state detection process are executed by the control device 5. Details of these processes will be described below.

[0065] Here, the control program described above may be stored in a readable state on a portable storage medium (e.g., flash memory) before being installed in the peeling device, or it may be stored in a downloadable state on another server or the like. Furthermore, the control processing performed by the control device 5 (position adjustment processing, peeling processing, peeling state detection processing, etc.) is not limited to being implemented in software by executing the program, but may also be implemented in hardware by processing circuits built within the peeling device.

[0066] <Position Adjustment Process> The position adjustment process is started when the laminate Ws is placed on the stage section 20, and then the relative position Pr of the second chamber forming section 12 with respect to the first chamber forming section 11 reaches the handover position Ph (i.e., when the biasing section 301 takes over the support from below of the second chamber forming section 12 from the drive section 13; see Figures 5(A) and 5(B)).

[0067] When the position adjustment process is started, the control device 5 rotates the screw shaft 311 of the ball screw 310, thereby linking the movable parts 31A and 31B and moving them outward in directions away from each other (same and opposite directions to the second direction D2) (see Figure 6). As a result, the inclined surface 321A (cam) provided on the movable part 31A comes into contact with the roller 322A (follower), and at the same time, the inclined surface 321B (cam) provided on the movable part 31B comes into contact with the roller 322B (follower).

[0068] Subsequently, the control device 5 rotates the screw shaft 311 further, causing the movable parts 31A and 31B to move in conjunction and further outward (see Figure 7(A)). This moves the roller 322A relatively along the inclined surface 321A, and as a result, moves the roller 322A in the opposite direction to the first direction D1 against the biasing force of the biasing part 301. At the same time, the roller 322B moves relatively along the inclined surface 321B, and as a result, moves the roller 322B in the same direction as the roller 322A by the same amount of displacement.

[0069] In this way, the control device 5 displaces the second chamber forming section 12, which is a driven link common to the cam structures 32A and 32B, toward the first position P1 by the same amount as the displacement of the rollers 322A and 322B, while maintaining an appropriate posture (horizontal posture in this embodiment), thereby merging the second chamber forming section 12 with the first chamber forming section 11 (see Figure 7(A)).

[0070] As a result, the chamber 10 is formed, and the pad 22 is pressed against the back surface of the workpiece W2 (the surface opposite to the bonding surface) (see Figures 7(B) and 8). Furthermore, the seal portion 26 is pressed against the back surface of the workpiece W2, thereby dividing the space within the chamber 10 into an inner seal region Rg and an outer seal region Rh, and sealing the space between these regions (see Figure 8).

[0071] At this time, the control device 5 adjusts the relative position Pr of the second chamber forming section 12 to coincide with a predetermined position Pz (see Figure 9(B)) set between the first position P1 and the second position P2, so that the amount of compression of the pad 22 itself becomes an appropriate value (in other words, so that the pad 22 is in a moderately compressed state). Specifically, the control device 5 adjusts the relative position Pr of the second chamber forming section 12 to coincide with the predetermined position Pz by controlling the positions of the movable parts 31A and 31B based on the output G of the displacement sensor 41.

[0072] Then, with the chamber mechanism 1 in this positional adjustment state, the peeling process described below is started. On the other hand, in the peeling process, as a process necessary to grow the crack Kw, in the initial stage (before starting peeling of the two workpieces W1 and W2), the internal pressure of the seal-out region Rh inside the chamber 10 is increased to a predetermined pressure necessary for peeling using the pressure difference with the back side of the workpiece W2. As a result, a force is generated in the first chamber forming section 11 and the second chamber forming section 12 that tries to pull them apart. Consequently, there is a risk that the chamber 10 itself will expand at that time, or in other words, the relative position Pr of the second chamber forming section 12 may change in a direction away from the first chamber forming section 11. For this reason, even if the compression amount of the pad 22 itself is adjusted to an appropriate value, if the internal pressure of the seal-out region Rh is increased afterward, the compression amount of the pad 22 itself will decrease, weakening the pressing force on the workpiece W2, which may cause peeling defects when the crack Kw is grown. Thus, the expansion of the chamber 10 may adversely affect the processing within the chamber 10.

[0073] Therefore, even when the internal pressure of the seal-external region Rh inside the chamber 10 is raised to a predetermined pressure in the initial stage of the peeling process, the control device 5 controls the positions of the movable parts 31A and 31B based on the output G of the displacement sensor 41, thereby adjusting the relative position Pr of the second chamber forming section 12 to coincide with the predetermined position Pz.

