Method for microfabrication of glass substrate

Abstract

The present invention relates to a method for microfabrication of a glass substrate, and provides a method for microfabrication of a glass substrate, the method being characterized by comprising: a step for preparing a glass substrate; a step for forming a micro-hole penetrating the glass substrate through a laser treatment and an etching process; and a step for performing operations for adjusting the thickness and improving the surface of the glass substrate having the micro-hole formed therein.

Description

Glass substrate microfabrication method

[0001] The present invention relates to a micro-processing method for a glass substrate, and provides a micro-processing method for a glass substrate that can be utilized in advanced circuit boards by enabling the formation of ultra-fine holes and the adjustment of roughness and precise thickness for the fabrication of conductors and sensors.

[0002] Various substrates are used for the fabrication of electronic devices, such as semiconductor and sensor devices. Among these, silicon substrates enable the realization of high-performance, high-density devices but require complex processes and expensive equipment, while PCB substrates allow for large-area mass production at low manufacturing costs but have disadvantages such as poor durability, thermal management issues, and signal loss.

[0003] Recently, interest in glass substrates has been increasing as advanced semiconductor devices and sensors require substrates capable of large-area, high-precision processing. In other words, glass substrates enable the fabrication of large-area substrates and possess advantages such as excellent electrical properties that are favorable for high-frequency signal processing, superior mechanical durability, and thermal management.

[0004] However, while connections between multilayer circuits are essential for fabricating advanced devices using glass substrates, glass substrates have the disadvantage of being difficult to process.

[0005] Recently, research and development to form ultra-precision micro-holes for electrical connection between the top and bottom of a glass substrate is actively underway. This is commonly referred to as TGV (Through Glass Via), and efforts are being made to form ultra-precision micro-holes through various processes and methods.

[0006] Various technologies are being applied as processing methods to form ultrafine holes in glass substrates. For example, although attempts are being made to create micro-holes in glass substrates through mechanical processing, problems have arisen where smooth micro-hole formation is not possible due to cracking issues during processing and cleaning problems within the holes.

[0007] The present invention has been devised to solve these problems and provides a glass substrate micro-processing method that forms ultra-fine holes through laser processing and etching, allows the thickness of the micro-holes to be freely changed, and can form the flatness and flatness of the glass substrate consistently.

[0008] The present invention provides a method for micro-processing a glass substrate, characterized by comprising the steps of preparing a glass substrate according to the present invention, forming a microhole penetrating the glass substrate through laser treatment and etching processes, and performing thickness control and surface improvement work on the glass substrate having the microhole formed.

[0009] The step of forming the microhole comprises: performing laser pretreatment on a microhole formation area of ​​the glass substrate; forming a surface protective coating film on the upper and lower surfaces of the laser-pretreated glass substrate; using a laser to remove the surface protective coating film above the area where the microhole is to be formed to expose the upper and lower surfaces of the glass substrate; removing the exposed glass substrate area to form the microhole; and removing the surface protective coating film remaining on the glass substrate.

[0010] The above laser pretreatment uses a femtosecond laser, a picosecond laser, or a nanosecond laser, and irradiates the upper and lower surfaces of a glass substrate with a laser, and the surface protective coating film uses a polyimide-based material, a polymer-based material, a polyurethane-based material, an enamel-based material, an epoxy-based material, a photoresist-based material, or a wax-based material, and is formed through a spin coating, spray coating, brush application, or dipping process, or is coated as a film type, and when the maximum diameter of the microhole is 100, the diameter of the surface protective coating film to be removed is 80 to 100.

[0011] The step of performing the thickness control and surface improvement work described above includes the step of filling the inside of the microhole with a filling material and the step of improving the thickness and surface of the glass substrate through glass substrate surface treatment, wherein the glass substrate surface treatment is characterized by immersing the glass substrate in a substrate etching solution or performing a dry etching process.

[0012] The filling step is characterized by immersing the glass substrate in a filling material, then removing the filling material from the upper and lower surfaces of the glass substrate to fill the microhole area with the filling material, and using enamel, polymer, epoxy resin, wax, or paste as the filling material.

[0013] In addition, the present invention provides a method for micro-processing a glass substrate, characterized by comprising the steps of: preparing a glass substrate according to the present invention; improving the thickness and surface of the glass substrate; forming a surface protection layer on the upper and lower surfaces of the glass substrate; forming an etching barrier layer on the surface protection layer on the upper surface of the glass substrate; removing the etching barrier layer and the surface protection layer in the area where a microhole is to be formed to expose the glass substrate; irradiating a laser onto the exposed glass substrate; removing the area of ​​the glass substrate irradiated by the laser to form a microhole; and removing the remaining etching barrier layer and the surface protection layer.

