Circuit board, display module and display device

Abstract

A circuit board, comprising a first sub-board and a second sub-board. The first sub-board comprises a first circuit board, a first electronic element and a first bonding pin, wherein the first electronic element is arranged on a first side of the first circuit board; the first bonding pin is arranged on a second side of the first circuit board and located at one end of the first circuit board; and a first side and a second side of the first circuit board are two opposite sides of the first circuit board. The second sub-board comprises a second circuit board. The second circuit board is connected to the end of the first circuit board at which the first bonding pin is arranged, and the second circuit board comprises a first portion and a second portion. The first portion can be bent toward the second side of the first circuit board along a first bending axis extending in a first direction, such that the second portion is bent to the second side of the first circuit board. The first portion and the second portion are arranged in a second direction, and the second portion is located on the side of the first portion away from the first circuit board. The second direction intersects the first direction and is parallel to a surface of the first circuit board on which the first electronic element is arranged.

Description

Circuit boards, display modules and display devices

[0001] This application claims priority to Chinese patent application No. 202411497681.7, filed on October 24, 2024, the entire contents of which are incorporated herein by reference. Technical Field

[0002] This disclosure relates to the field of display technology, and in particular to a circuit board, a display module, and a display device. Background Technology

[0003] With the rapid development of display technology, display technologies such as organic light-emitting diode (OLED) displays, quantum dot OLED displays, and micro light-emitting diode (MEMB) displays have been widely integrated into people's daily lives, such as mobile phones, wearable watches, televisions, laptops, and in-vehicle displays. Summary of the Invention

[0004] On one hand, a circuit board is provided. The circuit board includes a first sub-board and a second sub-board. The first sub-board includes a first circuit board, a first electronic component, and a first bonding pin, wherein the first electronic component is disposed on a first side of the first circuit board. The first bonding pin is disposed on a second side of the first circuit board and located at one end of the first circuit board. The first side and the second side of the first circuit board are opposite sides of the first circuit board.

[0005] The second sub-board includes a second circuit board. The second circuit board is connected to the end of the first circuit board where the first bonding pin is located. The second circuit board includes a first portion and a second portion. The first portion is bendable along a first bending axis extending in a first direction toward a second side of the first circuit board, causing the second portion to bend to the second side of the first circuit board. The first portion and the second portion are arranged along a second direction, with the second portion located on the side of the first portion away from the first circuit board. The second direction intersects the first direction and is parallel to the surface of the first circuit board where the first electronic component is located.

[0006] In some embodiments, the second sub-board further includes a second electronic component disposed on one side of the second circuit board. Furthermore, when the second circuit board is bent to a second side of the first circuit board, the second electronic component is located on the side of the second circuit board away from the first circuit board.

[0007] In some embodiments, the height of the second electronic component is greater than or equal to 0.1 mm and less than 0.5 mm.

[0008] In some embodiments, the second sub-board is a second circuit board that does not contain electronic components.

[0009] In some embodiments, the first circuit board has a third portion and a fourth portion, the third portion and the fourth portion being arranged along a second direction, and the fourth portion being located on the side of the third portion away from the second circuit board. The second direction intersects the first direction and is parallel to the surface of the first circuit board on which the first electronic component is disposed. The first circuit board includes multiple layers of first conductive layers, and the third portion includes fewer first conductive layers than the fourth portion.

[0010] In some embodiments, the first circuit board includes a grounding region disposed on a first side of the first circuit board and located at the end of the first circuit board away from the first bonding pin.

[0011] In some embodiments, the first circuit board has a third portion and a fourth portion, the third portion and the fourth portion being arranged along a second direction, and the fourth portion being located on the side of the third portion away from the second circuit board. The second direction intersects the first direction and is parallel to the surface of the first circuit board on which the first electronic component is disposed.

[0012] The fourth part includes a first sub-part, a second sub-part, and a third sub-part, which are arranged along the second direction, with the second sub-part located between the first and third sub-parts. The second sub-part can be bent toward a first side of the first circuit board via a second bending axis extending along the first direction, causing the third sub-part to bend toward the side of the first sub-part away from the circuit board connection.

[0013] In some embodiments, the first circuit board includes a grounding region disposed on a second side of the first circuit board and located at the end of the third sub-part away from the first bonding pin.

[0014] In some embodiments, all of the first electronic components are disposed in the third portion.

[0015] In some embodiments, the first circuit board includes multiple first substrate layers, the first substrate layer being a rigid substrate layer, and the second circuit board includes multiple second substrate layers, the second substrate layer being a flexible substrate layer.

[0016] In some embodiments, the thickness of the first circuit board is greater than the thickness of the second circuit board.

[0017] In some embodiments, the first circuit board has a first cutout area, which is used to accommodate a driver chip.

[0018] In some embodiments, the first circuit board has a third portion and a fourth portion, the third portion and the fourth portion being arranged along a second direction, and the fourth portion being located on the side of the third portion away from the second circuit board. The first cutout area is disposed at one end of the third portion near the fourth portion.

[0019] In some embodiments, the first circuit board includes a first circuit trace, the second circuit board includes a second circuit trace, and the first bonding pin is connected to the first circuit trace and the second circuit trace.

[0020] In some embodiments, the first circuit board includes a bonding portion and a routing portion, the first bonding pin is disposed on the bonding portion, and the first electronic component is disposed on the routing portion. The thickness of the bonding portion is less than the thickness of the routing portion; and / or, the thickness of the bonding portion is less than the thickness of the second circuit board.

[0021] In some embodiments, the circuit board further includes a third sub-board, which includes a third circuit board and a connector. The third circuit board is connected to one end of the first circuit board. The connector is located at the end of the third circuit board away from the first circuit board.

[0022] On the other hand, a display module is provided. The display module includes a display panel and a circuit board. The display panel includes a main body, a circuit board connecting portion, and a bending portion located between the main body and the circuit board connecting portion. The main body has a display side and a back side disposed opposite to each other. The bending portion can be bent toward the back side of the main body along a third bending axis extending in a first direction, so that the circuit board connecting portion bends to the back side of the main body. The circuit board connecting portion is provided with a plurality of second bonding pins.

[0023] The circuit board is the circuit board described in any of the above embodiments. The first bonding pin of the circuit board is connected to the second bonding pin, and the first part of the second circuit board of the circuit board is bent toward the second side of the first circuit board along the first bending axis in the first direction, so that the second part of the second circuit board is bent between the circuit board connection part and the main body part.

