Support plate, display module, display apparatus and manufacturing method for support plate
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- BOE TECHNOLOGY GROUP CO LTD
- Filing Date
- 2025-10-15
- Publication Date
- 2026-06-04
Smart Images
Figure CN2025127727_04062026_PF_FP_ABST
Abstract
Description
Manufacturing methods for support plate, display module, display device and support plate
[0001] Cross-references to related applications
[0002] This application claims priority to Chinese Patent Application No. 202411745529.6, filed in China on November 29, 2024, the entire contents of which are incorporated herein by reference. Technical Field
[0003] This disclosure relates to the field of display product manufacturing technology, and in particular to a method for manufacturing a support plate, a display module, a display device, and a support plate. Background Technology
[0004] Display screens are an important medium for human-computer interaction. With the rapid advancement of information technologies such as artificial intelligence, wearable devices, and smart vehicles, display devices, which serve as information windows, have been required to be flexible, thin, energy-saving, foldable, and ultra-large in size. Organic light-emitting diode (OLED) display technology has emerged to meet these needs.
[0005] OLED technology, characterized by self-emissiveness, fast response speed, rich color display, low power consumption, and applicability to flexible displays and wearables, is gradually gaining popularity, especially in the mobile phone sector. The application of full-screen and foldable display technologies has brought a better user experience, indicating that OLED display technology is becoming a hot topic and focus in the industry. In recent years, the smartphone market has experienced sluggish demand and weak shipment growth, making the application of new technologies a breakthrough point for various companies. Foldable smartphones, in particular, are considered a hot direction for technological innovation in consumer electronics. Summary of the Invention
[0006] To address the aforementioned technical problems, this disclosure provides a support plate, a display module, a display device, and a method for manufacturing the support plate. This solves the problem that using carbon fiber as a support plate requires additional bonding of conductive copper foil, leading to increased support plate thickness and higher costs.
[0007] To achieve the above objectives, the technical solution adopted in this disclosure is: a support plate for supporting a flexible display panel, comprising a carbon fiber substrate and a conductive structure, wherein the carbon fiber substrate and the conductive structure are integrally formed by the same process.
[0008] Optionally, the conductive structure includes a conductive layer embedded in a first surface of the carbon fiber substrate, and a second surface of the conductive layer is exposed outside the carbon fiber substrate.
[0009] Optionally, the thickness of the carbon fiber substrate is 0.1-0.2 mm.
[0010] Optionally, the thickness of the conductive layer is 10µm to 30µm.
[0011] Optionally, the conductive layer is made of a conductive metal film or conductive metal powder.
[0012] Optionally, the conductive structure includes conductive particles filled within the carbon fiber substrate.
[0013] Optionally, the carbon fiber substrate includes at least one carbon fiber layer, each of which comprises carbon fibers arranged in parallel.
[0014] Optionally, the carbon fiber substrate includes at least two carbon fiber layers, with the carbon fibers on adjacent carbon fiber layers extending in opposite directions.
[0015] Optionally, it includes a flat region and a bending region that can be bent along the folding axis, and at least two carbon fiber layers include a first carbon fiber layer in which the carbon fibers of the first carbon fiber layer extend in a direction perpendicular to the extension direction of the folding axis.
[0016] Optionally, it includes a flat region and a bending region that can be bent along the folding axis, and at least two carbon fiber layers include a second carbon fiber layer, wherein the carbon fibers of the second carbon fiber layer extend in a direction parallel to the extension direction of the folding axis.
[0017] This disclosure also provides a display module, including a flexible display panel and a support plate disposed on the backlight side of the flexible display panel, wherein the support plate is the aforementioned support plate.
[0018] This disclosure also provides a display device, including the display module described above.
[0019] This disclosure also provides a method for manufacturing a support plate, used to manufacture the aforementioned support plate, comprising:
[0020] Provide carbon fiber prepreg;
[0021] A mold with a conductive material fixed on it is provided, and the carbon fiber prepreg is placed into the mold and hot-pressed to form the support plate.
