Integrated laser device component group

Abstract

The invention relates to an integrated component group, comprising: a carrier, in particular a submount, having a first main side and an opposite second main side; a laser, which is arranged on the carrier on the first main side and which has a first light decoupling surface and an opposite second light decoupling surface, wherein the laser is designed to emit more laser light via the first light decoupling surface than via the second light decoupling surface during its intended use; and a photodiode, which is integrated into the carrier and which is designed to detect laser light emitted by the laser from the second light decoupling surface.

Description

[0001] 2024 PF00822

[0002] 1

[0003] INTEGRATED LASER COMPONENT GROUP

[0004] The present application claims priority from German patent application No. 10 2024 130 241 0 of 17 October 2024, the publication of which

[0005] 5. The cash value is hereby incorporated into the present application by reference.

[0006] The present invention relates to an integrated component group comprising a laser arranged on a support, and to a method for manufacturing an integrated component group.

[0007] BACKGROUND

[0008] Laser packages play a crucial role in the development of electronic devices and systems designed for the production and emission of laser light. Particularly in the fields of virtual reality (VR) and augmented reality (AR), laser packages are essential in devices such as smart glasses or AR / VR glasses, where they are used to generate holographic images to provide users with an immersive experience. Historically, laser packages were primarily used in industrial applications where size and weight were not critical. However, they are now increasingly used in consumer devices like AR and VR glasses. Therefore, it is essential that manufacturers develop smaller laser packages and associated driver circuits or control loops suitable for these applications.

[0009] However, the size of these individual components in combination, especially a combination of laser package, control loop for adjusting the laser package, and a driver circuit for operating the laser package, has so far posed a challenge for use in AR and VR glasses. Current laser packages in combination with a driver circuit and a control loop for operating the laser package are too large to be discreetly integrated into AR and VR glasses. This presents developers and manufacturers with problems, as they need to use smaller components.

[0010] 2

[0011] Components are needed to reduce the size and weight of the glasses.

[0012] Therefore, there is a need to create a comprehensive laser package that includes a…

[0013] 5. To provide a suitable control loop that can resolve at least some of the problems mentioned above. Furthermore, there is a need to provide a method for manufacturing such a laser package with an associated control loop.

[0014] SUMMARY OF THE INVENTION

[0015] This need is addressed by the subject matter of the independent patent claims. Further developments and embodiments of the proposed principle are specified in the dependent claims.

[0016] To solve the aforementioned problem, the inventors propose an integrated component group comprising a substrate, such as a submount, a laser mounted on the substrate, and a photodiode integrated into the substrate. The photodiode, together with a driver circuit, operates the laser as needed and adjusts its speed accordingly. Both the laser and the photodiode are integrated into the component group, resulting in a highly integrated device for which a space-saving arrangement of the individual components can be chosen. In particular, the integration of the components significantly reduces the lateral footprint of such an integrated component group compared to individual components arranged side by side.

[0017] According to a first aspect, an integrated component assembly is provided. The integrated component assembly comprises a carrier, in particular a submount, with a first main surface and an opposing second main surface. The integrated component assembly also comprises a laser, which is arranged on the carrier on the first main surface and which has a first light-emitting surface and an opposing second light-emitting surface. The light-emitting surfaces are designed and arranged as shown in 2024 PF00822.

[0018] 3 that a resonator forms between the two light output surfaces, and that during the intended use of the laser, more laser light is emitted via the first light output surface than via the second light output surface. For this purpose, the second light output surface can be

[0019] The 5th surface has a greater reflectivity for the laser light than the first light coupling surface.

[0020] Furthermore, a photodiode is integrated into the carrier, which is designed to detect laser light emitted by the laser from the second light output surface.

[0021] According to some aspects, the integrated component group also includes a driver circuit that is arranged on the carrier on the first main side or is integrated into the carrier and is configured to operate the laser depending on the laser light detected by the photodiode.

