Semiconductor chip tray integrated with locking parts configured such that multiple trays can be stacked

Abstract

According to the present disclosure, a semiconductor chip tray (10) configured to be stackable while accommodating a semiconductor chip may comprise: a tray body (100) having a groove in which the semiconductor chip is accommodated; a cover (200) disposed above the tray body (100) to protect the semiconductor chip; and locking parts (300) installed in the tray body (100) and configured to be rotatable toward the cover (200), the locking parts (300) being compressed and fixed to the cover (200), thereby fixing the cover (200) to the tray body (100).

Description

Semiconductor chip tray with integrated locking parts that allows multiple trays to be stacked

[0001] The technical concept of the present disclosure relates to a semiconductor chip tray, and more specifically, to a semiconductor chip tray in which a locking part is integrally formed and a plurality of trays can be stacked.

[0002] Referring to FIG. 1, the semiconductor chip tray is a tray used for storing or transporting semiconductor chips and has a structure divided into multiple compartments to safely accommodate multiple chips. Each compartment is equipped with an inner wall that separates and protects the semiconductor chips so that they do not come into contact with each other.

[0003] For such semiconductor chip trays, guide components may be used to stably combine or secure the tray body and the cover. These guide components may take longer to assemble and disassemble the tray, and there is also a risk of loss.

[0004] Guide components can frequently be lost, particularly in mass production sites or environments where multiple workers must share trays and guide parts. This can lead to additional costs and impact productivity, as the loss of parts can cause work delays or render the trays unusable.

[0005] Furthermore, conventional semiconductor chip trays are designed with a male-female structure in which the lower surface of the tray body and the upper surface of the cover interlock to enable stacking; however, since the lower surface of the tray body lacks a configuration capable of accurately gripping the protrusions on the upper surface, there is a problem in that semiconductor chip trays cannot be stably stacked.

[0006] The problem that the technical concept of the present disclosure aims to solve is to provide a semiconductor chip tray with an integrated locking part that can stably stack a plurality of trays.

[0007] A semiconductor chip tray (10) configured to accommodate and stack semiconductor chips according to the present disclosure may include a tray body (100) having a groove formed therein for accommodating the semiconductor chips, a cover (200) disposed in the upper direction of the tray body (100) to protect the semiconductor chips, and a locking part (300) installed on the tray body (100) and configured to rotate in the direction of the cover (200), which is pressed and fixed to the cover (200) to secure the cover (200) to the tray body (100).

[0008] According to one embodiment, the cover (200) may include a locking projection (210) protruding upward along the edge, and the locking part (300) may include a locking groove (350) with a depth corresponding to the locking projection (210).

[0009] According to one embodiment, the locking part (300) may be characterized by including a protrusion (310) that protrudes outwardly and protrudes upward relative to the tray body (100) when the locking part (300) is pressed and fixed to the cover (200), and by configuring a plurality of semiconductor chip trays (10) so that another semiconductor chip tray (10) is fitted and fixed to the protrusion (310).

[0010] According to one embodiment, when the cover (200) is covered by the tray body (100), the side wall (340) of the cover (200) and the side wall (340) of the tray body (100) are formed to be continuously connected without a step, and the protrusion (310) of the first semiconductor chip tray (10_1) may be characterized by being inserted and fixed between at least one of the side wall (340) of the tray body (100) and the side wall (340) of the cover (200) of the second semiconductor chip tray (10_2) which is distinguished from the first semiconductor chip tray (10_1) and the locking part of the second semiconductor chip tray (10_2).

[0011] According to one embodiment, the locking part may be characterized by being fitted and fixed to a fixing projection (110) protruding inwardly into the tray body (100) when rotated in the opposite direction to the cover (200) and coming into contact with the bottom surface of the tray body (100).

[0012] According to one embodiment, when the locking part (300) is fitted and fixed to the fixed projection (110), a portion of the locking part protrudes downward toward the tray body (100), thereby separating the tray body (100) from the workbench by a predetermined distance when the semiconductor chip tray (10) is placed on the workbench.