[0024] In some embodiments, the display module further includes a first adhesive and a second adhesive. The first adhesive is disposed between the main body portion and the second portion. The second adhesive is disposed between the circuit board connector portion and the second portion.

[0025] In some embodiments, the second sub-board of the circuit board includes a second electronic component disposed on one side of the second circuit board. Furthermore, when the second circuit board is bent along the first bending axis to a second side of the first circuit board, the second electronic component is located on the side of the second circuit board away from the first circuit board. The display module further includes a support assembly disposed between the main body and the circuit board connection portion. The support assembly has a first clearance hole, and the second electronic component is located within the first clearance hole.

[0026] In some embodiments, the support assembly includes a first adhesive layer, a buffer layer, and a support layer stacked sequentially, with the first adhesive layer located between the main body and the buffer layer. The first clearance hole penetrates through the first adhesive layer, the buffer layer, and the support layer.

[0027] In some embodiments, the first circuit board of the circuit board has a third portion and a fourth portion, the fourth portion including a first sub-part, a second sub-part, and a third sub-part, wherein the second sub-part is bendable toward a first side of the first circuit board via a second bending axis extending along the first direction, such that the third sub-part bends toward the first side of the first sub-part. The display module further includes a third adhesive backing disposed on the first circuit board between the first sub-part and the third sub-part.

[0028] In some embodiments, the first circuit board has a first cutout area, and the display module further includes a driver chip, which is disposed on the circuit board connection portion and located in the first cutout area.

[0029] In another aspect, a display device is provided. The display device includes a housing and a display module as described in any of the above embodiments, the display module being disposed within the housing. Attached Figure Description

[0030] To more clearly illustrate the technical solutions in this disclosure, the accompanying drawings used in some embodiments of this disclosure will be briefly described below. Obviously, the drawings described below are only drawings of some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams and are not intended to limit the actual size of the product, the actual flow of the method, the actual timing of the signals, etc. involved in the embodiments of this disclosure.

[0031] Figure 1 is a structural diagram of a display device according to some embodiments;

[0032] Figure 2 is a structural diagram of another display device according to some embodiments;

[0033] Figure 3 is a cross-sectional view of a display device shown in Figure 1 along section line AA;

[0034] Figure 4 is a structural diagram of a display panel according to some embodiments;

[0035] Figure 5 is a structural diagram of a circuit board according to some embodiments;

[0036] Figure 6A is a structural diagram of a display panel and a circuit board bonded together according to some embodiments, with neither of them bent;

[0037] Figure 6B is a structural diagram of a display panel and a circuit board bonded together according to some embodiments, with only the circuit board bent;

[0038] Figure 7 is a structural diagram of a display panel and a circuit board that are both bent according to some embodiments;

[0039] Figure 8 is a structural diagram of a first circuit board according to some embodiments;

[0040] Figure 9 is a structural diagram of a second circuit board according to some embodiments;

[0041] Figure 10 is a structural diagram of another circuit board according to some embodiments;

[0042] Figure 11A is a structural diagram of another circuit board according to some embodiments;

[0043] Figure 11B is a structural diagram of the circuit board shown in Figure 11A after it is bonded to the display panel;

[0044] Figure 12 is a structural diagram of another circuit board according to some embodiments;

[0045] Figure 13 is a structural diagram of the circuit board shown in Figure 12 after it is bonded to the display panel;

[0046] Figure 14 is a structural diagram of another circuit board according to some embodiments;

[0047] Figure 15 is a structural diagram of the circuit board shown in Figure 14 after it is bonded to the display panel;

[0048] Figure 16 is a structural diagram of a circuit board and a display panel bonded according to some embodiments;

[0049] Figure 17 is a structural diagram of another circuit board bonded to a display panel according to some embodiments;

[0050] Figure 18 is a structural diagram of a circuit board bonded to a display panel according to some embodiments;

[0051] Figure 19 is a structural diagram of a circuit board bonded to a display panel according to some embodiments. Detailed Implementation

[0052] The technical solutions in some embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments provided in this disclosure are within the scope of protection of this disclosure.

[0053] Unless the context otherwise requires, throughout the specification and claims, the term "comprise" and its other forms, such as the third-person singular "comprises" and the present participle "comprising," are interpreted as open-ended and encompassing, meaning "including, but not limited to." In the description of the specification, terms such as "one embodiment," "some embodiments," "exemplary embodiments," "example," "specific example," or "some examples," etc., are intended to indicate that a particular feature, structure, material, or characteristic associated with that embodiment or example is included in at least one embodiment or example of this disclosure. The illustrative representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics mentioned may be included in any suitable manner in any one or more embodiments or examples.

[0054] Hereinafter, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of this disclosure, unless otherwise stated, "a plurality of" means two or more.

[0055] In describing some embodiments, the term "connection" and its derivative expressions may be used. For example, in describing some embodiments, the term "connection" may be used to indicate that two or more components are in direct physical or electrical contact with each other, or to indicate that two or more components are fixed or electrically connected to each other through an intermediate medium.

[0056] "At least one of A, B and C" has the same meaning as "at least one of A, B or C", both including the following combinations of A, B and C: only A, only B, only C, combinations of A and B, combinations of A and C, combinations of B and C, and combinations of A, B and C.

[0057] "A and / or B" includes the following three combinations: A only, B only, and a combination of A and B.

[0058] As used herein, “about,” “approximately,” or “approximately” includes the stated value and the average value within an acceptable range of deviation from the given value, wherein the acceptable range of deviation is determined by a person skilled in the art taking into account the measurement under discussion and the error associated with the measurement of the given quantity (i.e., the limitations of the measurement system).

[0059] As used herein, “parallel,” “perpendicular,” and “equal” include the described situation and situations that are similar to the described situation, within an acceptable range of deviation, which is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, “parallel” includes absolute parallelism and approximate parallelism, where an acceptable range of deviation for approximate parallelism may be, for example, within 5°; “perpendicular” includes absolute perpendicularity and approximate perpendicularity, where an acceptable range of deviation for approximate perpendicularity may also be, for example, within 5°; “equal” includes absolute equality and approximate equality, where an acceptable range of deviation for approximate equality may be, for example, a difference between the two equals being less than or equal to 5% of either one.

