System and method for processing glass substrate using laser and laser defect inspection method

Abstract

The present invention relates to a system and method for processing a glass substrate using a laser, and a laser defect inspection method, the system being characterized by comprising: a loading module unit for loading a glass substrate into the system; a laser pretreatment module unit which performs pretreatment on a glass substrate area, in which a hole is to be formed, through laser irradiation, and has a laser defect inspection function; a hole forming module unit for forming a hole in the glass substrate by controlling the pretreated glass substrate area; and a via module unit for forming a micro-via by filling the hole with a metallic material.

Description

Laser-based glass substrate processing system and method and laser defect inspection method

[0001] The present invention relates to a laser-based glass substrate processing system and method and a laser defect inspection method. It provides a laser-based glass substrate processing system and method and a laser defect inspection method capable of forming ultrafine holes in a glass substrate through laser processing for use in the fabrication of semiconductors and sensors, and reducing defects in the laser irradiation process for forming micro-holes.

[0002] Various substrates are used for the fabrication of electronic devices, such as semiconductor and sensor devices. Among these, silicon substrates enable the realization of high-performance, high-density devices but require complex processes and expensive equipment, while PCB substrates allow for large-area mass production at low manufacturing costs but have disadvantages such as poor durability, thermal management issues, and signal loss.

[0003] Recently, interest in glass substrates has been increasing as advanced semiconductor devices and sensors require substrates capable of large-area, high-precision processing. In other words, glass substrates enable the fabrication of large-area substrates and possess advantages such as excellent electrical properties that are favorable for high-frequency signal processing, superior mechanical durability, and thermal management.

[0004] However, while connections between multilayer circuits are essential for fabricating advanced devices using glass substrates, glass substrates have the disadvantage of being difficult to process.

[0005] Recently, research and development to form ultra-precision micro-holes for electrical connection between the top and bottom of a glass substrate is actively underway. This is commonly referred to as TGV (Through Glass Via), and efforts are being made to form ultra-precision micro-holes through various processes and methods.

[0006] Recently, TGVs used in advanced semiconductors are becoming increasingly miniaturized, integrated, and precise, leading to the fabrication of TGVs smaller than 50 µm. To achieve this, Laser Induced Deep Etching (LIDE) technology must be introduced. The LIDE process proceeds in the order of laser pretreatment, etching, and deposition; however, if laser pretreatment is not performed during the preceding laser pretreatment step, the subsequent etching and deposition processes cannot be carried out, resulting in a problem where the TGV cannot be formed.

[0007] The present invention has been devised to solve these problems and provides a glass substrate processing system and method using a laser and a laser defect inspection method, wherein a separate laser pulse detection means capable of detecting laser pulses in real time after a laser pretreatment step and an etching step can be provided to check for laser defects, whether a through hole is formed can be checked in situ or through other equipment or devices during the process, and TGV formation defects can be resolved by changing the laser irradiation method.

[0008] The present invention provides a glass substrate processing system using a laser, characterized by comprising: a loading module for loading a glass substrate according to the present invention into the system; a laser pretreatment module for performing pretreatment by laser irradiation on a glass substrate area to be formed and having a laser defect inspection function; a hole forming module for controlling a pretreated glass substrate area to form a hole in the glass substrate; and a via module for forming a micro via by filling the inside of the hole with a metallic material.

[0009] The above laser preprocessing module is characterized by comprising a laser alignment unit for aligning a loaded glass substrate, a laser generation unit for generating a laser, a Bessel beam generation unit for converting a laser beam into a Bessel beam, a beam irradiation unit for irradiating a Bessel beam to a processing area of ​​a glass substrate, and an oscillation detection unit for detecting whether the irradiated beam is oscillating.

[0010] The above-mentioned oscillation detection unit is installed in at least one of the beam irradiation section, the Bessel beam generation section, and the laser generation section where the Bessel beam is irradiated onto the glass substrate, or is characterized by detecting the Bessel beam penetrating the glass substrate.

[0011] The above-described oscillation detection unit comprises a dummy unit located on the lower surface of a glass substrate and having its characteristics changed by light, a vision unit that performs vision inspection on the dummy unit, and an artificial intelligence judgment unit that determines a light loss area using the vision inspection results, wherein the dummy unit is characterized by using at least one of a photosensitive paper, a photochromic film, a photocurable resin sheet, a photocatalytic sheet, a photosensitive resist sheet, and a photosensitive polyimide sheet.

[0012] In addition, the present invention provides a glass substrate processing system using a laser, characterized by comprising: a loading module for loading a glass substrate according to the present invention into the system; a laser pretreatment module for performing pretreatment by laser irradiation on a glass substrate area to be formed with a hole; a hole forming module for controlling a pretreated glass substrate area to form a hole in the glass substrate; a microhole verification module for determining whether the microhole formed through the hole forming module has penetrated; and a via module for forming a microvia by filling the inside of the hole with a metallic material.

[0013] The above micro-hole verification module is characterized by comprising a space separation unit that seals and separates the upper surface space and the lower surface space of a glass substrate, an inspection management unit that sprays a verification medium containing liquid and / or gas into one of the two spaces of the glass substrate separated by the space separation unit, and a hole inspection unit that inspects for penetration defects of micro-holes in the glass substrate through the verification medium sprayed into the other space of the glass substrate.

[0014] In addition, the present invention provides a method for processing a glass substrate using a laser according to the present invention, comprising the steps of: loading a glass substrate using a loading module; irradiating a Bessel beam onto a processing area of ​​the loaded glass substrate using a laser pretreatment module; identifying a laser loss area through an oscillation detection unit of the laser pretreatment module, and if a loss area exists, irradiating an additional Bessel beam onto the loss area; performing etching on the glass substrate to remove a processing area of ​​the laser-treated glass substrate to form a microhole; and filling the microhole area of ​​the glass substrate with metal to form a micro via hole.

