Electronic module and method for producing an electronic module

Abstract

The invention relates to an electronic module (1) for a transmitter, comprising: - a first printed circuit board (10) having a front face (11), a rear face (12) opposite the front face (11), and an end face (13) connecting the front face (11) and the rear face (12), wherein a first conducting track (14) is arranged on the front face (11) and a second conducting track (15) is arranged between the front face (11) and the rear face (12) and is electrically connected to the first conducting track (14), and wherein the second conducting track (15) has a first contacting point (16) on the end face (13) and / or the first conducting track (14) has a third contacting point (18) on the end face (13); - an electronic component (20) having a second contacting point (21); - a connection (30) from the first contacting point (16) or from the third contacting point (18) to the second contacting point (21).

Description

[0001] Electronic module and method for manufacturing an electronic module

[0002] The invention relates to an electronic module and a method for manufacturing an electronic module.

[0003] In analytical measurement technology, particularly in water management, environmental analysis, and industrial applications (e.g., food technology, biotechnology, and pharmaceuticals), as well as for a wide variety of laboratory applications, measured parameters such as temperature, pH value, conductivity, or the concentration of analytes (e.g., ions or dissolved gases) in a gaseous or liquid medium are of great importance. These measured parameters can be acquired and / or monitored using electrochemical sensors, such as thermal, optical, potentiometric, amperometric, voltammetric, or coulometric sensors, or conductivity sensors.

[0004] Due to the ever-increasing technical demands placed on these so-called field devices, transmitters in particular—that is, electrical devices that process sensor readings—are increasingly incorporating more electronic components. Furthermore, users expect these transmitters to be as small as possible to allow for easy and space-saving use in industrial environments.

[0005] For this reason, there is a need for a space-saving arrangement of electronic components in transmitters.

[0006] It is therefore an object of the invention to propose a space-saving electronic module for a transmitter.

[0007] This problem is solved according to the invention by an electronic module for a transmitter according to claim 1.

[0008] The electronic module according to the invention comprises: a first printed circuit board with a front side, a back side opposite the front side and an end face connecting the front side and the back side, wherein a first conductor track is arranged on the front side and a second conductor track is arranged between the front side and the back side and is electrically connected to the first conductor track, wherein the second conductor track has a first contact point on the end face and / or the first conductor track has a third contact point on the end face, an electronic component with a second contact point, a connection from the first contact point or from the third contact point to the second contact point.

[0009] The electronic module according to the invention enables an extremely compact arrangement of the printed circuit board and the electronic component, thus saving space. In particular, the contacting on the end face of the printed circuit board allows significantly more space to be available for electronic components on the board, or the printed circuit board can be reduced in size. The electronic module also protects the components by reducing heat input. Furthermore, thanks to the electronic module, no reworking of the connection points is necessary.

[0010] According to one embodiment of the invention, the electronic component has a second circuit board with a front side, a back side opposite the front side, and an end face connecting the front side and the back side, wherein a third conductor track is arranged on the front side and a fourth conductor track is arranged between the front side and the back side and is electrically connected to the third conductor track, wherein the third conductor track or the fourth conductor track has the second contact point on the end face.

[0011] According to a further embodiment of the invention, the second circuit board is arranged parallel to the first circuit board.

[0012] According to one embodiment of the invention, the connection is a bond wire or a cable. According to one embodiment of the invention, the electronic module comprises a housing, wherein the first printed circuit board and the second printed circuit board are fixed in the housing, wherein the first contact point and the second contact point are spaced apart by a distance, and wherein the connection has a length that is greater than the distance.

[0013] According to one embodiment of the invention, the electronic component comprises a first connector, wherein the first connector is suitable for receiving a cable, and wherein the first connector has the second contact point for connecting the second contact point to the cable.

[0014] According to one embodiment of the invention, the electronic module comprises at least one second connector which is connected to the housing and to the first circuit board.

[0015] According to one embodiment of the invention, the first circuit board has a through-hole for the second connector and the second connector is arranged in the through-hole.