[0022] Such an integrated component group allows the integration of, for example, photodiodes (n), ICs (s), ESD diodes (n), temperature sensors (en), and other components, or a combination of several such components with one or more lasers, at the smallest integration level on a substrate, particularly a submount. The substrate can serve, on the one hand, to provide a common plane for the components and the laser, on the other hand, to provide an elevated position for the laser to avoid so-called "beam clipping," on the other hand, to provide a heat sink for the heat generated in the laser during its operation, and / or on the other hand, to provide an intelligent substrate into which at least some of the aforementioned components can be integrated.

[0023] The laser can be, in particular, an edge-emitting laser configured to emit laser light at least via its first light-emitting surface. The laser can have one or more laser resonators or laser ridges and can accordingly be configured as a single-ridge laser or multi-ridge laser. Furthermore, it is also possible for several lasers to be arranged on the substrate. Similarly, the integrated component group can also be 2024 PF00822.

[0024] 4. Several driver circuits and / or photodiodes. However, the laser can also be formed by a VCSEL, which is arranged on the substrate, for example, in such a way that laser light is emitted along the substrate onto the photodiode and in an opposite direction.

[0025] 5 will be .

[0026] According to certain aspects, the laser is positioned on the substrate such that it projects beyond it in the emission direction from the first light coupling surface, particularly in the lateral direction, or is essentially flush with it. In particular, the substrate can be designed as a submount for the laser, on which the laser is mounted at a higher elevation. Such a submount can be advantageous, for example, in combination with an optical element located downstream of the laser in the light emission direction, since raising the laser prevents or at least reduces beam clipping of the laser light emitted by the laser. Furthermore, it allows for greater flexibility in the choice of the optical element with regard to, for example, size, optical properties, and material, as well as greater flexibility regarding the arrangement of the optical element in relation to the distance between the optical element and the laser.

[0027] According to some aspects, the support is formed from silicon or it comprises silicon. In particular, the support may be formed by a silicon (Si) substrate. The use of a Si substrate allows for the integration of components, such as the photodiode and / or the driver circuit and / or one or more other components, directly into the support, and / or the use of a Si substrate allows for simplified mounting of components, such as the photodiode and / or the driver circuit and / or one or more other components, directly onto the support or in pockets provided therein. Mounting on a Si substrate can be advantageous in that it allows for the direct mounting or integration of components in various configurations, in particular, in such a way as to achieve the best performance for their function. 2024 PF00822

[0028] 5

[0029] According to some aspects, the carrier, the photodiode, and optionally the driver circuit are formed as a single unit, especially if the photodiode or the driver circuit is integrated into the carrier. "Single unit" can be understood to mean that the photodiode

[0030] 5 and / or the driver circuit are positively integrated into the substrate or have been manufactured using similar materials or processes. In particular, "one-piece" should be understood to mean that the photodiode and / or the driver circuit are not formed by discrete components that have been soldered or bonded onto the substrate.

[0031] According to some aspects, the substrate is made of a thermally conductive material, in particular a ceramic material such as AlN or SiC. The substrate can therefore not only provide the functionality of a submount or smart substrate, but also, in particular, serve as a heat sink or heat dissipation medium for the heat generated in the laser and / or other components. It is also conceivable that the integrated component group additionally includes a heat dissipation layer arranged between components of the component group.Such a heat sink and / or heat dissipation layer can be designed in particular to store and / or dissipate heat generated during the operation of the integrated component group in order to prevent overheating and associated changes in the operating conditions of the integrated component group or, in extreme cases, even failure of the integrated component group.

[0032] According to some aspects, the laser is at least partially mounted on the driver circuit. In particular, the laser can be at least partially mounted on the driver circuit and electrically connected to it. For example, the driver circuit can be integrated into the substrate and the laser at least partially mounted on the driver circuit. The driver circuit can have corresponding electrical contacts on its side facing the laser, to which the laser can be directly bonded or with which the laser can be electrically connected, e.g., by wire bonding or by creating electrical conductors (PICO). 2024 PF00822

[0033] 6

[0034] According to some aspects, the photodiode has a photosensitive surface which is designed to couple laser light emitted by the laser from the second light-emitting surface into it.

[0035] 5 and is subsequently detected by the photodiode. The photosensitive surface can be essentially parallel to the first main surface, or the photosensitive surface can be inclined towards the second output coupling surface.

