Component conveying device

Abstract

This document describes a component conveying device and a method for picking up a component, depositing a component, and inspecting components in the component conveying device. The component conveying device comprises at least a first and a second conveyor unit, a control unit, and a component inspection unit, wherein the component inspection unit is arranged between the first conveyor unit and the second conveyor unit in a conveying direction. The first conveyor unit comprises at least a first component pick-up that is movable at least along and against a conveying direction. The component inspection unit comprises at least one first plate rotatable about a first axis of rotation and at least one second component pick-up arranged radially outside the first plate and rotatable about a second axis of rotation. The second conveyor unit comprises at least one third component pick-up which is movable at least along and against a pick-up direction and a conveying direction.

Description

[0001] MB Automation GmbH & Co. KG -1 - 30A-168 210

[0002] Component conveying device

[0003] Description

[0004] Background

[0005] A component conveying device and methods for picking up a component, depositing a component, and inspecting components in the component conveying device is described here. These components may be semiconductor chips. Details are defined in the claims. The description also contains relevant information on the structure and functionality as well as variants of the device and methods.

[0006] A component here is, for example, an electronic component, also referred to as a "chip" or "die." Such a component usually has a prismatic shape, an essentially polygonal, e. g., quadrangular (rectangular or square), cross-section with several lateral surfaces and an end or top surface or an upper and a lower front surface. The lateral surfaces of the component are hereinafter synonymously referred to as side surfaces. The component may also have a number of lateral surfaces other than four. A component may also be or comprise an electronic and / or optical component (prism, mirror, lens, etc.). Overall, a component may have any geometric shape.

[0007] From the applicant's operational practice, so-called pick-up and deposit devices in which components are picked up from a substrate by means of a pick-up tool and then deposited on a carrier or in a transport container or the like are known. Before being deposited, the component is inspected. For this purpose, images of one or more side surfaces of the component are recorded with one or more cameras and evaluated by means of automated image processing.

[0008] EP 1 470 747 Bl relates to a chip removal device, a chip removal system, placing system, and a method for removing and further processing chips. The chips are removed from a wafer and transported to a transfer position and simultaneously turned over. This chip removal device for removing chips from structured semiconductor wafers is equipped with a rotatable removal tool for removing the chips from the wafer and turning the removed chips 180° around their longitudinal or transverse axis, and a rotatable turning tool for turning the removed chips again by 180° about their longitudinal or transverse axis, which interacts with the removal tool. The MB Automation GmbH & Co. KG -2 - 30A-168 210 removal tool has a first transfer position and the turning tool has a second transfer position, at which the chips can be transferred to a placing head for further processing.

[0009] EP 0 906 011 A2 relates to a device for removing and mounting electrical components on a substrate. The device comprises a rotatable transfer device which removes the electrical components from a feed module at a pick-up position and transfers them to a suction belt for further processing at a first transfer position. The components are picked up from the suction belt by a revolving equipping head and transported to a second transfer position.

[0010] WO 02 / 054480 Al relates to a device for optically inspecting various surfaces of a chip to be mounted. The device comprises a first, upper transport disc which is set up to remove the chips from a feed unit and transport them to a first transfer position. The chips are held in suction openings formed on the outer surface of the upper transport drum and moved by rotating the upper transport disc. The device also has a second, lower transport disc formed like the upper transport disc, which picks up the removed chips at the first transfer position and transports them to a second transfer position. The device enables inspection of the chips by means of cameras arranged to the side of the transport discs to inspect the top and bottom of the chips. The chips are transferred to a sorting device for further processing without being turned relative to their original orientation.

[0011] US 4,619,043 A discloses a device and a method for removing and attaching electronic components, in particular chips, to a printed circuit board. The device comprises a conveyor means for picking up the chips in pick-up units and for transporting the picked-up chips to a first transfer position. The conveyor means has a conveyor chain and a rotatable sprocket wheel, which engage with each other. The device further comprises a rotatable fastening tool with deposit heads for picking up the chips at the first transfer position. The fastening tool is further set up to transport the picked-up chips to a second transfer position by means of a rotary movement, whereby they are turned over.

[0012] JP H02-193 813 A refers to a device for picking up and turning electronic components that are inspected by testing devices. The device comprises a feed unit from which chip-like electronic components are removed by a first rotating body and arranged around its circumference. The electronic components are transported to a first transfer position by a rotary movement of the rotating body, whereby they are MB Automation GmbH & Co. KG -3 - 30A-168 210 turned about their longitudinal or transverse axis. The device further comprises a second rotating body, which picks up the removed electronic components at the first transfer position and transports them to a second transfer position. This involves further turning of the electronic components about their longitudinal or transverse axis. The device makes it possible to inspect different sides of the components.

[0013] Underlying problem

[0014] When picking up components from a substrate such as a wafer foil, the component may be damaged by the picking device, in particular by the picking tool. Such damage may include, for example, damage to the surface of the component due to the picking tool striking the surface of the component at too high a velocity. In addition, such damage can also include breakage or deformation of the component due to the component being lifted off the substrate too quickly. Adhesion between the component and the substrate causes the component to initially stick to the substrate. If the component is lifted too quickly, it may not have completely detached from the substrate when it is moved away from the substrate by the pick-up tool. This can lead to breakage of the component, especially in the case of components whose surface area is many times larger than the surface area of the pick-up tool.

[0015] The solution presented here is intended to enable improved, precise handling of components and their inspection at high throughput compared to the state of the art.

[0016] Proposed solution

[0017] The solution to the problem is achieved by the subject matter of the attached independent patent claims. The following solution is disclosed in terms of process and device aspects, whereby the device aspects also relate to the process and vice versa.

[0018] According to a first aspect, a method for picking up a component at a pick-up point in a component conveying device is provided. The component conveying device comprises at least one conveyor unit. The component conveying device further comprises at least one control unit. The at least one conveyor unit comprises at least one first component pick-up. The component pick-up is continuously movable at least along and against a pick-up direction. The control unit controls the movements of the at least one conveyor unit. The method comprises the following steps: i) moving the component pick-up from a resting position in the pick-up direction toward the pick-up location to a first intermediate position at a first velocity; MB Automation GmbH & Co. KG -4 - 30A-168 210 ii) moving the component pick-up from the first intermediate position in the pick-up direction to a second intermediate position at a second velocity; iii) moving the component pick-up from the second intermediate position in the pick-up direction to the pick-up point at a third velocity; iv) picking up the component with the component pick-up at the pick-up point; v) moving the component pick-up with the picked-up component in the opposite direction to the pick-up direction towards the resting position to a third intermediate position at a fourth velocity; vi) moving the component pick-up from the third intermediate position against the pick-up direction to a fourth intermediate position at a fifth velocity; vii) moving the component pick-up from the fourth intermediate position against the pick-up direction to the resting position at a sixth velocity.

[0019] The first velocity, the second velocity, the third velocity, the fourth velocity, the fifth velocity, and the sixth velocity are each in adjacent velocity ranges. The first velocity, the second velocity, the third velocity, the fourth velocity, the fifth velocity, and the sixth velocity increase and / or decrease at least in sections.

[0020] The first velocity range can be from about 0 mm / s to about 4000 mm / s. The second velocity range can be from about 3 mm / s to about 250 mm / s. The third velocity range can be from about 0 mm / s to about 3 mm / s. The fourth velocity range can be from about 0 mm / s to about -3 mm / s. The fifth velocity range can range from approximately -3 mm / s to approximately -250 mm / s. The sixth velocity range can range from approximately -4000 mm / s to approximately 0 mm / s. A negative velocity represents a movement of the component pick-up against the pick-up direction.

[0021] Adjacent velocity ranges are defined by velocity ranges that have at least one identical velocity value, so that when the movement of the component pick-up transitions from, for example, a first velocity in a first velocity range to a second velocity in a second velocity range, the transition and thus the movement of the component pickup is continuous. Adjacent velocity ranges do not exclude the possibility that one velocity range may be completely contained within another velocity range.

[0022] The first intermediate position can be a position at which a soft landing process starts. The soft landing represents a particularly gentle approach of the component MB Automation GmbH & Co. KG -5 - 30A-168 210 pick-up to the top of the component. This is achieved in particular by reduced velocity and acceleration values of the component pick-up from the first intermediate position onwards. The soft landing causes the component pick-up not to hit the surface of the component at too high a velocity and thereby damage it.

[0023] The first intermediate position can be preset in the controller. Alternatively or additionally, the first intermediate position can be determined depending on the component height and / or the distance between the resting position and the pick-up point.

[0024] The second intermediate position can be a position at which the component pick-up just touches the surface of the component.

[0025] The pick-up point can be a position at which the component pick-up is pressed against the surface of the component with a preset pressure. This causes a pick-up head of the component pick-up to be pressed against the surface of the component in such a way that a suction channel, which forms an opening in the pick-up head, is sealed airtight and the component can be sucked onto the component pick-up.

[0026] The third intermediate position can be a position at which the component picked up by the component pick-up begins to detach from the substrate. The third intermediate position can be located in the pick-up direction between the second intermediate position and the pick-up point.

[0027] Due to adhesion, the component lying on the substrate initially adheres to the substrate, so that the component does not detach from the substrate abruptly, i. e. evenly over the entire surface of the component, but rather detaches from the substrate gradually with a movement in the opposite direction to the pick-up direction and thus away from the substrate.

[0028] The fourth intermediate position can be a position at which the component picked up by the component pick-up has completely detached from the substrate.

