Smart heating and cooling device, and manufacturing method therefor

Abstract

The present invention relates to a smart heating and cooling device capable of selectively implementing solar heating and radiant cooling, and a manufacturing method therefor. The smart heating and cooling device according to one embodiment of the present invention comprises: a flexible substrate; a bottom layer which is disposed on the flexible substrate and which has a radiant cooling body; and a top layer which is disposed on the flexible substrate, and which has a band partially fixed to the flexible substrate so as to be bent and deformed according to the deformation of the flexible substrate, and a solar absorber connected to the band so as to be movable according to the deformation of the band, wherein the solar absorber moves according to the deformation of the flexible substrate so as to selectively cover the radiant cooling body.

Description

Smart heating and cooling device and method of manufacturing the same

[0001] The present invention relates to a smart heating and cooling device and a method for manufacturing the same, and more specifically, to a smart heating and cooling device capable of selectively implementing solar heating and radiant cooling and a method for manufacturing the same.

[0002] As energy consumption continues to rise globally, eco-friendly solutions for reducing energy consumption in the heating and cooling of buildings and electronic devices are gaining attention. In particular, dual-mode thermal management technology is attracting attention as an eco-friendly method that utilizes the sun (approx. 5800K) as a heat source and outer space (approx. 3K) as a coolant.

[0003] Recently, technologies for controlling radiative heat transfer have advanced with the development of various surface structures using organic and inorganic materials. Based on a deep understanding of materials science, optics, and thermodynamics, high-performance radiative heat transfer management technologies are being implemented, providing practical and effective solutions to reduce global energy consumption.

[0004] However, in real-world environments, thermal management systems are exposed to non-constancy conditions such as daily temperature fluctuations and seasonal changes, making it difficult to apply single-mode thermal management systems to variable environments.

[0005] Furthermore, conventional temperature control devices have the problem of complex overall systems and reduced energy efficiency because heating and cooling functions are implemented as separate devices. In addition, there are limitations in achieving optimal performance in actual application environments due to the difficulty of actively responding to environmental changes and the lack of system flexibility.

[0006] Moreover, conventional devices have limitations in size reduction due to their structural characteristics, making them difficult to apply to miniaturized systems; furthermore, complex manufacturing processes and high costs impose constraints on commercialization.

[0007] The problem that the present invention aims to solve is to provide a smart heating and cooling device capable of selectively implementing solar heating and radiant cooling, and a method for manufacturing the same.

[0008] In addition, the problem that the present invention aims to solve is to provide a smart heating and cooling device capable of active temperature control through a structure that reversibly switches between a 2D structure and a 3D structure by mechanical deformation, and a method for manufacturing the same.

[0009] Furthermore, the problem that the present invention aims to solve is to provide a smart heating and cooling device and a method for manufacturing the same that can be utilized in a wide range of fields by ensuring versatility applicable to various substrate materials and being able to be manufactured through a simple process.

[0010] The problems of the present invention are not limited to those mentioned above, and other unmentioned problems will be clearly understood by those skilled in the art from the description below.

[0011] To solve the problem described above, a smart heating and cooling device according to one embodiment of the present invention comprises: a flexible substrate; a bottom layer disposed on the flexible substrate and having a radiative cooling body; and a top layer disposed on the flexible substrate and having a band partially fixed to the flexible substrate so as to be bent and deformed according to the deformation of the flexible substrate, and a solar absorber connected to the band so as to be able to move according to the deformation of the band, wherein the solar absorber moves according to the deformation of the flexible substrate to selectively cover the radiative cooling body.

[0012] The above solar absorber can adjust the angle relative to the radiative coolant according to the amount of deformation of the flexible substrate.

[0013] In a smart heating and cooling device according to one embodiment of the present invention, the angle of the solar absorber relative to the radiative cooler changes according to the uniaxial strain of the flexible substrate, so that the radiative cooler may be covered by the solar absorber or exposed to the outside.

[0014] The above radiative cooling body may include a base disposed on the flexible substrate; a reflective layer disposed on the base; and a radiative cooling layer disposed on the reflective layer.

[0015] The above radiative cooling layer may include at least one material selected from PDMS (polydimethylsiloxane), PMMA (polymethyl methacrylate), DPHA (dipentaerythritol penta / hexa acrylate), SU-8, PMMA, and PVDF (polyvinylidene fluoride).

[0016] The bottom layer comprises a pair of end sections spaced apart from each of the two ends of the base; and a plurality of connecting sections connecting the base and the pair of end sections, wherein the base and the pair of end sections are fixed to the flexible substrate, and the plurality of connecting sections may not be fixed to the flexible substrate.

[0017] The above-mentioned solar absorber may include a cover connected to the band; and a solar absorbing layer disposed on the cover.

[0018] The above-mentioned solar light absorption layer may include colored paint.

[0019] The band comprises a fixed section fixed to the flexible substrate; and a bending section not fixed to the flexible substrate so as to be bendable according to the deformation of the flexible substrate, and the cover may be connected to the bending section.

[0020] The top layer may include a bridge connecting the cover and the banding section.

[0021] The above bridge may be positioned offset toward one of the two ends of the above bending section.

[0022] The above cover and the above bridge may be placed on both sides of the above band.

[0023] The top layer may include an auxiliary reflective layer disposed on the inner surface of the cover to reflect visible light.

[0024] To solve the problem described above, a smart heating and cooling device according to another embodiment of the present invention comprises: an expandable flexible substrate; a radiative cooling body disposed on the flexible substrate; a band connected to the flexible substrate to deform according to the expansion and contraction of the flexible substrate; and a solar absorber connected to the band, which selectively covers the radiative cooling body by changing its angle according to the deformation of the band.

[0025] The above solar absorber may be tilted due to buckling deformation of the band.

[0026] To solve the problem described above, a smart heating and cooling device according to another embodiment of the present invention comprises: a flexible substrate capable of switching between a first deformation state and a second deformation state; a radiative cooling body disposed on the flexible substrate and having mid-infrared radiation characteristics; and a solar absorber disposed on the radiative cooling body and having solar absorption characteristics, and connected to the flexible substrate such that its relative position to the radiative cooling body changes according to the deformation state of the flexible substrate, wherein when the flexible substrate is in the first deformation state, the radiative cooling body is covered by the solar absorber and operates in a heating mode, and when the flexible substrate is in the second deformation state, the radiative cooling body is exposed to the outside and operates in a cooling mode.

[0027] The first deformation state is a state in which the flexible substrate is elongated by uniaxial strain, and the second deformation state may be a state in which the elongation of the flexible substrate is released.

[0028] A smart heating and cooling device according to another embodiment of the present invention may include an actuator that causes a uniaxial deformation of the flexible substrate.

[0029] To solve the problem described above, a smart heating and cooling device according to another embodiment of the present invention comprises: a flexible substrate; a bottom layer disposed on the flexible substrate and having a radiative cooling element; and a top layer disposed on the flexible substrate such that the radiative cooling element covers the radiative cooling element, wherein the top layer is partially bent and deformed according to the deformation of the flexible substrate to selectively cover the radiative cooling element.

[0030] To solve the problem described above, a method for manufacturing a smart heating and cooling device according to an embodiment of the present invention comprises the steps of: preparing a flexible substrate; preparing a bottom layer having a radiative cooling body; preparing a top layer having a solar absorber; stretching the flexible substrate; fixing the bottom layer to the stretched flexible substrate; and partially fixing the top layer to the stretched flexible substrate so that the solar absorber covers the radiative cooling body, wherein the top layer is partially bent and deformed according to the deformation of the flexible substrate and is arranged to selectively cover the solar absorber.

