Wafer boat

Abstract

This wafer boat comprises: a pair of side plates; separators positioned at predetermined intervals between the pair of side plates and partitioning a loading area into which a plurality of wafers are inserted; and a guide bar supporting the wafers between the pair of side plates, wherein the average surface roughness value (Ra) of at least one of the guide bar or the separators may be different from the average surface roughness value (Ra) of the pair of side plates.

Description

Wafer boat

[0001] The present invention relates to a wafer boat.

[0002] The process of manufacturing a solar cell or semiconductor includes a step of forming a thin film by reacting gas molecules with the surface of a wafer. The thin film formation process is carried out by methods such as Chemical Vapor Deposition (CVD) or Atomic Layer Deposition (ALD), and the wafer on which the thin film is formed exhibits electrical properties. After loading the wafer to be formed with the thin film into a boat, it is introduced into a process chamber, and the thin film formation process is carried out under a predetermined atmosphere, temperature, and pressure.

[0003] However, conventional boats can only load about 100 wafers per unit, making it difficult to load a large number of wafers into the process chamber at once. In addition, there is a problem that it takes a long time to load each conventional boat loaded with wafers into the process chamber and to remove it from the process chamber. Furthermore, conventional boats lack a guide member for wafer insertion in the wafer insertion area, so it is not easy to insert wafers into the boat, and in some cases, damage to the wafers occurs during the insertion process.

[0004] A wafer boat according to one or more embodiments can load hundreds or more wafers at once, allows wafers to be stably inserted and loaded, allows easy entry and exit from a process chamber, and provides a wafer boat with improved durability through surface treatment.

[0005] A wafer boat comprises a pair of side plates, a separator positioned at a predetermined interval between the pair of side plates and partitioning a loading area into which a plurality of wafers are inserted, and a guide bar that supports the wafer between the pair of side plates, wherein one or more of the separator and the guide bar may have an average surface roughness (Ra) value different from that of the pair of side plates.

[0006] The separator and the guide bar may be sanded to have an average surface roughness value (Ra) smaller than that of the pair of side plates.

[0007] The guide bar comprises two first guide bars spaced apart from each other, each comprising a plurality of first insertion grooves supporting one side of the wafer and a plurality of first insertion protrusions partitioning the plurality of first insertion grooves, and two second guide bars located below the first guide bar and spaced more narrowly than the two first guide bars, each comprising a plurality of second insertion grooves supporting the other side of the wafer and a plurality of second insertion protrusions partitioning the plurality of second insertion grooves, and the plurality of first insertion grooves and the plurality of second insertion grooves may have a shape in which the width gradually narrows toward the inside.

[0008] The first guide bar may further include a plurality of first insertion protrusions located between the plurality of first insertion grooves, wherein at least a portion of the edge of the surface on which the wafer is inserted is chamfered.

[0009] The first insertion projection comprises a first protruding surface extending downward at an angle, a second protruding surface extending from the end of the first protruding surface, a third protruding surface extending downward at an angle from the end of the second protruding surface, a first support surface provided on both sides of the first protruding surface and in contact with the first insertion groove, and a second support surface provided on both sides of the third protruding surface and in contact with the first insertion groove, wherein a portion of the corner of the second protruding surface in contact with the first support surface may be chamfered.

[0010] The line of the first support surface contacting the first insertion groove gradually narrows in the height direction of the first guide bar, and the portion of the second support surface contacting the first insertion groove may extend vertically in the height direction of the first guide bar.

[0011] The above side plate may include a mounting groove on the inner surface into which both ends of the separator are inserted, and a bracket that supports the separator by being mounted in a cut-out formed at the bottom of the mounting groove.

[0012] The above side plate may include a triangular support groove formed concavely on the outer surface.

[0013] The wafer boat further includes a coating layer formed on the guide bar, and the average surface roughness value (Ra) of the coating layer may be smaller than the average surface roughness value (Ra) of the guide bar.

[0014] A wafer boat according to one or more embodiments can prevent the wafer from being damaged by surface treating the separator and guide bar, which are frequently in contact when a wafer is inserted, so that their surface roughness is smaller than that of other components of the wafer boat.

[0015] A wafer boat according to one or more embodiments can partition a loading area into which a plurality of wafers are inserted using a separator, so that a deposition gas can be uniformly introduced into a plurality of wafers.

[0016] A wafer boat according to one or more embodiments can minimize damage to the wafer by changing the shape of the portion where the guide bar contacts the wafer.

[0017] Figure 1 shows the state in which a wafer boat is introduced into a process chamber.

[0018] Figure 2 shows a perspective view of a wafer boat.

[0019] Figure 3 shows an exploded perspective view of a wafer boat.

[0020] Figure 4 shows a plan view of a part of the wafer boat.

[0021] Figure 5 shows one side of the side plate.

[0022] Figure 6 shows the other side of the side plate.

[0023] Figure 7 shows the first guide bar.

[0024] Figures 8 and 9 show an enlarged view of a portion of the first guide bar.

[0025] Figure 10 shows the second guide bar.

[0026] Figures 11 and 12 show an enlarged view of a portion of the second guide bar.

[0027] Figure 13 shows an enlarged view of a portion of the second guide bar.

[0028] The present disclosure is described below with reference to embodiments illustrated in the attached drawings. The embodiments described herein are not limited to those described herein and may take different forms. Accordingly, embodiments are described below with reference to the drawings only to explain aspects and features of the present invention.

