Communication method and related device

Abstract

Disclosed are a communication method and a related device, which are used to implement the internet access function of a lightweight device and improve the user experience. For example, a communication system comprises a first chip, a second chip and a network module, wherein the network module is distributedly deployed on the first chip and the second chip, and the network module is used for network connection. The method comprises: a first chip generating a first request, wherein the first request is used for requesting network content; the first chip sending the first request to a server by means of a network module distributedly deployed on the first chip and a second chip; and the first chip receiving a first response from the server by means of the network module distributedly deployed on the first chip and the second chip, wherein the first response comprises the network content.

Description

A communication method and related equipment

[0001] Cross-reference to related applications

[0002] This application claims priority to Chinese Patent Application No. 202411569809.6, filed on November 5, 2024, entitled "A Communication Method and Related Device", the entire contents of which are incorporated herein by reference. Technical Field

[0003] This application relates to the field of terminal technology, and in particular to a communication method and related equipment. Background Technology

[0004] Internet access is a feature found in most electronic devices. For example, mobile phones and tablets all have internet access capabilities. Generally, internet access in electronic devices requires corresponding hardware support, such as integrated wireless fidelity (Wi-Fi) chips or modem chips. However, for lightweight devices, the constraints of size and weight make it difficult to integrate this hardware. Therefore, how to implement internet access functionality on lightweight devices is a problem that needs to be considered. Summary of the Invention

[0005] This application provides a communication method and related equipment that enables internet access on lightweight devices, thereby improving the user experience of lightweight devices.

[0006] A first aspect provides a communication method applied to a communication system, the communication system including a first chip, a second chip, and a network module, the network module being distributed across the first chip and the second chip, and the network module being used for network connection. The method includes: the first chip generating a first request for requesting network content; the first chip sending the first request to a server via the network module distributed across the first chip and the second chip; and the first chip receiving a first response from the server via the network module distributed across the first chip and the second chip, the first response including network content.

[0007] In this embodiment, the first chip can achieve internet access through network modules distributed across the first and second chips. This eliminates the need for a complete network module on either the first or second chip, saving chip area and thus achieving a lightweight device (the device containing the chip).

[0008] In this embodiment, distributed deployment can be understood as different parts being deployed in different locations. For example, the network module is distributed across the first chip and the second chip, meaning that different parts of the network module are deployed across the first chip and the second chip. For instance, one part of the network module is deployed on the first chip, and another part is deployed on the second chip.

[0009] In one possible design, the network module is distributed across the first chip and the second chip, and includes: the network module includes a processing module, which is used to process data according to a protocol stack, wherein the protocol stack is a communication protocol stack supported by the server, and the processing module is distributed across the first chip and the second chip.

[0010] In this embodiment, the processing module in the network module used to process data according to the protocol stack can be distributed across the first chip and the second chip. In this way, neither the first chip nor the second chip needs to handle all data processing tasks, saving chip workload and contributing to device lightweighting.

[0011] In one possible design, the processing module includes a first module and a second module, which are distributed across the first chip and the second chip. Specifically, the first module is deployed on the first chip, and the second module is deployed on the second chip. The first module processes data according to the M-layer protocol in the protocol stack, and the second module processes data according to the NM-layer protocol in the protocol stack. The NM-layer protocol refers to other layer protocols besides the M-layer protocol in the protocol stack, where N is the total number of layers in the protocol stack.

[0012] In this embodiment of the application, the processing module in the network module used to process data according to the protocol stack can be distributed and deployed on the first chip and the second chip. For example, the first module (the module used to process data according to the M-layer protocol) is deployed on the first chip, and the second module (the module used to process data according to the NM-layer protocol) is deployed on the second chip. On the one hand, this saves the chip area of ​​the first chip and the second chip, and on the other hand, it saves the computational load of the first chip and the second chip, which helps to achieve device lightweighting.

[0013] In one possible design, the processing module is distributed across the first chip and the second chip, including: the protocol stack in the processing module is distributed across the first chip and the second chip.

[0014] In this embodiment, the protocol stack can be distributed across the first chip and the second chip. That is, the first chip does not need to deploy a complete protocol stack, and the second chip does not need to deploy a complete protocol stack, which can save chip area and thus achieve device lightweighting.

[0015] In one possible design, the protocol stack is distributed across the first chip and the second chip, including: the M-layer protocol in the protocol stack is deployed on the first chip, the NM-layer protocol in the protocol stack is deployed on the second chip, the NM-layer protocol is the other layer protocols in the protocol stack besides the M-layer, and N is the total number of layers in the protocol stack.

[0016] In this embodiment, the protocol stack can be distributed across the first chip and the second chip. For example, the protocol stack includes N layers, where layer M can be deployed on the first chip and layer NM can be deployed on the second chip. Thus, neither the first nor the second chip needs to deploy a complete protocol stack, saving chip area and achieving device lightweighting.

[0017] In one possible design, the M-layer protocol is located above the NM-layer protocol.

[0018] In this embodiment, the upper-layer protocols in the protocol stack can be deployed on the first chip, and the lower-layer protocols can be deployed on the second chip. Thus, after the first chip generates a first request, it can first process the data according to the protocol deployed on the first chip, and then continue processing the data according to the protocol deployed on the second chip, conforming to the processing flow of processing the first request according to the protocol stack (i.e., processing sequentially from top to bottom within the protocol stack).

[0019] In one possible design, the M-layer protocol includes an application layer, and the NM-layer protocol includes a transport layer, a network layer, a data link layer, and a physical layer.

[0020] In this embodiment, the first chip can process the data according to the corresponding protocol of the application layer, and then continue to process the data according to other layer protocols deployed on the second chip. This conforms to the processing flow of processing the first request according to the protocol stack (i.e., processing in the order from top to bottom in the protocol stack). Moreover, only one layer, namely the application layer, needs to be deployed on the first chip, which can save the chip area of ​​the first chip and realize the lightweighting of the device.

[0021] In one possible design, the first chip sends the first request to the server via a network module, including: the first chip encapsulating the first request according to the M-layer protocol to obtain a second request; the first chip sending the second request to the second chip, the second chip encapsulating the second request according to the NM-layer protocol to obtain a third request, and sending the third request to the server, the third request being used to request the network content.

[0022] In this embodiment, the M layer of the protocol stack is deployed on the first chip, and the NM layer is deployed on the second chip. The first chip processes network requests using the M layer protocol and then provides them to the second chip. The second chip further processes the network requests according to the NM layer protocol, ensuring that the network requests conform to the server's communication protocol, thus enabling the server to receive them and obtain the network content fed back by the server. Therefore, only a portion of the protocol layers need to be deployed on the first chip to achieve internet access functionality. Moreover, since the first chip only needs to process data according to a portion of the protocol layers, its workload is not significantly increased. That is, while achieving internet access functionality on the first chip, the workload is not excessively increased, making it suitable for lightweight devices.

[0023] In one possible design, the first chip receives a first response from the server via a network module, comprising: the first chip receiving a second response sent by the second chip, wherein the second response is obtained by the second chip after receiving a third response from the server and decrypting the third response according to the NM layer protocol, and the third response includes the network content; and the first chip decrypting the second response according to the M layer protocol to obtain the first response.

[0024] In this embodiment, the M layer of the protocol stack is deployed on the first chip, and the NM layer is deployed on the second chip. After receiving the response from the server, the second chip first decrypts the data according to the NM layer protocol and then provides it to the first chip. The first chip then decrypts the data according to the M layer protocol, thereby enabling the first chip to obtain the network content. Therefore, only a portion of the protocol layers need to be deployed on the first chip to achieve internet access functionality. Moreover, since the first chip only needs to process data according to a portion of the protocol layers, its workload is not significantly increased. That is, while achieving internet access functionality, the workload of the first chip is not excessively increased, making it suitable for lightweight devices.

[0025] In one possible design, the network module further includes a transceiver module for receiving data from or sending data to the server, and the transceiver module is deployed on the second chip. In this embodiment, the transceiver module within the network module can be deployed on the second chip, thus eliminating the need to deploy a transceiver module on the first chip, saving chip area and contributing to a lighter device (the device containing the first chip).

[0026] In one possible design, the network module is distributed across the first chip and the second chip, comprising: the network module including a processing module and a transceiver module; the processing module being used to process data according to a protocol stack, the protocol stack including a communication protocol stack supported by the server; and the transceiver module being used to receive data from the server or send data to the server. The processing module is deployed on the first chip, and the network module is deployed on the second chip.

[0027] In this embodiment, the processing module within the network module can be deployed on a first chip, and the transceiver module can be deployed on a second chip. Thus, the first chip can process data using the processing module deployed on its own chip, and then send the processed data out using the transceiver module deployed on the second chip. Since the transceiver module does not need to be deployed on the first chip, chip area is saved, contributing to a lighter device (the device containing the first chip).

[0028] In one possible design, the first chip sends the first request to the server through the network modules distributed on the first and second chips, including: the processing module in the first chip encapsulates the first request according to the protocol stack to obtain a second request, and sends the second request to the second chip; the second chip sends the second request to the server through the transceiver module. The first chip receives a first response from the server through the network modules distributed on the first and second chips, including: the second chip receives a second response from the server through the transceiver module, the second response including the network content; the second chip sends the second response to the first chip; and the processing module in the first chip decapsulates the second response according to the protocol stack to obtain the first response.

[0029] In this embodiment, the processing module within the network module can be deployed on a first chip, and the transceiver module can be deployed on a second chip. Thus, the first chip can process data using the processing module deployed on its own chip, and then send the processed data out using the transceiver module deployed on the second chip. Since the transceiver module does not need to be deployed on the first chip, chip area is saved, contributing to a lighter device (the device containing the first chip).

[0030] In one possible design, the second chip may reside in the same device as the first chip or in a different device. Taking the first and second chips in the same device as an example—that is, within a single device, the network module is distributed across different chips—helps save chip area per chip. Taking the first and second chips in different devices as an example—that is, the network module is distributed across different devices—helps achieve device lightweighting.

[0031] In one possible design, the first chip and the second chip are located in different devices. Before the first chip sends the first request to the server through the network modules distributed on the first chip and the second chip, the method further includes: determining that the first chip meets a first condition, and / or that the second chip meets a second condition; wherein the first condition includes one or more of the following: the current remaining power of the device where the first chip is located is less than a first power; the current operating load of the device where the first chip is located is greater than a first load; the current operating mode of the device where the first chip is located is a power-saving mode; wherein the second condition includes one or more of the following: the current remaining power of the device where the second chip is located is greater than or equal to a second power, and the second power is greater than or equal to the first power; the current operating load of the device where the second chip is located is less than or equal to a second load, and the second load is less than or equal to the first load; the current operating mode of the device where the second chip is located is a non-power-saving mode; the current network signal strength of the device where the second chip is located is higher than a first strength.

[0032] In this embodiment of the application, when the first chip and the second chip are located in different devices, before the first chip can realize the Internet access function through the second chip, it can first determine whether the first chip and / or the second chip meet the conditions. If the first chip meets the first condition (e.g., low remaining power and high operating load), and / or the second chip meets the second condition (e.g., high remaining power and low operating load), then the Internet access function can be realized through the second chip to avoid affecting the normal operation of the second chip.

[0033] In one possible design, the first chip and the second chip are located in the same device. Before the first chip sends the first request to the server through the network module distributed on the first chip and the second chip, the method further includes: determining that the first chip meets a first condition, and / or that the second chip meets a second condition; the first condition includes at least one of the following: the current operating load of the first chip is greater than a third load, and the current operating mode of the first chip is a power-saving mode; the second condition includes at least one of the following: the current operating load of the second chip is less than or equal to a fourth load, and the current operating mode of the second chip is a non-power-saving mode, wherein the fourth load is less than or equal to the third load.

[0034] In this embodiment of the application, when the first chip and the second chip are located in the same device, before the first chip can realize the Internet access function through the second chip, it can first determine whether the first chip and / or the second chip meet the conditions. If the first chip meets the first condition (e.g., high operating load) and / or the second chip meets the second condition (e.g., low operating load), then the Internet access function can be realized through the second chip to avoid affecting the normal operation of the second chip.

[0035] In one possible design, the second chip and the first chip are located in the same device, and the first chip sends a second request to the second chip, including: the first chip sending the second request to the second chip through an inter-chip communication connection; the second chip sends a second response to the first chip, including: the second chip sending the second response to the first chip through the inter-chip communication connection.

[0036] In this embodiment, when the second chip and the first chip are located in the same device, the two chips communicate with each other through an inter-chip communication connection, which provides high security.

