Display device and method for manufacturing display device

Abstract

A display device according to an embodiment comprises: a display unit; and an imaging element that is for detecting the line-of-sight, is provided outside the display unit, and is integrated with the display unit.

Description

Display device and method for manufacturing a display device

[0001] This disclosure relates to a display device and a method for manufacturing a display device.

[0002] Image sensors used for detecting gaze (viewpoint), such as those in eye-tracking devices, are typically positioned near the eye (see, for example, Patent Document 1).

[0003] International Publication No. 2017 / 014137

[0004] However, it is difficult to fix the image sensor in a predetermined position near the eye, and depending on the movement of the eyeball, the image sensor may not be able to detect the line of sight, reducing the efficiency of line of sight detection. Furthermore, it is difficult to fix the image sensor accurately in the desired position, making it difficult to achieve positional accuracy for the image sensor.

[0005] Therefore, this disclosure proposes a display device and a method for manufacturing a display device that can improve the efficiency of gaze detection and the positional accuracy of the image sensor.

[0006] The display device according to this embodiment comprises a display unit and an image sensor for eye-tracking detection provided outside the display unit and integrated with the display unit.

[0007] The method for manufacturing the display device according to the embodiment includes providing an image sensor for eye-tracking detection outside the display unit and integrating it with the display unit.

[0008] This is a plan view showing an example configuration of the display device of Embodiment 1 according to the first embodiment. This is a cross-sectional view showing an example configuration of the display device of Embodiment 1 according to the first embodiment. This is a cross-sectional view showing an example configuration of the display device of Embodiment 2 according to the first embodiment. This is a cross-sectional view showing an example configuration of the display device of Embodiment 3 according to the first embodiment. This is a plan view showing an example configuration of the display device of Embodiment 4 according to the first embodiment. This is a plan view showing an example configuration of the display device of Embodiment 5 according to the first embodiment. This is a cross-sectional view showing an example configuration of the display device of Embodiment 5 according to the first embodiment. This is a plan view showing an example configuration of the display device of Embodiment 6 according to the first embodiment. This is a diagram showing an example configuration of the display unit according to the first embodiment. This is a diagram showing an example configuration of the pixel circuit according to the first embodiment. This is a cross-sectional view showing an example configuration of the pixel according to the first embodiment. This is a cross-sectional view showing an example manufacturing process for the display device of Embodiment 1 according to the first embodiment. This is a cross-sectional view showing an example manufacturing process for the display device of Embodiment 2 according to the first embodiment. This is a cross-sectional view showing an example manufacturing process for the display device of Embodiment 5 according to the first embodiment. This is a cross-sectional view showing an example manufacturing process for the display device of Embodiment 6 according to the first embodiment. This is a cross-sectional view showing an example configuration of the display device of Embodiment 1 according to the second embodiment. This is a cross-sectional view showing an example configuration of the display device of Embodiment 2 according to the second embodiment. This is a cross-sectional view showing an example of the configuration of the display device according to Embodiment 3 of the second embodiment. This is a cross-sectional view showing an example of the configuration of the display device according to Embodiment 4 of the second embodiment. This is a cross-sectional view showing an example of the configuration of the display device according to Embodiment 5 of the second embodiment. This is a cross-sectional view showing an example of the configuration of the display device according to Embodiment 6 of the second embodiment. This is a cross-sectional view showing an example of the configuration of the display device according to Embodiment 7 of the second embodiment. This is a cross-sectional view showing an example of the configuration of the display device according to Embodiment 8 of the second embodiment. This is a cross-sectional view showing an example of the configuration of the display device according to Embodiment 9 of the second embodiment. This is a diagram showing an example of the manufacturing process of the display device according to Embodiment 1 of the second embodiment. This is a diagram showing an example of the manufacturing process of the display device according to Embodiment 1 of the second embodiment. This is a diagram showing an example of the manufacturing process of the display device according to Embodiment 2 of the second embodiment. This is a diagram showing an example of the manufacturing process of the display device according to Embodiment 5 of the second embodiment. This is a front view showing an example of the appearance of a digital still camera.This is a rear view showing an example of the external appearance of a digital still camera. This is a diagram showing an example of the external appearance of a head-mounted display. This is a diagram showing an example of the external appearance of a see-through head-mounted display. This is a diagram showing an example of the external appearance of a television system. This is a diagram showing an example of the external appearance of a smartphone. This is a diagram showing an example of the internal configuration of an automobile. This is a diagram showing an example of the internal configuration of an automobile.

[0009] Embodiments of this disclosure will be described in detail below with reference to the drawings. Embodiments include examples and modifications. However, the technology relating to this disclosure is not limited by the embodiments. In addition, redundant descriptions are omitted by denoting the same reference numerals for essentially the same parts in the embodiments.

[0010] This disclosure will be described in the following order of items: 1. First Embodiment 1-1. Example of Display Device Configuration 1-2. Example of Display Unit Configuration 1-3. Example of Display Device Manufacturing Process 2. Second Embodiment 2-1. Example of Display Device Configuration 2-2. Example of Display Device Manufacturing Process 3. Operation and Effects 4. Other Embodiments 5. Application Examples 6. Notes

[0011] <1. First Embodiment> <1-1. Example of Display Device Configuration> Example of the configuration of the display device 1 in each of the 1 to 6 embodiments of the first embodiment will be described with reference to Figures 1 to 9.

[0012] (Example 1) Figure 1 is a plan view showing an example configuration of the display device 1 according to Example 1 of the first embodiment. Figure 2 is a cross-sectional view showing an example configuration of the display device 1 according to Example 1 of the first embodiment. The cross-sectional view of Figure 2 is a cross-sectional view taken along the line A1-A1 in Figure 1.

[0013] As shown in Figures 1 and 2, the display device 1 of Embodiment 1 comprises a display unit 10, an imaging unit 20, and a mounting substrate 30. The display unit 10 and the imaging unit 20 are integrated by the mounting substrate 30, and the display device 1 is an example of a display module.

[0014] The display unit 10 comprises a first substrate 11 and a first light-transmitting substrate 12. This display unit 10 may also be called, for example, a display panel. The display unit 10 is, for example, an OLED (organic light-emitting diode) microdisplay.

[0015] The first substrate 11 has a plurality of pads 11a. These pads 11a are arranged in a row at the edge of the upper surface of the first substrate 11. Each pad 11a is electrically connected to the mounting substrate 30 by a wire 11b. The plurality of wires 11b are covered and sealed with a sealing material 11c such as resin. For example, the first substrate 11 incorporates elements and wiring for displaying an image. The first substrate 11 is made of, for example, a semiconductor substrate. Each wire 11b is made of, for example, a metal such as Au, Al, Ag, or Cu. The wire 11b is an example of a conductive member.

[0016] The first translucent substrate 12 is fixed to the upper surface of the first substrate 11, avoiding each pad 11a. For example, the first translucent substrate 12 functions as a protective member for the first substrate 11. The first translucent substrate 12 is made of, for example, glass or a resin substrate.

[0017] The imaging unit 20 is positioned around the display unit 10 and fixed to the upper surface of the mounting substrate 30. For example, the imaging unit 20 is positioned next to the display unit 10 and provided at the edge of the upper surface of the mounting substrate 30. More specifically, the imaging unit 20 is positioned next to the end of the display unit 10 opposite to the pad 11a side and provided at the end of the upper surface of the mounting substrate 30 opposite to the sealing material 11c side.

[0018] As shown in Figure 2, the imaging unit 20 includes a second substrate 21, an image sensor 22 for line-of-sight detection, a rib portion 23, and a second translucent substrate 24. The imaging unit 20 is, for example, a CMOS (Complementary Metal Oxide Semiconductor) image sensor. This imaging unit 20 is packaged, for example. As an example, the imaging unit 20 is a WLCSP (Wafer Level Chip Size Package).

[0019] The second substrate 21 is a substrate that supports the image sensor 22. This second substrate 21 incorporates a wiring layer 21a, for example, which includes wiring. The second substrate 21 is fixed to the upper surface of the mounting substrate 30 by solder 21b, for example, and is electrically connected to the mounting substrate 30. The second substrate 21 is made of, for example, an organic substrate or a ceramic substrate. Solder 21b is an example of a conductive material.

[0020] The image sensor 22 is fixedly mounted on the upper surface of the second substrate 21. The image sensor 22 on the second substrate 21 is electrically connected to the second substrate 21 by a plurality of wires 22a. In this way, the image sensor 22 on the second substrate 21 is electrically connected to the mounting substrate 30 via each wire 22a, the wiring layer 21a of the second substrate 21, and solder 21b. Each wire 22a is made of a metal such as Au, Al, Ag, or Cu. The wires 22a are an example of conductive materials.

[0021] The rib portion 23 is fixed to the upper surface of the second substrate 21 so as to surround the image sensor 22 on the second substrate 21. For example, the rib portion 23 is formed in an annular shape in plan view. The rib portion 23 functions as a side wall member formed around the installation area of ​​the image sensor 22, for example, according to a predetermined size. The rib portion 23 is made of resin, for example. The rib portion 23 may also be referred to as a dam portion, for example.