[0014] In addition, the glass substrate micro-processing system for micro-processing a glass substrate according to the present invention comprises: a loading module for loading a glass substrate; a laser processing module for performing laser processing on the loaded glass substrate; a coating film forming module for forming a surface protection coating film on the upper and lower surfaces of the laser-processed glass substrate; a coating film pattern module for removing a portion of the surface protection coating film; a hole forming module for removing the glass substrate from which the surface protection coating film has been removed to form a micro hole; a coating film removal module for removing the surface protection coating film on the upper and lower surfaces of the glass substrate in which the micro hole is formed; a hole filling module for filling the micro hole with a filler; a substrate surface treatment module for performing thickness and surface treatment of the glass substrate; and a filler removal module for removing the filler inside the micro hole.

[0015]

[0016] As such, the present invention allows the ultrafine hole formation process and the glass substrate surface treatment process to be performed separately, thereby avoiding affecting the ultrafine holes and improving the precision and reproducibility of the process.

[0017] In addition, the present invention can form ultrafine holes in a glass substrate through laser pretreatment and etching processes, and can minimize edge concentration around the micro-holes by forming a protective layer on top thereof, thereby improving the sharpness of the hole entrance and the straightness of the entire hole.

[0018] In addition, the present invention makes it possible to protect the inner side of the ultrafine hole and to achieve improved flatness and uniform flatness through thickness control and surface treatment of the glass substrate.

[0019] In addition, the protective layer within the micro-holes can be removed by cleaning with organic solvents to improve processability and avoid deformation of the hole size.

[0020]

[0021] FIG. 1 is a flowchart illustrating a method for micro-processing a glass substrate according to one embodiment of the present invention.

[0022] FIGS. 2 to 10 are flowcharts for explaining a method for microfabrication of a glass substrate according to one embodiment.

[0023] FIG. 11 is a flowchart illustrating a method for micro-processing a glass substrate according to another embodiment of the present invention.

[0024] FIGS. 12 to 17 are flowcharts illustrating a method for microfabrication of a glass substrate according to another embodiment.

[0025] FIG. 18 is a block diagram illustrating a glass substrate micro-processing system according to one embodiment of the present invention.

[0026]

[0027] Hereinafter, embodiments of the present invention will be described in more detail with reference to the attached drawings. However, the present invention is not limited to the embodiments disclosed below but may be implemented in various different forms; these embodiments are provided merely to ensure that the disclosure of the present invention is complete and to fully inform those skilled in the art of the scope of the invention. Identical reference numerals in the drawings refer to identical elements.

[0028] It is intended to clarify that the classification of components in this specification is merely based on the primary function each component is responsible for. That is, two or more components described below may be combined into a single component, or a single component may be divided into two or more components based on more subdivided functions. Furthermore, each component described below may additionally perform some or all of the functions performed by other components in addition to its own primary function, and it is obvious that some of the primary functions performed by each component may be exclusively performed by other components. Therefore, the existence of each component described in this specification should be interpreted functionally. For this reason, it is clearly stated that the configuration of the components of the glass substrate microfabrication method of the present invention may vary to the extent that the objective of the present invention can be achieved.

[0029] In this specification, relational terms such as first and second, upper and lower, etc., may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying an actual relationship or order between such entities or actions. The terms “comprises,” “comprising,” or other variations thereof are intended to cover non-exclusive inclusions so that a process, method, product, or device comprising a list of components may not include only the component but may include other components not explicitly enumerated or inherent in such process, method, product, or device. A component proceeding to “comprising” excludes, without further limitation, the presence of additional identical components within the process, method, product, or device comprising the component.

[0030]

[0031] FIG. 1 is a flowchart illustrating a method for micro-processing a glass substrate according to one embodiment of the present invention.

[0032] FIGS. 2 to 10 are flowcharts for explaining a method for microfabrication of a glass substrate according to one embodiment.

[0033] First, as illustrated in FIG. 1, a glass substrate (100) is prepared for micro-processing of a glass substrate according to the present embodiment (S110) and mounted on a processing machine. Then, a micro hole (120) penetrating the glass substrate (100) is processed in the prepared glass substrate (100) (S120). Then, a process is performed to process the thickness and surface roughness of the glass substrate (100) in which the micro hole (10) is formed (S130). Through this, it is possible to form a glass substrate (100) of a target thickness, with not only ultra-fine holes but also a consistent flatness and flatness.

[0034] When forming micro-holes in a glass substrate using a conventional laser drilling method, one can avoid cracking issues similar to those in conventional mechanical processing; however, there are limitations to ultra-fine precision machining due to the disadvantage of surface burrs caused by heat. Furthermore, the laser drilling process does not allow for surface treatment of the glass substrate, and separate surface treatment processes can cause deformities in the internal diameter or shape of the processed holes.