[0037] In one possible design, the second chip and the first chip are located in different devices. The first chip sends a second request to the second chip, including: the first chip sending the second request to the second chip via a short-range communication connection; the second chip sends a second response to the first chip, including: the second chip sending the second response to the first chip via the short-range communication connection.

[0038] In this embodiment of the application, when the second chip and the first chip are located in different devices, the two devices communicate through a short-range communication connection, which provides high security.

[0039] In one possible design, the second chip and the first chip are located in different devices. Before the first chip sends the first request to the server through the network module distributed on the first chip and the second chip, the method further includes: determining that a short-range communication connection has been established between the different devices; or the second chip and the first chip are located in the same device. Before the first chip sends the first request to the server through the network module distributed on the first chip and the second chip, the method further includes: determining that an inter-chip communication connection has been established between the two chips.

[0040] In this embodiment, when the second chip and the first chip are located in the same device, the first chip enables internet access through the second chip after determining that an inter-chip communication connection has been established between the two chips. When the second chip and the first chip are located in different devices, the first chip enables internet access through the second device after determining that a short-range communication connection has been established between the two devices.

[0041] In one possible design, the first chip includes an MCU and the second chip includes an AP. In embodiments of this application, the first chip may also be a chip other than an MCU, and the second chip may also be a chip other than an AP. Optionally, the first chip and the second chip may be the same or different; for example, both may be MCUs or both may be APs.

[0042] In one possible design, the first request is an HTTP request and the first response is an HTTP response; or, the first request is an HTTPS request and the first response is an HTTPS response.

[0043] Secondly, a communication method is also provided, applied to a first chip, the method comprising: the first chip generating a first request, the first request being used to request network content; the first chip sending the first request to a server through a network module, the network module being distributed and deployed on the first chip and a second chip; and the first chip receiving a first response from the server through the network module, the first response including the network content.

[0044] In one possible design, the network module is distributed across the first chip and the second chip, and includes: the network module includes a processing module, which is used to process data according to a protocol stack, wherein the protocol stack is a communication protocol stack supported by the server, and the processing module is distributed across the first chip and the second chip.

[0045] In one possible design, the processing module is distributed across the first chip and the second chip, including: the protocol stack in the processing module is distributed across the first chip and the second chip.

[0046] In one possible design, the protocol stack is distributed across the first chip and the second chip, including: the M-layer protocol in the protocol stack is deployed on the first chip, the NM-layer protocol in the protocol stack is deployed on the second chip, the NM-layer protocol is the other layer protocols in the protocol stack besides the M-layer, and N is the total number of layers in the protocol stack.

[0047] In one possible design, the M-layer protocol is located above the NM-layer protocol.

[0048] In one possible design, the M-layer protocol includes an application layer, and the NM-layer protocol includes a transport layer, a network layer, a data link layer, and a physical layer.

[0049] In one possible design, the first chip sends the first request to the server via a network module, including: the first chip encapsulating the first request according to the M-layer protocol to obtain a second request; the first chip sending the second request to the second chip, the second chip encapsulating the second request according to the NM-layer protocol to obtain a third request, and sending the third request to the server, the third request being used to request the network content.

[0050] In one possible design, the first chip receives a first response from the server via a network module, comprising: the first chip receiving a second response sent by the second chip, wherein the second response is obtained by the second chip after receiving a third response from the server and decrypting the third response according to the NM layer protocol, and the third response includes the network content; and the first chip decrypting the second response according to the M layer protocol to obtain the first response.

[0051] In one possible design, the network module further includes a transceiver module for receiving data from or sending data to the server, the transceiver module being deployed on the second chip.

[0052] In one possible design, the second chip is located in the same device or a different device as the first chip.

[0053] In one possible design, the first chip and the second chip are located in different devices. Before the first chip sends the first request to the server through the network modules distributed on the first chip and the second chip, the method further includes: determining that the first chip meets a first condition, and / or that the second chip meets a second condition; wherein the first condition includes one or more of the following: the current remaining power of the device where the first chip is located is less than a first power; the current operating load of the device where the first chip is located is greater than a first load; the current operating mode of the device where the first chip is located is a power-saving mode; wherein the second condition includes one or more of the following: the current remaining power of the device where the second chip is located is greater than or equal to a second power, and the second power is greater than or equal to the first power; the current operating load of the device where the second chip is located is less than or equal to a second load, and the second load is less than or equal to the first load; the current operating mode of the device where the second chip is located is a non-power-saving mode; the current network signal strength of the device where the second chip is located is higher than a first strength.

[0054] In one possible design, the first chip and the second chip are located in the same device. Before the first chip sends the first request to the server through the network module distributed on the first chip and the second chip, the method further includes: determining that the first chip meets a first condition, and / or that the second chip meets a second condition; the first condition includes at least one of the following: the current operating load of the first chip is greater than a third load, and the current operating mode of the first chip is a power-saving mode; the second condition includes at least one of the following: the current operating load of the second chip is less than or equal to a fourth load, and the current operating mode of the second chip is a non-power-saving mode, wherein the fourth load is less than or equal to the third load.

[0055] In one possible design, the first chip includes an MCU and the second chip includes an AP.

[0056] Thirdly, a communication method is also provided, applied to a second chip, the method comprising: the second chip acquiring a third request, the third request being for requesting network content, and the third request being processed by a network module, the network module being distributed and deployed on the first chip and the second chip; the second chip sending the third request to a server; the second chip receiving a third response from the server, the third response including the network content; the second chip determining a second response based on the third response; and the second chip sending the second response to the first chip.

[0057] In one possible design, the network module is distributed across the first chip and the second chip, and includes: the network module includes a processing module, which is used to process data according to a protocol stack, wherein the protocol stack is a communication protocol stack supported by the server, and the processing module is distributed across the first chip and the second chip.

[0058] In one possible design, the processing module is distributed across the first chip and the second chip, including: the protocol stack in the processing module is distributed across the first chip and the second chip.

[0059] In one possible design, the protocol stack is distributed across the first chip and the second chip, including: the M-layer protocol in the protocol stack is deployed on the first chip, the NM-layer protocol in the protocol stack is deployed on the second chip, the NM-layer protocol is the other layer protocols in the protocol stack besides the M-layer, and N is the total number of layers in the protocol stack.

[0060] In one possible design, the M-layer protocol is located above the NM-layer protocol.

[0061] In one possible design, the M-layer protocol includes an application layer, and the NM-layer protocol includes a transport layer, a network layer, a data link layer, and a physical layer.

[0062] In one possible design, the second chip obtains the third request by: the second chip receiving a second request sent by the first chip, wherein the second request is obtained by the first chip generating a first request and then encapsulating the first request according to the M-layer protocol, and the first request is used to request the network content; and the second chip encapsulating the second request according to the NM-layer protocol to obtain the third request.

[0063] In one possible design, the second chip determines a second response based on the third response, including: the second chip decapsulating the third response according to the NM layer protocol to obtain a second response; the first chip decapsulating the second response according to the M layer protocol to obtain a first response, the first response including the network content.

[0064] In one possible design, the network module further includes a transceiver module for receiving data from or sending data to the server, the transceiver module being deployed on the second chip.

[0065] In one possible design, the second chip is located in the same device or a different device as the first chip.

[0066] In one possible design, the first chip and the second chip are located in different devices. Before the first chip sends the first request to the server through the network modules distributed on the first chip and the second chip, the method further includes: determining that the first chip meets a first condition, and / or that the second chip meets a second condition; wherein the first condition includes one or more of the following: the current remaining power of the device where the first chip is located is less than a first power; the current operating load of the device where the first chip is located is greater than a first load; the current operating mode of the device where the first chip is located is a power-saving mode; wherein the second condition includes one or more of the following: the current remaining power of the device where the second chip is located is greater than or equal to a second power, and the second power is greater than or equal to the first power; the current operating load of the device where the second chip is located is less than or equal to a second load, and the second load is less than or equal to the first load; the current operating mode of the device where the second chip is located is a non-power-saving mode; the current network signal strength of the device where the second chip is located is higher than a first strength.

[0067] In one possible design, the first chip and the second chip are located in the same device. Before the first chip sends the first request to the server through the network module distributed on the first chip and the second chip, the method further includes: determining that the first chip meets a first condition, and / or that the second chip meets a second condition; the first condition includes at least one of the following: the current operating load of the first chip is greater than a third load, and the current operating mode of the first chip is a power-saving mode; the second condition includes at least one of the following: the current operating load of the second chip is less than or equal to a fourth load, and the current operating mode of the second chip is a non-power-saving mode, wherein the fourth load is less than or equal to the third load.

[0068] In one possible design, the first chip includes an MCU and the second chip includes an AP.

[0069] Fourthly, a communication system is provided, comprising: a first chip and a second chip.

[0070] The first chip is used to perform the method as provided in the second aspect above;

[0071] The second chip is used to perform the method provided in the third aspect above.

[0072] In one possible design, the first chip and the second chip may be located in the same device or in different devices. When the first chip and the second chip are located in different devices, the communication system includes two devices. When the first chip and the second chip are located in the same device, the communication system includes one device.

[0073] In one possible design, the communication system can be a chip system. Optionally, the chip system can be deployed in the same device or different devices, that is, the first chip and the second chip can be deployed in the same device or different devices.

[0074] Fifthly, an electronic device is provided, comprising: a first chip and a second chip.

[0075] The first chip is used to perform the method as provided in the second aspect above;

[0076] The second chip is used to perform the method provided in the third aspect above.

[0077] Sixthly, an electronic device is also provided, comprising:

[0078] Processor, memory, and one or more programs;

[0079] The one or more programs are stored in the memory, and the one or more programs include instructions that, when executed by the processor, cause the electronic device to perform the method provided in the second aspect above.

[0080] In a seventh aspect, a chip is also provided for performing the method as provided in the second aspect above.

[0081] Eighthly, an electronic device is also provided, comprising: a processor, a memory, and one or more programs; wherein the one or more programs are stored in the memory, and the one or more programs include instructions that, when executed by the processor, cause the electronic device to perform the method provided in the third aspect above.

[0082] Ninthly, a chip is also provided for performing the method as provided in the third aspect above.

[0083] In a tenth aspect, a computer-readable storage medium is also provided for storing a computer program that, when run on a computer, causes the computer to perform the methods provided in the first, second, or third aspects described above.

[0084] Eleventhly, a computer program product is also provided, comprising a computer program that, when run on a computer, causes the computer to perform the methods provided in the first, second, or third aspects described above.

[0085] The technical effects that can be achieved in the second to eleventh aspects mentioned above are described in the description of the technical effects that can be achieved by the corresponding design schemes in the first aspect mentioned above, and will not be repeated here. Attached Figure Description

[0086] Figure 1 is a schematic diagram of a communication system provided in an embodiment of this application;

[0087] Figure 2 is a schematic diagram of a cross-device scenario provided in an embodiment of this application;

[0088] Figures 3A to 3D are schematic diagrams of a first solution in a cross-device scenario provided by an embodiment of this application;

[0089] Figures 4A to 4D are schematic diagrams of a second solution in a cross-device scenario provided by an embodiment of this application;

[0090] Figure 5 is a schematic diagram of the same device scenario provided in an embodiment of this application;

[0091] Figures 6A to 6D are schematic diagrams of a first solution under the same device scenario provided in an embodiment of this application;

[0092] Figures 7A to 7D are schematic diagrams of a second solution in the same device scenario provided by an embodiment of this application;

[0093] Figures 8A and 8B are schematic diagrams illustrating the combination of two scenarios provided in an embodiment of this application;

[0094] Figure 9 is a schematic diagram of the GUI of an electronic device provided in an embodiment of this application;

[0095] Figure 10 is a schematic diagram of an electronic device provided in an embodiment of this application;

[0096] Figure 11 is a schematic diagram of an electronic device provided in an embodiment of this application. Detailed Implementation

[0097] The following explanations of some terms used in the embodiments of this application are provided to facilitate understanding by those skilled in the art.

[0098] The embodiments of this application involve at least one, including one or more; where "multiple" means two or more. Furthermore, it should be understood that in the description of this specification, terms such as "first," "second," and "third" are used only for descriptive purposes and should not be construed as indicating relative importance or order. For example, "first chip" and "second chip" do not represent the degree of importance of the two or their order, but are merely for descriptive distinction. In the embodiments of this application, "and / or" merely describes an association relationship, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, and B alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0099] The directional terms mentioned in the embodiments of this application, such as "up", "down", "left", "right", "inner", and "outer", are only for reference to the directions in the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of this application, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0100] References to "one embodiment," "in some examples," or "some embodiments" as described in the embodiments of this application mean that one or more embodiments of this specification include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in some examples," "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0101] The technical solutions provided by the embodiments of this application are described below with reference to the accompanying drawings.