[0015] The step of irradiating the above-mentioned Bessel beam is characterized by irradiating the processing area of ​​the glass substrate with a laser through a single shot or with a laser through a double shot, while adjusting the depth to perform irradiation on the lower part of the glass substrate first and irradiate the upper part of the glass substrate second.

[0016] In addition, the present invention provides a laser defect inspection method using a laser-based glass substrate processing system according to the present invention, comprising the steps of: irradiating a glass substrate with a laser through laser pretreatment and etching to form microholes; separating and sealing the upper surface space and the lower surface space of the glass substrate; injecting a verification medium into at least one of the two separated spaces and applying a pressure difference; and using an inspection device to confirm that one verification medium is ejected into the other space due to the pressure difference, and determining the area where the medium is not ejected as an area where microholes are not formed as a laser pretreatment defect.

[0017]

[0018] As such, the present invention can rapidly detect defects in the preprocessing step through a detection means capable of detecting errors in laser pulse shots in the laser preprocessing step.

[0019] In addition, by positioning the laser pulse detection device in the area where the Bessel beam is emitted, rapid detection is possible, and by positioning the detection device on the lower surface of the glass substrate, not only light loss but also laser defects caused by the surrounding environment, such as particles, can be detected.

[0020] In addition, by positioning a dummy detector, whose characteristics change due to laser light for pulse detection, on the underside of a glass substrate, not only can optical loss be detected, but production costs can also be reduced by using low-cost dummy sheets instead of expensive equipment.

[0021] In addition, after forming microholes, a verification medium such as a liquid or gas is used to allow them to flow out to the opposite side through the microholes of the glass substrate due to a pressure difference, thereby enabling verification of areas where the ultra-fine holes are not penetrated and preventing defects caused by this.

[0022] In addition, instead of performing a single laser shot, it is possible to prevent pre-processing errors and hole penetration errors by dividing the substrate into upper and lower sections and performing two double shots.

[0023]

[0024] FIG. 1 is a conceptual diagram illustrating a glass substrate processing system using a laser according to a first embodiment of the present invention.

[0025] FIG. 2 is a block diagram illustrating a laser preprocessing module according to a first embodiment.

[0026] FIG. 3 is a block diagram illustrating a laser pretreatment module according to a first variation of the first embodiment of the present invention.

[0027] FIG. 4 is a block diagram illustrating a laser pretreatment module according to a second variation of the first embodiment of the present invention.

[0028] FIG. 5 is a block diagram illustrating a dummy detection unit according to a second modified example.

[0029] FIG. 6 is a flowchart illustrating a method for processing a glass substrate using a laser according to a first embodiment of the present invention.

[0030] FIGS. 7 to 10 are conceptual diagrams for explaining a glass substrate processing method according to a first embodiment.

[0031] FIG. 11 is a flowchart illustrating a laser defect inspection method according to a first embodiment of the present invention.

[0032] FIG. 12 is a conceptual diagram illustrating a glass substrate processing system using a laser according to a second embodiment of the present invention.

[0033] FIG. 13 is a block diagram illustrating a laser pretreatment module according to a second embodiment.

[0034] FIG. 14 is a block diagram illustrating a micro-hole verification module according to a second embodiment.

[0035] FIG. 15 is a conceptual diagram for explaining a microhole verification module according to a first variation of the second embodiment.

[0036] FIG. 16 is a flowchart illustrating a method for processing a glass substrate using a laser according to a second embodiment of the present invention.

[0037] FIGS. 17 to 22 are conceptual diagrams for explaining a glass substrate processing method according to a first embodiment.

[0038] FIG. 23 is a flowchart illustrating a laser defect inspection method according to a second embodiment of the present invention.

[0039]

[0040] Hereinafter, embodiments of the present invention will be described in more detail with reference to the attached drawings. However, the present invention is not limited to the embodiments disclosed below but may be implemented in various different forms; these embodiments are provided merely to ensure that the disclosure of the present invention is complete and to fully inform those skilled in the art of the scope of the invention. Identical reference numerals in the drawings refer to identical elements.

[0041] It is intended to clarify that the classification of components in this specification is merely based on the primary function each component is responsible for. That is, two or more components described below may be combined into a single component, or a single component may be divided into two or more components based on more subdivided functions. Furthermore, each component described below may additionally perform some or all of the functions performed by other components in addition to its own primary function, and it is obvious that some of the primary functions performed by each component may be exclusively performed by other components. Therefore, the existence of each component described in this specification should be interpreted functionally. For this reason, it is clearly stated that the configuration of the components of the laser-based glass substrate processing system and method and the laser defect inspection method of the present invention may vary to the extent that the objectives of the present invention can be achieved.

[0042] In this specification, relational terms such as first and second, upper and lower, etc., may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying an actual relationship or order between such entities or actions. The terms “comprises,” “comprising,” or other variations thereof are intended to cover non-exclusive inclusions so that a process, method, product, or device comprising a list of components may not include only the component but may include other components not explicitly enumerated or inherent in such process, method, product, or device. A component proceeding to “comprising” excludes, without further limitation, the presence of additional identical components within the process, method, product, or device comprising the component.

[0043]

[0044] FIG. 1 is a conceptual diagram illustrating a glass substrate processing system using a laser according to a first embodiment of the present invention.

[0045] FIG. 2 is a block diagram illustrating a laser preprocessing module according to a first embodiment.

[0046] As illustrated in FIGS. 1 and 2, a glass substrate processing system using a laser according to the first embodiment includes a loading module (100) for loading a glass substrate (10) into the system, a laser pretreatment module (200) for performing pretreatment by laser irradiation on a glass substrate area to be formed and having a laser defect inspection function, a hole forming module (300) for controlling a pretreated glass substrate area to form a hole in the glass substrate (10), and a via module (400) for forming a micro via by filling the inside of the hole with a metallic material.