[0022] This disclosure also provides a method for manufacturing a support plate, used to manufacture the aforementioned support plate, comprising:
[0023] Provide carbon fiber prepreg;
[0024] After fixing the carbon fiber prepreg in the mold, the conductive material is placed on the surface of the carbon fiber prepreg.
[0025] The conductive material and the carbon fiber prepreg are hot-pressed together to form the support plate.
[0026] The beneficial effects of this disclosure are: the support plate provided by this disclosure includes a carbon fiber substrate and a conductive structure. The conductive structure and the carbon fiber substrate are integrally formed by the same process, so there is no need to apply conductive copper foil, which simplifies the process and saves costs. Moreover, compared with the method of applying conductive copper foil, it does not increase the thickness of the support plate, which is conducive to the thinning of the display module. Attached Figure Description
[0027] Figure 1 shows a schematic diagram of the support plate in the related technology;
[0028] Figure 2 shows a schematic diagram of the support plate in an embodiment of this disclosure;
[0029] Figure 3 shows a schematic diagram of the support plate in an embodiment of this disclosure;
[0030] Figure 4 shows an exploded view of the carbon fiber substrate in an embodiment of this disclosure;
[0031] Figure 5 shows a schematic diagram of the carbon fiber substrate in an embodiment of this disclosure;
[0032] Figure 6 shows a schematic diagram of the carbon fiber substrate in an embodiment of this disclosure;
[0033] Figure 7 shows a schematic diagram of the carbon fiber substrate in an embodiment of this disclosure. Detailed Implementation
[0034] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the described embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.
[0035] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms “an,” “a,” or “the,” and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms “including,” “comprising,” or “containing,” and similar terms mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. The terms “connected,” “linked,” or similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms “upper,” “lower,” “left,” and “right,” etc., are used only to indicate relative positional relationships, and these relative positional relationships may change accordingly when the absolute position of the described objects changes.
[0036] The features such as "parallel," "perpendicular," and "identical" used in the embodiments of this disclosure include features in the strict sense of "parallel," "perpendicular," and "identical," as well as cases where "approximately parallel," "approximately perpendicular," and "approximately identical" include certain tolerances. Taking into account the measurement and the tolerances associated with the measurement of a specific quantity (e.g., limitations of the measurement system), they represent the acceptable deviation range for a specific value as determined by a person skilled in the art. For example, "approximately" can mean within one or more standard deviations, or within 3% or 5% of said value.
[0037] In the foldable display industry, major domestic terminal manufacturers have all released their own foldable products. Currently, to achieve foldable requirements, foldable display technology on the market requires flexible cover plates and bendable support structures. The non-bending areas of the support structure improve the overall mechanical performance of the foldable display, while the mesh-like perforated areas can meet bending requirements of over 200,000 bends. As the core structure of the flexible module, the support components typically use materials such as SUS and Ti alloys. These materials have high density, resulting in a heavy overall weight for the foldable screen. To bring consumers lighter and thinner foldable products, carbon fiber has become the primary material for the support components in recent years, becoming the first choice for high-end foldable screens. However, its high cost and complex processing technology have restricted the further development of carbon fiber in the display field.
[0038] Carbon fiber, as a supporting component for foldable screens, not only needs to provide strength but also requires good surface conductivity to match the grounding of the FPC and the entire device. Since the conductive carbon filaments are encased in resin, the resin is the only material in direct contact with the FPC, which cannot meet the FPC grounding requirements. To achieve both conductivity and grounding of the carbon fiber, conductive copper foil needs to be additionally bonded. This increases the overall thickness of the carbon fiber board and requires adhesive to bond the copper foil and carbon fiber, further increasing costs.