[0035] Accordingly, in this embodiment, micro-processing of a glass substrate can be performed by introducing new technologies and processes to resolve these issues. Below, the micro-processing of the glass substrate according to the present invention is described based on an additional process flow diagram.

[0036] As shown in FIGS. 1 and 2, a glass substrate (100) for micro-processing is prepared. At this time, it is also possible to perform a surface cleaning operation on the glass substrate (100). Through this, it is possible to remove contaminants, organic matter, or particles from the surface of the glass substrate. This can optimize the surface characteristics of the glass substrate and increase high quality and efficiency in the subsequent laser process.

[0037] As shown in FIGS. 1 and FIGS. 3 to 6, a micro hole (120) is formed in a glass substrate (100).

[0038] First, as shown in FIG. 3, laser pretreatment is performed on the glass substrate area where micro-holes are to be formed. Through this, it is possible to form micro-cracks and voids in the glass substrate area where micro-holes are to be formed. Of course, it is possible to change the phase of the glass substrate area where micro-holes are to be formed.

[0039] In this embodiment, for such laser pretreatment, it is effective to perform pretreatment by irradiating a laser (200) onto the upper surface of a glass substrate (100) and the lower surface opposite it. At this time, for laser irradiation on the upper and lower surfaces of a single area, it is effective to form an alignment mark on one side of the glass substrate (100) for alignment. Through this, it becomes possible to irradiate the laser (200) onto the upper and lower surfaces of the same space.

[0040] Of course, this is not limited to this, and if lasers (200) are positioned above and below the glass substrate (100) and arranged so that the lasers (200) are aligned with each other, it is possible to irradiate the upper and lower surfaces of the same area by moving the substrate based on the lasers (200) positioned above and below to irradiate the lasers. In addition, at this time, it is also possible for the lasers (200) to be positioned vertically up and down or horizontally left and right.

[0041] For laser pretreatment, a femtosecond laser, a picosecond laser, or a nanosecond laser can be used. Of course, it is also possible to use multiple of these. At this time, laser irradiation can be performed once, or multiple lasers (200) can be irradiated into a single space in a short period of time. In addition, a multi-pulse irradiation method, that is, irradiating lasers of multiple wavelengths and outputs into a single space, is possible.

[0042] In this embodiment, since laser pretreatment is performed on a large-area glass substrate (100), the laser source unit can be moved to perform laser pretreatment while the glass substrate (100) is fixed. Furthermore, it is not limited to this, and it is also possible to perform laser pretreatment by using the glass substrate (100) while the laser source unit is fixed.

[0043] Next, as shown in FIG. 4, a surface protection coating film (110) is formed on the upper and lower surfaces of the glass substrate (100) that has undergone laser pretreatment. This makes it possible to protect the glass substrate area excluding the area where micro-holes are to be formed during subsequent processes. Additionally, it is possible to stabilize the glass substrate (100) due to the laser pretreatment process. Furthermore, it is possible to protect against damage caused by the movement of the glass substrate (100).

[0044] For the surface protection coating film (110), it is effective to use a polyimide-based material, a polymer-based material, a polyurethane-based material, an enamel-based material, an epoxy-based material, a photoresist-based material, or a wax-based material. It is effective to form such a surface protection coating film (110) through spin coating, spray coating, brush application, or dipping processes. Of course, it is not limited to these methods and can be formed through various coating methods. Also, as mentioned above, it is effective not to form the surface protection coating film (110) on the alignment mark formed on one or multiple sides of the glass substrate (100). This makes it possible to specify the area where a microhole is to be formed in the glass substrate (100) based on this alignment mark. To achieve this, it is possible to perform a process of forming the surface protection coating film (110) and removing the surface protection coating film (110) above the alignment mark area, or to apply a semi-coating material in which the surface protection coating film (110) is not coated on the alignment mark area of ​​the glass substrate (100) in advance. In addition, it is preferable to apply a material film with chemical properties different from those of the surface protection coating film (110) in advance on the alignment mark of the glass substrate (100) so that the alignment mark can be identified even when the surface protection coating film (110) is formed.

[0045] In addition, not limited thereto, it is also possible to form a surface protection coating film (110) in the form of a film and apply this film to the upper and lower surfaces of a glass substrate (100) to form a surface protection coating film (110).

[0046] Next, as shown in FIG. 5, the surface protection coating film (110) coated on the upper and lower parts of the glass substrate in the area where the micro-hole is to be formed is removed through laser irradiation.

