Blender assembly

The snap ring with a stainless steel substrate and low friction polymer layer addresses noise and vibration issues in assemblies, improving assembly performance and longevity.

WO2026073238A1PCT designated stage Publication Date: 2026-04-02SAINT GOBAIN PERFORMANCE PLASTICS CORP
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Patent Information

Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Filing Date
2025-09-30
Publication Date
2026-04-02

AI Technical Summary

Technical Problem

Existing snap rings do not adequately address noise, harshness, and vibration issues in assemblies such as blenders, while maintaining a long assembly lifetime.

Method used

A snap ring comprising an annular body with a substrate and a polymer layer, where the substrate is made from materials like stainless steel and the polymer layer is made from low friction materials such as polyketone, providing a low friction interface to reduce noise and vibration.

Benefits of technology

The snap ring effectively reduces noise and vibration in assemblies by utilizing a composite material with a low friction polymer layer, enhancing the assembly's lifetime and performance.

✦ Generated by Eureka AI based on patent content.

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Abstract

A blender assembly including: an inner member including a bearing oriented down a central axis; an outer member including a housing disposed at least partially exterior and concentric to the inner member; and at least one snap ring disposed radially between the inner member and the outer member, the at least one snap ring including: a snap ring body including a split annular body defining an aperture oriented down the central axis, where the snap ring body includes a substrate and a polymer layer overlying the substrate.
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Description

[0001] Attorney Docket No.: 22-OE-0223WO01

[0002] BLENDER ASSEMBLY

[0003] TECHNICAL FIELD

[0004] This disclosure generally relates to snap rings and, in particular, to snap rings for improving noise and vibration within assemblies.

[0005] BACKGROUND ART

[0006] Commonly, snap rings constrain relative movement to the desired motion and reduce friction between neighboring parts. One type of snap ring may be located in a gap between the outer surface of an inner component and the inner surface of the bore of an outer component within an assembly. Exemplary assemblies may include blenders, mixers, food processors, or other assemblies known in food preparation applications. Sometimes, there exists a need to have less noise, harshness and vibration across components such as the inner component (such as a shaft or bearing) and the outer component (such as a housing) in such an assembly. Therefore, there exists an ongoing need for improved snap rings that provide improved noise, harshness and vibration characteristics while maintaining a longer lifetime of the assembly.

[0007] BRIEF DESCRIPTION OF THE DRAWINGS

[0008] The present disclosure may be better understood, and its numerous features and advantages made apparent to those skilled in the art by referencing the accompanying drawings.

[0009] FIG. 1 includes a method of producing a snap ring in accordance with an embodiment;

[0010] FIG. 2A includes a cross-sectional view of a composite material that may form snap ring in accordance with an embodiment;

[0011] FIG. 2B includes a cross-sectional view of a composite material that may form a snap ring in accordance with an embodiment;

[0012] FIG. 2C includes a cross-sectional view of a composite material that may form of a snap ring in accordance with an embodiment;

[0013] FIG. 3 A includes top perspective view of a snap ring in accordance with embodiments described herein;

[0014] FIG. 3B includes top perspective view of a snap ring in accordance with embodiments described herein; Atorney Docket No.: 22-OE-0223WO01

[0015] FIG. 3C includes top perspective view of a snap ring in accordance with embodiments described herein;

[0016] FIG. 3D includes top perspective view of a snap ring in accordance with embodiments described herein;

[0017] FIG. 4 includes a top perspective view of a snap ring within an assembly in accordance with embodiments described herein;

[0018] FIG. 5 A includes a side view of a blender assembly in accordance with embodiments described herein;

[0019] FIG. 5B includes a top unassembled view of a snap ring in a blender assembly in accordance with embodiments described herein;

[0020] FIG. 6 includes a graph of noise reduction [dB] of blender assemblies according to embodiments herein versus blender assemblies known in the art.

[0021] Skilled artisans appreciate that elements in the figures are illustrated for simplicity and clarity and have not necessarily been drawn to scale. For example, the dimensions of some of the elements in the figures may be exaggerated relative to other elements to help to improve understanding of embodiments of the invention. The use of the same reference symbols in different drawings indicates similar or identical items.

[0022] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT(S)

[0023] The following description in combination with the figures is provided to assist in understanding the teachings disclosed herein. The following discussion will focus on specific implementations and embodiments of the teachings. This focus is provided to assist in describing the teachings and should not be interpreted as a limitation on the scope or applicability of the teachings. However, other embodiments can be used based on the teachings as disclosed in this application.

[0024] The terms “comprises,” “comprising,” “includes,” “including,” “has,” “having” or any other variation thereof, are intended to cover a non-exclusive inclusion. For example, a method, article, or apparatus that comprises a list of features is not necessarily limited only to those features but may include other features not expressly listed or inherent to such method, article, or apparatus. Further, unless expressly stated to the contrary, “or” refers to an inclusive-or and not to an exclusive-or. For example, a condition A or B is satisfied by any one of the Atorney Docket No.: 22-OE-0223WO01 following: A is true (or present) and B is false (or not present), A is false (or not present) and B is true (or present), and both A and B are true (or present).

[0025] Also, the use of “a” or “an” is employed to describe elements and components described herein. This is done merely for convenience and to give a general sense of the scope of the invention. This description should be read to include one, at least one, or the singular as also including the plural, or vice versa, unless it is clear that it is meant otherwise. For example, when a single embodiment is described herein, more than one embodiment may be used in place of a single embodiment. Similarly, where more than one embodiment is described herein, a single embodiment may be substituted for that more than one embodiment.

[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The materials, methods, and examples are illustrative only and not intended to be limiting. To the extent not described herein, many details regarding specific materials and processing acts are conventional and may be found in textbooks and other sources within the snap ring and snap ring assembly arts.

[0027] Embodiments described herein are generally directed to a snap ring and methods of creating and using a snap ring within an assembly. In particular embodiments, the snap ring may have an annular snap ring body including a substrate and a polymer layer overlying the substrate.