[0013] According to one embodiment, the adhesive pad may be composed of a first surface that is adhesively fixed to the groove of the tray body (100) and a second surface that assists in fixing the semiconductor chip received in a direction opposite to the first surface, and the adhesive force of the first surface may be stronger than the adhesive force of the second surface.

[0014] A semiconductor chip tray according to an embodiment of the present disclosure has a locking part integrally mounted with the tray body, which reduces the risk of loss and allows for quick installation. In addition, it is configured so that another semiconductor chip tray can be stably mounted through the protrusion of the locking part, thereby enabling the stable stacking of multiple semiconductor chip trays.

[0015] The effects obtainable from the exemplary embodiments of the present disclosure are not limited to those mentioned above, and other unmentioned effects can be clearly derived and understood by those skilled in the art to which the exemplary embodiments of the present disclosure belong from the description below. That is, unintended effects resulting from the implementation of the exemplary embodiments of the present disclosure can also be derived by those skilled in the art from the exemplary embodiments of the present disclosure.

[0016] FIG. 1 is a drawing illustrating a semiconductor chip tray according to a prior embodiment.

[0017] FIG. 2 is a drawing illustrating a semiconductor chip tray according to an embodiment of the present disclosure.

[0018] FIG. 3 is a drawing illustrating a tray body according to one embodiment.

[0019] FIG. 4 is a drawing illustrating a cover according to one embodiment.

[0020] FIG. 5 is a drawing illustrating a locking part according to one embodiment.

[0021] FIGS. 6 and FIGS. 7 are drawings illustrating an embodiment in which a plurality of semiconductor chip trays are stacked according to one embodiment.

[0022] FIG. 8 is a drawing illustrating an embodiment of fastening locking parts according to one embodiment.

[0023] FIG. 9 is a drawing illustrating an embodiment in which a locking part is fitted and fastened to the lower part of the tray body according to one embodiment.

[0024] FIG. 10 is a drawing illustrating a tray body capable of accommodating semiconductor chips of different sizes according to one embodiment.

[0025] FIG. 11 is a drawing showing the inner wall of a tray body with a guide slot formed according to one embodiment.

[0026] A semiconductor chip tray (10) configured to accommodate and stack semiconductor chips according to the present disclosure may include a tray body (100) having a groove formed therein for accommodating the semiconductor chips, a cover (200) disposed in the upper direction of the tray body (100) to protect the semiconductor chips, and a locking part (300) installed on the tray body (100) and configured to rotate in the direction of the cover (200), which is pressed and fixed to the cover (200) to secure the cover (200) to the tray body (100).

[0027] Hereinafter, various embodiments of the present disclosure are described in conjunction with the accompanying drawings. As various embodiments of the present disclosure may be subject to various modifications and may have various forms, specific embodiments are illustrated in the drawings and described in detail. However, this is not intended to limit the various embodiments of the present disclosure to specific forms, and it should be understood that they include all modifications and / or equivalents and substitutions that fall within the spirit and scope of the various embodiments of the present disclosure. In relation to the description of the drawings, similar reference numerals have been used for similar components.

[0028] In various embodiments of the present disclosure, terms such as “comprising” or “having” are intended to indicate the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

[0029] In various embodiments of the present disclosure, expressions such as “or” include any and all combinations of the words listed together. For example, “A or B” may include A, may include B, or may include both A and B.

[0030] Expressions such as "first," "second," "first," or "second" used in various embodiments of the present disclosure may modify various components of the various embodiments, but do not limit such components. For example, such expressions do not limit the order and / or importance of such components and may be used to distinguish one component from another.

[0031] When it is mentioned that a component is "connected" or "joined" to another component, it should be understood that the component may be directly connected or joined to the other component, but that a new component may also exist between the component and the other component.

[0032] In the embodiments of the present disclosure, terms such as "module," "unit," "part," etc. are used to refer to a component that performs at least one function or operation, and such component may be implemented in hardware or software, or in a combination of hardware and software. Additionally, a plurality of "modules," "units," "parts," etc. may be integrated into at least one module or chip and implemented as at least one processor, except where each needs to be implemented in specific individual hardware.