[0022] The second translucent substrate 24 is positioned above the image sensor 22 on the second substrate 21 so as to cover the image sensor 22, and is provided on the upper surface of the rib portion 23. For example, the second translucent substrate 24 is fixed to the upper surface of the rib portion 23 by adhesive 24a. The second translucent substrate 24 is made of, for example, glass or a resin substrate. The image sensor 22 on the second substrate 21 is hermetically sealed by, for example, the second translucent substrate 24 and the rib portion 23.

[0023] The mounting substrate 30 supports the display unit 10 and the imaging unit 20. The display unit 10 and the imaging unit 20 are fixedly mounted on the upper surface of the mounting substrate 30. The mounting substrate 30 incorporates a wiring layer 31, which includes, for example, wiring. The wiring includes, for example, conductors, circuits, and elements. A connector 32 is provided on the lower surface of the mounting substrate 30. The mounting substrate 30 is made of, for example, an organic substrate or a ceramic substrate.

[0024] In this configuration, the display device 1 displays various images using the display unit 10. The display device 1 also detects light, such as gaze (viewpoint), using the imaging unit 20, which functions as a detection unit. In other words, the display device 1 realizes both image display and gaze detection (e.g., eye tracking) in a single device. The image displayed by the display device 1 (e.g., visible light) is seen by the eyes (eyeballs) of a person or other person. The light reflected by the eyes (e.g., infrared light) is detected by the imaging unit 20. From the detection result, the gaze (e.g., eye movement) is detected. The light source emitting infrared light may be provided either outside or inside the display device 1.

[0025] In Embodiment 1, the display unit 10 and the imaging unit 20 are integrated. As a result, the image sensor 22 is positioned at a desired location relative to the display unit 10 (for example, a desired location based on the design), and the line of sight to the display unit 10 is reliably detected, thereby improving the line of sight detection efficiency. Furthermore, since the image sensor 22 is precisely fixed at the aforementioned desired location, the positional accuracy of the image sensor 22 can be improved.

[0026] In Embodiment 1, the imaging unit 20 is positioned in the display unit 10 so as to contact the end opposite to each pad 11a. However, the installation position of the imaging unit 20 is not limited. For example, the imaging unit 20 may be positioned in the display unit 10 so as not to contact the end opposite to each pad 11a.

[0027] (Example 2) Figure 3 is a cross-sectional view showing an example of the configuration of the display device 1 in Example 2 according to the first embodiment. The difference between Example 2 and Example 1 (see Figure 2) is the configuration of the imaging unit 20.

[0028] As shown in FIG. 3, in the display device 1 of the second embodiment, the imaging element 22 is provided directly on the upper surface of the mounting substrate 30, and the rib portion 23 is provided on the upper surface of the mounting substrate 30 so as to surround the periphery of the imaging element 22 on the mounting substrate 30. Further, the second light-transmissive substrate 24 is provided directly on the rib portion 23.

[0029] In the second embodiment, since the imaging element 22 is provided directly on the upper surface of the mounting substrate 30, the second substrate 21 (see FIG. 2) according to the first embodiment does not exist. Further, in the second embodiment, since the second light-transmissive substrate 24 is provided directly on the rib portion 23 and fixed by the rib portion 23, the adhesive 24a (see FIG. 2) according to the first embodiment also does not exist.

[0030] According to the second embodiment, the imaging element 22 and the rib portion 23 are provided directly on the upper surface of the mounting substrate 30. Thereby, the degree of design freedom can be improved.

[0031] In the second embodiment as well, the same effects as those of the first embodiment (for example, improving the line-of-sight detection efficiency and the positional accuracy of the imaging element 22) can be obtained. This is the same in the following third to sixth embodiments, and in each of the third to sixth embodiments, the same effects as those of the first embodiment can be obtained.

[0032] (Embodiment 3) FIG. 4 is a cross-sectional view showing a configuration example of the display device 1 of Embodiment 3 according to the first embodiment. The difference between Embodiment 3 and Embodiment 2 (see FIG. ۳) is the type of the mounting substrate 30A.

[0033] As shown in FIG. 4, in the display device 1 of Embodiment 3, the mounting substrate 30A is constituted by a flexible printed circuit (FPC), rather than an organic substrate or a ceramic substrate.

[0034] According to Embodiment 3, the mounting substrate 30A is constituted by a flexible substrate. Thereby, the degree of design freedom can be improved.

[0035] (Embodiment 4) FIG. 5 is a plan view showing a configuration example of the display device 1 of Embodiment 4 according to the first embodiment. The difference between Embodiment 4 and Embodiment 1 (see FIG. 1) is that the light source 40 is provided.

[0036] As shown in Figure 5, the display device 1 of Embodiment 4 includes a light source 40. The light source 40 incorporates a light-emitting element 41. The light-emitting element 41 emits, for example, infrared light. The light source 40 is positioned around the display unit 10 and fixed to the upper surface of the mounting substrate 30. For example, the light source 40 is positioned next to the display unit 10 and provided at the edge of the upper surface of the mounting substrate 30. More specifically, the light source 40 is positioned at the end of the display unit 10 opposite to each pad 11a and next to the imaging unit 20, and is provided at the end of the upper surface of the mounting substrate 30 opposite to the sealing material 11c.

[0037] The structure of the light source 40 may be the same as that of the imaging unit 20 according to Examples 1 to 3 (see Figures 2 to 4). In other words, the structure of the light source 40 may be the same as that of the imaging sensor 22 in Figure 2, Figure 3, or Figure 4, but with the light-emitting element 41 replaced.

[0038] In Embodiment 4, the light source 40 is integrated with the display unit 10 and the imaging unit 20. This ensures that the line of sight to the display unit 10 is reliably detected, thereby reliably improving the line of sight detection efficiency.

[0039] Although the light source 40 (for example, the light-emitting element 41) is provided outside the display unit 10, it may also be provided inside the display unit 10. For example, the light source 40 may be formed on the first substrate 11 as part of the display unit 10.

[0040] (Example 5) Figure 6 is a plan view showing an example configuration of the display device 1 of Example 5 according to the first embodiment. Figure 7 is a cross-sectional view showing an example configuration of the display device 1 of Example 5 according to the first embodiment. The cross-sectional view of Figure 7 is a cross-sectional view taken along line A2-A2 in Figure 6. The difference between Example 5 and Example 1 (see Figure 2) is the installation position of the image sensor 22.

[0041] As shown in Figures 6 and 7, in the display device 1 of Embodiment 5, the image sensor 22 is provided on the upper surface of each pad 11a. For example, the image sensor 22 is provided in a region that includes the upper surfaces of some of the pads 11a (a portion of the upper surface of the first substrate 11). This image sensor 22 is electrically connected to each pad 11a by each wire 22a. Each wire 22a of the image sensor 22 is sealed with a sealing material 11c, similar to the wires 11b of the first substrate 11.

[0042] In Example 5, since the image sensor 22 is directly provided on the upper surface of the first substrate 11, the second substrate 21 (see Figure 2) according to Example 1 does not exist. Also, in Example 5, the rib portion 23, adhesive 24a, and second translucent substrate 24 (see Figure 2) according to Example 1 do not exist.

[0043] According to Embodiment 5, the image sensor 22 is provided on the display unit 10. This makes it possible to reduce the size of the mounting substrate 30 in the X-axis direction, thereby enabling miniaturization of the display device 1.

[0044] In the above-described embodiment 5, the upper surface of the image sensor 22 is not covered by the sealing material 11c. However, if the sealing material 11c is a light-transmitting material (for example, a transparent material), the upper surface of the image sensor 22 may be covered by the sealing material 11c.

[0045] (Example 6) Figure 8 is a plan view showing an example configuration of the display device 1 of Example 6 according to the first embodiment. Figure 9 is a cross-sectional view showing an example configuration of the display device 1 of Example 6 according to the first embodiment. The cross-sectional view of Figure 9 is a cross-sectional view taken along line A3-A3 in Figure 8. The difference between Example 6 and Example 1 (see Figure 2) is the installation position of the image sensor 22.

[0046] As shown in Figures 8 and 9, in the display device 1 of Embodiment 6, the image sensor 22 is provided on the upper surface of the first substrate 11, avoiding each pad 11a. For example, the image sensor 22 is positioned inside the first substrate 11 from each pad 11a and is provided next to each pad 11a. This image sensor 22 is electrically connected to the mounting substrate 30 by each wire 22a. Each wire 22a of the image sensor 22 is sealed with a sealing material 11c, similar to each wire 11b of the first substrate 11.

[0047] According to Example 6, similar to Example 5, the image sensor 22 is provided on the display unit 10. This makes it possible to reduce the size of the mounting substrate 30 in the X-axis direction, thereby enabling miniaturization of the display device 1.

[0048] <1-2. Example of Display Unit Configuration> An example of the configuration of the display unit 10 according to the first embodiment will be described with reference to Figures 10 to 12.

[0049] (Display Unit) Figure 10 shows an example of the configuration of the display unit 10 according to the first embodiment.

