Thermal insulation device and semiconductor processing apparatus

Abstract

The present application relates to the field of semiconductor apparatuses. Provided are a thermal insulation device and a semiconductor processing apparatus. The thermal insulation device comprises a body, wherein the body has a thermal insulation cavity and a first gas supply channel, the first gas supply channel is not in communication with the thermal insulation cavity, and the first gas supply channel is provided with a plurality of gas supply ports, which are all arranged on an outer wall surface of the body. The semiconductor processing apparatus comprises a process chamber and the thermal insulation device, wherein the thermal insulation device is arranged in the process chamber, and the body is arranged close to an exhaust port of the chamber. The thermal insulation device has dual functions of thermal insulation and gas supply. When the gas supply function of the thermal insulation device is configured to compensate for gas intake of the process chamber, the gas intake amount of a region where the gas supply port for gas output is located and a region near the gas supply port can be increased, thereby facilitating more uniform distribution of gas and pressure thereof in the process chamber, and further facilitating accurate control and improvement of the process indexes such as film uniformity and step coverage between wafers, the film process level and finished-product quality of the wafers, and the production capacity of the apparatus.

Description

A heat preservation device and semiconductor process equipment Technical Field

[0001] This application relates to the technical field of semiconductor equipment, and more specifically, to a heat preservation device and semiconductor process equipment. Background Technology

[0002] In semiconductor process equipment such as vertical diffusion furnaces, the uniformity of the film layers between wafers and the step coverage are important process indicators that not only directly affect the quality of the finished wafers, but also the production capacity of the equipment.

[0003] The distribution of gas and its pressure within the process chamber is directly related to process parameters such as inter-wafer film uniformity and step coverage. Uneven distribution of gas and its pressure within the process chamber is one of the important reasons for low inter-wafer film uniformity and step coverage.

[0004] However, in related technologies, the process chamber is only equipped with devices such as valves, flow meters, vacuum gauges or differential pressure gauges to regulate or detect the overall pressure inside, which cannot regulate the distribution of gas and its pressure inside the process chamber. Therefore, the finished product quality of the wafer is relatively low and the production capacity of the equipment is also relatively low. Summary of the Invention

[0005] The first objective of this application is to provide a heat preservation device to solve the technical problem in the related art where uneven distribution of gas and its pressure in the process chamber leads to low finished wafer quality.

[0006] The heat preservation device provided in this application includes a body, which has a heat preservation cavity and a first air supply channel. The first air supply channel is not connected to the heat preservation cavity. The first air supply channel is provided with multiple air supply ports, all of which are located on the outer wall surface of the body.

[0007] Furthermore, the main body has a barrel-shaped structure, and an insulating cover is sealed and fixed at the opening of the main body. The insulating cover and the inner wall of the main body enclose the insulating cavity.

[0008] Furthermore, the insulation cavity is provided with a support column and fins. The support column is fixed to the body, and the fins are multiple and fixed to the support column at intervals along the axial direction of the support column.

[0009] Furthermore, the air inlet includes a first air inlet and a first air outlet, the first air outlet being located on the outer side of the body; and / or, the first air inlet being located on the outer end face of the body.

[0010] Furthermore, the first air outlet has multiple outlets, which are distributed circumferentially and / or axially along the body.

[0011] Furthermore, the first air supply channel is an annular channel surrounding the outside of the insulation cavity.

[0012] Furthermore, the opening is located at the top of the body, and the first air inlet is located at the bottom end face of the body.

[0013] Furthermore, the heat preservation device also includes a rotating shaft fixed to the bottom end face of the main body, the rotating shaft being coaxial with the main body; the rotating shaft has a second air supply channel, the second air supply channel having a second air inlet and a second air outlet, the second air outlet being located on the top end face of the rotating shaft and connected to the first air inlet.

[0014] Furthermore, the second air inlet is located on the bottom end face of the rotating shaft.

[0015] Furthermore, the longitudinal section of the rotating shaft is T-shaped, with its larger end located at the top of the rotating shaft, and the longitudinal section is a plane passing through the axis of the rotating shaft.

[0016] Furthermore, the second air delivery channel is an annular channel and is coaxial with the rotating shaft.

[0017] Furthermore, the first air inlet is an arc-shaped structure, having multiple inlets, which are circumferentially spaced along the bottom end face of the body, and / or radially spaced along the bottom end face of the body.

[0018] The second air outlet has an arc-shaped structure and has multiple outlets, which are circumferentially spaced along the top surface of the rotating shaft and / or radially spaced along the top surface of the rotating shaft, and correspond to the position of the first air inlet.

[0019] Furthermore, one of the top surface of the rotating shaft and the bottom surface of the body is provided with a limiting protrusion, and the other is provided with a limiting groove, wherein the limiting protrusion and the limiting groove cooperate.

[0020] The heat preservation device provided in this application can produce the following beneficial effects:

[0021] The heat preservation device provided in this application has a heat preservation cavity and a first air supply channel, which are not connected. The heat preservation cavity has a heat preservation function. For example, if the heat preservation device is placed above, below or to the side of the crystal boat in the process chamber, it can block or at least greatly reduce the heat transfer between the area where the crystal boat is located and the external environment above, below or to the side of the process chamber.

[0022] The first gas supply channel has a gas supply function, which means that gas can be transported from one space to another. For example, gas can be transported from outside the process chamber to inside the process chamber. Therefore, it can be used for gas intake or compensation intake of the process chamber. When used for compensation intake of the process chamber, it can increase the intake volume of the area where the gas supply port for gas outlet is located and the surrounding area, thereby helping to regulate the distribution of gas and its pressure in the process chamber, making the distribution of gas and its pressure in the process chamber more uniform, which in turn helps to accurately control and improve process indicators such as film uniformity and step coverage between wafers.

[0023] In summary, the heat preservation device provided in this application has dual functions of heat preservation and air supply. Its air supply function can improve the wafer film layer process level, thereby helping to improve the finished product quality of the wafer and the production capacity of the equipment.

[0024] The second objective of this application is to provide a semiconductor process apparatus to solve the technical problem in the related art where uneven distribution of gas and pressure within the process chamber leads to low finished wafer quality.

[0025] The semiconductor process equipment provided in this application includes a process chamber and the aforementioned heat preservation device. The process chamber has a chamber air inlet and a chamber exhaust outlet. The heat preservation device is disposed in the process chamber, and the main body is disposed near the chamber exhaust outlet.

[0026] Furthermore, the semiconductor process equipment also includes a pressure detection component configured to detect gas pressure at different height positions within the process chamber.

[0027] Furthermore, the process chamber is provided with a pressure measuring hole; the pressure detection component includes a pressure measuring tube and a pressure measuring vacuum gauge, one end of the pressure measuring tube is connected to the pressure measuring vacuum gauge, and the other end can extend from the pressure measuring hole to the target height position inside the process chamber.

[0028] Furthermore, the pressure measuring tube and the pressure measuring vacuum gauge are sealed together by a first vacuum conversion connector, and / or the pressure measuring hole and the pressure measuring tube are sealed together by a second vacuum conversion connector.

[0029] Furthermore, the first vacuum conversion connector includes:

[0030] The first body has a first through hole, a first end of the first through hole extends radially inward to form a first limiting end face, and a second end extends radially outward to form a second limiting end face; the first through hole is sleeved on the outer wall of the pressure measuring tube, and one end of the pressure measuring tube abuts against the first limiting end face;

[0031] A first locking member has a first through hole and a first locking hole that are connected to each other. The first through hole is fitted onto the outer wall of the pressure measuring tube. The first locking hole extends radially outward from the inner wall surface of one end of the first through hole and extends axially away from the first through hole, penetrating the corresponding end face of the first locking member. The first locking hole is fitted onto the outer wall of the first body.

