A pressure sensor with a heater and an operating method, thereof

Abstract

The present application relates to a pressure sensor (1) with at least one external heater (13) for a H2 storage component and proposes an operating method about heating of the pressure sensor (1).

Description

[0001] SPECIFICATION

[0002] A PRESSURE SENSOR WITH A HEATER AND AN OPERATING METHOD, THEREOF

[0003] Technical Field of the Invention

[0004] The present application relates to a pressure sensor with at least one heating member which can be used in H2 storage component, according to preamble of appended claims.

[0005] Background of the Invention

[0006] In the prior art, there are various types of pressure sensors for detecting the pressure of a measuring medium.

[0007] State of the art designs for pressure measurement in cryogenic conditions for vehicles, include sensors which utilize Application-Specific Integrated Circuits (ASIC) and which deliver robust data above a certain temperature as the circuit reliability deteriorates in lower temperatures.

[0008] The pressure measurement of media at temperatures lower than the rated range in examplary; below -40°C temperature and lower temperatures of the related ASIC is not reliable and enable. During defueling process of compressed H2 (in examplary; while driving); gas temperatures drop to -60°C I -70°C. None of any pressure sensors (Electronics I ASIC (Application-Specific Integrated Circuits) I PCB (printed circuit board)) are capable to measure below -40°C due to the ASIC dropping below reliable operating temperature.

[0009] A prior art pressure sensor is disclosed in the published document with the number W02004001362A1. According to publication, the invention relates to a device for pressure measurement, especially for high-pressure measurement, comprising a pressure sensor which is arranged in a sensor housing. Said sensor housing comprises a first sensor housing element provided with a pressure connection and a second sensor housing element provided with an electrical connection. In order to reduce production costs, the inventive device comprises a connection element which can be embodied as a simple press-bent element or a thin-walled tubular element. Said connection element can also form an electromagnetic compatibility region. Brief Description of the Invention

[0010] Primary object of the present invention is to overcome the above-mentioned shortcomings of the prior art.

[0011] A further object of the present invention is to enable reliable pressure measurement of media at temperatures lower than the rated range of the related ASIC or related electronics, in cryogenic conditions for vehicles.

[0012] Another object of the present invention is to provide a heater for a pressure sensor which is external and detachable from outside to the sensor and can be changeable easily. Also the heater design can be provided according to different kind of the pressure sensors.

[0013] The present application proposes a pressure sensor for detecting pressure of a measuring medium, in particular for detecting a pressure in a hydrogen-operated system, comprising a sensor housing with a housing interior and a pressure sensor cell, wherein a circuit board electrically connected to the pressure sensor cell is arranged in the housing interior formed in a frame and on a base plate. At least one heater is arranged at a place that is outside of the pressure sensor and on the pressure sensor where the heater is disposed close to the pressure sensor cell and the circuit board of the pressure sensor. Thus, a reliable pressure measurement of media at temperatures lower than the rated range of the related ASIC or related electronics in cryogenic conditions for vehicles, is provided.

[0014] Therefore, without giving any harm to inner components such as circuit board, heating of the pressure sensor is provided at predetermined and desired temperatures for very cold environments.

[0015] In another embodiment of the present invention, the at least one heater is arranged on the sensor housing and / or on the frame and / or on a pressure port which is extending from the base plate. Thus, heating of the pressure sensor’s internal components is provided from outside of the pressure sensor.

[0016] In another embodiment of the present invention, the heater is designed as it fits onto the sensor housing and / or onto the frame and / or onto the pressure port from their peripheral walls. Thus, a reliable engaging onto the pressure sensor is provided.

[0017] In another embodiment of the present invention, the heater is designed separate from the pressure sensor which is detachable from outside of the pressure sensor. Thus, the heater can be demounted when it is defected and can be chancable with new one, easily. In another embodiment of the present invention, the heater comprises a number of heating element which are arrayed radially on a base of the heating element. Thus, positions of the heating elements on the heater can be re-designed and changed according to thermal needs about heating the pressure sensor from the surfaces.

[0018] In another embodiment of the present invention, a material of the heater can be made completely by a heat conductor material. Thus, the heat is provided from the complete surface of the heater.