[0050] As shown in Figure 10, the display unit 10 comprises a pixel array unit 151, a horizontal drive circuit 152, and a vertical drive circuit 153. These pixel array unit 151, horizontal drive circuit 152, and vertical drive circuit 153 are provided, for example, on the aforementioned first substrate 11 (see Figure 2, etc.).

[0051] The pixel array section 151 has a plurality of pixels 100. Each of the pixels 100 functions as a light-emitting element. The pixel array section 151 is, for example, a panel capable of displaying color. In the example in Figure 10, the pixels 100 that emit red light are denoted by the code R, the pixels 100 that emit green light are denoted by the code G, and the pixels 100 that emit blue light are denoted by the code B.

[0052] The pixel array section 151 further includes multiple scan lines (SCLs) and multiple signal lines (DTLs). Each scan line (SCL) extends in the row direction (X-axis direction in Figure 10) and is a line for scanning each pixel 100. Each signal line (DTL) extends in the column direction (Y-axis direction in Figure 10) and is a line for supplying voltage to each pixel 100.

[0053] The pixels 100 are arranged in a two-dimensional matrix, for example, M pixels in the row direction and N pixels in the column direction, for a total of M × N pixels. These pixels 100 are connected to each scan line SCL and each signal line DTL. A single pixel 100 may function as a single pixel, or a single pixel 100 may function as a sub-pixel, and a predetermined number (e.g., three, four, etc.) of sub-pixels may function as a single pixel.

[0054] The horizontal drive circuit 152 and the vertical drive circuit 153 are circuits for driving each of the pixels 100. In the example shown in Figure 10, the horizontal drive circuit 152 and the vertical drive circuit 153 are located at the edge of the display unit 10, but their arrangement is not particularly limited.

[0055] The horizontal drive circuit 152 sequentially supplies scan signals to each scan line SCL in order to scan each pixel 100 row by row when writing a signal to each pixel 100. The horizontal drive circuit 152 is composed of, for example, a shift register that sequentially shifts (transfers) start pulses in synchronization with the input clock pulse.

[0056] The vertical drive circuit 153 supplies a signal voltage (for example, a signal voltage corresponding to brightness information) supplied from a signal source (not shown) to each pixel 100 selected in a column-by-column unit via the signal line DTL.

[0057] Such a display unit 10 can be used in various displays such as televisions, personal computers, VR (Virtual Reality), MR (Mixed Reality), and AR (Augmented Reality), as well as in EVFs (Electronic View Finders) and small projectors.

[0058] It should be noted that the configuration of the display unit 10 is not limited to the configuration shown in Figure 10. In other words, the configuration shown in Figure 10 is merely an example, and the display unit 10 according to the first embodiment can take various configurations.

[0059] For example, it is possible to apply various color arrays (color arrays) of pixels 100 of different colors to the display unit 10. As color arrays (color patterns), various patterns can be used, such as RGB stripe arrays, RGB delta arrays or square arrays, Bayer arrays (e.g., RGBG, GRGB, RGBB, etc.), and RGB mosaic arrays. In addition to RGB primary colors, various complementary colors can also be used.

[0060] (Example of Pixel Circuit Configuration) Figure 11 is a diagram showing an example of the circuit configuration of a pixel 100 according to the first embodiment. In the example in Figure 11, the wiring relationship for one pixel 100 is shown.

[0061] As shown in Figure 11, the pixel 100 includes a light-emitting unit 101 and a drive circuit 102. The drive circuit 102 is a circuit that controls the light emission of the light-emitting unit 101. The drive circuit 102 includes, for example, a writing transistor TR Ｗ or drive transistor TR Ｄ , capacity C Ｓ It has, among other things, a writing transistor TR. Ｗ and drive transistor TR Ｄ For example, a p-channel field-effect transistor is one such example.

[0062] The light-emitting section 101 is composed of, for example, an organic electroluminescent light-emitting element (organic EL element) such as an OLED (organic light-emitting diode). The light-emitting section 101 is, for example, a current-driven light-emitting section in which the luminescence changes according to the current value.

[0063] One end of the light-emitting part 101 (for example, the anode electrode) is connected to the drive transistor TR Ｄ It is electrically connected to the power supply line PS1 via [a certain method]. The other end of the light-emitting part 101 (for example, the cathode electrode) is electrically connected to the common power supply line PS2. In the example in Figure 11, the capacitance of the light-emitting part 101 is indicated by the symbol C. ＥＬ It is represented as follows.

[0064] The power supply line PS1 is a line connected to one pixel 100. The common power supply line PS2 is a line commonly connected to all the pixels 100. These power supply line PS1 and common power supply line PS2 are provided in the pixel array section 151. A predetermined drive voltage V ｃｃ is supplied to the power supply line PS1, and a common voltage V Ｃat (for example, ground potential) is supplied to the common power supply line PS2.

[0065] One source / drain region of the driving transistor TR Ｄ is electrically connected to one end of the capacitor C Ｓ and the power supply line PS1, and the other source / drain region is electrically connected to one end (for example, the anode electrode) of the light emitting section 101. The gate electrode of the driving transistor TR Ｄ is electrically connected to one source / drain region of the writing transistor TR Ｗ and the other end of the capacitor C Ｓ . Also, the other source / drain region of the writing transistor TR Ｗ is electrically connected to the signal line DTL, and the gate electrode of the writing transistor TR Ｗ is electrically connected to the scanning line SCL.

[0066] In such a pixel 100, with a voltage corresponding to the luminance of the image to be displayed supplied from the vertical drive circuit 153 to the signal line DTL, when the writing transistor TR Ｗ is turned on by the scanning signal from the horizontal drive circuit 152, a voltage corresponding to the luminance is written into the capacitor C Ｓ . After the writing transistor TR Ｗ is turned off, a current flows through the driving transistor TR Ｓ according to the voltage held in the capacitor C Ｄ , causing the light emitting section 101 to emit light.

[0067] (Configuration example of pixel) FIG. 12 is a cross-sectional view showing a configuration example of the pixel 100 according to the first embodiment.

[0068] As shown in Figure 12, the pixel 100 includes a substrate 110, an emissive layer (light-emitting element layer) 120, a color filter layer 130, and a lens layer 140. The substrate 110, emissive layer 120, color filter layer 130, and lens layer 140 are stacked in the order described. This stack is included in the aforementioned first substrate 11 (see Figure 2, etc.). Note that the lens layer 140 may be omitted.

[0069] The substrate 110 is formed on a semiconductor substrate, such as a silicon substrate. This substrate 110 supports the light-emitting layer 120, etc. The material of the substrate 110 is, for example, SiO ２ The substrate may be an insulating material such as SiN or SiON. Furthermore, a circuit element (e.g., a transistor, wiring, etc.) for driving the light-emitting layer 120 is provided on the surface of the substrate 110 opposite to the light-emitting layer 120. This circuit element is electrically connected to the light-emitting layer 120, for example, via a contact plug.

[0070] The light-emitting layer 120 is provided on the substrate 110. The light-emitting layer 120 is, for example, an organic EL element, but it may also be an LED (Light Emitting Diode) element or the like. The light-emitting layer 120 corresponds to the light-emitting section 101 described above.

[0071] This light-emitting layer 120 includes an electrode layer 121, an organic layer 122, an electrode layer 123, a protective layer 124, and a planarization layer 125. The electrode layer 121, organic layer 122, electrode layer 123, protective layer 124, and planarization layer 125 are laminated in the order described.

[0072] The electrode layer 121 is provided on the substrate 110. This electrode layer 121 has an electrode 121a for each pixel 100. An insulating layer 121b is provided between the respective edges of each electrode 121a and the organic layer 122. The insulating layer 121b functions as an electrode edge film. As a result, each adjacent electrode 121a is electrically isolated. Furthermore, the portion of the electrode 121a covered by the insulating layer 121b is electrically isolated from the organic layer 122, and the light emission of the organic layer 122 corresponding to this portion is suppressed.

[0073] The organic layer 122 is provided on the electrode layer 121. For example, the organic layer 122 may be configured to emit light of a different color for each pixel 100 (e.g., red light, green light, blue light, etc.), or to emit light of the same color for all pixels 100 (e.g., white light). Alternatively, the organic layer 122 may have a laminated structure in which multiple layers emitting light of each color are stacked.

[0074] The electrode layer 123 is provided on the organic layer 122. The electrode layer 123 is provided in common across each pixel 100. In the example in Figure 12, it is provided in common across the red pixel 100, the green pixel 100, and the blue pixel 100. The electrode layer 123 is formed of, for example, a material that is light-transmitting and conductive (for example, a conductive transparent material).

[0075] The protective layer 124 is provided on the electrode layer 123. The protective layer 124 is formed of, for example, a light-transmitting material (e.g., a transparent material). The material of the protective layer 124 is, for example, SiN, SiON, Al ２ O3, TiO ２ And so on.

[0076] The planarization layer 125 is provided on the protective layer 124, that is, between the protective layer 124 and the color filter layer 130. The material of the planarization layer 125 is, for example, a base material made of acrylic resin with TiO ２ A base material consisting of a material to which TiO has been added, and the same material as the color filter layer 130 (excluding pigments). ２ These are materials to which certain substances have been added.

