Shielding assembly, processing method for shielding assembly, and electronic device

Abstract

The present application relates to the technical field of shielding. Disclosed are a shielding assembly, a processing method for a shielding assembly, and an electronic device. The shielding assembly comprises: a shielding cover, wherein the shielding cover comprises a cover plate and a side wall, the side wall surrounding the peripheral side of the cover plate to form a shielding cavity, and the cover plate being provided with a first through hole; an electrically conductive plate, wherein the electrically conductive plate is arranged on the side of the cover plate away from the shielding cavity, and the electrically conductive plate covers the first through hole; and an electrically conductive film layer, wherein the electrically conductive film layer is arranged along the edge of the electrically conductive plate, and the electrically conductive film layer comprises a first covering area and a second covering area connected to each other, the first covering area covering the end face of the end of the electrically conductive plate away from the cover plate, and the first covering area being fixedly connected to the cover plate, the second covering area covering the end face of the side of the cover plate away from the shielding cavity, and the second coverage area being fixedly connected to the cover plate; the electrically conductive plate is electrically connected to the cover plate via the electrically conductive film layer.

Description

Shielding components, methods for manufacturing shielding components, and electronic equipment

[0001] Cross-references to related applications

[0002] This application claims priority to Chinese Patent Application No. 202411526423.7, filed in China on October 30, 2024, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This application relates to the field of shielding technology, specifically to a shielding component, a method for processing the shielding component, and an electronic device. Background Technology

[0004] With the application of 5G mobile communication technology, in order to improve mobile phone performance, protect the device from external signal interference, and prevent internal electromagnetic waves from interfering with the outside world, a metal shielding cover is usually designed on the mobile phone motherboard to reduce the impact of electromagnetic interference on the mobile phone circuitry. In areas where chips such as the Central Processing Unit (CPU) generate a lot of heat, the metal shielding cover usually needs to be perforated to allow a layer of thermally conductive grease to be applied over the heat-generating chip for heat dissipation. Then, a layer of copper foil is attached to the perforated area of ​​the metal shielding cover to seal the perforation. Because copper foil has good electrical conductivity, it achieves a very good electromagnetic shielding effect.

[0005] As shown in Figure 1, the copper foil consists of two parts: an upper copper foil substrate 901 and a lower conductive adhesive layer 902 containing conductive metal particles 903. When bonding the copper foil, pressure is applied to the copper foil so that the conductive metal particles 903 can pierce the conductive adhesive layer 902, forming a conductive path from the copper foil substrate 901 to the conductive metal particles 903 and the metal shielding cover, thereby achieving the effect of shielding against electromagnetic interference.

[0006] Since the conductive adhesive layer 902 below the copper foil substrate 901 is composed of glue and metal conductive particles 903, under a certain thickness, the adhesiveness of the conductive adhesive layer 902 is negatively correlated with the proportion of metal conductive particles 903. That is, when the proportion of glue is higher, the adhesiveness is higher, but the conductivity is worse. When the proportion of metal conductive particles 903 is higher, the conductivity is better, but the adhesiveness is worse. If the conductive adhesive layer 902 is too thick, the conductive metal particles 903 will not be able to pass through, thus preventing the copper foil from conducting through the metal shielding cover. Therefore, in order for the conductive metal particles 903 to pierce the adhesive, the conductive adhesive layer 902 must be very thin, generally less than 10µm. However, electronic devices are subjected to various harsh environments during use, including device heating, high temperature and humidity, temperature changes, or mechanical vibration. The very thin conductive adhesive layer 902 will age, harden, or even fall off, causing the fixed connection between the copper foil and the metal shielding cover to loosen, resulting in the copper foil edge lifting. The corresponding conductive metal particles 903 under the copper foil will lose contact with the metal shielding cover and lose conductive connection, thus leading to a deterioration in the shielding effect. Summary of the Invention

[0007] This application provides a shielding component, a method for processing the shielding component, and an electronic device, which are beneficial to the shielding effect of the shielding component.

[0008] In a first aspect, this application provides a shielding component, comprising:

[0009] A shielding cover, the shielding cover including a cover plate and a side wall, the cover plate surrounding the side wall to form a shielding cavity, the cover plate having a first through hole;

[0010] A conductive plate is disposed on the side of the cover plate away from the shielding cavity, and the conductive plate covers the first through hole;

[0011] A conductive film layer is arranged along the edge of the conductive plate, and the conductive film layer includes a first covering area and a second covering area connected to each other. The first covering area covers the end face of the conductive plate away from the cover plate and is fixedly connected to the cover plate. The second covering area covers the end face of the cover plate away from the shielding cavity and is fixedly connected to the cover plate. The conductive plate is electrically connected to the cover plate through the conductive film layer.

[0012] Secondly, this application provides a method for processing a shielding component, the method comprising:

[0013] A conductive plate is placed over the first through hole of the shielding cover to seal the first through hole. The shielding cover includes a cover plate and a side wall. The cover plate surrounds the side wall to form a shielding cavity. The cover plate has the first through hole. The conductive plate is disposed on the side of the cover plate away from the shielding cavity.

[0014] Adhesive is applied to the joint between the conductive plate and the cover plate to form a coating layer, wherein the adhesive includes a solvent, an adhesive, conductive particles and a tackifier, the coating layer includes a portion arranged along the edge of the conductive plate and covering a first coating area and a second coating area, the first coating area being located on the end face of the conductive plate away from the cover plate, and the second coating area being located on the end face of the cover plate away from the shielding cavity;

[0015] The coating layer is baked to cure it into a conductive film layer. The conductive film layer is arranged along the edge of the conductive plate and includes a first covering area and a second covering area connected to each other. The first covering area covers the end face of the conductive plate away from the cover plate and is fixedly connected to the cover plate. The second covering area covers the end face of the cover plate away from the shielding cavity and is fixedly connected to the cover plate. The conductive plate is electrically connected to the cover plate through the conductive film layer.