[0019] In another embodiment of the invention, the heater has electrical connections to convey electricity to the heater from a electrical supply. Thus, the heater is heated by electricity.

[0020] In another embodiment of the invention, the heater has annular or sleeve shape. Thus, the form of the heater fits to outer shapes of the pressure sensor.

[0021] In another embodiment of the invention, the heater is controlled by a HSCll or HSC unit via providing electric on / off signal which are in electrical communication with the heater by electrical connections of the heater. Thus, the heater is controlled by in a reliable manner.

[0022] In another embodiment of the invention, the heater is made by a ceramic or a composite or a metal material which having material properties to conduct the heat. Thus, a durable heater is provided.

[0023] The present application proposes an operating method to heat the pressure sensor with at least one heater. The method characterized by, comprising method steps of:

[0024] - taking an ambient temperature information from an ASIC or the circuit board by HSC or HSCll units,

[0025] - giving a command by HSC or HSCll units to an electrical unit to activate the electrical energy for the heater if an ambient temperature is defined by the pressure sensor is less than minimum -35 °C degree.

[0026] Thus, a reliable pressure measurement of media at temperatures lower than the rated range of the related ASIC or related electronics in cryogenic conditions for vehicles, is provided in a practical way without need complexity of componenets.

[0027] Therefore, without giving any harm to inner components such as circuit board, heating of the pressure sensor is provided at predetermined and desired temperatures for very cold environments. In another method of the invention comprises method step of; providing an additional temperature sensor to measure the temperature of the heater and / or the outer surface of the pressure sensor and giving feedback to the HSC and / or HSCll units. Thus, the HSC and / or HSCll units can sent new temperature values or on-off information via evaluating the feedback.

[0028] In another method of the invention comprises method step of; controlling the heat of the heater by a HSCll or HSC unit via providing electric on / off signal which are in electrical communication with the heater by electrical connections of the heater.

[0029] In another method of the invention comprises method step of; setting a time control and adjustment for heating duration of the heater is arranged on the HCU: heater control unit.

[0030] Brief Description of the Figures

[0031] The figures, whose brrief explanations are herewith provided, are solely intended for providing a better understanding of the present invention and are as such not intended to define the scope of protection or the context in which the scope is to be interpreted in the absence of the description.

[0032] Fig.1 is a cross-sectional view of an examplary pressure sensor which is given in Fig.2.

[0033] Fig.2 shows a two-dimensional frontal view of an examplary pressure sensor, according to the present invention.

[0034] Fig.3 is a cross-sectional view of another examplary pressure sensor, according to the present invention.

[0035] Fig.4 is a cross-sectional view of another examplary pressure sensor, according to the present invention.

[0036] Fig.5 shows a heater with electrical connection, from a top view.

[0037] Fig.6 shows a heater without electrical connection, from a top view. Detailed Description of the Figures

[0038] Referring to the figures described above, the present application proposes a pressure sensor (1) with at least one external heater (13) for a H2 storage component and proposes an operating method about heating of the pressure sensor (1).

[0039] In a general meaning, the H2 storage component can comprise a hydrogen tank valve, a hydrogen tank manifold or a hydrogen tank plug. A hydrogen pressure regulator can be fixed to these embodiment and can comprise at least one pressure sensor (1).

[0040] The current pressure sensor technology developed for automotive electronics is capable up to -40°C which means the temperature value closes to “0” or above. With the present invention, the pressure sensor (1) provided with the heater (13) is capable to measure the “Tgas” media temperature lower than this temperature i.e. below -40°C and provides heat via the heater (13) to the pressure sensor (1). ASIC (Application-Specific Integrated Circuits) (9) reads its own temperature and the “Tgas” media temperature to use this information to activate heating on the heater (13) when temperature is drop below -40°C i. e. drop below -35°C. The temperature info is taken from the ASIC (9) via a temperature sensor.

[0041] Referring to the figures; 1, 2 and 3, special parts of the pressure sensor (1) are arranged in a sensor housing (10) which is placed on a base plate (4). Electrical contact elements (20) of the pressure sensor (1) are electrically connected to conductor tracks of the circuit board (8). A pressure sensor cell (7) and a circuit board (8) which is electrically connected to the pressure sensor cell (7), are arranged in the housing interior (14).