[0036] According to some aspects, the photosensitive surface runs essentially parallel to the first main surface. The photosensitive surface can lie essentially in the same plane as the first main surface and thus be flush with it, or the photosensitive surface can be formed parallel to and offset from the first main surface, in particular lying at a distance from the support.

[0037] According to some aspects, the first main surface in the photodiode area and / or the photosensitive area is roughened in such a way that the coupling of the laser light emitted by the laser from the second light-emitting surface into the photodiode is increased. In particular, the first main surface in the photodiode area and / or the photosensitive area can be roughened in such a way that a light coupling structure is provided for the laser light emitted by the laser from the second light-emitting surface into the photodiode. This allows for a better signal-to-noise ratio of the signal detected by the photodiode.

[0038] According to some aspects, a waveguide section is arranged on the photosensitive surface of the photodiode. The waveguide section can be configured, in particular, to guide laser light emitted from the second light-emitting surface and laser light coupled into the waveguide section towards the photodiode or the photosensitive surface, so that it can be detected there. This increases the coupling of the laser light emitted from the second light-emitting surface into the photodiode, thereby achieving a better signal-to-noise ratio of the signal detected by the photodiode. 2024 PF00822

[0039] 7. For example, the waveguide section can be arranged on the substrate and the photosensitive surface, and can be made of silicon or another transparent material such as glass. Furthermore, one of the photosensitive surfaces can

[0040] 5. The opposite outer surface of the waveguide section, or areas of the waveguide section that are not facing the second light output surface or the photosensitive surface, have a reflective coating in order to direct as much of the laser light emitted from the second light output surface as possible into the photodiode.

[0041] According to some aspects, the waveguide section is configured as a prism, for example made of silicon or comprising silicon, which is designed to direct a portion of the laser light emitted from the second light-emitting surface towards the photodiode or the photosensitive surface and optionally to deflect another portion of the laser light, for example in a direction essentially perpendicular to the first main surface. For this purpose, the waveguide section can, for example, have a partially reflective coating that transmits a portion of the laser light emitted from the second light-emitting surface so that it can be detected by the photodiode, and reflects the other portion of the laser light emitted from the second light-emitting surface. The reflected light can then be used further, for example, to be recombined with the light emitted from the first light-emitting surface.

[0042] According to some aspects, the photosensitive surface is inclined towards the second output surface. This inclined arrangement increases the coupling of the laser light emitted from the second output surface into the photodiode, thus achieving a better signal-to-noise ratio for the signal detected by the photodiode. Such an arrangement or configuration can also be referred to as an angled photodiode. The fact that the photosensitive surface is inclined towards the second output surface can be understood, in particular, to mean that the photosensitive surface is tilted relative to the first main surface and, more importantly, is not parallel to it. [In the direction of the second output surface 2024 PF00822]

[0043] 8 inclined can in particular mean that the photosensitive surface with the first main side encloses an angle between greater than 0° and less than 180°, in particular an angle between 30° and 150°, or between 45° and 135°, or between 90° and 150°.

[0044] 5

[0045] According to some aspects, the photodiode is arranged on or integrated into an inclined surface of the substrate, for example, on / in a side surface of a pocket or step formed on or in the substrate. The side surface into which the photodiode is integrated can, in particular, adjoin the first main surface.

[0046] In some aspects, an electrical contact structure is formed between the laser and the substrate. This electrical contact structure can serve two purposes: firstly, to electrically connect the laser, particularly to the driver circuit, and secondly, to provide a raised platform on which the laser is mounted. Such a platform can be advantageous, for example, in combination with an optical element located downstream of the laser in the direction of light emission, as raising the laser prevents or at least reduces beam clipping of the emitted laser light. The electrical contact structure can be implemented, for example, as a direct-bonded copper (DBG) structure or a copper-plated ceramic (DPC) structure, enabling a close electrical / thermal connection of electronic components and chips via copper.The contact structure can also be designed as a redistribution layer (RDL). In particular, such a redistribution layer can provide an electrical connection or interconnection of the functionalities integrated into the carrier or arranged on the carrier (photodiode, ESD protection diode, temperature sensor, etc.).