[0102] To facilitate understanding of this solution, the principle of internet access for electronic devices will be briefly explained first. For example, please refer to Figure 1, which is a schematic diagram of a communication system provided in an embodiment of this application. As shown in Figure 1, the communication system includes an electronic device and a server. The electronic device includes application a and a network module, which is used to enable the electronic device to access the internet. For example, application a in the electronic device can access the internet through the network module, that is, access the server through the network module. The server can be the application server corresponding to application a. As shown in Figure 1, the network module includes a processing module and a transceiver module.

[0103] The processing module is used for data processing, including processing uplink and / or downlink data from application a. Uplink data from application a refers to data sent by application a to the server, such as a network request for network content. Downlink data from application a refers to data sent by the server to application a, such as a network response for providing network content. One possible way the processing module processes data is by using a protocol stack. For ease of understanding, a simple explanation of the protocol stack is provided first. A protocol stack can include N layers, where N is a positive integer. For example, as shown in Figure 1, the protocol stack includes five layers: application layer, transport layer, network layer, data link layer, and physical layer. Each of the N layers is different. A protocol can be understood as a specification document that indicates the data format. The data format can include: the total length of the data, the number of fields, the length of each field, the content, the order of different fields, the first field, the last field, etc. Therefore, each layer of the protocol stack indicates a different data format. The following explanation uses the five-layer protocol in Figure 1 as an example.

[0104] The application layer can support Hypertext Transfer Protocol (HTTP), Hypertext Transfer Protocol over Secure Socket Layer (HTTPS), or other protocols. Taking HTTP as an example, the application layer can encapsulate network requests generated by application A into HTTP format.

[0105] The transport layer can support Transmission Control Protocol (TCP), User Datagram Protocol (UDP), or other protocols. Taking TCP as an example, the transport layer can encapsulate HTTP-formatted data output from the application layer into TCP format.

[0106] The network layer can support the Internet Protocol (IP) or other protocols. Taking IP as an example, the network layer can encapsulate TCP-formatted data output from the transport layer into IP format.

[0107] The data link layer can support Media Access Control (MAC) protocols or other protocols. For example, the data link layer can encapsulate IP-formatted data output from the network layer into MAC format.

[0108] The physical layer can support LAN protocols, WAN protocols, or other protocols. Taking LAN protocols as an example, the physical layer can encapsulate data in MAC format provided by the data link layer into a bit stream.

[0109] It should be noted that the above is an example of each layer of the five-layer protocol and does not constitute a limitation on the five-layer protocol. Furthermore, while Figure 1 uses a five-layer protocol stack as an example, in practical applications, the protocol stack can include more or fewer layers, without limitation.

[0110] As mentioned earlier, the processing module can process data through the protocol stack, which may include: processing uplink data of application a, and / or processing downlink data of application a. This paper refers to the process of processing uplink data of application a through the protocol stack as the encapsulation process, and the process of processing downlink data of application a through the protocol stack as the decapsulation process.

[0111] I. Encapsulation Process: This refers to the encapsulation process performed by the processing module on the uplink data of application a (e.g., a network request to be sent to the server). The encapsulation process can be performed layer by layer. For example, the protocol stack in Figure 1 includes five layers, and the processing module can encapsulate the data layer by layer in a top-down order, such as application layer -> transport layer -> network layer -> data link layer -> physical layer. For example, the layer-by-layer encapsulation process can include: the application layer encapsulating the network request of application a into HTTP format; the transport layer encapsulating the HTTP format data output by the application layer into TCP format; the network layer encapsulating the TCP format data output by the transport layer into IP format; the data link layer encapsulating the IP format data output by the network layer into MAC format; and the physical layer encapsulating the MAC format data into a bit stream.

[0112] II. The decapsulation process refers to the process by which the processing module decapsulates the downlink data of application a (e.g., the network response sent by the server to application a). The decapsulation process can be performed layer by layer. For example, the protocol stack in Figure 1 includes five layers. The processing module can decapsulate these five layers in a bottom-up order, i.e., in the order of physical layer -> data link layer -> network layer -> transport layer -> application layer. For example, the layer-by-layer decapsulation process may include: the physical layer decapsulating the network response from a bitstream to MAC format; the data link layer decapsulating the MAC format data provided by the physical layer to IP format; the network layer decapsulating the IP format data provided by the data link layer to TCP format; the transport layer decapsulating the TCP format data provided by the network layer to HTTP format; and the application layer decapsulating the HTTP format data provided by the transport layer into network content, which is the network content requested by application a.

[0113] The transceiver module is used for data transmission and reception. For example, it can send network requests to a server or receive network responses from a server. Optionally, the transceiver module may include a wireless network module and / or a mobile data module. The wireless network module may include a Wi-Fi chip for accessing Wi-Fi. The mobile data module may include a subscriber identity module (SIM card) and a modem chip. If the SIM card has an internet service activated (e.g., data traffic), the modem chip can access the network according to the internet service activated by the SIM card. Optionally, the internet service may be a 3G / 4G / 5G / 6G or higher-order network, without limitation.

[0114] Continuing with Figure 1 as an example, the internet access process of application a in the electronic device can include two parts. (1) The process of application a initiating a network request. The data transmission process in this part can include: application a -> network module -> server. For example, application a generates a network request to request network content. The processing module is used to encapsulate the network request according to the protocol stack and send the encapsulated network request to the server through the transceiver module. (2) The process of application a receiving a network response. The data transmission process in this part can include: server -> network module -> application a. For example, the transceiver module of the electronic device receives the network response sent by the server, and the network response includes the network content. The processing module is used to decapsulate the network response according to the protocol stack to obtain the network content, and then send the network content to application a.

[0115] The above text, illustrated in Figure 1, explains the principle of internet access for electronic devices. As can be seen, for an electronic device to function as an internet device, it needs to integrate a network module. In other words, if an electronic device does not have an integrated network module, it cannot access the internet.

[0116] Therefore, this application provides a technical solution that enables electronic devices without integrated network modules to access the internet. For ease of understanding, the following description is divided into two different scenarios: a cross-device scenario and a same-device scenario.

[0117] The first scenario: cross-device scenario.

[0118] This scenario can include two devices, such as a first device and a second device. The first device does not have a network module integrated, while the second device does. The first device can use the second device to access the internet. For example, as shown in Figure 2, the first device includes application b but does not include a network module, while the second device does include a network module. Application b in the first device can use the second device to access the internet; for example, application b in the first device can use the network module in the second device to access the internet.

[0119] Optionally, application b can be any type of application, such as instant messaging applications, map applications, navigation applications, sports and health applications, social applications, etc., without limitation.

[0120] Optionally, the first device can be a lightweight device or a non-lightweight device. Taking lightweight devices as an example, they can include wearable devices, Internet of Things (IoT) devices, etc. Wearable devices can include wrist-worn devices and head-mounted devices. Wrist-worn devices can include watches, wristbands, etc. Head-mounted devices can include glasses, helmets, headphones, etc. IoT devices can be smart home devices and leisure and entertainment devices. Smart home devices can include home appliances, lighting equipment, security equipment, audio-visual equipment, cleaning equipment, cooking equipment, etc. Home appliances can include televisions, refrigerators, washing machines, etc. Lighting equipment can include various types of lamps. Security equipment can include door locks, doorbells, peepholes, cameras, etc. Audio-visual equipment can include speakers, microphones, etc. Cleaning equipment can include robot vacuum cleaners, air purifiers, dishwashers, etc. Cooking equipment can include smart rice cookers, smart range hoods, etc. Leisure and entertainment devices can include fitness equipment, claw machines, self-checkout machines, etc. Taking non-lightweight devices as an example, they may include portable devices such as mobile phones, tablets, laptops, personal computers (PCs), ultra-mobile personal computers (UMPCs), netbooks, and personal digital assistants (PDAs); or, they may be vehicle-mounted devices, which can be mounted on various means of transportation such as cars, trains, electric vehicles, helicopters, airplanes, ships, bicycles, and motorcycles; in short, the specific type of the first device is not limited in the embodiments of this application.

[0121] Optionally, the second device can be a lightweight device or a non-lightweight device. Taking lightweight devices as an example, they can include wearable devices, IoT devices, etc. Wearable devices can include wrist-worn devices and head-mounted devices, as described above. IoT devices can be smart home devices and leisure and entertainment devices, as described above. Taking non-lightweight devices as an example, they can include portable devices such as mobile phones, tablets, laptops, PCs, UMPCs, netbooks, and PDAs; or, they can be in-vehicle devices. In short, the specific type of the second device is not limited in this application embodiment. Optionally, the device types of the second device and the first device can be the same or different, without limitation. For ease of understanding, this document uses a watch as the first device and a mobile phone as the second device for illustration.

[0122] Continuing with Figure 2 as an example, in a cross-device scenario, application b in the first device can utilize the network module in the second device to access the internet. Optionally, application b's utilization of the network module in the second device can include two methods: full utilization and partial utilization, which will be explained below.

[0123] In the first approach, application b in the first device fully utilizes the network module in the second device.

[0124] As mentioned above, the network module of the second device includes a processing module and a transceiver module, and the processing module includes a protocol stack. Application b can fully utilize the network module of the second device by utilizing both the processing module and the transceiver module within the network module, and by utilizing all layers of the protocol stack within the processing module.

[0125] Continuing with Figure 2 as an example, the network module in the second device can enable internet access for local applications (e.g., application a) on the second device. However, application b, located in the first device, is a cross-device application, and the network module cannot directly enable internet access for cross-device applications. One possible approach is, as shown in Figure 3A, to include a proxy application for application b in the second device. Data generated by application b in the first device can be synchronized to the proxy application in the second device. The proxy application is a local application on the second device, and the network module can enable internet access for the proxy application. Optionally, the proxy application for application b can be completely identical to or slightly different from application b; for example, the proxy application may have fewer functions than application b.

[0126] Please refer to Figure 3B, which is another schematic diagram of the communication system in Figure 3A. The internet access process of application b in the first device is explained in conjunction with Figure 3B. As shown in Figure 3B, the internet access process of application b can include two parts: (1) The process of application b initiating a network request. The data transmission process in this part can include: application b → proxy application → network module → server. For example, application b generates a first request to request network content. Application b sends the first request to the proxy application through the short-range module. After receiving the first request, the proxy application sends it to the network module. The processing module in the network module encapsulates the first request according to the protocol stack to obtain a second request, and then sends the second request to the server through the transceiver module. (2) The process of application b receiving a network response. The data transmission process in this part can include: server → network module → proxy application → application b. For example, the transceiver module of the second device receives a second response sent by the server, which includes network content. The processing module of the second device can decapsulate the second response according to the protocol stack to obtain a first response, which includes network content, and then sends the first response to the proxy application. The proxy application sends the first response to application b through the short-range communication module.

[0127] It should be noted that Figures 3A and 3B use the example of the first device including application b. Therefore, the second device includes a proxy application for application b. It can be understood that besides application b, the first device may also include other applications, such as application c. In this case, the second device can also include a proxy application for application c. The principle by which application c uses the second device to access the internet is the same as that of application b, and will not be repeated. Optionally, the proxy application for application b and the proxy application for application c can be the same proxy application or different proxy applications; this is not limited.

[0128] In the preceding embodiments, data transmission occurs between application b and the proxy application. Optionally, to ensure data security, the transmitted data between application b and the proxy application can be encapsulated according to a certain protocol. For example, as shown in Figure 3C, the first device includes application b and a first module, the first module including protocol b. Optionally, the first module can be located within application b or independent of application b. The second device includes a proxy application of application b and a second module, the second module including protocol b. Optionally, the second module can be located within the proxy application or independent of the proxy application. Protocol b is the transmission protocol between application b and the proxy application; that is, the transmitted data between application b and the proxy application needs to be encapsulated using protocol b. Optionally, protocol b can be a proprietary protocol provided by the provider of application b. One possible scenario is that application b and the proxy application come from the same provider, and this provider provides protocol b between application b and the proxy application. When the first device downloads application b, it simultaneously downloads protocol b; when the second device downloads the proxy application, it also simultaneously downloads protocol b.