[0032] The first clamping sleeve is fitted onto the outer wall of the pressure measuring tube and located inside the first locking hole. One end abuts against the bottom end face of the first locking hole, and the other end face is tightly pressed with the second limiting end face by a first sealing ring. The first sealing ring is tightly fitted onto the outer wall of the pressure measuring tube.

[0033] Furthermore, the second vacuum conversion connector includes:

[0034] The second body has a second through hole, one end of which extends radially outward to form a third limiting end face; the second through hole is sleeved on the outer wall of the pressure measuring tube;

[0035] The second locking member has a second through hole and a second locking hole that are connected to each other. The second through hole is sleeved on the outer wall of the pressure measuring tube. The second locking hole extends radially outward from the inner wall surface of one end of the second through hole and extends axially away from the second through hole, penetrating the corresponding end face of the second locking member. The second locking hole is sleeved on the outer wall of the second body.

[0036] The second clamping sleeve is fitted onto the outer wall of the pressure measuring tube and located inside the second locking hole. One end abuts against the bottom end face of the second locking hole, and the other end face is tightly pressed against the third limiting end face with a second sealing ring. The second sealing ring is tightly fitted onto the outer wall of the pressure measuring tube.

[0037] Furthermore, the pressure detection assembly also includes a first metal connector, a first air valve, and a second metal connector connected in sequence. The end of the first metal connector away from the first air valve is fixed to the first vacuum conversion connector, and the end of the second metal connector away from the first air valve is fixed to the pressure measuring vacuum gauge.

[0038] Furthermore, the pressure detection assembly also includes a support arm with a through hole. After the pressure detection assembly is installed in place, the first metal connector passes through the through hole, and the first vacuum conversion connector overlaps the support arm.

[0039] The semiconductor process equipment provided in this application can produce the following beneficial effects:

[0040] The semiconductor process equipment provided in this application has a process chamber equipped with the aforementioned heat preservation device. The heat preservation device provides heat preservation for the area where the wafer boat is located within the process chamber. Furthermore, the body of the heat preservation device is located close to the chamber exhaust port. Therefore, the heat preservation device can also increase the air intake in the area near the chamber exhaust port. By locally compensating for the air intake, the gas pressure in the area near the chamber exhaust port can be increased. This can balance the axial pressure gradient of the process chamber, thereby helping to regulate the distribution of gas and its pressure within the process chamber, making the distribution of gas and its pressure within the process chamber more uniform. This, in turn, is beneficial for accurately controlling and improving process parameters such as the uniformity of the film layer between wafers and the step coverage rate.

[0041] That is, the semiconductor process equipment provided in this application has all the beneficial effects of the above-mentioned heat preservation device because it includes a heat preservation device with dual functions of heat preservation and gas supply. The wafer film layer process level is high, the finished product quality is high, and the equipment capacity is also high. Attached Figure Description

[0042] To more clearly illustrate the technical solutions in the embodiments of this application or related technologies, the drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0043] Figure 1 is one of the partial front cross-sectional views of the semiconductor process equipment provided in the embodiments of this application;

[0044] Figure 2 is a second partial front cross-sectional view of the semiconductor process equipment provided in an embodiment of this application;

[0045] Figure 3 is a three-dimensional cross-sectional schematic diagram of the heat preservation device and the chamber door provided in the embodiment of this application;

[0046] Figure 4 is a three-dimensional structural schematic diagram of the heat preservation device and chamber door provided in the embodiment of this application;

[0047] Figure 5 is a bottom view of the main body of the heat preservation device provided in the embodiment of this application;

[0048] Figure 6 is a top view of the rotating shaft of the heat preservation device provided in the embodiment of this application;

[0049] Figure 7 is a simplified structural diagram of the semiconductor process equipment provided in an embodiment of this application;

[0050] Figure 8 is one of the partial structural schematic diagrams of the pressure detection component in the semiconductor process equipment provided in the embodiments of this application;

[0051] Figure 9 is a schematic diagram of the structure of the first vacuum conversion connector of the pressure detection component in the semiconductor process equipment provided in the embodiment of this application;

[0052] Figure 10 is a schematic diagram of the structure of the second vacuum conversion connector of the pressure detection component in the semiconductor process equipment provided in the embodiment of this application;

[0053] Figure 11 is a second partial structural schematic diagram of the pressure detection component in the semiconductor process equipment provided in the embodiments of this application;

[0054] Figure 12 is a schematic diagram of the gas delivery pipe in the semiconductor process equipment provided in the embodiment of this application;

[0055] Figure 13 is a three-dimensional structural diagram of the outer tube of the gas delivery pipe in the semiconductor process equipment provided in the embodiment of this application;

[0056] Figure 14 is a cross-sectional view of the outer tube of the gas delivery pipe in the semiconductor process equipment provided in the embodiment of this application;

[0057] Figure 15 is a partial structural diagram of the inner tube of the gas delivery pipe in the semiconductor process equipment provided in the embodiment of this application;

[0058] Figure 16 is a partial structural schematic diagram of the gas delivery pipe in the semiconductor process equipment provided in the embodiment of this application.

[0059] Explanation of reference numerals in the attached drawings: 100-Cavity assembly; 110-Process chamber; 111-Cavity air inlet; 112-Cavity exhaust outlet; 113-Process door; 120-Crystal boat; 200-Insulation device; 210-Body; 211-Insulation cavity; 212-First air supply channel; 213-First air inlet; 214-First air outlet; 215-Outer wall surface; 216-Outer side surface; 217-Bottom end surface; 218-Limiting groove; 219-Inner wall surface; 220-Insulation cover; 231-Support column; 232-Fin; 240-Rotating shaft; 241-Second air supply channel; 242-Second air inlet; 243-Second air outlet; 244-Receiving groove; 245-Limiting ring; 310 - Gas delivery pipe; 311 - Inner pipe; 312 - Inner hole; 313 - Protrusion; 314 - Installation pipe; 316 - Outer pipe; 317 - Outer hole; 318 - Groove; 400-Pressure detection assembly; 410-Pressure measuring tube; 420-First vacuum conversion connector; 421-First body; 422-First through hole; 423-First limiting end face; 424-Second limiting end face; 425-First locking element; 426-First through hole; 427-First locking hole; 428-First clamping sleeve; 429-First sealing ring; 430-First metal connecting pipe; 440-First air valve; 450-Second metal connecting pipe; 460-Pressure measuring vacuum gauge; 470-Second vacuum conversion connector; 471-Second body; 472-Second through hole; 473-Third limiting end face; 474-Second locking element; 475-Second through hole; 476-Second locking hole; 477-Second clamping sleeve; 478-Second sealing ring; 480-Support arm; 481-Fixing block; 482-Fixing plate; 500 - Exhaust assembly; 510 - Exhaust pipe; 520 - Vacuum pump; 530 - Exhaust vacuum gauge; 540 - Second air valve. Detailed Implementation

[0060] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, specific embodiments of this application will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0061] In semiconductor process equipment such as vertical diffusion furnaces, the uneven distribution of gas and pressure within the process chamber 110 leads to low uniformity of film layers and step coverage between wafers, which not only directly affects the finished product quality of the wafers but also the production capacity of the equipment.