[0029] The gradual detachment of the component is also referred to as peeling, so that the peeling process is completed at the fourth intermediate position. Analogous to the soft landing when the component pick-up moves toward the pick-up point, the movement in the opposite direction of the pick-up direction from the pick-up point to the fourth intermediate position is referred to as a soft start. MB Automation GmbH & Co. KG -6 - 30A-168 210

[0030] A substrate is defined here as any base on which the component is ready to be picked up by the component pick-up. The substrate can be, for example, a structured component stack or another component pick-up.

[0031] A maximum value of the first velocity can be greater than a maximum value of the second velocity. A maximum value of the second velocity can be greater than a maximum value of the third velocity. An amount of a maximum value of the sixth velocity can be greater than an amount of a maximum value of the fifth velocity. An amount of a maximum value of the fifth velocity can be greater than an amount of a maximum value of the fourth velocity.

[0032] The maximum value of the first velocity, which can be greater than the maximum value of the second velocity, and the maximum value of the second velocity, which can be greater than the maximum value of the third velocity, ensure, in particular, that the component pick-up approaches the component quickly while simultaneously making slow and gentle contact between the component pick-up and the component. This significantly reduces damage to the surface of the component caused by the component pick-up striking the surface of the component too quickly.

[0033] Due to the amount of the maximum value of the sixth velocity, which may be greater than the amount of the maximum value of the fifth velocity, and the amount of the maximum value of the fifth velocity, which may be greater than the amount of the maximum value of the fourth velocity, in particular a slow and gentle lifting of the component from the substrate can be ensured. This prevents damage to the component caused by lifting the component too quickly against the adhesion between the substrate and the component. The adhesion causes that the component initially sticks to the substrate and can only be detached from the substrate against the adhesive force.

[0034] The first velocity may be nearly constant, at least in sections. The first velocity may increase with a first acceleration, at least in sections. The first velocity may decrease at least in sections with a second acceleration. The first acceleration may range from approximately 0 mm / s2to approximately 150000 mm / s2. The second acceleration may range from approximately 0 mm / s2to approximately -150000 mm / s2. A negative acceleration hereby represents an acceleration of the component pick-up in the opposite direction to the direction of movement. A negative acceleration may, depending on the direction of movement of the component pick-up, i. e. depending on MB Automation GmbH & Co. KG -7 - 30A-168 210 whether the component pick-up has a positive or negative velocity, can lead to an increase or a decrease in the amount of velocity.

[0035] The second velocity may be nearly constant, at least in sections. The second velocity may decrease with a third acceleration, at least in sections. The third acceleration may range from approximately 0 mm / s2to approximately -4000 mm / s2.

[0036] The third velocity may be nearly constant, at least in sections. The third velocity may decrease with a fourth acceleration, at least in sections. The fourth acceleration may range from approximately 0 mm / s2to approximately -400 mm / s2.

[0037] The fourth velocity may be nearly constant, at least in sections. The fourth velocity may increase, at least in sections, with a fifth acceleration. The fifth acceleration may range from approximately 0 mm / s2to approximately -400 mm / s2.

[0038] The fifth velocity may be nearly constant, at least in sections. The fifth velocity may increase with a sixth acceleration, at least in sections. The sixth acceleration may range from approximately 0 mm / s2to approximately -4000 mm / s2.

[0039] The sixth velocity may be nearly constant, at least in sections. The sixth velocity may increase with a seventh acceleration, at least in sections. The sixth velocity may decrease with an eighth acceleration, at least in sections. The seventh acceleration may range from approximately 0 mm / s2to approximately -150000 mm / s2. The eighth acceleration can range from approximately 0 mm / s2to approximately 150000 mm / s2.

[0040] The component pick-up can be moved from the fourth intermediate position against the pick-up direction beyond the resting position to a fifth intermediate position.

[0041] The component pick-up can be moved from the fifth intermediate position in the pick-up direction to the resting position.

[0042] The conveyor unit may comprise at least one first sensor. The fourth intermediate position may be determined by means of the first sensor. At the fourth intermediate position, the component picked up by the component pick-up may be completely detached from the structured component stack. Determining the fourth intermediate position offers the advantage that complete detachment of the component from the structured component stack or the substrate can be detected. This prevents damage due to excessive velocity when the component has not yet been completely MB Automation GmbH & Co. KG -8 - 30A-168 210 detached. In addition, the velocity can be increased from the fourth intermediate position onwards, resulting in high throughput.

[0043] The first sensor can be designed as a force sensor or comprise a force sensor. The first sensor may be configured to measure a force counteracting the movement of the component pick-up. Determining the fourth intermediate position may include measuring the force counteracting the movement of the component pick-up from the pick-up point toward the resting position. The counteracting force may be approximately 0 N at the fourth intermediate position.

[0044] The first sensor may alternatively or additionally be formed as an imaging sensor or comprise an imaging sensor. The first sensor may be integrated into the component pick-up. The first sensor may be arranged outside the component pick-up.

[0045] The component pick-up may comprise at least one vacuum device. The component pick-up may comprise at least one pick-up head. The component pick-up may comprise at least one suction channel. The suction channel may be connected to the vacuum device. The suction channel may form an opening in the pick-up head.

[0046] A surface of the component may correspond to at least three times the cross-sectional area of the suction channel. Picking up the component at the pick-up point may comprise generating a vacuum by the vacuum device so that the component is sucked onto the pick-up head by the vacuum present in the suction channel.

[0047] In one variant, the pick-up head may be formed from a deformable material or comprise a deformable material. In one variant, the pick-up head may be formed from a metal or comprise a metal. In one variant, the pick-up head may be formed from a sintered material or comprise a sintered material. The pick-up head may also be formed electrically conductive. The elastomer may be formed electrically conductive.

[0048] The formation of an electrically conductive pick-up head reduces the likelihood of damage to the component due to electrostatic discharge.

[0049] The component pick-up can be guided linearly. Linear guidance offers the advantage that precise longitudinal movements of the component pick-up can be performed, in this case along and against the pick-up direction, allowing the component pick-up to be positioned exactly. The conveyor unit can have a first drive. The first drive can be set up to move the component pick-up along and against the pick-up direction. The MB Automation GmbH & Co. KG -9 - 30A-168 210 first drive can be an electric machine, in one variant. The electric machine can be a permanently excited electric machine. In one variant, the first drive can be integrated into the component pick-up.

[0050] The component pick-up can be mounted so that it can rotate axially, in one variant. Axial rotation describes the rotation about the longitudinal axis of the component pick-up, whereby the longitudinal axis of the component pick-up is defined as the axis along which the component pick-up is moved in or against the pick-up direction. The component pick-up may have a second drive that is designed to rotate the component pick-up axially. In one variant, the pick-up head may be mounted in the component pick-up so that it can rotate axially. The second drive may be designed to rotate the pick-up head axially. The axial rotatability of the component pick-up or the pick-up head offers the advantage that the component can be precisely aligned at the deposit point during deposit, which in turn facilitates subsequent inspection and further processing of the component. The second drive may be an electric machine.

[0051] The component pick-up may comprise a second sensor. The second sensor may be configured to detect a position of the component pick-up along the pick-up direction. The second sensor may be formed as a linear encoder or comprise a linear encoder, in one variant. In one variant, the second sensor may be formed as a contact sensor or comprise a contact sensor.

[0052] The component pick-up may comprise a third sensor. The third sensor may be formed to detect a rotation angle of the component pick-up or the pick-up head. The rotation angle represents the angle by which the component pick-up or the pick-up head is rotated axially. The third sensor may be formed as a rotary encoder or comprise a rotary encoder.

[0053] The component pick-up may comprise a fourth sensor. The fourth sensor may be set up to detect the negative pressure generated by the vacuum device within the suction channel and / or within the vacuum device.

[0054] The component pick-up may comprise a fifth sensor. The fifth sensor may be set up to detect a contact force of the component on the pick-up head. The contact force represents the force with which the component is sucked onto the pick-up head by the vacuum. Furthermore, the contact force represents the force with which the component pick-up is pressed onto the component when picking up the component. MB Automation GmbH & Co. KG -10 - 30A-168 210

[0055] The fifth sensor may be integrated into the pick-up head. The fifth sensor may be formed as a force sensor or comprise a force sensor.

[0056] The component conveying device may comprise at least one first imaging sensor. A first front surface of the component located at the pick-up point may be inspected by the first imaging sensor.

[0057] Inspecting here means examining a surface for existing defects.

[0058] The first imaging sensor may be formed as a camera or comprise a camera. Alternatively or additionally, the first imaging sensor may be formed as or comprise a camera with a particularly high imaging sharpness and a correspondingly low depth of field (DOF). Alternatively or additionally, the first imaging sensor may be formed as or comprise an automatic optical inspection (AOI) system. Alternatively or additionally, the first imaging sensor may be formed as or comprise a short-wave infrared (SWI) camera.

[0059] According to a second aspect, a method is provided for depositing a component at a deposit point in a component conveying device. The component conveying device comprises at least one conveyor unit. The component conveying device comprises at least one control unit. The at least one conveyor unit comprises at least one first component pick-up. The component receptacle is movable along and against a pickup direction. The control unit controls the movements of the at least one conveyor unit.

[0060] The method comprises the following steps: i) moving the component pick-up with the picked-up component from a resting position in the pick-up direction toward the deposit point to a first intermediate position at a first velocity; ii) moving the component pick-up from the first intermediate position in the pick-up direction to the deposit point at a second velocity; iii) depositing the component at the deposit point; iv) moving the component pick-up in against the pick-up direction towards the resting position to a second intermediate position at a third velocity; v) moving the component pick-up from the second intermediate position in the pick-up direction to the resting position at a fourth velocity. MB Automation GmbH & Co. KG -11 - 30A-168 210

[0061] The first velocity, the second velocity, the third velocity, and the fourth velocity are each in adjacent velocity ranges. The first velocity, the second velocity, the third velocity, and the fourth velocity increase and / or decrease at least in sections.

