Storage system

Abstract

The present invention comprises: a first placement part (11) on which a first container (70) is placed; a replacement device (20) that causes a holding member (90) to hold each of a plurality of articles (W) taken out from the first container (70), and forms stacked bodies (ST) by stacking the articles (W) held by the holding member (90); a accommodation device (30) that accommodates the stacked bodies (ST) in second containers (80) that are capable of storing the articles (W) at a higher density than the first container (70) and are capable of hermetically sealing internal spaces (S) for storing the articles (W); a storage device (50) that includes a second placement part (51) on which the second containers (80) are placed, a plurality of storage shelves (53) that stores the second containers (80), and a conveyance device (57) for conveying the second containers (80) between the second placement part (51) and the storage shelves (53), the storage device (50) being suspended from and supported by a ceiling (C); and a relay device (60) that conveys the second containers (80) in which the stacked bodies (ST) are accommodated between the accommodation device (30) and the second placement part (51).

Description

Storage system

[0001] One aspect of the present invention relates to a storage system.

[0002] For example, Patent Document 1 below discloses a storage system for storing articles such as semiconductor wafers. A first container such as a FOUP (Front Opening Unified Pod) in which an article is stored is transported by an overhead transporter and placed on a placement part such as a port. Next, a second container such as a wafer container in which the article is transferred from the first container by a transfer device is stored in a storage device suspended from the ceiling. The second container is composed of a laminate in which a plurality of holding members for holding one article are stacked and a sandwiching body that sandwiches the laminate from above and below. Since the articles are stored in the second container as a laminate, the interval between the vertically arranged articles becomes narrow, so that the articles can be stored at high density.

[0003] International Publication No. 2024 / 70624

[0004] In the storage system as described above, usually, an inert gas is filled inside the container to prevent deterioration of the article. A high sealing degree is required to maintain the cleanliness inside the container. However, in the above conventional second container, although adjacent holding members are held in close contact with each other by the sandwiching body, since they are separate members independent of each other, there is a possibility of unintentional gaps occurring.

[0005] Therefore, an object of one aspect of the present invention is to provide a storage system capable of storing articles at high density and high sealing degree.

[0006] (1) A storage system according to one aspect of the present invention comprises: a first mounting section on which a first container for storing a plurality of articles is placed; a transfer device for taking out a plurality of articles stored in the first container placed on the first mounting section and transferring each of the taken-out articles to a holding member; a storage device for stacking the articles held by the holding member to form a laminate, and storing the laminate in a second container that can accommodate articles at a higher density than the first container and can seal the internal space for storing the articles; a storage device having a second mounting section on which the second container is placed and suspended from the ceiling; and a relay device for transporting the second container containing the laminate between the storage device and the second mounting section.

[0007] In this storage system configuration, a laminate consisting of retaining members that hold each individual item is stored in a second container, which is capable of holding items at a higher density than the first container, thus enabling high-density storage of items. Furthermore, in this storage system configuration, a laminate consisting of retaining members that hold each individual item is stored in a second container whose internal space for storing items can be sealed, thus enabling high-degree airtight storage of items.

[0008] (2) In the storage system described in (1) above, the storage device may further include a plurality of storage shelves for storing the second containers, and a transport device for transporting the second containers between the second placement section and the storage shelves. In this configuration, the relay device does not need to move between the storage device and the second placement section as a storage location, but only between the storage location and the second placement section as a transfer location to the transport device. This makes it possible to increase the transport efficiency of the relay device, and consequently increase the transport efficiency of the storage system.

[0009] (3) In the storage system described in (1) or (2) above, the second container has a lid portion having an upper portion that covers the top of the stacked material and a lateral portion that covers the sides of the stacked material, and a bottom portion having a lower portion that covers the bottom of the stacked material and that can be fitted into the lid portion, and the internal space is formed by the space enclosed by the lid portion and the bottom portion when the lid portion and the bottom portion are fitted together, and the storage device may fit the lid portion and the bottom portion together so that the stacked material is placed in the internal space. In this configuration, since the articles are stored in the internal space of the closed space enclosed by the lid portion and the bottom portion, the degree of airtightness can be increased with a simple configuration.

[0010] (4) In the storage system described in any one of (1) to (3) above, the relay device may have a main body that is movable along a guide section suspended from the ceiling, and a gripping section suspended from the main body that grips the second container. This configuration increases the degree of freedom in arranging the storage device relative to the storage device.

[0011] (5) In the storage system described in (4) above, the relay device may further have a rotating part that rotates the gripping part around an axis that extends vertically relative to the main body. In this configuration, the orientation of the second container can be changed arbitrarily, which further increases the degree of freedom in arranging the storage device relative to the storage device.

[0012] (6) In the storage system described in any one of (1) to (5) above, the multiple storage shelves are arranged along the first direction, the conveying device is configured to travel along a track extending along the first direction, the relay device is configured to move along the first direction, and the first mounting section may be arranged along the first direction. In this configuration, in an arrangement where the arrangement direction of the multiple storage shelves and the arrangement direction of the first mounting section coincide, the relay device can appropriately relay the second container between the transfer device and the second mounting section.

[0013] (7) In the storage system described in any one of (1) to (5) above, the multiple storage shelves are arranged along a first direction, the transport device is configured to travel along a track extending along the first direction, the relay device is configured to move along a second direction perpendicular to the first direction, and the first mounting section may be arranged along the second direction. In this configuration, in an arrangement where the arrangement direction of the multiple storage shelves and the arrangement direction of the first mounting section are perpendicular to each other, the relay device can appropriately relay the second container between the transfer device and the second mounting section.

[0014] (8) The storage system described in any one of (1) to (7) above may further include a plurality of third mounting sections on which second containers can be placed, which are arranged to be transferable by a relay device. In this configuration, second containers that are to be stored for a relatively long period of time can be stored in the storage device, and second containers that are to be released in a relatively short period of time can be stored in the third mounting sections. As a result, second containers that are to be released in a relatively short period of time can be released in a shorter time than second containers that are to be stored for a relatively long period of time, thereby improving transport efficiency.

[0015] According to one aspect of the present invention, articles can be stored at high density and with a high degree of airtightness.

