Radio frequency front end module and electronic device comprising same

Abstract

This electronic device comprises: at least one processor including a processing circuit; an RF transceiver; an RFFE module including a power amplifier; a power supply circuit for providing a supply voltage through a power path; a thermistor circuit; a first switch circuit for selectively connecting or disconnecting the power path to or from the power amplifier; a second switch circuit for selectively connecting or disconnecting the thermistor circuit to or from the power path; and a PMIC connected to the thermistor circuit, wherein the second switch circuit is controlled to connect the power path to the thermistor circuit, the PMIC identifies a voltage value corresponding to a parallel resistance between the power amplifier and the thermistor circuit, and the first switch circuit is controlled, on the basis of the voltage value lower than a threshold voltage value, to not connect the power amplifier to the power path.

Description

Radio frequency front-end module and electronic device including the same

[0001] The following descriptions relate to an electronic device including a radio frequency front end module (RFFE).

[0002] An electronic device may include radio frequency front end module (RFFE) modules for transmitting or receiving signals. For example, an RFFE module may include a power amplifier (PA) for the transmit power of a signal to be transmitted through an antenna connected to the RFFE module.

[0003] The information described above may be provided as related art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art related to the present disclosure.

[0004] An electronic device is provided. The electronic device may include at least one processor including a processing circuit. The electronic device may include a radio frequency (RF) transceiver. The electronic device may include a radio frequency front end (RFFE) module including a power amplifier. The electronic device may include a power supply circuit for providing a supply voltage through a power path. The electronic device may include a thermistor circuit. The electronic device may include a first switch circuit configured to selectively connect or disconnect the power path and the power amplifier. The electronic device may include a second switch circuit configured to selectively connect or disconnect the thermistor circuit and the power path. The electronic device may include a power management integrated circuit (PMIC) connected to the thermistor circuit. The second switch circuit may be controlled to connect the power path and the thermistor circuit according to the control of the at least one processor or the RF transceiver. The PMIC may be configured to identify a voltage value corresponding to a parallel resistance between the power amplifier and the thermistor circuit under the control of the at least one processor or the RF transceiver. The first switch circuit may be controlled not to connect the power amplifier and the power path under the control of the at least one processor or the RF transceiver based on the voltage value being less than a threshold voltage value.

[0005] An RFFE module is provided. The RFFE module may include a power amplifier. The RFFE module may include a first switch circuit configured to selectively connect or disconnect the power path of a power supply circuit for providing a supply voltage to the power amplifier. The RFFE module may include a second switch circuit configured to selectively connect or disconnect the power path to a thermistor circuit. The second switch circuit may be controlled to connect the power path to the thermistor circuit under the control of at least one processor or RF (radio frequency) transceiver. The first switch circuit may be controlled not to connect the power amplifier to the power path under the control of at least one processor or RF transceiver, based on a voltage value corresponding to a parallel resistance between the power path and the thermistor circuit that is less than a threshold voltage value.

[0006] In relation to the description of the drawings, the same or similar reference numerals may be used for identical or similar components.

[0007] Figure 1 is a block diagram of an electronic device in a network environment.

[0008] Figure 2 illustrates the components of an electronic device for detecting damage to a power amplifier.

[0009] Figure 3 illustrates an example of a power management integrated circuit (PMIC) for measuring the voltage of a thermistor.

[0010] Figure 4 illustrates the components of an electronic device for detecting damage to a power amplifier.

[0011] Figure 5 illustrates the components of an electronic device for detecting damage to a power amplifier.

[0012] Figure 6 illustrates the components of an electronic device for detecting damage to a power amplifier.

[0013] Figure 7 illustrates the components of an electronic device for detecting damage to a power amplifier.

[0014] Figure 8 illustrates the components of an electronic device for detecting damage to a power amplifier.

[0015] FIG. 9 illustrates the components of an electronic device for detecting damage to a power amplifier.

[0016] FIG. 10 illustrates the components of an electronic device for detecting damage to a power amplifier.

[0017] FIG. 11 illustrates the components of an electronic device for detecting damage to a power amplifier.

[0018] Figure 12 is a flowchart showing the operations of an electronic device for detecting damage to a power amplifier.

[0019] The terms used in this disclosure are used merely to describe specific embodiments and are not intended to limit the scope of other embodiments. A singular expression may include a plural expression unless the context clearly indicates otherwise. Terms used herein, including technical or scientific terms, may have the same meaning as generally understood by those skilled in the art described in this disclosure. Terms used in this disclosure that are defined in a general dictionary may be interpreted as having the same or similar meaning as they have in the context of the relevant technology, and are not to be interpreted in an ideal or overly formal sense unless explicitly defined in this disclosure. In some cases, even terms defined in this disclosure are not to be interpreted to exclude the embodiments of this disclosure.

[0020] In the various embodiments of the present disclosure described below, a hardware-based approach is described as an example. However, since the various embodiments of the present disclosure include techniques using both hardware and software, the various embodiments of the present disclosure do not exclude a software-based approach.

[0021] Terms referring to components of electronic devices used in the following description (e.g., communication module, wireless communication module, substrate, PCB (printed circuit board), FPCB (flexible PCB), module, antenna, antenna element, circuit, processor, chip, component, device), terms referring to RF-related components (FEM (front end module), PAM (power amplifier module), FEMid (FEM including duplexer), PAMid (power amplifier module including duplexer), LPAMid (Low noise amplifier PAM including duplexer), RFFE (radio frequency front end)), RFIC (radio frequency integrated circuit)), terms referring to the shape of components (e.g., structure, support, contact, protrusion), terms referring to connections between structures (e.g., connection, contact, support, contact structure, conductive member, assembly), and terms referring to circuits (e.g., PCB, FPCB, signal line, feeding line, data line, RF signal line, antenna line, signal path, RF path, RF module, RF Circuits, splitters, dividers, couplers, combiners, etc. are examples provided for convenience of explanation. Accordingly, the present disclosure is not limited to the terms described below, and other terms having equivalent technical meanings may be used. Furthermore, terms such as '...part', '...device', '...object', '...body' used below may refer to at least one structural shape or a unit that performs a function.

[0022] Additionally, in this disclosure, expressions of "greater than" or "less than" may be used to determine whether a specific condition is satisfied or fulfilled; however, this is merely for the purpose of expressing an example and does not exclude descriptions of "greater than" or "less than." Conditions described as "greater than" may be replaced with "greater than," conditions described as "less than" may be replaced with "less than," and conditions described as "greater than and less than" may be replaced with "greater than and less than." Furthermore, "A" to "B" below refer to at least one of elements from A (including A) to B (including B). Below, "C" and / or "D" refers to including at least one of "C" or "D," i.e., {'C', 'D', 'C' and 'D'}.

[0023] Figure 1 is a block diagram of an electronic device in a network environment.

[0024] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or with at least one of an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In some embodiments, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into a single component (e.g., display module (160)).

[0025] The processor (120) can control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., a program (140)), for example, and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) that can operate independently or together with it (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, if the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use lower power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof.

[0026] The auxiliary processor (123) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0027] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, software (e.g., program (140)) and input or output data for related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0028] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0029] The input module (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0030] The sound output module (155) can output a sound signal to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0031] The display module (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0032] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150) or output sound through the sound output module (155) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (101).

[0033] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0034] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0035] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0036] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that can be perceived by the user through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0037] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0038] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0039] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0040] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (104) through a first network (198) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0041] The wireless communication module (192) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (192) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), external electronic device (e.g., electronic device (104)), or network system (e.g., second network (199)). According to one embodiment, the wireless communication module (192) may support a Peak data rate (e.g., 20 Gbps or more) for eMBB realization, loss coverage (e.g., 164 dB or less) for mMTC realization, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for URLLC realization.

[0042] An antenna module (197) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197).

[0043] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0044] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0045] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (104) or the server (108) may be included within the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0046] To support various frequency combinations, the electronic device (101) may include multiple power amplifiers (PAs). When multiple power amplifiers are connected to a single power supply circuit, one of the power amplifiers may be damaged (or burned out). Since the damaged power amplifier is short-circuited, other power amplifiers connected to the power supply circuit cannot be used. A method for identifying whether a power amplifier is damaged based on a comparator has been proposed, but this method may cause an increase in the cost of the entire module. To solve the above-mentioned problem, an apparatus and method for identifying whether a power amplifier is damaged by adding only a switch circuit compared to an existing circuit are described.

[0047] FIG. 2 illustrates components of an electronic device for detecting damage to a power amplifier. In FIG. 2, in a circuit structure in which a power amplifier (PA) (241) is placed within a single RFFE module (240), the operations of an electronic device (101) for identifying (or detecting) whether the power amplifier (241) is damaged are described.

[0048] Referring to FIG. 2, the electronic device (101) may include a processor (210), an RF (radio frequency) transceiver (220), a PMIC (power management integrated circuit) (230), a thermistor (235), a power supply circuit (236), and an RFFE (radio frequency front end) module (240).

[0049] In one embodiment, the electronic device (101) may include a processor (210). For example, the processor (210) may include an application processor (AP) (e.g., the main processor (121) of FIG. 1) and / or a communication processor (CP) (e.g., the auxiliary processor (123) of FIG. 1). For example, the processor (210) may control the RF transceiver (220) through a control interface (e.g., a mobile industry processor interface (MIPI)). The processor (210) may control the RF transceiver (220) so that a signal is transmitted through an antenna. The processor (210) may control the RF transceiver (220) so that a signal is received.

[0050] In one embodiment, the electronic device (101) may include an RF transceiver (220). For example, the RF transceiver (220) may be implemented as part of a single chip (e.g., a radio frequency integrated circuit (RFIC)) or a single package. For example, the RF transceiver (220) may include a digital-to-analog converter (DAC) for converting a digital signal into an analog signal. The RF transceiver (220) may include a mixer and an oscillator (e.g., a local oscillator (LO) or a voltage-controlled oscillator (VCO)) for up-conversion. The RF transceiver (220) may convert a baseband signal generated by the processor (210) into an RF signal. The RF transceiver (220) may include one or more transmission ports. In the example illustrated in FIG. 2, the RF transceiver (220) may include a first transmission port (221), a second transmission port (222), a third transmission port (223), a fourth transmission port (224), a fifth transmission port (225), and a sixth transmission port (226). However, the number of transmission ports illustrated in FIG. 2 is merely an example, and the present disclosure is not limited thereto. The RF transceiver (220) may provide an RF signal converted from a baseband signal to a power amplifier (241) of an RFFE module (240) using the first transmission port (221). For example, the RF transceiver (220) may include an analog-to-digital converter (ADC) for converting an analog signal into a digital signal. The RF transceiver (220) may include a mixer and an oscillator for down-conversion.The RF transceiver (220) can convert an RF signal received from an antenna into a baseband signal so that it can be processed by a processor (210). Although not illustrated, the RF transceiver (220) may include one or more receiving ports.

[0051] In one embodiment, the processor (210) and / or RF transceiver (220) may control at least some of the PMIC (230), power supply circuit (236), and RFFE module (240) through a control interface (e.g., MIPI). For example, the processor (210) and / or RF transceiver (220) may control the PMIC (230) through the control interface to obtain a voltage value of the ADC port (231). For example, the processor (210) and / or RF transceiver (220) may control the power supply circuit (236) through the control interface to provide or not provide a supply voltage. For example, the processor (210) and / or RF transceiver (220) can control the RFFE module (240) through a control interface so that the switch circuit (245) connects or does not connect the power path (237) of the thermistor (235) and the power supply circuit (236).

[0052] In one embodiment, the electronic device (101) may include a PMIC (230) and a power supply circuit (236) for powering the components of the electronic device (101). For example, the PMIC (230) may provide a fixed voltage (e.g., 1.8 V) to the thermistor (235) using a low dropout (LDO) module (e.g., LDO module (312), LDO module (322) of FIG. 3). The PMIC (230) may identify (or measure) the voltage value of the ADC port (231) using an ADC module (e.g., ADC module (311), ADC module (321) of FIG. 3). For example, the voltage value of the ADC port (231) measured while the switch circuit (245) connects the thermistor (235) and the power path (237) of the power supply circuit (236) may correspond to the parallel resistance value of the thermistor (235) and the power amplifier (241). For example, the voltage value of the ADC port (231) measured while the switch circuit (245) does not connect the thermistor (235) and the power path (237) of the power supply circuit (236) may correspond to the resistance value of the thermistor (235). The power supply circuit (236) may be configured to provide a voltage (hereinafter referred to as supply voltage) (Vcc) to the power amplifier (241) of the RFFE module (240) through the power path (237). The power supply circuit (236) can generate a supply voltage based on a battery voltage provided from the battery of the electronic device (101) (e.g., battery (189) of FIG. 1). The power supply circuit (236) can generate a supply voltage by boosting and / or lowering the battery voltage. To generate a supply voltage, the power supply circuit (236) may include at least one circuit for DC (direct current)-DC converting.

[0053] In one embodiment, the electronic device (101) may include a thermistor (235). The thermistor (235) may be a device having a resistance value that varies with temperature. The thermistor (235) may be placed around (or inside) the RFFE module (240) to measure the temperature of the power amplifier (241). In one example, if the temperature of the power amplifier (241) increases, the resistance value of the thermistor (235) may increase. If the temperature of the power amplifier (241) decreases, the resistance value of the thermistor (235) may decrease. A thermistor (235) whose resistance value is proportional to temperature may be referred to as a positive temperature coefficient (PTC) thermistor. In another example, if the temperature of the power amplifier (241) increases, the resistance value of the thermistor (235) may decrease. If the temperature of the power amplifier (241) decreases, the resistance value of the thermistor (235) may increase. A thermistor (235) in which the resistance value is inversely proportional to the temperature may be referred to as an NTC (negative temperature coefficient) thermistor. In the present disclosure, the thermistor (235) may be used to detect whether power amplifiers included in the electronic device (101) are damaged, in addition to measuring the temperature of the power amplifier (241). The thermistor (235) may be referred to as a thermistor circuit or other terms having an equivalent technical / functional meaning, in addition to being a thermistor.

[0054] In one embodiment, the electronic device (101) may include an RFFE module (240). Wireless communication systems are evolving in a direction to support higher data transmission rates to meet the continuously increasing demand for wireless data traffic. To support various frequency combinations, a plurality of transmit (Tx) / receive (Rx) modules (e.g., RFFE modules (240)) may be placed around an RF transceiver (220). For example, the RFFE module (240) may be a PAMid including a power amplifier (241) and RF components for processing the transmit signal (e.g., a duplexer, a filter). For example, the RFFE module (240) may be an LPAMid including a low noise amplifier (LNA). For example, the RFFE module (240) may be a power amplifier module including a power amplifier (241) and a control circuit for the power amplifier (241). In the example illustrated in FIG. 2, the RFFE module (240) may include a power amplifier (241) and a switch circuit (245). The power amplifier (241) may amplify an RF signal provided from an RF transceiver (220) through a first transmission port (221). The power amplifier (241) may radiate the RF signal into the air by providing the amplified RF signal to an antenna. The switch circuit (245) may be controlled to connect or disconnect the power path (237) of the thermistor (235) and the power supply circuit (236) according to the control of the processor (210) and / or the RF transceiver (220). Although not shown in FIG. 2, the RFFE module (240) may further include a control circuit for controlling a switch circuit (245) inside the RFFE module (240) or for controlling the bias voltage of a power amplifier (241). The control circuit may be used to control internal components of the RFFE module (240).In addition to being a control circuit, the control circuit may be referred to as a control unit, a controller, a logic circuit, a CMOS (complementary metal-oxide-semiconductor) controller, a CMOS logic circuit, a CMOS control circuit, a control logic circuit, an RFFE controller, an RFFE control circuit, an RFFE module control circuit, and / or other terms having an equivalent technical or functional meaning.

[0055] In the example illustrated in FIG. 2, the operations of an electronic device (101) for detecting whether a power amplifier (241) is damaged are described. At least some of the operations of the electronic device (101) may be controlled by a processor (210) and / or an RF transceiver (220). For example, control by the processor (210) and / or the RF transceiver (220) may be based on MIPI commands.

[0056] In one embodiment, the electronic device (101) may detect (or identify) an event. For example, the event may identify the booting of the electronic device (101) and / or the deactivation of an operating mode (e.g., airplane mode) for deactivating the communication circuits of the electronic device (101) (e.g., RF transceiver (220), PMIC (230), power supply circuit (236), and at least part of the RFFE module (240). Based on identifying the event, the electronic device (101) may control the RFFE module (240) so that the switch circuit (245) connects the thermistor (235) and the power path (237) of the power supply circuit (236). While the switch circuit is controlled, the power supply circuit (236) may be controlled not to provide a supply voltage through the power path (237). By controlling the switch circuit (245), the power amplifier (241) and the thermistor (235) can be connected in parallel.

[0057] In one embodiment, the electronic device (101) can identify (or measure, acquire) the voltage value of the ADC port (231) of the PMIC (230) while the power amplifier (241) and the thermistor (235) are connected in parallel. The PMIC (230) can provide a fixed voltage (e.g., 1.8 V) using an LDO module. The voltage value of the ADC port (231) can be identified (or measure, acquire) by the ADC module of the PMIC (230). The voltage value of the ADC port (231) may mean the voltage value distributed to the parallel resistor among the pull-up resistor (e.g., about 10 kΩ) and the parallel resistor between the power amplifier (241) and the thermistor (235) with respect to the voltage provided by the LDO module. For example, the voltage value of the ADC port (231) can correspond to the parallel resistance value between the power amplifier (241) and the thermistor (235).

[0058] In one example, if the power amplifier (241) is not damaged, the resistance value of the power amplifier (241) may be a first value (e.g., 2328.57 kΩ). If the power amplifier (241) is not damaged, the parallel resistance value of the power amplifier (241) and the thermistor (235) (e.g., 100 kΩ) may be a second value (e.g., 95.88 kΩ). The voltage value distributed to the parallel resistance from the voltage provided by the LDO module of the PMIC (230) may be 1.63 V. In another example, if the power amplifier (241) is damaged, the resistance value of the power amplifier (241) may be a third value (e.g., 0 Ω). If the power amplifier (241) is damaged, the parallel resistance value of the power amplifier (241) and the thermistor (235) may be a fourth value (e.g., 0 Ω). The voltage value distributed to the parallel resistor among the voltages provided by the LDO module of the PMIC (230) may be 0V. As illustrated, if the power amplifier (241) is damaged, the voltage value identified (or acquired) by the ADC module of the PMIC (230) may be close to 0V.

[0059] In one embodiment, the electronic device (101) can identify whether the power amplifier (241) is damaged based on the identified (or acquired) voltage value. For example, the electronic device (101) can identify whether the voltage value exceeds a threshold voltage value (e.g., 0.9 V). For example, the electronic device (101) can identify that the power amplifier (241) is not damaged based on the identification that the voltage value exceeds the threshold voltage value. For example, the electronic device (101) can identify that the power amplifier (241) is damaged based on the identification that the voltage value is below the threshold voltage value. The RFFE module (240) may be configured to refrain from using the power amplifier (241) if the power amplifier (241) is damaged. Although not shown, the electronic device (101) can control the RFFE module (240) using a switch circuit so that, in the event that the power amplifier (241) is damaged, the power path (237) of the power amplifier (241) and the power supply circuit (236) is not connected.

[0060] In one embodiment, after identification of whether the power amplifier (241) is damaged is performed, the electronic device (101) may control the RFFE module (240) so as not to connect the thermistor (235) and the power path (237) of the power supply circuit (236). The electronic device (101) may control the power supply circuit (236) to provide a supply voltage through the power path (237). While the switch circuit (245) does not connect the thermistor (235) and the power path (237), the voltage value obtained by the PMIC (230) may indicate the temperature of the power amplifier (241).