[0016] Thirdly, this application provides an electronic device, including a circuit board, electrical components, and the shielding assembly described in the first aspect;

[0017] The electrical component is mounted on the circuit board, the shielding cover of the shielding assembly is fastened to the circuit board, the electrical component is housed in the shielding cover, and the orthographic projection of the electrical component on the plane of the cover plate is located in the first through hole.

[0018] In this embodiment, by including a conductive film layer in the shielding assembly, the conductive film layer comprises a first covering area and a second covering area connected to each other. The first covering area covers the end face of the conductive plate away from the cover plate and is fixedly connected to the cover plate. The second covering area covers the end face of the cover plate away from the shielding cavity and is fixedly connected to the cover plate. Thus, the conductive film layer simultaneously covers the joint between the conductive plate and the cover plate, rather than being located between the conductive plate and the cover plate. In this way, when the electrical components inside the shielding assembly generate heat, causing changes in the ambient temperature, the conductive film layer will not be stretched by the conductive plate and the cover plate due to the difference in thermal expansion coefficients. This allows the conductive film layer to have better thermal stability. Because the conductive film layer has strong adhesion and good thermal stability, the risk of aging, hardening, or even detachment of the conductive film layer due to heat generation from the electrical components inside the shielding assembly can be reduced. This reduces the risk of edge lifting of the conductive layer, which helps to ensure the stability of the electrical connection between the conductive plate and the cover plate through the conductive film layer, thereby improving the shielding effect of the shielding assembly. Attached Figure Description

[0019] Figure 1 is a schematic diagram of the structure of copper foil in the background art;

[0020] Figure 2 is a schematic diagram of the internal structure of the electronic device after the shielding component in the embodiment of this application is applied to the electronic device;

[0021] Figure 3 is one of the structural schematic diagrams of the conductive plate in the embodiments of this application;

[0022] Figure 4 is a schematic diagram of the structure in Figure 3 where the conductive plate and the cover plate are connected by a conductive film layer.

[0023] Figure 5 is a second schematic diagram of the structure of the conductive plate in an embodiment of this application;

[0024] Figure 6 is a schematic diagram of the structure in Figure 5 where the conductive plate and the cover plate are connected by a conductive film layer.

[0025] Figure 7 is a third schematic diagram of the conductive plate in an embodiment of this application;

[0026] Figure 8 is a schematic diagram of the structure in Figure 7 where the conductive plate and the cover plate are connected by a conductive film layer.

[0027] Figure 9 is one of the structural schematic diagrams of the connection between the shielding component and the circuit board in an embodiment of this application;

[0028] Figure 10 is a partial schematic diagram of the shielding components in some embodiments;

[0029] Figure 11 is a top view of the shielding component connected to the circuit board in an embodiment of this application;

[0030] Figure 12 is a schematic diagram of the structure of the conductive plate in the related technology;

[0031] Figure 13 is one of the process flow diagrams for fabricating the shielding component in the embodiments of this application on a circuit board;

[0032] Figure 14 is a second schematic flowchart of the manufacturing process for the shielding component in the embodiment of this application on a circuit board;

[0033] Figure 15 is a flowchart illustrating the processing method of the shielding component provided in an embodiment of this application. Detailed Implementation

[0034] The technical solutions of the embodiments of this application will be clearly described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application are within the scope of protection of this application.

[0035] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0036] The following description, in conjunction with the accompanying drawings, details a shielding component, a method for processing the shielding component, and an electronic device provided in this application, through specific embodiments and application scenarios.

[0037] Please refer to Figure 2-11. This application embodiment provides a shielding component, which includes:

[0038] The shielding cover 100 includes a cover plate 102 and a side wall 105. The cover plate 102 surrounds the side wall 105 to form a shielding cavity 101. The cover plate 102 has a first through hole 104.

[0039] A conductive plate 200 is disposed on the side of the cover plate 102 away from the shielding cavity 101, and the conductive plate 200 covers the first through hole 104.

[0040] A conductive film layer 300 is arranged along the edge of the conductive plate 200, and the conductive film layer 300 includes a first covering area 301 and a second covering area 302 connected to each other. The first covering area 301 covers the end face of the conductive plate 200 away from the cover plate 102 and is fixedly connected to the cover plate 102. The second covering area 302 covers the end face of the cover plate 102 away from the shielding cavity 101 and is fixedly connected to the cover plate 102. The conductive plate 200 is electrically connected to the cover plate 102 through the conductive film layer 300.

[0041] Please refer to Figure 4. In some embodiments of this application, the conductive film layer 300 is annular. The conductive film layer 300 further includes a first boundary line and a second boundary line. The first boundary line is located inside the boundary line of the conductive plate 200, and the second boundary line is located outside the boundary line of the conductive plate 200. The first covering area 301 is the area formed by the first boundary line and the boundary line of the conductive plate 200, and the second covering area 302 is the area formed by the second boundary line and the boundary line of the conductive plate 200. The second boundary line may be the boundary line of the cover plate 102, or the second boundary line may be located inside the boundary line of the cover plate 102.

[0042] Please refer to Figure 2. The cover plate 102 is the top plate of the shielding cover 100. When the shielding cover 100 is fastened to the circuit board 500, the cover plate 102 is opposite to the circuit board 500. Please refer to Figure 2. In addition to the cover plate 102, the shielding cover 100 may also include four side walls 105 connected to the cover plate 102. The four side walls 105 are arranged around the edge of the cover plate 102, and the cover plate 102 and the four side walls 105 together form the shielding cavity 101.