[0062] The first velocity range can comprise approximately 0 mm / s to approximately 4000 mm / s. The second velocity range can comprise approximately 0 mm / s to approximately 250 mm / s. The third velocity range can comprise approximately 0 mm / s to approximately -250 mm / s. The fourth velocity range can comprise approximately 0 mm / s to approximately -4000 mm / s. A negative velocity represents a movement of the component pick-up against the pick-up direction.

[0063] The first intermediate position can be a position at which a soft landing process starts. The soft landing represents a particularly gentle approach of the component pick-up with the picked-up component to the deposit point. This is achieved in particular by reduced velocity and acceleration values of the component pick-up from the first intermediate position onwards.

[0064] The first intermediate position can be preset in the controller. Alternatively or additionally, the first intermediate position can be determined depending on the component height and / or the distance between the resting position and the deposit point.

[0065] The second intermediate position can be a position at which the component pick-up has completely detached from the surface of the deposited component. The movement of the component pick-up from the deposit point to the second intermediate position is also referred to as a soft start.

[0066] A maximum value of the first velocity may be greater than a maximum value of the second velocity. An amount of a maximum value of the fourth velocity may be greater than an amount of a maximum value of the third velocity.

[0067] The maximum value of the first velocity, which may be greater than the maximum value of the second velocity, ensures that the component pick-up with the picked-up component approaches the deposit point quickly and that the component is deposited slowly and gently at the deposit point. This significantly reduces damage to the component caused by the component hitting the deposit point too quickly.

[0068] The amount of the maximum value of the fourth velocity, which may be greater than the amount of the maximum value of the third velocity, ensures, in particular, that MB Automation GmbH & Co. KG -12 - 30A-168 210 the component pick-up is released slowly and gently from the deposited component. This prevents damage to the component caused by the component pick-up moving too quickly in conjunction with possible adhesion between the component pick-up and the component.

[0069] The component conveying device may comprise at least a first imaging sensor. A second front surface of the component located on the component pick-up may be inspected by the first imaging sensor.

[0070] The first imaging sensor may be formed as a camera or comprise a camera. Alternatively or additionally, the first imaging sensor may be formed as or comprise a camera with a particularly high imaging sharpness and an associated low depth of field (DOF). Alternatively or additionally, the first imaging sensor may be formed as or comprise an automatic optical inspection (AOI) system. Alternatively or additionally, the first imaging sensor may be formed as or comprise a short-wave infrared camera (SWI camera).

[0071] According to a third aspect, a method for inspecting components in a component conveying device is provided. The component conveying device comprises at least one control unit. The component conveying device further comprises at least one component inspection unit. The component conveying device comprises at least one first imaging sensor. The component inspection unit comprises at least one first plate rotatable about a first axis of rotation. The component inspection unit comprises at least one component pick-up arranged radially outside the first plate and rotatable about a second axis of rotation. The control unit controls the rotational movement of the at least one first plate. The control unit controls the rotational movement of the at least one component pick-up.

[0072] The method comprises the following steps:

[0073] - picking up the component with the component pick-up at a pick-up position,

[0074] - rotating the first plate through a first predetermined angle so that the component located in the component pick-up is at a first inspection position,

[0075] - inspecting a first side surface of the component located in the first inspection position by the first imaging sensor, MB Automation GmbH & Co. KG -13 - 30A-168 210

[0076] - rotating the component pick-up through a second predetermined angle so that a second side surface of the component can be inspected by the first imaging sensor,

[0077] - inspecting the second side surface of the component by the first imaging sensor,

[0078] - rotating the first plate by a third predetermined angle so that the component located in the component pick-up is at a first deposit position.

[0079] The first imaging sensor may be formed as a camera or comprise a camera. Alternatively or additionally, the first imaging sensor may be formed as or comprise a camera with a particularly high image sharpness and a correspondingly low depth of field (DOF). Alternatively or additionally, the first imaging sensor may be formed as or comprise an automatic optical inspection (AOI) system. Alternatively or additionally, the first imaging sensor may be formed as or comprise a short-wave infrared (SWI) camera.

[0080] The component conveying device may comprise a second imaging sensor. The second imaging sensor may be formed as a camera or comprise a camera. Alternatively or additionally, the second imaging sensor may be formed as a camera with a particularly high image sharpness and an associated shallow depth of field (DOF) or comprise such a camera. Alternatively or additionally, the second imaging sensor may be formed as or comprise an automatic optical inspection (AOI) system. Alternatively or additionally, the second imaging sensor may be formed as or comprise a short-wave infrared camera (SWI camera).

[0081] The component conveying device may comprise a third imaging sensor. The first plate may be rotated by a fourth predetermined angle so that the component located in the component pick-up is at a second inspection position. A third side surface of the component located at the second inspection position may be inspected by the third imaging sensor.

[0082] The component pick-up can be rotated by a second predetermined angle so that a fourth side surface of the component can be inspected by the third imaging sensor. The fourth side surface of the component can be inspected by the third imaging sensor.

[0083] The third imaging sensor may be formed as a camera or comprise a camera. Alternatively or additionally, the third imaging sensor may be formed as or comprise a MB Automation GmbH & Co. KG -14 - 30A-168 210 camera with a particularly high image sharpness and an associated shallow depth of field (DOF). Alternatively or additionally, the third imaging sensor may be formed as an automatic optical inspection system (AOI system) or comprise such a system. Alternatively or additionally, the third imaging sensor may be formed as a short-wave infrared camera (SWI camera) or comprise such a camera.

[0084] A first front surface of the component can be inspected by the second imaging sensor at the pick-up position. In one variant, the first front surface of the component can be inspected by the second imaging sensor at the first inspection position. In one variant, the first front surface of the component can be inspected by the second imaging sensor at the second inspection position.

[0085] According to a fourth aspect, a component conveying device is provided. The component conveying device is set up and configured to perform the methods of the preceding aspects. The component conveying device comprises at least a first conveyor unit. The component conveying device comprises at least one second conveyor unit. The component conveying device comprises at least one control unit. The component conveying device comprises at least one component inspection unit. The component inspection unit is arranged in a conveying direction between the first conveyor unit and the second conveyor unit. The first conveyor unit comprises at least one first component pick-up. The first component pick-up is movable at least along and against a pick-up direction. The first component pick-up is movable at least along and against a conveying direction. The first conveyor unit is designed and configured to pick up a component from a structured component stack. The first conveyor unit is set up and configured to transport the picked-up component along the conveying direction. The first conveyor unit is further set up and configured to transfer the picked-up component to a second component pick-up of the component inspection unit located at a pick-up position. The component inspection unit comprises at least one first plate rotatable about a first axis of rotation. The component inspection unit comprises at least the second component pick-up, which is arranged radially outside at the first plate and is rotatable about a second axis of rotation. The second conveyor unit comprises at least one third component pick-up. The third component pick-up can be moved at least along and against a pick-up direction. The third component pick-up can be moved at least along and against a conveying direction. The second conveyor unit is set up and configured to pick up the component from the at least one second component pick-up at a deposit position. The second conveyor unit is set up and configured to transport the picked-up component along the conveying direction. The second conveyor unit is set up and configured to place the picked-up MB Automation GmbH & Co. KG -15 - 30A-168 210 component on a deposit plate (P). The control unit is set up and configured to control the movements of the first conveyor unit. The control unit is set up and configured to control the movements of the second conveyor unit. The control unit is set up and configured to control the movements of the component inspection unit.

[0086] The first axis of rotation and the second axis of rotation can run parallel to each other.

[0087] Brief description of the drawings

[0088] Further details, features, advantages and effects of the arrangements and procedures described herein are apparent from the following description of currently preferred variants and from the drawings. The drawings show:

[0089] Fig. l a schematic side view of a component conveying device;

[0090] Fig. 2 a schematic top view of a component inspection device of the component conveying device according to Fig. 1;

[0091] Figs. 3a-3d a schematic side view of a component pick-up of a conveyor unit that picks up a component from a pick-up point;

[0092] Figs. 4a & 4b schematically the movement of the component pick-up when picking up a component;

[0093] Figs. 5a & 5b schematically the velocity profile of the component pick-up when picking up the component;

[0094] Fig. 6 schematically the movement of the component pick-up when picking up a component;

[0095] Figs. 7a & 7b schematically the movement of the component pick-up when the component is being deposited;

[0096] Figs. 8a & 8b schematically show the velocity curve of the component pick-up when the component is being deposited.

[0097] Detailed description of the drawings MB Automation GmbH & Co. KG -16 - 30A-168 210

[0098] In the following description, the definition applies that the directions x, y, z shown in the figures form an orthogonal coordinate system, i. e., the direction x is orthogonal to the direction y and to the direction z, and the direction y is orthogonal to the direction z. Furthermore, the directions x and y span a horizontal plane and the direction z forms the vertical to the horizontal plane. In the figures, the height of a component is defined by its extension in the z direction, its length by its extension in the x direction, and its width by its extension in the y direction. A component is considered to be arranged above another component if the component is arranged behind the other component when viewed in the z-direction. All proportions and dimensions of the components shown in the figures are not to scale. Individual components may be shown greatly enlarged. This is for the sake of clarity only and does not limit the subject matter of the present disclosure.

[0099] In Fig. 1, a component conveying device 100 for conveying and inspecting components B is schematically shown.

[0100] The components B can be, for example, dies. These are individual, unencapsulated pieces of a semiconductor wafer. Unencapsulated here means that the dies have not yet been installed in a housing or mounted on a circuit carrier. The dies can also be referred to as "chips" or "bare chips."