[0028] Embodiments of the invention may include: a blender assembly comprising: an inner member comprising a bearing oriented down a central axis; an outer member comprising a housing disposed at least partially exterior and concentric to the inner member; and at least one snap ring disposed radially between the inner member and the outer member, the at least one snap ring comprising:

[0029] For purposes of illustration, FIG. 1 includes a method of producing a snap ring in accordance with an embodiment described above. The forming process 10 may include a first step 12 of providing a base material, a second step 14 of coating the base material with a low friction coating to form a composite material and a third step 16 of forming the composite material into a snap ring.

[0030] Referring to the first step 12, the base material may be a substrate. In an embodiment, the substrate can at least partially include a metal. According to certain embodiments, the metal may include iron, copper, titanium, tin, aluminum, alloys Atorney Docket No.: 22-OE-0223WO01 thereof, or may be another type of material. More particularly, the substrate can at least partially include a steel, such as stainless steel, carbon steel, or spring steel. For example, the substrate can at least partially include a 301 stainless steel. The 301 stainless steel may be annealed, % hard, ’A hard, % hard, or full hard. Moreover, the steel can include stainless steel including chrome, nickel, or a combination thereof. A particular stainless steel is 301 stainless steel. The substrate may include a woven mesh or an expanded metal grid. Alternatively, the woven mesh can be a woven polymer mesh. In an alternate embodiment, the substrate may not include a mesh or grid. The substrate may include conductive material.

[0031] In a number of embodiments, the substrate may be spring steel. The spring steel substrate may be annealed, A hard, ’A hard, % hard, or full hard. The spring steel substrate may have a tensile strength of not less than 600 MPa, such as not less than 700 MPa, such as not less than 750 MPa, such as not less than 800 MPa, such as not less than 900 MPa, or such as not less than 1000 MPa. The spring steel substrate may have a tensile strength of no greater than 1500 MPa, or such as no greater than 1250 MPa.

[0032] FIG. 2 A includes an illustration of the composite material 1000 that may be formed according to first step 12 and second step 14 of the forming process 10 for producing a snap ring in accordance with an embodiment described above. For purposes of illustration, FIG. 2A shows the layer-by-layer configuration of a composite material 1000 after second step 14. In a number of embodiments, the composite material 1000 may include a substrate 1119 (i.e., the base material provided in the first step 12) and a polymer layer 1104 (i.e., the low friction coating applied in second step 14). As shown in FIG. 2A, the polymer layer 1104 can be coupled to at least a portion of the substrate 1119. In a particular embodiment, the polymer layer 1104 can be coupled to a surface of the substrate 1119 so as to form a low friction interface with another surface of another component. The polymer layer 1104 can be coupled to the radially inner surface of the substrate 1119 so as to form a low friction interface with another surface of another component. The polymer layer 1104 can be coupled to the radially outer surface of the substrate 1119 so as to form a low friction interface with another surface of another component.

[0033] In a number of embodiments, the polymer layer 1104 can include a low friction material. Low friction materials may include, for example, a polymer, such as Atorney Docket No.: 22-OE-0223WO01 a polyketone, a polyaramid, a polyimide, a polytherimide, a polyphenylene sulfide, a polyetherslfone, a polysulfone, a polypheylene sulfone, a polyamideimide, ultra high molecular weight polyethylene, a fluoropolymer, a polyamide, a polybenzimidazole, or any combination thereof. In an example, the polymer layer 1104 includes a polyketone, a polyaramid, a polyimide, a polyetherimide, a polyamideimide, a polyphenylene sulfide, a polyphenylene sulfone, a fluoropolymer, a polybenzimidazole, a derivation thereof, or a combination thereof. In a particular example, the low friction / wear resistant layer includes a polymer, such as a polyketone, a thermoplastic polyimide, a polyetherimide, a polyphenylene sulfide, a polyether sulfone, a polysulfone, a polyamideimide, a derivative thereof, or a combination thereof. In a further example, the low friction / wear resistant layer includes polyketone, such as polyether ether ketone (PEEK), polyether ketone, polyether ketone ketone, polyether ketone ether ketone, a derivative thereof, or a combination thereof. In an additional example, the low friction / wear resistant layer may be an ultra high molecular weight polyethylene. An example fluoropolymer includes fluorinated ethylene propylene (FEP), polytetrafluoroethylene (PTFE), polyvinylidene fluoride (PVDF), perfluoroalkoxy (PF A), a terpolymer of tetrafluoroethylene, hexafluoropropylene, and vinylidene fluoride (THV), polychlorotrifluoroethylene (PCTFE), ethylene tetrafluoroethylene copolymer (ETFE), ethylene chlorotrifluoroethylene copolymer (ECTFE), polyacetal, polybutylene terephthalate (PBT), polyethylene terephthalate (PET), polyimide (PI), polyetherimide, polyetheretherketone (PEEK), polyethylene (PE), polysulfone, polyamide (PA), polyphenylene oxide, polyphenylene sulfide (PPS), polyurethane, polyester, liquid crystal polymers (LCP), an elastomer, or any combination thereof. Exemplary fluoropolymers include a polytetrafluoroethylene (PTFE), a modified PTFE (TFM), a fluorinated ethylene propylene (FEP), a polyvinylidene fluoride (PVDF), a perfluoroalkoxy (PF A), a terpolymer of tetrafluoroethylene, a hexafluoropropylene and vinylidene fluoride (THV), a polychlorotrifluoroethylene (PCTFE), an ethylene tetrafluoroethylene copolymer (ETFE), an ethylene chlorotrifluoroethylene copolymer (ECTFE), EVA, silicone, polyolefin, polycarbonate, HDPE, POE, COC, COP, PMP, FEP, PTFE, FEP (fluorinated ethylene-propylene), TFE (tetrafluoroethylene), PFA (perfluoroalkoxy), PVF (polyvinylfluoride), PVDF (polyvinylidene fluoride), PTFE (polytetrafluoroethylene), Atorney Docket No.: 22-OE-0223WO01

