Circuit board having signal interference prevention function, and backlight module and display apparatus

Abstract

A circuit board having a signal interference prevention function, and a backlight module and a display apparatus. The circuit board is provided with a plurality of metal units and at least one electronic element, wherein the metal units are arranged in a plurality of recesses of the circuit board in a one-to-one manner, and the recesses are arranged at intervals on the periphery of the circuit board, such that the metal units surround the at least one electronic element; the metal units are electrically connected to each other to form at least one grounding path; and the at least one electronic element is a light-emitting element. The present invention enables a light-emitting element to be closer to the edge of a circuit board, such that dark areas in the border region can be reduced; and the function of preventing noise interference is also achieved.

Description

Circuit boards with anti-interference function, backlight modules and display devices

[0001] This application claims priority to Chinese Patent Application No. 202411514125.6, filed on October 28, 2024, entitled "Circuit Board with Anti-Signal Interference Function, Backlight Module and Display Device", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This invention relates to the technical field of circuit boards, and particularly to circuit boards for narrow bezel backlight modules and display devices. Background Technology

[0003] The via (VIA) connection technology widely used in traditional technology can not only enable signal transmission between different conductor layers in multilayer circuit boards, but also vent noise or prevent electrostatic discharge, thereby reducing signal interference. However, these vias are generally located around the circuit board, and there is still a gap between the vias and the edge of the circuit board. Therefore, the distance between the bezel of the backlight module or display device and electronic components (such as LEDs) is relatively large, which limits the display area and produces obvious dark areas.

[0004] Therefore, it is necessary to provide a circuit board that shortens the distance between the light-emitting elements and the edge of the board without affecting the protection against signal interference or increasing the difficulty of designing the circuit board and the manufacturing cost. Summary of the Invention

[0005] Based on the above deficiencies, the purpose of this invention is to provide a circuit board with anti-signal interference function, which can shorten the distance between the light-emitting element on the circuit board and the edge of the board, thereby meeting the market demand for narrow bezels.

[0006] According to the present invention, a circuit board with signal interference protection function is provided, having two opposing surfaces and comprising: at least one electronic component disposed on at least one of the two surfaces; a plurality of recesses spaced apart around the periphery of the circuit board; a plurality of metal units disposed one-to-one in the recesses, each metal unit having at least one end exposed on at least one of the two surfaces of the circuit board; and at least one metal layer connecting two adjacent metal units; wherein the electronic component is surrounded by the metal units.

[0007] In some embodiments, the circuit board further includes a ground wire, which is connected to at least one of the metal units or to a metal layer.

[0008] In some embodiments, the metal unit is a hollow semi-cylinder with two ends, each end exposed on two surfaces, and the hollow semi-cylinder is exposed at the periphery of the connecting surfaces of the circuit board.

[0009] In some embodiments, the surface of the end is at the same height as the surface of the metal layer.

[0010] In some embodiments, the circuit board has an insulating layer and two ink layers, and two metal layers. The two ink layers are located on opposite side surfaces of the insulating layer, and the two metal layers are located between different side surfaces of the insulating layer and the ink layers.

[0011] In some embodiments, the surface of the end is at the same height as the surface of the ink layer or the insulating layer.

[0012] In some embodiments, the width of the metal layer is less than or equal to the outer radius of the hollow semi-cylinder.

[0013] In some embodiments, the distance between at least one electronic component and the edge of the circuit board is positively correlated with the size of the metal unit.

[0014] Another object of the present invention is to provide a backlight module comprising: the aforementioned circuit board with anti-signal interference function, wherein the electronic components are light-emitting elements.

[0015] Another object of the present invention is to provide a display device comprising: the aforementioned backlight module, and a display panel disposed above the backlight module.

[0016] The circuit board of the present invention utilizes a metal layer with multiple spaced metal units around its perimeter and connecting two adjacent metal units to surround the electronic components and establish a protective distance, thereby preventing signal interference and bringing the electronic components closer to the edge of the circuit board. When applied in a backlight module, where the electronic components are multiple LEDs, the distance between the LEDs and the edge of the board can be effectively shortened, thereby achieving the effect of narrow bezels in the backlight module and display device products, and thus solving the problem of edge shadows. Attached Figure Description

[0017] To make the above and other objects, features, advantages and embodiments of the present invention more readily understood, the accompanying drawings are now described below.

[0018] Figure 1 is a partial enlarged view of the first embodiment of the circuit board of the present invention.

[0019] Figure 2 is a top view of a first embodiment of the circuit board of the present invention.

[0020] Figure 3 is a partially enlarged view of a second embodiment of the circuit board of the present invention.

[0021] Figure 4 is a partial top view of a second embodiment of the circuit board of the present invention.

[0022] Figure 5 is a schematic diagram of the backlight module and display device of the present invention. Detailed Implementation

[0023] To make the description of this disclosure more detailed and complete, the embodiments and specific examples of the present invention will now be described in detail.