[0039] As shown in Figure 1, the support plate in the related technology includes a carbon fiber plate 1 and a conductive layer 2 disposed on the carbon fiber plate 1. The conductive layer 2 is a conductive film layer deposited on the carbon fiber plate by PVD (Physical Vapor Deposition) or a conductive copper foil bonded to the carbon fiber plate 1 by an adhesive 3. Regardless of which method the conductive layer 2 is used to connect to the carbon fiber plate, the conductive layer 2 will increase the overall thickness of the support plate. Furthermore, whether it is deposited by PVD or bonded to the carbon fiber plate 1 by an adhesive 3, the cost is increased.
[0040] Referring to Figures 2-7, in order to address the above-mentioned problems, this embodiment provides a support plate for supporting a flexible display panel, including a carbon fiber substrate 1 and a conductive structure, wherein the carbon fiber substrate 1 and the conductive structure are integrally formed by the same process.
[0041] In this embodiment, the carbon fiber substrate 1 and the conductive structure are integrally formed using the same process. Compared to the PVD method of depositing the conductive layer 21, the process is simpler, less expensive, and does not increase the overall thickness of the support plate. Compared to directly bonding the conductive layer 21 to the carbon fiber plate with adhesive, the support plate is thinner, does not require adhesive, and is more cost-effective.
[0042] It should be noted that the carbon fiber substrate 1 includes resin and carbon fibers disposed within the resin. Carbon fibers are mainly composed of carbon elements and possess properties such as high temperature resistance, friction resistance, electrical conductivity, thermal conductivity, and corrosion resistance. They are fibrous in shape, soft, and can be processed into various fabrics. Due to their graphite microcrystalline structure preferentially oriented along the fiber axis, they exhibit high tensile strength and tensile modulus along the fiber axis. Carbon fibers have advantages such as low density, high specific strength, and high specific modulus. The resin is a thermosetting resin, such as epoxy resin, phenolic resin, polyester resin, and vinyl ester resin. In some embodiments, the resin is epoxy resin. Epoxy resin has excellent physical and mechanical properties, electrical insulation properties, and adhesion properties to various materials, especially to metals.
[0043] Referring to Figures 2 and 3, in an exemplary embodiment, the conductive structure includes a conductive layer 21 embedded in a first surface of the carbon fiber substrate 1, and a second surface of the conductive layer 21 exposed on the carbon fiber substrate 1.
[0044] In an exemplary embodiment, the conductive material of the conductive layer 21 is a conductive metal film or conductive metal powder, or it can be a conductive metal sheet, as long as it can be integrally formed with the carbon fiber substrate 1 to achieve the conductive function of the support plate including the carbon fiber substrate 1.
[0045] It should be noted that in this embodiment, the conductive layer 21 and the carbon fiber substrate 1 are integrally formed by a hot pressing process. The carbon fiber substrate 1 includes resin and carbon fiber 101. Before hot pressing, the conductive material forming the conductive layer 21 can be fixed to the surface of the hot pressing mold, or, after placing the carbon fiber substrate 1 in the hot pressing mold, the conductive material can be placed on the surface of the carbon fiber substrate 1. During hot pressing, the resin is in a molten state. Therefore, after cooling, the conductive layer 21 formed by the conductive material is naturally embedded in the surface of the carbon fiber substrate 1. Because of this molding process, the conductive material forming the conductive layer 21 can be conductive metal powder. In other words, the selection of the conductive material forming the conductive layer 21 is more flexible and can reduce costs.
[0046] In an exemplary embodiment, the conductive layer 21 is embedded on the first surface of the carbon fiber substrate 1, and the first surface and the second surface are flush.
[0047] The conductive layer 21 enables the support plate to conduct electricity. In this embodiment, the conductive layer 21 and the carbon fiber substrate are integrally formed by hot pressing. During hot pressing, the resin in the carbon fiber substrate 1 is in a molten state and has fluidity, thus allowing the conductive layer 21 to be embedded in the carbon fiber substrate, and making the first surface and the second surface flush. Compared with forming the conductive layer 21 by vapor deposition or by bonding the conductive layer 21 with adhesive, the support plate in this embodiment has better flatness.