[0034] PCTFE (polychlorotrifluoroethylene), ETFE (polyethylenetetrafluoroethylene), ECTFE (polyethylenechlorotrifluoroethylene), FFPM / FFKM (perfluoroelastomer), FPM / FKM (chlorotrifluoroethylenevinylidene fluoride), PFPE (perfluoropolyether), MFA (tetrafuoroethylene and perfuoromethyl vinyl-ether copolymer), CTFE / VDF (chlorotrifuoroethylene-vinylidene fluoride copolymer), and TFE / HFP (tetrafuoroethylene-hexafuoropropylene copolymer), natural polyisoprene rubber (NR), synthetic polyisoprene rubber (IR), polybutadiene rubber (BR), chloroprene rubber (CR), butyl rubber (IIR), halogenated butyl rubbers (CIIR, BUR), styrenebutadiene rubber (SBR), nitrile rubber (NBR) and hydrogenated nitrile rubber (HNBR), ethylene propylene rubber (EPM), ethylene propylene diene rubber (EPDM), epichlorohydrin rubber (ECO), polyacrylic rubber (ACM, ABR), silicone rubber (SI, Q, VMQ), fluorosilicone rubber (FSR, FVMQ), fluoroelastomers (FKM, FEPM), perfluoroelastomers (FFKM), polyether block amides (PEB A), chlorosulfonated polyethylene (CSM), ethylene-vinyl acetate (EVA), cyclic olefin copolymers, polyolefin elastomers, polypropylene elastomer (PE), elastomeric PET, or mixtures thereof, or any combination thereof. Other fluoropolymers, polymers, and blends may be included in the composition of the apparatus 100 or any components thereof listed herein. In another particular embodiment, the polymer layer 1104 can at least partially include, or even consist essentially of, a polyethylene (PE) such as an ultra-high-molecular-weight polyethylene (UHMWPE). In another particular embodiment, the polymer layer 1104 may include a thermoplastic elastomeric hydrocarbon block copolymer, a polyether-ester block co-polymer, a thermoplastic polyamide elastomer, a thermoplastic polyurethane elastomer, a thermoplastic polyolefin elastomer, a thermoplastic vulcanizate, an olefin-based copolymer, an olefin-based ter-polymer, a polyolefin plastomer, or combinations thereof. In an embodiment, the polymer layer 1104 may include a styrene based block copolymer such as styrene-butadiene, styrene-isoprene, blends or mixtures thereof, and the like. Exemplary styrenic thermoplastic elastomers include triblock styrenic block copolymers (SBC) such as styrene-butadiene-styrene (SBS), styrene- isoprene-styrene (SIS), styrene-ethylene butylene-styrene (SEBS), styrene-ethylene propylene- styrene (SEPS), styrene-ethylene-ethylene-butadiene-styrene (SEEBS), styrene-ethylene-ethylene-propylene-styrene (SEEPS), styrene-isoprene-butadiene- styrene (SIBS), or combinations thereof. Commercial examples include some grades Atorney Docket No.: 22-OE-0223WO01 of Kraton™ and Hybrar™ resins. In an embodiment, the apparatus 100 or any components thereof listed herein may include an elastomer including at least one of Acrylonitrile-Butadiene (NBR) Carboxylated Nitrile (XNBR) Ethylene Acrylate (AEM, Vamac®), Ethylene Propylene Rubber (EPR, EPDM), Butyl Rubber (IIR), Chloroprene Rubber (CR), Fluorocarbon (FKM, FPM), Fluorosilicone (FVMQ), Hydrogenated Nitrile (HNBR), Perfluoroelastomer (FFKM), Polyacrylate (ACM), Polyurethane (AU, EU), Silicone Rubber (Q, MQ, VMQ, PVMQ), Tetrafluoroethylene-Propylene (AFLAS®) (FEPM). The polymer layer 1104 may include a solid based material including lithium soap, graphite, boron nitride, molybdenum disulfide, tungsten disulfide, polytetrafluoroethylene, carbon nitride, tungsten carbide, or diamond like carbon, a metal (such as aluminum, zinc, copper, magnesium, tin, platinum, titanium, tungsten, lead, iron, bronze, steel, spring steel, stainless steel), a metal alloy (including the metals listed), an anodized metal (including the metals listed), or any combination thereof. Fluoropolymers may be used according to particular embodiments.

[0035] In a number of embodiments, the polymer layer 1104 may further include fillers, including glass fibers, carbon fibers, silicon, PEEK, aromatic polyester, carbon particles, bronze, fluoropolymers, thermoplastic fillers, aluminum oxide, polyamidimide (PAI), PPS, polyphenylene sulfone (PPSO2), LCP, aromatic polyesters, molybdenum disulfide, tungsten disulfide, graphite, grapheme, expanded graphite, boron nitrade, talc, calcium fluoride, or any combination thereof. Additionally, the filler can include alumina, silica, titanium dioxide, calcium fluoride, boron nitride, mica, Wollastonite, silicon carbide, silicon nitride, zirconia, carbon black, pigments, or any combination thereof. Fillers can be in the form of beads, fibers, powder, mesh, or any combination thereof. The fillers may be at least 1 wt% based on the total weight of the polymer layer, such as at least 5 wt%, or even 10 wt% based on the total weight of the polymer layer.

[0036] The substrate 1119 can have a thickness Ts of between about 10 microns to about 1500 microns, such as between about 50 microns and about 1000 microns, such as between about 100 microns and about 750 microns, such as between about 150 microns and about 650 microns. In a number of embodiments, the substrate 1119 may have a thickness Ts of between about 200 and 600 microns. It will be further appreciated that the thickness Ts of the substrate 1119 may be any value between any Atorney Docket No.: 22-OE-0223WO01 of the minimum and maximum values noted above. The thickness of the substrate 1119 may be uniform, i.e., a thickness at a first location of the substrate 1119 can be equal to a thickness at a second location therealong. The thickness of the substrate 1119 may be non-uniform, i.e., a thickness at a first location of the substrate 1119 can be different from a thickness at a second location therealong.

