Electronic assembly and motor vehicle

Abstract

The present invention relates to an electronic assembly and to a motor vehicle. The electronic assembly (1) comprises at least one electronic-assembly housing element (2) and a capacitor housing element (10), and is characterised in that the electronic assembly (1) comprises a cooling device (30) for cooling the capacitor housing element (10), wherein the cooling device (30) comprises at least one cavity (11) which is formed in a delimiting side (12) of the capacitor housing element (10) and / or of the electronic-assembly housing element (2), and the electronic-assembly housing element (2) is positioned relative to the capacitor housing element (10) in such a way that the cavity (11) in one of the two housing elements (2, 10) is covered by the other housing element (2, 10), thereby forming, together with the cavity (11), a laterally delimited cooling channel (31) through which a coolant can flow, and heat can thus be dissipated from the capacitor housing element (10) by heat transfer between the capacitor housing element (10) and the coolant in the cooling channel (31). The electronic assembly and the motor vehicle according to the invention enable effective cooling of a capacitor housing element of the electronic assembly in a simple, cost-effective, and space-saving manner.

Description

[0001] Electronic assembly unit and motor vehicle

[0002] The present invention relates to an electronic assembly and a motor vehicle.

[0003] Effective cooling of electronic components is crucial in many applications, particularly in power electronics. Insufficient heat dissipation can lead to overheating of the electrical components, which can severely impair the lifespan and efficiency of an electronic unit or pose an immediate safety risk. This challenge is especially pronounced in frequency converters and inverters. These typically include capacitors, which generate a significant amount of waste heat and require effective cooling. It is known that thermal pads, so-called gap pads, made of a thermally conductive material, can be used to improve heat conduction between a capacitor housing and an outer casing, with the heat from the outer casing usually being dissipated via the environment or a cooling medium.Busbar cooling systems are also known, where the good thermal conductivity of the condenser's busbars is utilized by arranging the busbars within a cooling circuit or by connecting them to the outer casing using thermal pads. In some cases, additional busbars not required for electrical function are also used for cooling. Another approach is to encapsulate the condenser within the outer casing, encasing the metal inserts forming the cooling channels, for example, with epoxy resin. The heat is then dissipated via the epoxy resin and, if necessary, a cooling medium. However, these approaches can have disadvantages. Thermal pads often have limited thermal conductivity and can lead to insufficient heat dissipation if the pressure distribution is uneven or when used with condenser casing materials that have limited thermal conductivity.Busbar cooling systems often require more installation space, which is particularly problematic in small electronic assemblies. Due to optimized inductance, the busbars on the capacitor are often short, resulting in a relatively small surface area for heat dissipation. While encapsulated capacitors or capacitor housings can sometimes provide sufficiently effective cooling, their manufacturing and quality control are complex and expensive. Furthermore, adhesion problems can arise during manufacturing, as defects in such a component assembly are difficult to trace back to individual components.

[0004] Other approaches to cooling capacitors within electronic components are known from the state of the art.

[0005] US patent 2022 0295 662 A1 discloses a power electronics module with a flat circuit carrier and an electronic assembly electrically contacted on the upper flat side of the circuit carrier and thermally contacting heat sinks on the underside of the circuit carrier, wherein a heat bridge is arranged on the top of the circuit carrier, spanning the assembly and covering a large area of ​​it, and wherein the heat bridge is in thermal contact with the heat sink at mounting points arranged next to the assembly, and the space between the heat bridge and the circuit carrier is filled with a thermally conductive potting compound.

[0006] Based on this, the invention aims to provide an electronics unit and a motor vehicle that enable effective cooling of a capacitor housing element encompassed by the electronics unit in a simple, cost-effective and space-saving manner.

[0007] This problem is solved by the electronic assembly according to claim 1 and by the motor vehicle according to claim 10. Advantageous embodiments of the electronic assembly are specified in dependent claims 2 to 9.

[0008] The features of the claims can be combined in any technically meaningful way, whereby the explanations from the following description as well as features from the figures, which comprise supplementary embodiments of the invention, can also be used. The invention relates to an electronic assembly comprising at least one electronic assembly housing element and a capacitor housing element, characterized in that the electronic assembly has a cooling device for cooling the capacitor housing element, wherein the cooling device comprises at least one cavity which is provided in a boundary face of the capacitor housing element and / or the electronic assembly housing element.The electronics assembly housing element is positioned in relation to the capacitor housing element in such a way that the cavity in one of the two housing elements is covered by the other housing element, thereby creating a laterally limited cooling channel for the flow of a cooling fluid, and thus heat can be dissipated from the capacitor housing element through heat transfer between the capacitor housing element and the cooling fluid in the cooling channel.