[0047] According to some aspects, the integrated component group further includes a functional component, such as an ESD protection diode and / or a temperature sensor and / or another driver circuit, and / or a passive electrical component, such as a resistor, a capacitor and / or an inductor, which is mounted on the carrier on 2024 PF00822

[0048] 9 of the first main page is arranged or integrated into the carrier. This allows additional functionality to be provided for the integrated component group, while reducing the space requirement in the lateral direction of such an integrated component group.

[0049] The number of individual components arranged side by side is still greatly reduced.

[0050] According to some aspects, the integrated component group further comprises an optical element, in particular a lens, which is arranged downstream of the laser on the substrate in the direction of light emission. Due to the arrangement of the optical element on the same substrate on which the laser is mounted, thermal stresses within the integrated component group have little or no negative impact on the position of the optical element relative to the laser. This may be due, among other things, to the fact that the optical element is mounted on the same continuous material as the laser. Furthermore, by placing the optical element and the laser on the substrate, the lateral space requirement of such an integrated component group can be further reduced compared to individual components arranged side by side.

[0051] In some aspects, the integrated component group is designed as an SMD component. In particular, the substrate can have contact pads or electrical connections on its second main side, which are formed, for example, by a ball grid array (BGA). Such a design enables SMD assembly of the integrated component group, since the connections are compactly located on the second main side of the integrated component group. The connections are small solder balls arranged side by side in a grid of columns and rows. These balls are melted in a soldering oven during reflow soldering and bond with corresponding contact pads onto a target substrate. This design solves the problem of accommodating a very large number of connections on a single component. The component group can thus be used, for example, with a large area soldered on the substrate.They can be removed (desoldered) with hot air without sustaining damage. 2024 PF00822.

[0052] 10

[0053] According to some aspects, the integrated component group has only two contacts for the electrical power supply of the integrated component group and one contact for transmitting a data signal. In particular, any control and regulation of the

[0054] The five lasers within the integrated component group are controlled, allowing the integrated component group to be installed and used in a final product without extensive calibration, adjustment, or other additional steps. Operating the integrated component group requires only an electrical power supply and a data signal.

[0055] According to another aspect, a method for manufacturing an integrated component group, in particular an integrated component group according to at least some of the aspects described above, is provided. The method comprises the following steps:

[0056] Providing a support, in particular submounts, with a first main side and an opposing second main side;

[0057] Arranging a laser on the support on the first main surface, wherein the laser has a first light-emitting surface and an opposing second light-emitting surface, and wherein the laser, during its intended use, is configured to emit more laser light via the first light-emitting surface than via the second light-emitting surface; and

[0058] Integrating a photodiode into the carrier, wherein the photodiode is configured to detect laser light emitted by the laser from the second light-exit surface.

[0059] According to a further aspect, an alternative integrated component group is proposed. The integrated component group comprises a carrier, in particular a submount, with a first main surface and an opposing second main surface. The integrated component group also comprises a laser, which is arranged on the carrier on the first main surface and which has a first light-emitting surface and an opposing second light-emitting surface. 5 The light-emitting surfaces are designed and arranged such that a resonator is formed between the two light-emitting surfaces, and that during the intended use of the laser, the laser is not emitted in a way that allows the laser to emit light in a resonator. 2024 PF00822

[0060] 11. More laser light is emitted via the first light-emitting surface than via the second light-emitting surface. The second light-emitting surface can also have a higher reflectivity for the laser light than the first light-emitting surface. Furthermore, on the support...

[0061] 5. A photodiode is arranged on the first main surface, configured to detect laser light emitted by the laser from the second light coupling surface. Additionally, a driver circuit is arranged on the carrier on the first main surface, configured to operate the laser depending on the laser light detected by the photodiode.

[0062] The alternative integrated component group can be, in particular, an integrated component group exhibiting at least some of the aspects described above, with the difference that the photodiode is not integrated into the carrier but is arranged on the support. All aspects already described for the integrated component group described above can be applied accordingly to the alternative integrated component group.