[0129] Please refer to Figure 3D, which is another schematic diagram of the communication system in Figure 3C. The internet access process of application b in the first device is explained in conjunction with Figure 3D. As shown in Figure 3D, the internet access process of application b can include two parts. (1) The process of application b initiating a network request. The data transmission process in this part includes: application b → first module → second module → proxy application → network module → server. For example, application b generates a first request to request network content. Application b sends the first request to the first module, which encapsulates the first request using protocol b to obtain a second request, and then sends the second request to the second module in the second device through the short-range communication module. The second module decapsulates the second request using protocol b to obtain the first request, and then sends the first request to the proxy application. After receiving the first request, the proxy application sends it to the network module. The processing module in the network module encapsulates the first request according to the protocol stack to obtain a third request, and then sends the third request to the server through the transceiver module. (2) The process of application b receiving a network response. The data transmission process in this part can include: server → network module → proxy application → second module → first module → application b. For example, the transceiver module of the second device receives a third response from the server, which includes network content. The processing module of the second device can decapsulate the third response according to the protocol stack to obtain a first response, which also includes network content, and then send the first response to the proxy application. The proxy application sends the first response to the second module, which encapsulates the first response using protocol b to obtain a second response, and then sends the second response to the first module of the first device via a short-range communication module. The first module decapsulates the second response using protocol b to obtain the first response, and then sends the first response to application b.

[0130] Compare Figures 3B and 3D. In Figure 3B, data transmission between application b and the proxy application does not require the use of a proprietary protocol (e.g., protocol b). However, in Figure 3D, data transmission between application b and the proxy application requires the use of a proprietary protocol (e.g., protocol b), thus improving data security. It should be noted that, compared to Figure 3B, Figure 3D adds an additional conversion process from a proprietary protocol to a standard protocol for the second device. For example, in Figure 3D, the data received by the second device from the first device is encapsulated using a proprietary protocol. The second device needs to decapsulate this data using the proprietary protocol before it can be encapsulated using the standard protocol in the network module's protocol stack—this is the conversion process from a proprietary protocol to a standard protocol. Furthermore, Figure 3D uses application b as an example in the first device, so the first module includes protocol b corresponding to application b, and the second device includes the proxy application of application b. It can be understood that, in addition to application b, the first device may also include other applications, such as application c. In this case, the first module may also include protocol c corresponding to application c, and the second device may also include the proxy application of application c. In other words, the first module includes the private protocols corresponding to each application. The principle by which application c uses a second device to access the internet is the same as that of application b, and will not be repeated here.

[0131] The above explains the principle of the first method. In this method, since the first device fully utilizes the network module in the second device, the first device does not need to integrate a network module, which helps to achieve the lightweighting of the first device.

[0132] In the second approach, application b in the first device utilizes the network module in the second device.

[0133] As mentioned above, the network module of the second device includes a processing module and a transceiver module, and the processing module includes a protocol stack. Application b of the first device utilizes the network module of the second device, which may include: utilizing only the processing module of the second device, or utilizing only the transceiver module of the second device, or utilizing both the processing module and the transceiver module, but only utilizing a portion of the protocol stack in the processing module.

[0134] Taking the example of only using the transceiver module of the second device, for example, as shown in FIG. 4A, the first device includes application b and a processing module, and the processing module includes a protocol stack. In this case, the first device does not need to use the processing module in the second device and only needs to use the transceiver module in the second device. Optionally, in this case, the second device may or may not include a processing module (so in FIG. 4A, the processing module in the second device is shown by a dashed line). For example, if the second device itself has an Internet access requirement, it may include a processing module; if the second device itself does not have an Internet access requirement, it may not include a processing module. Therefore, in FIG. 4A, the processing module in the first device and the transceiver module in the second device can form a network module for implementing the Internet access function. It can also be understood that the network module is distributedly deployed on the first device and the second device. For example, the processing module in the network module is deployed on the first device, and the transceiver module is deployed on the second device.

[0135] Taking the example of using both the processing module and the transceiver module of the second device, and only using a partial layer of the protocol stack in the processing module, for example, as shown in FIG. 4B, the first device includes application b and a first module. The first module includes M-layer protocols, where M is a positive integer and M < N, and N is the total number of layers of the protocol stack. For example, N = 5. Since the first module in the first device includes M-layer protocols, the first device only needs to use the N - M layer protocols in the second device, and the N - M layer protocols are the other protocols in the N-layer protocols except the M-layer protocols. In this case, the second device may or may not include the M-layer protocols (so in FIG. 4B, the M-layer protocols in the second device are shown by a dashed line). Therefore, in FIG. 4B, the M-layer protocols in the first device and the N - M layer protocols in the second device form the protocol stack in the processing module of the network module. It can also be understood that the network module is distributedly deployed on the first device and the second device. For example, the processing module in the network module (for example, the protocol stack in the processing module) is distributedly deployed on the first device and the second device. For example, the M layers in the protocol stack are deployed on the first device, and the N - M layers are deployed on the second device.

[0136] In the embodiments of the present application, the M-layer protocols in the first device may be one or more upper-layer protocols in the N-layer protocols. The N - M layer protocols in the second device may be one or more lower-layer protocols in the N-layer protocols. For example, the M layer in the first device includes the application layer, and the N - M layer in the second device includes the transport layer, network layer, data link layer, and physical layer. Or, the M layer in the first device includes the application layer and the transport layer, and the N - M layer in the second device includes the network layer, data link layer, and physical layer. Or, the M layer in the first device includes the application layer, transport layer, and network layer, and the N - M layer in the second device includes the data link layer and the physical layer. Or, the M layer in the first device includes the application layer, transport layer, network layer, and data link layer, and the N - M layer in the second device includes the physical layer.

[0137] For ease of understanding, the following explanation will use the example of the first device where layer M only includes the application layer. For example, as shown in Figure 4C, the first device includes application b and a first module. The first module includes the application layer. In this case, the second device may or may not include the application layer (therefore, the application layer in the second device in Figure 4C is represented by a dashed line). For ease of description, the following explanation will use the second device including the application layer as an example.

[0138] Understandably, the first device needs to acquire the first module before using it. Optionally, there are several ways to acquire it. Method 1: The first module is configured pre-installed on the first device at the factory. It should be understood that the more layers a first module contains, the more storage space it occupies and the more power it consumes. The manufacturer of the first device can determine the number of layers in the first module based on the device's storage space and power consumption. Method 2: The first device downloads the first module. For example, the first module can be in various forms such as an application, plugin, or mini-program. The first device can download the first module from an app store or website. Method 3: The first device receives the first module from other devices. For example, the first device receives an installation package of the first module from another device and installs the first module based on that package.

[0139] Please refer to Figure 4D, which is another schematic diagram of the communication system shown in Figure 4C. The following description, in conjunction with Figure 4D, illustrates the internet access process of application b in the first device of Figure 4C. As shown in Figure 4D, the internet access process of application b can include two parts.

[0140] I. The process of application b initiating a network request. This data transmission flow can include: application b -> first module -> network module -> server. For example, as shown in Figure 4D, the process of application b initiating a network request can include the following:

[0141] ① Application b sends a first request to the first module. The first request requests network content. The first module encapsulates the first request to obtain a second request. As mentioned above, the first module includes an application layer. Encapsulating the first request by the first module can include encapsulating the first request through the application layer. In this embodiment, application b sending the first request to the first module can include application b sending the first request to the first module through a first interface. The first interface can be an application programming interface (API) or other types of interfaces, without limitation. Optionally, the first interface can be called by various applications. For example, the first device includes application b, application c, etc., and these applications can all call the first interface. In other words, these applications can all send network requests to the first module through the first interface. In some embodiments, the first interface can support a first transmission format, that is, the data transmitted through the first interface needs to meet the first transmission format. The first transmission format can be the format corresponding to an HTTP request or the format corresponding to an HTTPS request. Taking the format corresponding to an HTTP request as an example, the network request sent by the application to the first module through the first interface is an HTTP request; taking the format corresponding to an HTTPS request as an example, the network request sent by the application to the first module through the first interface is an HTTPS request. Optionally, the first module can receive the first request sent by application b through the first interface in two ways. Method A: The first module can listen to the first interface, for example, to check if there is data transmission on the first interface. When it detects a first request on the first interface, it retrieves the first request. Optionally, the first module can listen to the first interface periodically. In this method, the first module needs to register a listening event for the first interface to listen to it. The method of registering a listening event is not detailed here; for example, it can be registered using the Binder mechanism. Method B: The first module does not listen to the first interface, but receives the first request from the first interface when it receives a notification message sent by application b. The notification message is used to notify the first module to retrieve the first request from the first interface. In this approach, application b needs to send a notification message to the first module. One possible approach is that after generating the first request, application b calls a function to send the notification message to the first module. The function can be a callback function or other functions, without limitation.

[0142] ② The first module sends the second request to the network module in the second device via a short-range communication connection. For example, as shown in Figure 4D, both the first and second devices include a short-range communication module. Optionally, the short-range communication modules in both the first and second devices can be Bluetooth modules, ultra-wideband (UWB) modules, near-field communication (NFC) modules, radio frequency identification (RFID) modules, or Near Link modules, without limitation. Therefore, the first and second devices can establish a short-range communication connection through their respective short-range communication modules, allowing the first module to send the second request to the network module in the second device via this connection. For example, as shown in Figure 4D, the first module sends the second request to the short-range communication module in the first device, which then sends the second request to the short-range communication module in the second device, which in turn sends the second request to the network module.

[0143] In some embodiments, before the first device sends a second request to the second device via a short-range communication connection, the process may further include: determining that the first device meets a first condition, and / or that the second device meets a second condition.

[0144] Optionally, the first condition may include at least one of the following:

[0145] a. The current remaining power of the first device is less than the first power level.

[0146] b. The current operating load of the first device is greater than the first load.

[0147] c. The current operating mode of the first device is power saving mode. Power saving mode may also have other names, such as battery life mode, energy-saving mode, low-power mode, etc.

[0148] In other words, when the first device has low battery, high load, or is in power-saving mode, a second request is sent to the second device via a short-range communication connection to access the Internet using the second device.

[0149] Optionally, the second condition may include at least one of the following:

[0150] a. The current remaining power of the second device is greater than or equal to the second power, and the second power is greater than or equal to the first power.

[0151] b. The current operating load of the second device is less than or equal to the second load, and the second load is less than or equal to the first load.

[0152] c. The current operating mode of the second device is non-power-saving mode.

[0153] d. The current network signal strength of the second device is higher than that of the first device.

[0154] In other words, when the first device determines that the second device has sufficient power, low load, is in non-power-saving mode, or has a high network signal strength, it sends a second request to the second device through a short-range communication connection to access the Internet using the second device.

[0155] ③ The processing module in the network module encapsulates the second request according to other layers below the application layer in the protocol stack to obtain the third request, and then sends the third request to the server through the transceiver module. It can be understood that, as mentioned above, the second request received by the network module is a request encapsulated by the application layer in the first device. Therefore, after receiving the second request, the network module encapsulates it layer by layer through the transport layer -> network layer -> data link layer -> physical layer to obtain the third request, and then sends the third request out.

[0156] II. The process of application b receiving network responses. This data transmission flow can include: Server -> Network Module -> First Module -> Application b. For example, as shown in Figure 4D, the process of application b receiving network responses can include the following:

[0157] ④ The second device receives the third response sent by the server through its transceiver module. The third response is the server's response based on the third request. For example, the third response includes the network content requested in the third request. The processing module in the second device decapsulates the third response through other layers below the application layer in the protocol stack, such as decapsulating it layer by layer through the physical layer -> data link layer -> network layer -> transport layer, to obtain the second response.

[0158] ⑤ The second device sends a second response to the first device via a short-range communication connection.

[0159] ⑥ The first module in the first device decapsulates the second response through the application layer to obtain the first response, which includes network content, and then sends the first response to application b. In this embodiment, the first module sending the first response to application b may include: the first module sending the first response to application b through a second interface. The second interface may be an API interface or other types of interfaces, without limitation. Optionally, the second interface may be available for various applications to call. For example, the first device includes application b, application c, etc., and these applications can all call the second interface. In other words, these applications can all receive the network response sent by the first module through the second interface. In some embodiments, the second interface may support a second transmission format, that is, the data transmitted through the second interface needs to meet the second transmission format. The second transmission format may be the format corresponding to an HTTP response or the format corresponding to an HTTPS response. Taking the second transmission format as the format corresponding to an HTTP response as an example, the network response sent by the first module to the application through the second interface is an HTTP response; taking the second transmission format as the format corresponding to an HTTPS response as an example, the network response sent by the first module to the application through the second interface is an HTTPS response. Optionally, application b receives the first response sent by the first module through the second interface, which can include two methods. Method A: Application b can listen to the second interface, for example, to check if there is data transmission on the second interface. When a first response is detected on the second interface, it obtains the first response. Optionally, application b can listen to the second interface periodically. In this method, application b needs to register a listening event for the second interface to listen to it. The method of registering the listening event is not detailed here; for example, it can be registered through the Binder mechanism. Method B: Application b does not need to listen to the second interface. Instead, when it receives a notification message sent by the first module, it receives the first request from the first interface. The notification message is used to notify application b to obtain the first response. In this method, the first module needs to send a notification message to application b. One possible approach is that after obtaining the first response, the first module calls a function to send the notification message to application b. The function can be a callback function or other functions, without limitation.