[0029] The present disclosure includes various embodiments and modifications, and specific embodiments are illustrated in the drawings and described in the description below. However, the present disclosure is not limited to the embodiments described above and includes all modifications, equivalents, and substitutions that fall within the spirit and scope of the present invention.

[0030] When an element or layer is referred to as being "on" another element or layer, or being "connected" or "combined" to another element or layer, said element or layer may be directly connected or combined to the other element or layer. Or one or more additional elements or layers may exist. When an element or layer is referred to as being "immediately on" another element or layer, or being "directly connected" or "directly combined," there may not be any other intermediate elements or intermediate layers between them. For example, where it is stated that a first element is "combined" or "connected" to a second element, the first element may be directly combined or connected to the second element, or the first element may be indirectly combined or connected to the second element through one or more intermediate elements.

[0031] In the drawings, dimensions of various elements, layers, etc., may be exaggerated for the sake of clarity of example. Identical reference numerals may denote identical elements. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items. Additionally, when describing embodiments of the present disclosure, the use of “may” relates to “one or more embodiments of the present disclosure.” Expressions such as “at least one” and “any one” may modify the entire list of elements when preceding a list of elements, but may not modify the individual elements of the list. For example, the expression “at least one of a, b, or c” may indicate only a, only b, only c, both a and b, both a and c, both b and c, all a, b, and c, or variations thereof. As used herein, the terms “use,” “using,” and “used” may be considered synonyms for the terms “utilize,” “utilizing,” and “utilized,” respectively. The terms “substantially,” “about,” and similar terms as used herein are used as terms of approximation rather than terms of degree, and are intended to describe inherent variations in measured or calculated values ​​that a person skilled in the art can recognize.

[0032] Although terms such as first, second, third, etc. may be used herein to describe various elements, components, regions, layers, and / or sections, these elements, components, regions, layers, and / or sections are not limited to these terms. These terms are used to distinguish one element, component, region, layer, or section from another element, component, region, layer, or section. Accordingly, the first element, first component, first region, first layer, or first section discussed below may be named a second element, second component, second region, second layer, or second section without departing from the disclosure of exemplary embodiments.

[0033] Spatially relative terms such as “below,” “lower,” “above,” “upper,” etc. may be used herein for convenience of description to explain the relationship between one element or feature and another element with respect to other element(s) or the function(s) described in the drawings. Spatially relative terms may include other directions of the device in use or operation in addition to the directions depicted in the drawings. For example, if the device in the drawings is inverted, an element described as “below” or “lower” of another element or feature may be oriented “above” or “upper” of that other element or feature. Thus, the term “below” may include both upward and downward directions. The device may be oriented in other directions (rotated 90 degrees or in other directions), and spatially relative descriptors used herein should be interpreted accordingly.

[0034] The terms used herein are for describing embodiments of the invention and are not intended to limit the invention. The singular forms used herein may include the plural forms unless the context clearly indicates otherwise. The terms “comprising,” “comprising,” and “composing” specify the features, integers, steps, actions, elements, and / or components specified herein, but do not exclude the presence or addition of one or more other functions, integers, steps, actions, elements, components, and / or groups thereof.

[0035] Where the embodiments can be implemented as processes, the specific order of processes may be performed differently from the described order. For example, two processes described in succession may be performed simultaneously or substantially simultaneously, or in the reverse order of the described order.

[0036] FIG. 1 shows the state in which a wafer boat (10) is introduced into a process chamber (1), and FIG. 2 shows a perspective view of the wafer boat (10). FIG. 2 shows only a plurality of wafers (W) loaded in one loading area (S), but a plurality of wafers (W) can also be loaded in other loading areas (S). FIG. 3 shows an exploded perspective view of the wafer boat (10), and in FIG. 3, a plurality of wafers (W) are omitted for convenience of explanation.

[0037] FIG. 4 shows a plan view of a part of the wafer boat (10). FIG. 4 shows a view from above of a region other than the end of the wafer boat (10). FIG. 5 shows a part of the inner surface as one side of the side plate (100). FIG. 6 shows a part of the outer surface as the other side of the side plate (100). FIG. 7 shows a view from above of the first guide bar (310). FIG. 8 and FIG. 9 show an enlarged view of a part of the first guide bar (310). FIG. 10 shows the second guide bar (320). FIG. 11 and FIG. 12 show an enlarged view of a part of the second guide bar (320).

[0038] The process chamber (1) is a device for heat-treating a wafer (W), and can perform a deposition process to form a thin film composed of a predetermined material layer on the wafer (W), for example. The process chamber (1) may have an internal space that is long in the horizontal direction so that a wafer boat (10) can be introduced. When a wafer boat (10) is introduced into the process chamber (1), a deposition gas is introduced into the process chamber (1) from a gas supply source (3), and a predetermined atmosphere is formed inside the process chamber (1). Then, a heater (2) located inside and / or outside the process chamber (1) heats the process chamber (1), so that a heat treatment process can be performed.

[0039] A wafer boat (10) can be used to store and transport multiple wafers (W). One wafer boat (10) may be a batch-type boat capable of loading 100 or more, 200 or more, or 300 or more wafers (W). Additionally, the wafer boat (10) may be a horizontal-type boat in which multiple wafers (W) are loaded in a horizontal direction. The wafer boat (10) may be made of metal, for example, an aluminum alloy. The wafer boat (10) may be used to load multiple wafers (W) into a process chamber (1) and to remove multiple wafers (W) from the process chamber (1) after the process is completed.

