Substrate thickness measurement apparatus and method

Abstract

Disclosed are a substrate thickness measurement apparatus and method, whereby the thickness of a substrate wound on a process roll in a roll-to-roll (R2R) process can be measured in-line with high accuracy. The substrate thickness measurement apparatus according to an embodiment of the present invention comprises: a sensor unit that calculates thickness measurement data by measuring a distance for calculating the thickness of a substrate supported on a rotatably-provided process roll; a driving unit configured to move the sensor unit in a width direction parallel to a rotation axis of the process roll; a storage unit that stores thickness correction data, corresponding to a thickness correction value in the width direction, for the process roll; and a thickness calculation unit that calculates the thickness of the substrate by correcting the thickness measurement data, obtained while moving the sensor unit in the width direction, on the basis of the thickness correction data. The driving unit scan drives the sensor unit in the width direction so that the sensor unit is synchronized with a circumferential position indicating the rotation angle of the process roll.

Description

Device and method for measuring substrate thickness

[0001] The present invention relates to a substrate thickness measuring device and method, and more specifically, to a substrate thickness measuring device and method capable of measuring the thickness of a substrate wound on a process roll of a roll-to-roll (R2R) process in-line with high accuracy.

[0002] Processes such as battery electrode coating, film extrusion processes including BOPE (Biaxially Oriented Polyethylene) and separators, and film coating processes are performed by roll-to-roll (R2R, RtR) processes, and it is necessary to measure the thickness of the substrate, such as the coating film thickness or extrusion thickness, during the R2R process. If errors occur in the thickness of the substrate or if thickness deviations occur in the width direction, losses due to product defects may occur, and to reduce such losses, technology is required to measure the thickness of the substrate in-line in real time during the R2R process.

[0003] To measure the thickness of a substrate between process rolls in an R2R process, a method may be considered in which sensors are positioned to face each other from above and below the substrate while it is in a free-standing state between the rolls to measure the thickness of the coating or film. This method of measuring product thickness is verified through sampling, but since it requires the shutdown of the production equipment, it becomes a factor that reduces productivity.

[0004] In addition, mechanical settings are required to prevent misalignment of the measurement sensor and to ensure accurate alignment of the sensor, and sensor calibration is also required to correct the difference between the actual thickness value of the product sample and the sensor measurement value. Furthermore, due to negative pressure phenomena in the R2R process room, fluctuations caused by the air blower, and periodic fluctuations in motor vibrations during process roll rotation, measurement errors in the substrate thickness may occur.

[0005] On the other hand, there is a method utilizing transmission measuring instruments based on radioisotope sources, but this carries a risk of radiation exposure. For example, in roll-to-roll processes, the amount of β-ray radioisotope penetration is measured on a free-standing substrate after the drying process to calculate the loading level, or the weight per unit area of ​​the substrate. However, the β-ray measurement-based loading level method cannot be used as accurate quality data due to the large variation in loading levels across different products; it is only suitable for monitoring data trends. Furthermore, the β-ray measurement method requires additional work to calibrate the β-ray values ​​through periodic actual measurements of the loading level. For instance, the process must involve measuring the weight of a 5 cm x 5 cm sample after die stamping. Moreover, the presence of radiation safety specialists, along with periodic management by specialized radioisotope inspection and calibration companies, increases process costs and reduces process efficiency.

[0006] The present invention is intended to provide a substrate thickness measuring device and method capable of measuring the thickness of a substrate wound on a process roll of a roll-to-roll (R2R) process in-line with high accuracy.

[0007] In addition, the present invention is intended to provide a substrate thickness measuring device and method capable of measuring the loading level of a substrate with high accuracy in-line based on the thickness and temperature of the substrate wound on a process roll of a roll-to-roll process.

[0008] In addition, the present invention is intended to acquire a thickness / temperature profile in the diagonal direction of the process roll to efficiently correct thickness deviations of the substrate according to the width and circumferential directions of the process roll, and to reduce the time required to adjust process conditions for measuring the substrate thickness.

[0009] In addition, the present invention is intended to reduce the measurement error of the substrate thickness caused by the air blower due to negative (-) pressure phenomena in the R2R process room and the periodic fluctuation of motor vibration during process roll rotation.

[0010] Furthermore, the present invention aims to prevent product defect losses by measuring the thickness and temperature of a substrate in real time without the need for actual measurement by sampling during the product manufacturing process, and to accurately measure the thickness of a substrate without the risk of radiation exposure.

[0011] In addition, the present invention is intended to simultaneously measure thickness and temperature at different positions in the width direction of the process roll immediately after film extrusion or coating, and to efficiently and precisely detect left-right thickness non-uniformity defects resulting from film extrusion or coating.

[0012] The technical problems that the present invention aims to solve are not limited to those mentioned above, and other unmentioned technical problems will be clearly understood by those skilled in the art from the description below.

[0013] A substrate thickness measuring device according to an embodiment of the present invention may include: a sensor unit that calculates thickness measurement data by measuring a distance for calculating the thickness of a substrate supported on a process roll that is rotatably arranged; a driving unit configured to move the sensor unit in a width direction parallel to the rotation axis of the process roll; a storage unit that stores thickness correction data corresponding to a thickness correction value in the width direction with respect to the process roll; and a thickness calculation unit that calculates the thickness of the substrate by correcting the thickness measurement data obtained while moving the sensor unit in the width direction based on the thickness correction data.

[0014] The above driving unit can drive the sensor unit to scan in the width direction so as to be synchronized with the circumferential position representing the rotation angle of the process roll.

[0015] The sensor unit may be configured to measure the thickness and temperature of the substrate supported on the process roll.

[0016] A substrate thickness measuring device according to an embodiment of the present invention may further include a loading level calculation unit that calculates a loading level representing the weight per unit area of ​​the substrate based on the thickness and temperature of the substrate.

[0017] The thickness measurement data may include the thickness profile in the width direction obtained for the substrate as the sensor unit moves in the width direction by the driving unit.

[0018] The sensor unit can acquire the thickness profile along the diagonal direction traversing the width direction of the process roll and the circumference direction of the process roll while moving in conjunction with the rotation of the process roll by the driving unit.

[0019] A substrate thickness measuring device according to an embodiment of the present invention may further include a rotation measuring unit for measuring the rotation angle of the process roll; and a synchronization unit that synchronizes the encoder position within the rotation area measured by the rotation measuring unit with the corresponding movement position within the linear movement area of ​​the sensor unit that is scanned and driven.

[0020] The sensor unit may include a thickness sensor for measuring the coating thickness or extrusion film thickness on the substrate; and a temperature sensor for measuring the coating temperature or extrusion film temperature on the substrate.

[0021] The thickness sensor can obtain a thickness correction profile of the coating thickness or the extrusion film thickness along the diagonal direction of the process roll.

[0022] The temperature sensor can obtain a temperature correction profile of the coating temperature or the extrusion film temperature along the diagonal direction of the process roll.

[0023] The thickness calculation unit above can calculate the thickness of the substrate by correcting the thickness profile based on the thickness correction profile and the temperature correction profile.

[0024] The sensor unit can acquire the thickness profile along the diagonal direction of the process roll while scanning left and right in the width direction of the process roll as the process roll rotates 360°.