[0016] Figure 1 is a plan view showing an overall overview of a storage system according to one embodiment. Figure 2 is a side view taken along line II-II shown in Figure 1. Figure 3 is an exploded perspective view of a wafer container showing a laminated structure stored inside. Figure 4(A) is a perspective view of the lid of the wafer container included in Figure 3, taken from diagonally above. Figure 4(B) is a perspective view of the lid of the wafer container included in Figure 3, taken from diagonally below. Figure 5(A) is a perspective view of the bottom of the wafer container included in Figure 3, taken from diagonally above. Figure 5(B) is a perspective view of the bottom of the wafer container included in Figure 3, taken from diagonally below. Figure 6(A) is a perspective view of the retaining part of the wafer container included in Figure 3, taken from diagonally above. Figure 6(B) is a perspective view of the retaining part of the wafer container included in Figure 3, taken from diagonally below. Figure 7 is a perspective view of the wafer container with a laminated structure stored inside, taken from diagonally below. Figure 8 is a perspective view of the cell ring that holds the wafer, taken from diagonally above. Figure 9 is a perspective view of the laminated structure, in which the cell rings that hold the wafers are stacked, taken from diagonally above. Figure 10 is a front view of the first overhead transport vehicle, seen from the front. Figure 11 is a perspective view of the robot arm included in the transfer device, seen from diagonally above. Figure 12 is a front view of the inside of the ring opener included in the storage device, seen from the front. Figure 13 is a diagram illustrating the operation of the ring opener. Figure 14 is a diagram illustrating the operation of the ring opener. Figure 15(A) is a top view of the container mounting section of the ring opener, seen from above. Figure 15(B) is a perspective view of the switching device provided in the container mounting section, seen from diagonally above. Figure 16 is a side view of the second overhead transport vehicle, seen from the side. Figure 17 is a plan view showing an overall overview of the storage system according to a modified example. Figure 18 is a side view of the storage system according to a modified example, further comprising a pre-device storage device. Figure 19(A) is a front view of the pre-device storage device of Figure 18, seen from the front. Figure 19(B) is a side view of the pre-device storage device of Figure 18, seen from the side. Figure 20 is a plan view showing an overall overview of the storage system according to a further modified example.

[0017] The following describes a storage system 1 according to one embodiment with reference to the drawings. In the description of the drawings, the same elements are denoted by the same reference numerals, and redundant explanations are omitted. The dimensional ratios in the drawings do not necessarily match those in the description. Also, for the sake of explanation, the directions in Figures 1, 2, 10, 17, 18, and 20 will be described using the XYZ coordinate system. In this XYZ coordinate system, the plane parallel to the horizontal plane is defined as the XY plane. In this XY plane, the travel direction of the first overhead transport vehicle 2 (hereinafter referred to as "first transport vehicle 2") and the second overhead transport vehicle 57 (hereinafter referred to as "second transport vehicle 57"), and the first sliding direction of the relay device 60 are denoted as the X direction, and the direction perpendicular to the X direction in the XY plane is denoted as the Y direction. The direction perpendicular to the XY plane is denoted as the Z direction. The X direction (first direction), Y direction (second direction), and Z direction (vertical direction) are perpendicular to each other.

[0018] The storage system 1 shown in Figures 1 and 2 is a system that takes out wafers (items) W stored in a FOUP (Front Opening Unified Pod: first container) 70, stores them in a wafer container (second container) 80, and then puts the wafer container 80 containing the wafers W into a storage device 50. The storage system 1 is also a system that takes out wafers W from the wafer container 80 that has been taken out of the storage device 50, and stores the taken out wafers W in a FOUP 70. The wafer container 80 is a container that can accommodate wafers W in a higher density and more airtight state than the FOUP 70.

[0019] The wafer W is, for example, disc-shaped. However, the wafer W does not have to be disc-shaped. The wafer W may have a shape in which a part of the disc is missing (for example, a flat notch cut along a straight line corresponding to a chord, or a notched notch in which a part of the periphery is cut in a triangular shape). The wafer W has at least an arc portion. The center of the wafer W is determined with respect to the said arc portion.

[0020] First, the FOUP 70 and wafer container 80 used in the storage system 1 will be described. The FOUP 70 has a box body 71 having an opening that opens horizontally, a lid 72 that covers the opening, and a flange 73 that is positioned on the top of the box body 71 and is gripped by a chuck provided on the lifting platform 3E of the first transport vehicle 2, which will be described in detail later. The FOUP 70 is suspended and held by the first transport vehicle 2 by the flange 73 being gripped by the chuck.

[0021] As shown in Figure 3, the wafer container 80 houses a laminated body ST of cell rings (holding members) 90 that hold (support) the wafer W. Note that the wafer W is not shown in Figure 3. The wafer container 80 has a lid portion 81, a bottom portion 84, and a cover portion 87. The wafer container 80 houses the laminated body ST, which is held between the bottom portion 84 and the cover portion 87, and is covered from above by the lid portion 81. The lid portion 81, the bottom portion 84, and the cover portion 87 are made of a material such as resin.

[0022] As shown in Figures 3, 4(A), and 4(B), the lid portion 81 has an upper surface portion 81A, a side portion 81B, a flange 81C, a rim portion 81D, and a locking portion 81E. The upper surface portion 81A covers the top of the laminate ST. The upper surface portion 81A is formed in a rectangular shape in plan view. The side portion 81B covers the sides of the laminate ST. The side portion 81B is a member consisting of four surfaces that hang down from the four outer edges of the upper surface portion 81A. Flanges 81C are formed on two of the four surfaces of the side portion 81B that are opposite each other. Each of the four surfaces of the side portion 81B is formed in a rectangular shape when viewed from the horizontal direction.

[0023] The flange 81C is the part that is gripped by the chuck 65A provided on the lifting section 65 of the relay device 60. The flange 81C is located on two of the four side portions 81B that are facing each other. The flange 73 of the FOUP 70, which has a similar function, is formed on the upper surface of the box body 71, whereas the flange 81C of the wafer container 80 is formed on the side portion 81B of the lid portion 81, which is the difference between the two.

