Battery management assembly and apparatus
By separating and spacing the BMS control board from the heat-generating modules in the battery management system, and combining this with an aluminum substrate structure, the problem of inadequate heat dissipation in the BMS was solved, resulting in more efficient heat dissipation and a simplified circuit design.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- SHANGHAI BAICHENG ELECTRONICS
- Filing Date
- 2024-12-24
- Publication Date
- 2026-05-15
AI Technical Summary
In existing battery management systems, the BMS and other electrical components generate significant heat, resulting in poor heat dissipation and complex and cumbersome circuit design.
The BMS control board is separately mounted on the PCB board from the sampling module, current control module, and current limiting module, which generate a lot of heat. They are also spaced at different locations. Combined with the structural design of the circuit layer, insulation layer, and metal layer of the aluminum substrate, the heat dissipation effect is enhanced.
It improves the heat dissipation of the BMS control board, simplifies circuit design, reduces the difficulty of manufacturing process, and reduces the need for heat dissipation structures.
Smart Images
Figure CN2024141719_15052026_PF_FP_ABST
Abstract
Description
Battery management components and devices
[0001] This application claims priority to Chinese Patent Application No. 202411565757.5, filed on November 5, 2024, and Chinese Patent Application No. 202422695210.9, filed on November 5, 2024, the entire contents of which are incorporated herein by reference. Technical Field
[0002] This application relates to the field of battery management technology, and for example to a battery management component and device. Background Technology
[0003] With the continuous development of battery technology, the discharge current of individual battery cells is increasing, and the internal resistance of individual cells is decreasing. This places increasingly higher demands on the discharge current of the Battery Management System (BMS), leading to more severe heat generation in other electrical components connected to the BMS. Additional heat dissipation structures are needed for the BMS, and the circuit design must avoid high-temperature areas. This makes the circuit design more complex, the manufacturing process more intricate, and the concentration of multiple components together, causing mutual interference in heat dissipation, resulting in unsatisfactory heat dissipation. Summary of the Invention
[0004] This application provides a battery management component and device to improve the heat dissipation of the BMS control board and simplify circuit design.
[0005] This application provides a battery management component, including: a PCB board and a BMS control board;
[0006] One side of the PCB board is provided with the BMS control board, positive connection module, negative connection module, sampling module, current control module and current limiting module; the BMS control board, the positive connection module, the negative connection module, the sampling module, the current control module and the current limiting module are arranged at intervals;
[0007] One end of the negative electrode connection module is connected to the negative electrode of the battery, and the other end of the negative electrode connection module is connected to one end of the sampling module through the PCB board. The other end of the sampling module is connected to one end of the current control module through the PCB board, and the other end of the current control module is connected to the first end of the BMS control board through the PCB board.
[0008] One end of the positive electrode connection module is connected to the positive electrode of the battery, and the other end of the positive electrode connection module is connected to one end of the current limiting module through the PCB board. The other end of the current limiting module is connected to the second end of the BMS control board.
[0009] In one embodiment, the battery management component further includes at least one heat dissipation module, one end of which is connected to the battery, and the other end of which is connected to a third terminal of the BMS control board via the PCB board. The third terminal of the BMS control board collects battery information from the battery.
[0010] In one embodiment, the positive electrode connection module includes a positive electrode connection patch, the top surface of which is connected to the positive electrode of the battery, and the bottom surface of which is connected to the PCB board.
[0011] The negative electrode connection module includes a negative electrode connection patch, the top surface of which is connected to the negative electrode of the battery, and the bottom surface of which is connected to the PCB board.
[0012] Each of the at least one heat dissipation module includes a heat dissipation connection patch, the top surface of which is connected to the positive / negative terminal of the battery, and the bottom surface of which is connected to the PCB board.
[0013] In one embodiment, the BMS control board includes a first connecting portion, a second connecting portion, and at least one third connecting portion, wherein the first connecting portion, the second connecting portion, and the at least one third connecting portion include a plurality of connecting grooves; the plurality of connecting grooves are disposed on the edge of the BMS control board;
[0014] The first end of the BMS control board is connected to the current control module through the connection groove of the first connection part, the second end of the BMS control board is connected to the current limiting module through the connection groove of the second connection part, and the third end of the BMS control board is connected to the heat dissipation module through the connection groove of the at least one third connection part.
[0015] In one embodiment, the at least one connection groove is further configured to connect the BMS control board to the PCB board.