[0074] As a result, when the internal pressure Rh in the seal-out region of the chamber 10 is increased to the atmospheric pressure (predetermined pressure) required for peeling in the peeling mechanism 2, even if the relative position Pr of the second chamber forming section 12 changes in a direction away from the first chamber forming section 11, it becomes possible to return the relative position Pr to a position (predetermined position Pz) suitable for peeling the two workpieces W1 and W2 in the peeling mechanism 2. Therefore, while simplifying and miniaturizing the peeling device, it becomes possible to suppress the expansion and contraction of the chamber 10 itself due to changes in internal pressure as needed.

[0075] In the following, the adjustment of the internal pressure of the chamber 10 and the position adjustment of the relative position Pr, which are performed by the control device 5 in the initial stage of the peeling process, will be collectively referred to as process (S1). In this embodiment, in process (S1), the control device 5 further sets the output G of the displacement sensor 41 when the relative position Pr of the second chamber forming section 12 is aligned with a predetermined position Pz as the initial value Gs before the start of peeling.

[0076] After adjusting the relative position Pr, the control device 5, without making any further adjustments to the relative position Pr, executes the separation state detection process described later, and detects the separation state between the two workpieces W1 and W2 based on the change in the output G of the displacement sensor 41 from the initial value Gs.

[0077] <Peeling Process> The peeling process is started after the chamber 10 is formed by the position adjustment process described above (see Figure 7(B)). Therefore, at the start of the peeling process, the seal portion 26 is pressed against the back surface of the workpiece W2, thereby dividing the space inside the chamber 10 into an inner seal region Rg and an outer seal region Rh, and sealing the space between these regions with the seal portion 26 (see Figure 8). The crack that triggers peeling (growth of crack Kw) (see Figure 8) is created at a position close to the ventilation opening 23A on the outer edge of the laminate Ws using a well-known generation means 6 (for example, see Patent Document 1). Furthermore, the formation of such a crack (trigger creation) may be performed before the formation of the chamber 10, or after the formation of the chamber 10 but before the start of the peeling process.

[0078] When the peeling process is started, the control device 5 sets the position of the piston 241 in the cylinder chamber 24 to the starting position Ps (the position between the vent 23A and the adjacent vent 23B) (see Figure 10(A)).

[0079] Subsequently, the control device 5 controls the pressure boosting unit 25B to increase the internal pressure of the second space S2 within the cylinder chamber 24, thereby increasing the pressure in all the slit grooves 21B through the vent 23B, and the resulting increased pressure strongly presses the entire pad 22 against the workpiece W2 (see Figures 10(A) and 10(B)). As a result, the overall amount of compression of the pad 22 itself increases, and the pressing force against the entire workpiece W2 is strengthened.

[0080] Next, the control device 5 controls the internal pressure adjustment unit 14 to raise the internal pressure of the seal-external region Rh within the chamber 10 to a predetermined pressure necessary for peeling using the pressure difference with the back side of the workpiece W2 (process (S1). See Figure 10(B)). At this time, as described above, the control device 5 adjusts the relative position Pr of the second chamber forming unit 12 to coincide with the predetermined position Pz during the position adjustment process.

[0081] Subsequently, the control device 5 causes the peeling mechanism 2 to perform peeling (peeling within the chamber 10) on the two workpieces W1 and W2.

[0082] Specifically, the control device 5 controls the pressure reduction unit 25A to lower the internal pressure of the first space S1 in the cylinder chamber 24, thereby reducing the pressure inside the seal inner region Rg through the vent 23A and the annular groove 21A. This creates a pressure difference between the seal inner region Rg and the seal outer region Rh, where the seal outer region Rh side is at positive pressure, and this pressure difference is used to bring the back surface of the workpiece W2 into close contact with the surface of the pad 22 (see Figure 10(B)). Figure 10(B) shows the case where the crack Kw grows along the seal inner region Rg to near the pad 22 due to the close contact of the workpiece W2 with the surface of the pad 22.

[0083] Next, the control device 5 moves the piston 241 through the shaft 242 from the starting position Ps to the ending position Pt (in this case, in the X-axis direction) (see Figure 11(A)), thereby expanding the occupied area of ​​the first space S1 within the cylinder chamber 24. As a result, starting with the vent 23B closest to the vent 23A, the space within the cylinder chamber 24 leading to the vent 23B is switched from the second space S2 to the first space S1. In this way, starting with the slit groove 21B closest to the vent 23A, the state within the slit groove 21B is switched from a pressurized state to a depressurized state.

