Processing condition calculating device, processing condition calculating method, and laser processing device

Abstract

A processing condition calculating device (10) comprises a processing condition calculating unit (13) that calculates second laser processing conditions to be used in second laser processing of a workpiece (W) after first laser processing has been performed on the workpiece (W) under first laser processing conditions, and a storage unit (12) that stores correspondence relationship information in which processing information, which is information relating to the first laser processing conditions and the second laser processing, and the second laser processing conditions are associated with each other, wherein the processing condition calculating unit (13) calculates the second laser processing conditions corresponding to the first laser processing and the second laser processing on the basis of the processing information corresponding to the first laser processing and the second laser processing and the correspondence relationship information.

Description

Processing condition calculation device, processing condition calculation method, and laser processing device

[0001] The present disclosure relates to a processing condition calculation device, a processing condition calculation method, and a laser processing device for calculating processing conditions used when processing an object to be processed with a laser beam.

[0002] The laser processing device irradiates a laser beam onto the upper surface of a plate-shaped object to be processed or the side surface of a tubular object to be processed, thereby performing laser drilling on the object to be processed or laser cutting of the object to be processed. For example, in a screw hole formed in an object to be processed, countersinking may be required to cut around the edge of the screw hole larger than the size of the screw head. Also, chamfering may be required to smooth the right-angled edge portion formed by laser cutting of the object to be processed.

[0003] The laser processing device described in Patent Document 1 performs laser processing on an object to be processed, and then moves the processing head to a position slightly deviated from the edge portion of the object to be processed formed by the laser processing, and irradiates a laser beam that does not cut the object to be processed to chamfer the edge portion.

[0004] Japanese Patent Laid-Open No. 8-108287

[0005] However, in the technology of Patent Document 1, since chamfering is performed while the appropriate laser beam parameters during chamfering are unknown, in order to achieve high-quality processing, it is necessary to recalculate the laser beam parameters according to the evaluation results of the chamfered processed product. After that, the laser processing device of Patent Document 1 performs laser processing on a new object to be processed, and then chamfers the edge portion using the recalculated laser beam parameters. Therefore, the laser processing device of Patent Document 1 has a problem that the tact time increases in order to achieve high-quality processing.

[0006] The present disclosure has been made in view of the above, and an object thereof is to obtain a processing condition calculation device that can calculate processing conditions capable of suppressing the tact time while realizing high-quality processing.

[0007] To solve the above-mentioned problems and achieve the objective, the processing condition calculation device of this disclosure comprises a processing condition calculation unit that calculates a second laser processing condition to be used in a second laser processing on a workpiece after a first laser processing on the workpiece has been performed with the first laser processing condition, and a storage unit that stores correspondence relationship information, which is information on the first laser processing condition and the second laser processing, and the second laser processing condition. The processing condition calculation unit calculates the second laser processing condition corresponding to the first laser processing and the second laser processing based on the processing information corresponding to the first laser processing and the second laser processing and the correspondence relationship information.

[0008] The processing condition calculation device described herein has the effect of being able to calculate processing conditions that can suppress cycle time while achieving high-quality processing.

[0009] A diagram showing the configuration of a laser processing apparatus equipped with a processing condition calculation device according to an embodiment. A top view showing the external configuration of the laser processing apparatus according to an embodiment. A front view showing the external configuration of the laser processing apparatus according to an embodiment. A side view showing the external configuration of the laser processing apparatus according to an embodiment. A diagram explaining the laser cutting process performed by the laser processing apparatus according to an embodiment. A diagram explaining the chamfering process performed by the laser processing apparatus according to an embodiment. A diagram explaining the chamfering angle of the chamfering process performed by the laser processing apparatus according to an embodiment. A diagram explaining the countersink angle of the countersinking process performed by the laser processing apparatus according to an embodiment. A diagram explaining the Y-shaped countersink shape formed by the laser processing apparatus according to an embodiment. A diagram explaining the V-shaped countersink shape formed by the laser processing apparatus according to an embodiment. A diagram explaining the processing performed by the processing condition calculation device according to an embodiment. A diagram showing the configuration of correspondence information used by the processing condition calculation device according to an embodiment. A flowchart showing the processing procedure of the process performed by the laser processing apparatus according to an embodiment. A flowchart showing the processing procedure of the process performed by the laser processing apparatus of a comparative example. A diagram showing an example of the configuration of the processing circuit when the processing circuit of the processing condition calculation device according to an embodiment is implemented with a processor and memory. A diagram showing an example of the configuration of the processing circuit when the processing circuit of the processing condition calculation device according to an embodiment is configured with dedicated hardware.

[0010] The processing condition calculation apparatus, processing condition calculation method, and laser processing apparatus according to embodiments of this disclosure will be described in detail below with reference to the drawings.

[0011] Embodiment. Figure 1 is a diagram showing the configuration of a laser processing apparatus equipped with a processing condition calculation device according to the embodiment. The laser processing apparatus 1 is a device that laser processes a workpiece (object to be processed) W by irradiating it with a laser beam. The laser processing apparatus 1 performs laser cutting or laser drilling on the workpiece W, and chamfering or countersinking on the workpiece W.