[0077] The color filter layer 130 is provided on the planarization layer 125, i.e., the light-emitting layer 120. The color filter layer 130 includes one of the color filters 130R, 130G, or 130B for each pixel 100. The red color filter 130R allows red light from the light-emitting layer 120 to pass through. The green color filter 130G allows green light from the light-emitting layer 120 to pass through. The blue color filter 130B allows blue light from the light-emitting layer 120 to pass through. The material of the color filter layer 130 is various materials, such as color resist material.

[0078] The lens layer 140 is provided on the color filter layer 130. The lens layer 140 includes a plurality of lenses 141 and a protective layer 142. Each lens 141 is provided on the color filter layer 130 for every pixel 100. For example, each lens 141 is arranged in an array in the planar direction of the lens layer 140. The lenses 141 are, for example, microlenses. The protective layer 142 is provided on each lens 141. The protective layer 142 is formed of, for example, a light-transmitting material (for example, a transparent material).

[0079] It should be noted that the configuration of the pixel 100 is not limited to the configuration shown in Figure 11 or Figure 12. In other words, the configuration shown in Figure 11 or Figure 12 is merely an example, and the pixel 100 according to the first embodiment can take various configurations.

[0080] <1-3. Example of Manufacturing Process for Display Device> An example of the manufacturing process for the display device 1 according to the first embodiment will be described with reference to Figures 13 to 16.

[0081] (Example of manufacturing process for the display device of Example 1) Figure 13 is a cross-sectional view showing an example of the manufacturing process for the display device 1 (see Figure 2) of Example 1 according to the first embodiment.

[0082] As shown in Figure 13, in step S11, a mounting substrate 30 having an imaging unit 20 and a connector 32, and a display unit 10 are prepared. The imaging unit 20 and the connector 32 are fixedly mounted on the mounting substrate 30.

[0083] In step S12, the display unit 10 is attached to the prepared mounting substrate 30 by die bonding. For example, the display unit 10 is positioned next to the imaging unit 20 and is provided on the upper surface of the mounting substrate 30 (the surface on which the imaging unit 20 is provided).

[0084] In step S13, the display unit 10 on the mounting board 30 is electrically connected to the mounting board 30 by wire bonding. For example, each pad 11a of the display unit 10 on the mounting board 30 is electrically connected to the mounting board 30 by each wire 11b.

[0085] In step S14, each wire 11b connecting each pad 11a of the display unit 10 to the mounting substrate 30 is covered and sealed with the sealing material 11c. This completes the display device 1 of Embodiment 1.

[0086] (Example of manufacturing process for the display device of Example 2) Figure 14 is a cross-sectional view showing an example of the manufacturing process for the display device 1 of Example 2 (see Figure 3) according to the first embodiment.

[0087] As shown in Figure 14, in step S21, the image sensor 22, the mounting substrate 30 having the connector 32, and the display unit 10 are prepared.

[0088] In step S22, the image sensor 22 and the display unit 10 are attached to the prepared mounting substrate 30 by die bonding. For example, the image sensor 22 is positioned at the edge of the mounting substrate 30 and provided on the upper surface of the mounting substrate 30, and the display unit 10 is positioned next to the image sensor 22 and provided on the upper surface of the mounting substrate 30.

[0089] In step S23, the display unit 10 on the mounting board 30 is electrically connected to the mounting board 30 by wire bonding. For example, each pad 11a of the display unit 10 on the mounting board 30 is electrically connected to the mounting board 30 by each wire 11b.

[0090] In step S24, a rib portion 23 is formed around the image sensor 22 on the mounting substrate 30, and each wire 11b connecting each pad 11a of the display unit 10 to the mounting substrate 30 is sealed with a sealing material 11c. The formation of the rib portion 23 and the sealing of each wire 22a are performed in the same process.

[0091] In step S25, a second translucent substrate 24 is provided on the rib portion 23 on the mounting substrate 30. The second translucent substrate 24 is fixed to the rib portion 23 on the mounting substrate 30 by a sealing material 11c. This completes the display device 1 of Embodiment 2.

[0092] Furthermore, the manufacturing process of the display device 1 in Example 2 can also be applied to the manufacturing process of the display device 1 in Example 3 (see Figure 4).

[0093] (Example of manufacturing process for the display device of Example 5) Figure 15 is a cross-sectional view showing an example of the manufacturing process for the display device 1 (see Figure 7) of Example 5 according to the first embodiment.

[0094] As shown in Figure 15, in step S31, a mounting board 30 having a connector 32, a display unit 10, and an image sensor 22 are prepared.

[0095] In step S32, the display unit 10 is attached to the prepared mounting substrate 30 by die bonding, and the image sensor 22 is attached to the display unit 10 on the mounting substrate 30 by die bonding. For example, the image sensor 22 is attached to the edge of the upper surface of the first substrate 11 (the upper surface of the plurality of pads 11a).

[0096] In step S33, the image sensor 22 on the display unit 10 is electrically connected to the display unit 10 by wire bonding, and the display unit 10 on the mounting substrate 30 is electrically connected to the mounting substrate 30 by wire bonding. For example, the image sensor 22 on the display unit 10 is electrically connected to each pad 11a of the display unit 10 on the mounting substrate 30 by each wire 22a, and each pad 11a of the display unit 10 on the mounting substrate 30 is electrically connected to the mounting substrate 30 by each wire 11b.

[0097] In step S34, each wire 22a on the display unit 10 and each wire 11b on the mounting substrate 30 are sealed with the sealing material 11c. This completes the display device 1 of Embodiment 5.

[0098] (Example of manufacturing process for the display device of Example 6) Figure 16 is a cross-sectional view showing an example of the manufacturing process for the display device 1 (see Figure 9) of Example 6 according to the first embodiment.

[0099] As shown in Figure 16, in step S41, a mounting board 30 having a connector 32, a display unit 10, and an image sensor 22 are prepared.

[0100] In step S42, the display unit 10 is attached to the prepared mounting substrate 30 by die bonding, and the image sensor 22 is attached to the display unit 10 on the mounting substrate 30 by die bonding. For example, the image sensor 22 is positioned next to each pad 11a of the first substrate 11 and is provided on the upper surface of the first substrate 11.

[0101] In step S43, the image sensor 22 on the display unit 10 and the display unit 10 on the mounting substrate 30 are electrically connected to the mounting substrate 30 by wire bonding. For example, the image sensor 22 on the display unit 10 is electrically connected to the mounting substrate 30 by each wire 22a, and each pad 11a of the display unit 10 on the mounting substrate 30 is electrically connected to the mounting substrate 30 by each wire 11b.

[0102] In step S44, each wire 22a on the display unit 10 and each wire 11b on the mounting substrate 30 are sealed with the sealing material 11c. This completes the display device 1 of Embodiment 6.

[0103] <2. Second Embodiment> <2-1. Example of Display Device Configuration> Example of the configuration of the display device 1 of each embodiment 1 to 9 according to the second embodiment will be described with reference to Figures 17 to 25. The difference between the second embodiment and the first embodiment (see Figure 2, etc.) is that the first translucent substrate 12 and the second translucent substrate 24 according to the first embodiment are integrated.

[0104] (Example 1) Figure 17 is a cross-sectional view showing an example of the configuration of the display device 1 according to Example 1 of the second embodiment.

[0105] As shown in Figure 17, in the display device 1 of Embodiment 1, a portion of the first translucent substrate 12 functions as the aforementioned second translucent substrate 24 (see Figure 2, etc.). In other words, the end of the first translucent substrate 12 opposite to the sealing material 11c side protrudes from the first substrate 11. This protruding portion 12A covers the image sensor 22 and functions as the aforementioned second translucent substrate 24.

[0106] In other words, the first translucent substrate 12 and the second translucent substrate 24 in the first embodiment are not separate but are integrated. The first translucent substrate 12 and the second translucent substrate 24 are made of, for example, a single glass substrate.

[0107] In Embodiment 1, the first translucent substrate 12 is provided in common to both the first substrate 11 and the imaging unit 20. This makes it possible to provide the first translucent substrate 12 to both the first substrate 11 and the imaging unit 20 simultaneously, reducing the number of assembly steps and materials compared to the case where the first translucent substrate 12 and the second translucent substrate 24 are provided separately, as in the first embodiment. Furthermore, compared to the case where the first translucent substrate 12 and the second translucent substrate 24 are provided separately, as in the first embodiment, the parallelism between the imaging unit 20 and the display unit 10 can be stabilized, and the refractive index of light can be stabilized, thereby achieving stable gaze detection.

[0108] Furthermore, in the manufacturing process of the display device 1, even after the imaging unit 20 is attached to the mounting substrate 30 by solder 21b, the image sensor 22 is not covered by the first light-transmitting substrate 12, so the image sensor 22 can be inspected. This makes it possible to detect abnormalities in the image sensor 22 caused by heat during soldering, and the reliability (e.g., heat resistance) of the image sensor 22 can be maintained. On the other hand, if the imaging unit 20 in a package state (see Figure 2) is attached to the mounting substrate 30 by solder 21b, the image sensor 22 is hermetically sealed, so the image sensor 22 cannot be inspected.