[0062] To solve the above-mentioned technical problems, this embodiment provides a heat preservation device 200 and a semiconductor process equipment. The heat preservation device 200 not only has a heat preservation function but also a gas supply function. As shown in FIG1, the semiconductor process equipment includes the above-mentioned heat preservation device 200 and a chamber assembly 100. The chamber assembly 100 includes a process chamber 110, which has a chamber air inlet 111 and a chamber exhaust outlet 112. The heat preservation device 200 is disposed in the process chamber 110, and the body 210 of the heat preservation device 200 is disposed close to the chamber exhaust outlet 112. With this configuration, the insulation device 200 provides insulation for the area where the crystal boat 120 is located within the process chamber 110. It also increases the air intake near the chamber exhaust port 112, thereby increasing the gas pressure near the chamber exhaust port through local compensation of air intake. This balances the axial pressure gradient of the process chamber, which helps to regulate the distribution of gas and its pressure within the process chamber 110, making the distribution of gas and its pressure within the process chamber 110 more uniform. This, in turn, facilitates accurate control and improvement of process parameters such as the uniformity of the film layer between wafers and the step coverage rate. In other words, this semiconductor process equipment, including the insulation device 200 with dual functions of insulation and gas supply, achieves a high level of wafer film layer processing, high finished product quality, and high equipment capacity.

[0063] The following is a detailed description of the heat preservation device 200 provided in this embodiment:

[0064] As shown in Figures 2 and 3, the heat preservation device 200 provided in this embodiment includes a body 210. The body 210 has a heat preservation cavity 211 and a first air supply channel 212. The first air supply channel 212 is not connected to the heat preservation cavity 211. The first air supply channel 212 is provided with multiple air supply ports, all of which are located on the outer wall surface 215 of the body 210. The heat preservation cavity 211 has a heat preservation function. For example, if the heat preservation device 200 is placed below the crystal boat 120 in the process chamber 110 as shown in Figure 1, it can block, or at least greatly reduce, the heat transfer between the area where the crystal boat 120 is located and the external environment below the process chamber 110. In other embodiments of this application, the heat preservation device 200 can also be placed above or to the side of the crystal boat 120 in the process chamber 110. In this case, it can block or reduce the heat transfer between the area where the crystal boat 120 is located and the external environment above or to the side of the process chamber 110.

[0065] The first air supply channel 212 of the insulation device 200 has an air supply function, that is, it can transport gas from one space to another. For example, in Figure 1, it can transport gas from outside the process chamber 110 to inside the process chamber 110. Therefore, it can be used for air intake or compensation intake of the process chamber 110. In Figure 1, the first air supply channel 212 is used for compensation intake of the process chamber 110. It can increase the air intake in the area where the air supply port for air outlet is located and the surrounding area, thereby helping to regulate the distribution of gas and its pressure in the process chamber 110, making the distribution of gas and its pressure in the process chamber 110 more uniform. This is beneficial for accurately controlling and improving process indicators such as film uniformity and step coverage between wafers. That is, the air supply function of the insulation device 200 can improve the film layer process level of the wafer, thereby helping to improve the finished product quality of the wafer and the production capacity of the equipment.

[0066] Continuing with Figures 2 and 3, in this embodiment, the main body 210 has a barrel-shaped structure, and an insulating cover 220 is fixedly installed at the open end of the main body 210. The insulating cover 220 and the inner wall surface 219 of the main body 210 enclose an insulating cavity 211. With this configuration, the shape of the insulating device 200 is well-matched to the process chamber 110 and the crystal boat 120 within it. When placed in the process chamber 110, the insulating device 200 can better perform its insulating function and its function of supplying gas to ensure uniform gas and pressure distribution within the process chamber 110. However, it should be noted that in other embodiments of this application, the shape of the main body 210 of the insulating device 200 is not limited to a barrel shape, but can be any other shape, as long as it can perform the required insulating and gas supply functions.

[0067] In this embodiment, the insulation cavity 211 is provided with a support column 231 and fins 232. The support column 231 is fixed to the body 210, and multiple fins 232 are fixed to the support column 231 at intervals along the axial direction of the support column 231. The fins 232 are used to improve the insulation performance of the insulation device 200, while the support column 231 is used to support the fins 232. It should be noted that the form of the fins 232 and the support column 231 is not limited to the structure shown in the schematic diagram, but different forms of fins and support columns can be selected according to different process requirements.

[0068] In this embodiment, as shown in Figures 2 and 3, and in conjunction with Figures 4 and 5, the air inlet includes a first air inlet 213 and a first air outlet 214. The first air outlet 214 is located on the outer side 216 of the body 210; the first air inlet 213 is located on the outer end face of the body 210. More specifically, in this embodiment, the opening of the body 210 is located at its top, and the first air inlet 213 is located on the bottom end face 217 of the body 210. However, in other embodiments of this application, if the heat preservation device 200 is located above the crystal boat 120, that is, below the heat preservation device 200, then the first air inlet 213 can be located on the top surface of the body 210, and the opening of the body 210 can be located at its bottom. Of course, in other embodiments of this application, the positions of the first air inlet 213 and the first air outlet 214 are not limited to the positions described above, but are as long as they can deliver the required gas from one space to another space that needs the gas through the first air delivery channel 212.

[0069] Specifically, as shown in Figure 4, in this embodiment, there are multiple first air outlets 214, which are distributed at intervals along the circumference of the body 210 and also at intervals along the axial direction of the body 210. This arrangement facilitates uniform air output from the body 210 both circumferentially and axially. If the gas and pressure distribution around the insulation device 200 is uniform, then placing it below the crystal boat 120 within the process chamber 110 will allow for uniform compensation of air intake. However, it should be noted that as long as it can fulfill the function of compensating for air intake, this application does not impose restrictions on the specific arrangement, shape, and size of the first air outlets 214.

[0070] In this embodiment, as shown in Figures 2 and 3, the first air supply channel 212 is an annular channel surrounding the outside of the insulation cavity 211. More specifically, the cavity wall of the insulation cavity 211 is hollow. The first air supply channel 212 is formed by the inner wall surface 219 and the outer wall surface 215 of the body 210. Along its circumference, its radial cross-section is L-shaped, where the radial cross-section refers to the cross-section passing through the central axis of the body 210. With this configuration, the gas entering the first air supply channel 212 from the first air inlet 213 can first flow uniformly in the horizontal direction to the surrounding area, and then flow uniformly upward in the vertical direction, i.e., axially, and diffuse uniformly into the process chamber 110 from the first air outlet 214 uniformly arranged on the outer side 216. Of course, in other embodiments of this application, the arrangement of the first air supply channel 212 is not limited to this, as long as it can supply air. For example, the first air supply channel 212 may also include a plurality of branch channels evenly arranged in the circumferential direction, with the air inlet end of each branch channel corresponding to a first air inlet 213 and the air outlet end corresponding to a row of first air outlets 214.

[0071] As shown in Figures 2 and 3, in this embodiment, the heat preservation device 200 further includes a rotating shaft 240 fixed to the bottom end face 217 of the body 210. The rotating shaft 240 is coaxial with the body 210. The rotating shaft 240 is used to support the body 210 of the heat preservation device 200 and the crystal boat 120 above the heat preservation device 200, and to realize the rotation of the body 210 and the crystal boat 120. The connection between the body 210 and the rotating shaft 240 includes, but is not limited to, using bolts, buckles, pins and other structures made of the same material as the body 210.

[0072] More specifically, in this embodiment, the rotating shaft 240 has a second air supply channel 241, which has a second air inlet 242 and a second air outlet 243. The second air outlet 243 is located on the top surface of the rotating shaft 240 and communicates with the first air inlet 213. In this configuration, gas can sequentially enter the process chamber 110 through the second air supply channel 241 and the first air supply channel 212, thereby providing compensating air supply to the process chamber 110.

[0073] The second air inlet 242 is located on the bottom end face of the rotating shaft 240 and can be connected to an external air source. Of course, in other embodiments of this application, if the bottom end of the rotating shaft 240 extends outside the process chamber 110, the second air inlet 242 can also be located on the side wall of the rotating shaft 240.