[0043] The aforementioned shielding cover 100 can be any type of shielding cover 100 with electromagnetic shielding function, such as various metal shielding covers 100. The shielding assembly can be applied to shielding electromagnetically radiating electrical components 400 in various electronic devices. Specifically, when the shielding assembly is used to electromagnetically shield electrical components 400 in electronic devices, the shielding cover 100 can be fastened to the circuit board 500 where the electrical component 400 is located, and the electrical component 400 is housed within the enclosed space formed by the shielding assembly and the circuit board 500. This prevents electromagnetic interference generated by the electrical component 400 during operation from leaking outside the shielding assembly, thereby reducing electromagnetic interference from the electrical component 400 to other devices outside the shielding assembly. The electrical component 400 located in the shielding assembly can be any type of electrical component 400 capable of generating electromagnetic interference, such as a CPU, Double Data Rate Synchronous Dynamic Random Access Memory (DDR), various switching devices, diodes, and nonlinear passive components.

[0044] In some embodiments of this application, the first through-hole 104 may be a perforation provided to dissipate heat from the electrical component 400, which generates a large amount of heat in the shielding assembly. Referring to Figure 2, in this case, to dissipate heat from the electrical component 400, the electrical component 400 can be positioned directly below the first through-hole 104, that is, the orthographic projection of the electrical component 400 onto the plane of the cover plate 102 is located within the first through-hole 104. Simultaneously, a first thermally conductive grease layer 600 can be coated on the end face of the electrical component 400 facing the first through-hole 104, and the first thermally conductive grease... The end face of the layer away from the electrical component 400 can be attached to the conductive plate 200, and a second thermally conductive ester layer 700 can be coated on the end face of the conductive plate 200 away from the first thermally conductive ester layer 600. The end face of the second thermally conductive ester layer 700 away from the conductive plate 200 can be attached to the middle frame 800 in the electronic device. In this way, the heat generated by the electrical component 400 during operation can be conducted to the middle frame 800 for heat dissipation through the following path: electrical component 400 → first thermally conductive ester layer 600 → conductive plate 200 → second thermally conductive ester layer 700 → middle frame 800.

[0045] In other embodiments of this application, the first through hole 104 may also be a clearance hole to avoid electrical components 400 with a large height in the shielding assembly. Specifically, in common electronic devices such as mobile phones, there may be some electrical components 400 whose height exceeds the height of the internal space of the shielding cover 100, as shown in Figure 9. In this case, in order to install the electrical component 400 inside the shielding cover 100, the first through hole 104 can be opened in the cover plate 102, and the electrical component 400 can be installed directly below the first through hole 104. At this time, the top of the electrical component 400 can be embedded in the first through hole 104. In this way, it is possible to install electrical components 400 whose height exceeds the height of the internal space of the shielding cover 100 inside the shielding assembly.

[0046] The aforementioned conductive plate 200 can be any plate with conductive properties, specifically a thin plate of various metal materials. In the embodiments of this application, the conductive plate 200 can be a copper foil in the form of a plate.

[0047] The aforementioned conductive film layer 300 can be any film layer that has conductive properties and adhesiveness. Thus, the conductive film layer 300 can both fix the position between the conductive plate 200 and the cover plate 102 and enable electrical conduction between the conductive plate 200 and the cover plate 102.

[0048] Please refer to Figure 13, which is a schematic flowchart of the manufacturing process for fabricating the shielding component in this embodiment of the application on the circuit board 500. The circuit board 500 includes electrical components 400, and the manufacturing process specifically includes the following steps:

[0049] Step 1301: Attach the shielding cover 100 to the circuit board 500 and house the electrical component 400 inside the shielding cover 100. The electrical component 400 is opposite to the opening of the first through hole 104. The electrical component 400 and the shielding cover 100 can be fixed to the circuit board 500 by welding or other processes.

[0050] Step 1302: Coat the end face of the electrical component 400 facing the first through hole 104 with a second thermally conductive ester layer 700.

[0051] Step 1303: Cover the first through hole 104 of the shielding cover 100 with the conductive plate 200 to seal the first through hole 104. The shielding cover 100 includes a cover plate 102 and a side wall 105. The cover plate 102 surrounds the side wall 105 to form a shielding cavity 101. The cover plate 102 has the first through hole 104. The conductive plate 200 is disposed on the side of the cover plate 102 away from the shielding cavity 101.

[0052] Step 1304: Apply adhesive to the joint between the conductive plate 200 and the cover plate 102 to form a coating layer, wherein the adhesive includes a solvent, an adhesive, conductive particles and a tackifier, the coating layer is arranged along the edge of the conductive plate 200 and covers a first coating area and a second coating area, the first coating area is located on the end face of the conductive plate 200 away from the cover plate 102, and the second coating area is located on the end face of the cover plate 102 away from the shielding cavity 101;

[0053] Step 1305: The coating layer is baked to cure it and form a conductive film layer 300. The conductive film layer 300 is arranged along the edge of the conductive plate 200 and includes a first covering area 301 and a second covering area 302 connected to each other. The first covering area 301 covers the end face of the conductive plate 200 away from the cover plate 102 and is fixedly connected to the cover plate 102. The second covering area 302 covers the end face of the cover plate 102 away from the shielding cavity 101 and is fixedly connected to the cover plate 102. The conductive plate 200 is electrically connected to the cover plate 102 through the conductive film layer 300.