[0109] Furthermore, the same effects as in the first embodiment can be obtained in Example 1 (for example, by improving the gaze detection efficiency and the positional accuracy of the image sensor 22). The same applies to each of the following Examples 2 to 9, and the same effects as in the first embodiment can be obtained in each of Examples 2 to 9.

[0110] (Example 2) Figure 18 is a cross-sectional view showing an example of the configuration of the display device 1 in Example 2 according to the second embodiment. The difference between Example 2 and Example 1 (see Figure 17) is the configuration and installation position of the imaging unit 20.

[0111] As shown in Figure 18, in the display device 1 of Embodiment 2, the imaging unit 20 is provided on the lower surface (exposed surface) of the first translucent substrate 12 of the display unit 10, for example, on a part of the lower surface of the protruding portion 12A of the first translucent substrate 12. A conductive film 12a is provided on a part of the lower surface of this protruding portion 12A, that is, the area where the imaging unit 20 is installed. In other words, the imaging unit 20 is fixedly provided on a part of the lower surface of the protruding portion 12A via the conductive film 12a. The image sensor 22 of the imaging unit 20 faces the conductive film 12a.

[0112] The conductive film 12a is electrically connected to the wiring 11e via a protruding electrode 11d. The protruding electrode 11d is formed on the upper surface of the first substrate 11. The wiring 11e is embedded in the first substrate 11. One end of the wiring 11e is connected to the protruding electrode 11d, and the other end of the wiring 11e is connected to the pad 11a. The conductive film 12a is formed of a material that is, for example, translucent (transparent as an example). As an example, the conductive film 12a is composed of an ITO (indium tin oxide) film. The conductive film 12a is an example of a conductive member.

[0113] For example, the conductive film 12a and the wiring 11e are located in different layers and are electrically connected at a position where they overlap planarly via the protruding electrode 11d. The protruding electrode 11d is formed, for example, in a columnar shape. The protruding electrode 11d is an example of a conductive member.

[0114] The second substrate 21 of the imaging unit 20 is fixed to the lower surface of the protruding portion 12A by rib portions 23A, such as covering a part of the lower surface of the protruding portion 12A, for example, the conductive film 12a. The rib portions 23A contain a plurality of conductive members 23a. The second substrate 21 and the conductive film 12a are electrically connected via each conductive member 23a. As a result, the image sensor 22 is electrically connected to the conductive film 12a via each wire 22a, the wiring layer 21a of the second substrate 21, and each conductive member 23a.

[0115] According to Embodiment 2, since the first translucent substrate 12 is provided in common to the first substrate 11 and the imaging unit 20, the parallelism between the imaging unit 20 and the display unit 10 can be stabilized. Furthermore, since the imaging unit 20 is integrated with the display unit 10, the handling of both the imaging unit 20 and the display unit 10 can be improved.

[0116] (Example 3) Figure 19 is a cross-sectional view showing an example of the configuration of the display device 1 in Example 3 according to the second embodiment. The difference between Example 3 and Example 1 (see Figure 17) is the configuration and installation position of the imaging unit 20.

[0117] As shown in Figure 19, in the display device 1 of Embodiment 3, the second substrate 21A of the imaging unit 20 is made of a flexible printed circuit board (FPC) instead of an organic substrate or a ceramic substrate. An image sensor 22 is provided on the upper surface of this second substrate 21A, and a rib portion 23 is provided on the upper surface of the second substrate 21A so as to surround the image sensor 22. The rib portion 23 is bonded to the lower surface of the protruding portion 12A via adhesive 24a, and the imaging unit 20 is fixed to a part of the lower surface of the protruding portion 12A.

[0118] In Example 3, similar to Example 2, the first translucent substrate 12 is provided in common to the first substrate 11 and the imaging unit 20, so the parallelism between the imaging unit 20 and the display unit 10 can be stabilized. Furthermore, since the imaging unit 20 is integrated with the display unit 10, the handling of the imaging unit 20 and the display unit 10 can be improved.

[0119] (Example 4) Figure 20 is a cross-sectional view showing an example of the configuration of the display device 1 in Example 4 according to the second embodiment. The difference between Example 4 and Example 1 (see Figure 17) is the type of mounting substrate 30A.

[0120] As shown in Figure 20, in the display device 1 of Embodiment 4, the mounting substrate 30A is made of a flexible printed circuit board (FPC) rather than an organic substrate or a ceramic substrate. A reinforcing plate 30B is provided on this flexible mounting substrate 30A. The reinforcing plate 30B is made of, for example, metal. This reinforces the flexible mounting substrate 30A.

[0121] According to Example 4, the same effects as in Example 1 can be obtained. Furthermore, the mounting substrate 30A is made of a flexible substrate. This improves the degree of design freedom.

[0122] (Example 5) Figure 21 is a cross-sectional view showing an example of the configuration of the display device 1 in Example 5 according to the second embodiment. The difference between Example 5 and Example 2 (see Figure 18) is that there is a lead-out board 50 instead of a mounting board 30.

[0123] As shown in Figure 21, in the 5th embodiment, the display device 1 has a lead-out substrate 50 that is electrically connected to each pad 11a of the display unit 10 and is mounted on the display unit 10. The lead-out substrate 50 is made of, for example, a flexible substrate. For example, the lead-out substrate 50 is mounted on the display unit 10 by attaching an ACF (anisotropic conductive film). In addition to attaching an ACF, the lead-out substrate 50 may also be mounted by metal bonding such as Au.

[0124] In Example 5, similar to Examples 2 and 3, the first translucent substrate 12 is provided in common to the first substrate 11 and the imaging unit 20, so the parallelism between the imaging unit 20 and the display unit 10 can be stabilized. Furthermore, since the imaging unit 20 is integrated with the display unit 10, the handling of the imaging unit 20 and the display unit 10 can be improved.

[0125] (Example 6) Figure 22 is a cross-sectional view showing an example of the configuration of the display device 1 in Example 6 according to the second embodiment. The difference between Example 6 and Example 3 (see Figure 19) is that a lead-out board 50 is present instead of a mounting board 30.

[0126] As shown in Figure 22, in the display device 1 of Embodiment 6, similar to Embodiment 5 described above, the pull-out circuit board 50 is electrically connected to each pad 11a of the display unit 10 and mounted on the display unit 10.

[0127] According to Example 6, similar to Examples 2, 3, and 5, the first translucent substrate 12 is provided in common to the first substrate 11 and the imaging unit 20, so the parallelism between the imaging unit 20 and the display unit 10 can be stabilized. In addition, since the imaging unit 20 is integrated with the display unit 10, the handling of the imaging unit 20 and the display unit 10 can be improved.

[0128] (Example 7) Figure 23 is a cross-sectional view showing an example of the configuration of the display device 1 in Example 7 according to the second embodiment. The difference between Example 7 and Example 1 (see Figure 17) is the electrical connection structure between the display unit 10 and the mounting substrate 30.

[0129] As shown in Figure 23, in the display device 1 of Embodiment 7, a plurality of through-holes 11f are formed in the first substrate 11 of the display unit 10. Each through-hole 11f penetrates from the top surface to the bottom surface of the first substrate 11. In each through-hole 11f, one end of the through-hole 11f is connected to a pad 11a, and the other end of the through-hole 11f is connected to a wire 11b. Each wire 11b is connected to the mounting substrate 30. Thus, each pad 11a and the mounting substrate 30 are electrically connected. Each wire 11b is covered and sealed with a sealing material 11c.

[0130] According to Example 7, wire bonding is performed on the lower surface of the display unit 10. This makes it possible to reduce the size of the mounting substrate 30 in the X-axis direction, thereby enabling miniaturization of the display device 1.

[0131] (Example 8) Figure 24 is a cross-sectional view showing an example of the configuration of the display device 1 in Example 8 according to the second embodiment. The difference between Example 8 and Example 2 (see Figure 18) is the electrical connection structure between the display unit 10 and the mounting substrate 30.

[0132] As shown in Figure 24, in the display device 1 of Embodiment 8, a plurality of through-holes 11f are formed in the first substrate 11 of the display unit 10, similar to Embodiment 7 described above.

[0133] According to Example 8, similar to Example 7 described above, wire bonding is performed on the lower surface of the display unit 10. This makes it possible to reduce the size of the mounting substrate 30 in the X-axis direction, thereby enabling miniaturization of the display device 1.

[0134] (Example 9) Figure 25 is a cross-sectional view showing an example of the configuration of the display device 1 in Example 9 according to the second embodiment. The difference between Example 9 and Example 3 (see Figure 19) is the electrical connection structure between the display unit 10 and the mounting substrate 30.

[0135] As shown in Figure 25, in the display device 1 of Embodiment 9, a plurality of through-holes 11f are formed in the first substrate 11 of the display unit 10, similar to Embodiment 7 described above.

[0136] According to Example 9, similar to Example 7 described above, wire bonding is performed on the lower surface of the display unit 10. This makes it possible to reduce the size of the mounting substrate 30 in the X-axis direction, thereby enabling miniaturization of the display device 1.