[0009] The cooling of the condenser housing element involves convective heat removal.

[0010] The capacitor housing element forms at least part of a capacitor housing, wherein the capacitor housing is designed to enclose or encompass a capacitor.

[0011] If the capacitor housing contains a capacitor, the capacitor can also be cooled by cooling the capacitor housing element. The heat can be generated by ohmic losses in windings enclosed by the capacitor.

[0012] The capacitor housing, and thus potentially a capacitor enclosed within the capacitor housing, can be located inside an electronics assembly housing. The electronics assembly housing is at least partially formed by the electronics assembly housing element.

[0013] The cooling device is not limited to cooling the condenser housing element, but may also be designed to heat or preheat the condenser housing element and thus, if necessary, a condenser.

[0014] Furthermore, the cooling device can also be capable of dissipating heat from the electronics assembly housing. The cavity can be realized, for example, by at least one groove formed in the boundary side of the capacitor housing element and / or in the boundary side of the electronics assembly housing element.

[0015] The boundary side of the capacitor housing element, into which the cavity may be located, is an outer surface of the capacitor housing element. The boundary side of the electronic assembly housing element, into which the cavity or another cavity may be located, is an inner or outer surface of the electronic assembly housing element.

[0016] The cooling channel can have an elongated shape, at least in sections.

[0017] A lateral boundary of the cooling channel is understood to be a boundary perpendicular to the flow direction.

[0018] For this purpose of lateral limitation, the other housing element covers the cavity in one of the two housing elements, whereby "coverage" here does not necessarily mean a vertical cover, but also a lateral cover, insofar as the cavity should be open laterally.

[0019] The positioning of the electronics assembly housing element relative to the capacitor housing element can be achieved by a mechanical connection between the two housing elements, such as an adhesive bond or screw connections. It is necessary that the mechanical connection withstands the pressure load caused by the cooling fluid being transported under pressure through the cooling channel of the cooling device. This pressure load can exert a force of 1 kN to 15 kN on the boundary side encompassing the cavity. This force can act essentially perpendicular to the boundary side.

[0020] In an advantageous embodiment, the capacitor housing element has flange segments with openings through which bolts pass. These bolts are screwed into, or pass through, the electronics assembly housing element and are supported there. For example, six flange segments, and thus six screw connections, can be provided, evenly distributed along one edge of the capacitor housing element. Alternatively or additionally, screws can also pass through the capacitor and past the internal windings, for example, if support in the middle is required. The presence of multiple screw connections ensures a uniform contact pressure between the electronics assembly housing element and the capacitor housing element.

[0021] The cooling channel formed by the cavity can be a continuous flow channel or be realized by several cooling channel sections that are connected in parallel in terms of flow technology.

[0022] Furthermore, the cooling device for cooling the condenser housing element, and thus the cooling channel, can have an inlet and an outlet. This inlet and outlet can each be implemented through a flow opening in the electronics assembly housing element.

[0023] The cooling device can be fluidically integrated into a cooling circuit through which the cooling fluid can circulate. If necessary, the cooling circuit includes a section designed to dissipate heat to the environment.

[0024] The cooling device for cooling the capacitor housing element can optionally be used in combination with other cooling mechanisms. For example, the electronic assembly can have busbar cooling, wherein a capacitor enclosed by the capacitor housing is electrically connected to at least one busbar, and this busbar can be cooled by the cooling device for cooling the capacitor housing or is connected to a separate cooling circuit. In this case, heat can also be dissipated from the capacitor via the busbar. Optionally, the busbar cooling includes at least one auxiliary busbar that is not electrically necessary and is solely for cooling purposes. A busbar can be a so-called busbar.

[0025] Furthermore, it is possible that some of the heat can be dissipated via the electronics assembly housing and, for example, released from the electronics assembly housing to the environment.

[0026] The electronic component can be, for example, an inverter or a frequency converter. An inverter can also be called an inverter. Within an inverter, a capacitor may be configured to buffer current. An inverter may also include a circuit module and an electromagnetic compatibility filter, with the capacitor electrically connected between them.