[0031] In the step of preparing the bottom layer, the radiative cooling body can be manufactured through the steps of: preparing a base; placing a reflective layer on the base; and placing a radiative cooling layer on the reflective layer.

[0032] The above-mentioned reflective layer is formed through the deposition of a metal having reflective properties, and the above-mentioned radiative cooling layer can be formed through spin coating of a mid-infrared radiation material.

[0033] In the step of preparing the top layer, the solar absorber can be manufactured through the steps of: preparing a cover connected to a band; and placing a solar absorbing layer on the cover.

[0034] A method for manufacturing a smart heating and cooling device according to one embodiment of the present invention may form the solar light absorption layer by applying colored paint onto the cover.

[0035] The step of preparing the top layer may include the step of placing an auxiliary reflective layer on the inner surface of the cover.

[0036] In the step of stretching the flexible substrate, the flexible substrate can be stretched by uniaxial strain.

[0037] To solve the problem described above, a method for manufacturing a smart heating and cooling device according to another embodiment of the present invention comprises the steps of: sequentially stacking a base, a reflective layer, and a radiative cooling layer to form a radiative cooling body; placing a solar absorption layer on a cover connected to a band to form a solar absorber; coupling the radiative cooling body onto an extended flexible substrate; and partially fixing the band to the flexible substrate so that the solar absorber covers the radiative cooling body.

[0038] To solve the problem described above, a method for manufacturing a smart heating and cooling device according to another embodiment of the present invention comprises the steps of: preparing a radiative cooling body; preparing a top base layer having a band and a cover connected to the band; coupling the radiative cooling body onto an extended flexible substrate; partially fixing the band to the extended flexible substrate so that the cover covers the radiative cooling body and thereby positioning the top base layer on the extended flexible substrate; and forming a solar light absorption layer on the cover.

[0039] The smart heating and cooling device according to the present invention allows the top layer to reversibly switch between a 2D structure and a 3D structure depending on the expansion and contraction of a flexible substrate, and can selectively implement solar heating and radiative cooling functions depending on the reversible structural change of the top layer.

[0040] In addition, the smart heating and cooling device according to the present invention enables fine temperature control by adjusting the amount of deformation of the flexible substrate.

[0041] Furthermore, since the smart heating and cooling device according to the present invention utilizes solar absorption and radiative cooling, it can significantly reduce energy consumption and minimize the emission of environmental pollutants. In addition, since it can utilize existing semiconductor process technology, mass production is easy, and costs can be reduced through the simplification of the manufacturing process.

[0042] In addition, the smart heating and cooling device according to the present invention can be manufactured through a simple process and ensures versatility applicable to various objects, thereby enabling its use in a wide range of fields such as construction materials, electronic devices, and medical devices.

[0043] The various and beneficial advantages and effects of the present invention are not limited to those described above, and even more diverse effects are included in this specification.

[0044] FIG. 1 is a schematic perspective view of a smart heating and cooling device according to one embodiment of the present invention.

[0045] FIG. 2 is a perspective view showing the bottom layer and top layer of a smart heating and cooling device according to one embodiment of the present invention separated.

[0046] FIG. 3 is an exploded perspective view showing the bottom layer of a smart heating and cooling device according to one embodiment of the present invention.

[0047] FIG. 4 is an exploded perspective view showing the top layer of a smart heating and cooling device according to one embodiment of the present invention.

[0048] FIG. 5 is a schematic side view showing the top layer of a smart heating and cooling device according to one embodiment of the present invention transformed into a 2D structure.

[0049] FIG. 6 is a schematic side view showing the top layer of a smart heating and cooling device according to one embodiment of the present invention transformed into a 3D structure.

[0050] FIG. 7 is a schematic perspective view showing a smart heating and cooling device according to one embodiment of the present invention operating in a cooling mode.

[0051] FIG. 8 is a bottom perspective view showing a top layer according to another embodiment.

[0052] FIG. 9 is a process diagram showing a method for manufacturing a smart heating and cooling device according to one embodiment of the present invention.

[0053] FIG. 10 is a process diagram showing a method for manufacturing a smart heating and cooling device according to another embodiment of the present invention.

[0054] Figures 11 and 12 are photographs of a macro smart heating and cooling device fabricated according to an experimental example of the present invention.

[0055] Figures 13 and 14 are photographs of a micro smart heating and cooling device fabricated according to an experimental example of the present invention.

[0056] FIGS. 15 to 17 are graphs showing the temperature change of an object in which a macro smart heating and cooling device manufactured according to an experimental example of the present invention is placed.

[0057] The advantages and features of this specification and the methods for achieving them will become clear by referring to the embodiments described below in detail together with the accompanying drawings. However, this specification is not limited to the embodiments disclosed below but may be implemented in various different forms, and these embodiments are provided merely to ensure that the disclosure of this specification is complete and to fully inform those skilled in the art of the scope of this specification.

[0058] Shapes, areas, ratios, angles, numbers, etc. disclosed in the drawings for explaining the embodiments of this specification are exemplary, and this specification is not limited to the depicted details. Throughout the specification, the same reference numerals refer to the same components. Furthermore, in describing this specification, if it is determined that a detailed description of related prior art could unnecessarily obscure the essence of this specification, such detailed description is omitted. Where terms such as "includes," "has," or "is made up" are used in this specification, other parts may be added unless "only" is used. Where a component is expressed in the singular, it includes cases where it is included in the plural unless specifically stated otherwise.

[0059] In interpreting the components, they are interpreted to include a margin of error even in the absence of a separate explicit statement.

[0060] In the case of describing a positional relationship, for example, when the positional relationship between two parts is described using expressions such as 'on,' 'upper,' 'lower,' or 'next to,' one or more other parts may be located between the two parts unless 'immediately' or 'directly' is used.

[0061] Additionally, terms such as "first," "second," etc. are used to describe various components, but these components are not limited by these terms. These terms are used merely to distinguish one component from another. Accordingly, the first component mentioned below may be the second component within the technical scope of this specification.

[0062] Throughout the specification, the same reference numerals refer to the same components.

[0063] The area and thickness of each component shown in the drawings are illustrated for convenience of explanation and are not necessarily limited to the area and thickness of the components illustrated in this specification.

[0064] In the embodiments, a 'module' or 'part' performs at least one function or operation and may be implemented in hardware or software, or a combination of hardware and software. Additionally, a plurality of 'modules' or a plurality of 'parts' may be integrated into at least one module, except for the 'module' or 'part' that needs to be implemented in specific hardware.

[0065] The features of each of the various embodiments of this specification may be combined or combined with one another, either partially or wholly, and may technically enable various interlocking and operation. Each embodiment may be implemented independently of one another or may be implemented together in an associated relationship.

[0066] The present invention will be described below with reference to the drawings.

[0067] FIG. 1 is a schematic perspective view of a smart heating and cooling device according to one embodiment of the present invention, FIG. 2 is a perspective view showing the bottom layer and top layer of a smart heating and cooling device according to one embodiment of the present invention separated, FIG. 3 is an exploded perspective view showing the bottom layer of a smart heating and cooling device according to one embodiment of the present invention, and FIG. 4 is an exploded perspective view showing the top layer of a smart heating and cooling device according to one embodiment of the present invention.

[0068] As shown in the drawing, a smart heating and cooling device (100) according to one embodiment of the present invention comprises a flexible substrate (110), a bottom layer (120), and a top layer (130). The flexible substrate (110) is elastically deformable, the bottom layer (120) comprises a radiative cooling body (126) having a radiative cooling function, and the top layer (130) comprises a solar absorber (136) having a solar absorption function. Accordingly, the bottom layer (120) can function as a first functional layer that performs a radiative cooling function, and the top layer (130) can function as a second functional layer that performs a solar absorption function.