[0012] The laser processing apparatus 1 comprises a laser oscillator 2, a control device 3, a processing gas supply unit 21, an axis movement control unit 22, gas piping 23, a processing head 24, and a work table 26.

[0013] The control device 3 controls the laser oscillator 2, the processing gas supply unit (processing gas supply source) 21, and the axis movement control unit 22. The laser oscillator 2 outputs a laser beam according to commands from the control device 3 and sends it to the processing head 24. The laser beam output by the laser oscillator 2 is either a continuous wave or a pulsed wave.

[0014] The processing gas supply unit 21 is a valve that supplies processing gas to the processing head 24. The processing gas supply unit 21 supplies the processing gas used during laser processing to the processing head 24 via the gas piping 23, according to commands from the control device 3. The processing gas supply unit 21 is capable of supplying multiple types of assist gases (processing gases) and supplies the type of assist gas according to the instructions from the control device 3.

[0015] The axis movement control unit 22 includes a servo amplifier, a servo motor, a rack, a pinion, and a ball screw. The axis movement control unit 22 controls the axial movement of the machining head 24 according to commands from the control device 3. The axis movement control unit 22 moves the machining head 24 in the X-axis, Y-axis, and Z-axis directions, for example. The X-axis, Y-axis, and Z-axis are three axes perpendicular to each other. The X-axis and Y-axis are, for example, axes parallel to the horizontal direction. The Z-axis is, for example, an axis parallel to the vertical direction. The axis movement control unit 22 moves the machining head 24 to a position where a laser beam is irradiated onto the workpiece W.

[0016] The workpiece W is placed on the work table 26. The top surface of the work table 26 is shaped like a pincushion, and the workpiece W is supported by multiple pins on the pincushion. The workpiece W is plate-shaped or tubular. The workpiece W is, for example, a steel plate or a steel pipe. The processing head 24 has a processing nozzle 25 at its tip. The processing head 24 moves over the workpiece W according to commands from the axis movement control unit 22. The processing nozzle 25 irradiates the processing point of the workpiece W with a laser beam sent from the laser oscillator 2, and also sprays processing gas sent from the processing gas supply unit 21 onto the processing point of the workpiece W. As a result, the workpiece W is laser processed.

[0017] When the workpiece W is in the shape of a plate, the laser processing device 1 performs cutting or laser drilling of the workpiece W. When the workpiece W is in the shape of a tube, the laser processing device 1 performs cutting or laser drilling of the workpiece W on its side.

[0018] When the laser processing apparatus 1 performs laser cutting on the workpiece W, it separates the workpiece W into processed parts (products) and scraps. Alternatively, when the laser processing apparatus 1 performs laser cutting on the workpiece W, it may separate the workpiece W into multiple processed parts.

[0019] If the workpiece W is plate-shaped, laser drilling will penetrate the top and bottom surfaces of the workpiece W. If the workpiece W is tubular, laser drilling will penetrate the outer and inner walls of the workpiece W.

[0020] Furthermore, the laser processing device 1 performs chamfering on the workpiece W that has been cut, and countersinking on the workpiece W that has been laser drilled. The laser processing device 1 performs chamfering to smooth the right-angle edges formed by the laser cutting of the workpiece W, or to remove burrs. In addition, the laser processing device 1 performs countersinking on the screw holes formed by the laser drilling of the workpiece W in order to create space for the screw heads. The laser processing device 1 performs countersinking by cutting around the edge of the screw hole, making the area larger than the size of the screw head.

[0021] In the following, laser cutting and laser drilling may be referred to as pre-processing. Chamfering and countersinking may be referred to as post-processing. Pre-processing is the first laser process, and post-processing is the second laser process.

[0022] If laser cutting is performed in the preceding stage, the laser processing device 1 will perform chamfering in the subsequent stage. If laser drilling is performed in the preceding stage, the laser processing device 1 will perform countersinking in the subsequent stage.

[0023] The control device 3 comprises a processing condition calculation device 10 and a control unit 15. The processing condition calculation device 10 is a computer that calculates processing conditions. Based on processing information that includes the processing conditions used in the preceding processing (laser cutting or laser drilling) and information on the subsequent processing, the processing condition calculation device 10 calculates processing conditions (hereinafter referred to as "subsequent processing conditions") to be applied to chamfering or countersinking. The processing conditions of the preceding processing are the first laser processing conditions, and the subsequent processing conditions are the second laser processing conditions.

[0024] The processing information includes the shape of the subsequent processing and the shape formed by the subsequent processing (processed shape). The processing condition calculation device 10 calculates the subsequent processing conditions corresponding to the processing information based on correspondence relationship information that shows the correspondence between the processing information and the subsequent processing conditions.

