Double-anode thermal plasma-based sulfur hexafluoride conversion device and method

Abstract

The present invention relates to the technical field of sulfur hexafluoride degradation, and particularly to a double-anode thermal plasma-based sulfur hexafluoride conversion device and method. The device comprises: a ventilation assembly, which comprises a gas mixing member and a control member, the control member being arranged on the gas mixing member; a degradation assembly, which comprises a reaction member and a degradation member, the reaction member being arranged on the gas mixing member, and the degradation member being arranged on the reaction member; and a cooling and exhaust assembly, which comprises a cooling member and an exhaust member, the cooling member being arranged on the reaction member, and the exhaust member being arranged on the cooling member, such that high-concentration SF6 degradation can be realized. The degradation efficiency is high, and the degradation rate is relatively fast; the contents of degraded components can be visually displayed, and data investigation is very convenient; an arc-striking anode increases the arc length and arc pressure, thereby achieving a low-current input and a high-power output; and the main product after degradation is tungsten hexafluoride, and thus the exhaust gas after degradation is also recoverable.

Description

A sulfur hexafluoride conversion device and method based on dual-anode thermal plasma Technical Field

[0001] This invention relates to the technical field of sulfur hexafluoride (greenhouse gas) degradation, and in particular to a sulfur hexafluoride conversion device and method based on dual-anode thermal plasma. Background Technology

[0002] Sulfur hexafluoride (SF6) is a colorless, odorless, non-toxic, non-flammable, and non-explosive inert gas. In recent years, many commonly used environmental waste gas treatment methods have been applied to degrade SF6, including thermocatalytic degradation, photolysis, and electrolysis. Thermal plasma treatment technology, as a popular waste gas treatment method in recent years, has advantages such as convenience, simplicity, low energy consumption, and thorough treatment, and its application prospects are very broad. Furthermore, related technologies have already been reported to be applied in the treatment of SF6 waste gas.

[0003] Currently, methods for treating sulfur hexafluoride (SF6) gas include patents such as "Sulfur Hexafluoride Recovery and Treatment Process" (CN 104386652A, published on March 4, 2015) and "A Sulfur Hexafluoride Gas Recovery and Charging Device" (CN 107588325A, published on January 16, 2018). These patents mainly focus on the collection, purification, and storage of SF6 gas, and externally treat SF6 waste gas through methods such as thermal cracking and water washing.

[0004] To explore efficient degradation of SF6 waste gas that has not met the standards for fresh gas after purification and recycling, is difficult to reuse, or is about to be decommissioned, the study investigated the effects of different methods on its degradation effect. It was found that thermal plasma has a good degradation effect on SF6, and the degradation efficiency of SF6 can be greatly improved by using a dual-anode reactor with arc ignition voltage. Based on this, a sulfur hexafluoride conversion method and device based on dual-anode thermal plasma was prepared. Summary of the Invention

[0005] In view of the above-mentioned problems with the efficient degradation of SF6 waste gas that has not met the standards for new gas, is difficult to reuse, or is about to be decommissioned, this invention is proposed.

[0006] Therefore, the purpose of this invention is to provide a sulfur hexafluoride conversion device based on dual-anode thermal plasma.

[0007] To solve the above-mentioned technical problems, the present invention provides the following technical solution: a sulfur hexafluoride conversion device based on dual-anode thermal plasma, comprising,

[0008] A ventilation assembly includes a mixing element and a control element, the control element being disposed on the mixing element; and

[0009] A degradation component includes a reactant and a degradation component, the reactant being disposed on the gas mixing component, and the degradation component being disposed on the reactant; and,

[0010] A cooling exhaust assembly includes a cooling component and an exhaust component, wherein the cooling component is disposed on the reaction unit and the exhaust component is disposed on the cooling component.

[0011] As a preferred embodiment of the sulfur hexafluoride conversion device based on dual-anode thermal plasma of the present invention, the gas mixing component includes a first gas cylinder and a second gas cylinder, the first gas cylinder and the second gas cylinder are connected to a gas mixing instrument, the first gas cylinder and the second gas cylinder are horizontally arranged, the first gas cylinder contains a certain amount of SF6, and the second gas cylinder contains a certain amount of inert gas.

[0012] As a preferred embodiment of the sulfur hexafluoride conversion device based on dual-anode thermal plasma of the present invention, the control components include a first solenoid valve disposed on the first gas cylinder, a second solenoid valve disposed on the second gas cylinder, and a third solenoid valve disposed on the gas mixing instrument.

