Adhesive tape cutting method and adhesive tape cutting device

The cutting method and apparatus for adhesive tape on a ring frame address residue issues by setting the cutting line and blade position offset, ensuring residue-free integration of the wafer and ring frame.

WO2026115778A1PCT designated stage Publication Date: 2026-06-04TOKYO SEIMITSU CO LTD
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Patent Information

Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
TOKYO SEIMITSU CO LTD
Filing Date
2025-06-17
Publication Date
2026-06-04

AI Technical Summary

Technical Problem

The existing methods for cutting adhesive tape to attach a wafer to a ring frame often result in whisker-like residues due to misalignment of the start and end points of the cutting, which can cause issues during the dicing process.

Method used

A cutting method and apparatus that sets the cutting line along the surface of the ring frame, positions the rotary blade offset from the cutting line, and moves the blade relative to the frame to cut the tape along the line, preventing residue formation.

Benefits of technology

Prevents the formation of whisker-like residues on the adhesive tape, ensuring smooth integration of the wafer and ring frame during the dicing process.

✦ Generated by Eureka AI based on patent content.

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    Figure JP2025021744_04062026_PF_FP_ABST
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Abstract

A cutting line CL for an adhesive tape 62 is set along the surface of a ring frame 20. This cutting method comprises a blade placement step for placing a rotary blade 40 at a blade placement position Cp that is offset by a prescribed distance from a position C0 at which the rotary blade 40 is to be placed on the cutting line CL, a movement step for moving the rotary blade 40 and the ring frame 20 relative to each other such that the rotary blade 40 moves from the blade placement position Cp toward the cutting line CL, and a cutting step for moving the cutting blade 40 in a circle along the cutting line CL from a start point C0 on the cutting line CL.
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