[0025] The thickness correction data above can represent a thickness variation profile in the width direction according to at least one of the roundness, straightness, equipment vibration variation, and mechanism setting position deviation of the process roll.

[0026] A substrate thickness measuring device according to an embodiment of the present invention may further include a thickness correction data calculation unit that calculates the thickness correction data based on a thickness profile obtained along the width direction by the sensor unit with respect to the process roll.

[0027] The thickness calculation unit can calculate the thickness of the substrate and the thickness deviation in the width direction of the substrate through a difference operation between the thickness measurement data obtained for the substrate by the sensor unit and the thickness correction data.

[0028] The sensor unit may include a thickness sensor that calculates thickness measurement data by measuring the distance to the substrate to calculate the thickness of the coating film or extrusion film of the substrate; and a temperature sensor for measuring the temperature of the coating film or the temperature of the extrusion film on the substrate.

[0029] The above loading level calculation unit calculates the density of a coating film or extrusion film corresponding to the temperature of the substrate based on the temperature of the substrate; and can calculate the loading level of the substrate by multiplying the density of the coating film or extrusion film by the thickness of the coating film or extrusion film.

[0030] The above loading level calculation unit can calculate the loading level of the substrate by multiplying the solid content of the coating film coated on the substrate, the density of the coating film, and the thickness of the coating film.

[0031] The thickness sensor can calculate the thickness measurement data for a set measurement position in the above-described material in a fixed mode in which the sensor part is fixed without moving.

[0032] The temperature sensor can measure the temperature of the coating film or extrusion film at the measurement location in the fixed mode.

[0033] A method for measuring the thickness of a substrate according to an embodiment of the present invention may include: a step of obtaining thickness measurement data by measuring a distance for calculating the thickness of a substrate supported on a process roll by the sensor unit while moving a sensor unit in a width direction parallel to the rotation axis of a process roll; and a step of calculating the thickness of the substrate by correcting the thickness measurement data based on thickness correction data by a thickness calculation unit.

[0034] The above thickness correction data can represent a thickness correction value in the width direction for the process roll.

[0035] The step of acquiring the thickness measurement data may include the step of scanning and driving the sensor unit in the width direction by the driving unit so as to be synchronized with the circumferential position representing the rotation angle of the process roll.

[0036] A method for measuring the thickness of a substrate according to an embodiment of the present invention may further include the step of measuring the thickness and temperature of a substrate supported on a process roll by the sensor unit; and the step of calculating a loading level representing the weight per unit area of ​​the substrate based on the thickness and temperature of the substrate by the loading level calculation unit.

[0037] The thickness measurement data above may include a thickness profile in the width direction obtained for the substrate while the sensor unit moves in the width direction by the driving unit.

[0038] The step of acquiring the thickness measurement data may include the step of acquiring the thickness profile along a diagonal direction traversing the width direction of the process roll and the circumference direction of the process roll while moving in conjunction with the rotation of the process roll by the driving unit.

[0039] The step of acquiring the thickness measurement data may include: a step of measuring the coating thickness or extrusion film thickness on the substrate by the thickness sensor of the sensor unit; and a step of measuring the coating temperature or extrusion film temperature on the substrate by the temperature sensor of the sensor unit.

[0040] The step of measuring the thickness may include obtaining a thickness correction profile of the coating thickness or the extrusion film thickness along the diagonal direction of the process roll.

[0041] The step of measuring the temperature may include obtaining a temperature correction profile of the coating temperature or the extrusion film temperature along the diagonal direction of the process roll.

[0042] The step of calculating the thickness of the above-mentioned material may include the step of calculating the thickness of the above-mentioned material by correcting the thickness profile based on the thickness correction profile and the temperature correction profile.

[0043] The step of acquiring the thickness measurement data may include the step of acquiring the thickness profile along the diagonal direction of the process roll while scanning left and right in the width direction of the process roll while the process roll rotates 360°.

[0044] The thickness correction data above can represent a thickness variation profile in the width direction according to at least one of the roundness, straightness, equipment vibration variation, and mechanism setting position deviation of the process roll.

[0045] A method for measuring the thickness of a substrate according to an embodiment of the present invention may further include a step of calculating the thickness correction data based on a thickness profile obtained along the width direction by the sensor unit with respect to the process roll by a thickness correction data calculation unit.

[0046] The step of calculating the thickness of the above-mentioned substrate may include: a step of calculating the thickness of the above-mentioned substrate through a difference operation between the thickness measurement data obtained for the above-mentioned substrate by the sensor unit and the thickness correction data; and a step of calculating the thickness deviation in the width direction of the above-mentioned substrate.

[0047] In addition, according to an embodiment of the present invention, a computer-readable non-transient recording medium is provided on which a computer program for executing the above-described thickness measurement method is recorded.

[0048] According to an embodiment of the present invention, a substrate thickness measuring device and method are provided that can measure the thickness of a substrate wound on a process roll of a roll-to-roll (R2R) process in-line with high accuracy.

[0049] According to an embodiment of the present invention, a substrate thickness measuring device and method are provided that can measure the loading level of a substrate with high accuracy in-line based on the thickness and temperature of the substrate wound on a process roll of a roll-to-roll process.

[0050] In addition, according to an embodiment of the present invention, by obtaining a thickness / temperature profile in the diagonal direction of the process roll, the thickness deviation of the substrate according to the width direction and circumferential direction of the process roll can be efficiently corrected, and the time for adjusting process conditions can be reduced.

[0051] In addition, according to an embodiment of the present invention, the measurement error of the substrate thickness caused by the air blower due to the negative (-) pressure phenomenon in the R2R process room and the periodic variation of motor vibration during process roll rotation can be reduced.

[0052] In addition, according to an embodiment of the present invention, product defect losses can be prevented through real-time thickness and temperature measurement of the substrate without the need for actual measurement by sampling during the product manufacturing process, and the thickness of the substrate can be accurately measured without the risk of radiation exposure.

[0053] In addition, according to an embodiment of the present invention, thickness and temperature can be simultaneously measured at each position in the width direction of the process roll immediately after film extrusion or coating, and left-right thickness non-uniformity defects resulting from film extrusion or coating can be efficiently and precisely detected.

[0054] The effects that the present invention aims to achieve are not limited to those mentioned above, and other unmentioned effects can be clearly understood by those skilled in the art from the description below.

[0055] FIG. 1 is a conceptual diagram of a substrate thickness measuring device according to an embodiment of the present invention.

[0056] FIG. 2 is a perspective view showing a substrate thickness measuring device according to an embodiment of the present invention.

[0057] FIG. 3 is a diagram showing the process of calculating thickness correction data by a substrate thickness measuring device according to an embodiment of the present invention.

[0058] FIG. 4 is a diagram illustrating the scan position synchronization process of a driving unit constituting a substrate thickness measuring device according to an embodiment of the present invention.

[0059] FIG. 5 is a plan view showing the thickness of a substrate calculated in a diagonal direction across the width direction and circumferential direction of a process roll by a substrate thickness measuring device according to an embodiment of the present invention.

[0060] FIG. 6 is a flowchart of a method for measuring substrate thickness according to an embodiment of the present invention.

[0061] Figure 7 is a diagram showing the results of measuring thickness correction data by an in-line scan measurement mode system for a process roll.