[0047] The loading module (100) is effective for loading and unloading the glass substrate (10) into the system. Additionally, it is desirable for the loading module (100) to be responsible for transporting the glass substrate (10) between each module. Through this, it becomes possible to form micro-holes and micro-via holes filled therein in a continuous process.

[0048] The laser preprocessing module (200) includes a laser alignment unit (210) for aligning a loaded glass substrate (10), a laser generation unit (220) for generating a laser, a Bessel beam generation unit (230) for converting a laser beam into a Bessel beam, a beam irradiation unit (240) for irradiating a Bessel beam to a processing area of ​​the glass substrate (10), and an oscillation detection unit (250) for detecting whether the irradiated beam is oscillating.

[0049] The laser alignment unit (210) ensures that the glass substrate (10) loaded through the loading module (100) is accurately aligned to the alignment position. At this time, if the alignment position is misaligned or the alignment is incorrect, a problem arises in which a hole is not formed in the desired area of ​​the glass substrate (10). At this time, it is preferable for the laser alignment unit (210) to be equipped with a separate alignment mark or alignment means, a vision system or a sensing system, and to ensure that the glass substrate (10) is accurately aligned on the stage based on this.

[0050] It is effective for the laser generating unit (220) to use various laser sources capable of pre-processing the glass substrate (10). Through the laser generating unit (220), a phase transition and a nano pore structure are formed on the glass substrate (10) through the laser. This enables isotropic processing during etching and allows for the provision of selectivity by shape, thereby enabling selective etching.

[0051] It is possible to use femtosecond, picosecond, or nanosecond lasers as laser sources. Of course, it is also possible to use multiple of these. In this case, laser irradiation can be performed in a single burst, or multiple lasers can be irradiated into a single space in a short period of time. Additionally, a multi-pulse irradiation method is possible, that is, irradiating a single space with lasers of multiple wavelengths and powers. The laser sources used should utilize wavelengths ranging from UV to NIR, and using ultrashort pulse lasers can improve the precision of the processing.

[0052] The Bessel beam generating unit (230) effectively generates a Bessel beam by utilizing an axicon lens and a focusing lens. Through the Bessel beam, strong energy concentration without diffraction is maintained within the transparent glass substrate (10), that is, by adjusting the depth of focus, it is possible to process micro-holes with a vertical profile. In particular, it is possible to form micro-holes with a high aspect ratio by controlling the beam shape.

[0053] The beam irradiation unit (240) irradiates the beam generated through the Bessel beam generation unit (230) onto the processing area of ​​the glass substrate (10). It is effective for the beam irradiation unit (240) to steer the generated beam, finally adjust the focus of the beam, and then irradiate it onto the processing area of ​​the glass substrate.

[0054] Through the beam irradiation unit (240), the Bessel beam is positioned so that the focal depth of the Bessel beam is located in the processing area of ​​the organic substrate (10), thereby enabling a phase change for accurate hole formation.

[0055] In this embodiment, pretreatment of a glass substrate (10) using a laser is made possible through the irradiation of an optimized Bessel beam. However, an issue may arise where abnormalities occur within the laser pretreatment module (200), such as laser errors or degradation of beam quality, or where the laser beam is not generated locally, resulting in a failure to cause a phase transition in the processing area of ​​the glass substrate. A single-shot process is performed by irradiating a single laser shot onto a single hole, that is, the processing area of ​​the glass substrate (10), through the beam irradiation unit (240).

[0056] Accordingly, in this example, it is effective to detect the oscillation of the Bessel beam through the oscillation detection unit (250).

[0057] It is effective for the oscillation detection unit (250) to be installed at the beam irradiation unit (240) where the Bessel beam is irradiated onto the glass substrate (10). Of course, it is also possible to install it at the Bessel beam generation unit (230) where the Bessel beam is generated, or at the laser generation unit (220). Of course, it is also possible to detect all three of these areas.

[0058] At this time, for the oscillation detection unit (250), it is effective to check whether the Bessel beam is oscillating by using an optical energy detection device. To do this, a detection device capable of optical detection can be used, and it is possible to use a beam profiler, photodiode, photomultiplier tube (PMT), thermocouple, pyroelectric sensor, blotometer, and CCD camera.

[0059] Through such an oscillation detection unit (250), defects caused by laser loss can be checked in real time in various laser environments, such as single shots or multi-shots of the laser. That is, if the Bessel beam does not oscillate at the time it is supposed to oscillate through the oscillation detection unit, the Bessel beam cannot cause a phase change in the processing area of ​​the glass substrate, so microholes and microvias are not formed even if a subsequent process is performed. Accordingly, it is possible to detect defects caused by such laser loss in advance through the oscillation detection unit (250).

[0060] A phase transition occurs in the processing area of ​​the glass substrate (10) loaded through the preceding laser pretreatment module (200), that is, the area where a micro-hole is to be formed. Although not illustrated, for laser pretreatment, it is possible to move the glass substrate (10) on a stage or to uniformly irradiate a laser onto a large-area glass substrate (10) where the beam irradiation unit (240) moves.

[0061] Micro-holes are formed on the phase-transformed glass substrate region by processing through a hole-forming module. In the description of the following examples, the descriptions of operations and devices performed in a general processing process are omitted.

[0062] The hole forming module (300) is effective in forming a micro hole in the glass substrate (10) by performing an etching process on the glass substrate (10).

[0063] It is effective for the hole forming module (300) to be equipped with various configurations and devices depending on the etching process used. It may vary depending on whether a wet process or a dry process is performed as the etching process.