[0160] The above embodiments illustrate two ways in which the first device utilizes the second device to achieve internet access in the first scenario (cross-device scenario), namely, the first method (full utilization) and the second method (partial utilization). The differences between these two methods are analyzed below. For ease of understanding, a comparison is made between Figure 3C in the first method and Figure 4C in the second method, which may include at least one of the following differences:

[0161] (a) The first module in the first device in Figure 3C is different from the first module in the first device in Figure 4C.

[0162] In Figure 3C, the first module contains the protocols for various applications, such as protocol b for application b, protocol c for application c, etc. These protocols are application-specific, requiring different protocols for different applications; for example, application b uses protocol b, and application c uses protocol c. In other words, for different applications, the first device needs to use different protocols for encapsulation, and the second device needs to use different protocols for decapsulation, a cumbersome process with high power consumption. Furthermore, if there are many applications, both the first and second devices need to store a large number of protocols, occupying significant storage space.

[0163] In Figure 4C, the first module includes an application layer. The protocol corresponding to the application layer is a standard protocol, which can be used by different applications such as application b and application c, achieving unification. Furthermore, in Figure 4C, the first device does not need to store the private protocols corresponding to different applications, reducing the number of stored protocols. Moreover, for different applications, the first device does not need to use the private protocol corresponding to the application for encapsulation, and the second device does not need to use the private protocol corresponding to the application for decapsulation, reducing the complexity of device execution. Further, in this embodiment, the N layers in the protocol stack are distributed across the first and second devices. For example, the first device includes the application layer, and the second device includes other layers below the application layer. This distributed layout allows network requests initiated by applications in the first device to be encapsulated on both devices, thereby achieving protocol unification. Furthermore, there is no duplicate encapsulation process on the two devices, avoiding power waste.

[0164] (b) The second device in Figure 3C includes an application agent, while the second device in Figure 4C does not, which saves storage space in the second device.

[0165] (c) In Figure 3C, the data received by the second device from the first device is encapsulated using the proprietary protocol of the first module. Therefore, the second device needs to perform protocol conversion on this data, converting it from the proprietary protocol to the standard protocol. In Figure 4C, the data received by the second device from the first device is encapsulated using the application layer. The second device does not need to perform protocol conversion on this data and can directly use other layers below the application layer for encapsulation. Therefore, compared with Figure 3C, Figure 4C saves the protocol conversion process for the second device, reducing the execution complexity of the second device.

[0166] The second scenario: same device scenario.

[0167] For example, the first device includes two chips, a first chip and a second chip. The first chip does not integrate a network module, while the second chip does. The first chip can utilize the second chip to achieve internet access functionality. For example, as shown in Figure 5, the first device includes a first chip and a second chip. Application b is deployed on the first chip, but the first chip does not include a network module. The second chip includes a network module. Application b on the first chip can utilize the second chip to achieve internet access functionality. For example, application b on the first device can utilize the network module in the second chip to achieve internet access functionality.

[0168] Optionally, a first processor may be integrated on the first chip. The first processor may include one or more processors. For example, the first processor may include one or more of the following: a central processing unit (CPU), an application processor (AP), a micro control unit (MCU), a modem processor, a graphics processing unit (GPU), an image signal processor (ISP), a controller, a memory, a video codec, a digital signal processor (DSP), a baseband processor, and a neural network processing unit (NPU).

[0169] Optionally, a second processor may be integrated on the second chip. The second processor may include one or more processors. For example, the second processor may include one or more of the following: CPU, AP, MCU, modem processor, GPU, ISP, controller, memory, video codec, DSP, baseband processor, NPU, etc. Optionally, the first processor on the first chip and the second processor on the second chip may be the same or different, without limitation.

[0170] Optionally, the first chip and the second chip can be two independent chips or two parts of a single chip. Furthermore, it should be noted that, in Figure 5, which uses the example of a network module integrated on the second chip and not integrated on the first chip, one possible scenario is that the second chip has higher performance than the first chip; for example, the second chip includes an access point (AP), while the first chip includes an MCU.

[0171] Continuing with Figure 5 as an example, application b in the first chip can utilize the network module in the second chip to achieve internet access. Optionally, application b's utilization of the network module in the second chip can include two methods: full utilization and partial utilization, which will be explained below.

[0172] In the first approach, application b in the first chip fully utilizes the network module in the second chip.

[0173] As shown in Figure 5 above, the network module of the second chip includes a processing module and a transceiver module. The processing module includes a protocol stack. Application b of the first chip fully utilizes the network module of the second chip, which may include: utilizing the processing module and transceiver module in the network module of the second chip, and utilizing all layers of the protocol stack in the processing module.

[0174] Continuing with Figure 5 as an example, the network module in the second chip can enable internet access for local applications (e.g., application a) on the second chip. However, application b is located in the first chip and is a cross-chip application; the network module cannot directly enable internet access for cross-chip applications. One possible approach is, as shown in Figure 6A, to deploy a proxy application for application b in the second chip. Data generated by application b can be synchronized to the proxy application. The proxy application is a local application on the second chip, and the network module can enable internet access for the proxy application.

[0175] Please refer to Figure 6B, which is another schematic diagram of the communication system in Figure 6A. The internet access process of application b in the first device is explained in conjunction with Figure 6B. As shown in Figure 6B, the internet access process of application b can include two parts: (1) The process of application b initiating a network request. The data transmission process in this part can include: application b → proxy application → network module → server. For example, application b of the first chip generates a first request to request network content. Application b sends the first request to the proxy application of the second chip through the inter-chip communication module. After receiving the first request, the proxy application sends it to the network module. The processing module in the network module encapsulates the first request according to the protocol stack to obtain a second request, and then sends the second request to the server through the transceiver module. (2) The process of application b receiving a network response. The data transmission process in this part can include: server → network module → proxy application → application b. For example, the transceiver module of the second chip receives a second response sent by the server, which includes network content. The processing module of the second chip decapsulates the second response according to the protocol stack to obtain a first response, which includes network content, and then sends the first response to the proxy application. The proxy application sends the first response to application b through the inter-chip communication module.

[0176] It should be noted that Figures 6A and 6B use application b deployed on the first chip as an example. Therefore, the proxy application of application b is deployed on the second chip. It can be understood that, besides application b, other applications, such as application c, can be deployed on the first chip. In this case, the proxy application of application c can also be deployed on the second chip. The principle by which application c uses the second chip to achieve internet access is the same as that of application b, and will not be repeated. Optionally, the proxy application of application b and the proxy application of application c can be the same proxy application or different proxy applications; this is not limited.

[0177] In the preceding embodiments, data transmission occurs between application b and the proxy application. Optionally, to ensure data security, the transmitted data between application b and the proxy application can be encapsulated according to a certain protocol. For example, as shown in Figure 6C, the first chip includes a first module, which includes protocol b of application b. Optionally, the first module can be located within application b or independent of application b. The proxy application of application b is deployed on a second chip, and the second chip includes a second module, which includes protocol b. Optionally, the second module can be located within the proxy application or independent of the proxy application. Protocol b is the transmission protocol between application b and the proxy application; for a description of protocol b, please refer to the preceding description.

[0178] Please refer to Figure 6D, which is another schematic diagram of the communication system in Figure 6C. The internet access process of application b in the first chip is explained in conjunction with Figure 6D. As shown in Figure 6D, the internet access process of application b can include two parts. (1) The process of application b initiating a network request. The data transmission process in this part includes: application b → first module → second module → proxy application → network module → server. For example, application b generates a first request to request network content. Application b sends the first request to the first module, which encapsulates the first request using protocol b to obtain a second request, and then sends the second request to the second module in the second device through the inter-chip communication module. The second module decapsulates the second request using protocol b to obtain the first request, and then sends the first request to the proxy application. After receiving the first request, the proxy application sends it to the network module. The processing module in the network module encapsulates the first request according to the protocol stack to obtain a third request, and then sends the third request to the server through the transceiver module. (2) The process of application b receiving a network response. The data transmission process in this part can include: server → network module → proxy application → second module → first module → application b. For example, the transceiver module of the second chip receives a third response from the server, which includes network content. The processing module of the second chip can decapsulate the third response according to the protocol stack to obtain a first response, which also includes network content, and then send the first response to the proxy application. The proxy application sends the first response to the second module, which encapsulates the first response using protocol b to obtain a second response, and then sends the second response to the first module of the first chip via the inter-chip communication module. The first module decapsulates the second response using protocol b to obtain the first response, and then sends the first response to application b.

[0179] The above explains the principle of the first method. In this method, since the first chip fully utilizes the network module in the second chip, the first chip does not need to integrate a network module, which helps to achieve the lightweighting of the first chip.

[0180] In the second approach, application b in the first chip utilizes the network module in the second chip.

[0181] As mentioned above, the network module of the second chip includes a processing module and a transceiver module, and the processing module includes a protocol stack. Application b of the first chip utilizes the network module of the second chip, which may include: utilizing only the processing module of the second chip, or utilizing only the transceiver module of the second chip, or utilizing both the processing module and the transceiver module, but only utilizing a portion of the protocol stack in the processing module.

[0182] Taking the example of only using the transceiver module of the second chip, for example, as shown in Figure 7A, Application B and a processing module are deployed on the first chip, and the protocol stack is included in the processing module. In this case, the first chip does not need to use the processing module in the second chip and only uses the transceiver module in the second chip. Optionally, in this case, the second chip may or may not include a processing module (so the processing module in the second chip in Figure 7A is represented by a dashed line). For example, if the second chip has an Internet access requirement, it may include a processing module; if the second chip does not have an Internet access requirement, it may not include a processing module. Therefore, in Figure 7A, the processing module on the first chip and the transceiver module on the second chip can form a network module for implementing the Internet access function. It can also be understood that the network mode is distributedly deployed on the first chip and the second chip, that is, the processing module in the network module is deployed on the first chip, and the transceiver module is deployed on the second chip.

[0183] Taking the example of using both the processing module and the transceiver module of the second chip and only using a partial layer of the protocol stack in the processing module, for example, as shown in Figure 7B, Application B and a first module are deployed on the first chip. The first module includes M-layer protocols, where M is a positive integer and M < N, and N is the total number of layers of the protocol stack. For example, N = 5. Since the first module on the first chip includes M-layer protocols, the first chip only needs to use the N - M layer protocols in the second chip, and the N - M layer protocols are the other protocols in the N-layer protocols except the M-layer protocols. In this case, the second chip may or may not include the M-layer protocols (so the M-layer protocols on the second chip in Figure 7B are represented by a dashed line). Therefore, in Figure 7B, the M-layer protocols on the first chip and the N - M layer protocols on the second chip form the protocol stack in the processing module of the network module. It can also be understood that the network module is distributedly deployed on the first chip and the second chip. For example, the processing module in the network module (for example, the protocol stack in the processing module) is distributedly deployed on the first chip and the second chip, that is, the M layer is deployed on the first chip, and the N - M layer is deployed on the second chip.

[0184] In the embodiments of the present application, the M-layer protocols in the first chip may be one or more upper-layer protocols in the N-layer protocols. The N - M layer protocols in the second chip may be one or more lower-layer protocols in the N-layer protocols. For example, the M layer in the first chip includes the application layer, and the N - M layer in the second chip includes the transport layer, network layer, data link layer, and physical layer. Or, the M layer in the first chip includes the application layer and the transport layer, and the N - M layer in the second chip includes the network layer, data link layer, and physical layer. Or, the M layer in the first chip includes the application layer, transport layer, and network layer, and the N - M layer in the second chip includes the data link layer and the physical layer. Or, the M layer in the first chip includes the application layer, transport layer, network layer, and data link layer, and the N - M layer in the second chip includes the physical layer.

[0185] For ease of understanding, the following explanation assumes that the M layer of the first chip only includes the application layer. For example, as shown in Figure 7C, the first chip has application b and a first module deployed on it. The first module includes the application layer. In this case, the second chip may or may not include the application layer (therefore, the application layer on the second chip in Figure 7C is represented by a dashed line). For ease of description, the following explanation assumes that the second chip has the application layer deployed on it. It is understood that the first chip needs to obtain the first module before using it. Regarding the method of obtaining the first module, please refer to the previous description; it will not be repeated here.

[0186] Please refer to Figure 7D, which is another schematic diagram of the communication system shown in Figure 7C. The following description, in conjunction with Figure 7D, illustrates the internet access process of application b in the first chip of Figure 7C. As shown in Figure 7D, the internet access process of application b can include two parts.