[0047] At this time, it is effective for the area to be removed to be similar to the maximum diameter of the microhole (120) to be formed. That is, when the maximum diameter of the microhole (120) is set to 100, it is preferable that the diameter of the surface protection coating film (110) to be removed be 80 to 100. At this time, if it is larger than 100, there is a disadvantage that the glass substrate (100) in the space other than the microhole (120) is etched during the subsequent etching process, making it difficult to form the target microhole (120). Also, if it is smaller than 80, there is a disadvantage that the upper region is not expanded during the etching process, and various curved shapes may appear in the microhole (120). Therefore, it is effective to remove the surface protection coating film (110) with the above diameter to form the target microhole (120) in the subsequent process.

[0048] In this step, the laser (200b) may be a different laser (200) from the laser (200a) used for the previous glass substrate pretreatment.

[0049] This is because the previous laser (200a) affects the glass substrate (100), but the present laser (200b) does not affect the glass substrate (100) and only needs to remove a portion of the upper surface protection coating film (110). To achieve this, it is effective to use a laser (200) with a wavelength or pulse width that does not affect the glass substrate (100). That is, since the absorption characteristics of the glass substrate (100) and the surface protection coating film (110) are different, it is possible to distinguish the operating sections by using different wavelengths or pulse widths. For example, it is effective to use a wavelength of 355 nm to 1064 nm or a nanosecond laser. In addition, it is also possible to adjust the output of the irradiated laser. Through this, the removal speed of the surface protection coating film (110) removed by the laser (200) can be controlled so that only the surface protection coating film (110) is removed and the glass substrate (100) is not affected. In addition, it is possible to use a method that removes only the surface protective coating film (110) by adjusting the irradiation method. As for the irradiation method, it is effective to use a method that adjusts multiple pulse waves or the irradiation time.

[0050] Of course, it is also possible to use the same laser source used in the previous laser pretreatment step. In this case, as mentioned, by adjusting the laser output and irradiation method, it becomes possible to remove only the surface protective coating film (110) on the upper surface, rather than the glass substrate (100).

[0051] It is not limited to this, and it is possible to remove the surface protection coating film (110) on the upper and lower surfaces of the glass substrate where the microholes are to be formed through physical drilling, plasma etching, or chemical removal methods other than laser.

[0052] Next, as shown in FIG. 6, a micro-hole (120) is formed by removing the glass substrate area exposed by removing the surface protective coating film (110). It is effective to perform the removal of the glass substrate through etching.

[0053] In this example, it is effective to form a microhole (10) by removing the exposed glass substrate (100) by performing etching using an etching solution on a glass substrate (100) from which the surface protective coating film (110) of the area to be formed for the microhole is removed. It is effective to use hydrogen fluoride (HF), hydrochloric acid (HCl), potassium hydroxide (KOH), or nitric acid (HNO3) as the etching solution. Here, the removal speed and the area removed on the upper and lower surfaces of the glass substrate (100) can be controlled according to the etching time, the temperature of the solution, the concentration of the solution, and the reaction rate.

[0054] In this way, it is possible to form micro-holes (120) in the glass substrate (100) through etching and then remove the etching solution remaining inside the micro-holes (120) and on the surface protective coating film (110) through a cleaning process.

[0055] In addition, not limited to this, it is also possible to form micro-holes (10) in the glass substrate (100) by spraying an etching solution onto the upper and lower surfaces of the glass substrate (100) using a spray method.

[0056] The present invention is not limited to the wet etching described above, and it is possible to form a micro hole (120) by performing a dry etching process.

[0057] To achieve this, it is effective to remove the exposed glass substrate (100) by converting the aforementioned gaseous chemical into a plasma state. It is preferable to use a fluoride-based material as the gaseous chemical. Since this dry etching has superior straightness compared to wet etching, the profile of the microhole can be made to have a vertical profile. At this time, it is possible to use reactive ion etching (RIE), deep reactive ion etching (DRIE), and plasma etching.

[0058] Since laser pretreatment was performed in advance in the preceding step, when the glass substrate (100) is removed through the etching process, the reactivity is enhanced, and it becomes possible to form a hole of the target size in the target area. In addition, it becomes possible to widen the hole to the desired size and diameter. That is, through the pretreatment, the shape of the crack, i.e., the size and depth, is controlled in advance, and by etching this area, it becomes possible to form a target micro-hole (120) and to form a very precise micro-structure. In other words, since the etching process removes the glass along the micro-cracks, a hole shape with a deep and precise structure can be formed.

[0059] Through this, the effects of heat can be minimized to prevent thermal damage to the glass substrate (100) and to minimize the occurrence of cracks. In addition, it is possible to prevent the irregular removal of the upper and lower surfaces of the glass substrate (100) during the etching process. The surface protection coating film (110) protects the upper and lower surfaces of the glass substrate (100) to suppress unnecessary processing, reduce edge concentration phenomena that occur during hole processing, and improve the sharpness of the hole entrance and the straightness of the entire hole.

[0060] Chemicals and impurities used when making micro-holes (120) are removed through a cleaning process.