[0064] In the hole forming module (300) of the present example, it is effective to form microholes in the glass substrate (10) through a wet process using an etching solution. At this time, it is effective to use hydrogen fluoride (HF), potassium hydroxide (KOH), hydrochloric acid (HCl), or nitric acid (HNO3) as the etching solution. Here, the removal speed and removal area of ​​the upper and lower surfaces of the glass substrate (10) can be controlled according to the etching time, the temperature of the solution, the concentration of the solution, and the reaction rate.

[0065] In addition, not limited to this, it is also possible to form micro-holes in the glass substrate by spraying an etching solution onto the upper and lower surfaces of the glass substrate (10) using a spray method.

[0066] The present invention is not limited to the wet etching described above, and it is possible to form micro-holes by performing a dry etching process.

[0067] To achieve this, it is effective to remove the glass substrate (10) in the phase-changed region by converting the preceding gaseous chemical into a plasma state. It is preferable to use a fluoride-based material as the gaseous chemical. Since this dry etching has superior straightness compared to wet etching, the profile of the microhole can be made to have a vertical profile. At this time, it is possible to use reactive ion etching (RIE), deep reactive ion etching (DRIE), and plasma etching.

[0068] Since pretreatment of the glass substrate (10) is performed through the laser pretreatment module (200), when the glass substrate (10) is removed by an etching process through the hole formation module (300), the reactivity is improved, and it becomes possible to form a hole of a target size in a target area. In addition, it becomes possible to widen the hole to a desired size and diameter. That is, through pretreatment, the shape of the crack, i.e., size and depth, is controlled in advance, and by etching this area, it becomes possible to form a target micro-hole and form a very precise micro-structure. In other words, since the etching process removes the glass along the micro-cracks, a hole shape with a deep and precise structure can be formed.

[0069] Through this, the effects of heat can be minimized to prevent thermal damage to the glass substrate (10) and to minimize the occurrence of cracks. In addition, it is possible to prevent the irregular removal of the upper and lower surfaces of the glass substrate (10) during the etching process.

[0070] It is effective for the via module (400) to include various device configurations that form a micro via pattern by filling the inside of the micro via hole of the glass substrate (10) formed by the hole forming module (300) with a metal material.

[0071] It is preferable for the via module (400) to fill the inside of the micro via hole with metal through a plating process or a paste application process, and to form the micro via hole through surface flattening. At this time, electroplating or electroless plating may be performed as the plating process, and the paste may include a process of applying a metallic material. In addition, it is preferable to perform a CMP process for surface flattening.

[0072] As described above, in the first embodiment, by checking in real time whether the Bessel beam is oscillating through the oscillation detection unit (50), it is possible to determine in which section the Bessel beam is not emitted, thereby enabling the identification of the laser loss area and allowing for a response to be taken.

[0073] The present invention is not limited thereto and various modifications are possible. Hereinafter, a glass substrate micro-hole processing system using a laser according to a modified example of the first embodiment of the present invention is described with reference to the drawings. The technology described below is applicable to the above-described embodiment. Furthermore, descriptions that overlap with the above-described embodiment are omitted in the following description.

[0074]

[0075] FIG. 3 is a block diagram illustrating a laser pretreatment module according to a first variation of the first embodiment of the present invention.

[0076] As illustrated in FIG. 3, the laser preprocessing module (500) according to the first variant includes a laser alignment unit (510) for aligning a loaded glass substrate (10), a laser generation unit (520) for generating a laser, a Bessel beam generation unit (530) for converting a laser beam into a Bessel beam, a beam irradiation unit (540) for irradiating a Bessel beam to a processing area of ​​the glass substrate (10), and an oscillation detection unit (550) for detecting a Bessel beam penetrating the glass substrate (10).

[0077] In this first modified example, it is effective to position the oscillation detection unit (550) on the lower surface of the glass substrate (10) and to sense the beam that penetrates the glass substrate (10).

[0078] To this end, it is effective for the oscillation detection unit (550) to be positioned at a lower corresponding position of the beam irradiation unit (540). Through this, it is possible to confirm whether the Bessel beam is oscillated and whether the oscillated beam has reached the glass substrate (10).

[0079] In the preceding embodiment, the oscillation detection unit (550) is located in the beam irradiation unit (540) area to check the energy of the irradiated beam and thus confirm whether oscillation is occurring. However, there may be cases where the oscillated beam cannot be irradiated onto the glass substrate (10) due to the influence of the surrounding environment. That is, the oscillated Bessel beam may not reach the processing area of ​​the glass substrate due to reasons beyond the surrounding environment, such as substrate contamination or obstacles.

[0080] In the first variation, the beam irradiation unit (540) of the laser pretreatment module (500) is positioned on the upper surface of the organic substrate (10), and the oscillation detection unit (550) is positioned on the lower surface of the glass substrate (10), so that it is possible to check whether the oscillated beam has accurately reached the processing area of ​​the glass substrate (10).

[0081] For the oscillation detection unit (550), it is effective to use a light energy detection device to check whether a Bessel beam is oscillating. To do this, a detection device capable of light detection can be used, such as a beam profiler, photodiode, photomultiplier tube (PMT), thermocouple, pyroelectric sensor, blotometer, and CCD camera, or a battery panel that generates electricity using a light source can be used. When using a battery panel, it is effective to detect that a microcurrent flows due to light.

[0082]

[0083] FIG. 4 is a block diagram illustrating a laser pretreatment module according to a second variation of the first embodiment of the present invention.

[0084] FIG. 5 is a block diagram illustrating a dummy detection unit according to a second modified example.

[0085] As illustrated in FIGS. 4 and 5, the laser preprocessing module (600) according to the second variant includes a laser alignment unit (610) that aligns a loaded glass substrate (10), a laser generation unit (620) that generates a laser, a Bessel beam generation unit (630) that converts a laser beam into a Bessel beam, a beam irradiation unit (640) located on the upper surface of the glass substrate that irradiates a Bessel beam to a processing area of ​​the glass substrate (10), and a dummy detection unit (650) located on the lower surface of the glass substrate whose characteristics are changed by light.