[0024] The flange portion 81D is the part into which the base portion 84 is fitted. The flange portion 81D is located at the lower end of the lateral portion 81B in the vertical direction. In other words, the flange portion 81D is provided on the side of the lateral portion 81B opposite to the upper surface portion 81A in one direction. The flange portion 81D has a protruding portion 81Da that extends horizontally at the lower end of the lateral portion 81B and a hanging portion 81Db that hangs down from the protruding portion 81D. The flange portion 81D is formed in an L-shape in cross-section. The flange portion 81D is formed such that when the base portion 84 is inserted into the flange portion 81D from below, the upper surface of the periphery of the base portion 84 and the inner surface of the protruding portion 81D come into contact with each other via an elastic member 84F, which will be described in detail later.

[0025] The locking portion 81E is the part that locks the bottom portion 84, which is fitted into the flange portion 81D. The locking portion 81E is attached to four hanging portions 81Db that hang down from the four outer edges of the protruding portion 81Da. Two locking portions 81E are attached to each of the four hanging portions 81Db, which are opposite pairs of hanging portions 81Db, for a total of four. The locking portions 81E are attached to the hanging portions 81Db so that two locking portions 81E are slidable in opposing directions. The locking portion 81E is formed to be operable by a switching device 29B, which will be described in detail later.

[0026] As shown in Figures 3, 5(A), and 5(B), the bottom portion 84 has a main surface portion 84A, a locking portion 84B, a protrusion 84C, a support portion 84D, a gas supply portion 84E, and an elastic member 84F. The main surface portion 84A covers the bottom of the laminate ST. The main surface portion 84A is a rectangular plate-shaped member. In plan view, the main surface portion 84A is formed to be slightly larger than the laminate ST (cell ring 90). A recess 84G is formed on the lower surface of the main surface portion 84A, which fits into a positioning portion 57E formed on the transfer portion 57D of the second transport vehicle 57 and protruding upward.

[0027] The locking portion 84B is a portion that can be locked to the locking portion 81E. Two locking portions 84B are formed on each of the two opposing sides of the four sides of the main surface portion 84A. The locking portions 84B are recesses formed on the lower surface of the main surface portion 84A that can be locked by the locking portion 81E. Figure 7 shows the bottom portion 84 locked by the locking portion 81E of the lid portion 81. The elastic member 84F is arranged on the periphery of the main surface portion 84A. The elastic member 84F contacts the flange portion 81D when the lid portion 81 is locked. The elastic member 84F is made of a material such as rubber. That is, in the locked state, the bottom portion 84 and the lid portion 81 of the wafer container 80 are in contact with each other via the elastic member 84F.

[0028] As shown in Figures 3, 5(A), and 5(B), the protrusion 84C is a part that positions the cell ring 90 that forms the laminate ST. The protrusion 84C is formed on the upper surface of the main surface 84A and is arranged to face each other diagonally among the four corners. The support part 84D is a part that supports a part of the cell ring 90 that holds the wafer W. The support part 84D is formed on the upper surface of the main surface 84A and is formed to protrude above the main surface 84A. The gas supply part 84E is a part to which inert gas is supplied from a nozzle (not shown) installed on the lifter 26B. The wafer container 80 is supplied with inert gas from the outside via the gas supply part 84E.

[0029] As shown in Figures 3, 6(A), and 6(B), the cover portion 87 is a member that contacts the upper surface of the laminate ST and covers the laminate ST from above. The cover portion 87 functions as a member that prevents the wafer W, which is placed on the cell ring 90 located at the uppermost stage of the laminate ST, from being exposed and protects it from dust. The cover portion 87 has a frame portion 87A, an inner surface portion 87B, an upper surface portion 87C, and a positioning portion 87D.

[0030] The frame portion 87A is formed in a frame shape. In a plan view, the frame portion 87A is formed to be the same size as the laminate ST (cell ring 90). The frame portion 87A has thickness in the height direction. The inner surface portion 87B is formed to be able to contact the laminate ST (cell ring 90) when the laminate ST (cell ring 90) is stored in the wafer container 80, and the upper surface portion 87C is formed to face the inner surface of the upper surface portion 81A of the lid portion 81. The positioning portion 87D is formed on the frame portion 87A and is arranged to face each other diagonally among the four corners.

[0031] As shown in Figures 3 and 7, the wafer container 80 has an internal space S formed by the space enclosed by the lid 81 and the bottom 84 when the bottom 84 is fitted into the flange 81D of the lid 81. The wafer container 80 stores the laminate ST and the cover 87 in the internal space S. The wafer container 80 is fitted with the lid 81 and the bottom 84 by the storage device 30, which will be described in detail later, so that the laminate ST and the cover 87 are arranged in the internal space S. In addition, the locking portion 81E of the lid 81 is operated by the switching device 29B of the storage device 30 and is locked into the locking portion 84B of the bottom 84.

[0032] Next, the cell ring 90 that forms the laminate ST will be described. The cell ring 90 is, for example, a molded product made of resin. As shown in Figures 8 and 9, the cell ring 90 comprises a rectangular outer frame 91, a holding portion 93, a first channel forming portion 94, and a second channel forming portion 95.

[0033] The outer frame 91 is formed in a rectangular shape, for example, a rectangular or square shape. The holding portion 93 protrudes inward from the outer frame 91. The holding portion 93 supports the wafer W from below. Multiple (for example, four) holding portions 93 are formed. The holding portion 93 protrudes above the outer frame 91, for example, and holds the wafer W above the outer frame 91. The multiple holding portions 93 are arranged to be located on a virtual circumference equal to the diameter of the wafer W. The holding portion 93 supports the wafer W at the horizontal tip of the holding portion 93.

[0034] Furthermore, in two cell rings 90, 90 adjacent to each other in the vertical direction, the cell rings 90 may be designed so that the retaining portions 93, 93 provided in a certain part of the circumferential direction are slightly offset from each other in the circumferential direction. Such circumferential offset between the retaining portions 93, 93 can be achieved by rotating the cell ring 90 by 180°.

[0035] The first channel forming section 94 is connected to a part of the outer frame 91, forming an opening OP that penetrates vertically. The opening OP forms an inert gas channel P1 when the cell rings 90 are stacked (when the stacked body ST is formed). When placed on the ring opener 25, the channel P1 forms an upward channel through which the inert gas supplied via the gas supply section 84E at the bottom 84 flows from below to above. In addition, the gaps between adjacent first channel forming sections 94, 94 in the stacking direction form a supply port for supplying inert gas to the region where the wafer W is held.