[0062] FIG. 8 is comparison data of the repeatability of thickness correction data measured by a substrate thickness measuring device according to an embodiment of the present invention.

[0063] FIG. 9 is a diagram showing thickness correction data calculated from the average value of a thickness correction profile measured each time a process roll is rotated multiple times according to an embodiment of the present invention.

[0064] FIG. 10 is electrode coating thickness measurement data before correction calculated by the sensor unit according to an embodiment of the present invention.

[0065] FIG. 11 is the final thickness data corrected for the electrode coating thickness calculated by the sensor unit according to an embodiment of the present invention.

[0066] FIG. 12 is a flowchart of a method for measuring substrate thickness according to another embodiment of the present invention.

[0067] FIG. 13 is a conceptual diagram of a substrate thickness measuring device according to another embodiment of the present invention.

[0068] Figure 14 is an enlarged view of section 'A' of Figure 13.

[0069] FIG. 15 is a flowchart of a method for measuring substrate thickness according to another embodiment of the present invention.

[0070] FIG. 16 is a flowchart illustrating a method for measuring substrate thickness according to an embodiment of FIG. 15 in more detail.

[0071] FIG. 17 is an exemplary diagram showing a substrate to explain a method for measuring substrate thickness according to an embodiment of the present invention.

[0072] The advantages and features of the present invention and the methods for achieving them will become clear by referring to the embodiments described below in detail together with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below but may be implemented in various different forms. These embodiments are provided merely to ensure that the disclosure of the present invention is complete and to fully inform those skilled in the art of the scope of the invention, and the present invention is defined only by the scope of the claims. Accordingly, in some embodiments, well-known process steps, well-known device structures, and well-known techniques are not specifically described to avoid the present invention being interpreted ambiguously. Throughout the specification, like reference numerals refer to like components.

[0073] The technical concept of the present invention is not limited to some of the described embodiments and can be implemented in various different forms. Within the scope of the technical concept of the present invention, one or more of the components among the embodiments may be selectively combined or substituted, and it should be understood that new embodiments combining various embodiments are also included in this disclosure. Each component described as an integral may be implemented by dividing it into multiple elements, and likewise, components described as multiple elements may also be implemented in an integral form.

[0074] Terms containing ordinal numbers, such as "first," "second," etc., may be used to describe various components, but the meaning of the components is not limited by the ordinal numbers. Terms containing ordinal numbers are used solely for the purpose of distinguishing one component from another and are not limited by the essence, order, or sequence of the corresponding component. For example, without departing from the scope of the present invention, the second component may be named the first component, and similarly, the first component may be named the second component. Furthermore, if the meaning of the component does not depart from the scope of the present invention even without ordinal numbers such as "first" and "second," the component may be referred to by excluding the ordinal number.

[0075] The expression "and / or" is interpreted to mean that it may include one or more or all of the enumerated components; for example, "A and / or B" should be understood to include cases where A alone, B alone, or both A and B are included. In this application, terms such as "include," "provided," "have," and "composed of" are intended to specify the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and should not be interpreted as precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

[0076] FIG. 1 is a conceptual diagram of a substrate thickness measuring device according to an embodiment of the present invention. FIG. 2 is a perspective view showing a substrate thickness measuring device according to an embodiment of the present invention. FIG. 3 is a diagram showing the process of calculating thickness correction data by a substrate thickness measuring device according to an embodiment of the present invention. Referring to FIG. 1 to FIG. 3, a substrate thickness measuring device (100) according to an embodiment of the present invention is for calculating the thickness of a substrate (20) wound and supported on a process roll (30) in-line, and for this purpose, it may include a sensor unit (110), a driving unit (120), a thickness correction data calculation unit (130), a storage unit (140), and a thickness calculation unit (150).

[0077] The sensor unit (110) can calculate thickness measurement data by measuring a distance for calculating the thickness of a substrate (20) supported on a process roll (30) that is rotatably provided. The substrate (20) may refer to a coating or film supported on a process roll (30), such as a coating roll and / or a cooling roll, used in a roll-to-roll (R2R) process such as a film extrusion process, a film coating process, a film extrusion process, a film coating process, etc., such as a composite membrane for water electrolysis (e.g., a BOPE (Biaxially Oriented Polyethylene) film), a separator, an alkaline water electrolysis membrane, or a PEM (Proton Exchange Membrane) water electrolysis membrane, but is not limited thereto. After the process is performed by a process device (10), such as an extrusion device or a coating device, the substrate (20) can be wound onto a process roll (30) and transferred to a subsequent process.

[0078] The sensor unit (110) may include a thickness sensor (111) for measuring the thickness of a substrate, such as the coating thickness or extrusion film thickness on the substrate (20), and a temperature sensor (112) for measuring the temperature of a substrate, such as the coating temperature or extrusion film temperature on the substrate (20). Examples of the thickness sensor (111) include a laser displacement sensor, an optical distance sensor, an infrared sensor, an ultrasonic sensor, and LiDAR (Light Detection and Ranging), but are not limited thereto. Examples of the temperature sensor (112) include an infrared temperature sensor and a thermal imaging camera, but are not limited thereto.

[0079] The driving unit (120) is configured to move the sensor unit (110) in the width direction (X) parallel to the rotation axis of the process roll (30). The driving unit (120) may be provided as a driving means capable of moving the sensor unit (110) in a linear reciprocating motion. The driving unit (120) may be provided as various driving means for moving the sensor unit (110). The driving unit (120) may be implemented, for example, as a driving motor such as a linear motor, a driving cylinder, a gear combination such as a rack / pinion or screw shaft, a driving belt, etc., but is not limited thereto.

[0080] In the illustrated embodiment, the driving unit (120) may include a moving frame (121) supporting the sensor unit (110), a guide rail (122) guiding the movement of the moving frame (121), and a driving device (123) that drives and moves the moving frame (121). The moving frame (121) may be provided to be movable in the width direction (X) parallel to the rotation axis of the process roll (30) along the guide rail (122). The guide rail (122) may be provided to extend along the width direction (X) of the process roll (30) to guide the linear reciprocating motion of the moving frame (121). The driving device (123) may drive the moving frame (121) so that the moving frame (121) moves along the guide rail (122).

[0081] FIG. 4 is a diagram illustrating the scan position synchronization process of a driving unit constituting a substrate thickness measuring device according to an embodiment of the present invention. FIG. 5 is a plan view showing the calculation of the thickness of a substrate in a diagonal direction crossing the width direction (X) and circumferential direction of a process roll by a substrate thickness measuring device according to an embodiment of the present invention. The driving unit (120) drives the sensor unit (110) to scan in the width direction (X) so as to be synchronized with a circumferential position representing the rotation angle of the process roll (30).

[0082] The thickness measurement data produced by the sensor unit (110) may be a thickness profile in the width direction (X, TD) obtained for the substrate (20) while the sensor unit (110) moves in the width direction (X) by the driving unit (120). The sensor unit (110) can produce a thickness profile by measuring the distance to the substrate (20) during the rotation of the process roll (30). Accordingly, the thickness profile produced by the sensor unit (110) may be provided as thickness data in the diagonal direction (TSD1, TSD2) that crosses the circumferential direction (MD) of the process roll (30) in the width direction (X, TD) parallel to the rotation axis (RAX) of the process roll (30).