[0040] The wafer boat (10) may include a side plate (100), a separator (200), a guide bar (300), and an end plate (400).

[0041] One or more side plates (100) are provided on at least one side of the wafer boat (10) and can support other components of the wafer boat (10), such as a separator (200), a guide bar (300), and an end plate (400). For example, the side plates (100) may extend in one direction (e.g., the X-axis direction as the length direction of the wafer boat (10)). Two side plates (100) may be provided spaced apart in the width direction of the wafer boat (10) (e.g., the Y-axis direction). A separator (200) may be positioned between the two side plates (100) to partition a loading area (S) where multiple wafers (W) are loaded. Additionally, an end plate (400) may be provided at each end of the two side plates (100). The loading area (S) may be appropriately selected according to the specifications and capacity of the wafer boat (10). For example, as shown in FIG. 2, there may be 8 loading areas (S). Alternatively, there may be 8 or fewer loading areas (S) or 8 or more loading areas. Tens or hundreds of wafers (W) may be loaded in one loading area (S).

[0042] The side plate (100) may be made of aluminum alloy. Additionally, the side plate (100) may have a predetermined surface roughness value through surface treatment. For example, the side plate (100) may have a surface roughness value by sanding. For example, the average roughness value (Ra) of the side plate (100) may be about 9 μm or more. Here, the average roughness value (Ra) refers to the center line average height (Ra). Accordingly, when reusing the wafer boat (10), the surface of the side plate (100) may peel off during the deposition process, or the peeling phenomenon in which the deposited material on the side plate (100) peels off can be prevented. In addition, the cost of surface cleaning can be reduced when reusing the wafer boat (10). For example, the side plate (100) may be surface-treated to have a larger surface roughness value than other components of the wafer boat (10). As a result, the deposited material deposited during deposition can bond more strongly on the side plate (100), which has a surface roughness value greater than that of other components. Therefore, it is possible to prevent the deposited material deposited on the side plate (100) from falling off the side plate (100) and causing contamination on the wafer (W), etc. during the process, and the deposited material deposited on the wafer (W) can have excellent uniformity characteristics.

[0043] The side plate (100) may include a mounting groove (110) into which a separator (200) is inserted. As shown in FIG. 4, the mounting groove (110) may be formed on the inner surface of the side plate (100) extending downward in the height direction (e.g., Z-axis direction). The mounting groove (110) may extend straight downward and be formed concavely on the inner surface of the side plate (100). The mounting groove (110) may be formed on each of the two side plates (100) so as to face each other. Both ends of the separator (200) may be inserted into each of the two facing mounting grooves (110).

[0044] The side plate (100) may include a support hole (120) that supports a guide bar (300). The support hole (120) is formed in the side plate (100) so that the end of the guide bar (300) can be inserted. For example, as shown in FIG. 5, the side plate (100) may include a plurality of support holes (120), and four support holes (120) may be formed in one loading area (S). The end of one guide bar (300) may be inserted into each support hole (120). Thus, a guide bar (300) extending in the width direction of the wafer boat (10) between two side plates (100) can be inserted into the support hole (120) to support a plurality of wafers (W).

[0045] The support hole (120) may include a first support hole (121) and a second support hole (122).

[0046] A first support hole (121) may be formed in the side plate (100) to correspond to the first guide bar (310). For example, as shown in FIGS. 5 and 6, two first support holes (121) may be formed for each loading area (S) to correspond to the mounting groove (110) of the side plate (100). The first support hole (121) may be formed at the center or above it in the height direction of the side plate (100). The first support hole (121) may include a hole penetrating the side plate (100) and a concave area formed around it to form a step with the inner surface of the side plate (100). The concave area of ​​the first support hole (121) may have a shape corresponding to the cross-section of the end of the first guide bar (310). For example, as shown in the enlarged view of FIG. 5, the first support hole (121) may include a hexagonal concave groove and a groove formed on the inner side thereof. When the first guide bar (310) is inserted into the groove of the first support hole (121), the first guide bar (310) can be fixed to the first support hole (121) by inserting a fastening member, such as a bolt, from the outer surface of the side plate (100).

[0047] A second support hole (122) may be formed in the side plate (100) to correspond to the second guide bar (320). For example, as shown in FIGS. 5 and 6, the second support hole (122) may be formed in the lower part of the side plate (100) and may also be formed further inward than the first support hole (121). Two second support holes (122) may be formed for each loading area (S). The second support hole (122) may include a hole penetrating the side plate (100) and a concave area formed around it to form a step with the inner surface of the side plate (100). The concave area of ​​the second support hole (122) may have a shape corresponding to the cross-section of the end of the second guide bar (320). For example, as shown in the enlarged view of FIG. 5, the second support hole (122) may include a pentagonal concave groove and a groove formed on the inner side thereof. When the second guide bar (320) is inserted into the groove of the second support hole (122), the second guide bar (320) can be fixed to the second support hole (122) by inserting a fastening member, such as a bolt, from the outer surface of the side plate (100).

[0048] The bracket (130) is located at the bottom of the side plate (100) and can support the separator (200) inserted into the mounting groove (110). For example, as shown in FIG. 5, the bracket (130) can be mounted on the cut portion (131) of the side plate (100) formed at the bottom of the mounting groove (110). The bracket (130) is coupled to the cut portion (131) through a fastening member such as a bolt, so that the separator (200) inserted into the mounting groove (110) does not fall out below the mounting groove (110).