[0036] The second channel forming section 95 is connected to a part of the outer frame 91, forming an opening OP that penetrates vertically. When the cell rings 90 are stacked (when the stacked body ST is formed), the opening OP forms an inert gas channel P2. When placed on the ring opener 25, the channel P2 forms a downward channel through which the inert gas supplied via channel P1 flows from top to bottom. In addition, the gaps between adjacent second channel forming sections 95, 95 in the stacking direction form suction ports that draw in inert gas from the area where the wafer W is held. In the storage device 30, the cleanliness can be further enhanced by forming such an inert gas supply path (forming a purging facility).

[0037] Each cell ring 90 is provided with, for example, a hole 98 and a projection 99 at its corner. Another cell ring 90 is stacked on top of one cell ring 90, rotated 180 degrees relative to that cell ring 90. At this time, the projection 99 of one cell ring 90 is inserted into the hole 98 of the other cell ring 90, thereby positioning the multiple cell rings 90. As shown in Figure 9, the multiple cell rings 90 have the same outer shape and are stacked tightly in the vertical direction. A laminate ST is formed by stacking the multiple cell rings 90 that hold the wafer W. The multiple cell rings 90 constitute a container body 90A that houses the wafer W.

[0038] The stacked structure of the multiple cell rings 90 can be realized by known structures, mechanisms, and / or methods, for example, as disclosed in International Publication No. 2021 / 044791.

[0039] As shown in Figures 1 and 2, the storage system 1 comprises a transfer device 10, a storage device 50, and a relay device 60. In Figure 1, for the sake of explanation, only the lifting and lowering section 65 of the relay device 60 is shown.

[0040] The transfer device 10 is a device that takes out a wafer W stored in the FOUP 70 and stores it in the wafer container 80, or takes out a wafer W stored in the wafer container 80 and stores it in the FOUP 70. The transfer device 10 has a first port (first mounting section) 11, a replacement device 20, and a storage device 30.

[0041] The first port 11 is on which the FOUP 70 for storing the wafer W is placed. The first port 11 is used to transfer the FOUP 70 between the first transport vehicle 2 or the worker and the transfer device 20. The first port 11 is located below the track 6 on which the first transport vehicle 2 travels. In this embodiment, multiple (for example, four) first ports 11 are arranged along the extending direction of the track 6.

[0042] Here, the first transfer vehicle 2 will be described. As shown in FIG. 1, the first transfer vehicle 2 travels in one direction D1 along the track 6 and transfers the FOUP 70. The first transfer vehicle 2 is configured to be able to transfer the FOUP 70. The first transfer vehicle 2 is an overhead traveling type autonomous guided vehicle. The first transfer vehicle 2 includes a main body part 3, a traveling part 4, and a transfer vehicle controller 5.

[0043] The main body part 3 includes a main body frame 3A, a lateral feed part 3B, a θ drive 3C, a lifting drive part 3D, a lifting platform 3E, and a fall prevention cover 3F. The lateral feed part 3B laterally feeds the θ drive 3C, the lifting drive part 3D, and the lifting platform 3E together in a direction perpendicular to the extending direction of the track 6. The θ drive 3C rotates at least one of the lifting drive part 3D and the lifting platform 3E within a predetermined angle range in the horizontal plane. The lifting drive part 3D raises and lowers the lifting platform 3E by winding or unwinding a suspension material such as a wire, a rope, and a belt.

[0044] The lifting platform 3E is provided so as to be able to move up and down with respect to the lifting drive part 3D. A chuck 3Ea is provided on the lifting platform 3E, and the FOUP 70 can be freely gripped or released. The fall prevention cover 3F is provided, for example, in a pair before and after the traveling direction of the first transfer vehicle 2. The fall prevention cover 3F prevents the FOUP 70 from falling during transfer by causing a claw or the like (not shown) to protrude and retract below the FOUP 70 being transferred.

[0045] The traveling part 4 is configured to include a motor or the like, and causes the first transfer vehicle 2 to travel along the track 6. The traveling part 4 has, for example, a power receiving communication part 4A that receives power from the track 6 side by non-contact power supply. The transfer vehicle controller 5 is an electronic control unit including a CPU (Central Processing Unit), a ROM (Read Only Memory), a RAM (Random Access Memory), and the like. The transfer vehicle controller 5 controls various operations in the first transfer vehicle 2.

[0046] Returning to FIGS. 1 and 2, the wafer replacement device 20 takes out wafers W stored in a FOUP 70 placed on the first port 11, holds each of the taken-out plurality of wafers W in a cell ring 90 (held by a cell ring 90 held at an interval by a storage device 30), and is a device that transfers the wafers W to the cell ring 90. Further, the wafer replacement device 20 takes out wafers W from the cell ring 90 held at an interval by the storage device 30 and transfers them to the FOUP 70 placed on the first port 11. The wafer replacement device 20 is mainly constituted by a robot arm 21.

[0047] The robot arm 21 takes out wafers W stored in a FOUP 70 placed on the first port 11 and holds each of the taken-out plurality of wafers W in a cell ring 90 accommodated in a ring opener 25. The robot arm 21 is, for example, a horizontal articulated robot. As shown in FIG. 11, the robot arm 21 has two arms 22A and 22B, two slide forks 23A and 23B, and a base 24.

[0048] The two arms 22A and 22B are fixed to the base 24. One end of the arm 22A is connected to the upper surface of the base 24, and the other end is connected to the proximal end of the slide fork 23A. One end of the arm 22B is connected to the upper surface of the base 24, and the other end is connected to the proximal end of the slide fork 23B. The proximal ends of the two arms 22A and 22B are rotatably provided by a drive unit (not shown). Each of the two slide forks 23A and 23B is moved by scooping up the wafer W.

[0049] The robot arm 21 transfers the wafers W to each cell ring 90 supported by a first ring support portion 27A and a third ring support portion 28A, which will be described later. More specifically, the slide fork 23A transfers the wafer W to each cell ring 90 supported by the first ring support portion 27A, and the slide fork 23B transfers the wafer W to each cell ring 90 supported by the third ring support portion 28A. The robot arm 21 is not limited to the above configuration, and various known devices such as an EFEM (Equipment Front End Module) can also be used.