[0187] I. The process of application b initiating a network request. This data transmission flow can include: application b -> first module -> network module -> server. For example, as shown in Figure 7D, the process of application b initiating a network request can include the following:

[0188] (1) Application b sends a first request to the first module. The first request is used to request network content. The first module encapsulates the first request to obtain a second request. As mentioned above, the first module includes an application layer. The encapsulation of the first request by the first module may include: encapsulating the first request through the application layer. For the process of application b sending the first request to the first module, please refer to the previous description.

[0189] (2) The first module sends the second request to the network module in the second chip via an inter-chip communication connection. For example, as shown in Figure 7D, the first chip includes an inter-chip communication module, and the second device includes an inter-chip communication module. Optionally, the inter-chip communication modules in the first and second chips can be implemented based on inter-process communication (IPC) technology or other technologies, without limitation. Therefore, the first chip and the second chip can establish an inter-chip communication connection through their respective inter-chip communication modules. In this way, the first module can send the second request to the network module in the second chip via the inter-chip communication connection. For example, the first module sends the second request to the inter-chip communication module in the first chip, which then forwards the second request to the inter-chip communication module in the second chip, and the inter-chip communication module in the second chip forwards the second request to the network module.

[0190] In some embodiments, before the first module sends a second request to the second chip via an inter-chip communication connection, it may further include: determining that the first chip meets a first condition, and / or that the second chip meets a second condition.

[0191] Optionally, the first condition may include at least one of the following:

[0192] a. The current operating load of the first chip is greater than the first load.

[0193] b. The current operating mode of the first chip is power saving mode.

[0194] In other words, when the first chip is under high load or in power-saving mode, a second request is sent to the second chip through the inter-chip communication connection to access the Internet using the second chip.

[0195] Optionally, the second condition may include at least one of the following:

[0196] a. The current operating load of the second chip is less than or equal to the second load, and the second load is less than or equal to the first load.

[0197] b. The current operating mode of the second chip is non-power-saving mode.

[0198] c. The current network signal strength of the second chip is higher than that of the first chip.

[0199] In other words, when the first chip determines that the second chip has a low load, is in a non-power-saving mode, or has a high network signal strength, it sends a second request to the second chip through the inter-chip communication connection to access the Internet using the second chip.

[0200] (3) The processing module in the network module encapsulates the second request according to other layers below the application layer in the protocol stack to obtain the third request, and then sends the third request to the server through the transceiver module. It can be understood that, as mentioned above, the second request received by the network module is a request encapsulated by the application layer in the first chip. Therefore, after receiving the second request, the network module encapsulates it layer by layer through the transport layer -> network layer -> data link layer -> physical layer to obtain the third request, and then sends the third request out.

[0201] II. The process of application b receiving network responses. This data transmission flow can include: Server -> Network Module -> First Module -> Application b. For example, as shown in Figure 7D, the process of application b receiving network responses can include the following:

[0202] (4) The second chip receives the third response sent by the server through the transceiver module. The third response is the server's response based on the third request. For example, the third response includes the network content requested by the third request. The processing module in the second chip decapsulates the third response through other layers below the application layer in the protocol stack, such as encapsulating it layer by layer through the physical layer -> data link layer -> network layer -> transport layer to obtain the second response.

[0203] (5) The second chip sends a second response to the first chip through the inter-chip communication module.

[0204] (6) The first module in the first chip decapsulates the second response through the application layer to obtain the first response, and sends the first response to application b. The first response includes network content. For the process of the first module sending the first response to application b, please refer to the previous description.

[0205] The above embodiments illustrate two ways in which the first chip utilizes the second chip to achieve internet access in the second scenario (same device scenario): the first method (full utilization) and the second method (partial utilization). The differences between these two methods are the same in principle as the differences between the two methods in the first scenario (cross-device scenario) described above, and will not be repeated.

[0206] The above embodiments provide technical solutions for two scenarios (cross-device scenario and same-device scenario). For ease of description, the technical solution for the first scenario is referred to as the first solution, and the technical solution for the second scenario is referred to as the second solution. Optionally, the first device may only be configured with the first solution and not with the second solution, in which case the first device uses the first solution. Alternatively, the first device may only be configured with the second solution and not with the first solution, in which case the first device uses the second solution. Or, the first device may be configured with both the first and second solutions, in which case the first device can use one or both of the two solutions. For example, as shown in Figure 8A, the first device includes a first chip and a second chip, application b and a first module are deployed on the first chip, the first module includes an application layer, and the second chip includes a network module. The second device includes a network module. In this case, the first chip in the first device can use either the first solution (i.e., using the second device to achieve internet access) or the second solution (i.e., using the second chip to achieve internet access). One possible scenario is that the first device (e.g., the first chip in the first device) can use one or both of the two solutions.

[0207] Taking the use of one of two schemes as an example, for instance, a first device (e.g., a first chip in the first device) can select one of the two schemes. The selection method can include both automatic selection and manual selection. Taking manual selection as an example, the first device (e.g., the first chip in the first device) can provide a selection button for selecting either the first scheme or the second scheme. Taking automatic selection as an example, it includes, but is not limited to, at least one of the following methods.

[0208] In method A, the first device (e.g., the first chip in the first device) selects a scheme according to the priority order of the first scheme and the second scheme.

[0209] Optionally, the priority order of the first and second schemes can be pre-configured or user-defined, without limitation.

[0210] Taking the example of the first solution having a higher priority than the second solution, the first device prioritizes using the first solution. If the first solution is unavailable, the second solution is used. The first device determining that the first solution is unavailable may include: determining that it cannot establish a short-range communication connection with the second device, and / or that the second device is not connected to the network (e.g., the second device is not connected to Wi-Fi or mobile data is not enabled). In some embodiments, if the first device determines that a short-range communication connection has been established with the second device, and the second device is not connected to the network, there are two possible handling methods: Method 1, use the second solution, i.e., use the second chip to access the internet; Method 2, trigger the second device to connect to the network, and then use the first solution, i.e., use the second device to access the internet. Optionally, before triggering the second device to connect to the network, the first device may output a prompt message to the user to ask whether to trigger the second device to connect to the network. If the user confirms the connection, the second device connects to the network. Optionally, the second device may also output a prompt message before connecting to the network to ask the user whether to connect. If the user confirms the connection, the second device connects to the network.

[0211] Taking the example of the second solution having a higher priority than the first solution, the first device prioritizes using the second solution. If the second solution is unavailable, the first solution is used. The first device determining that the second solution is unavailable may include: determining that the first chip and the second chip cannot establish an inter-chip communication connection, and / or that the second chip is not connected to the network (e.g., the second chip is not connected to Wi-Fi or mobile data is not enabled). One possible scenario where the first chip and the second chip cannot establish an inter-chip communication connection is that the second chip is not working (e.g., the second chip is not working when the first device is in power-saving mode). In some embodiments, if the first device determines that the first chip and the second chip have established an inter-chip communication connection, and the second chip is not connected to the network, there are two possible handling methods: Method 1: Use the first solution, i.e., use the second device to access the internet; Method 2: Trigger the second chip to connect to the network, and then use the second solution, i.e., use the second chip to access the internet. Optionally, before triggering the second chip to connect to the network, the first device may output a prompt message to the user to ask whether to trigger the second chip to connect to the network. If the user confirms the connection, the second chip is then triggered to connect to the network.

[0212] In method B, the first device (e.g., the first chip in the first device) selects a scheme based on the first operating parameters of the first device and / or the second operating parameters of the second device.

[0213] Optionally, the first operating parameter of the first device may include at least one of the following: the current remaining power of the first device, the current operating load, the current operating mode, and the current network quality. Optionally, the second operating parameter of the second device may include at least one of the following: the current remaining power of the second device, the current operating load, the current operating mode, and the current network quality.

[0214] Taking the first device selecting a scheme based on first operating parameters as an example, for instance, the first device determines, based on the first operating parameters, that it meets at least one of the following conditions: the current remaining battery power is lower than a first battery power level, the current operating load is higher than a first load level, the current operating mode is power saving mode, or the current network signal strength is lower than a first signal strength level. In this case, the first scheme is used; otherwise, the second scheme is used. Optionally, the first device's current operating load being higher than the first load level can include at least one of the following: the operating load of the first chip in the first device is higher than the first load level, the operating load of the second chip in the first device is higher than the first load level, or the combined load of the first chip and the second chip is higher than the first load level. The first device's current network signal strength being lower than the first signal strength level can include: the current network signal strength of the second chip in the first device is lower than the first signal strength level.

[0215] Taking the first device selecting a scheme based on second operating parameters as an example, for instance, the first device determines, based on the second operating parameters, that the second device meets at least one of the following conditions: the current remaining battery power is higher than the second battery power, the current operating load is lower than the second load, the current operating mode is non-power-saving mode, and the current network signal strength is higher than the second signal strength. If any of these conditions are met, the first scheme is used; otherwise, the second scheme is used. The second battery power can be greater than or equal to the first battery power. The second load can be less than or equal to the first load. The second signal strength can be greater than or equal to the first signal strength.

[0216] Taking the selection of a scheme by a first device based on a first operating parameter and a second operating parameter as an example, the first device can compare the first and second operating parameters and select a scheme based on the comparison result. For example, if the first operating parameter includes the current remaining power of the first device, and the second operating parameter includes the current remaining power of the second device, then if the current remaining power of the second device is greater than or equal to the current remaining power of the first device, the first scheme is used; if the current remaining power of the second device is less than the current remaining power of the first device, the second scheme is used. Similarly, if the first operating parameter includes the current operating mode of the first device, and the second operating parameter includes the current operating mode of the second device, then if the current operating mode of the first device is power-saving mode and the current operating mode of the second device is not power-saving mode, the first scheme is used; if the current operating mode of the first device is not power-saving mode and the current operating mode of the second device is power-saving mode, the second scheme is used. Finally, if the first operating parameter includes the current operating load of the first device, and the second operating parameter includes the current operating load of the second device, then if the current operating load of the second device is less than or equal to the current operating load of the first device, the first scheme is used; if the current operating load of the second device is greater than the current operating load of the first device, the second scheme is used. Taking the first operating parameter including the current network signal strength of the first device and the second operating parameter including the current network signal strength of the second device as an example, if the current network signal strength of the second device is greater than or equal to the current network signal strength of the first device, the first scheme is used; if the current network signal strength of the second device is less than the current network signal strength of the first device, the second scheme is used.

[0217] Continuing with the example of choosing one of two schemes, see Figure 8B, which is another schematic diagram of Figure 8A. The process of the first device choosing the first or second scheme is explained in conjunction with Figure 8B. The selection of the scheme can be handled by the first module in Figure 8B or by application b. Taking the first module's responsibility for scheme selection as an example, the process of application b accessing the server may include: ① Application b sends a first request to the first module, the first request being used to request network content; the first module encapsulates the first request to obtain a second request. The first module can choose to use either the first or second scheme. The selection methods include automatic and manual methods, the processes of which have been described above and will not be repeated. If the first module chooses the first scheme, processes ② to ⑥ are executed; for details on ② to ⑥, see Figure 4D above. If the first module chooses the second scheme, processes (2) to (6) are executed; for details on (2) to (6), see Figure 7D above. Taking application b as the solution selection example, application b sends a first request to the first module and also instructs the first module whether to use the first solution or the second solution. Based on the instruction of application b, the first module determines whether to use the first solution or the second solution. If the first solution is used, the process from ② to ⑥ is executed. If the second solution is used, the process from (2) to (6) is executed.

[0218] Taking the use of two schemes as an example, for example, the first device (e.g., the first chip in the first device) uses both the first scheme and the second scheme simultaneously. Continuing with Figure 8B as an example, the process of the first device using both the first scheme and the second scheme simultaneously will be explained in conjunction with Figure 8B. As shown in Figure 8B, the process of application b accessing the server includes: ① Application b sends a first request to the first module. The first request is used to request network content. The first module encapsulates the first request to obtain a second request. After that, it executes both processes ② to ⑥ and processes (2) to (6). For ② to ⑥, please refer to Figure 4D above. For (2) to (6), please refer to Figure 7D above. It can be understood that in this case, application b can obtain the network content fed back by the second device and the network content fed back by the second chip. These two network contents may arrive at application b at the same time or at different times. If they arrive at application b at the same time, then application b can choose one of the network contents (e.g., randomly select) and discard the other. If they do not arrive at application b at the same time, then application b uses the network content that arrives first and discards the network content that arrives later.