[0063] According to some aspects, a photodiode substrate, for example a silicon substrate, is formed on the support, on which the photodiode is arranged. The photodiode substrate can, in particular, have a surface inclined towards the second output coupling surface, on which the photodiode is arranged, or the photodiode can be arranged on the photodiode substrate such that its photosensitive surface points towards the photodiode substrate or towards the support.

[0064] The photodiode substrate can be configured, in particular, to guide laser light emitted from the second light-emitting surface and laser light coupled into the photodiode substrate towards the photodiode or the photosensitive surface, so that it can be detected there by the photodiode or the photosensitive surface. This increases the coupling of the laser light emitted from the second light-emitting surface into the photodiode, thus achieving a better signal-to-noise ratio of the signal detected by the photodiode. For example, the photodiode substrate 2024 PF00822

[0065] 12. The photosensitive surface must be arranged tightly on the substrate and, for example, be made of silicon or another transparent material such as glass. Furthermore, an outer surface of the waveguide section opposite the photosensitive surface, or areas of the...

[0066] 5 waveguide sections that are not facing the second light output surface or the photosensitive surface have a reflective coating in order to direct as much of the laser light emitted from the second light output surface as possible into the photodiode.

[0067] According to some aspects, the photodiode substrate is configured as a prism, for example made of silicon or comprising silicon, which is designed to direct a portion of the laser light emitted from the second light-emitting surface towards the photodiode or the photosensitive surface and optionally to deflect another portion of the laser light, for example in a direction essentially perpendicular to the first main surface. For this purpose, the photodiode substrate can, for example, have a partially reflective coating that transmits a portion of the laser light emitted from the second light-emitting surface so that it can be detected by the photodiode, and reflects the other portion of the laser light emitted from the second light-emitting surface. The reflected light can then be used further, for example, to be recombined with the light emitted from the first light-emitting surface.

[0068] BRIEF DESCRIPTION OF THE DRAWINGS

[0069] Further aspects and embodiments according to the proposed principle will be revealed in relation to the various embodiments and examples, which are described in detail in conjunction with the accompanying drawings.

[0070] Figures 1A to IC each show a side view of an integrated component group according to some aspects of the proposed principle; 2024 PF00822

[0071] Fig. 2 shows a top view of an integrated component group according to some aspects of the proposed principle;

[0072] Figures 3A and 3B show a side view and a top view of another embodiment of an integrated component group according to some aspects of the proposed principle;

[0073] Figures 4A and 4B each show a side view of an alternative embodiment of an integrated component group according to some aspects of the proposed principle;

[0074] Fig. 5 shows a top view of another alternative integrated component group according to some aspects of the proposed principle; and

[0075] Fig. 6 shows a side view of another alternative embodiment of an integrated component group according to some aspects of the proposed principle.

[0076] DETAILED DESCRIPTION

[0077] The following embodiments and examples show various aspects and their combinations according to the proposed principle. The embodiments and examples are not always to scale. Likewise, various elements may be enlarged or reduced to highlight individual aspects. It is understood that the individual aspects and features of the embodiments and examples shown in the figures can readily be combined without affecting the principle of the invention. Some aspects have a regular structure or shape. It should be noted that in practice, minor deviations from the ideal shape may occur without contradicting the inventive idea. 2024 PF00822

[0078] Furthermore, the individual figures, features, and aspects are not necessarily depicted in the correct size, and the proportions between the individual elements may not be entirely accurate. Some aspects and features are emphasized by making them larger or smaller.

[0079] 5. Terms such as "above", "above", "below", "below", "larger", "smaller", and the like are, however, correctly represented in relation to the elements in the figures. Thus, it is possible to derive such relationships between the elements from the illustrations.

[0080] Figures 1A to 1IC each show a side view of an integrated component group 1 according to some aspects of the proposed principle, and Figure 2 shows a possible top view of such an integrated component group 1. The integrated component group 1 comprises a support 6 on which an edge-emitting laser 5 is arranged. The laser 5 is configured to emit laser light L via a first light-emitting surface 4a. Furthermore, the laser has a second light-emitting surface 4b opposite the first light-emitting surface 4a, via which the laser also emits a smaller amount of laser light compared to the first light-emitting surface 4a during intended use of the integrated component group 1.In the case shown, and characterized by the light cones, the laser 5 is designed as a simple laser with a resonator; however, the use of a laser with several first light coupling surfaces, e.g., a multi-ridge laser, or the...

