Electronic component and component-embedded substrate equipped with same

Abstract

[Problem] To make it possible to visually recognize the article orientation regarding an electronic component that has a configuration in which a plurality of elements are embedded in a base body. [Solution] An electronic component 100 comprises: a magnetic base body M; and coils 111-114 that are embedded in the magnetic base body M and are arranged in the X direction. Each of the coils 111-114 includes: a terminal electrode 121 which has an end face exposed out of a main surface 101; and a terminal electrode 122 which has an end face exposed out of a main surface 102. A lateral face 103 of the magnetic base body M is provided with a recess 107 which serves as an orientation mark to enable visual recognition of X-direction orientation.

Description

Electronic component and component-embedded substrate including the same

[0001] The present disclosure relates to an electronic component and a component-embedded substrate including the same, and more particularly to an electronic component having a configuration in which a plurality of element portions are embedded in a body portion and a component-embedded substrate including the same.

[0002] Patent Document 1 discloses a stacked coil array having a configuration in which a plurality of coil conductors are embedded in a body portion. The stacked coil array disclosed in Patent Document 1 is designed such that the inductances of the plurality of coil conductors are substantially equal.

[0003] Japanese Patent Application Laid-Open No. 2006-032425

[0004] However, in an electronic component having a configuration in which a plurality of element portions are embedded in a body portion, when the element constants of the plurality of element portions are different, the circuit characteristics change depending on the mounting direction of the electronic component. In particular, in an electronic component of a type that is embedded in a circuit board and used, unlike an electronic component of a type that is surface-mounted using solder, an external electrode for solder connection is not separately added to the surface of the magnetic body portion, so the direction cannot be confirmed by using the shape of the external electrode.

[0005] In the present disclosure, a technique for making the direction of a product visible without adding an external electrode to the surface of a body portion in an electronic component having a configuration in which a plurality of element portions are embedded in the body portion is described.

[0006] An electronic component according to one aspect of the present disclosure includes a body portion having a first main surface, a second main surface located on the opposite side of the first main surface, and side surfaces orthogonal to the first and second main surfaces, and a plurality of element portions embedded in the body portion and arranged in a first direction parallel to the first main surface. Each of the plurality of element portions includes a first terminal electrode whose end face is exposed on the first main surface and a second terminal electrode whose end face is exposed on the second main surface, and a direction mark that can visually recognize the direction in the first direction is provided on the side surface of the body portion.

[0007] According to the present disclosure, a technique is provided for making the direction of a product visible without adding an external electrode to the surface of a body portion in an electronic component having a configuration in which a plurality of element portions are embedded in the body portion.

[0008] Figure 1 is a schematic perspective view showing the configuration of an electronic component 100 according to a first embodiment of the technology according to this disclosure. Figure 2 is a schematic cross-sectional view along the line A-A shown in Figure 1. Figure 3 is a schematic cross-sectional view along the line B-B shown in Figure 1. Figures 4(a) and 4(b) are schematic plan views illustrating the structures of terminal electrodes 121 and 122, respectively. Figure 5 is a schematic cross-sectional view illustrating the structure of a component-embedded substrate 10 containing a plurality of electronic components 100. Figure 6 is a schematic perspective view showing the configuration of an electronic component 200 according to a second embodiment of the technology according to this disclosure. Figure 7 is a schematic perspective view showing the configuration of an electronic component 300 according to a third embodiment of the technology according to this disclosure. Figure 8 is a schematic perspective view showing the configuration of an electronic component 400 according to a fourth embodiment of the technology according to this disclosure.

[0009] The embodiments of the technology described herein will be described in detail below with reference to the attached drawings.

[0010] <First Embodiment> Figure 1 is a schematic perspective view showing the configuration of an electronic component 100 according to a first embodiment of the technology of this disclosure. Figure 2 is a schematic cross-sectional view along the line A-A shown in Figure 1, and Figure 3 is a schematic cross-sectional view along the line B-B shown in Figure 1.