[0084] As a result, a pressure difference is generated between the slit groove 21B and the seal outer region Rh (crack Kw), starting from the slit groove 21B closest to the vent 23A, causing the seal outer region Rh to be in positive pressure (i.e., generating an attractive force in the slit groove 21B). Then, by using this pressure difference to elastically deform the pad 22, the crack Kw is grown along the bonding surface (see Figures 11(A) and 11(B)). Through this process, the crack Kw is grown across the entire bonding surface in the chamber 10, causing the two workpieces W1 and W2 to be separated at the bonding surface (see Figure 12).

[0085] On the other hand, during the growth of the crack Kw, even if the internal pressure of the chamber 10 remains constant, the pressure-receiving area of ​​the first chamber forming section 11 and the second chamber forming section 12 increases as the peeling area increases due to the growth of the crack Kw, and consequently, the force trying to separate the two chamber forming sections also increases. In the peeling device of this embodiment, this change in force manifests as a change in the relative position Pr of the second chamber forming section 12 relative to the first chamber forming section 11. Therefore, in this embodiment, the peeling state between the two workpieces W1 and W2 is indirectly detected by utilizing the fact that the relative position Pr changes as the crack Kw grows. This will be explained in detail below.

[0086] <Peeling State Detection Process> Figure 13 is a flowchart showing the peeling state detection process. This peeling state detection process is started when the initial value Gs before peeling starts is set in the process (S1) described above. Therefore, the peeling state detection process is executed in parallel with the peeling process described above when the peeling (peeling within the chamber 10) of the two workpieces W1 and W2 is performed by the peeling mechanism 2. The peeling state detection process can be called the process (S2) that is executed after process (S1).

[0087] When the delamination state detection process is started, the control device 5 detects the delamination state between the two workpieces W1 and W2 based on the change in the output G of the displacement sensor 41 from the initial value Gs that occurs during the delamination process. Specifically, it is as follows:

[0088] Figure 14(A) is a conceptual diagram illustrating the relationship between the position of the piston 241 and the change amount ΔG from the initial value Gs of the output G of the displacement sensor 41 (amount corresponding to the displacement amount from a predetermined position Pz for the relative position Pr of the second chamber forming section 12). As shown in this figure, during the peeling process, by moving the piston 241 from the starting position Ps to the ending position Pt, the peeling area increases as the crack Kw grows, and accordingly, the change amount ΔG from the initial value Gs of the output G of the displacement sensor 41 increases. When the crack Kw grows across the entire bonding surface, this change amount ΔG will reach a predetermined value ΔGt corresponding to the peeling area at that time.

[0089] On the other hand, in a peeling device, the growth of the crack Kw may stop midway through the peeling process for some reason. In this case, the peeling state between the two workpieces W1 and W2 will be such that workpiece W2 remains partially attached to workpiece W1 (a state in which peeling failure occurs). The change amount ΔG will then stop changing midway through moving the piston 241 toward the end position Pt (i.e., before reaching the predetermined value ΔGt), as shown in Figure 14(B).

[0090] Therefore, the control device 5 first determines whether or not there is a change in the amount of change ΔG from the initial value Gs for the output G of the displacement sensor 41 (step S101 in Figure 13). If the control device 5 determines in step S101 that there is "no change (No)", then it determines that the separation state between the two workpieces W1 and W2 is in a state where separation failure has occurred (step S110 in Figure 13).

[0091] On the other hand, if the control device 5 determines in step S101 that there is a change (Yes), it can determine that the crack Kw is growing. In this case, the control device 5 determines whether the piston 241 has reached the end position Pt (step S102). The control device 5 then repeatedly executes steps S101 and S102 until it can determine in step S101 that there is no change (No), or in step S102 that it has reached the end position (Yes).

[0092] If the control device 5 determines in step S102 that it has "reached (Yes)", it further determines whether the change amount ΔG has reached a predetermined value ΔGt (step S103 in Figure 13). If the control device 5 determines in step S103 that it has "reached (Yes)", it uses that determination to determine that the delamination state between the two workpieces W1 and W2 has reached a state where the crack Kw has grown across the entire bonding surface and delamination is complete (step S111 in Figure 13). On the other hand, if the control device 5 determines in step S103 that it has "not reached (No)", it uses that determination to determine that the delamination state between the two workpieces W1 and W2 has reached a state where delamination failure has occurred (step S110 in Figure 13).