[0049] A support groove (140) is formed on one side of a side plate (100) and can be used to transport a wafer boat (10). For example, a plurality of support grooves (140) are formed on the outer side of the side plate (100), and a lift (L) can be inserted into the support groove (140) to lift the wafer boat (10). For example, the support groove (140) may be a triangular groove. As shown in FIG. 6, the support groove (140) is a triangular groove with a base that is placed flat with the ground, and the part corresponding to the vertex may have a curved shape. Therefore, even if the lift (L) is not inserted at the upper vertex of the support groove (140) all at once, or if the support groove (140) is located at another vertex of the support groove (140) or on a different side, the lift (L) will naturally be positioned at the upper vertex of the support groove (140) as it rises. Therefore, the wafer boat (10) can achieve the effect of correcting the position of the lift (L) solely through the shape of the support groove (140) without the need to correct the position of the lift (L) multiple times. The support groove (140) is provided in the same number as the loading area (S) and can be formed at a position corresponding to each loading area (S).

[0050] The separator (200) has a flat plate shape and partitions a loading area (S) where multiple wafers (W) are loaded. For example, the separator (200) has a rectangular flat plate shape and may be provided in multiple units spaced apart in one direction (e.g., X-axis direction) between two side plates (100). A loading area (S) where multiple wafers (W) are loaded may be partitioned between each separator (200). Additionally, the separator (200) allows the deposition gas to pass uniformly through multiple wafers (W) after the wafer boat (10) is inserted into the process chamber (1), thereby improving the deposition quality. If the separator (200) is not provided, the deposition gas sprayed from the top of the wafer boat (10) passes through the wafers (W) and is discharged through a gas outlet formed at the bottom of the process chamber (1). Since the gas outlet is located at the center of the process chamber (1), the deposition gas moves downward and collects at the center before being discharged. As a result, the density of the deposition gas is reduced in the wafers (W) located at both ends, and the deposition quality of the wafers (W) is reduced. On the other hand, the wafer boat (10) includes a separator (200), so that the deposition gas sprayed from above enters the loading area (S) partitioned by each separator (200) uniformly, and can be discharged after passing through all the multiple wafers (W) loaded in each loading area (S). For example, the wafer boat (10) includes 7 separators (200), and 8 loading areas (S) can be partitioned between the 7 separators (200) and 2 end plates (400). However, the number of separators (200) may vary depending on the number of loading areas (S) to be formed.

[0051] The separator (200) can be inserted into a mounting groove (110) formed in the side plate (100). As shown in FIG. 4, both ends of the separator (200) can be inserted into mounting grooves (110) formed facing each other in two side plates (100). The height of the separator (200) may be lower than the height of the side plate (100).

[0052] The separator (200) can be separated into two parts. For example, the separator (200) may include a first separator (210) positioned above the first guide bar (310) and a second separator (220) positioned below it. The second separator (220) may be inserted into the mounting groove (110) first and positioned at the bottom of the mounting groove (110), and then the first guide bar (310) may be mounted in the first support hole (121) and then the first separator (210) may be inserted into the mounting groove (110). Thus, the first separator (210) and the second separator (220) may be positioned above and below the first guide bar (310).

[0053] The separator (200) may be made of an aluminum alloy. Additionally, the separator (200) may have a predetermined surface roughness value through surface treatment. For example, the separator (200) may have a surface roughness value by sanding. For example, the average roughness value (Ra) of the separator (200) may be about 3.2 μm or less. Accordingly, when reusing the wafer boat (10), the peeling phenomenon in which the surface of the separator (200) peels off during the deposition process or the deposited material on the side plate (100) peels off can be prevented. In addition, the cost of surface cleaning can be reduced when reusing the wafer boat (10).

[0054] The separator (200) may have a surface roughness value smaller than that of the side plate (100). For example, the average roughness (Ra) value of the separator (200) may be about 35% or less of the average roughness (Ra) value of the side plate (100). Therefore, when inserting the wafer (W) into the loading area (S), even if the wafer (W) comes into contact with the separator (200), damage to the wafer (W) caused by the surface roughness of the separator (200) can be minimized.

[0055] A guide bar (300) can guide the position where a plurality of wafers (W) are inserted and support a plurality of wafers (W). A plurality of guide bars (300) may be provided in each loading area (S). A plurality of guide bars (300) may be provided in the width direction (e.g., Y-axis direction) of the wafer boat (10) so as to intersect the length direction (e.g., X-axis direction) of the wafer boat (10). Each guide bar (300) may be located between two side plates (100). For example, four guide bars (300) may be provided in one loading area (S).

[0056] The guide bar (300) may be made of aluminum alloy. Additionally, the guide bar (300) may have a predetermined surface roughness value through surface treatment. For example, the guide bar (300) may have a surface roughness value by sanding. For example, the average roughness value (Ra) of the guide bar (300) may be about 3.2 μm or less. Accordingly, when reusing the wafer boat (10), the peeling phenomenon in which the surface of the guide bar (300) peels off during the deposition process or the deposited material on the side plate (100) peels off can be prevented. In addition, the cost of surface cleaning can be reduced when reusing the wafer boat (10).