[0042] A pressure port (6) is arranged on a base plate (4). The base plate (4) is designed as a plate-shaped base part and extending towards an outside space and having a peripheral wall (5) suitable for the attachment of a screwing tool and preferably designed as a hexagon. The base plate (4) is made from a metal material which can have resistance to tightening and loosening torques.

[0043] In this embodiment, the sensor housing (10) is manufactured with a housing cover (11) as an injection-molded part made of plastic. The sensor housing (10) comprises electrical contact elements (20) inside and a frame (3) injected into it. However, the sensor housing (10) can also be made of another material, for example metal. Then, the electrical contact elements (20) are insulated from the sensor housing (10). The frame (3) is formed by a deep-drawn method and has an approximately pot-shaped form with a cylindrical outer shell (32) and a base (31). The base (31) is completely embedded in the plastic moulding of the sensor housing (10). The frame (3) can be designed with very thin walls. The first ends (21) of the electrical contact elements (20) are guided from the housing interior (14) towards a connection part (12) of the pressure sensor (1). The pot-shaped design of the frame (3) ensures very good EMC (electromagnetic compatibility) protection of the evaluation electronics on the circuit board (8). The frame (3) and the base plate (4) form an almost closed electromagnetic compatibility space.

[0044] The sensor housing (10) comprises a peripheral extension which is covering the base (31) of the frame (3). The outer shell (32) of the frame (3) can have peripheral bended extension which is extending on the base plate (4). The frame (3) can be welded onto the base plate (4) from its outer shell (32).

[0045] A pressure sensor cell (7) made of stainless steel serves as the pressure sensor, which is provided on its side facing away from a pressure feed channel (61), for example, with resistors manufactured using thin-film technology. The processing and amplification of the signal of the resistors is carried out, for example, via an ASIC (9), which is arranged on a circuit board (8) positioned into the sensor housing (10).

[0046] The cup-shaped pressure sensor cell (7) is mounted to a pressure port (6) which has the feed channel (61) and a threaded part (62). The mounting can be done for example by laser welding, resistance welding or electron beam welding or in another way.

[0047] For this purpose, the pressure sensor cell (7) is placed with its open side on a collar of the pressure port (6) and the pressure sensor cell (7) has a blind hole-like inner recess (72) formed as continuing form the pressure feed channel (61). The pressure sensor cell (7) with its sensor circuit (71) is mostly disposed in a central opening (41) of the base plate (4). The circuit board (8) is glued onto the base plate (4) by using an adhesive (81). The circuit board (8) has an inner recess (82) into which the pressure sensor cell (7) engages from one of the sensor circuits (71) arranged in the pressure sensor cell (7).

[0048] Connection surfaces of the circuit boards (8) are connected via contact springs (87) to electrical contact elements (20). Contact springs (87) connect the circuit board (8) to electrical contact elements (20) via second ends (22) of the electrical contact elements (20). The pressure sensor cell (7) is connected to the circuit board (8) via electrical wire connections (83). In a detailed description of the invention, the invention proposes a pressure sensor (1) with at least one heater (13) for heating the pressure sensor (1) which is in particular used for detecting a pressure in a medium containing hydrogen operated system. Also the invention proposes an operating method to provide an external heating from outside of the pressure sensor (1) with at least one external heater (13) positoned on the pressure sensor (1).

[0049] According to the invention, it is proposed that an external heater (13) is arranged outside of the pressure sensor (1), as it can be seen from the figures; 1, 2, 3 and 4.

[0050] In one embodiment of the present invention, as it can be seen from the Fig.1 and Fig.2, the heater (13) is located on the outer shell (32) of the frame (3) from a periphery of the outer shell (32) and also located onto the base plate (4) or peripeharal wall (hexagon piece) (5).

[0051] In an alternative embodiment of the present invention, as it can be seen from the Fig.3, the heater (1) is located under the base plate (4) having the peripeharal wall (hexagon piece) (5).

[0052] In another alternative embodiment of the present invention, as it can be seen from the Fig.4, the heater (13) can have a sleeve shape and can be located outside of the frame (3) particularly can surround the sensor housing (10) or can be arranged just surrounding the frame (3).