[0083] In order to synchronize the rotation angle of the process roll (30) and the position of the sensor unit (110), the substrate thickness measuring device (100) may be equipped with a rotation measuring unit (160) and a synchronization unit (170). The rotation measuring unit (160) can measure the rotation angle of the process roll (30). In addition, the rotation measuring unit (160) may be equipped with a sensor for detecting one rotation of the process roll (30) in conjunction with this to measure the thickness of the substrate (20) for each rotation of the process roll (30). The sensor of the rotation measuring unit (160) for detecting the rotation angle of the process roll (30) may be provided, for example, as an encoder sensor that detects the rotation angle of the process roll (30), but any means capable of measuring the rotation angle of the process roll (30) may be used without particular limitation.

[0084] The synchronization unit (170) can synchronize the encoder position (161) within the rotational area (CRZ) of the process roll (30), measured by the rotational measuring unit (160), with the corresponding movement position (124) within the linear movement area (SLS) of the scan-driven sensor unit (110). When the movement position of the sensor unit (110) corresponding to various rotational angles of the process roll (30) is synchronized, the data subsequently collected at a specific position by the sensor unit (110) can be used to calculate the thickness of the substrate (20) related to the corresponding rotational angle of the process roll (30), that is, the thickness at a specific width direction position of the substrate (20). When the thickness of the substrate (20) is obtained continuously or discretely within a range set in the width direction, the set of thicknesses in the width direction (X) of the obtained substrate (20) forms a thickness profile.

[0085] The sensor unit (110) moves in conjunction with the rotation of the process roll (30) by the driving unit (120), and can acquire a thickness profile along the diagonal direction (TSD1, TSD2) that crosses the width direction (X, TD) of the process roll (30) and the circumference direction (MD) of the process roll (30). That is, because the process roll (30) rotates while the sensor unit (110) is moving, a thickness profile is acquired in the diagonal direction (TSD1, TSD2) on the circumferential surface of the process roll (30).

[0086] The sensor unit (110) can acquire a thickness profile along the diagonal direction (TSD1, TSD2) of the process roll (30) while scanning left and right in the width direction of the process roll (30) while the process roll (30) rotates 360°. Accordingly, while the process roll (30) rotates 180°, a first thickness profile is acquired in the diagonal direction (TSD1) from one side of the process roll (30) toward the other side while the process roll (30) rotates 180° further, and a second thickness profile is acquired in the diagonal direction (TSD2) from the other side toward the one side while the process roll (30) rotates another 180°.

[0087] The thickness sensor (111) of the sensor unit (110) can obtain a thickness correction profile related to the substrate thickness, such as the coating thickness or extrusion film thickness, along the diagonal direction (TSD1, TSD2) of the process roll (30). The thickness correction profile may be a thickness profile related to the process roll (30), the sensor unit (110), and the drive unit (120) that is measured in advance to correct the roundness, straightness, design error, and positional misalignment of the sensor unit (110) and the drive unit (120), rather than the thickness of the substrate (20) itself. Additionally, to correct thickness deviation related to temperature, the temperature sensor (112) of the sensor unit (110) can obtain a temperature correction profile related to the substrate temperature, such as the coating temperature or extrusion film temperature, along the diagonal direction (TSD1, TSD2) of the process roll (30).

[0088] The thickness correction data calculation unit (130) can calculate thickness correction data based on a thickness profile obtained along the width direction (X) by the sensor unit (110) for the process roll (30). The thickness correction data can represent a thickness variation profile in the width direction (X) according to the roundness, straightness, equipment vibration variation, and mechanism setting position deviation of the process roll (30). The thickness correction data can be provided as a thickness correction value in the width direction (X) for the process roll (30), more precisely in the diagonal direction (TSD1, TSD2) of the process roll (30). The thickness correction data calculated by the thickness correction data calculation unit (130) is stored in the storage unit (140). The storage unit (140) can be provided as a memory, a database, etc., for storing data.

[0089] The thickness calculation unit (150) calculates the thickness of the substrate (20) by correcting the thickness measurement data obtained while moving the sensor unit (110) in the width direction (X) based on the thickness correction data. The thickness calculation unit (150) can calculate the thickness of the substrate (20) by correcting the thickness profile obtained by the sensor unit (110) based on the thickness correction profile and temperature correction profile calculated by the thickness correction data calculation unit (130).

[0090] The thickness calculation unit (150) can calculate the thickness of the substrate (20) and the thickness deviation in the width direction (X) of the substrate (20) through a difference operation between the thickness measurement data obtained for the substrate (20) by the sensor unit (110) and the thickness correction data. The thickness of the substrate (20) can be calculated for each position along the width direction (X) of the process roll (30). The average thickness of the substrate (20) can be calculated by statistically processing the thickness values ​​of the substrate (20) along the width direction (X) of the process roll (30), such as by averaging, and the thickness deviation of the substrate (20) can be calculated by calculating the standard deviation, variance, etc. of the thickness values ​​of the substrate (20).

[0091] According to an embodiment of the present invention, the thickness of the substrate (20) wound on the process roll of the roll-to-roll (R2R) process can be accurately calculated in-line by compensating for error factors caused by vibration of the process roll (30) or misalignment of the sensor and driving mechanism through the deviation between the thickness profile measured by the sensor unit (110) and the thickness correction profile calculated in advance for the process roll (30).

[0092] In addition, according to an embodiment of the present invention, by obtaining a thickness / temperature profile in the diagonal direction (TSD1, TSD2) of the process roll, the thickness deviation of the substrate according to the width direction and circumferential direction of the process roll (30) can be efficiently corrected, and the time for adjusting process conditions to measure the thickness of the substrate (20) can be reduced. In addition, according to an embodiment of the present invention, the measurement error of the substrate thickness caused by the air blower due to the negative (-) pressure phenomenon in the R2R process room and the periodic variation of motor vibration during the rotation of the process roll can be reduced.

[0093] Furthermore, according to an embodiment of the present invention, product defect losses can be prevented through real-time thickness and temperature measurement of a substrate without the need for actual measurement by sampling during the product manufacturing process, and the thickness of the substrate can be accurately measured without the risk of radiation exposure. In addition, according to an embodiment of the present invention, thickness and temperature can be simultaneously measured at different positions in the width direction of the process roll immediately after film extrusion or coating, and left-right thickness non-uniformity defects resulting from film extrusion or coating can be efficiently and precisely detected.

[0094] FIG. 6 is a flowchart of a method for measuring substrate thickness according to an embodiment of the present invention. Referring to FIGS. 1 to 6, the method for measuring the thickness of a substrate according to an embodiment of the present invention comprises the steps of: driving a sensor unit (110) to scan and drive it in the width direction (X) of a process roll (30) so as to be synchronized with a circumferential position representing the rotation angle of the process roll (30) by a driving unit (120) (S61); calculating thickness correction data based on a thickness profile obtained by the sensor unit (110) along the width direction (X) of the process roll (30) by a thickness correction data calculation unit (130) (S62); moving the sensor unit (110) in the width direction (X) of the process roll (30) and measuring a distance to calculate the thickness of a substrate (20) supported on the process roll (30) by the sensor unit (110) to obtain thickness measurement data (S63); and correcting the thickness measurement data based on thickness correction data (thickness correction value in the width direction calculated for the process roll) by a thickness calculation unit (150). It may include a step (S64) of calculating the thickness of the substrate (20).