[0060] It should be understood that when a layer or element is referred to as being on another layer or substrate, it can mean that the layer or element is directly on the other layer or substrate, or that there is an intermediate layer between the layer or element and the other layer or substrate.

[0061] This document describes exemplary embodiments with reference to cross-sectional views and / or plan views, which are idealized exemplary drawings. In the drawings, the thickness of layers and the area of ​​regions are enlarged for clarity. Therefore, variations in shape relative to the drawings are contemplated due to, for example, manufacturing techniques and / or tolerances. Thus, exemplary embodiments should not be construed as being limited to the shapes of the regions shown herein, but rather include shape deviations due to, for example, manufacturing processes. For example, etched areas shown as rectangular would typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to show the actual shapes of the areas of the device, nor are they intended to limit the scope of the exemplary embodiments.

[0062] In this specification, when a component (or area, layer, section) is referred to as "covering" another component, it can directly cover the other component, or there may be an intervening third component.

[0063] The term "relative" means that the first element can be directly or indirectly relative to the second element. In the case where the third element is between the first and second elements, although they are still relative to each other, the first and second elements can be understood as being indirectly relative to each other.

[0064] As shown in FIG1, some embodiments of the present disclosure provide a display device 1000, which can be any device that displays text or images, whether in motion (e.g., video) or fixed (e.g., still image).

[0065] For example, referring to Figures 1 and 2, the display device 1000 can be any product or component with display function, such as a portable display product, wearable device, television, computer, flight display, vehicle display, clock, virtual reality (VR) device, augmented reality (AR) device, signboard, and billboard.

[0066] For example, as shown in Figure 1, the display device 1000 can be the mobile phone shown in Figure 1. As another example, referring to Figure 2, the display device 1000 can be the VR device shown in Figure 2.

[0067] It should be noted that, depending on the application scenario, the display device 1000 can be a flat display device or a curved display device, etc., and the shape of the display surface of the display device 1000 can be any one of a circle, an ellipse, a polygon, or an irregular shape. The embodiments disclosed herein are not limited to this.

[0068] The following description uses the flat panel display device (mobile phone) shown in FIG1 as an example to illustrate some embodiments of the present disclosure. However, the implementation of the present disclosure is not limited to this, and any display device can be considered as long as the same technical concept is applied.

[0069] In some embodiments, referring to FIG3, the display device 1000 includes a display module 100 and a housing 200, wherein the display module 100 may be disposed within the housing 200.

[0070] For example, as shown in FIG3, the display module 100 includes a display panel 10, a circuit board 20 and a cover plate 30. The longitudinal section of the housing 200 may be U-shaped, for example. The display panel 10 and the circuit board 20 are disposed inside the housing 200, and the cover plate 30 is disposed at the opening of the housing 200 to protect the display panel 10.

[0071] The aforementioned display panel 10 may be an organic light-emitting diode (OLED) display panel, a quantum dot light-emitting diode (QLED) display panel, a micro light-emitting diode (Micro LED) display panel, a silicon-based Micro OLED display panel, or a sub-millimeter light-emitting diode (Mini Light Emitting Diodes) display panel; however, the embodiments disclosed herein are not limited to these.

[0072] Referring to Figures 4 and 5, the circuit board 20 is connected to the display panel 10 to provide display signals to the display panel 10. For example, the circuit board 20 is provided with a plurality of first bonding pins 202, and the display panel 10 is provided with a plurality of second bonding pins 121. The first bonding pins 202 of the circuit board 20 are connected to the second bonding pins 121 of the circuit board connection part 120 to provide display signals to the display panel 10.

[0073] In some examples, referring to FIG4, the display panel 10 includes a main body 110, a circuit board connection 120, and a bent portion 130 located between the main body 110 and the circuit board connection 120.

[0074] As shown in FIG6B, the main body 110 has a display side 10A and a back side 10B disposed opposite to each other. The display side 10A refers to the side of the main body 110 that displays the image (the lower side in FIG6B), and the back side 10B refers to the other side opposite to the display side 10A (the upper side in FIG6B).

[0075] As shown in Figures 5 and 6B, the circuit board connection portion 120 is used to connect the circuit board 20. For example, the circuit board 20 is provided with a plurality of first bonding pins 202, and the circuit board connection portion 120 is provided with a plurality of second bonding pins 121. The first bonding pins 202 of the circuit board 20 are connected to the second bonding pins 121 of the circuit board connection portion 120 to provide display signals to the display panel 10.

[0076] As shown in Figures 5, 6B, and 7, the bending portion 130 can be bent along a third bending axis extending in the first direction X toward the back side 10B of the main body portion 110, causing the circuit board connecting portion 120 to bend to the back side 10B of the main body portion 110. In this way, the circuit board 20 is connected to the circuit board connecting portion 120 on the back side 10B of the main body portion 110. The circuit board 20 can be disposed on the back side 10B of the main body portion 110 without increasing the area of ​​the display module 100 on the plane where the main body portion 110 is located, which helps to reduce the bezel of the display device 1000 (see Figure 1).

[0077] In this document, the plane in which the main body 110 is located may be, for example, the plane in which the surface of the display side 10A of the main body 110 is located.

[0078] The bending radius of the aforementioned bending portion 130 can be, for example, 0.2 mm to 0.3 mm. For instance, the bending radius of the bending portion 130 can be any one of 0.2 mm, 0.22 mm, 0.23 mm, 0.25 mm, 0.26 mm, 0.28 mm, and 0.3 mm. The distance between the aforementioned circuit board connecting portion 120 and the main body portion 110 can be, for example, 0.4 mm to 0.6 mm. For instance, the distance between the circuit board connecting portion 120 and the main body portion 110 can be any one of 0.4 mm, 0.42 mm, 0.45 mm, 0.47 mm, 0.5 mm, 0.52 mm, 0.55 mm, 0.58 mm, and 0.6 mm.

[0079] In some embodiments, referring to FIG6B, the display module 100 further includes a back film 50, which is disposed on the back side of the display panel 10 and serves to protect and support the display panel 10. The thickness of the back film 50 can be, for example, 0.05 mm to 0.08 mm. For example, the thickness of the back film 50 is any one of 0.05 mm, 0.06 mm, 0.07 mm, and 0.08 mm.