[0048] It should be noted that in this embodiment, the required conductive material is placed on the surface of the mold or the surface of the carbon fiber prepreg during hot pressing, utilizing the molten state of the resin. After cooling, the conductive layer 21 is naturally embedded into the surface of the carbon fiber substrate 1. Therefore, the thickness of the support plate formed by the conductive layer 21 embedded in the carbon fiber substrate 1 is the same as the thickness of the carbon fiber substrate 1, and will not increase the overall thickness of the support plate, which is beneficial to the thinning of the display module.
[0049] In an exemplary embodiment, the thickness of the carbon fiber substrate 1 is 0.1-0.2 mm, but it is not limited thereto. In some specific embodiments, the thickness of the carbon fiber substrate 1 is 0.17 mm.
[0050] In an exemplary embodiment, the thickness of the conductive layer 21 is 10 μm to 30 μm. In some specific embodiments, the thickness of the conductive layer 21 is 30 μm, but this is not a limitation.
[0051] In an exemplary embodiment, the conductive structure includes conductive particles 22 filled within the carbon fiber substrate 1.
[0052] The conductive particles 22 are filled into the carbon fiber substrate 1, which makes the carbon fiber substrate as a whole conductive and improves the electrostatic discharge performance of the support plate.
[0053] It should be noted that although the conductive particles are filled inside the carbon fiber substrate 1, at least some of the conductive particles are in contact, that is, forming a conductive path and extending to the surface of the carbon fiber substrate 1. Furthermore, the conductive structure and the carbon fiber substrate 1 are integrally formed by hot pressing. During the hot pressing process, the conductive particles are compressed, increasing the contact area between the conductive particles and improving the conductivity of the carbon fiber substrate 1, thereby making the carbon fiber substrate 1 as a whole conductive.
[0054] It should be noted that the electrical conductivity of the carbon fiber substrate 1 is related to factors such as the density and content of the conductive particles 22 and the size of the conductive ions. The density, content, and size of the conductive particles 22 can all be set according to actual needs. For example, the content of the conductive particles can be 5%-60%, and the shape of the conductive particles can be spherical or other irregular shapes.
[0055] In an exemplary embodiment, the material of the conductive particles 22 may include, but is not limited to, metals such as copper, nickel, silver, and gold, as well as conductive materials such as metal oxides.
[0056] Referring to Figure 7, in an exemplary embodiment, the conductive structure includes a conductive layer 21 embedded on the first surface of the carbon fiber substrate 1, and conductive particles 22 filled within the carbon fiber substrate 1. This enhances the conductivity of the support plate.
[0057] It should be noted that the conductive layer 21 in Figure 7 is made of conductive metal powder, but this is not a limitation.
[0058] In an exemplary embodiment, the carbon fiber substrate 1 includes at least one carbon fiber layer, and each carbon fiber layer includes parallel-arranged carbon fibers 101.
[0059] The carbon fiber substrate 1 can be a single-layer carbon fiber layer or a composite multi-layer carbon fiber layer.
[0060] In an exemplary embodiment, the carbon fiber substrate 1 includes at least two carbon fiber layers, and the extension directions of the carbon fibers 101 on adjacent carbon fiber layers are arranged to intersect.
[0061] In an exemplary embodiment, the support plate includes a flat area and a bending area that can be bent along the folding axis, and at least two carbon fiber layers include a first carbon fiber layer, wherein the extension direction of the carbon fibers 101 of the first carbon fiber layer is perpendicular to the extension direction of the folding axis.
[0062] In an exemplary embodiment, the support plate includes a flat area and a bending area that can be bent along the folding axis, and at least two carbon fiber layers include a second carbon fiber layer, wherein the extension direction of the carbon fibers 101 of the second carbon fiber layer is parallel to the extension direction of the folding axis.