[0025] The processing condition calculation device 10 includes an input unit 11, a storage unit 12, and a processing condition calculation unit 13. The input unit 11 receives processing information from an external source and transmits it to the processing condition calculation unit 13. Processing information is automatically input to the input unit 11 from an external device (not shown) of the control unit 15 and control device 3 (for example, a product design device). Processing information may also be input to the input unit 11 by a user.

[0026] Machining information includes, for example, material, plate thickness, gas type, chamfer angle, chamfer shape, countersink angle, and countersink shape. Of the machining information, material, plate thickness, and gas type are the machining conditions used in the preceding machining process, while chamfer angle, chamfer shape, countersink angle, and countersink shape are information for the subsequent machining process. Machining information includes at least one machining condition used in the preceding machining process. Furthermore, machining information includes at least one piece of information for the subsequent machining process.

[0027] The material is the material of the workpiece W. An example of the material is SS (Structural Steel) 400. The plate thickness is the plate thickness of the workpiece W. The gas type is the type of processing gas supplied from the processing gas supply unit 21.

[0028] The chamfer angle is the angle between the chamfered surface (the surface after processing) and the cut surface (the surface after laser cutting). The chamfer shape is the type of chamfering process. Examples of chamfer shapes include C-chamfering and thread chamfering (deburring). The chamfer shape may include information about the dimensions of the surface after processing. For example, in the case of C-chamfering, the dimensions in the chamfer shape are expressed as the dimensions from the tip of the chamfered edge.

[0029] The countersink angle is the angle formed between the opposing countersink surfaces that straddle the hole axis after countersinking. A countersink is conical, and the countersink angle is the angle formed between the opposing generatrixes of the cone. The countersink shape is the type of countersinking process. Cross-sectional shapes of countersinks include Y-shapes and V-shapes. The countersink shape may include information about the dimensions of the surfaces after countersinking. For example, dimensions in a countersink shape can be expressed as the maximum diameter of the countersink or the depth of the countersink.

[0030] The storage unit 12 stores correspondence information in advance, which shows the correspondence between processing information and subsequent processing conditions. In the correspondence information, processing information is associated with subsequent processing conditions that can achieve stable, high-quality processing in relation to the processing information. The storage unit 12 may be located outside the processing condition calculation device 10.

[0031] The processing condition calculation unit 13 calculates the subsequent processing conditions corresponding to the processing information based on the correspondence relationship information and the processing information. The processing condition calculation unit 13 may calculate the subsequent processing conditions at any time before the subsequent processing. For example, the processing condition calculation unit 13 may calculate the subsequent processing conditions before the preceding processing, or it may calculate the subsequent processing conditions during the preceding processing. Alternatively, the processing condition calculation unit 13 may calculate the subsequent processing conditions after the preceding processing.

[0032] The post-processing conditions include at least one of the following: output value, frequency, duty cycle, processing speed, focus, beam focusing diameter, nozzle height, Z-axis elevation distance, and path offset amount (beam offset amount).

[0033] The output value is the output value of the laser beam, and the frequency is the output frequency of the laser beam. The duty cycle is the ratio of the on-time to the off-time of a pulse in a pulse wave of a laser beam that is continuous at a specific period.

[0034] The processing speed is the speed at which the workpiece W is processed. The processing speed is the distance that is processed per unit time. The unit of processing speed is mm / min. The focal point is the focal point of the laser beam and is indicated by the distance in the Z-axis direction from the processing surface (processing position) on the workpiece W. The positive direction of the focal point is the upper side of the workpiece W (towards the processing head 24). For example, in countersinking, a positive focal value is used to perform processing with a wide laser beam diameter. The beam focusing diameter is the beam diameter of the laser beam when the focal point is 0 mm (reference position).

[0035] The nozzle height is the height of the machining nozzle 25 and is indicated by the distance between the surface of the work table 26 and the tip of the machining nozzle 25. The Z-axis lift distance is the lift distance in the direction parallel to the Z-axis direction (machining depth direction) in which the machining nozzle 25 moves during machining.

[0036] The path offset amount is the offset amount of the processing path. Specifically, the path offset amount is the difference between the processing path in the preceding processing stage (the path in the XY plane to which the laser beam is irradiated) and the processing path in the subsequent processing stage. The laser processing apparatus 1 performs the subsequent processing stage using a corrected processing path that has been corrected using the path offset amount relative to the processing path in the preceding processing stage.

[0037] The processing condition calculation unit 13 outputs the calculated subsequent processing conditions to the control unit 15. The control unit 15 stores the processing program in advance. The processing program may be stored outside the control unit 15.

[0038] When performing a preliminary machining operation (laser cutting or laser drilling), the control unit 15 executes control processing using the machining program and the machining conditions for the preliminary machining operation. When performing a subsequent machining operation (chamfering or countersinking), the control unit 15 executes control processing using the machining program and the calculated subsequent machining conditions.

[0039] Figure 2 is a top view showing the external configuration of a laser processing apparatus according to an embodiment. Figure 3 is a front view showing the external configuration of a laser processing apparatus according to an embodiment. Figure 4 is a side view showing the external configuration of a laser processing apparatus according to an embodiment.