[0080] For example, as shown in FIG6B, the back film 50 may include a first sub-back film 51 and a second sub-back film 52, the first sub-back film 51 and the second sub-back film 52 are separately disposed, the first sub-back film 51 covers the main body portion 110, and the second sub-back film 52 covers the circuit board connection portion 120.

[0081] At this time, along the thickness direction of the circuit board connection portion 120, the size of the gap between the circuit board connection portion 120 and the main body portion 110 is 0.24 mm to 0.5 mm. This gap between the circuit board connection portion 120 and the main body portion 110 refers to the size between the circuit board connection portion 120 and the main body portion 110 excluding the thickness of the back film 50. For example, the distance of the gap between the circuit board connection portion 120 and the main body portion 110 can be any one of 0.24 mm, 0.26 mm, 0.3 mm, 0.33 mm, 0.35 mm, 0.38 mm, 0.4 mm, 0.45 mm, and 0.5 mm.

[0082] In some embodiments, referring to FIG3, FIG6B and FIG7, the display module 100 further includes a battery 40 disposed on the back side 10B of the main body 110 for supplying power to the display panel 10 and the circuit board 20.

[0083] However, due to the limited space on the back side of the main body, the circuit board in the related technology occupies a lot of space on the back side of the main body, which makes the space occupied by the battery smaller, resulting in low battery capacity and poor battery life of the display device.

[0084] Based on this, referring to FIG5, some embodiments of the present disclosure provide a circuit board 20 including a first sub-board 21 and a second sub-board 22.

[0085] As shown in Figures 5 and 7, the first sub-board 21 includes a first circuit board 210, a first electronic component 201, and a first bonding pin 202. The first electronic component 201 is disposed on a first side of the first circuit board 210, and the first bonding pin 202 is disposed on a second side of the first circuit board 210 and located at one end of the first circuit board 210. The first side and the second side of the first circuit board 210 are opposite sides of the first circuit board 210.

[0086] The number of the aforementioned first binding pins 202 is multiple, and the multiple first binding pins 202 can be arranged sequentially along the first direction X, for example.

[0087] The first electronic component 201 described above includes at least one of a capacitor, resistor, inductor, transistor, diode, triode, and chip, and the embodiments disclosed herein are not limited thereto. The height of the first electronic component 201 ranges from 0.1 mm to 0.8 mm.

[0088] The first circuit board 210 has integrated first circuit traces, that is, the first circuit board 210 includes first circuit traces. Multiple first electronic components 201 can be connected to each other, and first electronic components 201 can be connected to first bonding pins 202 through the first circuit traces.

[0089] Referring to Figure 8, the first circuit board 210 may include multiple first substrate layers 211 and multiple first conductive layers 212, which are alternately stacked. The first substrate layers 211 provide support, and the first conductive layers 212 form first circuit traces. For example, the first circuit board 210 is a double-layer circuit board, meaning it includes two first conductive layers 212. For instance, the first circuit board 210 includes two first substrate layers 211 and two first conductive layers 212, which are alternately stacked.

[0090] The aforementioned first substrate layer 211 includes a rigid substrate layer or a flexible substrate layer. The rigid substrate layer includes at least one of paper-based, glass fiber cloth-based, composite epoxy material (CEM), multilayer board-based, ceramic-based, and metal core-based materials, and the embodiments disclosed herein are not limited to these. The flexible substrate layer includes at least one of polyimide (PI) film, polyester (PET) film, and polytetrafluoroethylene (PTFE) film, and the embodiments disclosed herein are not limited to these.

[0091] As shown in Figures 5 and 7, the second sub-board 22 includes a second circuit board 220, which is connected to one end of the first circuit board 210 that has a first bonding pin 202. The second circuit board 220 includes a first portion 223 and a second portion 224, which are arranged along a second direction Y, with the second portion 224 located on the side of the first portion 223 away from the first circuit board 210. The first portion 223 can be bent toward the second side of the first circuit board 210 along a first bending axis extending along the first direction X, causing the second portion 224 to bend to the second side of the first circuit board 210. It should be noted that the second direction Y intersects the first direction X and is parallel to the surface of the first circuit board where the first electronic component is located; for example, the second direction Y is perpendicular to the first direction X.

[0092] Based on the above structure, referring to Figures 6A, 6B and 7, after the circuit board 20 is connected to the display panel 10, the circuit board 20 can be bent first, and then the display panel 10 can be bent, so that the circuit board 20 is located on the back side 10B of the main body 110.

[0093] The second circuit board 220 integrates second circuit traces, meaning that the second circuit board 220 includes second circuit traces. Multiple first electronic components 201 can also be connected to each other, and to each first electronic component 201 and its first bonding pin 202, via the second circuit traces.

[0094] For example, referring to Figure 5, the two sides of the first bonding pin 202 can be connected to a first circuit trace and a second circuit trace, respectively. In this way, during the bonding connection process of the first bonding pin 202 and the second bonding pin 121, the first circuit trace and the second circuit trace on both sides of the first bonding pin 202 can disperse stress, which can reduce stress concentration on one side of the circuit trace of the first bonding pin 202 and reduce the risk of breakage of the circuit trace connected to the first bonding pin 202.

[0095] Referring to Figure 9, the second circuit board 220 may include multiple layers of second substrate layers 221 and multiple layers of second conductive layers 222, which are alternately stacked. The second substrate layers 221 provide support, and the second conductive layers 222 form second circuit traces. For example, the second circuit board 220 is a double-layer circuit board, meaning it includes two layers of second conductive layers 222. For instance, the second circuit board 220 includes two layers of second substrate layers 221 and two layers of second conductive layers 222, which are alternately stacked.

[0096] The aforementioned second substrate layer 221 includes a flexible substrate layer, thus the second substrate layer 221 has good flexibility and tensile strength, which is conducive to bending. The flexible substrate layer includes at least one of polyimide (PI) film, polyester (PET) film, and polytetrafluoroethylene (PTFE) film, and the embodiments disclosed herein are not limited thereto.

[0097] As described above, after the circuit board 20 provided in this embodiment is connected to the display panel 10 via the first bonding pin 202 and the second bonding pin 121, the first sub-board 21 can be located on the side of the circuit board connection portion 120 away from the main body portion 110. In this way, the first sub-board 21 can utilize the space occupied by the circuit board connection portion 120 on the back side 10B of the main body portion 110, thereby reducing the space occupied by the circuit board 20 alone on the back side 10B of the main body portion 110, increasing the space that the battery 40 can occupy, improving battery capacity, and enhancing the battery life of the display device 1000.