[0037] In an embodiment, the polymer layer 1104 can have a thickness TSL of between about 1 micron to about 500 microns, such as between about 10 microns and about 400 microns, such as between about 50 microns and about 350 microns, such as between about 100 microns and about 300 microns. In a number of embodiments, the polymer layer 1104 may have a thickness TSL of between about 50 and 250 microns. It will be further appreciated that the thickness TSL of the polymer layer 1104 may be any value between any of the minimum and maximum values noted above. The thickness of the polymer layer 1104 may be uniform, i.e., a thickness at a first location of the polymer layer 1104 can be equal to a thickness at a second location therealong. The thickness of the polymer layer 1104 may be non-uniform, i.e., a thickness at a first location of the polymer layer 1104 can be different from a thickness at a second location therealong. It can be appreciated that different polymer layers 1104 may have different thicknesses. The polymer layer 1104 may overlie one major surface of the substrate 1119, shown, or overlie both major surfaces. The substrate 1119 may be at least partially encapsulated by the polymer layer 1104. That is, the polymer layer 1104 may cover at least a portion of the substrate 1119. Axial surfaces of the substrate 1119 may be exposed from the polymer layer 1104.

[0038] FIG. 2B includes an illustration of an alternative embodiment of the composite material that may be formed according to first step 12 and second step 14 of the forming process 10 for producing a snap ring in accordance with an embodiment described above. For purposes of illustration, FIG. 2B shows the layer-by-layer configuration of a composite material 1002 after second step 14. According to this particular embodiment, the composite material 1002 may be similar to the composite material 1000 of FIG. 2A, except this composite material 1002 may also include at least one adhesive layer 1121 that may couple the polymer layer 1104 to the substrate 1119 (i.e., the base material provided in the first step 12) and a polymer layer 1104 (i.e., the low friction coating applied in second step 14). Atorney Docket No.: 22-OE-0223WO01

[0039] The adhesive layer 1121 may include any known adhesive material common to the snap ring arts including, but not limited to, fluoropolymers, epoxy resins, polyimide resins, polyether / polyamide copolymers, ethylene vinyl acetates, ethylene tetrafluoroethylene (ETFE), ETFE copolymer, perfluoroalkoxy (PF A), or any combination thereof. Additionally, the adhesive can include at least one functional group selected from -C=O, -C-O-R, -COH, -COOH, -COOR, -CF2=CF-OR, or any combination thereof, where R is a cyclic or linear organic group containing between 1 and 20 carbon atoms. Additionally, the adhesive can include a copolymer. In an embodiment, the hot melt adhesive can have a melting temperature of not greater than 250°C, such as not greater than 220°C. In another embodiment, the adhesive may break down above 200°C, such as above 220°C. In further embodiments, the melting temperature of the hot melt adhesive can be higher than 250°C or even higher than 300°C. The adhesive layer 1121 can have a thickness of about 1 to 50 microns, such as about 10 to 30 microns. In an embodiment, the hot melt adhesive can have a melting temperature of not greater than 250°C, such as not greater than 220°C. In another embodiment, the adhesive may break down above 200°C, such as above 220°C. In further embodiments, the melting temperature of the hot melt adhesive can be higher than 250°C or even higher than 300°C.

[0040] The adhesive layer 1121 can have a thickness TAL of between about 1 micron to about 80 microns, such as between about 5 microns and about 50 microns, such as between about 15 microns and about 40 microns. In a number of embodiments, the adhesive layer 1121 may have a thickness TAL of between about 3 and 20 microns. In a number of embodiments, the adhesive layer 1121 may have a thickness TAL of between about 10 and 60 microns. It will be further appreciated that the thickness TAL of the adhesive layer 1121 may be any value between any of the minimum and maximum values noted above. The thickness of the adhesive layer 1121 may be uniform, i.e., a thickness at a first location of the adhesive layer 1121 can be equal to a thickness at a second location therealong. The thickness of the adhesive layer 1121 may be non-uniform, i.e., a thickness at a first location of the adhesive layer 1121 can be different from a thickness at a second location therealong.

[0041] FIG. 2C includes an illustration of an alternative embodiment of the composite material that may be formed according to first step 12 and second step 14 of the forming process 10 for producing a snap ring in accordance with an embodiment Atorney Docket No.: 22-OE-0223WO01 described above. For purposes of illustration, FIG. 2C shows the layer-by-layer configuration of a composite material 1003 after second step 14. According to this particular embodiment, the composite material 1003 may be similar to the composite material 1002 of FIG. 2B, except this composite material 1003 may also include at least one corrosion protection layer 1704 and 1705, and a dampening coating 1125 that can include an adhesion promoter layer 1127 and an elastomeric layer 1129 that may couple to the substrate 1119 (i.e., the base material provided in the first step 12) and a polymer layer 1104 (i.e., the low friction coating applied in second step 14).

[0042] The substrate 1119 may be coated with corrosion protection layers 1704 and 1705 to prevent corrosion of the composite material 1003 prior to processing. Each of layers 1704 and 1705 can have a thickness of about 1 to 50 microns, such as about 7 to 15 microns. Layers 1704 and 1705 can include a phosphate of zinc, iron, manganese, or any combination thereof, or a nano-ceramic layer. Further, layers 1704 and 1705 can include functional silanes, nano-scaled silane based primers, hydrolyzed silanes, organosilane adhesion promoters, solvent / water based silane primers, chlorinated polyolefins, passivated surfaces, commercially available zinc (mechanical / galvanic) or zinc-nickel coatings, or any combination thereof. Corrosion protection layers 1704 and 1705 can be removed or retained during processing.

[0043] The composite material 1003 may further include a dampening coating 1125. The dampening coating 1125 can have a thickness of about 1 to 500 microns, such as about 50 to 400 microns, and such as about 100 to 300 microns. The dampening coating 1125 can include an adhesion promoter layer 1127 and an elastomeric layer 1129. The adhesion promoter layer 1127 can include a phosphate of zinc, iron, manganese, tin, or any combination thereof, or a nano-ceramic layer. The adhesion promoter layer 1127 can include functional silanes, nano-scaled silane based layers, hydrolyzed silanes, organosilane adhesion promoters, solvent / water based silane primers, chlorinated polyolefins, passivated surfaces, commercially available zinc (mechanical / galvanic) or Zinc-Nickel coatings, or any combination thereof. The elastomeric layer 1129 can be any elastomeric material known in the art including any of the elastomers listed herein. Further, the elastomeric layer 1129 can include rubber, NVR, etc., or any combination thereof. The elastomeric layer 1129 can further include a hardening agent. Atorney Docket No.: 22-OE-0223WO01

[0044] In an embodiment, under step 14 of FIG. 1, any of the layers on the composite material 1000, 1002, 1003, as described above, can each be disposed in a roll and peeled therefrom to join together under pressure, at elevated temperatures (hot or cold pressed or rolled), by an adhesive, or by any combination thereof. Any of the layers of the composite material 1000, as described above, may be laminated together such that they at least partially overlap one another. Any of the layers on the composite material 1000, 1002, 1003, as described above, may be applied together using coating technique, such as, for example, physical or vapor deposition, spraying, plating, powder coating, or through other chemical or electrochemical techniques. In a particular embodiment, the polymer layer 1104 may be applied by a roll-to-roll coating process, including for example, extrusion coating. The polymer layer 1104 may be heated to a molten or semi-molten state and extruded through a slot die onto a major surface of the substrate 1119. In another embodiment, the polymer layer 1104 may be cast or molded.

