A repairable and upgradable wearable smart device

Abstract

This application relates to a wearable smart device. The wearable smart device comprises: a casing having an interior cavity; a motherboard disposed within the interior cavity, the motherboard comprising a processing unit and an electrical connector, wherein the electrical connector is configured to support a plurality of different bus architectures; a power supply electrically coupled to the motherboard; and a removable daughterboard comprising a complementary electrical connector for mating with the electrical connector of the motherboard, the complementary electrical connector configured to support at least one of the plurality of different bus architectures supported by the electrical connector of the motherboard. This application further relates to a motherboard for a wearable smart device, a daughterboard for a wearable smart device, a kit of parts for a wearable smart device and a method of modifying a wearable smart device.

Description

[0001] A REPAIRABLE AND UPGRADABLE WEARABLE SMART DEVICE

[0002] TECHNICAL FIELD

[0003] This application relates to a wearable smart device, such as a smart watch. In particular, this application relates to a modular wearable smart device that is readily repairable and upgradable.

[0004] BACKGROUND ART

[0005] Smart wearable devices, such as smart watches and fitness trackers and the like, often prove difficult to repair and / or upgrade. Such devices are often discarded after only a relatively short period of usage, such as one to two years, due to issues such as a damage to the electronic display, diminishing battery life, or broken / obsolete internal hardware. Disposing of these otherwise perfectly working electronic devices contributes to the 60 million tonnes of electronic waste which is generated annually around the world. A more environmentally friendly solution which prevents such waste is needed.

[0006] Typical wearable smart devices include complex internal hardware which is often rigidly fixed in place by solder or glue or the like, and difficult to access or dismantle without destroying the entire device. Further, many wearable smart devices include a single integrated circuit board which may need to be entirely replaced if a hardware fault occurs with any part of the circuit board. Additionally, wearable smart devices that include multiple internal hardware components often require specific, sometimes permanent, connections to be made between components, which can further prevent disassembly of the device as well as the ability to modify or upgrade the device.

[0007] We have appreciated that it would be desirable to provide a wearable smart device that allows consumers to more easily repair the device, for example by replacing or upgrading hardware components with new spare parts, and without the need for special tools or expertise.

[0008] SUMMARY OF THE INVENTION

[0009] The invention is defined by the independent claims, to which reference should now be made. Advantageous features are set out in the dependent claims.

[0010] According to a first aspect of the invention, a wearable smart device is provided. The wearable smart device comprises: a casing having an interior cavity; a motherboard disposed within the interior cavity, the motherboard comprising a processing unit and an electrical connector, wherein the electrical connector is configured to support a plurality of different bus architectures; a power supply electrically coupled to the motherboard; and a removable daughterboard comprising a complementary electrical connector for mating with the electrical connector of the motherboard, the complementary electrical connector configured to support at least one of the plurality of different bus architectures supported by the electrical connector of the motherboard.

[0011] In one example, the daughterboard comprises a non-volatile storage module configured to store information for identifying the daughterboard to the processing unit of the motherboard.

[0012] In one example, the information for identifying the daughterboard comprises at least one of: a model identification number of the daughterboard, information indicative of a functionality of the daughterboard, or information indicative of the least one bus architecture supported by the complementary electrical connector of the daughterboard.

[0013] In one example, the processing unit is configured to determine the at least one bus architecture supported by the complementary electrical connector of the daughterboard based on the information identifying the daughterboard.

[0014] In one example, the processing unit selects for communication via the electrical connector a communication protocol corresponding to the determined at least one bus architecture supported by the complementary electrical connector.

[0015] In one example, the electrical connector is configured to support one or more of the following bus architectures: Serial Peripheral Bus (SPI), Inter-Integrated Circuit (l2C), Universal Asynchronous Receiver and Transmitter (UART), and / or General Purpose Input / Output (GPIO).

[0016] In one example, the daughterboard comprises a communication module configured for at least one of Bluetooth, cellular, RFID, or GPS communications.

[0017] In one example, the daughterboard comprises at least one of: an accelerometer, an inertial measurement unit, or an altimeter.

[0018] In one example, the daughterboard comprises a circuit board and an antenna electrically coupled to the circuit board.

[0019] In one example, the antenna is disposed on an antenna carrier and the antenna carrier is coupled to the circuit board.

[0020] In one example, the antenna carrier comprises injection moulded plastic.

[0021] In one example, the antenna comprises an antenna trace etched onto the antenna carrier by Laser Direct Structuring (LDS).

[0022] In one example, the circuit board is coupled to a first portion of the antenna carrier and the antenna is disposed on a second portion of the antenna carrier.

[0023] In one example, the second portion is configured to extend perpendicularly to the plane of the circuit board when the circuit board is coupled to the first portion. In one example, the second portion of the antenna carrier has a curved profile that is complementary to the curvature of a sidewall of the casing.

[0024] In one example, the second portion of the antenna carrier includes a flattened portion and at least a portion of the antenna is disposed on the flattened portion.

[0025] In one example, the antenna carrier comprises one or more interlocking portions that are configured to cooperate with one or more interlocking portions of the casing to removably hold the daughterboard in place inside the interior cavity of the casing.

[0026] In one example, the daughterboard comprises one or more fastening elements for releasably securing the daughterboard within the interior cavity of the casing when the interlocking portions of the antenna carrier are engaged with the interlocking portions of the casing.

[0027] In one example, the antenna carrier is configured to be removably fittable inside the interior cavity of the casing to hold the daughterboard inside the interior cavity of the casing.

[0028] In one example, the motherboard comprises two electrical connectors each configured to support the plurality of different bus architectures; and the wearable smart device comprises two daughterboards each comprising complementary electrical connectors configured to support at least one of the plurality of different bus architectures.

[0029] In one example, the electrical connectors are located on opposing sides of the motherboard when viewed in a direction perpendicular to a plane of the motherboard, such that the daughterboards are located at opposing edges of the motherboard when the complementary electrical connector of each daughterboard is coupled to a respective one of the electrical connectors.

[0030] In one example, the two daughterboards each comprise a circuit board and an antenna disposed on a respective antenna carrier coupled to the circuit board.

[0031] In one example, each antenna carrier is configured to be removably fittable inside the interior cavity of the casing such that both daughterboards can be held inside the interior cavity of the casing at the same time.

[0032] In one example, the respective antenna carriers are identical in shape.

[0033] In one example, the antenna of each daughterboard is etched into the antenna carrier by Laser Direct Structuring (LDS), each antenna comprising an antenna trace of differing trace length and / or shape.

[0034] In one example, the antennas of the two daughterboards are tuned to receive and / or transmit at different frequencies based on a functionality of the respective daughterboard.

[0035] In one example, a first of the two daughterboards comprises a communication module configured for GPS, and a second of the two daughterboards comprises a communication module configured for Bluetooth communications. In one example, the antenna of the first daughterboard is tuned for communication at a first frequency, such as 1.6 GHz, and the antenna of the second daughterboard is tuned for communication at a second frequency, such as 2.4 GHz.

[0036] In one example, the antenna of the first daughterboard includes an antenna trace that is longer than an antenna trace of the antenna of the second daughterboard.

[0037] In one example, the motherboard further comprises a body sensor connector; and the wearable smart device further comprises a removable body sensor module comprising a complementary body sensor connector for mating with the body sensor connector on the motherboard.

[0038] In one example, the body sensor connector is configured to support a second plurality of different bus architectures; and the complementary body sensor connector is configured to support at least one of the second plurality of different bus architectures supported by the body sensor connector of the motherboard.

[0039] In one example, the body sensor module comprises a non-volatile storage module configured to store information for identifying the body sensor module to the processing unit of the motherboard.

[0040] In one example, the information for identifying the body sensor module comprises at least one of: a model identification number of the body sensor module, information indicative of a functionality of the body sensor module, or information indicative of the least one bus architecture supported by the complementary body sensor connector.