[0074] Continuing with Figures 2 and 3, in this embodiment, the longitudinal section of the rotating shaft 240 is T-shaped, with its larger end located at the top of the rotating shaft 240. The longitudinal section is a plane passing through the axis of the rotating shaft 240. With this configuration, the body 210 is positioned on the larger end of the rotating shaft 240, resulting in a relatively large bearing area for the body 210 and the crystal boat 120 above it, thus providing better bearing stability for the body 210 and the crystal boat 120.

[0075] In this embodiment, the second air delivery channel 241 is an annular channel and is coaxial with the rotating shaft 240. More specifically, the rotating shaft 240 is a hollow structure, and its radial cross-section along the circumference of the second air delivery channel 241 is approximately "7" shaped, where the radial cross-section refers to the cross-section through the axis of the rotating shaft 240. With this configuration, the gas entering the second air delivery channel 241 from the second air inlet 242 first flows upward axially, then diffuses horizontally in all directions, and then enters the first air delivery channel 212 after passing upward through the second air outlet 243 and the first air inlet 213. Of course, in other embodiments of this application, the second air delivery channel 241 is not limited to the above form, as long as it can deliver gas. For example, the second air delivery channel 241 can also be a cylindrical channel and coaxial with the rotating shaft 240.

[0076] As shown in Figure 5, in this embodiment, the first air inlet 213 has an arc-shaped structure and multiple inlets, which are spaced apart both circumferentially and radially along the bottom end face 217 of the body 210. More specifically, with the axis of the body 210 as the center, the first air inlet 213 has multiple rings, and the multiple rings of first air inlets 213 are evenly arranged radially, while the multiple first air inlets 213 in each ring are evenly arranged circumferentially. In this way, the arrangement of the first air inlets 213 is relatively uniform, thereby improving the uniformity of air intake.

[0077] As shown in Figure 6, the second air outlet 243 is also an arc-shaped structure with multiple outlets. They are evenly spaced both circumferentially and radially along the top surface of the rotating shaft 240. This ensures that the outlets are evenly spaced, thus guaranteeing uniformity of air output. Furthermore, the second air outlet 243 corresponds to the first air inlet 213, allowing the gas flowing out from the second air outlet 243 to directly enter the first air inlet 213. This results in low gas resistance and high gas delivery efficiency.

[0078] In this embodiment, one of the top surface of the rotating shaft 240 and the bottom surface 217 of the body 210 can be provided with a limiting protrusion, and the other can be provided with a limiting groove 218. The limiting protrusion and the limiting groove 218 cooperate to position and limit the position between the rotating shaft 240 and the body 210, which helps to ensure the coaxiality of the two.

[0079] Specifically, in this embodiment, as shown in Figures 2 and 3, a limiting groove 218 is provided on the bottom end surface 217 of the body 210, and a receiving groove 244 is provided on the top end surface of the rotating shaft 240. A limiting ring 245 is installed in the receiving groove 244, and the limiting ring 245 forms a limiting protrusion. Of course, in other embodiments of this application, the limiting protrusion can also be directly provided on the top end surface of the rotating shaft 240. Moreover, although the limiting groove 218, the receiving groove 244, and the limiting ring 245 are all annular in this embodiment, in other embodiments of this application, the limiting groove 218 and the limiting protrusion are not limited to being annular, but only need to be able to provide the above-mentioned positioning and limiting functions for the rotating shaft 240 and the body 210.

[0080] As shown in Figures 1 and 7, the semiconductor process equipment provided in this embodiment also includes a pressure detection component 400, which is configured to detect the gas pressure at different height positions within the process chamber 110. By detecting the gas pressure at different height positions within the process chamber 110, the specific value and distribution of the axial pressure within the process chamber 110 can be accurately determined. This facilitates targeted adjustment of the axial pressure within the process chamber 110 using a heat preservation device 200 or similar means, based on differences in the axial pressure distribution. This improves the uniformity of the axial pressure within the process chamber 110, thereby enhancing the uniformity of the film layers and step coverage between wafers at different height positions.

[0081] The pressure detection component 400 is described in detail below:

[0082] As shown in Figures 1, 7, and 8, in this embodiment, the pressure detection assembly 400 includes a pressure measuring tube 410 and a pressure measuring vacuum gauge 460. One end of the pressure measuring tube 410 is connected to the pressure measuring vacuum gauge 460, and the other end can extend from a pressure measuring hole provided in the process chamber 110 to a target height position inside the process chamber 110. The free end of the pressure measuring tube 410 is not closed. When detecting the gas pressure at a certain height position inside the process chamber 110, the free end is extended to the target height position inside the process chamber 110, and then the pressure measuring vacuum gauge 460 is used for detection. The type and model of the pressure measuring vacuum gauge 460 can be selected according to requirements.

[0083] The pressure measuring tube 410 is made of high-temperature resistant materials such as quartz or silicon carbide, preferably the same material as the process chamber 110.

[0084] Considering that the pressure measuring tube 410 is relatively fragile, in this embodiment, the connection between the pressure measuring tube 410 and other devices is through a vacuum conversion connector. Specifically, a first vacuum conversion connector 420 is provided between the pressure measuring tube 410 and the pressure measuring vacuum gauge 460, and the pressure measuring tube 410 is sealed to the first vacuum conversion connector 420; the pressure measuring hole is sealed to the pressure measuring tube 410 through a second vacuum conversion connector 470.

[0085] Specifically, as shown in Figure 9, the first vacuum conversion connector 420 includes a first body 421, a first locking member 425, and a first clamping sleeve 428. The first body 421 has a first through hole 422. The first end of the first through hole 422 extends radially inward to form a first limiting end face 423, and the second end extends radially outward to form a second limiting end face 424. The first through hole 422 is sleeved on the outer wall of the pressure measuring tube 410, and one end of the pressure measuring tube 410 abuts against the first limiting end face 423. The first locking member 425 has a first through hole 426 and a first locking hole 427 that are connected. The first through hole 426 is sleeved on the pressure measuring tube. The outer wall of the first body 421; the first locking hole 427 extends radially outward from the inner wall surface of one end of the first through hole 426, and extends axially away from the first through hole 426 and penetrates the corresponding end face of the first locking member 425. The first locking hole 427 is fitted onto the outer wall of the first body 421; the first pressing sleeve 428 is fitted onto the outer wall of the pressure measuring tube 410 and located inside the first locking hole 427. One end abuts against the bottom end face of the first locking hole 427, and the end face of the other end is tightly pressed against the second limiting end face 424 with a first sealing ring 429. The first sealing ring 429 is tightly fitted onto the outer wall of the pressure measuring tube 410. The tightness referred to by "tightly pressing" and "tightly fitted" is such that the first sealing ring 429 can fix the pressure measuring tube 410 to the first vacuum conversion connector 420 without damaging the pressure measuring tube 410.

[0086] When assembling the pressure measuring tube 410 and the first vacuum conversion connector 420, the first locking member 425, the first clamping sleeve 428, and the first sealing ring 429 can be sequentially fitted from the end of the pressure measuring tube 410 used to connect with the first vacuum conversion connector 420 to the outside of the pressure measuring tube 410; then the end of the pressure measuring tube 410 is inserted into the first through hole 422 and abuts against the first limiting end face 423. During this process, if the initial position of the first sealing ring 429 is too close to the end of the pressure measuring tube 410, the first sealing ring 429 will contact the second limiting end face 424 before the pressure measuring tube 410 is inserted into the position, and the second limiting end face 424 will push it backward to the target position. Finally, the first locking member 425 is fixedly connected to the first body 421. During this process, the first locking member 425 will push the first pressing sleeve 428 toward the first sealing ring 429 and squeeze the first sealing ring 429 so that the first sealing ring 429 is tightly fitted outside the pressure measuring tube 410, thereby fixing the pressure measuring tube 410. If the initial position of the first sealing ring 429 is too far from the end of the pressure measuring tube 410, during the process of the first locking member 425 being fixedly connected to the first body 421, the first locking member 425 will first push the first sealing ring 429 to the target position through the first pressing sleeve 428, and then squeeze it to be tightly fitted outside the pressure measuring tube 410.