[0045] In an embodiment, the polymer layer 1104 or any layers can be glued to the substrate 1119 using the melt adhesive layer 1121 to form a laminate. In an embodiment, any of the intervening or outstanding layers on the material or composite material 1000, 1002, 1003, may form the laminate. The laminate may then be cut through use of a stamp, press, punch, water pressure cut, saw, laser cut, or may be machined in a different way to form a snap ring. Cutting the laminate can create cut edges including an exposed portion of the substrate 1119.

[0046] In other embodiments, under step 14 of FIG. 1, any of the layers on the composite material 1000, 1002, 1003, as described above, may be applied by a coating technique, such as, for example, physical or vapor deposition, spraying, plating, powder coating, or through other chemical or electrochemical techniques. In a particular embodiment, the polymer layer 1104 may be applied by a roll-to-roll coating process, including for example, extrusion coating. The polymer layer 1104 may be heated to a molten or semi-molten state and extruded through a slot die onto a major surface of the substrate 1119. In another embodiment, the polymer layer 1104 may be cast or molded.

[0047] Referring now to the third step 16 of the forming process 10 as shown in FIG. 1, according to certain embodiments, forming the composite material 1000, 1002, 1003 into a snap ring may include a cutting operation as described above. In a Atorney Docket No.: 22-OE-0223WO01 number of embodiments, the cutting operation may form a peripheral surface on the snap ring. The cutting operation may define a cutting direction initiated from a first major surface to a second major surface, opposite the first major surface, to form the peripheral surfaces or edges. Alternatively, the cutting operation may define a cutting direction initiated from the second major surface to the first major surface to form the peripheral surfaces or edges.

[0048] After shaping the snap ring, the snap ring may be cleaned to remove any lubricants and oils used in the forming and shaping process. Additionally, cleaning can prepare the exposed surface of the substrate for the application of the coating. Cleaning may include chemical cleaning with solvents and / or mechanical cleaning, such as ultrasonic cleaning.

[0049] Turning now to the snap ring formed according to embodiments described herein, for purposes of illustration, FIG. 3 A includes a top view of a snap ring 100 formed from a blank of material or composite material 1000, 1001, 1002, 1003 as described using the forming process above for producing a snap ring in accordance with embodiments described herein. For purposes of illustration, FIG. 3B shows a side view of a snap ring 100 formed from a blank of material or composite material 1000, 1001, 1002, 1003 as described using the forming process above for producing a snap ring in accordance with embodiments described herein, which can include a snap ring body 102 oriented about a central axis A. The snap ring body 102 may be formed from a blank as described above and include a substrate 1119 (e.g. spring steel) that may be curved into a ring-like (substantially annular) shape about a central axis A, forming an aperture 180. The snap ring body 102 may further include a polymer layer 1104 that conforms to the shape of the annular base 104, as formed as a polymer layer 1104 from the blank of composite material 1000, 1001, 1002, 1003 as described above. The snap ring body 102 may further include an annular base 104. The ends of the annular base 104 may not meet (e.g., it may be formed as a split ring), thereby leaving an axial gap 111 circumferentially between a first circumferential end 102 A and a second circumferential end 102B. In a number of embodiments, at least one of the first circumferential end 102 A or the second circumferential end 102B includes a bulged portion 115A, 115B. In particular embodiments, at least one of the bulged portions 115A, 115B may define a bulged portion aperture 117A, 117B oriented down the central axis. In a number of embodiments, at least one of the Atorney Docket No.: 22-OE-0223WO01 bulged portions 115A, 115B bulges inward in the radial direction. In a number of embodiments, at least one of the bulged portions 115A, 115B bulges outward in the radial direction. In a number of embodiments, at least one of the bulged portions 115A, 115B may be at least partially arcuate. In a number of embodiments, at least one of the bulged portions 115A, 115B may be at least partially rectilinear.

[0050] In a number of embodiments, the snap ring body 102 may include an inner radial edge 103 and an outer radial edge 105. The inner radial edge or outer radial edge may define a peripheral surface of the snap ring 100. The inner radial edge 103 may at least partially define the aperture 180 in the snap ring 100. In some embodiments, the snap ring 100 may further include at least one radial taper 110 disposed along at least one of the inner radial edge 103 or the outer radial edge 105 of the annular base 104.

[0051] In a number of embodiments, as shown in FIG. 3 A, the snap ring 100 may have an overall outer radius ORw. For purposes of embodiments described herein, the outer radius ORw of the snap ring 100 is the distance from the central axis A to the outer radial edge 105. According to certain embodiments, the outer radius ORw of the snap ring 100 may be at least about 1 mm, such as, at least about 10 mm or at least about 20 mm or at least about 30 mm or at least about 40 mm or even at least about 50 mm. According to still other embodiments, the outer radius ORw of the snap ring 100 may be not greater than about 100 mm, such as, not greater than about 50 mm or even not greater than about 25 mm. It will be appreciated that the outer radius ORw of the snap ring 100 may be within a range between any of the minimum and maximum values noted above. It will be further appreciated that the outer radius ORw of the snap ring 100 may be any value between any of the minimum and maximum values noted above. For example, the outer radius ORw of the snap ring 100 may be 7.5 mm.