[0016] The above-mentioned problem is also solved by a method for manufacturing an electronic module according to claim 9.

[0017] The method according to the invention comprises:

[0018] Providing a first printed circuit board with a front, a back opposite the front and an end face connecting the front and the back, wherein a first conductor is arranged on the front and a second conductor is arranged between the front and the back and is electrically connected to the first conductor, wherein the second conductor has a first contact point on the end face and / or the first conductor has a third contact point on the end face,

[0019] Providing an electronic component with a second contact point, providing a connection from the first contact point or from the third contact point to the second contact point, connecting the first contact point or the third contact point of the first printed circuit board to the second contact point of the electronic component by means of the connection.

[0020] According to one embodiment of the invention, joining is carried out by ultrasonic welding, laser welding, friction welding or resistance welding.

[0021] The invention is explained in more detail with reference to the following description of figures. The figures show:

[0022] - Fig. 1 : an electronic module according to the invention comprising a first printed circuit board and a second printed circuit board,

[0023] - Fig. 2: an alternative embodiment of the electronic module with a first printed circuit board and a first connector,

[0024] - Fig. 3: another embodiment of the electronic module with a first circuit board, a second circuit board and connectors.

[0025] First, the electronic module 1 according to the invention is described.

[0026] Figure 1 shows an embodiment of an electronic module 1 for a transmitter comprising a first circuit board 10, an electronic component 20 and a connection 30.

[0027] The first printed circuit board 10 has a front surface 11, a back surface 12 opposite the front surface 11, and an end surface 13 connecting the front surface 11 and the back surface 12. The first printed circuit board 10 is a multilayer printed circuit board. A first conductor 14 is arranged on the front surface 11, and a second conductor 15 is arranged between the front surface 11 and the back surface 12 and is electrically connected to the first conductor 14. The second conductor 15 has a first contact point 16 on the end surface 13. The first conductor 14 preferably has a third contact point 18 on the end surface 13 (shown only in Fig. 3). The first conductor 14 and the second conductor 15 are preferably made of copper. The first contact point 16 and the third contact point 18 are formed, for example, by metallizing an end surface of the second conductor 15.The electronic component 20 has a second contact point 21 for connection with the first contact point 16 or the third contact point 18.

[0028] The connection 30 extends from the first contact point 16 or the third contact point 18 to the second contact point 21. The connection 30 is, for example, a bond wire or a cable. A bond wire is particularly advantageous due to its small footprint.

[0029] According to the embodiment shown in Figure 1, the electronic component 20 has a second circuit board 40 with a front side 41, a back side 42 opposite the front side 41, and an end face 43 connecting the front side 41 and the back side 42. The second circuit board 40 is preferably identical to the first circuit board 10.

[0030] A third conductor track 44 is arranged on the front side 41, and a fourth conductor track 45 is arranged between the front side 41 and the back side 42 and is electrically connected to the third conductor track 44. The third conductor track 44 or the fourth conductor track 45 has the second contact point 21 on the end face 43.

[0031] The second circuit board 40 is preferably arranged parallel to the first circuit board 10. This makes it particularly easy to connect the first contact point 16 to the second contact point 21.

[0032] The first circuit board 10 and the second circuit board 40 are preferably circular. Thanks to the circular shape, the space for electrical components on the circuit boards is optimized.

[0033] The electronic module 1 preferably comprises a housing 50. The first printed circuit board 10 and the second printed circuit board 40 are fixed in the housing 50. The first contact point 16 and the second contact point 21 are preferably spaced apart by a distance A1. The connection 30 has a length L1, which is greater than the distance A1. This facilitates the insertion of the printed circuit boards into the housing 50. In other words, the connected printed circuit boards can be more easily inserted into the housing 50 because they no longer need to be specially aligned.

[0034] Figure 2 shows an alternative embodiment of the electronic module 1, compatible with all described embodiments, in which the electronic component 20 has a first connector 22. The first connector 22 is suitable for receiving a cable 2. The first connector 22 has a second contact point 21. The connector 22 has a cable contact 25 for contacting the cable 2. The cable contact 25 is connected to the second contact point 21. The second contact point 21 is, for example, implemented as a pin.