[0086] In the second modified example, a dummy detection unit (650) is positioned on the lower surface of the glass substrate (10), and after laser pretreatment, the dummy detection unit (650) is inspected to identify the location where laser loss occurred. Through this, the area where loss occurred can be additionally and quickly reprocessed to reduce the defect rate.

[0087] This means that when light is irradiated onto the processing area of ​​the glass substrate, the Bessel beam is not only irradiated onto the glass substrate area corresponding to the depth of focus, but also passes through the transparent glass substrate (10) and is irradiated onto the area below it. In the second modified example, this is used to place a film or sheet whose properties change due to light on the area below the glass substrate, and after the pre-processing process by the Bessel beam, it is possible to quickly inspect it to identify the area where loss has occurred.

[0088] To this end, it is effective for the dummy detection unit (650) to include a dummy part (651) whose characteristics change due to light, a vision unit (652) that performs vision inspection on the dummy part (651), and an artificial intelligence judgment unit (653) that determines the light loss area using the vision inspection results. At this time, the vision unit (52) and the artificial intelligence judgment unit (653) may be installed on the outside of the module. Through this, after performing initial laser preprocessing, it becomes possible to quickly extract only the dummy part (651), recognize it through the vision unit (652) and the artificial intelligence judgment unit (653), and provide the result back to the laser preprocessing module (600) to perform re-inspection on the loss area, that is, the area where light loss occurred.

[0089] Here, it is preferable to use various films or sheets whose properties change due to light as the dummy part (651). It is preferable to position this film or sheet below the glass substrate. In this modified example, it is preferable to use photosensitive paper, photochromic film, photocurable resin sheet, photocatalytic sheet, photosensitive resist sheet, and photosensitive polyimide sheet as the dummy part.

[0090] In the following, a processing method using a glass substrate processing system using a laser according to the first embodiment described above is explained.

[0091]

[0092] FIG. 6 is a flowchart illustrating a method for processing a glass substrate using a laser according to a first embodiment of the present invention.

[0093] FIGS. 7 to 10 are conceptual diagrams for explaining a glass substrate processing method according to a first embodiment.

[0094] As shown in FIGS. 6 to 10, a glass substrate (10) is loaded using a loading module (100) (S110).

[0095] A Bessel beam is irradiated onto the processing area of ​​the loaded glass substrate (10) using the laser pretreatment module (200) (S120).

[0096] As previously explained, the laser of the laser generating unit (220) is converted into a Bessel beam through the Bessel beam generating unit (320), and the Bessel beam is irradiated onto the surface of the glass substrate through the beam irradiation unit (240).

[0097] At this time, it is preferable to irradiate the processing area of ​​the glass substrate (10) with a laser through a single shot.

[0098] It is not limited to this, and it is effective to irradiate the processing area of ​​the glass substrate (10) with a laser through a double shot. This involves adjusting the depth to perform irradiation on the lower part of the glass substrate (10) first, and then performing irradiation on the upper part of the glass substrate (10) second.

[0099] For example, by adjusting the depth and spot size of the laser of the laser pretreatment module (200), when the thickness of the glass substrate (10) is 100, it is effective to perform a first irradiation on the lower 50% and a second irradiation on the upper 50%. Of course, this is not limited to this, and the direction can be freely adjusted.

[0100] In this way, through double shot, shape errors caused by mis-pulses, that is, beam loss, can be reduced and straightness improved, and shape distortion caused by contaminants such as debris can be reduced.

[0101] A laser loss section is identified through the oscillation detection unit (250) of the laser preprocessing module (200), and if there is a loss section, an additional Bessel beam is irradiated onto the loss section (S130).

[0102] In this example, the light energy irradiated by the beam irradiation unit (240) is detected in real time by the oscillation detection unit (250), and additional beams are irradiated in the section where the beam was not irradiated, i.e., the section where the beam was lost, thereby preventing defects caused by beam loss.

[0103] Etching is performed on the glass substrate (10) to remove the laser-treated area of ​​the glass substrate and form a microhole (20) (S140).

[0104] Micro via holes are formed by filling the micro-hole region of the glass substrate (10) with metal (S150).

[0105] In addition, as in the previous variation, the laser loss section can be checked at the Bessel beam generating unit (230) or at the bottom of the glass substrate (10).

[0106] The following describes a laser defect inspection method according to the first embodiment described above.

[0107]

[0108] FIG. 11 is a flowchart illustrating a laser defect inspection method according to a first embodiment of the present invention.

[0109] As shown in Fig. 11, a dummy portion is placed on the lower part of a glass substrate whose characteristics change according to light irradiation (S210).

[0110] A laser generated through the laser pretreatment module is irradiated onto the processing area of ​​the glass substrate (S220). At this time, the surface characteristics of the dummy part located at the bottom of the glass substrate are also changed by the laser penetrating the glass substrate.

[0111] The dummy part is recovered, and the area in the dummy part whose characteristics have changed is detected through the vision unit (S230).

[0112] Compare the detected results with the target information to determine whether they match.

[0113] It is effective for the target information to be laser irradiation data related to the processing area pattern of the glass substrate. This information is used to determine the laser irradiation and can also serve as a reference value for the aforementioned result comparison. Since the processing area pattern of the glass substrate consists of a repeating structure, analyzing it using AI technology after vision is more efficient than direct human judgment.

[0114] In areas where the judgment result does not match, it is determined that a defect caused by laser loss has occurred (S240).

[0115] This allows for additional laser irradiation of the area where the defect occurred.