[0054] Please refer to Figure 14, which is a schematic flowchart of the manufacturing process for fabricating the shielding component in this embodiment of the application on the circuit board 500. The circuit board 500 includes electrical components 400, and the manufacturing process specifically includes the following steps:

[0055] Step 1401: Attach the shielding cover 100 to the circuit board 500 and house the electrical component 400 inside the shielding cover 100. The electrical component 400 is opposite to the opening of the first through hole 104. The electrical component 400 and the shielding cover 100 can be fixed to the circuit board 500 by processes such as welding.

[0056] Step 1402: Cover the first through hole 104 of the shielding cover 100 with the conductive plate 200 to seal the first through hole 104. The shielding cover 100 includes a cover plate 102 and a side wall 105. The cover plate 102 surrounds the side wall 105 to form a shielding cavity 101. The cover plate 102 has the first through hole 104. The conductive plate 200 is disposed on the side of the cover plate 102 away from the shielding cavity 101.

[0057] Step 1403: Apply adhesive to the joint between the conductive plate 200 and the cover plate 102 to form a coating layer, wherein the adhesive includes a solvent, an adhesive, conductive particles and a tackifier, the coating layer is arranged along the edge of the conductive plate 200 and covers a first coating area and a second coating area, the first coating area is located on the end face of the conductive plate 200 away from the cover plate 102, and the second coating area is located on the end face of the cover plate 102 away from the shielding cavity 101;

[0058] Step 1404: The coating layer is baked to cure and form a conductive film layer 300. The conductive film layer 300 is arranged along the edge of the conductive plate 200 and includes a first covering area 301 and a second covering area 302 connected to each other. The first covering area 301 covers the end face of the conductive plate 200 away from the cover plate 102 and is fixedly connected to the cover plate 102. The second covering area 302 covers the end face of the cover plate 102 away from the shielding cavity 101 and is fixedly connected to the cover plate 102. The conductive plate 200 is electrically connected to the cover plate 102 through the conductive film layer 300.

[0059] In the embodiments shown in Figures 2 and 9, the solvent can be various solvents with dilution functions, such as ethanol, acetone, ethyl acetate, methyl ethyl ketone, chloroform, methyl tert-butyl ether, etc. The binder can be various types of binders, such as polymer-modified polyethylene (PE) resin, polypropylene, silicone resin, polyether, polyvinyl alcohol, etc., which have adhesive properties. The conductive particles can be various particles with conductive properties, such as silver powder, copper powder, "mixed particles of silver powder and aluminum powder", "mixed particles of nickel powder and carbon powder", etc. The tackifier can be various tackifiers that can improve thixotropy. The solvent content in the adhesive can be 30%–50%, the binder content in the adhesive can be 30%–50%, the conductive particle content in the adhesive can be 10%–25%, and the content of the tackifier and other substances in the adhesive can be 5%–15%. For example, in some embodiments of this application, the solvent content in the adhesive is 40%, the binder content is 40%, the conductive particle content is 12%, and the content of other substances such as tackifiers is 8%. As another example, in some embodiments of this application, the solvent content in the adhesive is 35%, the binder content is 35%, the conductive particle content is 20%, and the content of other substances such as tackifiers is 10%. It is understood that the specific types and contents of the various components in the above-mentioned adhesive can be set as needed.

[0060] In some embodiments of this application, the main components of the adhesive include 30-50% ethanol solvent for dilution, 30-50% polymer resin modified polyethylene (PE) for bonding, 10-25% conductive particles for conductivity, and 5-15% tackifier to improve thixotropy. The conductive particles can be silver powder, copper powder, etc. The adhesive can be applied to the joint between the conductive plate 200 and the cover plate 102 by a piezoelectric valve dispensing process to form the coating layer. Before dispensing, the adhesive needs to be thoroughly stirred to ensure that the metal particles inside the adhesive are evenly distributed.

[0061] In the embodiments shown in Figures 2 and 9, the baking treatment of the coating layer specifically refers to baking and curing at a temperature of 60 to 120°C for 10 to 25 minutes. During the baking process, the solvent in the coating layer will evaporate, and the polymer modified polyethylene will cross-link to form a film and bond with the surface of the shielding cover metal or copper foil. The surface sheet resistance of the cured conductive film layer 300 is less than 0.5 ohms.

[0062] In this embodiment, by including a conductive film layer 300 in the shielding assembly, the conductive film layer 300 includes a first covering area 301 and a second covering area 302 connected to each other. The first covering area 301 covers the end face of the conductive plate 200 away from the cover plate 102 and is fixedly connected to the cover plate 102. The second covering area 302 covers the end face of the cover plate 102 away from the shielding cavity 101 and is fixedly connected to the cover plate 102. Thus, the conductive film layer 300 simultaneously covers the area above the joint between the conductive plate 200 and the cover plate 102, rather than being located between the conductive plate 200 and the cover plate 102. Therefore, when... When the electrical components 400 inside the shielding assembly generate heat, causing changes in the ambient temperature, the conductive film layer 300 will not be stretched by the conductive plate 200 and the cover plate 102 due to the difference in thermal expansion coefficients between the conductive plate 200 and the cover plate 102. This allows the conductive film layer 300 to have good thermal stability. Because the conductive film layer 300 has strong adhesion and good thermal stability, the risk of aging, hardening, or even detachment of the conductive film layer 300 due to the heat generated by the electrical components 400 inside the shielding assembly can be reduced. This reduces the risk of edge lifting of the conductive layer 201, which helps to ensure the stability of the electrical connection between the conductive plate 200 and the cover plate 102 through the conductive film layer 300, thereby improving the shielding effect of the shielding assembly.