[0081] Use of multiple lasers 5 is possible.

[0082] In the illustrated case, the support 6 is formed by a silicon substrate and has a first main surface 3a and an opposing second main surface 3b. The laser 5 is arranged on the first main surface 3a. A number of contact surfaces (not shown) are formed on the second main surface 3b, which are, for example, configured as a ball grid array and can serve for the electrical contacting of the integrated component group 6. A driver circuit 7 is integrated into the support 6, which is essentially flush with the first main surface 3a and on which the laser 5 is at least partially arranged and electrically connected. 2024 PF00822

[0083] - 15 - is . The driver circuit 7 can be formed directly in the silicon substrate 6, or arranged in a pocket in the silicon substrate 6. The driver circuit 7 is configured to control the laser 5 and to operate it according to its intended use.

[0084] 5 operate .

[0085] The integrated component group 1 also includes a photodiode 2, which is designed and arranged to detect laser light emitted by the laser 5 from the second light-emitting surface 4b. The photodiode 2, like the driver circuit 7, is integrated into the carrier 6. The photodiode 2, together with the driver circuit 7 and the laser 5, can serve as a feedback loop for the laser 5 to compensate for wavelength shifts and / or changes in the intensity of the laser light emitted by the laser 5, e.g., due to temperature heating or aging of the components, and to adjust the laser 5 accordingly.

[0086] The photodiode 2 is implemented downstream of the second light-emitting surface 4b in the silicon substrate 6 such that it is flat and essentially flush with the first main surface 3a. Accordingly, a photosensitive surface 8 of the photodiode 2 can lie essentially in the same plane as the first main surface 3a. To increase the coupling of the laser light L emitted from the second light-emitting surface 4b into the photodiode, the photosensitive surface 8 (i.e., the photodiode 2) and the silicon substrate 6 in the region of the photosensitive surface 8 can be roughened or structured, as shown in Fig. 1B, to allow different angles of incidence of the laser light L and thus achieve a better signal-to-noise ratio of the signal detected by the photodiode 2.

[0087] As shown in Fig. IC, a waveguide section 9 can be provided on the photodiode 2, into which the laser light L emitted from the second light-emitting surface 4b is coupled and can subsequently be detected by the photodiode 2 adjacent to the waveguide section 9. The photosensitive surface 8 of the photodiode 2 points towards the waveguide section 9. This allows more laser light to be collected (shown by the arrows in the waveguide). 2024 PF00822

[0088] - 16 - section 9 ), which can subsequently be detected by photodiode 2. Such a measure can again achieve a better signal-to-noise ratio of the signal detected by photodiode 2.

[0089] 5

[0090] As shown in the figures, the laser 5 is arranged on the support 6 or on the driver circuit 7 such that it projects beyond the support 6 in the emission direction from the first light output surface 4a, i.e., particularly in the lateral direction. The support 6 thus acts as a submount for the laser 5, on which the laser 5 is mounted at an elevated position. Such a submount can be advantageous, for example, in combination with an optical element located downstream of the laser 5 in the light emission direction, since raising the laser 5 prevents or at least reduces beam clipping of the laser light L emitted by the laser 5. Furthermore, it allows for greater flexibility in the choice of the optical element with regard to, for example, size, optical properties, and material, as well as greater flexibility regarding the arrangement of the optical element with respect to the distance between the optical element and the laser 5.

[0091] As can be seen in the top view in Fig. 2, one or more additional functional components 12 can be provided on or integrated into the carrier 6. The additional functional component 12 can be, for example, an ESD protection diode, a temperature sensor, another driver circuit, or a passive electrical component such as a resistor, a capacitor, and / or an inductor, which is arranged on the carrier 6 on the first main surface 3a or is integrated into the carrier 6. This provides additional functionality for the integrated component group 1, while the space requirement in the lateral direction of such an integrated component group 1 is greatly reduced compared to individual components arranged side by side.