[0011] As shown in Figures 1 to 3, the electronic component 100 according to the first embodiment is an inductor component and comprises a magnetic element part M and a plurality of element parts, which are coil parts 111 to 114, embedded in the magnetic element part M. In this embodiment, the number of coil parts embedded in the magnetic element part M is four, but the number of coil parts is not particularly limited as long as there are two or more. The magnetic element part M may be made of a composite magnetic material in which magnetic particles made of a high permeability material such as ferrite or permalloy are solidified with a resin binder. The magnetic element part M has main surfaces 101 and 102 that constitute the XZ plane and are located on opposite sides, side surfaces 103 and 104 that constitute the XY plane and are located on opposite sides, and side surfaces 105 and 106 that constitute the YZ plane and are located on opposite sides.

[0012] The coil portions 111 to 114 are embedded in the magnetic element portion M so as to be arranged in this order in the first direction, the X direction. The terminal electrodes 121 forming one end of each coil portion 111 to 114 are exposed from the main surface 101 of the magnetic element portion M, and the terminal electrodes 122 forming the other end are exposed from the main surface 102 of the magnetic element portion M. The area and shape of the terminal electrodes 121 and 122 may be the same.

[0013] As shown in Figure 3, the coil portion 111 has two conductor layers L1 and L2 stacked in the second direction, the Z direction. The same applies to the other coil portions 112 to 114. The conductor layers L1 and L2 may both be covered with an interlayer insulating film 130 so as not to come into contact with the magnetic element portion M. An interlayer insulating film 130 also exists between adjacent conductor layers L1 and L2 in the Z direction, and therefore these conductor layers L1 and L2 are stacked in the Z direction via the interlayer insulating film 130. The conductor layers L1 and L2 are made of good conductors such as copper (Cu). The interlayer insulating film 130 is made of resin or the like.

[0014] The conductor layer L1 is located at one end in the Z direction and is formed first during manufacturing. In the example shown in Figure 3, the conductor layer L1 includes terminal patterns 141 and 142 and a coil pattern C11. The terminal pattern 141 has its XZ end face in the +Y direction exposed to the main surface 101 of the magnetic element M. The terminal pattern 142 has its XZ end face in the -Y direction exposed to the main surface 102 of the magnetic element M. The coil pattern C11 is a conductor pattern that extends linearly in the Y direction to connect the terminal patterns 141 and 142. However, it is not essential that the coil pattern C11 is a linear conductor pattern.

[0015] The conductor layer L2 is a conductor layer located on the other end side in the Z direction, and is formed after the conductor layer L1 during manufacturing. In the example shown in Figure 3, the conductor layer L2 includes terminal patterns 143 and 144. The XZ end face of terminal pattern 143 in the +Y direction is exposed to the main surface 101 of the magnetic element M. The XZ end face of terminal pattern 144 in the -Y direction is exposed to the main surface 102 of the magnetic element M. The terminal patterns 143 and 144 are provided independently within the plane of the conductor layer L2 without being connected to other conductor patterns. In other words, the conductor layer L2 does not contain a conductor pattern corresponding to the coil pattern C11, and only terminal patterns 143 and 144 exist. However, it is not essential that the terminal patterns 143 and 144 are provided independently within the plane of the conductor layer L2 without being connected to other conductor patterns; another coil pattern connecting terminal patterns 143 and 144 may be included in the conductor layer L2.

[0016] In this embodiment, the thickness of the conductor layer L2 in the Z direction is greater than the thickness of the conductor layer L1 in the Z direction. Therefore, the thickness of the terminal patterns 143 and 144 in the Z direction is greater than the thickness of the terminal patterns 141 and 142 in the Z direction. As a result, the thickness of the coil pattern C11 is reduced, resulting in a high inductance, and sufficient area of ​​the terminal electrode 121 exposed on the main surface 101 of the magnetic element M, and the area of ​​the terminal electrode 122 exposed on the main surface 102 of the magnetic element M can be secured.

[0017] Terminal patterns 141 and 143 are connected to each other via via conductors 151 that penetrate the interlayer insulating film 130. Similarly, terminal patterns 142 and 144 are connected to each other via via conductors 152 that penetrate the interlayer insulating film 130. The via conductors 151 and 152 may be formed at the same time as the conductor layer L2, or they may be formed after the conductor layer L1 is formed but before the conductor layer L2 is formed. In the former case, via conductor 151 becomes integrated with terminal pattern 143, and via conductor 152 becomes integrated with terminal pattern 144.