[0063] Optionally, the conductive plate 200 has a plurality of notches 204 on its edge, the plurality of notches 204 being arranged at intervals along the edge of the conductive plate 200, and the second covering area 302 covering the area where the notches 204 are located.

[0064] When the internal component density of an electronic device is high, the length and width dimensions of its internal shielding cover 100 are usually small, and the distance from the edge of the conductive plate 200 to the edge of the shielding cover 100 is also correspondingly small, i.e., the value of d in Figure 4 is small. At the same time, the edge shape of the conventional conductive plate 200 is usually flat and continuous, as shown in Figure 12. This results in a smaller area for the conductive film layer 300 to adhere to in the cover plate 102, reducing the overall adhesion of the conductive film layer 300 and potentially affecting the long-term stability of the overall shielding effect. Therefore, this embodiment proposes to reduce the area of ​​the conductive plate 200... Multiple spaced notches 204 are provided along the edge, so that the edge of the conductive plate 200 is processed into an alternating concave-convex shape as shown in Figure 3. This shape is similar to a spliced ​​foam pad. The conductive film layer 300 can still be continuously applied to the entire annular area, as shown in Figure 4. In this way, a portion of the conductive film layer 300 on the shielding cover 100 is embedded in the notch area of ​​the conductive plate 200. This increases the adhesion area of ​​the conductive film layer 300 on the shielding cover 100 and also increases the bonding force of the conductive film layer 300 to the conductive plate 200 to a greater extent, so as to further prevent the edge of the conductive plate 200 from lifting.

[0065] In some embodiments of this application, when the distance d from the edge of the conductive plate 200 to the edge of the shielding cover 100 is particularly small, for example, when d ≤ 0.5 mm, the conductive film layer 300 is difficult to adhere to the cover plate 102, and the adhesion area is small. There is also the problem that the conductive film layer 300 is too close to the edge of the shielding cover 100, causing it to scatter on the surface of the circuit board 500 and contaminate the circuit board 500. In this case, based on the embodiment shown in FIG3, the size of the notch area along the edge of the conductive plate 200 can be increased. This reduces the number of protruding portions 206 on the edge of the conductive plate 200 in the embodiment shown in FIG3, as shown in FIG5. The protruding portions 206 on the edge of the conductive plate 200 facilitate the preparation of the conductive film layer 300 before fabrication. Since the conductive film layer 300 is difficult to adhere to the outside of the protrusion 206, in order to increase the size of the notch area along the edge of the conductive plate 200, the width of the protrusion 206 can be further reduced. For example, the width of the protrusion 206 is no more than 3 mm, that is, the distance between two adjacent notches 204 is no more than 3 mm, that is, the width b in Figure 5 is no more than 3 mm. In this way, by increasing the area of ​​the notch area on the outside of the conductive plate 200, the first covering area 301 of the conductive film layer 300 can cover the area where the notch 204 is located, thereby increasing the adhesion area between the conductive film layer 300 and the cover plate 102. Therefore, it is beneficial to improve the adhesion effect between the conductive film layer 300 and the cover plate 102.

[0066] It is understood that the sum of the areas of the orthogonal projections of all the notches 204 on the edge of the conductive plate 200 in the cover plate 102 can be negatively correlated with the above-mentioned d, that is, the smaller the value of d, the larger the sum of the areas of the orthogonal projections of all the notches 204 on the edge of the conductive plate 200 in the cover plate 102.

[0067] In this embodiment, by providing multiple notches 204 along the edge of the conductive plate 200, with the notches 204 spaced apart, and the second covering area 302 covering the area where the notches 204 are located, the stability of the connection between the conductive film layer 300, the conductive plate 200, and the cover plate 102 is improved, thereby further preventing the problem of edge lifting of the conductive plate 200. Furthermore, since the distance between the edge of the conductive plate 200 and the shielding cover 100 is small, a better adhesion effect between the conductive film layer 300 and the shielding cover 100 is also achieved. This facilitates the miniaturization of the circuit board 500 while enhancing the adhesion strength of the conductive film layer 300.

[0068] Optionally, the conductive plate 200 has a plurality of second through holes 205, which are arranged at intervals along the edge of the conductive plate 200, and the second through holes 205 are opposite to the cover plate 102.

[0069] The second coverage area 302 includes a plurality of first sub-coverage areas 3021 corresponding one-to-one with the plurality of second through holes 205, and a second sub-coverage area 3022 located on the outside of the conductive plate 200.

[0070] The first sub-covering area 3021 covers the corresponding second through hole 205 and is fixedly connected to the cover plate 102. Simultaneously, the first sub-covering area 3021 is connected to the first covering area 301. The second sub-covering area 3022 covers the area between the second boundary line and the boundary line of the conductive plate 200 in the cover plate 102. The second sub-covering area 3022 is fixedly connected to the cover plate 102 and is connected to the first covering area 301.

[0071] In this embodiment of the application, in addition to providing a notch 204 at the edge of the conductive plate 200, as shown in Figure 7, a plurality of second through holes 205 can also be machined on the inner side of the conductive plate 200. The shape of the second through holes 205 can be set as needed. For example, the shape of the second through holes 205 can be circular, elliptical, polygonal, etc.

[0072] It is understood that the first sub-coverage area 3021, the second coverage area 302, and the second sub-coverage area 3022 can be connected sequentially. Specifically, during the fabrication of the conductive film layer 300, adhesive can be continuously applied from the first boundary line to the second boundary line. After baking and curing, the first sub-coverage area 3021, the second coverage area 302, and the second sub-coverage area 3022 can be formed in sequence.