[0033] Terms such as those defined in commonly used dictionaries should be interpreted as having meanings consistent with their meanings in the context of the relevant technology, and should not be interpreted in an ideal or overly formal sense unless explicitly defined in the various embodiments of the present disclosure.

[0034] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the attached drawings.

[0035] FIG. 2 is a drawing illustrating a semiconductor chip tray (10) according to an embodiment of the present disclosure.

[0036] Referring to FIG. 2, a semiconductor chip tray (10) according to an embodiment of the present disclosure may include a tray body, a cover (200), and a locking part (300). The tray body may have a groove formed therein for receiving a semiconductor chip, and the cover (200) may cover the tray body in an upward direction to protect the semiconductor chip. The locking part (300) may press and fix the cover (200) to the tray body while the cover (200) is covered by the tray body. The locking part (300) may be referred to as a latch, a clamp, a locking device, or a locking clip.

[0037] The locking part (300) can be installed on the lower part of the tray body and can be rotated around an axis (330) that crosses the tray body. The axis (330) that crosses the tray body may be the y-axis (330) of FIG. 1. The locking part (300) can be mounted on the cover (200) after being rotated in the direction of the cover (200), and when rotated in the opposite direction of the cover (200), it can be fixed by contacting the bottom surface of the tray body. The direction of the cover (200) in which the locking part (300) is rotated may be a direction of counterclockwise rotation in the xz plane of FIG. 1, and the opposite direction of the cover (200) may be a direction of clockwise rotation in the xz plane.

[0038] When the locking part (300) is mounted on the cover (200), the cover (200) can be fixed to the tray body so that the cover (200) does not detach from the tray body. When the locking part (300) is rotated in the opposite direction to the cover (200) and fixed by contacting the bottom surface of the tray body, a part of the locking part (300) can be used as a support leg so that a worker can work on the tray body. In this case, since the fixation between the cover (200) and the tray body is released, the worker can remove the cover (200), place a semiconductor chip on the tray body, and perform work.

[0039]

[0040] FIG. 3 is a drawing illustrating a tray body according to one embodiment.

[0041] Referring to FIG. 3, the tray body according to one embodiment may be configured with an inner wall (120) and an outer wall (130) to accommodate four semiconductor chips. The inner wall (120) and the outer wall (130) may be configured to be higher than the height of the semiconductor chips to prevent impact and / or intrusion of foreign substances from the outside.

[0042] According to one embodiment, a support member of a certain height may be formed protruding downward on the bottom surface of the tray body. When the semiconductor chip tray (10) is placed on a workbench with the cover (200) of the tray body covered, the semiconductor chip tray (10) can be stably placed on the workbench or another semiconductor chip tray (10) by means of the support member of the tray body.

[0043] According to one embodiment, a pair of fixing protrusions (110) protruding inward may be formed on the inner side wall (340) of the support, and the locking part (300) may be fitted and fixed by the pair of fixing protrusions (110) so that the support is configured to be spaced apart from the workbench at a predetermined distance. When the cover (200) of the semiconductor chip tray (10) is not covered and the groove of the tray body is exposed to the outside, the exposed surface of the semiconductor chip tray (10) must prevent foreign matter from penetrating from the workbench, and by fixing the locking part (300) to the fixing protrusion (110), the tray body can be spaced apart from the workbench at a predetermined distance to prevent foreign matter from penetrating.

[0044]

[0045] FIG. 4 is a drawing illustrating a cover (200) according to one embodiment.

[0046] Referring to FIG. 4, the cover (200) can be positioned to engage with the outer wall (130) of the tray body. A locking projection (210) protruding along the edge may be formed in the upper direction of the cover (200), and the cover (200) can be fixed to the tray body by hooking the locking groove (350) of the locking part (300) to the locking projection (210). That is, the depth of the locking groove (350) to which the hook is engaged may correspond to the length of the protruding locking projection (210).