[0061] FIG. 3 illustrates an example of a power management integrated circuit (PMIC) for measuring the voltage of a thermistor. In FIG. 3, a first structure (310) in which a pull-up resistor is placed inside the PMIC (230) and a second structure (320) in which a pull-up resistor is placed outside the PMIC (230) are described.

[0062] Referring to FIG. 3, in the first structure (310), the PMIC (230) of the electronic device (101) may include an analog-to-digital converter (ADC) module (311) and a low drop-out (LDO) module (312). A pull-up resistor (313) may be placed outside the PMIC (230). The PMIC (230) may be configured to identify (or measure, acquire) the voltage value of the ADC port (231) under the control of the processor (210) and / or the RF transceiver (220). For example, the PMIC (230) may be controlled to provide a fixed voltage (e.g., 1.8 V) using the LDO module (312). The voltage value of the ADC port (231) may be identified (or measured, acquired) by the ADC module (311) of the PMIC (230). The voltage value of the ADC port (231) may be the voltage value distributed to the parallel resistor among the pull-up resistor and the parallel resistor of the power amplifier and thermistor (235) with respect to the voltage provided by the LDO module (312). For example, the voltage value of the ADC port (231) may correspond to the parallel resistor value of the power amplifier and thermistor (235).

[0063] In the second structure (320), the PMIC (230) of the electronic device (101) may include an ADC module (321), an LDO module (322), and a pull-up resistor (323). The pull-up resistor (323) may be placed inside the PMIC (230). The PMIC (230) may be configured to identify (or measure, acquire) the voltage value of the ADC port (231) under the control of the processor (210) and / or the RF transceiver (220). For example, the PMIC (230) may be controlled to provide a fixed voltage (e.g., 1.8 V) using the LDO module (322). The voltage value of the ADC port (231) may be identified (or measured, acquired) by the ADC module (321) of the PMIC (230). The voltage value of the ADC port (231) may be the voltage value distributed to the parallel resistor among the pull-up resistor and the parallel resistor of the power amplifier and thermistor (235) with respect to the voltage provided by the LDO module (322). For example, the voltage value of the ADC port (231) may correspond to the parallel resistor value of the power amplifier and thermistor (235).

[0064] FIG. 4 illustrates components of an electronic device for detecting damage to a power amplifier. In FIG. 4, the operations of an electronic device (101) for detecting (or identifying) whether a power amplifier (PA) (241) and a power amplifier (251) are damaged are described in a circuit structure in which RFFE (radio frequency front end) modules are arranged. The same reference numerals may be used for the same descriptions. Descriptions of FIG. 2 and FIG. 3 may be used for FIG. 4.

[0065] In FIG. 4, a thermistor (235) used to detect (or identify) whether power amplifiers are damaged may be placed inside the first RFFE module (240). However, this is merely an example and the present disclosure is not limited thereto. For example, the thermistor (235) may be placed inside another RFFE module (e.g., the second RFFE module (250)).

[0066] Referring to FIG. 4, an electronic device (101) according to one embodiment may include a processor (210), an RF (radio frequency) transceiver (220), a PMIC (power management integrated circuit) (230), a power supply circuit (236), a first RFFE module (240), and a second RFFE module (250). Operations performed by the electronic device (101) may be controlled by the processor (210) and / or the RF transceiver (220). In the following, operations performed by the electronic device (101) may be based on control according to a MIPI (mobile industry processor interface) command of the processor (210) and / or the RF transceiver (220).

[0067] In one embodiment, the first RFFE module (240) may include a power amplifier (241), a thermistor (235), a first switch circuit (401), and a second switch circuit (402). For example, the power amplifier (241) may receive an RF signal from an RF transceiver (220) through a first transmission port (221). The power amplifier (241) may amplify the received RF signal. The power amplifier (241) may radiate the RF signal into the air by providing the amplified RF signal to an antenna connected to the first RFFE module (240). For example, the first switch circuit (401) may be configured to selectively connect or disconnect the power path (237) of the thermistor (235) and the power supply circuit (236) according to the control of the processor (210) and / or the RF transceiver (220). For example, the second switch circuit (402) may be configured to selectively connect or disconnect the power path (237) of the power amplifier (241) and the power supply circuit (236) according to the control of the processor (210) and / or the RF transceiver (220).

[0068] In one embodiment, the second RFFE module (250) may include a power amplifier (251) and a third switch circuit (403). For example, the power amplifier (251) may receive an RF signal from an RF transceiver (220) through a second transmission port (222). The power amplifier (251) may amplify the received RF signal. The power amplifier (251) may radiate the RF signal into the air by providing the amplified RF signal to an antenna connected to the second RFFE module (250). For example, the third switch circuit (403) may be configured to selectively connect or disconnect the power path (237) of the power amplifier (251) and the power supply circuit (236) under the control of the processor (210) and / or the RF transceiver (220).

[0069] In one embodiment, the electronic device (101) may detect (or identify) an event. For example, the event may include the booting of the electronic device (101) and / or the deactivation of an operating mode (e.g., airplane mode) for deactivating the communication circuits of the electronic device (101) (e.g., RF transceiver (220), PMIC (230), power supply circuit (236), first RFFE module (240), and at least part of the second RFFE module (250). Based on detecting the event, the electronic device (101) may control the first RFFE module (240) so that the first switch circuit (401) connects the thermistor (235) and the power path (237) of the power supply circuit (236). The electronic device (101) can control the first RFFE module (240) so that the second switch circuit (402) connects the power amplifier (241) and the power path (237) of the power supply circuit (236) based on detecting an event. The electronic device (101) can control the second RFFE module (250) so that the third switch circuit (403) does not connect the power amplifier (251) and the power path (237) of the power supply circuit (236) based on detecting an event. While the switch circuits are being controlled, the power supply circuit (236) can be controlled so that it does not provide a supply voltage through the power path (237). By controlling the switch circuits, other power amplifiers (e.g., power amplifier (251)) other than the power amplifier (241) may not be connected to the thermistor (235). By controlling the switch circuits, the power amplifier (241) and the thermistor (235) can be connected in parallel.

[0070] In one embodiment, the electronic device (101) can identify (or measure, acquire) the voltage value of the analog-to-digital converter (ADC) port (231) of the PMIC (230) while the power amplifier (241) and the thermistor (235) are connected in parallel. The PMIC (230) can provide a fixed voltage (e.g., 1.8 V) using a low drop-out (LDO) module. The voltage value of the ADC port (231) can be identified (or measured, acquire) by the ADC module of the PMIC (230). The voltage value of the ADC port (231) may be the voltage value distributed to the parallel resistor among the pull-up resistor and the parallel resistor of the power amplifier (241) and thermistor (235) with respect to the voltage provided by the LDO module. For example, the voltage value of the ADC port (231) can correspond to the parallel resistance value of the power amplifier (241) and the thermistor (235).

[0071] In one embodiment, the electronic device (101) can identify whether the power amplifier (241) is damaged based on the identified (or measured, acquired) voltage value. For example, the electronic device (101) can identify whether the voltage value exceeds a threshold voltage value (e.g., 0.9V). For example, the electronic device (101) can identify that the power amplifier (241) is not damaged based on the identification that the voltage value exceeds the threshold voltage value. For example, the electronic device (101) can identify that the power amplifier (241) is damaged based on the identification that the voltage value is below the threshold voltage value. Based on identifying that the power amplifier (241) is damaged, the electronic device (101) can control the first RFFE module (240) so that the second switch circuit (402) does not connect the power amplifier (241) and the power path (237) of the power supply circuit (236). The first RFFE module (240) may be configured to refrain from using the power amplifier (241) by the above control. By opening the second switch circuit (402), other power amplifiers (e.g., power amplifier (251)) connected to the power path (237) may not be affected by the damaged power amplifier (241).

[0072] In one embodiment, the electronic device (101) may control the first RFFE module (240) so that, after identification is performed regarding whether the power amplifier (241) is damaged, the second switch circuit (402) does not connect the power path (237) of the power amplifier (241) and the power supply circuit (236). The electronic device (101) may control the second RFFE module (250) so that, after the identification is performed, the third switch circuit (403) connects the power amplifier (251) and the power path (237) of the power supply circuit (236). By controlling the switch circuits, other power amplifiers other than the power amplifier (251) (e.g., power amplifier (241)) may not be connected to the thermistor (235). By controlling the switch circuits, the power amplifier (251) and the thermistor (235) may be connected in parallel.

[0073] In one embodiment, the electronic device (101) can identify (or measure, acquire) the voltage value of the ADC port (231) of the PMIC (230) while the power amplifier (251) and the thermistor (235) are connected in parallel. The PMIC (230) can provide a fixed voltage (e.g., 1.8V) using an LDO module. The voltage value of the ADC port (231) can be identified (or measured, acquire) by the ADC module of the PMIC (230). The voltage value of the ADC port (231) may be the voltage value distributed to the parallel resistor among the pull-up resistor and the parallel resistor of the power amplifier (251) and thermistor (235) with respect to the voltage provided by the LDO module. For example, the voltage value of the ADC port (231) may correspond to the parallel resistor value of the power amplifier (251) and thermistor (235).

[0074] In one embodiment, the electronic device (101) can identify whether the power amplifier (251) is damaged based on the identified (or measured, acquired) voltage value. For example, the electronic device (101) can identify whether the voltage value exceeds a threshold voltage value (e.g., 0.9V). For example, the electronic device (101) can identify that the power amplifier (251) is not damaged based on the identification that the voltage value exceeds the threshold voltage value. For example, the electronic device (101) can identify that the power amplifier (251) is damaged based on the identification that the voltage value is below the threshold voltage value. Based on identifying that the power amplifier (251) is damaged, the electronic device (101) can control the second RFFE module (250) so that the third switch circuit (403) does not connect the power amplifier (251) and the power path (237) of the power supply circuit (236). The second RFFE module (250) can be configured to refrain from using the power amplifier (251) by the above control. By keeping the third switch circuit (403) in an open state, other power amplifiers connected to the power path (237) can be prevented from being affected by the damaged power amplifier (251).

[0075] In one embodiment, the electronic device (101) can control the first RFFE module (240) so that the first switch circuit (401) does not connect the power path (237) of the thermistor (235) and the power supply circuit (236) after identifying whether there is damage to all power amplifiers of the electronic device (101) (e.g., power amplifier (241), power amplifier (251)). The thermistor (235) can be used to measure the temperature of the power amplifier (241).

[0076] FIG. 5 illustrates components of an electronic device for detecting damage to a power amplifier. In FIG. 5, the operations of an electronic device (101) for detecting (or identifying) whether a power amplifier (PA) (241), a power amplifier (242), and a power amplifier (251) are damaged are described in a circuit structure in which RFFE (radio frequency front end) modules are arranged. The same reference numerals may be used for the same descriptions. Descriptions of FIG. 2 and FIG. 3 may be used for FIG. 5.

[0077] In FIG. 5, a thermistor (235) used to detect (or identify) whether power amplifiers are damaged may be placed inside the first RFFE module (240). However, this is merely an example and the present disclosure is not limited thereto. For example, the thermistor (235) may be placed inside another RFFE module (e.g., the second RFFE module (250)).

[0078] Referring to FIG. 5, an electronic device (101) according to one embodiment may include a processor (210), an RF (radio frequency) transceiver (220), a PMIC (power management integrated circuit) (230), a power supply circuit (236), a first RFFE module (240), and a second RFFE module (250). Operations performed by the electronic device (101) may be controlled by the processor (210) and / or the RF transceiver (220). In the following, operations performed by the electronic device (101) may be based on control according to a MIPI (mobile industry processor interface) command of the processor (210) and / or the RF transceiver (220).

[0079] In one embodiment, the first RFFE module (240) may include a power amplifier (241), a power amplifier (242), a thermistor (235), a first switch circuit (501), a second switch circuit (502), and a third switch circuit (503). For example, the power amplifier (241) may receive an RF signal from an RF transceiver (220) through a first transmission port (221). The power amplifier (241) may amplify the received RF signal. The power amplifier (241) may radiate the RF signal into the air by providing the amplified RF signal to an antenna connected to the first RFFE module (240). For example, the power amplifier (242) may receive an RF signal from an RF transceiver (220) through a second transmission port (222). The power amplifier (242) may amplify the received RF signal. The power amplifier (242) can radiate an RF signal into the air by providing the amplified RF signal to an antenna connected to the first RFFE module (240). For example, the first switch circuit (501) may be configured to selectively connect or disconnect the power path (237) of the thermistor (235) and the power supply circuit (236) under the control of the processor (210) and / or the RF transceiver (220). For example, the second switch circuit (502) may be configured to selectively connect or disconnect the power path (237) of the power amplifier (241) and the power supply circuit (236) under the control of the processor (210) and / or the RF transceiver (220). For example, the third switch circuit (503) may be configured to selectively connect or disconnect the power path (237) of the power amplifier (242) and the power supply circuit (236) according to the control of the processor (210) and / or the RF transceiver (220).

[0080] In one embodiment, the second RFFE module (250) may include a power amplifier (251) and a fourth switch circuit (504). For example, the power amplifier (251) may receive an RF signal from an RF transceiver (220) through a third transmission port (223). The power amplifier (251) may amplify the received RF signal. The power amplifier (251) may radiate the RF signal into the air by providing the amplified RF signal to an antenna connected to the second RFFE module (250). For example, the fourth switch circuit (504) may be configured to selectively connect or disconnect the power path (237) of the power amplifier (251) and the power supply circuit (236) under the control of the processor (210) and / or the RF transceiver (220).

[0081] In one embodiment, the electronic device (101) may detect (or identify) an event. For example, the event may include the booting of the electronic device (101) and / or the deactivation of an operating mode (e.g., airplane mode) for deactivating the communication circuits of the electronic device (101) (e.g., RF transceiver (220), PMIC (230), power supply circuit (236), first RFFE module (240), and at least part of the second RFFE module (250). Based on detecting the event, the electronic device (101) may control the first RFFE module (240) so that the first switch circuit (501) connects the thermistor (235) and the power path (237) of the power supply circuit (236). The electronic device (101) can control the first RFFE module (240) based on detecting an event so that the second switch circuit (502) connects the power path (237) of the power amplifier (241) and the power supply circuit (236). The electronic device (101) can control the first RFFE module (240) based on detecting an event so that the third switch circuit (503) does not connect the power path (237) of the power amplifier (242) and the power supply circuit (236). The electronic device (101) can control the second RFFE module (250) based on detecting an event so that the fourth switch circuit (504) does not connect the power path (237) of the power amplifier (251) and the power supply circuit (236). By controlling the switch circuits, other power amplifiers other than the power amplifier (241) (e.g., power amplifier (242), power amplifier (251)) may not be connected to the thermistor (235). By controlling the switch circuits, the power amplifier (241) and the thermistor (235) may be connected in parallel.

[0082] In one embodiment, the electronic device (101) can identify (or measure, acquire) the voltage value of the analog-to-digital (ADC) port (231) of the PMIC (230) while the power amplifier (241) and the thermistor (235) are connected in parallel. The PMIC (230) can provide a fixed voltage (e.g., 1.8 V) using a low drop-out (LDO) module. The voltage value of the ADC port (231) can be identified (or measured, acquire) by the ADC module of the PMIC (230). The voltage value of the ADC port (231) may be the voltage value distributed to the parallel resistor among the pull-up resistor and the parallel resistor of the power amplifier (241) and thermistor (235) with respect to the voltage provided by the LDO module. For example, the voltage value of the ADC port (231) can correspond to the parallel resistance value of the power amplifier (241) and the thermistor (235).

[0083] In one embodiment, the electronic device (101) can identify whether the power amplifier (241) is damaged based on an identified (or, measured, acquired) voltage value. For example, the electronic device (101) can identify whether the voltage value exceeds a threshold voltage value (e.g., 0.9V). For example, the electronic device (101) can identify that the power amplifier (241) is not damaged based on the identification that the voltage value exceeds the threshold voltage value. For example, the electronic device (101) can identify that the power amplifier (241) is damaged based on the identification that the voltage value is below the threshold voltage value. Based on identifying that the power amplifier (241) is damaged, the electronic device (101) can control the first RFFE module (240) so that the second switch circuit (502) does not connect the power amplifier (241) and the power path (237) of the power supply circuit (236). The first RFFE module (240) may be configured to refrain from using the power amplifier (241) by the above control. By keeping the second switch circuit (502) in an open state, other power amplifiers (e.g., power amplifier (242), power amplifier (251)) connected to the power path (237) may not be affected by the damaged power amplifier (241).

[0084] In one embodiment, the electronic device (101) may control the first RFFE module (240) so that, after identification is performed regarding whether the power amplifier (241) is damaged, the second switch circuit (502) does not connect the power path (237) of the power amplifier (241) and the power supply circuit (236). The electronic device (101) may control the first RFFE module (240) so that, after the identification is performed, the third switch circuit (503) connects the power amplifier (242) and the power path (237) of the power supply circuit (236). By controlling the switch circuits, other power amplifiers other than the power amplifier (242) (e.g., power amplifier (241), power amplifier (251)) may not be connected to the thermistor (235). By controlling the switch circuits, the power amplifier (242) and the thermistor (235) may be connected in parallel.

[0085] In one embodiment, the electronic device (101) can identify (or measure, acquire) the voltage value of the ADC port (231) of the PMIC (230) while the power amplifier (242) and the thermistor (235) are connected in parallel. The PMIC (230) can provide a fixed voltage (e.g., 1.8 V) using an LDO module. The voltage value of the ADC port (231) can be identified (or measured, acquire) by the ADC module of the PMIC (230). The voltage value of the ADC port (231) may be the voltage value distributed to the parallel resistor among the pull-up resistor and the parallel resistor of the power amplifier (242) and thermistor (235) with respect to the voltage provided by the LDO module. For example, the voltage value of the ADC port (231) may correspond to the parallel resistor value of the power amplifier (242) and thermistor (235).

[0086] In one embodiment, the electronic device (101) can identify whether the power amplifier (242) is damaged based on the identified (or measured, acquired) voltage value. For example, the electronic device (101) can identify whether the voltage value exceeds a threshold voltage value (e.g., 0.9V). For example, the electronic device (101) can identify that the power amplifier (242) is not damaged based on the identification that the voltage value exceeds the threshold voltage value. For example, the electronic device (101) can identify that the power amplifier (242) is damaged based on the identification that the voltage value is below the threshold voltage value. Based on identifying that the power amplifier (242) is damaged, the electronic device (101) can control the first RFFE module (240) so that the third switch circuit (503) does not connect the power amplifier (242) and the power path (237) of the power supply circuit (236). The first RFFE module (240) may be configured to refrain from using the power amplifier (242) by the above control. By keeping the third switch circuit (503) in an open state, other power amplifiers connected to the power path (237) may not be affected by the damaged power amplifier (242).

[0087] In one embodiment, the electronic device (101) may control the first RFFE module (240) so that the third switch circuit (503) does not connect the power amplifier (242) to the power path (237) of the power supply circuit (236) after identification is performed on whether the power amplifier (242) is damaged. The electronic device (101) may control the second RFFE module (250) so that the fourth switch circuit (504) connects the power amplifier (251) to the power path (237) of the power supply circuit (236) after the identification is performed. By controlling the switch circuits, other power amplifiers other than the power amplifier (251) (e.g., power amplifier (241), power amplifier (242)) may not be connected to the thermistor (235). By controlling the switch circuits, the power amplifier (251) and the thermistor (235) may be connected in parallel.

[0088] In one embodiment, the electronic device (101) can identify (or measure, acquire) the voltage value of the ADC port (231) of the PMIC (230) while the power amplifier (251) and the thermistor (235) are connected in parallel. The PMIC (230) can provide a fixed voltage (e.g., 1.8V) using an LDO module. The voltage value of the ADC port (231) can be identified (or measured, acquire) by the ADC module of the PMIC (230). The voltage value of the ADC port (231) may be the voltage value distributed to the parallel resistor among the pull-up resistor and the parallel resistor of the power amplifier (251) and thermistor (235) with respect to the voltage provided by the LDO module. For example, the voltage value of the ADC port (231) may correspond to the parallel resistor value of the power amplifier (251) and thermistor (235).