[0073] In this embodiment, by providing a plurality of second through holes 205 in the conductive plate 200 and arranging the plurality of second through holes 205 at intervals along the edge of the conductive plate 200, with the second through holes 205 facing the cover plate 102, and by making the first covering area 301 include a plurality of first sub-covering areas 3021 corresponding one-to-one with the plurality of second through holes 205, and a second sub-covering area 3022 located on the outer side of the conductive plate 200, it is beneficial to increase the adhesion area between the conductive film layer 300 and the cover plate 102, thereby improving the adhesion effect between the conductive film layer 300 and the cover plate 102. Furthermore, since the distance between the edge of the conductive plate 200 and the shielding cover 100 is small, a better bonding effect between the conductive film layer 300 and the shielding cover 100 can also be achieved. This is beneficial for miniaturizing the circuit board 500 while enhancing the adhesion strength of the conductive film layer 300.

[0074] Optionally, the shield 100 has at least one vent 103.

[0075] The vent 103 can be located at any position on the surface of the shield 100. For example, the vent 103 can be formed in the cover plate 102 of the shield 100. Alternatively, the vent 103 can also be located on the side wall of the shield 100.

[0076] Specifically, the shape of the vent 103 can be set as needed. For example, the vent 103 can be circular, elliptical, polygonal, etc. When the vent 103 is a circular hole, its diameter is less than or equal to 1.0 mm. When the shape of the vent 103 is other than circular, its orifice area is less than or equal to 0.78 mm². 2 It is understood that the opening of the vent 103 must not be blocked. That is, the vent 103 connects the internal and external spaces of the shielding cover 100.

[0077] In this embodiment, by providing ventilation holes 103 on the surface of the shielding cover 100, when the air inside the shielding cover 100 expands due to heat during the baking and curing process of the conductive film layer 300, it can be discharged to the outside of the shielding cover 100 through the ventilation holes 103. This avoids the conductive plate 200 being pushed to separate from the shielding cover 100 due to excessive air pressure difference inside and outside the shielding cover 100, and also avoids problems such as air bubbles being filled into the conductive film layer 300 due to excessive air pressure difference inside and outside the shielding cover 100.

[0078] Optionally, as shown in Figure 11, the shielding cover 100 has two ventilation holes 103, which are located at two opposite corners of the cover plate 102.

[0079] In this embodiment, by providing a vent 103 at each of the two opposite corners of the cover plate 102, the high-pressure air inside the shield 100 can be discharged to the outside of the shield 100 through the vent 103 which is relatively close, thereby helping to ensure that the air pressure at various locations inside the shield 100 is relatively balanced.

[0080] Optionally, the thickness of the conductive film layer 300 ranges from 30 μm to 100 μm.

[0081] In this embodiment, the thickness of the conductive film layer 300 is 30µm to 100µm, while in related technologies, the thickness of the adhesive layer connecting the copper foil and the shielding cover 100 is usually less than 10µm. That is, the thickness of the conductive film layer 300 in this embodiment is much greater than the thickness of the adhesive layer in related technologies. This is beneficial to improve the adhesion of the conductive film layer 300, thereby improving the bonding effect between the conductive film layer 300 and the shielding cover 100 and the conductive plate 200.

[0082] Optionally, referring to FIG9, in some embodiments of this application, the conductive plate 200 includes a conductive layer 201 and an insulating adhesive layer 202. The insulating adhesive layer 202 is located between the conductive layer 201 and the cover plate 102, and the conductive layer 201 is bonded to the cover plate 102 through the insulating adhesive layer 202.

[0083] The insulating adhesive layer 202 can be an adhesive layer formed by various insulating adhesives. The conductive layer 201 can be copper foil. Referring to Figure 9, in this embodiment, since the conductive layer 201 can be electrically connected to the shielding cover 100 through the conductive film layer 300, it achieves the effect of shielding electromagnetic interference. Therefore, there is no need to add conductive particles to the adhesive layer. Thus, in addition to being bonded to the cover plate 102 through the conductive film layer 300, the conductive plate 200 can also be bonded to the cover plate 102 through the insulating adhesive layer 202, which further improves the bonding effect between the conductive plate 200 and the shielding cover 100, thereby further reducing the risk of the conductive plate 200's edges lifting.

[0084] When the shielding assembly is applied to the circuit board 500, if conductive particles are embedded in the adhesive layer, the conductive plate 200 is directly opposite the electrical component 400 inside the shielding cover 100 in the area where the first through hole 104 is located. Therefore, when the end face of the electrical component 400 facing the first through hole 104 has a conductive portion and the height of the electrical component 400 is large, for example, if the electrical component 400 is a capacitor or inductor with a large height, the electrical component 400 is prone to contact with the conductive plate 200 and short circuit. Based on this, in this embodiment, by making the end face of the conductive plate 200 facing the first through hole 104 the end face of the insulating adhesive layer 202, that is, by making the end face of the conductive plate 200 facing the first through hole 104 insulated, the problem of short circuit caused by contact between the electrical component 400 inside the shielding cover 100 and the conductive plate 200 can be avoided.

[0085] In this embodiment, by including a conductive layer 201 and an insulating adhesive layer 202 in the conductive plate 200, with the insulating adhesive layer 202 located between the conductive layer 201 and the cover plate 102, and the conductive layer 201 bonded to the cover plate 102 via the insulating adhesive layer 202, the bonding effect between the conductive plate 200 and the shielding cover 100 is further improved, thereby further reducing the risk of edge lifting of the conductive plate 200. Simultaneously, it avoids the problem of short circuits occurring in the electrical components 400 inside the shielding cover 100 due to contact with the conductive plate 200.