[0040] Figures 2 to 4 show a laser processing apparatus 1 in which the X and Y axes are parallel to the horizontal direction and the Z axis is parallel to the vertical direction. The laser processing apparatus 1 includes an X-axis drive unit 30X, a Y-axis drive unit 30Y, and a Z-axis drive unit 30Z that drive the processing head 24.

[0041] The processing head 24 is attached to the Z-axis drive device 30Z, and the Z-axis drive device 30Z drives the processing head 24 in the Z-axis direction. The Z-axis drive device 30Z is attached to the Y-axis drive device 30Y, and the Y-axis drive device 30Y drives the Z-axis drive device 30Z in the Y-axis direction. Thereby, the Y-axis drive device 30Y drives the processing head 24 attached to the Z-axis drive device 30Z in the Y-axis direction.

[0042] The Y-axis drive device 30Y is attached to the X-axis drive device 30X, and the X-axis drive device 30X drives the Y-axis drive device 30Y in the X-axis direction. Thereby, the X-axis drive device 30X drives the Z-axis drive device 30Z attached to the Y-axis drive device 30Y in the X-axis direction, and drives the processing head 24 attached to the Z-axis drive device 30Z in the X-axis direction.

[0043] Thus, the processing head 24 is driven in the X-axis direction by the X-axis drive device 30X, driven in the Y-axis direction by the Y-axis drive device 30Y, and driven in the Z-axis direction by the Z-axis drive device 30Z.

[0044] FIG. 5 is a diagram for explaining the laser cutting process executed by the laser processing apparatus according to the embodiment. In FIG. 5, the processing path 41 in the laser cutting process when the workpiece W is viewed from above is shown. That is, in FIG. 5, the processing path 41 when viewed from the Z-axis direction is shown.

[0045] The laser processing apparatus 1 laser cuts the workpiece W along the processing path 41 indicated by the arrow. In FIG. 5, the inner region surrounded by the processing path 41 is the region that becomes the product Px. The processing path 41 has a piercing position at a position outside the region that becomes the product Px, and is a path that starts from the piercing process and proceeds to surround the region that becomes the product Px. The laser processing apparatus 1 laser cuts the workpiece W using the processing path 41 provided with the joint J1 so that the portion that becomes the product Px is not separated from the workpiece W. The region outside the region that becomes the product Px may or may not become a product.

[0046] FIG. 6 is a diagram for explaining chamfering performed by the laser processing apparatus according to the embodiment. FIG. 6 is a cross-sectional view taken along line VI-VI of the workpiece W shown in FIG. 5, and shows the product P1 after laser cutting and chamfering. In FIG. 6, a cross-sectional view of the product P1 and a cross-sectional view of the processing nozzle 25 and the laser beam L are shown.

[0047] After laser cutting the workpiece W along the processing path 41 described in FIG. 5, the laser processing apparatus 1 performs chamfering on the edge portion after processing so as to have the shape shown in FIG. 6. In FIG. 6, the shape of the product P1 after the chamfered portion C1 of the product P1 has been chamfered is shown.

[0048] The laser processing apparatus 1 performs chamfering using the same processing path as the processing path 41 of the laser cutting, which is the previous-stage processing. In this case, the laser processing apparatus 1 performs chamfering along a processing path (hereinafter sometimes referred to as a subsequent-stage processing path) in which a path offset amount R1 is set with respect to the position in the XY plane of the processing path 41. That is, the laser processing apparatus 1 moves the processing head 24 to a position offset by the path offset amount R1 from the edge portion of the processed shape formed by laser cutting, and performs chamfering.

[0049] The laser processing apparatus 1 performs chamfering along a subsequent-stage processing path in which the path offset amount R1 is set, for example, inside the processing path 41 shown in FIG. 5. The path offset amount R1 here is the amount of deviation between the path of the laser cutting, which is the previous-stage processing, and the path of the chamfering, which is the subsequent-stage processing.

[0050] By performing chamfering along the subsequent-stage processing path in which the path offset amount R1 is set, the laser processing apparatus 1 can chamfer the edge portion (chamfered portion C1) formed by laser processing along the processing path 41.

[0051] In addition, in FIG. 6, the case where the right side of the product P1 also becomes the product P0 is shown. That is, in FIG. 6, the case where the right side of the product P1 is also chamfered is shown. When the right side of the product P1 does not become a product, chamfering of the workpiece W on the right side is unnecessary.

[0052] Thus, the laser processing apparatus 1 performs laser cutting to separate the normal processed product (product P1) from the scrap material, as well as chamfering to form the chamfered portion C1 as shown in Figure 6. When performing this chamfering, the laser processing apparatus 1 achieves chamfering by irradiating a laser beam L with an output density equal to or different from that of the preceding process in the subsequent process (chamfering), after the preceding process (preliminary processing), which is laser cutting. When the hole processing in the preceding process is performed with low output (in the case of small diameter processing), if the chamfering angle in the subsequent process is large, the laser processing apparatus 1 increases the offset amount in the Z-axis direction during chamfering, so the output density of the chamfering may be higher than that of the hole processing. Also, when the hole processing in the preceding process is performed with high output (in the case of large diameter processing), the output density of the chamfering may be lower than that of the hole processing.