[0024] First, please refer to Figures 1 and 2, which illustrate schematic diagrams of a first embodiment of the circuit board 100 of the present invention. The circuit board 100 has two opposing surfaces, and at least one electronic component 50 is disposed on one of the two surfaces. A plurality of recesses are distributed at intervals around the periphery of the circuit board 100. A plurality of metal units 10 are embedded one-to-one in these recesses and surround the at least one electronic component 50. Each of these metal units 10 has at least one end 12, which is exposed on at least one of the two surfaces of the circuit board 100, thereby allowing the metal units 10 to easily contact other electrical conductors. These metal units 10 are electrically connected to each other to form at least one grounding path to conduct noise or static electricity out of the circuit board 100, thereby preventing signal interference and threats and damage caused by electrostatic discharge. More specifically, the two opposing surfaces of the circuit board 100 of the present invention are connected to the periphery, wherein a plurality of recesses are spaced apart on the periphery of the circuit board 100. This allows the electronic components 50 disposed on the surface of the circuit board 100 to be surrounded by the metal unit 10, establishing a protective distance for the electronic components 50, thereby achieving the effect of preventing signal interference. In the embodiments disclosed in this application, taking the lamp board in the backlight module as an example, the electronic components 50 are a plurality of LEDs spaced apart on one surface of the circuit board 100, and the LEDs have a protective distance from the edge of the circuit board 100. By using the metal unit 10 and the metal layer 30 of this application, it can be ensured that this protective distance does not need to be increased, and the requirement for a narrow bezel in the backlight module can be met, thereby solving the problem of edge shadows.

[0025] For example, each metal unit 10 has a hollow semi-cylindrical structure and also has walls 11 exposed at the periphery of the circuit board 100. When the exposed area of ​​these walls 11 and these ends 12 is larger, the impedance becomes smaller, thus improving the overall noise immunity and anti-static effect. Moreover, the larger the exposed area of ​​the ends 12, the more beneficial it is for the metal unit 10 to contact other electrical conductors.

[0026] In one embodiment, each metal unit 10 may be provided with conductive metal by electroplating or other means to form the ends 12 and the walls 11. The conductive metal may be selected from, but is not limited to, copper, silver or nickel. The thickness of the plated conductive metal is between 10 μm and 22 μm, thereby effectively achieving excellent conductivity.

[0027] In this embodiment, at least one grounding path is at least one metal layer 30, and the number of metal layers 30 is selected to be two. The circuit board 100 also has an insulating layer 40 and two ink layers 20. The two ink layers 20 are respectively located on opposite side surfaces of the insulating layer 40, and the two metal layers 30 are respectively located between different side surfaces of the insulating layer 40 and each ink layer 20. This embodiment is a two-layer board configuration, with the two metal layers 30 connecting two adjacent metal units 10. This configuration can effectively discharge noise and static electricity from the circuit board 100, thereby achieving the characteristics of anti-signal interference and anti-static discharge.

[0028] Furthermore, the surfaces of the two ends 12 of each metal unit 10 are at the same height as the surfaces of the two ink layers 20, ensuring that the two surfaces of the circuit board 100 remain flat. This facilitates the connection of these metal units 10 with other electrical conductors and improves the functionality of the circuit board 100 in practical applications. In actual implementation, as shown in Figure 1, an ink layer 20 also covers the insulating layer 40. Since the thickness of the ink layer 20 and the metal layer 30 is on the micrometer (μm) scale, while the thickness of the insulating layer 40 is on the centimeter (mm) scale, the thickness of the ink layer 20 and the metal layer 30 can be ignored. Therefore, the surfaces of the two ends 12 of each metal unit 10 can also be at the same height as the outer surfaces of the two metal layers 30, or they can be at the same height as the two opposite side surfaces of the insulating layer 40. The dimensions shown in Figures 1 and 3 are not actual scales to illustrate the relative relationship between the ink layer 20, the metal layer 30, and the insulating layer 40.

[0029] Next, please refer to Figures 3 and 4, which illustrate a second embodiment of the circuit board 100 of the present invention. The circuit board 100 has a multilayer structure, and at least one grounding path includes multiple metal layers 30 and a ground wire 31. The circuit board 100 has two ink layers 20 and multiple insulating layers 40. The two ink layers 20 are located on two surfaces of the circuit board 100, and the metal layers 30 and the insulating layers 40 are located between the two ink layers 20. The metal layers 30 and the insulating layers 40 are arranged in an alternating stack, and the two metal layers 30 connect two adjacent metal units 10. This embodiment is a four-layer board. The ground wire 31 is located inside the circuit board 100 and is connected to one of the metal units 10 and / or one of the metal layers 30, so that noise in these metal units 10 is discharged from the circuit board 100 through these metal layers 30 and the ground wire 31, thereby forming an effective grounding path to discharge noise and static electricity, further enhancing the anti-interference effect.

[0030] In the first and second embodiments, the thickness of the ink layers 20 is 10-20 μm, the thickness of the metal layers 30 is 40-45 μm, and the thickness of the insulating layer 40 is 25-30 mm, making the circuit board 100 thin and light, suitable for use in thin and light components with strict requirements on size and weight, thus improving the flexibility of product design.