[0137] <2-2. Example of Manufacturing Process for Display Device> An example of the manufacturing process for the display device 1 according to the second embodiment will be described with reference to Figures 26 to 30.

[0138] (Example of manufacturing process for the display device of Example 1) Figures 26 and 27 are diagrams showing examples of the manufacturing process for the display device 1 of Example 1 (see Figure 17) according to the second embodiment.

[0139] As shown in Figure 26, in step S51, the wafer 200 is prepared. The wafer 200 has a substrate layer 201 and a light-transmitting substrate layer 202.

[0140] In step S52, the translucent substrate layer 202 is cut by the scribe tool 210, and the substrate layer 201 is cut by the blade 220. At this time, the cutting position by the scribe tool 210 and the cutting position by the blade 220 are not on the same straight line, but are offset by a predetermined distance. The cutting is performed while avoiding each pad 11a on the substrate layer 201. Through this cutting, the display unit 10, consisting of the first substrate 11 and the first translucent substrate 12, is cut out from the wafer 200.

[0141] As shown in Figure 27, in step S61, a display unit 10 and a mounting board 30 having an imaging unit 20 and a connector 32 are prepared. The imaging unit 20 and the connector 32 are fixedly mounted on the mounting board 30.

[0142] In step S62, die bond material 10a is applied to the prepared mounting substrate 30, and adhesive 24a is applied to the upper surface of the rib portion 23 of the imaging unit 20. The die bond material 10a is made of, for example, a resin-based or metal-based material.

[0143] In step S63, the display unit 10 is mounted on the mounting substrate 30 via a die bond material 10a. For example, the display unit 10 is positioned next to the imaging unit 20 and is provided on the upper surface of the mounting substrate 30 such that the end of the first translucent substrate 12 of the display unit 10 covers the image sensor 22.

[0144] In step S64, the display unit 10 on the mounting board 30 is electrically connected to the mounting board 30 by wire bonding. For example, each pad 11a of the display unit 10 on the mounting board 30 is electrically connected to the mounting board 30 by each wire 11b.

[0145] In step S65, each wire 11b connecting each pad 11a of the display unit 10 to the mounting substrate 30 is sealed with the sealing material 11c. This completes the display device 1 of Embodiment 1.

[0146] (Example of manufacturing process for the display device of Example 2) Figures 28 and 29 are diagrams showing examples of the manufacturing process for the display device 1 of Example 2 (see Figure 18) according to the second embodiment.

[0147] As shown in Figure 28, in step S71, a substrate layer 201 containing a plurality of wirings 11e and a translucent substrate layer 202 containing a plurality of conductive films 12a are prepared. Each wiring 11e is formed on the upper surface of the substrate layer 201, and each conductive film 12a is formed on the lower surface of the translucent substrate layer 202.

[0148] In step S72, a protruding electrode 11d is formed on each of the wirings 11e on the substrate layer 201. For example, the protruding electrode 11d is formed on one end of the wiring 11e.

[0149] In step S73, a translucent substrate layer 202 having each conductive film 12a and a substrate layer 201 having each wiring 11e and each protruding electrode 11d are laminated via a plurality of insulating layers 201a. This completes the wafer 200A. Note that each insulating layer 201a is formed on each wiring 11e, avoiding each protruding electrode 11d.

[0150] In step S74, the wafer 200A is prepared. This wafer 200A is formed as described in steps S71 to S73 above and has a substrate layer 201, a translucent substrate layer 202, and the like.

[0151] In step S75, the translucent substrate layer 202 is cut by the scribe tool 210, and the substrate layer 201 is cut by the blade 220. At this time, the cutting position by the scribe tool 210 and the cutting position by the blade 220 are not on the same straight line, but are offset by a predetermined distance. The cutting is performed while avoiding each protruding electrode 11d and each wiring 11e on the substrate layer 201. Through this cutting, the display unit 10, consisting of the first substrate 11 and the first translucent substrate 12, is cut out from the wafer 200.

[0152] As shown in Figure 29, in step S81, the display unit 10 is prepared. This display unit 10 is cut from the wafer 200A as described in step S75 above, and includes a first substrate 11 and a first translucent substrate 12.

[0153] In step S82, the imaging unit 20 is provided on the display unit 10. For example, the display unit 10 is inverted and the imaging unit 20 is provided on the end of the first translucent substrate 12 of the display unit 10, that is, on the exposed surface (one surface of the protruding portion 12A) of one surface of the first translucent substrate 12 that is not covered by the first substrate 11.

[0154] In step S83, a display unit 10 having an imaging unit 20 is attached to the mounting substrate 30 by die bonding. For example, the display unit 10 is inverted (the side of the display unit 10 facing the imaging unit 20 faces the mounting substrate 30) and is attached to the upper surface of the mounting substrate 30.

[0155] In step S84, the display unit 10 on the mounting board 30 is electrically connected to the mounting board 30 by wire bonding. For example, each pad 11a of the display unit 10 on the mounting board 30 is electrically connected to the mounting board 30 by each wire 11b.

[0156] In step S85, each wire 11b connecting each pad 11a of the display unit 10 to the mounting substrate 30 is sealed with the sealing material 11c. This completes the display device 1 of Embodiment 2.

[0157] Furthermore, the manufacturing process of the display device 1 in this embodiment 2 can also be applied to the manufacturing process of the display device 1 in embodiment 3 (see Figure 19) described above.

[0158] (Example of manufacturing process for the display device of Example 5) Figure 30 shows an example of the manufacturing process for the display device 1 of Example 5 (see Figure 21) according to the second embodiment.

[0159] As shown in Figure 30, in step S91, the display unit 10 is prepared. This display unit 10 is cut from the wafer 200A as described in step S75 above, and includes a first substrate 11 and a first translucent substrate 12.

[0160] In step S92, the imaging unit 20 is provided on the display unit 10. For example, the display unit 10 is inverted and the imaging unit 20 is provided on the end of the first translucent substrate 12 of the display unit 10, that is, on the exposed surface (one surface of the protruding portion 12A) of one surface of the first translucent substrate 12 that is not covered by the first substrate 11.

[0161] In step S93, the ACF (anisotropic conductive film) 10b is attached to the display unit 10. For example, the display unit 10 is inverted, and the ACF 10b is attached to the area of ​​the display unit 10 including each pad 11a.

[0162] In step S94, the pull-out circuit board 50 is connected to the display unit 10. For example, the pull-out circuit board 50 is electrically connected to each pad 11a of the display unit 10 via the ACF 10b. This completes the display device 1 of Embodiment 5.

[0163] Furthermore, the manufacturing process of the display device 1 in this embodiment 5 can also be applied to the manufacturing process of the display device 1 in embodiment 6 (see Figure 22) described above.

[0164] <3. Function and Effects> As described above, the display device 1 according to the embodiment comprises a display unit 10 and an image sensor 22 provided outside the display unit 10 and integrated with the display unit 10 (see Figures 1 to 9, etc.). The image sensor 22 is located outside the display unit 10 but is integrated with the display unit 10. As a result, the image sensor 22 is provided at a desired position relative to the display unit 10 (for example, a desired position based on the design, etc.), and the line of sight to the display unit 10 is reliably detected, thereby improving the line of sight detection efficiency. Furthermore, since the image sensor 22 is precisely fixed at the aforementioned desired position, the positional accuracy of the image sensor 22 can be improved.

[0165] Furthermore, the display unit 10 may also include a first substrate 11 and a first translucent substrate 12, and a second translucent substrate 24 provided at a position facing the image sensor 22 (see Figures 1 to 4). As a result, the presence of the first translucent substrate 12 and the second translucent substrate 24 provides protection for the first substrate 11 and the image sensor 22.

[0166] Furthermore, the first translucent substrate 12 and the second translucent substrate 24 may be separate components (see Figures 1 to 4). This improves the degree of design flexibility.

[0167] Furthermore, the first translucent substrate 12 and the second translucent substrate 24 may be integrated (see Figures 17 to 25). This makes it possible to reduce the number of assembly steps and the amount of material used.

[0168] Furthermore, the image sensor 22 may be further surrounded by a rib portion 23, and the second light-transmitting substrate 24 may be provided on the rib portion 23 (see Figures 1 to 4, etc.). This ensures reliable protection of the image sensor 22.

[0169] Furthermore, the display device 1 may further include a mounting substrate 30 on which a display unit 10 and an image sensor 22 are provided (see Figures 1 to 5, 17, 20, and 23). This ensures that the display unit 10 and the image sensor 22 are integrated.

[0170] Furthermore, the image sensor 22 on the mounting substrate 30 may be electrically connected to the mounting substrate 30 by a conductive member (for example, a wire 22a) (see Figures 1 to 5). This allows the image sensor 22 to be electrically connected to the mounting substrate 30.

[0171] Furthermore, the mounting substrate 30 may be an organic substrate, a ceramic substrate, or a flexible substrate (see Figures 1 to 5, etc.). This improves the degree of design flexibility.