[0016] In one embodiment, the sampling module includes a sampling resistor, the current control module includes a MOSFET, and the current limiting module includes a fuse.
[0017] In one embodiment, the PCB board includes an aluminum substrate, the aluminum substrate comprising:
[0018] Circuit layer,
[0019] An insulating layer is disposed on the side of the circuit layer away from the BMS control board;
[0020] A metal layer is disposed on the side of the insulating layer away from the BMS control board.
[0021] Optionally, the positive electrode connection patch, the negative electrode connection patch, and the heat dissipation patch comprise copper.
[0022] This application also provides a battery management device, including the battery management component described in any of the first aspects.
[0023] In one embodiment, the battery management device further includes a battery bracket, in which a plurality of battery cells are disposed, the positive terminals of the plurality of battery cells being connected to the positive terminal connection patch via the battery bracket, and the negative terminals of the plurality of battery cells being connected to the negative terminal connection patch via the battery bracket. Attached Figure Description
[0024] Figure 1 is a schematic diagram of a battery management component according to an embodiment of this application;
[0025] Figure 2 is a schematic diagram of another battery management component provided according to an embodiment of this application;
[0026] Figure 3 is a schematic diagram of another battery management component provided according to an embodiment of this application;
[0027] Figure 4 is a schematic diagram of the PCB board structure of a battery management component according to an embodiment of this application;
[0028] Figure 5 is a schematic diagram of a battery management device provided according to an embodiment of this application. Detailed Implementation
[0029] The technical solutions of the embodiments of this application will now be described with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of this application.
[0030] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.
[0031] Figure 1 is a schematic diagram of a battery management component according to an embodiment of this application. Referring to Figure 1, the battery management component includes: a PCB board 100 and a BMS control board 200; one side of the PCB board 100 is provided with a BMS control board 200, a positive electrode connection module 110, a negative electrode connection module 120, a sampling module 130, a current control module 140, and a current limiting module 150; the BMS control board 200, the positive electrode connection module 110, the negative electrode connection module 120, the sampling module 130, the current control module 140, and the current limiting module 150 are arranged at intervals; one end of the negative electrode connection module 120 is connected to the negative electrode of the battery, and the negative electrode connection module 120... The other end of module 20 is connected to one end of sampling module 130 via PCB board 100. The other end of sampling module 130 is connected to one end of current control module 140 via PCB board 100. The other end of current control module 140 is connected to the first end of BMS control board 200 via PCB board 100. One end of positive terminal connection module 110 is connected to the positive terminal of battery. The other end of positive terminal connection module 110 is connected to one end of current limiting module 150 via PCB board 100. The other end of current limiting module 150 is connected to the second end of BMS control board 200.
[0032] One side of the printed circuit board (PCB) has traces to achieve electrical connections between the BMS control board and the positive terminal connection module 110, negative terminal connection module 120, sampling module 130, current control module 140, and current limiting module 150. The BMS control board 200 is the core component of the battery management assembly. It monitors battery voltage, current, and temperature through connected devices such as the sampling module 130, current control module 140, and current limiting module 150. The sampling module 130, current control module 140, and current limiting module 150, which are directly connected to the battery's positive or negative terminals, experience higher current flows, resulting in higher temperatures and heat generation. In contrast, the current flowing through the BMS control board 200 itself is smaller, preventing excessive temperature and heat generation. Separating the BMS control board 200 from other high-heat-generating components reduces the temperature rise of the PCB board 100, thereby improving the overall heat dissipation of the battery management assembly. The positive connection module 110, negative connection module 120, sampling module 130, current control module 140 and current limiting module 150 can be arranged at intervals in different areas of the PCB board 100, thereby ensuring that the heat dissipation effect of multiple modules does not affect each other and further improving the heat dissipation effect.