[0013] As a preferred embodiment of the sulfur hexafluoride conversion device based on dual-anode thermal plasma of the present invention, the reaction element includes a thermal plasma reactor installed on the gas mixing instrument, and an arc-starting anode and a cathode tube installed inside the thermal plasma reactor.

[0014] As a preferred embodiment of the sulfur hexafluoride conversion device based on dual-anode thermal plasma of the present invention, the degradation component includes an air pump disposed on the thermal plasma reactor, and a tungsten powder tank disposed on the air pump.

[0015] As a preferred embodiment of the sulfur hexafluoride conversion device based on dual-anode thermal plasma of the present invention, the cooling component includes a water cooler disposed on the thermal plasma reactor.

[0016] As a preferred embodiment of the sulfur hexafluoride conversion device based on dual-anode thermal plasma of the present invention, the tail gas component includes a cooling machine disposed on the thermal plasma reactor, a concentration detector disposed on the cooling machine, and a tail gas recovery device disposed on the concentration detector.

[0017] As a preferred embodiment of the sulfur hexafluoride conversion device based on dual-anode thermal plasma of the present invention, there are two arc-initiating anodes, and a cathode tube is disposed between the two arc-initiating anodes.

[0018] A sulfur hexafluoride conversion apparatus and method based on dual-anode thermal plasma, comprising the aforementioned sulfur hexafluoride conversion apparatus based on dual-anode thermal plasma, and including the following steps:

[0019] The dilution ratio is controlled by a solenoid valve to prepare the mixed gas;

[0020] The mixed gas and tungsten powder are introduced into the reactor for degradation;

[0021] Water cooling is used to reduce the temperature and the degradation efficiency of SF6 waste gas is monitored in real time.

[0022] As a preferred embodiment of the sulfur hexafluoride conversion device and method based on dual-anode thermal plasma of the present invention, the reactor is used to achieve low current input and high power output, thereby expanding the plasma region and completing the conversion treatment of SF6.

[0023] The beneficial effects of this invention are as follows: This invention can be connected to SF6 gas and Ar gas storage cylinders, which not only improves the degradation efficiency of SF6 and enables the treatment of high-concentration SF6, but also accelerates the degradation rate of SF6 at high temperatures, and the exhaust gas after degradation is also usable. Furthermore, an SF6 concentration detector is installed, allowing for direct and rapid observation of the SF6 degradation efficiency. The water-cooling device installed around the reactor and the cooling device at the reactor outlet protect the equipment, preventing damage to the experimental and detection equipment caused by the gases released from the high-temperature reaction in the reactor.

[0024] The main advantages of using this invention are as follows:

[0025] (1) It can achieve high concentration SF6 degradation with high degradation efficiency and fast degradation rate;

[0026] (2) It can intuitively display the content of degradation components, making data collection very convenient;

[0027] (3) During the degradation of SF6, even under high temperature conditions, the experimental equipment will not be damaged.

[0028] (4) The arc-starting anode increases the arc length and arc voltage, achieving low current input and high power output;

[0029] (5) The main product after degradation is tungsten hexafluoride, so the exhaust gas after degradation is also usable. Attached Figure Description

[0030] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0031] Figure 1 is a schematic diagram of the overall structure of a sulfur hexafluoride conversion device based on dual-anode thermal plasma according to the present invention.

[0032] Figure 2 is a schematic diagram of the various structural connections of a sulfur hexafluoride conversion device based on dual-anode thermal plasma according to the present invention. Detailed Implementation

[0033] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0034] Many specific details are set forth in the following description in order to provide a full understanding of the invention. However, the invention may also be practiced in other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the spirit of the invention. Therefore, the invention is not limited to the specific embodiments disclosed below.

[0035] Secondly, the term "an embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in different places throughout this specification does not necessarily refer to the same embodiment, nor is it a single embodiment or an embodiment selectively excluded from other embodiments.

[0036] Secondly, the present invention is described in detail with reference to the schematic diagrams. When detailing the embodiments of the present invention, for ease of explanation, the cross-sectional views illustrating the device structure may be partially enlarged, not according to the usual scale. Furthermore, the schematic diagrams are merely examples and should not limit the scope of protection of the present invention. In addition, actual fabrication should include the three-dimensional spatial dimensions of length, width, and depth.

