Printed wiring board

The innovative conductor configuration in printed circuit boards optimizes current flow and reduces board size by minimizing electrical resistance and voltage drop through symmetrical conductor connections, addressing non-uniform current density issues.

WO2026094672A1PCT designated stage Publication Date: 2026-05-07KYOCERA CORP
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Patent Information

Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
KYOCERA CORP
Filing Date
2025-10-17
Publication Date
2026-05-07

AI Technical Summary

Technical Problem

Existing printed circuit boards face challenges in reducing electrical resistance and voltage drop in power supply paths due to non-uniform current density distribution, leading to increased board size and layer requirements.

Method used

The design incorporates a power supply layer with specific conductor configurations, including a conductor portion within a rectangular region and symmetrical conductor connection portions, defined by arcs and triangles, to optimize current flow and reduce electrical resistance while minimizing board area.

Benefits of technology

This configuration maintains low electrical resistance and reduces voltage drop, allowing for a more compact printed circuit board design without exceeding acceptable resistance limits.

✦ Generated by Eureka AI based on patent content.

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Abstract

This printed wiring board comprises a power supply layer having a conductor portion, a first conductor connection portion, and a second conductor connection portion. The conductor portion is located within a rectangular region, and the first conductor connection portion and the second conductor connection portion protrude from a first end portion and a second end portion, respectively, to the outside of the rectangular region at positions equidistant from one vertex of the rectangular region. The conductor portion includes: a peripheral region surrounded by a chord and a first arc, the chord being a line segment connecting a first point of the first end portion and a second point of the second end portion, and the first arc having the first point and the second point as both ends; and a triangular second region connecting the first point, the second point, and the vertex. The sine of a first angle formed by a first line segment connecting a first center point of the first arc and the vertex, and a second line segment connecting the first center point and the first point is 0.851 or less.
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Description

printed wiring board

[0001] This disclosure relates to printed circuit boards.

[0002] In printed circuit boards, techniques are known to widen the wiring width between terminals in the power supply path to reduce voltage drop due to electrical resistance and to ensure sufficient current capacity against load fluctuations. Furthermore, Japanese Patent Publication No. 2004-39686 describes a power supply plane shape that surrounds the power supply terminals to reduce impedance.

[0003] One aspect of the present disclosure includes a power supply layer having: [1] a conductor portion located in a rectangular region on a power supply path, having a first end located on a first side of the rectangular region and a second end on a second side of the rectangular region adjacent to the first side; a first conductor connection portion projecting outwards from the first end of the rectangular region on the path; and a second conductor connection portion projecting outwards from the second end of the rectangular region on the path, wherein the first distance between the first point furthest from the intersection of the first and second sides at the first end and the intersection is equal to the distance between the second point furthest from the intersection at the second end and the intersection; and the conductor portion includes a first region enclosed by a first circular arc with the first and second points as its ends and the chord, with the line segment connecting the first and second points as the chord; and a triangular second region connecting the first point, the second point and the intersection. A printed circuit board in which the sine of the first angle formed by the first line segment connecting the first center point of the first arc and the intersection point, and the second line segment connecting the first center point and the first point, is 0.851 or less.[2] A conductor portion located within a rectangular region on the path of power supply, having a first end portion located on a first side of the rectangular region and a second end portion on a second side of the rectangular region adjacent to the first side; A first conductor connection portion protruding from the first end portion to the outside of the rectangular region on the path; A second conductor connection portion protruding from the second end portion to the outside of the rectangular region on the path; A power supply layer having the above; A first distance between a first point farthest from an intersection of the first side and the second side at the first end portion and the intersection is equal to a distance between a second point farthest from the intersection at the second end portion and the intersection; The conductor portion includes: A first region surrounded by a first arc having the first point and the second point as both ends and the chord, with the line segment connecting the first point and the second point as the chord; A second region within a triangle connecting the first point, the second point, and the intersection; A sine of a first angle formed by a first line segment connecting the first center point of the first arc and the intersection and a second line segment connecting the first center point and the first point is 0.851 or less; The second region is a region surrounded by a second arc having a second center point on a straight line passing through the chord, the intersection, and the midpoint of the chord, a central angle of 90 degrees, a third line segment connecting the third point where the second arc contacts the first side and the first point, and a fourth line segment connecting the fourth point where the second arc contacts the second side and the second point; A second distance, which is a distance from the second center point to the third point and the fourth point, is 0.5 times or less of the first distance; A printed wiring board. [3] The peripheries of the first conductor connection portion and the second conductor connection portion include curved portions; The printed wiring board according to [1] or [2]. [4] The first conductor connection portion and the second conductor connection portion have the same shape; The printed wiring board according to [1] or [2].