[0033] It should be noted that this embodiment does not limit the positions of the positive electrode connection module 110, negative electrode connection module 120, sampling module 130, current control module 140, and current limiting module 150 on the PCB board 100. For example, as shown in FIG1, the BMS control board 200 can be located in the center of the PCB board 100, leaving space for other components to be arranged around the BMS control board 200. The positive electrode connection module 110 and negative electrode connection module 120 can be respectively located in the corners of the PCB board 100 to shorten the connection paths between the positive and negative electrodes of the battery and the positive electrode connection module 110 and negative electrode connection module 120, respectively. One end of the sampling module 130 is connected to the negative electrode connection module 120 via a trace on the PCB board 100, and the other end is connected to one end of the current control module 140 via a trace. The other end of the current control module 140 is connected to the first end of the BMS control board 200. The sampling module 130 can be a sampling resistor, and the BMS control board 200 can obtain battery information based on the current or voltage flowing through the sampling resistor. The current control module 140 can be a discharge metal-oxide-semiconductor field-effect transistor (MOS transistor). The current control module 140 can perform switching operations through the control signals of the BMS control board 200 to adjust the battery discharge state and prevent over-discharge. The sampling module 130 can be located on the edge of the PCB board 100 near the negative terminal connection module 120, and the current control module 140 can be located on the PCB board 100 near the BMS control board 200, thereby maintaining a certain distance between the sampling module 130 and the current control module 140 on the PCB board 100, reducing the impact between the heat dissipation of the sampling module 130 and the current control module 140. One end of the current limiting module 150 is connected to the positive terminal connection module 110 through a trace on the PCB board 100, and the other end is connected to the second end of the BMS control board 200 through a trace. The current limiting module 150 can be a fuse. When the current in the battery abnormally rises to a certain level and temperature, the current limiting module 150 can cut off the current to protect the components on the PCB board 100 from being burned out. The current limiting module 150 can be set on the PCB board 100 near the BMS control board 200 to reduce the heat dissipation impact between the positive connection module 110 and the current limiting module 150.
[0034] The battery management component provided in this application separates the BMS control board (which generates less heat) and the sampling module, current control module, and current limiting module (which generate more heat) on the PCB board. The sampling module, current control module, and current limiting module are also spaced out at different positions on the PCB board, thereby reducing the heat dissipation impact between multiple modules and improving the overall heat dissipation effect. It eliminates the need for an additional heat dissipation structure for the BMS control board, reducing the overall circuit design difficulty and simplifying the manufacturing process.
[0035] Optionally, referring to Figure 1 further, the battery management component also includes at least one heat dissipation module 160. One end of the heat dissipation module 160 is connected to the battery, and the other end of the heat dissipation module 160 is connected to the third end of the BMS control board 200 through the PCB board 100. The third end of the BMS control board 200 collects battery information.
[0036] Multiple battery cells can be installed inside the battery. Each battery cell is connected to the third terminal of the BMS control board 200 via a heat dissipation module 160 and traces on the PCB board 100, enabling the BMS control board 200 to monitor the battery information of each individual battery cell. This embodiment does not limit the position or number of heat dissipation modules 160 on the PCB board 100. For example, as shown in Figure 1, four heat dissipation modules 160 are installed on the PCB board 100, each connected to a battery cell. The heat dissipation modules 160 can be located at the edge of the PCB board 100, shortening the connection path between the individual battery cell and the BMS control board 200 while further improving the heat dissipation effect of the PCB board 100.
[0037] Optionally, Figure 2 is a schematic diagram of another battery management component provided according to an embodiment of this application. Based on the above embodiments, refer to Figure 2. The positive electrode connection module 110 includes a positive electrode connection patch 111, the top surface of which is connected to the positive electrode of the battery, and the bottom surface of which is connected to the PCB board 100; the negative electrode connection module 120 includes a negative electrode connection patch 121, the top surface of which is connected to the negative electrode of the battery, and the bottom surface of which is connected to the PCB board 100; the heat dissipation module 160 includes a heat dissipation connection patch 161, the top surface of which is connected to the positive / negative electrode of the battery, and the bottom surface of which is connected to the PCB board 100.
[0038] The positive electrode connection patch 111, negative electrode connection patch 121, and heat dissipation connection patch 161 can be metal foils of a certain shape. The metal foils can increase the contact area between the PCB board 100 and the positive / negative terminals of the battery, ensuring the stability of the circuit connection on the one hand; on the other hand, they can dissipate heat along the connection path between the PCB board 100 and the positive / negative terminals of the battery, improving heat dissipation. The bottom surfaces of the positive electrode connection patch 111, negative electrode connection patch 121, and heat dissipation connection patch 161 can be soldered to the PCB board 100. This embodiment does not specifically limit the shape and material of the metal foils. For example, as shown in FIG2, the positive electrode connection patch 111, negative electrode connection patch 121, and heat dissipation connection patch 161 can be set as rectangular copper foils.