[0063] The carbon fiber substrate 1 is lightweight, reducing the overall weight of the support plate. Furthermore, the carbon fiber substrate 1 contains carbon fiber 101, an anisotropic material with different mechanical properties in different directions. For example, data shows that carbon fiber 101 has a tensile strength of 2924 MPa in the 0° direction (parallel to the carbon fiber extension direction) and 71 MPa in the 90° direction (perpendicular to the carbon fiber extension direction). Due to the characteristics of carbon fiber 101, if the extension direction of carbon fiber 101 in the carbon fiber layer is perpendicular to the extension direction of the folding axis of the support plate, a greater rebound force will be generated when bending in the bending area, making the module less prone to deformation. If the extension direction of carbon fiber 101 in the carbon fiber layer is parallel to the extension direction of the folding axis of the support plate, it facilitates bending in the bending area.
[0064] In an exemplary embodiment, the support plate includes a flat area and a bending area that can be bent along the folding axis, and at least two carbon fiber layers include a first carbon fiber layer, wherein the extending direction of the carbon fibers 101 of the first carbon fiber layer is perpendicular to the extending direction of the folding axis.
[0065] Furthermore, at least two of the carbon fiber layers include a second carbon fiber layer, wherein the extending direction of the carbon fiber 101 of the second carbon fiber layer is parallel to the extending direction of the folding axis, or the extending direction of the carbon fiber 101 of the second carbon fiber layer forms an acute or obtuse angle with the extending direction of the folding axis.
[0066] The carbon fibers 101 in the first carbon fiber layer extend perpendicularly to the extension direction of the folding axis of the support plate, generating a greater rebound force when bending in the bending area, making the display module less prone to deformation. The carbon fibers 101 in the second carbon fiber layer extend parallel to the extension direction of the folding axis, or the extension direction of the carbon fibers 101 in the second carbon fiber layer forms an acute or obtuse angle with the extension direction of the folding axis. This reduces the rebound force generated by the support plate when bending, thereby reducing the tension on the upper display module when it is used to support the display module, thus reducing the risk of creases in the display module due to prolonged tension.
[0067] Referring to Figures 4-6, Figure 4 is an exploded view of the carbon fiber substrate 1, Figure 3 is a schematic diagram of the composite layer of the carbon fiber substrate, and Figure 6 is a cross-sectional schematic diagram of the carbon fiber substrate. In an exemplary embodiment, the carbon fiber substrate 1 includes a first carbon fiber layer 11, a second carbon fiber layer 12, and a third carbon fiber layer 13 stacked together. The extending direction of the carbon fibers in the first carbon fiber layer 11 is parallel to the extending direction of the folding axis, the extending direction of the carbon fibers in the second carbon fiber layer 12 is perpendicular to the extending direction of the folding axis, and the extending direction of the carbon fibers in the third carbon fiber layer 13 is parallel to the extending direction of the folding axis.
[0068] In an exemplary embodiment, the bending area is provided with a hollow structure to reduce the difficulty of bending the bending area.
[0069] For example, the hollow structure can be configured in various ways. For instance, the hollow structure includes multiple rows of hollow sections arranged in parallel, the extension direction of the hollow sections is parallel to the extension direction of the folding shaft, and each row of hollow sections includes multiple through holes spaced apart along the extension direction of the hollow section.
[0070] For example, to prevent the bending area from breaking during bending, the through holes in adjacent hollowed-out portions are staggered. For instance, multiple rows of hollowed-out portions include first hollowed-out portions and second hollowed-out portions. The first hollowed-out portion includes multiple first through holes and a first connecting portion located between two adjacent first through holes. The second hollowed-out portion includes multiple second through holes and a second connecting portion located between two adjacent second through holes. The orthographic projection of the first connecting portion on the second hollowed-out portion is located on the corresponding second through hole.
[0071] This disclosure also provides a display module, including a flexible display panel and a support plate disposed on the backlight side of the flexible display panel, wherein the support plate is the aforementioned support plate.