[0069] A smart heating and cooling device (100) according to one embodiment of the present invention can selectively implement a heating mode and a cooling mode in a single device. Specifically, when the flexible substrate (110) is in an extended state, the top layer (130) is deformed into a 2D structure (see FIG. 1 and FIG. 5) that covers the bottom layer (120) and operates in a heating mode that absorbs solar heat, and when the flexible substrate (110) is released from extension, the top layer (130) is deformed into a 3D structure (see FIG. 6 and FIG. 7) so that the bottom layer (120) is exposed and operates in a radiative cooling mode.

[0070] A smart heating and cooling device (100) according to one embodiment of the present invention may be implemented as a macro device or a micro device. A macro device may represent a device in which the size of the radiative cooler (126) is larger than 10 mm. And a micro device may represent a device in which the size of the radiative cooler (126) having a radiative cooling function is smaller than 1 mm.

[0071] The flexible substrate (110) is made of an elastically deformable material capable of stretching and contracting. For example, the flexible substrate (110) may be made of silicone elastomer. Silicone elastomer has excellent elasticity and resilience, so it can maintain stable characteristics even during repeated stretching and contraction processes. However, the material of the flexible substrate (110) is not limited to silicone elastomer and can be changed in various ways.

[0072] The flexible substrate (110) is configured to allow for uniaxial strain. That is, the flexible substrate (110) is capable of switching between a first strained state and a second strained state. For example, as shown in FIG. 5, the flexible substrate (110) can be stretched by more than or less than 100% in both directions (horizontal direction of the drawing). The first strained state indicates a state in which the flexible substrate (110) is stretched, and the second strained state indicates a state in which the flexible substrate (110) is released from stretching and restored to its original state. The amount of uniaxial strain can be controlled by an actuator (140) capable of pulling both ends of the flexible substrate (110).

[0073] The flexible substrate (110) is configured to allow UV ozone (UVO) treatment on its surface. UV ozone treatment serves to improve adhesion with the bottom layer (120) and the top layer (130) by forming an oxide layer on the surface of the flexible substrate (110). In particular, the UV ozone-treated silicon elastomer surface can form a strong bond with an inorganic adhesive material such as Ti / SiO2.

[0074] As shown in FIGS. 2 and 3, the bottom layer (120) acts as a first functional layer that performs a radiative cooling function by including a radiative coolant (126). The bottom layer (120) includes a bottom base layer (121), a reflective layer (122), a radiative cooling layer (123), and a bottom layer adhesive member (124).

[0075] The bottom base layer (121) includes a central base (121a), a first end section (121b) and a second end section (121c) spaced apart on both sides of the base (121a), and a connecting section (121d) connecting them. The bottom base layer (121) may be made of a flexible polymer material such as polyimide (PI), but the material of the bottom base layer (121) may be varied.

[0076] A base (121a), a first end section (121b), and a second end section (121c) are fixed to a flexible substrate (110). The first end section (121b) and the second end section (121c) are connected to the base (121a) through a plurality of connecting sections (121d). A plurality of bases (121a) are spaced apart between the first end section (121b) and the second end section (121c), and the plurality of bases (121a) can be connected to each other through a plurality of connecting sections (121d).

[0077] A plurality of connecting sections (121d) are not fixed to the flexible substrate (100) and connect the base (121a) to the first end section (121b), the base (121a) to the second end section (121c), and the bases (121a) to each other. The connecting sections (121d) are formed with a serpentine structure. This serpentine structure serves to effectively relieve mechanical stress generated during the expansion and contraction process of the flexible substrate (110).

[0078] The specific configuration of the connecting section (121d) is not limited to that shown in the drawing and can be changed in various ways.

[0079] A reflective layer (122) is placed on a base (121a) and serves to reflect sunlight. The reflective layer (122) may include various materials capable of reflecting sunlight. For example, the reflective layer (122) may include metallic materials such as gold (Au), copper (Cu), silver (Ag), aluminum (Al), titanium (Ti), platinum (Pt), etc.

[0080] The radiative cooling layer (123) is placed on the reflective layer (122) and acts as a radiative emitter. The radiative cooling layer (123) may include a material having mid-infrared radiation capabilities. For example, the radiative cooling layer (123) may include a polymer material with excellent mid-infrared radiation properties, such as PDMS (polydimethylsiloxane), PMMA (polymethyl methacrylate), DPHA (dipentaerythritol penta / hexa acrylate), SU-8, PVDF (polyvinylidene fluoride), etc. The radiative cooling layer (123) can lower the temperature of an object through the action of mid-infrared radiation.

[0081] The bottom layer adhesive member (124) serves to fix the base (121a), the first end section (121b), and the second end section (121c) to the flexible substrate (110). The bottom layer adhesive member (124) may include a silicone adhesive or an inorganic adhesive such as Ti / SiO2. In particular, a Ti / SiO2 adhesive is preferred as it can form a strong chemical bond with the UV ozone-treated flexible substrate (110).

[0082] However, the bottom layer adhesive member (124) may include other adhesive materials capable of fixing the bottom layer (120) to the flexible substrate (110), in addition to silicone adhesive or Ti / SiO2.

[0083] The base (121a) of the bottom base layer (121), the reflection layer (122), and the radiative cooling layer (123) constitute a radiative cooling body (126). The bottom layer (120) is placed on a flexible substrate (110) so that the radiative cooling body (126) is covered by the top layer (130). The bottom layer (120) has difficulty performing a radiative cooling function when covered by the top layer (130), but performs a radiative cooling function when the top layer (130) is deformed into a 3D structure and exposed to the outside. In particular, the combination of the reflection layer (122) and the radiative cooling layer (123) can achieve excellent radiative cooling performance by effectively reflecting sunlight while efficiently radiating mid-infrared rays.

[0084] As shown in FIGS. 2 and 4, the top layer (130) acts as a second functional layer that performs a solar heat absorption function by including a solar absorber (136). The top layer (130) includes a top base layer (131), a solar absorber layer (132), and a top layer adhesive member (133).

[0085] The top base layer (131) includes a cover (131a), a band (131b), and a bridge (131c). The top base layer (131) may be made of a flexible polymer material such as polyimide (PI), just like the bottom base layer (121), but the material of the top base layer (131) may be varied.

[0086] The cover (131a) is connected to the band (131b) so that it is not fixed to the flexible substrate (110) but can be tilted relative to the bottom layer (120). When the flexible substrate (110) expands and contracts and the band (131b) is deformed, the tilt of the cover (131a) relative to the bottom layer (120) can change.

[0087] The band (131b) is partially fixed to the flexible substrate (110) so that it can be bent when the flexible substrate (110) is deformed. The band (131b) includes a fixed section (131b1) and a bending section (131b2). The fixed section (131b1) is fixed to the flexible substrate (110) by a top layer adhesive member (133), and the bending section (131b2) is not fixed to the flexible substrate (110). The bending section (131b2) can freely buckle according to the deformation of the flexible substrate (110). Thus, when the elongation of the flexible substrate (110) is released, the bending section (131b2) bends upward, causing the cover (131a) to tilt.

[0088] The bridge (131c) connects the cover (131a) and the band (131b). The bridge (131c) is positioned to extend from the edge of the band (131b) to connect the edge of the cover (131a) and the edge of the band (131b). The bridge (131c) is positioned offset toward one of the two ends of the bending section (131b2) and is connected to the cover (131a) offset toward one of the two ends of the cover (131a). Thus, when the extension of the flexible substrate (110) is released and the bending section (131b2) undergoes buckling deformation, the cover (131a) can tilt more smoothly.