[0089] In one embodiment, the electronic device (101) can identify whether the power amplifier (251) is damaged based on the identified (or measured, acquired) voltage value. For example, the electronic device (101) can identify whether the voltage value exceeds a threshold voltage value (e.g., 0.9V). For example, the electronic device (101) can identify that the power amplifier (251) is not damaged based on the identification that the voltage value exceeds the threshold voltage value. For example, the electronic device (101) can identify that the power amplifier (251) is damaged based on the identification that the voltage value is below the threshold voltage value. Based on identifying that the power amplifier (251) is damaged, the electronic device (101) can control the second RFFE module (250) so that the fourth switch circuit (504) does not connect the power amplifier (251) and the power path (237) of the power supply circuit (236). The second RFFE module (250) can be configured to refrain from using the power amplifier (251) by the above control. By keeping the fourth switch circuit (504) in an open state, other power amplifiers connected to the power path (237) can be prevented from being affected by the damaged power amplifier (251).

[0090] In one embodiment, the electronic device (101) can control the first RFFE module (240) so that the first switch circuit (501) does not connect the power path (237) of the thermistor (235) and the power supply circuit (236) after identifying whether there is damage to all power amplifiers of the electronic device (101) (e.g., power amplifier (241), power amplifier (242), power amplifier (251)). The thermistor (235) can be used to measure the temperature of the power amplifier (241).

[0091] FIG. 6 illustrates components of an electronic device for detecting damage to a power amplifier. In FIG. 6, in a circuit structure in which RFFE (radio frequency front end) modules are arranged, the operations of an electronic device (101) for detecting (or identifying) whether a power amplifier (PA) (241), power amplifier (251), power amplifier (261), power amplifier (271), power amplifier (281), and power amplifier (282) are damaged are described. The same reference numerals may be used for the same descriptions. Descriptions of FIG. 2 and FIG. 3 may be used for FIG. 6.

[0092] In FIG. 6, a thermistor (235) used to detect (or identify) whether power amplifiers are damaged may be placed inside the first RFFE module (240). However, this is merely an example and the present disclosure is not limited thereto. For example, the thermistor (235) may be placed inside another RFFE module.

[0093] Referring to FIG. 6, an electronic device (101) according to one embodiment may include a processor (210), an RF (radio frequency) transceiver (220), a PMIC (power management integrated circuit) (230), a first power supply circuit (236), a second power supply circuit (238), a first RFFE module (240), a second RFFE module (250), a third RFFE module (260), a fourth RFFE module (270), and a fifth RFFE module (280). Operations performed by the electronic device (101) may be controlled by the processor (210) and / or the RF transceiver (220). In the following, operations performed by the electronic device (101) may be based on control according to a MIPI (mobile industry processor interface) command of the processor (210) and / or the RF transceiver (220).

[0094] In one embodiment, the first RFFE module (240) may include a power amplifier (241), a thermistor (235), a first switch circuit (601), a second switch circuit (602), and a third switch circuit (603). For example, the power amplifier (241) may receive an RF signal from an RF transceiver (220) through a sixth transmission port (226). The power amplifier (241) may amplify the received RF signal. The power amplifier (241) may radiate the RF signal into the air by providing the amplified RF signal to an antenna connected to the first RFFE module (240). For example, the first switch circuit (601) may be configured to selectively connect or disconnect the thermistor (235) and the third power path (610) under the control of the processor (210) and / or the RF transceiver (220). For example, the second switch circuit (602) may be configured to selectively connect or not connect the third power path (610) to the first power path (237) of the first power supply circuit (236) or the second power path (239) of the second power supply circuit (238), depending on the control of the processor (210) and / or the RF transceiver (220). The second switch circuit (602) may be configured not to connect the third power path (610) to the first power path (237) and the second power path (239) in an idle state. The third switch circuit (603) may be configured not to selectively connect or not connect the power amplifier (241) to the third power path (610), depending on the control of the processor (210) and / or the RF transceiver (220).

[0095] In one embodiment, the second RFFE module (250) may include a power amplifier (251) and a fourth switch circuit (604). For example, the power amplifier (251) may receive an RF signal from an RF transceiver (220) through a fourth transmission port (224). The power amplifier (251) may amplify the received RF signal. The power amplifier (251) may radiate the RF signal into the air by providing the amplified RF signal to an antenna connected to the second RFFE module (250). For example, the fourth switch circuit (604) may be configured to selectively connect or disconnect the power amplifier (251) and the third power path (610) under the control of the processor (210) and / or the RF transceiver (220).

[0096] In one embodiment, the third RFFE module (260) may include a power amplifier (261) and a fifth switch circuit (605). For example, the power amplifier (261) may receive an RF signal from an RF transceiver (220) through a fifth transmission port (225). The power amplifier (261) may amplify the received RF signal. The power amplifier (261) may radiate the RF signal into the air by providing the amplified RF signal to an antenna connected to the third RFFE module (260). For example, the fifth switch circuit (605) may be configured to selectively connect or disconnect the power amplifier (261) and the third power path (610) under the control of the processor (210) and / or the RF transceiver (220).

[0097] In one embodiment, the fourth RFFE module (270) may include a power amplifier (271) and a sixth switch circuit (606). For example, the power amplifier (271) may receive an RF signal from an RF transceiver (220) through a first transmission port (221). The power amplifier (271) may amplify the received RF signal. The power amplifier (271) may radiate the RF signal into the air by providing the amplified RF signal to an antenna connected to the fourth RFFE module (270). For example, the sixth switch circuit (606) may be configured to selectively connect or disconnect the first power path (237) of the power amplifier (271) and the first power supply circuit (236) under the control of the processor (210) and / or the RF transceiver (220).

[0098] In one embodiment, the fifth RFFE module (280) may include a power amplifier (281), a power amplifier (282), a seventh switch circuit (607), and an eighth switch circuit (608). For example, the power amplifier (281) may receive an RF signal from an RF transceiver (220) through a second transmission port (222). The power amplifier (281) may amplify the received RF signal. The power amplifier (281) may radiate the RF signal into the air by providing the amplified RF signal to an antenna connected to the fifth RFFE module (280). For example, the power amplifier (282) may receive an RF signal from an RF transceiver (220) through a third transmission port (223). The power amplifier (282) may amplify the received RF signal. The power amplifier (282) can radiate the RF signal into the air by providing the amplified RF signal to the antenna connected to the fifth RFFE module (280).

[0099] In one embodiment, the electronic device (101) may detect (or identify) an event. For example, the event may include the booting of the electronic device (101) and / or the deactivation of an operating mode (e.g., airplane mode) for deactivating the communication circuits of the electronic device (101) (e.g., RF transceiver (220), PMIC (230), power supply circuit (236), at least part of the first RFFE module (240), second RFFE module (250), third RFFE module (260), fourth RFFE module (270), and fifth RFFE module (280). Based on detecting the event, the electronic device (101) may control the first RFFE module (240) so that the first switch circuit (601) connects the thermistor (235) to the third power path (610). The electronic device (101) can control the first RFFE module (240) so that the second switch circuit (602) operates in an idle state based on detecting an event. In an idle state, the second switch circuit (602) can be configured not to connect the third power path (610) to the first power path (237) and the second power path (239). The electronic device (101) can control the first RFFE module (240) so that the third switch circuit (603) connects the power amplifier (241) and the third power path (610) based on detecting an event. The electronic device (101) can control the second RFFE module (250) so that the fourth switch circuit (604) does not connect the power amplifier (251) and the third power path (610) based on detecting an event. The electronic device (101) can control the third RFFE module (260) based on detecting an event so that the fifth switch circuit (605) does not connect the power amplifier (261) and the third power path (610).The electronic device (101) can control the fourth RFFE module (270) based on detecting an event so that the sixth switch circuit (606) does not connect the first power path (237) of the power amplifier (271) and the first power supply circuit (236). The electronic device (101) can control the fifth RFFE module (280) based on detecting an event so that the seventh switch circuit (607) does not connect the second power path (239) of the power amplifier (281) and the second power supply circuit (238). The electronic device (101) can control the fifth RFFE module (280) based on detecting an event so that the eighth switch circuit (608) does not connect the second power path (239) of the power amplifier (282) and the second power supply circuit (238). By controlling the switch circuits, power amplifiers other than the power amplifier (241) may not be connected to the thermistor (235). By controlling the switch circuits, the power amplifier (241) and the thermistor (235) may be connected in parallel.

[0100] In one embodiment, the electronic device (101) can identify (or measure, acquire) the voltage value of the analog-to-digital (ADC) port (231) of the PMIC (230) while the power amplifier (241) and the thermistor (235) are connected in parallel. The PMIC (230) can provide a fixed voltage (e.g., 1.8 V) using a low drop-out (LDO) module. The voltage value of the ADC port (231) can be identified (or measured, acquire) by the ADC module of the PMIC (230). The voltage value of the ADC port (231) may be the voltage value distributed to the parallel resistor among the pull-up resistor and the parallel resistor of the power amplifier (241) and thermistor (235) with respect to the voltage provided by the LDO module. For example, the voltage value of the ADC port (231) can correspond to the parallel resistance value of the power amplifier (241) and the thermistor (235).

[0101] In one embodiment, the electronic device (101) can identify whether the power amplifier (241) is damaged based on the identified (or measured, acquired) voltage value. For example, the electronic device (101) can identify whether the voltage value exceeds a threshold voltage value (e.g., 0.9V). For example, the electronic device (101) can identify that the power amplifier (241) is not damaged based on the identification that the voltage value exceeds the threshold voltage value. For example, the electronic device (101) can identify that the power amplifier (241) is damaged based on the identification that the voltage value is below the threshold voltage value. Based on identifying that the power amplifier (241) is damaged, the electronic device (101) can control the first RFFE module (240) so that the third switch circuit (603) does not connect the power amplifier (241) to the third power path (610). The first RFFE module (240) may be configured to refrain from using the power amplifier (241) by the above control. By keeping the third switch circuit (603) in an open state, other power amplifiers connected to the power paths may not be affected by the damaged power amplifier (241).

[0102] In one embodiment, the electronic device (101) may control the first RFFE module (240) so that the third switch circuit (603) does not connect the power amplifier (241) to the third power path (610) after identification is performed on whether the power amplifier (241) is damaged. The electronic device (101) may control the second RFFE module (250) so that the fourth switch circuit (604) connects the power amplifier (251) to the third power path (610) after the identification is performed. By controlling the switch circuits, other power amplifiers other than the power amplifier (251) may not be connected to the thermistor (235). By controlling the switch circuits, the power amplifier (251) and the thermistor (235) may be connected in parallel.

[0103] In one embodiment, the electronic device (101) can identify (or measure, acquire) the voltage value of the ADC port (231) of the PMIC (230) while the power amplifier (251) and the thermistor (235) are connected in parallel. The PMIC (230) can provide a fixed voltage (e.g., 1.8V) using an LDO module. The voltage value of the ADC port (231) can be identified (or measured, acquire) by the ADC module of the PMIC (230). The voltage value of the ADC port (231) may be the voltage value distributed to the parallel resistor among the pull-up resistor and the parallel resistor of the power amplifier (251) and thermistor (235) with respect to the voltage provided by the LDO module. For example, the voltage value of the ADC port (231) may correspond to the parallel resistor value of the power amplifier (251) and thermistor (235).

[0104] In one embodiment, the electronic device (101) can identify whether the power amplifier (251) is damaged based on the identified (or measured, acquired) voltage value. For example, the electronic device (101) can identify whether the voltage value exceeds a threshold voltage value (e.g., 0.9V). For example, the electronic device (101) can identify that the power amplifier (251) is not damaged based on the identification that the voltage value exceeds the threshold voltage value. For example, the electronic device (101) can identify that the power amplifier (251) is damaged based on the identification that the voltage value is below the threshold voltage value. Based on identifying that the power amplifier (251) is damaged, the electronic device (101) can control the second RFFE module (250) so that the fourth switch circuit (604) does not connect the power amplifier (251) to the third power path (610). The second RFFE module (250) can be configured to refrain from using the power amplifier (251) by the above control. By keeping the fourth switch circuit (604) in an open state, other power amplifiers connected to the power paths can be prevented from being affected by the damaged power amplifier (251).

[0105] In one embodiment, the electronic device (101) may control the second RFFE module (250) so that the fourth switch circuit (604) does not connect the power amplifier (251) to the third power path (610) after identification is performed on whether the power amplifier (251) is damaged. The electronic device (101) may control the third RFFE module (260) so that the fifth switch circuit (605) connects the power amplifier (261) to the third power path (610) after the identification is performed. By controlling the switch circuits, other power amplifiers other than the power amplifier (261) may not be connected to the thermistor (235). By controlling the switch circuits, the power amplifier (261) and the thermistor (235) may be connected in parallel.

[0106] In one embodiment, the electronic device (101) can identify (or measure, acquire) the voltage value of the ADC port (231) of the PMIC (230) while the power amplifier (261) and the thermistor (235) are connected in parallel. The PMIC (230) can provide a fixed voltage (e.g., 1.8 V) using an LDO module. The voltage value of the ADC port (231) can be identified (or measured, acquire) by the ADC module of the PMIC (230). The voltage value of the ADC port (231) may be the voltage value distributed to the parallel resistor among the pull-up resistor and the parallel resistor of the power amplifier (261) and thermistor (235) with respect to the voltage provided by the LDO module. For example, the voltage value of the ADC port (231) may correspond to the parallel resistor value of the power amplifier (261) and thermistor (235).

[0107] In one embodiment, the electronic device (101) can identify whether the power amplifier (261) is damaged based on the identified (or measured, acquired) voltage value. For example, the electronic device (101) can identify whether the voltage value exceeds a threshold voltage value (e.g., 0.9V). For example, the electronic device (101) can identify that the power amplifier (261) is not damaged based on the identification that the voltage value exceeds the threshold voltage value. For example, the electronic device (101) can identify that the power amplifier (261) is damaged based on the identification that the voltage value is below the threshold voltage value. Based on identifying that the power amplifier (261) is damaged, the electronic device (101) can control the third RFFE module (260) so that the fifth switch circuit (605) does not connect the power amplifier (261) to the third power path (610). The third RFFE module (260) can be configured to refrain from using the power amplifier (261) by the above control. By keeping the fifth switch circuit (605) in an open state, other power amplifiers connected to the power paths can be prevented from being affected by the damaged power amplifier (261).

[0108] In one embodiment, the electronic device (101) may control the third RFFE module (260) so that the fifth switch circuit (605) does not connect the power amplifier (261) to the third power path (610) after the identification is performed on whether the power amplifier (261) is damaged. The electronic device (101) may control the first RFFE module (240) so that the second switch circuit (602) connects the third power path (610) to the first power path (237) after the identification is performed. The electronic device (101) may control the fourth RFFE module (270) so that the sixth switch circuit (606) connects the power amplifier (271) to the first power path (237) after the identification is performed. By controlling the switch circuits, other power amplifiers other than the power amplifier (271) may not be connected to the thermistor (235). By controlling the switch circuits, the power amplifier (271) and the thermistor (235) can be connected in parallel.

[0109] In one embodiment, the electronic device (101) can identify (or measure, acquire) the voltage value of the ADC port (231) of the PMIC (230) while the power amplifier (271) and the thermistor (235) are connected in parallel. The PMIC (230) can provide a fixed voltage (e.g., 1.8V) using an LDO module. The voltage value of the ADC port (231) can be identified (or measured, acquire) by the ADC module of the PMIC (230). The voltage value of the ADC port (231) may be the voltage value distributed to the parallel resistor among the pull-up resistor and the parallel resistor of the power amplifier (271) and thermistor (235) with respect to the voltage provided by the LDO module. For example, the voltage value of the ADC port (231) may correspond to the parallel resistor value of the power amplifier (271) and thermistor (235).

[0110] In one embodiment, the electronic device (101) can identify whether the power amplifier (271) is damaged based on the identified (or measured, acquired) voltage value. For example, the electronic device (101) can identify whether the voltage value exceeds a threshold voltage value (e.g., 0.9V). For example, the electronic device (101) can identify that the power amplifier (271) is not damaged based on the identification that the voltage value exceeds the threshold voltage value. For example, the electronic device (101) can identify that the power amplifier (271) is damaged based on the identification that the voltage value is below the threshold voltage value. Based on identifying that the power amplifier (271) is damaged, the electronic device (101) can control the fourth RFFE module (270) so that the sixth switch circuit (606) does not connect the power amplifier (271) to the first power path (237). The fourth RFFE module (270) can be configured to refrain from using the power amplifier (271) by the above control. By keeping the sixth switch circuit (606) open, other power amplifiers connected to the power paths can be prevented from being affected by the damaged power amplifier (271).

[0111] In one embodiment, the electronic device may control the fourth RFFE module (270) so that the sixth switch circuit (606) does not connect the power amplifier (271) to the first power path (237) after the identification is performed on whether the power amplifier (271) is damaged. The electronic device (101) may control the first RFFE module (240) so that the second switch circuit (602) connects the third power path (610) to the second power path (239) after the identification is performed. The electronic device (101) may control the fifth RFFE module (280) so that the seventh switch circuit (607) connects the power amplifier (281) to the second power path (239) after the identification is performed. By controlling the switch circuits, other power amplifiers other than the power amplifier (281) may not be connected to the thermistor (235). By controlling the switch circuits, the power amplifier (281) and the thermistor (235) can be connected in parallel.

[0112] In one embodiment, the electronic device (101) can identify (or measure, acquire) the voltage value of the ADC port (231) of the PMIC (230) while the power amplifier (281) and the thermistor (235) are connected in parallel. The PMIC (230) can provide a fixed voltage (e.g., 1.8 V) using an LDO module. The voltage value of the ADC port (231) can be identified (or measured, acquire) by the ADC module of the PMIC (230). The voltage value of the ADC port (231) may be the voltage value distributed to the parallel resistor among the pull-up resistor and the parallel resistor of the power amplifier (281) and thermistor (235) with respect to the voltage provided by the LDO module. For example, the voltage value of the ADC port (231) may correspond to the parallel resistor value of the power amplifier (281) and thermistor (235).

[0113] In one embodiment, the electronic device (101) can identify whether the power amplifier (281) is damaged based on the identified (or measured, acquired) voltage value. For example, the electronic device (101) can identify whether the voltage value exceeds a threshold voltage value (e.g., 0.9V). For example, the electronic device (101) can identify that the power amplifier (281) is not damaged based on the identification that the voltage value exceeds the threshold voltage value. For example, the electronic device (101) can identify that the power amplifier (281) is damaged based on the identification that the voltage value is below the threshold voltage value. Based on identifying that the power amplifier (281) is damaged, the electronic device (101) can control the fifth RFFE module (280) so that the seventh switch circuit (607) does not connect the power amplifier (281) to the second power path (239). The fifth RFFE module (280) may be configured to refrain from using the power amplifier (281) by the above control. By keeping the seventh switch circuit (607) open, other power amplifiers connected to the power paths may not be affected by the damaged power amplifier (281).

[0114] In one embodiment, the electronic device (101) may control the fifth RFFE module (280) so that the seventh switch circuit (607) does not connect the power amplifier (281) to the second power path (239) after identification is performed on whether the power amplifier (281) is damaged. The electronic device (101) may control the fifth RFFE module (280) so that the eighth switch circuit (608) connects the power amplifier (282) to the second power path (239) after the identification is performed. By controlling the switch circuits, other power amplifiers other than the power amplifier (282) may not be connected to the thermistor (235). By controlling the switch circuits, the power amplifier (282) and the thermistor (235) may be connected in parallel.