[0004] This is a schematic plan view illustrating a printed circuit board and a power supply path. This is a schematic cross-sectional view illustrating a printed circuit board and a power supply path. This is a diagram illustrating an embodiment of the conductor. This is a diagram illustrating an embodiment of the conductor. This is a distribution diagram obtained by numerical simulation of the current density and current direction flowing through a reference conductor. This is a diagram showing the distribution of current density and current direction obtained by numerical simulation. This is a diagram showing the distribution of current density and current direction obtained by numerical simulation. This is a chart showing the results of numerical simulation related to the shape of the conductor. This is a diagram illustrating another embodiment of the conductor. This is a diagram showing the distribution of current density and current direction obtained by numerical simulation. This is a chart showing the results of numerical simulation related to the shape of the second region of the conductor. This is a diagram showing another embodiment of the current path.

[0005] The embodiments will be described below with reference to the drawings. Figure 1A is a schematic plan view of a power supply path connecting a first IC 5, which is the power source, and a second IC 6, which receives power, on the same layer as the ICs. Figure 1B is a schematic cross-sectional view along cross-sectional line i-i when the first IC 5 and the second IC 6 are mounted on a printed circuit board 1 and the power supply path is located on the same layer as the ICs.

[0006] As shown in Figure 1A, the printed circuit board 1 has a first IC 5 that is the power source and a second IC 6 that receives power. There may be multiple second ICs 6. The current or voltage that each of the multiple second ICs 6 receives may be a constant current or a constant voltage. The voltages that the multiple second ICs 6 receive may be different from each other. Other electronic components 7 that are not related to the supply and demand of power may be located on the printed circuit board 1.

[0007] The first IC 5 has an output terminal 51. The output terminal 51 is connected to the first conductor connection part 21. The second IC 6 has an input terminal 61. The input terminal 61 is connected to the second conductor connection part 22. The first conductor connection part 21 and the second conductor connection part 22 are connected by a conductor part 10, which is a planar power supply plane. The power supply path is in the order of output terminal 51, first conductor connection part 21, conductor part 10, second conductor connection part 22, and input terminal 61.

[0008] The first IC 5 and / or the second IC 6 may be located in a different conductor layer on the printed circuit board 1 from the power supply layer 2 which includes the conductor portion 10. In this case, the output terminal 51 and the first conductor connection portion 21, and the input terminal 61 and the second conductor connection portion 22 may be connected via through conductors that penetrate the insulating layer between the conductor portion 10 and the first IC 5 and / or the second IC 6. If the insulating layer 4 is, for example, solder resist, the first conductor connection portion 21 exposed at an opening in the solder resist and the output terminal 51 are connected by solder S. Also, the second conductor connection portion 22 exposed at an opening in the solder resist and the input terminal 61 are connected by solder S. The power supply layer 2 may be located in an inner layer of the printed circuit board 1 which has a multilayer structure. Note that the sizes of the first IC 5, the second IC 6 and the conductor portion 10 shown in Figures 1A and 1B do not necessarily reflect the ratio of their actual sizes for illustrative purposes.

[0009] Figures 2A and 2B illustrate an embodiment of the conductor portion 10. As shown in Figure 2A, the power supply layer 2 has a conductor portion 10, a first conductor connection portion 21, and a second conductor connection portion 22. The conductor portion 10 connects the first conductor connection portion 21 and the second conductor connection portion 22 on the substrate. The first end portion 21L, which forms the boundary line between the conductor portion 10 and the first conductor connection portion 21, is located in the range Y > 0 on the Y axis. The second end portion 22L, which forms the boundary line between the conductor portion 10 and the second conductor connection portion 22, is located in the range X > 0 on the X axis. That is, the first end portion 21L and the second end portion 22L are perpendicular. The conductor portion 10 is located within a rectangular region 10F where X ≥ 0 and Y ≥ 0. The intersection point O of the X-axis, which is the second side of the rectangular region 10F, and the Y-axis, which is the first side of the rectangular region 10F, i.e., the point where X = 0 and Y = 0, is one of the vertices of the rectangular region 10F. The first conductor connection portion 21 protrudes outward from the first end portion 21L of the rectangular region 10F. The second conductor connection portion 22 protrudes outward from the second end portion 22L of the rectangular region 10F. The conductor portion 10 may be used when the first conductor connection portion 21 and the second conductor connection portion 22 cannot be arranged facing each other.