[0087] As shown in Figure 10, the second vacuum conversion connector 470 includes a second body 471, a second locking member 474, and a second clamping sleeve 477. The second body 471 has a second through hole 472, and one end of the second through hole 472 extends radially outward to form a third limiting end face 473. The second through hole 472 is fitted onto the outer side wall of the pressure measuring tube 410. The second locking member 474 has a second through hole 475 and a second locking hole 476 that are connected. The second through hole 475 is fitted onto the outer side wall of the pressure measuring tube 410. The second locking hole 476 extends from the second through hole 475. One end of the inner wall of the 5 extends radially outward and axially away from the second through hole 475, penetrating the corresponding end face of the second locking member 474. The second locking hole 476 is fitted onto the outer wall of the second body 471. The second pressing sleeve 477 is fitted onto the outer wall of the pressure measuring tube 410 and located inside the second locking hole 476. One end abuts against the bottom end face of the second locking hole 476, and the other end face is tightly pressed against the third limiting end face 473 with a second sealing ring 478. The second sealing ring 478 is tightly fitted onto the outer wall of the pressure measuring tube 410. The tightness referred to by "tightly pressing" and "tightly fitted" is such that the second sealing ring 478 can fix the pressure measuring tube 410 to the second vacuum conversion connector 470 without damaging the pressure measuring tube 410.

[0088] The bottom wall of the process chamber 110 is its process door 113, and the pressure measuring hole is located in the process door 113; the second body 471 is fixed to the process door 113 and is arranged coaxially with the pressure measuring hole.

[0089] When assembling the pressure measuring tube 410 and the second vacuum conversion connector 470, the second sealing ring 478, the second clamping sleeve 477, and the second locking member 474 can be sequentially fitted onto the outside of the pressure measuring tube 410 from the end of the pressure measuring tube 410 used to connect with the second vacuum conversion connector 470. The second sealing ring 478 is then moved to the target position, that is, when the free end of the pressure measuring tube 410 is inserted into the target height position inside the process chamber 110 through the second through hole 472, the required position of the second sealing ring 478 can be determined in advance through simple calculation and measurement. After the free end of the pressure measuring tube 410 is inserted into the target height position inside the process chamber 110 through the second through hole 472, the second locking member 474 is fixedly connected to the second body 471. During this process, the second locking member 474 will push the second clamping sleeve 477 toward the second sealing ring 478 and squeeze the second sealing ring 478 so that the second sealing ring 478 is tightly fitted onto the outside of the pressure measuring tube 410, thereby fixing the pressure measuring tube 410.

[0090] More specifically, as shown in Figures 1 and 8, in this embodiment, the pressure detection assembly 400 further includes a first metal connector 430, a first air valve 440, and a second metal connector 450 connected in sequence. The end of the first metal connector 430 away from the first air valve 440 is fixed to a first vacuum conversion connector 420, and the end of the second metal connector 450 away from the first air valve 440 is fixed to a pressure measuring vacuum gauge 460. The first air valve 440 can be a ball valve, and the first metal connector 430 and the second metal connector 450 are connected to the ball valve via a compression fitting on the ball valve. When assembling the pressure detection component 400, the first metal connector 430, the first air valve 440, and the second metal connector 450 can be assembled first. The connection between the first metal connector 430 and the first body 421 of the first vacuum conversion connector 420 can be achieved by first inserting the first metal connector 430 into the through hole of the first body 421 and then welding it. The second metal connector 450 and the pressure gauge 460 can be connected through an adapter that is compatible with the pressure gauge 460, including but not limited to VCR connectors, flange connectors, etc. After assembling the above-mentioned unbreakable components, the pressure measuring tube 410 can be installed.

[0091] Considering the limited positional stability of the pressure sensing component 410 relative to its weight, and given that the pressure sensing component 400 is secured to the process chamber 110 solely by the second sealing ring 478, as shown in Figure 7, in this embodiment, the pressure sensing component 400 also includes a support arm 480. The support arm 480 has a through hole. After the pressure sensing component 400 is installed, the first metal connector 430 passes through the through hole, and the first vacuum conversion connector 420 overlaps the support arm 480. This arrangement primarily relies on the support arm 480 to bear the weight of the components of the pressure sensing component 400 other than the support arm 480 itself. This significantly improves the positional stability of the pressure sensing component 400, which is beneficial for ensuring smooth detection and accurate detection results.

[0092] More specifically, as shown in Figure 11, the support arm 480 may be provided with a fixing block 481 and a fixing plate 482. The fixing block 481 is fixedly connected to the main body of the support arm 480. Each side of the fixing block 481 and the fixing plate 482 has a partial through hole. After the fixing plate 482 is fixed to the fixing block 481, the two parts of the through hole form the aforementioned perforation. With this configuration, when assembling for testing, the fixing block 481 can be moved to one side of the first metal connector 430 first, and then the fixing plate 482 can be merged into the fixing block 481 without having to insert the pipe into the perforation axially, which is very convenient. Furthermore, at least one of the two parts of the through hole can be made smaller than half a hole. In this way, the size of the perforation and the clamping degree of the first metal connector 430 can be adjusted by adjusting the screws connecting the two.

[0093] In summary, when detecting gas pressure at different heights within the process chamber 110, the pressure detection assembly 400 can be installed and removed following these steps:

[0094] S102, Remove the sealing plug on the second vacuum conversion connector 470 at the pressure test hole of the process door 113 of the process chamber 110 and place it properly.

[0095] S104, connect and assemble the first vacuum conversion connector 420, the first metal connector 430, the first air valve 440, and the second metal connector 450. Connect the pressure measuring vacuum gauge 460 to the second metal connector 450 through the adapter. Assemble the step formed between the lower end of the first vacuum conversion connector 420 and the first metal connector 430 with the support arm 480. The tightness of the screws that fix the fixing plate 482 to the fixing block 481 is such that the first metal connector 430 can move up and down in the through hole of the support arm 480 without being restricted, and can be slightly wobbled, so as to prevent the pressure measuring tube 410 from being subjected to abnormal force when connecting the pressure measuring tube 410.

[0096] S106. Connect the data cable of the pressure gauge 460 to the computer to confirm that the data can be stored and read.

[0097] S108, remove the second locking part 474, the second clamping sleeve 477 and the second sealing ring 478 from the pressure testing hole of the second vacuum conversion connector 470 at the process door 113, and wipe the second sealing ring 478 with pure water to make the surface of the second sealing ring 478 clean and free of foreign matter.

[0098] S110: Based on the target detection height, determine the distance from the bottom surface of the pressure testing tube 410 to the bottom surface of the second vacuum conversion connector 470. Fit the second sealing ring 478 to its target position, then install the pressure testing tube 410. Specifically, insert the pressure testing tube 410 into the pressure testing hole and slowly move it upwards to prevent collisions until the second sealing ring 478 abuts against the third limiting end face 473. Securely connect the second locking member 474 to the second body 471. If the second locking member 474 is overtightened, do not reverse it, as this can easily lead to seal failure. Completely unscrew the second locking member 474 from the second body 471 and then retighten it. Axial installation errors only need to be controlled within the allowable range, such as within 5mm.