[0093] This process allows the displacement sensor 41 to detect changes in the relative position Pr of the second chamber forming section 12 with respect to the first chamber forming section 11, thereby indirectly detecting how much the peeling area has increased due to the growth of the crack Kw (in other words, the peeling state between the two workpieces W1 and W2). Specifically, step S101 allows detection that a peeling defect has occurred between the two workpieces W1 and W2 (that the growth of the crack Kw has stopped midway). Furthermore, step S103 allows detection that the peeling of the two workpieces W1 and W2 has been completed (that the crack Kw has grown across the entire bonding surface).

[0094] Therefore, with the peeling device of this embodiment, when peeling two workpieces W1 and W2 inside the chamber 10, the peeling state between the two workpieces W1 and W2 can be detected without opening the chamber 10.

[0095] [2] Modified Version [2-1] First Modified Version In the peeling apparatus described above, if the control device 5 determines that there is "no change (No)" in step S101 of Figure 13, or if it determines that it has "not reached (No)" in step S103, it may cause the peeling mechanism 2 to restart the peeling of the two workpieces W1 and W from the beginning or in the middle.

[0096] This makes it possible to repeat the peeling process until the peeling defect is eliminated if one occurs.

[0097] [2-2] Second Modified Example In the peeling apparatus described above, if the chamber 10 expands when the internal pressure of the seal-external region Rh inside the chamber 10 is increased to a predetermined pressure in the initial stage of the peeling process, and it is not necessary to adjust the relative position Pr of the second chamber forming portion 12 to coincide with the predetermined position Pz, then the output G of the displacement sensor 41 at that time (output G of the displacement sensor 41 without position adjustment) may be set as the initial value Gs.

[0098] [2-3] Third Modification In the position adjustment mechanism 3 described above, the cam structure 32A is not limited to a combination of a cam and follower formed therein, where the inclined surface 321A formed on the movable part 31A is the cam and the roller 322A installed on the side surface of the second chamber forming part 12 is the follower, but may be appropriately changed to another combination that can perform the same function. The same applies to the cam structure 32B.

[0099] Figures 15(A) to 15(D) are conceptual diagrams showing four different modifications of the cam structure 32A. These modifications can also be applied to the cam structure 32B.

[0100] Figure 15(A) shows the case where the follower of the cam structure 32A is changed to an inclined surface 323. In this case, by moving the movable part 31A in the second direction D2, the inclined surface 321A (cam) is brought into surface contact with the inclined surface 323 (follower) (see the right diagram in Figure 15(A)). Then, by further moving the movable part 31A in the second direction D2, it is made to slide along the inclined surface 323 (follower) while maintaining surface contact, and as a result, the inclined surface 323 (follower) can be moved in the opposite direction to the first direction D1.

[0101] Figure 15(B) shows the configuration of Figure 15(A) in which a rolling mechanism 324 (such as a roller) is provided on the inclined surface 323 (follower). With this configuration, the sliding of the inclined surface 321A (cam) against the inclined surface 323 (follower) is improved.

[0102] Figure 15(C) shows a case where the follower of the cam structure 32A is composed of a linear guide 325, a block portion 326, and a receiving portion 327. Specifically, the block portion 326 is slidably installed on the inclined surface 321A via the linear guide 325. The receiving portion 327 is installed on the side surface of the second chamber forming portion 12 and is configured to receive the block portion 326 midway when the movable portion 31A moves in the second direction D2 (see the right diagram in Figure 15(C)), thereby allowing the subsequent movement of the block portion 326 (movement resulting from sliding relative to the inclined surface 321A) to be transmitted directly to the second chamber forming portion 12.

[0103] In the example shown in Figure 15(C), the receiving portion 327 is formed in an L-shape. This allows the receiving portion 327 to receive the block portion 326, and then, when the block portion 326 slides relative to the inclined surface 321A (cam) and moves in the opposite direction to the first direction D1, the movement of the block portion 326 at that time can be directly transmitted to the second chamber forming portion 12 via the receiving portion 327.

[0104] Figure 15(D) shows the case where the relationship between the cam and follower for the inclined surface 321A and roller 322A in the above-described embodiment is reversed (i.e., a reverse cam configuration).