[0018] Figures 4(a) and 4(b) are schematic plan views illustrating the structure of terminal electrodes 121 and 122, respectively. In the examples shown in Figures 4(a) and 4(b), via conductors 151 and 152 are integrated with terminal patterns 143 and 144, respectively.

[0019] In the example shown in Figure 4(a), the terminal electrode 121 is composed of a portion consisting of the XZ end faces of terminal patterns 141 and 143 exposed from the main surface 101 of the magnetic element M, and a portion consisting of the XZ end faces of via conductor 151 exposed from the main surface 101 of the magnetic element M. Of the terminal electrode 121, the portions consisting of the XZ end faces of terminal patterns 141 and 143 constitute the first portion A1 and the second portion A2, respectively. Of the terminal electrode 121, the portion consisting of the XZ end faces of via conductor 151 constitutes the third portion A3. The terminal electrode 121 having such a structure is surrounded by an interlayer insulating film 130 on the main surface 101 of the magnetic element M. The width W4 in the X direction of the via conductor 151 exposed from the main surface 101 of the magnetic element M may be 3 / 4 or more of the width W1 in the X direction of the terminal patterns 141 and 143 exposed from the main surface 101 of the magnetic element M. This makes it possible to secure a sufficient area for the terminal electrode 121.

[0020] The widths W1 of terminal patterns 141 and 143 do not need to be exactly the same; they may be different. In this case, the widths W1 of terminal patterns 141 and 143 may be defined by the average value.

[0021] In the example shown in Figure 4(b), the terminal electrode 122 is composed of a portion consisting of the XZ end faces of terminal patterns 142 and 144 exposed from the main surface 102 of the magnetic element M, and a portion consisting of the XZ end faces of via conductor 152 exposed from the main surface 102 of the magnetic element M. Of the terminal electrode 122, the portions consisting of the XZ end faces of terminal patterns 142 and 144 constitute the first portion B1 and the second portion B2, respectively. Of the terminal electrode 122, the portion consisting of the XZ end faces of via conductor 152 constitutes the third portion B3. The terminal electrode 122 having such a structure is surrounded by an interlayer insulating film 130 on the main surface 102 of the magnetic element M. The width W5 in the X direction of the via conductor 152 exposed from the main surface 102 of the magnetic element M may be 3 / 4 or more of the width W2 in the X direction of the terminal patterns 142 and 144 exposed from the main surface 102 of the magnetic element M. This makes it possible to secure a sufficient area for the terminal electrode 122. The widths W4 and W5 may be the same.

[0022] The widths W2 of terminal patterns 142 and 144 do not need to be exactly the same; they may be different. In this case, the widths W2 of terminal patterns 142 and 144 may be defined by their average values. As shown in Figure 2, the width W3 in the X direction of the coil pattern C11 included in coil sections 111 to 114 is smaller than the widths W1 and W2. The inductance and DC resistance of the coil pattern C11 can be adjusted by its width W3. For example, reducing the width W3 can increase the inductance, and increasing the width W3 can decrease the DC resistance.

[0023] As shown in Figure 1, in this embodiment, a recess 107 is provided on the side surface 103 of the magnetic element M. The recess 107 is positioned offset in the +X direction on the side surface 103 of the magnetic element M. Therefore, when mounting the electronic component 100 according to this embodiment, the recess 107 can be used as a marker to confirm the orientation in the X direction. In other words, the recess 107 functions as a orientation mark.

[0024] The surface of the terminal electrode 121 may be coplanar with the main surface 101 of the magnetic element M, or it may be recessed from the main surface 101 of the magnetic element M, as shown in Figure 3. Similarly, the surface of the terminal electrode 122 may be coplanar with the main surface 102 of the magnetic element M, or it may be recessed from the main surface 102 of the magnetic element M.

[0025] As described above, the electronic component 100 according to this embodiment constitutes a coil array incorporating four coil sections 111 to 114 arranged in the X direction, and the orientation can be easily confirmed using the recess 107 provided on the side surface 103 of the magnetic element section M as a marker. This makes it possible to mount the electronic component 100 even if the inductances of the coil sections 111 to 114 do not match, taking this into consideration. Moreover, in this embodiment, since the orientation mark consists of the recess 107, there is no change in the external size of the electronic component 100 due to the provision of the orientation mark.

