Bonding device, bonding method, and storage medium

Abstract

The present invention provides a bonding device, a bonding method, and a computer-readable storage medium. The bonding device comprises a frame, a wafer chuck, and a bonding head. The wafer chuck is arranged on the frame, and is used for suctioning a first surface of a wafer from top to bottom so that a second surface to be bonded of the wafer faces downwards. The bonding head is mounted on the frame, and is used for suctioning a first surface of a chip from bottom to top and bonding, from bottom to top, a second surface to be bonded of the chip to a target position of said second surface of the wafer. In the present invention, the wafer to be bonded is placed upside down to prevent the surface to be bonded from defects caused by external contamination or damage, and the chip is bonded to the wafer from bottom to top to avoid bonding errors caused by transition between tensile and compressive forces during bonding of the bonding head.

Description

Bonding devices, bonding methods and storage media Technical Field

[0001] This invention relates to the field of semiconductor device fabrication, and more particularly to a bonding apparatus, a bonding method, and a computer-readable storage medium. Background Technology

[0002] In existing technologies, C2W (Chip to Wafer) bonding equipment typically places the wafer upright on the wafer stage, then picks up the chip via a bonding head and moves it to an optical system for image and orientation correction. Afterward, the chip can be placed downwards onto the wafer using relatively little force via the bonding head. However, in existing C2W bonding equipment, the wafer's bonding surface faces upwards, making it susceptible to defects from impacts from external components and contamination. This also places extremely high demands on the cleanliness of the bonding environment. Furthermore, when bonding chips from top to bottom, the bonding head's drive mechanism and adsorption surface are subjected to a downward pull due to gravity before contacting the wafer. However, during the bonding process after the bonding head contacts the wafer, this drive mechanism and adsorption surface are subjected to upward pressure from the wafer. This change in the direction of force creates significant deformation errors in the drive mechanism and adsorption surface, thus affecting bonding accuracy.

[0003] In order to overcome the above-mentioned defects in the existing technology, there is an urgent need in the field for an improved bonding device to avoid defects on the bonding surface of the wafer due to external contamination or damage, and to avoid bonding errors caused by the conversion of tension and pressure of the bonding head during the bonding process. Summary of the Invention

[0004] The following provides a brief overview of one or more aspects to offer a basic understanding of them. This overview is not an exhaustive summary of all conceived aspects, nor is it intended to identify key or decisive elements of all aspects, nor to define the scope of any or all aspects. Its sole purpose is to present some concepts of one or more aspects in a simplified form as a prelude to the more detailed descriptions that follow.

[0005] To overcome the aforementioned deficiencies in the prior art, the present invention provides a bonding apparatus, a bonding method, and a computer-readable storage medium. By inverting the wafer to be bonded, defects can be avoided on the bonding surface due to external contamination or damage. Furthermore, by bonding the chip to the wafer from bottom to top, bonding errors caused by the conversion of tension and pressure during the bonding process can be avoided.

[0006] Specifically, the bonding apparatus provided according to a first aspect of the present invention includes a rack, a wafer chuck, and a bonding head. The wafer chuck is disposed on the rack and is used to adsorb a first surface of a wafer from top to bottom, so that the second surface of the wafer to be bonded faces downwards. The bonding head is mounted on the rack and is used to adsorb the first surface of a chip from bottom to top, and to bond the second surface of the chip to be bonded to a target position on the second surface of the wafer from bottom to top.

[0007] Furthermore, in some embodiments of the present invention, the bonding apparatus further includes a gantry motion assembly, which includes at least one gantry base and at least one gantry beam. The at least one gantry base extends along a predetermined Y direction and is fixedly connected to the frame. The at least one gantry beam extends along a predetermined X direction, and its first slider is disposed in a first groove of the at least one gantry base to allow the gantry beam to translate along the Y direction. The second slider of the bonding head is disposed in a second groove of the at least one gantry beam to allow the bonding head to translate along the X direction.

[0008] Furthermore, in some embodiments of the present invention, the bonding apparatus further includes a first vision component, a second vision component, and a controller. The first vision component is mounted on the wafer chuck and is used to acquire a first image of at least one first mark on the chip from a downward perspective. The second vision component is mounted on the bonding head and is used to acquire a second image of at least one second mark on the wafer from an upward perspective. The controller is configured to: parse the first image to determine first coordinates of each first mark in the first image; parse the second image to determine second coordinates of each second mark in the second image; align the chip to its target position based on the first coordinates and the second coordinates; and lift the bonding head to bond the second surface of the chip to the target position on the wafer from bottom to top.