[0086] Optionally, referring to FIG10, in some other embodiments of this application, the conductive plate 200 includes a conductive layer 201 and a conductive adhesive layer 203. The conductive adhesive layer 203 is located between the conductive layer 201 and the cover plate 102, and the conductive layer 201 is bonded to the cover plate 102 through the conductive adhesive layer 203. The conductive layer 201 is electrically connected to the cover plate 102 through the conductive adhesive layer 203.

[0087] The conductive layer 201 can be a copper foil, and the conductive adhesive layer 203 can be a conductive adhesive layer 203 formed by adding conductive particles to the adhesive layer. The conductive particles can be various metal particles with conductive properties.

[0088] In this embodiment, the conductive plate 200 is electrically connected to the shielding cover 100 via both the conductive film layer 300 and the conductive adhesive layer 203. This helps ensure that the shielding assembly has a temperature-controlled electromagnetic shielding effect. Simultaneously, the conductive plate 200 can be fixedly connected to the shielding cover 100 via both the conductive film layer 300 and the conductive adhesive layer 203, further improving the adhesion between the conductive plate 200 and the shielding cover 100 and reducing the risk of edge lifting of the conductive plate 200.

[0089] Please refer to Figure 15, which is a flowchart illustrating a method for processing a shielding component according to an embodiment of this application. The method includes the following steps:

[0090] Step 1501: Cover the first through hole 104 of the shielding cover 100 with the conductive plate 200 to seal the first through hole 104. The shielding cover 100 includes a cover plate 102 and a side wall 105. The cover plate 102 surrounds the side wall 105 to form a shielding cavity 101. The cover plate 102 has the first through hole 104. The conductive plate 200 is disposed on the side of the cover plate 102 away from the shielding cavity 101.

[0091] Step 1502: Apply adhesive to the joint between the conductive plate 200 and the cover plate 102 to form a coating layer, wherein the adhesive includes a solvent, an adhesive, conductive particles and a tackifier, the coating layer is arranged along the edge of the conductive plate 200 and covers a first coating area and a second coating area, the first coating area is located on the end face of the conductive plate 200 away from the cover plate 102, and the second coating area is located on the end face of the cover plate 102 away from the shielding cavity 101;

[0092] Step 1503: The coating layer is baked to cure it and form a conductive film layer 300. The conductive film layer 300 is arranged along the edge of the conductive plate 200 and includes a first covering area 301 and a second covering area 302 connected to each other. The first covering area 301 covers the end face of the conductive plate 200 away from the cover plate 102 and is fixedly connected to the cover plate 102. The second covering area 302 covers the end face of the cover plate 102 away from the shielding cavity 101 and is fixedly connected to the cover plate 102. The conductive plate 200 is electrically connected to the cover plate 102 through the conductive film layer 300.

[0093] The solvents mentioned above can be various solvents with diluting functions, such as ethanol, acetone, ethyl acetate, methyl ethyl ketone, chloroform, methyl tert-butyl ether, etc. The binders mentioned above can be various types of binders, such as polymer-modified polyethylene (PE) resins, polypropylene, silicone resins, polyethers, polyvinyl alcohol, etc., which have adhesive properties. The conductive particles mentioned above can be various particles with conductive properties, such as silver powder, copper powder, "mixed particles of silver and aluminum powder", "mixed particles of nickel and carbon powder", etc. The tackifiers mentioned above can be various tackifiers that can improve thixotropy. The solvent content in the adhesive can be 30%–50%, the binder content in the adhesive can be 30%–50%, the conductive particle content in the adhesive can be 10%–25%, and the content of tackifiers and other substances in the adhesive can be 5%–15%. For example, in some embodiments of this application, the solvent content in the adhesive is 40%, the binder content is 40%, the conductive particle content is 12%, and the content of other substances such as tackifiers is 8%. As another example, in some embodiments of this application, the solvent content in the adhesive is 35%, the binder content is 35%, the conductive particle content is 20%, and the content of other substances such as tackifiers is 10%. It is understood that the specific types and contents of the various components in the above-mentioned adhesive can be set as needed.

[0094] In some embodiments of this application, the main components of the adhesive include 30-50% ethanol solvent for dilution, 30-50% high-molecular-weight modified polyethylene (PE) polymer resin for bonding, 10-25% conductive particles for conductivity, and 5-15% tackifier to improve thixotropy. The adhesive can be applied to the joint between the conductive plate 200 and the cover plate 102 using a piezoelectric valve dispensing process to form the coating layer. Before dispensing, the adhesive needs to be thoroughly stirred to ensure that the metal particles inside the adhesive are evenly distributed.

[0095] The baking treatment of the coating layer mentioned above can specifically refer to baking and curing at a temperature of 60 to 120°C for 10 to 25 minutes. During the baking process, the solvent in the coating layer will evaporate, and the polymer modified polyethylene will cross-link to form a film and bond to the surface of the shielding cover metal or copper foil. The surface sheet resistance of the cured conductive film layer 300 is less than 0.5 ohms.

[0096] It is understood that the processing method of the shielding component provided in the embodiments of this application can be used to process the shielding component provided in the above embodiments.

[0097] This embodiment is a processing method for a shielding component corresponding to the above embodiment. Its specific implementation process is similar to that of the above embodiment and has the same beneficial effects. To avoid repetition, it will not be described again here.

[0098] This application also provides an electronic device, which includes a circuit board 500, electrical components 400, and the shielding assembly described in the above embodiments;

[0099] The electrical component 400 is mounted on the circuit board 500, the shielding cover 100 of the shielding assembly is fastened to the circuit board 500, the electrical component 400 is housed in the shielding cover 100, and the orthographic projection of the electrical component 400 on the plane of the cover plate 102 is located in the first through hole 104.