[0053] In another alternative embodiment of the present invention, the pressure sensor (1) can have at least one heater (13) on the base plate (4) and / or at least one heater (13) under the base plate (4), as it can be seen also from the Fig.4.

[0054] The heater (13) can comprise a base (132) to array a number of heating elements (131) on the base (132) or in another embodiment; a material of the heater (13) can be made completely by a heat conductor material, as it can be seen from the Fig.5 and Fig.6. The heater (13) is designed as it can be fit onto the sensor housing (10) and / or onto the frame (3) and / or onto the pressure port (6) from their peripheral walls. The heater (13) can be in an annular shape having a hollow at the center or can be in a sleeve shape.

[0055] In detail, the heater (13) operates to heat the circuit board (8) and / or the pressure sensor cell (7) and / or the ASIC (9) from outside to a target temperature and therefore finally to heat to the pressure sensor (1). The separate and external heater (13) is mounted exclusively for heating purposes, which is suitable and designed to heat the frame (3) and / or base plate (4) having the periperal wall (5) which can be a hexagon piece and therefore to heat to the circuit board (8) and / or the pressure sensor cell (7) and / or the ASIC (9) to a predeterminable temperature value.

[0056] The circuit board (8) can be a circuit board (8) provided with electrical and / or electronic components. The circuit board (8) can be, for example, a circuit board or a ceramic substrate, which can be equipped with passive electrical components such as resistors, coils or capacitors and / or with active electronic components and also with elctrical contact elements (20).

[0057] The pressure sensor (1) can be suitable for detecting the pressure of a fluid measuring medium. The measuring medium can be liquid or gaseous. Without being limited to this, the actual pressure sensor cell (7) can, for example, be designed as a metallic pressure measuring cell with a deflectable membrane, which is located in a housing interior (14), similar to that in W02004001362A1 facing side is provided with a sensor circuit (71).

[0058] The pressure sensor (1) is understood to be also a temperature sensor element, which is a temperature detected on or in a component of the pressure sensor (1). The combined pressure and temperature sensors known from the prior art, in which the pressure and temperature of the measuring medium are recorded, the temperature sensor element does not detect an outside temperature, but rather a temperature present inside the pressure sensor (1). At digital pressure sensors (1), the ASIC (9) can provide temperature value information besides the pressure information. Therefore, a temperature value of the pressure sensor (1) can be defined by the ASIC (9). The temperature value information is sent to a “HCU”: heater control unit of the pressure sensor (1). A “HSCU“: hydrogen storage controlling unit and the “HCU”: heater control unit can operate as coordinated with each other (not illustrates in the figures). A command to heat to the heater (13) can be sent via HSCU to the HCU. An electrical signal from the ASIC (9) is sent to the HCU and an electrical supply unit is activated for the heater (13). As it can be seen from the Fig.5, the heater (13) comprises electrical connections (133) such as wire or cable to connect the heater (13) to the electrical supply unit and the electrical connections (133) have electircal communication with the HCU and therefore with the HSCU.

[0059] In another embodiment of the invention, an additional temperature sensor (not shown in the figures) which can be in electrical communication with the heater (13), can be arranged to measure the temperature value of outside of the pressure sensor (1).

[0060] Advantages of the invention, the pressure sensor (1) according to the invention offers the advantage that it in particular is also well suited for hydrogen applications. Those described above prior art pressure sensors are designed for operating conditions not suitable at below the temperature i.e. -40°C.

[0061] This is due to the fact that the standard electronic components of the circuit board (8) are used the manufacturer is limited to a temperature range above -40°C. If such pressure sensors are used for hydrogen applications, then they are suitable for applications above -40°C.

[0062] The pressure sensor (1) according to the invention, is also advantageous for media temperatures suitable below i.e. -35°C. This is achieved according to the invention by a separate and external heater (13) and an operation method, tehereof, which is suitable and designed for the circuit board (8) with the electronic components to be heated from outside of the pressure sensor (1).