[0035] Figure 3 shows an alternative embodiment which is compatible with all described embodiments. In this embodiment, the first connector 22 is connected to the housing 50, so that a cable 2 can be inserted into the cable contact 25 of the first connector 22 from outside the housing 50. The cable contact 25 of the first connector 22 is preferably designed as a clamp connection, in particular as a screw or spring clamp.

[0036] The first circuit board 10 is arranged in the housing 50. The electronic module 1 preferably comprises a second connector 23 and preferably a third connector 24, each of which is connected to the housing 50 and to the first circuit board 10 and / or the second circuit board 40. The second connector 23 and the third connector 24 are preferably identical to the first connector 22. Of course, it is also possible for the connectors to have, for example, pins of different lengths, each with a contact point, as shown in Figure 3. The first connector 22 is connected to the first circuit board 10 via the connection 30', in particular a bond wire or a cable.

[0037] The first circuit board 10 preferably has at least one through-hole 17 for the second connector 23. The second connector 23 is preferably arranged with its pin in the through-hole 17 and connected to the first circuit board 10 at the contact point in the through-hole 17. If the connector 23 is connected to the housing 50 and is, for example, soldered or mechanically clamped to the through-hole 17 via a pin, this enables mechanical fixation of the first circuit board 10 relative to the housing 50.

[0038] Furthermore, the second circuit board 40 is arranged in the housing 50 and is electrically connected to the first circuit board 10 via the connection 30, in particular a bond wire or a cable.

[0039] Preferably, the first printed circuit board 10 is arranged to the second printed circuit board 40 such that a projection surface of the two printed circuit boards overlaps by at least 80%, preferably 95%, particularly preferably 100% (see Figure 1 and Figure 3).

[0040] As shown in Figure 3, the second connector 23 is connected to the first circuit board 10 via a pin, for example. The first circuit board 10 preferably has a fifth conductor 18, which is arranged on the back side 12 of the first circuit board 10. The second circuit board 40 preferably has a sixth conductor 46, which is arranged on the back side 42 of the second circuit board 40.

[0041] For example, the second connector 23 is connected to the fifth conductor track 18 via a connection 30", in particular a bond wire. The third connector 24 is preferably mechanically connected to the first circuit board 10 via the through-hole 17" and / or mechanically connected to the second circuit board 40 via the through-hole 17' and electrically connected to the sixth conductor track 46. For example, the third connector 24 is soldered to the sixth conductor track 46 or connected to the sixth conductor track 46 via a bond wire. Thanks to the mechanical connection between the second connector 23 and the first circuit board 10, as well as the mechanical connection between the third connector 24 and the second circuit board 40, the first circuit board 10 and the second circuit board 40 are stabilized in the housing 50.Of course, it is also possible that the first circuit board 10 and / or the second circuit board 40 are directly mechanically connected to the housing 50 in order to fix them in the housing 50. The second connector 23 is suitable for receiving an additional cable 2'. The third connector 24 is suitable for receiving another cable 2".

[0042] The following section describes the inventive method for manufacturing an electronic module 1.

[0043] First, the first circuit board 10 described above, the electronic component 20 described above and the connection 30 described above are provided.

[0044] The first contact point 16 or the third contact point 18 of the first circuit board 10 is then connected to the second contact point 21 of the second circuit board 40 via the connection 30. The connection 30 is, for example, a bond wire or a cable.

[0045] Preferably, the joining is carried out by ultrasonic welding, laser welding, friction welding, or resistance welding. Ultrasonic welding is particularly preferred when a bonding wire is used as the connection 30, since this method is especially well-suited for wire bonding.

[0046] In the event that the electronic component 20 is a second printed circuit board 40, as shown in Figure 1, the second contact point 21 of the second printed circuit board 40 is arranged on the end face 43 of the second printed circuit board 40.