[0053] The power density in the preceding process is the power density required to cut the workpiece W in a single laser cutting operation, while the power density in the subsequent process is the power density required to cut the workpiece W in a single laser cutting operation. The control unit 15 calculates the power density of the laser beam L in the subsequent processing based on the output value, frequency, duty cycle, processing speed, focus, beam focusing diameter, nozzle height, Z-axis elevation distance, and path offset amount R1 included in the subsequent processing.

[0054] Figure 7 is a diagram illustrating the chamfering angle of the chamfering process performed by the laser processing apparatus according to the embodiment. Figure 7 shows a cross-sectional view of the product P2 formed from the workpiece W when it is cut by a plane parallel to the XZ plane.

[0055] In chamfering, the chamfer angle CA1 is the angle between the depth direction (Z-axis direction) of the slit (cutting allowance) SL formed by laser cutting and the surface (chamfered surface F1) formed by chamfering. Figure 7 shows the case where the chamfer angle CA1 is the angle between the Z-axis direction and the chamfered surface F1 when the product P2 is cut by a plane parallel to the XZ plane.

[0056] Figure 8 is a diagram illustrating the countersink angle of the countersinking process performed by the laser processing apparatus according to the embodiment. Figure 8 shows a cross-sectional view of the product P3 formed from the workpiece W when it is cut by a plane parallel to the XZ plane.

[0057] In countersinking, the countersink angle HA1 is the angle formed by the generatrixes B1 and B2 that are opposite each other across the hole H. The hole H is the hole formed by drilling, and the generatrixes B1 and B2 are the generatrixes of the cone formed by countersinking. Figure 8 shows the case where the countersink angle HA1 is the angle formed by the generatrixes B1 and B2 when the product P3 is cut by a plane parallel to the XZ plane.

[0058] Figure 9 is a diagram illustrating a Y-shaped countersunk hole formed by the laser processing apparatus according to the embodiment. Figure 9 shows a cross-sectional view of product P4 formed from the workpiece W when cut with a plane parallel to the XZ plane. Note that the Y-shape shown in Figure 9 can also be formed by chamfering. Therefore, the Y-shape shown in Figure 9 may be a countersunk hole or a chamfered shape.

[0059] If the Y-shape shown in Figure 9 is a countersunk hole, the countersunk hole shape is represented by the maximum diameter D1 of the countersunk hole, the depth D2 of the countersunk hole, etc. The maximum diameter D1 is the diameter of the top surface of the countersunk hole (the base of the cone). In other words, the maximum diameter D1 is the largest diameter of the conical countersunk hole. If the Y-shape shown in Figure 9 is a chamfered shape, the chamfered shape is represented by the dimension D3 from the edge tip E of the chamfered part, etc. The edge tip E is a right-angled part formed by laser cutting. In chamfering, the chamfered part including the edge tip E is removed by laser processing.

[0060] Figure 10 is a diagram illustrating the V-shaped countersunk hole formed by the laser processing apparatus according to the embodiment. Figure 10 shows a cross-sectional view of the product P5 formed from the workpiece W when cut with a plane parallel to the XZ plane. The countersunk hole shape shown in Figure 10 is represented by the maximum diameter D4 of the countersunk hole, the depth D5 of the countersunk hole, etc. The maximum diameter D4, like the maximum diameter D1, is the diameter of the uppermost surface of the countersunk hole.

[0061] Figure 11 is a diagram illustrating the process performed by the machining condition calculation device according to the embodiment. Machining information is input to the machining condition calculation device 10. The machining information includes at least one of the material, plate thickness, and gas type, and at least one of the chamfer angle, chamfer shape, countersink angle, and countersink shape. The machining condition calculation device 10 stores correspondence information in advance.

[0062] The processing condition calculation device 10 calculates the subsequent processing conditions corresponding to the processing information based on the correspondence information and the processing information. The subsequent processing conditions include at least one of the following: output value, frequency, duty cycle, processing speed, focus, beam focusing diameter, nozzle height, Z-axis elevation distance, and path offset amount R1. The processing condition calculation device 10 outputs the calculated subsequent processing conditions to the control unit 15.

[0063] The control unit 15 controls the preliminary processing (laser cutting or laser drilling) using the processing program and the processing conditions for the preliminary processing. The control unit 15 also controls the subsequent processing using the processing program and the processing conditions for the subsequent processing.