[0219] As mentioned above, the first device can use one or both of the two schemes. Taking the use of one scheme as an example, one possible scenario is that different applications in the first device (e.g., the first chip within the first device) all use the same scheme. For example, the first device includes application b and application c, and both applications use the same scheme. Taking the use of both schemes as an example, for instance, the same application in the first device (e.g., the first chip within the first device) can use both schemes simultaneously (as shown in Figure 8B), or different applications can use different schemes. For example, the first device includes application b and application c, with application b using the first scheme and application c using the second scheme.

[0220] Optionally, the first device may use one or both schemes, which can be user-defined or the device's default settings. Taking user-defined settings as an example, the first device may provide a first button, which the user can configure to use one or both schemes simultaneously. Therefore, the first device can determine whether to use one or both schemes based on the user's operation of the first button. If the first device determines to use one scheme, then it needs to select one of the two schemes. The selection methods include automatic selection and manual selection, which have been described previously and will not be repeated.

[0221] The above embodiments illustrate the principle that application b in the first chip of the first device uses the second device or the second chip to achieve Internet access. The following uses a home space application as an example to illustrate an application scenario of the technical solution of this application embodiment. As shown in Figure 9(a), the first device displays an interface, which can be the interface of a home space application. This interface includes the health data of two members, such as the father's health data and the mother's health data. One possible scenario is that member 1 (e.g., the father) reports health data to the cloud through device 1, and member 2 (e.g., the mother) reports health data to the cloud through device 2. The first device can establish an association with device 1 and device 2, thereby being able to obtain the health data reported by device 1 and device 2 from the cloud. Therefore, the first device needs to access the Internet and can use one or both of the aforementioned first and second solutions to achieve Internet access. Taking the use of one solution as an example, the first device can choose one of the two solutions. The selection method includes automatic selection and manual selection, which have been described above and will not be repeated. Assuming the first scheme is selected, as shown in Figure 8B, application b (e.g., a home space application) can send a first request to the first module. The first request is used to request network content (e.g., health data reported by devices 1 and 2). The first module encapsulates the first request to obtain a second request. Then, processes ② to ⑥ are executed. For details on ② to ⑥, please refer to Figure 4D above. Assuming the second scheme is selected, as shown in Figure 8B, application b (e.g., a home space application) can send a first request to the first module. The first request is used to request network content (e.g., health data reported by devices 1 and 2). The first module encapsulates the first request to obtain a second request. Then, processes (2) to (6) are executed. For details on (2) to (6), please refer to Figure 7D above. Before obtaining the health data of the members, the first device can display a "Data synchronization in progress" message, as shown in (b) of Figure 9. After obtaining the health data of the members, the first device can display a "Synchronization successful" message and update the health data of the members, as shown in (c) of Figure 9.

[0222] Please refer to Figure 10, which is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. The electronic device can be any of the electronic devices listed above, such as the first device or the second device. As shown in Figure 10, the electronic device may include a processor 110, an external memory interface 120, an internal memory 121, a universal serial bus (USB) interface 130, a charging management module 140, a power management module 141, a battery 142, an antenna 1, an antenna 2, a mobile communication module 150, a wireless communication module 160, an audio module 170, a speaker 170A, a receiver 170B, a microphone 170C, a headphone jack 170D, a sensor module 180, a button 190, a motor 191, an indicator 192, a camera 193, a display screen 194, and a subscriber identification module (SIM) card interface 195, etc. The sensor module 180 may include a pressure sensor 180A, a gyroscope sensor 180B, a barometric pressure sensor 180C, a magnetic sensor 180D, an accelerometer sensor 180E, a distance sensor 180F, a proximity sensor 180G, a fingerprint sensor 180H, a temperature sensor 180J, a touch sensor 180K, an ambient light sensor 180L, a bone conduction sensor 180M, etc.

[0223] Processor 110 may include one or more processing units, such as an application processor (AP), a modem processor, a graphics processing unit (GPU), an image signal processor (ISP), a controller, memory, a video codec, a digital signal processor (DSP), a baseband processor, and / or a neural network processing unit (NPU). Different processing units may be independent devices or integrated into one or more processors. The controller may serve as the nerve center and command center of the electronic device. The controller can generate operation control signals based on instruction opcodes and timing signals to control instruction fetching and execution. Processor 110 may also include memory for storing instructions and data. In some embodiments, the memory in processor 110 is a cache memory. This memory can store instructions or data that processor 110 has just used or is repeatedly used. If processor 110 needs to reuse the instruction or data, it can directly retrieve it from the memory. This avoids repeated access, reduces the waiting time of processor 110, and thus improves system efficiency.

[0224] In some embodiments, the processor 110 may execute the communication methods provided in the embodiments of this application.

[0225] In some embodiments, the processor 110 may include one or more interfaces. Interfaces may include an inter-integrated circuit (I2C) interface, an inter-integrated circuit sound (I2S) interface, a pulse code modulation (PCM) interface, a universal asynchronous receiver / transmitter (UART) interface, a mobile industry processor interface (MIPI), a general-purpose input / output (GPIO) interface, a subscriber identity module (SIM) interface, and / or a universal serial bus (USB) interface, etc.

[0226] The I2C interface is a bidirectional synchronous serial bus, including a serial data line (SDA) and a serial clock line (SCL). In some embodiments, the processor 110 may include multiple I2C buses. The processor 110 can couple to the touch sensor 180K, charger, flash, camera 193, etc., through different I2C bus interfaces. For example, the processor 110 can couple to the touch sensor 180K through the I2C interface, enabling the processor 110 and the touch sensor 180K to communicate through the I2C bus interface, thereby realizing the touch function of the electronic device 100.

[0227] The I2S interface can be used for audio communication. In some embodiments, the processor 110 may include multiple I2S buses. The processor 110 can be coupled to the audio module 170 via the I2S bus to enable communication between the processor 110 and the audio module 170. In some embodiments, the audio module 170 can transmit audio signals to the wireless communication module 160 via the I2S interface to enable the function of answering phone calls through a Bluetooth headset.

[0228] The PCM interface can also be used for audio communication, sampling, quantizing, and encoding analog signals. In some embodiments, the audio module 170 and the wireless communication module 160 can be coupled via the PCM bus interface. In some embodiments, the audio module 170 can also transmit audio signals to the wireless communication module 160 via the PCM interface, enabling the function of answering phone calls through a Bluetooth headset. Both the I2S interface and the PCM interface can be used for audio communication.

[0229] The UART interface is a universal serial data bus used for asynchronous communication. This bus can be a bidirectional communication bus. It converts the data to be transmitted between serial and parallel communication. In some embodiments, the UART interface is typically used to connect the processor 110 and the wireless communication module 160. For example, the processor 110 communicates with the Bluetooth module in the wireless communication module 160 via the UART interface to implement Bluetooth functionality. In some embodiments, the audio module 170 can transmit audio signals to the wireless communication module 160 via the UART interface to enable music playback through Bluetooth headphones.

[0230] The MIPI interface can be used to connect the processor 110 to peripheral devices such as the display screen 194 and the camera 193. The MIPI interface includes a camera serial interface (CSI) and a display serial interface (DSI). In some embodiments, the processor 110 and the camera 193 communicate via the CSI interface to enable the electronic device 100 to capture images. The processor 110 and the display screen 194 communicate via the DSI interface to enable the electronic device 100 to display images.

[0231] The GPIO interface can be configured via software. It can be configured as a control signal or a data signal. In some embodiments, the GPIO interface can be used to connect the processor 110 to a camera 193, a display screen 194, a wireless communication module 160, an audio module 170, a sensor module 180, etc. The GPIO interface can also be configured as an I2C interface, an I2S interface, a UART interface, a MIPI interface, etc.

[0232] USB port 130 is a USB standard compliant interface, specifically a Mini USB port, Micro USB port, USB Type-C port, etc. USB port 130 can be used to connect a charger to charge electronic device 100, and can also be used for data transfer between electronic device 100 and peripheral devices. It can also be used to connect headphones for audio playback. This interface can also be used to connect other electronic devices, such as AR devices.

[0233] It is understood that the interface connection relationships between the modules illustrated in the embodiments of the present invention are merely illustrative and do not constitute a structural limitation on the electronic device 100. In other embodiments of this application, the electronic device 100 may also employ different interface connection methods or combinations of multiple interface connection methods as described in the above embodiments.

[0234] The wireless communication function of the electronic device can be implemented through antenna 1, antenna 2, mobile communication module 150, wireless communication module 160, modem processor, and baseband processor. Antenna 1 and antenna 2 are used to transmit and receive electromagnetic wave signals. Each antenna in the electronic device can be used to cover one or more communication frequency bands. Different antennas can also be reused to improve antenna utilization. For example, antenna 1 can be reused as a diversity antenna for a wireless local area network. In some other embodiments, the antenna can be used in conjunction with a tuning switch.

[0235] The mobile communication module 150 can provide solutions for wireless communication applications including 2G / 3G / 4G / 5G in electronic devices. The mobile communication module 150 may include at least one filter, switch, power amplifier, low noise amplifier (LNA), etc. The mobile communication module 150 can receive electromagnetic waves via antenna 1, and perform filtering, amplification, and other processing on the received electromagnetic waves before transmitting them to a modem processor for demodulation. The mobile communication module 150 can also amplify the signal modulated by the modem processor and convert it into electromagnetic waves for radiation via antenna 1. In some embodiments, at least some functional modules of the mobile communication module 150 may be housed in processor 110. In some embodiments, at least some functional modules of the mobile communication module 150 and at least some modules of the processor 110 may be housed in the same device.

[0236] The wireless communication module 160 can provide solutions for wireless communication applications in electronic devices, including wireless local area networks (WLANs) (such as wireless fidelity (Wi-Fi) networks), Bluetooth (BT), global navigation satellite system (GNSS), frequency modulation (FM), near field communication (NFC), and infrared (IR) technologies. The wireless communication module 160 can be one or more devices integrating at least one communication processing module. The wireless communication module 160 receives electromagnetic waves via antenna 2, performs frequency modulation and filtering of the electromagnetic wave signals, and sends the processed signal to processor 110. The wireless communication module 160 can also receive signals to be transmitted from processor 110, perform frequency modulation and amplification, and convert them into electromagnetic waves for radiation via antenna 2.

[0237] In some embodiments, antenna 1 of the electronic device is coupled to mobile communication module 150, and antenna 2 is coupled to wireless communication module 160, enabling the electronic device to communicate with networks and other devices via wireless communication technology.

[0238] The display screen 194 is used to display the application's interface, etc. The display screen 194 includes a display panel. In some embodiments, the electronic device may include one or N display screens 194, where N is a positive integer greater than 1.

[0239] The electronic device 100 can perform shooting functions through an ISP, a camera 193, a video codec, a GPU, a display 194, and an application processor. The ISP is used to process the data fed back by the camera 193.

[0240] Internal memory 121 can be used to store computer executable program code, which includes instructions. Processor 110 executes various functional applications and data processing of the electronic device by running the instructions stored in internal memory 121. Internal memory 121 may include a program storage area and a data storage area. The program storage area may store the operating system and software code for at least one application program. The data storage area may store data generated during the use of the electronic device (e.g., images, videos, etc.). Furthermore, internal memory 121 may include high-speed random access memory and may also include non-volatile memory, such as at least one disk storage device, flash memory device, general-purpose flash memory, etc.

[0241] The external storage interface 120 can be used to connect an external memory card, such as a Micro SD card, to expand the storage capacity of the electronic device. The external memory card communicates with the processor 110 through the external storage interface 120 to perform data storage functions. For example, images, videos, and other files can be saved on the external memory card.

[0242] Electronic devices can implement audio functions such as music playback and recording through audio modules 170, speakers 170A, receivers 170B, microphones 170C, headphone jacks 170D, and application processors.

[0243] The audio module 170 is used to convert digital audio information into analog audio signals for output, and also to convert analog audio input into digital audio signals. The audio module 170 can also be used for encoding and decoding audio signals. In some embodiments, the audio module 170 may be located in the processor 110, or some functional modules of the audio module 170 may be located in the processor 110.

[0244] The speaker 170A, also known as a "loudspeaker," is used to convert audio electrical signals into sound signals. The electronic device 100 can listen to music or listen to hands-free calls and other external playback scenarios through one or more speakers 170A.

[0245] The receiver 170B, also known as a "handpiece," can be one or more, and is used to convert audio electrical signals into sound signals. When the electronic device 100 answers a telephone call or voice message, the receiver 170B can be brought close to the ear to listen to the voice.

[0246] The microphone 170C, also known as a "microphone" or "voice transducer," is used to convert sound signals into electrical signals.

[0247] The 170D headphone jack is used to connect wired headphones.