[0009] Furthermore, in some embodiments of the present invention, the translation range of the gantry motion assembly covers the chip pick-up station and the chip bonding station of the bonding head. The first vision assembly is mounted between the chip pick-up station and the chip bonding station. The controller is further configured to: in response to the bonding head completing chip pick-up, control the gantry motion assembly to translate the bonding head to the field of view of the first vision assembly to acquire the first image via the first vision assembly; and in response to completing the acquisition of the first image, control the gantry motion assembly to translate the bonding head a second time below the wafer chuck to acquire the second image via the second vision assembly.

[0010] Furthermore, in some embodiments of the present invention, the step of aligning the chip to its target position according to the first coordinate and the second coordinate includes: determining the positional deviation of the chip relative to the target position based on the coordinate difference between the first coordinate and the second coordinate, and the coordinate change of the secondary translation; and compensating for the positional deviation via the gantry motion component to fine-tune the bonding head to the chip bonding station aligned with the target position.

[0011] Furthermore, in some embodiments of the present invention, the bonding apparatus further includes a rotation mechanism. The step of aligning the chip to its target position according to the first coordinate and the second coordinate includes: determining the planar orientation deviation of the chip relative to the target position based on the coordinate difference between the first coordinate and the second coordinate, and the coordinate change of the secondary translation; and compensating for the planar orientation deviation via the rotation mechanism to rotate the bonding head to the chip bonding station aligned with the target position.

[0012] Furthermore, in some embodiments of the present invention, the bonding apparatus further includes a tilting mechanism. The controller is also configured to: parse the second image before lifting the bonding head to determine the tilt angle of the bonding head relative to the second surface of the wafer; and compensate for the tilt angle via the tilting mechanism to perform orientation correction and leveling of the bonding head and the wafer.

[0013] Furthermore, in some embodiments of the present invention, the first visual component and the second visual component each include a plurality of visual units and a triangular prism. Each visual unit includes a mirror, a lens, and a camera to focus and image at least one mark of the corresponding imaging object via the triangular prism.

[0014] Furthermore, in some embodiments of the present invention, at least one of the visual units of the first visual component and / or the second visual component further includes a slide for adjusting the relative position of the visual unit with the field of view of the remaining visual units of the same visual component, so as to adapt to the image acquisition requirements of at least one mark of imaging objects of various sizes.

[0015] Furthermore, the bonding method provided by the second aspect of the present invention includes the following steps: adsorbing the first surface of a wafer from top to bottom via a wafer chuck of a bonding apparatus as provided by the first aspect of the present invention, so that the second surface of the wafer to be bonded faces downward; and adsorbing the first surface of a chip from bottom to top via a bonding head of the bonding apparatus, and bonding the second surface of the chip to be bonded to the target position of the second surface of the wafer from bottom to top.

[0016] Furthermore, the computer-readable storage medium provided according to the third aspect of the present invention stores computer instructions thereon. When the computer instructions are executed by a processor, the bonding method as provided in the second aspect of the present invention is implemented. Attached Figure Description

[0017] The above-described features and advantages of the present invention will be better understood after reading the following detailed description of embodiments of the present disclosure in conjunction with the accompanying drawings. In the drawings, components are not necessarily drawn to scale, and components having similar related characteristics or features may have the same or similar reference numerals.

[0018] Figure 1 shows a schematic diagram of the structure of a bonding device provided according to some embodiments of the present invention.

[0019] Figure 2 shows a schematic diagram of the structure of a gantry motion assembly provided according to some embodiments of the present invention.

[0020] Figure 3 shows a schematic diagram of the structure of a first vision component provided according to some embodiments of the present invention.

[0021] Figure 4 shows a schematic diagram of the structure of a second vision component provided according to some embodiments of the present invention.

[0022] Figure 5 shows a schematic flowchart of a bonding method provided according to some embodiments of the present invention. Detailed Implementation

[0023] The following specific embodiments illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. Although the description of the present invention is presented in conjunction with preferred embodiments, this does not mean that the features of the invention are limited to these embodiments. On the contrary, the purpose of describing the invention in conjunction with embodiments is to cover other options or modifications that may be derived based on the claims of the present invention. To provide a thorough understanding of the invention, many specific details will be included in the following description. The invention may also be implemented without using these details. Furthermore, to avoid confusion or obscuring the focus of the invention, some specific details will be omitted in the description.