[0052] In a number of embodiments, as shown in FIG. 3 A, the snap ring 100 may have an overall inner radius IRw. For purposes of embodiments described herein, the inner radius IRw of the snap ring 100 is the distance from the central axis A to the inner radial edge 103. According to certain embodiments, the inner radius IRw of the snap ring 100 may be at least about 1 mm, such as, at least about 10 mm or at least about 20 mm or at least about 30 mm or at least about 40 mm or even at least about 50 mm. According to still other embodiments, the inner radius IRw of the snap ring 100 may be not greater than about 100 mm, such as, not greater than about 50 mm or even Atorney Docket No.: 22-OE-0223WO01 not greater than about 25 mm. It will be appreciated that the inner radius IRw of the snap ring 100 may be within a range between any of the minimum and maximum values noted above. It will be further appreciated that the inner radius IRw of the snap ring 100 may be any value between any of the minimum and maximum values noted above. For example, the inner radius IRw of the snap ring 100 may be 4 mm. The inner radius IRw may coincide with the radius of the aperture 180.

[0053] As shown in FIG. 3 A, the annular base 104 can include a first axial surface 106 and a second axial surface 107 opposite the first axial surface 106 oriented down the central axis A and spaced apart by an axial height. At least one of the first axial surface 106 or second axial surface 107 may form a major surface of the snap ring 100. The first axial surface 106 may have a polymer layer 1104 that conforms to the shape of the annular base 104 with the substrate 1119, as formed from the composite material 1000, 1001, 1002, 1003 as described above. Alternatively, or additionally, the second axial surface 107 may have a polymer layer 1104 that conforms to the shape of the annular base 104, as formed from the composite material 1000, 1001, 1002, 1003 as described above. In other embodiments, the polymer layer 1104 may be laminated onto both surfaces of the annular base 104. The annular base 104 may have a polygonal, oval, circular, semi-circular, or substantially circular cross-section when viewed in a plane perpendicular to the central axis A.

[0054] In a number of embodiments, the snap ring 100 may have a particular axial height or thickness Tw. For purposes of embodiments described herein and as shown in FIG. 3B, the axial height Tw of the snap ring 100 is the distance from the first axial surface 106 to the second axial surface 107. According to certain embodiments, the axial height Tw of the snap ring 100 may be at least about 0.1 mm or at least about 0.2 mm or at least about 0.3 mm or at least about 0.4 mm or even at least about 0.5 mm. According to still other embodiments, the axial height Tw of the snap ring 100 may be not greater than about 10 mm, such as, not greater than about 5 mm or even not greater than about 1 mm. It will be appreciated that the axial height Tw of the snap ring 100 may be within a range between any of the minimum and maximum values noted above. It will be further appreciated that the axial height Tw of the snap ring 100 may be any value between any of the minimum and maximum values noted above. For example, the axial height Tw of the snap ring 100 may be 1.3 mm. Atorney Docket No.: 22-OE-0223WO01

[0055] For purposes of illustration, FIG. 3B includes a top view of a snap ring 100 formed from a blank of material or composite material 1000, 1001, 1002, 1003 as described using the forming process above for producing a snap ring in accordance with embodiments described herein. The reference numerals of FIG. 3 A are incorporated into FIG. 3B and are contemplated to perform in a similar way, have a similar function, or have a similar structure unless otherwise indicated. As shown in FIG. 3B, the ends of the annular base 104 may not meet (e.g., it may be formed as a split ring), thereby leaving an axial gap 111 circumferentially between a first circumferential end 102 A and a second circumferential end 102B. In a number of embodiments, at least one of the first circumferential end 102A or the second circumferential end 102B includes a bulged portion 115A, 115B. In particular embodiments, at least one of the bulged portions 115A, 115B may define a bulged portion aperture 117A, 117B oriented down the central axis. In a number of embodiments, as shown in FIG. 3B, at least one of the bulged portions 115A, 115B bulges inward in the radial direction. As shown in FIG. 3B, in a number of embodiments, at least one of the bulged portions 115A, 115B may be at least partially rectilinear.

[0056] For purposes of illustration, FIG. 3C includes a top view of a snap ring 100 formed from a blank of material or composite material 1000, 1001, 1002, 1003 as described using the forming process above for producing a snap ring in accordance with embodiments described herein. The reference numerals of FIG. 3C are incorporated into FIG. 3B and are contemplated to perform in a similar way, have a similar function, or have a similar structure unless otherwise indicated. As shown in FIG. 3C, the ends of the annular base 104 may not meet (e.g., it may be formed as a split ring), thereby leaving an axial gap 111 circumferentially between a first circumferential end 102 A and a second circumferential end 102B. In a number of embodiments, at least one of the first circumferential end 102A or the second circumferential end 102B includes a bulged portion 115A, 115B. In particular embodiments, at least one of the bulged portions 115A, 115B may define a bulged portion aperture 117A, 117B oriented down the central axis. In a number of embodiments, as shown in FIG. 3C, at least one of the bulged portions 115A, 115B bulges outward in the radial direction. As shown in FIG. 3C, in a number of embodiments, at least one of the bulged portions 115A, 115B may be at least partially Atorney Docket No.: 22-OE-0223WO01 arcuate. As shown in FIG. 3C, in a number of embodiments, at least one of the bulged portions 115A, 115B may be at least partially rectilinear.

[0057] For purposes of illustration, FIG. 3D includes a top view of a snap ring 100 formed from a blank of material or composite material 1000, 1001, 1002, 1003 as described using the forming process above for producing a snap ring in accordance with embodiments described herein. The reference numerals of FIG. 3D are incorporated into FIG. 3B and are contemplated to perform in a similar way, have a similar function, or have a similar structure unless otherwise indicated. As shown in FIG. 3D, the ends of the annular base 104 may not meet (e.g., it may be formed as a split ring), thereby leaving an axial gap 111 circumferentially between a first circumferential end 102 A and a second circumferential end 102B. In a number of embodiments, at least one of the first circumferential end 102A or the second circumferential end 102B includes a bulged portion 115A, 115B. In a number of embodiments, as shown in FIG. 3D, at least one of the bulged portions 115A, 115B bulges inward in the radial direction. As shown in FIG. 3D, in a number of embodiments, at least one of the bulged portions 115A, 115B may be at least partially arcuate. As shown in FIG. 3D, in a number of embodiments, at least one of the bulged portions 115A, 115B may be at least partially rectilinear. In a number of embodiments, the annular base 104 may include a base bulged portion 119. In particular embodiments, the base bulged portion 119 may bulge outward in the radial direction. In particular embodiments, as shown in FIG. 3D, the base bulged portion 119 may bulge inward in the radial direction. As shown in FIG. 3D, in a number of embodiments, the base bulged portion 119 may be at least partially arcuate. As shown in FIG. 3D, in a number of embodiments, the base bulged portion 119 may be at least partially rectilinear.