[0101] However, the components B can also be complete semiconductor wafers. The semiconductor wafers have not yet been divided into individual dies.

[0102] The component conveying device 100 comprises a first conveyor unit 200, a second conveyor unit 400, a component inspection unit 300, and a control unit ECU. In the embodiment shown, the component inspection unit 300 is arranged in the conveying direction F between the first transport unit 200 and the second transport unit 400. The conveying direction F also represents the x-direction here.

[0103] The first conveyor unit 200 comprises two component pick-ups 220. Alternatively, the first conveyor unit 200 may also have exactly one component pick-up 220 or more than two component pick-ups 220. The two component pick-ups 220 shown here are connected to a base plate 210 of the first conveyor unit 200 and can be moved relative to the base plate 210 along and against the conveying direction F. In addition, the two component pick-ups 220 can be moved along and against a pick-up direction A. The pick-up direction A runs opposite to the z-direction. MB Automation GmbH & Co. KG -17 - 30A-168 210

[0104] The base plate 210 of the first conveyor unit 200 can have any structural design on which the component pick-ups 220 can be movably arranged. For example, the first base plate 210 can have several rails to which the component pick-ups 220 are attached. The two component pick-ups 220 can be moved independently of each other. The movements are controlled by the control unit ECU.

[0105] In the embodiment shown here, the second conveyor unit 400 comprises three component pick-ups 420 which are connected to a base plate 410 of the second conveyor unit 400 and can be moved relative to the base plate 410 along and against the conveying direction F. In addition, the three component pick-ups 420 can be moved along and against the pick-up direction A. The second conveyor unit 400 may be formed identical to the first conveyor unit 200.

[0106] The component inspection unit 300 comprises at least one first plate 310 rotatable about a first axis of rotation 301. The component inspection unit 300 further comprises a plurality of component pick-ups 320 arranged radially outwardly on the first plate 310, each of which is rotatable about a second axis of rotation 302. The first axis of rotation 301 and the second axis of rotation 301 run parallel to each other in the z-direction. An exemplary structure of a component inspection unit 300 is shown in Fig. 2 in a top view.

[0107] The first conveyor unit 200 is designed to pick up a component B from a structured component stack U, transport it along the conveying direction F, and transfer it to a component pick-up 320 of the component inspection unit 300. The component B lies in an x-y plane on the structured component stack U.

[0108] The component inspection unit 300 is set up to inspect the component B. The inspection of the component B by the component inspection unit 300 is explained in more detail in the following description of Fig. 2.

[0109] The second conveyor unit 400 is set up to pick up component B with the component pick-up 420 from the component pick-up 320 of the component inspection unit 300, transport it along the conveying direction F, and place it on a deposit plate P.

[0110] The component conveying device 100 further comprises a first imaging sensor KI, which is set up to inspect a first front surface S5 of the component B on the structured component stack U. The first front surface S5 represents the upper side of the component B. The first imaging sensor KI can be, for example, a camera, in MB Automation GmbH & Co. KG -18 - 30A-168 210 particular a dot camera. Alternatively or additionally, the first imaging sensor KI can be an automatic optical inspection (AOI) system. An AOI describes a system that uses image processing methods to detect defects in production or, in this case, defects in components. Alternatively or additionally, the first imaging sensor KI may also comprise a short-wave infrared camera (SWI) or be formed as a short-wave infrared camera. The first imaging sensor KI may be arranged outside the first conveyor unit 200. Alternatively, the first imaging sensor KI may be arranged in or on the base plate 210 or in or on the component pick-up 220.

[0111] The component conveying device 100 has a second imaging sensor K2, which is set up to check the first front surface S5 of the component B after the component B has been placed on the component pick-up 320 of the component inspection unit 300 and to check the alignment of the component B with respect to the component pickup 320. The second imaging sensor K2 can check the alignment of the component both in an x-y plane and in a z direction. The second imaging sensor K2 can be formed analogously to the first imaging sensor KI as a camera, in particular a dot camera, an AOI system and / or an SWI camera, or comprise a camera, in particular a dot camera, an AOI system and / or an SWI camera. In further embodiments, the second imaging sensor K2 may be configured to check the first front surface S5 and the alignment of the component B at the first inspection position 312 and / or at the second inspection position 314, as they are shown in Fig. 2.

[0112] The component conveying device 100 has a third imaging sensor K3 that is configured to check a second front surface S6 of the component B after the component B has been picked up from the component pick-up 320 of the component inspection unit 300 by the component pick-up 420. The second front surface S6 of the component represents the underside of the component B. In the embodiment shown here, the third imaging sensor K3 is formed as a camera with a particularly high image sharpness and a correspondingly low depth of field (DOF), but, analogous to the first imaging sensor KI, it can be formed as a camera, in particular a dot camera, an AOI system and / or an SWI camera, or comprise a camera, in particular a dot camera, an AOI system and / or an SWI camera.

[0113] The component conveying device 100 has a fourth imaging sensor K4, which is set up to check the second front surface S6 of the component B after the component B has been picked up from the component pick-up 320 of the component inspection unit 300 by the component pick-up 420. The fourth imaging sensor K4 is formed to be movable in the x and y directions and as an infrared camera. However, the fourth MB Automation GmbH & Co. KG -19 - 30A-168 210 imaging sensor K4 can be formed analogously to the first imaging sensor KI as a camera, in particular a dot camera, an AOI system and / or an SWI camera, or comprise a camera, in particular a dot camera, an AOI system and / or an SWI camera.

[0114] The component conveying device 100 has a fifth imaging sensor K5, which is designed to check the first front surface S5 and the deposit position and orientation of the component B on the deposit plate P after the component B has been placed on the deposit plate P by the component pick-up 420. The fifth imaging sensor K5 is formed as a dot camera, but, analogous to the first imaging sensor KI, it can be formed as an AOI system and / or an SWI camera or comprise an AOI system and / or an SWI camera.

[0115] The component conveying device 100 has a sixth imaging sensor K6, which is designed to check the first front surface S5 as well as the deposit position and the alignment of the component B on the deposit plate P after the component B has been placed on the deposit plate P by the component pick-up 420 and the deposit plate P has been transported further in the direction of a further processing station not shown here. The sixth imaging sensor K6 is formed as a dot camera, but, analogous to the first imaging sensor KI, it can be formed as an AOI system and / or an SWI camera or comprise an AOI system and / or an SWI camera.

[0116] In Fig. 2, a component inspection unit 300 of the component conveying device 100 according to Fig. 1 in a top view is schematically shown.

[0117] The component inspection unit 300 has a first plate 310 that can rotate around a first axis of rotation 301 running in the z-direction. In the embodiment shown here, the first plate 310 has a round core area and arms extending radially outward, distributed evenly along the circumference of the round core area. However, the first plate 310 is not limited to this design. Alternatively, the first plate 310 can be formed, for example, as a circular plate or a ring. Other expert designs of a first plate 310 are possible. The component inspection unit 300 further has eight component pick-ups 320, which are arranged radially outward on the arms of the first plate 310. The component pick-ups 320 are each rotatable about a second axis of rotation 302 extending in the z-direction. The rotational movements of the first plate 310 and the component pick-ups 320 are controlled by the control unit ECU.

[0118] The component inspection unit 300 also has a seventh imaging sensor K7 and an eighth imaging sensor K8. The seventh imaging sensor K7 is set up to inspect a first MB Automation GmbH & Co. KG -20 - 30A-168 210 side surface SI and a second side surface S2 of the component at a first inspection position 312. The eighth imaging sensor K8 is designed to inspect a third side surface S3 and a fourth side surface S4 of the component at a second inspection position 314. In the embodiment shown, the seventh imaging sensor K7 and the eighth imaging sensor K8 are formed as short-wave infrared sensors (SWI), but, analogous to the first imaging sensor KI, they can be formed as a camera, in particular a dot camera, and / or an AOI system, or comprise a camera, in particular a dot camera, and / or an AOI system.

[0119] The following describes in more detail the process of inspecting a component B in the component inspection unit 300.

[0120] Component B is transferred from the component pick-up 220 of the first conveyor unit 200, which is not shown here, to the component pick-up 320 of the component inspection unit 300, which is located at position 311. After component B is picked up at position 311, the first front surface S5, i. e. the top side, of component B is inspected by the second imaging sensor K2 shown in Fig. 1.

[0121] The first plate 310 is then rotated by a first predetermined angle so that the component pick-up 320 carrying the component B is located at the first inspection position 312. The component B is positioned on the component pick-up 320 in such a way that a first side surface SI of the component B forms the radially outermost side of the component B with respect to the first axis of rotation 301 of the first plate 310, and this first side surface SI is approximately tangent to a circle running around the first axis of rotation 301.

[0122] The first side surface SI of component B is inspected by the seventh imaging sensor K7. The component pick-up 320 carrying the component B is then rotated by approximately 180° about the second axis of rotation 302, so that the second side surface S2 opposite the first side surface SI now forms the radially outermost side of the component B. The second side surface S2 is inspected by the seventh imaging sensor K7 in a next step.

[0123] The first plate 310 is then rotated again by the first predetermined angle so that the component pick-up 320 carrying the component B is located at position 313. At position 313, the component pick-up 320 is rotated by approximately 90° so that a third side surface S3 now forms the radially outermost side of the component B. MB Automation GmbH & Co. KG -21 - 30A-168 210

[0124] In a next step, the first plate 310 is rotated again by the first predetermined angle so that the component pick-up 320 carrying the component B is located at the second inspection position 314. The two rotations of the first plate 310 through the first predetermined angle, so that the component pick-up 320 is moved from the first inspection position 312 to the second inspection position 314, and the rotation of the component pick-up 320 at position 313 can be performed in a single operation. It is not absolutely necessary to interrupt the rotational movement of the first plate 310 at position 313.