[0098] Based on this, the first portion 223 of the second circuit board 220 can be bent toward the second side of the first circuit board 210 along the first bending axis extending in the first direction X, so that the second portion 224 is bent between the circuit board connection portion 120 and the main body portion 110. In this way, the second portion 224 can also utilize the space occupied by the circuit board connection portion 120 on the back side 10B of the main body portion 110, thereby further reducing the space occupied by the circuit board 20 alone on the back side 10B of the main body portion 110, increasing the space that the battery 40 can occupy, increasing the battery capacity, and improving the battery life of the display device 1000.

[0099] Furthermore, the first circuit board 210 is located on the side of the circuit board connection portion 120 away from the main body portion 110, and the second portion 224 is located between the circuit board connection portion 120 and the main body portion 110. The area for arranging circuit traces can be more than twice the area of ​​the circuit board connection portion 120. In other words, with a larger area for arranging circuit traces, the thickness of the circuit board 20 can be set to be thinner, which can reduce the thickness of the display module 100 and facilitate the thinner and lighter design of the display device 1000.

[0100] Furthermore, referring to Figure 7, the display module 100 also includes a first adhesive 41 and a second adhesive 42. The first adhesive 41 is disposed between the main body portion 110 and the second portion 224, and the second adhesive 42 is disposed between the circuit board connector portion 120 and the second portion 224 to fill the gap between the circuit board connector portion 120 and the main body portion 110, and to fix the second portion 224 and the circuit board connector portion 120 to the back side 10B of the main body portion 110. In this case, the second portion 224 is bent between the circuit board connector portion 120 and the main body portion 110, which can also fill the gap between the circuit board connector portion 120 and the main body portion 110, reducing the amount of adhesive used to fix the circuit board connector portion 120 to the back side 10B of the main body portion 110, thereby reducing material costs.

[0101] The thickness of the first adhesive 41 and the second adhesive 42 is greater than or equal to 0.01 mm. The thickness of the first adhesive 41 and the second adhesive 42 can be adjusted according to the gap between the circuit board connecting part 120 and the main body part 110, and can fill the gap between the circuit board connecting part 120 and the main body part 110.

[0102] In some embodiments, referring to FIG5, FIG6B and FIG7, the first circuit board 210 includes a bonding portion 230 and a trace portion 240, a first bonding pin 202 is disposed on the bonding portion 230, and a first electronic component 201 is disposed on the trace portion 240.

[0103] The thickness of the bonding portion 230 can be, for example, less than the thickness of the trace portion 240. For instance, the bonding portion 230 of the first circuit board 210 includes a first substrate layer 211 and a first conductive layer 212. The trace portion B of the first circuit board 210 includes two first substrate layers 211 and two first conductive layers 212. In this way, the bonding portion 230 of the first circuit board 210 is thinner, and during bending of the first portion 223, the stress concentration at the connection point between the bonding portion 230 and the first portion 223 is smaller, reducing the risk of cracking at the connection point between the bonding portion 230 and the first portion 223 of the second circuit board 220 or breakage of the circuit trace. Furthermore, the thickness of the bonding portion 230 can also be less than the thickness of the second circuit board 220. For example, the bonding portion 230 includes a first substrate layer 211 and a first conductive layer 212. The second circuit board 220 has a uniform thickness and includes two first substrate layers 211 and two first conductive layers 212. In this way, the bonding portion 230 of the first circuit board 210 is thinner, and the stress concentration at the connection position between the bonding portion 230 and the first portion 223 is smaller during the bending process of the first part 223, which can reduce the risk of cracking or circuit breakage at the connection position between the bonding portion 230 and the first part 223 of the second circuit board 220.

[0104] In some embodiments, referring to Figures 5, 6B, and 7, the display module 100 further includes a driver chip 60, which is disposed on the circuit board connection portion 120. In this case, the trace portion 240 of the first circuit board 210 has a first cutout area H for accommodating the driver chip 60. The driver chip 60 is located in the first cutout area H to prevent the first circuit board 210 from connecting to the circuit board connection portion 120 and to avoid interference between the first circuit board 210 and the driver chip 60.

[0105] Here, the number of first cutout areas H is specifically set according to the number of driver chips 60. For example, as shown in Figures 5 and 7, the display module 100 includes one driver chip 60, and the first circuit board 210 is provided with a first cutout area H. For example, as shown in Figures 7 and 10, the display module 100 includes two driver chips 60, and the two driver chips 60 can be arranged along the first direction X. The first circuit board 210 is provided with two first cutout areas H, and the two first cutout areas H are arranged along the first direction X.

[0106] In some embodiments, referring to FIG7, the length of the circuit board connection portion 120 is relatively long along the second direction Y. For example, the length of the circuit board connection portion 120 is greater than 15 mm; or the length of the circuit board connection portion 120 is greater than 15 mm and less than or equal to 25 mm.

[0107] Based on this, the number of conductive layers included in the first circuit board 210 and the second circuit board 220 is relatively small, which is sufficient to meet the requirements for circuit routing. For example, both the first circuit board 210 and the second circuit board 220 can be double-layer circuit boards with a thickness of 0.11mm to 0.14mm. For example, the thickness of the double-layer circuit board can be any one of 0.11mm, 0.12mm, 0.13mm, and 0.14mm. The thickness of the double-layer circuit board is smaller than the size of the gap (0.24mm to 0.5mm) between the circuit board connection portion 120 and the main body portion 110, and it can be bent between the circuit board connection portion 120 and the main body portion 110.

[0108] At this time, the position of the first electronic component 201 can be flexibly set. For example, as shown in Figures 5 and 7, the first circuit board 210 has multiple device setting areas C, and the first electronic component 201 is set in the device setting area C. The multiple device setting areas C are located between the first cutout area H and the bonding part 230. Figure 5 illustrates two device setting areas C as an example.

[0109] For example, as shown in Figures 7, 11A, and 11B, the first circuit board 210 has multiple device placement areas C, and the first electronic component 201 is disposed in the device placement area C. Part of the device placement area C is located between the first cutout area H and the bonding portion 230, while another part of the device placement area C is located on the side of the first cutout area H away from the bonding portion 230. The figures illustrate this with two device placement areas C located between the first cutout area H and the bonding portion 230, and two device placement areas C located on the side of the first cutout area H away from the bonding portion 230.