[0039] Optionally, Figure 3 is a schematic diagram of another battery management component provided according to an embodiment of this application. Based on the above embodiments, refer to Figures 1 and 3. The BMS control board 200 includes a first connecting portion 210, a second connecting portion 220, and at least one third connecting portion 230. The first connecting portion 210, the second connecting portion 220, and the third connecting portion 230 each include a plurality of connecting grooves 300. The connecting grooves 300 are disposed on the edge of the BMS control board 200. The first end of the BMS control board 200 is connected to the current control module 140 through the connecting groove 300 of the first connecting portion 210, the second end of the BMS control board 200 is connected to the current limiting module 150 through the connecting groove 300 of the second connecting portion 220, and the third end of the BMS control board 200 is connected to the heat dissipation module 160 through the connecting groove 300 of the third connecting portion 230.
[0040] The first connecting portion 210, the second connecting portion 220, and the third connecting portion 230 can be respectively disposed on different end faces of the BMS control board 200, thereby reducing the heat dissipation impact between different connections. The BMS control board 200 has a certain thickness, and along the thickness direction, different numbers of connecting grooves 300 are provided on the edge portions of different end faces of the BMS control board 200. The BMS control board 200 can be connected to the current control module 140, the current limiting module 150, and the heat dissipation module 160 respectively through the connecting grooves 300 on the first connecting portion 210, the second connecting portion 220, and the third connecting portion 230. The connecting grooves 300 can increase the connection area between the BMS control board 200 and the current control module 140, the current limiting module 150, and the heat dissipation module 160, thereby further improving the heat dissipation effect. In this embodiment, the shape, size, and number of connecting grooves 300 on different connecting portions are not limited. For example, as shown in FIG3, six arc-shaped connecting grooves 300 may be provided on the first connecting portion 210 and the second connecting portion 220 respectively, and two arc-shaped connecting grooves 300 may be provided on the third connecting portion 230.
[0041] Optionally, based on the above embodiments, referring to Figures 1 and 3, the connecting groove 300 is also configured to connect the BMS control board 200 to the PCB board 100.
[0042] A flexible metal wire can be installed within the connecting groove 300. Based on the electrical connections between the BMS control board 200 and the current control module 140, current limiting module 150, and heat dissipation module 160, the BMS control board 200 is then fixedly connected to the PCB board 100. Alternatively, solder paste can be applied to the area where the PCB board 100 connects to the BMS control board 200 via the connecting groove 300, and the electrical and fixed connection between the BMS control board 200 and the PCB board 100 can be achieved through a soldering process. This embodiment does not limit the connection method between the BMS control board 200 and the PCB board 100 via the connecting groove.
[0043] Optionally, Figure 4 is a schematic diagram of the structure of a PCB board for a battery management component according to an embodiment of this application. Based on the above embodiment, refer to Figure 4. The PCB board 100 includes an aluminum substrate, which includes: a circuit layer 101; an insulating layer 102 disposed on the side of the circuit layer 101 away from the BMS control board 200; and a metal layer 103 disposed on the side of the insulating layer away from the BMS control board 200.
[0044] Connection traces can be provided on circuit layer 101, which can be obtained by etching copper foil. The BMS control board 200, positive connection module 110, negative connection module 120, sampling module 130, current control module 140, and current limiting module 150 are disposed on the surface of circuit layer 101 and electrically connected through the connection traces on circuit layer 101. Insulating layer 102 bonds circuit layer 101 and metal layer 103 together, serving both insulation and thermal conductivity functions. Heat generated by the devices on the surface of circuit layer 101 during operation is rapidly transferred to metal layer 103 through insulating layer 102, and then dissipated through metal layer 103, achieving heat dissipation for the devices on the surface of circuit layer 101. Metal layer 103 can be an aluminum plate, providing support for the entire PCB board 100 and improving the overall heat dissipation effect of the PCB board 100.
[0045] This application also provides a battery management device. The battery management device provided in this application includes the battery management component provided in any of the above embodiments, and has the beneficial effects of the battery management component provided in any of the above embodiments, which will not be repeated here.
[0046] Optionally, Figure 5 is a schematic diagram of a battery management device according to an embodiment of this application. Based on the above embodiment, refer to Figures 2 and 5. The battery management device further includes a battery holder 400, in which multiple battery cells are disposed. The positive terminals of the multiple battery cells are connected to a positive terminal connection patch 111 via the battery holder 400, and the negative terminals of the multiple battery cells are connected to a negative terminal connection patch 121 via the battery holder.
