Mainboard and server
By placing the power module on the same side of the motherboard as the processor and combining it with a heat dissipation system, the problem of low power supply efficiency caused by long power supply paths is solved, achieving efficient power supply and improved stability.
WO2026113337A1PCT designated stage Publication Date: 2026-06-04INSPUR SUZHOU INTELLIGENT TECH CO LTD
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- INSPUR SUZHOU INTELLIGENT TECH CO LTD
- Filing Date
- 2025-06-16
- Publication Date
- 2026-06-04
AI Technical Summary
Technical Problem
The long power supply path between the processor and the power supply results in low power supply efficiency, which is especially noticeable in high-performance computers.
Method used
By placing the power supply module and processor on the same side of the motherboard, and using a combination of sockets and through holes, the power supply module and processor can overlap or be directly inserted in the same direction, shortening the power supply path, and effectively dissipating heat by combining heat-conducting components and a heat dissipation system.
Benefits of technology
It significantly improves power supply efficiency, reduces current loss, enhances processor stability and reliability, extends hardware lifespan, and maintains high performance in low-power conditions.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN2025101213_04062026_PF_FP_ABST
Abstract
The present application relates to the technical field of mainboard structures, and discloses a mainboard and a server. The mainboard comprises a board body, and a first power supply module. Specifically, a mounting portion for mounting a processor is provided on the board body. The first power supply module is disposed in the mounting portion, and overlaps with the mounting portion along a first direction, the first power supply module being used to supply power to the processor, and the first direction being perpendicular to the board body. The mainboard and the server disclosed in the present application solve or alleviate the problems of a power supply path between a processor and a power supply being long, and power supply efficiency being low.
Need to check novelty before this filing date? Find Prior Art