[0072] The shape of the support plate matches the shape of the flexible display panel, so that the support plate can fully contact the flexible display panel and support and protect the flexible display panel.
[0073] In an exemplary embodiment, the display module further includes a flexible circuit board, the flexible display panel is electrically connected to the motherboard through the flexible circuit board, one end of the flexible circuit board is electrically connected to the flexible display panel, and the other end of the flexible circuit board is electrically connected to the side of the support plate away from the flexible display panel to achieve a grounding function.
[0074] This disclosure also provides a display device, including the display module described above.
[0075] The display device can be any product or component with display function, such as a digital photo frame, mobile phone, or tablet computer. The display device also includes a flexible circuit board, a printed circuit board, and a backplate.
[0076] This disclosure also provides a method for manufacturing a support plate, used to manufacture the aforementioned support plate, wherein the conductive structure includes a conductive layer embedded in a first surface of the carbon fiber substrate, and the manufacturing method includes:
[0077] Provide carbon fiber prepreg;
[0078] A mold with a conductive material fixed on it is provided, and the carbon fiber prepreg is placed into the mold and hot-pressed to form the support plate.
[0079] For example, the carbon fiber substrate includes multiple carbon fiber layers, and the step of providing the carbon fiber prepreg specifically includes:
[0080] Multiple carbon fiber prepregs are provided, and the multiple carbon fiber prepregs are stacked according to preset conditions, the preset conditions including that the extension directions of the carbon fibers of the multiple carbon fiber prepregs are intersected.
[0081] For example, the preset conditions include the carbon fibers of the multilayer carbon fiber prepreg being arranged perpendicularly to each other.
[0082] This disclosure also provides a method for manufacturing a support plate, used to manufacture the aforementioned support plate, wherein the conductive structure includes a conductive layer embedded in a first surface of the carbon fiber substrate, and the manufacturing method includes:
[0083] Provide carbon fiber prepreg;
[0084] After fixing the carbon fiber prepreg in the mold, the conductive material is placed on the surface of the carbon fiber prepreg.
[0085] The conductive material and the carbon fiber prepreg are hot-pressed together to form the support plate.
[0086] For example, the carbon fiber substrate includes multiple carbon fiber layers, and the step of providing the carbon fiber prepreg specifically includes:
[0087] Multiple carbon fiber prepregs are provided, and the multiple carbon fiber prepregs are stacked according to preset conditions, the preset conditions including that the extension directions of the carbon fibers of the multiple carbon fiber prepregs are intersected.
[0088] For example, the preset conditions include the carbon fibers of the multilayer carbon fiber prepreg being arranged perpendicularly to each other.
[0089] This disclosure also provides a method for manufacturing a support plate, used to manufacture the aforementioned support plate, wherein the conductive structure includes conductive particles filled within the carbon fiber substrate, and the manufacturing method includes:
[0090] Provide carbon fiber prepreg;
[0091] The carbon fiber prepreg is heated and melted, and conductive particles are filled into the melted carbon fiber prepreg.
[0092] After curing, the support plate is formed.
[0093] This disclosure also provides a method for manufacturing a support plate, used to manufacture the aforementioned support plate, wherein the conductive structure includes a conductive layer embedded in a first surface of the carbon fiber substrate, and conductive particles filled within the carbon fiber substrate, and the manufacturing method includes:
[0094] Provide carbon fiber prepreg;
[0095] Conductive particles are filled into the carbon fiber prepreg;
[0096] After fixing the carbon fiber prepreg filled with conductive particles in a mold, a conductive material is placed on the surface of the carbon fiber prepreg; or, a mold with a conductive material fixed is provided, and the carbon fiber prepreg is placed in the mold.
[0097] The conductive material and the carbon fiber prepreg are hot-pressed together to form the support plate.