[0026] Figure 5 is a schematic cross-sectional view illustrating the structure of a component-embedded substrate 10 containing multiple electronic components 100 according to this embodiment.

[0027] The component-embedded substrate 10 shown in Figure 5 comprises insulating layers 11 to 15 stacked in this order, a plurality of wiring patterns 20 formed on the surfaces of the insulating layers 11 to 15, and two electronic components 100 embedded in the insulating layer 13. The wiring patterns 20 include eight wiring patterns 21 located between the insulating layer 13 and the insulating layer 14, and eight wiring patterns 22 located between the insulating layer 12 and the insulating layer 13. Each of the eight wiring patterns 21 is positioned to overlap with the terminal electrode 121 of the electronic component 100, and each is connected to the corresponding terminal electrode 121 via a substrate via conductor 31. Similarly, each of the eight wiring patterns 22 is positioned to overlap with the terminal electrode 122 of the electronic component 100, and each is connected to the corresponding terminal electrode 122 via a substrate via conductor 32.

[0028] Thus, the electronic component 100 according to this embodiment is not used by mounting it on the surface of a circuit board using solder or the like, but is used by embedding it in a component-embedded substrate 10. For this reason, the end faces of the terminal patterns 141 and 143 exposed from the main surface 101 of the magnetic element M are used as terminal electrodes 121, and the end faces of the terminal patterns 142 and 144 exposed from the main surface 102 of the magnetic element M are used as terminal electrodes 122. Furthermore, in this embodiment, since not only the end face of the conductor layer L1 having the coil pattern C11 but also the end face of the conductor layer L2 without the coil pattern is exposed, it is possible to secure a sufficient area for the terminal electrodes 121 and 122.

[0029] Furthermore, since not only the end faces of the terminal patterns 141 and 143 but also the end faces of the via conductors 151 are exposed from the main surface 101 of the magnetic element M, the terminal electrodes 121 are not divided into multiple parts by the interlayer insulating film 130 on the main surface 101 of the magnetic element M. Similarly, since not only the end faces of the terminal patterns 142 and 144 but also the end faces of the via conductors 152 are exposed from the main surface 102 of the magnetic element M, the terminal electrodes 122 are not divided into multiple parts by the interlayer insulating film 130 on the main surface 102 of the magnetic element M.

[0030] Furthermore, since the terminal electrodes 121 and 122 are surrounded by the interlayer insulating film 130 on the main surfaces 101 and 102 of the magnetic element M, it is possible to increase the dielectric breakdown voltage between adjacent terminal electrodes 121 in the X direction, and between adjacent terminal electrodes 122 in the X direction. Also, if the surface of the terminal electrode 121 is recessed below the main surface 101 of the magnetic element M, the connection reliability between the terminal electrode 121 and the substrate via conductor 31 can be improved. Similarly, if the surface of the terminal electrode 122 is recessed below the main surface 102 of the magnetic element M, the connection reliability between the terminal electrode 122 and the substrate via conductor 32 can be improved.

[0031] As described above, the electronic component 100 according to this embodiment is designed to be used embedded in a component-embedded substrate 10. Therefore, unlike electronic components that are mounted on the surface of a circuit board using solder or the like, no external electrodes made of silver paste or the like that come into contact with the terminal electrodes 121 and 122 are added to the surface of the magnetic element M. For this reason, external electrodes cannot be used as directional markers in electronic components that are used embedded in a component-embedded substrate 10. However, in this embodiment, the recess 107 provided on the side surface 103 of the magnetic element M can be used as a directional marker. Moreover, since the recess 107, which is the directional marker, is provided on a surface different from the main surfaces 101 and 102 of the magnetic element M, there is no deterioration in the embedding characteristics of the electronic component 100 in the component-embedded substrate 10 that would result from creating irregularities on the main surfaces 101 and 102.