[0058] For purposes of illustration, FIG. 4 includes a top perspective view of a snap ring within an assembly in accordance with embodiments described herein. It will be appreciated that corresponding components between FIG. 4 (i.e., components having the same reference number) may be described as having any of the characteristics or features described in reference to any of the other figures disclosed herein. In a number of embodiments, the snap ring 100 can be disposed adjacent to, or contacting, an inner component 452 (such as a bearing, shaft, a side member, a tolerance ring, another structural member, or combinations thereof) in an assembly 450. In a number Atorney Docket No.: 22-OE-0223WO01 of embodiments, the inner component 452 may be a shaft or bearing (e.g. ball bearing or roller bearing) for a blender assembly as discussed in more detail below. The assembly 400 may also include an outer component 454 (such as a bearing, housing, a side member, another structural member, or combinations thereof) disposed radially exterior to the inner component 452. In a number of embodiments, the outer component 454 may be a housing for a blender assembly as discussed in more detail below. In operation, the snap ring 400 may be located in an axial gap 416 between two opposing (mating) components 452, 454. In an embodiment, the outer component 454 may be adapted to rotate relative to the inner component 452. The snap ring 400 may act as a spring and deforms to fit the components 452, 454 together with zero clearance therebetween. In another embodiment, the inner component 452 may be adapted to rotate relative to the outer component 454. The snap ring 100 can be disposed adjacent to, or contacting, an inner component 452 in an assembly 450. In a number of embodiments, the snap ring 400 may be installed on the inner component 452 in the assembly 450. The snap ring 400 can be disposed adjacent to, or contacting, an outer component 454 in an assembly 450. In a number of embodiments, the snap ring 400 may be installed on the outer component 454 in the assembly 450. In a number of embodiments, the assembly 450 can include multiple snap rings 400.

[0059] For purposes of illustration, FIG. 5 A includes a side view of a blender assembly in accordance with embodiments described herein. FIG. 5B includes a top unassembled view of a snap ring in a blender assembly in accordance with embodiments described herein. As shown in FIGs. 5A-5B, the blender assembly 550 may include a snap ring 500 between the housing 554 and the bushing / bearing 552 within the blender assembly 550. The blender assembly 550 may further include a plurality of blades 560 operatively connected to the snap ring 500.

[0060] Generally, the method of forming a snap ring 100 may generally include: providing a blank including a substrate 1119, and a polymer layer 1104 coupled to the substrate 1119; forming the blank into a snap ring 100 including a split annular body 102 adapted to contact at least one of an inner component 552 or an outer component 554 within a blender assembly.

[0061] FIG. 6 includes a graph of noise reduction [dB] of blender assemblies according to embodiments herein versus blender assemblies known in the art. Sample Atorney Docket No.: 22-OE-0223WO01

[0062] 1 is an average noise reduction reading of multiple trails for a blender assembly with an inner component (multiple tolerance rings and bearing) and an outer component (housing) with a snap ring fitted between the inner component and the outer component according to embodiments herein. Sample 4 is a noise reduction reading for blender assembly with an inner component (bearing) and an outer component (housing) without a snap ring fitted between the inner component and the outer component according to conventional blender assemblies. As shown in FIG. 6, snap rings according to embodiments herein provide an optimized level of noise reduction [dB] in the blender assembly not seen in conventional blender assemblies.

[0063] Applications for embodiments include, for example, assemblies for mixers, blenders, food preparation components, or other types of applications. According to particular embodiments herein, the snap ring may provide decreased noise / vibration / harshness, reduce wear of the snap ring surface and the mating components and reduce complex componentry and assembly time, thereby increasing lifetime, improving visual appearance, and improving effectiveness and performance of the assembly, the snap ring, and its other components verses conventional blender assemblies.

[0064] Many different aspects and embodiments are possible. Some of those aspects and embodiments are described below. After reading this specification, skilled artisans will appreciate that those aspects and embodiments are only illustrative and do not limit the scope of the present invention. Embodiments may be in accordance with any one or more of the embodiments as listed below.

[0065] Embodiment 1 : A blender assembly comprising: an inner member comprising a bearing oriented down a central axis; an outer member comprising a housing disposed at least partially exterior and concentric to the inner member; and at least one snap ring disposed radially between the inner member and the outer member, the at least one snap ring comprising: a snap ring body comprising a split annular body defining an aperture oriented down the central axis, wherein the snap ring body comprises a substrate and a polymer layer overlying the substrate.

[0066] Embodiment 2: The blender assembly of embodiment 1, wherein the substrate of the snap ring body comprises a metal.

[0067] Embodiment 3 : The blender assembly of embodiment 2, wherein the metal comprises stainless steel, spring steel, or carbon steel. Atorney Docket No.: 22-OE-0223WO01

[0068] Embodiment 4: The blender assembly of any of the preceding embodiments, wherein the polymer layer comprises a polymer.

[0069] Embodiment 5: The blender assembly of embodiment 4, wherein the polymer layer comprises a polyketone, polyaramid, a thermoplastic polyimide, a polyetherimide, a polyphenylene sulfide, a polyethersulfone, a polysulfone, a polyphenylene sulfone, a polyamideimide, ultra high molecular weight polyethylene, a thermoplastic fluoropolymer, a polyamide, a polybenzimidazole, elastomer, or any combination thereof.

[0070] Embodiment 6: The blender assembly of embodiment 4, wherein the polymer layer comprises a fluoropolymer.

[0071] Embodiment 7: The blender assembly of embodiment 6, wherein the polymer layer comprises polytetrafluoroethylene.

[0072] Embodiment 8: The blender assembly of any of the preceding embodiments, wherein the snap ring further comprises an adhesive layer disposed between the substrate and the polymer layer.