[0172] Furthermore, the image sensor 22 may be provided on the display unit 10 (see Figures 6 to 9, 18 to 19, 21 to 22, and 24 to 25). This ensures that the display unit 10 and the image sensor 22 are integrated.

[0173] Furthermore, the image sensor 22 is provided on the display unit 10, and the display device 1 may further include a mounting substrate 30 on which the display unit 10 is provided (see Figures 6 to 9, 18 to 19, and 24 to 25). This ensures that the display unit 10 and the image sensor 22 are integrated.

[0174] Furthermore, the image sensor 22 on the display unit 10 may be electrically connected to the display unit 10 by a conductive member (for example, a wire 22a) (see Figures 6 and 7). This allows the image sensor 22 to be electrically connected to the display unit 10.

[0175] Furthermore, the display unit 10 may have a pad 11a, and the image sensor 22 may be provided on the pad 11a (see Figures 6 and 7). This allows the image sensor 22 to be electrically and reliably connected to the display unit 10.

[0176] Furthermore, the image sensor 22 on the display unit 10 may be electrically connected to the mounting substrate 30 by a conductive member (for example, a wire 22a) (see Figures 8 and 9). This allows the image sensor 22 to be electrically connected to the mounting substrate 30.

[0177] Furthermore, the display unit 10 may have a pad 11a, and the image sensor 22 may be provided around the pad 11a (see Figures 8 and 9). This allows the image sensor 22 to be electrically and reliably connected to the mounting substrate 30.

[0178] Furthermore, the image sensor 22 may be provided on the display unit 10, and the image sensor 22 may be electrically connected to the display unit 10 by a conductive member (for example, a wire 22a, a wiring layer 21a of the second substrate 21, a conductive member 23a, a conductive film 12a) (see Figures 18, 21, 24, etc.). This allows the image sensor 22 to be electrically connected to the display unit 10.

[0179] Furthermore, the conductive member may include a conductive film 12a provided on the display unit 10, and the image sensor 22 may be electrically connected to the display unit 10 via the conductive film 12a (see Figures 18, 21, 24, etc.). This ensures that the image sensor 22 is electrically and reliably connected to the display unit 10.

[0180] Furthermore, the image sensor 22 is positioned opposite the conductive film 12a, and the conductive film 12a may be light-transmitting (see Figures 18, 21, 24, etc.). This makes it possible to reliably detect the line of sight to the display unit 10, thereby reliably improving the line of sight detection efficiency.

[0181] Furthermore, the image sensor 22 may be provided around the display unit 10 (see Figures 1 and 2, etc.). This makes it possible to reliably detect the line of sight to the display unit 10, thereby reliably improving the line of sight detection efficiency.

[0182] Furthermore, the display device 1 may also include a light source 40 (for example, a light-emitting element 41) provided outside the display unit 10 and integrated with the display unit 10 and the image sensor 22 (see Figure 5). This makes it possible to accurately fix the light source 40 at a desired position based on the design, thereby improving the positional accuracy of the light source 40.

[0183] <4. Other Embodiments> The configurations and processes described in the above-described embodiments (including examples and modifications) may be implemented in various other forms besides those described above. For example, the configurations and processes may be in various forms, not limited to the examples described above. Also, for example, the configurations, processing procedures, specific names, and information including various data and parameters shown in the above document and drawings may be changed at will unless otherwise specified.

[0184] Furthermore, the configurations and processes described in the above-mentioned embodiments (including examples and modifications) do not necessarily have to be physically configured as shown in the figures. In other words, the specific forms of distribution and integration of each configuration and process are not limited to those shown in the figures, and all or part of them may be functionally or physically distributed or integrated in any unit depending on various loads and usage conditions.

[0185] Furthermore, the various configurations and processes described in the above-mentioned embodiments (including examples and modifications) may be combined as appropriate. For example, at least a part of one embodiment may be combined with at least a part of another embodiment as appropriate. Also, the effects described in the embodiments are merely illustrative and not limiting, and other effects may also occur.

[0186] <5. Examples of Application> The technology relating to this disclosure may be applied, for example, to the display units of various electronic devices. Examples of electronic devices to which this technology can be applied are described below. However, the specific examples given here are merely examples and are not limited to them.

[0187] (First Specific Example) Figure 31 is a front view showing an example of the external appearance of the digital still camera 400. Figure 32 is a rear view showing an example of the external appearance of the digital still camera 400. This digital still camera 400 is a single-lens reflex type with interchangeable lenses, and has an interchangeable shooting lens unit (interchangeable lens) 412 located approximately in the center of the front of the camera body 411, and a grip portion 413 for the photographer to hold on the left side of the front.

[0188] A monitor 414 is located slightly to the left of the center of the back of the camera body 411. An electronic viewfinder (eyepiece) 415 is provided above the monitor 414. The photographer can determine the composition by looking through the electronic viewfinder 415 and visually confirming the light image of the subject guided by the shooting lens unit 412. The aforementioned display device 1 can be applied to the monitor 414 and the electronic viewfinder 415.

[0189] (Second Specific Example) Figure 33 shows an example of the appearance of a head-mounted display 500. The head-mounted display 500 has, for example, a glasses-shaped display unit 511 and ear hooks 512 on both sides for being attached to the user's head. In this head-mounted display 500, the display device 1 described above can be applied to the display unit 511.

[0190] (Third Specific Example) Figure 34 shows an example of the external appearance of the see-through head-mounted display 600. The see-through head-mounted display 600 consists of a main body 612, an arm 613, and a lens barrel 611.

[0191] The main body 612 is connected to the arm 613 and the eyeglasses 614. Specifically, the long end of the main body 612 is connected to the arm 613, and one side of the main body 612 is connected to the eyeglasses 614 via a connecting member. The main body 612 may also be directly attached to the head of a person.

[0192] The main body 612 houses a control board for controlling the operation of the see-through head-mounted display 600, as well as a display unit. The arm 613 connects the main body 612 to the lens barrel 611 and supports the lens barrel 611. Specifically, the arm 613 is connected to the end of the main body 612 and the end of the lens barrel 611, respectively, to fix the lens barrel 611 in place. The arm 613 also houses signal lines for communicating image data provided from the main body 612 to the lens barrel 611.

[0193] The microscope tube 611 projects image light, provided from the main body 612 via the arm 613, through the eyepiece lens towards the eyes of the user wearing the see-through head-mounted display 600. In this see-through head-mounted display 600, the display device 1 described above can be applied to the display unit of the main body 612.

[0194] (Fourth Specific Example) Figure 35 shows an example of the external appearance of a television device 700. This television device 700 has, for example, a video display screen section 711 including a front panel 712 and a filter glass 713. The display device 1 described above can be applied to this video display screen section 711.

[0195] (Fifth Specific Example) Figure 36 shows an example of the external appearance of a smartphone 800. The smartphone 800 has a display unit 811 that displays various information, and an operation unit consisting of buttons, etc. that accept user input. The display device 1 described above can be applied to the display unit 811.

[0196] (Sixth Specific Example) Figures 37 and 38 show the internal configuration of an automobile having the display device 1 according to the embodiment. More specifically, Figure 37 shows the interior of the automobile from the rear to the front, and Figure 38 shows the interior of the automobile from the diagonally rear to the diagonally front.

[0197] The automobile shown in Figures 37 and 38 has a center display 911, a console display 912, a head-up display 913, a digital rear mirror 914, a steering wheel display 915, and a rear entertainment display 916. Some or all of these displays can be fitted with the aforementioned display device 1.

[0198] The center display 911 is positioned on the center console 907, facing the driver's seat 901 and the passenger seat 902. Figures 37 and 38 show examples of horizontally elongated center displays 911 (911C, 911L, 911R) extending from the driver's seat 901 to the passenger seat 902, but the screen size and placement of the center display 911 are arbitrary. The center display 911 can display information detected by various sensors (not shown). As a specific example, the center display 911 can display images captured by an image sensor, distance images to obstacles in front of or to the side of the vehicle measured by a ToF (Time of Flight) sensor, and the body temperature of passengers detected by an infrared sensor. The center display 911 can be used to display, for example, at least one of safety-related information, operation-related information, life logs, health-related information, authentication / identification-related information, and entertainment-related information.

[0199] Safety-related information includes information such as drowsiness detection, distraction detection, detection of mischief by a passenger, seat belt fastening status, and detection of an unattended occupant. This information is detected, for example, by a sensor (not shown) placed on top of the back of the center display 911. Operation-related information is detected by sensing occupant gestures using sensors. The detected gestures may include the operation of various equipment in the vehicle. For example, the operation of air conditioning equipment, navigation system, AV (Audio / Visual) system, lighting system, etc., is detected. Lifelogs include the lifelogs of all occupants. For example, lifelogs include records of each occupant's actions while riding in the vehicle. By acquiring and saving lifelogs, it is possible to confirm the state of the occupants at the time of an accident. Health-related information is detected by sensing the occupant's body temperature using a temperature sensor and inferring the occupant's health status based on the detected body temperature. Alternatively, the occupant's face may be captured using an image sensor, and the occupant's health status may be inferred from the captured facial expression. Furthermore, the system may engage in automated voice conversations with the occupants and infer their health status based on their responses. Authentication / identification-related information includes keyless entry functions that use sensors for facial recognition, and functions that automatically adjust seat height and position based on facial recognition. Entertainment-related information includes functions that use sensors to detect information on how the occupants operate the AV equipment, and functions that use sensors to recognize the occupants' faces and provide content suitable for the occupants through the AV equipment.