[0125] At the second inspection position 314, the third side surface S3 of the component B is inspected by the eighth imaging sensor K8. The component pick-up 320 is then rotated by approximately 180° so that the fourth side surface S4 opposite the third side surface S3 now forms the radially outermost side of the component B. In a next step, the fourth side surface S4 is inspected by the eighth imaging sensor K8.

[0126] The first plate 310 is rotated once more by the first predetermined angle so that the component pick-up 320 carrying the component B is located at the deposit position 315, where the component B is picked up by the component pick-up 420 of the second conveyor unit 400.

[0127] In the embodiment shown here, positions 311 to 315 are arranged around the first plate 310 at an identical angular distance corresponding to an angular distance between the arms of the first plate 310. However, the component inspection unit 300 is not limited to this arrangement.

[0128] The component inspection unit 300 may have additional imaging sensors and additional inspection positions in addition to the seventh imaging sensor K7 and the eighth imaging sensor K8, so that, for example, only one side surface of the component B is inspected per inspection position. This increases the throughput of the components B to be inspected, since a total of four components B can be inspected simultaneously.

[0129] Figs. 3a to 3d show the picking up of a component B by a component pick-up 220 or 420 of the first or second conveyor unit 200 or 400 in a schematic side view. Figs. 3a to 3d show in particular the picking up of a component B from the structured component stack U. However, the steps described below apply analogously to the picking up of the component B from the component pick-up 320 of the component inspection unit 300 or another substrate. MB Automation GmbH & Co. KG -22 - 30A-168 210

[0130] In the embodiment shown here, the component pick-up 220 / 420 has a vacuum device 221, a pick-up head 224, and a suction channel 222, which is connected to the vacuum device 221 and forms an opening in the pick-up head 224. The opening in the pick-up head 224 has a first cross-sectional area Al. The vacuum device 221 is set up to generate a vacuum in the suction channel 222 and thereby suck a component B onto the pick-up head 224.

[0131] The component pick-up 220 / 420 is guided linearly, i. e. it can be moved linearly along and against the pick-up direction. Furthermore, in the embodiment shown here, the component pick-up 220 / 420 is mounted axially rotatable. Due to the axially rotatable bearing, the component pick-up 220 / 420 can be rotated about its longitudinal axis, which is not explicitly shown here for reasons of clarity and runs coaxially to the suction channel 222. This enables precise alignment of the pick-up head 224 with the component B to be picked-up and, in the case of a component B that has already been picked-up, alignment of the component B with the deposit location.

[0132] To move the component pick-up 220 / 420 along and against the pick-up direction A, the component pick-up 220 / 420 has a first drive in the form of an electric machine. To rotate the component pick-up 220 / 420 about the longitudinal axis, the component pick-up 220 / 420 has a second drive in the form of an electric machine. The first electric machine and the second electric machine are not explicitly shown.

[0133] The component pick-up 220 / 420 also comprises sensors, not shown here, for detecting the position of the component pick-up 220 / 420 along the pick-up direction and the angle of rotation of the axial rotation of the component pick-up 220 / 420 about the longitudinal axis.

[0134] The pick-up head 224 is made of an electrically conductive, deformable material, such as an elastomer. The deformable material of the pick-up head 224 reduces the likelihood of damage to the component B by the pick-up head 224 when the component B is picked-up. The electrical conductivity of the pick-up head 224 reduces the likelihood of damage to component B due to electrostatic discharge.

[0135] In Fig. 3a, component B is located on the structured component stack U and the component pick-up 220 / 420 moves along the pick-up direction A toward component B. The upper side of component B corresponding to the first front surface S5 has a MB Automation GmbH & Co. KG -23 - 30A-168 210 surface area A2 that is at least three times the cross-sectional area Al of the opening in the pick-up head 224.

[0136] The second intermediate position z2 shown in Fig. 3a represents a position in the z- direction at which the underside of the pick-up head 224 of the component pick-up 220 / 420, when it is at the second intermediate position z2, just touches the upper side and thus the first front surface S5 of component B.

[0137] The suction of the component B to the pick-up head 224 requires that the suction channel 222 in the pick-up head 224 be sealed airtight by the first front surface S5.

[0138] For this purpose, the component pick-up 220 / 420 is moved further in the pick-up direction A to a position z3, as shown in Fig. 3b, so that the underside of the pick-up head 224 would theoretically be located below the first front surface S5 and thus within component B if no component B were lying on the structured component stack U. The underside of the pick-up head 224 is thus pressed against the component B with a preset pressure, so that the deformable material of the pick-up head 224 deforms and conforms to the component B, so that the suction channel 222 be sealed airtight.

[0139] Position z3 is also referred to below as the pick-up position or pick-up point.

[0140] In a next step, the vacuum unit 221 generates a vacuum in the suction channel 222, which is now sealed airtight by component B, so that component B is sucked onto the pick-up head 224.

[0141] Fig. 3c shows the component pick-up 220 / 420 after it has been moved in the opposite direction to the pick-up direction A from the pick-up point z3 to a third intermediate position z6.

[0142] The third intermediate position z6 represents a position at which the underside of the pick-up head 224 has been moved away from the pick-up point z3 in the opposite direction to the pick-up direction A to such an extent that component B begins to detach from the structured component stack U. Due to adhesion, the component B lying on the structured component stack U initially adheres to the structured component stack U, so that the component B does not detach abruptly, i. e. evenly over the entire surface of the component B, from the structured component stack, but rather detaches successively during a movement in the opposite direction to the pick-up MB Automation GmbH & Co. KG -24 - 30A-168 210 direction A, and thus away from the structured component stack U. The successive detachment of component B is also referred to as peeling.

[0143] The adhesion is in particular a mechanical adhesion and is achieved by form-fitting anchoring of microscopically small pores and recesses between the surface of component B and the surface of the structured component stack U.

[0144] Fig. 3d shows the component pick-up 220 / 420 with the sucked-on component B at a fourth intermediate position z5. The fourth intermediate position z5 represents the position of the underside of the pick-up head 224 at which the component B has detached from the structured component stack U over its entire surface. The peeling process is complete.

[0145] The component pick-up 220 / 420 also has a first sensor 225 that is set up to determine the fourth intermediate position z5.

[0146] Determining the fourth intermediate position z5 offers the advantage that complete detachment of the component B from the structured component stack U can be detected. This prevents damage due to excessive movement of the component B that has not yet been completely detached. In addition, the velocity can be increased again from the fourth intermediate position z5, so that a high throughput in the conveyance and inspection of the components B continues to be achieved.

[0147] The first sensor 225 is designed as a force sensor that is set up to measure a force counteracting the movement of the component pick-up 220 / 420. At the fourth intermediate position z5, the force counteracting the movement is almost 0 N.

[0148] Fig. 4a schematically shows the temporal sequence of movements of the component pick-up 220 / 420 in the z-direction over time from the resting position zO along the pick-up direction A to the pick-up point z3 with a soft landing (curve 1) and without a soft landing (curve 2).

[0149] Fig. 4b schematically shows the temporal sequence of movements of the component pick-up 220 / 420 in the z-direction over time from the pick-up point z3 in the opposite direction to the pick-up direction A to the resting position zO with a soft start (curve 3) and without a soft start (curve 4). MB Automation GmbH & Co. KG -25 - 30A-168 210

[0150] Figs. 5a and 5b schematically show the temporal sequence of velocity of a component pick-up 220 / 420 during a movement with a soft landing and a soft start as in Figs. 4a (curve 1) and 4b (curve 3).

[0151] The resting position zO represents the position in the z-direction at which the underside of the pick-up head 224 of the component pick-up 220 / 420 is located when the component pick-up is moved along or against the conveying direction F or when the component conveying device 100 is not in operation.

[0152] The mounting point z3 represents, analogous to the pick-up point z3 shown in Figs. 3a to 3d, the position at which the underside of the pick-up head 224 of the component mount 220 / 420 is pressed against the component B with a preset pressure, so that the pick-up head 224 deforms and conforms to the component B and the suction channel 222 is sealed airtight.

[0153] The following describes the temporal sequence of movement and velocity of the component pick-up 220 / 420, as shown in Figs. 4a (curve 1) and 5a, during the movement from the resting position zO along the pick-up direction A to the pick-up point z3.

[0154] At a point in time 11, the component pick-up 220 / 420 is moved from the resting position zO along the pick-up direction A at a first velocity vl to a first intermediate position zl. The component pick-up 220 / 420 reaches the first intermediate position zl at a point in time 12. The first velocity vl is not constant during the movement, but lies within a first velocity range vll, which comprises approximately 0 mm / s to approximately 4000 mm / s. In particular, the component pick-up 220 / 420 is first accelerated with a first acceleration al to the maximum velocity of the first velocity range vll, i. e. to approximately 4000 mm / s, and then immediately decelerated with a second acceleration a2. In the embodiment shown here, the first acceleration al has values of approximately 0 mm / s2to approximately 150000 mm / s2and the second acceleration a2 has values of approximately 0 mm / s2to approximately - 150000 mm / s2.

[0155] The first intermediate position zl represents the position from which the component pick-up 220 / 420 begins the soft landing. The soft landing represents a particularly gentle approach of the underside of the pick-up head 224 of the component pick-up 220 / 420 to the first front surface S5 located at the second intermediate position z2 and thus to the upper side of the component B. This is achieved in particular by MB Automation GmbH & Co. KG -26 - 30A-168 210 lower velocity and acceleration values of the component pick-up 220 / 420 in contrast to the first velocity vl.