[0047]

[0048] FIG. 5 is a drawing illustrating a locking part (300) according to one embodiment.

[0049] Referring to FIG. 5, the locking part (300) may include a protrusion (310) that protrudes outwardly and protrudes upward relative to the tray body when the locking part (300) is pressed and fixed to the cover (200). The protrusion (310) may function as a means to assist a worker in gripping the semiconductor chip tray (10), and may also function to secure the stacking by being inserted into another semiconductor chip tray (10) when a plurality of semiconductor chip trays (10) are stacked.

[0050] According to one embodiment, the locking part (300) may be fixed to the tray body and have an axis (330) formed therein for rotation in the direction of the cover (200). The axis (330) may protrude outwardly from the side wall (340) of the locking part (300) and may be inserted into the tray body, and the locking part (300) may rotate on the tray body around the axis (330). The side wall (340) of the locking part (300) may be configured in a '7' shape so that a catch groove (350) can be formed on the locking part (300). Additionally, an empty space may be formed between a pair of side walls (340).

[0051] The shaft (330) and the side wall (340) may act as obstructing elements to the locking part (300) of another semiconductor chip tray (10) during the process of stacking on another semiconductor chip tray (10), thereby hindering smooth stacking. Accordingly, a guide groove (320) may be formed on the upper surface of the locking part (300) of the present disclosure to the size of the shaft (330). When a plurality of semiconductor chip trays (10) are stacked, the shaft (330) of the first semiconductor chip tray (10_1) is inserted into the guide groove (320) of the second semiconductor chip tray (10_2), and the protrusion (310) of the second semiconductor chip tray (10_2) is fitted into the first semiconductor chip tray (10_1) to fix the stacking.

[0052]

[0053] FIGS. 6 and FIGS. 7 are drawings illustrating an embodiment in which a plurality of semiconductor chip trays (10) are stacked according to one embodiment.

[0054] Referring to FIG. 6, each of the plurality of semiconductor chip trays (10) can be fitted into the protrusion (310) of another semiconductor chip tray (10) and stacked. For example, a second semiconductor chip tray (10_2) can be fitted into the protrusion (310) of a first semiconductor chip tray (10_1) and stacked, and a third semiconductor chip tray (10_3) can be fitted into the protrusion (310) of a second semiconductor chip tray (10_2) and stacked.

[0055] Referring to FIG. 7, which is a cross-sectional view of the state in which the cover (200) is covered by the tray body (100) and the locking device is engaged, when the cover (200) is covered by the tray body (100), the side wall (340) of the cover (200) and the side wall (340) of the tray body (100) can be formed to be continuously connected without a step. When the second semiconductor chip tray (10_2) is fitted into the protrusion (310) of the first semiconductor chip tray (10_1), the protrusion (310) of the first semiconductor chip tray (10_1) can be fitted and fixed between at least one of the side wall (340) of the tray body (100) and the side wall (340) of the cover (200) of the second semiconductor chip tray (10_2) and the locking part (300) of the second semiconductor chip tray (10_2).

[0056] Specifically, the side walls (340) of a pair of hook-shaped locking parts (300) can be in contact with the side walls (340) of the cover (200) and the tray body (100) to secure the cover (200) and the tray body (100). At this time, a void space may be formed between the side walls (340) of the locking parts (300), and a protrusion (310) of the semiconductor chip tray (10) may be fitted into the void space. Referring to the cross-sectional view of FIGS. 5 and FIGS. 7, the width of the void space may be wider than the thickness of the locking projection (210) of the cover (200), and even if the locking part (300) is caught on the locking projection (210), there may still be space for the protrusion (310) to be inserted. That is, the width of the empty space of the locking part (300) can correspond to the length of the sum of the thickness of the protrusion (310) of the locking part (300) and the locking projection of the cover (200).

[0057]

[0058] FIG. 8 is a drawing illustrating an embodiment of fastening locking parts according to one embodiment.