[0057] The guide bar (300) may have a surface roughness value corresponding to that of the separator (200). For example, the average surface roughness value (Ra) of the guide bar (300) may correspond to the average roughness value (Ra) of the separator (200). Here, the correspondence of the average surface roughness value (Ra) may mean that they are the same within an error range. Additionally, it may have a surface roughness value smaller than that of the side plate (100). For example, the average roughness value (Ra) of the guide bar (300) may be about 35% or less of the average roughness value (Ra) of the side plate (100). Therefore, when inserting the wafer (W) into the loading area (S), even if the wafer (W) comes into contact with the guide bar (300), damage to the wafer (W) caused by the surface roughness of the guide bar (300) can be minimized.

[0058] Additionally, a coating layer (not shown) may be further formed on the guide bar (300). For example, the guide bar (300) may be coated after surface treatment. For instance, the guide bar (300) may be sanded and then anodized, and a coating layer may be further formed on the surface of the guide bar (300). Through aluminum anodizing, a coating layer containing aluminum oxide is formed on the surface of the guide bar (300), thereby improving corrosion resistance, wear resistance, paint adhesion, etc.

[0059] Additionally, as a coating layer is formed on the guide bar (300), the guide bar (300) may have a lower surface roughness value. For example, the average surface roughness value (Ra) of the guide bar (300) with the coating layer formed, such as the average surface roughness value (Ra) of the coating layer surface, may be smaller than the average surface roughness value (Ra) of the guide bar (300) without the coating layer formed. That is, the average surface roughness value (Ra) of the coating layer surface may be lower than the average surface roughness value (Ra) of the guide bar (300) within a range of about 3.2 μm or less.

[0060] Accordingly, when a wafer (W) is inserted into or removed from a loading area (S), scratches or damage to the wafer (W) can be prevented or minimized due to the surface roughness of the guide bar (300).

[0061] Multiple wafers (W) can be inserted and supported in a B-to-B (Back to Back) manner on a guide bar (300). That is, two wafers (W) can be inserted into a single insertion groove included in the guide bar (300) while in contact with each other's rear surfaces. Therefore, the rear surface of the wafer (W) that does not require deposition is covered by another wafer (W), and the deposition process can proceed with the front surface exposed. Accordingly, it is possible to prevent the deposition material from being unnecessarily deposited on the rear surface of the wafer (W).

[0062] In addition, the deposition process is carried out with two wafers (W) in contact, which can minimize the number of first insertion grooves (312) described later and maximize process efficiency. Also, as two wafers (W) are inserted and arranged within the first insertion groove (312), shaking such as vibrations on the wafers (W) within the first insertion groove (312) during the process can be minimized.

[0063] The guide bar (300) may include a first guide bar (310) and a second guide bar (320).

[0064] The first guide bar (310) may be a component that first contacts the plurality of wafers (W) when the plurality of wafers (W) are inserted into the loading area (S). The first guide bar (310) may be provided in the upper portion among the plurality of guide bars (300). For example, two first guide bars (310) may be spaced apart in the longitudinal direction (e.g., X-axis direction) of the wafer boat (10). The distance between the two first guide bars (310) may correspond to the length of the wafer (W) in one direction. Both ends of the first guide bar (310) may be inserted into two first support holes (121) formed in each of the two side plates (100). With both ends of the first guide bar (310) inserted into the two first support holes (121), the first guide bar (310) can be fixed to the side plate (100) by inserting a fastening member, such as a bolt, into the first support holes (121) from the outside of the side plate (100).

[0065] The first guide bar (310) may include a first body (311), a first insertion groove (312), a first insertion projection (313), and an end portion (314).

[0066] The first body (311) has a long rod shape in one direction (e.g., the X-axis direction), and a plurality of first insertion grooves (312) and a plurality of first insertion protrusions (313) may be formed on one side and the other side, respectively. Additionally, end portions (314) that are inserted into the first support hole (121) may be formed at both ends along the length direction of the first body (311). The first body (311) has a flat shape on its upper and lower surfaces, and a plurality of first insertion grooves (312) and a plurality of first insertion protrusions (313) may be formed on each of the protruding sides.

[0067] The first insertion groove (312) is a groove into which a wafer (W) is inserted and supported, and can be formed between two adjacent first insertion protrusions (313). Two wafers (W) can be inserted into one first insertion groove (312) in a B-to-B manner. The first insertion groove (312) and the first insertion protrusion (313) can be formed on one side and the other side of the first body (311), respectively. The first insertion groove (312) may have a shape in which the width gradually narrows from the outside to the inside in the width direction (e.g., X-axis direction) of the first guide bar (310). For example, as shown in FIG. 7, when viewed from above, the first insertion groove (312) may be a V-shaped groove. The first insertion groove (312) may have a shape that gradually narrows from top to bottom in the height direction (e.g., Z-axis direction) of the first guide bar (310). For example, as shown in FIG. 8, when viewed from the side, the first insertion groove (312) may be a V-shaped groove. In this way, by having a V-shaped shape in which the first insertion groove (312) gradually narrows in the width direction and / or height direction of the first guide bar (310), it can guide the wafer (W) to be naturally inserted into the first insertion groove (312) and firmly support the wafer (W) so that it does not shake during the process.

[0068] The first insertion projection (313) may include a first protruding surface (3131), a second protruding surface (3132), a third protruding surface (3133), a first supporting surface (3134), and a second supporting surface (3135).