[0115] In one embodiment, the electronic device (101) can identify (or measure, acquire) the voltage value of the ADC port (231) of the PMIC (230) while the power amplifier (282) and the thermistor (235) are connected in parallel. The PMIC (230) can provide a fixed voltage (e.g., 1.8 V) using an LDO module. The voltage value of the ADC port (231) can be identified (or measured, acquire) by the ADC module of the PMIC (230). The voltage value of the ADC port (231) may be the voltage value distributed to the parallel resistor among the pull-up resistor and the parallel resistor of the power amplifier (282) and thermistor (235) with respect to the voltage provided by the LDO module. For example, the voltage value of the ADC port (231) may correspond to the parallel resistor value of the power amplifier (282) and thermistor (235).

[0116] In one embodiment, the electronic device (101) can identify whether the power amplifier (282) is damaged based on the identified (or measured, acquired) voltage value. For example, the electronic device (101) can identify whether the voltage value exceeds a threshold voltage value (e.g., 0.9V). For example, the electronic device (101) can identify that the power amplifier (282) is not damaged based on the identification that the voltage value exceeds the threshold voltage value. For example, the electronic device (101) can identify that the power amplifier (282) is damaged based on the identification that the voltage value is below the threshold voltage value. Based on identifying that the power amplifier (282) is damaged, the electronic device (101) can control the fifth RFFE module (280) so that the eighth switch circuit (608) does not connect the power amplifier (282) to the second power path (239). The fifth RFFE module (280) may be configured to refrain from using the power amplifier (282) by the above control. By keeping the eighth switch circuit (608) open, other power amplifiers connected to the power paths may not be affected by the damaged power amplifier (282).

[0117] In one embodiment, the electronic device (101) can control the first RFFE module (240) so that the first switch circuit (601) does not connect the thermistor (235) to the third power path (610) after identifying whether there is damage to all power amplifiers of the electronic device (101) (e.g., power amplifier (241), power amplifier (251), power amplifier (261), power amplifier (271), power amplifier (281), power amplifier (282)). The thermistor (235) can be used to measure the temperature of the power amplifier (241).

[0118] FIG. 7 illustrates components of an electronic device for detecting damage to a power amplifier. In FIG. 7, the operations of an electronic device (101) for detecting (or identifying) whether a power amplifier (PA) (241), a power amplifier (242), and a power amplifier (251) are damaged are described in a circuit structure in which RFFE (radio frequency front end) modules are arranged. The same reference numerals may be used for the same descriptions. Descriptions of FIG. 2 and FIG. 3 may be used for FIG. 7.

[0119] In FIG. 7, a thermistor (235) used to detect (or identify) whether power amplifiers are damaged may be placed inside the first RFFE module (240). However, this is merely an example and the present disclosure is not limited thereto. For example, the thermistor (235) may be placed inside another RFFE module.

[0120] Referring to FIG. 7, an electronic device (101) according to one embodiment may include a processor (210), an RF (radio frequency) transceiver (220), a PMIC (power management integrated circuit) (230), a first power supply circuit (236), a second power supply circuit (238), a first RFFE module (240), and a second RFFE module (250). Operations performed by the electronic device (101) may be controlled by the processor (210) and / or the RF transceiver (220). In the following, operations performed by the electronic device (101) may be based on control according to a MIPI (mobile industry processor interface) command of the processor (210) and / or the RF transceiver (220).

[0121] In one embodiment, the first RFFE module (240) may include a power amplifier (241), a power amplifier (242), a thermistor (235), a first switch circuit (701), a second switch circuit (702), a third switch circuit (703), and a fourth switch circuit (704). For example, the power amplifier (241) may receive an RF signal from an RF transceiver (220) through a first transmission port (221). The power amplifier (241) may amplify the received RF signal. The power amplifier (241) may radiate the RF signal into the air by providing the amplified RF signal to an antenna connected to the first RFFE module (240). For example, the power amplifier (242) may receive an RF signal from an RF transceiver (220) through a second transmission port (222). The power amplifier (242) may amplify the received RF signal. The power amplifier (242) can radiate an RF signal into the air by providing the amplified RF signal to an antenna connected to the first RFFE module (240). For example, the first switch circuit (701) may be configured to selectively connect or disconnect the thermistor (235) and the first power path (237) of the first power supply circuit (236) under the control of the processor (210) and / or the RF transceiver (220). For example, the second switch circuit (702) may be configured to selectively connect or disconnect the thermistor (235) and the second power path (239) of the second power supply circuit (238) under the control of the processor (210) and / or the RF transceiver (220). For example, the third switch circuit (703) may be configured to selectively connect or not connect the power path (237) of the power amplifier (241) and the first power supply circuit (236) according to the control of the processor (210) and / or RF transceiver (220).For example, the fourth switch circuit (704) may be configured to selectively connect or not connect the power path (239) of the power amplifier (242) and the second power supply circuit (238) according to the control of the processor (210) and / or RF transceiver (220).

[0122] In one embodiment, the second RFFE module (250) may include a power amplifier (251) and a fifth switch circuit (705). For example, the power amplifier (251) may receive an RF signal from an RF transceiver (220) through a third transmission port (223). The power amplifier (251) may amplify the received RF signal. The power amplifier (251) may radiate the RF signal into the air by providing the amplified RF signal to an antenna connected to the second RFFE module (250). For example, the fifth switch circuit (705) may be configured to selectively connect or disconnect the second power path (239) of the power amplifier (251) and the second power supply circuit (238) under the control of the processor (210) and / or the RF transceiver (220).

[0123] In one embodiment, the electronic device (101) may detect (or identify) an event. For example, the event may include the booting of the electronic device (101) and / or the deactivation of an operating mode (e.g., airplane mode) for deactivating the communication circuits of the electronic device (101) (e.g., RF transceiver (220), PMIC (230), first power supply circuit (236), second power supply circuit (238), first RFFE module (240), and at least part of the second RFFE module (250). Based on detecting the event, the electronic device (101) may control the first RFFE module (240) so that the first switch circuit (701) connects the thermistor (235) and the first power path (237) of the first power supply circuit (236). The electronic device (101) can control the first RFFE module (240) based on detecting an event so that the second switch circuit (702) does not connect the thermistor (235) and the second power path (239) of the second power supply circuit (236). The electronic device (101) can control the first RFFE module (240) based on detecting an event so that the third switch circuit (703) connects the power amplifier (241) and the first power path (237) of the first power supply circuit (236). The electronic device (101) can control the first RFFE module (240) based on detecting an event so that the fourth switch circuit (704) does not connect the power amplifier (242) and the second power path (239) of the second power supply circuit (238). The electronic device (101) can control the second RFFE module (250) based on detecting an event so that the fifth switch circuit (705) does not connect the power amplifier (251) and the second power path (239) of the second power supply circuit (238). By controlling the switches, other power amplifiers other than the power amplifier (241) may not be connected to the thermistor (235).By controlling the switches, the power amplifier (241) and the thermistor (235) can be connected in parallel.

[0124] In one embodiment, the electronic device (101) can identify (or measure, acquire) the voltage value of the analog-to-digital (ADC) port (231) of the PMIC (230) while the power amplifier (241) and the thermistor (235) are connected in parallel. The PMIC (230) can provide a fixed voltage (e.g., 1.8 V) using a low drop-out (LDO) module. The voltage value of the ADC port (231) can be identified (or measured, acquired) by the ADC module of the PMIC (230). The voltage value of the ADC port (231) may be the voltage value distributed to the parallel resistor among the pull-up resistor and the parallel resistor of the power amplifier (241) and thermistor (235) with respect to the voltage provided by the LDO module. For example, the voltage value of the ADC port (231) may correspond to the parallel resistor value of the power amplifier (241) and thermistor (235).

[0125] In one embodiment, the electronic device (101) can identify whether the power amplifier (241) is damaged based on the identified (or measured, acquired) voltage value. For example, the electronic device (101) can identify whether the voltage value exceeds a threshold voltage value (e.g., 0.9V). For example, the electronic device (101) can identify that the power amplifier (241) is not damaged based on the identification that the voltage value exceeds the threshold voltage value. For example, the electronic device (101) can identify that the power amplifier (241) is damaged based on the identification that the voltage value is below the threshold voltage value. Based on identifying that the power amplifier (241) is damaged, the electronic device (101) can control the first RFFE module (240) so that the third switch circuit (703) does not connect the power amplifier (241) to the first power path (237). The first RFFE module (240) can be configured to refrain from using the power amplifier (241) by the above control. By keeping the third switch circuit (703) in an open state, other power amplifiers connected to the power paths can be prevented from being affected by the damaged power amplifier (241).

[0126] In one embodiment, after identification is performed regarding whether the power amplifier (241) is damaged, the electronic device (101) may control the first RFFE module (240) so that the third switch circuit (703) does not connect the power amplifier (241) to the first power path (237) of the first power supply circuit (236). After the identification is performed, the electronic device (101) may control the first RFFE module (240) so that the first switch circuit (701) does not connect the thermistor (235) to the first power path (236) of the first power supply circuit (236). After the identification is performed, the electronic device (101) may control the first RFFE module (240) so that the second switch circuit (702) connects the thermistor (235) to the second power path (239) of the second power supply circuit (238). After the identification is performed, the electronic device (101) can control the first RFFE module (240) so that the fourth switch circuit (704) connects the power amplifier (242) and the second power path (239) of the second power supply circuit (238). By controlling the switches, other power amplifiers other than the power amplifier (242) may not be connected to the thermistor (235). By controlling the switches, the power amplifier (242) and the thermistor (235) may be connected in parallel.

[0127] In one embodiment, the electronic device (101) can identify (or measure, acquire) the voltage value of the analog-to-digital (ADC) port (231) of the PMIC (230) while the power amplifier (242) and the thermistor (235) are connected in parallel. The PMIC (230) can provide a fixed voltage (e.g., 1.8 V) using a low drop-out (LDO) module. The voltage value of the ADC port (231) can be identified (or measured, acquire) by the ADC module of the PMIC (230). The voltage value of the ADC port (231) may be the voltage value distributed to the parallel resistor among the pull-up resistor and the parallel resistor of the power amplifier (242) and thermistor (235) with respect to the voltage provided by the LDO module. For example, the voltage value of the ADC port (231) can correspond to the parallel resistance value of the power amplifier (242) and the thermistor (235).

[0128] In one embodiment, the electronic device (101) can identify whether the power amplifier (242) is damaged based on the identified (or measured, acquired) voltage value. For example, the electronic device (101) can identify whether the voltage value exceeds a threshold voltage value (e.g., 0.9V). For example, the electronic device (101) can identify that the power amplifier (242) is not damaged based on the identification that the voltage value exceeds the threshold voltage value. For example, the electronic device (101) can identify that the power amplifier (242) is damaged based on the identification that the voltage value is below the threshold voltage value. Based on identifying that the power amplifier (242) is damaged, the electronic device (101) can control the first RFFE module (240) so that the fourth switch circuit (704) does not connect the power amplifier (242) to the second power path (239). The first RFFE module (240) may be configured to refrain from using the power amplifier (242) by the above control. By keeping the fourth switch circuit (704) in an open state, other power amplifiers connected to the power paths may not be affected by the damaged power amplifier (242).

[0129] In one embodiment, after identification is performed regarding whether the power amplifier (242) is damaged, the electronic device (101) may control the first RFFE module (240) so that the fourth switch circuit (704) does not connect the power amplifier (242) to the second power path (239) of the second power supply circuit (238). After the identification is performed, the electronic device (101) may control the second RFFE module (250) so that the fifth switch circuit (705) connects the power amplifier (251) to the second power path (239) of the second power supply circuit (238). By controlling the switches, other power amplifiers other than the power amplifier (251) may not be connected to the thermistor (235). By controlling the switches, the power amplifier (251) and the thermistor (235) may be connected in parallel.

[0130] In one embodiment, the electronic device (101) can identify (or measure, acquire) the voltage value of the analog-to-digital (ADC) port (231) of the PMIC (230) while the power amplifier (251) and the thermistor (235) are connected in parallel. The PMIC (230) can provide a fixed voltage (e.g., 1.8 V) using a low drop-out (LDO) module. The voltage value of the ADC port (231) can be identified (or measured, acquire) by the ADC module of the PMIC (230). The voltage value of the ADC port (231) may be the voltage value distributed to the parallel resistor among the pull-up resistor and the parallel resistor of the power amplifier (251) and thermistor (235) with respect to the voltage provided by the LDO module. For example, the voltage value of the ADC port (231) can correspond to the parallel resistance value of the power amplifier (251) and the thermistor (235).

[0131] In one embodiment, the electronic device (101) can identify whether the power amplifier (251) is damaged based on the identified (or measured, acquired) voltage value. For example, the electronic device (101) can identify whether the voltage value exceeds a threshold voltage value (e.g., 0.9V). For example, the electronic device (101) can identify that the power amplifier (251) is not damaged based on the identification that the voltage value exceeds the threshold voltage value. For example, the electronic device (101) can identify that the power amplifier (251) is damaged based on the identification that the voltage value is below the threshold voltage value. Based on identifying that the power amplifier (251) is damaged, the electronic device (101) can control the second RFFE module (250) so that the fifth switch circuit (705) does not connect the power amplifier (251) to the second power path (239). The second RFFE module (250) can be configured to refrain from using the power amplifier (251) by the above control. By keeping the fifth switch circuit (705) in an open state, other power amplifiers connected to the power paths can be prevented from being affected by the damaged power amplifier (251).

[0132] In one embodiment, the electronic device (101) can control the first RFFE module (240) so that the first switch circuit (701) does not connect the thermistor (235) to the first power path (237) of the first power supply circuit (236) after identifying whether there is damage to all power amplifiers of the electronic device (101) (e.g., power amplifier (241), power amplifier (242), power amplifier (251)). After the identification, the electronic device (101) can control the first RFFE module (240) so that the second switch circuit (702) does not connect the thermistor (235) to the second power path (239) of the second power supply circuit (238). The thermistor (235) can be used to measure the temperature of the power amplifier (241).

[0133] FIG. 8 illustrates components of an electronic device for detecting damage to a power amplifier. In FIG. 8, the operations of an electronic device (101) for detecting (or identifying) whether a power amplifier (PA) (241) and a power amplifier (251) are damaged are described in a circuit structure in which RFFE (radio frequency front end) modules are arranged. The same reference numerals may be used for the same descriptions. Descriptions of FIG. 2 and FIG. 3 may be used for FIG. 8.

[0134] In FIG. 8, a thermistor (235) used to detect (or identify) whether power amplifiers are damaged may be placed around (or outside) the first RFFE module (240). However, this is merely an example and the present disclosure is not limited thereto. For example, the thermistor (235) may be placed around (or outside) another RFFE module (e.g., the second RFFE module (250)).

[0135] Referring to FIG. 8, an electronic device (101) according to one embodiment may include a processor (210), an RF (radio frequency) transceiver (220), a PMIC (power management integrated circuit) (230), a thermistor (235), a power supply circuit (236), a first RFFE module (240), and a second RFFE module (250). Operations performed by the electronic device (101) may be controlled by the processor (210) and / or the RF transceiver (220). In the following, operations performed by the electronic device (101) may be based on control according to a MIPI (mobile industry processor interface) command of the processor (210) and / or the RF transceiver (220).

[0136] In one embodiment, the first RFFE module (240) may include a power amplifier (241), a first switch circuit (401), and a second switch circuit (402). For example, the power amplifier (241) may receive an RF signal from an RF transceiver (220) through a first transmission port (221). The power amplifier (241) may amplify the received RF signal. The power amplifier (241) may radiate the RF signal into the air by providing the amplified RF signal to an antenna connected to the first RFFE module (240). For example, the first switch circuit (401) may be configured to selectively connect or disconnect the power path (237) of the thermistor (235) and the power supply circuit (236) according to the control of the processor (210) and / or the RF transceiver (220). For example, the second switch circuit (402) may be configured to selectively connect or disconnect the power path (237) of the power amplifier (241) and the power supply circuit (236) according to the control of the processor (210) and / or the RF transceiver (220).

[0137] In one embodiment, the second RFFE module (250) may include a power amplifier (251) and a third switch circuit (403). For example, the power amplifier (251) may receive an RF signal from an RF transceiver (220) through a second transmission port (222). The power amplifier (251) may amplify the received RF signal. The power amplifier (251) may radiate the RF signal into the air by providing the amplified RF signal to an antenna connected to the second RFFE module (250). For example, the third switch circuit (403) may be configured to selectively connect or disconnect the power path (237) of the power amplifier (251) and the power supply circuit (236) under the control of the processor (210) and / or the RF transceiver (220).

[0138] In one embodiment, the electronic device (101) may detect (or identify) an event. For example, the event may include the booting of the electronic device (101) and / or the deactivation of an operating mode (e.g., airplane mode) for deactivating the communication circuits of the electronic device (101) (e.g., RF transceiver (220), PMIC (230), power supply circuit (236), first RFFE module (240), and at least part of the second RFFE module (250). Based on detecting the event, the electronic device (101) may control the first RFFE module (240) so that the first switch circuit (401) connects the thermistor (235) and the power path (237) of the power supply circuit (236). The electronic device (101) can control the first RFFE module (240) so that the second switch circuit (402) connects the power amplifier (241) and the power path (237) of the power supply circuit (236) based on detecting an event. The electronic device (101) can control the second RFFE module (250) so that the third switch circuit (403) does not connect the power amplifier (251) and the power path (237) of the power supply circuit (236) based on detecting an event. While the switch circuits are being controlled, the power supply circuit (236) can be controlled so that it does not provide a supply voltage through the power path (237). By controlling the switch circuits, other power amplifiers (e.g., power amplifier (251)) other than the power amplifier (241) may not be connected to the thermistor (235). By controlling the switch circuits, the power amplifier (241) and the thermistor (235) can be connected in parallel.

[0139] In one embodiment, the electronic device (101) can identify (or measure, acquire) the voltage value of the analog-to-digital converter (ADC) port (231) of the PMIC (230) while the power amplifier (241) and the thermistor (235) are connected in parallel. The PMIC (230) can provide a fixed voltage (e.g., 1.8 V) using a low drop-out (LDO) module. The voltage value of the ADC port (231) can be identified (or measured, acquire) by the ADC module of the PMIC (230). The voltage value of the ADC port (231) may be the voltage value distributed to the parallel resistor among the pull-up resistor and the parallel resistor of the power amplifier (241) and thermistor (235) with respect to the voltage provided by the LDO module. For example, the voltage value of the ADC port (231) can correspond to the parallel resistance value of the power amplifier (241) and the thermistor (235).

[0140] In one embodiment, the electronic device (101) can identify whether the power amplifier (241) is damaged based on an identified (or, measured, acquired) voltage value. For example, the electronic device (101) can identify whether the voltage value exceeds a threshold voltage value (e.g., 0.9V). For example, the electronic device (101) can identify that the power amplifier (241) is not damaged based on the identification that the voltage value exceeds the threshold voltage value. For example, the electronic device (101) can identify that the power amplifier (241) is damaged based on the identification that the voltage value is below the threshold voltage value. Based on identifying that the power amplifier (241) is damaged, the electronic device (101) can control the first RFFE module (240) so that the second switch circuit (402) does not connect the power amplifier (241) and the power path (237) of the power supply circuit (236). The first RFFE module (240) may be configured to refrain from using the power amplifier (241) by the above control. By opening the second switch circuit (402), other power amplifiers (e.g., power amplifier (251)) connected to the power path (237) may not be affected by the damaged power amplifier (241).