[0156] The component pick-up 220 / 420, and in particular the underside of the pick-up head 224, reaches the first intermediate position zl at a velocity vl that corresponds to a maximum value of the second velocity range v21. In the example shown, the second velocity range v21 covers approximately 3 mm / s to approximately 250 mm / s and thus a maximum value of 250 mm / s.

[0157] The component pick-up 220 / 420 is then moved along the pick-up direction A to a second intermediate position z2 at a second velocity v2, which lies within the second velocity range v21. The component pick-up 220 / 420 reaches the second intermediate position z2 at a point in time 13.

[0158] The second intermediate position z2 represents a position in the z direction at which the underside of the pick-up head 224 of the component pick-up 220 / 420 just touches the upper side and thus the first front surface S5 of the component B.

[0159] The distance between the first intermediate position zl and the second intermediate position z2 is also referred to as the soft landing distance dl.

[0160] In a first section of the movement from the first intermediate position zl to the second intermediate position z2, the component pick-up 220 / 420 is decelerated with a third acceleration a3 until the second velocity v2 assumes a minimum value of the second velocity range v21, i. e. approximately 3 mm / s. The third acceleration a3 has a value of approximately 0 mm / s2to approximately -4000 mm / s2. In a second section of the movement, the component pick-up 220 / 420 is moved to the second intermediate position z2 at a constant velocity v2, which corresponds to the minimum value of the second velocity range v21.

[0161] The minimum value of the second velocity range v21, at which the component pickup 220 / 420 reaches the second intermediate position z2, corresponds to a maximum value of a third velocity range v31. In the example shown, the third velocity range v31 comprises approximately 0 mm / s to approximately 3 mm / s.

[0162] The component pick-up 220 / 420 is then moved along the pick-up direction A to the pick-up point z3 at a third velocity v3, which lies within the third velocity range v31. The component pick-up 220 / 420 reaches the pick-up point z3 at a point in time 14. MB Automation GmbH & Co. KG -27 - 30A-168 210

[0163] In a first section of the movement from the second intermediate position z2 to the pick-up point z3, the component pick-up 220 / 420 is moved toward the pick-up point z3 at a constant third velocity v3, which corresponds to a maximum value of the third velocity range v31. In doing so, the underside of the pick-up head 224 of the component pick-up 220 / 420 is pressed against the first front surface S5 of the component B, so that the pick-up head 224 deforms and conforms to the component B and the suction channel 222 is sealed airtight. In a second section of the movement, the component pick-up 220 / 420 is decelerated with a fourth acceleration a4 so that the third velocity v3 assumes a minimum value of the third velocity range v31, i. e. approximately 0 mm / s, when it has reached the pick-up point z3. The fourth acceleration a4 has a value of approximately 0 mm / s2to approximately -400 mm / s2.

[0164] The movement curve of the component pick-up 220 / 420 without a soft landing, i. e. without a first intermediate position zl, is shown in curve 2 of Fig. 4a. The movement curve differs from the movement curve shown in curve 1 in particular due to the absence of the first intermediate position 1 and thus due to increased deceleration of the component pick-up 220 / 420 and a slow and gentle approach to the surface of the component B at the second intermediate position z2. This can lead in particular to damage to the surface of component B and thus to the destruction of component B.

[0165] The following describes the movement and velocity curve of the component pick-up 220 / 420, as shown in Figs. 4b (curve 3) and 5b, during the movement from the pickup point in the opposite direction to the pick-up direction A to the resting position zO.

[0166] At a point in time 31, the component pick-up 220 / 420 is moved from the pick-up point z3 in the opposite direction to the pick-up direction A to a third intermediate position z6 at a fourth velocity v4. The component pick-up 220 / 420 reaches the third intermediate position z6 at a point in time 32. The fourth velocity v4 is not constant during the movement, but lies in a fourth velocity range v41, which comprises approximately 0 mm / s to -3 mm / s. The negative velocity value of the fourth velocity range v41 indicates movement in the opposite direction to the pick-up direction A. The component pick-up 220 / 420 is accelerated with a fifth acceleration a5, whereby the fifth acceleration a5 can have a value of approximately 0 mm / s2to approximately -400 mm / s2. MB Automation GmbH & Co. KG -28 - 30A-168 210

[0167] The third intermediate position z6 represents the position at which the underside of the pick-up head 224 has been moved so far away from the pick-up point z3 in the opposite direction to the pick-up direction A that the component B begins to detach from the structured component stack U and the peeling process starts. As shown in Fig. 4b, the third intermediate position z6 lies in the z-direction below the second intermediate position z2 and thus below the upper side of the component B.

[0168] The component pick-up 220 / 420 is then moved in the opposite direction to the pickup direction A to a fourth intermediate position z5 at a fifth velocity v5, which lies in a fifth velocity range v51. The component pick-up 220 / 420 reaches the fourth intermediate position z5 at a point in time 33. In the example shown, the fifth velocity range v51 comprises approximately -3 mm / s to approximately -250 mm / s.

[0169] In a first section of the movement from the third intermediate position z6 to the fourth intermediate position z5, the component pick-up 220 / 420 is moved toward the fourth intermediate position z5 at a constant fifth velocity v5, which corresponds to a minimum value of the fifth velocity range v51, i. e. approximately -3 mm / s2. In a second section of the movement, the component pick-up 220 / 420 is accelerated with a sixth acceleration a6 so that the fifth velocity v5 assumes a maximum value of the fifth velocity range v51, i. e. approximately -250 mm / s.

[0170] At the fourth intermediate position z5, the peeling process and thus the soft start are complete and the component B has completely detached from the structured component stack U. The distance between the second intermediate position z2 and the fourth intermediate position z5 is also referred to as the peeling distance pl.

[0171] The component pick-up 220 / 420 is then moved from the fourth intermediate position z5 in the opposite direction to the pick-up direction A at a sixth velocity v6 to the resting position zO. The component pick-up 220 / 420 reaches the resting position at a point in time 34. The sixth velocity v6 is not constant during the movement, but lies within a sixth velocity range v61, which comprises approximately -4000 mm / s to 0 mm / s. In particular, the component pick-up 220 / 420 is first accelerated with a seventh acceleration a7 to the maximum velocity of the sixth velocity range v61, i. e. to -4000 mm / s, and then immediately decelerated with an eighth acceleration a8 in such a way that the sixth velocity v6 corresponds to the minimum value of the sixth velocity range v61, i. e. 0 mm / s, when the resting position zO is reached. In the embodiment shown here, the seventh acceleration a7 has values of approximately MB Automation GmbH & Co. KG -29 - 30A-168 210

[0172] 0 mm / s2to approximately -150000 mm / s2and the eighth acceleration a8 has values of approximately 0 mm / s2to approximately 150000 mm / s2.

[0173] The movement curve of the component pick-up 220 / 420 without a soft start, i. e. without a fourth intermediate position z5, is shown in curve 4 of Fig. 4b. The movement curve differs from the movement curve shown in curve 3 in particular due to the absence of the fourth intermediate position z5 and thus due to a slow movement of the component pick-up 220 / 420 until the component B has completely detached from the structured component stack U. Rather, in the movement curve shown in curve 4, the component pick-up 220 / 420 is accelerated directly to a maximum velocity. Due to the adhesion between the component B and the structured component stack U, this can lead to bending or breakage of the component B.

[0174] In Fig. 6, the movement curve of a component pick-up 220 / 420 from the resting position zO via the pick-up point z3 back to the resting position zO is shown. The movement curve differs from the movement curve shown in Fig. 4b (curve 3) in particular by an overshoot before the component pick-up 220 / 420 finally returns to the resting position zO after picking up component B at the pick-up point z3.

[0175] The component pick-up 220 / 420 is first moved, analogous to the movement shown in Fig. 4a, from the resting position zO to the first intermediate position zl from which the soft landing process then begins.

[0176] After picking up component B at pick-up point z3 and completing the peeling process at the fourth intermediate position z5, the component pick-up 220 / 420 is moved in the opposite direction to the pick-up direction A towards the resting position zO. In the embodiment shown here, the component pick-up 220 / 420 is moved by a first drive in the form of an electric machine. The electric machine has a control and regulation circuit or is controlled by a control and regulation circuit. Due to the high velocity of the component pick-up 220 / 420 and the control behavior of the control and regulation circuit, an overshoot occurs when the component pick-up 220 / 420 moves in the direction of the resting position zO. The component pick-up 220 / 420 is first moved beyond the resting position zO in the opposite direction to the pick-up direction A to a seventh intermediate position z7 before it is then moved along the pickup direction A to the resting position zO.

[0177] Such overshoots are typical control behavior of control and regulation circuits with fast response behavior and large changes in the setpoints, in this case the velocity. MB Automation GmbH & Co. KG -30 - 30A-168 210

[0178] In the embodiment shown here, the first intermediate position zl corresponds to the fourth intermediate position z5, so that in particular the soft landing distance dl and the peeling distance pl are identical. In addition, the movement curve shown here represents a symmetrical movement curve in that the component pick-up 220 / 420 has identical velocity and acceleration values when moving from the resting position zO to the pick-up point z3 as when moving from the pick-up point z3 to the resting position zO.

[0179] Figs. 7a and 7b schematically show the temporal movement curve of the component pick-up 220 / 420 in the z-direction when a component B is placed on a deposit plate P or a component pick-up 320 of the component inspection unit 300.

[0180] Fig. 7a schematically shows the movement of the component pick-up 220 / 420 in the z-direction over time from the resting position zO along the pick-up direction A to the deposit position z4 with a soft landing (curve 5) and without a soft landing (curve 6).