[0050] The storage device 30 holds the wafers W received from the transfer device 20 in the cell rings 90, stacks the wafers W held by the cell rings 90 to form a laminate ST, and stores the formed laminate ST in the wafer container 80. The storage device 30 also removes the laminate ST from the wafer container 80 and opens the gaps between the cell rings 90 that hold the wafers W forming the removed laminate ST, so that the wafers W held by the cell rings 90 can be transferred to the transfer device 20. The storage device 30 includes a ring opener 25 and a container mounting section 29.

[0051] The ring opener 25 is a device for opening (separating) multiple stacked cell rings 90 (laminated ST) in the vertical direction in order to allow the robot arm 21 to access the stacked cell rings 90. The ring opener 25 is also a device for selectively closing (bringing together) the spaces between multiple cell rings 90 in order to stack the vertically opened (separated) cell rings 90 to form a laminate ST, in order to allow the robot arm 21 to access them.

[0052] As shown in Figure 12, the ring opener 25 comprises a base 26A, a lifter (lifting platform) 26B, a pair of ball screws 26C, 26C, a linear guide 26D, a first opening / closing module 27, a second opening / closing module 28, a housing 26E, and a suction device 26F.

[0053] The base 26A is installed at the bottom of the housing 26E. The base 26A houses various mechanisms. The inside of the base 26A is maintained under negative pressure, for example, by an exhaust fan. The lifter 26B is configured to be able to move up and down on the base 26A. Multiple cell rings 90 are arranged on the lifter 26B in a stacked state (stacked body ST). The lifter 26B raises and lowers the stacked body ST, which is supported by the bottom 84. By raising and lowering the stacked body ST placed on the bottom 84, the lifter 26B inserts and removes the stacked body ST into and out of the wafer container 80 through the opening 29C. An elastic member 26Ba is provided on the lifter 26B to support the outer edge of the bottom 84. Examples of elastic members include materials such as rubber. The elastic member 26Ba may be formed in a frame shape along the outer edge of the bottom 84, or it may be intermittent along the outer edge.

[0054] The ball screw 26C is a drive mechanism that drives the lifter 26B. For example, a drive unit that rotates the ball screw 26C around its axis is provided at one end of the ball screw 26C (for example, the end on the base 26A side). The lifter 26B is integrally provided with a female threaded portion (not shown) which is screwed into the ball screw 26C. When the ball screw 26C is rotationally driven by the drive unit, the female threaded portion screwed into the ball screw 26C moves vertically, and the lifter 26B, which is integrally formed with the female threaded portion, moves vertically. Alternatively, another known drive mechanism capable of driving the lifter 26B (for example, a belt drive mechanism) may be used instead of the ball screw 26C. The linear guide 26D guides the raising and lowering of the lifter 26B. The linear guide 26D is fixed to the base 26A.

[0055] The first opening / closing module 27 has a first ring support portion 27A and a second ring support portion 27B capable of supporting the cell ring 90. The second ring support portion 27B supports another cell ring 90 adjacent to the cell ring 90 supported by the first ring support portion 27A, at a position above the holding position of the cell ring 90 supported by the first ring support portion 27A. The first opening / closing module 27 forms a gap between the cell ring 90 supported by the first ring support portion 27A and the cell ring 90 supported by the second ring support portion 27B, through which the slide fork 23A of the robot arm 21 can enter.

[0056] The second opening / closing module 28, like the first opening / closing module 27, has a third ring support portion 28A and a fourth ring support portion 28B capable of supporting the cell ring 90. The fourth ring support portion 28B supports another cell ring 90 adjacent to the cell ring 90 supported by the third ring support portion 28A, at a position above the holding position of the cell ring 90 supported by the third ring support portion 28A. The second opening / closing module 28 forms a gap between the cell ring 90 supported by the third ring support portion 28A and the cell ring 90 supported by the fourth ring support portion 28B, through which the slide fork 23B of the robot arm 21 can enter.

[0057] The housing 26E forms a lifting space S1 through which the stacked body ST is raised and lowered by the lifter 26B. The lifting space S1 is located above the base 26A. The suction device 26F is provided on the housing 26E. The suction device 26F sucks gas from the lifting space S1 through the suction port 26Fa. That is, the suction device 26F sucks up dust and other particles floating in the lifting space S1. The suction port 26Fa of the suction device 26F is located on at least one of the sides and below the lifting space S1. In this embodiment, the suction device 26F is located below the lifting space S1.

[0058] The container mounting section 29 is the part that places (stores) the laminated body ST in the internal space S. The container mounting section 29 is provided on the upper surface 26Ea of the housing 26E. The container mounting section 29 is located above the ring opener 25 (lifter 26B). The container mounting section 29 forms a recessed area that is recessed from the upper surface 26Ea of the housing 26E. The container mounting section 29 supports the periphery of the lid 81. More specifically, the container mounting section 29 places the periphery of the lid 81 from the outside of the opening 29C through which the laminated body ST, supported by the bottom 84, can pass. An elastic member 29A that supports the periphery of the lid 81 is provided on the container mounting section 29.

[0059] A switching device 29B is provided in the container mounting section 29. The switching device 29B switches between a locked state in which the locking portion 81E locks the bottom portion 84 to the lid portion 81, and an unlocked state in which the locking portion 81E does not lock the bottom portion 84 to the lid portion 81. The switching device 29B is operated by a drive unit (not shown).

[0060] Here, the operation of transferring the wafer W to the cell ring 90 by the ring opener 25 and the operation of storing the laminate ST consisting of the cell ring 90 into the wafer container 80 by the container mounting section 29 will be explained mainly with reference to Figures 12 to 14. First, the operation when storing the wafer W in an empty laminate ST in which no wafer W is held in the container mounting section 29 will be explained. As shown in Figure 13 (1), when an empty laminate ST in which no wafer W is held is placed on the container mounting section 29, the locking section 81E is switched to an unlocked state by the switching device 29B. This releases the engagement between the lid section 81 and the bottom section 84.