[0024] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0025] Furthermore, the terms "upper," "lower," "left," "right," "top," "bottom," "horizontal," and "vertical" used in the following description should be understood as the orientations shown in the relevant paragraphs and accompanying drawings. These relative terms are for illustrative purposes only and do not imply that the described apparatus must be manufactured or operated in a specific orientation, and therefore should not be construed as limiting the invention.

[0026] It is understood that although terms such as "first," "second," and "third" may be used herein to describe various components, regions, layers, and / or parts, these components, regions, layers, and / or parts should not be limited by these terms, and these terms are only used to distinguish different components, regions, layers, and / or parts. Therefore, the first components, regions, layers, and / or parts discussed below may be referred to as second components, regions, layers, and / or parts without departing from some embodiments of the present invention.

[0027] As mentioned above, in existing C2W bonding equipment, the wafer's bonding surface faces upwards, making it susceptible to defects from collisions with external components and external contamination. This also places extremely high demands on the cleanliness of the bonding environment. Furthermore, when bonding chips from top to bottom, the bonding head's drive mechanism and adsorption surface are subjected to a downward pull due to gravity before contacting the wafer. However, during the bonding process after the bonding head contacts the wafer, this drive mechanism and adsorption surface are subjected to upward pressure from the wafer. This change in the direction of force creates significant deformation errors in the drive mechanism and adsorption surface, thus affecting bonding accuracy.

[0028] To overcome the aforementioned deficiencies in the prior art, the present invention provides a bonding apparatus, a bonding method, and a computer-readable storage medium. By inverting the wafer to be bonded, defects can be avoided on the bonding surface due to external contamination or damage. Furthermore, by bonding the chip to the wafer from bottom to top, bonding errors caused by the conversion of tension and pressure during the bonding process can be avoided.

[0029] Please refer to Figures 1 through 4 for details. Figure 1 shows a schematic diagram of the structure of a bonding device provided according to some embodiments of the present invention. Figure 2 shows a schematic diagram of the structure of a gantry motion assembly provided according to some embodiments of the present invention. Figure 3 shows a schematic diagram of the structure of a first vision assembly provided according to some embodiments of the present invention. Figure 4 shows a schematic diagram of the structure of a second vision assembly provided according to some embodiments of the present invention.

[0030] In the embodiment shown in FIG1, the bonding apparatus provided by the first aspect of the present invention includes a rack 11, a wafer chuck 12, and a bonding head 13. Here, the wafer chuck 12 is disposed on the rack 11 for adsorbing the first surface of a wafer 17 from top to bottom, so that the second surface of the wafer 17 to be bonded faces downwards. The bonding head 13 is mounted on the rack 11 for adsorbing the first surface of a chip 18 from bottom to top, and bonding the second surface of the chip 18 to be bonded to the target position on the second surface of the wafer 17 from bottom to top.

[0031] Furthermore, in the embodiments shown in Figures 1 and 2, the bonding apparatus provided in the first aspect of the present invention further includes a gantry motion assembly 14. Here, the gantry motion assembly 14 includes at least one gantry base 141 and at least one gantry beam 142. The gantry base 141 extends along a predetermined Y direction and is fixedly connected to the frame 11. The gantry beam 142 extends along a predetermined X direction, and its first slider is disposed in a first groove of the at least one gantry base 141 for translation of the gantry beam 142 along the Y direction. The second slider of the bonding head 13 is disposed in a second groove of the at least one gantry beam 142 for translation of the bonding head 13 along the X direction.

[0032] Furthermore, in the embodiment shown in FIG1, the bonding apparatus provided in the first aspect of the present invention further includes a first vision component 15 and a second vision component 16. Here, the first vision component 15 is mounted on the wafer chuck 12 for downward acquisition of a first image of at least one first mark on the chip 18. The second vision component 16 is mounted on the bonding head 13 for upward acquisition of a second image of at least one second mark on the wafer 17.

[0033] Furthermore, in the embodiments shown in Figures 3 and 4, the first vision component 15 and the second vision component 16 respectively include multiple vision units and a triangular prism. Each vision unit includes a mirror, a lens, and a camera to focus and image at least one mark of the corresponding imaging object via the triangular prism. Here, the imaging object is a wafer or a chip.