[0041] In one example, the processing unit is configured to determine the at least one bus architecture supported by the complementary body sensor connector based on the information identifying the body sensor module.

[0042] In one example, the processing unit selects for communication via the body sensor connector a communication protocol corresponding to the determined at least one bus architecture supported by the complementary body sensor connector.

[0043] In one example, the body sensor connector is configured to support one or more of the following bus architectures: Serial Peripheral Bus (SPI), Inter-Integrated Circuit (l2C), and / or General Purpose Input / Output (GPIO).

[0044] In one example, the body sensor connector and / or complementary body sensor connector comprises one or more pogo pin connectors.

[0045] In one example, the body sensor module is configured to take one or more of the following measurements from a person wearing the wearable smart device: heart rate, oxygen saturation, electrocardiogram (ECG), body temperature or galvanic skin response.

[0046] In one example, the body sensor module comprises at least one of: an accelerometer, an inertial measurement unit, or an altimeter.

[0047] In one example, the body sensor module is configured to removably couple to an underside of the casing to define the interior cavity. In one example, the casing is openable by removing the body sensor module from the underside of the casing, and resealable by recoupling the body sensor module to the underside of the casing.

[0048] In one example, the power supply is removable via the underside of the casing when the body sensor module is uncoupled from the casing.

[0049] In one example, the motherboard further comprises a display connector; and the wearable smart device further comprises a display module comprising a complementary display connector for mating with the display connector on the motherboard.

[0050] In one example, the display connector is configured to support a third plurality of different bus architectures; and the complementary display connector is configured to support at least one of the third plurality of different bus architectures supported by the display connector of the motherboard.

[0051] In one example, the display module comprises a non-volatile storage module configured to store information for identifying the display module to the processing unit of the motherboard.

[0052] In one example, the information for identifying the display module comprises at least one of: a model identification number of the display module, or information indicative of the least one bus architecture supported by the complementary display connector.

[0053] In one example, the processing unit is configured to determine the at least one bus architecture supported by the complementary display connector based on the information identifying the display module.

[0054] In one example, the processing unit selects for communication via the display connector a communication protocol corresponding to the determined at least one bus architecture supported by the complementary display connector.

[0055] In one example, the display connector is configured to support bus architectures for both Memory-ln-Pixel type displays as well as Active-Matrix Organic Light-Emitting Diode (AMOLED) type displays.

[0056] In one example, the display module is configured to removably couple to a top side of the casing to define the interior cavity.

[0057] In one example, the casing is openable by removing the display module from the top side of the casing, and resealable by recoupling the display module to the top side of the casing.

[0058] In one example, the motherboard and the daughterboard are removable via the top side of the casing when the display module is uncoupled from the casing.

[0059] In one example, the power supply is a rechargeable battery.

[0060] In one example, the battery comprises electrical contacts positioned on a side of the battery that is perpendicular to the major plane of the battery. In one example, the motherboard and the daughterboard are not connected to the casing by a permanent fixing, such that the electrical connector and complementary electrical connector can be repeatedly mated and unmated from one another on assembly and disassembly of the wearable smart device.

[0061] In one example, the motherboard is configured to connect to a plurality of daughterboards each contained within the casing along with the motherboard.

[0062] In one example, the motherboard is configured to connect to a plurality of daughterboards having different functions and / or bus architectures in a modular fashion.

[0063] In one example, the wearable smart device further comprises a USB connector integrated on the motherboard.

[0064] In one example, the wearable smart device further comprises a wrist strap coupled to the casing.

[0065] In one example, the wearable smart device is a smart watch.

[0066] According to a second aspect of the invention, a motherboard for a wearable smart device is provided. The motherboard comprises: a processing unit; and an electrical connector for mating with a complementary electrical connector on a removable daughterboard, wherein the electrical connector is configured to support a plurality of different bus architectures.

[0067] According to a third aspect of the invention, a daughterboard for a wearable smart device is provided. The daughterboard comprises: a complementary electrical connector for mating with an electrical connector on a motherboard, wherein the complementary electrical connector is configured to support at least one of a plurality of different bus architectures supported by the electrical connector of the motherboard.

[0068] According to a fourth aspect of the invention, a kit of parts for a wearable smart device is provided. The kit of parts comprises: a casing having an interior cavity; a motherboard comprising a processing unit and an electrical connector, wherein the electrical connector is configured to support a plurality of different bus architectures; and a daughterboard comprising a complementary electrical connector for mating with the electrical connector of the motherboard, the complementary electrical connector configured to support at least one of the plurality of different bus architectures supported by the electrical connector of the motherboard.

[0069] According to a fifth aspect of the invention, a method of modifying a wearable smart device is provided, the wearable smart device having a motherboard comprising a processing unit and an electrical connector, wherein the electrical connector is configured to support a plurality of different bus architectures. The method comprises the steps of: unmating, from the electrical connector, a complementary electrical connector of a first removable daughterboard, wherein the complementary electrical connector of the first removable daughterboard is configured to support at least one of the plurality of different bus architectures supported by the electrical connector of the motherboard; mating, with the electrical connector, a complementary electrical connector of a second removable daughterboard, wherein the complementary electrical connector of the second removable daughterboard is configured to support at least one of the plurality of different bus architectures supported by the electrical connector of the motherboard.

[0070] In one example, the method further comprises the step of: identifying, by the second removable daughterboard, to the processing unit of the motherboard, at least one of: a model identification number of the daughterboard, information indicative of a functionality of the daughterboard, or information indicative of the least one bus architecture supported by the complementary electrical connector of the daughterboard.

[0071] In one example, the method further comprises the step of: determining, by the processing unit, the at least one bus architecture supported by the complementary electrical connector of the daughterboard based on the information identifying the daughterboard.

[0072] In one example, the method further comprises the step of: selecting, by the processing unit, for communication via the electrical connector, a communication protocol corresponding to the determined at least one bus architecture supported by the complementary electrical connector of the second daughterboard.

[0073] Embodiments described herein provide a wearable smart device having a multifunction daughterboard system, with the daughterboards being modular and removable to allow repair or upgrading of the hardware of the wearable smart device. Further, the connectors within the wearable smart device, particularly on the motherboard, are configured to be compatible with multiple bus architecture and communication protocol standards. This further improves the upgradability and compatibility of the wearable smart device, as new daughterboards offering different or upgraded functionality can be seamlessly installed within the wearable smart device.

[0074] Embodiments described herein provide a more sustainable wearable smart device solution, in terms of reduction of electronic waste. Specifically, embodiments of the wearable smart device have a modular design, with upgradeable and repairable components including the display, the sensor, the power supply and the internal circuit boards. If a user damages or wishes to upgrade any part of the watch, the user can order a suitable spare part and make the replacement at home, without requiring any specialist tools. Thus disposal of the entire device due to one piece of hardware being damaged or becoming obsolete can be prevented.

[0075] BRIEF DESCRIPTION OF THE DRAWINGS

[0076] Embodiments of the invention will now be described in relation to the accompanying drawings, by way of example only, in which: Figure 1 shows a wearable smart device according to one embodiment;

[0077] Figure 2A shows a partially exploded view of a top side of the wearable smart device of Figure 1 ;

[0078] Figure 2B shows a partially exploded view of a top side of the wearable smart device of Figure 1 ;

[0079] Figure 2C shows a partially exploded view of an underside of the wearable smart device of Figure 1 ;

[0080] Figure 3 shows a schematic diagram of a motherboard of a wearable smart device according to one embodiment;

[0081] Figure 4 shows a schematic diagram of a daughterboard of a wearable smart device according to one embodiment;

[0082] Figure 5 shows a schematic diagram of a body sensor module of a wearable smart device according to one embodiment;

[0083] Figure 6 shows a schematic diagram of a display module of a wearable smart device according to one embodiment;

[0084] Figure 7A shows a perspective view of a daughterboard of a wearable smart device according to one embodiment;

[0085] Figure 7B shows a plan view of a daughterboard of a wearable smart device according to one embodiment.