[0061] Afterwards, the surface protection coating film (110) formed on the upper and lower surfaces of the glass substrate (100) as shown in FIG. 7 is removed.

[0062] In this embodiment, the surface protection coating film (110) can be removed using a separate remover. Additionally, the surface protection coating film (110) on the upper and lower surfaces of the glass substrate can be removed using a film removal or thin film removal device.

[0063] At this time, it is possible to immerse the glass substrate in a separate removal solution to remove the remaining surface protection coating film (110), or to remove the surface protection coating film (110) through physical treatment.

[0064] As shown in FIG. 8, it is effective to fill the inside of the microhole (120) with a filler (130).

[0065] To achieve this, first, the entire glass substrate (100) is immersed in a separate filling material. Through this, a film of filling material is formed on the upper and lower surfaces of the glass substrate (100), and at the same time, the inside of the micro-hole (120) is filled with the filling material (130). Subsequently, the film of filling material on the upper and lower surfaces of the glass substrate (100) is removed so that the filling material is filled only inside the micro-hole (120), and the upper and lower surfaces of the glass substrate (100) are exposed. This is effective.

[0066] At this time, enamel, polymer, wax, or paste may be used as the filling material, and it is also possible to form it by applying it using an immersion method, pressure filling using a pressure difference, spin coating, or screen printing method.

[0067] In order for the filler material (130) to be filled inside the micro-hole (120) of the glass substrate (100), it is effective to adjust its viscosity and fluidity. This allows the filler material (130) to be sufficiently filled inside the micro-hole (120) while being formed thinly on the surface of the glass substrate (100). This enables the filler material (130) to function in preventing the shape or pattern of the micro-hole (120) from being deformed by a subsequent process. Here, it is effective to use a low-viscosity material as the filler material. That is, it is effective to use a polymer material with a viscosity of 0.1 to 100 cP or an epoxy resin with a viscosity of 100 to 1,000 cP. Of course, it is not limited to this, and as mentioned above, it is possible to perform surface coating by immersing the glass substrate (100) in a liquid material.

[0068] A film of filling material is formed on the upper and lower surfaces of a glass substrate (100), and a filling material (130) is filled into the micro-holes (120). Afterward, it is effective to remove the film of filling material on the upper and lower surfaces of the glass substrate (100) using an organic solvent. It is preferable to remove the film of filling material by spraying the organic solvent using a spray or washing method.

[0069] Of course, in addition to organic solvents, it is possible to remove the filling material film on the upper and lower surfaces of the glass substrate (100), excluding the filling material (130) filled inside the microhole (120), by irradiating a laser or through a mechanical grinding process.

[0070] As illustrated in FIG. 9, it is effective to improve the thickness and surface of the glass substrate (100) through chemical or physical surface treatment. At this time, since the micro-holes (120) are filled with a filler (130), they may not be affected by the surface treatment, so it is possible to make the glass substrate (100) have a desired thickness and desired flatness and flatness without changing the pattern or shape of the micro-holes (120).

[0071] To improve the surface, a glass substrate (100) filled with a filler (130) in micro-holes (120) is immersed in a substrate etching solution. It is effective to use hydrogen fluoride (HF), hydrochloric acid (HCl), potassium hydroxide (KOH), or nitric acid (HNO3) as the etching solution. Then, by controlling the immersion time in the solution, the temperature and concentration of the solution, and the reaction rate, the thickness of the glass substrate (100) can be freely controlled and the surface improvement can be performed.

[0072] It is possible to control the thickness of the glass substrate (100) and improve the surface through a dry etching process as well as the wet etching process described above. Of course, the thickness, surface flatness, and precision can also be controlled through a process such as CMP.

[0073] As shown in FIG. 10, the filling material (130) of the microhole (120) is removed to form the microhole (120), and a glass substrate (100) with improved thickness and surface is produced.

[0074] It is effective to remove the filler (130) remaining in the micro-holes (120) by immersing the glass substrate (100) in a cleaning solution such as an organic solvent.

[0075] In the example described above, it was explained that a surface protection coating film (110) is formed after laser treatment, and the surface protection coating film (110) is removed using a laser (200) and then the glass substrate (100) is etched. However, this is not limited thereto, and as another variation, it is possible to pattern and form an antimatter film of the surface protection coating film (110), that is, a material that interferes with the coating of the surface protection coating film (110), on the glass substrate (100) in the area where microholes are to be formed after laser treatment. In this way, when the surface protection coating film (110) is coated on the glass substrate (100), the surface protection coating film (110) is formed in the glass substrate area where the antimatter film is not formed, but the surface protection coating film (110) is not formed on the upper part of the area where the antimatter film is present, that is, the area where microholes are to be formed. Afterwards, if the antimatter film is removed through a cleaning process or a lift-off process, patterning of the surface protection coating film (110) can be performed without using a separate laser process.