[0069] The first protruding surface (3131) may be extended downward at an angle from the upper surface of the first body (311). The second protruding surface (3132) may be extended downward (e.g. vertically) from the end of the first protruding surface (3131), and the third protruding surface (3133) may be extended downward at an angle toward the lower surface of the first body (311) from the end of the second protruding surface (3132). Thus, as shown in FIG. 8, the protruding surface divided into the first protruding surface (3131), the second protruding surface (3132), and the third protruding surface (3133) may be extended to one side of the first body (311) to support the wafer (W) inserted into the first insertion groove (312).

[0070] A first support surface (3134) is formed on both sides of the first protruding surface (3131), and a second support surface (3135) may be formed on both sides of the third protruding surface (3133). As shown in FIG. 8, the first support surface (3134) is formed on each side of the first protruding surface (3131), and its lower end may correspond to the second protruding surface (3132). Additionally, the second support surface (3135) is formed on each side of the third protruding surface (3133), and its upper end may be in contact with the first support surface (3134) and correspond to the second protruding surface (3132).

[0071] The first support surface (3134) may have a shape inclined toward the first insertion groove (312) in the width direction of the first guide bar (310). The second support surface (3135) may have a shape inclined toward the first insertion groove (312) in the width direction of the first guide bar (310). Therefore, when viewed from above, the first insertion groove (312) may have a V-shape that gradually narrows inward in the width direction of the first guide bar (310).

[0072] The first support surface (3134) may have a shape that slopes downward toward the first insertion groove (312) along the length of the first guide bar (310). By having two first support surfaces (3134) that slope toward the inside of the first insertion groove (312), the first insertion groove (312) may have a V-shape that gradually narrows from top to bottom. The second support surface (3135) may have a side that contacts the first insertion groove (312) that extends vertically downward. Accordingly, the first insertion groove (312), which is partitioned by the first support surface (3134) and the second support surface (3135), has a shape that gradually narrows downward up to the boundary between the first support surface (3134) and the second support surface (3135), and may have a constant width from the second support surface (3135) to the bottom. Therefore, when the first wafer (W) is inserted into the first insertion groove (312), it is naturally inserted into the upper part of the first insertion groove (312) which has a relatively wide width, and subsequently can be firmly supported in the lower part of the first insertion groove (312) which has a relatively narrow width and is formed between the two second support surfaces (3135).

[0073] The side where the second protruding surface (3132) and the first supporting surface (3134) meet may have a shape that is at least partially chamfered. For example, as shown in FIG. 8, the second protruding surface (3132) may have a shape where the part corresponding to the vertex of the rectangle is chamfered when viewed from the front. Therefore, the tip of the first supporting surface (3134) may not meet the second protruding surface (3132) at a point, but may meet the edge of the second protruding surface (3132) at a surface. By having the first insertion projection (313) have such a shape, when the wafer (W) is inserted into the first insertion groove (312), it is possible to prevent damage to the wafer (W) from coming into contact with the protruding tip of the second protruding surface (3132) and the first supporting surface (3134).

[0074] As shown in FIG. 9, at least some of the first protruding surface (3131), second protruding surface (3132), third protruding surface (3133), first support surface (3134), and second support surface (3135) of the first insertion projection (313) may have different inclinations. For example, two adjacent first support surfaces (3134) may have a first angle ø1. That is, the angle between two first support surfaces (3134) facing each other with the first insertion groove (312) in between may be the first angle ø1. Here, the first angle ø1 may be the angle between the edges of two first support surfaces (3134) that are in contact with the bottom surface of the first insertion groove (312). Additionally, two adjacent second support surfaces (3135) may have a second angle ø2. That is, the angle between the two second support surfaces (3135) with the first insertion groove (312) in between may be the second angle ø2. Here, the second angle ø2 may be the angle between the corners of the two second support surfaces (3135) that are in contact with the third protruding surface (3133). Also, the angle formed by the boundary line of the first support surface (3134) and the second support surface (3135) may be the third angle ø3. That is, the angle at which the boundary line of the first support surface (3134) and the second support surface (3135) extends from the bottom surface of the first insertion groove (312) may be the third angle ø3. For example, the first angle ø1 may be greater than the second angle ø2. For example, the first angle ø1 may be 25 degrees or more and 35 degrees or less, and the second angle ø2 may be 10 degrees or more and 20 degrees or less. Alternatively, the first angle ø1 may be 20 degrees or more and 40 degrees or less, and the second angle ø2 may be 5 degrees or more and 25 degrees or less. Also, the third angle ø3 may be smaller than the first angle ø1 and larger than the second angle ø2. For example, the third angle ø3 may be 20 degrees or more and 30 degrees or less. Alternatively, the third angle ø3 may be 15 degrees or more and 35 degrees or less.By satisfying the aforementioned size relationship between the first angle ø1, the second angle ø2, and the third angle ø3, the wafer (W) can be smoothly inserted into and removed from the first guide bar (310), and the wafer (W) can be firmly supported and fixed to the first guide bar (310).

[0075] The second guide bar (320) is positioned below the first guide bar (310) to support the underside of a plurality of wafers (W). A plurality of second guide bars (320) may be provided at the bottom of the plurality of guide bars (300). For example, two second guide bars (320) may be spaced apart in the longitudinal direction (e.g., X-axis direction) of the wafer boat (10). The distance between two second guide bars (320) may be narrower than the distance between two first guide bars (310). Therefore, when viewed from the side of the wafer boat (10), the virtual line connecting the two first guide bars (310) and the two second guide bars (320) may have a trapezoidal shape with a longer upper side. The second guide bar (320) may be inserted at both ends into two second support holes (122) formed in each of the two side plates (100). With both ends of the second guide bar (320) inserted into the two second support holes (122), the second guide bar (320) can be fixed to the side plate (100) by inserting a fastening member, such as a bolt, into the second support holes (122) from the outside of the side plate (100).