[0181] Fig. 7b schematically shows the movement of the component pick-up 220 / 420 in the z-direction from the deposit position z4 in the opposite direction to the pick-up direction A to the resting position zO with a soft start (curve 7) and without a soft start (curve 8).

[0182] Figs. 8a and 8b schematically show the velocity curve over time of a component pickup 220 / 420 with a movement curve with a soft landing and a soft start as in Figs. 7a (curve 5) and 7b (curve 7).

[0183] The following section first describes the movement curve shown in Figs. 7a (curve 5) and 8a and the velocity curve of the component pick-up 220 / 420 during movement from the resting position zO along the pick-up direction A to the deposit location z4.

[0184] At a point in time 51, the component pick-up 220 / 420 is moved from the resting position zO along the pick-up direction A to a first intermediate position zl at an initial velocity vlOO. The component pick-up 220 / 420 reaches the first intermediate position zl at a point in time 12. The first velocity vlOO is not constant during the movement, but lies within a first velocity range vlOl, which comprises approximately 0 mm / s to 1500 mm / s. In particular, the component pick-up 220 / 420 is first accelerated to the maximum velocity of the first velocity range vlOl, i. e. to 1500 mm / s, MB Automation GmbH & Co. KG -31 - 30A-168 210 and then immediately decelerated so that the first velocity vlOO at the first intermediate position zl has a maximum value of a second velocity range v201.

[0185] The first intermediate position zl represents the position from which the component pick-up 220 / 420 begins the soft landing. The soft landing represents a particularly gentle approach of the component pick-up 220 / 420 carrying the component B, and in particular the underside, and thus the second front surface S6 of component B, to the upper side of the deposit plate P located at the storage position z4 or the component pick-up 320 of the component inspection unit 300.

[0186] The distance between the first intermediate position zl and the deposit location z4 defines the soft landing distance d2.

[0187] The component pick-up 220 / 420 is then moved at a second velocity v200, which lies within the second velocity range v201, along the pick-up direction A to the deposit point z4, where the component B is deposited by switching off a vacuum in the suction channel 222. The component pick-up 220 / 420 reaches the deposit point at a point in time 53. The second velocity range v201 comprises approximately 0 mm / s to approximately 250 mm / s. The second velocity 200 is not constant throughout the movement, but decreases at least in sections, as shown in Fig. 8a.

[0188] The movement curve of the component pick-up 220 / 420 with the component B picked-up without a soft landing, i. e. without a first intermediate position zl, is shown in curve 6 of Fig. 7a. The movement curve differs from that shown in curve 5 in particular due to the absence of the first intermediate position zl and thus due to increased deceleration of the component pick-up 220 / 420 and a slow and gentle approach to the surface of the deposit plate P. This can lead in particular to damage to the component B, especially the underside of component B, due to an impact on the deposit plate P or the component pick-up 320 of the component inspection unit 300 that is too fast.

[0189] The following describes the movement and velocity curve of the component pick-up 220 / 420 shown in Figs. 7b (curve 7) and 8b during the movement from the deposit position z4 in the opposite direction to the pick-up direction A to the resting position zO.

[0190] At a point in time 71, the component pick-up 220 / 420 is moved at a third velocity v300 from the deposit location z4 in the opposite direction to the pick-up direction A MB Automation GmbH & Co. KG -32 - 30A-168 210 to a second intermediate position z5. The component pick-up 220 / 420 reaches the second intermediate position z5 at a point in time 72. The third velocity v300 is not constant during the movement, but lies within a third velocity range v301, which comprises approximately 0 mm / s to approximately -250 mm / s. The negative velocity value of the third velocity range v301 indicates the movement in the opposite direction to the pick-up direction A. During the movement from the deposit location z4 to the second intermediate position z5, the component pick-up 220 / 420 is accelerated at least in sections and moves at least in sections at a constant velocity.

[0191] The second intermediate position z5 represents the position at which the underside of the pick-up head 224 has been moved so far in the opposite direction to the pickup direction A, and thus away from the first front surface S5 of the deposited component B, that the underside of the pick-up head 224 has completely detached from the component B. During detachment of the pick-up head 224 from the top side and thus from the first front surface S5 of the component B, mechanical adhesion and thus a peeling process may occur during detachment, analogous to the detachment of the component B from the structured component stack U.

[0192] The component pick-up 220 / 420 is then moved at a fourth velocity v400, which lies in a fourth velocity range v401, in the opposite direction to the pick-up direction A to the resting position zO. The component pick-up 220 / 420 reaches the resting position zO at a point in time 73. In the example shown, the fourth velocity range v401 comprises approximately 0 mm / s to approximately -1500 mm / s. In particular, the component pick-up 220 / 420 is first accelerated to the maximum velocity of the fourth velocity range v401, i. e. to -1500 mm / s, and then immediately decelerated so that the fourth velocity v400 at the resting position zO has a minimum value of the fourth velocity range v401, i. e. 0 mm / s.

[0193] The movement curve of the component pick-up 220 / 420 without a soft start, i. e. without a second intermediate position z5, is shown in curve 8 of Fig. 7b. The movement curve differs from that shown in curve 7 in particular due to the absence of the second intermediate position z5 and thus due to a slow movement of the component pick-up 220 / 420 until the pick-up head 224 of the component pick-up 220 / 420 has completely detached from the component B. Rather, in the movement curve shown in curve 8, the component pick-up 220 / 420 is accelerated directly to a maximum velocity. This can lead in particular to damage to the surface of the component B due to adhesion between the component B and the pick-up head 224. MB Automation GmbH & Co. KG -33 - 30A-168 210

[0194] The variants of the device described above, their design and operating aspects, and the variants of the procedure serve only to provide a better understanding of the structure, functionality, and characteristics; they do not limit the disclosure to the embodiments. The figures are partly schematic. Essential characteristics and effects are sometimes shown significantly enlarged in order to clarify the functions, operating principles, technical designs, and features. Each functionality, each principle, each technical design, and each feature disclosed in the Figs, or in the text can be freely and arbitrarily combined with all claims, each feature in the text and in the other Figs., other functionalities, principles, technical designs, and features contained in or resulting from this disclosure, so that all realistic combinations of the procedure described in the can be assigned. This also comprises combinations between all individual embodiments in the text, i. e., in each section of the description, in the claims, and also combinations between different variants in the text, in the claims, and in the Figs. The claims also do not limit the disclosure and thus the possible combina- tions of all the features shown. All disclosed features are explicitly disclosed here, both individually and in combination with all other features.

Claims

MB Automation GmbH & Co. KG -34 - 30A-168 210Claims1. A method for picking up a component (B) at a pick-up point (z3) in a component conveying device (100), wherein the component conveying device (100) comprises at least one conveyor unit (200 / 400) and a control unit (ECU); wherein- the at least one conveyor unit (200 / 400) comprises at least one first component pick-up (220 / 420), wherein the component pick-up (220 / 420) is continuously movable at least along and against a pick-up direction (A); and- the control unit (ECU) controls the movements of the at least one conveyor unit (200 / 400); wherein the method comprises the following steps: i) moving the component pick-up (220 / 420) from a resting position (zO) in the pick-up direction (A) toward the pick-up point (z3) to a first intermediate position (zl) at a first velocity (vl); ii) moving the component pick-up (220 / 420) from the first intermediate position (zl) in the pick-up direction (A) to a second intermediate position (z2) at a second velocity (v2); iii) moving the component pick-up (220 / 420) from the second intermediate position (z2) in the pick-up direction (A) to the pick-up point (z3) at a third velocity (v3); iv) picking up the component (B) with the component pick-up (220 / 420) at the pick-up point (z3); v) moving the component pick-up (220 / 420) with the picked-up component (B) against the pick-up direction (A) in the direction of the resting position (zO) to a third intermediate position (z6) at a fourth velocity (v4); vi) moving the component pick-up (220 / 420) from the third intermediate position (z6) against the pick-up direction (A) to a fourth intermediate position (z5) at a fifth velocity (v5); vii) moving the component pick-up (220 / 420) from the fourth intermediate position (z5) in the opposite direction to the pick-up direction (A) to the resting position (zO) at a sixth velocity (v6); and wherein the first velocity (vl), the second velocity (v2), the third velocity (v3), the fourth velocity (v4), the fifth velocity (v5) and the sixth velocity (v6) areMB Automation GmbH & Co. KG -35 - 30A-168 210 each in adjacent velocity ranges (vll to v61) and increase and / or decrease at least in sections.

2. The method according to claim 1, wherein the first velocity range (vll) comprises approximately 0 mm / s to approximately 4000 mm / s; and / or the second velocity range (v21) comprises approximately 3 mm / s to approximately 250 mm / s; and / or the third velocity range (v31) comprises approximately 0 mm / s to approximately 3 mm / s; and / or the fourth velocity range (v41) comprises approximately 0 mm / s to approximately -3 mm / s; and / or the fifth velocity range (v51) comprises approximately -3 mm / s to approximately -250 mm / s; and / or the sixth velocity range (v61) comprises approximately -4000 mm / s to approximately 0 mm / s.

3. The method according to any of the preceding claims, wherein a maximum value of the first velocity (vl) is greater than a maximum value of the second velocity (v2); and / or a maximum value of the second velocity (v2) is greater than a maximum value of the third velocity (v3); and / or an amount of a maximum value of the sixth velocity (v6) is greater than an amount of a maximum value of the fifth velocity (v5); and / or an amount of a maximum value of the fifth velocity (v5) is greater than an amount of a maximum value of the fourth velocity (v4).