[0076] The present invention is not limited to the description above and various modifications are possible. Below, a method for micro-processing a glass substrate according to another embodiment of the present invention is described with reference to the drawings. Descriptions that overlap with the above-described embodiment are omitted. Furthermore, the technology described below may be applied to the above-described embodiment.

[0077]

[0078] FIG. 11 is a flowchart illustrating a method for micro-processing a glass substrate according to another embodiment of the present invention.

[0079] FIGS. 12 to 17 are flowcharts illustrating a method for microfabrication of a glass substrate according to another embodiment.

[0080] As illustrated in the flowchart of FIG. 11, a glass substrate (300) is first prepared for micro-processing of a glass substrate according to the present example. First, a process for measuring the thickness and surface processing of the glass substrate (300) is performed. Afterward, a micro-hole (330) penetrating the glass substrate (300) is formed to produce a glass substrate (300) having a micro-penetrating hole.

[0081] A method for micro-processing such a glass substrate (300) is explained based on a flowchart.

[0082] First, a glass substrate (300) is prepared as shown in FIG. 12. Then, it is effective to improve the thickness and surface of the glass substrate (300) through surface treatment of the glass substrate. Through this, it is possible to make the glass substrate (300) to a target thickness and to have a target uniform flatness and flatness.

[0083] For surface treatment of the glass substrate (300), it is effective to immerse the glass substrate (300) in a substrate etching solution. At this time, by controlling the immersion time, process temperature, and reaction speed, it is possible to freely control the thickness of the glass substrate (300) and perform surface improvement.

[0084] Of course, in this example, it is possible to adjust the thickness, flatness, and precision by additionally performing a CMP process.

[0085] As shown in FIG. 13, a surface protection layer (310) is formed on the upper and lower surfaces of a glass substrate (300) with thickness and surface processing, and an etching barrier layer (320) is formed on the surface protection layer (310) on the upper surface of the glass substrate.

[0086] In FIG. 13, the etching barrier layer (320) is exemplarily described as being formed only on the surface protection layer (310) on the upper surface of the glass substrate, but the etching barrier layer (320) may also be formed on the surface protection layer (310) on the lower surface of the glass substrate.

[0087] In this example, it is effective to form a surface protection layer (310) by attaching a film-type surface protection layer (310) to the upper and lower surfaces of a glass substrate (300). It is also effective to form an etching barrier layer (320) on the surface protection layer (310) on the upper surface of the glass substrate (300) through a coating method.

[0088] When separating the surface protection layer (310) from the glass substrate (300) after the subsequent process, it is desirable to avoid affecting the surface of the glass substrate (300). To achieve this, it is effective to use a film-type surface protection layer (310). Additionally, it is effective for the film-type surface protection layer (310) to lose its adhesive strength when exposed to light. Through this, it is desirable to irradiate light onto the glass substrate (300) so that the surface protection layer (310) located on the upper and lower surfaces of the glass substrate (300) can be easily detached. Furthermore, the etching barrier layer (320) formed on the upper surface protection layer (310) can also be removed together with the surface protection layer (310), so that a separate removal process is not required, thereby simplifying the process.

[0089] Of course, not limited to the above description, it is also possible to form the surface protection layer (310) by a coating method.

[0090] As shown in FIG. 14, the surface protection layer (310) and the etching barrier layer (320) on the upper surface of the glass substrate in the area where the micro-hole (330) is to be formed are removed.

[0091] In this example, it is effective to simultaneously remove the surface protection layer (310) and the etching barrier layer (320) on the upper surface of the glass substrate (300) using a laser (400).

[0092] At this time, it is effective for the area to be removed to be similar to the maximum diameter of the microhole (330). That is, when the maximum diameter of the microhole (330) is 100, it is preferable that the diameter of the surface protection layer (310) and the etching barrier layer (320) to be removed be 80 to 100.

[0093] It is effective to use a laser (400) for removing the surface protection layer (310) and the etching barrier layer (320) without affecting the glass substrate (300), and to use various lasers for removing them. That is, it is effective to use a laser of a wavelength that does not affect the glass substrate (300), or to remove only the surface protection layer (310) and the etching barrier layer (320) by adjusting the irradiation method. For example, it is effective to use a wavelength of 355 nm to 1064 nm or a nanosecond laser.

[0094] Of course, this is not limited to this, and as a variation of the present embodiment, it is effective to use a photoresist layer as an etching barrier layer (320) on the surface protection layer (310).