[0061] Next, as shown in Figure 13 (2), with the engagement between the lid 81 and the bottom 84 released, the lifter 26B descends to a first predetermined position. When the lifter 26B descends to the first predetermined position and stops, as shown in Figure 14 (3), the fourth ring support portion 28B supports the predetermined cell ring 90. Then, with the fourth ring support portion 28B supporting the predetermined cell ring 90, the lifter 26B descends to a second predetermined position. When the lifter 26B descends to the second predetermined position and stops, the third ring support portion 28A supports the predetermined cell ring 90. As a result, a gap is formed between the cell ring 90 supported by the fourth ring support portion 28B and the cell ring 90 supported by the third ring support portion 28A, into which the slide fork 23B of the robot arm 21 can enter. In this state, the slide fork 23B of the robot arm 21 causes the cell ring 90 to hold the wafer W.

[0062] Next, with the third ring support portion 28A supporting the predetermined cell ring 90, the lifter 26B descends to the third predetermined position. When the lifter 26B descends to the third predetermined position and stops, the second ring support portion 27B supports the predetermined cell ring 90. Then, with the second ring support portion 27B supporting the predetermined cell ring 90, the lifter 26B descends to the fourth predetermined position. When the lifter 26B descends to the fourth predetermined position and stops, the first ring support portion 27A supports the predetermined cell ring 90. As a result, a gap is formed between the cell ring 90 supported by the second ring support portion 27B and the cell ring 90 supported by the first ring support portion 27A, into which the slide fork 23A of the robot arm 21 can enter. In this state, the slide fork 23A of the robot arm 21 causes the cell ring 90 to hold the wafer W.

[0063] Next, the lifter 26B begins to rise. Specifically, the lifter 26B waits at the fourth predetermined position for the first ring support 27A to release its support of the cell ring 90. Once the first ring support 27A releases its support of the cell ring 90, the lifter 26B rises to the third predetermined position and stops, waiting for the second ring support 27B to release its support of the cell ring 90. Once the second ring support 27B releases its support of the cell ring 90, the lifter 26B rises to the second predetermined position and stops, waiting for the third ring support 28A to release its support of the cell ring 90. Once the third ring support 28A releases its support of the cell ring 90, the lifter 26B rises to the first predetermined position and stops, waiting for the fourth ring support 28B to release its support of the cell ring 90.

[0064] As shown in Figure 14 (4), when the support of the cell ring 90 by the fourth ring support portion 28B is released, the lifter 26B rises to the container mounting portion 29 and stops. The lid portion 81 is placed on the container mounting portion 29. The lifter 26B raises and lowers the laminated body ST placed on the bottom portion 84, thereby allowing the laminated body ST to enter the lid portion 81 through the opening 29C. When the laminated body ST enters the lid portion 81, the locking portion 81E is switched to the locked state by the switching device 29B. As a result, the lid portion 81 and the bottom portion 84 are fitted together, and the bottom portion 84 engages with the lid portion 81.

[0065] The storage device 50 is a device for storing wafer containers 80. The storage device 50 has a second port (second mounting section) 51, a plurality of storage shelves 53, and a second transport cart (transport device) 57. The storage device 50 is positioned suspended from the ceiling C of a building such as a factory.

[0066] The second port 51 is where the wafer container 80 is placed. The second port 51 is used to transfer the wafer container 80 between the second transport vehicle 57 and the relay device 60. In the Y direction, the second port 51 is located between the track 59 on which the second overhead transport vehicle 57 travels and the relay device 60. In this embodiment, multiple (for example, four) second ports 51 are arranged along the extending direction of the track 59. The second port 51 supports the lower surface of the bottom 84 of the wafer container 80 from below with a pair of support parts 51A, 51A. In the X direction, the pair of support parts 51A, 51A are spaced apart so that the transfer part 57D of the second transport vehicle 57 can pass through.

[0067] The storage rack 53 stores the wafer container 80. The storage rack 53 supports the lower surface of the bottom 84 of the wafer container 80 from below with a pair of support parts 53A, 53A. In the X direction, the pair of support parts 53A, 53A are spaced apart so that the transfer part 57D of the second transport vehicle 57 can pass through. Multiple storage racks 53 are arranged in the X and Z directions. In this embodiment, three storage racks 53 are arranged in the Z direction, and the uppermost of some of them has the second port 51 as described above. In this embodiment, the storage rack 53 has been described as an open configuration exposed to the outside, but it may also be arranged inside a closed space that is closed off by a wall or the like so that it is not exposed to the outside.

[0068] As shown in Figures 1, 2, and 16, the second transport vehicle 57 transports wafer containers 80 between the second port 51 and the storage racks 53. The second transport vehicle 57 also transports wafer containers 80 between the storage racks 53 in the storage device 50. The second transport vehicle 57 may be deployed as a single unit or as a multiple unit (for example, two units). The second transport vehicle 57 comprises a traveling carriage 57A, two masts 57B, 57B, a lifting platform 57C, and a transfer unit 57D.

[0069] The traveling carriage 57A travels in the X direction along a track 59 suspended from the ceiling C by a traveling drive unit (not shown). The two masts 57B, 57B are rectangular prism-shaped members extending in the Z direction and are spaced apart in the X direction. The lifting platform 57C is stretched across the two masts 57B, 57B. The lifting platform 57C moves up and down along the two masts 57B, 57B by a lifting drive unit (not shown). The lifting platform 57C is provided with a transfer section 57D for transferring wafer containers 80. The transfer section 57D uses, for example, a robot arm to support the lower surface of the bottom 84 of the wafer container 80. The transfer section 57D has a positioning section 57E that protrudes upward.

[0070] As shown in Figures 1 and 2, the relay device 60 transports the wafer container 80 containing the laminate ST between the storage device 30 and the second port 51. The relay device 60 includes a suspension support section (guide section) 61, a first slide section (guide section) 62, a second slide section (main body section) 63, and a lifting section 65.

[0071] The suspension support section 61 is suspended from the ceiling. The suspension support section 61 is a member that supports the first slide section 62 so that it can slide in the X direction. The X direction is the arrangement direction of the first port 11 and the storage rack 53, and the direction of travel of the first transport vehicle 2 and the traveling trolley 57A. The first slide section 62 moves in the X direction by a drive unit (not shown). The first slide section 62 is a member that supports the second slide section 63 so that it can slide in the Y direction. The Y direction is perpendicular to the sliding direction of the first slide section 62. The second slide section 63 moves in the Y direction by a drive unit (not shown). The second slide section 63 raises and lowers the lifting section 65 by winding or unwinding a suspension material 63A such as a wire, rope, or belt.