[0027] In an advantageous embodiment, the cavity is incorporated into a boundary side of the capacitor housing element and covered by the electronics assembly housing element.

[0028] The boundary surface of the capacitor housing element can essentially lie in a plane and be covered by a similarly plane boundary surface of the electronics assembly housing element. Both planes can be aligned parallel to each other.

[0029] Furthermore, the boundary side of the electronics assembly housing element and the boundary side of the capacitor housing element can at least partially abut each other.

[0030] The capacitor housing element can be made of plastic.

[0031] A capacitor housing comprising the capacitor housing element consists, at least in the area of ​​the cavity arrangement, of plastic.

[0032] If the cavity is integrated into a boundary face of the capacitor housing element, the capacitor housing element and the cavity can be manufactured together in a single production step. For example, the capacitor housing element and the cavity can be injection-molded from plastic. Alternatively, the entire capacitor housing can be injection-molded from plastic.

[0033] In an advantageous embodiment, the electronics unit housing element is made of an aluminum alloy.

[0034] It may be intended that the cavity, and thus the formed cooling channel, has a meandering shape.

[0035] The meander shape can be formed by one or more grooves in the boundary side of the electronics assembly housing element and / or capacitor housing element.

[0036] The cooling channel of the cooling device for cooling the condenser housing element can be designed as a continuous meandering shape or have several cooling channel sections connected in parallel, each with a meandering shape. For example, the cooling channel can have six cooling channel sections connected in parallel, each with a meandering shape.

[0037] A meandering cooling channel, along with several meandering cooling channel sections connected in parallel flow paths, ensures uniform heat dissipation from the condenser housing element. This meandering shape can reduce or prevent the boundary of the condenser housing element from heating up more in the area of ​​the outlet than in the area of ​​the inlet due to the warming of the cooling fluid.

[0038] In a further embodiment, the cavity-forming boundary side of the electronic component housing element and / or capacitor housing element has protruding shaped elements in the form of pins and / or fins, wherein the cavity is partially penetrated by the shaped elements. The shaped elements serve to increase the surface area of ​​the boundary side and thus to improve heat transfer.

[0039] The capacitor housing element can be fluid-tightly sealed against the electronic assembly housing element by means of a first circumferential sealing element, whereby the cooling device for cooling the capacitor housing element is fluid-tightly sealed to the outside of the cooling device.

[0040] A cooling device for cooling the condenser housing element that is sealed to the outside is understood to be a cooling device from which no cooling fluid can escape to the outside of the cooling device, whereby it is possible that different cooling channel sections of the cooling channel enclosed by the cooling device are not sealed to each other by the sealing element. "Outside the cooling device" includes the interior of the electronic assembly, at least partially formed by the electronic assembly housing element. An inlet and an outlet enclosed by the cooling device are not to be understood as leaks.

[0041] The first circumferential sealing element can, for example, be designed to run around the edge of at least one housing, with the cooling channel formed by the cavity running within the area enclosed by the first circumferential sealing element. The first circumferential sealing element does not necessarily have to follow the course of the cooling channel, but can enclose the cooling device as a whole.

[0042] A first circumferential sealing element can create a fluid-tight seal to the outside of the cooling device without sealing the cavity against the housing element that delimits the cavity. The cooling fluid can therefore have direct contact with the housing element that laterally delimits the cavity.

[0043] In the case of a boundary side extending in a plane with a cavity arranged in this boundary side, the first circumferential sealing element can be arranged essentially in the plane of the boundary side or in a plane parallel to it.

[0044] If necessary, a sealing groove is provided in the capacitor housing element and / or in the electronic assembly housing element, in which the first circumferential sealing element or a part of the first circumferential sealing element is inserted.

[0045] In addition, a first flat sealing element may be present, which is arranged between the capacitor housing element and the electronics assembly housing element, at least partially covering the cavity.

[0046] A first, flat sealing element allows different cooling channel sections to be fluid-tightly sealed from one another. All cooling channel sections are encompassed by the cooling system for cooling the condenser housing element. Furthermore, the flow resistance within the cooling system can be adjusted more precisely, as the fluid-tight sealing of cooling channel sections reduces tolerance variations in local flow resistance.

[0047] The first flat sealing element could, for example, be a thin-walled membrane.