[0059] Referring to FIG. 8, a semiconductor chip tray (10) can be locked by a pair of locking parts (300) that are rotated inwardly toward the semiconductor chip tray (10) to lock the cover (200) and the tray body (100). For example, the first locking part (300a) can be rotated to the left and the second locking part (300b) can be rotated to the right to lock it. In the locked state, the locking parts (300) can be rotated in the opposite direction to unlock it. For example, the first locking part (300a) can be rotated to the right and the second locking part (300b) can be rotated to the left to unlock it.

[0060]

[0061] FIG. 9 is a drawing illustrating an embodiment in which a locking part (300) is fitted and fastened to the lower part of a tray body (100) according to one embodiment.

[0062] Referring to FIG. 9, when the semiconductor chip tray (10) is unlocked, a pair of locking parts (300) can be rotated in the direction of the bottom surface of the tray body (100) with respect to the axis (330). Specifically, in FIG. 9(a), when each of the pair of locking parts (300) is locked, they can be rotated 270 degrees in opposite directions to come into contact with the bottom surface of the tray body (100), and the locking parts (300) can be fitted into the fixed projection (110) formed on the support of the tray body (100). For example, the first locking part (300a) can be rotated 270 degrees clockwise, and the second locking part (300b) can be rotated 270 degrees counterclockwise to come into contact with the bottom surface of the tray body (100). The first locking part (300a) and the second locking part (300b) can be fitted and fixed to a fixed projection (110) formed on a support.

[0063] At this time, a portion of the locking part (300) may be longer than the length of the support of the tray body (100), and a portion of the locking part (300) may become a support leg so that the tray body (100) can be stably positioned on the workbench while being spaced apart from the workbench.

[0064] Referring to FIGS. 3 and 7, the second length (d2) of the locking part (300) may be longer than the first length (d1) of the support of the tray body (100), and may protrude downward from the support by the difference between the second length (d2) and the first length (d1). A pair of protruding locking parts (300) can stably support the tray body (100) by being symmetrically arranged.

[0065]

[0066] FIG. 10 is a drawing illustrating a tray body (100) capable of accommodating semiconductor chips of different sizes according to one embodiment.

[0067] Referring to FIG. 10, the tray body (100) of the present disclosure may be formed in various sizes. For example, a space for accommodating semiconductor chips may be partitioned in a 2x2 manner through the inner wall (120), and a space for accommodating semiconductor chips may be partitioned in a 3x3, 4x4, or 5x5 manner. That is, the number and size of the spaces for accommodating semiconductor chips in the tray body (100) according to the embodiment of the present disclosure may not be limited to a specific number.

[0068] According to one embodiment, an adhesive pad may be installed in a space for accommodating a semiconductor chip. The adhesive pad may be composed of a first surface that is adhesively fixed to a groove for accommodating a semiconductor chip in a tray body (100), and a second surface that assists in fixing the semiconductor chip accommodating the semiconductor chip in a direction opposite to the first surface. The adhesive force of the second surface is stronger than the adhesive force of the first surface, so that the semiconductor chip can be stably accommodated even if the size of the semiconductor chip is small compared to the size of the space for accommodating the semiconductor chip.

[0069]

[0070] FIG. 11 is a drawing showing the inner wall (120) of a tray body (100) having a guide slot (121) formed according to one embodiment.

[0071] Referring to FIG. 11, at least one side of the inner wall (120) of the tray body (100) according to one embodiment may have a guide slot (121) formed therein. The guide slot (121) may be a groove formed in the inner wall (120), and the width of the inner wall (120) in which the guide slot (121) is formed may be narrower than the width of the inner wall (120) in which the guide slot (121) is not formed.

[0072] In order for a worker to place a semiconductor chip on the tray body (100) or to take out a semiconductor chip, the worker performs the operation using tweezers. At this time, if the size of the semiconductor chip is the same as the size of the chip receiving space in the tray body (100), the semiconductor chip is in close contact with the inner wall (120) of the tray body (100), so a gap for gripping the semiconductor chip with tweezers may not be formed. Accordingly, the inner wall (120) of the tray body (100) of the present disclosure may have a guide slot (121) formed therein to form a gap for gripping the semiconductor chip with tweezers.

