Imaging device and camera system
The imaging device addresses noise issues in miniaturized, stacked substrate designs by insulating through electrodes from third electrodes, enhancing signal and voltage transmission for improved image quality.
WO2026094412A1PCT designated stage Publication Date: 2026-05-07PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
- Filing Date
- 2025-09-02
- Publication Date
- 2026-05-07
Smart Images
Figure JP2025030875_07052026_PF_FP_ABST
Abstract
This imaging device comprises: a first substrate having a pixel region R1 in which a plurality of pixels are arranged and a peripheral region R2 adjacent to the pixel region R1, the first substrate including a semiconductor substrate and an insulating layer positioned above the semiconductor substrate; a pixel electrode positioned on the upper surface of the insulating layer in the pixel region R1; a photoelectric conversion layer positioned above the pixel electrode; a counter electrode positioned above the photoelectric conversion layer; a through electrode electrically connected to the pixels and penetrating the semiconductor substrate in the peripheral region R2; and a connection electrode positioned on the upper surface of the insulating layer in the peripheral region R2 and electrically connected to the counter electrode. The through electrode is electrically insulated from the connection electrode. In plan view, the through electrode does not overlap the connection electrode.
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Citation Information
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