[0116] The present invention is not limited thereto and various embodiments are possible. Hereinafter, a glass substrate micro-hole processing system using a laser according to a second embodiment of the present invention will be described with reference to the drawings. The technology described below is applicable to the embodiments described above. Furthermore, descriptions that overlap with the embodiments described above will be omitted.

[0117]

[0118] FIG. 12 is a conceptual diagram illustrating a glass substrate processing system using a laser according to a second embodiment of the present invention.

[0119] FIG. 13 is a block diagram illustrating a laser pretreatment module according to a second embodiment.

[0120] FIG. 14 is a block diagram illustrating a micro-hole verification module according to a second embodiment.

[0121] As illustrated in FIGS. 12 to 14, a glass substrate processing system using a laser according to a second embodiment includes a loading module (1100) for loading a glass substrate (10) into the system, a laser pretreatment module (1200) for performing pretreatment by laser irradiation on a glass substrate area to be formed with a hole, a hole forming module (1300) for controlling a pretreated glass substrate area to form a hole in the glass substrate (10), a microhole verification module (1400) for determining whether the microhole formed through the hole forming module (1300) has penetrated, and a via module (1500) for forming a microvia by filling the inside of the hole with a metallic material.

[0122] The loading module (1100) is effective for loading and unloading the glass substrate (10) into the system.

[0123] The laser preprocessing module (1200) includes a laser alignment unit (1210) for aligning a loaded organic substrate (10), a laser generation unit (1220) for generating a laser, a Bessel beam generation unit (1230) for converting a laser beam into a Bessel beam, and a beam irradiation unit (1240) for irradiating a Bessel beam to a processing area of ​​a glass substrate (10).

[0124] The laser alignment unit (1210) ensures that the glass substrate (10) loaded through the loading module (1100) is accurately aligned to the alignment position. At this time, if the alignment position is misaligned or the alignment is incorrect, a problem arises in which a hole is not formed in the desired area of ​​the glass substrate (10). At this time, it is desirable for the laser alignment unit (1210) to be equipped with a separate alignment mark or alignment means, a vision system or a sensing system, and to ensure that the glass substrate is accurately aligned on the stage based on this.

[0125] It is effective for the laser generating unit (1220) to use various laser sources capable of pre-processing the glass substrate (10). Through the laser generating unit (1220), a phase transition and a nanopore structure are formed using a laser, rather than a hole processing of the glass substrate (10). This enables isotropic processing during etching and allows for the provision of selectivity by shape, thereby enabling selective etching.

[0126] The Bessel beam generating unit (1230) effectively generates a Bessel beam by utilizing an axicon lens and a focusing lens. Through the Bessel beam, strong energy concentration is maintained without diffraction within a transparent glass substrate; that is, by adjusting the depth of focus, it is possible to process micro-holes with a vertical profile. In particular, it is possible to form micro-holes with a high aspect ratio by controlling the beam shape.

[0127] The beam irradiation unit (1240) irradiates the beam generated through the Bessel beam generation unit (1230) onto the processing area of ​​the glass substrate (10). It is effective for the beam irradiation unit (1240) to steer the generated beam, finally adjust the focus of the beam, and then irradiate it onto the processing area of ​​the glass substrate (10).

[0128] Through the beam irradiation unit (1240), the Bessel beam is positioned so that the focal depth of the Bessel beam is located in the processing area of ​​the organic substrate (10), thereby enabling a phase change for accurate hole formation.

[0129] The hole forming module (1300) is effective in forming a micro hole in the glass substrate (10) by performing an etching process on the glass substrate (10).

[0130] It is effective for the hole forming module (1300) to be equipped with various configurations and devices depending on the etching process used. It may vary depending on whether a wet process or a dry process is performed as the etching process.

[0131] Since pretreatment of the glass substrate (10) is performed through the laser pretreatment module (1200), when the glass substrate (10) is removed by an etching process through the hole formation module (1300), the reactivity is improved, and it becomes possible to form a hole of a target size in a target area. In addition, it becomes possible to widen the hole to a desired size and diameter. That is, through pretreatment, the shape of the crack, i.e., size and depth, is controlled in advance, and by etching this area, it becomes possible to form a target micro-hole and form a very precise micro-structure. In other words, since the etching process removes the glass along the micro-cracks, a hole shape with a deep and precise structure can be formed.

[0132] Through this, the effects of heat can be minimized to prevent thermal damage to the glass substrate (10) and to minimize the occurrence of cracks. In addition, it is possible to prevent the irregular removal of the upper and lower surfaces of the glass substrate during the etching process.

[0133] The micro-hole verification module (1400) includes a chamber section (1410) that separates the upper and lower surfaces of the glass substrate (10) into separate spaces according to the loading of the glass substrate (10), a verification medium management section (1420) that injects different verification media into the two separated spaces, a pressure difference generating section (1430) that generates a pressure difference between the two spaces into which the verification media is injected, and a hole inspection section (1440) that inspects for penetration defects of the micro-holes in the glass substrate (10) using the verification media pushed out to the other side of the glass substrate by the pressure difference.

[0134] It is effective for the chamber section (1410) to include a chamber structure in which a glass substrate (10) is loaded and which can be sealed or vacuumed. It is effective for the chamber section (1410) to have a structure capable of loading glass substrates (10) of various sizes and shapes. The chamber section (1410) can have a structure that separates into an upper space and a lower space through the loading of the glass substrate (10). Of course, it is not limited to this, and it is effective to provide a separate space separation section to form the upper space and the lower space of the glass substrate (10) after the glass substrate (10) is loaded. Through this, it becomes possible to separate the upper space and the lower space of the glass substrate (10) from each other in a sealed state.