[0095] That is, a surface protection layer (310) is formed, and then a photoresist is applied on top of it. At this time, a photoresist layer can be formed on a glass substrate (300) using various methods such as spin coating or slit coating. Afterwards, it is effective to place a mask that opens only the area where the microhole (330) is to be formed on the photoresist layer, and to irradiate light onto this mask to change the physical properties of the photoresist in the area where the microhole (330) is to be formed. Afterwards, it is desirable to cure the photoresist and remove the part with changed physical properties through an etching process. Here, it is also possible to irradiate light onto an area where the microhole (330) is not formed to change the physical properties of that part.

[0096] Afterwards, it is also possible to perform an etching process using a photoresist layer with the micro-hole (330) formation area removed as a mask to remove the surface protection layer (310) exposed underneath, thereby exposing the glass substrate (300) in the area where the micro-hole is to be formed.

[0097] As shown in FIG. 15, laser pretreatment is performed on the exposed glass substrate (300). This makes it possible to form micro-cracks in the glass substrate area where micro-holes (330) are to be formed.

[0098] For laser pretreatment, it is possible to use femtosecond lasers, picosecond lasers, or nanosecond lasers. Of course, it is also possible to use multiple of these. In this case, laser irradiation can be performed in a single step, or multiple lasers can be irradiated into a single space in a short period of time. In addition, a multi-pulse irradiation method is possible, that is, irradiating a single space with multiple wavelengths and powers.

[0099] As shown in FIG. 16, a glass substrate (300) that has undergone laser pretreatment is etched to form a micro hole (330).

[0100] In this example, it is effective to perform a dry etching process for etching a glass substrate. To do this, a glass substrate (300) is placed on the stage of a dry etching device. An etching gas is injected and plasma-ized. The plasma-ized etching gas is guided to the glass substrate to remove the exposed glass substrate and form a micro-hole.

[0101] At this time, the plasma-generated etching gas does not etch the lower structure in the area where the etching barrier layer (320) is located, and only removes the exposed glass substrate (300). Through this dry etching, the microhole (330) can have a vertical profile, and it is also possible to form holes with a large aspect ratio.

[0102] In addition, when etching continues, the occurrence of burrs or cracks in the entrance area of ​​the micro-hole (330) on the lower surface of the substrate can be prevented because it is protected by the lower surface protection layer (310).

[0103] As shown in FIG. 17, it is possible to produce a glass substrate (310) with a micro hole (330) formed by removing the surface protection layer (310) and the etching barrier layer (320) located on the upper surface of the glass substrate (310) after the micro hole (330) is formed, and removing the surface protection layer (310) on the lower surface of the glass substrate.

[0104]

[0105] Furthermore, the present invention is not limited to the description above and provides a system capable of performing micro-processing of a glass substrate as a continuous process. A glass substrate micro-processing system is described below. Descriptions that overlap with the embodiments described above are omitted. Additionally, the technology described below can be applied to the embodiments described above.

[0106] FIG. 18 is a block diagram illustrating a glass substrate micro-processing system according to one embodiment of the present invention.

[0107] As illustrated in FIG. 18, the glass substrate micro-processing system according to the present embodiment includes a loading module (1100) for loading a glass substrate, a laser processing module (1200) for performing laser processing on the loaded glass substrate, a coating film forming module (1300) for forming a surface protection coating film on the upper and lower surfaces of the laser-processed glass substrate, a coating film pattern module (1400) for removing a portion of the surface protection coating film, a hole forming module (1500) for removing the glass substrate from which the surface protection coating film has been removed to form a micro hole, a coating film removal module (1600) for removing the surface protection coating film on the upper and lower surfaces of the glass substrate in which the micro hole is formed, a hole filling module (1700) for filling the micro hole with a filler, a substrate surface treatment module (1800) for performing thickness and surface treatment of the glass substrate, and a filler removal module (1900) for removing the filler inside the micro hole.

[0108] The loading module (1100) is effective for loading a glass substrate into the system and transporting the glass substrate between each module. Through this, the system can produce a glass substrate having micro-holes in a continuous process.

[0109] The laser processing module (1200) is effective for irradiating a laser onto the upper and lower surfaces of the glass substrate. For this purpose, it is effective to position laser sources on the upper and lower surfaces of the glass substrate, respectively. Of course, it is not limited to this, and it is also possible to have a structure in which a laser is irradiated onto one surface of the glass substrate, and then the glass substrate is flipped over or the laser is moved to irradiate the other surface of the glass substrate.

[0110] It is effective for the coating film forming module (1300) to have a structure that forms a coating film on the upper and lower surfaces of a moving glass substrate. Of course, it may also have a structure that attaches a film to the upper and lower surfaces. Furthermore, it is not limited to this, and may have a structure that rotates the glass substrate and applies a coating liquid to the upper surface.

[0111] It is effective for the coating film pattern module (1400) to have a structure similar to the laser processing module (1200) described above.

[0112] The hole forming module (1500) may be formed with a structure including a water tank in which a glass substrate is immersed and an etching solution located inside the water tank. Through this, a hole can be formed by removing the glass substrate using the etching solution.