[0099] S112, remove the first locking part 425, the first pressing sleeve 428, and the first sealing ring 429 from the first vacuum conversion connector 420, wipe the first sealing ring 429 with pure water to keep the surface of the first sealing ring 429 clean and free of foreign matter; and then put the first locking part 425, the first pressing sleeve 428, and the first sealing ring 429 onto the outside of the pressure measuring tube 410 in sequence.

[0100] S114, move the support arm 480 so that the first vacuum conversion connector 420 is concentric with the pressure measuring tube 410 that has been installed on the process gate 113, and the upper surface of the first vacuum conversion connector 420 is 8-10mm away from the bottom surface of the pressure measuring tube 410.

[0101] S116, hold the assembled component and slowly move it upwards until the first sealing ring 429 on the outer sleeve of the pressure measuring tube 410 abuts against the second limiting end face 424. Then tighten the first locking member 425 of the first vacuum conversion connector 420 to the first body 421. Similarly, if the first locking member 425 is over-tightened, do not untighten it. Instead, completely unscrew the first locking member 425 from the first body 421 and then tighten it back on.

[0102] Hold the assembled components and adjust the height of the support arm 480 so that the support arm 480 can just provide support through the first vacuum conversion joint 420.

[0103] S118, adjust the process state in the process chamber 110, heat up to the test temperature, and test the leakage rate after assembly. If the leakage rate Spec≤4mTorr / min, the leak test is passed and pressure test can be performed. If the leak test fails, the condition of the sealing rings of the first vacuum conversion connector 420 and the second vacuum conversion connector 470 needs to be checked, reinstalled and tested for leaks until the leak test is passed.

[0104] S120, after the test is completed, the process chamber 110 is cooled down. Wearing high-temperature gloves, loosen the second locking part 474 of the second vacuum conversion connector 470 at the process door 113, remove the first locking part 425 of the first vacuum conversion connector 420, move the support arm 480, unscrew the second locking part 474 of the second vacuum conversion connector 470 at the process door 113, take out the pressure measuring tube 410, and the test is completed.

[0105] In this embodiment, as shown in FIG7, the semiconductor process equipment further includes an exhaust assembly 500, which includes an exhaust pipe 510 and a vacuum pump 520. The exhaust pipe 510 connects the process chamber 110 and the vacuum pump 520, and the exhaust pipe 510 is equipped with an exhaust vacuum gauge 530 and a second gas valve 540, which can be a butterfly valve. The vacuum pump 520 can evacuate the process chamber 110, allowing gas to exit the process chamber 110 through the exhaust pipe 510; the exhaust vacuum gauge 530 can monitor and measure the exhaust pressure; and the second gas valve 540 can control the magnitude of the exhaust pressure.

[0106] When using the aforementioned pressure detection component 400 to detect the gas pressure at different heights within a process chamber 110 under certain process conditions, after assembling and installing the pressure detection component 400, process gas is introduced into the process chamber 110. A vacuum pump 520 evacuates the process chamber 110, and the process gas is discharged from the process chamber 110 through the exhaust pipe 510. A certain pressure distribution is achieved within the process chamber 110. At this point, the pressure value measured by the pressure gauge 460 connected to the pressure measuring tube 410 is the pressure value at the location of the top opening of the pressure measuring tube 410. The pressure value measured by the pressure gauge 460 can be read by a connected computer. The computer records the pressure value at that height within the process chamber 110 at certain time intervals and can plot this series of pressure values ​​as a pressure-time curve on the computer. After the gas pressure at one target height has been measured, the length of the pressure measuring tube 410 extending into the process chamber 110 can be adjusted to measure the gas pressure at another target height, until the gas pressure at all target heights has been measured. By comparing the measured pressure value at each height with the target pressure value, the pressure difference value can be obtained. Based on the pressure difference value corresponding to each height position, targeted pressure adjustments can be made.

[0107] According to the measured data, along the axial direction of the process chamber 110, the gas pressure at the top and middle of the wafer area is basically the same, both greater than the pressure at the bottom. The bottom is the part near the insulation area where the insulation device 200 is located. The reason is that the bottom of the wafer area is closer to the chamber exhaust port 112, so the pressure change at this part is more obvious and the pressure is lower than that at the top and middle.

[0108] Based on the above experimental results, the heat preservation device 200 can compensate for the air intake in the vicinity of the chamber exhaust port 112, thereby increasing the gas at the bottom of the wafer location area, increasing the gas pressure in that area, and thus improving the uniformity of the gas and pressure distribution along the axial direction in the wafer location area.

[0109] The semiconductor process equipment provided in this embodiment, as shown in Figures 1 and 7, also includes an air intake assembly, which includes a gas delivery pipe 310 and related valves, wherein the gas delivery pipe 310 is used as an air intake pipe.

[0110] It is worth noting that, in order to adjust the air intake at different heights within the process chamber 110 and to make the axial pressure within the process chamber 110 more uniform, the gas delivery pipe 310 in the semiconductor process equipment provided in this embodiment has the function of adjusting the air intake at different heights. The following is a detailed description of the gas delivery pipe 310:

[0111] Referring to Figures 12 to 16, in this embodiment, the gas delivery pipe 310 includes an inner pipe 311 and an outer pipe 316 nested together. The inner pipe 311 has an inner hole 312 penetrating its sidewall, and there are multiple inner holes 312, which are spaced apart along the axial direction of the inner pipe 311. The outer pipe 316 has an outer hole 317 penetrating its sidewall, and there are multiple outer holes 317, which are spaced apart along the axial direction of the outer pipe 316. The circumferential relative position between the outer pipe 316 and the inner pipe 311 is adjustable, and the inner holes 312 and the outer holes 317 can form vent holes. When the outer pipe 316 and the inner pipe 311 are in different circumferential relative positions, the venting area of ​​the vent hole formed at at least one axial position is different. When the outer pipe 316 and the inner pipe 311 are in any circumferential relative position, the venting area of ​​at least two vent holes is different along the axial direction of the outer pipe 316.

[0112] The gas delivery pipe 310 provided in this embodiment has an inner hole 312 in the inner tube 311 and an outer hole 317 in the outer tube 316 forming a vent. Therefore, the gas delivery pipe 310 can be used for air intake. Gas delivered through the inner cavity of the inner tube 311 can diffuse through the vent to the external environment of the outer tube 316. For example, it can be used for air intake in the process chamber 110, delivering gas from outside the process chamber 110 to inside. Of course, the gas delivery pipe 310 is not limited to use as an intake pipe; when applied to other equipment, it can also be used as an exhaust pipe.

[0113] The gas delivery pipe 310 provided in this embodiment has an adjustable circumferential relative position between the inner pipe 311 and the outer pipe 316. When the outer pipe 316 and the inner pipe 311 are in any circumferential relative position, the ventilation area of ​​the vent at different positions along the axial direction of the outer pipe 316 can be different, thereby meeting the ventilation volume requirements at different axial positions. Furthermore, when the outer pipe 316 and the inner pipe 311 are in different circumferential relative positions, the ventilation area of ​​the vent at the same axial position can also be different. Therefore, by adjusting the circumferential relative position of the outer pipe 316 and the inner pipe 311, the ventilation volume at the same axial position can be adjusted to meet the different ventilation volume requirements at the same axial position.