[0089] The asymmetric arrangement of these bridges (131c) enables a more stable reversible transition of the 2D / 3D structure of the top layer (130) with a configuration in which the band (131b) is partially fixed to the flexible substrate (110).

[0090] Bridges (131c) are positioned on both sides of bands (131b), and covers (131a) are also positioned on both sides of bands (131b). As shown in FIGS. 1 and 2, one radiative cooler (126) can be covered by two top layers (130). That is, two bands (131b) are positioned on each side of one radiative cooler (126), and one of the two covers (131a) connected to one band (131b) covers half of the radiative cooler (126), and one of the two covers (131a) connected to the other band (131b) covers the remaining half of the radiative cooler (126). Additionally, the two covers (131a) connected to one band (131b) can partially cover each of the two radiative coolers (126) positioned on both sides of bands (131b).

[0091] Although the drawing shows the bridge (131c) being symmetrically positioned on both sides of the band (131b) and the cover (131a) also being symmetrically positioned on both sides of the band (131b), the arrangement of the bridge (131c) and the arrangement of the cover (131a) can be varied.

[0092] The arrangement structure of the bottom layer (120) and the top layer (130) is intended to securely fix the band (131b) to the flexible substrate (110) while avoiding the radiative cooler (126), but the arrangement structure of the bottom layer (120) and the top layer (130) can be varied. For example, the top layer (130) may be arranged so that one cover (131a) completely covers one radiative cooler (126).

[0093] Referring to FIGS. 2 and 4, a solar absorption layer (132) is placed on a cover (131a) and serves to absorb sunlight. The solar absorption layer (132) may include a colored paint such as carbon black paint, but the material of the solar absorption layer (132) can be varied. In addition to the cover (131a), the solar absorption layer (132) may also be placed on a band (131b) and a bridge (131c).

[0094] The top layer adhesive member (133) secures the fixed section (131b1) of the band (131b) to the flexible substrate (110). The top layer adhesive member (133) may include a silicone adhesive or an inorganic adhesive such as Ti / SiO2, similar to the bottom layer adhesive member (124), but the adhesive material constituting the top layer adhesive member (133) may be varied.

[0095] The top layer (130) can be deformed into a 2D structure when the flexible substrate (110) is stretched, thereby performing a solar light absorption function. That is, when the flexible substrate (110) is stretched, the top layer (130) becomes a closed window structure that covers the radiative cooler (126) and the solar light absorber (136) is positioned approximately parallel to the flexible substrate (110), so that solar light can be stably absorbed.

[0096] Additionally, the top layer (130) is deformed into a 3D structure when the extension of the flexible substrate (110) is released, thereby enabling the radiative cooling function of the bottom layer (120). That is, when the extension of the flexible substrate (110) is released, the top layer (130) is deformed into an open window structure and tilted so that the radiative cooling body (126) can be exposed to perform the radiative cooling function.

[0097] Referring to FIGS. 5 and 6, a smart heating and cooling device (100) according to one embodiment of the present invention includes an actuator (140) for deforming a flexible substrate (110). The actuator (140) serves to deform the flexible substrate (110) by pulling the edge portion of the flexible substrate (110).

[0098] The actuator (140) can extend or contract the flexible substrate (110) in the short-circuit direction (left-right direction of the drawing). For example, the actuator (140) can shorten the flexible substrate (110) by more than 100% or less. The actuator (140) is a driving device that generates power and may include, but is not limited to, a linear motor, a pneumatic cylinder, a hydraulic cylinder, etc.

[0099] The actuator (140) can precisely control the amount of deformation of the flexible substrate (110). This allows the tilting angle of the solar absorber (136) to be adjusted, and consequently, the heating and cooling performance of the smart heating and cooling device (100) can be finely controlled. For example, if the amount of deformation of the flexible substrate (110) is controlled to 50%, moderate cooling performance can be obtained, and if it is controlled to 100%, maximum cooling performance can be obtained.

[0100] Optionally, the smart heating and cooling device (100) may include a sensor for monitoring the amount of deformation of the flexible substrate (110) or the solar absorber (136), a sensor for detecting solar illuminance, a sensor for detecting temperature, and a controller for controlling the actuator (140). Through this feedback control system, more precise deformation control is possible, and active response to changes in the external environment is possible.

[0101] A smart heating and cooling device (100) according to one embodiment of the present invention can selectively operate in a heating mode and a cooling mode depending on the deformation state of a flexible substrate (110). Each operating mode will be described in detail below.

[0102] As shown in FIG. 5, when the flexible substrate (110) is stretched by the actuator (140), the top layer (130) forms a 2D structure so that the smart heating and cooling device (100) operates in a heating mode.

[0103] Specifically, when the flexible substrate (110) is stretched, the band (131b) of the top layer (130) is pulled taut, and the banding section (131b2) remains flat. At this time, the solar absorber (136) also remains horizontal, so that the solar absorber (136) completely covers the radiative cooler (126).

[0104] As shown in FIGS. 1 and 5, when sunlight is incident while the solar absorber (136) completely covers the radiative cooler (126), the solar absorber (136)'s solar absorber's (136) solar absorber's (132) effectively absorbs solar energy. The solar energy absorbed by the solar absorber's (132) is converted into thermal energy, and this thermal energy is transferred to an object to which the flexible substrate (110) is attached, thereby heating the object.

[0105] Meanwhile, as shown in FIG. 6, when the actuator (140) releases the extension of the flexible substrate (110), the top layer (130) is deformed into a 3D structure and the smart heating and cooling device (100) operates in a cooling mode.

[0106] Specifically, when the extension of the flexible substrate (110) is released, the distance between the fixed sections (131b1) of the band (131b) is narrowed, and a buckling force is applied to the bending section (131b2). This buckling force causes buckling deformation of the bending section (131b2), causing the bending section (131b2) to bend upward. Consequently, the cover (131a) connected to the bending section (131b2) tilts in a certain direction.

[0107] As shown in FIGS. 6 and 7, when the solar absorber (136) is tilted, the radiative cooler (126) is exposed. At this time, the radiative cooling layer (123) of the exposed radiative cooler (126) effectively radiates mid-infrared rays to produce a cooling effect. Also, the reflective layer (122) of the radiative cooler (126) reflects incident sunlight to prevent unnecessary heat absorption. Thus, the object to which the flexible substrate (110) is attached can be cooled.

[0108] As described above, in a smart heating and cooling device (100) according to one embodiment of the present invention, the top layer (130) can be reversibly switched between a 2D structure and a 3D structure depending on the expansion and contraction of the flexible substrate (110), and solar heating and radiative cooling functions can be selectively implemented depending on the reversible structural change of the top layer (130). Thus, it can actively respond to daily temperature changes or seasonal changes.

[0109] In addition, the smart heating and cooling device (100) according to one embodiment of the present invention enables fine temperature control by adjusting the amount of deformation of the flexible substrate (110).

[0110] In addition, since the smart heating and cooling device (100) according to one embodiment of the present invention utilizes solar energy absorption and radiative cooling, energy consumption can be significantly reduced and the emission of environmental pollutants can be minimized. Furthermore, since existing semiconductor process technology can be utilized, mass production is easy, and costs can be reduced through the simplification of the manufacturing process.

[0111] FIG. 8 is a bottom perspective view showing a top layer according to another embodiment.

[0112] The top layer (230) shown in FIG. 8 includes an auxiliary reflective layer (235) in addition to the top layer (130) described earlier.

[0113] The auxiliary reflective layer (235) is placed on the inner surface of the cover (131a) and is exposed to the outside when the top layer (230) is transformed into an open window structure. The auxiliary reflective layer (235) can improve cooling efficiency by blocking sunlight incident on the radiative cooling layer (123).