[0086] DETAILED DESCRIPTION

[0087] The present disclosure relates to wearable smart devices that are readily repairable and upgradable. In the embodiments described below the smart device is a smart watch, however the techniques and disclosure herein may be applied to any type of wearable smart device, including fitness trackers or the like.

[0088] Figure 1 shows a wearable smart device according to one embodiment. The wearable smart device 100 of Figure 1 is a smart watch 100 that includes a watch casing 102, also referred to as a watch body herein. The watch casing 102 is connected to a wrist strap 104 to enable to the smart watch 100 to be worn by the user. The watch casing 102 has a watch face 106 on a top side of the casing. The watch face 106 is formed from a display module 108, as will be discussed in more detail below, which can display information to the user, including information about the user measured by the smart device 100, as well as further information such as the time or information received via telecommunication.

[0089] Figures 2A to 2C show exploded views of the wearable smart device 100 of Figure 1 , and in particular the watch casing 102. Figure 2A shows a partially exploded view of a top side of the watch casing 102. Figure 2B shows another a partially exploded view of a top side of the watch casing 102 with the display module 108 removed. Figure 2C shows a partially exploded view of an underside of the watch casing 102.

[0090] As seen in Figures 2A to 2C, the watch casing 102 includes an interior cavity within which the various internal electronic components of the wearable smart device 100 are contained. The interior cavity of the watching casing is defined by a sidewall of the casing having a substantially circular perimeter, so as to define a cylindrical volume within the casing 102. The interior cavity is enclosed at each end face of this cylindrical volume by the watch face 106 and a case back 110 respectively. As mentioned the watch face may include or be formed from a display module 108. Further, the case back 110 may include or be formed from a body sensor module 112, as will be discussed in more detail below.

[0091] As best seen in Figure 2B, a motherboard 114 is positioned within the interior cavity of the watch casing 102. The motherboard includes a processing unit and memory for performing the various computing functions of the smart device 100. A power supply 116 is also contained within the interior cavity, as seen in Figure 2C, to provide power to the motherboard 114. The power supply 116 may be a battery in some embodiments, and may be either disposable or rechargeable. As shown in Figure 2C, the power supply may be held within a slot defined by a spacing component 118 (also referred to as a battery compartment moulding). In the present embodiment the power supply 116 is a rechargeable battery, and includes electrical contacts 120 positioned on a side of the battery (i.e. an edge of the battery when viewed perpendicular to the major plane of the battery). The electrical contacts couple with corresponding contacts 121 on the motherboard to provide power to the motherboard 114. The contacts 121 may be spring type contacts in some embodiments. Using a battery with side positioned electrical contacts (including both rectangular or circular batteries) has been found to allow a more efficient use of the space within the interior cavity.

[0092] In the case that a rechargeable battery is used, the motherboard 114 may further comprising a charging port for the power supply, such as charger port 122, which can be accessed from an opening in the sidewall of the casing 102. A USB Type-C port may be used to prevent the electronic waste associated with proprietary charger cables.

[0093] The motherboard 114 may further include additional components such as buttons 124 operable from the exterior of the casing 102, as well as components for sending alerts to the user, such as a vibration motor or speaker / buzzer unit (shown in Figure 3).

[0094] The motherboard 114 is configured to interface with the other electrical components of the smart device 100. In particular, the smart device 100 of the present embodiment includes two daughterboards 126, as best seen in Figures 2A and 2B, as well as the display module 108 and the body sensor module 112. Each of these components are electrically connectable to the processing unit of the motherboard 114.

[0095] Specifically the motherboard 114 includes a first and second electrical connector 128 (shown in Figure 2B, also referred to as daughterboard electrical connectors herein) for forming an electrical connection with each of the daughterboards 126. The electrical connectors 128 are configured for mating with a complementary electrical connector 130 of each daughterboard 126 (best seen in Figures 7A and 7B).

[0096] Further, the motherboard 114 includes a display electrical connector 132 (also referred to simply as a display connector, shown in Figures 2A and 2B) for forming an electrical connection with a complementary display connector on the display module 108 (not shown in Figures 2A to 2C).

[0097] Lastly, the motherboard 114 includes a body sensor electrical connector 134 (also referred to simply as a body sensor connector, shown in Figure 2C) for forming an electrical connection with a complementary body sensor connector on the body sensor module 112 108 (not shown in Figures 2A to 2C).

[0098] Each of the first and second electrical connectors 128, the display connector 132, and the body sensor connector 134 are configured to support multiple bus architectures, as will be discussed in greater detail in relation to Figures 3 to 6 later, to allow for upgradability of the smart device 100.

[0099] Further, the modular nature of the electrical components of the wearable smart device allows for straightforward repair of the device. Specifically, if any one of the motherboard, either daughterboard, body sensor module, display module, or power supply develop a fault, that component can be easily removed and replaced with the appropriate spare part, preventing the need for the entire device (along with the remaining working components) from being unnecessarily disposed of. To this end, each of the motherboard, daughterboards, body sensor module, display module, and power supply are removable. The motherboard can be releasably held within the interior cavity of the casing by any appropriate mounting structure, such as clips or screws or the like. Each daughterboard can then be removably coupled to the motherboard via the mating of the electrical connector 128 and complementary electrical connector 130, and the daughterboard may be releasably secured in place via one or more fastening elements, such as the screws 136 shown in Figure 2B. Other suitable fastening elements may additionally or alternatively be used.

[0100] The display module 108 may be removably coupled to the sidewall of the casing 102 to enclose the top side of the casing 102. In the present embodiment the display module is held in place via one or more screws 138, however any removable fastening elements may be used in general. In this way, the motherboard 114 and daughterboards 126 may be removed via the top side of the casing 102 when the display module 108 is uncoupled from the casing 102.

[0101] Similarly, the case back 110 and body sensor module 112 may be removably coupled to the sidewall of the casing 102 to enclose the underside of the casing 102. In the present embodiment the body sensor module 112 is held in place via one or more screws 140, however any removable fastening elements may be used in general. In this way, power supply 116 may be removed via the bottom side of the casing 102 when the case back 110 and body sensor module 112 is uncoupled from the casing 102.

[0102] Examples of removable fastening elements include screws, clips, push-fit arrangements or the like which are readily removable by the user when access inside the watch casing is desired, e.g. during a repair. Such removable fastening elements 136,138,140 beneficially allow repeated rapid access into the interior cavity and repeated removal of the daughterboards, as opposed to permanent fixing mechanisms used in the construction of typical wearable devices, such as adhesives and permanent rivets or welding or the like. Further, the display module 108 and body sensor module 112 themselves may be rapidly replaced if a repair is needed via the removable fastening elements 138,140.

[0103] The functionality and electrical connections of each of the above described electrical components will now be discussed in more detail in relation to Figures 3 to 6.

[0104] Figure 3 shows a schematic diagram of the motherboard 114 in more detail. As discussed above, the motherboard 114 includes a processing unit 142 and a memory 144. The processing unit may be implemented as a microcontroller, such as an ARM Cortex-M33 microcontroller, in some embodiments. Further, the memory 114 may be a permanent memory storage in the form of an embedded Multi Media Card (eMMC) device or the like. In some embodiments, the motherboard 114 may further include buttons 124 via which input controls can be received from the user, as well as components for communicating alerts to the user such as a vibration motor 146 (to provide haptic feedback generation) and an audible buzzer unit 148. Further, the motherboard 114 includes a power supply interface 150 for receiving power from the power supply. In the present embodiment the power supply 116 is a battery, and the power supply interface 150 may include the contacts 121 discussed previously. Further, the motherboard 114 includes the USB interface 122 (i.e. charger port) as discussed previously. In the present embodiment the USB interface is a USB connector / port integrated directly onto the motherboard 114. Alternatively, the USB interface 122 may include a separate USB port which is communicatively coupled to the motherboard 114. Further, the motherboard 114 may include optional components related to the control of power to and from the power supply 116, such as a power management unit 152, a battery charger unit 154, and a battery protection unit 156.