[0034] Furthermore, in the embodiments shown in Figures 3 and 4, at least one visual unit of the first visual component 15 and / or the second visual component 16 further includes a slide stage for adjusting the relative position of the visual unit with the field of view of the other visual units of the same visual component, to accommodate the image acquisition requirements of at least one mark of an imaging object of various sizes. Here, the imaging object is a wafer or a chip.

[0035] Specifically, in the embodiment shown in Figure 3, the first vision component 15 includes a first reflector 151, a second reflector 152, a first lens 153, a second lens 154, a first camera 155, a second camera 156, a first triangular prism 157, a first slide 158, and a second slide 159. Here, the first slide 158 and the second slide 159 are respectively used to position the left and right marks on the imaging object at the center of the field of view of the first camera 155 and the second camera 156.

[0036] Similarly, in the embodiment shown in FIG4, the second vision component includes a third reflector 161, a fourth reflector 162, a third lens 163, a fourth lens 164, a third camera 165, a fourth camera 166, a second triangular prism 167, a third slide 168, and a fourth slide 169. Here, the third slide 168 and the fourth slide 169 are respectively used to position the left and right marks on the imaging object at the center of the field of view of the third camera 165 and the fourth camera 166.

[0037] In some non-limiting embodiments, the bonding apparatus provided in the first aspect of the present invention includes a memory and a controller. Here, the memory includes, but is not limited to, the computer-readable storage medium provided in the third aspect above, on which computer instructions are stored. The controller is connected to the memory and configured to execute the computer instructions stored in the memory to implement the bonding method as provided in the second aspect of the present invention.

[0038] The working principle of the bonding device described above will be described below with reference to some embodiments of bonding methods. Those skilled in the art will understand that these embodiments of bonding methods are merely non-limiting implementations provided by the present invention, intended to clearly demonstrate the main concepts of the invention and provide specific solutions convenient for public implementation, rather than limiting all functions or operating methods of the bonding device. Similarly, the bonding device is also only one non-limiting implementation provided by the present invention, and does not limit the executing entity or execution order of the steps in these bonding methods.

[0039] Please refer to Figure 5. Figure 5 shows a schematic flowchart of a bonding method provided according to some embodiments of the present invention.

[0040] As shown in FIG5, the controller can adsorb the first surface of the wafer 17 from top to bottom via the wafer chuck 12 of the bonding apparatus provided in the first aspect of the present invention, so that the second surface of the wafer 17 to be bonded faces down.

[0041] Specifically, in some preferred embodiments, the translation range of the gantry motion assembly 14 covers the chip pick-up station of the bonding head 13 and the chip bonding station directly below the wafer chuck 12. The first vision assembly 15 is mounted between the chip pick-up station and the chip bonding station. Here, in response to the bonding head 13 completing the pick-up of the chip 18, the controller can also control the gantry motion assembly 14 to translate the bonding head 13 into the field of view of the first vision assembly 15, so as to acquire a first image via the first vision assembly 15.

[0042] Subsequently, in response to the completion of the acquisition of the first image, the controller can control the gantry motion assembly 14 to move the bonding head 13 to a position below the wafer chuck 12 for a second time, so as to acquire the second image via the second vision assembly 16.

[0043] Subsequently, the controller can use the bonding head 13 of the bonding device to adsorb the first surface of the chip 18 from bottom to top, and bond the second surface of the chip 18 to be bonded to the target position of the second surface of the wafer 17 from bottom to top.

[0044] Specifically, the controller can first parse the first image acquired by the first vision component 15 to determine the first coordinates of each first marker in the first image.

[0045] The controller can then parse the second image acquired via the second vision component 16 to determine the second coordinates of each second marker in the second image.

[0046] Then, the controller can align the chip 18 with its target position based on the first and second coordinates mentioned above.

[0047] Specifically, the controller can determine the position deviation (Δx, Δy) of the chip 18 relative to the target position based on the coordinate difference between the first coordinate and the second coordinate, as well as the coordinate change of the second translation, and compensate for the position deviation through the gantry motion component 14 so as to fine-tune the bonding head 13 to the chip bonding station aligned with the target position.