[0010] The first conductor connection portion 21 and the second conductor connection portion 22 may have the same shape, for example, they may be squares of the same size. Therefore, the first end portion 21L and the second end portion 22L have the same length. The first distance d between the first point 21E, which is furthest from the intersection O, and the intersection O of the first end portion 21L is equal to the distance between the second point 22E, which is furthest from the intersection O, and the intersection O of the second end portion 22L.

[0011] The conductor portion 10 consists of a rectangular central region 121 formed by connecting the ends of the first end 21L and the second end 22L with a straight line, and peripheral regions 122 and 11 that are in contact with two sides 121a and 121b of the central region 121, respectively, which do not include the first end 21L or the second end 22L. From the positional relationship of the first end 21L, the second end 22L, the first point 21E, and the second point 22E, the sides 121a and 121b are parallel and intersect the X and Y axes at 45 degrees, respectively. Therefore, the central region 121 has a trapezoidal shape.

[0012] The peripheral region 122 is tangent to the side 121a of the two sides 121a and 121b that is closer to the intersection point O, and is located on the side of the intersection point O relative to the central region 121 in the rectangular region 10F. Therefore, the peripheral region 122 is located within a right-angled triangular region with side 121a as the base and the intersection point O as the vertex. Here, the peripheral region 122 may be the entire right-angled triangular region. In one embodiment, the peripheral region 122 and the central region 121 form the second region 12. Therefore, the second region 12 is also located within a right-angled triangular region with the intersection point O as the vertex, and the second region 12 may be the entire right-angled triangular region.

[0013] The peripheral region 11 is the region tangent to the edge 121b connecting the first point 21E and the second point 22E. The peripheral region 11 is the area within the rectangular region 10F of the circle whose center is the first center point C, further cut by the edge 121b. The first point 21E and the second point 22E are points on the circumference of the circle. That is, the distance between the first center point C and the first point 21E, and the distance between the first center point C and the second point 22E are both equal to the radius r0 of the circle. In one embodiment, the peripheral region 11 constitutes the first region. Therefore, the boundary between the peripheral region 11, which is the first region, and the second region 12 is the edge 121b.

[0014] From the above positional relationship, the line LH passing through the first center point C and the intersection point O is the angle bisector of the right angle, which is the angle between the X and Y axes. Line LH is also the angle bisector of sides 121a and 121b. The distance of the first center point C from the X and Y axes is less than or equal to the first distance d, and may be smaller than the first distance d. Therefore, a part of the circle may extend into the region where X < 0, and another part may extend into the region where Y < 0. In one embodiment, the circle may extend into the regions where X < 0 and Y < 0 on the side of the intersection point O, respectively, from the first point 21E and the second point 22E. In this case, the first region is the shape enclosed by the first circular arc A1 of the first center point C, which connects the first point 21E and the second point 22E and passes through a position further from the intersection point O than the central region 121, with the line segment connecting the first point 21E and the second point 22E as the chord, and the aforementioned chord. The central angle φ0 of the first circular arc A1 is greater than 180 degrees and less than 270 degrees; that is, the first circular arc A1 is larger than a semicircle. The first angle φ formed by the second line segment LE connecting the first center point C and the first point 21E, and the first line segment of the line LH connecting the first center point C and the intersection point O, is expressed as (2π - φ0) / 2. r0・sin(φ) is d / (2) 1/2 These are fixed values. The ranges for the central angle φ0 and the first angle φ will be described later.

[0015] On the other hand, as shown in Figure 2B, in one embodiment, the circle may extend into regions where X < 0 and Y < 0 on the sides further from the intersection point O than the first point 21E and the second point 22E, respectively. In this case, the central angle φ0 of the first arc A1 is greater than 270 degrees. Consequently, compared to the case in Figure 2A, the first angle φ is smaller and the radius r0 of the first arc A1 is larger. In this case, the first region is a part of the shape enclosed by the first arc A1 of the first center point C, which passes further from the intersection point O than the central region 121, and the chord connecting the first point 21E and the second point 22E, and is located within the rectangular region 10F. That is, the first region has a shape in which a part of the shape is cut by the X axis and the Y axis.