[0047] The battery bracket 400 can fix multiple battery cells together to form a battery pack. The PCB board 100 can be mounted on one side of the battery pack. The positive terminals of the multiple battery cells are combined and connected to the positive terminal of the battery pack and connected to the positive terminal connection piece 410 of the battery bracket 400. The negative terminals of the multiple battery cells are combined and connected to the negative terminal of the battery pack and connected to the negative terminal connection piece 420 of the battery bracket 400. The positive terminal connection piece 410 is connected to the positive terminal connection patch 111, and the negative terminal connection piece 420 is connected to the negative terminal connection patch 121, thereby transmitting the battery information of the battery pack to the BMS control board 200 through the PCB board 100. The battery bracket 400 is also provided with a cell connection piece 430. The positive or negative terminal of a single battery cell can be connected to a heat dissipation connection patch 161 through the cell connection piece 430, transmitting the information of the single battery cell to the BMS control board 200 through the PCB board 100.
[0048] It should be understood that the various processes shown above can be used to rearrange, add, or delete steps. For example, the multiple steps described in this application can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution of this application can be achieved, and this is not limited herein.
Claims
1. A battery management component, comprising: Printed circuit boards (PCBs) and battery management systems (BMS) control boards; One side of the PCB board is provided with the BMS control board, positive connection module, negative connection module, sampling module, current control module and current limiting module; the BMS control board, the positive connection module, the negative connection module, the sampling module, the current control module and the current limiting module are arranged at intervals; One end of the negative electrode connection module is connected to the negative electrode of the battery, and the other end of the negative electrode connection module is connected to one end of the sampling module through the PCB board. The other end of the sampling module is connected to one end of the current control module through the PCB board, and the other end of the current control module is connected to the first end of the BMS control board through the PCB board. One end of the positive electrode connection module is connected to the positive electrode of the battery, and the other end of the positive electrode connection module is connected to one end of the current limiting module through the PCB board. The other end of the current limiting module is connected to the second end of the BMS control board.
2. The battery management component according to claim 1 further includes at least one heat dissipation module, one end of the at least one heat dissipation module being connected to the battery, and the other end of the at least one heat dissipation module being connected to a third end of the BMS control board through the PCB board, wherein the third end of the BMS control board collects battery information of the battery.
3. The battery management component according to claim 2, wherein, The positive electrode connection module includes a positive electrode connection patch, the top surface of which is connected to the positive electrode of the battery, and the bottom surface of which is connected to the PCB board. The negative electrode connection module includes a negative electrode connection patch, the top surface of which is connected to the negative electrode of the battery, and the bottom surface of which is connected to the PCB board. Each of the at least one heat dissipation module includes a heat dissipation connection patch, the top surface of which is connected to the positive / negative terminal of the battery, and the bottom surface of which is connected to the PCB board.
4. The battery management component according to claim 2, wherein, The BMS control board includes a first connecting portion, a second connecting portion, and at least one third connecting portion. The first connecting portion, the second connecting portion, and the at least one third connecting portion include multiple connecting grooves. The multiple connecting grooves are disposed on the edge of the BMS control board. The first end of the BMS control board is connected to the current control module through the connection groove of the first connection part, the second end of the BMS control board is connected to the current limiting module through the connection groove of the second connection part, and the third end of the BMS control board is connected to the heat dissipation module through the connection groove of the at least one third connection part.
5. The battery management component according to claim 4, wherein, The at least one connection groove is further configured to connect the BMS control board to the PCB board.
6. The battery management component according to claim 1, wherein, The sampling module includes a sampling resistor, the current control module includes a metal-oxide-semiconductor field-effect transistor (MOS), and the current limiting module includes a fuse.
7. The battery management component according to claim 1, wherein, The PCB board includes an aluminum substrate, and the aluminum substrate includes: Circuit layer, An insulating layer is disposed on the side of the circuit layer away from the BMS control board; A metal layer is disposed on the side of the insulating layer away from the BMS control board.
8. The battery management component according to claim 2, wherein, The positive electrode connection patch, the negative electrode connection patch, and the heat dissipation patch all contain copper.
9. A battery management device comprising the battery management component according to any one of claims 1-8.
10. The battery management device according to claim 9 further includes a battery bracket, wherein a plurality of battery cells are disposed within the battery bracket, the positive terminals of the plurality of battery cells are connected to the positive terminal connection patch through the battery bracket, and the negative terminals of the plurality of battery cells are connected to the negative terminal connection patch through the battery bracket.