[0048] Furthermore, in some optional embodiments, the bonding apparatus provided in the first aspect of the present invention further includes a rotation mechanism. Here, the controller can also determine the planar attitude deviation Δθ of the chip 18 relative to the target position based on the coordinate difference between the first coordinate and the second coordinate, as well as the coordinate change of the secondary translation, and compensate for the planar attitude deviation via the rotation mechanism to rotate the bonding head 13 to the chip bonding station aligned with the target position.

[0049] Then, the controller can lift the bonding head 13 to bond the second surface of the chip 18 to the target position on the wafer 17 from bottom to top.

[0050] Furthermore, in some preferred embodiments, the bonding apparatus provided in the first aspect of the present invention also includes a tilting mechanism. Here, the controller may also analyze the second image before lifting the bonding head 13 to determine the tilt angle of the bonding head 13 relative to the second surface of the wafer 17, and compensate for the tilt angle via the tilting mechanism to perform orientation correction and leveling of the bonding head 13 and the wafer 17.

[0051] In summary, the bonding apparatus, bonding method, and computer-readable storage medium provided by the present invention can all prevent defects on the bonding surface from being caused by external contamination or damage by inverting the wafer to be bonded, and avoid bonding errors caused by the conversion of tension and pressure during the bonding process by bonding the chip to the wafer from bottom to top.

[0052] Although the methods described above are illustrated and depicted as a series of actions for the sake of simplicity, it should be understood and appreciated that these methods are not limited by the order of the actions, as some actions may occur in a different order and / or concurrently with other actions from the illustrations and descriptions herein or not illustrated and described herein but which may be understood by those skilled in the art, according to one or more embodiments.

[0053] Although the controller described in the above embodiments can be implemented through a combination of software and hardware, it is understood that the controller can also be implemented in software or hardware. For hardware implementation, the controller can be implemented using one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), programmable logic devices (PLDs), field-programmable gate arrays (FPGAs), processors, controllers, microcontrollers, microprocessors, other electronic devices for performing the above functions, or a selection of combinations of the above devices. For software implementation, the controller can be implemented using independent software modules such as procedures and functions running on a general-purpose chip, each module performing one or more functions and operations described herein.

[0054] The steps of the methods or algorithms described in conjunction with the embodiments disclosed herein may be embodied directly in hardware, in a software module executed by a processor, or in a combination of both. The software module may reside in RAM memory, flash memory, ROM memory, EPROM memory, EEPROM memory, registers, hard disk, removable disk, CD-ROM, or any other form of storage medium known in the art. An exemplary storage medium is coupled to a processor such that the processor can read and write information to / from the storage medium. In an alternative, the storage medium may be integrated into the processor. The processor and storage medium may reside in an ASIC. The ASIC may reside in a user terminal. In an alternative, the processor and storage medium may reside as discrete components in the user terminal.

[0055] In one or more exemplary embodiments, the described functionality may be implemented in hardware, software, firmware, or any combination thereof. If implemented in software as a computer program product, the functionality may be stored or transmitted as one or more instructions or code on or through a computer-readable medium. A computer-readable medium includes both computer storage media and communication media, encompassing any medium that facilitates the transfer of a computer program from one location to another. A storage medium may be any available medium accessible to a computer. By way of example and not limitation, such a computer-readable medium may include RAM, ROM, EEPROM, CD-ROM or other optical disc storage, disk storage or other magnetic storage devices, or any other medium that can be used to carry or store desired program code in the form of instructions or data structures and is accessible to a computer. Any connection is also legitimately referred to as a computer-readable medium. For example, if the software is transmitted from a website, server, or other remote source using coaxial cable, fiber optic cable, twisted pair, digital subscriber line (DSL), or wireless technologies such as infrared, radio, and microwave, then the coaxial cable, fiber optic cable, twisted pair, DSL, or wireless technologies such as infrared, radio, and microwave are included in the definition of a medium. As used in this article, disk and disc include compact discs (CDs), laser discs, optical discs, digital multi-purpose discs (DVDs), floppy disks, and Blu-ray discs. Disks typically reproduce data magnetically, while discs reproduce data optically using lasers. Combinations of these should also be included within the scope of computer-readable media.

[0056] The prior description of this disclosure is provided to enable any person skilled in the art to make or use this disclosure. Various modifications to this disclosure will be apparent to those skilled in the art, and the general principles defined herein may be applied to other variations without departing from the spirit or scope of this disclosure. Therefore, this disclosure is not intended to be limited to the examples and designs described herein, but should be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A bonding apparatus, characterized in that, include: frame; A wafer chuck, disposed in the rack, is used to adsorb the first surface of a wafer from top to bottom, so that the second surface of the wafer to be bonded faces downwards; as well as A bonding head, mounted on the rack, is used to adsorb the first surface of the chip from bottom to top and to bond the second surface of the chip to be bonded to the target position of the second surface of the wafer from bottom to top.