[0016] Next, the central angle φ0 and the first angle φ will be explained. The conductor portion 10 needs to have low electrical resistance in order to reduce voltage drop and heat generation in the power supply path. Electrical resistance is proportional to the length of the wiring and inversely proportional to the cross-sectional area. Here, the length corresponds to the length of the central region 121 and is a fixed value. Therefore, increasing the cross-sectional area is necessary to reduce the electrical resistance.

[0017] However, the widths of the first end 21L and the second end 22L are narrower than those of the conductor portion 10. As a result, the current density flowing through the conductor portion 10 is not uniform, even if the width perpendicular to the extension direction of the central region 121 is simply wider. That is, in regions where the width rapidly increases, the current does not diffuse immediately, and in regions where the width rapidly decreases, the current does not converge immediately.

[0018] Figure 3 is a distribution diagram obtained by numerical simulation of the current density and current direction flowing through the reference conductor section. In this numerical simulation, the electrical resistance of the conductor section 10 is calculated by the voltage drop when a current of 1A flows with an input voltage of 1V to the first conductor connection section 21, between the first conductor connection section 21 and the second conductor connection section 22, each measuring 4mm × 4mm × 0.03556mm. The insulating layer on which the power plane conductor section 10 is formed corresponds to Panasonic®'s R-1766, and has a thickness of 30μm, a relative permittivity of 4.6, and a dielectric loss tangent of 0.014. On this insulating layer, the conductor section 10 is formed of copper (electrical conductivity ρ = 5.959E + 07S / m) with a thickness of 35.56μm. The upper surface of the conductor section 10 is covered with a solder resist (relative permittivity of 4.2, dielectric loss tangent of 0.021) with a thickness of 30μm. The resistance value of the conductor portion 10 under the above conditions was calculated using Cadence Power DC ver. 17 from Cadence Design Systems, Inc. (Cadence; registered trademark).

[0019] In this example, to illustrate the "rectangle" shape, the conductor section 10 is a conventional rectangular shape, and the conductor section 10 is 250 mm x 250 mm in size. The first conductor connection section 21 and the second conductor connection section 22 are located at points 80 mm apart in the vertical and horizontal directions from a common vertex, respectively, with the first point 21E and the second point 22E positioned thereto.

[0020] In this case, the current flows linearly from the first conductor connection 21 to the second conductor connection 22, and also tends to diverge in an arc shape to the upper left and converge to the lower right. The flow along the four sides, especially at the four corners, is relatively small. In other words, it can be seen that the area near the four corners contributes relatively little to the increase in electrical resistance within this rectangle.

[0021] The resistance value of the conductor 10 at this time is the reference resistance value, and the upper limit of the allowable resistance value is set to 110% of the reference resistance value, i.e., a change rate of 10%. The reason for limiting the change rate of resistance to 10% or less is that, in the connection reliability evaluation of via conductors, it is common to judge a failure if the resistance value after environmental reliability tests such as temperature cycling exceeds 10% of the initial value. This concept of connection reliability evaluation is brought into the electrical characteristic simulation, and the value that does not indicate a failure, i.e., 10% or less, is adopted as the allowable amount of change in the power supply path of this embodiment.

[0022] Figures 4A and 4B show the distribution of current density and current direction obtained from numerical simulations. In Figure 4A, a semicircle with a diameter equal to the line segment connecting the first point 21E and the second point 22E is defined as the first region, the peripheral region 11. That is, the radius of the semicircle is 56.5 mm, the central angle φ0 is 180 degrees, and the first angle φ is 90 degrees. The first point 21E, the second point 22E, and the lower left corner of the above rectangular region are the three vertices, and a right-angled isosceles triangle with two sides enclosing the right angle having lengths of 80 mm is defined as the second region 12. Compared to the peripheral region 11, the direction of the current curves somewhat sharply near the right angle in the second region 12, which is assumed to contribute to an increase in electrical resistance.