[0095] In step S61, the sensor unit (110) is driven to scan in the width direction (X) of the process roll (30) so as to be synchronized with the circumferential position representing the rotation angle of the process roll (30) by the driving unit (120). To this end, the driving unit (120) can adjust the driving speed for each position of the sensor unit (110) according to the synchronization data of the synchronization unit (170) so that the rotation angle of the process roll (30) and the position of the sensor unit (110) are synchronized.

[0096] In step S62, the thickness correction data calculation unit (130) calculates thickness correction data (thickness correction profile) by the sensor unit (110). The thickness correction data may be performed before the process of calculating the thickness of the substrate (20) in order to compensate for design errors or vibrations of the process roll (30), sensor unit (110), driving unit (120), etc. The thickness correction data may be calculated based on a thickness profile obtained along the width direction (X) of the process roll (30).

[0097] When thickness correction data is calculated in step S62, in step S63, while the sensor unit (110) is scanned by the driving unit (120) in the width direction (X) of the process roll (30), thickness measurement data (thickness profile) of the substrate (20) is calculated to measure the thickness of the substrate (20) wound on the process roll (30) in-line. When the distance for calculating the thickness of the substrate (20) supported on the process roll (30) is measured and thickness measurement data is obtained while the sensor unit (110) is scanned, step S64 is performed to calculate the thickness of the substrate (20) based on the thickness correction data.

[0098] In step S64, the thickness calculation unit (150) calculates the thickness of the substrate (20) for each position along the width direction (X) of the process roll (30) by correcting the thickness measurement data measured for the substrate (20) by the sensor unit (110) based on the thickness correction data (thickness correction value in the width direction calculated for the process roll). That is, the thickness calculation unit (150) can calculate the thickness profile of the substrate (20) in the width direction (X) of the process roll (30) by performing a difference operation between the thickness measurement data measured by the sensor unit (110) and the thickness correction data.

[0099] The thickness of the substrate (20) can be measured in-line in real time during the process of winding it onto the process roll (30). Accordingly, there is no need to stop the process to measure the thickness of the substrate (20), nor is there a need to perform sampling to measure the thickness of the substrate (20). In addition, since the thickness of the substrate (20) is calculated by considering the thickness variation factors at each position along the width direction (X) of the process roll (30), the thickness at each position along the width direction (X) of the substrate (20) can be accurately calculated.

[0100] To evaluate the feasibility and verify the performance of the present invention, an experiment was conducted by implementing an in-line scan measurement mode system. FIG. 7 is a diagram showing the results of measuring thickness correction data for a process roll using the in-line scan measurement mode system. FIG. 8 is comparison data (50) of the repeatability of thickness correction data measured by a substrate thickness measuring device according to an embodiment of the present invention. The measurement was performed a total of four times.

[0101] Through experiments, thickness correction data (40) measured in the width direction (TD) for the process roll according to the in-line scan measurement mode occurred in a similar pattern during four repeated experiments. This can be presumed to be because the roundness, straightness, vibration, and fluctuations resulting from the operation of the process roll (30), sensor unit (110), and driving unit (120) occur in a similar pattern during every rotation of the process roll (30).

[0102] During one rotation of the process roll, the thickness compensation data shows a pattern of gradually increasing and then decreasing, and exhibits a periodically vibrating fluctuation pattern. This fluctuation pattern is caused by periodic vibrations occurring during the internal lead pitch movement when the process roll motor is driven, and by the difference in measurement distance values ​​resulting from structural misalignment between the measurement unit and the object to be measured.

[0103] In order to reduce thickness measurement errors caused by factors such as the roundness and straightness of the process roll, equipment vibration fluctuations, and mechanism setting deviations, the process roll (30) is rotated multiple times, and a thickness correction profile is repeatedly measured and obtained for each rotation of the process roll, and the average value thereof is calculated to obtain thickness correction data. The thickness correction data is then used to measure the thickness of the substrate (20) by correcting the in-line scan mode thickness measurement data measured by the sensor unit (110).

[0104] FIG. 9 is a diagram showing thickness correction data (60) calculated from the average value of a thickness correction profile measured each time a process roll is rotated multiple times according to an embodiment of the present invention. FIG. 10 is electrode coating thickness measurement data (70) before correction calculated by a sensor unit according to an embodiment of the present invention. FIG. 11 is final thickness data (80) with the electrode coating thickness corrected calculated by a sensor unit (110) according to an embodiment of the present invention.

[0105] The thickness of the substrate (20) can be measured in real time for every rotation of the process roll (30) by performing a difference operation between the thickness profile measured by the sensor unit (110) while scanning and the thickness correction profile calculated in advance. Accordingly, the thickness of the substrate wound on the process roll of the roll-to-roll (R2R) process can be measured in-line with high accuracy. In addition, according to an embodiment of the present invention, by obtaining a thickness / temperature profile in the diagonal direction of the process roll, the thickness deviation of the substrate according to the width direction and circumference direction of the process roll can be efficiently corrected, and the time for adjusting process conditions can be reduced.

[0106] In addition, according to an embodiment of the present invention, measurement errors in substrate thickness caused by air blower-induced fluctuations due to negative (-) pressure phenomena in the R2R process room and periodic fluctuations in motor vibration during process roll rotation can be reduced. Furthermore, according to an embodiment of the present invention, product defect losses can be prevented through real-time thickness and temperature measurements of the substrate without the need for actual measurements by sampling during the product manufacturing process.

[0107] Furthermore, according to an embodiment of the present invention, the thickness of a substrate can be accurately measured without the risk of radiation exposure. According to an embodiment of the present invention, thickness and temperature can be simultaneously measured at different positions in the width direction of the process roll immediately after film extrusion or coating. In addition, according to an embodiment of the present invention, left-right thickness non-uniformity defects resulting from film extrusion or coating can be efficiently and precisely detected.

[0108] FIG. 12 is a flowchart of a method for measuring substrate thickness according to another embodiment of the present invention. The embodiment of FIG. 12 differs from the previously described embodiment in that it calculates the thickness of the substrate by considering a temperature profile along with a thickness profile. Redundant descriptions of components identical or corresponding to the previously described embodiment will be omitted, and the explanation will focus on the parts corresponding to the differences. Referring to FIG. 2 and FIG. 12, a thickness correction profile of the coating thickness or extrusion film thickness is obtained along the diagonal direction of the process roll (30) by the thickness correction data calculation unit (130) (S121). Next, a temperature correction profile of the coating temperature or extrusion film temperature is obtained along the diagonal direction of the process roll (30) (S122).

[0109] Next, the sensor unit (110) scans left and right in the width direction of the process roll, and acquires a thickness profile and a temperature profile along the diagonal direction of the process roll (S123). Next, a thickness correction profile corresponding to the temperature correction profile is determined, or the thickness correction profile is corrected based on the temperature correction profile (S124). Error factors related to the thickness measurement of the substrate (20) may change depending on the temperature of the process roll (30), the ambient temperature, the temperature of the substrate (20) wound on the process roll (30), etc. This is because vibrations and fluctuations of the process roll (30) or the substrate (20) may occur differently depending on the process conditions, and expansion / contraction of the process roll (30), roundness / shape deformation, etc., may occur depending on the temperature.