[0105] The processing unit 142 of the motherboard 114 is responsible for the overall operation of the smart device 100, and communicates with (i.e. interfaces with) and controls each of the daughterboards 126, as well as the display module 108 and the body sensor module 112. The processing unit 142 communicates with each daughterboard 126 via one of the electrical connectors 128. The electrical connectors 128 are each configured to support a plurality of different bus architectures. For example, in the present embodiment each electrical connector is configured to support each of the following bus architectures: Serial Peripheral Bus (SPI), Inter-Integrated Circuit (l2C), Universal Asynchronous Receiver and Transmitter (LIART), and General Purpose Input / Output (GPIO), as shown in Figure 3. This list is not intended to be limiting, and other bus architectures may also be used in alternative embodiments.

[0106] The term bus architecture refers to the function of each pin in the electrical connector 128 (i.e. the pinout configuration), as well as to the communication protocol used by the processing unit 142 to communicate via the pins of the electrical connector 128. For example, for the electrical connector 128 to support the SPI architecture, the electrical connector 128 must include each of the pins required by SPI (i.e. pins for the following: Master Output / Slave Input, MOSI, Master Input / Slave Output, MISO, Clock, SCLK, Slave Select / Chip Select, SS / CS) appropriately wired to the processing unit 142 for communication according to the SPI protocol. For the electrical connector 128 to support multiple bus architectures, the electrical connector 128 must include pins corresponding to each of the pins required by each bus architecture.

[0107] In general, each electrical connector 128 may include multiple general-purpose I / O pins, as well as the pins for each of the supported bus architecture. A suitable processing unit 142, such as a suitable microcontroller, which has enough input / output pins is chosen to provide the connection schemes to each of the electrical connectors 128.

[0108] As shown in Figure 3, the electrical connector 128 also includes a power supply line from the processing unit 142, to enable the electrical connector 128 to transfer power from the power supply 116 to the daughterboard. The electrical connector 128 may advantageously be configured to provide a wide variety of different power supplies to suit different chip requirements for different daughterboards.

[0109] In order for the processing unit 142 to interface with the daughterboard 126 via the electrical connector 128, each daughterboard 126 includes a complementary electrical connector 130 for mating with the electrical connector 128. The complementary electrical connector 130 must be configured to support at least one of the bus architectures supported by the electrical connector 128 of the motherboard. For example, if the electrical connector 128 supports each of SPI, l2C, LIART or GPIO, the complementary electrical connector 130 on the daughterboard 126 must support one of, or a combination of, these bus architectures.

[0110] The physical construction of the electrical connector 128 and complementary electrical connector 130 must be such that the electrical connector 128 and complementary electrical connector 130 may be mechanically mated together. In other words, the connectors 128,130 must share complementary mechanical interfaces. Further, the specific structural layout of the pins in the electrical connector 128 and complementary electrical connector 130 must correspond to each other, such that when mated each pin of the electrical connector 128 is in electrical contact with the correct pin of the complementary electrical connector 130 (i.e. the pin with the same function in the bus architecture in accordance with the pinout configuration). For example, in one specific example, the electrical connector 128 may support SPI and l2C, and thus include pins corresponding to each of these bus architectures, and the complementary electrical connector 130 of the daughterboard 126 may support only SPI. In this example, each of the pins of the SPI bus architecture (MOSI, MISO, SCLK, and SS / CS) in the complementary electrical connector 130 must be arranged such that they contact with the corresponding SPI pins in the electrical connector 128 when the two connectors are mated. In this way, each complementary electrical connector 130 has a mechanical interface and pinout configuration that allows connection to the processing unit 142 via the electrical connector 128 using at least one of the bus architectures supported by the electrical connector 128.

[0111] Thus the electrical connector 128 enables electrical bus connections to be made to the processing unit 142 according to multiple different bus architectures via a single electrical connector 128 (a single interface). By supporting each of the most common types of bus architectures used by integrated circuit manufacturers, the electrical connectors 128 enable the wearable smart device 100 to be compatible with a wide range of different plug-in daughterboards 126. This can enable upgrading or modification of the smart device 100, as daughterboards can be swapped out and replaced with daughterboards having different functions that may use or require a different bus architecture. The electrical connectors 128 may therefore flexibly accommodate a wide variety of plug-in daughterboards 126.

[0112] Figure 4 shows a schematic diagram of a daughterboard 126 in more detail. The daughterboard 126 of Figure 4 is configured to provide Global Positioning System (GPS) functionality. In particular, as well as the complementary electrical connector 130, the daughterboard 126 of Figure 4 comprises an antenna 158, as well as a GPS communication module 160. The GPS communication module 160 and complementary electrical connector 130 may be implemented on a circuit board of the daughterboard, to which the antenna is electrically coupled. The GPS communication module 160 includes components to enable GPS functionality, including a low power GNSS receiver 162, a Temperature Controlled Crystal Oscillator (TCXO) 164, a Low Noise Amplifier (LN A) 166, and a Surface Acoustic Wave (SAW) Filter 168. The GPS daughterboard of Figure 4 can therefore perform GPS locating and tracking, and provide this information to the processing unit 142 of the motherboard 114. This can enable the smart device 100 to provide tracking or locating services to the user via the display module 108.

[0113] In alternative embodiments, daughterboards 126 which provide additional or alternative functionalities are possible. For example, the daughterboard 126 of Figure 4 could additionally or alternatively include a Bluetooth communication module enabling Bluetooth communication, a cellular communication module enabling cellular communication (e.g. LTE or 5G), and / or an RFID communication module enabling RFID communication. This list is not intended to be limiting, and other types of communication functionalities may be used in alternative embodiments. Such communication modules can beneficially enable communication with a paired smart phone of the user, or communication via the internet or the like.

[0114] Further, functionalities not related to communication may additionally or alternatively be enabled on the daughterboard 126. For example, in some embodiments the daughterboard 126 may include any of an accelerometer, an inertial measurement unit, and / or an altimeter (such as a pressure sensor) to provide detail about the location and movement of the smart device 100 to the processing unit 142

[0115] Therefore each plug in daughterboard 126 is able to provide one or more different functionalities to the motherboard 114 depending on the desired use of the wearable smart device 100. The modular nature of the motherboard 114 and daughterboard 126 allows each daughterboard to be removed and replaced by the end user, to change or update the functionalities provided by the wearable smart device 100 (and enabled by each daughterboard 126). Such a modular arrangement results in a highly upgradable and repairable wearable smart device 100, preventing the entire device from being disposed of when a particular component, e.g. a particular daughterboard, needs repairing or upgrading.

[0116] Further, the plurality of different bus architectures supported by the electrical connectors 128 of the motherboard 114 allows for multiple different daughterboards 126 that use or require various different bus architectures to be compatible with the wearable smart device 100, further improving the adaptability and flexibility of the device.

[0117] In embodiments where the complementary electrical connector 130 of the daughterboard 126 supports more than one of the bus architectures supported by the electrical connector 128, each bus architecture supported by the complementary electrical connector 130 of a daughterboard 126 may be linked to a specific functionality of that daughterboard, such as the functionalities mentioned above.

[0118] In embodiments where the complementary electrical connector 130 of the daughterboard 126 supports one or more of the bus architectures supported by the electrical connector 128, the daughterboard 126 may identify itself to the processing unit 142 in order for the processing unit 142 to determine which bus architecture should be used to communicate with the daughterboard 126. Specifically, the processing unit 142 can determine the specific pins of the electrical connector 128 to which communication signals should be sent, as well as the specific communication protocol that should be used for the bus architecture supported by the daughterboard 126.

[0119] In some embodiments, each daughterboard 126 may include a memory 170 as shown in Figure 4. The memory is a non-volatile storage module such as an Electrically Erasable Programmable Read-Only Memory (EEPROM) or the like, which can store information for identifying the daughterboard 126 even when the daughterboard is disconnected from the motherboard 114 (and therefore disconnected from the power supply). Upon connection of the complementary electrical connector 130 of the daughterboard 126 to the electrical connector 128 of the motherboard 114, the identifying information stored on the memory 170 may be communicated to the processing unit 142.