[0073] Embodiment 9: The blender assembly of embodiment 8, wherein the adhesive layer comprises at least one of fluoropolymers, epoxy resins, polyimide resins, polyether / polyamide copolymers, ethylene vinyl acetates, ethylene tetrafluoroethylene (ETFE), ETFE copolymer, perfluoroalkoxy (PF A), or any combination thereof.

[0074] Embodiment 10: The blender assembly of any of the preceding embodiments, wherein the polymer layer has a thickness between 50 and 1000 microns.

[0075] Embodiment 11 : The blender assembly of any of the preceding embodiments, wherein the annular body comprises a first major surface and a second major surface with a thickness disposed between along the central axis.

[0076] Embodiment 12: The blender assembly of embodiment 11, wherein the annular body has a thickness within the range of between 0.5 and 1 mm.

[0077] Embodiment 13: The blender assembly of any of the preceding claims, wherein the annular body comprises a first circumferential end and a second circumferential end defining a split in the annular body.

[0078] Embodiment 14: The blender assembly of embodiment 13, wherein at least one of the first circumferential end or the second circumferential end comprises a bulged portion defining a bulged portion aperture oriented down the central axis. Atorney Docket No.: 22-OE-0223WO01

[0079] Embodiment 15: The blender assembly of embodiment 14, wherein the bulged portion bulges inward in the radial direction.

[0080] Embodiment 16: The blender assembly of embodiment 14, wherein the bulged portion is at least partially arcuate.

[0081] Embodiment 17: The blender assembly of any of the preceding embodiments, wherein the annular body has an inner diameter within the range of between 5 and 10 mm.

[0082] Embodiment 18: The blender assembly of any of the preceding embodiments, wherein the annular body has an outer diameter within the range of between 8 and 15 mm.

[0083] Embodiment 19: The blender assembly of any of the preceding embodiments, wherein at least one of the housing or the bearing is operatively connected to a plurality of blades.

[0084] Embodiment 20: The blender assembly of any of the preceding embodiments, wherein the at least one snap ring comprises a plurality of snap rings.

[0085] Note that not all of the features described above are required, that a region of a specific feature may not be required, and that one or more features may be provided in addition to those described. Still further, the order in which features are described is not necessarily the order in which the features are installed.

[0086] Certain features are, for clarity, described herein in the context of separate embodiments, and may also be provided in combination in a single embodiment. Conversely, various features that are, for brevity, described in the context of a single embodiment, may also be provided separately or in any subcombinations.

[0087] Benefits, other advantages, and solutions to problems have been described above with regard to specific embodiments, however, the benefits, advantages, solutions to problems, and any feature(s) that may cause any benefit, advantage, or solution to occur or become more pronounced are not to be construed as a critical, required, or essential feature of any or all the claims.

[0088] The specification and illustrations of the embodiments described herein are intended to provide a general understanding of the structure of the various embodiments. The specification and illustrations are not intended to serve as an exhaustive and comprehensive description of all of the elements and features of assembly and systems that use the structures or methods described herein. Separate Atorney Docket No.: 22-OE-0223WO01 embodiments may also be provided in combination in a single embodiment, and conversely, various features that are, for brevity, described in the context of a single embodiment, may also be provided separately or in any subcombination. Further, reference to values stated in ranges includes each and every value within that range. Many other embodiments may be apparent to skilled artisans only after reading this specification. Other embodiments may be used and derived from the disclosure, such that a structural substitution, logical substitution, or any change may be made without departing from the scope of the disclosure. Accordingly, the disclosure is to be regarded as illustrative rather than restrictive.

Claims

Attorney Docket No.: 22-OE-0223WO01WHAT IS CLAIMED IS:

1. A blender assembly comprising: an inner member comprising a bearing oriented down a central axis; an outer member comprising a housing disposed at least partially exterior and concentric to the inner member; and at least one snap ring disposed radially between the inner member and the outer member, the at least one snap ring comprising: a snap ring body comprising a split annular body defining an aperture oriented down the central axis, wherein the snap ring body comprises a substrate and a polymer layer overlying the substrate.

2. The blender assembly of claim 1, wherein the substrate of the snap ring body comprises a metal.

3. The blender assembly of claim 2, wherein the metal comprises stainless steel, spring steel, or carbon steel.

4. The blender assembly of any of the preceding claims, wherein the polymer layer comprises a polymer.

5. The blender assembly of claim 4, wherein the polymer layer comprises a polyketone, polyaramid, a thermoplastic polyimide, a polyetherimide, a polyphenylene sulfide, a polyethersulfone, a polysulfone, a polyphenylene sulfone, a polyamideimide, ultra high molecular weight polyethylene, a thermoplastic fluoropolymer, a polyamide, a polybenzimidazole, elastomer, or any combination thereof.

6. The blender assembly of claim 4, wherein the polymer layer comprises a fluoropolymer.

7. The blender assembly of claim 6, wherein the polymer layer comprises poly tetrafluoroethyl ene .

8. The blender assembly of any of the preceding claims, wherein the snap ring further comprises an adhesive layer disposed between the substrate and the polymer layer.

9. The blender assembly of claim 8, wherein the adhesive layer comprises at least one of fluoropolymers, epoxy resins, polyimide resins, polyether / polyamide copolymers, ethylene vinyl acetates, ethylene tetrafluoroethylene (ETFE), ETFE copolymer, perfluoroalkoxy (PF A), or any combination thereof.Atorney Docket No.: 22-OE-0223WO0110. The blender assembly of any of the preceding claims, wherein the polymer layer has a thickness between 50 and 1000 microns.

11. The blender assembly of any of the preceding claims, wherein the annular body comprises a first major surface and a second major surface with a thickness disposed between along the central axis.

12. The blender assembly of claim 11, wherein the annular body has a thickness within the range of between 0.5 and 1 mm.

13. The blender assembly of any of the preceding claims, wherein the annular body comprises a first circumferential end and a second circumferential end defining a split in the annular body.

14. The blender assembly of claim 13, wherein at least one of the first circumferential end or the second circumferential end comprises a bulged portion defining a bulged portion aperture oriented down the central axis.

15. The blender assembly of claim 14, wherein the bulged portion bulges inward in the radial direction.

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