[0114] In this embodiment, there may be multiple outer tubes 316, which are arranged sequentially along the axial direction of the inner tube 311. This arrangement allows multiple outer tubes 316 to divide the venting portion of the gas delivery pipe 310 into multiple segments along the axial direction. Therefore, for each segment's corresponding height range, the circumferential relative position of each outer tube 316 and inner tube 311 can be adjusted to obtain more combinations of vent holes, meeting the different ventilation requirements for different height ranges. This makes the adjustment of the ventilation volume along the axial direction of the gas delivery pipe 310 more precise, for example, making the adjustment of the air intake volume along the axial direction of the process chamber 110 more precise, thereby improving the uniformity of the gas and its pressure within the process chamber 110 along the axial direction.

[0115] Specifically, as shown in Figure 12, taking the setting of four outer tubes 316 as an example, the four outer tubes 316 are arranged sequentially along the axial direction of the inner tube 311, correspondingly dividing the venting portion of the gas delivery pipe 310 into four segments framed by the dashed lines. Of course, in other embodiments of this application, the number of outer tubes 316 is not limited to four; for example, it can also be two, three, or five, etc., which can be set according to the specific distribution of gas and its pressure in the process chamber 110.

[0116] It should be noted that the lengths of the multiple outer tubes 316 can be different. The specific length can be determined according to the specific axial distribution of the gas and its pressure in the process chamber 110. For example, the gas and its pressure distribution can be divided into the same height range if they are relatively close, and the length of the corresponding outer tube 316 can be determined according to the length of each height range.

[0117] In this embodiment, multiple positioning structures are provided between the inner tube 311 and the outer tube 316, and are spaced apart along the circumference of the inner tube 311. The positioning structures are configured such that the inner tube 311 and the outer tube 316 are relatively fixedly connected when their relative circumferential positions are different. By setting the positioning structures, after adjusting the relative circumferential positions of the outer tube 316 and the inner tube 311, the outer tube 316 and the inner tube 311 can be relatively fixed, thereby ensuring that the ventilation area of ​​each vent remains unchanged, and thus ensuring accurate ventilation through the vents.

[0118] Specifically, referring to Figures 13 to 16, in this embodiment, the positioning structure includes: protrusions 313 and grooves 318; there are multiple protrusions 313, circumferentially spaced on the inner tube 311, and protruding from the outer wall of the inner tube 311; there are multiple grooves 318, circumferentially spaced on the outer tube 316, recessed in the inner wall of the outer tube 316, and penetrating the corresponding ends of the outer tube 316 along the axial direction; when in different circumferential relative positions, the protrusions 313 are engaged in the corresponding grooves 318. In this embodiment, the outer tube 316 can be tightly fitted onto the outer wall of the inner tube 311, and the tightness does not hinder the coaxial relative rotation and axial relative movement of the outer tube 316 and the inner tube 311. Of course, the length of the outer tube 316 is less than the distance between the protrusions 313 at both ends, so that the outer tube 316 and the inner tube 311 can be smoothly adjusted from one circumferential relative position to another circumferential relative position. Specifically, when adjusting the circumferential relative position of the outer tube 316 and the inner tube 311, first move the outer tube 316 a certain distance relative to the inner tube 311 along the axial direction so that the groove 318 disengages from the corresponding protrusion 313. Then rotate the outer tube 316 to the target position. Finally, move the outer tube 316 along the axial direction so that the groove 318 engages with the corresponding protrusion 313 in the new position.

[0119] In addition, the groove 318 extends through the corresponding end of the outer tube 316 along the axial direction, allowing the operator to visually see from the corresponding end of the outer tube 316 whether the protrusion 313 and the groove 318 have been engaged. The positioning structure also plays a certain role in axial positioning and limiting of the outer tube 316, which helps to ensure the accurate axial relative position of the outer tube 316 and the inner tube 311.

[0120] More specifically, as shown in Figures 13 and 14, and in conjunction with Figure 16, in this embodiment, the groove 318 penetrates the outer wall surface of the outer tube 316 radially. Because when the outer tube 316 and the inner tube 311 are in any circumferential relative position, each protrusion 313 should be engaged in the corresponding groove 318. Therefore, by setting the groove 318 to penetrate the outer wall surface of the outer tube 316, the operator can clearly see from the side whether the protrusion 313 and the groove 318 have been engaged, thus enabling a very intuitive determination of whether the circumferential relative position of the outer tube 316 and the inner tube 311 has been adjusted to the correct position.

[0121] Of course, in other embodiments of this application, the groove 318 may not penetrate the outer wall of the outer tube 316, but only penetrate the end of the outer tube 316. In that case, the operator can judge whether the adjustment is in place from the end of the outer tube 316.

[0122] In this embodiment, the outer tube 316 and the inner tube 311 can both be made of materials such as quartz.

[0123] In this embodiment, multiple positioning structures are arranged in correspondence with the outer tube 316 along the axial direction of the inner tube 311.

[0124] In this embodiment, as shown in Figures 13 to 15, the inner holes 312 are arranged in a single row, and all inner holes 312 have the same diameter; the outer holes 317 are arranged in multiple rows, with the same diameter for outer holes 317 in the same row and different diameters for outer holes 317 in different rows; the maximum diameter of the outer holes 317 is not greater than the diameter of the inner holes 312. With this arrangement, when the outer tube 316 and the inner tube 311 are in different circumferential relative positions, the outer tube 316 either partially blocks the inner holes 312 or is directly opposite and equal in size to the inner holes 312. Furthermore, when the outer tube 316 partially blocks the inner holes 312, the area of ​​obstruction by the outer tube 316 varies depending on the circumferential relative position. In this configuration, when the outer tube 316 is adjusted so that the outer holes 317 in different rows are opposite the inner holes 312, a row of vent holes with the same diameter as the outer holes 317 will be formed. Of course, in other embodiments of this application, the outer tube 316 may be a single tube, in which case the diameters of the outer holes 317 in the same row are different, and the diameters of the outer holes 317 in different rows are also different.

[0125] It should be noted that in other embodiments of this application, the inner hole 312 and outer hole 317 can also be configured as follows: the inner hole 312 has multiple rows, the inner holes 312 in the same row have different diameters, and the inner holes 312 in different rows also have different diameters; the outer hole 317 has one row, and the diameters of each outer hole 317 are the same; the maximum diameter of the inner hole 312 is not greater than the diameter of the outer hole 317. In this case, when the outer tube 316 is adjusted so that the outer hole 317 is opposite to the inner holes 312 in different rows, a row of vent holes with the same diameter as the inner holes 312 will be formed.

[0126] In this embodiment, as shown in Figure 12, the free end of the inner tube 311 is sealed. This arrangement ensures that all gas in the inner cavity of the inner tube 311 diffuses out through the vents. Of course, if the free end of the inner tube 311 requires ventilation, it can also be provided with corresponding vents.

[0127] In this embodiment, as shown in Figure 12 and in conjunction with Figure 1, one end of the inner tube 311 is connected to an installation tube 314 at an angle to it, and the gas delivery tube 310 is fixedly installed through the installation tube 314. In Figure 1, the chamber inlet 111 is located on the side wall of the process chamber 110, so the installation tube 314 facilitates the fixed installation of the gas delivery tube 310. Of course, if the chamber inlet 111 is located on the top or bottom wall of the process chamber 110, the gas delivery tube 310 may not need to be provided with an installation tube 314, but can be directly fixedly installed at the chamber inlet 111.

[0128] In summary, the semiconductor process equipment provided in this embodiment, through the pressure detection component 400, can achieve transparency of the axial pressure distribution within the process chamber 110. Given that the axial pressure distribution and specific pressure values ​​within the process chamber 110 are known, the axial gas pressure within the process chamber 110 can be specifically adjusted at points of difference in axial pressure distribution through the compensating air intake function of the gas delivery pipe 310 and the heat preservation device 200. This improves the uniformity of the axial pressure distribution within the process chamber 110, thereby optimizing the uniformity of the inter-wafer process film layers and improving step coverage, ultimately enhancing process performance and wafer product quality. The gas delivery pipe 310 and the heat preservation device 200 can function as a single pressure regulator, or both can be used in combination for pressure regulation.