[0037] Example 1

[0038] Referring to Figures 1-2, a first embodiment of the present invention is provided, which offers a sulfur hexafluoride conversion device based on dual-anode thermal plasma. This device includes a ventilation assembly 100, comprising a gas mixing component 101 and a control component 102, the control component 102 being disposed on the gas mixing component 101; and

[0039] The degradation component 200 includes a reaction element 201 and a degradation element 202. The reaction element 201 is disposed on the gas mixing element 101, and the degradation element 202 is disposed on the reaction element 201. The degradation of SF6 can be completed through the gas ventilation component 100 and the degradation component 200.

[0040] Specifically, the gas mixing unit 101 includes a first gas cylinder 101a and a second gas cylinder 101b, and a gas mixing instrument 101c connected to the first gas cylinder 101a and the second gas cylinder 101b. The first gas cylinder 101a and the second gas cylinder 101b are fixedly connected to the gas mixing instrument 101c at the same height. The first gas cylinder 101a and the second gas cylinder 101b are set horizontally. The first gas cylinder 101a contains a certain amount of gas, and the second gas cylinder 101b contains a certain amount of inert gas.

[0041] The inert gas can be Ar, etc.

[0042] Furthermore, the control unit 102 includes a first solenoid valve 102a installed on the first gas cylinder 101a, a second solenoid valve 102b installed on the second gas cylinder 101b, and a third solenoid valve 102c installed on the gas mixing instrument 101c. The flow rates of Ar and SF6 are controlled by the first solenoid valve 102a and the second solenoid valve 102b, thereby achieving the mixing ratio of the two gases.

[0043] Furthermore, the reaction unit 201 includes a thermal plasma reactor 201a mounted on a gas mixing instrument 101c. The thermal plasma reactor 201a contains an arc-initiating anode 201b and a cathode tube 201c. The thermal plasma reactor 201a has a unique structure with two arc-initiating anodes 201b, with a cathode tube 201c positioned between them. This structure, which incorporates two anodes and inserts a cathode between them, enables low current input and high power output, significantly improving degradation efficiency. The presence of the arc-initiating anode 201b reduces the arc-initiating voltage of the plasma torch, increases the arc length and arc voltage, expands the plasma region, and promotes the degradation effect.

[0044] Furthermore, the degradation component 202 includes an air pump 202a disposed on the thermal plasma reactor 201a, and a tungsten powder tank 202b disposed on the air pump 202a. One side of the air pump 202a is fixedly connected to one side of the thermal plasma reactor 201a, and the other side of the air pump 202a is fixedly connected to the tungsten powder tank 202b containing tungsten powder. The tungsten powder is blown into the thermal plasma reactor 201a by the air pump 202a to participate in the reaction and degrade SF6.

[0045] During operation, each gas cylinder is connected to a gas mixing device via a solenoid valve. Gas mixing takes place in the mixing device. The power is turned on, and the mixed gas is introduced into the thermal plasma reactor 201a. Simultaneously, the gas pump 202a is turned on to blow tungsten powder into the reactor to react fully with the mixed gas. The gas cylinders contain SF6 waste gas and Ar; the SF6 waste gas is generally collected in a gas cylinder. During use, the gas in the cylinders is discharged through the solenoid valve, and the gas path can be controlled to shut off. When using the device, first open the main valve of the carrier gas cylinder, with an initial absolute pressure of approximately 0.1 MPa, then open the solenoid valve to release the gas, allowing it to enter the gas mixing device. After the gas mixing is completed, the mixed gas is introduced into the thermal plasma reactor 201a. Tungsten powder is also blown into the reactor through the gas pump 202a to participate in the reaction. The reactor is powered by a power source. The core of the thermal plasma reactor 201a is the thermal plasma torch, which consists of two arc-igniting anodes 201b and a cathode is inserted between the two anodes. During the reaction, the power source first generates an overvoltage between the cathode and the arc-igniting anode 201b to ignite the arc, and then provides a stable current between the cathode and the arc-igniting anode 201b to maintain the thermal plasma.

[0046] Example 2

[0047] Referring to Figures 1 and 2, a second embodiment of the present invention is provided, which provides a sulfur hexafluoride conversion device based on dual-anode thermal plasma. This device includes a cooling and exhaust assembly 300, which includes a cooling element 301 and an exhaust gas element 302. The cooling element 301 is disposed on the reaction element 201, and the exhaust gas element 302 is disposed on the cooling element 301. By using the cooling and exhaust assembly 300, the temperature of the reaction process equipment is reduced, which is beneficial for continuous use and for exhaust gas emission.