[0076] The second guide bar (320) may include a second body (321), a second insertion groove (322), a second insertion projection (323), and an end portion (324).

[0077] The second body (321) has a long rod shape in one direction (e.g., the X-axis direction), and a plurality of second insertion grooves (322) and a plurality of second insertion protrusions (323) may be formed on one side and the other side, respectively. Additionally, end portions (324) that are inserted into the second support hole (122) may be formed at both ends along the length of the second body (321). The second body (321) has a flat shape on its upper and lower surfaces, and a plurality of second insertion grooves (322) and a plurality of second insertion protrusions (323) may be formed on each of the protruding sides.

[0078] The second insertion groove (322) is a groove into which a wafer (W) is inserted and supported, and can be formed between two adjacent second insertion protrusions (323). Two wafers (W) can be inserted into one second insertion groove (322) in a B-to-B manner. The second insertion groove (322) and the second insertion protrusion (323) can be formed on one side and the other side of the second body (321), respectively. The second insertion groove (322) may have a shape in which the width gradually narrows from the outside to the inside in the width direction (e.g., X-axis direction) of the second guide bar (320). For example, as shown in FIG. 10, when viewed from one side (e.g., the front in the Y-axis direction), the second insertion groove (322) may be a V-shaped groove. The second insertion groove (322) may have a shape that gradually narrows from top to bottom in the height direction (e.g., Z-axis direction) of the second guide bar (320). For example, as shown in FIG. 10, when viewed from the side, the second insertion groove (322) may be a V-shaped groove. In this way, by having a V-shaped shape in which the second insertion groove (322) gradually narrows in the width direction and / or height direction of the second guide bar (320), it can guide the wafer (W) to be naturally inserted into the second insertion groove (322) and firmly support the wafer (W) so that it does not shake during the process.

[0079] The second insertion projection (323) may include a fourth protruding surface (3231), a fifth protruding surface (3232), a sixth protruding surface (3233), and a third supporting surface (3234).

[0080] The fourth protruding surface (3231) may be inclined upward from one side of the second body (321), and the sixth protruding surface (3233) may be inclined upward from the other side of the second body (321). Additionally, the fifth protruding surface (3232) may be located between the fourth protruding surface (3231) and the sixth protruding surface (3233). Thus, as shown in FIG. 10, the protruding surfaces divided into the fourth protruding surface (3231), the fifth protruding surface (3232), and the sixth protruding surface (3233) may protrude upward from the second body (321) to support the wafer (W) inserted into the second insertion groove (322).

[0081] A third support surface (3234) may be formed on both sides of the second insertion projection (323). As shown in FIG. 10, the third support surface (3234) may be formed between the fourth protruding surface (3231), the fifth protruding surface (3232), the sixth protruding surface (3233), and the second insertion groove (322). The third support surface (3234) may have a shape inclined toward the second insertion groove (322) in the width direction of the second guide bar (320). Therefore, when viewed from above, the second insertion groove (322) may have a V-shape in which the width gradually narrows toward the inside in the width direction of the second guide bar (320).

[0082] The third support surface (3234) may have a shape that slopes downward toward the second insertion groove (322) along the length of the second guide bar (320). Since the two third support surfaces (3234) have a shape that slopes toward the inside of the second insertion groove (322), the second insertion groove (322) may have a V-shape that gradually narrows from top to bottom. Therefore, when the first wafer (W) is inserted into the second insertion groove (322), it is naturally inserted into the upper part of the second insertion groove (322), which has a relatively wide width, and subsequently can be firmly supported in the lower part of the second insertion groove (322), which has a relatively narrow width.

[0083] As shown in FIG. 12, two adjacent third support surfaces (3234) may have a fourth angle ø4. That is, the angle between two third support surfaces (3234) facing each other with the second insertion groove (322) in between may be a fourth angle ø4. For example, the fourth angle ø4 may be smaller than the first angle ø1. Also, the fourth angle ø4 may be smaller than the third angle ø3. Also, the fourth angle ø4 may be smaller than the third angle ø3. For example, the fourth angle may be 10 degrees or more and 20 degrees or less. Or the fourth angle may be 5 degrees or more and 25 degrees or less. By satisfying the aforementioned size relationship between the fourth angle ø4 and the first angle ø1, the second angle ø2, and the third angle ø3, the wafer (W) can be smoothly inserted into and removed from the second guide bar (320), and the wafer (W) can be firmly supported and fixed to the second guide bar (320). The end guide bar (330) may be provided on one side of the end plate (400), for example, the end guide bar (330) may be provided on the inner surface of each of the two end plates (400). The end guide bar (330) can support the wafer (W) between adjacent first guide bars (310). The end guide bar (330) may have a shape corresponding to half of the first guide bar (310) in one direction (for example, the X-axis direction). For example, the end guide bar (330) may have a shape similar to the first guide bar (310) in which the first insertion groove (312) and the first insertion projection (313) are formed only on one side.