[0032] Furthermore, unlike electronic components that are mounted on the surface of a circuit board using solder or the like, the electronic component 100 according to this embodiment does not have external electrodes on its sides 103 to 106, and the entire surface of sides 103 to 106 is composed of a magnetic element M. Therefore, when the electronic component 100 according to this embodiment is embedded in the component-embedded substrate 10, unintended short-circuit failures between other wiring patterns and terminal electrodes 121 and 122 are less likely to occur. Moreover, since no external electrodes are added to the main surfaces 101 and 102, it is possible to form the substrate via conductors 31 and 32 shown in Figure 5 with a narrow pitch.

[0033] <Second Embodiment> Figure 6 is a schematic perspective view showing the configuration of an electronic component 200 according to a second embodiment of the technology of this disclosure.

[0034] As shown in Figure 6, the electronic component 200 according to the second embodiment differs from the electronic component 100 according to the first embodiment in that the recessed portion 107, which is a direction mark, is provided on the side surface 105 of the magnetic element portion M. Since the other basic configurations are the same as those of the electronic component 100 according to the first embodiment, the same reference numerals are used for the same elements, and redundant explanations are omitted.

[0035] As illustrated by the electronic component 200 according to the second embodiment, the position where the directionality mark is provided may be on the YZ plane of the magnetic element M, as long as the directionality in the X direction is visible.

[0036] <Third Embodiment> Figure 7 is a schematic perspective view showing the configuration of an electronic component 300 according to a third embodiment of the technology of this disclosure.

[0037] As shown in Figure 7, the electronic component 300 according to the third embodiment differs from the electronic component 100 according to the first embodiment in that, instead of having a recess 107 on the side surface 103 of the magnetic element M, a protrusion 108 is provided on the side surface 103 of the magnetic element M. Since the other basic configurations are the same as those of the electronic component 100 according to the first embodiment, the same reference numerals are used for the same elements, and redundant explanations are omitted.

[0038] As illustrated by the electronic component 300 according to the third embodiment, the direction mark may be convex, as long as the directionality in the X direction is visible. This does not result in a reduction in the volume of the magnetic element M.

[0039] <Fourth Embodiment> Figure 8 is a schematic perspective view showing the configuration of an electronic component 400 according to the fourth embodiment of the technology of this disclosure.

[0040] As shown in Figure 8, the electronic component 400 according to the fourth embodiment differs from the electronic component 100 according to the first embodiment in that, instead of providing a recess 107 on the side surface 103 of the magnetic element M, a direction mark 109 is marked on the side surface 103 of the magnetic element M. Since the other basic configurations are the same as those of the electronic component 100 according to the first embodiment, the same reference numerals are used for the same elements, and redundant explanations are omitted. The direction mark 109 may be made by applying ink or the like, or by altering the surface of the magnetic element M by laser irradiation.

[0041] As illustrated by the electronic component 400 according to the fourth embodiment, as long as the directionality in the X direction can be visually recognized, the directionality mark does not have to be a modified shape of the magnetic element portion M itself. According to this, a reduction in the volume of the magnetic element portion M and an increase in the outer dimension of the electronic component 100 do not occur.

[0042] As described above, the embodiments of the technology according to the present disclosure have been described. However, the technology according to the present disclosure is not limited to the above-described embodiments, and various modifications can be made without departing from the gist thereof, and it is needless to say that those are also included in the scope of the technology according to the present disclosure.

[0043] For example, in the above embodiment, the concave portion 107, the convex portion 108, and the directionality mark 109 are not offset in the Y direction and are all arranged at the center in the Y direction. However, these may be offset and arranged in the Y direction. According to this, it becomes possible to visually recognize the directionality in the Y direction as well.

[0044] Further, in the above embodiment, the concave portion 107, the convex portion 108, and the directionality mark 109 are all arranged offset in the X direction. However, as long as the directionality in the X direction can be visually recognized, these may be arranged at the center in the X direction. As an example, a concave portion 107, a convex portion 108, or a directionality mark 109 having a different shape on the +X direction side and the -X direction side may be used and arranged at the center in the X direction of the side surface 103 of the magnetic element portion M.

[0045] Furthermore, in the above embodiment, the electronic component has been described as an example. However, the object of the present invention is not limited to the electronic component, and other types of electronic components, for example, an LC filter or the like may be used, or a capacitor array may be used. When the present invention is applied to a capacitor array, the element body portion in which the capacitor as the element portion is embedded may be made of a non-magnetic material.