[0048] Specifically, the cooling component 301 includes a water chiller 301a installed on the thermal plasma reactor 201a. The water chiller 301a is connected to the outside of the thermal plasma reactor 201a and can achieve cooling when the reaction is carried out inside the thermal plasma reactor 201a, thus ensuring the safety of the experimental personnel and experimental equipment.

[0049] Furthermore, the exhaust gas component 302 includes a cooling unit 302a mounted on the thermal plasma reactor 201a, a concentration detector 302b mounted on the cooling unit 302a, and an exhaust gas recovery unit 302c mounted on the concentration detector 302b. The cooling unit 302a is fixedly connected to the thermal plasma reactor 201a, and the concentration detector 302b is fixedly connected to the exhaust gas flow position behind the cooling unit 302a for exhaust gas detection. The exhaust gas recovery unit 302c is installed behind the concentration detector 302b for final exhaust gas recovery. It is located at the flow position after the SF6 reaction, where the generated exhaust gas is cooled, and then the concentration of the exhaust gas is detected by the concentration detector 302b. Finally, the exhaust gas can be recovered using the exhaust gas recovery unit 302c.

[0050] During operation, the water cooling device is turned on to cool the reactor. After the reaction is completed, the gas after the reaction is introduced into the cooling device from the gas chamber inside the reactor. After cooling, the gas is introduced into the SF6 concentration detector 302b for concentration monitoring. Finally, the tail gas is discharged and treated for tail gas recovery.

[0051] When SF6 is injected into the plasma torch, the arc voltage increases significantly, making it difficult to ignite and maintain. Simultaneously, a water-cooling device is activated to maintain the reactor temperature within an ideal range during the high-temperature reaction. After passing through the thermal plasma reactor 201a, the high-temperature gas is discharged from the reactor's internal chamber into a cooling device to prevent damage to the experimental equipment. After cooling, the gas is passed into the SF6 concentration detector 302b, which directly reflects the degree of SF6 degradation. The exhaust gas is then collected and treated.

[0052] Example 3

[0053] Referring to Figures 1-2, the third embodiment of the present invention provides a sulfur hexafluoride conversion device and method based on dual-anode thermal plasma, including the following:

[0054] S1. The dilution ratio is controlled by a solenoid valve to prepare a mixed gas in the gas mixing device;

[0055] S2. The mixed gas is introduced into the thermal plasma reactor 201a, and tungsten powder is blown into the reactor by the gas pump 202a;

[0056] S3. Turn on the power to degrade the mixed gas;

[0057] S4. During the degradation process, a water cooling system is used to cool the reactor and keep the temperature within a reasonable range.

[0058] S5. After the reaction is complete, the gas is discharged through the gas chamber at the bottom of the reactor and then passed through a cooling device before being introduced into an SF6 detector to monitor the degradation efficiency of the SF6 waste gas in real time.

[0059] When connecting equipment, the air circuit connection should be performed first, followed by the electrical circuit connection. In the air circuit connection, each stage can be connected to a flow path via a three-way valve for monitoring, thus enabling real-time monitoring of the operating status of each stage of the equipment.

[0060] After the equipment has finished operating, it should be shut down in the order of gas path first, then electrical path. Because there may be uncertainties in the reaction process, this section only describes the shutdown of the gas path. First, close the main valve of the SF6 cylinder, then close the solenoid valve, and simultaneously turn off the gas pump 202a to stop blowing tungsten powder into the reactor. Then wait a few minutes for the reaction unit to completely degrade the remaining SF6 mixture before turning off the power. Note that the carrier gas path should be shut down last, as it needs to purge the remaining SF6 gas from the gas pipe and the reaction unit. Finally, close the carrier gas valve, following the same shutdown order as the SF6 path.

[0061] It is important to note that the constructions and arrangements of this application shown in several different exemplary embodiments are merely illustrative. Although only a few embodiments are described in detail in this disclosure, those who consult this disclosure will readily understand that many modifications are possible (e.g., variations in the size, scale, structure, shape, and proportion of various elements, as well as parameter values, mounting arrangements, use of materials, color, orientation, etc.) without substantially departing from the novel teachings and advantages of the subject matter described in this application. For example, an element shown as integrally formed may be composed of multiple parts or elements, the position of elements may be inverted or otherwise altered, and the nature or number or position of discrete elements may be changed or altered. Therefore, all such modifications are intended to be included within the scope of the invention. The order or sequence of any process or method steps may be changed or rearranged according to alternative embodiments. In the claims, any "device plus function" clause is intended to cover the structure described herein that performs the function, and not only structurally equivalent but also equivalent in structure. Other substitutions, modifications, changes, and omissions may be made in the design, operation, and arrangement of the exemplary embodiments without departing from the scope of the invention. Therefore, the present invention is not limited to the specific embodiments, but extends to various modifications that still fall within the scope of the appended claims.