[0105] [2-4] Fourth Modification In the position adjustment mechanism 3 described above, the movable part 31B may be configured to move in the same direction in conjunction with the movable part 31A. Specifically, the screw shaft 311 may be configured such that the two screw portions formed thereon (the two screw portions into which the nuts 312A and 312B are screwed) are either right-hand threads or left-hand threads.

[0106] In this case, the cam structure 32B is modified as appropriate to have a corresponding configuration. Specifically, the cam structure 32B is configured so that even when the movable part 31B is modified to move in the same direction as the movable part 31A, the second chamber forming part 12 can be displaced in the same direction and by the same amount as the displacement of the second chamber forming part 12 obtained by the cam structure 32A.

[0107] As another variation, the movable parts 31A and 31B may be configured to selectively switch between moving in opposite directions in conjunction with each other and moving in the same direction. Specifically, the two screw parts described above may be connected via a switching gear so that they can selectively switch between rotating in the same direction in conjunction with each other and rotating in opposite directions.

[0108] With this switchable configuration, when the position adjustment mechanism 3 adjusts the relative position Pr by moving the movable parts 31A and 31B in opposite directions, even if a misalignment occurs between the two cam structures 32A and 32B for some reason with respect to the displacement of the second chamber forming part 12, it becomes possible to return to a state without misalignment by moving the two movable parts 31A and 31B in the same direction and thereby adjusting the position of the midpoint that bisects the distance between the two movable parts 31A and 31B.

[0109] Furthermore, when the position adjustment mechanism 3 adjusts the relative position Pr by moving the movable parts 31A and 31B in the same direction, if a misalignment occurs between the two cam structures 32A and 32B for any reason regarding the displacement of the second chamber forming part 12, the two movable parts 31A and 31B can be moved in opposite directions, thereby adjusting the distance between the two movable parts 31A and 31B and returning to a state without misalignment.

[0110] [2-5] Figure 16 of the fifth modified example is a cross-sectional view of the peeling device according to the fifth modified example (a cross-sectional view along the same line I-I shown in Figure 2). As shown in this figure, a surface irregularity-relieving layer 27 may be formed on the surface of the pad 22 to reduce irregularities that may occur on the surface when the pad 22 is elastically deformed by a pressure difference (suction force). As an example, the surface irregularity-relieving layer 27 is formed by attaching a resin plate (for example, a resin plate with a thickness of about 1 to 1.5 mm) to the surface of the pad 22.

[0111] According to the fifth modification, even if the workpiece W2 is thin and easily deformed, it becomes possible to maintain the portion peeled off from the workpiece W1 in as flat a state as possible due to the growth of the crack Kw. Furthermore, by forming an unevenness-relieving layer 27 (such as a resin plate) on the surface of the pad 22, foreign matter (dust, dirt, etc.) that was originally attached to the pad 22, as well as wear particles of the pad 22 itself generated by repeated elastic deformation of the pad 22, can be sealed to the pad 22 side by the unevenness-relieving layer 27. As a result, it becomes possible to prevent these foreign matter and wear particles from being transferred to the workpiece W2 during the peeling process and adversely affecting the workpiece W2.

[0112] [2-6] Figure 17 of the sixth modified example is a conceptual diagram showing a peeling device according to the sixth modified example. As shown in this figure, the vent 23A may be connected to an internal pressure adjustment section 25C (at least including a pressure reduction section) different from the pressure reduction section 25A and the pressure increase section 25B, without being exposed into the cylinder chamber 24. With this configuration, it becomes possible to reduce the pressure inside the annular groove 21A independently of the position of the piston 241, in other words, independently of the control that reduces or increases the pressure inside the slit groove 21B through the cylinder chamber 24.

[0113] The above-described embodiments and modifications should be considered in all respects to be illustrative and not restrictive. The scope of the present invention is indicated by the claims, rather than by the above-described embodiments and modifications. Furthermore, the scope of the present invention is intended to include all modifications within the meaning and scope equivalent to the claims.

[0114] Furthermore, the subject matter of the invention may not be limited to the peeling device, but may be partially extracted from the above-described embodiments and modifications. This may include components of the peeling device (such as the chamber mechanism 1 and the peeling mechanism 2), or some or all of the processes performed by the control device 5 (such as position adjustment processing, peeling processing, and peeling state detection processing, including the corresponding position adjustment method, peeling method, and peeling state detection method), or even programs for executing these processes.