[0114] Additionally, the auxiliary reflective layer (235) can effectively control the radiation direction of mid-infrared rays emitted from the radiative cooling layer (123) when the cover (131a) is tilted in cooling mode.

[0115] The auxiliary reflective layer (235) may include various materials capable of reflecting sunlight. For example, the auxiliary reflective layer (235) may include metallic materials such as gold (Au), copper (Cu), silver (Ag), aluminum (Al), titanium (Ti), platinum (Pt), etc.

[0116] Hereinafter, a method for manufacturing a smart heating and cooling device according to the present invention will be described.

[0117] FIG. 9 is a process diagram showing a method for manufacturing a smart heating and cooling device according to one embodiment of the present invention.

[0118] Referring to FIG. 9, a method for manufacturing a smart heating and cooling device according to one embodiment of the present invention includes a bottom layer manufacturing step (S11), a top layer manufacturing step (S12), and a step of bonding the bottom layer and the top layer to a flexible substrate (S13).

[0119] The bottom layer manufacturing step (S11) is a step of manufacturing a bottom layer (120) comprising a bottom base layer (121), a reflective layer (122), a radiative cooling layer (123), and a bottom layer adhesive member (124) as described above.

[0120] The top layer manufacturing step (S12) is a step of manufacturing a top layer (130) including a top base layer (131), a solar absorption layer (132), and a top layer adhesive member (133) as described above.

[0121] The step (S13) of bonding the bottom layer and the top layer to the flexible substrate is to bond the fabricated bottom layer (120) and the top layer (130) to the stretched flexible substrate (110) in sequence.

[0122] A smart heating and cooling device (100) according to one embodiment of the present invention may be implemented as a macro device in which the size of the radiant cooling body (126) is larger than 10 mm or as a micro device in which the size of the radiant cooling body (126) is smaller than 1 mm, and the manufacturing method of the macro device and the manufacturing method of the micro device may be different.

[0123] In the following, the manufacturing method of smart heating and cooling devices will be explained by classifying them into macro devices and micro devices.

[0124] A method for manufacturing a macro device includes a bottom layer fabrication step (S11), a top layer fabrication step (S12), and a step of bonding the bottom layer and the top layer to a flexible substrate (S13).

[0125] The bottom layer manufacturing step (S11) proceeds in the order of manufacturing the bottom base layer (121), placing the reflection layer (122), placing the radiative cooling layer (123), and placing the bottom layer adhesive member (124).

[0126] First, a bottom base layer (121) is produced by processing a base material such as a polyimide (PI) film. For example, a bottom base layer (121) in which a base (121a), a first end section (121b), a second end section (121c), and a connecting section (121d) are integrally formed can be produced by laser cutting the base material.

[0127] Next, a reflective layer (122) is placed on one side of the base (121a). For example, the reflective layer (122) can be selectively formed on the base (121a) by depositing a metal material using a shadow mask. The metal material constituting the reflective layer (122) can be selected from gold (Au), copper (Cu), aluminum (Al), titanium (Ti), and platinum (Pt).

[0128] Next, a radiative cooling layer (123) is placed on the reflective layer (122). For example, the radiative cooling layer (123) can be formed by spin-coating a polymer material with excellent mid-infrared radiation properties on the reflective layer (122). The polymer material with excellent mid-infrared radiation properties may be selected from PDMS (polydimethylsiloxane), PMMA (polymethyl methacrylate), DPHA (dipentaerythritol penta / hexa acrylate), SU-8, and PVDF (polyvinylidene fluoride).

[0129] Finally, a bottom layer adhesive member (124) is placed on the other side of the bottom base layer (121). For example, the bottom layer adhesive member (124) can be placed by optionally applying silicone adhesive to the other sides of the base (121a), the first end section (121b), and the second end section (121c).

[0130] The top layer manufacturing step (S12) proceeds in the order of manufacturing the top base layer (131), placing the solar absorption layer (132), and placing the top layer adhesive member (133).

[0131] First, a top base layer (131) is produced by processing a base material such as a polyimide (PI) film. For example, a top base layer (131) in which a cover (131a), a band (131b), and a bridge (131c) are integrally formed can be produced by laser cutting the base material.

[0132] Next, a solar absorption layer (132) is placed on one side of the cover (131a). For example, the solar absorption layer (132) can be optionally formed on the cover (131a) by applying colored paint using a shadow mask. Carbon black paint may be used as the colored paint. In the step of placing the solar absorption layer (132), the solar absorption layer (132) may also be placed on the band (131b) and the bridge (131c) in addition to the cover (131a).

[0133] Finally, a top layer adhesive member (133) is placed on the other side of the top base layer (131). For example, a bottom layer adhesive member (124) can be formed by optionally applying silicone adhesive to the fixed section (131b1) of the band (131b).

[0134] The step (S13) of bonding the bottom layer and the top layer to the flexible substrate proceeds in the order of the extension step of the flexible substrate (110), the bonding step of the bottom layer (120), and the bonding step of the top layer (130).

[0135] First, a flexible substrate (110) capable of stretching and contracting is stretched and fixed. For example, the flexible substrate (110) can be stretched 100% in the short-axis direction and fixed.

[0136] A silicon elastomer substrate may be used as the flexible substrate (110). When a silicon elastomer substrate is used as the flexible substrate (110), the surface of the flexible substrate (110) can be treated with UV ozone (UVO). Through UV ozone treatment, an oxide layer is formed on the surface of the flexible substrate (110) to induce a strong chemical bond during the subsequent bonding process.

[0137] Next, the fabricated bottom layer (120) is bonded onto the flexible substrate (110). For example, the bottom layer (120) can be picked up using PVA tape, aligned onto the flexible substrate (110), and then placed on the flexible substrate (110). At this time, the base (121a), the first end section (121b), and the second end section (121c) are fixed to the flexible substrate (110) by the bottom layer adhesive member (124).

[0138] Next, the fabricated top layer (130) is bonded onto the flexible substrate (110). For example, the top layer (130) can be picked up using PVA tape and aligned onto the flexible substrate (110) to which the bottom layer (120) is attached, and then the top layer (130) can be placed on the flexible substrate (110) so that the solar absorber (136) covers the radiative coolant (126). At this time, the fixed section (131b1) of the band (131b) is fixed to the flexible substrate (110) by the top layer adhesive member (133).

[0139] A plurality of bottom layers (120) and a plurality of top layers (130) can be manufactured in the manner described above, and a plurality of bottom layers (120) and a plurality of top layers (130) can be combined on a single flexible substrate (110).

[0140] The method for manufacturing a micro device includes a bottom layer fabrication step (S11), a top layer fabrication step (S12), and a step of bonding the bottom layer and the top layer to a flexible substrate (S13). The method for manufacturing a micro device may utilize microprocessing technologies such as photolithography, spin coating, deposition, and reactive ion etching.

[0141] First, in the bottom layer fabrication step (S11), a bottom layer (120) is fabricated on a donor substrate using microprocessing technology. That is, a sacrificial layer is formed on a donor substrate such as a silicon wafer, a bottom layer adhesive member (124) is formed on the sacrificial layer, a base layer that forms a bottom base layer (121) is formed on the sacrificial layer, a reflective base layer that forms a reflective layer (122) is formed on the base layer, a radiative cooling base layer that forms a radiative cooling layer (123) is formed on the reflective base layer, and a mask layer is formed on the radiative cooling base layer, and then the bottom layer (120) can be fabricated through an etching process.

[0142] Specifically, the sacrificial layer can be formed on a donor substrate with a uniform thickness by spin-coating a polymer material such as PMMA. The sacrificial layer is used to separate the bottom layer (120) produced in a subsequent process from the donor substrate, and can be stabilized by baking at an appropriate temperature after spin-coating.