4. The method according to one of the previous claims, wherein the first velocity (vl) is at least partially nearly constant and / or increases at least partially with a first acceleration (al), and / or decreases at least in sections with a second acceleration (a2), and wherein the first acceleration (al) comprises approximately 0 mm / s2to approximately 150000 mm / s2and wherein the second acceleration (a2) comprises approximately 0 mm / s2to approximately -150000 mm / s2; and / or the second velocity (v2) is approximately constant at least in sections and / or decreases at least in sections with a third acceleration (a3), and wherein the third acceleration (a3) comprises approximately 0 mm / s2to approximately - 4000 mm / s2; and / orMB Automation GmbH & Co. KG -36 - 30A-168 210 the third velocity (v3) is nearly constant at least in sections and / or decreases at least in sections with a fourth acceleration (a4), and wherein the fourth acceleration (a4) comprises approximately 0 mm / s2to approximately - 400 mm / s2; and / or the fourth velocity (v4) is approximately constant at least in sections and / or increases at least in sections with a fifth acceleration (a5), and wherein the fifth acceleration (a5) comprises approximately 0 mm / s2to approximately - 400 mm / s2; and / or the fifth velocity (v5) is approximately constant at least in sections and / or increases at least in sections with a sixth acceleration (a6), and wherein the sixth acceleration (a6) comprises approximately 0 mm / s2to approximately - 4000 mm / s2; and / or the sixth velocity (v6) is approximately constant at least in sections and / or increases at least in sections with a seventh acceleration (a7), and / or at least in sections decreases with an eighth acceleration (a8), and wherein the seventh acceleration (a7) comprises approximately 0 mm / s2to approximately - 150000 mm / s2and wherein the eighth acceleration (a8) comprises approximately 0 mm / s2to approximately 150000 mm / s2.

5. The method according to one of the previous claims, wherein the method comprises the following steps:- moving the component pick-up (220 / 420) from the fourth intermediate position (z5) against the pick-up direction (A) beyond the resting position (zO) to a fifth intermediate position (z7); and- moving the component pick-up (220 / 420) from the fifth intermediate position (z7) in the pick-up direction (A) to the resting position (zO).

6. The method according to one of the previous claims, wherein the conveyor unit (200 / 400) comprises at least a first sensor (225); and wherein the method comprises the following step:- determining the fourth intermediate position (z5) by means of the first sensor (225), wherein at the fourth intermediate position (z5) the component (B) held by the component pick-up (220 / 420) is completely detached from the structured component stack (U).

7. The method according to claim 6, wherein the first sensor (225) is a force sensor that is designed to measure a force counteracting the movement of theMB Automation GmbH & Co. KG -37 - 30A-168 210 component pick-up (220 / 240); and wherein determining the fourth intermediate position (z5) comprises:- measuring the force counteracting the movement of the component pickup (220 / 420) from the pick-up point (z3) towards the resting position (zO), wherein the counteracting force at the fourth intermediate position (z5) is approximately 0 N.

8. The method according to any of the previous claims, wherein the component pick-up (220 / 420) comprises at least one vacuum device (221), a pick-up head (224), and a suction channel (222); wherein the suction channel (222) is connected to the vacuum device (221) and forms an opening in the pick-up head (224); and wherein a surface (A2) of the component (B) corresponds to at least three times the cross-sectional area (Al) of the suction channel (222); and wherein picking-up the component (B) at the pick-up point (z3) comprises:- generating a vacuum by the vacuum device (221) so that the component (B) is sucked onto the pick-up head (224) by the vacuum present in the suction channel (221).

9. The method according to one of the previous claims, wherein the component conveying device (100) comprises at least a first imaging sensor (KI), and wherein the method comprises the following step:- inspecting a first front surface (S5) of the component (B) located at the pick-up point (z3) by the first imaging sensor (KI).

10. A method for depositing a component (B) at a deposit point (z4) in a component conveyor (100), wherein the component conveyor (100) comprises at least one conveyor unit (200 / 400) and a control unit (ECU), wherein- the at least one conveyor unit (200 / 400) comprises at least one first component pick-up (220 / 420), wherein the component pick-up (220 / 420) is movable along and against a pick-up direction (A); and- the control unit (ECU) controls the movements of the at least one conveyor unit (200 / 400); wherein the method comprises the following steps: i) moving the component pick-up (220 / 420) with the picked-up component (B) from a resting position (zO) in the pick-up direction (A) toward the deposit point (z4) to a first intermediate position (zl) at a first velocity (vlOO);MB Automation GmbH & Co. KG -38 - 30A-168 210 ii) moving the component pick-up (220 / 420) from the first intermediate position (zl) in the pick-up direction (A) to the deposit point (z4) at a second velocity (v200); iii) depositing the component (B) at the deposit point (z4); iv) moving the component pick-up (220 / 420) in the opposite direction to the pick-up direction (A) towards the resting position (zO) to a second intermediate position (z5) at a third velocity (v300); v) moving the component pick-up (220 / 420) from the second intermediate position (z5) in the pick-up direction (A) to the resting position (zO) at a fourth velocity (v400); and wherein the first velocity (vlOO), the second velocity (v200), the third velocity (v300), and the fourth velocity (v400) each lie in adjacent velocity ranges (vlOl to v401) and increase and / or decrease at least in sections.

11. The method according to claim 10, wherein the first velocity range (vlOl) comprises approximately 0 mm / s to approximately 4000 mm / s; and / or the second velocity range (v201) comprises approximately 0 mm / s to approximately 250 mm / s; and / or the third velocity range (v301) comprises approximately 0 mm / s to approximately -250 mm / s; and / or the fourth velocity range (v401) comprises approximately 0 mm / s to approximately -4000 mm / s.

12. The method according to any of the previous claims, wherein a maximum value of the first velocity (vlOO) is greater than a maximum value of the second velocity (v200); an amount of a maximum value of the fourth velocity (v400) is greater than an amount of a maximum value of the third velocity (v300).

13. The method according to claim 10 or 11, wherein the component conveying device (100) comprises at least a first imaging sensor (K3 / K4), and wherein the method comprises the following step:- inspecting a second front surface (S6) of the component (B) located on the component pick-up (220 / 420) by the first imaging sensor (K3 / K4).

14. A method for inspecting components (B) in a component conveying device (100), wherein the component conveying device (100) comprises at least oneMB Automation GmbH & Co. KG -39 - 30A-168 210 control unit (ECU), a component inspection unit (300), and at least one first imaging sensor (K7), wherein- the component inspection unit (300) comprises at least one first plate (310) rotatable about a first axis of rotation (301) and at least one component pick-up (320) arranged radially outside the first plate (310) and rotatable about a second axis of rotation (302), and- the control unit (ECU) controls the rotational movement of the at least one first plate (310) and the at least one component pick-up (320), wherein the method comprises the following steps:- picking up the component (B) with the component pick-up (320) at a pickup position (311),- rotating the first plate (310) by a first predetermined angle so that the component (B) located in the component pick-up (320) is at a first inspection position (312),- inspecting a first side surface (SI) of the component (B) located at the first inspection position (312) by the first imaging sensor (K7),- rotating the component pick-up (320) by a second predetermined angle so that a second side surface (S2) of the component (B) can be inspected by the first imaging sensor (K7),- inspecting the second side surface (S2) of the component (B) by the first imaging sensor (K7),- rotating the first plate (310) by a third predetermined angle so that the component (B) located in the component pick-up (320) is at a first discharge position (315).

15. The method according to claim 14, wherein the component conveying device (100) comprises a second imaging sensor (K2) and a third imaging sensor (K8), and wherein the method comprises the following steps:- rotating the first plate (310) by a fourth predetermined angle so that the component (B) located in the component pick-up (320) is at a second inspection position (314),- inspecting a third side surface (S3) of the component (B) located in the second inspection position (314) by the third imaging sensor (K8),- rotating the component pick-up (320) by a second predetermined angle so that a fourth side surface (S4) of the component (B) can be inspected by the third imaging sensor (K8),- inspecting the fourth side surface (S4) of the component (B) by the third imaging sensor (K8),MB Automation GmbH & Co. KG -40 - 30A-168 210 inspecting a first front surface (S5) of the component (B) by the second imaging sensor (K2) at the first pick-up position (311), the first inspection position (312), and / or the second inspection position (314).

16. A component conveying device (100) set up and configured to perform the methods according to claims 1, 4, and 7, wherein the component conveying device (100) comprises at least a first and a second conveyor unit (200 / 400), a control unit (ECU), and a component inspection unit (300), wherein, in a conveying direction (F), the component inspection unit (300) is arranged between the first conveyor unit (200) and the second conveyor unit (400), and wherein- the first conveyor unit (200) comprises at least one first component pickup (220) which is movable at least along and against a pick-up direction (A) and a conveying direction (F), wherein the first conveyor unit (220) is set up and configured to receive a component (B) from a structured component stack (U), transport the received component (B) along the conveying direction (F) and transfer it to a second component pick-up (320) of the component inspection unit (300) located at a pick-up position (311),- the component inspection unit (300) comprises at least one first plate (310) rotatable about a first axis of rotation (301) and at least one second component pick-up (320) arranged radially outside the first plate (310) and rotatable about a second axis of rotation (302),- the second conveyor unit (400) comprises at least one third component pick-up (420) which is movable at least along and against a pick-up direction (A) and a conveying direction (F), wherein the second conveyor unit (420) is set up and configured to pick up the component (B) from the at least one second component pick-up (320) at a deposit position (315), to transport the picked-up component (B) along the conveying direction (F) and to place it on a deposit plate (P),- the control unit (ECU) is designed and configured to control the movements of the first conveyor unit (200), the second conveyor unit (400), and the component inspection unit (300).

17. The component conveying device (100) according to claim 16, wherein the first axis of rotation (301) and the second axis of rotation (302) run parallel to each other.

Images