2. The bonding apparatus as described in claim 1, characterized in that, The bonding device also includes a gantry motion assembly, which comprises: At least one gantry base extends along a predetermined Y direction and is fixedly connected to the frame; and At least one gantry beam extends along a predetermined X direction, and its first slider is disposed in a first groove of the at least one gantry base to allow the gantry beam to translate along the Y direction. The second slider of the bonding head is disposed in a second groove of the at least one gantry beam to allow the bonding head to translate along the X direction.

3. The bonding apparatus as described in claim 2, characterized in that, Also includes: A first vision component, mounted on the wafer chuck, is used to capture a first image of at least one first mark on the chip from below. A second vision component, mounted on the bonding head, is used to acquire a second image of at least one second mark on the wafer. as well as The controller is configured to: parse the first image to determine the first coordinates of each of the first markers in the first image; The second image is parsed to determine the second coordinates of each of the second marks in the second image; the chip is aligned with its target position based on the first coordinates and the second coordinates; And to lift the bonding head to bond the second surface of the chip to the target location on the wafer from bottom to top.

4. The bonding apparatus as described in claim 3, characterized in that, The translation range of the gantry motion component covers the chip pickup station and the chip bonding station of the bonding head. The first vision component is installed between the chip pickup station and the chip bonding station. The controller is further configured to: In response to the bonding head completing the chip pickup, the gantry motion assembly is controlled to translate the bonding head to the field of view of the first vision assembly, so as to acquire the first image via the first vision assembly; as well as In response to the completion of the acquisition of the first image, the gantry motion assembly is controlled to move the bonding head a second time to below the wafer chuck, so as to acquire the second image via the second vision assembly.

5. The bonding apparatus as described in claim 4, characterized in that, The step of aligning the chip to its target position based on the first coordinate and the second coordinate includes: Based on the coordinate difference between the first and second coordinates, and the coordinate change due to the secondary translation, the positional deviation of the chip relative to the target position is determined; and The position deviation is compensated by the gantry motion component to fine-tune the bonding head to the chip bonding station aligned with the target position.

6. The bonding apparatus as described in claim 4, characterized in that, The bonding device further includes a rotation mechanism, and the step of aligning the chip to its target position according to the first coordinate and the second coordinate includes: Based on the coordinate difference between the first and second coordinates, and the coordinate change due to the secondary translation, the planar attitude deviation of the chip relative to the target position is determined; and The planar orientation deviation is compensated by the rotation mechanism to rotate the bonding head to the chip bonding station aligned with the target position.

7. The bonding apparatus as described in claim 3, characterized in that, The bonding device further includes a tilting mechanism, and the controller is further configured to: Before lifting the bonding head, the second image is analyzed to determine the tilt angle of the bonding head relative to the second surface of the wafer; and The tilting mechanism compensates for the tilt angle to perform orientation correction and leveling between the bonding head and the wafer.

8. The bonding apparatus as described in claim 3, characterized in that, The first vision component and the second vision component each include a plurality of vision units and a triangular prism, wherein each vision unit includes a mirror, a lens and a camera, for focusing and imaging at least one mark of the corresponding imaging object via the triangular prism.

9. The bonding apparatus as described in claim 8, characterized in that, At least one of the visual units of the first visual component and / or the second visual component further includes a slide for adjusting the relative position of the visual unit with the field of view of the remaining visual units of the same visual component to accommodate the image acquisition requirements of at least one mark of a variety of imaging objects of different sizes.

10. A bonding method, characterized in that, Includes the following steps: The first surface of the wafer is adsorbed from top to bottom via the wafer chuck of the bonding apparatus as described in any one of claims 1 to 9, so that the second surface of the wafer to be bonded faces downward; as well as The first surface of the chip is adsorbed from bottom to top via the bonding head of the bonding device, and the second surface of the chip to be bonded is bonded from bottom to top to the target position of the second surface of the wafer.

11. A computer-readable storage medium storing computer instructions thereon, characterized in that, When the computer instructions are executed by the processor, the bonding method as described in claim 10 is implemented.

Images