Circuit board and semiconductor package comprising same
The circuit board design addresses miniaturization and reliability issues by using a dummy trench and capacitor structures to enhance stress-dissipation and bonding strength, ensuring efficient electrical connections and signal integrity.
WO2026095455A1PCT designated stage Publication Date: 2026-05-07LG INNOTEK CO LTD
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- LG INNOTEK CO LTD
- Filing Date
- 2025-10-20
- Publication Date
- 2026-05-07
Smart Images
Figure KR2025016571_07052026_PF_FP_ABST
Abstract
Disclosed is a circuit board according to an embodiment of the present invention comprising a first insulation layer, and a second insulation layer disposed on the first insulation layer, the second insulation layer comprising protrusions disposed in dummy trenches penetrating at least a portion of the first insulation layer, and thermal expansion coefficient of the first insulation layer being smaller than that of the second insulation layer.
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Citation Information
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