[0048] Optionally, the first flat sealing element is configured to provide a fluid-tight seal for the cooling device from the outside. In one embodiment, the first flat sealing element is part of a first sealing unit, which may also include the first circumferential sealing element. The first circumferential sealing element is thickened relative to the first flat sealing element. The cooling channel formed by the cavity runs within a region surrounded by the thickened, first circumferential sealing element. In this embodiment, a sealing groove for receiving the circumferential sealing element may be provided in the capacitor housing element and / or in the electronics assembly housing element.

[0049] In another embodiment, at least two sealing units are provided, wherein the first circumferential sealing element forms a circumferential sealing unit for fluid-tight sealing of the cooling channel to the outside of the cooling device and the first planar sealing element forms a planar sealing unit for fluid-tight sealing of different cooling channel sections of the cooling channel to each other.

[0050] The electronic assembly can comprise an electrical circuit module and a cooling unit for cooling the circuit module, wherein the cooling unit for cooling the circuit module is fluidically connected in series or parallel with the cooling device for cooling the capacitor housing element.

[0051] The electrical circuit module can be a so-called power module. For example, the circuit module can be a bipolar transistor with an insulated gate electrode or a metal-oxide-semiconductor field-effect transistor, e.g., a SiC MOSFET.

[0052] The cooling unit for cooling the circuit module includes at least one flow channel through which the cooling fluid can be conducted.

[0053] Fluid dynamically connected in series means that the cooling fluid can be conducted sequentially through the cooling device for cooling the capacitor housing element and to the cooling device for cooling the circuit module, or vice versa.

[0054] Flow-technically connected in parallel means that the cooling fluid is divided between the cooling device for cooling the capacitor housing element and the cooling device for cooling the circuit module, and is then possibly merged again afterwards.

[0055] In both a fluid-technically series and a fluid-technically parallel arrangement, the cooling unit for cooling the circuit module and the cooling device for cooling the capacitor housing element can be components of a common cooling circuit.

[0056] In addition, the cooling unit of the circuit module may have a second sealing unit, which may include a second flat sealing element for sealing flow channel sections from each other and / or a second circumferential sealing element for fluid-tight sealing to the outside of the cooling unit.

[0057] It is possible that more heat can be dissipated from the circuit module by the cooling unit than can be dissipated from the capacitor housing element by the cooling device, since the circuit module may produce more heat than a capacitor enclosed in the capacitor housing.

[0058] The electronic assembly may comprise several circuit modules.

[0059] In one embodiment, the cooling unit for cooling the circuit module is fluidically connected in series with the cooling device for cooling the capacitor housing element, wherein the cooling unit for cooling the circuit module has a greater flow resistance than the cooling device for cooling the capacitor housing element.

[0060] The flow resistance of the cooling unit for cooling the circuit module and the cooling device for cooling the capacitor housing element refers in each case to the flow channel of the cooling unit or the cooling channel of the cooling device.

[0061] The value of the flow resistance can be composed of the sum of individual flow resistances within a cooling device or cooling unit.

[0062] For example, the flow resistance can be adjusted via the cross-sections of the cooling channel and / or flow channel. Optionally, the flow channel of the circuit module's cooling unit may have a smaller cross-section than the cooling channel of the capacitor housing element's cooling device. This allows the cooling fluid to flow faster within the cooling unit for cooling the circuit module, thus improving convective heat transfer in this area. In another embodiment, the cooling unit for cooling the circuit module is fluidically connected in parallel with the cooling device for cooling the capacitor housing element, and the cooling unit for cooling the circuit module has a lower flow resistance than the cooling device for cooling the capacitor housing element.

[0063] The flow resistance of the cooling unit for cooling the circuit module and the cooling device for cooling the capacitor housing element refers in each case to the flow channel of the cooling unit or the cooling channel of the cooling device.

[0064] The value of the flow resistance can be composed of the sum of individual flow resistances within a cooling device or cooling unit.

[0065] The flow resistance can be adjusted, for example, by changing the cross-sections of the cooling channel and / or flow channel. For instance, the flow channel of the circuit module's cooling unit can have a larger cross-section compared to the cooling channel of the capacitor housing element's cooling system. This allows the cooling fluid to flow predominantly through the cooling unit to cool the circuit module, thus improving convective heat transfer in this area.

[0066] Furthermore, it is possible that the flow resistance within the cooling unit for cooling the circuit module and / or within the cooling device for cooling the capacitor housing element is matched to the respective local heat drop from the capacitor housing element and / or circuit module.