[0135] It is effective for the verification medium management unit (1420) to inject different verification media into the upper surface space and the lower surface space of the glass substrate (10). In this example, it is effective to inject a liquid for inspection into the upper surface space of the glass substrate (10) and a gas for liquid verification into the lower surface space. It is effective for the verification medium management unit (1420) to include a liquid injection unit for injecting liquid into the upper surface space of the sealed glass substrate (10), a gas injection unit for injecting gas into the lower surface space of the glass substrate, and an exhaust unit for discharging the liquid and gas after inspection.

[0136] The pressure difference generating unit (1430) is effective in creating a pressure difference between the upper surface space and the lower surface space of the glass substrate (10). Through this, the inspection liquid located in the upper surface space of the glass substrate is pushed out into the lower surface space of the glass substrate (10) through the micro-hole formed in the glass substrate (10).

[0137] That is, a hole with a diameter of several µm to several tens of µm and a high aspect ratio is formed in the glass substrate (10). Therefore, when the pressure in the upper space and the lower space is the same within the error range, no liquid flow occurs. However, when a pressure difference is applied, the liquid moves due to the pressure difference, and the liquid is exposed in the space on the opposite side. The inspection liquid flows out along the micro-hole, and since the space on the opposite side is a space with gas, it appears in a spherical shape due to the surface tension of the liquid.

[0138] At this time, the inspection liquid pushed out through the hole inspection unit (1440) can be checked using vision to see if the hole is formed in the correct position.

[0139] If there is a section where no hole is formed, the glass substrate (10) can be pretreated through a laser pretreatment module (1200), and additional holes can be formed through a hole formation module (1300) to prevent defects.

[0140] In this way, it is preferable to form a via by forming a metal layer through the via module (500) on a glass substrate (10) that is free of defects through the micro-hole verification module (1400).

[0141] Here, the microhole verification module (1400) is manufactured in the form of a separate inspection device to effectively inspect whether microholes are formed in the glass substrate.

[0142] The present invention is not limited thereto and various modifications are possible. Hereinafter, a glass substrate micro-hole processing system using a laser according to a modified example of the second embodiment of the present invention is described with reference to the drawings. The technology described below is applicable to the above-described embodiment. Furthermore, descriptions that overlap with the above-described embodiment are omitted in the following description.

[0143]

[0144] FIG. 15 is a conceptual diagram for explaining a microhole verification module according to a first variation of the second embodiment.

[0145] As illustrated in FIG. 15, the microhole verification module (1600) according to the first variant is effectively mounted in-line within a laser-based glass substrate processing system having a loading module (1100), a laser pretreatment module (1200), a hole forming module (1300), and a via module (1500).

[0146] It is preferable that the microhole verification module (1600) be positioned in an inline manner between the hole forming module (1300) and the via module (1500).

[0147] To this end, the micro-hole verification module (1600) includes a space separation unit (1610) that seals and separates the upper surface space and the lower surface space of the glass substrate (10), an inspection management unit (1620) that sprays an inspection gas into one of the two spaces of the glass substrate (10) separated by the space separation unit (1610), and a hole inspection unit (1630) that inspects for penetration defects of the micro-holes of the glass substrate (10) through the gas sprayed into the other space of the glass substrate (10).

[0148] In this modified example, since it is located within an inline system, it is effective to separate the upper and lower surfaces of the glass substrate (10) through a separate space separation unit (1610). At this time, it is effective to seal the upper surface space and the lower surface space through the space separation unit (1610).

[0149] Then, through the inspection management unit (1620), an inspection gas is ejected into one of the two spaces, and due to the pressure of the gas, the inspection gas is ejected into the other space of the glass substrate (10). At this time, by detecting the inspection gas ejected into the other space of the glass substrate (10) through the hole inspection unit (1630), it becomes possible to inspect whether the micro-hole of the glass substrate (1630) has been penetrated.

[0150] In this way, since the inspection is performed using a separate space separation unit (1610) and gas, it is possible to perform micro-hole inspection in-line without installing equipment such as a separate chamber that uses liquid as in the previous embodiment.

[0151] In the following, a processing method using a glass substrate processing system using a laser according to the second embodiment described above is explained.

[0152]

[0153] FIG. 16 is a flowchart illustrating a method for processing a glass substrate using a laser according to a second embodiment of the present invention.

[0154] FIGS. 17 to 22 are conceptual diagrams for explaining a glass substrate processing method according to a first embodiment.

[0155] As illustrated in FIGS. 16 to 22, a glass substrate (10) is loaded using a loading module (1100) (S310).

[0156] A Bessel beam is irradiated onto the processing area of ​​the loaded glass substrate (10) using the laser pretreatment module (1200) (S320).

[0157] Etching is performed on the glass substrate (10) to remove the laser-treated area of ​​the glass substrate (10) and form a microhole (20) (S330).

[0158] The upper and lower surfaces of the glass substrate (10) having micro-holes (20) formed therein are sealed into separate spaces (S340).

[0159] Injecting an inspection medium into at least one of the two enclosed spaces and inspecting the inspection medium exposed to the other space to check for defects in the micro-hole (20) (S350).

[0160] If a defect is found as a result of the defect inspection, additional laser pretreatment and etching are performed, and if no defect is found, the micro-hole area of ​​the glass substrate is filled with metal to form a micro via hole (S360).

[0161] The following describes a laser defect inspection method according to the second embodiment described above.

[0162]

[0163] FIG. 23 is a flowchart illustrating a laser defect inspection method according to a second embodiment of the present invention.

[0164] As shown in FIG. 23, a laser is irradiated onto a glass substrate (10) and etched to form microholes (S410).

[0165] At this time, a phase transition is performed on the glass substrate in the area where the microhole is to be formed through laser pretreatment, and then, etching is performed to remove the glass substrate in the phase-changed area to form the microhole.

[0166] The upper surface space and the lower surface space of the glass substrate are each separated and sealed (S420).