[0113] The coating film removal module (1600) can be formed with a structure that removes a film located on the surface of a glass substrate using a film removal device.

[0114] In addition, the hole filling module (1700) may be similar to the coating film forming module (1300). Additionally, it may have a structure that forms a separate coating liquid in the form of a slit coating.

[0115] It is effective for the substrate surface treatment module (1800) and the filler removal module (1900) to have a structure similar to the preceding hole forming module.

[0116] Through this process, micro-holes are formed in the glass substrate as it passes through each module section, and its thickness and surface treatment can be performed. This process allows for the selective use of only some modules or the entire module to be used differently as needed.

[0117] Although the technical concept of the present invention described above has been specifically described in preferred embodiments, it should be noted that the aforementioned embodiments are for illustrative purposes only and are not intended to be limiting. Furthermore, a person skilled in the art will understand that various embodiments are possible within the scope of the technical concept of the present invention.

[0118]

[0119] ** Explanation of Drawing Symbols **

[0120] 100, 300: Glass substrate 110: Surface protective coating film

[0121] 120, 330: Microholes 130: Filler

[0122] 200, 400: Laser 310: Surface protective layer

[0123] 320: Etching barrier layer 1100: Loading module

[0124] 1200: Laser processing module 1300: Coating film formation module

[0125] 1400: Coating film pattern module 1500: Hole forming module

[0126] 1600: Coating film removal module 1700: Hole embedding module

[0127] 1800: Substrate surface treatment module 1900: Filler removal module

Claims

1. Step of preparing a glass substrate; A step of forming microholes penetrating a glass substrate through laser processing and etching processes; and A method for micro-processing a glass substrate characterized by including the step of performing thickness control and surface improvement work on a glass substrate having micro-holes formed therein.

2. In Paragraph 1, The step of forming the microholes above is, A step of performing laser pretreatment on the microhole formation area of ​​the glass substrate; A step of forming a surface protective coating film on the upper and lower surfaces of a laser-pretreated glass substrate; A step of selectively removing a surface protective coating film on the upper surface of the area where microholes are to be formed using a laser to expose the upper and lower surfaces of the glass substrate; A step of removing an exposed glass substrate area to form a microhole; and A method for micro-processing a glass substrate characterized by including a step of removing a surface protective coating film remaining on a glass substrate.

3. In Paragraph 2, The above laser pretreatment uses a femtosecond laser, a picosecond laser, or a nanosecond laser, and irradiates the upper and lower surfaces of a glass substrate with the laser, and As the above surface protective coating film, polyimide-based materials, polymer-based materials, polyurethane-based materials, enamel-based materials, epoxy-based materials, photoresist-based materials, or wax-based materials are used, and are formed through spin coating, spray coating, brush application, or dipping processes, or coated as a film type. A method for micro-processing a glass substrate characterized in that, when the maximum diameter of the microhole is 100, the diameter of the surface protective coating film to be removed is 80 to 100.

4. In Paragraph 1, The step of performing the above thickness control and surface improvement work is, A step of filling the interior of the microhole with a filling material; The method includes a step of improving the thickness and surface of a glass substrate through surface treatment of the glass substrate, wherein The above glass substrate surface treatment is A method for micro-processing a glass substrate characterized by immersing the glass substrate in a substrate etching solution or performing a dry etching process.

5. Step of preparing a glass substrate; A step of improving the thickness and surface of the above glass substrate; A step of forming a surface protection layer on the upper and lower surfaces of the glass substrate; A step of forming an etching barrier layer on a surface protection layer on the upper surface of the glass substrate; A step of removing the etching barrier layer and surface protection layer in the area where microholes are to be formed to expose the glass substrate; Step of irradiating a laser onto the exposed glass substrate; A step of removing the glass substrate region irradiated with the laser to form a microhole; and A method for microfabrication of a glass substrate characterized by including the step of removing the residual etching barrier layer and surface protection layer.

6. The glass substrate micro-machining system for glass substrate micro-machining A loading module for loading a glass substrate, and A laser processing module that performs laser processing on a loaded glass substrate, and A coating film forming module that forms a surface protection coating film on the upper and lower surfaces of a laser-processed glass substrate, and A coating film pattern module that removes a portion of the surface protective coating film, and A hole forming module that removes a glass substrate from which a surface protective coating film has been removed to form a micro-hole, and A coating film removal module for removing a surface protection coating film on the upper and lower surfaces of a glass substrate with micro-holes formed therein, and A hole filling module that fills micro-holes with a filler, and A substrate surface treatment module that performs thickness and surface treatment of a glass substrate, and A glass substrate micro-processing system characterized by including a filler removal module for removing filler inside a micro hole.

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