[0084] An end plate (400) may be provided at an end along the longitudinal direction (e.g., the X-axis direction) of the wafer boat (10). For example, as shown in FIG. 3, two end plates (400) may be provided at each end along the longitudinal direction of the wafer boat (10) to form a loading area (S) between the nearby separator (200). An end guide bar (330) may be located on the inner surface of the end plate (400).

[0085] The end plate (400) may be made of aluminum alloy. Additionally, the end plate (400) may have a predetermined surface roughness value through surface treatment. For example, the end plate (400) may have a surface roughness value by sanding. For example, the average roughness value (Ra) of the end plate (400) may be about 9 μm or more. Accordingly, when reusing the wafer boat (10), the peeling phenomenon in which the surface of the end plate (400) peels off during the deposition process or the deposited material on the side plate (100) peels off can be prevented. In addition, the cost of surface cleaning can be reduced when reusing the wafer boat (10). For example, the end plate (400) may be surface-treated to have a surface roughness value greater than that of other components of the wafer boat (10). For example, the end plate (400) may have a surface roughness value corresponding to that of the side plate (100). Specifically, one side of the end plate (400) and the side plate (100) facing the wafer (W) may have an average roughness value (Ra) that corresponds to each other within an error range.

[0086] As a result, the deposited material during deposition can bond more strongly to the end plate (400), which has a relatively high surface roughness value. Therefore, it is possible to prevent the deposited material deposited on the end plate (400) from detaching from the end plate (400) and causing contamination to the wafer (W), etc., during the process, and the deposited material deposited on the wafer (W) can have excellent uniformity characteristics.

[0087] FIG. 13 shows a second guide bar (320A) according to another embodiment.

[0088] The second guide bar (320A) may have a different shape of the second insertion groove (322A) compared to the second guide bar (320) described above, and other components may be the same as those of the second guide bar (320). For convenience of explanation, the following description will focus on the second insertion groove (322A).

[0089] The second guide bar (320A) may include a second body (321A), a second insertion groove (322A), and a second insertion projection (323A).

[0090] The second insertion groove (322A) may be tilted by an angle θ with respect to the vertical axis (e.g., the Z-axis). The angle θ may be 10 to 80 degrees, or 20 to 60 degrees, or 30 to 45 degrees. For example, the angle θ may be 25 to 35 degrees. And the wafer (W) may be supported in the second insertion groove (322A) while tilted by the angle of the second insertion groove (322A). Thus, the lower part of the wafer (W) is supported on the inclined surface of the second insertion groove (322A), so that it can be supported more stably in the second insertion groove (322A).

[0091] Although the present invention has been described with reference to the embodiments illustrated in the drawings, this is merely illustrative. Those skilled in the art will fully understand that various modifications and equivalent alternative embodiments are possible from the embodiments. Accordingly, the true technical scope of protection of the present invention should be determined based on the appended claims.

Claims

1. A pair of side plates; A separator positioned at a predetermined interval between the above pair of side plates and partitioning a loading area into which a plurality of wafers are inserted; and A guide bar supporting the wafer between the pair of side plates; comprising A wafer boat in which one or more of the separator and the guide bar have an average surface roughness (Ra) value different from the average surface roughness (Ra) of the pair of side plates.

2. In Paragraph 1, A wafer boat in which the separator and the guide bar are sanded to have an average surface roughness value (Ra) smaller than that of the pair of side plates.

3. In Paragraph 1, The above guide bar is Two spaced-apart first guide bars, each including a plurality of first insertion grooves supporting one side of the wafer and a plurality of first insertion protrusions partitioning the plurality of first insertion grooves; and It includes a plurality of second insertion grooves supporting the other side of the wafer and a plurality of second insertion protrusions partitioning the plurality of second insertion grooves, and two second guide bars located below the first guide bar and spaced more narrowly apart than the two first guides; A wafer boat having a plurality of first insertion grooves and a plurality of second insertion grooves that gradually narrow in width toward the inside.

4. In Paragraph 3, A wafer boat, wherein the first guide bar is positioned between the plurality of first insertion grooves and further comprises a plurality of first insertion protrusions having at least a portion of the edges of the surface on which the wafer is inserted chamfered.

5. In Paragraph 3, The above first insertion projection A first protruding surface extending downwardly; A second protruding surface extending from the end of the first protruding surface; A third protruding surface extending downwardly at the end of the second protruding surface; A first support surface provided on both sides of the first protruding surface and in contact with the first insertion groove; and It includes a second support surface provided on both sides of the third protruding surface and in contact with the first insertion groove; A wafer boat in which a portion of the corner in contact with the first support surface is chamfered, the second protruding surface is a wafer boat.

6. In Paragraph 5, The line of the first support surface contacting the first insertion groove gradually narrows in the height direction of the first guide bar, and A wafer boat in which the portion of the second support surface contacting the first insertion groove extends vertically in the height direction of the first guide bar.

7. In Paragraph 1, The above side plate is A mounting groove on the inner surface into which both ends of the separator are inserted; and A wafer boat comprising: a bracket that supports the separator and is mounted in a cut portion formed at the bottom of the mounting groove.

8. In Paragraph 1, A wafer boat, wherein the above-mentioned side plate includes a triangular support groove formed concavely on the outer surface.

9. In Paragraph 1, The wafer boat further includes a coating layer formed on the guide bar, and A wafer boat in which the average surface roughness value (Ra) of the coating layer is smaller than the average surface roughness value (Ra) of the guide bar.

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