[0092] Figures 3A and 3B show a side view and a top view of a further embodiment of an integrated component group 1 according to 2024 PF00822.

[0093] 17 some aspects of the proposed principle. The photodiode 2 is integrated into the carrier 6 in such a way that its photosensitive surface 8 is inclined towards the second light output surface 4b or is formed facing the second light output surface 4b.

[0094] 5. The carrier 6 has a pocket 14 on whose side surface 15 the photodiode 2 is formed. The side surface 15 borders the first main surface 3a, is inclined relative to the first main surface 3a, and forms an angle of approximately 35° with it in the illustrated case. This arrangement allows more of the laser light L emitted by the laser 5 from the second output surface to be detected by the photodiode 2, thus achieving a better signal-to-noise ratio of the signal detected by the photodiode 2.

[0095] Figures 4A and 4B each show a side view of an alternative embodiment of an integrated component group 1 according to some aspects of the proposed principle, and Figure 5 shows a top view of an alternative embodiment of the integrated component group 1 from Figure 4B. The support is not formed by a silicon substrate, but by a material with better thermal conductivity, e.g., a ceramic material. Accordingly, the driver circuit 7 and the photodiode 2 are not integrated into the support 6, but are arranged on it or on a separate photodiode substrate 10, in particular a silicon substrate.

[0096] The photodiode substrate 10 is arranged downstream of the laser 5 and the second coupling surface 4b on the first main surface 3a and has a side surface inclined relative to the first main surface 3a, on which the photodiode 2 is arranged. Additionally, as shown in Fig. 4B, an electrical contact structure 13 can be formed between the laser 5 and the support 6. The electrical contact structure 13 can serve, firstly, to electrically connect the laser, in particular to electrically couple it to the driver circuit 7, and secondly, it can provide a raised platform on which the laser 5 is mounted. Such a raised platform can be particularly advantageous with the photodiode 2 downstream of the laser 5, since the raised platform prevents beam clipping of the laser 5.

[0097] 18 emitted laser light L can be prevented or at least reduced. The electrical contact structure 13 can, for example, be applied in the form of a direct bonded copper (DBC, also direct copper bonded, DCB) structure or a copper plated ceramic (DPC), with

[0098] 5ths which enables a close electrical / thermal connection of electronic components and chips via copper.

[0099] This design has the advantage that more of the laser light L emitted by the laser 5 from the second coupling surface can be detected by the photodiode 2, thus achieving a better signal-to-noise ratio of the signal detected by the photodiode 2. Furthermore, a more powerful laser 5 can be used in this design, since the laser 5 is in contact with a more thermally conductive material and can therefore be dissipated more effectively during operation.

[0100] As shown in Fig. 4B, contact surfaces 16 can also be provided on the second main surface 3b, by means of which the integrated component group 1 can be surface-mounted, i.e. as an SMD component.

[0101] Fig. 6 shows a side view of another alternative embodiment of an integrated component group 1 according to some aspects of the proposed principle. This embodiment combines aspects of the embodiment shown in Figs. IC and 4B. The photodiode substrate 10 is configured as a waveguide section, on the top of which the photodiode 2 is arranged. Part of the laser light L emitted by the laser 5 from the second coupling surface is coupled into the waveguide section so that it can be detected by the photodiode 2, while another part of the laser light L emitted by the laser 5 from the second coupling surface is reflected by a partially reflective layer 11, which is arranged on a side surface of the waveguide section inclined relative to the first main surface 3a, in a direction substantially perpendicular to the first main surface 3a.This allows part of the laser light L emitted by the laser 5 from the second output coupling surface 4b to be used for subsequent control of the laser 5- 2024 PF00822.

[0102] - 19 - places, and the other part of the laser light L emitted by the laser 5 from the second output coupling surface can be used for other purposes and is not lost. For example, the reflected portion of the laser light L can be used by combining it again with the laser light L emitted by the laser 5 from the first 4a output coupling surface.