[0031] The center point spacing between two adjacent metal units 10 is 0.2-20 mm. The inner radius of these metal units 10 is 0.1-0.2 mm, and the outer radius is 0.3-0.6 mm. The width of these metal layers 30 is less than or equal to the outer radius of these metal units 10. Since the area of ​​these metal layers 30 is sufficient to provide noise interference prevention, the distance between at least one electronic component 50 and the edge of the circuit board 100 can be shortened without reducing anti-interference capabilities. In this embodiment, taking the lamp board in a direct-lit backlight module as an example, the distance between at least one electronic component 50 and the edge of the circuit board 100 is 0.8-4.5 mm. Since the aforementioned distance is positively correlated with the size of these metal units 10, the size of these metal units 10 can be reduced to bring at least one electronic component 50 closer to the edge of the circuit board 100, thereby maximizing the use of design space and solving the problem of dark areas at the edge of the backlight module, thus achieving a narrow bezel effect.

[0032] Please refer to Figure 5, which shows a preferred embodiment of the backlight module 200 and display device 300 of the present invention. The backlight module 200 includes a circuit board 100 of either the first or second embodiment described above, and at least one electronic component 50 is a light-emitting element, which is an LED lamp, but not limited thereto. The display device 300 includes the aforementioned backlight module 200, an optical film group 60, and a display panel 70. The optical film group 60 is disposed above the backlight module 200, and the display panel 70 is disposed above the optical film group 60. Through this design, the distance between these light-emitting elements and the edge of the circuit board 100 can be effectively shortened.

[0033] This invention, by placing metal units 10 with anti-signal interference function around the periphery of the circuit board 100, and placing at least one electronic component 50 close to the edge of the circuit board 100, reduces dark bands around the frame and improves the problem of shadows at the screen edges when the circuit board 100 is used in a backlight module 200 or a display device 300, thereby achieving optimal optical quality. Furthermore, the circuit board 100 of this invention can be manufactured using existing molds and production components, eliminating the need for mold redesign, reducing manufacturing costs, and possessing extremely high industrial application value.

[0034] The circuit board 100 of the present invention utilizes a plurality of spaced metal units 10 around its periphery and a metal layer 30 connecting two adjacent metal units 10 to surround the electronic component 50 and establish a protective distance, thereby achieving signal interference prevention and allowing the electronic component 50 to be closer to the edge of the circuit board 100. When applied to a backlight module 200, where the electronic component 50 is a plurality of LEDs, the distance between the LEDs and the edge of the board can be effectively shortened, thereby achieving the effect of the backlight module 200 and the display device 300 conforming to a narrow bezel, and thus solving the problem of edge shadows.

[0035] The embodiments disclosed above are merely illustrative of the principles, features, and effects of the present invention and are not intended to limit the scope of implementation of the present invention. Any person skilled in the art can modify and alter the above embodiments without departing from the spirit and scope of the present invention. Any equivalent changes and modifications made using the content disclosed in this invention are still covered by the appended claims.

[0036]

List of reference numerals

Claims

1. A circuit board with signal interference protection function, having two opposing surfaces, and comprising: At least one electronic component is disposed on at least one of the two surfaces; Multiple recesses are spaced apart around the periphery of the circuit board with anti-signal interference function; A plurality of metal units, each disposed one-to-one in the recess, each metal unit having at least one end exposed on at least one of the two surfaces of the circuit board with anti-interference function; and At least one metal layer that connects two adjacent metal units; in, The electronic components are surrounded by the metal unit.

2. The circuit board with anti-signal interference function according to claim 1, wherein, The circuit board with anti-signal interference function also includes a ground wire, and the ground wire is connected to at least one of the metal units or to the metal layer.

3. The circuit board with anti-signal interference function according to claim 1, wherein, The metal unit is a hollow semi-cylinder with two ends, which are respectively exposed on the two surfaces. The hollow semi-cylinder is exposed on the periphery of the circuit board with anti-signal interference function, which connects the two surfaces.

4. The circuit board with anti-signal interference function according to claim 1, wherein, The surface of the end is at the same height as the surface of the metal layer.

5. The circuit board with anti-signal interference function according to claim 1, wherein, The circuit board with anti-signal interference function has an insulating layer and two ink layers. There are two metal layers. The two ink layers are located on opposite side surfaces of the insulating layer, and the two metal layers are located between different side surfaces of the insulating layer and the ink layers.

6. The circuit board with anti-signal interference function according to claim 5, wherein, The surface of the end is at the same height as the surface of the ink layer or the insulating layer.

7. The circuit board with anti-signal interference function according to claim 3, wherein, The width of the metal layer is less than or equal to the outer radius of the hollow semi-cylinder.

8. The circuit board with anti-signal interference function according to claim 1, wherein, The distance between the at least one electronic component and the edge of the circuit board with anti-interference function is positively correlated with the size of the metal unit.

9. A backlight module, comprising: The circuit board with anti-signal interference function according to any one of claims 1 to 8, wherein, The electronic component is a light-emitting element.

10. A display device comprising: The backlight module according to claim 9; and The display panel is located above the backlight module.

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