[0047] Reference symbol list

[0048] 1 electronic module

[0049] Cable

[0050] 10 first circuit board

[0051] 11 Front

[0052] 12 Back

[0053] 13 Front

[0054] 14 first conductor track

[0055] 15 second conductor track

[0056] 16 first point of contact

[0057] 17 through hole

[0058] 18 third contact point

[0059] 20 Electronic component

[0060] 21 second contact point

[0061] 22 first connector

[0062] 23 second connector

[0063] 24 third connector

[0064] 25 cable contacts

[0065] 30 connection

[0066] 40 second circuit board

[0067] 41 Front

[0068] 42 Back

[0069] 43 Front

[0070] 44 third conductor track

[0071] 45 fourth conductor track

[0072] 50 cases

[0073] A1 distance

[0074] L1 length

Claims

Patent claims 1. Electronic module (1 ) for a transmitter comprising: - a first circuit board (10) with a front side (11) , one of the front sides (11 ) opposite back side (12) and an end side (13) connecting the front side (11 ) and the back side (12), wherein a first conductor track (14) is arranged on the front side (11 ) and a second conductor track (15) is located between the front side (11 ) and the back side (12) arranged and electrically connected to the first conductor track (14), wherein the second conductor track (15) has a first contact point (16) on the end face (13) and / or the first conductor track (14) has a third contact point (18) on the end face (13), - an electronic component (20) with a second contact point (21) , - a connection (30) from the first contact point (16) or from the third contact point (18) to the second contact point (21).

2. Electronic module (1) according to claim 1, wherein the electronic component (20) has a second printed circuit board (40) with a front (41), a back (42) opposite the front (41), and an end face (43) connecting the front (41) and the back (42), wherein a third conductor (44) is arranged on the front (41), and a fourth conductor (45) is arranged between the front (41) and the back (42) and is electrically connected to the third conductor (44), wherein the third conductor (44) or the fourth conductor (45) has the second contact point (21) on the end face (43).

3. Electronic module (1 ) according to claim 2, wherein the second circuit board (40) is arranged parallel to the first circuit board (10).

4. Electronic module (1) according to any of the preceding claims, wherein the connection (30) is a bond wire or a cable.

5. Electronic module (1) according to one of the preceding claims, wherein the electronic module (1) comprises a housing (50), wherein the first circuit board (10) and the second circuit board (40) are fixed in the housing (50), wherein the The first contact point (16) and the second contact point (21) are spaced apart by a distance (A1), the connection (30) having a length (L1) which is greater than the distance (A1).

6. Electronic module (1 ) according to claim 1 , wherein the electronic component (20) comprises a first connector (22) wherein the first connector (22) is suitable for receiving a cable (2) wherein the first connector (22) has the second contact point (21 ) to connect the second contact point (21 ) to the cable (2).

7. Electronic module (1 ) according to claim 5, wherein the electronic module (1 ) comprises at least one second connector (23) which is connected to the housing (50) and to the first circuit board (10).

8. Electronic module (1 ) according to claim 7, wherein the first printed circuit board (10) has a through-hole (17) for the second connector (23) and the second connector (23) is arranged in the through-hole (17).

9. Method for manufacturing an electronic module (1) comprising: - Providing a first printed circuit board (10) with a front (11), a back (12) opposite the front (11), and an end face (13) connecting the front (11) and the back (12), wherein a first conductor (14) is arranged on the front (11), and a second conductor (15) is arranged between the front (11) and the back (12) and is electrically connected to the first conductor (14), wherein the second conductor (15) has a first contact point (16) on the end face (13) and / or the first conductor (14) has a third contact point (18) on the end face (13), - Providing an electronic component (1 ) with a second contact point (21 ), - Providing a connection (30) from the first contact point (16) or from the third contact point (18) to the second contact point (21 ), - Connecting the first contact point (16) or the third contact point (18) of the first circuit board (10) to the second Contact point (21) of the electronic component (1) through the connection (30).

10. Method according to claim 9, wherein the joining is carried out by ultrasonic welding, laser welding, friction welding or Resistance welding is performed.

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