[0167] A verification medium is injected into one of the two separated spaces, and the verification medium is ejected into the other space through a microhole due to a pressure difference (S430).

[0168] It is effective to describe the upper surface space of the glass substrate as a single space and use a liquid as a verification medium. Through this, it is effective to fill the upper surface space of the glass substrate with liquid and apply a pressure change to cause the liquid to move to the lower surface space of the glass substrate.

[0169] Of course, this is not limited to this, and it is also possible to fill the space with liquid and move the liquid to the upper surface space.

[0170]

[0171] Of course, this is not limited to this; it is possible to inject gas as a verification medium into the upper surface space of a glass substrate, cause the gas to eject into the space along the micro-holes of the glass substrate, and inspect this ejection.

[0172] Using inspection equipment, the location of the ejected verification medium is identified to confirm the unpenetrated micro-hole area.

[0173] If there is a micro-hole area that is not penetrated, it is determined that the laser pretreatment for that area is defective (S440).

[0174] Although the technical concept of the present invention described above has been specifically described in preferred embodiments, it should be noted that the aforementioned embodiments are for illustrative purposes only and are not intended to be limiting. Furthermore, a person skilled in the art will understand that various embodiments are possible within the scope of the technical concept of the present invention.

[0175]

[0176] **Explanation of Drawing Symbols**

[0177] 100, 1100: Loading module section

[0178] 200, 500, 600, 1200: Laser pretreatment module

[0179] 210, 510, 610, 1210: Laser alignment unit

[0180] 220, 520, 620, 1220: Laser generator

[0181] 230, 530, 630, 1230: Bessel beam generator

[0182] 240, 540, 640, 1240: Beam irradiation unit 250, 550: Oscillation detection unit

[0183] 300, 1300: Hole forming module

[0184] 400, 1500: Via module

[0185] 650: Dummy detection unit

[0186] 1400, 1600: Micro-hole verification module

[0187] 1410: Chamber section

[0188] 1420: Verification Media Management Department

[0189] 1430: Pressure difference generating unit

[0190] 1440, 1630: Hall Inspection Department

[0191] 1610: Space Separator

[0192] 1620: Inspection Management Department

Claims

1. A loading module for loading a glass substrate into the system; A laser pretreatment module that performs pretreatment by laser irradiation on a glass substrate area where a hole is to be formed and has a laser defect inspection function; A hole forming module that controls a pre-processed glass substrate area to form a hole in the glass substrate; and A glass substrate processing system using a laser, characterized by including a via module that forms a microvia by filling the inside of a hole with a metallic material.

2. In Paragraph 1, A glass substrate processing system using a laser, characterized in that the above-mentioned laser preprocessing module comprises a laser alignment unit for aligning a loaded glass substrate, a laser generation unit for generating a laser, a Bessel beam generation unit for converting a laser beam into a Bessel beam, a beam irradiation unit for irradiating a Bessel beam to a processing area of ​​a glass substrate, and an oscillation detection unit for detecting whether the irradiated beam is oscillating.

3. In Paragraph 2, A glass substrate processing system using a laser, characterized in that the above-mentioned oscillation detection unit is installed in at least one of a beam irradiation section where a Bessel beam is irradiated onto a glass substrate, a Bessel beam generation section, and a laser generation section, or detects a Bessel beam penetrating a glass substrate.

4. In Paragraph 1, A laser-based glass substrate processing system characterized by comprising: a laser preprocessing module that aligns a loaded glass substrate, a laser generating unit that generates a laser, a Bessel beam generating unit that converts a laser beam into a Bessel beam, a beam irradiation unit located on the upper surface of the glass substrate that irradiates a Bessel beam to a processing area of ​​the glass substrate, and a dummy detection unit located on the lower surface of the glass substrate whose characteristics are changed by light.

5. A loading module for loading a glass substrate into the system; A laser pretreatment module that performs pretreatment by laser irradiation on a glass substrate area where a hole is to be formed; A hole forming module that controls a pre-processed glass substrate area to form a hole in the glass substrate; A microhole verification module that determines whether the microhole formed through the hole forming module has penetrated; and A glass substrate processing system using a laser, characterized by including a via module that forms a microvia by filling the inside of a hole with a metallic material.

6. In Paragraph 5, A glass substrate processing system using a laser, characterized in that the above-mentioned micro-hole verification module comprises a space separation unit that seals and separates the upper surface space and the lower surface space of a glass substrate, an inspection management unit that sprays a verification medium containing liquid and / or gas into one of the two spaces of the glass substrate separated by the space separation unit, and a hole inspection unit that inspects for penetration defects of micro-holes in the glass substrate through the verification medium sprayed into the other space of the glass substrate.

7. A processing method using a laser-based glass substrate processing system, A step of loading a glass substrate using a loading module; A step of irradiating a Bessel beam onto a processing area of ​​a loaded glass substrate using a laser pretreatment module; A step of identifying a laser loss section through an oscillation detection unit of a laser preprocessing module, and if a loss section exists, irradiating an additional Bessel beam onto the loss section; A step of forming microholes by performing etching on the glass substrate to remove the treated area of ​​the laser-treated glass substrate; and A method for processing a glass substrate using a laser, comprising the step of forming a micro via hole by filling a micro hole region of the glass substrate with metal.

8. A laser defect inspection method using a laser-based glass substrate processing system, A step of forming microholes by irradiating a glass substrate with a laser through laser pretreatment and etching; A step of separating and sealing the upper surface space and the lower surface space of the glass substrate; Steps for injecting a verification medium into at least one of two separated spaces and applying a pressure difference; and A laser defect inspection method comprising the step of using inspection equipment to confirm that a verification medium is ejected into another space due to a pressure difference, and determining that the area where it is not ejected is an area where micro-holes are not formed as a laser pretreatment defect.

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