[0141] In one embodiment, the electronic device (101) may control the first RFFE module (240) so that, after identification is performed regarding whether the power amplifier (241) is damaged, the second switch circuit (402) does not connect the power path (237) of the power amplifier (241) and the power supply circuit (236). The electronic device (101) may control the second RFFE module (250) so that, after the identification is performed, the third switch circuit (403) connects the power amplifier (251) and the power path (237) of the power supply circuit (236). By controlling the switch circuits, other power amplifiers other than the power amplifier (251) (e.g., power amplifier (241)) may not be connected to the thermistor (235). By controlling the switch circuits, the power amplifier (251) and the thermistor (235) may be connected in parallel.

[0142] In one embodiment, the electronic device (101) can identify (or measure, acquire) the voltage value of the ADC port (231) of the PMIC (230) while the power amplifier (251) and the thermistor (235) are connected in parallel. The PMIC (230) can provide a fixed voltage (e.g., 1.8V) using an LDO module. The voltage value of the ADC port (231) can be identified (or measured, acquire) by the ADC module of the PMIC (230). The voltage value of the ADC port (231) may be the voltage value distributed to the parallel resistor among the pull-up resistor and the parallel resistor of the power amplifier (251) and thermistor (235) with respect to the voltage provided by the LDO module. For example, the voltage value of the ADC port (231) may correspond to the parallel resistor value of the power amplifier (251) and thermistor (235).

[0143] In one embodiment, the electronic device (101) can identify whether the power amplifier (251) is damaged based on the identified (or measured, acquired) voltage value. For example, the electronic device (101) can identify whether the voltage value exceeds a threshold voltage value (e.g., 0.9V). For example, the electronic device (101) can identify that the power amplifier (251) is not damaged based on the identification that the voltage value exceeds the threshold voltage value. For example, the electronic device (101) can identify that the power amplifier (251) is damaged based on the identification that the voltage value is below the threshold voltage value. Based on identifying that the power amplifier (251) is damaged, the electronic device (101) can control the second RFFE module (250) so that the third switch circuit (403) does not connect the power amplifier (251) and the power path (237) of the power supply circuit (236). The second RFFE module (250) can be configured to refrain from using the power amplifier (251) by the above control. By keeping the third switch circuit (403) in an open state, other power amplifiers connected to the power path (237) can be prevented from being affected by the damaged power amplifier (251).

[0144] In one embodiment, the electronic device (101) can control the first RFFE module (240) so that the first switch circuit (401) does not connect the power path (237) of the thermistor (235) and the power supply circuit (236) after identifying whether there is damage to all power amplifiers of the electronic device (101) (e.g., power amplifier (241), power amplifier (251)). The thermistor (235) can be used to measure the temperature of the power amplifier (241).

[0145] FIG. 9 illustrates components of an electronic device for detecting damage to a power amplifier. In FIG. 9, the operations of an electronic device (101) for detecting (or identifying) whether a power amplifier (PA) (241), a power amplifier (242), and a power amplifier (251) are damaged are described in a circuit structure in which RFFE (radio frequency front end) modules are arranged. The same reference numerals may be used for the same descriptions. Descriptions of FIG. 2 and FIG. 3 may be used for FIG. 9.

[0146] In FIG. 9, a thermistor (235) used to detect (or identify) whether power amplifiers are damaged may be placed around (or outside) the first RFFE module (240). However, this is merely an example and the present disclosure is not limited thereto. For example, the thermistor (235) may be placed around (or outside) another RFFE module (e.g., the second RFFE module (250)).

[0147] Referring to FIG. 5, an electronic device (101) according to one embodiment may include a processor (210), an RF (radio frequency) transceiver (220), a PMIC (power management integrated circuit) (230), a thermistor (235), a power supply circuit (236), a first RFFE module (240), and a second RFFE module (250). Operations performed by the electronic device (101) may be controlled by the processor (210) and / or the RF transceiver (220). In the following, operations performed by the electronic device (101) may be based on control according to a MIPI (mobile industry processor interface) command of the processor (210) and / or the RF transceiver (220).

[0148] In one embodiment, the first RFFE module (240) may include a power amplifier (241), a power amplifier (242), a first switch circuit (501), a second switch circuit (502), and a third switch circuit (503). For example, the power amplifier (241) may receive an RF signal from an RF transceiver (220) through a first transmission port (221). The power amplifier (241) may amplify the received RF signal. The power amplifier (241) may radiate the RF signal into the air by providing the amplified RF signal to an antenna connected to the first RFFE module (240). For example, the power amplifier (242) may receive an RF signal from an RF transceiver (220) through a second transmission port (222). The power amplifier (242) may amplify the received RF signal. The power amplifier (242) can radiate an RF signal into the air by providing the amplified RF signal to an antenna connected to the first RFFE module (240). For example, the first switch circuit (501) may be configured to selectively connect or disconnect the power path (237) of the thermistor (235) and the power supply circuit (236) under the control of the processor (210) and / or the RF transceiver (220). For example, the second switch circuit (502) may be configured to selectively connect or disconnect the power path (237) of the power amplifier (241) and the power supply circuit (236) under the control of the processor (210) and / or the RF transceiver (220). For example, the third switch circuit (503) may be configured to selectively connect or disconnect the power path (237) of the power amplifier (242) and the power supply circuit (236) according to the control of the processor (210) and / or the RF transceiver (220).

[0149] In one embodiment, the second RFFE module (250) may include a power amplifier (251) and a fourth switch circuit (504). For example, the power amplifier (251) may receive an RF signal from an RF transceiver (220) through a third transmission port (223). The power amplifier (251) may amplify the received RF signal. The power amplifier (251) may radiate the RF signal into the air by providing the amplified RF signal to an antenna connected to the second RFFE module (250). For example, the fourth switch circuit (504) may be configured to selectively connect or disconnect the power path (237) of the power amplifier (251) and the power supply circuit (236) under the control of the processor (210) and / or the RF transceiver (220).

[0150] In one embodiment, the electronic device (101) may detect (or identify) an event. For example, the event may include the booting of the electronic device (101) and / or the deactivation of an operating mode (e.g., airplane mode) for deactivating the communication circuits of the electronic device (101) (e.g., RF transceiver (220), PMIC (230), power supply circuit (236), first RFFE module (240), and at least part of the second RFFE module (250). Based on detecting the event, the electronic device (101) may control the first RFFE module (240) so that the first switch circuit (501) connects the thermistor (235) and the power path (237) of the power supply circuit (236). The electronic device (101) can control the first RFFE module (240) based on detecting an event so that the second switch circuit (502) connects the power path (237) of the power amplifier (241) and the power supply circuit (236). The electronic device (101) can control the first RFFE module (240) based on detecting an event so that the third switch circuit (503) does not connect the power path (237) of the power amplifier (242) and the power supply circuit (236). The electronic device (101) can control the second RFFE module (250) based on detecting an event so that the fourth switch circuit (504) does not connect the power path (237) of the power amplifier (251) and the power supply circuit (236). By controlling the switch circuits, other power amplifiers other than the power amplifier (241) (e.g., power amplifier (242), power amplifier (251)) may not be connected to the thermistor (235). By controlling the switch circuits, the power amplifier (241) and the thermistor (235) may be connected in parallel.

[0151] In one embodiment, the electronic device (101) can identify (or measure, acquire) the voltage value of the analog-to-digital (ADC) port (231) of the PMIC (230) while the power amplifier (241) and the thermistor (235) are connected in parallel. The PMIC (230) can provide a fixed voltage (e.g., 1.8 V) using a low drop-out (LDO) module. The voltage value of the ADC port (231) can be identified (or measured, acquire) by the ADC module of the PMIC (230). The voltage value of the ADC port (231) may be the voltage value distributed to the parallel resistor among the pull-up resistor and the parallel resistor of the power amplifier (241) and thermistor (235) with respect to the voltage provided by the LDO module. For example, the voltage value of the ADC port (231) can correspond to the parallel resistance value of the power amplifier (241) and the thermistor (235).

[0152] In one embodiment, the electronic device (101) can identify whether the power amplifier (241) is damaged based on an identified (or, measured, acquired) voltage value. For example, the electronic device (101) can identify whether the voltage value exceeds a threshold voltage value (e.g., 0.9V). For example, the electronic device (101) can identify that the power amplifier (241) is not damaged based on the identification that the voltage value exceeds the threshold voltage value. For example, the electronic device (101) can identify that the power amplifier (241) is damaged based on the identification that the voltage value is below the threshold voltage value. Based on identifying that the power amplifier (241) is damaged, the electronic device (101) can control the first RFFE module (240) so that the second switch circuit (502) does not connect the power amplifier (241) and the power path (237) of the power supply circuit (236). The first RFFE module (240) may be configured to refrain from using the power amplifier (241) by the above control. By keeping the second switch circuit (502) in an open state, other power amplifiers (e.g., power amplifier (242), power amplifier (251)) connected to the power path (237) may not be affected by the damaged power amplifier (241).

[0153] In one embodiment, the electronic device (101) may control the first RFFE module (240) so that, after identification is performed regarding whether the power amplifier (241) is damaged, the second switch circuit (502) does not connect the power path (237) of the power amplifier (241) and the power supply circuit (236). The electronic device (101) may control the first RFFE module (240) so that, after the identification is performed, the third switch circuit (503) connects the power amplifier (242) and the power path (237) of the power supply circuit (236). By controlling the switch circuits, other power amplifiers other than the power amplifier (242) (e.g., power amplifier (241), power amplifier (251)) may not be connected to the thermistor (235). By controlling the switch circuits, the power amplifier (242) and the thermistor (235) may be connected in parallel.

[0154] In one embodiment, the electronic device (101) can identify (or measure, acquire) the voltage value of the ADC port (231) of the PMIC (230) while the power amplifier (242) and the thermistor (235) are connected in parallel. The PMIC (230) can provide a fixed voltage (e.g., 1.8 V) using an LDO module. The voltage value of the ADC port (231) can be identified (or measured, acquire) by the ADC module of the PMIC (230). The voltage value of the ADC port (231) may be the voltage value distributed to the parallel resistor among the pull-up resistor and the parallel resistor of the power amplifier (242) and thermistor (235) with respect to the voltage provided by the LDO module. For example, the voltage value of the ADC port (231) may correspond to the parallel resistor value of the power amplifier (242) and thermistor (235).

[0155] In one embodiment, the electronic device (101) can identify whether the power amplifier (242) is damaged based on the identified (or measured, acquired) voltage value. For example, the electronic device (101) can identify whether the voltage value exceeds a threshold voltage value (e.g., 0.9V). For example, the electronic device (101) can identify that the power amplifier (242) is not damaged based on the identification that the voltage value exceeds the threshold voltage value. For example, the electronic device (101) can identify that the power amplifier (242) is damaged based on the identification that the voltage value is below the threshold voltage value. Based on identifying that the power amplifier (242) is damaged, the electronic device (101) can control the first RFFE module (240) so that the third switch circuit (503) does not connect the power amplifier (242) and the power path (237) of the power supply circuit (236). The first RFFE module (240) may be configured to refrain from using the power amplifier (242) by the above control. By keeping the third switch circuit (503) in an open state, other power amplifiers connected to the power path (237) may not be affected by the damaged power amplifier (242).

[0156] In one embodiment, the electronic device (101) may control the first RFFE module (240) so that the third switch circuit (503) does not connect the power amplifier (242) to the power path (237) of the power supply circuit (236) after identification is performed on whether the power amplifier (242) is damaged. The electronic device (101) may control the second RFFE module (250) so that the fourth switch circuit (504) connects the power amplifier (251) to the power path (237) of the power supply circuit (236) after the identification is performed. By controlling the switch circuits, other power amplifiers other than the power amplifier (251) (e.g., power amplifier (241), power amplifier (242)) may not be connected to the thermistor (235). By controlling the switch circuits, the power amplifier (251) and the thermistor (235) may be connected in parallel.

[0157] In one embodiment, the electronic device (101) can identify (or measure, acquire) the voltage value of the ADC port (231) of the PMIC (230) while the power amplifier (251) and the thermistor (235) are connected in parallel. The PMIC (230) can provide a fixed voltage (e.g., 1.8V) using an LDO module. The voltage value of the ADC port (231) can be identified (or measured, acquire) by the ADC module of the PMIC (230). The voltage value of the ADC port (231) may be the voltage value distributed to the parallel resistor among the pull-up resistor and the parallel resistor of the power amplifier (251) and thermistor (235) with respect to the voltage provided by the LDO module. For example, the voltage value of the ADC port (231) may correspond to the parallel resistor value of the power amplifier (251) and thermistor (235).

[0158] In one embodiment, the electronic device (101) can identify whether the power amplifier (251) is damaged based on the identified (or measured, acquired) voltage value. For example, the electronic device (101) can identify whether the voltage value exceeds a threshold voltage value (e.g., 0.9V). For example, the electronic device (101) can identify that the power amplifier (251) is not damaged based on the identification that the voltage value exceeds the threshold voltage value. For example, the electronic device (101) can identify that the power amplifier (251) is damaged based on the identification that the voltage value is below the threshold voltage value. Based on identifying that the power amplifier (251) is damaged, the electronic device (101) can control the second RFFE module (250) so that the fourth switch circuit (504) does not connect the power amplifier (251) and the power path (237) of the power supply circuit (236). The second RFFE module (250) can be configured to refrain from using the power amplifier (251) by the above control. By keeping the fourth switch circuit (504) in an open state, other power amplifiers connected to the power path (237) can be prevented from being affected by the damaged power amplifier (251).

[0159] In one embodiment, the electronic device (101) can control the first RFFE module (240) so that the first switch circuit (501) does not connect the power path (237) of the thermistor (235) and the power supply circuit (236) after identifying whether there is damage to all power amplifiers of the electronic device (101) (e.g., power amplifier (241), power amplifier (242), power amplifier (251)). The thermistor (235) can be used to measure the temperature of the power amplifier (241).

[0160] FIG. 10 illustrates components of an electronic device for detecting damage to a power amplifier. In FIG. 10, the operations of an electronic device (101) for detecting (or identifying) whether a power amplifier (PA) (241), power amplifier (251), power amplifier (261), power amplifier (271), power amplifier (281), and power amplifier (282) are damaged are described in a circuit structure in which RFFE (radio frequency front end) modules are arranged. The same reference numerals may be used for the same descriptions. Descriptions of FIG. 2 and FIG. 3 may be used for FIG. 10.

[0161] In FIG. 10, a thermistor (235) used to detect (or identify) whether power amplifiers are damaged may be placed around (or outside) the first RFFE module (240). However, this is merely an example and the present disclosure is not limited thereto. For example, the thermistor (235) may be placed around (or outside) another RFFE module.

[0162] Referring to FIG. 10, an electronic device (101) according to one embodiment may include a processor (210), an RF (radio frequency) transceiver (220), a PMIC (power management integrated circuit) (230), a thermistor (235), a first power supply circuit (236), a second power supply circuit (238), a first RFFE module (240), a second RFFE module (250), a third RFFE module (260), a fourth RFFE module (270), and a fifth RFFE module (280). Operations performed by the electronic device (101) may be controlled by the processor (210) and / or the RF transceiver (220). In the following, operations performed by the electronic device (101) may be based on control according to a MIPI (mobile industry processor interface) command of the processor (210) and / or the RF transceiver (220).

[0163] In one embodiment, the first RFFE module (240) may include a power amplifier (241), a first switch circuit (601), a second switch circuit (602), and a third switch circuit (603). For example, the power amplifier (241) may receive an RF signal from an RF transceiver (220) through a sixth transmission port (226). The power amplifier (241) may amplify the received RF signal. The power amplifier (241) may radiate the RF signal into the air by providing the amplified RF signal to an antenna connected to the first RFFE module (240). For example, the first switch circuit (601) may be configured to selectively connect or disconnect the thermistor (235) and the third power path (610) under the control of the processor (210) and / or the RF transceiver (220). For example, the second switch circuit (602) may be configured to selectively connect or not connect the third power path (610) to the first power path (237) of the first power supply circuit (236) or the second power path (239) of the second power supply circuit (238), depending on the control of the processor (210) and / or the RF transceiver (220). The second switch circuit (602) may be configured not to connect the third power path (610) to the first power path (237) and the second power path (239) in an idle state. The third switch circuit (603) may be configured not to selectively connect or not connect the power amplifier (241) to the third power path (610), depending on the control of the processor (210) and / or the RF transceiver (220).

[0164] In one embodiment, the second RFFE module (250) may include a power amplifier (251) and a fourth switch circuit (604). For example, the power amplifier (251) may receive an RF signal from an RF transceiver (220) through a fourth transmission port (224). The power amplifier (251) may amplify the received RF signal. The power amplifier (251) may radiate the RF signal into the air by providing the amplified RF signal to an antenna connected to the second RFFE module (250). For example, the fourth switch circuit (604) may be configured to selectively connect or disconnect the power amplifier (251) and the third power path (610) under the control of the processor (210) and / or the RF transceiver (220).

[0165] In one embodiment, the third RFFE module (260) may include a power amplifier (261) and a fifth switch circuit (605). For example, the power amplifier (261) may receive an RF signal from an RF transceiver (220) through a fifth transmission port (225). The power amplifier (261) may amplify the received RF signal. The power amplifier (261) may radiate the RF signal into the air by providing the amplified RF signal to an antenna connected to the third RFFE module (260). For example, the fifth switch circuit (605) may be configured to selectively connect or disconnect the power amplifier (261) and the third power path (610) under the control of the processor (210) and / or the RF transceiver (220).

[0166] In one embodiment, the fourth RFFE module (270) may include a power amplifier (271) and a sixth switch circuit (606). For example, the power amplifier (271) may receive an RF signal from an RF transceiver (220) through a first transmission port (221). The power amplifier (271) may amplify the received RF signal. The power amplifier (271) may radiate the RF signal into the air by providing the amplified RF signal to an antenna connected to the fourth RFFE module (270). For example, the sixth switch circuit (606) may be configured to selectively connect or disconnect the first power path (237) of the power amplifier (271) and the first power supply circuit (236) under the control of the processor (210) and / or the RF transceiver (220).

[0167] In one embodiment, the fifth RFFE module (280) may include a power amplifier (281), a power amplifier (282), a seventh switch circuit (607), and an eighth switch circuit (608). For example, the power amplifier (281) may receive an RF signal from an RF transceiver (220) through a second transmission port (222). The power amplifier (281) may amplify the received RF signal. The power amplifier (281) may radiate the RF signal into the air by providing the amplified RF signal to an antenna connected to the fifth RFFE module (280). For example, the power amplifier (282) may receive an RF signal from an RF transceiver (220) through a third transmission port (223). The power amplifier (282) may amplify the received RF signal. The power amplifier (282) can radiate the RF signal into the air by providing the amplified RF signal to the antenna connected to the fifth RFFE module (280).

[0168] In one embodiment, the electronic device (101) may detect (or identify) an event. For example, the event may include the booting of the electronic device (101) and / or the deactivation of an operating mode (e.g., airplane mode) for deactivating the communication circuits of the electronic device (101) (e.g., RF transceiver (220), PMIC (230), power supply circuit (236), at least part of the first RFFE module (240), second RFFE module (250), third RFFE module (260), fourth RFFE module (270), and fifth RFFE module (280). Based on detecting the event, the electronic device (101) may control the first RFFE module (240) so that the first switch circuit (601) connects the thermistor (235) to the third power path (610). The electronic device (101) can control the first RFFE module (240) so that the second switch circuit (602) operates in an idle state based on detecting an event. In an idle state, the second switch circuit (602) can be configured not to connect the third power path (610) to the first power path (237) and the second power path (239). The electronic device (101) can control the first RFFE module (240) so that the third switch circuit (603) connects the power amplifier (241) and the third power path (610) based on detecting an event. The electronic device (101) can control the second RFFE module (250) so that the fourth switch circuit (604) does not connect the power amplifier (251) and the third power path (610) based on detecting an event. The electronic device (101) can control the third RFFE module (260) based on detecting an event so that the fifth switch circuit (605) does not connect the power amplifier (261) and the third power path (610).The electronic device (101) can control the fourth RFFE module (207) so that the sixth switch circuit (606) does not connect the first power path (237) of the power amplifier (271) and the first power supply circuit (236) based on detecting an event. The electronic device (101) can control the fifth RFFE module (280) so that the seventh switch circuit (607) does not connect the second power path (239) of the power amplifier (281) and the second power supply circuit (238) based on detecting an event. The electronic device (101) can control the fifth RFFE module (280) so that the eighth switch circuit (608) does not connect the second power path (239) of the power amplifier (282) and the second power supply circuit (238) based on detecting an event. By controlling the switch circuits, power amplifiers other than the power amplifier (241) may not be connected to the thermistor (235). By controlling the switch circuits, the power amplifier (241) and the thermistor (235) may be connected in parallel.