[0073] The guide slot (121) of the present disclosure may be formed on every inner wall (120) as in the embodiment of FIG. 11, but is not limited thereto, and may be formed on only one inner wall (120) of the space in which the semiconductor chip is accommodated, and the number of inner walls (120) in which the guide slot (121) is formed is not limited to a specific number.

[0074]

[0075] As described above, exemplary embodiments have been disclosed in the drawings and specification. Although specific terms have been used to describe the embodiments in this specification, they are used only for the purpose of explaining the technical concept of this disclosure and are not intended to limit the meaning or the scope of this disclosure as defined in the claims. Therefore, those skilled in the art will understand that various modifications and equivalent alternative embodiments are possible therefrom. Accordingly, the true technical scope of protection of this disclosure should be determined by the technical concept of the appended claims.

Claims

1. A semiconductor chip tray (10) configured to accommodate semiconductor chips and allow stacking, A tray body (100) having a groove formed therein for accommodating the semiconductor chip; A cover (200) positioned in the upper direction of the tray body (100) to protect the semiconductor chip; and A locking part (300) is installed on the tray body (100) and configured to rotate in the direction of the cover (200), and is fixed by compression to the cover (200) to fix the cover (200) to the tray body (100). A semiconductor chip tray (10) including 2. In Paragraph 1, The above cover (200) is, It includes a catch projection (210) that protrudes upward along the edge, The above locking part (300) is, A semiconductor chip tray (10) characterized by including a locking groove (350) of a depth corresponding to the locking projection (210) above.

3. In Paragraph 1, The above locking part (300) is, A protrusion (310) that protrudes outwardly and protrudes upward relative to the tray body (100) when the locking part (300) is pressed and fixed to the cover (200). Includes, A semiconductor chip tray (10) characterized by being configured such that a plurality of semiconductor chip trays (10) are stacked by fitting another semiconductor chip tray (10) to the protrusion (310).

4. In Paragraph 3, When the above cover (200) covers the tray body (100), the side wall (340) of the cover (200) and the side wall (340) of the tray body (100) are formed to be continuously connected without a step difference. A semiconductor chip tray (10) characterized in that a protrusion (310) of a first semiconductor chip tray (10_1) is inserted and fixed between at least one of the side wall (340) of the tray body (100) and the side wall (340) of the cover (200) of a second semiconductor chip tray (10_2) that is distinguished from the first semiconductor chip tray (10_1) and a locking part of the second semiconductor chip tray (10_2).

5. In Paragraph 1, The above locking part is, A semiconductor chip tray (10) characterized by being fitted and fixed to a fixed projection (110) protruding inwardly from the tray body (100) when rotated in the opposite direction to the direction of the cover (200) and coming into contact with the bottom surface of the tray body (100).

6. In Paragraph 5, A semiconductor chip tray (10) characterized in that when the locking part (300) is fitted and fixed to the fixed projection (110), a part of the locking part protrudes downward toward the tray body (100), thereby separating the tray body (100) from the workbench by a predetermined distance when the semiconductor chip tray (10) is placed on the workbench.

7. In Paragraph 1, A first surface that is adhesively fixed to the groove of the tray body (100); and A second surface that assists in fixing the semiconductor chip received in a direction opposite to the first surface. An adhesive pad composed of Includes, A semiconductor chip tray (10) characterized in that the adhesive force of the first surface is stronger than the adhesive force of the second surface.

8. A semiconductor chip tray (10) configured to accommodate semiconductor chips and allow stacking, A tray body (100) having a chip receiving space formed therein for accommodating the above semiconductor chip; A cover (200) positioned in the upper direction of the tray body (100) to protect the semiconductor chip; and A locking part (300) installed on the tray body (100) and rotated toward the cover (200) to secure the cover (200) to the tray body (100). Includes, The above tray body (100) is, An inner wall (120) having a guide slot (121) formed on at least one side to guide a tweezers for gripping the semiconductor chip A semiconductor chip tray (10) characterized by including

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