[0072] The lifting section 65 is provided so as to be able to move up and down relative to the second sliding section 63. The lifting section 65 is provided with a chuck (gripping section) 65A that can freely grip or release the flange 81C of the wafer container 80. The relay device 60 receives the wafer container 80 from one of the two storage devices 30 and delivers the wafer container 80 to one of the four second ports 51. The relay device 60 also receives the wafer container 80 from one of the four second ports 51 and delivers the wafer container 80 to one of the two storage devices 30.

[0073] The effects and advantages of the storage system 1 of the above embodiment will now be explained. In the storage system 1 of the above embodiment, a laminated structure ST consisting of cell rings 90 holding each wafer W is stored in a wafer container 80 that can accommodate wafers W at a higher density than FOUP 70, so wafers W can be stored at high density. Furthermore, in the storage system 1 of the above embodiment, a laminated structure ST consisting of cell rings 90 holding each wafer W is stored in a wafer container 80 that can seal the internal space S for accommodating wafers W, so wafers W can be stored with a high degree of airtightness. Moreover, in the storage system 1 of the above embodiment, since the storage device 50 is suspended and supported from the ceiling, the floor area occupied by the equipment in the factory building can be reduced (footprint reduction).

[0074] Furthermore, in the storage system 1 of the above embodiment, the storage area of ​​the wafer container 80 of the storage device 50 suspended from the ceiling is not a closed space but is open to the outside. Since the wafer container 80 itself can store wafers W in a highly airtight state, wafers W can be stored in a highly clean environment.

[0075] In the storage system 1 of the above embodiment, since the wafer W is stored in the internal space S of the closed space surrounded by the lid portion 81 and the bottom portion 84, the degree of airtightness can be increased with a simple configuration.

[0076] In the storage system 1 of the above embodiment, the relay device 60 has a second slide portion 63 that is movable along a suspension support portion 61 suspended and supported from the ceiling C, and a chuck 65A that is suspended from the second slide portion 63 and grips the wafer container 80. This configuration increases the degree of freedom in arranging the storage device 50 relative to the storage device 30.

[0077] In the storage system 1 of the above embodiment, the plurality of storage shelves 53 are arranged along the X direction, the first transport vehicle 2 is configured to travel on a track 6 extending along the X direction, and the relay device 60 is configured to move along the X direction. In this configuration, in an arrangement where the arrangement direction of the plurality of storage shelves 53 coincides with the arrangement direction of the first port 11, the relay device 60 can appropriately relay the wafer container 80 between the transfer device 20 and the second port 51.

[0078] Although one embodiment has been described above, one aspect of the present invention is not limited to the above embodiment. Various modifications are possible without departing from the spirit of the invention.

[0079] In the above embodiment of the storage system 1, the first transport vehicle 2 is configured to travel along a track 6 extending in the X direction, and the relay device 60 is configured to move along the X direction. However, the system is not limited to this example. For example, as shown in Figure 17, the first transport vehicle 2 may be configured to travel along a track 6 extending in the Y direction, and the relay device 60 may also be configured to move along the Y direction. In such a modified storage system 1, in an arrangement where the arrangement direction of the plurality of storage shelves 53 and the arrangement direction of the first port 11 are orthogonal to each other, the relay device 60 can appropriately relay wafer containers 80 between the transfer device 20 and the second port 51.

[0080] In addition to the configuration of the storage system 1 in the above embodiment and the above modified example, the relay device 60 may further have a rotating part 63B (see Figure 2) that rotates the chuck 65A around an axis extending vertically relative to the first slide part 62. This configuration increases the degree of freedom in arranging the storage device 50 relative to the storage device 30.

[0081] In the above embodiment and the modified storage system 1, an example was given in which one transfer device 20, one storage device 30, and one relay device 60 are provided. However, depending on the scale of the system, at least one of the transfer device 20, storage device 30, and relay device 60 may be provided in multiple units. This makes it possible to store wafers W more efficiently in accordance with the cycle time requirements.

[0082] In addition to the configuration of the storage system 1 of the above embodiment and the above modified example, a pre-device storage device 40 as shown in Figures 18, 19(A), and 19(B) may be provided. The pre-device storage device 40 comprises a plurality (for example, four) of buffers (third mounting sections) 42, a plurality (for example, two) of load ports 43, a transfer device 46, and a drive device 47.

[0083] The buffer 42 is a shelf for storing wafer containers 80 and is configured to hold the wafer containers 80. The buffer 42 is fixed to a support member 41, for example, which is fixed to a housing that houses the transfer device 20 and the storage device 30. The buffer 42 is located in the space above the storage device 30. The load port 43 is a shelf for transferring wafer containers 80 between the pre-storage device 40 and the relay device 60. The load port 43 is configured to hold wafer containers 80. Similar to the buffer 42, the load port 43 is fixed to a support member 41 and is located in the space above the storage device 30.

[0084] The transfer device 46 lifts the wafer container 80 placed on the container mounting section 29, buffer 42, and load port 43, and places the wafer container 80 on the container mounting section 29, buffer 42, and load port 43. The transfer device 46 has, for example, two arms 46A, 46A configured to move vertically, and the two arms 46A, 46A transfer the wafer container 80 by supporting the flange 81C of the lid portion 81 of the wafer container 80 from below. The drive device 47 moves the transfer device 46 along guides that extend, for example, horizontally and vertically. The drive device 47 moves the transfer device 46 between the container mounting section 29 and buffer 42, between the container mounting section 29 and load port 43, between buffer 42 and load port 43, and between one load port 43 and another load port 43.

[0085] The transfer device 46 and the drive device 47 are supported by a housing 45 located on the opposite side of the storage device 30 from the side where the replacement device 20 is located. In this modified example, the relay device that transports the wafer container 80 between the storage device 30 and the storage device 50 consists of a transfer device 46 and a drive device 47 that transport the wafer container 80 between the storage device 30 and the load port 43, and a relay device 60 that transports the wafer container 80 between the load port 43 and the storage device 50.