[0064] If the input processing information value is not included in the correspondence information, the processing condition calculation unit 13 calculates the subsequent processing conditions corresponding to the input processing information by performing linear approximation. In this case, the processing condition calculation unit 13 extracts the processing information before and after the input processing information value from the correspondence information. Then, the processing condition calculation unit 13 calculates the subsequent processing conditions corresponding to the input processing information by performing linear approximation of the subsequent processing conditions corresponding to the extracted processing information.

[0065] For example, if the input chamfer angle (hereinafter sometimes referred to as the input chamfer angle) is not found in the correspondence information, the machining condition calculation unit 13 extracts chamfer angles that are before and after the input chamfer angle from among the chamfer angles included in the correspondence information. That is, the machining condition calculation unit 13 extracts the chamfer angle closest to the input chamfer angle from among the chamfer angles that are larger than the input chamfer angle. The machining condition calculation unit 13 also extracts the chamfer angle closest to the input chamfer angle from among the chamfer angles that are smaller than the input chamfer angle. Then, the machining condition calculation unit 13 calculates the subsequent machining conditions corresponding to the input chamfer angle by linearly approximating the subsequent machining conditions corresponding to the two extracted chamfer angles.

[0066] Similarly, if the input countersink angle (hereinafter sometimes referred to as the input countersink angle) is not present in the correspondence information, the machining condition calculation unit 13 extracts the chamfer angles before and after the input countersink angle from the countersink angles included in the correspondence information. Then, the machining condition calculation unit 13 calculates the subsequent machining conditions corresponding to the input countersink angle by linearly approximating the subsequent machining conditions corresponding to the two extracted countersink angles.

[0067] Furthermore, if the input processing information value is not included in the correspondence information, the processing condition calculation unit 13 may extract any processing information value from the correspondence information. Also, if the input processing information value is not included in the correspondence information, the processing condition calculation unit 13 may extract three or more processing information values ​​from the correspondence information. In these cases as well, the processing condition calculation unit 13 calculates the subsequent processing conditions corresponding to the input processing information by linearly approximating the subsequent processing conditions corresponding to the extracted processing information.

[0068] The machining condition calculation unit 13 calculates the output value, frequency, duty cycle, machining speed, focal point, beam focusing diameter, nozzle height, Z-axis elevation distance, and path offset amount R1 corresponding to the input chamfer angle, for example by performing a linear approximation. The machining condition calculation unit 13 also calculates the output density based on the calculated output value, frequency, duty cycle, machining speed, focal point, beam focusing diameter, nozzle height, Z-axis elevation distance, and path offset amount R1.

[0069] Figure 12 shows the configuration of correspondence information used by the machining condition calculation device according to the embodiment. The correspondence information, which is a table of machining conditions, is information that shows an example of the correspondence between machining information 61 and subsequent machining conditions 62. That is, the correspondence information includes subsequent machining conditions 62 that correspond to machining information 61. In the correspondence information, the machining information 61 and subsequent machining conditions 62 in a series of machining processes including pre-machining and post-machining are shown in a matrix table for each machining process.

[0070] The processing information 61 here includes material, plate thickness, gas type, chamfer angle, chamfer shape, countersink angle, and countersink shape.

[0071] Furthermore, the subsequent processing conditions 62 here include the output value, frequency, duty cycle, processing speed, gas pressure, focal point, beam focusing diameter, nozzle height, Z-axis elevation distance, and the path offset amount R1 of the processing path.

[0072] Figure 13 is a flowchart showing the processing procedure of the laser processing apparatus according to the embodiment. The laser processing apparatus 1 performs the preliminary processing using the processing conditions of the preliminary processing (step S1). That is, the laser processing apparatus 1 performs laser drilling or laser cutting using the processing conditions of the preliminary processing.

[0073] The processing condition calculation device 10 of the laser processing apparatus 1 calculates the subsequent processing conditions corresponding to the processing information based on the processing information and correspondence relationship information (step S2). Specifically, the processing condition calculation unit 13 calculates the subsequent processing conditions corresponding to the processing information based on the correspondence relationship information read from the storage unit 12 and the processing information received from the outside by the input unit 11. Based on the subsequent processing conditions, the processing condition calculation device 10 calculates the laser power density to be applied to the subsequent processing (step S3). Here, the processing condition calculation device 10 calculates a laser power density such that the processed product does not separate from the original workpiece W. That is, the processing condition calculation device 10 calculates a laser power density lower than the laser power density during the previous processing. The processing condition calculation unit 13 transmits the subsequent processing conditions and the calculated laser power density to the control unit 15.

[0074] The laser processing apparatus 1 performs the subsequent processing using the subsequent processing conditions and laser power density (step S4). That is, the laser processing apparatus 1 performs countersinking or chamfering using the subsequent processing conditions and laser power density. If the laser processing apparatus 1 performed drilling in the preceding processing, it performs countersinking in the subsequent processing. Also, if the laser processing apparatus 1 performed laser cutting in the preceding processing, it performs chamfering in the subsequent processing.