[0110] In other embodiments, referring to Figures 4, 12, and 14, the length of the circuit board connection portion 120 is shorter along the second direction Y, for example, the length of the circuit board connection portion 120 is less than or equal to 15 mm. Based on this, the trace portion 240 has a third portion 241 and a fourth portion 242, which are arranged along the second direction Y, with the fourth portion 242 located on the side of the third portion 241 away from the second circuit board 220.

[0111] In some examples, as shown in Figures 12 and 13, the number of first conductive layers 212 (see Figure 8) included in the third portion 241 is less than the number of first conductive layers 212 (see Figure 8) included in the fourth portion 242. In this way, the circuit board 20 can increase the number of conductive layers in a local area (the fourth sub-portion 242) without increasing the area, thus meeting the requirements for circuit trace layout.

[0112] Referring to Figures 8, 12, and 13, the second circuit board 220 may include fewer conductive layers, while a portion of the first circuit board 210 may include more conductive layers. For example, the second circuit board 220 may be a double-layer circuit board, the third portion 241 of the first circuit board 210 may include two first conductive layers 212, and the fourth portion 242 of the first circuit board 210 may include three, four, or more first conductive layers 212.

[0113] In this design, all the first electronic components 201 can be disposed in the third portion 241, for example. This placement of the first electronic components 201 in the thinner third portion 241 reduces the size of the circuit board 20 in the thickness direction of the display module 100, facilitating a thinner and lighter design for the display device 1000. Furthermore, the first cutout area H is disposed at one end of the third portion 241 near the fourth portion 242. This results in a shallower depth of the first cutout area H, simplifying the manufacturing process.

[0114] In other examples, as shown in Figures 14 and 15, the fourth part 242 includes a first sub-part B1, a second sub-part B2, and a third sub-part B3, which are arranged along a second direction Y, with the second sub-part B2 located between the first sub-part B1 and the third sub-part B3. The second sub-part B2 can be bent toward a first side of the first circuit board 210 along a second bending axis extending along the first direction X, causing the third sub-part B3 to bend to the side of the first sub-part B1 away from the circuit board connection portion 120. In this way, the circuit board 20 can increase the area of ​​the first circuit board 210 (the area of ​​the third sub-part B3) without increasing the space occupied on the back side 10B of the main body 110, thereby meeting the requirements of circuit wiring layout.

[0115] At this point, as shown in Figures 14 and 15, the number of conductive layers included in the first circuit board 210 and the second circuit board 220 can be reduced to meet the requirements of circuit routing. For example, both the first circuit board 210 and the second circuit board 220 can be double-layer circuit boards.

[0116] In addition, the display module 100 further includes a third adhesive 43, which is disposed between the first sub-part B1 and the third sub-part B3 to fix the third sub-part B3 to the side of the first sub-part B1 away from the circuit board connection portion 120. The thickness of the third adhesive 43 is greater than or equal to 0.01 mm.

[0117] In this configuration, all the first electronic components 201 can be disposed, for example, in the third portion 241, so that the first electronic components 201 do not interfere with the bending of the fourth portion 242. Furthermore, the first cutout area H is disposed at one end of the third portion 241 near the fourth portion 242. Thus, the driving chip 60 located in the first cutout area H will not interfere with the bending of the fourth portion 242.

[0118] In the above embodiments, when the first circuit board 210 does not require bending, referring to Figures 5, 7, 12, and 13, the first substrate layer 211 of the first circuit board 210 (see Figure 8) can be set as a rigid substrate layer, and the second substrate layer 221 of the second circuit board 220 (see Figure 9) can be set as a flexible substrate layer. With this configuration, the fabrication process of the first circuit board 210 is simple and the cost is low; and the second circuit board 220 has better flexibility, facilitating bending. In this case, when the number of conductive layers included in the first circuit board 210 and the second circuit board 220 is the same, the thickness of the first circuit board 210 is greater than the thickness of the second circuit board 220.

[0119] In the above embodiments, when the first circuit board 210 needs to be bent, referring to Figures 14 and 15, both the first substrate layer 211 of the first circuit board 210 (see Figure 8) and the second substrate layer 221 of the second circuit board 220 (see Figure 9) can be flexible substrate layers. With this configuration, the first circuit board 210 and the second circuit board 220 have good flexibility, which is beneficial for bending.

[0120] In some embodiments, referring to Figures 12 and 14, the first circuit board 210 includes a grounding area D located at one end of the first circuit board 210 away from the first bonding pin 202. Figures 12 and 14 illustrate two grounding areas D as an example. The grounding area D is configured to transmit a ground signal. The first conductive layer 212 of the first circuit board 210 (see Figure 8) may include a grounding pattern, and the grounding area D may be an exposed grounding pattern on the first circuit board 210.

[0121] In the above embodiments, when the first circuit board 210 does not need to be bent, referring to Figures 5, 7, 12 and 13, the grounding area D can be provided, for example, on the first side of the first circuit board 210.

[0122] In the above embodiments, when the first circuit board 210 needs to be bent, referring to Figures 14 and 15, the junction area D can, for example, be located on the second side of the first circuit board 210.

[0123] In some embodiments, referring to Figures 5, 7, and 11A-15, the second sub-board 22 is a second circuit board 220 that does not contain electronic components. That is, no electronic components are disposed on the surface of the second sub-board 22. In this case, the maximum thickness of the second sub-board 22 is the same as the thickness of the second circuit board 220, and the second sub-board 22 occupies less space between the main body 110 and the circuit board connection portion 120, making it easy to install.

[0124] In other embodiments, referring to Figures 16, 17, 18, and 19, the second sub-board 22 further includes a second electronic component 203, which is disposed on one side of the second circuit board 220. Furthermore, when the second circuit board 220 is bent along the first bending axis to the second side of the first circuit board 210, the second electronic component 203 is located on the side of the second circuit board 220 away from the first circuit board 210.

[0125] The second electronic component 203 described above includes at least one of a capacitor, resistor, inductor, transistor, diode, triode, and chip, but the embodiments disclosed herein are not limited thereto. The height of the second electronic component 203 may be greater than or equal to 0.1 mm and less than 0.5 mm.