[0143] The bottom layer adhesive member (124) can be formed on the sacrificial layer through a photolithography process. For example, the bottom layer adhesive member (124) can be formed by applying and patterning a photoresist, and then selectively depositing an inorganic adhesive such as Ti / SiO2 using an electron beam deposition machine.

[0144] The base layer forming the bottom base layer (121) can be formed on a sacrificial layer on which the bottom layer adhesive member (124) is formed by spin coating. For example, the base layer can be formed by spin coating PI to a uniform thickness. The base layer can be heat-treated after spin coating.

[0145] The reflective base layer forming the reflective layer (122) can be formed by a deposition method of a metal material. For example, the reflective base layer can be formed by using an electron beam deposition machine to deposit a metal material with a uniform thickness on the base layer that has solar light reflective properties.

[0146] The radiative cooling substrate layer forming the radiative cooling layer (123) can be formed on the reflective substrate layer by a spin coating method. For example, a radiative cooling substrate layer can be formed on the reflective substrate layer by spin coating a polymer material having mid-infrared radiation properties, such as SU-8, to a uniform thickness.

[0147] A mask layer can be formed on a radiation-cooled substrate layer by a deposition method of a metallic material. For example, a mask layer can be formed by electron beam deposition of copper (Cu), which can be used as a hard mask, to a uniform thickness.

[0148] After forming the mask layer, the final structure of the bottom layer (120) is formed through an etching process. For example, by etching the radiation cooling base layer, the reflection base layer, and the base layer through reactive ion etching, a bottom base layer (121), a reflection layer (122), and a radiation cooling layer (123) including a base (121a), a first end section (121b), a second end section (121c), and a connecting section (121d) can be formed simultaneously.

[0149] And the mask layer can be removed using an etching agent or in another way, and the sacrificial layer can be dissolved using a solvent or in another way to separate the bottom layer (120) from the donor substrate.

[0150] The manufacturing of the top layer (130) of the micro device is based on microprocessing technology similar to that of the bottom layer (120), but special process conditions considering structural characteristics may be applied. The specific manufacturing process is as follows.

[0151] In the top layer fabrication step (S12), the top layer (130) is fabricated on a donor substrate using microprocessing technology. That is, a sacrificial layer is formed on a donor substrate such as a silicon wafer, a top layer adhesive member (133) is formed on the sacrificial layer, a base layer for forming the top base layer (131) is formed on the sacrificial layer, a mask layer is formed on the base layer, and then the top base layer (131) can be fabricated through an etching process.

[0152] The method for forming the sacrificial layer is the same as described above, and the method for forming the top layer adhesive member (133) is the same as the method for forming the bottom layer adhesive member (124). In addition, the etching process is the same as described above. Through the etching process, a top base layer (131) including a cover (131a), a band (131b), and a bridge (131c) can be formed. After the etching process, the mask layer can be removed and the sacrificial layer dissolved to separate the top base layer (131) from the donor substrate.

[0153] After forming the base layer in the top layer manufacturing step (S12), a solar absorption base layer can be formed to form a solar absorption layer (132) on the base layer. Then, the solar absorption base layer can be etched through an etching process to form the solar absorption layer (132).

[0154] The step (S13) of bonding the bottom layer and the top layer to the flexible substrate proceeds in the order of the extension step of the flexible substrate (110), the bonding step of the bottom layer (120), and the bonding step of the top layer (130).

[0155] First, a flexible substrate (110) capable of elongation and contraction is stretched and fixed. For example, the flexible substrate (110) can be fixed after being stretched to 100% by uniaxial deformation. As previously described, a silicon elastomer substrate can be used as the flexible substrate (110), and the surface of the flexible substrate (110) can be treated with UV ozone (UVO) before uniaxial deformation of the flexible substrate (110).

[0156] Next, the fabricated bottom layer (120) is bonded onto the flexible substrate (110). For example, the bottom layer (120) can be picked up from the donor substrate using PVA tape, aligned onto the flexible substrate (110), and then placed on the flexible substrate (110). At this time, the base (121a), the first end section (121b), and the second end section (121c) are fixed to the flexible substrate (110) by the bottom layer adhesive member (124).

[0157] Next, the fabricated top layer (130) is bonded onto the flexible substrate (110). For example, the top layer (130) can be picked up from the donor substrate using PVA tape and aligned onto the flexible substrate (110) to which the bottom layer (120) is attached, and then the top layer (130) can be placed on the flexible substrate (110) so that the solar absorber (136) covers the radiative coolant (126). At this time, the fixed section (131b1) of the band (131b) is fixed to the flexible substrate (110) by the top layer adhesive member (133).

[0158] A plurality of bottom layers (120) and a plurality of top layers (130) can be manufactured in the manner described above, and a plurality of bottom layers (120) and a plurality of top layers (130) can be combined on a single flexible substrate (110).

[0159] In this way, a smart heating and cooling device (100) that operates stably even at a micro scale can be manufactured using micro-process technology.

[0160] Previously, it was described that a solar absorption layer (132) is formed on a top base layer (131) and then the top layer (130) is bonded to a flexible substrate (110), but the solar absorption layer (132) can be formed in the final step.

[0161] FIG. 10 is a process diagram showing a method for manufacturing a smart heating and cooling device according to another embodiment of the present invention.

[0162] The manufacturing method shown in FIG. 10 includes a bottom layer fabrication step (S21), a top base layer fabrication step (S22), a step of bonding the bottom layer and the top base layer to a flexible substrate (S23), and a solar absorption layer placement step (S24). The bottom layer fabrication step (S21) and the top base layer fabrication step (S22) are the same as those previously described.

[0163] However, the top base layer is bonded to the flexible substrate (110) without the solar light absorption layer (132) being placed thereon. The method of bonding the top base layer (131) to the flexible substrate (110) is the same as described above.

[0164] In the step of placing the solar absorption layer (S24), a solar absorption layer (132) is placed on a top base layer (131) bonded to a flexible substrate (110). For example, a colored paint, such as carbon black paint, can be applied over the cover (131a) of the top base layer (131) using a shadow mask to form the solar absorption layer (132).

[0165] The manufacturing method shown in Fig. 10 can be applied to both the manufacturing of macro devices and micro devices.

[0166] Hereinafter, experimental examples of a smart heating and cooling device and a method for manufacturing the same according to the present invention will be described.

[0167] [Experimental Example 1: Preparation of a Macro Device]

[0168] A PI film with a thickness of approximately 120 μm was prepared, and a bottom base layer was fabricated through a laser cutting process using a Universal laser system (vls 4.60).

[0169] After aligning a PI shadow mask on a PI film as a bottom base layer, a silver (Ag) layer approximately 100 nm thick was deposited as a reflection layer using an electron beam deposition machine.

[0170] Next, PDMS was spin-coated as a radiative cooling layer on a silver (Ag) layer to form a PDMS layer with a thickness of about 100 μm.

[0171] Finally, as a bottom layer adhesive, a silicone adhesive (Md-74502, Dow Corning) was applied to a portion of the PI film to provide bonding sites to be fixed to the flexible substrate.

[0172] A PI film with a thickness of approximately 120 μm was prepared, and a top base layer was fabricated through a laser cutting process using a Universal laser system (vls 4.60).

[0173] Next, a silicone adhesive (Md-74502, Dow Corning) was applied to a portion of the PI film as a top layer adhesive to provide bonding sites to be fixed to a flexible substrate.

[0174] Subsequently, a PI film as a bottom base layer and a PI film as a top base layer were successively transferred onto an elongated (100% shortening) silicon elastomer substrate, and then a carbon black paint was selectively applied onto the PI film as a top base layer using a PI shadow mask to form a solar light absorption layer.