[0023] In Figure 4B, the peripheral region 11 is defined as the first region, with a radius of 66.5 mm defined by the line segment connecting the first point 21E and the second point 22E as the chord. That is, the central angle φ0 is 243.4 degrees, and the first angle is 58.3 degrees. The shape of the second region 12 is the same as in Figure 4A. Compared to the example in Figure 4A, the current concentration near the first conductor connection 21 and the second conductor connection 22 in the peripheral region 11 is reduced, and the current density along the arc is also reduced. As a result, it is assumed that the peripheral region 11 contributes to reducing the increase in electrical resistance compared to the example in Figure 4A.

[0024] Figure 5 is a chart showing the results of a numerical simulation related to the shape of the conductor. The reference resistance value in the reference rectangle shown in Figure 3 was 0.00216 Ω. Therefore, the allowable resistance value is 0.00238 Ω. In the case of the semicircular peripheral region 11 shown in Figure 4A, the resistance value is 0.00264 Ω, which is greater than the allowable resistance value. When the first center point C of the first region is moved and the radius of the arc of the first region is increased by 5 mm, the resistance value decreases to 0.00241 Ω, but this is still greater than the allowable resistance value. When the radius of the first arc A1 of the first region is further increased by 5 mm to 66.5 mm, that is, in the example of Figure 4B, the resistance value is 0.00237 Ω, which is less than or equal to the allowable resistance value. In this case, the ratio of the size of the conductor 10 to the original reference rectangle is 20.2%. That is, even if the area of ​​the conductor 10 is reduced to about 1 / 5, the electrical resistance of the conductor 10 remains within the allowable range. The first angle φ at which the resistance is 0.00238Ω or less is 58.3 degrees or less, and its sine is 0.851 or less.

[0025] Figure 6 illustrates another embodiment of the conductor portion 10. Instead of reducing the peripheral region 11 of the conductor portion 10 to the absolute minimum below the allowable resistance value, it is also possible to reduce the size of the second region 12 while maintaining a margin in the size of the peripheral region 11. Such a conductor portion 10 may be used when it is necessary to reduce the area near the intersection O due to the positional relationship with other components on or around the substrate.

[0026] For example, with respect to the shape of the conductor portion 10 shown in Figure 4B, the second region 12 may be defined by a second circular arc A2 centered at the second center point C2. The second circular arc A2 is part of the circumference of a circle with radius r2 that is tangent to the X and Y axes. In other words, the second center point C2 of the second circular arc A2 lies on a straight line passing through the intersection point O and the chord of the first circular arc A1, i.e., the midpoint of the line segment connecting the first point 21E and the second point 22E, and the radius r2 is equal to the second distance, which is the distance of the second center point C2 from the X and Y axes. Therefore, the peripheral region 122a of the second region 12 is the shape of the above isosceles triangle with the corner containing the intersection point O rounded. Here, the radius r2 is half of the first distance d. In the second region 12, the fourth point 14E, where the second arc A2 touches the X-axis, and the second point 22E are connected by a fourth line segment along the X-axis, and the third point 13E, where the second arc A2 touches the Y-axis, and the first point 21E are connected by a third line segment along the Y-axis. Therefore, it is assumed that the larger the radius r2, the larger the excluded area and the greater the electrical resistance.

[0027] Figure 7 shows the distribution of current density and current direction obtained from numerical simulation. The shape of the conductor portion 10 in Figure 7 is the same as the shape shown in Figure 6. The area over which current flows in the second region 12 is smaller than in Figure 4B, but the direction changes continuously along the second arc A2. Therefore, the effect on the increase in electrical resistance is small.

[0028] Figure 8 is a diagram showing the results of a numerical simulation related to the shape of the second region 12 of the conductor. As described above, the reference resistance value is 0.00216 Ω, and the allowable resistance position is 1.1 times that value, i.e., 0.00238 Ω. As shown in Figure 5, when the second region 12 is a right-angled isosceles triangle enclosed by side 121b, the X axis, and the Y axis, that is, when it is a semicircle with a radius of half the length of side 121b, and X≧0 and Y≧0, the rate of increase in electrical resistance is 110%. When the boundary of the second region 12 is defined by the second circular arc A2 with a radius of 40.0 mm as shown in Figures 6 and 7, the electrical resistance value is 0.00238 Ω, and the rate of increase in resistance is 110%. When the radius of the second circular arc A2 is increased beyond this, the electrical resistance value exceeds 0.00238 Ω, and the rate of increase in resistance exceeds 110%. In other words, if the second distance, which is the radius of the second arc A2, is 0.5 times or less of the first distance d, it is possible to reduce the second region 12 within a range where the resistance value remains within the allowable resistance value.