[0129] Furthermore, by using the gas delivery pipe 310, the air intake at different height positions within the process chamber 110 can be adjusted to bring the gas pressure at each height position close to the target pressure. Alternatively, the air intake within a certain height range can be adjusted to bring the gas pressure within that range close to the gas pressure in other height ranges, thereby achieving axial uniformity of the gas and its pressure within the process chamber 110. Specifically, if the gas pressure in a certain height range is lower than the gas pressure in other height ranges, the gas delivery pipe 310 and the outer pipe 316 corresponding to that height range can be rotated to make the vent area of ​​its vent larger than that of other height ranges, thereby increasing the air intake within that height range and raising the gas pressure within that height range. Conversely, if the gas pressure in a certain height range is higher than that of other height ranges, the gas delivery pipe 310 and the outer pipe 316 corresponding to that height range can be rotated to make the vent area of ​​its vent smaller than that of other height ranges, thereby reducing the air intake within that height range and lowering the pressure value within that height range.

[0130] Finally, it should be noted that in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0131] The above description of the disclosed embodiments enables those skilled in the art to make or use this application. Various modifications to the embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A heat preservation device, characterized in that, The device includes a main body, which has a heat-insulating cavity and a first air supply channel. The first air supply channel is not connected to the heat-insulating cavity. The first air supply channel is provided with multiple air supply ports, all of which are located on the outer wall surface of the main body.

2. The heat preservation device according to claim 1, characterized in that, The main body has a barrel-shaped structure, and an insulated cover is sealed and fixed at the opening of the main body. The insulated cover and the inner wall of the main body enclose the insulated cavity.

3. The heat preservation device according to claim 2, characterized in that, The insulation cavity is provided with a support column and fins. The support column is fixed to the body, and the fins are multiple and fixed to the support column at intervals along the axial direction of the support column.

4. The heat preservation device according to claim 2, characterized in that, The air inlet includes a first air inlet and a first air outlet, with the first air outlet located on the outer side of the body. And / or, the first air inlet is located on the outer end face of the body.

5. The heat preservation device according to claim 4, characterized in that, The first air outlet has multiple outlets, which are distributed circumferentially and / or axially along the body.

6. The heat preservation device according to claim 4, characterized in that, The first air supply channel is an annular channel surrounding the outside of the insulation cavity.

7. The heat preservation device according to any one of claims 4-6, characterized in that, The opening is located at the top of the body, and the first air inlet is located at the bottom end face of the body.

8. The heat preservation device according to claim 7, characterized in that, The heat preservation device also includes a rotating shaft fixed to the bottom end face of the main body, the rotating shaft being coaxial with the main body; The rotating shaft has a second air supply channel, which has a second air inlet and a second air outlet. The second air outlet is located on the top surface of the rotating shaft and is connected to the first air inlet.

9. The heat preservation device according to claim 8, characterized in that, The second air inlet is located on the bottom end face of the rotating shaft.

10. The heat preservation device according to claim 8, characterized in that, The longitudinal section of the shaft is "T" shaped, with its larger end located at the top of the shaft, and the longitudinal section is a plane passing through the axis of the shaft.

11. The heat preservation device according to claim 8, characterized in that, The second air delivery channel is an annular channel and is coaxial with the rotating shaft.

12. The heat preservation device according to claim 8, characterized in that, The first air inlet is an arc-shaped structure, having multiple inlets, which are circumferentially spaced along the bottom end face of the body, and / or radially spaced along the bottom end face of the body. The second air outlet has an arc-shaped structure and has multiple outlets, which are circumferentially spaced along the top surface of the rotating shaft and / or radially spaced along the top surface of the rotating shaft, and correspond to the position of the first air inlet.

13. The heat preservation device according to claim 8, characterized in that, One of the top surface of the rotating shaft and the bottom surface of the body is provided with a limiting protrusion, and the other is provided with a limiting groove, wherein the limiting protrusion and the limiting groove cooperate.

14. A semiconductor process apparatus, characterized in that, The invention includes a process chamber and a heat preservation device as described in any one of claims 1-13, wherein the process chamber has a chamber air inlet and a chamber exhaust outlet, the heat preservation device is disposed in the process chamber, and the main body is disposed near the chamber exhaust outlet.

15. The semiconductor process equipment according to claim 14, characterized in that, The semiconductor process equipment also includes a pressure detection component, which is configured to detect the gas pressure at different height positions within the process chamber.

16. The semiconductor process equipment according to claim 15, characterized in that, The process chamber is equipped with a pressure measuring hole; The pressure detection assembly includes a pressure measuring tube and a pressure measuring vacuum gauge. One end of the pressure measuring tube is connected to the pressure measuring vacuum gauge, and the other end can extend from the pressure measuring hole to the target height position in the process chamber.

17. The semiconductor process equipment according to claim 16, characterized in that, The pressure measuring tube and the pressure measuring vacuum gauge are sealed together by a first vacuum conversion joint, and / or the pressure measuring hole and the pressure measuring tube are sealed together by a second vacuum conversion joint.

18. The semiconductor process equipment according to claim 17, characterized in that, The first vacuum adapter includes: The first body has a first through hole, a first end of the first through hole extends radially inward to form a first limiting end face, and a second end extends radially outward to form a second limiting end face; the first through hole is sleeved on the outer wall of the pressure measuring tube, and one end of the pressure measuring tube abuts against the first limiting end face; A first locking member has a first through hole and a first locking hole that are connected to each other. The first through hole is fitted onto the outer wall of the pressure measuring tube. The first locking hole extends radially outward from the inner wall surface of one end of the first through hole and extends axially away from the first through hole, penetrating the corresponding end face of the first locking member. The first locking hole is fitted onto the outer wall of the first body. The first clamping sleeve is fitted onto the outer wall of the pressure measuring tube and located inside the first locking hole. One end abuts against the bottom end face of the first locking hole, and the other end face is tightly pressed with the second limiting end face by a first sealing ring. The first sealing ring is tightly fitted onto the outer wall of the pressure measuring tube.

19. The semiconductor process equipment according to claim 17, characterized in that, The second vacuum adapter includes: The second body has a second through hole, one end of which extends radially outward to form a third limiting end face; the second through hole is sleeved on the outer wall of the pressure measuring tube; The second locking member has a second through hole and a second locking hole that are connected to each other. The second through hole is sleeved on the outer wall of the pressure measuring tube. The second locking hole extends radially outward from the inner wall surface of one end of the second through hole and extends axially away from the second through hole, penetrating the corresponding end face of the second locking member. The second locking hole is sleeved on the outer wall of the second body. The second clamping sleeve is fitted onto the outer wall of the pressure measuring tube and located inside the second locking hole. One end abuts against the bottom end face of the second locking hole, and the other end face is tightly pressed against the third limiting end face with a second sealing ring. The second sealing ring is tightly fitted onto the outer wall of the pressure measuring tube.

20. The semiconductor process apparatus according to any one of claims 17-19, characterized in that, The pressure detection assembly further includes a first metal connector, a first air valve, and a second metal connector connected in sequence. The end of the first metal connector away from the first air valve is fixed to the first vacuum conversion connector, and the end of the second metal connector away from the first air valve is fixed to the pressure measuring vacuum gauge.

21. The semiconductor process equipment according to claim 20, characterized in that, The pressure detection assembly also includes a support arm with a through hole. After the pressure detection assembly is installed in place, the first metal connector passes through the through hole, and the first vacuum conversion connector overlaps the support arm.

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