[0098] For example, the carbon fiber substrate includes multiple carbon fiber layers, and the step of providing the carbon fiber prepreg specifically includes:
[0099] Multiple carbon fiber prepregs are provided, and the multiple carbon fiber prepregs are stacked according to preset conditions, the preset conditions including that the extension directions of the carbon fibers of the multiple carbon fiber prepregs are intersected.
[0100] For example, the preset conditions include the carbon fibers of the multilayer carbon fiber prepreg being arranged perpendicularly to each other.
[0101] The following points need to be explained:
[0102] (1) The accompanying drawings of the embodiments of this disclosure only involve the structures involved in the embodiments of this disclosure. Other structures can be referred to the general design.
[0103] (2) For clarity, the thickness of layers or regions is enlarged or reduced in the drawings used to describe embodiments of the present disclosure, i.e., these drawings are not drawn to actual scale. It will be understood that when an element such as a layer, film, region or substrate is referred to as being “above” or “below” another element, the element may be “directly” located “above” or “below” the other element or there may be intermediate elements.
[0104] (3) Where there is no conflict, the embodiments of this disclosure and the features in the embodiments can be combined with each other to obtain new embodiments.
[0105] It is understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of this disclosure, and this disclosure is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and substance of this disclosure, and these modifications and improvements are also considered to be within the scope of protection of this disclosure.
Claims
1. A support plate for supporting a flexible display panel, characterized in that, It includes a carbon fiber substrate and a conductive structure, wherein the carbon fiber substrate and the conductive structure are integrally formed by the same process.
2. The support plate according to claim 1, characterized in that, The conductive structure includes a conductive layer embedded in a first surface of the carbon fiber substrate, and a second surface of the conductive layer exposed outside the carbon fiber substrate.
3. The support plate according to claim 1, characterized in that, The thickness of the carbon fiber substrate is 0.1-0.2 mm.
4. The support plate according to claim 2, characterized in that, The thickness of the conductive layer is 10µm to 30µm.
5. The support plate according to claim 2, characterized in that, The conductive layer is made of a conductive metal film or conductive metal powder.
6. The support plate according to claim 1, characterized in that, The conductive structure includes conductive particles filled within the carbon fiber substrate.
7. The support plate according to claim 1, characterized in that, The carbon fiber substrate includes at least one carbon fiber layer, and each carbon fiber layer includes carbon fibers arranged in parallel.
8. The support plate according to claim 1, characterized in that, The carbon fiber substrate includes at least two carbon fiber layers, with the carbon fibers on adjacent carbon fiber layers extending in opposite directions.
9. The support plate according to claim 8, characterized in that, It includes a flat area and a bending area that can be bent along the folding axis, and at least two carbon fiber layers including a first carbon fiber layer, wherein the carbon fibers of the first carbon fiber layer extend in a direction perpendicular to the extension direction of the folding axis.
10. The support plate according to claim 8, characterized in that, It includes a flat area and a bending area that can be bent along the folding axis, and at least two carbon fiber layers include a second carbon fiber layer, wherein the carbon fibers of the second carbon fiber layer extend in a direction parallel to the extension direction of the folding axis.
11. A display module, characterized in that, It includes a flexible display panel and a support plate disposed on the backlight side of the flexible display panel, wherein the support plate is the support plate according to any one of claims 1-10.
12. A display device, characterized in that, Includes the display module as described in claim 11.
13. A method for manufacturing a support plate, used to manufacture the support plate according to any one of claims 1-10, characterized in that, include: Provide carbon fiber prepreg; A mold with a conductive material fixed on it is provided, and the carbon fiber prepreg is placed into the mold and hot-pressed to form the support plate.
14. A method for manufacturing a support plate, used to manufacture the support plate according to any one of claims 1-10, characterized in that, include: Provide carbon fiber prepreg; After fixing the carbon fiber prepreg in the mold, the conductive material is placed on the surface of the carbon fiber prepreg. The conductive material and the carbon fiber prepreg are hot-pressed together to form the support plate.