[0115] 1 Chamber mechanism 2 Delamination mechanism 3 Position adjustment mechanism 4 Detection sensor 5 Control device 6 Generation means G Output 10 Chamber 11 First chamber forming section 12 Second chamber forming section 11s, 12s Opposing surfaces 12t Back surface 13 Drive section 14 Internal pressure adjustment section 20 Stage section 21A Annular groove 21B Slit groove 22 Pad 23A, 23B Vent 24 Cylinder chamber 25A Pressure reduction section 25B Pressure increasing section 25C Internal pressure adjustment section 26 Seal section 27 Unevenness relaxation layer 31A, 31B Movable section 32A, 32B Cam structure 41 Displacement sensor D1 First direction D2 Second direction Gs Initial value Kw Crack Lx Imaginary line P1 First position P2 Second position P3 Third position Ph Transfer position Pr Relative position Ps Start position Pt End position Pz Determined position Rg Seal inner area Rh Seal outer area S1 First space S2 Second space W1, W2 Workpiece Ws Laminate ΔG Change amount ΔGt Determined value 101 First recess 102 Second recess 103 Seal part 121 Raised part 121a Surface 241 Piston 242 Shaft 301 Biasing part 301Q Support part 302 Main adjustment part 310 Ball screw 311 Screw shaft 312A, 312B Nut 313 Guide rail 321A, 321B Inclined surface 322A, 322B Roller 323 Inclined surface 324 Rolling means 325 Linear guide 326 Block part 327 Receiving part

Claims

A chamber mechanism comprising a first chamber forming section and a second chamber forming section that can change their relative positional relationship in a first direction and form a chamber by joining together via an elastic seal section, wherein by utilizing the elasticity of the seal section, the relative position of the second chamber forming section with respect to the first chamber forming section can be changed between a first position and a second position further away, while maintaining the joined state of the chamber forming sections, The peeling mechanism, located within the chamber, enables the separation of two bonded workpieces by growing a crack between their bonded surfaces. The peeling mechanism generates a pressure difference on either the front or back of one of the workpieces, using the internal pressure of the chamber to create a positive pressure on the bonded surface side of the workpiece, and expands the area where this pressure difference is generated to grow the crack. A displacement sensor for detecting the relative position of the second chamber forming portion with respect to the first chamber forming portion, A control device for detecting the separation state between the two workpieces based on the output of the displacement sensor, A peeling device equipped with the following features. 　 The control device is Before the peeling mechanism starts peeling the two workpieces, the process (S1) involves raising the internal pressure of the chamber to a predetermined pressure and setting the output of the displacement sensor at that time as the initial value before the start of peeling. Subsequently, the separation mechanism is made to perform separation on the two workpieces, and the separation state between the two workpieces is detected based on the change from the initial value that occurs in the output of the displacement sensor during this process (S2), The peeling apparatus according to claim 1, which performs the following: 　 A position adjustment mechanism that enables adjustment of the relative position of the second chamber forming portion with respect to the first chamber forming portion between the first position and the second position. Furthermore, The control device is In the process (S1), when the internal pressure of the chamber is raised to a predetermined pressure, the position adjustment mechanism is controlled based on the output of the displacement sensor to adjust the relative position of the second chamber forming portion to coincide with a predetermined position set between the first position and the second position. The peeling apparatus according to claim 2, wherein in the process (S2), the peeling state between the two workpieces is detected based on the change from the initial value that occurs in the output of the displacement sensor, without further adjustment of the relative position of the second chamber forming portion. 　 The position adjustment mechanism is, A movable part is installed in the first chamber forming section and is configured to be capable of translational movement in a second direction perpendicular to the first direction, A cam structure is provided in the movable part and the second chamber forming part, which converts the translational motion of the movable part in the second direction into the translational motion of the second chamber forming part directed toward the first position, The peeling apparatus according to claim 3, comprising: 　 In the process (S2), the control device determines that when the output of the displacement sensor changes from the initial value to a predetermined value, the peeling state between the two workpieces has reached a state in which the crack has grown over the entire bonding surface and peeling is complete, according to any one of claims 2 to 4. 　 In the process (S2), if the output of the displacement sensor does not reach the predetermined value and the output stops changing midway, the control device causes the peeling mechanism to restart the peeling of the two workpieces from the beginning or midway, as described in claim 5.

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