[0120] The information stored in the memory 170 for identifying the daughterboard 126 to the processing unit 142 can take various forms in different embodiments. In some embodiments, the information stored in memory 170 may be indicative of the actual bus architecture or architectures supported by the complementary electrical connector 130 of the daughterboard 126, such that the information received by the processing unit 142 directly instructs the processing unit 142 which bus architecture and corresponding communication protocol should be used.

[0121] In other embodiments, the information stored on memory 170 identifying the daughterboard 126 may include a model identification number (also referred to as a model ID number) of the daughterboard, and additionally or alternatively information indicative of a functionality of the daughterboard, such as GPS, Bluetooth, Altimeter, or the like. Upon receipt of this identifying information, the processing unit 142 can infer which bus architecture and corresponding protocol should be used to communicate with the daughterboard via the electrical connector 128. For example, the memory 144 on the motherboard 114 may have prestored thereon a look-up table or the like, which specifies which bus architecture is supported by the complementary electrical connector 130 of a daughter 126 having a specific model ID number and / or a specific functionality.

[0122] In some embodiments, the look up table can be updated, for example during regular software updates pushed out to the processing unit 142 of the smart device 100 (e.g. via a cellular enabled daughterboard 126), to provide supported bus architecture information for the complementary electrical connector 130 of a new model of daughterboard 126 with updated functionality. Once this update has completed, the user can upgrade the wearable smart device 100 to include this new model of daughterboard 126, allowing the hardware of the wearable smart device 100 to be upgraded without having to replace the entire device. Other ways of updating the look up table are also possible in alternative embodiments, such as a manual update via the USB interface 12. The plurality of bus architectures supported by the electrical connectors 128 provides a choice of possible bus architectures, to enable compatibility with a multitude of possible future daughterboard designs.

[0123] Returning to Figure 3, the processing unit 142 also communicates with the body sensor module 112 via the body sensor connector 134, as mentioned previously. Figure 5 shows a schematic diagram of a body sensor module 112 in more detail. The body sensor module 112 is configured to take measurements from the user wearing the wearable smart device 100. As the body sensor module 112 is positioned on or forms the case back 110, the body sensor module 112 is positioned against the skin of the user when the wearable smart device 100 is worn to enable such measurements to be taken using biosensing technologies. In the embodiment shown in Figure 5, the body sensor module 112 includes a heart rate monitor unit 172 to measure the user’s heart rate, and an oxygen saturation monitor unit 174 to measure the user’s oxygen saturation levels. In general, the body sensor module may include various sensing units configured to take readings from the user wearing the smart device 100, including but not limited to: the heart rate of the user, the oxygen saturation levels of the user, an electrocardiogram (ECG) of the user, the body temperature of the user, and / or the galvanic skin response of the user. Other biological measurements derived from the user are also possible in further embodiments.

[0124] As shown in Figure 5, the body sensor module 112 includes a complementary body sensor connector 176 for mating with the body sensor connector 134. Similarly to the electrical connector 128 and complementary electrical connector 130 discussed in relation to the daughterboards 126 above, the body sensor connector 134 is configured to support a plurality of different bus architectures and the complementary body sensor connector 176 is configured to support at least one of these bus architectures. In the present embodiment the body sensor connector 134 is configured to support each of the following bus architectures: Serial Peripheral Bus (SPI), Inter- Integrated Circuit (l2C), and General Purpose Input / Output (GPIO), as shown in Figure 5. This list is not intended to be limiting, and other bus architectures may also be used in alternative embodiments.

[0125] In general, the body sensor connector 134 and complementary body sensor connector 176 interface is largely analogous to the electrical connector 128 and complementary electrical connector 128 interface discussed above in relation to the daughterboards 126, and a complete description is therefore omitted. However, to summarise, the plurality of different bus architectures supported by the body sensor connector 134 enables upgradability in the same way as described for the daughterboards. Further, the body sensor module 112 may include an analogous memory such as an EEPROM (not shown in Figure 5) to store analogous information for identifying the body sensor module, enabling the body sensor module 112 to identify itself to the processing unit 142 such that the one or more bus architectures and corresponding protocols supported by the complementary body sensor connector 176 can be determined by the processing unit 142. In the case of the body sensor module 112, each supported bus architecture may again be linked to a specific functionality, where the functionality refers to the specific types of body sensor monitor units included on the body sensor module 112, e.g. heart rate, oxygen saturation etc. A power supply line is also included in the body sensor connector 134 to transfer power from the power supply 116 to the body sensor module 112. Further, in some embodiments the body sensor module 112 may include any of an accelerometer, an inertial measurement unit, and / or an altimeter, instead of one of the daughterboards.

[0126] As best seen in Figure 2C, a pogo pin type connection may advantageously be used for the body sensor connector 134 and complementary body sensor connector 176. Specifically, the body sensor connector 134 may include one or more pogo pin connectors and the complementary body sensor connector 176 may include contacts for receiving the pogo pins. Additionally or alternatively, the complementary body sensor connector 176 may include one or more pogo pin connectors and the body sensor connector 134 may include contacts for receiving the pogo pins. In some embodiments, each pogo pin may be used as one of the pins in the pinout configuration of a supported bus architecture. As shown in Figure 2C, the pogo pins can be configured to extend away from the major plane of the motherboard in some embodiments.

[0127] Using such spring-loaded pogo pin connectors is beneficial compared to known connection methods used in wearable devices. For example, flexible printed circuit boards (PCBs) are often used to form connections within wearable devices, however such flexible PCBs are very susceptible to damage, particularly during disassembly of the wearable device. The use of the pogo pins in the body sensor connector 134 and complementary body sensor connector 176 interface allows the end user to easily disconnect and reconnect the case back 110 and body sensor module 112 without the risk of damage to the interface.

[0128] Returning to Figure 3, the processing unit 142 also communicates with the display module 108 via the display connector 132, as mentioned previously. Figure 6 shows a schematic diagram of a display module 108 in more detail. The display module 108 includes a display screen 178, a backlight 180 and a touchscreen 182, as well as controlling circuitry for these components including one or more level translators 184, one or more backlight drivers 186, and one or more touchscreen controllers 188. In some embodiments, the display 178 may be an LCD display, a Memory-ln-Pixel (MIP) type display (such as the Sharp LS012B7DD06A display), or an Active-Matrix Organic Light-Emitting Diode (AMOLED) type display. The display module 108 is configured to both display information to the user on the watch face 106, for example via a graphical user interface (GUI), as well as to receive inputs from the user via the touchscreen.

[0129] The input and output of information via the display module 108 is controlled by the processing unit 142 of the motherboard 114. As shown in Figure 6, the display module 108 includes a complementary display connector 190 for mating with the display connector 132 to enable this control. Similarly to the electrical connector 128 and complementary electrical connector 128 discussed in relation to the daughterboards 126 above, the display connector 132 is configured to support a plurality of different bus architectures, and the complementary display connector 190 is configured to support at least one of these bus architectures. In the present embodiment the display connector 132 is configured to support both a parallel bus as required to drive Memory-ln-Pixel (MIP) type displays (such as a 2-bit parallel interface, RGB-222), and a Quad SPI bus as required for Active-Matrix Organic Light-Emitting Diode (AMOLED) type displays. This list is not intended to be limiting, and other bus architectures may also be used in alternative embodiments. In general, the display connector 132 and complementary display connector 190 interface is largely analogous to the electrical connector 128 and complementary electrical connector 128 interface discussed above in relation to the daughterboards 126, and a complete description is therefore omitted. However, to summarise, the plurality of different bus architectures supported by the display connector 132 enables upgradability in the same way as described for the daughterboards. Namely, the display connector 132 provides the ability to connect to both MIP type displays as well as AMOLED type displays. Further, the display module 108 may include an analogous memory such as an EEPROM (not shown in Figure 6) to store analogous information for identifying the display module 108, enabling the display module 108 to identify itself to the processing unit 142 such that the one or more bus architectures and corresponding protocols supported by the complementary display connector 190 can be determined by the processing unit 142. In the case of the display module 108, each supported bus architecture may again be linked to a specific functionality, where the functionality refers to the specific types of display 178 (e.g. MIP or AMOLED) included on the display module 108. A power supply line is also included in the display connector 132 to transfer power from the power supply 116 to the display module 108.