[0067] Another aspect of the invention is a motor vehicle comprising at least one described electronic assembly.

[0068] The motor vehicle can be at least partially electrically powered. Furthermore, the motor vehicle can be at least partially capable of autonomous operation.

[0069] The invention described above is explained in detail below against the relevant technical background with reference to the accompanying drawings, which show preferred embodiments. The invention is in no way limited by the purely schematic drawings, and it should be noted that the embodiments shown in the drawings are not limited to the dimensions depicted. It is illustrated in

[0070] Fig. 1: a sectional view of an electronic component with a first embodiment of a capacitor housing element; and

[0071] Fig. 2: a perspective view of a second embodiment of a capacitor housing element.

[0072] Figure 1 shows a sectional view of an electronic assembly 1. The electronic assembly 1 comprises an electronic assembly housing element 2, a capacitor housing element 10, and a circuit module 20. The capacitor housing element 10 is arranged on an inner side 3 of the electronic assembly housing element 2, and the circuit module 20 is arranged on an outer side 4 of the electronic assembly housing element 2. The electronic assembly 1 has a cooling device 30 for cooling the capacitor housing element 10 and for cooling a capacitor (not shown in Figure 1) enclosed by the capacitor housing element 10. Part of the cooling device 30 is a cooling channel 31 through which a cooling fluid flows. This channel is essentially defined by a groove-shaped cavity 11 in the capacitor housing element 10, which is formed in a boundary side 12.The cavity 11 in the capacitor housing element 10 is covered by the electronics assembly housing element 2, thus forming a laterally bounded cooling channel 31 that extends over a large part of the boundary side 12 and comprises several cooling channel sections 32. Furthermore, in the illustrated embodiment, a first sealing unit 70 is arranged between the electronics assembly housing element 2 and the capacitor housing element 1. This sealing unit comprises a thickened, first circumferential sealing element 71 and a first flat sealing element 72. The first circumferential sealing element 71 is inserted into a sealing groove 73 in the capacitor housing element 10 and serves to provide a fluid-tight seal to the outside of the cooling device 30, while the first flat sealing element 72 spans the cooling channel sections 32 of the cooling channel 31 and provides a fluid-tight seal between the cooling channel sections 32.In addition to the cooling device 30, the electronic assembly 1 has a cooling unit 40 with a flow channel 41 formed by a groove-shaped cavity 21 in the circuit module 20. The cooling unit 40 serves to cool the circuit module 20 and, analogous to the cooling device 30, is sealed by a second sealing unit 80, which comprises a second circumferential sealing element 81 and a second flat sealing element 82. Both the cooling device 30 and the cooling unit 40 are components of a cooling circuit 50, wherein the cooling device 30 and the cooling unit 40 are fluidically connected in parallel. Within the cooling circuit 50, which is not fully shown, the cooling fluid can flow along a flow direction 55 from an inlet 51 to an outlet 52.The electronics assembly housing element 2 and the capacitor housing element 1 are mechanically connected to each other by means of screw connections 60, two of which are located in the section plane. The screw connections 60 are realized by bolts 63, each of which passes through openings 62 in the flange segments 61 and is screwed into the electronics assembly housing element 2. Furthermore, Figure 1 shows two busbars 91 for contacting the capacitor in the capacitor housing element 10, and the circuit module 20 has two electrical lines 90.

[0073] Figure 2 shows a perspective view of a second embodiment of a capacitor housing element 10. As in the first embodiment, a groove-shaped cavity 11 is provided in the shown boundary side 12 of the capacitor housing element 10. This cavity serves to form a cooling channel 31 for a cooling device 30, which cools the capacitor housing element 10 and a capacitor enclosed by the capacitor housing element 10 (not shown in Figure 2). The boundary side 12 is designed to be positioned on an electronics assembly housing element (also not shown) in such a way that the cooling channel 31 is laterally bounded and closed. For this purpose, the capacitor housing element 10 has six flange segments 61, each with an opening 62, to create a mechanical connection.Figure 2 shows in particular the course of the cavity 11 in the condenser housing element 10 and thus the course of the cooling channel 31. The cooling channel 31 comprises seven flow-wise parallel and meandering cooling channel sections 32, so that a cooling fluid can flow from the position of an inlet 53 along a flow direction 55 into seven different cooling channel sections 32 before these merge again and the cooling fluid is directed to a position of an outlet 54. The cooling device 30 shown is enclosed by a circumferential sealing groove 73 in the condenser housing element 10 for the arrangement of a first sealing element (not shown here).