[0126] At this time, among the electronic components on the circuit board 20, electronic components with a height greater than or equal to 0.5 mm can be, for example, the first electronic component 201, that is, electronic components with a height greater than or equal to 0.5 mm are disposed on the first circuit board 210; electronic components with a height less than 0.5 mm can be, for example, the second electronic component 203, that is, electronic components with a height less than 0.5 mm are disposed on the second circuit board 220. In this way, all electronic components can be disposed separately on the first circuit board 210 or the second circuit board 220 according to their height, and the placement area of ​​electronic components is larger, which is beneficial to the arrangement of electronic components.

[0127] Based on this, as shown in Figures 16, 17, 18, and 19, the display module 100 further includes a support assembly 70, which is disposed between the main body 110 and the circuit board connection portion 120. In this case, the aforementioned first adhesive 41 can be connected to the support assembly 70 and the second portion 224. Furthermore, the support assembly 70 is provided with a first clearance hole 71, and the second electronic component 203 is located in the first clearance hole 71.

[0128] It should be noted that the first clearance hole 71 can be a through hole that penetrates the support component 70, or it can be a blind hole that only penetrates a portion of the support component 70.

[0129] In some embodiments, referring to FIG16, the support assembly 70 includes a first adhesive layer 710, a buffer layer 720, and a support layer 730 stacked sequentially, with the first adhesive layer 710 located between the buffer layer 720 and the main body 110. Exemplarily, the first adhesive layer 710 is bonded to a first sub-back film 51. The aforementioned first clearance hole 71, for example, penetrates through the first adhesive layer 710, the buffer layer 720, and the support layer 730, and terminates at the first sub-back film 51.

[0130] It should be noted that, as shown in Figures 17, 18 and 19, when the display module 100 does not include the back film 50, the first clearance hole 71 can stop at the main body 110 of the display panel 10.

[0131] The first adhesive layer 710 may be in a mesh shape to prevent air bubbles from forming during the bonding process between the first adhesive layer 710 and the back film 50, thus avoiding defects such as bulging of the back film 50. The material of the first adhesive layer 710 may include optical adhesive and / or pressure-sensitive adhesive, and the embodiments disclosed herein are not limited thereto.

[0132] The aforementioned buffer layer 720 mainly serves to buffer and resist shock, thereby improving the impact resistance of the display device 1000. The buffer layer 720 may include at least one of a polyimide (PI) layer, a polyethylene terephthalate (PET) plastic layer, and a foam layer.

[0133] The aforementioned support layer 730 can be a single-layer or multi-layer stacked structure. The material of the support layer 730 can include metals. For example, the material of the support layer 730 includes at least one of copper, silver, and steel. The support layer 730 can also include non-metals. For example, the material of the support layer 730 includes graphite.

[0134] In some embodiments, referring to FIG5, the circuit board 20 further includes a third sub-board 80, including a third circuit board 810 and a connector 820. The third circuit board 810 is connected to one end of the first circuit board 210. The connector 820 is disposed at the end of the third circuit board 810 away from the first circuit board 210 and is used to connect to external circuitry, such as a motherboard.

[0135] The aforementioned third circuit board 810 integrates third circuit traces, meaning that the third circuit board 810 includes third circuit traces. The first electronic component 201 and the first bonding pin 202 can be connected to external circuits through the third circuit traces.

[0136] The third circuit board 810 may include multiple third substrate layers and multiple third conductive layers, which are stacked alternately. The third substrate layers provide support, and the third conductive layers form the third circuit traces. For example, the third circuit board 810 is a double-layer circuit board, meaning it includes two third conductive layers.

[0137] The aforementioned third substrate layer includes a rigid substrate layer or a flexible substrate layer. The rigid substrate layer includes at least one of paper-based, glass fiber cloth-based, composite epoxy material (CEM), multilayer board-based, ceramic-based, and metal core-based materials, and the embodiments disclosed herein are not limited to these. The flexible substrate layer includes at least one of polyimide (PI) film, polyester (PET) film, and polytetrafluoroethylene (PTFE) film, and the embodiments disclosed herein are not limited to these. Exemplarily, the third substrate layer is a flexible substrate layer, so that the third circuit board 810 can be bent to facilitate the connection of the connector 820 to external circuitry.

[0138] It should be noted that if any two of the first circuit board 210, the second circuit board 220 and the third circuit board 810 have the same number and material of substrate layer and conductive layer, they can be formed together in the same process step, that is, they are an integral structure.

[0139] In some embodiments, referring to FIG6B, the display module 100 may further include a protective layer 90 covering the outer surface of the bent portion 130. Exemplarily, one end of the protective layer 90 extends to the main body portion 110, and the other end extends to the circuit board connection portion 120. In this manner, the first protective layer 140 can change the position of the stress neutral layer of the bent portion 130 during bending, reducing the risk of cracks or breakage of the display panel 10 at the junction of the main body portion 110, the bent portion 130, and the bonding portion 120.

[0140] In some embodiments, referring to FIG6A, the display module 100 further includes an antireflective layer 310 and a second adhesive layer 320, the antireflective layer 310 and the second adhesive layer 320 being disposed between the display panel 10 and the cover plate 30.

[0141] As shown in Figure 6A, the antireflective layer 310 covers the main body 110 to improve the display panel 10's resistance to interference from ambient light. The antireflective layer 310 can be directly formed on the display panel 10 using semiconductor processes. Alternatively, the antireflective layer 310 can be bonded to the display panel 10 using a transparent adhesive layer. For example, the antireflective layer 310 can be a circular polarizer.

[0142] As shown in Figure 6A, the second adhesive layer 320 is disposed on the side of the antireflective layer 310 away from the main body 110, and the cover plate 30 is disposed on the side of the second adhesive layer 320 away from the main body 110. The second adhesive layer 320 is used to bond the antireflective layer 310 to the cover plate 30. The material of the second adhesive layer 320 includes a transparent adhesive layer. Here, a transparent adhesive layer refers to an adhesive layer with a transmittance greater than or equal to 90%. For example, the material of the second adhesive layer 320 may include optical adhesive, but this embodiment is not limited thereto.