[0130] Figures 7A and 7B show perspective and plan views respectively of the structural configuration of a daughterboard 126 for a wearable smart device 100 according to one embodiment.

[0131] As shown in Figures 7A and 7B, the daughterboard 126 includes a circuit board 192 on which the various components of the daughterboard 126 mentioned previously may be implemented, including the communication module such as GPS communication module 160, the memory 170 (not shown in Figures 7A and 7B) and the complementary electrical connector 130. Further, the daughterboard 126 may include an antenna carrier 194 coupled to the circuit board 192.

[0132] As shown in Figures 7A and 7B, the antenna carrier 194 of the present embodiment includes a first portion 194a (best seen in Figures 2B and 7A) and a second portion 194b. The first and second portions are perpendicular to each other, such that the second portion 194b extends perpendicularly to the plane of the circuit board 192 when the circuit board is coupled to the first portion 194b.

[0133] The antenna 158 (not shown in Figures 7A and 7B) is located on the antenna carrier 194, specifically on the second portion 194b of the antenna carrier 194 in the present embodiment, and is electrically coupled the communication module of the circuit board 192. In some embodiments, the antenna 158 may be a metal trace printed on or etched into the antenna carrier 194. For example, the antenna carrier 194 may be formed of a plastic material, such as injection moulded plastic, and the antenna 158 may be a trace etched using Laser Direct Structuring (LDS) techniques. LDS techniques cover various process where conductive traces are chemically etched onto a carrier, typically an injection-moulded plastic carrier.

[0134] Using an antenna carrier such as that shown in Figures 7A and 7B beneficially provides rigidity and strength to the circuit board 192, as well as making handling of the daughterboard easier by the user during replacement or repair due to the additional gripping points provided by the antenna carrier 194. Further having the antenna 158 etched directly onto the antenna carrier 194, e.g. via LDS, can lead to a more efficient use of space within the interior cavity.

[0135] As well as carrying the antenna 158 itself, the antenna carrier 194 may also provide mechanical support for the connection between the motherboard 114 and daughterboard 126, by being removably fittable inside the interior cavity of the casing 102 to hold the daughterboard 126 inside the interior cavity of the casing when the complementary electrical connector 130 is coupled to the electrical connector 128 of the motherboard 114.

[0136] Specifically, as shown in Figures 7A and 7B, the antenna carrier 194 includes interlocking portions 196 which engage with corresponding interlocking portions 198 on the casing 102 (partially shown in Figure 2B) to removably hold the daughterboard 126 in place inside the interior cavity of the casing 102. In the present embodiment, the interlocking portions 196 are slots and corresponding interlocking portions 198 on the casing 102 include corresponding protrusions or tabs or the like to seat into the slots 196. The interlocking portions 196 and protrusions on the casing 102 may be sized so as to have a push-fit type engagement when the daughterboard is positioned in the interior cavity with the complementary electrical connector 130 coupled to the electrical connector 128 of the motherboard 114. Other releasable holding means may also be used as the interlocking portions 196 in some embodiments, such as magnetic couplings, or pins and corresponding holes, or the like.

[0137] During installation of a daughterboard, the interlocking portions 196,198 are engaged to seat the daughterboard 126 within the casing 102 as the complementary electrical connector 130 of the daughterboard 126 is coupled to the electrical connector 128 of the motherboard 114. This ensures a rigid connection between the motherboard 114 and daughterboard 126, reducing the likelihood of damage or of a poor electrical connection being formed during repair or replacement of the daughterboard by the end user.

[0138] Once the daughterboard 126 is seated in place with the interlocking portions 196,198 engaged, the daughterboard can be further secured in place via one or more fastening elements, such as the screws 136 shown in Figure 2B and mentioned previously.

[0139] The daughterboard 126 is therefore removable and insertable into the interior cavity by the end-user to provide the modular repairable design. Further, in embodiments such as that shown in Figures 2A, 7A and 7B, the second portion 194b of the antenna carrier may have a curved profile that is complementary to the curvature of a sidewall of the casing 102. This enables further efficient use of the space within the interior cavity, and can be beneficial for applications where a larger antenna carrier area is needed, such as GPS enabled daughterboards which typically require a larger antenna 158 and thus a larger antenna carrier 194.

[0140] As shown in the embodiment of Figures 7A and 7B, the second portion 196b of the antenna carrier may include a flattened portion 199. In some embodiments the antenna 158 may be etched onto flattened portion 199. However, in other embodiments the antenna 158 may also be etched onto the additional curved sections of the second portion 196b of the antenna carrier, to utilise the full available area on the second portion 196b of the antenna carrier.

[0141] Returning to Figures 2A to 3, the embodiments described herein include two daughterboards 126 and two electrical connectors 128 on the motherboard 114 for receiving the daughterboards. However in general the wearable smart device 100 may include only one daughterboard 126, or may include multiple (including more than two) daughterboards 126 which are removably fittable and can be held inside the interior cavity of the casing 102 at the same time along with the motherboard 114.

[0142] In embodiments where multiple daughterboards 126 are present, each daughterboard may provide a different functionality to the motherboard 114. For example a first of the daughterboards 126 could be GPS daughterboard such as that shown in Figure 4, and a second of the daughterboards 126 may be a Bluetooth daughterboard having a Bluetooth communication module in place of the GPS module 160 shown in Figure 4. Any combination of the different daughterboard functions mentioned here (including GPS, Bluetooth, RFID, cellular, acceleration measurement, inertial measurement, or altitude measurements) may be used, as well as combinations of other possible functionalities.

[0143] In general, the motherboard 114 includes an electrical connector 128 for each of the daughterboards 126 that can be received by the wearable smart device 100. The electrical connectors 128 may each be configured to support a plurality of bus architectures, and the plurality of bus architectures supported by each electrical connector 128 may be the same plurality or may be a different plurality.

[0144] In the present embodiment, and as shown best in Figure 2B, the motherboard 114 includes two electrical connectors 128 for two daughterboards 126. The two electrical connectors 128 may be located on opposing sides of the motherboard (when viewed in a direction normal to the plane of the motherboard). Therefore, the two daughterboards 126 are located one opposing sides (at opposing edges) of the motherboard 114 when the complementary electrical connector 130 of each daughterboard 126 is coupled to one of the electrical connectors 128. Such an arrangement is particularly spatially efficient, however other arrangements of the daughterboards 126 and electrical connectors 128 are possible. As shown in the embodiment of Figure 2B, the two daughterboards, and in particular the antenna carriers 194 of each daughterboard 126, may be identical in shape. This can advantageously allow each daughterboard 126 to engage with the casing 102, e.g. via the interlocking portions 196,198, at either side of the casing 108 and be received by either electrical connector 128 (provided that the daughterboard 126 supports at least one of the bus architectures supported by each electrical connector 128, and that the physical shape of the complementary electrical connector 130 is mateable with both electrical connectors 128).