[0200] The console display 912 can be used, for example, to display life log information. The console display 912 is located near the shift lever 908 on the center console 907 between the driver's seat 901 and the passenger seat 902. The console display 912 can also display information detected by various sensors (not shown). In addition, the console display 912 may display images of the vehicle's surroundings captured by an image sensor, or distance images to obstacles around the vehicle.

[0201] The head-up display 913 is virtually displayed behind the windshield 904 in front of the driver's seat 901. The head-up display 913 can be used to display at least one of the following: safety-related information, operation-related information, life logs, health-related information, authentication / identification-related information, and entertainment-related information. Because the head-up display 913 is often virtually positioned in front of the driver's seat 901, it is suitable for displaying information directly related to the operation of the vehicle, such as the vehicle's speed and fuel (battery) level.

[0202] The digital rearview mirror 914 can not only display the area behind the vehicle but also show the condition of the passengers in the rear seat. By placing a sensor (not shown) on top of the back of the digital rearview mirror 914, it can be used, for example, to display life log information.

[0203] The steering wheel display 915 is positioned near the center of the steering wheel 906 of the automobile. The steering wheel display 915 can be used to display at least one of the following: safety-related information, operation-related information, life log, health-related information, authentication / identification-related information, and entertainment-related information. In particular, because the steering wheel display 915 is located near the driver's hands, it is suitable for displaying life log information such as the driver's body temperature, or information related to the operation of AV equipment, air conditioning equipment, etc.

[0204] The rear entertainment display 916 is mounted on the back of the driver's seat 901 and the passenger seat 902, and is intended for viewing by rear-seat passengers. The rear entertainment display 916 can be used to display at least one of the following: safety-related information, operation-related information, life logs, health-related information, authentication / identification-related information, and entertainment-related information. In particular, because the rear entertainment display 916 is in front of the rear-seat passengers, it displays information relevant to the rear-seat passengers. For example, it may display information related to the operation of AV equipment or air conditioning equipment, or it may display the results of measurements of the rear-seat passengers' body temperature etc., taken by a temperature sensor (not shown).

[0205] As described above, by placing a sensor on top of the back of the display, the distance to surrounding objects can be measured. Optical distance measurement methods can be broadly divided into passive and active types. Passive methods measure distance by receiving light from an object without projecting light from the sensor onto the object. Passive methods include the lens focusing method, stereo method, and monocular method. Active methods measure distance by projecting light onto an object and receiving the reflected light from the object with a sensor. Active methods include optical radar, active stereo, illuminance difference stereo, moiré topography, and interferometry. The display device 1 according to this embodiment is applicable to any of these distance measurement methods. By using a sensor placed on top of the back of the display device 1 according to this embodiment, the passive or active distance measurement described above can be performed.

[0206] It should be noted that the electronic devices to which the aforementioned display device 1 may be applied are not limited to the examples given above. The aforementioned display device 1 can be applied to the display units of electronic devices in various fields. In other words, the technology relating to this disclosure can be applied to a variety of products. For example, the aforementioned display device 1 may be used in the display units of various mobile devices other than automobiles, such as motorcycles, bicycles, personal mobility devices, airplanes, drones, ships, robots, construction machinery, and agricultural machinery (tractors). Furthermore, the aforementioned display device 1 may be used in the display units of, for example, endoscopic surgery systems and microsurgical systems.

[0207] <6. Addendum> The technology can also be configured as follows: (1) A display device comprising: a display unit; and an image sensor for eye-tracking provided outside the display unit and integrated with the display unit. (2) The display device according to (1), wherein the display unit has a first substrate and a first translucent substrate, and further comprises a second translucent substrate provided at a position opposite to the image sensor. (3) The display device according to (2), wherein the first translucent substrate and the second translucent substrate are separate components. (4) The display device according to (2), wherein the first translucent substrate and the second translucent substrate are integral. (5) The display device according to any one of (2) to (4), further comprising a rib portion surrounding the image sensor, wherein the second translucent substrate is provided on the rib portion. (6) The display device according to any one of (1) to (5), further comprising a mounting substrate on which the display unit and the image sensor are provided. (7) The display device according to (6), wherein the image sensor is electrically connected to the mounting substrate by a conductive member. (8) The display device according to (6) or (7), wherein the mounting substrate is an organic substrate, a ceramic substrate, or a flexible substrate. (9) The display device according to any one of (1) to (5), wherein the image sensor is provided on the display unit. (10) The display device according to (9), further comprising a mounting substrate on which the display unit is provided. (11) The display device according to (10), wherein the image sensor is electrically connected to the display unit by a conductive member. (12) The display device according to (11), wherein the display unit has a pad, and the image sensor is provided on the pad. (13) The display device according to (10), wherein the image sensor is electrically connected to the mounting substrate by a conductive member. (14) The display device according to (13), wherein the display unit has a pad, and the image sensor is provided around the pad. (15) The display device according to (9), wherein the image sensor is electrically connected to the display unit by a conductive member.(16) The display device according to (15), wherein the conductive member includes a conductive film provided on the display unit, and the image sensor is electrically connected to the display unit via the conductive film. (17) The display device according to (16), wherein the image sensor is provided at a position facing the conductive film, and the conductive film is light-transmitting. (18) The display device according to any one of (1) to (17), wherein the image sensor is provided around the display unit. (19) The display device according to any one of (1) to (18), further comprising a light source provided outside the display unit and integrated with the display unit and the image sensor. (20) A method for manufacturing a display device, comprising providing an image sensor for eye-tracking outside the display unit and integrating it with the display unit. (21) An electronic device comprising the display device according to any one of (1) to (19). (22) A method for manufacturing a display device, comprising manufacturing the display device according to any one of (1) to (19).

[0208] 1 Display device 10 Display unit 10a Die bond material 10b ACF (Anisotropic conductive film) 11 First substrate 11a Pad 11b Wire 11c Sealing material 11d Protruding electrode 11e Wiring 11f Through hole 12 First translucent substrate 12a Conductive film 12A Protruding part 20 Imaging unit 21 Second substrate 21a Wiring layer 21A Second substrate 21b Solder 22 Image sensor 22a Wire 23 Rib part 23a Conductive material 23A Rib part 24 Second translucent substrate 24a Adhesive 30 Mounting substrate 30A Mounting substrate 30B Reinforcement plate 31 Wiring layer 32 Connector 40 Light source 41 Light-emitting element 50 Drawer substrate 200 Wafer 200A Wafer 201 Substrate layer 201a Insulating layer 202 Translucent substrate layer 210 Scribe tool 220 Blade

Claims

1. A display device comprising: a display unit; and an image sensor for eye-tracking provided outside the display unit and integrated with the display unit.

2. The display device according to claim 1, wherein the display unit has a first substrate and a first translucent substrate, and further comprises a second translucent substrate provided at a position opposite to the image sensor.

3. The display device according to claim 2, wherein the first translucent substrate and the second translucent substrate are separate components.

4. The display device according to claim 2, wherein the first translucent substrate and the second translucent substrate are integrally formed.

5. The display device according to claim 2, further comprising a rib portion surrounding the image sensor, wherein the second light-transmitting substrate is provided on the rib portion.

6. The display device according to claim 1, further comprising a mounting substrate on which the display unit and the image sensor are provided.

7. The display device according to claim 6, wherein the image sensor is electrically connected to the mounting substrate by a conductive member.

8. The display device according to claim 6, wherein the mounting substrate is an organic substrate, a ceramic substrate, or a flexible substrate.

9. The display device according to claim 1, wherein the image sensor is provided in the display unit.

10. The display device according to claim 9, further comprising a mounting board on which the display unit is provided.

11. The display device according to claim 10, wherein the image sensor is electrically connected to the display unit by a conductive member.

12. The display device according to claim 11, wherein the display unit has a pad, and the image sensor is provided on the pad.

13. The display device according to claim 10, wherein the image sensor is electrically connected to the mounting substrate by a conductive member.

14. The display device according to claim 13, wherein the display unit has a pad, and the image sensor is provided around the pad.

15. The display device according to claim 9, wherein the image sensor is electrically connected to the display unit by a conductive member.

16. The display device according to claim 15, wherein the conductive member includes a conductive film provided on the display unit, and the image sensor is electrically connected to the display unit via the conductive film.

17. The display device according to claim 16, wherein the image sensor is provided at a position facing the conductive film, and the conductive film is light-transmitting.

18. The display device according to claim 1, wherein the image sensor is provided around the display unit.

19. The display device according to claim 1, further comprising a light source provided outside the display unit and integrated with the display unit and the image sensor.

20. A method for manufacturing a display device, comprising providing an image sensor for eye-tracking detection outside the display unit and integrating it with the display unit.

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