[0169] In one embodiment, the electronic device (101) can identify (or measure, acquire) the voltage value of the analog-to-digital (ADC) port (231) of the PMIC (230) while the power amplifier (241) and the thermistor (235) are connected in parallel. The PMIC (230) can provide a fixed voltage (e.g., 1.8 V) using a low drop-out (LDO) module. The voltage value of the ADC port (231) can be identified (or measured, acquire) by the ADC module of the PMIC (230). The voltage value of the ADC port (231) may be the voltage value distributed to the parallel resistor among the pull-up resistor and the parallel resistor of the power amplifier (241) and thermistor (235) with respect to the voltage provided by the LDO module. For example, the voltage value of the ADC port (231) can correspond to the parallel resistance value of the power amplifier (241) and the thermistor (235).

[0170] In one embodiment, the electronic device (101) can identify whether the power amplifier (241) is damaged based on the identified (or measured, acquired) voltage value. For example, the electronic device (101) can identify whether the voltage value exceeds a threshold voltage value (e.g., 0.9V). For example, the electronic device (101) can identify that the power amplifier (241) is not damaged based on the identification that the voltage value exceeds the threshold voltage value. For example, the electronic device (101) can identify that the power amplifier (241) is damaged based on the identification that the voltage value is below the threshold voltage value. Based on identifying that the power amplifier (241) is damaged, the electronic device (101) can control the first RFFE module (240) so that the third switch circuit (603) does not connect the power amplifier (241) to the third power path (610). The first RFFE module (240) may be configured to refrain from using the power amplifier (241) by the above control. By keeping the third switch circuit (603) in an open state, other power amplifiers connected to the power paths may not be affected by the damaged power amplifier (241).

[0171] In one embodiment, the electronic device (101) may control the first RFFE module (240) so that the third switch circuit (603) does not connect the power amplifier (241) to the third power path (610) after identification is performed on whether the power amplifier (241) is damaged. The electronic device (101) may control the second RFFE module (250) so that the fourth switch circuit (604) connects the power amplifier (251) to the third power path (610) after the identification is performed. By controlling the switch circuits, other power amplifiers other than the power amplifier (251) may not be connected to the thermistor (235). By controlling the switch circuits, the power amplifier (251) and the thermistor (235) may be connected in parallel.

[0172] In one embodiment, the electronic device (101) can identify (or measure, acquire) the voltage value of the ADC port (231) of the PMIC (230) while the power amplifier (251) and the thermistor (235) are connected in parallel. The PMIC (230) can provide a fixed voltage (e.g., 1.8V) using an LDO module. The voltage value of the ADC port (231) can be identified (or measured, acquire) by the ADC module of the PMIC (230). The voltage value of the ADC port (231) may be the voltage value distributed to the parallel resistor among the pull-up resistor and the parallel resistor of the power amplifier (251) and thermistor (235) with respect to the voltage provided by the LDO module. For example, the voltage value of the ADC port (231) may correspond to the parallel resistor value of the power amplifier (251) and thermistor (235).

[0173] In one embodiment, the electronic device (101) can identify whether the power amplifier (251) is damaged based on the identified (or measured, acquired) voltage value. For example, the electronic device (101) can identify whether the voltage value exceeds a threshold voltage value (e.g., 0.9V). For example, the electronic device (101) can identify that the power amplifier (251) is not damaged based on the identification that the voltage value exceeds the threshold voltage value. For example, the electronic device (101) can identify that the power amplifier (251) is damaged based on the identification that the voltage value is below the threshold voltage value. Based on identifying that the power amplifier (251) is damaged, the electronic device (101) can control the second RFFE module (250) so that the fourth switch circuit (604) does not connect the power amplifier (251) to the third power path (610). The second RFFE module (250) can be configured to refrain from using the power amplifier (251) by the above control. By keeping the fourth switch circuit (604) in an open state, other power amplifiers connected to the power paths can be prevented from being affected by the damaged power amplifier (251).

[0174] In one embodiment, the electronic device (101) may control the second RFFE module (250) so that the fourth switch circuit (604) does not connect the power amplifier (251) to the third power path (610) after identification is performed on whether the power amplifier (251) is damaged. The electronic device (101) may control the third RFFE module (260) so that the fifth switch circuit (605) connects the power amplifier (261) to the third power path (610) after the identification is performed. By controlling the switch circuits, other power amplifiers other than the power amplifier (261) may not be connected to the thermistor (235). By controlling the switch circuits, the power amplifier (261) and the thermistor (235) may be connected in parallel.

[0175] In one embodiment, the electronic device (101) can identify (or measure, acquire) the voltage value of the ADC port (231) of the PMIC (230) while the power amplifier (261) and the thermistor (235) are connected in parallel. The PMIC (230) can provide a fixed voltage (e.g., 1.8 V) using an LDO module. The voltage value of the ADC port (231) can be identified (or measured, acquire) by the ADC module of the PMIC (230). The voltage value of the ADC port (231) may be the voltage value distributed to the parallel resistor among the pull-up resistor and the parallel resistor of the power amplifier (261) and thermistor (235) with respect to the voltage provided by the LDO module. For example, the voltage value of the ADC port (231) may correspond to the parallel resistor value of the power amplifier (261) and thermistor (235).

[0176] In one embodiment, the electronic device (101) can identify whether the power amplifier (261) is damaged based on the identified (or measured, acquired) voltage value. For example, the electronic device (101) can identify whether the voltage value exceeds a threshold voltage value (e.g., 0.9V). For example, the electronic device (101) can identify that the power amplifier (261) is not damaged based on the identification that the voltage value exceeds the threshold voltage value. For example, the electronic device (101) can identify that the power amplifier (261) is damaged based on the identification that the voltage value is below the threshold voltage value. Based on identifying that the power amplifier (261) is damaged, the electronic device (101) can control the third RFFE module (260) so that the fifth switch circuit (605) does not connect the power amplifier (261) to the third power path (610). The third RFFE module (260) can be configured to refrain from using the power amplifier (261) by the above control. By keeping the fifth switch circuit (605) in an open state, other power amplifiers connected to the power paths can be prevented from being affected by the damaged power amplifier (261).

[0177] In one embodiment, the electronic device (101) may control the third RFFE module (260) so that the fifth switch circuit (605) does not connect the power amplifier (261) to the third power path (610) after the identification is performed on whether the power amplifier (261) is damaged. The electronic device (101) may control the first RFFE module (240) so that the second switch circuit (602) connects the third power path (610) to the first power path (237) after the identification is performed. The electronic device (101) may control the fourth RFFE module (270) so that the sixth switch circuit (606) connects the power amplifier (271) to the first power path (237) after the identification is performed. By controlling the switch circuits, other power amplifiers other than the power amplifier (271) may not be connected to the thermistor (235). By controlling the switch circuits, the power amplifier (271) and the thermistor (235) can be connected in parallel.

[0178] In one embodiment, the electronic device (101) can identify (or measure, acquire) the voltage value of the ADC port (231) of the PMIC (230) while the power amplifier (271) and the thermistor (235) are connected in parallel. The PMIC (230) can provide a fixed voltage (e.g., 1.8V) using an LDO module. The voltage value of the ADC port (231) can be identified (or measured, acquire) by the ADC module of the PMIC (230). The voltage value of the ADC port (231) may be the voltage value distributed to the parallel resistor among the pull-up resistor and the parallel resistor of the power amplifier (271) and thermistor (235) with respect to the voltage provided by the LDO module. For example, the voltage value of the ADC port (231) may correspond to the parallel resistor value of the power amplifier (271) and thermistor (235).

[0179] In one embodiment, the electronic device (101) can identify whether the power amplifier (271) is damaged based on the identified (or measured, acquired) voltage value. For example, the electronic device (101) can identify whether the voltage value exceeds a threshold voltage value (e.g., 0.9V). For example, the electronic device (101) can identify that the power amplifier (271) is not damaged based on the identification that the voltage value exceeds the threshold voltage value. For example, the electronic device (101) can identify that the power amplifier (271) is damaged based on the identification that the voltage value is below the threshold voltage value. Based on identifying that the power amplifier (271) is damaged, the electronic device (101) can control the fourth RFFE module (270) so that the sixth switch circuit (606) does not connect the power amplifier (271) to the first power path (237). The fourth RFFE module (270) can be configured to refrain from using the power amplifier (271) by the above control. By keeping the sixth switch circuit (606) open, other power amplifiers connected to the power paths can be prevented from being affected by the damaged power amplifier (271).

[0180] In one embodiment, the electronic device may control the fourth RFFE module (270) so that the sixth switch circuit (606) does not connect the power amplifier (271) to the first power path (237) after the identification is performed on whether the power amplifier (271) is damaged. The electronic device (101) may control the first RFFE module (240) so that the second switch circuit (602) connects the third power path (610) to the second power path (239) after the identification is performed. The electronic device (101) may control the fifth RFFE module (280) so that the seventh switch circuit (607) connects the power amplifier (281) to the second power path (239) after the identification is performed. By controlling the switch circuits, other power amplifiers other than the power amplifier (281) may not be connected to the thermistor (235). By controlling the switch circuits, the power amplifier (281) and the thermistor (235) can be connected in parallel.

[0181] In one embodiment, the electronic device (101) can identify (or measure, acquire) the voltage value of the ADC port (231) of the PMIC (230) while the power amplifier (281) and the thermistor (235) are connected in parallel. The PMIC (230) can provide a fixed voltage (e.g., 1.8 V) using an LDO module. The voltage value of the ADC port (231) can be identified (or measured, acquire) by the ADC module of the PMIC (230). The voltage value of the ADC port (231) may be the voltage value distributed to the parallel resistor among the pull-up resistor and the parallel resistor of the power amplifier (281) and thermistor (235) with respect to the voltage provided by the LDO module. For example, the voltage value of the ADC port (231) may correspond to the parallel resistor value of the power amplifier (281) and thermistor (235).

[0182] In one embodiment, the electronic device (101) can identify whether the power amplifier (281) is damaged based on the identified (or measured, acquired) voltage value. For example, the electronic device (101) can identify whether the voltage value exceeds a threshold voltage value (e.g., 0.9V). For example, the electronic device (101) can identify that the power amplifier (281) is not damaged based on the identification that the voltage value exceeds the threshold voltage value. For example, the electronic device (101) can identify that the power amplifier (281) is damaged based on the identification that the voltage value is below the threshold voltage value. Based on identifying that the power amplifier (281) is damaged, the electronic device (101) can control the fifth RFFE module (280) so that the seventh switch circuit (607) does not connect the power amplifier (281) to the second power path (239). The fifth RFFE module (280) may be configured to refrain from using the power amplifier (281) by the above control. By keeping the seventh switch circuit (607) open, other power amplifiers connected to the power paths may not be affected by the damaged power amplifier (281).

[0183] In one embodiment, the electronic device (101) may control the fifth RFFE module (280) so that the seventh switch circuit (607) does not connect the power amplifier (281) to the second power path (239) after identification is performed on whether the power amplifier (281) is damaged. The electronic device (101) may control the fifth RFFE module (280) so that the eighth switch circuit (608) connects the power amplifier (282) to the second power path (239) after the identification is performed. By controlling the switch circuits, other power amplifiers other than the power amplifier (282) may not be connected to the thermistor (235). By controlling the switch circuits, the power amplifier (282) and the thermistor (235) may be connected in parallel.

[0184] In one embodiment, the electronic device (101) can identify (or measure, acquire) the voltage value of the ADC port (231) of the PMIC (230) while the power amplifier (282) and the thermistor (235) are connected in parallel. The PMIC (230) can provide a fixed voltage (e.g., 1.8 V) using an LDO module. The voltage value of the ADC port (231) can be identified (or measured, acquire) by the ADC module of the PMIC (230). The voltage value of the ADC port (231) may be the voltage value distributed to the parallel resistor among the pull-up resistor and the parallel resistor of the power amplifier (282) and thermistor (235) with respect to the voltage provided by the LDO module. For example, the voltage value of the ADC port (231) may correspond to the parallel resistor value of the power amplifier (282) and thermistor (235).

[0185] In one embodiment, the electronic device (101) can identify whether the power amplifier (282) is damaged based on the identified (or measured, acquired) voltage value. For example, the electronic device (101) can identify whether the voltage value exceeds a threshold voltage value (e.g., 0.9V). For example, the electronic device (101) can identify that the power amplifier (282) is not damaged based on the identification that the voltage value exceeds the threshold voltage value. For example, the electronic device (101) can identify that the power amplifier (282) is damaged based on the identification that the voltage value is below the threshold voltage value. Based on identifying that the power amplifier (282) is damaged, the electronic device (101) can control the fifth RFFE module (280) so that the eighth switch circuit (608) does not connect the power amplifier (282) to the second power path (239). The fifth RFFE module (280) may be configured to refrain from using the power amplifier (282) by the above control. By keeping the eighth switch circuit (608) open, other power amplifiers connected to the power paths may not be affected by the damaged power amplifier (282).

[0186] In one embodiment, the electronic device (101) can control the first RFFE module (240) so that the first switch circuit (601) does not connect the thermistor (235) to the third power path (610) after identifying whether there is damage to all power amplifiers of the electronic device (101) (e.g., power amplifier (241), power amplifier (251), power amplifier (261), power amplifier (271), power amplifier (281), power amplifier (282)). The thermistor (235) can be used to measure the temperature of the power amplifier (241).

[0187] FIG. 11 illustrates components of an electronic device for detecting damage to a power amplifier. In FIG. 11, the operations of an electronic device (101) for detecting (or identifying) whether a power amplifier (PA) (241), a power amplifier (242), and a power amplifier (251) are damaged are described in a circuit structure in which RFFE (radio frequency front end) modules are arranged. The same reference numerals may be used for the same descriptions. Descriptions of FIG. 2 and FIG. 3 may be used for FIG. 11.

[0188] In FIG. 11, a thermistor (235) used to detect (or identify) whether power amplifiers are damaged may be placed around (or outside) the first RFFE module (240). However, this is merely an example and the present disclosure is not limited thereto. For example, the thermistor (235) may be placed around (or outside) another RFFE module.

[0189] Referring to FIG. 11, an electronic device (101) according to one embodiment may include a processor (210), an RF (radio frequency) transceiver (220), a PMIC (power management integrated circuit) (230), a thermistor (235), a first power supply circuit (236), a second power supply circuit (238), a first RFFE module (240), and a second RFFE module (250). Operations performed by the electronic device (101) may be controlled by the processor (210) and / or the RF transceiver (220). In the following, operations performed by the electronic device (101) may be based on control according to a MIPI (mobile industry processor interface) command of the processor (210) and / or the RF transceiver (220).

[0190] In one embodiment, the first RFFE module (240) may include a power amplifier (241), a power amplifier (242), a first switch circuit (701), a second switch circuit (702), a third switch circuit (703), and a fourth switch circuit (704). For example, the power amplifier (241) may receive an RF signal from an RF transceiver (220) through a first transmission port (221). The power amplifier (241) may amplify the received RF signal. The power amplifier (241) may radiate the RF signal into the air by providing the amplified RF signal to an antenna connected to the first RFFE module (240). For example, the power amplifier (242) may receive an RF signal from an RF transceiver (220) through a second transmission port (222). The power amplifier (242) may amplify the received RF signal. The power amplifier (242) can radiate an RF signal into the air by providing the amplified RF signal to an antenna connected to the first RFFE module (240). For example, the first switch circuit (701) may be configured to selectively connect or disconnect the thermistor (235) and the first power path (237) of the first power supply circuit (236) under the control of the processor (210) and / or the RF transceiver (220). For example, the second switch circuit (702) may be configured to selectively connect or disconnect the thermistor (235) and the second power path (239) of the second power supply circuit (238) under the control of the processor (210) and / or the RF transceiver (220). For example, the third switch circuit (703) may be configured to selectively connect or not connect the power path (237) of the power amplifier (241) and the first power supply circuit (236) according to the control of the processor (210) and / or RF transceiver (220).For example, the fourth switch circuit (704) may be configured to selectively connect or not connect the power path (239) of the power amplifier (242) and the second power supply circuit (238) according to the control of the processor (210) and / or RF transceiver (220).

[0191] In one embodiment, the second RFFE module (250) may include a power amplifier (251) and a fifth switch circuit (705). For example, the power amplifier (251) may receive an RF signal from an RF transceiver (220) through a third transmission port (223). The power amplifier (251) may amplify the received RF signal. The power amplifier (251) may radiate the RF signal into the air by providing the amplified RF signal to an antenna connected to the second RFFE module (250). For example, the fifth switch circuit (705) may be configured to selectively connect or disconnect the second power path (239) of the power amplifier (251) and the second power supply circuit (238) under the control of the processor (210) and / or the RF transceiver (220).

[0192] In one embodiment, the electronic device (101) may detect (or identify) an event. For example, the event may include the booting of the electronic device (101) and / or the deactivation of an operating mode (e.g., airplane mode) for deactivating the communication circuits of the electronic device (101) (e.g., RF transceiver (220), PMIC (230), first power supply circuit (236), second power supply circuit (238), first RFFE module (240), and at least part of the second RFFE module (250). Based on detecting the event, the electronic device (101) may control the first RFFE module (240) so that the first switch circuit (701) connects the thermistor (235) and the first power path (237) of the first power supply circuit (236). The electronic device (101) can control the first RFFE module (240) based on detecting an event so that the second switch circuit (702) does not connect the thermistor (235) and the second power path (239) of the second power supply circuit (236). The electronic device (101) can control the first RFFE module (240) based on detecting an event so that the third switch circuit (703) connects the power amplifier (241) and the first power path (237) of the first power supply circuit (236). The electronic device (101) can control the first RFFE module (240) based on detecting an event so that the fourth switch circuit (704) does not connect the power amplifier (242) and the second power path (239) of the second power supply circuit (238). The electronic device (101) can control the second RFFE module (250) based on detecting an event so that the fifth switch circuit (705) does not connect the power amplifier (251) and the second power path (239) of the second power supply circuit (238). By controlling the switches, other power amplifiers other than the power amplifier (241) may not be connected to the thermistor (235).By controlling the switches, the power amplifier (241) and the thermistor (235) can be connected in parallel.

[0193] In one embodiment, the electronic device (101) can identify (or measure, acquire) the voltage value of the analog-to-digital (ADC) port (231) of the PMIC (230) while the power amplifier (241) and the thermistor (235) are connected in parallel. The PMIC (230) can provide a fixed voltage (e.g., 1.8 V) using a low drop-out (LDO) module. The voltage value of the ADC port (231) can be identified (or measured, acquire) by the ADC module of the PMIC (230). The voltage value of the ADC port (231) may be the voltage value distributed to the parallel resistor among the pull-up resistor and the parallel resistor of the power amplifier (241) and thermistor (235) with respect to the voltage provided by the LDO module. For example, the voltage value of the ADC port (231) may correspond to the parallel resistor value of the power amplifier (241) and thermistor (235).