[0046] The technology according to the present disclosure includes, but is not limited to, the following configuration examples.

[0047] An electronic component according to one aspect of the present disclosure includes a body portion having a first main surface, a second main surface located on the opposite side of the first main surface, and side surfaces orthogonal to the first and second main surfaces, and a plurality of element portions embedded in the body portion and arranged in a first direction parallel to the first main surface. Each of the plurality of element portions includes a first terminal electrode whose end face is exposed on the first main surface and a second terminal electrode whose end face is exposed on the second main surface. A direction mark capable of visually recognizing the directionality in the first direction is provided on the side surface of the body portion. According to this, it is possible to visually recognize the directionality of the product in the first direction without adding an external electrode such as a silver paste.

[0048] In the above-described electronic component, the direction mark may be formed by a concave portion provided on the side surface or may be formed by a convex portion provided on the side surface. According to these, it becomes easy to visually recognize the direction mark.

[0049] In the above-described electronic component, each of the plurality of element portions has a plurality of conductor layers including first and second conductor layers laminated in a second direction orthogonal to the first direction and parallel to the first main surface. The first conductor layer included in each of the plurality of element portions has a first terminal pattern whose end face is exposed on the first main surface and constitutes a first portion of the first terminal electrode, a second terminal pattern whose end face is exposed on the second main surface and constitutes a first portion of the second terminal electrode, and a coil pattern having one end connected to the first terminal electrode and the other end connected to the second terminal electrode. The second conductor layer included in each of the plurality of element portions has a third terminal pattern whose end face is exposed on the first main surface and constitutes a second portion of the first terminal electrode, and a fourth terminal pattern whose end face is exposed on the second main surface and constitutes a second portion of the second terminal electrode. The first terminal pattern and the third terminal pattern included in each of the plurality of element portions may be connected to each other via a first via conductor whose end face is exposed on the first main surface and constitutes a third portion of the first terminal electrode. The second terminal pattern and the fourth terminal pattern included in each of the plurality of element portions may be connected to each other via a second via conductor whose end face is exposed on the second main surface and constitutes a third portion of the second terminal electrode. According to this, it is possible to sufficiently secure the exposed area of the terminal electrode.

[0050] In the above-described electronic component, the first conductor layer and the second conductor layer, each included in multiple element sections, are each covered at least in part by an interlayer insulating film. The first terminal electrodes, each included in multiple element sections, may be surrounded by the interlayer insulating film on the first main surface, and the second terminal electrodes, each included in multiple element sections, may be surrounded by the interlayer insulating film on the second main surface. This increases the dielectric breakdown voltage between the first terminal electrodes on the first main surface and between the second terminal electrodes on the second main surface.

[0051] In the above-described electronic component, the third terminal pattern may be provided independently within the plane of the second conductor layer without being connected to other conductor patterns, and the fourth terminal pattern may also be provided independently within the plane of the second conductor layer without being connected to other conductor patterns. In this case, the third terminal pattern and the fourth terminal pattern function as auxiliary patterns.

[0052] In the above-described electronic component, the thickness of the second conductor layer in the second direction may be greater than the thickness of the first conductor layer in the second direction. This makes it possible to increase the inductance of the coil pattern while ensuring sufficient exposed area for the first and second terminal electrodes.

[0053] In the above-described electronic component, the surface of the first terminal electrode included in each of the multiple element sections may be recessed compared to the first main surface. This improves the adhesion between the first terminal electrode and the substrate via conductor when the component is embedded in a substrate.

[0054] In the above-described electronic component, the direction mark may be placed in a position where the directionality in a third direction perpendicular to the first main surface is visible. This makes it possible to visually identify the directionality in the third direction as well.

[0055] A component-embedded substrate according to one aspect of the present disclosure is a component-embedded substrate in which the above-mentioned electronic components are embedded, comprising: a plurality of first wiring patterns; a plurality of second wiring patterns; a plurality of first substrate via conductors connecting the plurality of first wiring patterns and the plurality of element portions, respectively, to each other; and a plurality of second substrate via conductors connecting the plurality of second wiring patterns and the plurality of element portions, respectively, to each other. With this, a sufficient contact area can be secured between the first terminal electrodes and the first substrate via conductors, and a sufficient contact area can be secured between the second terminal electrodes and the second substrate via conductors.