[0110] Next, the thickness of the substrate supported on the process roll is calculated through a difference operation between the thickness profile obtained for the substrate and the thickness correction profile corresponding to the temperature profile (S125). According to the embodiment of FIG. 12, the thickness correction profile can be corrected according to the temperature profile or one of various thickness correction profiles can be determined and the thickness of the substrate (20) can be measured through a difference operation with the thickness profile calculated for the substrate (20) based thereon.

[0111] For example, the thickness correction profile can be corrected by adjusting (increasing / decreasing) the positional correction value of the thickness correction profile according to the temperature value at each position in the width direction (X) of the temperature profile. The level of increase / decrease at each position of the thickness correction profile according to temperature can be pre-set to an appropriate value through various experiments. Alternatively, a thickness correction profile may be prepared for each of the various temperature profiles, and among the various thickness correction profiles, one thickness correction profile corresponding to the temperature profile measured by the sensor unit (110) may be selected, and the thickness profile of the substrate (20) may be calculated by performing a difference operation with the thickness measurement profile of the substrate (20) measured by the sensor unit (110) based on this.

[0112] FIG. 13 is a conceptual diagram of a substrate thickness measuring device according to another embodiment of the present invention. FIG. 14 is an enlarged view of section 'A' of FIG. 13. Referring to FIG. 13 and FIG. 14, a substrate thickness measuring device (100) according to an embodiment of the present invention measures the thickness and temperature of a substrate (20) that is wound and supported on a process roll (30) that is rotatably arranged, and can calculate the loading level of the substrate (20) based on the measured thickness and temperature of the substrate (20).

[0113] A substrate thickness measuring device (100) according to an embodiment of the present invention may include a sensor unit (110) and a loading level calculation unit (200). The sensor unit (110) can measure the thickness and temperature of a substrate (20) supported on a process roll (30). The sensor unit (110) can obtain thickness measurement data by measuring a distance to calculate the thickness of the substrate (20) supported on a process roll (30) that is rotatably provided, and can obtain temperature measurement data by calculating the temperature of the substrate (20).

[0114] The substrate (20) may refer to, for example, a substrate coated with a coating film or a substrate having a film formed thereon, supported on a process roll (30), such as a coating roll and / or a cooling roll, used in a roll-to-roll (RtR) process such as a battery electrode coating process, a film extrusion process, or a film coating process, but is not limited thereto. After the process is performed by a process device (10), such as an extrusion device or a coating device, the substrate (20) may be wound onto a process roll (30) and transferred to a subsequent process. In the example illustrated in FIG. 13, the substrate (20) is dried in a drying oven (11) and then wound onto a winding roll (33) through a nip roll (31) and a guide roll (32).

[0115] A sensor unit (110) for calculating a loading level for a substrate (20) is installed around a process roll (30), such as a coating roll or a guide roll, before being fed into a drying oven (11) after coating, and can measure the thickness and temperature in-line for a coating liquid or extrusion film, etc., in a state before solvent drying of the substrate (20) supported on the process roll (30). Based on the thickness and temperature of the substrate (20) measured by the sensor unit (110), the loading level calculation unit (200) can calculate an in-line loading level representing the weight per unit area of ​​the substrate (20) (dry weight of the coating layer per unit area).

[0116] The sensor unit (110) may include a thickness sensor (111) that measures the distance to the substrate (20) to calculate thickness measurement data in order to calculate the thickness of the coating film (coating thickness) and / or the thickness of the extruded film of the substrate (20), and a temperature sensor (112) for measuring the temperature of the coating film (coating temperature) and / or the temperature of the extruded film on the substrate (20). Examples of the thickness sensor (111) include a laser displacement sensor, an optical distance sensor, an infrared sensor, an ultrasonic sensor, and LiDAR (Light Detection and Ranging), but are not limited thereto. Examples of the temperature sensor (112) include an infrared temperature sensor and a thermal imaging camera, but are not limited thereto.

[0117] To reduce the error in the loading level of the substrate (20), the thickness sensor (111) and the temperature sensor (112) may be positioned and / or oriented to measure thickness and temperature at the same location on the substrate (20). In the illustrated example, the thickness sensor (111) and the temperature sensor (112) are supported on the same sensor support (110a), but they may also be installed and supported on different supports.

[0118] The loading level calculation unit (200) can calculate the density of the coating film and / or extrusion film corresponding to the temperature of the substrate (20) based on the temperature of the substrate (20), and calculate the loading level of the substrate (20) by multiplying the density of the coating film and / or extrusion film by the thickness of the coating film and / or extrusion film. When a coating film is coated on the substrate (20), the loading level calculation unit (200) can calculate the loading level of the substrate (20) by multiplying the solid content of the coating film of the substrate (20), the density of the coating film, and the thickness of the coating film.

[0119] The thickness sensor (111) can calculate thickness measurement data of the coating film and / or extrusion film for a set measurement position in the substrate (20) in a fixed mode in which the sensor part (110) is fixed without moving. The temperature sensor (112) can measure the temperature of the coating film and / or extrusion film at a set measurement position in the substrate (20) in a fixed mode in which the sensor part (110) is fixed without moving.

[0120] FIG. 15 is a flowchart of a method for measuring substrate thickness according to another embodiment of the present invention. FIG. 16 is a flowchart showing the method for measuring substrate thickness according to the embodiment of FIG. 15 in more detail. FIG. 17 is an illustrative diagram showing a substrate to explain the method for measuring substrate thickness according to one embodiment of the present invention. Referring to FIG. 13 to FIG. 17, the method for measuring substrate thickness according to an embodiment of the present invention may include a step (S30) of measuring the thickness and temperature of a substrate (20) wound and supported on a process roll (30) by a sensor unit (110), and a step (S40) of calculating the loading level of the substrate (20) based on the measured thickness and temperature of the substrate (20) by a loading level calculation unit.

[0121] The sensor unit (110) can obtain thickness measurement data by measuring a distance to calculate the thickness of a substrate (20) supported on a process roll (30) that is rotatably provided (S31), and can obtain temperature measurement data by calculating the temperature of the substrate (20) (S32). The thickness sensor (111) of the sensor unit (110) can obtain thickness measurement data by measuring a distance to the substrate (20) to calculate the thickness of the coating film (coating thickness) and / or the thickness of the extrusion film of the substrate (20). The temperature sensor (112) of the sensor unit (110) can measure the temperature of the coating film (coating temperature) and / or the temperature of the extrusion film on the substrate (20). Steps S31 and S32 of FIG. 16 do not imply a chronological order of precedence, and the order in which they are performed may be changed or performed in parallel.

[0122] When the thickness and temperature of the substrate (20) are calculated by the sensor unit (110), the loading level calculation unit (200) calculates the density of the coating film and / or extrusion film corresponding to the temperature of the substrate (20) based on the measured temperature of the substrate (20) (S41), and can calculate the loading level of the substrate (20) by multiplying the density of the coating film and / or extrusion film by the thickness of the coating film and / or extrusion film (S42). When the coating film (22) is coated on the substrate film (21) constituting the substrate (20), the loading level calculation unit (200) can calculate (predict) the loading level of the substrate (20) by multiplying the solid content of the coating film (22) of the substrate (20), the density of the coating film (22), and the thickness (t) of the coating film (22).