[0194] In one embodiment, the electronic device (101) can identify whether the power amplifier (241) is damaged based on the identified (or measured, acquired) voltage value. For example, the electronic device (101) can identify whether the voltage value exceeds a threshold voltage value (e.g., 0.9V). For example, the electronic device (101) can identify that the power amplifier (241) is not damaged based on the identification that the voltage value exceeds the threshold voltage value. For example, the electronic device (101) can identify that the power amplifier (241) is damaged based on the identification that the voltage value is below the threshold voltage value. Based on identifying that the power amplifier (241) is damaged, the electronic device (101) can control the first RFFE module (240) so that the third switch circuit (703) does not connect the power amplifier (241) to the first power path (237). The first RFFE module (240) can be configured to refrain from using the power amplifier (241) by the above control. By keeping the third switch circuit (703) in an open state, other power amplifiers connected to the power paths can be prevented from being affected by the damaged power amplifier (241).

[0195] In one embodiment, after identification is performed regarding whether the power amplifier (241) is damaged, the electronic device (101) may control the first RFFE module (240) so that the third switch circuit (703) does not connect the power amplifier (241) to the first power path (237) of the first power supply circuit (236). After the identification is performed, the electronic device (101) may control the first RFFE module (240) so that the first switch circuit (701) does not connect the thermistor (235) to the first power path (236) of the first power supply circuit (236). After the identification is performed, the electronic device (101) may control the first RFFE module (240) so that the second switch circuit (702) connects the thermistor (235) to the second power path (239) of the second power supply circuit (238). After the identification is performed, the electronic device (101) can control the first RFFE module (240) so that the fourth switch circuit (704) connects the power amplifier (242) and the second power path (239) of the second power supply circuit (238). By controlling the switches, other power amplifiers other than the power amplifier (242) may not be connected to the thermistor (235). By controlling the switches, the power amplifier (242) and the thermistor (235) may be connected in parallel.

[0196] In one embodiment, the electronic device (101) can identify (or measure, acquire) the voltage value of the analog-to-digital (ADC) port (231) of the PMIC (230) while the power amplifier (242) and the thermistor (235) are connected in parallel. The PMIC (230) can provide a fixed voltage (e.g., 1.8 V) using a low drop-out (LDO) module. The voltage value of the ADC port (231) can be identified (or measured, acquire) by the ADC module of the PMIC (230). The voltage value of the ADC port (231) may be the voltage value distributed to the parallel resistor among the pull-up resistor and the parallel resistor of the power amplifier (242) and thermistor (235) with respect to the voltage provided by the LDO module. For example, the voltage value of the ADC port (231) can correspond to the parallel resistance value of the power amplifier (242) and the thermistor (235).

[0197] In one embodiment, the electronic device (101) can identify whether the power amplifier (242) is damaged based on the identified (or measured, acquired) voltage value. For example, the electronic device (101) can identify whether the voltage value exceeds a threshold voltage value (e.g., 0.9V). For example, the electronic device (101) can identify that the power amplifier (242) is not damaged based on the identification that the voltage value exceeds the threshold voltage value. For example, the electronic device (101) can identify that the power amplifier (242) is damaged based on the identification that the voltage value is below the threshold voltage value. Based on identifying that the power amplifier (242) is damaged, the electronic device (101) can control the first RFFE module (240) so that the fourth switch circuit (704) does not connect the power amplifier (242) to the second power path (239). The first RFFE module (240) may be configured to refrain from using the power amplifier (242) by the above control. By keeping the fourth switch circuit (704) in an open state, other power amplifiers connected to the power paths may not be affected by the damaged power amplifier (242).

[0198] In one embodiment, after identification is performed regarding whether the power amplifier (242) is damaged, the electronic device (101) may control the first RFFE module (240) so that the fourth switch circuit (704) does not connect the power amplifier (242) to the second power path (239) of the second power supply circuit (238). After the identification is performed, the electronic device (101) may control the second RFFE module (250) so that the fifth switch circuit (705) connects the power amplifier (251) to the second power path (239) of the second power supply circuit (238). By controlling the switches, other power amplifiers other than the power amplifier (251) may not be connected to the thermistor (235). By controlling the switches, the power amplifier (251) and the thermistor (235) may be connected in parallel.

[0199] In one embodiment, the electronic device (101) can identify (or measure, acquire) the voltage value of the analog-to-digital (ADC) port (231) of the PMIC (230) while the power amplifier (251) and the thermistor (235) are connected in parallel. The PMIC (230) can provide a fixed voltage (e.g., 1.8 V) using a low drop-out (LDO) module. The voltage value of the ADC port (231) can be identified (or measured, acquire) by the ADC module of the PMIC (230). The voltage value of the ADC port (231) may be the voltage value distributed to the parallel resistor among the pull-up resistor and the parallel resistor of the power amplifier (251) and thermistor (235) with respect to the voltage provided by the LDO module. For example, the voltage value of the ADC port (231) can correspond to the parallel resistance value of the power amplifier (251) and the thermistor (235).

[0200] In one embodiment, the electronic device (101) can identify whether the power amplifier (251) is damaged based on the identified (or measured, acquired) voltage value. For example, the electronic device (101) can identify whether the voltage value exceeds a threshold voltage value (e.g., 0.9V). For example, the electronic device (101) can identify that the power amplifier (251) is not damaged based on the identification that the voltage value exceeds the threshold voltage value. For example, the electronic device (101) can identify that the power amplifier (251) is damaged based on the identification that the voltage value is below the threshold voltage value. Based on identifying that the power amplifier (251) is damaged, the electronic device (101) can control the second RFFE module (250) so that the fifth switch circuit (705) does not connect the power amplifier (251) to the second power path (239). The second RFFE module (250) can be configured to refrain from using the power amplifier (251) by the above control. By keeping the fifth switch circuit (705) in an open state, other power amplifiers connected to the power paths can be prevented from being affected by the damaged power amplifier (251).

[0201] In one embodiment, the electronic device (101) can control the first RFFE module (240) so that the first switch circuit (701) does not connect the thermistor (235) to the first power path (237) of the first power supply circuit (236) after identifying whether there is damage to all power amplifiers of the electronic device (101) (e.g., power amplifier (241), power amplifier (242), power amplifier (251)). After the identification, the electronic device (101) can control the first RFFE module (240) so that the second switch circuit (702) does not connect the thermistor (235) to the second power path (239) of the second power supply circuit (238). The thermistor (235) can be used to measure the temperature of the power amplifier (241).

[0202] FIG. 12 is a flowchart illustrating the operations of an electronic device for detecting damage to a power amplifier. The operations of FIG. 12 may be performed by an electronic device (101). At least some of the operations of FIG. 12 may be controlled by a processor (210) and / or an RF (radio frequency) transceiver (220) of the electronic device (101). For example, at least some of the operations performed by the electronic device (101) may be based on control according to MIPI (mobile industry processor interface) commands of the processor (210) and / or the RF transceiver (220). In the following, each operation may be performed sequentially, but is not necessarily performed sequentially. For example, at least two operations may be performed in parallel.

[0203] Referring to FIG. 12, in operation 1201, an electronic device (101) according to one embodiment can control a radio frequency front end (RFFE) module (240) so that a switch circuit (401) connects a power path (237) of a power supply circuit (236) to a thermistor (235). In one example, the thermistor (235) may be placed inside the RFFE module (240). In another example, the thermistor (235) may be placed around (or outside) the RFFE module (240).

[0204] In operation 1202, an electronic device (101) according to one embodiment can control an RFFE module (240) to connect a power amplifier (241) to a power path (237) of a power supply circuit (236). The electronic device (101) can control RFFE modules so that among the power amplifiers, only the power amplifier (241) is connected to the power path (237). By this control, other power amplifiers other than the power amplifier (241) may not be connected to the thermistor (235). By this control, the power amplifier (241) and the thermistor (235) may be connected in parallel.

[0205] In operation 1203, an electronic device (101) according to one embodiment can identify whether a voltage value obtained through a PMIC (230) exceeds a threshold voltage value.

[0206] In one embodiment, the electronic device (101) can identify (or measure, acquire) the voltage value of the analog-to-digital converter (ADC) port (231) of the PMIC (230) while the power amplifier (241) and the thermistor (235) are connected in parallel. The PMIC (230) can provide a fixed voltage (e.g., 1.8 V) using a low drop-out (LDO) module. The voltage value of the ADC port (231) can be identified (or measured, acquire) by the ADC module of the PMIC (230). The voltage value of the ADC port (231) may be the voltage value distributed to the parallel resistor among the pull-up resistor and the parallel resistor of the power amplifier (241) and thermistor (235) with respect to the voltage provided by the LDO module. For example, the voltage value of the ADC port (231) can correspond to the parallel resistance value of the power amplifier (241) and the thermistor (235).

[0207] In operation 1204, an electronic device (101) according to one embodiment can identify that the power amplifier (241) is not damaged. For example, the electronic device (101) can identify that the power amplifier (241) is not damaged by identifying that the voltage value obtained by the PMIC (230) exceeds a threshold voltage value. Although not illustrated, the electronic device (101) can perform the operations described in FIG. 12 on a power amplifier that is different from the power amplifier (241) of the RFFE module (240) to detect (or identify) whether the power amplifier (242) is damaged. Although not illustrated, the electronic device (101) can perform the operations described in FIG. 12 on a power amplifier of another RFFE module that is different from the RFFE module (240) after identifying whether all power amplifiers in the RFFE module (240) are damaged.

[0208] In operation 1205, an electronic device (101) according to one embodiment can identify that a power amplifier is damaged. For example, the electronic device (101) can identify that a power amplifier (241) is damaged based on the identification that a voltage value obtained by a PMIC (230) is below a threshold voltage value. Based on identifying that the power amplifier (241) is damaged, the electronic device (101) can control the first RFFE module (240) so that the second switch circuit (402) does not connect the power amplifier (241) to the power path (237) of the power supply circuit (236). The first RFFE module (240) can be configured to refrain from using the power amplifier (241) by the control. By opening the second switch circuit (402), other power amplifiers (e.g., power amplifier (251)) connected to the power path (237) can be prevented from being affected by the damaged power amplifier (241). Although not illustrated, the electronic device (101) may perform the operations described in FIG. 12 on a power amplifier that is different from the power amplifier (241) of the RFFE module (240) to detect (or identify) whether the power amplifier (e.g., power amplifier (242)) is damaged. Although not illustrated, the electronic device (101) may perform the operations described in FIG. 12 on a power amplifier of another RFFE module that is different from the RFFE module (240) after identifying whether all power amplifiers within the RFFE module (240) are damaged.

[0209] The apparatus and method according to the present disclosure can identify (or detect) whether a power amplifier (PA) is damaged by using a resistor (e.g., a thermistor) of an existing circuit. By identifying whether the power amplifier is damaged before a voltage is supplied by a power supply circuit, the apparatus and method according to the present disclosure can prevent additional damage caused by the voltage supplied by the power supply circuit.

[0210] The technical problems to be solved in this disclosure are not limited to those mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art to which this disclosure pertains.

[0211] The electronic device (101) described above may include at least one processor (210) including a processing circuit. The electronic device (101) may include an RF (radio frequency) transceiver (220). The electronic device (101) may include a power supply circuit (236) including a power path for providing a supply voltage. The electronic device (101) may include an RFFE (radio frequency front end) module (240) including a power amplifier (241). The electronic device (101) may include a thermistor circuit (235). The electronic device (101) may include a switch circuit (401) configured to selectively connect or disconnect the thermistor circuit (235) and the power path (236). The electronic device (101) may include a power management integrated circuit (PMIC) (230) connected to the thermistor circuit (235). The switch circuit (401) may be controlled to connect the power path (237) and the thermistor circuit (235) under the control of the at least one processor (210) or the RF transceiver (220). The RFFE module (240) may be configured to refrain from using the power amplifier (241) under the control of the at least one processor (210) or the RF transceiver (220) based on a voltage value less than a threshold voltage value obtained by the PMIC (230) while the power path (237) and the thermistor circuit (235) are connected.

[0212] For example, the electronic device (101) may further include a second switch circuit (402) configured to selectively connect or not connect the power amplifier (241) and the power path (237). The RFFE module (240) may be configured to avoid using the power amplifier (241) by controlling the second switch circuit (402) so that it does not connect the power amplifier (241) and the power path (237).

[0213] For example, the electronic device (101) may include a second RFFE module (250) including a second power amplifier (251). The electronic device (101) may include a third switch circuit (403) configured to selectively connect or disconnect the second power amplifier (251) and the power path (237). The second switch circuit (402) may be controlled to disconnect the power amplifier (241) and the power path (237) under the control of the at least one processor (210) or the RF transceiver (220). The third switch circuit (403) may be controlled to connect the second power amplifier (251) and the power path (237) under the control of the at least one processor (210) or the RF transceiver (220).

[0214] For example, the second RFFE module (250) may be configured to refrain from using the second power amplifier (251) under the control of at least one processor (210) or the RF transceiver (220), based on a voltage value less than the threshold voltage value obtained by the PMIC (230) while the second power amplifier (251) and the power path (237) are connected. While the second power amplifier (251) and the power path (237) are connected, the second power amplifier (251) and the thermistor circuit (235) may be connected in parallel.

[0215] For example, the electronic device (101) may include a second power supply circuit (238) including a second power path (239) for providing a second supply voltage. The electronic device (101) may include a second RFFE module (250) including a second power amplifier (251). The electronic device (101) may include a third RFFE module (260) including a third power amplifier (261). The electronic device (101) may include a fourth RFFE module (270) including a fourth power amplifier (271). The electronic device (101) may include a fifth RFFE module (280) including a fifth power amplifier (281) and a sixth power amplifier (282). The electronic device (101) may include a second switch circuit (603) configured to selectively connect or disconnect the power amplifier (241) and the third power path (610). The electronic device (101) may include a third switch circuit (604) configured to selectively connect or disconnect the second power amplifier (251) and the third power path (610). The electronic device (101) may include a fourth switch circuit (605) configured to selectively connect or disconnect the third power amplifier (261) and the third power path (610). The electronic device (101) may include a fifth switch circuit (606) configured to connect or disconnect the fourth power amplifier (271) and the power path (237). The electronic device (101) may include a sixth switch circuit (607) configured to connect or not connect the fifth power amplifier (281) and the second power path (239). The electronic device (101) may include a seventh switch circuit (608) configured to connect or not connect the sixth power amplifier (282) and the second power path (239).The electronic device (101) may include an eighth switch circuit (602) configured to selectively connect or not connect one of the third power path (610) and the power path (237) or the second power path (239).

[0216] For example, the second switch circuit (603) may be controlled so as not to connect the power amplifier (241) and the third power path (610) according to the control of the at least one processor (210) or the RF transceiver (220). The third switch circuit (604) may be controlled to connect the second power amplifier (251) and the third power path (610) according to the control of the at least one processor (210) or the RF transceiver (220). The fourth switch circuit (605) may be controlled so as not to connect the third power amplifier (261) and the third power path (610) according to the control of the at least one processor (210) or the RF transceiver (220). The eighth switch circuit (602) can be controlled so as not to connect the third power path (610), the power path (237), and the second power path (239) according to the control of the at least one processor (210) or the RF transceiver (220).

[0217] For example, the second RFFE module (250) may be configured to refrain from using the second power amplifier (251) under the control of at least one processor (210) or the RF transceiver (220), based on a voltage value less than the threshold voltage value obtained by the PMIC (230) while the second power amplifier (251) and the third power path (610) are connected. While the second power amplifier (251) and the third power path (610) are connected, the second power amplifier (251) and the thermistor circuit (235) may be connected in parallel.

[0218] For example, the third switch circuit (604) may be controlled not to connect the second power amplifier (251) and the third power path (610) under the control of the at least one processor (210) or the RF transceiver (220). The fourth switch circuit (605) may be controlled to connect the third power amplifier (261) and the third power path (610) under the control of the at least one processor (210) or the RF transceiver (220).

[0219] For example, the third RFFE module (260) may be configured to refrain from using the third power amplifier (261) under the control of at least one processor (210) or the RF transceiver (220), based on a voltage value less than the threshold voltage value obtained by the PMIC (230) while the third power amplifier (261) and the third power path (610) are connected. While the third power amplifier (261) and the third power path (610) are connected, the third power amplifier (261) and the thermistor circuit (235) may be connected in parallel.

[0220] For example, the fourth switch circuit (605) may be controlled so as not to connect the third power amplifier (261) and the third power path (610) according to the control of the at least one processor (210) or the RF transceiver (220). The fifth switch circuit (606) may be controlled so as to connect the fourth power amplifier (271) and the power path (237) according to the control of the at least one processor (210) or the RF transceiver (220). The eighth switch circuit (602) may be controlled so as to connect the third power path (610) and the power path (237) according to the control of the at least one processor (210) or the RF transceiver (220).

[0221] For example, the fourth RFFE module (270) may be configured to refrain from using the fourth power amplifier (271) under the control of at least one processor (210) or the RF transceiver (220), based on a voltage value less than the threshold voltage value obtained by the PMIC (230) while the fourth power amplifier (271) and the power path (237) are connected. While the fourth power amplifier (271) and the power path (237) are connected, the fourth power amplifier (271) and the thermistor circuit (235) may be connected in parallel.

[0222] For example, the fifth switch circuit (606) may be controlled so that the fourth power amplifier (271) and the power path (237) are not connected, depending on the control of the at least one processor (210) or the RF transceiver (220). The sixth switch circuit (607) may be controlled so that the fifth power amplifier (281) and the second power path (239) are connected, depending on the control of the at least one processor (210) or the RF transceiver (220). The seventh switch circuit (608) may be controlled so that the sixth power amplifier (282) and the second power path (239) are not connected, depending on the control of the at least one processor (210) or the RF transceiver (220). The eighth switch circuit (602) can be controlled to connect the third power path (610) and the second power path (239) according to the control of the at least one processor (210) or the RF transceiver (220).

[0223] For example, the fifth RFFE module (280) may be configured to refrain from using the fifth power amplifier (281) under the control of at least one processor (210) or the RF transceiver (220), based on a voltage value less than the threshold voltage value obtained by the PMIC (230) while the fifth power amplifier (281) and the second power path (239) are connected. While the fifth power amplifier (281) and the second power path (239) are connected, the fifth power amplifier (281) and the thermistor circuit (235) may be connected in parallel.

[0224] For example, the sixth switch circuit (607) may be controlled not to connect the fifth power amplifier (281) and the second power path (239) under the control of the at least one processor (210) or the RF transceiver (220). The seventh switch circuit (608) may be controlled to connect the sixth power amplifier (282) and the second power path (239) under the control of the at least one processor (210) or the RF transceiver (220).

[0225] For example, the fifth RFFE module (280) may be configured to refrain from using the sixth power amplifier (282) under the control of at least one processor (210) or the RF transceiver (220), based on a voltage value less than the threshold voltage value obtained by the PMIC (230) while the sixth power amplifier (282) and the second power path (239) are connected. While the sixth power amplifier (282) and the second power path (239) are connected, the sixth power amplifier (282) and the thermistor circuit (235) may be connected in parallel.

[0226] For example, the electronic device (101) may include a second power supply circuit (238) including a second power path (239) for providing a second supply voltage. The electronic device (101) may include a second RFFE module (250) including a second power amplifier (251). The electronic device (101) may include a seventh power amplifier (242) included in the RFFE module (240). The electronic device (101) may include a second switch circuit (703) configured to selectively connect or disconnect the power amplifier (241) and the power path (237). The electronic device (101) may include a third switch circuit (705) configured to selectively connect or disconnect the second power amplifier (251) and the second power path (239). The electronic device (101) may include an eighth switch circuit (702) configured to selectively connect or disconnect the thermistor circuit (235) and the second power path (239). The electronic device (101) further includes a ninth switch circuit (704) configured to selectively connect or disconnect the seventh power amplifier (242) and the second power path (239).