[0056] This application claims the interests of Japanese Patent Application No. 2024-190825, filed on 30 October 2024, the full disclosure of which is incorporated herein by reference.

[0057] 10 Component-embedded substrate 11-15 Insulating layer 20-22 Wiring pattern 31, 32 Substrate via conductor 100, 200, 300, 400 Electronic component 101 First main surface 102 Second main surface 103-106 Side surface 107 Recess 108 Protrusion 109 Directional mark 111-114 Coil section 121, 122 Terminal electrode 130 Interlayer insulating film 141-144 Terminal pattern 151, 152 Via conductor C11 Coil pattern L1, L2 Conductor layer M Magnetic element section

Claims

1. An electronic component comprising: a base body having a first main surface, a second main surface located opposite the first main surface, and a side surface perpendicular to the first and second main surfaces; and a plurality of element portions embedded in the base body and arranged in a first direction parallel to the first main surface, wherein each of the plurality of element portions includes a first terminal electrode whose end face is exposed to the first main surface and a second terminal electrode whose end face is exposed to the second main surface, and the side surface of the base body is provided with a direction mark that allows the direction in the first direction to be visually confirmed.

2. The electronic component according to claim 1, wherein the direction mark is formed by a recess provided on the side surface.

3. The electronic component according to claim 1, wherein the directional mark consists of a protrusion provided on the side surface.

4. Each of the plurality of element portions has a plurality of conductor layers, including first and second conductor layers, which are stacked in a second direction perpendicular to the first direction and parallel to the first main surface, and each of the plurality of element portions includes a first terminal pattern whose end face is exposed to the first main surface and constitutes a first part of the first terminal electrode, a second terminal pattern whose end face is exposed to the second main surface and constitutes a first part of the second terminal electrode, and a coil pattern whose one end is connected to the first terminal electrode and whose other end is connected to the second terminal electrode, and each of the plurality of element portions includes a third terminal pattern whose end face is exposed to the first main surface and constitutes a second part of the first terminal electrode, and a fourth terminal pattern whose end face is exposed to the second main surface and constitutes a second part of the second terminal electrode, and the first terminal pattern and the third terminal pattern included in each of the plurality of element portions are connected to each other via a first via conductor whose end face is exposed to the first main surface and constitutes a third part of the first terminal electrode. The electronic component according to claim 1, wherein the second terminal pattern and the fourth terminal pattern, each included in the plurality of element portions, have their end faces exposed to the second main surface and are connected to each other via a second via conductor that constitutes a third portion of the second terminal electrode.

5. The electronic component according to claim 4, wherein at least a portion of the first conductor layer and the second conductor layer, each included in the plurality of element portions, is covered by an interlayer insulating film, the first terminal electrode, each included in the plurality of element portions, is surrounded by the interlayer insulating film on the first main surface, and the second terminal electrode, each included in the plurality of element portions, is surrounded by the interlayer insulating film on the second main surface.

6. The electronic component according to claim 4, wherein the third terminal pattern is provided independently within the plane of the second conductor layer without being connected to other conductor patterns, and the fourth terminal pattern is provided independently within the plane of the second conductor layer without being connected to other conductor patterns.

7. The electronic component according to claim 6, wherein the thickness of the second conductor layer in the second direction is greater than the thickness of the first conductor layer in the second direction.

8. The electronic component according to claim 1, wherein the surface of the first terminal electrode included in each of the plurality of element portions is recessed compared to the first main surface.

9. The electronic component according to claim 1, wherein the direction mark is provided in a position where the direction in a third direction perpendicular to the first main surface can be visually identified.

10. A component-embedded substrate in which an electronic component according to any one of claims 1 to 9 is embedded, comprising: a plurality of first wiring patterns; a plurality of second wiring patterns; a plurality of first substrate via conductors connecting the plurality of first wiring patterns and the first terminal electrodes included in each of the plurality of element portions; and a plurality of second substrate via conductors connecting the plurality of second wiring patterns and the second terminal electrodes included in each of the plurality of element portions.

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