[0175] In the macro device fabricated in this way, the top layer is maintained in a 2D structure (closed window structure) while the silicon elastomer substrate is stretched, and when the stretching of the silicon elastomer substrate is released, the top layer is deformed into a 3D structure and the PDMS layer is exposed to the outside.

[0176] Figure 11 is a photograph showing the top layer of an experimentally fabricated macro device maintained as a closed window structure.

[0177] Figure 12 is a photograph showing the top layer of an experimentally fabricated macro device transformed into an open window structure.

[0178] [Experimental Example 2: Fabrication of Micro Devices]

[0179] A PMMA (Microchem INC) was spin-coated onto a silicon wafer serving as a donor substrate to form a PMMA layer with a thickness of approximately 100 nm as a sacrificial layer, and SiO2 / Ti (approx. 100 / 100 nm), which serves as a bottom layer adhesive, was selectively deposited using photolithography and an electron beam evaporator.

[0180] Next, a PI layer (about 6 μm) was formed on the PMMA layer by spin coating, a thin silver (Ag) layer (about 200 nm) was deposited using an electron beam evaporator, and an SU-8 layer (about 15 μm) serving as a radiative cooling layer was formed by spin coating.

[0181] Next, a thin copper (Cu) layer (about 100 nm) was deposited as a hard mask by electron beam evaporation, and a bottom layer was fabricated by etching the PI layer, silver (Ag) layer, and SU-8 layer through ion etching (RIE, O2 gas, 150 mTorr, 50 W, 30 sccm).

[0182] Next, the copper (Cu) layer was removed through wet etching (copper etchant type ce-100, TRANSENE INC).

[0183] A PMMA (Microchem INC) was spin-coated onto a silicon wafer serving as a donor substrate to form a PMMA layer with a thickness of approximately 100 nm as a sacrificial layer, and SiO2 / Ti (approx. 100 / 100 nm), which serves as a top layer adhesive, was selectively deposited using photolithography and an electron beam evaporator.

[0184] Next, a PI layer (about 6 μm) was formed on the PMMA layer by spin coating, and a thin copper (Cu) layer (about 100 nm) was deposited as a hard mask by electron beam evaporation.

[0185] Next, a bottom layer was fabricated by etching the PI layer using ion etching (RIE, O2 gas, 150 mTorr, 50 W, 30 sccm), and the copper (Cu) layer was removed using wet etching (copper etchant type ce-100, TRANSENE INC).

[0186] Afterwards, each PMMA layer was dissolved in acetone to separate the PI film as the bottom base layer and the PI film as the top base layer from each silicon wafer.

[0187] A silicon elastomer substrate was treated with UV ozone (UVO) for 3 minutes, and after stretching the silicon elastomer substrate (100% uniaxial deformation), a PI film as a bottom base layer and a PI film as a top base layer were each placed on the silicon elastomer substrate that had been continuously stretched with a PVA tape, and the PVA tape was dissolved in water to bond the PI film as a bottom base layer and the PI film as a top base layer to the silicon elastomer substrate with SiO2 / Ti. Then, a carbon black paint was selectively applied onto the PI film as a top base layer using a PI shadow mask to form a solar light absorption layer.

[0188] [Experimental Example 3: Performance Evaluation of Macro Devices]

[0189] To evaluate the performance of the macro device fabricated in the experimental example of the present invention, temperature measurement experiments were conducted in various application environments. The experiment was performed on May 24, 2024, on the rooftop of a building located in Daejeon (latitude 36.38°N, longitude 127.36°E).

[0190] The experiment was conducted on three objects, a building rooftop, a MEMS device, and a small model car, under conditions of heating mode (100% elongation of the silicon elastomer substrate) and cooling mode (release of elongation of the silicon elastomer substrate).

[0191] The experimental results applied to the rooftop of a building are as shown in the graph in Fig. 15. Looking at Fig. 15, it was confirmed that there was an effect of +5.3°C increase in heating mode and -11.0°C decrease in cooling mode.

[0192] The experimental results applied to the MEMS device are as shown in the graph in Fig. 16. Looking at Fig. 16, it was confirmed that there was an effect of +4.8°C increase in heating mode and -4.2°C decrease in cooling mode.

[0193] The experimental results applied to a small model car are as shown in the graph in Fig. 17. Looking at Fig. 17, it was confirmed that there was an effect of +1.8°C increase in heating mode and -2.2°C decrease in cooling mode.

[0194] As such, experiments confirmed the potential for the macro device to effectively switch between heating and cooling functions within a single unit and to actively respond to daily temperature fluctuations or seasonal changes.

[0195] Furthermore, these experimental results demonstrate that the smart heating and cooling device of the present invention can be utilized as an effective thermal management solution in various application fields, and have shown the potential for practical application in a wide range of areas, such as improving building energy efficiency, managing vehicle temperatures, and controlling the heat of electronic devices.

[0196] Although preferred examples of the present invention have been described above, the scope of the present invention is not limited to the forms described and illustrated above.

[0197] For example, the bottom layer (120) may include a radiative cooling body (126) and may not include end sections (121b) (121c) and connecting sections (121d).

[0198] In addition, although the manufacturing method of a macro device and the manufacturing method of a micro device were previously described as different, the manufacturing method of a smart heating and cooling device according to the present invention may be the same for macro devices and micro devices.

[0199] Although the embodiments of this specification have been described in more detail with reference to the attached drawings, this specification is not necessarily limited to these embodiments and may be modified in various ways within the scope of the technical spirit of this specification. Accordingly, the embodiments disclosed in this specification are intended to explain, not to limit, the technical spirit of this specification, and the scope of the technical spirit of this specification is not limited by these embodiments. Therefore, the embodiments described above should be understood as illustrative in all respects and not restrictive.

[0200] [National R&D projects that supported this invention]

[0201] [Project ID] 2024040037

[0202] [Assignment No.] 2024040037

[0203] [Ministry Name] Ministry of Science and ICT

[0204] [Name of Project Management (Specialized) Agency] (New) National Research Foundation of Korea (Integrated)

[0205] [Research Project Name] Outstanding Young Researcher

[0206] [Project Title] Development of High-Performance Soft Actuators for Micro Flying Robots

[0207] [Name of Project Performing Organization] Daegu Gyeongbuk Institute of Science and Technology

[0208] [Research Period] April 1, 2024 ~ March 31, 2025

[0209] [National R&D projects that supported this invention]

[0210] [Project ID] 2710016371

[0211] [Assignment No.] 2710016371

[0212] [Ministry Name] Ministry of Science and ICT

[0213] [Name of Project Management (Specialized) Agency] (New) National Research Foundation of Korea (Integrated)

[0214] [Research Project Name] Future Technology Research Lab

[0215] [Research Project Title] Development of Infrared Emissivity Control Materials for Energy Saving in Everyday Environments

[0216] [Name of Project Performing Organization] Yonsei University

[0217] [Research Period] 2024.01.01 ~ 2024.12.31

[0218] [National R&D projects that supported this invention]

[0219] [Project ID] 2710006244

[0220] [Assignment No.] 2710006244

[0221] [Ministry Name] Ministry of Science and ICT

[0222] [Name of Project Management (Specialized) Agency] (New) National Research Foundation of Korea (Integrated)

[0223] [Research Project Name] Nanomaterial Technology Development (R&D) - Materials Global Young Connect

[0224] [Project Title] Development of a Theramorphic Magnetic Composite Material Platform for Orally Administered All-in-One Soft Robots

[0225] [Name of Project Performing Organization] Ulsan National Institute of Science and Technology

[0226] [Research Period] April 1, 2024 ~ December 31, 2024

[0227] [National R&D projects that supported this invention]

[0228] [Project ID] 2710018118

[0229] [Assignment No.] 2710018118

[0230] [Ministry Name] Ministry of Science and ICT

[0231] [Name of Project Management (Specialized) Agency] (New) National Research Foundation of Korea (Integrated)

[0232] [Research Project Name] Group Research Support (R&D) - Global Leading Research Center (ERC)

[0233] [Research Project Title] Global Bio-convergence Interfacing Materials Center

[0234] [Name of Project Performing Organization] Korea Advanced Institute of Science and Technology

[0235] [Research Period] 2024.08.01 ~ 2025.04.30

Claims

1. Flexible substrate; A bottom layer disposed on the above flexible substrate and having a radiative cooler; and It includes a top layer having a band disposed on the flexible substrate and partially fixed to the flexible substrate so as to be bent and deformed according to the deformation of the flexible substrate, and a solar absorber connected to the band so as to be able to move according to the deformation of the band. A smart heating and cooling device in which a solar absorber moves according to the deformation of the flexible substrate to selectively cover the radiative cooler.