[0075] The processing procedure performed by the comparative example laser processing apparatus is described below. Figure 14 is a flowchart showing the processing procedure performed by the comparative example laser processing apparatus. Here, the processing procedure when the comparative example laser processing apparatus performs laser cutting is described. Note that some of the processing shown in Figure 14 includes processing performed by the user of the comparative example laser processing apparatus (step S15).

[0076] The comparative example laser processing apparatus sets the laser beam parameters according to instructions from the user (step S11). The laser beam parameters are the same information as the subsequent processing conditions. The comparative example laser processing apparatus performs laser cutting using the laser beam parameters (step S12).

[0077] The comparative example laser processing apparatus calculates a laser power density such that the processed product does not separate from the original workpiece W (step S13). The comparative example laser processing apparatus performs chamfering at the calculated laser power density (step S14).

[0078] The user of the comparative example laser processing apparatus determines whether the chamfered product has the desired shape (step S15). If the chamfered product does not have the desired shape (step S15, No), the comparative example laser processing apparatus resets the laser beam parameters according to the user's instructions (step S16). After this, steps S12 to S15 are repeated. Steps S16 and S12 to S15 are repeated until the user determines that the chamfered product has the desired shape. Once the user determines that the chamfered product has the desired shape (step S15, Yes), the comparative example laser processing apparatus terminates the laser processing.

[0079] In the case of the comparative example, when the laser processing apparatus performs laser drilling, laser drilling is performed in step S11 instead of laser cutting, and countersinking is performed in step S13 instead of chamfering.

[0080] The processing condition calculation device 10 of the embodiment calculates subsequent processing conditions based on processing information and correspondence information, so it does not require the processing of determining whether the product after chamfering has the desired shape, or the processing of resetting the laser beam parameters, as is the case with the laser processing device of the comparative example.

[0081] Next, the hardware configuration of the machining condition calculation device 10 will be described. The machining condition calculation device 10 is implemented by a processing circuit. The processing circuit may be a processor and memory that execute a program stored in memory, or it may be dedicated hardware.

[0082] Figure 15 is a diagram showing an example of the configuration of a processing circuit when the processing circuit of the processing condition calculation device according to the embodiment is realized with a processor and memory. The processing circuit 90 shown in Figure 15 comprises a processor 91 and memory 92. When the processing circuit 90 is composed of a processor 91 and memory 92, each function of the processing circuit 90 is realized by software, firmware, or a combination of software and firmware. The software or firmware is written as a processing condition calculation program that calculates processing conditions and is stored in memory 92. In the processing circuit 90, each function is realized by the processor 91 reading and executing the processing condition calculation program stored in memory 92. In other words, the processing circuit 90 includes memory 92 for storing the processing condition calculation program, which will result in the processing of the processing condition calculation device 10 being executed. This processing condition calculation program can also be said to be a program that causes the processing condition calculation device 10 to execute each function realized by the processing circuit 90. This processing condition calculation program may be provided on a computer-readable recording medium on which the processing condition calculation program is recorded, or it may be provided by other means such as a communication medium.

[0083] The above processing condition calculation program can also be described as a program that causes the processing condition calculation device 10 to execute the processes in steps S2 and S3 of Figure 13. Here, the processor 91 is, for example, a CPU (Central Processing Unit), processing unit, arithmetic unit, microprocessor, microcomputer, or DSP (Digital Signal Processor). The memory 92 is, for example, a non-volatile or volatile semiconductor memory such as RAM (Random Access Memory), ROM (Read Only Memory), flash memory, EPROM (Erasable Programmable ROM), EEPROM (Registered Trademark) (Electrically EPROM), magnetic disk, flexible disk, optical disk, compact disk, minidisc, or DVD (Digital Versatile Disc).

[0084] Figure 16 shows an example of the configuration of a processing circuit when the processing circuit of the machining condition calculation device according to the embodiment is configured with dedicated hardware. The processing circuit 93 shown in Figure 16 may be, for example, a single circuit, a composite circuit, a programmed processor, a parallel programmed processor, an ASIC (Application Specific Integrated Circuit), an FPGA (Field Programmable Gate Array), or a combination thereof. The processing circuit 93 may be partially implemented with dedicated hardware and partially implemented with software or firmware. In this way, the processing circuit 93 can realize each of the above functions with dedicated hardware, software, firmware, or a combination thereof. The control device 3 may be implemented with a processing circuit similar to that of the machining condition calculation device 10.

[0085] As described above, according to this embodiment, the processing condition calculation device 10 calculates subsequent processing conditions based on processing information and correspondence information, thus eliminating the need for time to adjust processing conditions for chamfering and countersinking. Furthermore, since the processing condition calculation device 10 can calculate appropriate subsequent processing conditions, laser processing using appropriate subsequent processing conditions stabilizes the countersink angle and chamfer angle, and enables stable, high-quality processing that eliminates processing defects such as dross. In this way, the processing condition calculation device 10 can calculate processing conditions that suppress cycle time while achieving high-quality processing.

[0086] The configurations shown in the above embodiments are merely examples, and can be combined with other known technologies. It is also possible to omit or modify parts of the configuration without departing from the gist of the invention.