[0103] 2024 PF00822

[0104] - 20 -

[0105] REFERENCE MARK LIST

[0106] 1 integrated component group

[0107] 5 2 Photodiode

[0108] 3a, 3b Main page

[0109] 4a, 4b Light from coupling surface

[0110] 5 lasers

[0111] 6 Carrier 0 7 Driver circuit

[0112] 8 photosensitive areas

[0113] 9 Waveguide section

[0114] 10 photodiode subs

[0115] 11 partially reflective layer 5 12 functional component

[0116] 13 electrical contact structure

[0117] 14 bags

[0118] 15 side surface

[0119] 16 Contact area 0

[0120] L Laser light 5

Claims

2024PF00822 - 21 - PATENT CLAIMS 1. Integrated component group (1) , comprising: 5 a carrier (6), in particular a submount, with a first main surface (3a) and an opposing second main surface (3b); a laser (5) arranged on the carrier (6) on the first main surface (3a) and having a first light-emitting surface (4a) and an opposing second light-emitting surface (4b), wherein the laser (5) is configured during its intended use to emit more laser light via the first light-emitting surface (4a) than via the second light-emitting surface (4b); a photodiode (2) integrated into the carrier (6) and configured to detect laser light emitted by the laser (5) from the second light-emitting surface (4b); and a driver circuit (7) integrated into the carrier (6) and configured to operate the laser (5) depending on the laser light detected by the photodiode (6); wherein the laser (5) is at least partially arranged on the driver circuit (7).

2. Integrated component group according to claim 1, wherein the laser (5) projects beyond the support (6) in the emission direction from the first light extraction surface (4a).

3. Integrated component group according to one of the preceding claims, wherein the laser (5) is formed by an edge-emitting laser.

4. Integrated component group according to any one of the preceding claims, wherein the support (6) is made of or comprises silicon.

5. Integrated component group according to any one of the preceding claims, wherein the photodiode (2) and the support (6) are formed integrally. 2024PF00822 - 22 - 6. Integrated component group according to one of the preceding claims, wherein the photodiode (2) has a photosensitive surface (8) inclined towards the second coupling surface (4b). 5 is .

7. Integrated component group according to one of the preceding claims, wherein the photodiode (2) has a photosensitive surface (8) and the photosensitive surface (8) and / or the first main surface (3a) have a light coupling structure.

8. Integrated component group according to one of the preceding claims, wherein a waveguide section (9) is arranged on a photosensitive surface (8) of the photodiode (2).

9. Integrated component group according to one of the preceding claims, wherein the support (6) is formed from a thermally conductive material, in particular AIN or SiC.

10. Integrated component group according to one of the preceding claims, further comprising a functional component (12) which is arranged on the carrier (6) on the first main surface (3a) or is integrated into the carrier (6), in particular an ESD protection diode and / or a temperature sensor and / or a further driver circuit .

11. Integrated component group according to one of the preceding claims, wherein an electrical contact structure (13) is formed between the laser (5) and the carrier (6).

12. Integrated component group according to any one of the preceding claims, wherein the integrated component group (1) is designed as an SMD component. 5 13. Integrated component group according to any one of the preceding claims, wherein the integrated component group has only two contacts for the electrical power supply of the integrated component group (1) and one contact for transmitting a data signal. 2024PF00822 23 14. Method for manufacturing an integrated component assembly (1) , in particular an integrated component assembly according to any of the preceding claims, comprising the steps: Providing a support (6) , in particular submounts, with a first main side (3a) and a second main side opposite (3b) ; Arranging a laser (5) on the support (6) on the first main surface (3a) , wherein the laser has a first light output surface (4a) and an opposite second light output surface (4b), and wherein the laser (5) is configured during its intended use to emit more laser light via the first light output surface (4a) than via the second light output surface (4b); Integrating a photodiode (2) into the carrier (6) , wherein the photodiode (2) is configured to detect laser light emitted by the laser (5) from the second light output coupling surface (4b); Integrate a driver circuit (7) into the carrier (6), wherein the driver circuit (7) is configured to operate the laser (5) depending on the laser light detected by the photodiode (6); wherein the laser (5) is at least partially arranged on the driver circuit (7).

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