[0123] The thickness (t) of the coating film of the substrate (20) or the thickness of the extrusion film may be calculated by subtracting the thickness of the substrate film (21) from the thickness measurement value calculated for the substrate (20), or by subtracting a reference distance value set according to the thickness of the substrate film (21) and the distance between the process roll (30) and the sensor unit (110) from the distance measurement value for the substrate (20). The loading level calculation unit (200) may calculate the loading level of the substrate (20) according to, for example, the following formula 1.

[0124] [Formula 1]

[0125]

[0126] In Formula 1, 'LL' is the loading level of the substrate (20) (e.g., weight per unit area of ​​the coating film when the coating film on the substrate is in a dried state) (g / m² 2 ), 'sc' is the solid content (weight%) of the coating film (22), 'w' is the weight (g) of the coating liquid of the coating film (22), and 'A' is the area (m²) of the coating film (22) of the substrate (20). 2 ), 'ρ(T)' is the density of the coating liquid of the coating film (22), and is the density of the coating liquid at temperature 'T' (g / cm²). 3), 't' is the thickness (㎛) of the coating film (22), and 'k' is a proportionality constant (wt%*g / cm²) obtained by multiplying the solid content of the coating film (22) by the density of the coating liquid. 3 )am.

[0127] The proportionality constant k is the solid content (0) of the slurry (coating liquid) of the un-dried coating film (22). <sc≤1)과 밀도를 곱한 값이다. 로딩 레벨은 단위 면적당 코팅막(22)의 건조 무게를 의미하며, 건조되지 않은 코팅막(22)의 두께 측정값에 비례한다. 코팅액의 밀도는 온도에 반비례하여 변화하므로, 코팅막(22)의 온도에 따른 코팅액 밀도 ρ(T) 측정값을 반영함으로써, 정밀한 로딩 레벨의 측정이 가능하다.

[0128] According to an embodiment of the present invention, for example, after roll-to-roll coating and before solvent drying, the thickness and temperature of the coating liquid at the same location on the substrate (20) are measured in-line non-contact using a thickness sensor (111), such as a laser displacement sensor, and a temperature sensor (112), such as an IR sensor, respectively, and based on this, the loading level according to the coating film at each location on the substrate (20) can be calculated in real time. At this time, the non-contact thickness / temperature measuring sensor can measure the thickness / temperature of the product in real time while moving in a fixed mode or a scan mode described later on the coating roll (or guide roll).

[0129] According to an embodiment of the present invention, the loading level can be checked in real time through inline thickness and temperature measurements immediately after film extrusion or coating on a substrate, thereby reducing losses due to product defects and minimizing the time required to adjust process conditions. In addition, the high precision of the loading level measurement eliminates the need for periodic sampling and actual weight measurement of the loading level during the product manufacturing process, thereby increasing process efficiency. Furthermore, it is possible to eliminate the risk of radiation exposure by replacing a transmission type detector using a β-ray radioisotope source, and the installation and operation costs are lower compared to a β-ray loading level detector, allowing for the reduction of equipment and maintenance costs.

[0130] The substrate thickness measuring device and method according to the embodiment of the present invention described above can be utilized to measure the thickness or loading level of various substrates, such as electrodes (e.g., battery electrodes), separators, alkaline water electrolysis membranes, or PEM (Proton Exchange Membrane) water electrolysis membranes, or composite membranes for water electrolysis (e.g., BOPE (Biaxially Oriented Polyethylene) films).

[0131] The methods and / or various embodiments described above may be realized in digital electronic circuits, computer hardware, firmware, software, and / or combinations thereof. Various embodiments of the present invention may be executed by a data processing device, for example, one or more programmable processors and / or one or more computing devices, or implemented as a computer program stored on a computer-readable medium and / or on a computer-readable medium. The computer program described above may be written in any form of programming language, including a compiled language or an interpreted language, and may be distributed in any form, such as a standalone program, a module, or a subroutine. The computer program may be distributed through a single computing device, a plurality of computing devices connected through the same network, and / or a plurality of computing devices distributed to be connected through a plurality of different networks.

[0132] The above-described methods and / or various embodiments may be performed by one or more processors configured to execute one or more computer programs that process, store, and / or manage any functions, functions, etc. by operating based on input data or generating output data. For example, the methods and / or various embodiments of the present invention may be performed by special-purpose logic circuits such as a Field Programmable Gate Array (FPGA) or an Application Specific Integrated Circuit (ASIC), and an apparatus and / or system for performing the methods and / or embodiments of the present invention may be implemented as a special-purpose logic circuit such as an FPGA or an ASIC.

[0133] One or more processors executing a computer program may include one or more processors of a general-purpose or special-purpose microprocessor and / or any type of digital computing device. The processor may receive instructions and / or data from each of read-only memory and random access memory, or receive instructions and / or data from read-only memory and random access memory. In the present invention, components of a computing device performing the methods and / or embodiments may include one or more processors for executing instructions and one or more memories for storing instructions and / or data.

[0134] According to one embodiment, a computing device may exchange data with one or more mass storage devices for storing data. For example, the computing device may receive and / or receive data from a magnetic disc or an optical disc, and may transfer data to a magnetic disc or an optical disc. A computer-readable medium suitable for storing instructions and / or data associated with a computer program may include, but is not limited to, any form of non-volatile memory including semiconductor memory devices such as EPROM (Erasable Programmable Read-Only Memory), EEPROM (Electrically Erasable PROM), and flash memory devices. For example, the computer-readable medium may include magnetic discs such as internal hard disks or removable disks, photomagnetic discs, CD-ROMs, and DVD-ROMs.

[0135] In the present invention, various embodiments may be implemented in a computing device comprising back-end components (e.g., data servers), middleware components (e.g., application servers), and / or front-end components. In this case, the components may be interconnected by any form or medium of digital data communication, such as a communication network. According to one embodiment, the communication network may be composed of a wired network such as Ethernet, Power Line Communication, telephone line communication devices, and RS-serial communication, a mobile communication network, a Wireless LAN (WLAN), a wireless network such as Wi-Fi, Bluetooth, and ZigBee, or a combination thereof. For example, the communication network may include a Local Area Network (LAN), a Wide Area Network (WAN), etc.

[0136] Various embodiments of the present invention, including specific structural and functional details, are exemplary. Accordingly, the embodiments of the present invention are not limited to those described above and may be implemented in various other forms. Furthermore, the terms used in the present invention are intended to describe some embodiments and are not to be interpreted as limiting the embodiments. For example, singular words and the above may be interpreted to include plural forms unless the context clearly indicates otherwise.

[0137] In this invention, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as generally understood by those skilled in the art to which such concepts belong. Furthermore, commonly used terms, such as those defined in advance, should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology.

[0138] Although the present invention has been described in relation to some embodiments, various modifications and changes may be made without departing from the scope of the invention as understood by a person skilled in the art to which the invention pertains. Furthermore, such modifications and changes should be considered to fall within the scope of the claims appended to this specification.