[0143] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0144] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. A circuit board, comprising: The first daughterboard includes a first circuit board, a first electronic component, and a first bonding pin, wherein the first electronic component is disposed on a first side of the first circuit board; The first bonding pin is disposed on the second side of the first circuit board and located at one end of the first circuit board; the first side and the second side of the first circuit board are opposite sides of the first circuit board. The second sub-board includes a second circuit board, which is connected to the end of the first circuit board where the first bonding pin is located; and the second circuit board includes a first part and a second part, wherein the first part can be bent toward the second side of the first circuit board along a first bending axis extending in a first direction, so that the second part bends to the second side of the first circuit board; the first part and the second part are arranged along a second direction, and the second part is located on the side of the first part away from the first circuit board; the second direction intersects the first direction and is parallel to the surface of the first circuit board where the first electronic component is located.

2. The circuit board according to claim 1, wherein, The second sub-board also includes: The second electronic component is disposed on one side of the second circuit board; and when the second circuit board is bent along the first bending axis to the second side of the first circuit board, the second electronic component is located on the side of the second circuit board away from the first circuit board.

3. The circuit board according to claim 2, wherein, The height of the second electronic component is greater than or equal to 0.1 mm and less than 0.5 mm.

4. The circuit board according to claim 1, wherein, The second sub-board is a second circuit board that does not contain electronic components.

5. The circuit board according to any one of claims 1 to 4, wherein, The first circuit board has a third portion and a fourth portion, the third portion and the fourth portion are arranged along a second direction, and the fourth portion is located on the side of the third portion away from the second circuit board; the second direction intersects the first direction and is parallel to the surface of the first circuit board on which the first electronic component is disposed; The first circuit board includes multiple first conductive layers, and the third part includes fewer first conductive layers than the fourth part.

6. The circuit board according to claim 5, wherein, The first circuit board includes a grounding area, which is disposed on a first side of the first circuit board and located at the end of the first circuit board away from the first bonding pin.

7. The circuit board according to any one of claims 1 to 5, wherein, The first circuit board has a third portion and a fourth portion, the third portion and the fourth portion are arranged along a second direction, and the fourth portion is located on the side of the third portion away from the second circuit board; the second direction intersects the first direction and is parallel to the surface of the first circuit board on which the first electronic component is disposed; The fourth part includes a first sub-part, a second sub-part, and a third sub-part, which are arranged along the second direction, and the second sub-part is located between the first sub-part and the third sub-part; the second sub-part can be bent toward the first side of the first circuit board by a second bending axis extending along the first direction, so that the third sub-part bends to the side of the first sub-part away from the circuit board connection portion.

8. The circuit board according to claim 7, wherein, The first circuit board includes a grounding area, which is disposed on a second side of the first circuit board and located at the end of the third sub-part away from the first bonding pin.

9. The circuit board according to any one of claims 5 to 8, wherein, All of the first electronic components are located in the third part.

10. The circuit board according to any one of claims 1 to 6, wherein, The first circuit board includes multiple first substrate layers, which are rigid substrate layers; the second circuit board includes multiple second substrate layers, which are flexible substrate layers.

11. The circuit board according to claim 10, wherein, The thickness of the first circuit board is greater than the thickness of the second circuit board.

12. The circuit board according to any one of claims 1 to 11, wherein, The first circuit board has a first cutout area, which is used to accommodate the driver chip.

13. The circuit board according to claim 12, wherein, The first circuit board has a third part and a fourth part, the third part and the fourth part are arranged along a second direction, and the fourth part is located on the side of the third part away from the second circuit board; the first cutout area is disposed at the end of the third part near the fourth part.

14. The circuit board according to any one of claims 1 to 13, wherein, The first circuit board includes a first circuit trace, the second circuit board includes a second circuit trace, and the first bonding pin is connected to the first circuit trace and the second circuit trace.

15. The circuit board according to any one of claims 1 to 14, wherein, The first circuit board includes a bonding section and a routing section, the first bonding pin is disposed on the bonding section, and the first electronic component is disposed on the routing section; The thickness of the bonding portion is less than the thickness of the trace portion; and / or, the thickness of the bonding portion is less than the thickness of the second circuit board.

16. The circuit board according to any one of claims 1 to 15, further comprising: The third daughterboard includes a third circuit board and a connector. The third circuit board is connected to one end of the first circuit board. The connector is located at the end of the third circuit board away from the first circuit board.

17. A display module, comprising: The display panel includes a main body, a circuit board connection part, and a bending part located between the main body and the circuit board connection part. The main body has a display side and a back side disposed opposite to each other. The bending part can be bent toward the back side of the main body along a third bending axis extending in a first direction, so that the circuit board connection part bends to the back side of the main body. The circuit board connection part is provided with a plurality of second bonding pins. The circuit board according to any one of claims 1 to 16, wherein the first bonding pin of the circuit board is connected to the second bonding pin, and the first portion of the second circuit board of the circuit board is bent toward the second side of the first circuit board along a first bending axis extending in a first direction, such that the second portion of the second circuit board is bent between the circuit board connection portion and the main body portion.

18. The display module according to claim 17, further comprising: A first adhesive backing is disposed between the main body and the second part. The second adhesive is disposed between the circuit board connection portion and the second portion.

19. The display module according to claim 17 or 18, wherein, The second sub-board of the circuit board includes a second electronic component, which is disposed on one side of the second circuit board; and, when the second circuit board is bent along the first bending axis to the second side of the first circuit board, the second electronic component is located on the side of the second circuit board away from the first circuit board. The display module also includes: A support assembly is disposed between the main body and the circuit board connection portion; The support assembly is provided with a first clearance hole, and the second electronic component is located in the first clearance hole.

20. The display module according to claim 19, wherein, The support component includes a first adhesive layer, a buffer layer, and a support layer stacked sequentially, with the first adhesive layer located between the main body and the buffer layer; the first clearance hole penetrates through the first adhesive layer, the buffer layer, and the support layer.

21. The display module according to any one of claims 17 to 20, wherein, The first circuit board of the circuit board has a third part and a fourth part. The fourth part includes a first sub-part, a second sub-part and a third sub-part. The second sub-part can be bent toward a first side of the first circuit board by a second bending axis extending along the first direction, so that the third sub-part bends toward the first side of the first sub-part. The display module also includes: The third adhesive is disposed on the first circuit board between the first sub-part and the third sub-part.

22. The display module according to any one of claims 17 to 21, wherein, The first circuit board has a first cutout area, and the display module further includes: The driver chip is disposed in the connection part of the circuit board and is located in the first cutout area.

23. A display device, comprising: case; The display module as described in any one of claims 17 to 22, wherein the display module is disposed within the housing.

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