[0248] The pressure sensor 180A is used to sense pressure signals and can convert the pressure signals into electrical signals. In some embodiments, the pressure sensor 180A may be disposed on the display screen 194.

[0249] The gyroscope sensor 180B can be used to determine the motion attitude of an electronic device. In some embodiments, the gyroscope sensor 180B can determine the angular velocity of the electronic device about three axes (i.e., the x, y, and z axes). The gyroscope sensor 180B can be used for image stabilization.

[0250] The barometric pressure sensor 180C is used to measure air pressure. In some embodiments, the electronic device calculates altitude using the air pressure value measured by the barometric pressure sensor 180C to assist in positioning and navigation.

[0251] The magnetic sensor 180D includes a Hall effect sensor. Electronic devices can use the magnetic sensor 180D to detect the opening and closing of a flip cover.

[0252] The 180E accelerometer can detect the magnitude of acceleration in various directions (typically three axes) of electronic devices. When the electronic device is stationary, it can detect the magnitude and direction of gravity.

[0253] The 180F distance sensor is used to measure distance. Electronic devices can measure distance using infrared or laser.

[0254] The proximity sensor 180G may include, for example, a light-emitting diode (LED) and a light detector, such as a photodiode. The LED may be an infrared LED. The electronic device emits infrared light outward through the LED. The electronic device uses the photodiode to detect infrared reflected light from nearby objects. When sufficient reflected light is detected, it can be determined that an object is near the electronic device. When insufficient reflected light is detected, the electronic device can determine that no object is near the electronic device.

[0255] An ambient light sensor 180L is used to detect ambient light levels. Electronic devices can adaptively adjust the brightness of the display screen 194 based on the detected ambient light levels.

[0256] The fingerprint sensor 180H is used to collect fingerprints.

[0257] The 180J temperature sensor is used to detect temperature.

[0258] Touch sensor 180K, also known as a "touch panel," can be located on display screen 194. The touch sensor 180K and display screen 194 together form a touchscreen, also known as a "touch screen." Touch sensor 180K is used to detect touch operations applied to or near it. The touch sensor can then transmit the detected touch operation to the application processor to determine the type of touch event.

[0259] The bone conduction sensor 180M can acquire vibration signals. In some embodiments, the bone conduction sensor 180M can acquire vibration signals from the vibrating bone segments of the human vocal cords.

[0260] Buttons 190 include a power button, volume buttons, etc. Buttons 190 can be mechanical buttons or touch buttons. The electronic device can receive button inputs and generate key signal inputs related to user settings and function control. Motor 191 can generate vibration alerts. Motor 191 can be used for incoming call vibration alerts or for touch vibration feedback. Indicator 192 can be an indicator light, used to indicate charging status, battery level changes, messages, missed calls, notifications, etc. SIM card interface 195 is used to connect a SIM card. The SIM card can be inserted into or removed from the SIM card interface 195 to achieve contact and separation with the electronic device.

[0261] It is understood that the components shown in Figure 10 do not constitute a specific limitation on the electronic device. The electronic device in embodiments of the present invention may include more or fewer components than those shown in Figure 10. Furthermore, the combination / connection relationships between the components in Figure 10 can also be adjusted and modified.

[0262] Figure 11 is a schematic diagram of the structure of an electronic device 1100 provided in an embodiment of this application. The electronic device 1100 can be either the first device or the second device mentioned above. As shown in Figure 11, the electronic device 1100 may include: one or more processors 1101; one or more memories 1102; a communication interface 1103; and one or more computer programs 1104. These devices can be connected via one or more communication buses 1105. The one or more computer programs 1104 are stored in the memory 1102 and configured to be executed by the one or more processors 1101. The one or more computer programs 1104 include instructions. For example, when the electronic device 1100 is the first device mentioned above, the instructions can be used to perform the relevant steps of the first device as described in the corresponding embodiments above, such as performing the relevant steps of the first device in Figures 1, 2, 3A to 3D, 4A to 4D, 5, 6A to 6D, 7A to 7D, 8A to 8B, and 9. For example, when electronic device 1100 is the second device mentioned above, this instruction can be used to execute the relevant steps of the second device as described in the corresponding embodiments above, such as executing the relevant steps of the second device in Figures 1, 2, 3A to 3D, 4A to 4D, 5, 6A to 6D, 7A to 7D, 8A to 8B, and 9. The communication interface 1103 is used to enable communication between electronic device 1100 and other devices; for example, the communication interface can be a transceiver.

[0263] The methods provided in the embodiments of this application above are described from the perspective of an electronic device (e.g., a watch or a mobile phone) as the executing entity. To implement the functions of the methods provided in the embodiments of this application above, the electronic device may include hardware structures and / or software modules, implementing the above functions in the form of hardware structures, software modules, or a combination of hardware structures and software modules. Whether a particular function is implemented in the form of hardware structures, software modules, or a combination of hardware structures and software modules depends on the specific application and design constraints of the technical solution.

[0264] In the above embodiments, implementation can be achieved entirely or partially through software, hardware, firmware, or any combination thereof. When implemented using software, it can be implemented entirely or partially in the form of a computer program product. The computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on a computer, all or part of the processes or functions described in the embodiments of the present invention are generated. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions can be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another. For example, the computer instructions can be transmitted from one website, computer, server, or data center to another website, computer, server, or data center via wired (e.g., coaxial cable, fiber optic, digital subscriber line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) means. The computer-readable storage medium can be any available medium that a computer can access or a data storage device such as a server or data center that integrates one or more available media. The available medium can be a magnetic medium (e.g., floppy disk, hard disk, magnetic tape), an optical medium (e.g., DVD), or a semiconductor medium (e.g., solid state disk (SSD)). Where there is no conflict, the solutions in the above embodiments can be combined.

[0265] Those skilled in the art will understand that embodiments of this application can be provided as methods, systems, or computer program products. Therefore, this application can take the form of a completely hardware embodiment, a completely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, this application can take the form of a computer program product embodied on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0266] This application is described with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer program products according to this application. It should be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions specified in one or more blocks of the flowchart illustrations and / or one or more blocks of the block diagrams.

[0267] These computer program instructions may also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing device to function in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means that implement the functions specified in one or more flowcharts and / or one or more block diagrams.

[0268] These computer program instructions may also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer-implemented process, such that the instructions, which execute on the computer or other programmable apparatus, provide steps for implementing the functions specified in one or more flowcharts and / or one or more block diagrams.

[0269] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the scope and intent of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application is also intended to include such modifications and variations.

Claims

1. A communication method, characterized in that, The method is applied to a communication system, the communication system comprising a first chip, a second chip, and a network module, the network module being distributed across the first chip and the second chip, the network module being used for network connectivity, the method comprising: The first chip generates a first request, which is used to request network content; The first chip sends the first request to the server through the network module distributed on the first chip and the second chip; The first chip receives a first response from the server through the network modules distributed on the first chip and the second chip, the first response including the network content.

2. A communication method, characterized in that, Applied to a first chip, the method includes: The first chip generates a first request, which is used to request network content; The first chip sends the first request to the server through a network module, wherein the network module is distributed across the first chip and the second chip. The first chip receives a first response from the server through the network module, the first response including the network content.

3. A communication method, characterized in that, Applied to a second chip, the method includes: The second chip obtains a third request, which is used to request network content, and the third request is processed by a network module, which is distributed and deployed on the first chip and the second chip. The second chip sends the third request to the server; The second chip receives a third response from the server, the third response including the network content; The second chip determines the second response based on the third response; The second chip sends the second response to the first chip.

4. The method according to any one of claims 1-3, characterized in that, The network module is distributed across the first chip and the second chip, and includes: The network module includes a processing module, which is used to process data according to a protocol stack, wherein the protocol stack is a communication protocol stack supported by the server, and the processing module is distributed on the first chip and the second chip.

5. The method according to claim 4, characterized in that, The processing module is distributed across the first chip and the second chip, and includes: The protocol stack in the processing module is distributed across the first chip and the second chip.

6. The method according to claim 5, characterized in that, The protocol stack is distributed across the first chip and the second chip, and includes: The M-layer protocol in the protocol stack is deployed on the first chip, and the NM-layer protocol in the protocol stack is deployed on the second chip. The NM-layer protocol refers to the other layer protocols in the protocol stack besides the M-layer protocol, and N is the total number of layers in the protocol stack.

7. The method according to claim 6, characterized in that, The M-layer protocol is located above the NM-layer protocol.

8. The method according to claim 6 or 7, characterized in that, The M-layer protocol includes an application layer, and the NM-layer protocol includes a transport layer, a network layer, a data link layer, and a physical layer.

9. The method according to any one of claims 6-8, characterized in that, The first chip sends the first request to the server via the network module, including: The first chip encapsulates the first request according to the M-layer protocol to obtain the second request; The first chip sends the second request to the second chip. The second chip encapsulates the second request according to the NM layer protocol to obtain a third request, and sends the third request to the server. The third request is used to request the network content.

10. The method according to any one of claims 6-9, characterized in that, The first chip receives a first response from the server via a network module, including: The first chip receives a second response sent by the second chip. The second response is obtained by the second chip after receiving a third response from the server and decrypting the third response according to the NM layer protocol. The third response includes the network content. The first chip deseals the second response according to the M-layer protocol to obtain the first response.

11. The method according to any one of claims 6-8, characterized in that, The second chip receives a third request, including: The second chip receives a second request sent by the first chip. The second request is obtained by the first chip generating the first request and encapsulating the first request according to the M-layer protocol. The first request is used to request the network content. The second chip encapsulates the second request according to the NM layer protocol to obtain the third request.

12. The method according to any one of claims 6-8 and 11, characterized in that, The second chip determines the second response based on the third response, including: The second chip decrypts the third response according to the NM layer protocol to obtain a second response; the first chip is used to decrypt the second response according to the M layer protocol to obtain a first response, the first response including the network content.

13. The method according to any one of claims 4-12, characterized in that, The network module further includes a transceiver module, which is used to receive data from the server or send data to the server. The transceiver module is deployed on the second chip.

14. The method according to any one of claims 1-13, characterized in that, The second chip may be located in the same device or a different device as the first chip.

15. The method according to claim 14, characterized in that, The first chip and the second chip are located in different devices. Before the first chip sends the first request to the server via the network module, it further includes: Determine that the first chip satisfies the first condition, and / or that the second chip satisfies the second condition; The first condition includes one or more of the following: The current remaining battery power of the device containing the first chip is less than the first battery power. The current operating load of the device containing the first chip is greater than the first load. The current operating mode of the device containing the first chip is power saving mode; The second condition includes one or more of the following: The remaining battery power of the device containing the second chip is greater than or equal to the second battery power, and the second battery power is greater than or equal to the first battery power. The current operating load of the device containing the second chip is less than or equal to the second load, and the second load is less than or equal to the first load; The device containing the second chip is currently operating in non-power-saving mode; The current network signal strength of the device containing the second chip is higher than that of the first chip.

16. The method according to claim 14, characterized in that, The first chip and the second chip are located in the same device. Before the first chip sends the first request to the server via the network module, it further includes: Determine that the first chip satisfies the first condition, and / or that the second chip satisfies the second condition; The first condition includes: the current operating load of the first chip is greater than the third load, and the current operating mode of the first chip is at least one of the following: power saving mode; The second condition includes: the current operating load of the second chip is less than or equal to the fourth load, the current operating mode of the second chip is at least one of the non-power-saving modes, and the fourth load is less than or equal to the third load.

17. The method according to any one of claims 1-16, characterized in that, The first chip includes an MCU, and the second chip includes an AP.

18. An electronic device, characterized in that, include: First chip and second chip; The first chip is used to perform the method of the first chip as described in any one of claims 1, 4-17; The second chip is used to perform the method of the second chip as described in any one of claims 1, 4-17.

19. An electronic device, characterized in that, include: Processor, memory, and one or more programs; The one or more programs are stored in the memory, and the one or more programs include instructions that, when executed by the processor, cause the electronic device to perform the steps of the method as described in any one of claims 2-17.

20. A chip, characterized in that, The chip is used to perform the method as described in any one of claims 2-17.

21. A chip system, characterized in that, include: First chip and second chip; The first chip is used to perform the method of the first chip as described in any one of claims 1, 4-17; The second chip is used to perform the method of the second chip as described in any one of claims 1, 4-17.

22. A computer program product, characterized in that, Includes a computer program that, when run on a computer, causes the computer to perform the method as described in any one of claims 1 to 17.

23. A computer-readable storage medium, characterized in that, The computer-readable storage medium is used to store a computer program that, when run on an electronic device, causes the electronic device to perform the steps of the method as described in any one of claims 1-17.

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