[0145] However, although the two daughterboards 126 may have identical physical shapes, the daughterboards 126 may provide different functionalities as mentioned above. In such cases, different circuitry will be present on the circuit board 192 of each daughterboard 126. Further, each different daughterboard communication functionality, e.g. GPS, Bluetooth, RFID or cellular, may require a different antenna configuration (e.g. different length and / or shape of the antenna trace) to tune the antenna 158 to the correct frequencies for the respective communication module. For example, in the case that a first daughterboard 126 is a GPS daughterboard including a communication module configured for GPS, the antenna 158 of that daughterboard may be tuned for communication at a first frequency, such as 1 .6 GHz. Further, in the case that a second daughterboard 126 is a Bluetooth daughterboard including a communication module configured for Bluetooth, the antenna 158 of that daughterboard may be tuned for communication at a second frequency, such as 2.4 GHz. In such cases, the antenna for the GPS daughterboard 126 will require an antenna trace that is longer than the antenna trace for the Bluetooth daughterboard 126.

[0146] In general, the antennas of the two daughterboards may be tuned to receive and / or transmit at different frequencies based on a functionality of the respective daughterboard. Forming the antenna trace via Laser Direct Structuring (LDS) allows custom antennas 158 having differing trace lengths and / or shapes to be easily formed for each daughterboard on the (preferably identical) antenna carriers 194 of the daughterboards 126.

[0147] In general, embodiments of the wearable smart device as described herein may be provided to consumers as a fully constructed device, i.e. with all components located within and fastened to the casing. However, replacement modular components such as the motherboard 114, daughterboards 126, display module 108, case back 110 and body sensor module 112, and power supply 116 may also be provided to the consumer separately as replacement parts, e.g. for repair or upgrade of the hardware functionality. Further, one or more of these components may be provided as a kit of parts to be assembled by the user.

[0148] In use, at least one of (and preferably any of) the electrical connectors 128 of the motherboard and the complementary electrical connector 130 of each daughterboard 126 can be repeatedly mated and unmated from one another to enable assembly and disassembly of the wearable smart device 100. Specifically, the end user may unmate a complementary electrical connector 130 of a first removable daughterboard 126 from an electrical connector 128. The end user may then mate, with the electrical connector 128, a complementary electrical connector 130 of a second removable daughterboard 126 that is a replacement or upgraded daughterboard 126 and supports at least one of the bus architecture supported by the electrical connector 128. Once the replacement / upgraded daughterboard 126 has been coupled to the motherboard 114, the replacement / upgraded daughterboard 126 can identify itself to the processing unit 142, for example by sending the identifying information stored on the memory 170 to the processing unit 142. The processing unit 142 may then determine the at least one bus architecture supported by the complementary electrical connector 130 of the replacement / upgraded daughterboard 126 based on the identifying information, and select the correct communication protocol corresponding to that bus architecture. This enables seamless repair or upgrading of each daughterboard 126 of the wearable smart device 100. Analogous methods also apply to the other plug-in modules of the smart wearable device 100, namely the display module 108 and the body sensor module 112. Although described separately, the features of the embodiments outlined above may be combined in different ways where appropriate. Various modifications to the embodiments described above are possible and will occur to those skilled in the art without departing from the scope of the invention which is defined by the following claims.

Claims

CLAIMS1 . A wearable smart device comprising: a casing having an interior cavity; a motherboard disposed within the interior cavity, the motherboard comprising a processing unit and an electrical connector, wherein the electrical connector is configured to support a plurality of different bus architectures; a power supply electrically coupled to the motherboard; and a removable daughterboard comprising a complementary electrical connector for mating with the electrical connector of the motherboard, the complementary electrical connector configured to support at least one of the plurality of different bus architectures supported by the electrical connector of the motherboard.

2. The wearable smart device of claim 1 , wherein the daughterboard comprises a nonvolatile storage module configured to store information for identifying the daughterboard to the processing unit of the motherboard.

3. The wearable smart device of claim 2, wherein the information for identifying the daughterboard comprises at least one of: a model identification number of the daughterboard, information indicative of a functionality of the daughterboard, or information indicative of the least one bus architecture supported by the complementary electrical connector of the daughterboard.

4. The wearable smart device of claims 2 or 3, wherein the processing unit is configured to determine the at least one bus architecture supported by the complementary electrical connector of the daughterboard based on the information identifying the daughterboard.

5. The wearable smart device of claim 4, wherein the processing unit selects for communication via the electrical connector a communication protocol corresponding to the determined at least one bus architecture supported by the complementary electrical connector.

6. The wearable smart device of any preceding claim, wherein the electrical connector is configured to support one or more of the following bus architectures: Serial Peripheral Bus (SPI), Inter-Integrated Circuit (l2C), Universal Asynchronous Receiver and Transmitter (UART), and / or General Purpose Input / Output (GPIO).

7. The wearable smart device of any preceding claim, wherein the daughterboard comprises a communication module configured for at least one of Bluetooth, cellular, RFID, or GPS communications.

8. The wearable smart device of any preceding claim, wherein the daughterboard comprises at least one of: an accelerometer, an inertial measurement unit, or an altimeter.

9. The wearable smart device of any preceding claim, wherein the daughterboard comprises a circuit board and an antenna electrically coupled to the circuit board.

10. The wearable smart device of claim 9, wherein the antenna is disposed on an antenna carrier and the antenna carrier is coupled to the circuit board.

11. The wearable smart device of claim 10, wherein the antenna carrier comprises injection moulded plastic.

12. The wearable smart device of claims 10 or 11 , wherein the antenna comprises an antenna trace etched onto the antenna carrier by Laser Direct Structuring (LDS).

13. The wearable smart device of any of claims 10 to 12, wherein the circuit board is coupled to a first portion of the antenna carrier and the antenna is disposed on a second portion of the antenna carrier.

14. The wearable smart device of claim 13, wherein the second portion is configured to extend perpendicularly to the plane of the circuit board when the circuit board is coupled to the first portion.

15. The wearable smart device of claims 13 or 14, wherein the second portion of the antenna carrier has a curved profile that is complementary to the curvature of a sidewall of the casing.

16. The wearable smart device of any of claims 13 to 15, wherein the second portion of the antenna carrier includes a flattened portion and at least a portion of the antenna is disposed on the flattened portion.

17. The wearable smart device of any of claims 10 to 16, wherein the antenna carrier comprises one or more interlocking portions that are configured to cooperate with one or more interlocking portions of the casing to removably hold the daughterboard in place inside the interior cavity of the casing.

18. The wearable smart device of claim 17, wherein the daughterboard comprises one or more fastening elements for releasably securing the daughterboard within the interior cavity of the casing when the interlocking portions of the antenna carrier are engaged with the interlocking portions of the casing.

19. The wearable smart device of any of claims 10 to 18, wherein the antenna carrier is configured to be removably fittable inside the interior cavity of the casing to hold the daughterboard inside the interior cavity of the casing.

20. The wearable smart device of any preceding claim, wherein: the motherboard comprises two electrical connectors each configured to support the plurality of different bus architectures; and the wearable smart device comprises two daughterboards each comprising complementary electrical connectors configured to support at least one of the plurality of different bus architectures.21 . The wearable smart device of claim 20, wherein the electrical connectors are located on opposing sides of the motherboard when viewed in a direction perpendicular to a plane of the motherboard, such that the daughterboards are located at opposing edges of the motherboard when the complementary electrical connector of each daughterboard is coupled to a respective one of the electrical connectors.

22. The wearable smart device of claims 20 or 21 , wherein the two daughterboards each comprise a circuit board and an antenna disposed on a respective antenna carrier coupled to the circuit board.

23. The wearable smart device of claim 22, wherein each antenna carrier is configured to be removably fittable inside the interior cavity of the casing such that both daughterboards can be held inside the interior cavity of the casing at the same time.

24. The wearable smart device of claims 22 or 23, wherein the respective antenna carriers are identical in shape.

25. The wearable smart device of any of claims 22 to 24, wherein the antenna of each daughterboard is etched into the antenna carrier by Laser Direct Structuring (LDS), each antenna comprising an antenna trace of differing trace length and / or shape.

26. The wearable smart device of any of claims 22 to 25, wherein the antennas of the two daughterboards are tuned to receive and / or transmit at different frequencies based on a functionality of the respective daughterboard.