[0086] Furthermore, the support member 41 that fixes the buffer 42 may not be fixed to the housing that houses the transfer device 20 and the storage device 30, but may be integrally formed with the housing 45. Also, the housing 45 integrally formed with the support member 41 may have wheels or the like that roll on the floor. In a storage system 1 with such a configuration, the pre-device storage device 40 can be attached to and detached from the housing that houses the transfer device 20 and the storage device 30.

[0087] In this modified configuration, wafer containers 80 intended for relatively long-term storage can be stored on the storage shelves 53 of the storage device 50, while wafer containers 80 intended for relatively short-term retrieval can be stored in the buffer 42 of the pre-storement device 40. As a result, wafer containers 80 intended for relatively short-term retrieval can be retrieved in a shorter time than wafer containers 80 intended for relatively long-term storage.

[0088] Furthermore, the transfer device 46 and the drive device 47 only need to be configured to move the wafer container 80, and are not limited to the configuration described above. Also, even if the pre-stored device 40 is replaced with a configuration in which multiple mounting sections (third mounting sections) that can be transferred by the relay device 60 of the above embodiment are provided, the above-described effects can still be obtained.

[0089] In the above embodiment and the above modified example of the storage system 1, the storage device 50 is equipped with a second transport cart 57 for transporting wafer containers 80 within the storage device 50. However, as shown in Figure 20, for example, the second overhead transport cart 57 does not necessarily have to be provided. In this case, for example, the relay device 60 described above may take on the role of the second transport cart 57, and the relay device 60 may be configured to directly transfer the wafers to the storage shelves 53 of the storage device 50.

[0090] In the above embodiment and the modified storage system 1, an example was given in which a purging facility is formed in the storage device 30 to further improve the cleanliness inside the storage device 30, but the system is not limited to this. Such a purging facility does not have to be formed in the storage device 30, and may be formed not only in the storage device 30, but also in the space in which the storage device 50 and the transfer device 20 are stored.

[0091] In the above embodiments and modifications, the second transport vehicle 57 with the configuration shown in Figure 16 was used as an example, but the invention is not limited thereto. For example, the second transport vehicle 57 may have the same configuration as the first overhead transport vehicle 2 shown in Figure 10. In this case, instead of or in addition to the storage racks 53 arranged to the side of the second transport vehicle 57, a storage rack 53 on which wafer containers 80 can be placed may be provided below the second transport vehicle 57. Furthermore, the second transport vehicle 57 may not be suspended from the ceiling, but may be configured to travel on a track.

[0092] In the storage device 30 of the above embodiment and the above modified example of the storage system 1, an example was given in which an elastic member 29A is provided on the container mounting section 29 to support the periphery of the lid 81. However, the elastic member 29A may not be provided, and the container mounting section 29 may directly support the periphery of the lid 81. Also, in the example given in which an elastic member 26Ba is provided on the lifter 26B to support the outer edge of the bottom 84 of the wafer container 80. However, the elastic member 26Ba may not be provided, and the lifter 26B may directly support the outer edge of the bottom 84. Furthermore, in the example given in which the bottom 84 and the lid 81 of the wafer container 80 are in contact with each other via an elastic member 84F when locked, the elastic member 84F may not be provided, and the bottom 84 and the lid 81 may be in direct contact.

[0093] 1...Storage system, 2...First overhead transport vehicle, 10...Transfer device, 11...First port (first mounting section), 20...Replacement device, 21...Robot arm, 25...Ring opener, 26B...Lifter (lifting platform), 26Ba...Elastic member, 26F...Suction device, 29...Container mounting section, 29A...Elastic member, 29B...Switching device, 29C...Opening, 30...Storage device, 40...Pre-device storage device, 42...Buffer (third mounting section), 43...Load port, 50...Storage device, 51...Second port (second mounting section) ), 53...Storage shelf, 57...Second overhead transport vehicle (transport device), 60...Transfer device, 61...Suspension support part (guide part), 62...First slide part (guide part), 63...Second slide part (main body part), 63B...Rotating part, 65A...Chuck (gripping part), 70...FOUP (first container), 80...Wafer container (second container), 81...Lid part, 84...Bottom part, 87...Cover part, 90...Cell ring (holding member), 90A...Container body, S...Internal space, S1...Lifting space, ST...Laminate, W...Wafer (article).

Claims

1. A storage system comprising: a first mounting section on which a first container for storing multiple articles is placed; a transfer device for taking out the multiple articles stored in the first container placed on the first mounting section and transferring each of the taken-out articles to a holding member; a storage device for stacking the articles held by the holding member to form a laminate, and storing the laminate in a second container capable of accommodating the articles at a higher density than the first container and capable of sealing the internal space for accommodating the articles; a storage device having a second mounting section on which the second container is placed and suspended from the ceiling; and a relay device for transporting the second container containing the laminate between the storage device and the second mounting section.

2. The storage system according to claim 1, further comprising: a plurality of storage shelves for storing the second containers; and a transport device for transporting the second containers between the second placement section and the storage shelves.

3. The storage system according to claim 1 or 2, wherein the second container has a lid portion having an upper portion that covers the top of the laminate and a lateral portion that covers the sides of the laminate, and a bottom portion having a lower portion that covers the bottom of the laminate and is fitted to the lid portion, and the internal space is formed by the space enclosed by the lid portion and the bottom portion when the lid portion and the bottom portion are fitted together, and the storage device fits the lid portion and the bottom portion together so that the laminate is placed in the internal space.

4. The storage system according to claim 1 or 2, wherein the relay device comprises a main body that is movable along a guide section suspended from the ceiling, and a gripping section suspended from the main body for gripping the second container.

5. The storage system according to claim 4, wherein the relay device further has a rotating part that rotates the gripping part around an axis extending vertically relative to the main body.

6. The storage system according to claim 2, wherein the plurality of storage shelves are arranged along a first direction, the transport device is configured to travel along a track extending along the first direction, the relay device is configured to move along the first direction, and the first mounting section is arranged along the first direction.

7. The storage system according to claim 2, wherein the plurality of storage shelves are arranged along a first direction, the transport device is configured to travel along a track extending along the first direction, the relay device is configured to move along a second direction perpendicular to the first direction, and the first mounting section is arranged along the second direction.

8. The storage system according to claim 1 or 2, further comprising a plurality of third mounting sections that are removably arranged by the relay device and on which the second container can be placed.

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