Claims

1. A sensor unit that calculates thickness measurement data by measuring a distance for calculating the thickness of a substrate supported on a process roll that is rotatably arranged; A driving unit configured to move the sensor unit in a width direction parallel to the rotation axis of the process roll; A storage unit for storing thickness correction data corresponding to a thickness correction value in the width direction for the above process roll; and A thickness calculation unit that calculates the thickness of the substrate by correcting the thickness measurement data obtained while moving the sensor unit in the width direction based on the thickness correction data; Includes, The above driving unit drives the sensor unit to scan in the width direction so as to be synchronized with a circumferential position indicating the rotation angle of the process roll. Substrate thickness measuring device.

2. In Claim 1, The sensor unit is configured to measure the thickness and temperature of a substrate supported on the process roll, and A loading level calculation unit that calculates a loading level representing the weight per unit area of ​​the above-mentioned substrate based on the thickness and temperature of the above-mentioned substrate; further comprising Substrate thickness measuring device.

3. In Claim 1, The above thickness measurement data The above sensor unit includes a thickness profile in the width direction obtained with respect to the above material while moving in the width direction by the above driving unit, Substrate thickness measuring device.

4. In Claim 3, The above sensor unit While moving in conjunction with the rotation of the process roll by the above driving unit, the thickness profile is obtained along a diagonal direction traversing the width direction of the process roll and the circumference direction of the process roll. Substrate thickness measuring device.

5. In Claim 1, A rotation measuring unit for measuring the rotation angle of the above process roll; and A synchronization unit that synchronizes the encoder position within the rotational area measured by the rotational measuring unit with the corresponding movement position within the linear movement area of ​​the sensor unit driven by scanning; A substrate thickness measuring device further comprising 6. In Claim 4, The above sensor unit A thickness sensor for measuring the coating thickness or extrusion film thickness on the above-mentioned substrate; and A temperature sensor for measuring the coating temperature or extrusion film temperature on the above-mentioned material; Includes, The thickness sensor above A thickness correction profile of the coating thickness or the extrusion film thickness is obtained along the diagonal direction of the process roll, and The above temperature sensor is A temperature correction profile of the coating temperature or the extrusion film temperature is obtained along the diagonal direction of the process roll, and The above thickness calculation unit Calculating the thickness of the substrate by correcting the thickness profile based on the thickness correction profile and the temperature correction profile. Substrate thickness measuring device.

7. In Claim 4, The above sensor unit While the process roll rotates 360°, the thickness profile is acquired along the diagonal direction of the process roll while scanning left and right in the width direction of the process roll. Substrate thickness measuring device.

8. In Claim 1, The above thickness correction data A thickness variation profile in the width direction according to at least one of the roundness, straightness, equipment vibration variation, and mechanism setting position deviation of the process roll. Substrate thickness measuring device.

9. In Claim 1, Further comprising a thickness correction data calculation unit that calculates the thickness correction data based on a thickness profile obtained along the width direction by the sensor unit for the process roll; The above thickness calculation unit Calculating the thickness of the substrate and the thickness deviation in the width direction of the substrate through a difference operation between the thickness measurement data obtained for the substrate by the sensor unit and the thickness correction data. Substrate thickness measuring device.

10. In Claim 2, The above sensor unit A thickness sensor that calculates thickness measurement data by measuring the distance to the substrate to calculate the thickness of the coating film or extrusion film of the above-mentioned substrate; and It includes a temperature sensor for measuring the temperature of the coating film or the temperature of the extruded film on the above-mentioned description, and The above loading level calculation unit Based on the temperature of the above-mentioned material, the density of the coating film or extrusion film corresponding to the temperature of the above-mentioned material is calculated; Calculating the loading level of the substrate by multiplying the density of the coating film or the extrusion film by the thickness of the coating film or the extrusion film. Substrate thickness measuring device.

11. In Claim 10, The above loading level calculation unit Calculating the loading level of the substrate by multiplying the solid content of the coating film coated on the substrate, the density of the coating film, and the thickness of the coating film. Substrate thickness measuring device.

12. In Claim 10, The thickness sensor above In a fixed mode in which the sensor unit is fixed without moving, the thickness measurement data is calculated for a set measurement position among the above-mentioned materials, and The above temperature sensor is In the above fixed mode, measuring the temperature of the coating film or extrusion film at the measurement location, Substrate thickness measuring device.

13. A step of obtaining thickness measurement data by measuring a distance for calculating the thickness of a substrate supported on the process roll by the sensor unit while moving the sensor unit in a width direction parallel to the rotation axis of the process roll; and A step of calculating the thickness of the substrate by the thickness calculation unit, by correcting the thickness measurement data based on thickness correction data—the thickness correction data represents a thickness correction value in the width direction for the process roll—; Includes, The step of acquiring the above thickness measurement data is A step comprising the step of scanning and driving the sensor unit in the width direction so as to be synchronized with a circumferential position indicating the rotation angle of the process roll by the driving unit, Method for measuring substrate thickness.

14. In Claim 13, A step of measuring the thickness and temperature of a substrate supported on the process roll by the sensor unit; and The method further includes the step of calculating a loading level representing the weight per unit area of ​​the substrate based on the thickness and temperature of the substrate by a loading level calculation unit. Method for measuring substrate thickness.

15. In Claim 13, The above thickness measurement data The thickness profile in the width direction obtained with respect to the substrate while the sensor unit moves in the width direction by the driving unit, and The step of acquiring the above thickness measurement data is The step of acquiring the thickness profile along a diagonal direction traversing the width direction and the circumference direction of the process roll while moving in conjunction with the rotation of the process roll by the driving unit. Method for measuring substrate thickness.

16. In Claim 15, The step of acquiring the above thickness measurement data is A step of measuring the coating thickness or extrusion film thickness on the substrate by means of a thickness sensor of the sensor unit; and The method includes the step of measuring the coating temperature or extrusion film temperature on the substrate by means of the temperature sensor of the sensor unit. The step of measuring the thickness above The method includes the step of obtaining a thickness correction profile of the coating thickness or the extrusion film thickness along the diagonal direction of the process roll. The step of measuring the above temperature The step of obtaining a temperature correction profile of the coating temperature or the extrusion film temperature along the diagonal direction of the process roll. Method for measuring substrate thickness.

17. In Claim 16, The step of calculating the thickness of the above-mentioned material The method includes the step of calculating the thickness of the substrate by correcting the thickness profile based on the thickness correction profile and the temperature correction profile. The step of acquiring the above thickness measurement data is The step of acquiring the thickness profile along the diagonal direction of the process roll while scanning left and right in the width direction of the process roll while the process roll rotates 360° Method for measuring substrate thickness.

18. In Claim 13, The above thickness correction data A thickness variation profile in the width direction according to at least one of the roundness, straightness, equipment vibration variation, and mechanism setting position deviation of the process roll. Method for measuring substrate thickness.

19. In Claim 13, The thickness correction data calculation unit further includes the step of calculating the thickness correction data based on the thickness profile obtained along the width direction by the sensor unit for the process roll. The step of calculating the thickness of the above-mentioned material A step of calculating the thickness of the substrate through a difference operation between the thickness measurement data obtained for the substrate by the sensor unit and the thickness correction data; and A step comprising calculating the thickness deviation in the width direction of the above description, Method for measuring substrate thickness.

20. A computer-readable, non-transient recording medium having a computer program recorded thereon for executing the thickness measurement method described in Claim 13.

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