[0087] 1 Laser processing device, 2 Laser oscillator, 3 Control device, 10 Processing condition calculation device, 11 Input unit, 12 Memory unit, 13 Processing condition calculation unit, 15 Control unit, 21 Processing gas supply unit, 22 Axis movement control unit, 23 Gas piping, 24 Processing head, 25 Processing nozzle, 26 Work table, 30X X-axis drive unit, 30Y Y-axis drive unit, 30Z Z-axis drive unit, 41 Processing path, 61 Processing information, 62 Subsequent processing conditions, 90, 93 Processing circuit, 91 Processor, 92 Memory, B1, B2 Busbar, C1 Chamfer section, CA1 Chamfer angle, D1, D4 Maximum diameter, D3 Dimension, E Edge tip, F1 Chamfer surface, H Hole, HA1 Countersunk hole angle, J1 Joint, L Laser beam, P1-P5, Px Product, R1 Path offset amount, W The object to be processed.

Claims

1. A processing condition calculation device comprising: a processing condition calculation unit that calculates a second laser processing condition to be used in a second laser processing on a workpiece after a first laser processing on the workpiece has been performed under first laser processing conditions; and a storage unit that stores correspondence relationship information, which is information on the first laser processing conditions and the second laser processing, and the second laser processing condition, wherein the processing condition calculation unit calculates a second laser processing condition corresponding to the first laser processing and the second laser processing based on the processing information corresponding to the first laser processing and the second laser processing and the correspondence relationship information.

2. The processing condition calculation device according to claim 1, characterized in that, when the first laser processing is laser cutting, the second laser processing is chamfering, and when the first laser processing is laser drilling, the second laser processing is countersinking.

3. The processing condition calculation device according to claim 2, characterized in that the second laser processing information includes at least one of the chamfering angle in the chamfering process, the chamfering shape in the chamfering process, the countersink angle in the countersinking process, and the countersink shape in the countersinking process.

4. The processing condition calculation device according to any one of claims 1 to 3, characterized in that the first laser processing conditions include at least one of the material of the workpiece, the thickness of the workpiece, and the type of assist gas sprayed onto the workpiece from the processing nozzle of the processing head during the first laser processing.

5. The processing condition calculation device according to claim 4, characterized in that the second laser processing condition includes at least one of the following: the output value of the laser beam in the second laser processing, the output frequency of the laser beam, the duty cycle of the laser beam, the processing speed of the workpiece, the focal point of the laser beam, the beam focusing diameter of the laser beam, the nozzle height of the processing nozzle, the upward distance in a direction parallel to the processing depth direction in which the processing nozzle moves during processing, and the path offset amount, which is the amount of deviation between the processing path in the first laser processing and the processing path in the second laser processing.

6. The processing condition calculation device according to claim 5, characterized in that the processing condition calculation unit calculates the output density of the laser beam based on the second laser processing condition when the second laser processing condition includes the output frequency, the duty cycle, the processing speed, the focal point, and the beam focusing diameter.

7. The processing condition calculation device according to claim 3, characterized in that, if the value of the chamfer angle is not included in the correspondence information, the processing condition calculation unit calculates a second laser processing condition corresponding to the chamfer angle by linear approximation.

8. The processing condition calculation device according to claim 3, characterized in that, if the value of the countersink angle is not included in the correspondence information, the processing condition calculation unit calculates a second laser processing condition corresponding to the countersink angle by linear approximation.

9. The processing condition calculation device according to claim 3, characterized in that the chamfer shape has a Y-shaped cross-section, and the countersunk hole shape has a Y-shaped or V-shaped cross-section.

10. A method for calculating processing conditions, comprising: a storage step in which a processing condition calculation device stores correspondence relationship information, which is processing information that is a first laser processing condition used in a first laser processing on a workpiece and information that is a second laser processing on the workpiece after the first laser processing has been performed, and a second laser processing condition used in the second laser processing; and a processing condition calculation step in which the processing condition calculation device calculates a second laser processing condition corresponding to the first laser processing and the second laser processing based on the processing information corresponding to the first laser processing and the second laser processing and the correspondence relationship information.

11. A laser processing apparatus comprising: a laser oscillator that outputs a laser beam; a processing head that irradiates a workpiece with the laser beam; and a processing condition calculation device that calculates processing conditions for laser processing the workpiece using the laser beam, wherein the processing condition calculation device comprises: a processing condition calculation unit that calculates second laser processing conditions to be used for a second laser processing on the workpiece after a first laser processing on the workpiece has been performed with first laser processing conditions; and a storage unit that stores correspondence relationship information, which is information on the first laser processing conditions and the second laser processing, and the second laser processing conditions, wherein the processing condition calculation unit calculates second laser processing conditions corresponding to the first laser processing and the second laser processing based on the processing information corresponding to the first laser processing and the second laser processing and the correspondence relationship information, and the second laser processing is automatically executed using the second laser processing conditions.

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