[0062] Furthermore, in order to provide a concise description of exemplary embodiments, not all features of actual embodiments (i.e., those features that are not relevant to the best mode of carrying out the invention as currently considered, or those features that are not relevant to implementing the invention) may be omitted.

[0063] It should be understood that numerous specific implementation decisions can be made during the development of any actual implementation method, and in any engineering or design project. Such development efforts may be complex and time-consuming, but for those of ordinary skill in the art who benefit from this disclosure, the development effort will be a routine work of design, manufacturing, and production without requiring much experimentation.

[0064] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and all such modifications or substitutions should be covered within the scope of the claims of the present invention.

Claims

1. A sulfur hexafluoride conversion device based on dual-anode thermal plasma, characterized in that: include, A ventilation assembly (100) includes a mixing element (101) and a control element (102), the control element (102) being disposed on the mixing element (101); as well as A degradation component (200) includes a reaction element (201) and a degradation element (202), wherein the reaction element (201) is disposed on the gas mixing element (101), and the degradation element (202) is disposed on the reaction element (201); and, The cooling exhaust assembly (300) includes a cooling component (301) and an exhaust component (302), wherein the cooling component (301) is disposed on the reaction component (201) and the exhaust component (302) is disposed on the cooling component (301).

2. The sulfur hexafluoride conversion device based on dual-anode thermal plasma according to claim 1, characterized in that: The gas mixing unit (101) includes a first gas cylinder (101a) and a second gas cylinder (101b), and the first gas cylinder (101a) and the second gas cylinder (101b) are connected to a gas mixing instrument (101c). The first gas cylinder (101a) and the second gas cylinder (101b) are arranged horizontally. The first gas cylinder (101a) contains a certain amount of SF6, and the second gas cylinder (101b) contains a certain amount of inert gas.

3. The sulfur hexafluoride conversion device based on dual-anode thermal plasma according to claim 2, characterized in that: The control unit (102) includes a first solenoid valve (102a) provided on the first gas cylinder (101a), a second solenoid valve (102b) provided on the second gas cylinder (101b), and a third solenoid valve (102c) provided on the gas mixing instrument (101c).

4. The sulfur hexafluoride conversion device based on dual-anode thermal plasma according to claim 3, characterized in that: The reaction device (201) includes a thermal plasma reactor (201a) installed on the gas mixing instrument (101c), and an arc-starting anode (201b) and a cathode tube (201c) installed inside the thermal plasma reactor (201a).

5. The sulfur hexafluoride conversion device based on dual-anode thermal plasma according to claim 4, characterized in that: The degradation component (202) includes an air pump (202a) disposed on the thermal plasma reactor (201a) and a tungsten powder tank (202b) disposed on the air pump (202a).

6. The sulfur hexafluoride conversion device based on dual-anode thermal plasma according to claim 4 or 5, characterized in that: The cooling component (301) includes a water chiller (301a) disposed on the thermal plasma reactor (201a).

7. The sulfur hexafluoride conversion device based on dual-anode thermal plasma according to claim 6, characterized in that: The exhaust gas component (302) includes a cooling unit (302a) disposed on the thermal plasma reactor (201a), a concentration detector (302b) disposed on the cooling unit (302a), and an exhaust gas recovery unit (302c) disposed on the concentration detector (302b).

8. The sulfur hexafluoride conversion device based on dual-anode thermal plasma according to claim 7, characterized in that: There are two arc-starting anodes (201b), and a cathode tube (201c) is disposed between the two arc-starting anodes (201b).

9. A sulfur hexafluoride conversion device and method based on dual-anode thermal plasma, characterized in that: The sulfur hexafluoride conversion device based on dual-anode thermal plasma as described in any one of claims 1 to 8 includes the following steps: The dilution ratio is controlled by a solenoid valve to prepare the mixed gas; The mixed gas and tungsten powder are introduced into the reactor for degradation; Water cooling is used to reduce the temperature and the degradation efficiency of SF6 waste gas is monitored in real time.

10. The sulfur hexafluoride conversion device and method based on dual-anode thermal plasma according to claim 9, characterized in that: The reactor was used to achieve low current input and high power output, thereby expanding the plasma region and completing the conversion of SF6.

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