2. In Paragraph 1, The above-described solar absorber is a smart heating and cooling device capable of angle adjustment for the radiative coolant according to the amount of deformation of the flexible substrate.

3. In Paragraph 1, A smart heating and cooling device in which the angle of the solar absorber relative to the radiative cooler changes according to the uniaxial strain of the flexible substrate, so that the radiative cooler is covered by the solar absorber or exposed to the outside.

4. In Paragraph 1, The above radiative cooling body is, A base disposed on the above flexible substrate; A reflective layer disposed on the above base; and A smart heating and cooling device comprising a radiative cooling layer disposed on the reflection layer.

5. In Paragraph 4, The above radiative cooling layer comprises at least one material selected from PDMS (polydimethylsiloxane), PMMA (polymethyl methacrylate), DPHA (dipentaerythritol penta / hexa acrylate), SU-8, PMMA, and PVDF (polyvinylidene fluoride), in a smart heating and cooling device.

6. In Paragraph 4, The above bottom layer is, A pair of end sections spaced apart from each of the two ends of the base; and It includes a plurality of connecting sections connecting the above base and the above pair of end sections, A smart heating and cooling device in which the base and the pair of end sections are fixed to the flexible substrate, and the plurality of connecting sections are not fixed to the flexible substrate.

7. In Paragraph 1, The above-mentioned solar absorber is, A cover connected to the above band; and A smart heating and cooling device comprising a solar absorption layer disposed on the above cover.

8. In Paragraph 7, The above-mentioned solar absorption layer is a smart heating and cooling device containing colored paint.

9. In Paragraph 7, The above band is, A fixed section fixed to the flexible substrate; and It includes a bending section that is not fixed to the flexible substrate so as to be bendable according to the deformation of the flexible substrate, The above cover is a smart heating and cooling device connected to the above banding section.

10. In Paragraph 9, The above top layer is, A smart heating and cooling device comprising a bridge connecting the above cover and the above banding section.

11. In Paragraph 10, The above bridge is a smart heating and cooling device positioned offset toward one of the two ends of the above bending section.

12. In Paragraph 10, The above cover and the above bridge are smart heating and cooling devices positioned on both sides of the band.

13. In Paragraph 7, The above top layer is, A smart heating and cooling device comprising an auxiliary reflective layer disposed on the inner surface of the cover and reflecting visible light.

14. Stretchable flexible substrate; A radiative cooler disposed on the above flexible substrate; A band connected to the flexible substrate to be deformed according to the expansion and contraction of the flexible substrate; and A smart heating and cooling device comprising a solar absorber connected to the above band and selectively covering the radiative cooler by changing its angle according to the deformation of the above band.

15. In Paragraph 14, The above-mentioned solar absorber is a smart heating and cooling device that tilts due to the buckling deformation of the band.

16. A flexible substrate capable of switching between a first deformation state and a second deformation state; A radiative cooler disposed on the above flexible substrate and having mid-infrared radiation characteristics; and It includes a solar absorber disposed on the radiative cooler, having solar absorption characteristics, and connected to the flexible substrate such that its relative position to the radiative cooler changes according to the deformation state of the flexible substrate. When the flexible substrate is in the first deformation state, the radiative coolant is covered by the solar absorber and operates in a heating mode, and A smart heating and cooling device in which, when the flexible substrate is in the second deformation state, the radiative cooler is exposed to the outside and operates in a cooling mode.

17. In Paragraph 16, The first deformation state above is a state in which the flexible substrate is stretched by uniaxial strain, and The above second deformation state is a smart heating and cooling device in which the elongation of the flexible substrate is released.

18. In Paragraph 17, A smart heating and cooling device comprising an actuator that causes uniaxial deformation of the above flexible substrate.

19. Flexible substrate; A bottom layer disposed on the above flexible substrate and having a radiative cooler; and It comprises a solar absorber, and a top layer disposed on the flexible substrate such that the solar absorber covers the radiative coolant. The above top layer is partially bent and deformed according to the deformation of the flexible substrate to selectively cover the solar absorber, a smart heating and cooling device.

20. Step of preparing a flexible substrate; Step of preparing a bottom layer having a radiative cooling element; Step of preparing a top layer having a solar absorber; A step of stretching the flexible substrate; A step of fixing the above bottom layer to the stretched flexible substrate; and The method includes the step of partially fixing the top layer to the extended flexible substrate so that the solar absorber covers the radiative coolant, A method for manufacturing a smart heating and cooling device in which the top layer is partially bent and deformed according to the deformation of the flexible substrate and arranged to selectively cover the solar absorber.

21. In Paragraph 20, In the step of preparing the above bottom layer, the radiative cooling body is, The stage of preparing the base; Step of placing a reflective layer on the above base; and A method for manufacturing a smart heating and cooling device by placing a radiative cooling layer on the reflection layer above.

22. In Paragraph 21, The above-mentioned reflective layer is formed through the deposition of a metal having reflective properties, and A method for manufacturing a smart heating and cooling device in which the above-mentioned radiative cooling layer is formed through spin coating of a mid-infrared radiation material.

23. In Paragraph 20, In the step of preparing the top layer, the solar absorber is, Step of preparing a cover connected to a band; and A method for manufacturing a smart heating and cooling device by placing a solar absorption layer on the above cover.

24. In Paragraph 23, A method for manufacturing a smart heating and cooling device by applying colored paint onto the cover to form the solar absorption layer.

25. In Paragraph 23, The step of preparing the top layer above is, A method for manufacturing a smart heating and cooling device comprising the step of placing an auxiliary reflective layer on the inner surface of the above cover.

26. In Paragraph 20, In the step of stretching the flexible substrate, A method for manufacturing a smart heating and cooling device that stretches the above-mentioned flexible substrate by uniaxial strain.

27. A step of forming a radiative coolant by sequentially stacking a base, a reflection layer, and a radiative cooling layer; A step of forming a solar absorber by placing a solar absorption layer on a cover connected to a band; A step of combining the radiative cooling body on an extended flexible substrate; and A method for manufacturing a smart heating and cooling device comprising the step of partially fixing the band to the flexible substrate so that the solar absorber covers the radiative coolant.

28. Step of preparing the radiative coolant; Step of preparing a top base layer having a band and a cover connected to the band; A step of combining the radiative cooling body on an extended flexible substrate; A step of partially fixing the band to the extended flexible substrate so that the cover covers the radiative coolant, thereby placing the top base layer on the extended flexible substrate; and A method for manufacturing a smart heating and cooling device comprising the step of forming a solar absorption layer on the above cover.

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