Chip packaging structure and optical device

By using a combination of containment rings and adhesives in the packaging structure, the corrosion problems caused by silver paste penetration and vaporization were solved, achieving stability and long lifespan of functional devices and meeting automotive-grade requirements.

WO2026113993A1PCT designated stage Publication Date: 2026-06-04SHENZHEN LASER INST
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Patent Information

Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
SHENZHEN LASER INST
Filing Date
2025-11-17
Publication Date
2026-06-04

AI Technical Summary

Technical Problem

During the thermo-press encapsulation process, silver paste may seep into the cavity and vaporize to generate corrosive gases, leading to corrosion and functional failure of the components.

Method used

The system employs a combination structure of a containment ring and an adhesive. The containment ring adheres tightly to the substrate to form the first seal, while the adhesive forms the second seal on the periphery, preventing the adhesive from seeping into the containment cavity. Furthermore, the possibility of vaporization is reduced by gradually decreasing the amount of adhesive and designing the height of the containment ring.

Benefits of technology

It improves the airtightness of the cavity, prevents corrosive gases from corroding functional components, enhances the stability and service life of the overall structure, and meets automotive-grade requirements.

✦ Generated by Eureka AI based on patent content.

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    Figure CN2025135314_04062026_PF_FP_ABST
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Abstract

The present application relates to a chip packaging structure and an optical device. The chip packaging structure comprises: a first substrate, having a predetermined mounting area; a second substrate, spaced apart from the first substrate and covering the predetermined mounting area; and a packaging assembly, comprising an adhesive and at least one surrounding ring body, wherein all the surrounding ring bodies are annularly arranged at the periphery of the predetermined mounting area, and the adhesive is annularly arranged at the periphery of the surrounding ring body closest to the predetermined mounting area, the adhesive bonds the first substrate and the second substrate, among all the surrounding ring bodies, the surrounding ring body closest to the predetermined mounting area is closely attached to the first substrate and the second substrate, so as to define an accommodating cavity together with the first substrate and the second substrate, and a functional device is accommodated in the accommodating cavity and mounted in the predetermined mounting area. The chip packaging structure of the present application has a good product yield, a long service life, a high structural stability, and a good working temperature resistance capability, thereby meeting automotive-grade requirements.
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