[0100] Referring to Figure 2, in some embodiments of this application, the electronic device may further include a circuit board 500, an electrical component 400, and a mid-frame 800. A shielding cover 100 is fastened to the circuit board 500. The electrical component 400 is located within the shielding cover 100 and is opposite to the first through-hole 104. A first thermally conductive grease layer 600 is coated on the end face of the electrical component 400 facing the first through-hole 104, and the end face of the first thermally conductive grease layer away from the electrical component 400 is coated with the first thermally conductive grease layer. The second thermally conductive ester layer 700 can be coated on the end face of the conductive plate 200 away from the first thermally conductive ester layer 600, and the end face of the second thermally conductive ester layer 700 away from the conductive plate 200 can be bonded to the middle frame 800 in the electronic device. In this way, the heat generated by the electrical component 400 during operation can be conducted to the middle frame 800 for heat dissipation in the following order: electrical component 400 → first thermally conductive ester layer 600 → conductive plate 200 → second thermally conductive ester layer 700 → middle frame 800.

[0101] Referring to Figure 9, in some other embodiments of this application, the electronic device may further include a circuit board 500 and an electrical component 400. The shielding cover 100 is fastened to the circuit board 500, and the electrical component 400 is located inside the shielding cover 100, with the electrical component 400 facing the first through hole 104. The height of the electrical component 400 is greater than the height of the internal space of the shielding cover 100, and the end of the electrical component 400 facing the conductive plate 200 is accommodated in the first through hole 104. In this way, it is possible to install the electrical component 400, whose height exceeds the height of the internal space of the shielding cover 100, inside the shielding assembly.

[0102] The electronic device provided by this embodiment includes the shielding component described in the above embodiments. Therefore, the electronic device can implement each process of the shielding component in the above embodiments and has the same beneficial effects. To avoid repetition, it will not be described again here.

[0103] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. A shielding component, comprising: A shielding cover, the shielding cover including a cover plate and a side wall, the cover plate surrounding the side wall to form a shielding cavity, the cover plate having a first through hole; A conductive plate is disposed on the side of the cover plate away from the shielding cavity, and the conductive plate covers the first through hole; A conductive film layer is arranged along the edge of the conductive plate, and the conductive film layer includes a first covering area and a second covering area connected to each other. The first covering area covers the end face of the conductive plate away from the cover plate and is fixedly connected to the cover plate. The second covering area covers the end face of the cover plate away from the shielding cavity and is fixedly connected to the cover plate. The conductive plate is electrically connected to the cover plate through the conductive film layer.

2. The shielding assembly according to claim 1, wherein, The conductive plate has multiple notches along its edge, and the multiple notches are spaced apart along the edge of the conductive plate. The second covering area covers the area where the notches are located.

3. The shielding assembly according to claim 1, wherein, The conductive plate has a plurality of second through holes, which are arranged at intervals along the edge of the conductive plate and are opposite to the cover plate. The second coverage area includes a plurality of first sub-coverage areas corresponding one-to-one with the plurality of second through holes, and a second sub-coverage area located on the outside of the conductive plate.

4. The shielding assembly according to claim 1, wherein, The shielding cover has at least one ventilation hole.

5. The shielding assembly according to claim 4, wherein, The shielding cover has two ventilation holes, which are located at two opposite corners of the cover plate.

6. The shielding assembly according to any one of claims 1 to 5, wherein, The thickness of the conductive film layer ranges from 30µm to 100µm.

7. The shielding assembly according to any one of claims 1 to 5, wherein, The conductive plate includes a conductive layer and an insulating adhesive layer. The insulating adhesive layer is located between the conductive layer and the cover plate, and the conductive layer is bonded to the cover plate through the insulating adhesive layer.

8. The shielding assembly according to any one of claims 1 to 5, wherein, The conductive plate includes a conductive layer and a conductive adhesive layer. The conductive adhesive layer is located between the conductive layer and the cover plate, and the conductive layer is bonded to the cover plate through the conductive adhesive layer. The conductive layer is electrically connected to the cover plate through the conductive adhesive layer.

9. A method for processing a shielding component, the method comprising: A conductive plate is placed over the first through hole of the shielding cover to seal the first through hole. The shielding cover includes a cover plate and a side wall. The cover plate surrounds the side wall to form a shielding cavity. The cover plate has the first through hole. The conductive plate is disposed on the side of the cover plate away from the shielding cavity. Adhesive is applied to the joint between the conductive plate and the cover plate to form a coating layer, wherein the adhesive includes a solvent, an adhesive, conductive particles and a tackifier, the coating layer includes a portion arranged along the edge of the conductive plate and covering a first coating area and a second coating area, the first coating area being located on the end face of the conductive plate away from the cover plate, and the second coating area being located on the end face of the cover plate away from the shielding cavity; The coating layer is baked to cure it into a conductive film layer. The conductive film layer is arranged along the edge of the conductive plate and includes a first covering area and a second covering area connected to each other. The first covering area covers the end face of the conductive plate away from the cover plate and is fixedly connected to the cover plate. The second covering area covers the end face of the cover plate away from the shielding cavity and is fixedly connected to the cover plate. The conductive plate is electrically connected to the cover plate through the conductive film layer.

10. An electronic device comprising a circuit board, electrical components, and a shielding assembly as described in any one of claims 1 to 8; The electrical component is mounted on the circuit board, the shielding cover of the shielding assembly is fastened to the circuit board, the electrical component is housed in the shielding cover, and the orthographic projection of the electrical component on the plane of the cover plate is located in the first through hole.

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