27. The wearable smart device of any of claims 22 to 26, wherein a first of the two daughterboards comprises a communication module configured for GPS, and a second of the two daughterboards comprises a communication module configured for Bluetooth communications.

28. The wearable smart device of claim 27, wherein the antenna of the first daughterboard is tuned for communication at a first frequency, such as 1 .6 GHz, and the antenna of the second daughterboard is tuned for communication at a second frequency, such as 2.4 GHz.

29. The wearable smart device of claims 27 or 28, wherein the antenna of the first daughterboard includes an antenna trace that is longer than an antenna trace of the antenna of the second daughterboard.

30. The wearable smart device of any preceding claim, wherein: the motherboard further comprises a body sensor connector; and the wearable smart device further comprises a removable body sensor module comprising a complementary body sensor connector for mating with the body sensor connector on the motherboard.31 . The wearable smart device of claim 30, wherein: the body sensor connector is configured to support a second plurality of different bus architectures; and the complementary body sensor connector is configured to support at least one of the second plurality of different bus architectures supported by the body sensor connector of the motherboard.

32. The wearable smart device of claim 31 , wherein the body sensor module comprises a non-volatile storage module configured to store information for identifying the body sensor module to the processing unit of the motherboard.

33. The wearable smart device of claim 32, wherein the information for identifying the body sensor module comprises at least one of: a model identification number of the body sensor module, information indicative of a functionality of the body sensormodule, or information indicative of the least one bus architecture supported by the complementary body sensor connector.

34. The wearable smart device of claims 32 or 33, wherein the processing unit is configured to determine the at least one bus architecture supported by the complementary body sensor connector based on the information identifying the body sensor module.

35. The wearable smart device of claim 34, wherein the processing unit selects for communication via the body sensor connector a communication protocol corresponding to the determined at least one bus architecture supported by the complementary body sensor connector.

36. The wearable smart device of any of claims 30 to 35, wherein the body sensor connector is configured to support one or more of the following bus architectures: Serial Peripheral Bus (SPI), Inter-Integrated Circuit (l2C), and / or General Purpose Input / Output (GPIO).

37. The wearable smart device of any of claims 30 to 36, wherein the body sensor connector and / or complementary body sensor connector comprises one or more pogo pin connectors.

38. The wearable smart device of any of claims 30 to 37, wherein the body sensor module is configured to take one or more of the following measurements from a person wearing the wearable smart device: heart rate, oxygen saturation, electrocardiogram (ECG), body temperature or galvanic skin response.

39. The wearable smart device of any of claims 30 to 38, wherein the body sensor module comprises at least one of: an accelerometer, an inertial measurement unit, or an altimeter.

40. The wearable smart device of any of claims 30 to 39, wherein the body sensor module is configured to removably couple to an underside of the casing to define the interior cavity.41 . The wearable smart device of claim 40, wherein the casing is openable by removing the body sensor module from the underside of the casing, and resealable by recoupling the body sensor module to the underside of the casing.

42. The wearable smart device of claims 40 or 41 , wherein the power supply is removable via the underside of the casing when the body sensor module is uncoupled from the casing.

43. The wearable smart device of any preceding claim, wherein: the motherboard further comprises a display connector; and the wearable smart device further comprises a display module comprising a complementary display connector for mating with the display connector on the motherboard.

44. The wearable smart device of claim 43, wherein: the display connector is configured to support a third plurality of different bus architectures; and the complementary display connector is configured to support at least one of the third plurality of different bus architectures supported by the display connector of the motherboard.

45. The wearable smart device of claim 44, wherein the display module comprises a nonvolatile storage module configured to store information for identifying the display module to the processing unit of the motherboard.

46. The wearable smart device of claim 45, wherein the information for identifying the display module comprises at least one of: a model identification number of the display module, or information indicative of the least one bus architecture supported by the complementary display connector.

47. The wearable smart device of claims 45 or 46, wherein the processing unit is configured to determine the at least one bus architecture supported by the complementary display connector based on the information identifying the display module.

48. The wearable smart device of claim 47, wherein the processing unit selects for communication via the display connector a communication protocol corresponding to the determined at least one bus architecture supported by the complementary display connector.

49. The wearable smart device of any of claims 43 to 48, wherein the display connector is configured to support bus architectures for both Memory-ln-Pixel type displays as well as Active-Matrix Organic Light-Emitting Diode (AMOLED) type displays.

50. The wearable smart device of any of claims 43 to 49, wherein the display module is configured to removably couple to a top side of the casing to define the interior cavity.51 . The wearable smart device of claim 50, wherein the casing is openable by removing the display module from the top side of the casing, and resealable by recoupling the display module to the top side of the casing.

52. The wearable smart device of claims 50 or 51 , wherein the motherboard and the daughterboard are removable via the top side of the casing when the display module is uncoupled from the casing.

53. The wearable smart device of any preceding claim, wherein the power supply is a rechargeable battery.

54. The wearable smart device of claim 53, wherein the battery comprises electrical contacts positioned on a side of the battery that is perpendicular to the major plane of the battery.

55. The wearable smart device of any preceding claim, wherein the motherboard and the daughterboard are not connected to the casing by a permanent fixing, such that the electrical connector and complementary electrical connector can be repeatedly mated and unmated from one another on assembly and disassembly of the wearable smart device.

56. The wearable smart device of any preceding claim, wherein the motherboard is configured to connect to a plurality of daughterboards each contained within the casing along with the motherboard.

57. The wearable smart device of any preceding claim, wherein the motherboard is configured to connect to a plurality of daughterboards having different functions and / or bus architectures in a modular fashion.

58. The wearable smart device of any preceding claim, further comprising a USB connector integrated on the motherboard.

59. The wearable smart device of any preceding claim, further comprising a wrist strap coupled to the casing.

60. The wearable smart device of any preceding claim, wherein the wearable smart device is a smart watch.61 . A motherboard for a wearable smart device, the motherboard comprising: a processing unit; and an electrical connector for mating with a complementary electrical connector on a removable daughterboard, wherein the electrical connector is configured to support a plurality of different bus architectures.

62. A daughterboard for a wearable smart device, the daughterboard comprising: a complementary electrical connector for mating with an electrical connector on a motherboard, wherein the complementary electrical connector is configured to support at least one of a plurality of different bus architectures supported by the electrical connector of the motherboard.

63. A kit of parts for a wearable smart device, the kit of parts comprising: a casing having an interior cavity; a motherboard comprising a processing unit and an electrical connector, wherein the electrical connector is configured to support a plurality of different bus architectures; and a daughterboard comprising a complementary electrical connector for mating with the electrical connector of the motherboard, the complementary electrical connector configured to support at least one of the plurality of different bus architectures supported by the electrical connector of the motherboard.

64. A method of modifying a wearable smart device having a motherboard comprising a processing unit and an electrical connector, wherein the electrical connector is configured to support a plurality of different bus architectures, the method comprising the steps of: unmating, from the electrical connector, a complementary electrical connector of a first removable daughterboard, wherein the complementary electrical connector of the first removable daughterboard is configured to support at least one of the plurality of different bus architectures supported by the electrical connector of the motherboard; mating, with the electrical connector, a complementary electrical connector of a second removable daughterboard, wherein the complementary electrical connector of the second removable daughterboard is configured to support at least one of the plurality of different bus architectures supported by the electrical connector of the motherboard.

65. The method of claim 64, further comprising the step of:identifying, by the second removable daughterboard, to the processing unit of the motherboard, at least one of: a model identification number of the daughterboard, information indicative of a functionality of the daughterboard, or information indicative of the least one bus architecture supported by the complementary electrical connector of the daughterboard.

66. The method of claim 65, further comprising the step of: determining, by the processing unit, the at least one bus architecture supported by the complementary electrical connector of the daughterboard based on the information identifying the daughterboard.

67. The method of claim 66, further comprising the step of: selecting, by the processing unit, for communication via the electrical connector, a communication protocol corresponding to the determined at least one bus architecture supported by the complementary electrical connector of the second daughterboard.

Images