[0227] For example, the second switch circuit (703) may be controlled so as not to connect the power amplifier (241) and the power path (237) according to the control of the at least one processor (210) or the RF transceiver (220). The third switch circuit (705) may be controlled so as not to connect the second power amplifier (251) and the second power path (239) according to the control of the at least one processor (210) or the RF transceiver (220). The eighth switch circuit (702) may be controlled to connect the second power path (239) and the thermistor (235) according to the control of the at least one processor (210) or the RF transceiver (220). The ninth switch circuit (704) can be controlled to connect the seventh power amplifier (242) and the second power path (239) according to the control of the at least one processor (210) or the RF transceiver (220).

[0228] For example, the RFFE module (240) may be configured to refrain from using the seventh power amplifier (242) under the control of at least one processor (210) or the RF transceiver (220), based on a voltage value less than the threshold voltage value obtained by the PMIC (230) while the seventh power amplifier (242) and the second power path (239) are connected. While the seventh power amplifier (242) and the second power path (239) are connected, the seventh power amplifier (242) and the thermistor circuit (235) may be connected in parallel.

[0229] For example, the third switch circuit (705) may be controlled to connect the second power amplifier (251) and the second power path (239) according to the control of the at least one processor (210) or the RF transceiver (220). The ninth switch circuit (704) may be controlled not to connect the seventh power amplifier (242) and the second power path (239) according to the control of the at least one processor (210) or the RF transceiver (220).

[0230] For example, the second RFFE module (250) may be configured to refrain from using the second power amplifier (251) under the control of at least one processor (210) or the RF transceiver (220), based on a voltage value less than the threshold voltage value obtained by the PMIC while the second power amplifier (251) and the second power path (239) are connected. While the second power amplifier (251) and the second power path (239) are connected, the second power amplifier (251) and the thermistor circuit (235) may be connected in parallel.

[0231] The electronic device (101) described above may include at least one processor (210) including a processing circuit. The electronic device (101) may include an RF (radio frequency) transceiver (220). The electronic device (101) may include an RFFE (radio frequency front end) module (240) including a power amplifier (241). The electronic device (101) may include a power supply circuit (236) for providing a supply voltage through a power path (237). The electronic device (101) may include a thermistor circuit (235). The electronic device (101) may include a first switch circuit (402) configured to selectively connect or disconnect the power path (237) and the power amplifier (241). The electronic device (101) may include a second switch circuit (401) configured to selectively connect or disconnect the thermistor circuit (235) and the power path (237). The electronic device (101) may include a power management integrated circuit (PMIC) (230) connected to the thermistor circuit (235). The second switch circuit (401) may be controlled to connect the power path (237) and the thermistor circuit (235) according to the control of the at least one processor (210) or the RF transceiver (220). The PMIC (230) may be configured to identify a voltage value corresponding to a parallel resistance between the power amplifier (241) and the thermistor circuit (235) according to the control of the at least one processor (210) or the RF transceiver (220).The first switch circuit (402) may be controlled not to connect the power amplifier (241) and the power path (237) based on the voltage value below the threshold voltage value, under the control of at least one processor (210) or the RF transceiver (220).

[0232] For example, the electronic device may include a second RFFE module including a second power amplifier. The electronic device may include a third switch circuit configured to selectively connect or disconnect the second power amplifier from the power path. The third switch circuit may be controlled to connect the second power amplifier to the power path according to the control of the at least one processor or the RF transceiver.

[0233] For example, the second RFFE module may be configured to refrain from using the second power amplifier under the control of at least one processor or the RF transceiver, based on a voltage value less than the threshold voltage value obtained by the PMIC while the second power amplifier and the power path are connected. While the second power amplifier and the power path are connected, the second power amplifier and the thermistor circuit may be connected in parallel.

[0234] For example, the electronic device may include a second power supply circuit for providing a second supply voltage through a second power path. The electronic device may include a second RFFE module including a second power amplifier. The electronic device may include a third RFFE module including a third power amplifier. The electronic device may include a fourth RFFE module including a fourth power amplifier. The electronic device may include a fifth RFFE module including a fifth power amplifier and a sixth power amplifier. The electronic device may include a third switch circuit configured to selectively connect or disconnect the second power amplifier and the power path. The electronic device may include a fourth switch circuit configured to selectively connect or disconnect the third power amplifier and the power path. The electronic device may include a fifth switch circuit configured to selectively connect or disconnect the third power path connected to the fourth power amplifier and the power supply circuit. The electronic device may include a sixth switch circuit configured to selectively connect or disconnect the fifth power amplifier and the second power path. The electronic device may include a seventh switch circuit configured to selectively connect or disconnect the sixth power amplifier and the second power path. The electronic device may include an eighth switch circuit configured to selectively connect or disconnect the power path to one of the second power path or the third power path.

[0235] For example, the third switch circuit may be controlled to connect the second power amplifier and the power path according to the control of the at least one processor or the RF transceiver. The fourth switch circuit may be controlled not to connect the third power amplifier and the power path according to the control of the at least one processor or the RF transceiver. The eighth switch circuit may be controlled not to connect the power path to the second power path and the third power path according to the control of the at least one processor or the RF transceiver.

[0236] For example, the second RFFE module may be configured to refrain from using the second power amplifier under the control of at least one processor or the RF transceiver, based on a voltage value less than the threshold voltage value obtained by the PMIC while the second power amplifier and the power path are connected. While the second power amplifier and the power path are connected, the second power amplifier and the thermistor circuit may be connected in parallel.

[0237] For example, the third switch circuit may be controlled not to connect the second power amplifier and the power path under the control of the at least one processor or the RF transceiver. The fourth switch circuit may be controlled to connect the third power amplifier and the power path under the control of the at least one processor or the RF transceiver.

[0238] For example, the third RFFE module may be configured to refrain from using the third power amplifier under the control of at least one processor or the RF transceiver, based on a voltage value less than the threshold voltage value obtained by the PMIC while the third power amplifier and the power path are connected. While the third power amplifier and the power path are connected, the third power amplifier and the thermistor circuit may be connected in parallel.

[0239] For example, the fourth switch circuit may be controlled so as not to connect the third power amplifier and the power path, depending on the control of the at least one processor or the RF transceiver. The fifth switch circuit may be controlled so as to connect the fourth power amplifier and the third power path, depending on the control of the at least one processor or the RF transceiver. The eighth switch circuit may be controlled so as to connect the power path and the third power path, depending on the control of the at least one processor or the RF transceiver.

[0240] For example, the fourth RFFE module may be configured to refrain from using the fourth power amplifier under the control of at least one processor or the RF transceiver, based on a voltage value less than the threshold voltage value obtained by the PMIC while the fourth power amplifier and the third power path are connected. While the fourth power amplifier and the third power path are connected, the fourth power amplifier and the thermistor circuit may be connected in parallel.

[0241] For example, the sixth switch circuit may be controlled to connect the fifth power amplifier and the second power path according to the control of the at least one processor or the RF transceiver. The seventh switch circuit may be controlled not to connect the sixth power amplifier and the second power path according to the control of the at least one processor or the RF transceiver. The eighth switch circuit may be controlled to connect the power path and the second power path according to the control of the at least one processor or the RF transceiver.

[0242] For example, the fifth RFFE module may be configured to refrain from using the fifth power amplifier under the control of at least one processor or the RF transceiver, based on a voltage value less than the threshold voltage value obtained by the PMIC while the fifth power amplifier and the second power path are connected. While the fifth power amplifier and the second power path are connected, the fifth power amplifier and the thermistor circuit may be connected in parallel.

[0243] For example, the sixth switch circuit may be controlled not to connect the fifth power amplifier and the second power path under the control of the at least one processor or the RF transceiver. The seventh switch circuit may be controlled to connect the sixth power amplifier and the second power path under the control of the at least one processor or the RF transceiver.

[0244] For example, the fifth RFFE module may be configured to refrain from using the sixth power amplifier under the control of at least one processor or the RF transceiver, based on a voltage value less than the threshold voltage value obtained by the PMIC while the sixth power amplifier and the second power path are connected. While the sixth power amplifier and the second power path are connected, the sixth power amplifier and the thermistor circuit may be connected in parallel.

[0245] For example, the electronic device may include a second power supply circuit including a second power path for providing a second supply voltage. The electronic device may include a second RFFE module including a second power amplifier. The electronic device may include a seventh power amplifier included in the RFFE module. The electronic device may include an eighth switch circuit configured to selectively connect or disconnect the second power amplifier and the second power path. The electronic device may include a ninth switch circuit configured to selectively connect or disconnect the thermistor circuit and the second power path. The electronic device may include a tenth switch circuit configured to selectively connect or disconnect the seventh power amplifier and the second power path.

[0246] For example, the eighth switch circuit may be controlled not to connect the second power amplifier and the second power path under the control of the at least one processor or the RF transceiver. The ninth switch circuit may be controlled to connect the second power path and the thermistor under the control of the at least one processor or the RF transceiver. The tenth switch circuit may connect the seventh power amplifier and the second power path under the control of the at least one processor or the RF transceiver.

[0247] For example, the RFFE module may be configured to refrain from using the seventh power amplifier under the control of at least one processor or the RF transceiver, based on a voltage value less than the threshold voltage value obtained by the PMIC while the seventh power amplifier and the second power path are connected. While the seventh power amplifier and the second power path are connected, the seventh power amplifier and the thermistor circuit may be connected in parallel.

[0248] For example, the eighth switch circuit may be controlled to connect the second power amplifier and the second power path according to the control of the at least one processor or the RF transceiver. The tenth switch circuit may be controlled not to connect the seventh power amplifier and the second power path according to the control of the at least one processor or the RF transceiver.

[0249] For example, the second RFFE module may be configured to refrain from using the second power amplifier under the control of at least one processor or the RF transceiver, based on a voltage value less than the threshold voltage value obtained by the PMIC while the second power amplifier and the second power path are connected. While the second power amplifier and the second power path are connected, the second power amplifier and the thermistor circuit may be connected in parallel.

[0250] The RFFE (radio frequency front end) module (240) described above may include a power amplifier (241). The RFFE module (240) may include a first switch circuit (402) configured to selectively connect or not connect the power path (237) of a power supply circuit (236) for providing a supply voltage to the power amplifier (241). The RFFE module (240) may include a second switch circuit (401) configured to selectively connect or not connect the power path (237) to a thermistor circuit (235). The second switch circuit (401) may be controlled to connect the power path (237) to the thermistor circuit (235) according to the control of at least one processor (210) or RF (radio frequency) transceiver (220). The first switch circuit (402) may be controlled not to connect the power amplifier (241) and the power path (237) according to the control of at least one processor (210) or the RF transceiver (220), based on a voltage value corresponding to the parallel resistance between the power path (237) and the thermistor circuit (235) which is less than a threshold voltage value.

[0251] The effects obtainable from the present disclosure are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art to which the present disclosure belongs.

[0252] Any of the embodiments described above may be combined with any other embodiment (or combination of embodiments) unless otherwise explicitly stated. The foregoing description of one or more embodiments is for illustrative and explanatory purposes only, and is not intended to limit or exhaust the scope of the embodiments in the exact form disclosed. Modifications and variations are possible in light of the foregoing teachings or may be obtained from the practice of various embodiments.

[0253] Methods according to the claims or embodiments described in the specification of the present disclosure may be implemented in the form of hardware, software, or a combination of hardware and software.

[0254] When implemented in software, a computer-readable storage medium (e.g., a non-transient computer-readable storage medium) storing one or more programs (software modules) may be provided. One or more programs stored in the computer-readable storage medium are configured for execution by one or more processors within an electronic device. One or more programs include instructions that cause the electronic device to execute methods according to the claims or embodiments described in the specification of this disclosure. The one or more programs may be provided as a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or distributed online (e.g., download or upload) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created on a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0255] Such programs (software modules, software) may be stored in random access memory, non-volatile memory including flash memory, read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), magnetic disc storage devices, compact disc-ROM (CD-ROM), digital versatile discs (DVDs), or other forms of optical storage devices, magnetic cassettes. Alternatively, they may be stored in memory composed of some or all of these. Additionally, each constituent memory may include multiple units.

[0256] Additionally, the program may be stored on an attachable storage device that can be accessed via a communication network such as the Internet, Intranet, LAN (local area network), WAN (wide area network), or SAN (storage area network), or a combination thereof. Such a storage device may be connected to a device performing an embodiment of the present disclosure through an external port. Additionally, a separate storage device on a communication network may be connected to a device performing an embodiment of the present disclosure.

[0257] In the specific embodiments of the present disclosure described above, the components included in the disclosure are expressed in a singular or plural form according to the specific embodiments presented. However, the singular or plural expression is selected to suit the situation presented for convenience of explanation, and the present disclosure is not limited to singular or plural components; even if a component is expressed in the plural form, it may be composed of a singular form, and even if a component is expressed in the singular form, it may be composed of a plural form.

[0258] According to the embodiments, one or more of the aforementioned components or operations may be omitted, or one or more other components or operations may be added. Generally or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the plurality of components in the same or similar manner as those performed by the corresponding component among the plurality of components prior to the integration. According to the embodiments, operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0259] Meanwhile, although specific embodiments have been described in the detailed description of the present disclosure, it is understood that various modifications are possible within the scope of the present disclosure.

Claims

1. In an electronic device, At least one processor including a processing circuit; RF (radio frequency) transceiver; RFFE (radio frequency front end) module including a power amplifier; Power supply circuit for providing supply voltage through a power path; Thermistor circuit; A first switch circuit configured to selectively connect or not connect the above power path and the above power amplifier; A second switch circuit configured to selectively connect or not connect the thermistor circuit and the power path; and It includes a PMIC (power management integrated circuit) connected to the thermistor circuit above, and The second switch circuit is controlled to connect the power path and the thermistor circuit according to the control of the at least one processor or the RF transceiver, and The above PMIC is configured to identify a voltage value corresponding to a parallel resistance between the power amplifier and the thermistor circuit under the control of the at least one processor or the RF transceiver, and The first switch circuit is controlled not to connect the power amplifier and the power path based on the voltage value below a threshold voltage value, under the control of at least one processor or the RF transceiver. Electronic device.

2. In Paragraph 1, A second RFFE module including a second power amplifier; and It further includes a third switch circuit configured to selectively connect or disconnect the second power amplifier and the power path, and The third switch circuit is controlled to connect the second power amplifier and the power path according to the control of the at least one processor or the RF transceiver. Electronic device.

3. In Paragraph 2, The second RFFE module is configured to refrain from using the second power amplifier based on a voltage value less than the threshold voltage value obtained by the PMIC while the second power amplifier and the power path are connected, under the control of at least one processor or the RF transceiver. While the second power amplifier and the power path are connected, the second power amplifier and the thermistor circuit are connected in parallel. Electronic device.

4. In Paragraph 1, A second power supply circuit for providing a second supply voltage through a second power path; A second RFFE module including a second power amplifier; A third RFFE module including a third power amplifier; A fourth RFFE module including a fourth power amplifier; A fifth RFFE module including a fifth power amplifier and a sixth power amplifier; A third switch circuit configured to selectively connect or disconnect the second power amplifier and the power path; A fourth switch circuit configured to selectively connect or disconnect the third power amplifier and the power path; A fifth switch circuit configured to selectively connect or disconnect a third power path connected to the fourth power amplifier and the power supply circuit; A sixth switch circuit configured to selectively connect or disconnect the fifth power amplifier and the second power path; A seventh switch circuit configured to selectively connect or disconnect the sixth power amplifier and the second power path; and A further comprising an eighth switch circuit configured to selectively connect or not connect the above power path to one of the second power path or the third power path, Electronic device.

5. In Paragraph 4, The third switch circuit is controlled to connect the second power amplifier and the power path according to the control of the at least one processor or the RF transceiver, and The fourth switch circuit is controlled not to connect the third power amplifier and the power path according to the control of the at least one processor or the RF transceiver, and The eighth switch circuit is controlled such that, under the control of the at least one processor or the RF transceiver, the power path is not connected to the second power path and the third power path. Electronic device.

6. In Paragraph 5, The second RFFE module is configured to refrain from using the second power amplifier under the control of at least one processor or the RF transceiver, based on a voltage value less than the threshold voltage value obtained by the PMIC while the second power amplifier and the power path are connected, and While the second power amplifier and the power path are connected, the second power amplifier and the thermistor circuit are connected in parallel. Electronic device.

7. In Paragraph 6, The third switch circuit is controlled not to connect the second power amplifier and the power path according to the control of the at least one processor or the RF transceiver, and The fourth switch circuit is controlled to connect the third power amplifier and the power path according to the control of the at least one processor or the RF transceiver. Electronic device.

8. In Paragraph 7, The third RFFE module is configured to refrain from using the third power amplifier under the control of at least one processor or the RF transceiver, based on a voltage value less than the threshold voltage value obtained by the PMIC while the third power amplifier and the power path are connected, and While the third power amplifier and the power path are connected, the third power amplifier and the thermistor circuit are connected in parallel. Electronic device.

9. In Paragraph 8, The above-mentioned fourth switch circuit is controlled not to connect the third power amplifier and the power path according to the control of the at least one processor or the RF transceiver, and The above-mentioned fifth switch circuit is controlled such that the fourth power amplifier and the third power path are connected according to the control of the at least one processor or the RF transceiver, and The eighth switch circuit is controlled such that the power path and the third power path are connected according to the control of the at least one processor or the RF transceiver. Electronic device.

10. In Paragraph 9, The fourth RFFE module is configured to refrain from using the fourth power amplifier based on a voltage value less than the threshold voltage value obtained by the PMIC while the fourth power amplifier and the third power path are connected, under the control of at least one processor or the RF transceiver. While the fourth power amplifier and the third power path are connected, the fourth power amplifier and the thermistor circuit are connected in parallel. Electronic device.

11. In Paragraph 10, The sixth switch circuit is controlled to connect the fifth power amplifier and the second power path according to the control of the at least one processor or the RF transceiver, and The above seventh switch circuit is controlled not to connect the sixth power amplifier and the second power path according to the control of the at least one processor or the RF transceiver, and The above eighth switch circuit is controlled such that the power path and the second power path are connected according to the control of the at least one processor or the RF transceiver. Electronic device.

12. In Paragraph 11, The fifth RFFE module is configured to refrain from using the fifth power amplifier based on a voltage value less than the threshold voltage value obtained by the PMIC while the fifth power amplifier and the second power path are connected, under the control of at least one processor or the RF transceiver. While the fifth power amplifier and the second power path are connected, the fifth power amplifier and the thermistor circuit are connected in parallel. Electronic device.

13. In Paragraph 12, The sixth switch circuit is controlled not to connect the fifth power amplifier and the second power path according to the control of the at least one processor or the RF transceiver, and The above seventh switch circuit is controlled to connect the sixth power amplifier and the second power path according to the control of the at least one processor or the RF transceiver, Electronic device.

14. In Paragraph 13, The fifth RFFE module is configured to refrain from using the sixth power amplifier under the control of at least one processor or the RF transceiver, based on a voltage value less than the threshold voltage value obtained by the PMIC while the sixth power amplifier and the second power path are connected, and While the sixth power amplifier and the second power path are connected, the sixth power amplifier and the thermistor circuit are connected in parallel. Electronic device.

15. In an RFFE (radio frequency front end) module, Power amplifier; A first switch circuit configured to selectively connect or disconnect the power path of the power supply circuit for providing the power amplifier and the supply voltage; It includes a thermistor circuit and a second switch circuit configured to selectively connect or disconnect the power path, and The second switch circuit is controlled to connect the power path and the thermistor circuit according to the control of at least one processor or RF (radio frequency) transceiver, and The first switch circuit is controlled not to connect the power amplifier and the power path according to the control of the at least one processor or the RF transceiver, based on a voltage value corresponding to the parallel resistance between the power path and the thermistor circuit that is less than a threshold voltage value. RFFE module.

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