[0063] Therefore, without giving any harm to inner components such as circuit board (8), heating of the pressure sensor (1) is provided at predetermined and desired temperatures for very cold environments. The heater (13) can be demounted when it is defected and can be chancable with new one, easily. The desired spesifications such as: materail, dimensions, shape and the electrical spescifics of the heater (13) can be arranged according to type of the pressure sensor (1). Reference signs

[0064] I pressure sensor 4 base plate

[0065] 10 sensor housing 41 central opening

[0066] II housing cover 5 peripheral wall

[0067] 12 connection part

[0068]

[0069] 6 pressure port

[0070] 14 housing interior 61 feed channel

[0071] 20 electrical contact elements 62 threaded part

[0072] 21 first ends 7 pressure sensor cell 22 second ends 71 sensor circuit

[0073] 3 frame 25 72 blind hole-like inner recess 31 base 8 circuit board

[0074] 32 outer shell 81 adhesive

[0075] 13 heater 82 inner recess

[0076] 131 heating element 83 electrical wire connections 132 base 30 87 contact spring

[0077] 133 electrical connection 9 ASIC

Claims

Claims1. A pressure sensor (1) for detecting pressure of a measuring medium, in particular for detecting a pressure in a hydrogen-operated system, comprising a sensor housing (10) with a housing interior (14) and a pressure sensor cell (7), wherein a circuit board (8) electrically connected to the pressure sensor cell (7) is arranged in the housing interior (14) formed in a frame (3) and on a base plate (4), characterized in that at least one heater (13) is arranged at a place that is outside of the pressure sensor (1) and on the pressure sensor (1) where the heater (13) is disposed close to the pressure sensor cell (7) and the circuit board (8) of the pressure sensor (1).

2. The pressure sensor (1) according to claim 1; wherein the at least one heater (13) is arranged on the sensor housing (10) and / or on the frame (3) and / or on a pressure port (6) which is extending from the base plate (4).

3. The pressure sensor (1) according to claim 2; wherein the heater (13) is designed as it fits onto the sensor housing (10) and / or onto the frame (3) and / or onto the pressure port (6) from their peripheral walls.

4. The pressure sensor (1) according to anyone of the preceding claims, wherein the heater (13) is designed separate from the pressure sensor (1) which is detachable from outside of the pressure sensor (1).

5. The pressure sensor (1) according to anyone of the preceding claims, wherein the heater (13) comprises a number of heating element (131) which are arrayed radially on a base (132) of the heating element (13).

6. The pressure sensor (1) according to claims 1 to 5, wherein a material of the heater (13) can be made completely by a heat conductor material.

7. The pressure sensor (1) according to anyone of the preceding claims, wherein the heater (13) has electrical connections (133) to convey electricity to the heater (13) from a electrical supply.

8. The pressure sensor (1) according to anyone of the preceding claims, wherein the heater (13) has annular or sleeve shape.

9. The pressure sensor (1) according to anyone of the preceding claims, wherein the heater (13) is controlled by a HSCll or HSC unit via providing electric on / off signal which are in electrical communication with the heater (13) by electrical connections10. The pressure sensor (1) according to anyone of the preceding claims, wherein the heater (13) is made by a ceramic or a composite or a metal material which having material properties to conduct the heat.

11. An operating method to heat the pressure sensor (1) with at least one heater (13) characterized by, comprising method steps of:- taking an ambient temperature information from an ASIC (9) or the circuit board (8) by HSC or HSCU units,- giving a command by HSC or HSCU units to an electrical unit to activate the electrical energy for the heater (13) if an ambient temperature is defined by the pressure sensor (1) is less than minimum -35 °C degree.

12. The operating method to heat the pressure sensor (1) with at least one heater (13) according to claim 11 characterized by, comprising method step of:providing an additional temperature sensor to measure the temperature of the heater (13) and / or the outer surface of the pressure sensor (1) and giving feedback to the HSC and / or HSCU units.

13. The operating method to heat the pressure sensor (1) with at least one heater (13) according to claim 11 or 12 characterized by, comprising method step of:controlling the heat of the heater (13) by a HSCU or HSC unit via providing electric on / off signal which are in electrical communication with the heater (13) by electrical connections (133) of the heater (13).

14. The operating method to heat the pressure sensor (1) with at least one heater (13) according to claim 11 to 13 characterized by, comprising method step of: setting a time control and adjustment for heating duration of the heater (13) is arranged on the HCU: heater control unit.

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