[0074] List of reference signs

[0075] 1 electronic module

[0076] 2 Electronic component housing element

[0077] 3 Inside

[0078] 4 Outside

[0079] 10 Capacitor housing element

[0080] 11 Cavity in the capacitor housing element

[0081] 12 Boundary page

[0082] 20 circuit module

[0083] 21 cavities in the circuit module

[0084] 30 Cooling equipment

[0085] 31 Cooling channel

[0086] 32 Cooling channel section

[0087] 40 cooling units

[0088] 41 Flow channel

[0089] 42 Flow channel section

[0090] 50 Cooling circuit

[0091] 51 Inflow

[0092] 52 Procedure

[0093] 53 Position of the inlet

[0094] 54 Position of the process

[0095] 55 Flow direction

[0096] 60 screw connection

[0097] 61 Flange segment

[0098] 62 Opening

[0099] 63 bolts

[0100] 70 First sealing unit

[0101] 71 First continuous sealing element

[0102] 72 First flat sealing element

[0103] 73 Sealing groove in the capacitor housing element

[0104] 80 Second sealing unit

[0105] 81 Second circumferential sealing element Second flat sealing element Sealing groove in the electronics assembly housing element Electrical conductor Busbar

Claims

Patent claims 1. Electronic assembly (1) comprising at least one electronic assembly housing element (2) and a capacitor housing element (10), characterized in that the electronic assembly (1) has a cooling device (30) for cooling the capacitor housing element (10), wherein the cooling device (30) comprises at least one cavity (11) which is provided in a boundary side (12) of the capacitor housing element (10) and / or the electronic assembly housing element (2), and the electronic assembly housing element (2) is positioned in relation to the capacitor housing element (10) such that the cavity (11) in one of the two housing elements (2, 10) is separated from the other housing element (2, 10).10) is covered and thus a laterally limited cooling channel (31) for flow with a cooling fluid is realized with the cavity (11) and thus heat can be dissipated from the condenser housing element (10) by heat transfer between condenser housing element (10) and cooling fluid in the cooling channel (31).

2. Electronic assembly (1 ) according to claim 1 , characterized in that the cavity (11 ) is incorporated into a boundary side (12) of the capacitor housing element (10) and is covered by the electronic assembly housing element (2).

3. Electronic assembly (1) according to at least one of the preceding claims, characterized in that the capacitor housing element (10) is made of plastic.

4. Electronic assembly (1 ) according to at least one of the preceding claims, characterized in that the cavity (11 ) and thus the formed cooling channel (31 ) has a meander shape.

5. Electronic assembly (1) according to at least one of the preceding claims, characterized in that the capacitor housing element (10) is opposite the electronic assembly housing element (2) is fluid-tight sealed with a first circumferential sealing element (71), whereby the cooling device (30) for cooling the capacitor housing element (10) is fluid-tight sealed to the outside of the cooling device (30).

6. Electronic assembly (1 ) according to at least one of the preceding claims, characterized in that a first planar sealing element (72) is provided, which is arranged between capacitor housing element (10) and electronic assembly housing element (2), covering at least the cavity (11) in some areas.

7. Electronic assembly (1) according to at least one of the preceding claims, characterized in that the electronic assembly (1) comprises an electrical circuit module (20) and a cooling unit (40) for cooling the circuit module (20), wherein the cooling unit (40) for cooling the circuit module (20) is fluidically connected in series or parallel with the cooling device (30) for cooling the capacitor housing element (10).

8. Electronic assembly (1) at least according to claim 7, characterized in that the cooling unit (40) for cooling the circuit module (20) is fluidically connected in series with the cooling device (30) for cooling the capacitor housing element (10), wherein the cooling unit (40) for cooling the circuit module (20) has a greater flow resistance than the cooling device (30) for cooling the capacitor housing element (10).

9. Electronic assembly (1) at least according to claim 7, characterized in that the cooling unit (40) for cooling the circuit module (20) is fluidly connected in parallel with the cooling device (30) for cooling the capacitor housing element (10), wherein the cooling unit (40) for cooling the circuit module (20) has a lower flow resistance than the cooling device (30) for cooling the capacitor housing element (10).

10. Motor vehicle comprising at least one electronic assembly (1 ) according to any one of claims 1 to 9.

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