[0029] Figure 9 shows another embodiment of the current path. The shape of the conductor portion 10 shown in Figure 9 is the same as the shape shown in Figure 2A. In one embodiment, the first conductor connection portion 21 and the second conductor connection portion 22 may each have curved sides that are different from the first end portion 21L and the second end portion 22L. The curved portion may have a diameter equal to the length of the first end portion 21L and the second end portion 22L and overlap with the circumference of a circle tangent to the first end portion 21L or the second end portion 22L. The shapes of the first conductor connection portion 21 and the second conductor connection portion 22 may correspond to the shapes of the input terminal 61 and the output terminal 51 to which they are connected, respectively.

[0030] As described above, in one embodiment, the printed circuit board 1 comprises a power supply layer 2 having a conductor portion 10, a first conductor connection portion 21, and a second conductor connection portion 22. The conductor portion 10 is located within a rectangular region 10F on the power supply path and has a first end portion 21L on the first side along the Y-axis of the rectangular region 10F, and a second end portion 22L on the second side along the X-axis of the rectangular region 10F that is in contact with the first side at intersection point O. The first conductor connection portion 21 protrudes outward from the first end portion 21L on the path. The second conductor connection portion 22 protrudes outward from the second end portion 22L on the path. The first distance d between the first point 21E, which is furthest from the intersection point of the first and second sides at the first end portion 21L, and the intersection point O is equal to the distance between the second point 22E, which is furthest from the intersection point O at the second end portion 22L, and the intersection point O. The conductor portion 10 includes a peripheral region 11, which is a first region, and a second region 12. The peripheral region 11 is enclosed by a first circular arc A1 with the first point 21E and the second point 22E as its ends, and a chord formed by a line segment connecting the first point 21E and the second point 22E. The second region 12 has a triangular shape formed by the first point 21E, the second point 22E, and the intersection point O. The sine of the first angle φ formed by the first line segment connecting the first center point C of the first circular arc A1 and the intersection point O, and the second line segment LE connecting the first center point C and the first point 21E, is 0.851 or less. Conventionally, if the wiring width is increased, the area occupied by the wiring increases accordingly. Therefore, there was a problem that at least one of the required size and number of layers of the printed circuit board also increased. In this disclosure, when the first conductor connection portion 21 and the second conductor connection portion 22 are connected to the conductor portion 10 at a 90-degree angle, the area of ​​the second region 12, which is on the inner corner side of the conductor portion 10, becomes smaller. By compensating for this reduction in the conductor portion 10 and defining an appropriate central angle φ0 and first angle φ shape region as the first region, which is the peripheral region 11, the area of ​​the conductor portion 10 can be effectively reduced, thereby reducing the required space, while maintaining the electrical resistance of the conductor portion 10 within an acceptable range.

[0031] Alternatively, in another embodiment, a printed circuit board 1 having a power supply layer 2 having a conductor portion 10, a first conductor connection portion 21, and a second conductor connection portion 22 in the above-described positional relationship, wherein the second region 12 is located within a triangle formed by the first point 21E, the second point 22E, and the intersection point O. The second region 12 is the region enclosed by a chord, a second circular arc A2 having a central angle of 90 degrees and a second center point C2 on a straight line passing through the intersection point O and the midpoint of the chord, a third line segment connecting the third point 13E where the second circular arc A2 is tangent to the first side and the first point 21E, and a fourth line segment connecting the fourth point 14E where the second circular arc A2 is tangent to the second side and the second point 22E. The second distance, which is the distance from the second center point C2 of the second circular arc A2 to the third point 13E and the fourth point 14E, i.e., the radius r2 of the second circular arc A2, is 0.5 times or less of the first distance d. In this way, by creating a second circular arc A2 with rounded corners at the peripheral region 122a of the second region 12, rather than making the peripheral region 11 at the very limit of the allowable electrical resistance, it is possible to leave some margin in the inner corner region between the first conductor connection portion 21 and the second conductor connection portion 22. This makes it possible to reduce the area of ​​the conductor portion 10 while maintaining the electrical resistance within the allowable range, and to provide more flexibility in connecting components to the printed circuit board 1.

[0032] Furthermore, the periphery of the first conductor connection portion 21a and the periphery of the second conductor connection portion 22a may include a curved portion. In this way, the shape of the first conductor connection portion 21a and the second conductor connection portion 22a can be changed, making it possible to match the shape of the terminals to which they are connected without increasing the area unnecessarily.

[0033] Furthermore, the first conductor connection portion 21 and the second conductor connection portion 22 may have the same shape. Since the input and output of current to the conductor portion 10 can be made symmetrical, the bias in the current density distribution in the conductor portion 10 can be easily reduced.

[0034] The above embodiment is illustrative and can be modified in various ways. For example, the shapes of the first conductor connection portion 21 and the second conductor connection portion 22 may be different from each other, and their sizes may also be different.

[0035] Furthermore, the specific details such as structure, configuration, materials, and size shown in the above embodiments may be modified as appropriate without departing from the spirit of this disclosure. The scope of the present invention includes the scope of the invention as described in the claims and its equivalents.

[0036] This disclosure can be used in printed circuit boards.

[0037] 1 Printed circuit board 2 Power layer 4 Insulation layer 5 First IC 51 Output terminal 6 Second IC 61 Input terminal 7 Electronic component 10 Conductor section 10F Rectangular region 11, 122, 122a Peripheral region 12 Second region 121 Central region 13E Third point 14E Fourth point 21, 21a First conductor connection 21L First end 21E First point 22, 22a Second conductor connection 22L Second end 22E Second point A1 First arc A2 Second arc C First center point C2 Second center point O Intersection

Claims

1. A power supply layer comprising: a conductor portion located within a rectangular region on a power supply path, having a first end located on the first side of the rectangular region and a second end on the second side of the rectangular region adjacent to the first side; a first conductor connection portion projecting outwards from the first end on the path to the outside of the rectangular region; and a second conductor connection portion projecting outwards from the second end on the path to the outside of the rectangular region, wherein the first distance between the first point furthest from the intersection of the first and second sides at the first end and the intersection is equal to the distance between the second point furthest from the intersection at the second end and the intersection; the conductor portion includes: a first region enclosed by a first circular arc with the first and second points as its ends and the chord, with the line segment connecting the first and second points as the chord; and a triangular second region connecting the first point, the second point and the intersection. A printed circuit board in which the sine of the first angle formed by the first line segment connecting the first center point of the first arc and the intersection point, and the second line segment connecting the first center point and the first point, is 0.851 or less.

2. A power supply layer comprising: a conductor portion located within a rectangular region on a power supply path, having a first end located on the first side of the rectangular region and a second end on the second side of the rectangular region adjacent to the first side; a first conductor connection portion projecting outwards from the first end on the path to the outside of the rectangular region; and a second conductor connection portion projecting outwards from the second end on the path to the outside of the rectangular region, wherein the first distance between the first point furthest from the intersection of the first and second sides at the first end and the intersection is equal to the distance between the second point furthest from the intersection at the second end and the intersection; the conductor portion includes: a first region enclosed by a first circular arc with the first and second points as its ends and the chord, with the line segment connecting the first and second points as the chord; and a second region within a triangle connecting the first point, the second point and the intersection. Printed circuit board, wherein the sine of the first angle formed by the first line segment connecting the first center point of the first arc and the intersection point, and the second line segment connecting the first center point and the first point, is 0.851 or less, the second region is the region enclosed by the chord, the second arc having a central angle of 90 degrees and having its second center point on a straight line passing through the intersection point and the midpoint of the chord, the third line segment connecting the third point where the second arc is tangent to the first side and the first point, and the fourth line segment connecting the fourth point where the second arc is tangent to the second side and the second point, and the second distance, which is the distance from the second center point to the third and fourth points, is 0.5 times or less the first distance.

3. The printed circuit board according to claim 1 or 2, wherein the periphery of the first conductor connection portion and the periphery of the second conductor connection portion include a curved portion.

4. The printed circuit board according to claim 1 or 2, wherein the first conductor connection portion and the second conductor connection portion have the same shape.

Citation Information

Patent Citations

  • Circuit board and electronic apparatus

    JP2004039686A

  • Printed wiring board

    WO2024204500A1